TW201822228A

TW201822228A - Electrical contact component

Info

Publication number: TW201822228A
Application number: TW106125229A
Authority: TW
Inventors: 山田勝信; 石川正治
Original assignee: 日商松下知識產權經營股份有限公司
Priority date: 2016-07-27
Filing date: 2017-07-27
Publication date: 2018-06-16
Also published as: WO2018021228A1

Abstract

In order to provide an electrical connection component for which contact reliability is improved and a sufficient bonding strength can be achieved, this electrical connection component (10) is provided with: a base material (101); a contact part (100) that is disposed in a first region on the outer surface of the base material (101) and is electrically connected, by contact, to another electrical circuit or another electrical contact component; and a bonding part (500) that is disposed in a second region which is different from the first region on the outer surface of the base material (101), and is connected, by bonding, to an external conductive member. The contact part (100) and the bonding part (500) are each provided with: a first plating layer (102) formed on the outer surface of the base material (101); and carbon nanomaterials (104) that are held in the first plating layer (102) and protrude from the outer surface of the first plating layer (102). The bonding part (500) is provided with a second plating layer (501) that is formed on the outer surface of the first plating layer (102) of the bonding part (500) and that covers the carbon nanomaterials (104) that protrude from the outer surface of the first plating layer (102) of the bonding part (500).

Description

Electrical connection member

本發明係關於電連接構件。詳細而言，本發明係關於繼電器及開關的接點零件以及連接器的端子零件等之電連接構件。The present invention relates to an electrical connection member. Specifically, the present invention relates to electrical connection members such as contact parts of relays and switches, and terminal parts of connectors.

以往，以提昇接觸可靠性作為目的，具備含有碳奈米材料的鍍層之電連接構件已被提出。例如，於專利文獻1記載的電接點零件200中，如第11圖所示般，於母材210的表面設置鍍層220，於鍍層220保持有碳奈米材料230（例如，日本特開2013-011016）。碳奈米材料230，係碳奈米管或碳黑等，且被設置成露出於鍍層220的表面。因而，碳奈米材料230，係比鍍層220更容易接觸其他構件，使電接點零件200的接觸可靠性提昇。　　於電接點零件200中，係藉由焊接等而接合於電路圖案等之導體，但，若碳奈米材料230露出於該接合部分之鍍層220的表面，則有著鍍層220的表面之焊料的潤濕性會降低而難以得到充分的接合強度之問題。Conventionally, an electrical connection member provided with a plating layer containing a carbon nanomaterial has been proposed for the purpose of improving contact reliability. For example, in the electrical contact part 200 described in Patent Document 1, as shown in FIG. 11, a plating layer 220 is provided on the surface of the base material 210, and a carbon nano material 230 is held on the plating layer 220 (for example, Japanese Patent Application Laid-Open No. 2013) -011016). The carbon nano material 230 is a carbon nano tube, carbon black, or the like, and is provided to be exposed on the surface of the plating layer 220. Therefore, the carbon nano material 230 is easier to contact other components than the plating layer 220, and the contact reliability of the electrical contact part 200 is improved. The electrical contact part 200 is a conductor that is bonded to a circuit pattern or the like by soldering or the like. However, if the carbon nanomaterial 230 is exposed on the surface of the plating layer 220 at the joint portion, the solder having the surface of the plating layer 220 is soldered. There is a problem that wettability decreases and it is difficult to obtain sufficient bonding strength.

本發明係鑑於上述之點而完成者，其目的在於，提供接觸可靠性提昇且可得到充分的接合強度的電連接構件。　　本發明之一樣態之電連接構件，其特徵為，具備有：母材、接觸部、以及接合部，　　該接觸部，係配置於前述母材之表面上的第1區域，並與其他電路或其他電接點零件藉由接觸而電連接；　　該接合部，係配置於與前述第1區域不同之前述母材之表面上的第2區域，與外部的導電構件藉由接合而連接，　　前述接觸部及前述接合部分別具備第1鍍層及碳奈米材料，該第1鍍層係形成於前述母材的表面；該碳奈米材料，係被前述第1鍍層保持，並從前述第1鍍層的表面突出，　　前述接合部具備第2鍍層，該第2鍍層，係形成於前述接合部之前述第1鍍層的表面，並覆蓋前述接合部之從前述第1鍍層的表面突出的前述碳奈米材料。　　本發明係由於碳奈米材料從設於接觸部之第1鍍層的表面突出，因此不會損害接觸部之接觸可靠性，於接合部中係以第2鍍層覆蓋碳奈米材料，藉此，因碳奈米材料導致之接合部的密合性之降低會被抑制，而可得到充分的接合強度。The present invention has been made in view of the foregoing points, and an object thereof is to provide an electrical connection member having improved contact reliability and sufficient bonding strength. An electrical connection member according to the present invention includes a base material, a contact portion, and a joint portion. The contact portion is arranged in a first region on the surface of the base material, and is connected to other circuits or circuits. Other electrical contact parts are electrically connected by contact; The joint is located in a second area on the surface of the base material different from the first area, and is connected to an external conductive member by joining, the contact And the joint portion are respectively provided with a first plating layer and a carbon nanomaterial, and the first plating layer is formed on the surface of the base material; the carbon nanomaterial is held by the first plating layer and is separated from the first plating layer. The surface protrudes, and the bonding portion includes a second plating layer formed on a surface of the first plating layer of the bonding portion and covering the carbon nanomaterial protruding from the surface of the first plating layer of the bonding portion. . In the present invention, since the carbon nano material protrudes from the surface of the first plating layer provided on the contact portion, the contact reliability of the contact portion is not impaired. The carbon nano material is covered with the second plating layer in the joint portion, thereby, A decrease in the adhesion of the joint portion due to the carbon nanomaterial is suppressed, and sufficient joint strength can be obtained.

以下，說明用以實施本發明之形態。（電連接構件之概要）　　本實施形態之電連接構件係具有：藉由接觸而電連接的接觸部、及藉由接合而連接的接合部。作為如此之電連接構件，係可例示繼電器及開關的接點零件以及連接器的端子零件等。作為接點零件，係可例示固定接點零件與可動接點零件等。作為端子零件，係可例示適用於插頭、插口（jack）、插孔（receptacle）、插座（socket）、排針（Pin Header）等之各種的連接器者。　　電連接構件之接觸部係接觸其他構件的部分。在此，「其他構件」係意味著該電連接構件以外的構件，且為其他電路或其他電接點零件。例如，在電連接構件為固定接點零件的情況，於其成對之可動接點零件係成為其他構件。亦即，於固定接點零件及可動接點零件中，該等可相互接觸的部分被形成作為接觸部。此外，在電連接構件為連接器之端子零件的情況，設於另一連接器的端子零件係成為其他構件。亦即，於連接器之端子零件中，設於被機械性連接的複數個連接器之各者的端子零件可相互接觸的部分被形成作為接觸部。藉由接觸部與其他構件接觸，而將電連接構件與其他構件電連接。　　電連接構件之接合部，係藉由接合而機械性連接於其他構件的部分。在此，「其他構件」係意味著該電連接構件以外的構件，且為外部之導電構件。此外，接合，係可例示焊接、打線結合（WB）、熔接、填隙（calking）等。例如，在電連接構件為固定接點零件及可動接點零件的情況，安裝該等之固定彈簧及可動彈簧等係成為其他構件。亦即，於固定接點零件及可動接點零件中，與其他構件接觸並結合的部分被形成作為接合部。此外，在電連接構件為連接器之端子零件的情況，安裝連接器之印刷配線板的電路圖案等係成為其他構件。亦即，於連接器之端子零件中，藉由焊接等機械性連接於其他構件的部分被形成作為接合部。藉由接合部與其他構件接合，而將電連接構件與其他構件電連接及機械性連接。　　接觸部與接合部雖然皆形成於母材之表面上，但接觸部係配置於母材之表面上的第1區域，接合部係配置於與第1區域不同的前述母材之表面上的第2區域。（接合部之說明）　　第1A圖係顯示電連接構件10之接合部500的概略圖。接合部500係被形成為具備：母材101、第1鍍層102、第2鍍層501、以碳奈米材料104。　　母材101係電連接構件10的基體，且因應使用目的而成形為所期望的形狀。母材101，係由銅或銅合金等之使用於電連接構件10之周知的金屬材料所形成。作為銅合金係可列舉：Cu-Ti、Cu-Ti-Fe、Cu-Be、Cu-Sn-P系、Cu-Zn系、Cu-Ni-Zn系、Cu-Ni-Si系、Cu-Fe-P系合金等。另外，母材101，亦可於表面具有用以提高與第1鍍層102之密合性的Ni鍍膜等之基底層。　　第1鍍層102，係附著於母材101之表面的鍍膜。第1鍍層102，係由結晶質或非晶質（amorphous）的金屬鍍膜所形成。第1鍍層102，只要考慮對母材101之附著性及碳奈米材料104之保持性、硬度、耐蝕性等，來決定其材質及厚度等即可。第1鍍層102之材質，較佳為由Ni或Ni-P合金所形成。第1鍍層102之膜厚，較佳為5μm以下。比5μm更厚的膜厚時，係有第1鍍層102之彈性容易消失，而容易發生因應力造成之裂縫的情況。為了確保碳奈米材料104之保持性等，第1鍍層102之膜厚的下限較佳係設為0.1μm。進而，若考慮接觸部100之耐蝕性的提昇，則第1鍍層102之膜厚，較佳為0.5μm以上，更佳為1μm以上。　　第2鍍層501，係附著於第1鍍層102之表面的鍍膜。第2鍍層501，係具備有被覆鍍層502及保護鍍層103，該被覆鍍層502，係形成於第1鍍層102的表面；該保護鍍層103，係形成於被覆鍍層502的表面。　　被覆鍍層502，係被覆從第1鍍層102之表面突出的碳奈米材料104之鍍敷。亦即，於接合部500中，從第1鍍層102之表面突出的碳奈米材料104，係被被覆鍍層502覆蓋而不露出被覆鍍層502之表面。藉此，因碳奈米材料104導致之接合部500的焊料之潤濕性的降低被抑制。　　被覆鍍層502，較佳係考慮與第1鍍層102之密合性、焊料潤濕性、與保護鍍層103之密合性等，而與第1鍍層102相同地由Ni或Ni-P合金所形成。被覆鍍層502之厚度，只要比從第1鍍層102之碳奈米材料104的突出長度更厚即可，例如，較佳為0.01μm以上、1.5μm以下，更佳為0.03μm以上、1.2μm以下。　　保護鍍層103，係用以抑制因第1鍍層102及被覆鍍層502與碳奈米材料104之電位差所產生的第1鍍層102及被覆鍍層502之腐蝕的鍍敷。於第11圖所示之以往例中，於亞硫酸氣體試驗等之嚴苛的耐蝕性試驗中，於鍍層220容易產生腐蝕。其係鍍層220與碳奈米材料230成為局部電池的間隙腐蝕。亦即，於鍍層220被覆碳奈米材料230的部分（界面部分），因鍍層220之凹凸變化等產生有間隙的情況時，於該間隙因鍍層220與碳奈米材料230之電位差導致之局部電池會作用，而產生間隙腐蝕。本實施形態之保護鍍層103，係抑制此間隙侵蝕之發生者。　　保護鍍層103，較佳係含有比第1鍍層102及被覆鍍層502中所含有的金屬元素更貴重的金屬元素。於此情況中，保護鍍層103，相較於第1鍍層102及被覆鍍層502，其相對於碳奈米材料104之電位差變小，保護鍍層103係比第1鍍層102及被覆鍍層502更不易產生腐蝕。其結果，第1鍍層102及被覆鍍層502被不易產生腐蝕的保護鍍層103被覆，於第1鍍層102及被覆鍍層502氧、水分、其他的腐蝕成分難以作用，而第1鍍層102及被覆鍍層502之腐蝕被抑制。　　具體而言，在第1鍍層102及被覆鍍層502由Ni鍍敷或Ni-P合金鍍敷所形成的情況，保護鍍層103，係可以選自由Cu、Sn、Au、Ag、Pd、Rh、Ru組成之群的1種或複數種的金屬元素所構成的鍍敷來形成。此外，在第1鍍層102及被覆鍍層502由Ni鍍敷或Ni-P合金鍍敷所形成的情況，保護鍍層103，係可以包含選自由Cu、Sn、Au、Ag、Pd、Rh、Ru組成之群的1種或複數種的金屬元素之合金鍍層來形成。作為此合金鍍敷，可列舉例如：Ni-Cu鍍敷、Ni-Sn鍍敷、Ni-Au鍍敷、Ni-Ag鍍敷、Ni-Pd鍍敷、Ni-Ph鍍敷、Ni-Ru鍍敷等。此外，保護鍍層103，係只要比第1鍍層102及被覆鍍層502耐蝕性更高即可，因此，例如，在第1鍍層102及被覆鍍層502由Ni鍍敷或Ni-P合金鍍敷所形成的情況，保護鍍層103係可以Ni-W鍍敷、Ni-B鍍敷、Ni-Fe鍍敷等來形成。進而，保護鍍層103，係只要保護第1鍍層102及被覆鍍層502不受腐蝕即可，因此，例如，保護鍍層103係可以Zn鍍敷來形成。於此情況中，藉由Zn鍍敷之犧牲防蝕作用，而藉由保護鍍層103抑制第1鍍層102及被覆鍍層502之腐蝕。此外，保護鍍層103，較佳係包含與被覆鍍層502形成金屬間化合物的金屬元素，焊料潤濕性優異亦佳。　　保護鍍層103之厚度，較佳為0.01μm以上、1.5μm以下，更佳為0.05μm以上、1.0μm以下。若保護鍍層103之厚度為此範圍，則第1鍍層102及被覆鍍層502之腐蝕容易被保護鍍層103所抑制。此外，上述Ni合金鍍敷，較佳係Ni以外之金屬元素的濃度為6質量%以上、12質量%以下，更佳係8質量%以上、10質量%以下。若為此範圍，則Ni鍍層不會過硬，而不易發生破裂等，此外，亦容易確保耐蝕性。　　保護鍍層103係因應需要而設置。亦即，在對電連接構件10要求高耐蝕性的情況，較佳係設有保護鍍層103，但，在不要求高耐蝕性的情況，亦可不特別設置保護鍍層103。　　第2鍍層501之厚度，較佳係被覆鍍層502之厚度與保護鍍層103之厚度的合計為0.03μm以上、2.0μm以下，藉此，容易覆蓋從第1鍍層102之表面突出的碳奈米材料104。第2鍍層501之厚度，更佳為0.05μm以上、1.8μm以下。　　碳奈米材料104係奈米級尺寸的碳材料，例如，碳奈米管（CNT）、碳黑（CB）、富勒烯、石墨烯等。碳奈米材料104，較佳為化學性安定且電傳導性、滑動性、機械性強度優異者。CNT，較佳係直徑為100nm以上、200nm以下，長度10μm以上、20μm以下。更佳係，CNT以直徑為120nm以上、180nm以下，長度12μm以上、18μm以下為佳。此外，CNT雖存在有石墨之薄片捲成1層筒狀的單層CNT、及石墨之薄片捲成2層以上之多層的多層CNT，但由於多層CNT比單層CNT量產性優異，且可較低價取得，因此在可抑制成本的點上為佳。CB為粒子狀，其粒徑較佳係藉由雷射繞射法等進行之測定為數nm以上、100nm以下。此外，CB，係電傳導性優異的品種，較佳係該各粒子以成為簇狀之微米級的大小之集合體的狀態存在。CB，由於比CNT量產性優異，且可較低價取得，因此在可抑制成本的點上為佳。　　第1A圖，係於接合部500中，針對碳奈米材料104為CNT的情況作顯示。此CNT，係其一端被埋入並固定於第1鍍層102。如此一來，CNT係被第1鍍層102保持。CNT，雖從第1鍍層102的表面突出，但被埋在被覆鍍層502內。　　碳奈米材料104被形成為與第1鍍層102之複合鍍敷。碳奈米材料104之使用量，相對於碳奈米材料104與第1鍍層102之合計量，較佳為0.02質量%以上、2.0質量%以下，更佳為0.05質量%以上至1.8質量%以下。若碳奈米材料104之使用量為上述之範圍，則可充分得到因碳奈米材料104所致之後述之接觸部100的接觸可靠性之提昇，此外，容易充分確保碳奈米材料104對於鍍液之分散性及第1鍍層102對於母材101之密合性。（接觸部之說明）　　第1B圖係顯示電連接構件10之接觸部100的概略圖。接觸部100係具備：與接合部500相同的母材101、第1鍍層102、保護鍍層103、以及碳奈米材料104所形成。亦即，接觸部100係不形成被覆鍍層502，而是碳奈米材料104從表面露出。　　於接觸部100中，母材101與第1鍍層102，係與接合部500的情況相同地形成。此外，於接觸部100中，係於第1鍍層102的表面形成有保護鍍層103。於此情況中，保護鍍層103，並未完全地覆蓋從第1鍍層102之表面突出的碳奈米材料104。亦即，保護鍍層103，係僅覆蓋碳奈米材料104之根部（第1鍍層102之表面的附近部分）。因而，於接觸部100中，碳奈米材料104，係貫穿保護鍍層103，且碳奈米材料104之前端，係從保護鍍層103的表面突出。保護鍍層103，係與上述相同地，用以抑制因第1鍍層102與碳奈米材料104之電位差所產生的第1鍍層102之腐蝕的鍍敷。於接觸部100中，從CNT之保護鍍層103的表面之突出長度較佳為0.1μm～10μm。　　另外，與接合部500之情況相同地，於接觸部100中，保護鍍層103亦為因應需要而設置。亦即，在對電連接構件10要求高耐蝕性的情況，較佳係設有保護鍍層103，但，在不要求高耐蝕性的情況，亦可不特別設置保護鍍層103。（鍍敷步驟）　　在形成上述之接觸部100及接合部500時，首先，於母材101的表面形成由碳奈米材料104與第1鍍層102所構成的複合鍍層。此複合鍍層，係藉由電鍍（電解鍍敷）而形成於母材101的表面。於此情況中，藉由使包含Ni及P等之金屬元素與碳奈米材料104的鍍液附著於母材101的表面，並進行通電，而析出形成保持碳奈米材料104之第1鍍層102。　　在此，碳奈米材料104，由於是以接觸部100與其他構件之接觸性的提昇為主目的，因此一般認為僅設置於母材101之接觸部100形成的部分。於此情況中，雖藉由部分浸漬法、點鍍法、使用噴霧器（sparger）之鍍敷法、遮罩鍍敷法、抗鍍劑鍍敷法等之部分鍍敷法，部分地形成由碳奈米材料104與第1鍍層102所構成的複合鍍層，但如此之複合鍍層，其鍍敷條件嚴密，且藉由如上述般之方法進行部分鍍敷係非常繁雜。尤其，母材101係非常小，難以在多數個母材101連成一串的捲帶材（hoop）部分地施行上述之複合鍍敷。因此，於本實施形態中，係於電連接構件10之成為基材的母材101之全體形成由碳奈米材料104與第1鍍層102所構成的複合鍍層，藉此，無須於母材101部分地形成複合鍍敷，煩雜度減輕，而電連接構件10之生產性提昇。　　接著，於接合部500所形成的部分中，於第1鍍層102的表面形成被覆鍍層502。被覆鍍層502係藉由上述所例示之部分鍍敷法所形成。例如，被覆鍍層502，係可藉由電鍍而形成。亦即，藉由使包含Ni等之金屬元素的鍍液附著於第1鍍層102的表面，並進行通電，而析出形成被覆鍍層502。被覆鍍層502，係不含碳奈米材料之鍍敷，由於並非如第1鍍層102般之複合鍍敷，因此鍍敷條件並不如複合鍍敷嚴密，而不會煩雜。　　接著，保護鍍層103係因應需要而形成。保護鍍層103，係可設於接觸部100與接合部500之雙方，亦可雙方皆不設置，亦可僅設於單方。此外，保護鍍層103，亦可設於接觸部100與接合部500以外的部分。於成為接觸部100的部分中，保護鍍層103係形成於第1鍍層102的表面。於成為接合部500的部分中，保護鍍層103係形成於被覆鍍層502的表面。（電連接構件之使用例）　　第2圖係顯示端子零件20a、20b。該等端子零件20a、20b，係分別被組入連接器之成為對的連接構件（例如，插頭與插座等）。端子零件20a、20b，係藉由連接構件之連接，而將一端之端子零件20a的接觸部21a、與另一方之端子零件20b的接觸部21b接觸，藉此，將端子零件20a與端子零件20b電接觸。此外，端子零件20a之接合部22a及端子零件20b之接合部22b，係分別藉由焊接等而接合於印刷配線板等之電路圖案的導體或配線的導體等。接著，端子零件20a、20b之一方或雙方可形成作為本實施形態之電連接構件10。亦即，接觸部21a、21b之一方或雙方可形成具有第1B圖所示的結構，接合部22a、22b之一方或雙方可形成具有第1A圖所示的結構。　　第3圖係顯示開關30之概略圖。此開關30係按鈕35突出設置於箱體31的上面。按鈕35係形成為以槓桿33按壓自如。於箱體31內，於按鈕35係設置有彈簧34。於彈簧34的前端，可動接點零件30a係突出設置於彈簧34的上下兩面。此外，於箱體31內，於可動接點零件30a的上方及下方，係設置有固定接點零件30b。各固定接點零件30b、30c，係分別接合於接點台36b、36c。此開關30，係藉由操作槓桿33而按壓按鈕35，使彈簧34動作，藉此而形成為：在可動接點零件30a與上方之固定接點零件30c接觸，且與下方之固定接點零件30b分離的狀態、與可動接點零件30a與上方之固定接點零件30c分離，且與下方之固定接點零件30b接觸的狀態之間進行切換。接著，藉由可動接點零件30a與固定接點零件30b接觸，而進行電連接。　　開關30，係可動接點零件30a與固定接點零件30b之一方或雙方可形成作為本實施形態之電連接構件10。亦即，可動接點零件30a的接觸部（與固定接點零件30b、30c接觸的部分）31a、固定接點零件30b、30c的接觸部（與可動接點零件30a接觸的部分）31b、31c之一方或雙方可形成具有第1B圖所示的結構。此外，可動接點零件30a的接合部（與彈簧34接合的部分）32a、固定接點零件30b、30c的接合部（與接點台36b、36c接合的部分）32b、32c之一方或雙方可形成具有第1A圖所示的結構。另外，在將可動接點部30a接合於彈簧34時，雖主要是使用鉚接，但亦可藉由熔接或焊接來接合。固定接點零件30b、30c與接點台36b、36c，主要是藉由熔接或焊接來接合。　　第4圖係顯示繼電器40之概略圖。此繼電器40，係在以本體42與箱體43所包圍的空間具備有電磁塊44與接點塊45。電磁塊44係具備有：線圈線46、線圈架47、鐵心48、電樞49、以及軛50。電連接於線圈線46的線圈端子51係於本體42從底面突出。接點塊45係具備有：可動彈簧52、可動接點零件40a、固定彈簧53、以及固定接點零件40b。電連接於可動接點零件40a與固定接點零件40b的接點端子54係於本體42從底面突出。電樞49與可動彈簧52係藉由卡55來連接。此繼電器40，係藉由對線圈線46之通電/不通電而使電樞49動作，藉此，使可動彈簧52動作，而形成為在可動接點零件40a與固定接點零件40b接觸的狀態、與可動接點零件40a與固定接點零件40b分離的狀態之間進行切換。接著，藉由可動接點零件40a與固定接點零件40b接觸，而進行電連接。　　繼電器40，係可動接點零件40a與固定接點零件40b之一方或雙方可形成作為本實施形態之電連接構件10。亦即，可動接點零件40a的接觸部（與固定接點零件40b接觸的部分）41a、與固定接點零件40b的接觸部（與可動接點零件40a接觸的部分）41b之一方或雙方可形成具有第1B圖所示的結構。此外，可動接點零件40a的接合部（與可動彈簧52接合的部分）42a、與固定接點零件40b的接合部（與固定彈簧53接合的部分）42b之一方或雙方可形成具有第1A圖所示的結構。另外，在將可動接點零件40a接合於可動彈簧52，或將固定接點零件40b接合於固定彈簧53時，雖主要是使用鉚接，但亦可藉由熔接或焊接來接合。（本實施形態之效果）　　本實施形態之電連接構件10，係具備藉由接觸而進行電連接的接觸部100，由於此接觸部100具有碳奈米材料104，因此即使為低接觸壓力，亦可藉由碳奈米材料104不損害並確保與其他構件之接觸而進行電連接，而容易確保在低接壓區域之接觸可靠性。　　此外，本實施形態之電連接構件10，係由於在接觸部100的表面、與和接觸部100接觸之其他構件之間介在碳奈米材料104，因此可減少接觸部100與其他構件之凝集/磨耗，而容易提昇電連接構件10之耐黏著性。因而，若將如上述般之電連接構件10作為開閉次數多的開關或繼電器等之接點零件使用，則不易引起黏著現象，此外，可容易謀求長壽命化，而為佳。　　此外，本實施形態之電連接構件10，係具備藉由接合而進行機械性連接的接合部500，由於此接合部500具有覆蓋從第1鍍層102之表面突出的碳奈米材料104之第2鍍層501，因此可減低接合部500之表面的碳奈米材料104之露出，而可提高接合部500之表面與其他構件之密著性來提高接合強度。　　進而，本實施形態之電連接構件10，係於保持碳奈米材料104的第1鍍層102之表面設有保護鍍層103，該保護鍍層103，係用以抑制因第1鍍層102與碳奈米材料104之電位差所產生的腐蝕。因而，本實施形態之電連接構件10，係可抑制第1鍍層102之腐蝕，而提高耐蝕性。 [實施例] 　　以下，藉由實施例來具體地說明本發明。（實施例1）　　作為母材，係使用材質為銅板或是被成形為適用於連接器之接點零件的形狀之磷青銅或鈦銅等之Cu合金。　　於母材之全體形成有具備碳奈米材料與第1鍍層的複合鍍層。在此，作為碳奈米材料，係使用含有CNT的Ni-P合金鍍液。作為CNT係使用昭和電工（股）製之VGCF。此CNT為多層之CNT。此外，CNT之直徑（外徑）為100～200nm，且長度為10～20μm之範圍。Ni-P合金鍍液之組成，係硫酸鎳（1mol/dm³ ）、氯化鎳（0.2mol/dm³ ）、硼酸（0.5mol/dm³ ）、檸檬酸（0.5mol/dm³ ）、膦酸（1.0mol/dm³ ）、作為分散劑之分子量5000的聚羧酸（2×10^-4 mol/dm³ ）。含有CNT的Ni-P合金鍍液，係將CNT之混合量設為2g/dm³ 。此外，含有CNT的Ni-P合金鍍液係設為鍍浴，並設為浴溫50±10℃、電流密度1~15A/dm² 之鍍敷條件。接著，形成作為Ni-P合金鍍層之第1鍍層的厚度為1.5μm、CNT之含量為1.0質量%的含CNT之Ni-P合金鍍層。　　接著，於成為接合部的部分中，於第1鍍層的表面形成被覆鍍層。藉由此被覆鍍層來被覆從第1鍍層之表面突出的CNT，以避免露出於外部。被覆鍍層係厚度1.5μm之Ni鍍膜，鍍敷條件，係在胺磺酸鎳（450g/l）、氯化鎳（3g/l）、硼酸（30g/l）、添加劑（適量）、防坑劑（適量）、pH=3.0~4.5、浴溫40~50℃下進行電鍍1分鐘。　　接著，於成為接觸部的部分及成為接合部的部分中，形成保護鍍層。於成為接觸部的部分中，係於第1鍍層的表面形成保護鍍層。於成為接合部的部分中，係於被覆鍍層的表面形成保護鍍層。保護鍍層係以Sn鍍敷所形成。於此情況中，作為鍍液係使用石原藥品股份有限公司製之「PF-095S」，並在浴溫35℃、電流密度3ASD之條件下形成Sn鍍敷。保護鍍層之厚度係設為0.3μm以上。　　以如此方式來形成電連接構件。於接觸部中，雖CNT從保護鍍層的表面突出，但於接合部中，CNT並未從由被覆鍍層與保護鍍層所構成之第2鍍層的表面突出。（實施例2）　　取代Sn鍍敷而藉由Au-Co合金鍍敷來形成厚度0.3μm之保護鍍層，除此之外，以與實施例1相同方式來形成電連接構件。於此情況中，作為鍍液係使用日本高純度化學公司製之「OROBRIGHT BAR7」，在浴溫50℃、電流密度5A/dm² 之條件下形成Au-Co合金鍍敷。（比較例1）　　除了不形成第2鍍層（被覆鍍層及保護鍍層）以外，皆與實施例1相同方式。於此情況中，於成為接合部的部分中，CNT係從第1鍍層的表面突出。（接觸可靠性之評估）　　針對上述之各實施例及比較例1，進行電連接構件之接觸部的亞硫酸氣體試驗後之接觸電阻值的測定。亞硫酸氣體試驗，係將各實施例及比較例1放置於溫度40±2℃、濕度90±3%RH、亞硫酸氣體濃度10±3ppm之條件下48小時來進行。　　於接觸電阻值之測定中，係使用（股）山崎精機研究所製作之電接點模擬器（型號CRS-113-AU型）。為了藉由交流4端子法進行測定，於測定值中不包含引線、連接器部等之固有電阻，而計測使接觸荷重變化時之接觸電阻值。藉由電動載台，以一定荷重掃描接觸位置，亦可進行想像於開關及繼電器接點之摩擦接觸（wiping）的測定。另外，以接觸力0.2N進行接觸電阻值之測定。此外，各實施例及比較例1係分別各以5個（樣品No.1～5）進行評估。將結果顯示於表1。　　如此結果得以明瞭般，各實施例可說是相較於比較例1接觸電阻值較小，在低接觸壓力區域下之接觸可靠性較高。　　此外，針對實施例1之5個，測定因接觸荷重之變化導致之電阻值的變化。將結果顯示於第6圖。如由第6圖所明瞭般地，於本實施形態之電連接構件中，即使接觸荷重0.1N亦顯示安定的接觸電阻值。（接合性之評估）　　針對各實施例及比較例1，進行焊接安裝後之插拔試驗。亦即，針對各實施例及比較例1，將電連接構件之接合部焊接於印刷配線板之導體電路圖案，其後，利用插拔試驗機，對於印刷配線板的表面以朝垂直方向拔出的方式來對電連接構件賦予荷重。拔出速度係設為2mm/min。接著，測定電連接構件從導體電路圖案分離時的力（剝離強度）。將結果顯示於表2。另外，對於導體電路圖案之電連接構件之接合部的焊接，係如以下方式進行。使用厚度0.12mm之遮罩，將無鉛焊料的糊料以成為Φ4.5mm之圓之形狀的方式塗佈於接合部的表面。焊料糊料係使用千住金屬工業（股）製之M705-221BM5-32-11.2K。安裝條件係設為在大氣下使用有第5圖之溫度輪廓的回焊。此外，各實施例及比較例係分別各以5個（樣品No.1～5）進行評估。　　由此結果，各實施例相較於比較例1接合強度較大，各實施例係具有充分的接合強度（規格2N以上）。第7A圖，係顯示實施例1之接觸部100之表面掃描型電子顯微鏡照片。相同地，於第7B圖係顯示實施例1之接合部500，於第7C圖係顯示比較例1之接合部500（接觸部100）之表面掃描型電子顯微鏡照片。於接觸部100之表面，係實施例1及比較例1之任一者CNT（碳奈米材料104）皆露出，但於實施例1之接合部500的表面並未觀察到CNT。（實施例3）　　作為母材，係使用大小3.5cm×4.0cm×厚度0.1cm之銅板。於母材之全體形成有具備碳奈米材料與第1鍍層的複合鍍層。在此，作為碳奈米材料，係使用含有CNT的Ni-P合金鍍液。作為CNT係使用昭和電工（股）製之VGCF。此CNT為單層CNT與多層CNT之混合物。此外，CNT之直徑（外徑）為100～200nm，且長度為10～20μm之範圍。Ni-P合金鍍液之組成，係硫酸鎳（1mol/dm³ ）、氯化鎳（0.2mol/dm³ ）、硼酸（0.5mol/dm³ ）、檸檬酸三鈉（0.5mol/dm³ ）、膦酸（1.0mol/dm³ ）。含有CNT的Ni-P合金鍍液，係將CNT之混合量設為2g/dm³ 。此外，含有CNT的Ni-P合金鍍液係設為鍍浴，並設為浴溫25℃、電流密度5A/dm² 之鍍敷條件。接著，形成作為Ni-P合金鍍層之第1鍍層的厚度為1.5μm、CNT之含量為0.2質量％的含CNT之Ni-P合金鍍層。　　接著，與實施例1相同地，於成為接合部的部分中，於第1鍍層的表面形成被覆鍍層。　　接著，於成為接觸部的部分及成為接合部的部分中，形成保護鍍層。於成為接觸部的部分中，係於第1鍍層的表面形成保護鍍層。於成為接合部的部分中，係於被覆鍍層的表面形成保護鍍層。保護鍍層係以Sn鍍敷所形成。於此情況中，作為鍍液係使用石原藥品股份有限公司製之「PF-095S」，並在浴溫35℃、電流密度3ASD之條件下形成Sn鍍敷。保護鍍層之厚度係設為0.1μm。　　以如此方式來形成電連接構件（平板）。於接觸部中，雖CNT從保護鍍層的表面突出，但於接合部中，CNT並未從由被覆鍍層與保護鍍層所構成之第2鍍層的表面突出。（實施例4）　　作為碳奈米材料係取代CNT而使用CB來形成含CB之Ni-P合金鍍層，除此之外，與實施例3相同方式。作為CB係使用Cabot公司製之VULCAN XC-72。此CB係直徑（粒徑）為20～40nm之範圍。（實施例5）　　作為第1鍍層係取代Ni-P合金鍍敷而形成Ni鍍敷，除此之外，與實施例3相同方式。Ni鍍液之組成，係硫酸鎳（1mol/dm³ ）、氯化鎳（0.2mol/dm³ ）、硼酸（0.5mol/dm³ ）。含有CNT的Ni鍍液，係將CNT之混合量設為2g/dm³ 。此外，含有CNT的Ni鍍液係設為鍍浴，並設為浴溫50℃、電流密度5A/dm² 之鍍敷條件。（比較例2）　　除了不形成被覆鍍層及保護鍍層以外，皆與實施例4相同方式。（比較例3）　　作為母材係使用與實施例3相同者。於母材之成為接觸部的部分形成Ni鍍層（不含碳奈米材料）。Ni鍍層之形成條件，係Ni鍍液之組成為磺胺酸鎳400g/dm³ 、硼酸40g/dm³ 、氯化鎳5g/dm³ 。此外，設為浴溫50℃、電流密度5A/dm² 之鍍敷條件。Ni鍍層之厚度係設為1.5μm。　　接著，於Ni鍍層之表面形成Au-Co合金鍍層。於此情況中，作為鍍液係使用日本高純度化學公司製之「OROBRIGHT BAR7」，在浴溫50℃、電流密度10A/dm² 之條件下形成Au-Co合金鍍敷。Au-Co合金鍍層之厚度係設為0.15μm。　　以如此方式來形成平板（電連接構件）。（比較例4）　　除了將Au-Co合金鍍層之厚度設為0.06μm以外，與比較例3相同方式。（比較例5）　　於比較例3中，於Au-Co合金鍍層施行封孔處理（在浸漬於水溶性封孔處理液後，以80℃進行乾燥）。（比較例6）　　於比較例4中，於Au-Co合金鍍層施行封孔處理。封孔處理之條件係與比較例5相同。（耐蝕性之評估）　　針對上述實施例3～5及比較例2～6，進行耐蝕性的評估。亦即，在將各實施例及各比較例之平板（電連接構件）浸漬於濃度80ppm之硫酸水溶液之後，以溫度260℃放置5分鐘。其後，進行電化學測定來製作塔菲爾圖（Tafel plot）。電化學測定，係使用北斗電工股份有限公司之「HZ-7000」，参照電極為Ag/Ag-Cl、於相對電極使用Pt，而測定腐蝕電流/電位。將結果顯示於第8圖。　　如第8圖所明瞭般，得知各實施例相較於各比較例腐蝕電位及腐蝕電流變低而更貴重，腐蝕被抑制。（接觸可靠性試驗）　　形成被使用於Panasonic股份有限公司製之連接器「P5KS」的端子零件。此連接器係由插頭與插座所構成，插頭與插座分別具有40個端子零件。作為連接器之樣品係準備有以下之（1）～（5）及現有品。　　樣品（1），係端子零件之接觸部具有作為碳奈米材料之CB與由Ni-P合金所構成之第1鍍層的複合鍍層（Ni-P-CB複合鍍層、第1鍍層之厚度1.5μm、鍍敷皮膜中之P濃度10wt%），於第1鍍層之表面具有作為保護鍍層之Sn鍍層（厚度0.1μm）者。　　樣品（2），係鍍敷皮膜中之P濃度5wt%，除此之外，以與樣品（1）相同方式形成。　　樣品（3），係保護鍍層為Sn-Ni合金鍍敷，除此之外，以與樣品（1）相同方式形成。　　樣品（4），碳奈米材料為CNT，除此之外，以與樣品（1）相同方式形成。　　樣品（5），碳奈米材料為CNT，除此之外，以與樣品（2）相同方式形成。　　現有品，係端子零件之接觸部不具有碳奈米材料，具有作為第1鍍層之Ni鍍層厚度為1.5μm，將保護鍍層以Au-Co合金鍍敷並以厚度0.2μm形成之後，進行封孔處理者。　　使用如此之連接器（樣品（1）～（5）及現有品），來進行以下之接觸電阻值之測定試驗1～4。各測定試驗係使用3個連接器來進行。（接觸電阻值之測定試驗1）　　測定在想定大氣壓回焊焊接步驟之溫度260℃的大氣中進行3次熱處理之後的接觸電阻值。（接觸電阻值之測定試驗2）　　測定於濃度10±3ppm之亞硫酸氣體中，在溫度40±2℃、濕度90±3%RH之條件下放置48小時之後的接觸電阻值。（接觸電阻值之測定試驗3）　　測定將插頭與插座拔插50次之後的接觸電阻值。（接觸電阻值之測定試驗4）　　測定進行了耐濕循環12次之後的接觸電阻值。　　將測定試驗1～4之結果顯示於第9A圖～第9D圖。如由此結果所明瞭般，樣品（1）～（5），係具有與現有品相同程度或低於現有品之接觸電阻值，可說是在低接觸壓力領域下之接觸可靠性為高。　　此外，針對樣品（1）～（5），測定因接觸荷重之變化導致之電阻值之變化。將結果顯示於第10圖。如由第10圖所明瞭般地，作為本實施形態之電連接構件的樣品（1）～（5），即使接觸荷重0.1N亦顯示安定的接觸電阻值。（本實施形態之特徵）　　本實施形態之電連接構件（10）係具有以下特徵。　　亦即，電連接構件（10）係具備：母材（101）、接觸部（100）、以及接合部（500），該接觸部（100），係配置於母材（101）之表面上的第1區域，與其他電路或其他電接點零件藉由接觸而電連接；該接合部（500），係配置於與第1區域不同之母材（101）之表面上的第2區域，與外部之導電構件藉由接合而連接。接觸部（100）及接合部（500）分別具備第1鍍層（102）及碳奈米材料（104），該第1鍍層（102）係形成於母材（101）的表面；該碳奈米材料（104），係被第1鍍層（102）保持並從第1鍍層（102）的表面突出。接合部（500）具備第2鍍層（501），該第2鍍層（501），係形成於接合部（500）之第1鍍層（102）的表面，並覆蓋接合部（500）之從第1鍍層（102）的表面突出的碳奈米材料（104）。　　如此之電連接構件（10），由於接觸部（100）具有碳奈米材料（104），因此即使為低接觸壓力，亦可藉由碳奈米材料（104）不損害並確保與其他構件之接觸而進行電連接，而容易確保在低接壓區域之接觸可靠性。此外，由於接合部（500）具有覆蓋從第1鍍層（102）之表面突出的碳奈米材料（104）的第2鍍層（501），因此可減低接合部（500）之表面的碳奈米材料（104）之露出，可提高接合部（500）之表面與其他構件之密合性而提高接合強度。　　上述電連接構件（10），較佳係第1鍍層（102）含有Ni或Ni-P合金，第2鍍層（501）含有Sn或Au之至少1者。　　如此之電連接構件（10），由於第1鍍層（102）含有Ni，因此可減少因氧化導致之變色等的外觀變化，此外，由於第2鍍層（501）含有Sn或Au，因此可提昇耐腐蝕性。　　上述電連接構件（10），較佳係第2鍍層（501）之厚度為0.03μm以上、2.0μm以下。　　如此之電連接構件（10），係可藉由第2鍍層（501）充分抑制碳奈米材料（104）之露出。　　上述電連接構件（10），較佳係接觸部（100）不具備第2鍍層（501）。　　如此之電連接構件（10），係接觸部（100）之表面的碳奈米材料（104）不被第2鍍層（501）所覆蓋，而接觸可靠性之降低被抑制。　　上述電連接構件（10），較佳係接觸部（100）具有保護鍍層（103），該保護鍍層（103）係用以抑制因第1鍍層（102）與碳奈米材料（104）之電位差所產生的腐蝕。　　如此之電連接構件（10），因第1鍍層（102）與碳奈米材料（104）之電位差所產生的腐蝕藉由保護鍍層（103）而被抑制，而耐蝕性高。　　上述電連接構件（10），較佳係保護鍍層（103）含有比第1鍍層（102）中所含有之金屬元素更貴重的金屬元素。　　如此之電連接構件（10），係可得到抑制因第1鍍層（102）與碳奈米材料（104）之電位差所產生之腐蝕的效果高的保護鍍層（103），而耐蝕性更高。　　上述電連接構件（10），係第1鍍層（102）由Ni或Ni-P合金所形成。保護鍍層（103），較佳係作為比Ni更貴重的金屬元素而含有選自由Sn、Cu、Ag、Au、Pd、Rh、Ru組成之群中至少1種。　　如此之電連接構件（10），因第1鍍層（102）中所含有之Ni與碳奈米材料（104）之電位差所產生的腐蝕，係藉由保護鍍層（103）中所含有之選自由Sn、Cu、Ag、Au、Pd、Rh、Ru組成之群中至少1種所抑制，而耐蝕性高。　　上述電連接構件（10），較佳係保護鍍層（103）之厚度為0.1μm以上、1.0μm以下。　　如此之電連接構件（10），係可得到抑制因第1鍍層（102）與碳奈米材料（104）之電位差所產生之腐蝕的效果高的保護鍍層（103），而耐蝕性更高。Hereinafter, embodiments for carrying out the present invention will be described. (Outline of Electrical Connection Member) The electrical connection member according to this embodiment includes a contact portion that is electrically connected by contact and a connection portion that is connected by bonding. Examples of such electrical connection members include contact parts of relays and switches, and terminal parts of connectors. Examples of the contact parts include a fixed contact part and a movable contact part. As the terminal parts, there are exemplified various connectors applicable to plugs, jacks, receptacles, sockets, and pin headers. The contact portion of the electrical connection member is a portion that contacts other members. Here, "another component" means a component other than the electrical connection component and is another circuit or other electrical contact part. For example, when the electrical connection member is a fixed contact part, the movable contact part of the pair becomes another member. That is, in the fixed contact part and the movable contact part, these mutually contactable portions are formed as contact portions. In addition, when the electrical connection member is a terminal part of a connector, a terminal part provided in another connector becomes another member. That is, among the terminal parts of the connector, a portion where the terminal parts provided on each of the plurality of connectors mechanically connected can contact each other is formed as a contact portion. When the contact portion comes into contact with other members, the electrical connection member is electrically connected to the other members. The joint portion of the electrical connection member is a portion that is mechanically connected to another member by joining. Here, "another member" means a member other than the electric connection member, and is an external conductive member. Examples of bonding include soldering, wire bonding (WB), welding, and calking. For example, when the electrical connection member is a fixed contact part or a movable contact part, mounting of such a fixed spring, a movable spring, or the like becomes another member. That is, in a fixed contact part and a movable contact part, the part which contacts and couples with another member is formed as a junction part. In addition, when the electrical connection member is a terminal part of the connector, the circuit pattern of the printed wiring board on which the connector is mounted becomes another member. That is, in the terminal parts of the connector, a portion that is mechanically connected to another member by welding or the like is formed as a joint portion. The joining portion is joined to other members, so that the electric connection member is electrically and mechanically connected to the other members. Although the contact portion and the joint portion are both formed on the surface of the base material, the contact portion is disposed on the first region on the surface of the base material, and the joint portion is disposed on the surface of the base material different from the first region. 2 areas. (Explanation of Joint Part) FIG. 1A is a schematic view showing a joint part 500 of the electrical connection member 10. The joint portion 500 is formed to include a base material 101, a first plating layer 102, a second plating layer 501, and a carbon nanomaterial 104. The base material 101 is a base of the electrical connection member 10 and is formed into a desired shape according to the purpose of use. The base material 101 is formed of a known metal material such as copper or a copper alloy used for the electrical connection member 10. Examples of the copper alloy system include Cu-Ti, Cu-Ti-Fe, Cu-Be, Cu-Sn-P system, Cu-Zn system, Cu-Ni-Zn system, Cu-Ni-Si system, and Cu-Fe. -P-based alloys. In addition, the base material 101 may have a base layer such as a Ni plating film or the like on the surface for improving the adhesion with the first plating layer 102. The first plating layer 102 is a plating film adhered to the surface of the base material 101. The first plating layer 102 is formed of a crystalline or amorphous metal plating film. The first plating layer 102 may be determined by considering the adhesion to the base material 101 and the retention, hardness, and corrosion resistance of the carbon nanomaterial 104, and the like, and then determining the material and thickness thereof. The material of the first plating layer 102 is preferably formed of Ni or a Ni-P alloy. The film thickness of the first plating layer 102 is preferably 5 μm or less. When the film thickness is thicker than 5 μm, the elasticity of the first plating layer 102 easily disappears, and cracks due to stress are liable to occur. In order to ensure the retention of the carbon nanomaterial 104 and the like, the lower limit of the film thickness of the first plating layer 102 is preferably set to 0.1 μm. Furthermore, when the improvement of the corrosion resistance of the contact part 100 is considered, the film thickness of the first plating layer 102 is preferably 0.5 μm or more, and more preferably 1 μm or more. The second plating layer 501 is a plating film attached to the surface of the first plating layer 102. The second plating layer 501 is provided with a coating plating layer 502 and a protective plating layer 103. The coating plating layer 502 is formed on the surface of the first plating layer 102. The protective plating layer 103 is formed on the surface of the coating plating layer 502. The coating plating layer 502 is a plating coating on the carbon nanomaterial 104 protruding from the surface of the first plating layer 102. That is, the carbon nanomaterial 104 protruding from the surface of the first plating layer 102 in the joint portion 500 is covered with the coating plating layer 502 without exposing the surface of the coating plating layer 502. Thereby, the decrease in the wettability of the solder of the joint 500 by the carbon nanomaterial 104 is suppressed. The covering plating layer 502 is preferably formed of Ni or Ni-P alloy in the same manner as the first plating layer 102 in consideration of the adhesion to the first plating layer 102, the solder wettability, and the adhesion to the protective plating layer 103. . The thickness of the coating plating layer 502 may be thicker than the protruding length of the carbon nanomaterial 104 from the first plating layer 102. For example, it is preferably 0.01 μm or more and 1.5 μm or less, and more preferably 0.03 μm or more and 1.2 μm or less. . The protective plating layer 103 is a plating for suppressing corrosion of the first plating layer 102 and the coating plating layer 502 caused by the potential difference between the first plating layer 102 and the coating plating layer 502 and the carbon nanomaterial 104. In the conventional example shown in FIG. 11, in a severe corrosion resistance test such as a sulfurous acid gas test, corrosion is easily generated in the plating layer 220. The plating layer 220 and the carbon nano-material 230 become gap corrosion of the local battery. That is, when a gap is generated in the portion (interface portion) where the carbon nanomaterial 230 is coated on the plating layer 220 due to the unevenness of the plating layer 220, the gap is caused by the potential difference between the plating layer 220 and the carbon nanomaterial 230. The battery will work and cause gap corrosion. The protective plating layer 103 of this embodiment suppresses the occurrence of this gap erosion. The protective plating layer 103 preferably contains a more expensive metal element than the metal elements contained in the first plating layer 102 and the coating plating layer 502. In this case, the protective plating layer 103 has a smaller potential difference with respect to the carbon nanomaterial 104 than the first plating layer 102 and the coating plating layer 502, and the protective plating layer 103 is less likely to be generated than the first plating layer 102 and the coating plating layer 502. corrosion. As a result, the first plating layer 102 and the coating plating layer 502 are covered with the protective plating layer 103 which is less prone to corrosion, and it is difficult for the first plating layer 102 and the coating plating layer 502 to react with oxygen, moisture, and other corrosion components, and the first plating layer 102 and the coating plating layer 502 Corrosion is suppressed. Specifically, when the first plating layer 102 and the coating plating layer 502 are formed by Ni plating or Ni-P alloy plating, the protective plating layer 103 may be selected from Cu, Sn, Au, Ag, Pd, Rh, and Ru. It is formed by plating composed of one or a plurality of types of metal elements. In addition, when the first plating layer 102 and the coating plating layer 502 are formed by Ni plating or Ni-P alloy plating, the protective plating layer 103 may include a member selected from the group consisting of Cu, Sn, Au, Ag, Pd, Rh, and Ru. It is formed by alloy plating of one or a plurality of types of metal elements. Examples of the alloy plating include Ni-Cu plating, Ni-Sn plating, Ni-Au plating, Ni-Ag plating, Ni-Pd plating, Ni-Ph plating, and Ni-Ru plating. Apply. In addition, the protective plating layer 103 only needs to have higher corrosion resistance than the first plating layer 102 and the coating plating layer 502. Therefore, for example, the first plating layer 102 and the coating plating layer 502 are formed by Ni plating or Ni-P alloy plating In the case, the protective plating layer 103 can be formed by Ni-W plating, Ni-B plating, Ni-Fe plating, or the like. Furthermore, the protective plating layer 103 is only required to protect the first plating layer 102 and the coating plating layer 502 from corrosion. Therefore, for example, the protective plating layer 103 can be formed by Zn plating. In this case, corrosion of the first plating layer 102 and the coating plating layer 502 is suppressed by the protective plating layer 103 by the sacrificial anticorrosive effect of Zn plating. In addition, the protective plating layer 103 preferably contains a metal element that forms an intermetallic compound with the coating plating layer 502, and has excellent solder wettability. The thickness of the protective plating layer 103 is preferably 0.01 μm or more and 1.5 μm or less, and more preferably 0.05 μm or more and 1.0 μm or less. If the thickness of the protective plating layer 103 falls within this range, the corrosion of the first plating layer 102 and the coating plating layer 502 is easily suppressed by the protective plating layer 103. In addition, in the Ni alloy plating, the concentration of metal elements other than Ni is preferably 6 mass% or more and 12 mass% or less, and more preferably 8 mass% or more and 10 mass% or less. Within this range, the Ni plating layer is not excessively hard, and cracks and the like are unlikely to occur. In addition, corrosion resistance is also easily ensured. The protective plating layer 103 is provided as needed. That is, when high corrosion resistance is required for the electrical connection member 10, the protective plating layer 103 is preferably provided. However, when high corrosion resistance is not required, the protective plating layer 103 may not be particularly provided. The thickness of the second plating layer 501 is preferably a total thickness of the coating plating layer 502 and the thickness of the protective plating layer 103 of 0.03 μm or more and 2.0 μm or less, thereby easily covering the carbon nanomaterial protruding from the surface of the first plating layer 102. 104. The thickness of the second plating layer 501 is more preferably from 0.05 μm to 1.8 μm. The carbon nano material 104 is a nano-sized carbon material, for example, carbon nanotube (CNT), carbon black (CB), fullerene, graphene, and the like. The carbon nano material 104 is preferably one that is chemically stable and has excellent electrical conductivity, sliding properties, and mechanical strength. CNTs preferably have a diameter of 100 nm or more and 200 nm or less, and a length of 10 μm or more and 20 μm or less. More preferably, the diameter of the CNT is preferably 120 nm or more and 180 nm or less, and the length is preferably 12 μm or more and 18 μm or less. In addition, although there are CNTs in which a graphite sheet is rolled into a single-layer cylindrical CNT and a graphite sheet is rolled into two or more multilayered CNTs, the multilayered CNTs have better mass productivity than single-layered CNTs and can Since it is obtained at a lower price, it is preferable to reduce costs. CB is particulate, and its particle diameter is preferably measured by a laser diffraction method or the like to be several nm or more and 100 nm or less. In addition, CB is a species having excellent electrical conductivity, and it is preferable that the particles exist in a state of clustered micron-sized aggregates. CB is superior to CNT in terms of mass productivity and can be obtained at a lower price, so it is preferable in terms of cost reduction. FIG. 1A shows the case where the carbon nanomaterial 104 is CNT in the joint portion 500. This CNT is embedded and fixed to the first plating layer 102 at one end. In this way, the CNT system is held by the first plating layer 102. The CNTs protrude from the surface of the first plating layer 102, but are buried in the coating plating layer 502. The carbon nano material 104 is formed as a composite plating with the first plating layer 102. The use amount of the carbon nano material 104 is preferably 0.02% by mass or more and 2.0% by mass or less, more preferably 0.05% by mass or more and 1.8% by mass or less relative to the total amount of the carbon nanomaterial 104 and the first plating layer 102. . When the amount of the carbon nano material 104 is within the above range, the contact reliability of the contact portion 100 described later due to the carbon nano material 104 can be sufficiently improved, and in addition, it is easy to sufficiently ensure that the carbon nano material 104 is resistant to The dispersibility of the plating solution and the adhesion of the first plating layer 102 to the base material 101. (Description of Contact Section) FIG. 1B is a schematic view showing the contact section 100 of the electrical connection member 10. The contact portion 100 is formed of the same base material 101, the first plating layer 102, the protective plating layer 103, and the carbon nanomaterial 104 as the joint portion 500. That is, the contact portion 100 does not form the coating plating layer 502, but the carbon nano material 104 is exposed from the surface. In the contact portion 100, the base material 101 and the first plating layer 102 are formed in the same manner as in the case of the joint portion 500. In the contact portion 100, a protective plating layer 103 is formed on the surface of the first plating layer 102. In this case, the protective plating layer 103 does not completely cover the carbon nanomaterial 104 protruding from the surface of the first plating layer 102. That is, the protective plating layer 103 covers only the root portion of the carbon nanomaterial 104 (the portion near the surface of the first plating layer 102). Therefore, in the contact portion 100, the carbon nano material 104 penetrates the protective plating layer 103, and the front end of the carbon nano material 104 protrudes from the surface of the protective plating layer 103. The protective plating layer 103 is a plating for suppressing the corrosion of the first plating layer 102 caused by the potential difference between the first plating layer 102 and the carbon nanomaterial 104 as described above. In the contact portion 100, the protruding length from the surface of the CNT protective plating layer 103 is preferably 0.1 μm to 10 μm. In addition, as in the case of the joint portion 500, the protective plating layer 103 is also provided in the contact portion 100 as needed. That is, when high corrosion resistance is required for the electrical connection member 10, the protective plating layer 103 is preferably provided. However, when high corrosion resistance is not required, the protective plating layer 103 may not be particularly provided. (Plating Step) When forming the contact portion 100 and the joint portion 500 described above, first, a composite plating layer composed of a carbon nano material 104 and a first plating layer 102 is formed on the surface of the base material 101. This composite plating layer is formed on the surface of the base material 101 by electroplating (electrolytic plating). In this case, the first plating layer holding the carbon nanomaterial 104 is deposited by depositing a plating solution containing metal elements such as Ni, P, and the carbon nanomaterial 104 on the surface of the base material 101 and applying current, thereby depositing it. 102. Here, the carbon nano-material 104 is mainly intended to be provided only at a portion formed by the contact portion 100 of the base material 101 because the main purpose is to improve the contact between the contact portion 100 and other members. In this case, although a partial immersion method, a spot plating method, a plating method using a sprayer, a mask plating method, a plating resist method, and the like are used to partially form carbon dioxide The composite plating layer composed of the nano material 104 and the first plating layer 102, but such a composite plating layer has strict plating conditions, and it is very complicated to perform partial plating by the method as described above. In particular, the base material 101 is very small, and it is difficult to partially perform the above-mentioned composite plating on a large number of coils (hoops) connected in series. Therefore, in this embodiment, the entire base material 101 which is the base material of the electrical connection member 10 forms a composite plating layer composed of the carbon nano material 104 and the first plating layer 102, thereby eliminating the need for the base material 101. The composite plating is partially formed, the complexity is reduced, and the productivity of the electrical connection member 10 is improved. Next, a coating plated layer 502 is formed on the surface of the first plated layer 102 in the portion where the joint portion 500 is formed. The coating plating layer 502 is formed by the partial plating method exemplified above. For example, the coating layer 502 can be formed by electroplating. That is, a plating solution containing a metal element such as Ni is adhered to the surface of the first plating layer 102 and is energized to form a coating plating layer 502. The coating plating layer 502 is a plating containing no carbon nano-material. Since it is not a composite plating like the first plating layer 102, the plating conditions are not as tight as the composite plating, and it is not complicated. Next, the protective plating layer 103 is formed as needed. The protective plating layer 103 may be provided on both the contact portion 100 and the joint portion 500, or both of them may not be provided, or may be provided on only one side. The protective plating layer 103 may be provided on portions other than the contact portion 100 and the joint portion 500. The protective plating layer 103 is formed on the surface of the first plating layer 102 in a portion that becomes the contact portion 100. The protective plating layer 103 is formed on the surface of the coating plating layer 502 in a portion that becomes the joint portion 500. (Example of Use of Electrical Connection Member) Fig. 2 shows terminal parts 20a and 20b. The terminal parts 20a and 20b are paired connection members (for example, plugs and sockets) which are respectively incorporated into the connector. The terminal parts 20a and 20b are connected by the connection members, and the contact part 21a of the terminal part 20a at one end and the contact part 21b of the other terminal part 20b are contacted, thereby the terminal part 20a and the terminal part 20b Electrical contact. In addition, the bonding portion 22a of the terminal component 20a and the bonding portion 22b of the terminal component 20b are each a conductor that is bonded to a circuit pattern such as a printed wiring board or a conductor by soldering or the like. Next, one or both of the terminal parts 20a and 20b may form the electrical connection member 10 as the present embodiment. That is, one or both of the contact portions 21 a and 21 b may be formed to have the structure shown in FIG. 1B, and one or both of the joint portions 22 a and 22 b may be formed to have the structure shown in FIG. 1A. FIG. 3 is a schematic diagram showing the switch 30. The switch 30 is a button 35 protruding from the top of the case 31. The button 35 is formed to be freely pressed by the lever 33. A spring 34 is provided on the button 35 in the case 31. At the front end of the spring 34, the movable contact parts 30a are provided on the upper and lower surfaces of the spring 34 in a protruding manner. In addition, in the case 31, fixed contact parts 30b are provided above and below the movable contact parts 30a. The fixed contact parts 30b and 30c are joined to the contact bases 36b and 36c, respectively. The switch 30 is operated by pressing the button 35 by operating the lever 33 to cause the spring 34 to move, thereby forming the movable contact part 30a in contact with the fixed contact part 30c above and the fixed contact part below The state where 30b is separated is switched from the state where the movable contact part 30a is separated from the upper fixed contact part 30c, and the state is in contact with the lower fixed contact part 30b. Next, the movable contact part 30a is brought into contact with the fixed contact part 30b, and electrical connection is performed. The switch 30 is one or both of the movable contact part 30a and the fixed contact part 30b, and can form the electrical connection member 10 as the present embodiment. That is, the contact portions of the movable contact part 30a (portions in contact with the fixed contact parts 30b, 30c) 31a, and the contact portions of the fixed contact parts 30b, 30c (portions in contact with the movable contact part 30a) 31b, 31c One or both of them can be formed to have the structure shown in FIG. 1B. In addition, one or both of the joint portion (the portion that engages the spring 34) 32a of the movable contact part 30a and the joint portion (the portion that engages the contact base 36b, 36c) 32b, 32c of the fixed contact part 30b, 30c may be used. It has the structure shown in FIG. 1A. In addition, when the movable contact portion 30a is joined to the spring 34, although caulking is mainly used, it may be joined by welding or welding. The fixed contact parts 30b and 30c and the contact bases 36b and 36c are mainly joined by welding or welding. FIG. 4 is a schematic diagram showing the relay 40. This relay 40 is provided with an electromagnetic block 44 and a contact block 45 in a space surrounded by the main body 42 and the case 43. The electromagnetic block 44 includes a coil wire 46, a coil bobbin 47, an iron core 48, an armature 49, and a yoke 50. A coil terminal 51 electrically connected to the coil wire 46 is attached to the body 42 and protrudes from the bottom surface. The contact block 45 includes a movable spring 52, a movable contact part 40a, a fixed spring 53, and a fixed contact part 40b. A contact terminal 54 electrically connected to the movable contact part 40 a and the fixed contact part 40 b is attached to the body 42 and protrudes from the bottom surface. The armature 49 and the movable spring 52 are connected by a card 55. This relay 40 moves the armature 49 by energizing / de-energizing the coil wire 46, thereby moving the movable spring 52 to form a state where the movable contact part 40a is in contact with the fixed contact part 40b. And switching between the state separated from the movable contact part 40a and the fixed contact part 40b. Next, the movable contact part 40a is brought into contact with the fixed contact part 40b, and electrical connection is performed. The relay 40 is one or both of the movable contact part 40a and the fixed contact part 40b, and can form the electrical connection member 10 of this embodiment. That is, one or both of the contact portion of the movable contact part 40a (the part contacting the fixed contact part 40b) 41a and the contact part of the fixed contact part 40b (the part contacting the movable contact part 40a) 41b The structure shown in FIG. 1B is formed. In addition, one or both of the joint portion (the portion that engages the movable spring 52) 42a of the movable contact part 40a and the joint portion (the portion that engages the fixed spring 53) 42b of the fixed contact part 40b can be formed as shown in FIG. Shown structure. In addition, when the movable contact part 40 a is joined to the movable spring 52 or the fixed contact part 40 b is joined to the fixed spring 53, although riveting is mainly used, it may be joined by welding or welding. (Effect of this embodiment) The electrical connection member 10 of this embodiment is provided with a contact portion 100 that is electrically connected by contact. Since the contact portion 100 has a carbon nano material 104, it is effective even at a low contact pressure. The carbon nano material 104 can be electrically connected without damaging and ensuring contact with other components, and it is easy to ensure contact reliability in a low contact pressure region. In addition, since the electrical connection member 10 of this embodiment has a carbon nano material 104 interposed between the surface of the contact portion 100 and other members in contact with the contact portion 100, the aggregation of the contact portion 100 and other members can be reduced Abrasion can easily improve the adhesion resistance of the electrical connection member 10. Therefore, if the electrical connection member 10 is used as a contact part such as a switch or a relay with a large number of openings and closings as described above, it is not easy to cause a sticking phenomenon, and it is easy to achieve a long life. In addition, the electrical connection member 10 of this embodiment is provided with a bonding portion 500 that is mechanically connected by bonding. This bonding portion 500 has a second portion covering the carbon nanomaterial 104 protruding from the surface of the first plating layer 102. The plating layer 501 can reduce the exposure of the carbon nanomaterial 104 on the surface of the joint portion 500, and can improve the adhesion between the surface of the joint portion 500 and other members to improve the joint strength. Furthermore, the electrical connection member 10 of this embodiment is provided with a protective plating layer 103 on the surface of the first plating layer 102 holding the carbon nanomaterial 104, and the protective plating layer 103 is used to suppress the first plating layer 102 and the carbon nanometer. Corrosion caused by the potential difference of the material 104. Therefore, the electrical connection member 10 of this embodiment can suppress the corrosion of the first plating layer 102 and improve the corrosion resistance. [Examples] Hereinafter, the present invention will be specifically described by examples. (Example 1) As a base material, a copper plate or a Cu alloy such as phosphor bronze or titanium copper which is formed into a shape suitable for a contact part of a connector is used. A composite plating layer including a carbon nano material and a first plating layer is formed on the entire base material. Here, as the carbon nanomaterial, a Ni-P alloy plating solution containing CNT is used. As the CNT, VGCF manufactured by Showa Denko Corporation was used. This CNT is a multilayer CNT. The diameter (outer diameter) of the CNT is 100 to 200 nm, and the length is in the range of 10 to 20 μm. Composition of Ni-P alloy plating solution, nickel sulfate (1mol / dm ³ ), Nickel chloride (0.2mol / dm ³ ), Boric acid (0.5mol / dm ³ ), Citric acid (0.5mol / dm ³ ), Phosphonic acid (1.0mol / dm ³ ), Polycarboxylic acid with a molecular weight of 5000 as a dispersant (2 × 10 ^-4 mol / dm ³ ). Ni-P alloy plating solution containing CNT, the mixing amount of CNT is set to 2g / dm ³ . In addition, the Ni-P alloy plating solution containing CNT is set as a plating bath, and the bath temperature is set to 50 ± 10 ° C and the current density is 1 to 15 A / dm. ² The plating conditions. Next, a CNT-containing Ni-P alloy plating layer having a thickness of 1.5 μm and a CNT content of 1.0% by mass as the first plating layer of the Ni-P alloy plating layer was formed. Next, a coating plated layer is formed on the surface of the first plated layer in a portion to be a joint portion. The CNTs protruding from the surface of the first plating layer are covered with the covering plating layer to avoid exposure to the outside. The coating layer is a 1.5 μm thick Ni coating. The plating conditions are based on nickel sulfamate (450g / l), nickel chloride (3g / l), boric acid (30g / l), additives (appropriate amount), and anti-pitting agent. (Appropriate amount), electroplating for 1 minute at pH = 3.0 ~ 4.5 and bath temperature of 40 ~ 50 ° C. Next, a protective plating layer is formed in a portion which becomes a contact portion and a portion which becomes a joint portion. A protective plating layer is formed on the surface of the first plating layer in a portion to be a contact portion. A protective plating layer is formed on the surface of the coating plating layer in a portion to be a joint portion. The protective plating layer is formed by Sn plating. In this case, "PF-095S" manufactured by Ishihara Pharmaceutical Co., Ltd. was used as the plating solution, and Sn plating was formed under conditions of a bath temperature of 35 ° C and a current density of 3 ASD. The thickness of the protective plating layer is 0.3 μm or more. The electrical connection member is formed in this manner. Although the CNTs protrude from the surface of the protective plating layer in the contact portion, the CNTs do not protrude from the surface of the second plating layer composed of the coating layer and the protective plating layer in the joint portion. Example 2 An electrical connection member was formed in the same manner as in Example 1 except that a protective plating layer having a thickness of 0.3 μm was formed by Au-Co alloy plating instead of Sn plating. In this case, "OROBRIGHT BAR7" manufactured by Japan High Purity Chemical Co., Ltd. was used as the plating solution, and the bath temperature was 50 ° C and the current density was 5 A / dm. ² Under these conditions, Au-Co alloy plating is formed. (Comparative Example 1) The same procedure as in Example 1 was performed except that the second plating layer (the coating plating layer and the protective plating layer) was not formed. In this case, the CNT system protrudes from the surface of the first plating layer in the portion that becomes the joint portion. (Evaluation of Contact Reliability) For each of the above Examples and Comparative Example 1, the contact resistance value after the sulfurous acid gas test of the contact portion of the electrical connection member was measured. The sulfurous acid gas test was performed under conditions of temperature of 40 ± 2 ° C., humidity of 90 ± 3% RH, and concentration of sulfurous acid gas of 10 ± 3 ppm for 48 hours. In the measurement of contact resistance, an electrical contact simulator (model CRS-113-AU) manufactured by Yamazaki Seiki Research Institute was used. In order to perform measurement by the AC 4-terminal method, the contact resistance value when the contact load is changed is measured without including the inherent resistance of the lead wire, the connector portion, and the like in the measurement value. By scanning the contact position with a certain load by the electric stage, it is also possible to measure the frictional contact (wiping) imagined at the contacts of switches and relays. The contact resistance was measured with a contact force of 0.2 N. In addition, each of the examples and comparative examples 1 was evaluated by five (sample Nos. 1 to 5). The results are shown in Table 1. Such results are clear. Compared with Comparative Example 1, each example can be said to have a lower contact resistance value and higher contact reliability in a low contact pressure region. In addition, for five of Example 1, the change in the resistance value due to the change in the contact load was measured. The results are shown in Fig. 6. As is clear from Fig. 6, the electrical connection member of this embodiment shows a stable contact resistance value even when the contact load is 0.1N. (Evaluation of Joinability) For each of the Examples and Comparative Example 1, a plug-in test after soldering was performed. That is, for each Example and Comparative Example 1, the joint portion of the electrical connection member was soldered to the conductor circuit pattern of the printed wiring board, and thereafter, the surface of the printed wiring board was pulled out in a vertical direction using a plug tester. Way to apply a load to the electrical connection member. The extraction speed was set to 2 mm / min. Next, the force (peel strength) when the electrical connection member was separated from the conductor circuit pattern was measured. The results are shown in Table 2. In addition, the welding of the joint portion of the electrical connection member of the conductor circuit pattern is performed as follows. Using a mask with a thickness of 0.12 mm, a paste of lead-free solder was applied to the surface of the joint so as to have a circle shape of 4.5 mm in diameter. For the solder paste, M705-221BM5-32-11.2K manufactured by Senju Metal Industry Co., Ltd. was used. The mounting conditions are set to reflow in the atmosphere using the temperature profile of Figure 5. In addition, each of the examples and comparative examples was evaluated by five (sample Nos. 1 to 5). As a result, each example has a larger bonding strength than Comparative Example 1, and each example has sufficient bonding strength (specification 2N or more). FIG. 7A is a scanning electron microscope photograph showing the surface of the contact portion 100 in Example 1. FIG. Similarly, FIG. 7B shows a surface scanning electron microscope photograph of the bonding portion 500 of Example 1 and FIG. 7C shows a bonding portion 500 (contact portion 100) of Comparative Example 1. On the surface of the contact portion 100, CNTs (carbon nanomaterials 104) of any of Example 1 and Comparative Example 1 were exposed, but CNTs were not observed on the surface of the bonding portion 500 of Example 1. (Example 3) As a base material, a copper plate having a size of 3.5 cm × 4.0 cm × a thickness of 0.1 cm was used. A composite plating layer including a carbon nano material and a first plating layer is formed on the entire base material. Here, as the carbon nanomaterial, a Ni-P alloy plating solution containing CNT is used. As the CNT, VGCF manufactured by Showa Denko Corporation was used. This CNT is a mixture of single-layer CNT and multilayer CNT. The diameter (outer diameter) of the CNT is 100 to 200 nm, and the length is in the range of 10 to 20 μm. Composition of Ni-P alloy plating solution, nickel sulfate (1mol / dm ³ ), Nickel chloride (0.2mol / dm ³ ), Boric acid (0.5mol / dm ³ ), Trisodium citrate (0.5mol / dm ³ ), Phosphonic acid (1.0mol / dm ³ ). Ni-P alloy plating solution containing CNT, the mixing amount of CNT is set to 2g / dm ³ . In addition, the Ni-P alloy plating solution containing CNT was set as a plating bath, and the bath temperature was 25 ° C and the current density was 5 A / dm. ² The plating conditions. Next, a CNT-containing Ni-P alloy plating layer having a thickness of 1.5 μm and a CNT content of 0.2% by mass as the first plating layer of the Ni-P alloy plating layer was formed. Next, in the same manner as in Example 1, a coating plated layer was formed on the surface of the first plated layer in a portion to be a joint portion. Next, a protective plating layer is formed in a portion which becomes a contact portion and a portion which becomes a joint portion. A protective plating layer is formed on the surface of the first plating layer in a portion to be a contact portion. A protective plating layer is formed on the surface of the coating plating layer in a portion to be a joint portion. The protective plating layer is formed by Sn plating. In this case, "PF-095S" manufactured by Ishihara Pharmaceutical Co., Ltd. was used as the plating solution, and Sn plating was formed under conditions of a bath temperature of 35 ° C and a current density of 3 ASD. The thickness of the protective plating layer is set to 0.1 μm. In this way, the electrical connection member (flat plate) is formed. Although the CNTs protrude from the surface of the protective plating layer in the contact portion, the CNTs do not protrude from the surface of the second plating layer composed of the coating layer and the protective plating layer in the joint portion. (Example 4) A CB-containing Ni-P alloy plating layer was formed using CB instead of CNT as a carbon nanomaterial material, and was the same as Example 3. As the CB, VULCAN XC-72 manufactured by Cabot Corporation was used. The CB-based diameter (particle diameter) is in the range of 20 to 40 nm. (Example 5) The same procedure as in Example 3 was performed except that Ni plating was formed instead of Ni-P alloy plating as the first plating layer. Composition of Ni plating solution, nickel sulfate (1mol / dm ³ ), Nickel chloride (0.2mol / dm ³ ), Boric acid (0.5mol / dm ³ ). Ni plating solution containing CNT, the mixing amount of CNT is set to 2g / dm ³ . In addition, the Ni plating solution containing CNT was used as a plating bath, and the bath temperature was 50 ° C and the current density was 5 A / dm. ² The plating conditions. (Comparative example 2) Except that a cover plating layer and a protective plating layer were not formed, it carried out similarly to Example 4. (Comparative example 3) The same as Example 3 was used as a base material system. A Ni plating layer (excluding carbon nanomaterial) is formed on a portion of the base material that becomes a contact portion. The formation conditions of the Ni plating layer, the composition of the Ni plating solution is nickel sulfonate 400g / dm ³ , Boric acid 40g / dm ³ 5g / dm of nickel chloride ³ . In addition, the bath temperature was 50 ° C and the current density was 5A / dm. ² The plating conditions. The thickness of the Ni plating layer was set to 1.5 μm. Next, an Au-Co alloy plating layer is formed on the surface of the Ni plating layer. In this case, "OROBRIGHT BAR7" manufactured by Japan High Purity Chemical Co., Ltd. was used as the plating solution, and the bath temperature was 50 ° C and the current density was 10 A / dm. ² Under these conditions, Au-Co alloy plating is formed. The thickness of the Au-Co alloy plating layer is set to 0.15 μm. A flat plate (electrical connection member) is formed in this manner. (Comparative Example 4) The same procedure as in Comparative Example 3 was performed except that the thickness of the Au-Co alloy plating layer was set to 0.06 μm. (Comparative Example 5) In Comparative Example 3, the Au-Co alloy plating layer was subjected to a plugging treatment (after being immersed in a water-soluble plugging treatment liquid, and dried at 80 ° C). (Comparative Example 6) In Comparative Example 4, a sealing treatment was performed on the Au-Co alloy plating layer. The conditions of the plugging treatment are the same as those of Comparative Example 5. (Evaluation of Corrosion Resistance) The corrosion resistance was evaluated for Examples 3 to 5 and Comparative Examples 2 to 6 described above. That is, the flat plates (electrical connection members) of the respective examples and comparative examples were immersed in a sulfuric acid aqueous solution having a concentration of 80 ppm, and then left at a temperature of 260 ° C for 5 minutes. Thereafter, an electrochemical measurement was performed to prepare a Tafel plot. For electrochemical measurement, "HZ-7000" of Beidou Electric Co., Ltd. was used, and the reference electrode was Ag / Ag-Cl, and the counter electrode was Pt to measure the corrosion current / potential. The results are shown in Fig. 8. As is clear from FIG. 8, it is found that the corrosion potential and corrosion current of each example are lower and more expensive than that of each comparative example, and corrosion is suppressed. (Contact reliability test) The terminal parts used in the connector "P5KS" manufactured by Panasonic Corporation were formed. This connector is composed of a plug and a socket, and the plug and the socket each have 40 terminal parts. Samples of the connector are the following (1) to (5) and conventional products. Sample (1), where the contact part of the terminal part has a composite coating of CB as a carbon nano material and a first coating composed of a Ni-P alloy (Ni-P-CB composite coating, the thickness of the first coating is 1.5 μm (P concentration in the plating film is 10 wt%), and the surface of the first plating layer has a Sn plating layer (thickness: 0.1 μm) as a protective plating layer. Sample (2) was formed in the same manner as sample (1) except that the P concentration in the plating film was 5 wt%. Sample (3) was formed in the same manner as sample (1) except that the protective plating layer was Sn-Ni alloy plating. The sample (4) was formed in the same manner as the sample (1) except that the carbon nanomaterial was CNT. The sample (5) was formed in the same manner as the sample (2) except that the carbon nanomaterial was CNT. Conventional products, the contact parts of the terminal parts do not have a carbon nano material, and the thickness of the Ni plating layer as the first plating layer is 1.5 μm. The protective plating layer is plated with an Au-Co alloy and formed with a thickness of 0.2 μm. Processor. Using such connectors (samples (1) to (5) and conventional products), the following measurement tests 1 to 4 of contact resistance values were performed. Each measurement test was performed using three connectors. (Measurement test of contact resistance value 1) Measure the contact resistance value after three heat treatments in the atmosphere at a temperature of 260 ° C. which is the atmospheric pressure reflow soldering step. (Measurement test of contact resistance value 2) Measure the contact resistance value in a sulfurous acid gas with a concentration of 10 ± 3ppm, and leave it for 48 hours under the conditions of temperature 40 ± 2 ° C and humidity 90 ± 3% RH. (Measurement test for contact resistance value 3) Measure the contact resistance value after plugging and unplugging the plug and socket 50 times. (Measurement test 4 of contact resistance value) The contact resistance value after 12 cycles of humidity resistance was measured. The results of measurement tests 1 to 4 are shown in Figs. 9A to 9D. As is clear from this result, the samples (1) to (5) have the same contact resistance value as the existing products or lower than the existing products, and it can be said that the contact reliability is high in the low contact pressure area. In addition, for samples (1) to (5), the change in resistance value due to the change in contact load was measured. The results are shown in Fig. 10. As is clear from FIG. 10, samples (1) to (5), which are electrical connection members of this embodiment, show stable contact resistance values even when the contact load is 0.1N. (Features of this embodiment) The electrical connection member (10) of this embodiment has the following characteristics. That is, the electrical connection member (10) includes a base material (101), a contact portion (100), and a joint portion (500). The contact portion (100) is disposed on a surface of the base material (101). The first region is electrically connected to other circuits or other electrical contact parts through contact; the joint portion (500) is a second region arranged on the surface of the base material (101) different from the first region, and The external conductive members are connected by bonding. The contact portion (100) and the joint portion (500) are respectively provided with a first plating layer (102) and a carbon nano material (104), and the first plating layer (102) is formed on the surface of the base material (101); the carbon nano The material (104) is held by the first plating layer (102) and protrudes from the surface of the first plating layer (102). The joint portion (500) includes a second plating layer (501) formed on the surface of the first plating layer (102) of the joint portion (500) and covering the first portion (500) of the joint portion (500). A carbon nano material (104) protruding from the surface of the plating layer (102). Since the electrical connection member (10) has the carbon nano material (104), the carbon nano material (104) can be used to prevent damage to other components even if the contact pressure is low. It is easy to ensure the contact reliability in the low contact area by making electrical connection by contact. In addition, since the joint portion (500) has a second plating layer (501) covering the carbon nano material (104) protruding from the surface of the first plating layer (102), the carbon nanometer on the surface of the joint portion (500) can be reduced. The exposure of the material (104) can improve the adhesion between the surface of the joint (500) and other members, and increase the joint strength. The electrical connection member (10) is preferably such that the first plating layer (102) contains Ni or a Ni-P alloy, and the second plating layer (501) contains at least one of Sn or Au. In such an electrical connection member (10), since the first plating layer (102) contains Ni, appearance changes such as discoloration due to oxidation can be reduced, and since the second plating layer (501) contains Sn or Au, the resistance can be improved. Corrosive. The electrical connection member (10) preferably has a thickness of the second plating layer (501) of 0.03 μm or more and 2.0 μm or less. Such an electrical connection member (10) can sufficiently suppress the exposure of the carbon nanomaterial (104) by the second plating layer (501). It is preferable that the electrical connection member (10) does not include the second plating layer (501) in the contact portion (100). In such an electrical connection member (10), the carbon nanomaterial (104) on the surface of the contact portion (100) is not covered by the second plating layer (501), and the reduction in contact reliability is suppressed. The electrical connection member (10) preferably has a protective plating layer (103) in the contact portion (100), and the protective plating layer (103) is used to suppress a potential difference between the first plating layer (102) and the carbon nanomaterial (104). The resulting corrosion. In such an electrical connection member (10), corrosion due to the potential difference between the first plating layer (102) and the carbon nanomaterial (104) is suppressed by the protective plating layer (103), and the corrosion resistance is high. The electrical connection member (10) is preferably such that the protective plating layer (103) contains a more expensive metal element than the metal element contained in the first plating layer (102). Such an electrical connection member (10) can obtain a protective plating layer (103) having a high effect of suppressing corrosion caused by the potential difference between the first plating layer (102) and the carbon nanomaterial (104), and has higher corrosion resistance. The electrical connection member (10) has a first plating layer (102) made of Ni or a Ni-P alloy. The protective plating layer (103) preferably contains at least one selected from the group consisting of Sn, Cu, Ag, Au, Pd, Rh, and Ru as a more expensive metal element than Ni. The corrosion of the electrical connection member (10) due to the potential difference between Ni and the carbon nanomaterial (104) contained in the first plating layer (102) is selected from the group consisting of the protective plating layer (103). At least one of the groups consisting of Sn, Cu, Ag, Au, Pd, Rh, and Ru is suppressed, and the corrosion resistance is high. The electrical connection member (10) preferably has a thickness of the protective plating layer (103) of 0.1 μm or more and 1.0 μm or less. Such an electrical connection member (10) can obtain a protective plating layer (103) having a high effect of suppressing corrosion caused by the potential difference between the first plating layer (102) and the carbon nanomaterial (104), and has higher corrosion resistance.

10‧‧‧電連接構件10‧‧‧ Electrical connection components

100、21a、21b、31a、31b、31c、41a、41b‧‧‧接觸部100, 21a, 21b, 31a, 31b, 31c, 41a, 41b

101‧‧‧母材101‧‧‧ mother material

102‧‧‧第1鍍層102‧‧‧The first coating

103‧‧‧保護鍍層103‧‧‧Protective coating

104‧‧‧碳奈米材料104‧‧‧carbon nano material

500、22a、22b、32a、32b、32c、42a、42b‧‧‧接合部500, 22a, 22b, 32a, 32b, 32c, 42a, 42b

501‧‧‧第2鍍層501‧‧‧Second coating

[第1圖]第1A圖，係顯示本發明之一實施形態的電連接構件之接合部的概略之剖面圖。第1B圖，係顯示本發明之一實施形態的電連接構件之接觸部的概略之剖面圖。　　[第2圖]第2圖，係顯示同上之連接器之端子零件的概略之正視圖。　　[第3圖]第3圖，係顯示同上之開關之可動接點零件與固定接點零件的概略之剖面圖。　　[第4圖]第4圖，係顯示同上之繼電器之可動接點零件與固定接點零件的概略之剖面圖。　　[第5圖]第5圖，係顯示接觸可靠性之試驗中的溫度輪廓之圖表。　　[第6圖]第6圖，係顯示實施例1之接觸可靠性試驗中之接觸荷重的變化與電阻值的變化之圖表。　　[第7圖]第7A圖，係實施例1之接觸部之表面掃描型電子顯微鏡照片。第7B圖，係實施例1之接合部之表面掃描型電子顯微鏡照片。第7C圖，係比較例之接觸部及接合部之表面掃描型電子顯微鏡照片。　　[第8圖]第8圖，係顯示實施例3～5及比較例2～6之耐蝕性的評估之圖表。　　[第9圖]第9A圖，係顯示接觸可靠性試驗中之接觸電阻值之測定試驗1的結果之圖表。第9B圖，係顯示接觸可靠性試驗中之接觸電阻值之測定試驗2的結果之圖表。第9C圖，係顯示接觸可靠性試驗中之接觸電阻值之測定試驗3的結果之圖表。第9D圖，係顯示接觸可靠性試驗中之接觸電阻值之測定試驗4的結果之圖表。　　[第10圖]第10圖，係顯示樣品（1）～（5）之接觸可靠性試驗中之接觸荷重的變化與電阻值的變化之圖表。　　[第11圖]第11圖，係顯示以往之電連接構件之接觸部的概略之剖面圖。[FIG. 1] FIG. 1A is a schematic cross-sectional view showing a joint portion of an electrical connection member according to an embodiment of the present invention. Fig. 1B is a schematic cross-sectional view showing a contact portion of an electrical connection member according to an embodiment of the present invention.第 [Fig. 2] Fig. 2 is a schematic front view showing the terminal parts of the same connector.第 [Fig. 3] Fig. 3 is a schematic cross-sectional view showing a movable contact part and a fixed contact part of the same switch.第 [Fig. 4] Fig. 4 is a schematic cross-sectional view showing the movable contact part and the fixed contact part of the relay. [Fig. 5] Fig. 5 is a graph showing a temperature profile in a contact reliability test. [Fig. 6] Fig. 6 is a graph showing a change in contact load and a change in resistance value in the contact reliability test of Example 1. [Fig. 7] Fig. 7A is a scanning electron microscope photograph of a surface of a contact portion in Example 1. FIG. 7B is a surface scanning electron microscope photograph of the joint portion of Example 1. FIG. FIG. 7C is a scanning electron microscope photograph of the surface of the contact portion and the joint portion of the comparative example. [Fig. 8] Fig. 8 is a graph showing the evaluation of the corrosion resistance of Examples 3 to 5 and Comparative Examples 2 to 6.第 [Fig. 9] Fig. 9A is a graph showing the results of the measurement test 1 of the contact resistance value in the contact reliability test. FIG. 9B is a graph showing the results of the measurement test 2 of the contact resistance value in the contact reliability test. FIG. 9C is a graph showing the results of the measurement test 3 of the contact resistance value in the contact reliability test. FIG. 9D is a graph showing the results of the measurement test 4 of the contact resistance value in the contact reliability test.第 [Fig. 10] Fig. 10 is a graph showing changes in contact load and changes in resistance value in the contact reliability test of samples (1) to (5). [Fig. 11] Fig. 11 is a schematic cross-sectional view showing a contact portion of a conventional electrical connection member.

Claims

An electrical connection member includes a base material, a contact portion, and a joint portion. The contact portion is disposed in a first region on a surface of the base material, and is in contact with other circuits or other electrical contact parts. And electrical connection; the joint portion is arranged in a second area on the surface of the base material different from the first area, and is connected to an external conductive member by joining; the contact portion and the joint portion are each provided with a first 1 plating layer and carbon nano material, the first plating layer is formed on the surface of the base material; the carbon nano material is held by the first plating layer and protrudes from the surface of the first plating layer; 2 plating layer, the second plating layer is formed on the surface of the first plating layer of the joint portion, and covers the carbon nano material of the joint portion protruding from the surface of the first plating layer.

The electrical connection member according to item 1 of the scope of the patent application, wherein the first plating layer contains Ni or a Ni-P alloy, and the second plating layer contains at least one of Sn or Au.

The electrical connection member according to item 1 or item 2 of the scope of patent application, wherein the thickness of the second plating layer is 0.03 μm or more and 2.0 μm or less.

The electrical connection member according to item 1 or item 2 of the scope of patent application, wherein the contact portion does not include the second plating layer.

The electrical connection member according to item 1 or item 2 of the scope of patent application, wherein the contact portion has a protective plating layer, and the protective plating layer is used to suppress the first plating layer and the carbon nanomaterial caused by the contact portion. Corrosion caused by the potential difference.

The electrical connection member according to item 5 of the scope of patent application, wherein the protective plating layer contains a metal element that is more expensive than the metal element contained in the first plating layer of the contact portion.

The electrical connection member according to item 5 of the scope of patent application, wherein the first plating layer of the contact portion contains Ni or Ni-P alloy, and the protective coating layer contains a material selected from the group consisting of Sn, Cu, Ag, Au, Pd, At least one of the groups consisting of Rh and Ru is a more expensive metal element than Ni.

The electrical connection member according to item 5 of the scope of patent application, wherein the thickness of the protective plating layer is 0.1 μm or more and 1.0 μm or less.