TW201822935A - Method for detecting abnormal event for laser welding process and detecting system using the same employing detection of vibration wave to determine existence of abnormal event during laser welding and issuing warning in real-time - Google Patents
Method for detecting abnormal event for laser welding process and detecting system using the same employing detection of vibration wave to determine existence of abnormal event during laser welding and issuing warning in real-time Download PDFInfo
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本發明是關於一種雷射焊接技術,特別是關於一種雷射焊接的異常事件的偵測方法及其偵測系統。 The invention relates to a laser welding technology, in particular to a method and a system for detecting abnormal events of laser welding.
隨著工業技術發展,雷射焊接技術為一種新的焊接技術,並且已被廣泛的應用於資訊科技(IT)、醫療、電子、汽車、機械和航空等各種行業。雷射焊接技術在焊縫寬度、質量,焊接速度、變形、效率、焊接控制度、定位精確度等方面存在著其他熔化焊接技術無法比擬的優勢。 With the development of industrial technology, laser welding technology is a new welding technology, and has been widely used in various industries such as information technology (IT), medical, electronics, automotive, machinery and aviation. Laser welding technology has incomparable advantages over other fusion welding technologies in terms of weld width, quality, welding speed, deformation, efficiency, welding control, and positioning accuracy.
雷射焊接技術是利用原子受激輻射原理使雷射材料受激而產生單色性好、方向性強且強度很高的雷射束,並且使產生的雷射束聚焦於欲進行焊接的焊接物上,以致雷射束在千分之幾秒甚至更短時間內被焊接物吸收後再轉化成熱能而熔化焊接物,最終熔化後的焊接物經冷卻結晶以實現焊接物的連接。 Laser welding technology uses the principle of atomic stimulated radiation to stimulate the laser material to produce a laser beam with good monochromaticity, strong directivity and high intensity, and focuses the generated laser beam on the welding to be welded. As a result, the laser beam is absorbed by the welding object within a few thousandths of a second or even less, and then converted into thermal energy to melt the welding object. Finally, the molten welding object is cooled and crystallized to achieve the connection of the welding object.
於雷射焊接的自動生產線上,雷射焊接機台雖設有焊接檢測設備,但此焊接檢測設備僅用於提醒作業員已執行的焊接次數並無法藉以得知雷射焊接機台是否有正確地進行焊接物的焊接。作業員需在大量焊接物焊接完成之後逐一以肉眼檢測各焊接物的的焊點,以確定是否有不良焊點(未成功接合)。當焊接物上有不良焊點時,此焊接物則利用雷射焊 接機台重焊。然而,重焊作業相當麻煩,而重焊的部分係不光滑且易於損壞。 On the laser welding automatic production line, although the laser welding machine is equipped with welding inspection equipment, this welding inspection equipment is only used to remind the operator of the number of welding operations performed and cannot be used to know whether the laser welding machine is correct. Welding of the welding object is performed in the ground. After the welding of a large number of welding objects is completed, the operator needs to visually inspect the welding points of each welding object one by one to determine whether there are bad welding points (unsuccessful joining). When there are bad solder joints on the welding object, the welding object is re-soldered by the laser welding machine. However, the re-soldering operation is quite troublesome, and the re-soldering part is not smooth and easily damaged.
由於在雷射焊接過程中會產生的強光,例如:閃光、電漿等,因此作業員在焊接過程中是無法進行焊接狀態的檢測。作業員只能在每個單位之焊接製程完成之後再進行檢測。並且,在整個焊接製程完成前,須反復批量進行焊接動作及檢測動作,因而減弱了雷射焊接可實現非接觸高速焊接的優點。 Due to the strong light generated during the laser welding process, such as flashing light, plasma, etc., the operator cannot detect the welding state during the welding process. The operator can only perform the inspection after the welding process of each unit is completed. In addition, before the entire welding process is completed, welding operations and inspection operations must be repeatedly performed in batches, thereby reducing the advantages of laser welding that can achieve non-contact high-speed welding.
再者,對於焊接強度的檢測,一般是以抽樣的方式對做為檢測樣品的焊接物進行破壞性檢測來確定各檢測樣品的焊點的接合強度是否足夠,進而判定於形成此些檢測樣品的連續時段中所形成的所有焊接物的焊接品質。換言之,電子產品上的各個焊接物僅能確認是否成功接合,對於焊接物的焊接品質(如,接合強度)則僅是推測良好並未能實際進行檢測。然而,電子產品的可靠度及耐久性卻與各焊接物的焊接品質息息相關。 Furthermore, for the detection of welding strength, the welding of the welded material used as a test sample is generally destructively tested to determine whether the joint strength of the solder joints of each test sample is sufficient, and then it is determined that the test samples are formed. Weld quality of all welds formed in consecutive periods. In other words, each soldered object on the electronic product can only confirm whether the bonding is successful, and the soldering quality (eg, bonding strength) of the soldered object is only speculatively good and cannot be actually tested. However, the reliability and durability of electronic products are closely related to the welding quality of each solder.
在一實施例中,一種雷射焊接的異常事件的偵測方法,其包括:利用一感測單元感測至少一組焊接物進行雷射焊接時產生的振動波以得到具有至少一有效訊號的一量測訊號、轉換各有效訊號為一頻域訊號、以及根據各頻域訊號與至少一強度條件判定是否存在異常事件。其中,當各頻域訊號未滿足任一強度條件時,判定此組焊接物進行雷射焊接時存在異常事件。反之,當各頻域訊號滿足至少一強度條件時,判定此組焊接物進行雷射焊接時不存在異常事件。於此,各有效訊號分別代表一組焊接物的雷射焊接的執行。 In one embodiment, a method for detecting an abnormal event of laser welding includes: using a sensing unit to sense vibration waves generated during laser welding of at least one group of welding objects to obtain at least one valid signal. Measuring a measurement signal, converting each valid signal into a frequency domain signal, and determining whether there is an abnormal event according to each frequency domain signal and at least one intensity condition. Among them, when each frequency-domain signal does not satisfy any of the strength conditions, it is determined that there is an abnormal event during laser welding of this group of welding objects. Conversely, when each frequency-domain signal satisfies at least one strength condition, it is determined that there is no abnormal event during laser welding of this group of welding objects. Here, each valid signal represents the performance of laser welding of a group of welds.
在一實施例中,一種雷射焊接的異常事件的偵測系統,其包括:一感測單元、一訊號產生電路以及一處理單元。訊號產生電路耦接感測單元,並且處理單元耦接訊號產生電路。訊號產生電路藉由感測單元感測至少一組焊接物進行雷射焊接時產生的振動波以得到具有至少一有效訊號的一量測訊號。處理單元接收量測訊號、轉換各有效訊號為一頻域訊號以及根據各頻域訊號與至少一強度條件判定是否存在異常事件。其中,當各頻域訊號未滿足任一強度條件時,處理單元判定此組焊接物進行雷射焊接時存在異常事件;以及當各頻域訊號滿足至少一強度條件時,處理單元判定此組焊接物進行雷射焊接時不存在異常事件。於此,各有效訊號分別代表一組焊接物的雷射焊接的執行。 In one embodiment, a laser welding abnormal event detection system includes a sensing unit, a signal generating circuit, and a processing unit. The signal generating circuit is coupled to the sensing unit, and the processing unit is coupled to the signal generating circuit. The signal generating circuit senses at least one group of welding objects to perform vibration welding by a sensing unit to obtain a measurement signal having at least one valid signal. The processing unit receives the measurement signal, converts each valid signal into a frequency domain signal, and determines whether there is an abnormal event according to each frequency domain signal and at least one strength condition. Wherein, when each frequency-domain signal does not meet any of the strength conditions, the processing unit determines that there is an abnormal event when the group of welding objects performs laser welding; and when each frequency-domain signal meets at least one strength condition, the processing unit determines this group of welding There are no abnormal events when objects are laser welded. Here, each valid signal represents the performance of laser welding of a group of welds.
綜上,根據本發明的雷射焊接的異常事件的偵測方法及其偵測系統,其利用振動波的感測單元感測各組焊接物進行雷射焊接時產生的振動波並透過分析振動波的量測訊號的頻域訊號來判定雷射焊接製程是否存在異常事件,藉以即時警告焊接時所發生的異常事件(如,失焦、雷射功率異常、材料離隙過大等製程參數異常),並且能進一步即時矯正(如,依據檢測結果解焊具有不合格焊點的焊接物並重新進行解焊後的焊接物焊接),進而提升電子產品的可靠度及耐久性。 In summary, according to the method and system for detecting abnormal events of laser welding according to the present invention, a vibration wave sensing unit is used to sense the vibration waves generated by each group of welding objects during laser welding and analyze the vibrations. The frequency-domain signal of the wave measurement signal is used to determine whether there are abnormal events in the laser welding process, so as to immediately warn about abnormal events that occur during welding (such as out-of-focus, abnormal laser power, excessive material clearance, etc.) , And can be further corrected immediately (for example, desoldering solders with unqualified solder joints and re-soldering solders after desoldering according to the test results), thereby improving the reliability and durability of electronic products.
10‧‧‧偵測系統 10‧‧‧ Detection System
110‧‧‧聲音/振動量測模組 110‧‧‧Sound / Vibration Measurement Module
112‧‧‧感測單元 112‧‧‧Sensing unit
114‧‧‧訊號產生電路 114‧‧‧Signal generating circuit
150‧‧‧處理單元 150‧‧‧ processing unit
170‧‧‧儲存單元 170‧‧‧Storage unit
20‧‧‧雷射焊接機台 20‧‧‧laser welding machine
210‧‧‧焊接載台 210‧‧‧welding stage
230‧‧‧雷射焊頭 230‧‧‧laser welding head
250‧‧‧機台控制組件 250‧‧‧machine control components
30‧‧‧焊接物 30‧‧‧weld
330‧‧‧焊點 330‧‧‧Soldering
SS‧‧‧量測訊號 SS‧‧‧Measurement signal
S1‧‧‧有效訊號 S1‧‧‧ effective signal
S40~S80‧‧‧步驟 S40 ~ S80‧‧‧step
圖1是根據本發明一實施例的雷射焊接的異常事件的偵測系統的功能方塊圖。 FIG. 1 is a functional block diagram of an abnormal event detection system for laser welding according to an embodiment of the present invention.
圖2是應用圖1之偵測系統的雷射焊接機台的示意圖。 FIG. 2 is a schematic diagram of a laser welding machine using the detection system of FIG. 1.
圖3是根據本發明一實施例的雷射焊接的異常事件的偵測方法的流程圖。 3 is a flowchart of a method for detecting an abnormal event of laser welding according to an embodiment of the present invention.
圖4是量測訊號的一示範例的波形圖。 FIG. 4 is a waveform diagram of an exemplary measurement signal.
圖5是頻域訊號的第一示範例的波形圖。 FIG. 5 is a waveform diagram of a first exemplary example of a frequency domain signal.
圖6是頻域訊號的第二示範例的波形圖。 FIG. 6 is a waveform diagram of a second exemplary example of a frequency domain signal.
圖7是頻域訊號的第三示範例的波形圖。 FIG. 7 is a waveform diagram of a third exemplary example of a frequency domain signal.
圖8是頻域訊號的第四示範例的波形圖。 FIG. 8 is a waveform diagram of a fourth exemplary example of a frequency domain signal.
圖9是頻域訊號的第五示範例的波形圖。 FIG. 9 is a waveform diagram of a fifth exemplary example of a frequency domain signal.
圖1是根據本發明一實施例的雷射焊接的異常事件的偵測系統的功能方塊圖。參照圖1,雷射焊接的異常事件的偵測系統(以下簡稱「偵測系統10」)包括:一聲音/振動量測模組110以及一處理單元150。聲音/振動量測模組110包括一感測單元112以及一訊號產生電路114。訊號產生電路114耦接感測單元112,並且處理單元150耦接訊號產生電路114。 FIG. 1 is a functional block diagram of an abnormal event detection system for laser welding according to an embodiment of the present invention. Referring to FIG. 1, an abnormal event detection system for laser welding (hereinafter referred to as “detection system 10”) includes a sound / vibration measurement module 110 and a processing unit 150. The sound / vibration measurement module 110 includes a sensing unit 112 and a signal generating circuit 114. The signal generating circuit 114 is coupled to the sensing unit 112, and the processing unit 150 is coupled to the signal generating circuit 114.
圖2是應用圖1之偵測系統10的雷射焊接機台的示意圖。參照圖2,雷射焊接機台20包括焊接載台210、雷射焊頭230與機台控制組件250。雷射焊頭230對應於焊接載台210並設置於機台控制組件250上。待進行焊接的電子產品或其組件(以下通稱「焊接物30」)設置在焊接載台210上。機台控制組件250能移動焊頭230至欲進行焊接的位置並驅動焊頭230以雷射焊接方式將一組焊接物30(如,二鈑件)焊接在一起。於此,此組焊接物30的接合處形成一焊縫,即為焊點330。感測單元112用以感測至各組焊接物30進行雷射焊接時產生的振動波。 FIG. 2 is a schematic diagram of a laser welding machine using the detection system 10 of FIG. 1. 2, the laser welding machine 20 includes a welding stage 210, a laser welding head 230, and a machine control assembly 250. The laser welding head 230 corresponds to the welding stage 210 and is disposed on the machine control assembly 250. An electronic product or a component thereof (hereinafter referred to as “solder 30”) to be soldered is set on the soldering stage 210. The machine control assembly 250 can move the welding head 230 to a position to be welded and drive the welding head 230 to weld a group of welding objects 30 (for example, two sheet parts) together by laser welding. Here, a welding seam is formed at the joint of the group of welding objects 30, that is, the welding point 330. The sensing unit 112 is configured to sense vibration waves generated when laser welding is performed on each group of welding objects 30.
在一些實施例中,感測單元112可固定設置於焊接載台210上,或者固定設置在焊接載台210附近能接收到雷射焊接機台20進行焊接物30的雷射焊接時產生的振動波的任意位置。 In some embodiments, the sensing unit 112 may be fixedly disposed on the welding stage 210 or fixedly disposed near the welding stage 210 and capable of receiving vibrations generated by the laser welding machine 20 during laser welding of the welding object 30. Arbitrary position of wave.
在一些實施例中,機台控制組件250具有一移動組件、一驅動組件以及一處理單元(圖未示)。處理單元耦接移動組件與驅動組件。雷射焊頭230裝設在移動組件上並且耦接驅動組件。處理單元控制移動組件移動以帶動雷射焊頭230至欲進行焊接的位置,然後處理單元控制驅動組件驅動雷射焊頭230射出雷射束以進行焊接。在一實施例中,雷射焊接機台20與偵測系統10可個別設置獨立的處理單元進行各自的運作控制。在另一實施例中,雷射焊接機台20與偵測系統10亦可共用處理單元150進行運作的控制。以下以共用處理單元150為例進行檢測運作的說明。 In some embodiments, the machine control assembly 250 has a moving assembly, a driving assembly, and a processing unit (not shown). The processing unit is coupled to the moving component and the driving component. The laser welding head 230 is mounted on the moving component and is coupled to the driving component. The processing unit controls the moving component to move the laser welding head 230 to a position to be welded, and then the processing unit controls the driving component to drive the laser welding head 230 to emit a laser beam for welding. In an embodiment, the laser welding machine 20 and the detection system 10 may be provided with independent processing units to perform respective operation control. In another embodiment, the laser welding machine 20 and the detection system 10 can also share the processing unit 150 for operation control. The following describes the detection operation using the common processing unit 150 as an example.
圖3是根據本發明一實施例的雷射焊接的異常事件的偵測方法的流程圖。參照圖1至3,於處理單元150開始控制焊件運作時或之前,處理單元150啟動訊號產生電路114。於雷射焊接實施過程中,訊號產生電路114藉由感測單元112感測至少一組焊接物30進行雷射焊接時產生的振動波以得到一量測訊號(步驟S40)。在一些實施例中,此量測訊號可為相當於感測單元112感測到的振動波的原始類比訊號,或者是由訊號產生電路114對原始類比訊號進行強化處理而得的強化後類比訊號。其中,強化處理可為濾波、放大或其組合等不改變訊號本質的訊號處理程序。 3 is a flowchart of a method for detecting an abnormal event of laser welding according to an embodiment of the present invention. Referring to FIGS. 1 to 3, the processing unit 150 activates the signal generating circuit 114 when or before the processing unit 150 starts to control the operation of the weldment. During the laser welding implementation process, the signal generating circuit 114 senses at least one group of welding objects 30 during the laser welding by the sensing unit 112 to obtain a measurement signal (step S40). In some embodiments, the measurement signal may be an original analog signal corresponding to the vibration wave sensed by the sensing unit 112, or an enhanced analog signal obtained by the signal generation circuit 114 for strengthening the original analog signal. . The enhancement processing may be a signal processing program that does not change the essence of the signal, such as filtering, amplification, or a combination thereof.
在一實施例中,感測單元112可為一麥克風,而訊號產生電路114可為音訊輸入電路。換言之,音訊輸入電路藉由麥克風接收焊接物30進行雷射焊接時產生的聲音(聲波)以得到一聲音訊號。在另一實施例中,感測單元112可為一加速規。換言之,訊號產生電路114藉由加速規感測焊接物30進行雷射焊接時產生的振動(振動波)以得到一量測訊號。 In one embodiment, the sensing unit 112 may be a microphone, and the signal generating circuit 114 may be an audio input circuit. In other words, the audio input circuit receives a sound (sound wave) generated by the welding object 30 during laser welding through a microphone to obtain a sound signal. In another embodiment, the sensing unit 112 may be an acceleration gauge. In other words, the signal generating circuit 114 senses the vibration (vibration wave) generated when the welding object 30 performs laser welding with an accelerometer to obtain a measurement signal.
於此,如圖4所示,得到的量測訊號SS具有至少一有效訊號S1,並且每一有效訊號S1代表一組焊接物30的雷射焊接的執行。在一實施例中,處理單元150接收量測訊號SS並找出接收量測訊號SS中的每個有 效訊號S1。在一些實施例中,處理單元150依循發生時間找出量測訊號SS的每個有值訊號區段並且定義為有效訊號S1。換言之,任二有值訊號區段(任二有效訊號S1)之間存在有一空白時間區間。於此,有值訊號區段是指量測訊號SS中連續時間的一段訊號區段,且此段訊號區段具有不為零或大於強度閥值的至少一訊號峰值。其中,強度閥值為預設之正數值。 Here, as shown in FIG. 4, the obtained measurement signal SS has at least one valid signal S1, and each valid signal S1 represents the execution of laser welding of a group of welding objects 30. In one embodiment, the processing unit 150 receives the measurement signals SS and finds each valid signal S1 in the received measurement signals SS. In some embodiments, the processing unit 150 finds each valued signal segment of the measurement signal SS according to the occurrence time and defines it as a valid signal S1. In other words, there is a blank time interval between any two valuable signal sections (any two valid signals S1). Here, the valued signal segment refers to a signal segment of continuous time in the measurement signal SS, and this signal segment has at least one signal peak that is not zero or greater than the strength threshold. The strength threshold is a preset positive value.
處理單元150轉換各有效訊號S1為一頻域訊號(步驟S50)。並且,處理單元150根據各頻域訊號與至少一強度條件判定是否存在異常事件(步驟S60),即確認各頻域訊號是否滿足至少一強度條件。其中,當各頻域訊號滿足全部的強度條件時,處理單元150判定此組焊接物進行雷射焊接時不存在異常事件(步驟S70)。反之,當各頻域訊號未滿足任一強度條件時,處理單元150判定此組焊接物進行雷射焊接時存在異常事件(步驟S80)。在一些實施例中,異常事件可為失焦、雷射功率異常、材料離隙過大等製程參數異常。 The processing unit 150 converts each valid signal S1 into a frequency domain signal (step S50). In addition, the processing unit 150 determines whether there is an abnormal event according to each frequency domain signal and at least one intensity condition (step S60), that is, confirms whether each frequency domain signal satisfies at least one intensity condition. Wherein, when each frequency-domain signal satisfies all the intensity conditions, the processing unit 150 determines that there is no abnormal event when the group of welding objects performs laser welding (step S70). Conversely, when each frequency-domain signal does not satisfy any of the intensity conditions, the processing unit 150 determines that there is an abnormal event when the group of welding objects performs laser welding (step S80). In some embodiments, the abnormal event may be abnormal process parameters such as defocus, abnormal laser power, excessive material clearance, and the like.
在一些實施例中,至少一強度條件可包括對應一第一頻帶的一第一數值與對應一第二頻帶的一第二數值。換言之,針對每一頻域訊號,處理單元150以第一數值比對此頻域訊號於第一頻帶中多個時間點的聲音強度,以確認於第一頻帶中多個時間點的聲音強度是否均小於第一數值;並且,處理單元150還以第二數值比對此頻域訊號於第二頻帶中多個時間點的聲音強度,以確認於第二頻帶中多個時間點的聲音強度是否均小於第二數值。 In some embodiments, the at least one intensity condition may include a first value corresponding to a first frequency band and a second value corresponding to a second frequency band. In other words, for each frequency domain signal, the processing unit 150 compares the sound intensity of the frequency domain signal at multiple time points in the first frequency band with a first value to confirm whether the sound intensity at multiple time points in the first frequency band is Both are smaller than the first value; and the processing unit 150 compares the sound intensity of the frequency domain signal at multiple time points in the second frequency band with a second value to confirm whether the sound intensity at multiple time points in the second frequency band is Both are smaller than the second value.
當此頻域訊號於第一頻帶中多個時間點的聲音強度均小於第一數值且於第二頻帶中多個時間點的聲音強度均小於第二數值(即此頻域訊號滿足所有強度條件)時,處理單元150則判定此組焊接物進行雷射焊接時不存在異常事件(步驟S70)。 When the sound intensity of this frequency domain signal at multiple time points in the first frequency band is less than the first value and the sound intensity of multiple time points in the second frequency band is less than the second value (that is, this frequency domain signal meets all intensity conditions ), The processing unit 150 determines that there is no abnormal event during the laser welding of the group of welding objects (step S70).
反之,當此頻域訊號於第一頻帶中任一時間點的聲音強度大於或等於第一數值或於第二頻帶中任一時間點的聲音強度大於或等於第二數值(即此頻域訊號未滿足任一強度條件)時,處理單元150則判定此組焊接物進行雷射焊接時存在異常事件(步驟S80)。 Conversely, when the sound intensity of this frequency domain signal at any time point in the first frequency band is greater than or equal to the first value or the sound intensity at any time point in the second frequency band is greater than or equal to the second value (that is, this frequency domain signal When any strength condition is not satisfied), the processing unit 150 determines that there is an abnormal event when the group of welding objects performs laser welding (step S80).
其中,第一頻帶介於3000Hz至5000Hz,較佳為4000Hz。第二頻帶介於7000Hz至9000Hz,較佳為8000Hz。第一數值為1.9Pa。第二數值為1Pa。在一些實施例中,第一數值與第二數值可依據實際使用的製程參數而決定。 The first frequency band is between 3000 Hz and 5000 Hz, preferably 4000 Hz. The second frequency band is between 7000 Hz and 9000 Hz, preferably 8000 Hz. The first value is 1.9Pa. The second value is 1 Pa. In some embodiments, the first value and the second value may be determined according to a process parameter actually used.
在另一些實施例中,至少一強度條件包括對應一第一頻帶的一第一數值範圍與對應一第二頻帶的一第二數值範圍。換言之,針對每一頻域訊號,處理單元150以第一數值範圍比對此頻域訊號於第一頻帶中多個時間點的聲音強度,以確認於第一頻帶中多個時間點的聲音強度是否均落入第一數值範圍;並且,處理單元150還以第二數值範圍比對此頻域訊號於第二頻帶中多個時間點的聲音強度,以確認於第二頻帶中多個時間點的聲音強度是否均落入第二數值範圍。在一些實施例中,數值範圍可為由上限值與下限值所構成的一數值範圍。於此,落入數值範圍(第一數值範圍或第二數值範圍)是指小於上限值且大於下限值。未落入數值範圍則是指大於或等於上限值或者小於或等於下限值。 In other embodiments, the at least one intensity condition includes a first value range corresponding to a first frequency band and a second value range corresponding to a second frequency band. In other words, for each frequency domain signal, the processing unit 150 compares the sound intensity of the frequency domain signal at multiple time points in the first frequency band with a first numerical range to confirm the sound intensity at multiple time points in the first frequency band. Whether they all fall into the first numerical range; and the processing unit 150 compares the sound intensity of the frequency domain signal at multiple time points in the second frequency band with the second numerical range to confirm the multiple time points in the second frequency band Whether or not the sound intensity falls within the second numerical range. In some embodiments, the numerical range may be a numerical range composed of an upper limit value and a lower limit value. Here, falling within the numerical range (the first numerical range or the second numerical range) means that it is less than the upper limit value and greater than the lower limit value. Not falling within the value range means greater than or equal to the upper limit or less than or equal to the lower limit.
當此頻域訊號於第一頻帶中多個時間點的聲音強度均落入第一數值範圍且於第二頻帶中多個時間點的聲音強度均落入第二數值範圍(即此頻域訊號滿足所有強度條件)時,處理單元150則判定此組焊接物進行雷射焊接時不存在異常事件(步驟S70)。 When the sound intensity of the frequency domain signal at multiple time points in the first frequency band falls within the first numerical range and the sound intensity of multiple time points in the second frequency band falls within the second numerical range (i.e. When all the strength conditions are satisfied), the processing unit 150 determines that there is no abnormal event during the laser welding of the group of welding objects (step S70).
反之,當此頻域訊號於第一頻帶中任一時間點的聲音強度未落入第一數值範圍或於第二頻帶中任一時間點的聲音強度未落入第二 數值範圍(即此頻域訊號未滿足任一強度條件)時,處理單元150則判定此組焊接物進行雷射焊接時存在異常事件(步驟S80)。 Conversely, when the sound intensity of this frequency domain signal at any time point in the first frequency band does not fall within the first numerical range or the sound intensity at any time point in the second frequency band does not fall within the second numerical range (that is, this frequency When the domain signal does not satisfy any of the strength conditions), the processing unit 150 determines that there is an abnormal event when the group of welding objects performs laser welding (step S80).
其中,第一頻帶介於3000Hz至5000Hz,較佳為4000Hz。第二頻帶介於7000Hz至9000Hz,較佳為8000Hz。第一數值範圍為0.8Pa~1.9Pa。第二數值範圍為0.2Pa~1Pa。在一些實施例中,第一數值範圍與第二數值範圍可依據實際使用的製程參數而決定。 The first frequency band is between 3000 Hz and 5000 Hz, preferably 4000 Hz. The second frequency band is between 7000 Hz and 9000 Hz, preferably 8000 Hz. The first value range is 0.8Pa ~ 1.9Pa. The second value range is 0.2Pa ~ 1Pa. In some embodiments, the first numerical range and the second numerical range may be determined according to a process parameter actually used.
在一些實施例中,針對不同製程參數所使用的強度條件能透過事先以精準的製程參數對數組焊接物30進行雷射焊接、收音與訊號分析(訊號分析步驟同應用於後續雷射焊接製程的雷射焊接的異常事件的偵測方法中所使用的訊號分析步驟)及逐一目測與破壞性檢測來建立。 In some embodiments, the intensity conditions used for different process parameters can be achieved by performing laser welding, radio, and signal analysis on the array welding 30 with accurate process parameters in advance (the signal analysis steps are the same as those applied to subsequent laser welding processes). The signal analysis steps used in the laser welding abnormality detection method) and one by one visual inspection and destructive detection are established.
在一些實施例中,參照圖1,偵測系統10可更包括:一儲存單元170。儲存單元170耦接處理單元150,並且儲存前述的強度條件(第一數值範圍與第二數值範圍、或第一數值與第二數值)。其中,儲存單元170還可用以儲存用以實施雷射焊接的異常事件的偵測方法或其相關運作之軟體/韌體程式、資料、訊號及其組合等。 In some embodiments, referring to FIG. 1, the detection system 10 may further include a storage unit 170. The storage unit 170 is coupled to the processing unit 150 and stores the aforementioned intensity conditions (a first numerical range and a second numerical range, or a first numerical range and a second numerical value). Among them, the storage unit 170 may also be used to store software / firmware programs, data, signals, and combinations thereof used to implement a method for detecting abnormal events of laser welding or related operations.
以標準雷射焊接參數對1mm與2mm鋁合金鈑件進行雷射疊焊作業為例。在標準雷射焊接參數中,雷射聚焦位置落在上層鈑件的上表面,並且兩鈑件之間的間隙理想為0mm。於此,使用高功率雷射將兩片鋁合金鈑件(上層鈑件的厚度為1mm,且下層鈑件的厚度為2mm)以雷射光加熱/熔接在一起,並且於進行雷射疊焊作業的過程中以麥克風進行收音(錄音)以分析錄製到的聲音訊號。 Take standard laser welding parameters for laser welding of 1mm and 2mm aluminum alloy sheet metal parts as an example. In the standard laser welding parameters, the laser focus position falls on the upper surface of the upper sheet metal part, and the gap between the two sheet metal parts is ideally 0 mm. Here, high-power laser is used to heat / weld two aluminum alloy sheets (the thickness of the upper sheet is 1mm and the thickness of the lower sheet is 2mm), and perform laser welding During the process, the microphone is used for radio (recording) to analyze the recorded sound signal.
參照圖5,當雷射焊接參數均為正常時,聲音訊號轉換後的頻域訊號在4000Hz的聲音強度為1.15Pa且在8000Hz的聲音強度為 0.6Pa;可見,二頻率點的聲音強度落入各自對應的數值範圍(第一數值範圍和第二數值範圍)中。 Referring to FIG. 5, when the laser welding parameters are normal, the sound intensity of the frequency-domain signal after the sound signal conversion is 1.15 Pa at 4000 Hz and 0.6 Pa at 8000 Hz; it can be seen that the sound intensity at the two frequency points falls into In the corresponding numerical range (the first numerical range and the second numerical range).
參照圖6,當雷射焊接參數中雷射聚焦位置偏移至上層鈑件的上表面上方約2mm(絕對距離)的位置(其餘參數維持正常)時,聲音訊號轉換後的頻域訊號在4000Hz的聲音強度為1.9Pa且在8000Hz的聲音強度為1Pa;可見,相較於正常雷射焊接參數,二頻率點的聲音強度明顯上升且未落入各自對應的數值範圍中。 Referring to FIG. 6, when the laser focus position of the laser welding parameter is shifted to a position about 2 mm (absolute distance) above the upper surface of the upper sheet metal (the remaining parameters remain normal), the frequency-domain signal after the sound signal conversion is at 4000 Hz. The sound intensity is 1.9Pa and the sound intensity at 8000Hz is 1Pa. It can be seen that compared with the normal laser welding parameters, the sound intensity at the two frequency points has increased significantly and does not fall into their respective numerical ranges.
參照圖7,當雷射焊接參數中雷射聚焦位置偏移至上層鈑件的上表面上方約3mm(絕對距離)的位置(其餘參數維持正常)時,聲音訊號轉換後的頻域訊號在4000Hz的聲音強度為1.9Pa且在8000Hz的聲音強度為1.1Pa;可見,相較於正常雷射焊接參數,二頻率點的聲音強度明顯上升。 Referring to FIG. 7, when the laser focus position of the laser welding parameter is shifted to a position about 3 mm (absolute distance) above the upper surface of the upper sheet metal (the remaining parameters remain normal), the frequency domain signal after the sound signal conversion is at 4000 Hz. The sound intensity is 1.9 Pa and the sound intensity is 1.1 Pa at 8000 Hz. It can be seen that compared to the normal laser welding parameters, the sound intensity at the two frequency points has increased significantly.
參照圖8,當雷射焊接參數中雷射功率降低約30%(其餘參數維持正常)時,聲音訊號轉換後的頻域訊號在4000Hz的聲音強度為1.9Pa且在8000Hz的聲音強度為1.35Pa;可見,相較於正常雷射焊接參數,二頻率點的聲音強度明顯上升且未落入各自對應的數值範圍中。 Referring to FIG. 8, when the laser power in the laser welding parameters is reduced by about 30% (the remaining parameters remain normal), the frequency-domain signal after the sound signal conversion has a sound intensity of 1.9 Pa at 4000 Hz and 1.35 Pa at 8000 Hz. ; It can be seen that compared with the normal laser welding parameters, the sound intensity at the two frequency points significantly increases and does not fall into the corresponding numerical range.
參照圖9,當雷射焊接參數中兩鈑件之間的間隙加大0.4mm(其餘參數維持正常)時,聲音訊號轉換後的頻域訊號在4000Hz的聲音強度為0.8Pa且在8000Hz的聲音強度為0.2Pa;可見,相較於正常雷射焊接參數,二頻率點的聲音強度明顯下降且未落入各自對應的數值範圍中。 Referring to FIG. 9, when the gap between two sheet metal parts in the laser welding parameters is increased by 0.4 mm (the remaining parameters remain normal), the sound intensity of the converted frequency-domain signal at the frequency of 4000 Hz is 0.8 Pa and the sound at 8000 Hz The intensity is 0.2Pa; it can be seen that compared with the normal laser welding parameters, the sound intensity at the two frequency points is significantly reduced and does not fall into the corresponding numerical range.
在一些實施例中,前述之處理單元可由一個或多個處理元件所實現。於此,各處理元件可以是例如微處理器、微控制器、數位信號處理器、微型計算機、中央處理器、場編程閘陣列、可編程邏輯設備、狀 態器、邏輯電路、類比電路、數位電路和/或任何基於操作指令操作信號(類比和/或數位)的設備等。 In some embodiments, the aforementioned processing unit may be implemented by one or more processing elements. Here, each processing element may be, for example, a microprocessor, a microcontroller, a digital signal processor, a microcomputer, a central processing unit, a field programmable gate array, a programmable logic device, a state device, a logic circuit, an analog circuit, or a digital circuit. And / or any device that operates on signals (analogs and / or digits) based on operating instructions.
在一些實施例中,前述之儲存單元可由一個或多個儲存元件所實現。於此,各儲存元件可以是例如記憶體或暫存器等,但在此並不對其限制。 In some embodiments, the aforementioned storage unit may be implemented by one or more storage elements. Here, each storage element may be, for example, a memory or a register, but it is not limited thereto.
在一些實施例中,前述之焊接物30可為電動汽車的電池電極、或電路板的固定結構等,但在此並不對其限制。 In some embodiments, the foregoing soldering object 30 may be a battery electrode of an electric vehicle, or a fixing structure of a circuit board, but it is not limited thereto.
需注意的是,雖然前述依序描述各步驟,但此順序並非本發明之限制,熟習相關技藝者應可瞭解在合理情況下部分步驟的執行順序可同時進行或先後對調。 It should be noted that although the foregoing steps are described in sequence, this order is not a limitation of the present invention. Those skilled in the art should understand that under reasonable circumstances, the execution order of some steps can be performed simultaneously or reversed.
綜上,根據本發明的雷射焊接的異常事件的偵測方法及其偵測系統,其利用振動波的感測單元感測各組焊接物進行雷射焊接時產生的振動波並透過分析振動波的量測訊號的頻域訊號來判定雷射焊接製程是否存在異常事件,藉以即時警告焊接時所發生的異常事件(如,失焦、雷射功率異常、材料離隙過大等製程參數異常),並且能進一步即時矯正(如,依據檢測結果解焊具有不合格焊點的焊接物並重新進行解焊後的焊接物焊接),進而提升電子產品的可靠度及耐久性。 In summary, according to the method and system for detecting abnormal events of laser welding according to the present invention, a vibration wave sensing unit is used to sense the vibration waves generated by each group of welding objects during laser welding and analyze the vibrations. The frequency-domain signal of the wave measurement signal is used to determine whether there are abnormal events in the laser welding process, so as to immediately warn about abnormal events that occur during welding (such as out-of-focus, abnormal laser power, excessive material clearance, etc.) , And can be further corrected immediately (for example, desoldering solders with unqualified solder joints and re-soldering solders after desoldering according to the test results), thereby improving the reliability and durability of electronic products.
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