TW201820947A - Main board module - Google Patents

Abstract

Main board module includes a main frame, a main board, a first positioning member, a second positioning member, and a positioning lever. The main frame has a bottom board. The main board is located on the bottom board. The first positioning member is located in the main frame and pivots to a first portion of the main board. The second positioning member is located in the main frame and pivots to a second portion of the main board. The positioning lever is connected between the first positioning member and the second positioning member and pivots to a third portion of the main board. The third portion is substantially located between the first portion and the second portion.

Description

Motherboard module

The invention relates to a motherboard module.

Generally speaking, after the processing of the motherboard, the micro-bend state may occur due to the external force (the main board body is directly heated, the thermal expansion and contraction or the excessive force during installation), and the micro-bend state affects the motherboard. The strength of the structure, which in turn reduces the life of the motherboard.

Furthermore, because of the microbend and warpage caused by the micro-bending of the main board body or the intervention of external force factors, the solder of each contact on the main board may fall off, thus causing the two contacts of the solder to be connected internally. It is unable to energize, which in turn creates an open circuit, making it difficult for the motherboard to perform its desired effect and destroying the entire board structure.

In addition, when the surface of the motherboard has a large unevenness or the warpage state of the main body is severe, the assembly of the components located thereon is affected. For example, when the connector is assembled into the motherboard and enters the motherboard, the warpage of the motherboard may make the connector difficult to lie on the motherboard, so that a collision may occur or the connector may be caused by the connector. Wrong insertion and bending damage.

Therefore, how to avoid or improve the occurrence of warpage of the motherboard structure is a problem that has been faced by those skilled in the art.

In view of the above, an object of the present invention is to provide a motherboard module.

In order to achieve the above object, according to an embodiment of the present invention, a motherboard module includes a casing, a motherboard, a first positioning component, a second positioning component, and a positioning link. The casing has a bottom plate. The motherboard is located on the backplane. The first positioning member is located in the casing and is connected to the first block of the motherboard. The second positioning member is located in the casing and is connected to the second block of the motherboard. The positioning link is connected between the first positioning component and the second positioning component and is connected to the third block of the motherboard. The third block is substantially located between the first block and the second block.

According to an embodiment of the invention, the aforementioned positioning link has a first end and a second end. The first end is connected to the first positioning member, and the second end is connected to the second positioning member.

According to an embodiment of the invention, the positioning link is fixed to the bottom plate of the casing via the third block of the motherboard.

According to an embodiment of the invention, the positioning link further includes an extension. The extension has a top position as well as a side portion. The top position is connected to the first end. The side portion is coupled to the top position, and the first positioning member includes the first protrusion. The first protrusion is limited between the top position and the motherboard, and is located between the first end and the side portion.

According to an embodiment of the invention, the motherboard module includes a plurality of third positioning members. The third positioning member is located in the casing, is attached to the motherboard, and is connected between the first positioning component and the casing.

According to an embodiment of the invention, the first positioning member is fixed to the bottom plate of the casing via the first block of the motherboard.

According to an embodiment of the invention, the second positioning member is fixed to the bottom plate of the casing via the second block of the motherboard.

According to an embodiment of the invention, the second positioning member has a through hole substantially facing the positioning link. The second end of the positioning link has a second protrusion substantially facing the second positioning member, and the second protrusion is disposed in the through hole.

According to an embodiment of the present invention, the second convex portion of the second end portion is pressed against a portion of the inner wall of the through hole.

According to an embodiment of the invention, the motherboard module includes a pivoting portion. The pivoting portion is disposed on the casing and is pivotally connected to an end of the second positioning member away from the positioning link.

In summary, the present disclosure connects and connects the main board, the first positioning member, the second positioning member, and the positioning link to each other in sequence or by fastening and overlapping with each other. With the above configuration, the first positioning member, the second positioning member and the positioning link can guide and straighten the whole of the main board and the entire surface of the main board, so that the main board can obtain a relatively stable structural design. . Therefore, according to the foregoing configuration, the warpage problem that may occur in the motherboard can be improved, and problems that may occur when components are assembled on the motherboard later can be avoided. For example, the structural configuration of the present disclosure can avoid the problem of a collision that may occur when the connector and the motherboard are assembled due to the warpage of the motherboard. Moreover, it is also possible to avoid the difficulty in alignment between the connector and the slot located on the motherboard due to the warpage of the motherboard, thereby causing the problem that the connector pins are mis-inserted and bent and damaged.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Please refer to Figure 1 and Figure 2. 1 and 2 are perspective views of a motherboard module 1 according to an embodiment of the present invention. In order to better understand the present invention, the motherboard 12 is omitted from the second diagram. As shown in FIGS. 1 and 2 , in the present embodiment, the main board module 1 includes a casing 10 , a main board 12 , a first positioning member 14 , a second positioning member 15 , and a positioning link 18 . The casing 10 has a bottom plate 10a (see Fig. 2). The structure, function, and connection relationship between the components will be described in detail below.

In the present embodiment, the motherboard 12 is located on the bottom plate 10a. The first positioning member 14 is located in the casing 10 and is coupled to the first block 120 of the motherboard 12 . The second positioning member 15 is located in the casing 10 and is coupled to the second block 122 of the motherboard 12 . The positioning link 18 is connected between the first positioning member 14 and the second positioning member 15 and is coupled to the third block 124 of the motherboard 12 and has a first end portion 180 and a second end portion 182. The first end 180 of the positioning link 18 is coupled to the first positioning member 14 and the second end 182 is coupled to the second positioning member 15. The third block 124 of the motherboard 12 is substantially located between the first block 120 and the second block 122.

Therefore, the first positioning member 14, the second positioning member 15, and the positioning link 18 can be paired by sequentially connecting the main board 12, the first positioning member 14, the second positioning member 15, and the positioning link 18 to each other. The whole of the motherboard 12 and the entire surface of the motherboard 12 are guided and aligned, so that the motherboard 12 can obtain a more stable structural design. Therefore, according to the foregoing structural configuration, the problem of unevenness of the motherboard 12 can be improved and problems that may occur after assembling components on the motherboard 12 are avoided, for example, the connector and the motherboard can be prevented from being warped due to the warpage of the motherboard 12. 12 Collision problems that may occur during assembly. Moreover, it is also possible to avoid the difficulty in alignment between the connector and the slot on the motherboard 12 due to the warpage of the motherboard 12, thereby causing the problem that the pins of the connector are mis-inserted and bent and damaged.

For example, as shown in FIG. 2, the first positioning member 14, the second positioning member 15, and the positioning link 18 further include a first engaging portion 142, a second engaging portion 152, and a third engaging portion 186, respectively. The first connecting portion 142 , the second connecting portion 152 and the third connecting portion 186 are disposed on the same horizontal surface for respectively engaging the first block 120 , the second block 122 and the third block 124 of the motherboard 12 . (See Figure 1). Therefore, when one of the first block 120, the second block 122, and the third block 124 of the motherboard 12 is deviated from the bottom plate 10a due to warpage, the corresponding engaging portion is pressed against the bottom plate 10a. The part of the motherboard 12. In contrast, when one of the first block 120, the second block 122, and the third block 124 of the motherboard 12 approaches the bottom plate 10a due to warping, the corresponding engaging portion is pulled back to the bottom plate. The part of the motherboard 12 of 10a.

In the embodiment, the motherboard module 1 further includes a plurality of third positioning members 16 . The third positioning member 16 includes two identical first positioning members 16a and second positioning members 16b, and the arrangement direction thereof is substantially perpendicular to the extending direction of the positioning link 18. The first positioning member 16a and the second positioning member 16b are located in the casing 10, are coupled to the motherboard 12, and are connected between the first positioning member 14 and the casing 10. Further, the first positioning member 16a and the second positioning member 16b respectively include a first fixing portion 162 and a second fixing portion 164. The first fixing portion 162 of the first positioning member 16a is coupled to the first positioning member 14, and the second fixing portion 164 is coupled to the first side wall 10b of the cabinet 10. In contrast, the first fixing portion 162 of the second positioning member 16b is coupled to the second side wall 10c of the casing 10, and the second fixing portion 164 is coupled to the first positioning member 14. Therefore, by the connection of the third positioning member 16 to the motherboard 12, the third positioning member 16 can improve the unevenness of the motherboard 12 in a direction substantially perpendicular to the extending direction of the positioning link 18.

In this embodiment, the connection manner between the third positioning member 16 and the casing 10 or the motherboard 12 is screw locking, but the disclosure is not limited to this connection. In other embodiments, the connection manner between the third positioning member 16 and the casing 10 or the motherboard 12 may also be overlapped or engaged with each other, as long as the third positioning member 16 is combined with the casing 10 or the motherboard. The manner in which 12 can be connected to each other can be applied to the present disclosure.

In addition, the motherboard module 1 further includes a pivoting portion 19. The pivoting portion 19 is disposed on the casing 10 at a side of the casing 10 with respect to the third positioning member 16 and has the same distance from the first sidewall 10b and the second sidewall 10c. The pivoting portion 19 is pivotally connected to one end of the second positioning member 15 away from the positioning link 18 and is connected to the second positioning member 15 .

According to the foregoing configuration, the first positioning member 14 and the second positioning member 15 are respectively connected to the casing 10 by the third positioning member 16 and the pivoting portion 19. Therefore, the motherboard 12 can be stably fixed in the casing 10 through the positioning member 18, the first positioning member 14 and the second positioning member 15 through the third positioning member 16 and the pivoting portion 19, and the host can be avoided. The plate 12 is warped.

For details, please refer to FIG. 3, FIG. 4A and FIG. 4B. FIG. 3 is a partially enlarged perspective view of the motherboard module 1 according to an embodiment of the present invention (Z1 in FIG. 2). 4A is a perspective view of the first end 180 of the positioning link 18 in accordance with an embodiment of the present invention. FIG. 4B is a perspective view showing a partial structure of the first positioning member 14 according to an embodiment of the present invention.

As shown, in the present embodiment, the positioning link 18 further includes an extension portion 184. The extension 184 has a top position 184a and a side portion 184b. The top end 184a of the positioning link 18 is coupled to the first end 180. The side portion 184b of the positioning link 18 is coupled to its top position 184a. The first positioning member 14 includes a first convex portion 140. The first protrusion 140 is limited between the top position 184a of the positioning link 18 and the motherboard 12 and is located between the first end 180 of the positioning link 18 and its side portion 184b. Thereby, the positioning link 18 and the first positioning member 14 can be connected and fixed by fastening and overlapping. Therefore, the motherboard 12 can achieve a more stable structural design by mutual fixation between the above components, thereby improving the problem of warpage of the motherboard 12. However, the manner of connecting the positioning link 18 and the first positioning member 14 of the present embodiment is not limited to the above manner, as long as the positioning link 18 and the first positioning member 14 can be connected to each other.

Further, in some embodiments, the positioning link 18 can be screwed through the third block 124 of the motherboard 12 to fix the motherboard 12 to the stud on the bottom plate 10a of the casing 10, thereby reducing The relative movement between the motherboard 12 and the casing 10 can enhance the stability of the motherboard module 1.

In some embodiments, the first positioning member 14 can be screwed through the first block 120 of the motherboard 12 to fix the motherboard 12 to the studs on the bottom plate 10a of the casing 10. In other embodiments, the second positioning member 15 can be screwed through the second block 122 of the motherboard 12 to fix the motherboard 12 to the stud on the bottom plate 10a of the casing 10. However, the fixing manner of the present disclosure is not limited to the above, as long as the first positioning member 14, the second positioning member 15, and the positioning link 18 can be fixed to the bottom plate 10a of the casing 10, the disclosure can be applied to the present disclosure.

Furthermore, please refer to FIG. 5, FIG. 6A and FIG. 6B. FIG. 5 is a partially enlarged perspective view of the motherboard module 1 according to an embodiment of the present invention (Z2 in FIG. 2). FIG. 6A is a perspective view showing a partial structure of the second positioning member 15 according to an embodiment of the present invention. FIG. 6B is a perspective view of the second end 182 of the positioning link 18 in accordance with an embodiment of the present invention. As shown, in the present embodiment, the second positioning member 15 has a through hole 150 substantially facing the positioning link 18. The second end 182 of the positioning link 18 has a second protrusion 1820 that faces substantially the second positioning member 15. The second protrusion 1820 of the positioning link 18 is disposed in the through hole 150.

The second protrusion 1820 of the second end portion 182 of the positioning link 18 is pressed against a portion of the inner wall of the through hole 150 of the second positioning member 15. Thereby, the positioning link 18 and the second positioning member 15 can be connected and fixed by fastening and overlapping. Therefore, the motherboard 12 can achieve a more stable structural design by mutual fixation between the above components, thereby improving the problem of warpage of the motherboard 12. However, the manner of connecting the positioning link 18 and the second positioning member 15 of the present embodiment is not limited to the above manner, as long as the positioning link 18 and the second positioning member 15 can be connected to each other.

It is apparent from the above detailed description of the specific embodiments of the present invention that the main board, the first positioning member, the second positioning member and the positioning link are sequentially connected to each other or are engaged with each other. Connected to the way of lap joint. With the above configuration, the first positioning member, the second positioning member and the positioning link can guide and straighten the whole of the main board and the entire surface of the main board, so that the main board can obtain a relatively stable structural design. . Therefore, according to the foregoing configuration, the warpage problem that may occur in the motherboard can be improved, and problems that may occur when components are assembled on the motherboard later can be avoided. For example, the structural configuration of the present disclosure can avoid the problem of a collision that may occur when the connector and the motherboard are assembled due to the warpage of the motherboard. Moreover, it is also possible to avoid the difficulty in alignment between the connector and the slot located on the motherboard due to the warpage of the motherboard, thereby causing the problem that the connector pins are mis-inserted and bent and damaged.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

1‧‧‧ motherboard module

10‧‧‧Chassis

10a‧‧‧floor

10b‧‧‧first side wall

10c‧‧‧second side wall

12‧‧‧ motherboard

120‧‧‧First block

122‧‧‧Second block

124‧‧‧ Third block

14‧‧‧First positioning piece

140‧‧‧First convex

142‧‧‧ First Connection

15‧‧‧Second positioning parts

150‧‧‧through hole

152‧‧‧Second Linkage

16‧‧‧ Third positioning piece

16a‧‧‧First positioning member

16b‧‧‧Second positioning member

162‧‧‧First Fixed Department

164‧‧‧Second fixed department

18‧‧‧ Positioning link

180‧‧‧First end

182‧‧‧ second end

1820‧‧‧second convex

184‧‧‧Extension

184a‧‧‧ top position

184b‧‧‧ side parts

186‧‧ Third Connection

19‧‧‧ pivotal department

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 2 is a perspective view of a motherboard module according to an embodiment of the present invention, in which a motherboard is omitted. FIG. 3 is a partially enlarged perspective view of the motherboard module according to an embodiment of the present invention (Z1 in FIG. 2). 4A is a perspective view of a first end of a positioning link according to an embodiment of the present invention. 4B is a perspective view showing a partial structure of a first positioning member according to an embodiment of the present invention. FIG. 5 is another partially enlarged perspective view of the motherboard module according to an embodiment of the present invention (Z2 in FIG. 2). FIG. 6A is a perspective view showing a partial structure of a second positioning member according to an embodiment of the present invention. 6B is a perspective view of the second end of the positioning link according to an embodiment of the present invention.

Claims (10)

A motherboard module includes: a casing having a bottom plate; a motherboard disposed on the bottom plate; a first positioning member located in the casing and coupled to the first block of the motherboard; a second positioning member is located in the casing and is coupled to the second block of the main board; and a positioning link is connected between the first positioning member and the second positioning member, and is connected to a third block of the motherboard, wherein the third block is substantially located between the first block and the second block. The motherboard module of claim 1, wherein the positioning link has a first end and a second end, the first end is connected to the first positioning member, and the second end is connected In the second positioning member. The motherboard module of claim 2, wherein the positioning link further comprises an extension portion having a top position and a side portion, the top position being connected to the first end portion, the side portion being connected In the top position, the first positioning member includes a first protrusion, and the first protrusion is located between the top position and the motherboard, and is located between the first end portion and the side portion. The motherboard module of claim 1 further includes a plurality of third positioning members located in the casing, coupled to the motherboard, and connected between the first positioning member and the casing. The motherboard module of claim 1, wherein the positioning link is fixed to the bottom plate of the casing via the third block of the motherboard. The motherboard module of claim 1, wherein the first positioning member is fixed to the bottom plate of the casing via the first block of the motherboard. The motherboard module of claim 1, wherein the second positioning member is fixed to the bottom plate of the casing via the second block of the motherboard. The motherboard module of claim 1, wherein the second positioning member has a through hole substantially facing the positioning link, and the second end of the positioning link has a second convex portion substantially facing the first Two positioning members, and the second convex portion is disposed in the through hole. The motherboard module of claim 8, wherein the second protrusion of the second end is pressed against a portion of the inner wall of the through hole. The motherboard module of claim 1 further includes a pivoting portion disposed on the casing and pivotally connected to an end of the second positioning member away from the positioning link.