TW201820889A - Integrated loudspeaker device having an acoustic chamber containing sound adsorber material - Google Patents

Integrated loudspeaker device having an acoustic chamber containing sound adsorber material Download PDF

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Publication number
TW201820889A
TW201820889A TW105138335A TW105138335A TW201820889A TW 201820889 A TW201820889 A TW 201820889A TW 105138335 A TW105138335 A TW 105138335A TW 105138335 A TW105138335 A TW 105138335A TW 201820889 A TW201820889 A TW 201820889A
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TW
Taiwan
Prior art keywords
acoustic
sound absorbing
chamber
sound
mobile device
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TW105138335A
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Chinese (zh)
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TWI786037B (en
Inventor
喬瑟夫 哈洛得
克里斯多夫 史區茂德
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奧音科技(北京)有限公司
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Priority to TW105138335A priority Critical patent/TWI786037B/en
Publication of TW201820889A publication Critical patent/TW201820889A/en
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Publication of TWI786037B publication Critical patent/TWI786037B/en

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Abstract

An acoustic device having a housing and an acoustic transducer is disclosed. The housing has a transducer space for the acoustic transducer, and a back volume space. The back volume is filled with a sound adsorber material. The sound adsorber material in the back volume space is configured to virtually increase the size of the back volume space, and shift the resonant frequency of the back volume space. The acoustic chamber for the acoustic transducer and the sound adsorber material is integral to the split-shell housing of the acoustic device. The sound adsorber material is retained in a portion of the acoustic chamber by an acoustically permeable material that facilitates gas exchange within the back volume space, and between the sound adsorber material and the transducer space. The acoustically permeable material is configured in different arrangements to facilitate the gas exchange.

Description

具有一包含吸音材料聲學腔室之整合式揚聲器裝置Integrated speaker unit with acoustic chamber containing sound absorbing material

本發明係關於聲學裝置之領域且特定言之本發明係關於具有吸音材料之小型揚聲器裝置,吸音材料整合於該揚聲器裝置之外殼之後置容積部分內。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to the field of acoustic devices and, more particularly, to a small speaker device having a sound absorbing material integrated into a volumetric portion of the outer casing of the speaker device.

在聲學技術中,習知的係:將一吸音材料放置於一揚聲器裝置之一後置容積中以就實際而言聲學地擴大後置容積。在具有一實體上較小之後置容積之一揚聲器裝置中,一吸音材料將該揚聲器裝置之諧振頻率降低至類似於具有一實體上較大之後置容積之一揚聲器裝置之一值。 更具體而言,安置於一揚聲器裝置之後置容積中之吸音材料改良其聲音特性,例如寬頻性能及揚聲器之視在聲學容積。吸音材料之實例包含沸石材料、沸石基材料、二氧化矽(SiO2 )、氧化鋁(Al2 O3 )、氧化鋯(ZrO3 )、氧化鎂(MgO)、四氧化三鐵(Fe3 O4 )、分子篩、富勒烯(fullerene)、奈米碳管及活性碳或木炭。與活性碳不同,沸石材料及沸石基材料係電隔離。由於沸石材料及沸石基材料不導電,所以沸石材料及沸石基材料不會影響併入具有此一吸音材料之一揚聲器裝置之一裝置之電組件(例如,天線、電池、內部電子產品等等)。此外,若非導電性沸石材料或沸石基材料在該裝置內變得鬆弛,則非導電性沸石材料或沸石基材料將不會引起短路。另外,沸石材料及沸石基材料之封裝比活性碳編織物之情況中容易得多。 在將由粉末、鬆散顆粒、鬆散微粒組成或至少包括粉末、鬆散顆粒、鬆散微粒之吸音材料插入或放置於揚聲器裝置之後置容積中時會產生一問題。另外,一小型揚聲器(諸如放置於行動電話、耳機等等中之一揚聲器裝置)之後置容積通常受包圍揚聲器之直接物理區域中之其他電路組件約束,且有時後置容積之形狀較為複雜且不符合聲學需求。一習知技術使用包裝一吸音材料之管,但此等管通常不良好配合於具有一複雜形狀之一後置容積。將吸音材料直接插入後置容積中在實踐上可較困難。另外,若吸音材料未牢固封裝,則其可進入揚聲器裝置以及使用揚聲器裝置之手持裝置之不同組件中,且因此,損壞揚聲器裝置或包含揚聲器裝置作為一組件之手持裝置。 美國申請案第13/818,374號(其全部內容以引用的方式併入本發明中)揭示包括一電聲學傳感器之一音訊系統或具有形成用以改良所發出之聲音之品質之一諧振容積之一外殼之揚聲器。申請案第13/818,374號中所揭示之音訊系統包括填充一揚聲器之諧振容積之一部分之一沸石顆粒材料或一實質上球狀沸石顆粒材料。沸石材料係一吸音材料,取決於材料之調配,該材料導致諧振空間之容積之一實際聲學擴大達1.5或更大之一因數。因此,包含沸石材料之揚聲器之外殼之容積可相較於填充空氣之一揚聲器之一外殼而變得較小。 用作為一小型揚聲器(諸如通常發現於今日之手持消費性電子裝置中之類型)之後置容積內部之一吸音器之一沸石基材料之封裝已具挑戰性。儘管不具電損壞性,但若未適當地含於裝置內,則申請案第13/818,374號中所揭示之沸石材料可干擾一小型揚聲器及一手持消費性電子裝置內之其他組件之適當操作。此外,歸因於一小型揚聲器之後置容積內之通常受限之空間,可阻抗氣體交換且沸石基吸音器之效率可由設計限制減小。儘管該小型揚聲器之後置容積可完全填充一沸石基吸音器,但只要吸音表面積之一有限量曝露於由聲學傳感器移動引起之壓力變化,申請案第13/818,374號中所揭示之諧振頻率偏移就會受限。In acoustic technology, a conventional system is to place a sound absorbing material in a rear volume of a speaker device to acoustically enlarge the rear volume in practice. In a speaker device having a physically smaller rear volume, a sound absorbing material reduces the resonant frequency of the speaker device to a value similar to one of the speaker devices having a substantially larger rear volume. More specifically, the sound absorbing material disposed in the rear volume of a speaker device improves its sound characteristics, such as broadband performance and the apparent acoustic volume of the speaker. Examples of sound absorbing materials include zeolitic materials, zeolite-based materials, cerium oxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), zirconium oxide (ZrO 3 ), magnesium oxide (MgO), and triiron tetroxide (Fe 3 O). 4 ), molecular sieves, fullerene, carbon nanotubes and activated carbon or charcoal. Unlike activated carbon, zeolitic materials and zeolite-based materials are electrically isolated. Since the zeolitic material and the zeolite-based material are not electrically conductive, the zeolitic material and the zeolite-based material do not affect the electrical components (eg, antennas, batteries, internal electronics, etc.) incorporated into one of the speaker devices having one of the sound absorbing materials. . Further, if the non-conductive zeolite material or the zeolite-based material becomes slack in the apparatus, the non-conductive zeolite material or the zeolite-based material will not cause a short circuit. In addition, the encapsulation of zeolitic materials and zeolite-based materials is much easier than in the case of activated carbon braids. A problem arises when a sound absorbing material composed of powder, loose particles, loose particles or at least a powder, loose particles, loose particles is inserted or placed in a volume after the speaker device is placed. In addition, the rear volume of a small speaker (such as one of the speaker devices placed in a mobile phone, earphone, etc.) is typically constrained by other circuit components in the direct physical area surrounding the speaker, and sometimes the shape of the rear volume is more complex and Does not meet acoustic requirements. One prior art technique uses a tube that wraps a sound absorbing material, but such tubes are typically not well fitted to a back volume having a complex shape. Inserting the sound absorbing material directly into the back volume can be difficult in practice. In addition, if the sound absorbing material is not securely packaged, it can enter different components of the speaker device and the handheld device using the speaker device, and thus, damage the speaker device or the handheld device including the speaker device as a component. U.S. Patent Application Serial No. 13/818,374, the entire disclosure of which is incorporated herein by reference in its entirety, the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire content Speaker for the case. The audio system disclosed in application Serial No. 13/818,374 includes a zeolite particulate material or a substantially spherical zeolite particulate material that fills one of the resonant volumes of a speaker. The zeolitic material is a sound absorbing material which, depending on the formulation of the material, results in an actual acoustic expansion of one of the volumes of the resonant space by a factor of 1.5 or greater. Therefore, the volume of the outer casing of the speaker containing the zeolitic material can be made smaller than the outer casing of one of the speakers filled with air. Encapsulation of a zeolite-based material, one of the internal sound absorbers of a volume after use as a small speaker, such as that found in today's handheld consumer electronic devices, has been challenging. Although not electrically damaging, the zeolitic materials disclosed in application No. 13/818,374 may interfere with proper operation of a small speaker and other components within a handheld consumer electronic device, if not properly contained within the device. Moreover, due to the generally limited space within the compact volume of a small speaker, the impedance of the gas exchange and the efficiency of the zeolite-based sound absorber can be reduced by design constraints. Although the small speaker rear volume can be completely filled with a zeolite-based sound absorber, as long as a limited amount of the sound-absorbing surface area is exposed to the pressure change caused by the movement of the acoustic sensor, the resonant frequency shift disclosed in the application No. 13/818,374 It will be limited.

所揭示之發明係關於在接合時形成一聲學傳感器之一整合式聲學腔室之一行動裝置(諸如一揚聲器)之外殼元件。該聲學腔室具有一後置容積、一前置容積及由該聲學傳感器佔據之一容積。在該聲學腔室之後置容積部分中,大量吸音材料安置於由該聲學腔室之壁產生之一腔室內。使用具有低聲阻之一可透氣材料將包含吸音材料之該腔室自該聲學腔室之其餘部分密封。該可透氣材料將該吸音材料保持在其指定腔室中同時允許吸音材料與該聲學腔室之其餘部分之間發生氣體交換。 根據本發明之一行動裝置之外殼之一實施例可包括:一印刷電路基板;及一護罩,其經組態以與該印刷電路基板配合以產生該行動裝置中之一聲學傳感器之外殼。在該實施例中,該護罩可包括:一腔室壁,其在與該印刷電路基板之一內表面接合時界定一實質上密封聲學腔室;一聲學傳感器(諸如一揚聲器或接收器),其安置於該聲學腔室內;一音埠,其聲學地耦合至該聲學傳感器;一內部腔室壁,其安置於該聲學腔室內且界定一後置容積;及大量吸音材料,其安置於該後置容積內。在該實施例中,一可透氣構件機械地耦合至該腔室壁之一頂部部分及該內部腔室壁之一頂部部分,其中該可透氣構件將該吸音材料保持在該聲學腔室內之一界定容積中。此實施例之該可透氣構件具有低聲阻且可包括一羊絨材料或一網狀材料之一或多者,且該可透氣構件之材料之孔徑經調適以小於吸音顆粒之大小。該可透氣構件藉由膠黏、捲邊、衝壓、壓印、熱封或超音波焊接而機械地附接至該腔室壁之該頂部部分該內部腔室壁之該頂部部分。此實施例可進一步包括插置在該印刷電路基板與該腔室壁之該頂部部分之間之一腔室襯墊,其中該腔室襯墊之一厚度判定通過其促進氣體交換之一限制之大小。此外,此實施例可進一步包括插置在該聲學傳感器與安置於該護罩中之該音埠之間之一音埠襯墊,其中該音埠襯墊自該後置容積密封該前置容積。在此實施例中,在該聲學腔室中,該後置容積部分部分地填充具有至少300微米之一最小直徑之實質上球形吸音顆粒之沸石基材料。 一行動裝置之一外殼之另一實施例可包括:一第一外殼元件,該第一外殼元件包括具有一印刷電路板,其具有電及機械地耦合至該印刷電路板之一聲學傳感器;及一第二外殼元件,其機械地耦合至該第一外殼元件以形成該行動裝置之該外殼。在此實施例中,該第二外殼元件可包括:一連續垂直元件,其在與該第一外殼元件之該印刷電路板接合時界定一實質上密封之聲學腔室;一音埠,其安置於聲學地耦合至該聲學傳感器(例如,一揚聲器或一接收器)之一傳感器空間中;一內部垂直元件,其安置於該聲學腔室中且與該連續垂直元件相交以界定一後置容積;大量吸音顆粒,其安置於該後置容積內;及一透聲材料,其機械地耦合至該連續垂直元件之一頂部部分及該內部垂直元件之一頂部部分,其中該透聲材料將該吸音顆粒保持在該聲學腔室內之一界定空間中。在此實施例中,該聲學傳感器在該第一外殼元件及該第二外殼元件耦合在一起時佔據該傳感器空間。在此實施例中,該聲學腔室之該後置容積部分部分地填充具有含至少200微米之一最小直徑(或在另一實施例中,至少350微米之一最小直徑)之實質上球形顆粒之一沸石基吸音顆粒。此實施例可包括插置在該印刷電路板與該連續垂直元件之該頂部部分之間之一腔室襯墊,其中該腔室襯墊之一厚度判定通過其促進氣體交換之一限制之大小。在此實施例中,該透聲材料可藉由膠黏或超音波焊接而機械地附接至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分。 在此實施例之一變化形式中,該內部垂直元件可包括一開口,其經組態以促進該吸音顆粒之氣體交換,其中該開口可包括具有實質上相同於機械地耦合至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之該透聲材料之聲阻之一材料,且安置於該內部垂直元件之該開口中之該此材料可包括一羊絨材料或一網狀材料之一或多者。在一進一步變化形式中,該內部垂直元件可包括一開口,其經組態以促進該吸音顆粒之氣體交換,其中該開口可包括具有不同於機械地耦合至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之該透聲材料之一聲阻之一材料。在一些實施例中,安置於該內部垂直元件之該開口中之該材料可包括一可透氣材料,其可包括經設定大小以將該吸音顆粒保持在該後置容積中之一界定區域中之多個孔徑。在一些實施例中,該外殼可包括插置在該聲學傳感器與安置於該第二外殼元件中之該音埠之間之一音埠襯墊,其中該音埠襯墊經組態以在將該第一外殼元件與該第二外殼元件接合時自該後置容積密封該音埠。 一行動裝置之一外殼之另一實施例可包括:一第一外殼元件,該第一外殼元件包括一印刷電路板,其具有電及機械地耦合至該印刷電路板之一聲學傳感器(例如,揚聲器或接收器);及一第二外殼元件,其機械地耦合至該第一外殼元件以形成該行動裝置之該外殼。該第二外殼可包括:一連續垂直元件,其在與該第一外殼元件之該印刷電路板接合時界定一實質上密封之聲學腔室;一音埠,其安置於聲學地耦合至該聲學傳感器之一傳感器空間;一內部垂直元件,其安置於該聲學腔室中且與該連續垂直元件相交以界定一後置容積。在此實施例中,該內部垂直元件可包括:一開口,其經組態用於氣體交換;一低聲阻嵌件,其完全覆蓋該開口;大量吸音顆粒,其安置於該後置容積內;一透聲材料,其機械地耦合至該連續垂直元件之一頂部部分及該內部垂直元件之一頂部部分,其中該透聲材料將該吸音顆粒保持在該聲學腔室內之一界定空間中。此實施例亦可包括插置在該印刷電路板與該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之間之一腔室襯墊。在此實施例中,該聲學傳感器在該第一外殼元件及該第二外殼元件耦合在一起時佔據該傳感器空間。在一些實施例中,該內部垂直元件中之該低聲阻嵌件及該透聲材料各包括一羊絨材料或一網狀材料之一或多者。此外,在一些實施例中,該聲學腔室之該後置容積部分部分地填充具有含至少300微米之一最小直徑及900微米之一最大直徑之實質上球形顆粒之一沸石基吸音顆粒。 可依以下方式製造一行動裝置之外殼之實施例。在實質上已完成護罩之後,易於在針對吸音材料指定之聲學腔室之後置容積部分中接收該材料。量測大量吸音材料且將其裝載至一配劑漏斗中。該護罩定位於該配劑漏斗下面,且當將該吸音材料澆注至該聲學腔室之該後置容積之指定部分或若干指定部分時振動。若該後置容積具有多個腔室,則吸音材料量測步驟及配劑步驟將視需要重複多次。在填充之後,該護罩振動多次以確保該吸音材料沉降至該聲學腔室之該指定部分或若干指定部分。接著,將一可透氣構件放置於該聲學腔室上且藉由膠黏、超音波焊接或其他技術而將其機械地附接至該聲學腔室。使一腔室襯墊與該聲學腔室之壁對準,且接著,將該印刷電路基板接合於該護罩,藉此完成該行動裝置之該聲學傳感器之該外殼。 可依以下方式製造一行動裝置之外殼之其他實施例。在實質上已完成護罩之後,易於在針對吸音材料指定之聲學腔室之後置容積部分中接收該材料。將一可透氣構件放置於將接收該吸音材料之該聲學腔室上且藉由膠黏、超音波焊接或其他技術而將其機械地附接至該聲學腔室。量測大量吸音材料且將其裝載至一配劑漏斗中。該護罩定位於該配劑漏斗下面,且當透過與安置於該護罩中之一裝填埠對準之一配劑漏斗將該吸音材料澆注至該聲學腔室之該後置容積之指定部分或若干指定部分時振動。若該後置容積具有多個腔室,則吸音材料量測步驟及配劑步驟將視需要重複多次。在填充之後,該護罩振動多次以確保該吸音材料沉降至該聲學腔室之該指定部分或若干指定部分。使一腔室襯墊與該聲學腔室之壁對準,且接著,將該印刷電路基板接合於該護罩,藉此完成該行動裝置之該聲學傳感器之該外殼。 將自以下說明書結合以下圖式明白所揭示之發明之其他特徵及優點。The disclosed invention relates to a housing component of a mobile device, such as a speaker, that forms an integrated acoustic chamber of an acoustic sensor when engaged. The acoustic chamber has a rear volume, a front volume, and a volume occupied by the acoustic sensor. In the volume portion of the acoustic chamber, a plurality of sound absorbing materials are disposed in one of the chambers created by the walls of the acoustic chamber. The chamber containing the sound absorbing material is sealed from the remainder of the acoustic chamber using a gas permeable material having a low acoustic resistance. The gas permeable material retains the sound absorbing material in its designated chamber while allowing gas exchange between the sound absorbing material and the remainder of the acoustic chamber. An embodiment of a housing for a mobile device in accordance with the present invention can include: a printed circuit substrate; and a shield configured to cooperate with the printed circuit substrate to produce an outer casing of one of the mobile devices. In this embodiment, the shield can include a chamber wall defining a substantially sealed acoustic chamber when engaged with an inner surface of the printed circuit substrate; an acoustic sensor (such as a speaker or receiver) Disposed in the acoustic chamber; a hammer that is acoustically coupled to the acoustic sensor; an interior chamber wall disposed within the acoustic chamber and defining a rear volume; and a plurality of sound absorbing materials disposed on Within the rear volume. In this embodiment, a gas permeable member is mechanically coupled to a top portion of the chamber wall and a top portion of the interior chamber wall, wherein the gas permeable member retains the sound absorbing material within the acoustic chamber Define the volume. The gas permeable member of this embodiment has low acoustic resistance and may comprise one or more of a cashmere material or a mesh material, and the pore diameter of the material of the gas permeable member is adapted to be smaller than the size of the sound absorbing particles. The gas permeable member is mechanically attached to the top portion of the interior chamber wall of the chamber wall by gluing, crimping, stamping, stamping, heat sealing or ultrasonic welding. This embodiment can further include a chamber liner interposed between the printed circuit substrate and the top portion of the chamber wall, wherein a thickness determination of the chamber liner is limited by one of its promoting gas exchange size. Moreover, this embodiment can further include a sound pad inserted between the acoustic sensor and the cover disposed in the shield, wherein the hammer pad seals the front volume from the rear volume . In this embodiment, in the acoustic chamber, the post-volume portion is partially filled with a zeolite-based material having substantially spherical sound absorbing particles of a minimum diameter of at least 300 microns. Another embodiment of a housing of a mobile device can include: a first housing component including a printed circuit board having an acoustic sensor electrically and mechanically coupled to the printed circuit board; A second outer casing member mechanically coupled to the first outer casing member to form the outer casing of the mobile device. In this embodiment, the second housing component can include: a continuous vertical component that defines a substantially sealed acoustic chamber when engaged with the printed circuit board of the first housing component; Acoustically coupled to one of the acoustic sensors (eg, a speaker or a receiver) in an sensor space; an internal vertical member disposed in the acoustic chamber and intersecting the continuous vertical member to define a rear volume a plurality of sound absorbing particles disposed within the rear volume; and a sound permeable material mechanically coupled to a top portion of one of the continuous vertical members and a top portion of the inner vertical member, wherein the sound permeable material The sound absorbing particles remain in a defined space within the acoustic chamber. In this embodiment, the acoustic sensor occupies the sensor space when the first housing element and the second housing element are coupled together. In this embodiment, the rear volume portion of the acoustic chamber is partially filled with substantially spherical particles having a minimum diameter of at least 200 microns (or in another embodiment, at least one of 350 microns) One of the zeolite-based sound absorbing particles. This embodiment can include a chamber liner interposed between the printed circuit board and the top portion of the continuous vertical member, wherein a thickness of one of the chamber liners is determined by a size that promotes gas exchange. . In this embodiment, the sound permeable material can be mechanically attached to the top portion of the continuous vertical member and the top portion of the inner vertical member by adhesive or ultrasonic welding. In a variation of this embodiment, the internal vertical member can include an opening configured to facilitate gas exchange of the sound absorbing particles, wherein the opening can include having substantially the same mechanical coupling to the continuous vertical member a material of the acoustic resistance of the top portion and the top portion of the inner vertical member, and the material disposed in the opening of the inner vertical member may comprise a cashmere material or a mesh material One or more. In a further variation, the internal vertical element can include an opening configured to facilitate gas exchange of the sound absorbing particles, wherein the opening can include having the top portion that is differently mechanically coupled to the continuous vertical element and One of the sound permeable materials of the top portion of the inner vertical member is acoustically resistant to one of the materials. In some embodiments, the material disposed in the opening of the inner vertical member can include a gas permeable material that can be sized to retain the sound absorbing particles in a defined area of the back volume. Multiple apertures. In some embodiments, the housing can include a voice cassette interposed between the acoustic sensor and the sound cassette disposed in the second housing element, wherein the sound pad is configured to The first outer casing element seals the sound from the rear volume when engaged with the second outer casing element. Another embodiment of a housing of a mobile device can include: a first housing component including a printed circuit board having an acoustic sensor electrically and mechanically coupled to the printed circuit board (eg, a speaker or receiver); and a second housing component mechanically coupled to the first housing component to form the housing of the mobile device. The second housing can include: a continuous vertical member defining a substantially sealed acoustic chamber when engaged with the printed circuit board of the first housing member; a sound chamber disposed to be acoustically coupled to the acoustic One sensor space of the sensor; an internal vertical element disposed in the acoustic chamber and intersecting the continuous vertical element to define a back volume. In this embodiment, the inner vertical member can include: an opening configured for gas exchange; a low acoustic resistance insert that completely covers the opening; a plurality of sound absorbing particles disposed within the rear volume a sound transmissive material mechanically coupled to a top portion of one of the continuous vertical members and a top portion of the inner vertical member, wherein the sound permeable material retains the sound absorbing particles in a defined space within the acoustic chamber. This embodiment can also include a chamber liner interposed between the printed circuit board and the top portion of the continuous vertical member and the top portion of the inner vertical member. In this embodiment, the acoustic sensor occupies the sensor space when the first housing element and the second housing element are coupled together. In some embodiments, the low acoustic resistance insert and the sound permeable material in the inner vertical element each comprise one or more of a cashmere material or a mesh material. Moreover, in some embodiments, the rear volume portion of the acoustic chamber is partially filled with zeolite-based sound absorbing particles having substantially spherical particles having a minimum diameter of at least 300 microns and a maximum diameter of 900 microns. An embodiment of a housing for a mobile device can be made in the following manner. After the shield has been substantially completed, it is easy to receive the material in the volume portion of the acoustic chamber designated for the sound absorbing material. A large amount of sound absorbing material was measured and loaded into a dispensing funnel. The shroud is positioned below the dispensing funnel and vibrates when the sound absorbing material is poured into a designated portion or portions of the back volume of the acoustic chamber. If the back volume has a plurality of chambers, the sound absorbing material measuring step and the dispensing step will be repeated as many times as needed. After filling, the shield vibrates a plurality of times to ensure that the sound absorbing material settles to the designated portion or portions of the acoustic chamber. Next, a gas permeable member is placed over the acoustic chamber and mechanically attached to the acoustic chamber by gluing, ultrasonic welding or other techniques. A chamber liner is aligned with the wall of the acoustic chamber, and then the printed circuit substrate is bonded to the shield, thereby completing the housing of the acoustic sensor of the mobile device. Other embodiments of a housing for a mobile device can be made in the following manner. After the shield has been substantially completed, it is easy to receive the material in the volume portion of the acoustic chamber designated for the sound absorbing material. A gas permeable member is placed on the acoustic chamber that will receive the sound absorbing material and mechanically attached to the acoustic chamber by gluing, ultrasonic welding or other techniques. A large amount of sound absorbing material was measured and loaded into a dispensing funnel. Positioning the shroud under the dispensing funnel and pouring the sound absorbing material into a designated portion of the backing volume of the acoustic chamber through a dispensing funnel aligned with one of the loading jaws disposed in the shroud Vibrate when there are several specified parts. If the back volume has a plurality of chambers, the sound absorbing material measuring step and the dispensing step will be repeated as many times as needed. After filling, the shield vibrates a plurality of times to ensure that the sound absorbing material settles to the designated portion or portions of the acoustic chamber. A chamber liner is aligned with the wall of the acoustic chamber, and then the printed circuit substrate is bonded to the shield, thereby completing the housing of the acoustic sensor of the mobile device. Other features and advantages of the disclosed invention will be apparent from the description and appended claims.

將參考附圖來提供所揭示之實施例之一詳細描述。 儘管本發明易受諸多不同形式之實施例影響,但圖式展示(且如將詳細描述)本發明之較佳實施例,其中應瞭解本揭示內容被視為本發明之原理之一範例,且不意欲使本發明之廣泛態樣受限於所繪示之實施例。 參考圖1及圖2,圖中繪示一揚聲器裝置10。揚聲器裝置10包括一上揚聲器外殼13、一下揚聲器外殼14,及一聲學傳感器12。使用緊固件、鎖定突片或一適合黏著劑使上揚聲器外殼13接合於下揚聲器外殼14。用以接合上揚聲器外殼13及下揚聲器外殼14之黏著劑宜不具有可影響後置容積中之吸音材料及影響其效率之任何排氣特性。當吸音材料19係內部地安置於揚聲器裝置10中時,虛線15指示揚聲器裝置中之吸音材料19的內部位置。上揚聲器外殼13包括一傳感器開口,其允許自聲學傳感器12至裝置外部之空間的聲音傳播/氣流。圖1中未展示揚聲器裝置之其他元件,諸如電接點、襯墊及內部配接線。 參考圖2,圖中繪示封裝吸音材料19之一方法。「吸音材料」(如本文所使用)指稱申請案第13/818,374號中所揭示之沸石材料,但可視需要使用其他吸音材料。如圖2中沿截面線A-A所展示,揚聲器裝置10之後置容積17在聲學傳感器12周圍延伸且延伸至其中安置吸音袋16之後置容積的內部部分中。申請案第14/003,217號(其全部內容以引用的方式併入本發明中)中揭示一種使用一袋圍封吸音材料19之技術。如申請案第14/003,217號中所揭示,吸音袋16經製造以配合於後置容積之內部輪廓,且吸音袋16之一側包括具有促進後置容積與吸音袋16之內部容積之間之氣體交換之一低聲阻之一可透氣材料。該可透氣材料亦必須將吸音材料19保持在袋之內部腔室內。吸音袋16之其餘側係由相對透氣或具有一高聲阻之一材料製造。吸音袋16經定位使得氣體交換透過該可透氣材料而發生於吸音材料19與後置容積17之間。 參考圖3,圖中繪示將吸音材料19保持在揚聲器裝置10之後置容積內的另一方法。如圖3中沿截面線A-A所展示,替代一吸音袋16,一可透氣壁18係安置於後置容積17內。可透氣壁18係由突片、凸緣或適合黏著劑保持在後置容積17內之其位置中。若使用一黏著劑,則該黏著劑宜不具有可影響後置容積中之吸音材料及影響其吸收能力的任何排氣特性。可透氣壁18可包括一打孔或蝕刻聚丙烯材料、具有低聲阻之一網狀材料、一濾波器材料,或具有一低聲阻之其他可透氣材料。如圖3中所展示,吸音材料19係保持在與聲學傳感器12之位置相對的後置容積17的一部分中。 如圖2及圖3中所展示,透過放置於吸音材料19與後置容積17之間的一可透氣材料來促進吸音材料19與後置容積17之間的氣體交換。然而,如圖2及圖3中所展示,位於與後置容積之介面處(即緊鄰於該可透氣材料)之吸音材料19將在吸音材料19遠離後置容積介面之前吸收或解吸氣體。即使吸音材料19係一顆粒(而非小得多的微粒),吸音材料19將聲阻呈現至通過該可透氣材料之氣體。此聲阻引起最接近後置容積介面之吸音材料19更多與氣體交換相互作用,而離該可透氣材料更遠之吸音器可具有較少相互作用。氣體交換中之此不均勻相互作用可引起吸音材料19之效率降低(若通過吸音材料之路徑太長/太窄)。 參考圖4,圖中描繪安置於由一音訊裝置之護罩33及印刷電路板32界定之一實質上密封之聲學腔室中之一聲學傳感器34之一實施例。在本申請案之內文中,一音訊裝置包含具有一音訊功能(諸如語音訊息、音樂或其他聲音檔案之重放)之任何類型之電子裝置,諸如一音樂播放器、行動電話等等。由於吸音材料可增強麥克風元件之頻率響應,所以亦包含具有一麥克風之音訊裝置。在圖4中,該實質上密封之聲學腔室由印刷電路板32、具有其腔室壁41之護罩33及插置在腔室壁41之頂部部分與印刷電路板32之頂部部分之間之腔室襯墊37界定。在一些實施例中,腔室壁41係一連續壁,且由射出模製塑膠形成或由金屬加工。替代具有其自身之上揚聲器外殼殼體及下揚聲器外殼殼體之一完整揚聲器單元,圖4中所展示之實施例依賴於提供揚聲器外殼之印刷電路板32及護罩33。通常,對於此類型之揚聲器組態,直至音訊裝置之印刷電路板32及護罩33接合才完成揚聲器。 音埠39允許聲音傳播至由印刷電路板32及護罩33及腔室襯墊37形成之腔室外部之環境。聲學傳感器34經由安置於印刷電路板32與聲學傳感器34之間的傳感器接點36電及機械地耦合至印刷電路板32。焊料或其他導電材料可用以將聲學傳感器34電及機械地耦合至印刷電路板32。替代地,聲學傳感器34可具有被推進抵靠印刷電路板32以提供電連續性之彈簧接點。聲學傳感器34經由傳感器接點36自印刷電路板32接收電信號。 聲學傳感器34由音埠襯墊38自音埠39及護罩33之內表面間隔。音埠襯墊38將實質上密封之聲學腔室分為一前置容積40及一後置容積35。前置容積40係可透過音埠39存取且由音埠襯墊38、音埠襯墊38內之護罩33之內表面之部分及面向音埠39之聲學傳感器34之部分定界之容積。實質上密封之聲學腔室之後置容積35由音埠襯墊38外部之護罩33之內表面之部分、腔室壁41之內表面、腔室襯墊37及腔室襯墊37內之印刷電路板32之內表面之部分定界。印刷電路板32之其他部分機械地耦合至護罩33以抵靠腔室壁41之頂部部分壓縮腔室襯墊37,及抵靠音埠39之區域中之聲學傳感器34及護罩33之內表面壓縮音埠襯墊38。腔室襯墊37及音埠襯墊38之壓縮實質上密封聲學傳感器34之聲學腔室。如所熟知,後置容積35改良聲學傳感器(在此例項中係一揚聲器)之操作。圖4中展示歸因於透過傳感器接點36接收之電信號之聲學傳感器34之移動期間自聲學傳感器34之後側至後置容積35中之氣流。 圖4亦描繪一罩殼30及一PCB殼體31,其中罩殼30安裝於護罩33上且PCB殼體31安裝於印刷電路板32上。罩殼30及PCB殼體31係音訊裝置之選用組件,且通常包含覆蓋護罩33及印刷電路板32之美學原因。更具體而言,護罩33可具有分模線、緊固件埠或美學上不令人愉悅之加工線,且罩殼30附接至護罩33以掩蓋該等製造人為誤差。類似地,PCB殼體31安裝在印刷電路板32上以覆蓋配接線、電跡線及其他製造人為誤差。 參考圖5,圖中描繪安置於具有一吸音材料19之一實質上密封之聲學腔室中之一聲學傳感器34之一實施例,該實質上密封之聲學腔室由一音訊裝置之印刷電路板32及護罩33界定。圖5之實施例之大多數結構特徵相同於圖4中展示之結構特徵。在圖5中展示之實施例中,後置容積35現由大量吸音材料19、一內部腔室壁44及在由內部腔室壁44、腔室壁41及可透氣構件43界定之容積內包含吸音材料19之可透氣構件43佔據。可透氣構件43機械地耦合或附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分上之可透氣構件附接點42。可透氣構件43僅覆蓋將接收吸音材料19之該實質上密封之聲學腔室(即後置容積35)之該等部分。該實質上密封之聲學腔室之其他部分(諸如聲學傳感器位於其中之部分)將不覆蓋有可透氣構件43。這允許在無需移除可透氣構件43或干擾吸音材料19之情況下修復及更換聲學傳感器34。腔室襯墊37覆蓋機械地耦合或附接至腔室壁41之頂部部分之可透氣構件43之部分。 儘管圖5僅揭示將包含吸音材料19之一單一後置容積35,但可預期後置容積35可包括由腔室壁41、護罩33及印刷電路板32界定之整個實質上密封之聲學腔室內之多個腔室類型區域。吾人可進一步預期該實質上密封之聲學腔室內之此等多個腔室類型區域之各者將由可透氣構件43、較佳地由經組態以覆蓋所有腔室類型區域之一單件式可透氣構件43覆蓋。吾人亦可預期取決於由腔室壁41、護罩33及印刷電路板32界定之實質上密封之聲學腔室之總體設計,亦可獲取多個可透氣構件43。另外,覆蓋包含吸音材料19之多個腔室之一可透氣構件43將不覆蓋指定為由聲學傳感器佔據之聲學腔室中之容積以促進聲學傳感器34之修復或更換。 如圖2中所展示,包含一吸音材料19之一吸音袋16可用於此類型之揚聲器組態中,其中揚聲器外殼模製為或係一音訊裝置之外殼之一整合式部分。吸音袋16之一限制係:後置容積35之角(如圖4及圖5中所展示)將不具有安置於其中之任何聲音材料。此係歸因於吸音袋16中固有之製造限制。更具體而言,九十度角無法模製為吸音袋16且亦需要後置容積35中之適當袋放置之一些容限,且因此少量後置容積35不接收吸音材料19。由於吸音材料19之填充埠將可見於一音訊裝置之外殼上,且美學上不令可能裝置購買者愉悅,所以圖3中所展示之其他方法將不適合於此類型之揚聲器組態,其中揚聲器外殼模製為或係該音訊裝置之外殼之一整合式部分。此外,存在一危險:音訊裝置之定期日常使用將引起填充端口上方之密封件偏移原位或破裂,藉此允許吸音材料漏出。 圖5中展示在歸因於透過傳感器接點36接收電信號而移動聲學傳感器34期間自聲學傳感器34之後側至後置容積35之氣流。在操作期間,聲學傳感器34在後置容積35中產生壓力,且此壓力引起與吸音材料19發生氣體交換。可透氣構件43促進後置容積35與吸音材料19之間的此氣體交換。較佳地,吸音材料19係如美國申請案第14/818,374號(其全部內容以引用的方式併入)所揭示之一鬆散沸石顆粒材料。更佳地,該鬆散沸石顆粒材料(用作為吸音材料19)係實質上球形且具有100微米或更大之一直徑範圍。該鬆散沸石顆粒材料因其易於在製造本文所揭示之類型之一聲學裝置中使用而係較佳的。亦可使用其他類型之吸音材料(諸如沸石粉末或活性炭),但可不太易於在製造程序中使用。 如技術中已知,聲音或氣體通過一材料之能量可與聲阻(即以MKS瑞(MKS rayl)為單位量測)一起描述。對於圖5中展示之實施例,可透氣構件43應具有低於可透氣構件43後面之一通常容積大小(在此情況中係1立方厘米)之一特定臨限值之一聲阻(通常為260 MKS瑞)。若開口較小,則選擇待用作為可透氣構件43之材料可引起開口處之聲阻超過260 MKS瑞臨限,藉此導致較差聲學效能。更具體而言,若超過260 MKS瑞臨限,則阻礙後置容積中之氣體到達吸音材料19。因此,若選擇一羊絨材料用作為可透氣構件43,則必須小心不超過260 MKS瑞臨限,尤其若限制51較小。對於一些實施例,羊絨材料係一非均質材料,且更具體而言,係由具有一未界定圖案之尼龍纖維製成之一平層材料。羊絨材料之目的係保持吸音材料19,且允許氣體與吸音材料19相互作用。羊絨材料之結構及材料中之任何孔徑使得吸音材料19 (呈粉末形式、微粒形式或顆粒形式)無法通過羊絨材料。 替代地,一網狀材料可用於可透氣構件43。在一些實施例中,不同於羊絨材料,明確界定網狀材料之表面結構及材料結構。例如,適合於用作為可透氣構件43之一層網狀材料可具有115微米之一標稱厚度、130微米之一孔徑大小及每平方厘米8.5 MKS瑞之一聲阻。如同羊絨材料,網狀材料之目的係保持吸音材料19,且允許氣體與吸音材料19相互作用。網狀材料之結構及材料中之任何孔徑使得吸音材料19 (呈粉末形式、微粒形式或顆粒形式)無法通過網狀材料。一聲學工程師具有相對於網狀材料之較寬設計緯度,此係由於網狀材料之聲阻較低且係一已知量。 可透氣構件43可藉由膠黏、捲邊、衝壓、壓印、熱封或較佳地藉由超音波焊接而耦合至腔室壁41之頂部部分及內部腔室壁44之頂部部分上之可透氣構件附接點42。超音波焊接之一優點係一一致及可靠黏著劑形成於可透氣構件43與腔室壁41之頂部部分及內部腔室壁44之頂部部分之間,其中可透氣構件43係一羊絨或網狀材料。超音波焊接引起材料熔合,由此當將材料熔合在一起時形成一堅固機械接合。通常,超音波焊接軟化網狀材料中之纖維,但不使纖維熔化。超音波焊接技術確保包括可透氣構件43之材料固定地緊固於腔室壁41之頂部部分及內部腔室壁44之頂部部分,藉此防止吸音材料19之任何洩漏同時仍允許氣體與吸音材料19相互作用。 將可透氣構件43用於保持吸音材料19之另一特徵係可在不會干擾或丟失吸音材料19之情況下修復或更換聲學傳感器34。將可透氣構件43牢固附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分防止吸音材料19自其指定容積漏出。 如圖5中所展示,限制51係內部腔室壁44之頂部部分與印刷電路板32之內表面之間的通路。限制51之大小基於腔室襯墊37之厚度。較佳地,腔室襯墊37之厚度係0.3毫米,但其他厚度可用以調整限制51之高度。 在圖5中所展示之實施例中,內部腔室壁44由一固體材料(較佳地射出模製塑膠或加工金屬)形成。在圖2及圖3中所展示之揚聲器實施例中,吸音材料19之有限量之表面積曝露可影響吸音材料19之效能。更具體而言,由於接近聲學傳感器之氣流較高且壁處之後置容積之遠端處之氣流較低,所以更遠離促進吸音材料19與後置容積之間的氣體交換之可透氣材料之吸音材料19不經歷相同於接近可透氣構件之吸音材料19之量之氣流/氣體速度。此係歸因於由接近後置容積形成之聲學彈簧及自身將一特定量之聲阻呈現至推動至由吸音材料19佔據之容積中之氣體之吸音材料19。此外,氣體交換必須流動通過內部腔室壁44之頂面與印刷電路板32之間的限制51。若聲阻變得太小,則限制51亦可呈現額外聲阻。 圖5中所展示之實施例僅具有PCB殼體31,而非罩殼30。在此實施例中,護罩33之外表面已經拋光,以將一美學上令人愉悅之表面呈現至裝置購買者,且因此罩殼30係外來的。歸因於印刷電路板32之電跡線而呈現PCB殼體31。 參考圖6,圖中描繪經安置於具有一吸音材料19之一實質上密封之聲學腔室中之一聲學傳感器34之另一實施例,該實質上密封之聲學腔室係由一音訊裝置之印刷電路板32及護罩33界定。圖6之實施例之大多數結構特徵相同於圖5中展示之結構特徵。在圖6中展示之實施例中,後置容積35現係由大量吸音材料19、一內部腔室壁44及在由內部腔室壁44、腔室壁41及可透氣構件43界定之容積內包含吸音材料19的可透氣構件43佔據。可透氣構件43經機械地耦合或附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分上的可透氣構件附接點42。可透氣構件43僅覆蓋將接收吸音材料19之該實質上密封之聲學腔室(即後置容積35)的該等部分。該實質上密封之聲學腔室的其他部分(諸如聲學傳感器34位於其中之部分)將不覆蓋有可透氣構件43。這允許在無需移除可透氣構件43或干擾吸音材料19的情況下,修復及更換聲學傳感器34。腔室襯墊37覆蓋經機械地耦合或附接至腔室壁41之頂部部分之可透氣構件43的部分。 在護罩33中,展示一裝填埠52。裝填埠52係位於護罩33之底面中,且在填充吸音材料19之後置容積35的部分與護罩33的外部之間提供一埠。裝填埠52係用以促進用於將一特定類型之吸音材料19裝載至後置容積中之一特殊技術。裝填埠52覆蓋有一裝填埠密封件53。裝填埠密封件53可係由一箔或薄膜材料製成,且可自黏。用於吸音材料19附近之任何黏著劑不應不利地影響吸音材料之效能。護罩33之外部上之裝填埠52的部分宜具有圍繞其直徑之容納裝填埠密封件53之一埋頭腔穴或環,且因此裝填埠密封件53係與護罩33之外表面齊平。裝填埠之大小宜係直徑為至少1.5毫米。圖6繪示兩個裝填埠52,一個位於護罩33之底面中,且一個位於腔室壁41中,在實際實踐中,僅將使用一個裝填埠52。裝填埠52之位置將取決於若干因數,諸如護罩33之設計、經指定以包含吸音材料19之後置容積區域之實體複雜性,及使用其他組件來填充護罩33及插置在吸音材料19之製造次序。不同於圖5中所展示之實施例,圖6中之實施例包括一罩殼30,此係由於護罩33可具有分模線、緊固件埠或美學上不令人愉悅之加工線,且護罩33可具有含需要被覆蓋之一裝填埠密封件53之一裝填埠52。 儘管圖5及圖6僅揭示將包含吸音材料19之一單一後置容積35,但可預期後置容積35可包括由腔室壁41、護罩33及印刷電路板32界定之整個實質上密封之聲學腔室內的多個腔室類型區域。吾人可進一步預期該實質上密封之聲學腔室內之此等多個腔室類型區域之各者將係由可透氣構件43、宜由經組態以覆蓋所有腔室類型區域之一單件式可透氣構件43覆蓋。吾人亦可預期取決於由腔室壁41、護罩33及印刷電路板32界定之實質上密封之聲學腔室的總體設計,亦可獲取多個可透氣構件43。另外,覆蓋包含吸音材料19之多個腔室之一可透氣構件43將不覆蓋指定為由聲學傳感器佔據之聲學腔室中的容積,以促進聲學傳感器34的修復或更換。 圖6中所展示之實施例具有PCB殼體31及罩殼30。在此實施例中,即使護罩33之外表面可經拋光以將一美學上令人愉悅之表面呈現至裝置購買者,若裝填埠52經安置使得其穿透護罩33之外表面,則存在一危險:裝填埠密封件53可被損壞或偏移原位,吸音材料19可被污染或可自後置容積洩漏出去。因此,罩殼30保護裝填埠密封件53且將一美學上令人愉悅之表面提供至裝置購買者。歸因於印刷電路板32之電跡線而呈現PCB殼體31。 圖7及圖8係沿截面線B-B之聲學裝置30之視圖。參考圖7,一壁開口50設置於內部腔室壁44中。在壁開口50中,提供一上突片46、側突片45及一下突片47。此等突片可為一長件固體材料(如圖7中所展示)或可為實質上佔據相同於圖7中所展示之該長件固體材料之空間之一系列突片。突片45、46、47可為射出模製塑膠、加工金屬或其他適合材料。一可透氣嵌件48安置於壁開口50中,且由上突片46、側突片45及下突片47保持在該位置中。可透氣嵌件48將吸音材料19保持在由腔室壁41、內部腔室壁44及可透氣構件43定界之腔室中。可透氣嵌件48亦擴展吸音材料19之曝露表面積之量。因此,氣體交換透過可透氣構件43及可透氣嵌件48發生,藉此改良吸音材料19之效率。可透氣嵌件48可相同於由上文所討論之用於可透氣構件43之材料製造,且應具有低於可透氣構件43之所建立之臨限值之以MKS瑞為單位之一聲阻。 參考圖8,圖中展示可透氣嵌件48之另一實施例。在此實施例中,蝕刻、衝壓或以其他方式加工一不透氣材料以具有複數個通風孔49。通風孔49經設定大小以防止吸音材料19通過通風孔,同時允許後置容積35與吸音材料19之間的氣體交換發生。較佳地,聚丙烯箔用以產生可透氣嵌件48。存在聚丙烯箔係可透氣嵌件48之一理想材料之若干原因。聚丙烯箔在其老化時不會變得易碎,其高度抵抗具損害性之紫外光,且其抵抗來自若干類型之化學物質之損害。一般而言,聚丙烯箔具有小於1 gram/cm3 之一非常低密度且大多數箔抗高達攝氏140度之熱。亦可使用諸如Kapton® 之相似材料。通風孔49可經形成呈多種幾何形狀及大小,只要通風孔49不超過一預定聲阻臨限值(較佳地係260 MKS瑞)。 參考圖9,本文所繪示之實施例基於圖7及圖8中所展示之內部腔室壁44實施例。腔室襯墊37已經擴展以包含安置於內部腔室壁44之頂部部分與印刷電路板32之間的一部分。由於壁開口50及可透氣嵌件48允許後置容積35與吸音材料19之間的氣體之交換,腔室襯墊37之額外部分閉合沿印刷電路板32之聲學路徑,且將氣體路由至壁開口50。雖然看起來可透氣構件43現係多餘的,但若需要修復或更換聲學傳感器34仍需要將吸音材料19保持在其界定容積中。 參考圖10A至圖10B,圖中揭示一種用於製造具有一揚聲器外殼作為其殼體之一整合式部分之一音訊裝置之方法。較佳地,儘管亦設想該音訊裝置之手動裝配,但使用最大效率之電腦控制製造設備來實施製造方法。更具體而言,製造程序之描述假定經歷裝配之音訊裝置已被放置在沿一裝配軌跡移動該音訊裝置穿過各種電腦控制裝配站之一裝配載體中。可存在未在該製造方法中描述之其他步驟,諸如插置在襯墊或製造電連接件。然而,此等類型之步驟通用於製造程序且不為本發明之部分。 參考圖10A及圖10B,將描述具有一揚聲器外殼作為其殼體之一整合式部分之一音訊裝置之製造方法之一實施例。在步驟S100中,將護罩33放置於一裝配載體中,且使配劑漏斗與護罩33之後置容積35對準。在製造程序之此階段中,經裝配之音訊裝置定位於一裝配載體中,且較佳地,該裝配載體助於配劑漏斗與護罩33中之後置容積35之對準。替代地,可手動使配劑漏斗與護罩33中之後置容積35對準。配劑漏斗之目的係確保吸音材料之所有經量測之劑量進入護罩33中之後置容積35。較佳地,具有一實質上球形形狀之一沸石材料用作為吸音材料,且此沸石材料之形式較佳地用於填充一閉合護罩33之後置容積。在聲學裝置之製造程序之此階段中,假定無其他組件需要安裝在護罩33中,聲學傳感器34除外。雖然可在將吸音材料19放置在後置容積35中之後添加額外組件,但存在干擾或污染吸音材料19之一風險。 在步驟S110中,將一預定數量之吸音材料裝載至配劑漏斗。基於設計者希望達成之所要聲學效應而判定將裝載至護罩33中之後置容積35之吸音材料之量。例如,沈積至護罩33中之後置容積35中之吸音材料之量係取決於聲學設計工程師希望達成之一諧振位移之量。容積或重力地執行用於插入至護罩33中之後置容積35中之吸音材料19之量之量測。 在步驟S120中,振動固持經歷配劑之聲學裝置之載體同時將來自配劑料箱之吸音材料19澆注至配劑漏斗,且隨後澆注至護罩33中之後置容積35。若吸音材料19呈粉末、微粒或顆粒形式,則在經由配劑漏斗將吸音材料19澆注至後置容積35時振動護罩33以允許材料相對快速及均勻地分散。 在步驟S130中,停止振動固持護罩33之載體達一預定時間。振動之停止允許現位於護罩33中之後置容積35內部之吸音材料19沉降。吸音材料19之沉降對於量測是否已適當填充後置容積係較為重要。 在步驟S140中,重新開始振動固持護罩33之載體達一預定時間。配劑步驟期間及配劑步驟之後兩者之護罩33之重複振動係確保護罩33之後置容積35內部之吸音材料19已到達後置容積35內之所有腔穴所必需。如先前所示,吸音材料19之沉降對於量測是否已適當填充後置容積35係較為重要。當護罩33之第二次振動結束時,移除配劑漏斗。 在步驟S150中,量測護罩33之後置容積35內部之吸音材料19之位準。可目視完成量測。更佳地,使用照明吸音材料19之一雷射來實施位準量測。 在步驟S160中,使後置容積35中之吸音材料19之量測位準與所製造之特殊護罩33之設計要求相比較。若吸音材料19之位準低於設計規範,則在步驟S170中,拒收護罩33。若吸音材料19之位準在設計規範內,則製造程序移動至步驟S180。 在步驟S180中,使可透氣構件43與腔室壁41之頂部部分及內部腔室壁44之頂部部分對準且將可透氣構件43附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分。可透氣構件43將吸音材料19保持在後置容積35內之一指定容積中。如文中所示,可透氣構件43可藉由膠黏、捲邊、衝壓、壓印、熱封或較佳地藉由超音波焊接而耦合至腔室壁41之頂部部分及內部腔室壁44之頂部部分上之可透氣構件附接點42。若使用一黏著劑,則該黏著劑較佳地不具有可影響後置容積35中之吸音材料19之效能之任何排氣特性。 在步驟S190中,使腔室襯墊37與護罩33中之腔室壁41對準。使腔室襯墊37與護罩33中之腔室壁41對準。如圖5、圖6及圖9中所展示,腔室襯墊支撐在腔室壁41之頂部部分上,且定位於現附接至可透氣構件附接點42處之腔室壁41之可透氣構件43上方。在裝配程序之此刻,可將聲學傳感器34放置於護罩33中之位置中。替代地,聲學傳感器34可機械地附接至印刷電路板32,且接著,在印刷電路板32接合至護罩33時將聲學傳感器34操縱至位置。 在步驟S200中,使印刷電路板32與護罩33對準,且將兩個組件配合在一起以產生成品聲學裝置。使用緊固件、適合黏著劑及/或模製於各自組件中之聯鎖突片來達成印刷電路板32及護罩33之機械附接。若使用一黏著劑,則該黏著劑較佳地不具有可影響後置容積35中之吸音材料19之任何排氣特性。印刷電路板32及護罩33之附接在聲學傳感器34之外殼殼體內產生一密封聲學腔室。 在步驟S210中,自裝配載體移除完整聲學裝置,且完整聲學裝置經測試以判定其是否滿足聲學裝置之設計要求。 參考圖11A至圖11B,圖中揭示另一種用於製造具有一揚聲器外殼作為其殼體之一整合式部分之一音訊裝置之方法。較佳地,儘管亦設想該音訊裝置之手動裝配,但使用最大效率之電腦控制製造設備來實施製造方法。更具體而言,製造程序之描述假定經歷裝配之音訊裝置已被放置在沿一裝配軌跡移動該音訊裝置穿過各種電腦控制裝配站之一裝配載體中。可存在未在該製造方法中描述之其他步驟,諸如插入襯墊或製造電連接件。然而,此等類型之步驟通用於製造程序且不為本發明之部分。 參考圖11A及圖11B,將描述具有一揚聲器外殼作為其殼體之一整合式部分之一音訊裝置之製造方法之另一實施例。在步驟S300中,將護罩33放置於一裝配載體中。在製造程序之此階段中,經裝配之音訊裝置定位於一裝配載體中,且在製造程序之一些實施例中,將必須在製造程序期間對準依不同角度裝配之音訊裝置。 在步驟S310中,使可透氣構件43與腔室壁41之頂部部分及內部腔室壁44之頂部部分對準且將可透氣構件43附接至腔室壁41之頂部部分及內部腔室壁44之頂部部分。可透氣構件43將吸音材料19保持在後置容積35內之一指定容積中。如文中所示,可透氣構件43可藉由膠黏、捲邊、衝壓、壓印、熱封或較佳地藉由超音波焊接而耦合至腔室壁41之頂部部分及內部腔室壁44之頂部部分上之可透氣構件附接點42。若使用一黏著劑,則該黏著劑較佳地不具有可影響後置容積35中之吸音材料19之效能之任何排氣特性。 在步驟S320中,重新對準裝配載體中之護罩以曝露裝填埠52使得配劑漏斗可與裝填埠52對準。較佳地,該裝配載體助於配劑漏斗與裝填埠52之對準,其將允許吸音材料19進入護罩33中之後置容積35中。替代地,可手動使配劑漏斗與護罩33中之裝填埠52對準。配劑漏斗之目的係確保吸音材料19之所有經量測之劑量進入護罩33中之後置容積35。較佳地,具有一實質上球形形狀之一沸石材料用作為吸音材料19,且此沸石材料之形式較佳地用於填充一閉合護罩33之後置容積。在聲學裝置之製造程序之此階段中,假定無其他組件需要安裝在護罩33中,聲學傳感器34除外。雖然可在將吸音材料19放置在後置容積35中之後添加額外組件,但存在干擾或污染吸音材料19之一風險。 在步驟S330中,將一預定數量之吸音材料裝載至配劑漏斗。基於設計者希望達成之所要聲學效應而判定將裝載至護罩33中之後置容積35之吸音材料之量。例如,沈積至護罩33中之後置容積35中之吸音材料之量係取決於聲學設計工程師希望達成之一諧振位移之量。容積或重力地執行用於插入至護罩33中之後置容積35中之吸音材料19之量之量測。 在步驟S340中,振動固持經歷配劑之聲學裝置之載體同時將來自配劑料箱之吸音材料19澆注至配劑漏斗,且隨後透過裝填埠52澆注至護罩33中之後置容積35。若吸音材料19呈粉末、微粒或顆粒形式,則在經由配劑漏斗將吸音材料19澆注至後置容積35時振動護罩33且裝填埠52允許材料相對快速及均勻地分散。 在步驟S350中,停止振動固持護罩33之載體達一預定時間。振動之停止允許現位於護罩33中之後置容積35內部之吸音材料19沉降。吸音材料19之沉降對於量測是否已適當填充後置容積係較為重要。 在步驟S360中,重新開始振動固持護罩33之載體達一預定時間。配劑步驟期間及配劑步驟之後兩者之護罩33之重複振動係確保護罩33之後置容積35內部之吸音材料19已到達後置容積35內之所有腔穴所必需。如先前所示,吸音材料19之沉降對於量測是否已適當填充後置容積35係較為重要。當護罩33之第二次振動結束時,移除配劑漏斗。 在步驟S370中,量測護罩33之後置容積35內部之吸音材料19之位準。可目視完成量測。更佳地,使用照明吸音材料19之一雷射來實施位準量測。 在步驟S380中,使後置容積35中之吸音材料19之量測位準與所製造之特殊護罩33之設計要求相比較。若吸音材料19之位準低於設計規範,則在步驟S390中,拒收護罩33。若吸音材料19之位準在設計規範內,則製造程序移動至步驟S400。 在步驟S400中,使用一裝填埠密封件53密封裝填埠52。裝填埠密封件53可為裝配至裝填埠52之一插件密封件或膠合或附接至裝填埠52之一箔或薄膜。該箔或薄膜可自黏。 在步驟S410中,使腔室襯墊37與護罩33中之腔室壁41對準。如圖5、圖6及圖9中所展示,腔室襯墊支撐在腔室壁41之頂部部分上,且定位於現附接至可透氣構件附接點42處之腔室壁41之可透氣構件43上方。在裝配程序之此刻,可將聲學傳感器34放置於護罩33中之位置中。替代地,聲學傳感器34可機械地附接至印刷電路板32,且接著,在印刷電路板32接合至護罩33時將聲學傳感器34操縱至位置。接著,使印刷電路板32與護罩33對準,且將兩個殼體配合在一起以產生成品聲學裝置。使用緊固件、適合黏著劑及/或模製於組件中之聯鎖突片來達成印刷電路板32及護罩33之機械附接。若使用一黏著劑,則該黏著劑較佳地不具有可影響後置容積35中之吸音材料19之任何排氣特性。印刷電路板32及護罩33之附接在聲學傳感器34之外殼殼體內產生一密封聲學腔室。 在步驟S420中,自裝配載體移除完整聲學裝置,且完整聲學裝置經測試以判定其是否滿足聲學裝置之設計要求。 已為了繪示及描述而呈現本發明之較佳實施例之前述描述。前述描述不意欲具窮舉性或使本發明受限於所揭示之精確形式,且根據以上教示修改及變化形式係可行的或可自本發明之實踐獲取。選擇及描述實施例以解釋本發明之原理及其實踐應用以使熟習技術者能夠利用依各種實施例且具有各種修改(如適合於所設想之特殊用途)之本發明。 應注意本文所揭示之任何實體(例如,揚聲器裝置等等)不受限於如在一些實施例中所描述之一專用實體。確切而言,所揭示之發明可以各種方式實施且在裝置層級上具有任意精細度同時仍提供所要功能。應注意術語「包括」不排除其他元件或步驟且「一」不排除複數。此外,可組合經描述與不同實施例相關聯之元件。亦應注意申請專利範圍中之元件符號不應被視為限制申請專利範圍之範疇。雖然已繪示及描述特定實施例,但可在不會顯著背離本發明之精神之情況下實行數種修改,且保護之範疇僅受限於隨附申請專利範圍之範疇。此外,縮寫字僅用以增強說明書及申請專利範圍之可讀性。應注意此等縮寫字不意欲減少所使用之術語之一般性且縮寫字不應被視為使申請專利之範疇受限於其中所描述之實施例。A detailed description of one of the disclosed embodiments will be provided with reference to the drawings. While the present invention is susceptible to various embodiments of the present invention, the embodiments of the present invention are intended to be It is not intended to limit the invention to the embodiments disclosed. Referring to Figures 1 and 2, a speaker device 10 is illustrated. The speaker device 10 includes an upper speaker housing 13, a lower speaker housing 14, and an acoustic sensor 12. The upper speaker housing 13 is joined to the lower speaker housing 14 using fasteners, locking tabs or a suitable adhesive. The adhesive used to join the upper speaker housing 13 and the lower speaker housing 14 preferably does not have any venting characteristics that can affect the sound absorbing material in the rear volume and affect its efficiency. When the sound absorbing material 19 is internally disposed in the speaker device 10, the broken line 15 indicates the internal position of the sound absorbing material 19 in the speaker device. The upper speaker housing 13 includes a sensor opening that allows for sound propagation/airflow from the acoustic sensor 12 to the space outside the device. Other components of the speaker device, such as electrical contacts, pads, and internal wiring, are not shown in FIG. Referring to Figure 2, a method of packaging the sound absorbing material 19 is illustrated. "Sound absorbing material" (as used herein) refers to the zeolitic material disclosed in application No. 13/818,374, although other sound absorbing materials may be used as desired. As shown in section 2 along section line AA, the speaker device 10 rearward volume 17 extends around the acoustic sensor 12 and extends into the interior portion of the volume in which the sound absorbing pocket 16 is disposed. A technique for enclosing a sound absorbing material 19 in a bag is disclosed in the application Serial No. 14/003,217, the entire disclosure of which is incorporated herein by reference. As disclosed in application No. 14/003,217, the sound absorbing bag 16 is manufactured to fit the inner contour of the rear volume, and one side of the sound absorbing pocket 16 includes between the inner volume of the sound absorbing bag 16 and the inner volume of the sound absorbing pocket 16. One of the low acoustic impedance of a gas exchange is a gas permeable material. The breathable material must also retain the sound absorbing material 19 within the interior of the bag. The remaining sides of the sound absorbing pocket 16 are made of a material that is relatively breathable or has a high acoustic resistance. The sound absorbing pocket 16 is positioned such that gas exchange occurs between the sound absorbing material 19 and the rear volume 17 through the gas permeable material. Referring to FIG. 3, another method of holding the sound absorbing material 19 within the rear volume of the speaker device 10 is illustrated. As shown in section 3 along section line AA, instead of a sound absorbing pocket 16, a gas permeable wall 18 is disposed within the rear volume 17. The permeable wall 18 is held in its position within the rear volume 17 by tabs, flanges or suitable adhesive. If an adhesive is used, the adhesive preferably does not have any venting properties that can affect the sound absorbing material in the back volume and affect its ability to absorb. The gas permeable wall 18 can comprise a perforated or etched polypropylene material, a mesh material having a low acoustic resistance, a filter material, or other gas permeable material having a low acoustic resistance. As shown in FIG. 3, the sound absorbing material 19 is held in a portion of the rear volume 17 opposite the position of the acoustic sensor 12. As shown in Figures 2 and 3, gas exchange between the sound absorbing material 19 and the rear volume 17 is facilitated by a gas permeable material placed between the sound absorbing material 19 and the rear volume 17. However, as shown in Figures 2 and 3, the sound absorbing material 19 at the interface with the rear volume (i.e., in close proximity to the gas permeable material) will absorb or desorb the gas before the sound absorbing material 19 is away from the rear volume interface. Even though the sound absorbing material 19 is a particle (rather than a much smaller particle), the sound absorbing material 19 presents the acoustic resistance to the gas passing through the gas permeable material. This acoustic resistance causes the sound absorbing material 19 closest to the rear volume interface to interact more with the gas exchange, while the sound absorbers further from the gas permeable material may have less interaction. This uneven interaction in the gas exchange can cause the efficiency of the sound absorbing material 19 to decrease (if the path through the sound absorbing material is too long/too narrow). Referring to FIG. 4, an embodiment of one of the acoustic sensors 34 disposed in an acoustic chamber substantially defined by a shield 33 of an audio device and a printed circuit board 32 is depicted. In the context of this application, an audio device includes any type of electronic device having an audio function, such as playback of voice messages, music or other sound files, such as a music player, mobile phone, and the like. Since the sound absorbing material enhances the frequency response of the microphone element, an audio device having a microphone is also included. In FIG. 4, the substantially sealed acoustic chamber is comprised of a printed circuit board 32, a shroud 33 having its chamber wall 41, and a top portion interposed between the chamber wall 41 and the top portion of the printed circuit board 32. The chamber liner 37 is defined. In some embodiments, the chamber wall 41 is a continuous wall and is formed from injection molded plastic or metal. Instead of having a complete speaker unit with its own speaker housing housing and lower speaker housing housing, the embodiment shown in Figure 4 relies on a printed circuit board 32 and shroud 33 that provide a speaker housing. Typically, for this type of speaker configuration, the speaker is completed until the printed circuit board 32 and shield 33 of the audio device are engaged. The cassette 39 allows the sound to propagate to the environment outside the chamber formed by the printed circuit board 32 and the shield 33 and the chamber liner 37. Acoustic sensor 34 is electrically and mechanically coupled to printed circuit board 32 via sensor contacts 36 disposed between printed circuit board 32 and acoustic sensor 34. Solder or other conductive material may be used to electrically and mechanically couple the acoustic sensor 34 to the printed circuit board 32. Alternatively, acoustic sensor 34 may have spring contacts that are advanced against printed circuit board 32 to provide electrical continuity. Acoustic sensor 34 receives electrical signals from printed circuit board 32 via sensor contacts 36. The acoustic sensor 34 is spaced from the inner surface of the voice cassette 39 and the shield 33 by a hammer pad 38. The acoustic pad 38 divides the substantially sealed acoustic chamber into a front volume 40 and a rear volume 35. The front volume 40 is accessible through the sound cassette 39 and is bounded by the sound pad 38, the portion of the inner surface of the shield 33 in the sound pad 38, and the portion of the acoustic sensor 34 facing the hammer 39. . The substantially sealed acoustic chamber rear volume 35 is printed by the inner surface of the shield 33 outside the acoustic pad 38, the inner surface of the chamber wall 41, the chamber liner 37, and the chamber liner 37. Portions of the inner surface of circuit board 32 are delimited. Other portions of the printed circuit board 32 are mechanically coupled to the shroud 33 to compress the chamber liner 37 against the top portion of the chamber wall 41 and into the acoustic sensor 34 and shroud 33 in the region of the hammer 39. The surface compresses the sound pad 38. The compression of the chamber liner 37 and the acoustic pad 38 substantially seals the acoustic chamber of the acoustic sensor 34. As is well known, the rear volume 35 improves the operation of the acoustic sensor (which is a speaker in this example). The airflow from the rear side of the acoustic sensor 34 to the rear volume 35 during movement of the acoustic sensor 34 due to the electrical signal received through the sensor contact 36 is shown in FIG. 4 also depicts a housing 30 and a PCB housing 31 in which the housing 30 is mounted to the shield 33 and the PCB housing 31 is mounted to the printed circuit board 32. The housing 30 and the PCB housing 31 are optional components of the audio device and typically include aesthetic considerations for covering the shield 33 and the printed circuit board 32. More specifically, the shield 33 can have parting lines, fasteners, or aesthetically unpleasant processing lines, and the cover 30 can be attached to the shield 33 to mask such manufacturing errors. Similarly, PCB housing 31 is mounted on printed circuit board 32 to cover wiring, electrical traces, and other manufacturing artifacts. Referring to Figure 5, there is depicted an embodiment of an acoustic sensor 34 disposed in an acoustic chamber having a substantially sealed sound absorbing material 19, the substantially sealed acoustic chamber being comprised of a printed circuit board of an audio device 32 and shield 33 are defined. Most of the structural features of the embodiment of Figure 5 are identical to the structural features shown in Figure 4. In the embodiment shown in FIG. 5, the rear volume 35 is now comprised of a plurality of sound absorbing materials 19, an interior chamber wall 44, and within a volume defined by the interior chamber wall 44, the chamber wall 41, and the gas permeable member 43. The gas permeable member 43 of the sound absorbing material 19 occupies. The gas permeable member 43 is mechanically coupled or attached to the top portion of the chamber wall 41 and the gas permeable member attachment point 42 on the top portion of the interior chamber wall 44. The gas permeable member 43 covers only those portions of the substantially sealed acoustic chamber (i.e., the rear volume 35) that will receive the sound absorbing material 19. Other portions of the substantially sealed acoustic chamber, such as portions of the acoustic sensor located therein, will not be covered with the gas permeable member 43. This allows the acoustic sensor 34 to be repaired and replaced without removing the gas permeable member 43 or interfering with the sound absorbing material 19. The chamber liner 37 covers a portion of the gas permeable member 43 that is mechanically coupled or attached to the top portion of the chamber wall 41. Although FIG. 5 only discloses a single rear volume 35 that will include a sound absorbing material 19, it is contemplated that the rear volume 35 can include an entirely substantially sealed acoustic cavity defined by the chamber wall 41, the shroud 33, and the printed circuit board 32. Multiple chamber type areas in the room. It is further contemplated that each of the plurality of chamber type regions within the substantially sealed acoustic chamber will be a single piece from the gas permeable member 43, preferably configured to cover all of the chamber type regions. The gas permeable member 43 is covered. It is also contemplated that a plurality of gas permeable members 43 may be obtained depending on the overall design of the substantially sealed acoustic chamber defined by the chamber wall 41, the shroud 33 and the printed circuit board 32. Additionally, one of the plurality of chambers covering the sound absorbing material 19 may not cover the volume in the acoustic chamber designated by the acoustic sensor to facilitate repair or replacement of the acoustic sensor 34. As shown in Fig. 2, a sound absorbing bag 16 comprising a sound absorbing material 19 can be used in a speaker configuration of this type, wherein the speaker housing is molded as an integral part of one of the housings of an audio device. One of the limitations of the sound absorbing pocket 16 is that the corner of the rear volume 35 (as shown in Figures 4 and 5) will not have any sound material disposed therein. This is due to the manufacturing limitations inherent in the sound absorbing pocket 16. More specifically, the ninety degree angle cannot be molded into the sound absorbing pocket 16 and some margin of proper pocket placement in the rear volume 35 is also required, and therefore a small amount of rear volume 35 does not receive the sound absorbing material 19. Since the fill 吸 of the sound absorbing material 19 will be visible on the outer casing of an audio device and aesthetically not pleasing to the purchaser of the device, the other methods shown in Figure 3 will not be suitable for this type of speaker configuration, where the speaker housing Molded as or integral with one of the outer casings of the audio device. In addition, there is a danger that regular daily use of the audio device will cause the seal above the fill port to shift in place or rupture, thereby allowing the sound absorbing material to escape. The airflow from the rear side of the acoustic sensor 34 to the rear volume 35 during movement of the acoustic sensor 34 due to the receipt of an electrical signal through the sensor contact 36 is shown in FIG. During operation, the acoustic sensor 34 creates a pressure in the rear volume 35 that causes gas exchange with the sound absorbing material 19. The gas permeable member 43 promotes this gas exchange between the rear volume 35 and the sound absorbing material 19. Preferably, the sound absorbing material 19 is one of the loose zeolite particulate materials as disclosed in U.S. Patent Application Serial No. 14/818,374, the entire disclosure of which is incorporated herein by reference. More preferably, the loose zeolite particulate material (used as the sound absorbing material 19) is substantially spherical and has a diameter range of one hundred microns or more. The loose zeolite particulate material is preferred for its ease of use in making an acoustic device of the type disclosed herein. Other types of sound absorbing materials (such as zeolite powder or activated carbon) can also be used, but can be used less easily in manufacturing procedures. As is known in the art, the energy of a sound or gas passing through a material can be described along with the acoustic resistance (i.e., measured in units of MKS rayl). For the embodiment shown in Figure 5, the gas permeable member 43 should have an acoustic resistance that is one of the specified thresholds of one of the normal volume sizes (in this case, 1 cubic centimeter) behind the gas permeable member 43 (usually 260 MKS Rui). If the opening is small, selecting the material to be used as the gas permeable member 43 may cause the acoustic resistance at the opening to exceed 260 MKS, thereby resulting in poor acoustic performance. More specifically, if it exceeds 260 MKS, the gas in the rear volume is prevented from reaching the sound absorbing material 19. Therefore, if a cashmere material is selected for use as the gas permeable member 43, care must be taken not to exceed 260 MKS, especially if the limit 51 is small. For some embodiments, the cashmere material is a heterogeneous material, and more specifically, a flat layer of material made of nylon fibers having an undefined pattern. The purpose of the cashmere material is to maintain the sound absorbing material 19 and to allow the gas to interact with the sound absorbing material 19. The structure of the cashmere material and any pore size in the material renders the sound absorbing material 19 (in powder form, particulate form or granular form) unable to pass through the cashmere material. Alternatively, a mesh material can be used for the gas permeable member 43. In some embodiments, unlike cashmere materials, the surface structure and material structure of the mesh material are clearly defined. For example, a layer of web material suitable for use as the gas permeable member 43 may have a nominal thickness of 115 microns, a pore size of 130 microns, and an acoustic resistance of 8.5 MKS per square centimeter. Like the cashmere material, the purpose of the mesh material is to maintain the sound absorbing material 19 and to allow the gas to interact with the sound absorbing material 19. The structure of the web material and any pore size in the material renders the sound absorbing material 19 (in powder form, particulate form or particulate form) unable to pass through the web material. An acoustic engineer has a wider design latitude relative to the web material due to the lower acoustic resistance of the web material and a known amount. The gas permeable member 43 can be coupled to the top portion of the chamber wall 41 and the top portion of the interior chamber wall 44 by gluing, crimping, stamping, stamping, heat sealing or preferably by ultrasonic welding. The permeable member attachment point 42. One advantage of ultrasonic welding is that a uniform and reliable adhesive is formed between the gas permeable member 43 and the top portion of the chamber wall 41 and the top portion of the interior chamber wall 44, wherein the gas permeable member 43 is a cashmere or mesh. Shaped material. Ultrasonic welding causes the material to fuse, thereby forming a strong mechanical bond when the materials are fused together. Typically, ultrasonic welding softens the fibers in the mesh material but does not melt the fibers. Ultrasonic welding techniques ensure that the material comprising the gas permeable member 43 is fixedly secured to the top portion of the chamber wall 41 and the top portion of the interior chamber wall 44, thereby preventing any leakage of the sound absorbing material 19 while still allowing gas and sound absorbing material 19 interactions. Another feature of the breathable member 43 for holding the sound absorbing material 19 is that the acoustic sensor 34 can be repaired or replaced without interfering with or losing the sound absorbing material 19. The secure attachment of the gas permeable member 43 to the top portion of the chamber wall 41 and the top portion of the interior chamber wall 44 prevents the sound absorbing material 19 from escaping from its designated volume. As shown in FIG. 5, the passage between the top portion of the internal chamber wall 44 and the inner surface of the printed circuit board 32 is limited 51. The size of the limit 51 is based on the thickness of the chamber liner 37. Preferably, the thickness of the chamber liner 37 is 0.3 mm, but other thicknesses can be used to adjust the height of the limit 51. In the embodiment shown in Figure 5, the interior chamber wall 44 is formed from a solid material, preferably injection molded plastic or machined metal. In the speaker embodiment shown in Figures 2 and 3, a limited amount of surface area exposure of the sound absorbing material 19 can affect the performance of the sound absorbing material 19. More specifically, since the airflow close to the acoustic sensor is higher and the airflow at the distal end of the rear volume is lower, the sound absorption of the gas permeable material that promotes gas exchange between the sound absorbing material 19 and the rear volume is further away. The material 19 does not experience a gas flow/gas velocity that is the same as the amount of sound absorbing material 19 that is adjacent to the gas permeable member. This is due to the acoustic spring formed by the proximity of the rear volume and the sound absorbing material 19 which itself presents a certain amount of acoustic resistance to the gas propelled into the volume occupied by the sound absorbing material 19. In addition, gas exchange must flow through the restriction 51 between the top surface of the interior chamber wall 44 and the printed circuit board 32. If the acoustic resistance becomes too small, the limit 51 can also exhibit additional acoustic resistance. The embodiment shown in FIG. 5 has only the PCB housing 31, rather than the housing 30. In this embodiment, the outer surface of the shield 33 has been polished to present an aesthetically pleasing surface to the device purchaser, and thus the cover 30 is external. The PCB housing 31 is presented due to the electrical traces of the printed circuit board 32. Referring to Figure 6, there is depicted another embodiment of an acoustic sensor 34 disposed in an acoustic chamber having a substantially sealed sound absorbing material 19, the substantially sealed acoustic chamber being comprised of an audio device Printed circuit board 32 and shroud 33 are defined. Most of the structural features of the embodiment of Figure 6 are identical to the structural features shown in Figure 5. In the embodiment shown in FIG. 6, the rear volume 35 is now comprised of a plurality of sound absorbing materials 19, an interior chamber wall 44, and within the volume defined by the interior chamber wall 44, the chamber wall 41, and the gas permeable member 43. The gas permeable member 43 containing the sound absorbing material 19 occupies. The gas permeable member 43 is mechanically coupled or attached to the top portion of the chamber wall 41 and the gas permeable member attachment point 42 on the top portion of the interior chamber wall 44. The gas permeable member 43 covers only those portions of the substantially sealed acoustic chamber (i.e., the rear volume 35) that will receive the sound absorbing material 19. Other portions of the substantially sealed acoustic chamber, such as portions of the acoustic sensor 34 located therein, will not be covered with the gas permeable member 43. This allows the acoustic sensor 34 to be repaired and replaced without removing the gas permeable member 43 or interfering with the sound absorbing material 19. The chamber liner 37 covers a portion of the gas permeable member 43 that is mechanically coupled or attached to the top portion of the chamber wall 41. In the shield 33, a loading pocket 52 is shown. The loading pocket 52 is located in the bottom surface of the shroud 33 and provides a weir between the portion of the volume 35 after filling the sound absorbing material 19 and the exterior of the shroud 33. The loading cassette 52 is used to facilitate a particular technique for loading a particular type of sound absorbing material 19 into a rear volume. The loading cassette 52 is covered with a filling jaw seal 53. The filling jaw seal 53 can be made of a foil or film material and is self-adhesive. Any adhesive used in the vicinity of the sound absorbing material 19 should not adversely affect the performance of the sound absorbing material. The portion of the outer surface of the shroud 33 that is loaded with the weir 52 preferably has a countersunk cavity or ring that accommodates the filling jaw seal 53 about its diameter, and thus the loading jaw seal 53 is flush with the outer surface of the shroud 33. The size of the filling bowl is preferably at least 1.5 mm in diameter. Figure 6 depicts two loading pockets 52, one in the bottom surface of the shroud 33 and one in the chamber wall 41. In practice, only one loading cartridge 52 will be used. The location of the loading pocket 52 will depend on a number of factors, such as the design of the shield 33, the physical complexity of the volumetric region designated to include the sound absorbing material 19, and the use of other components to fill the shield 33 and interpose in the sound absorbing material 19 Manufacturing order. Unlike the embodiment shown in FIG. 5, the embodiment of FIG. 6 includes a casing 30, since the shroud 33 can have parting lines, fasteners, or aesthetically unpleasant processing lines, and The shield 33 can have a loading pocket 52 containing one of the filling seals 53 that need to be covered. Although FIGS. 5 and 6 only disclose a single rear volume 35 that will include a sound absorbing material 19, it is contemplated that the rear volume 35 can include an entire substantially sealed shape defined by the chamber wall 41, the shroud 33, and the printed circuit board 32. Multiple chamber type regions within the acoustic chamber. It is further contemplated that each of the plurality of chamber type regions within the substantially sealed acoustic chamber will be a single piece of the gas permeable member 43, preferably configured to cover all of the chamber type regions. The gas permeable member 43 is covered. It is also contemplated that a plurality of gas permeable members 43 may be obtained depending on the overall design of the substantially sealed acoustic chamber defined by the chamber wall 41, the shroud 33 and the printed circuit board 32. Additionally, one of the plurality of chambers covering the sound absorbing material 19 may not cover the volume in the acoustic chamber designated to be occupied by the acoustic sensor to facilitate repair or replacement of the acoustic sensor 34. The embodiment shown in FIG. 6 has a PCB housing 31 and a housing 30. In this embodiment, even if the outer surface of the shield 33 can be polished to present an aesthetically pleasing surface to the device purchaser, if the loading pocket 52 is positioned such that it penetrates the outer surface of the shield 33, then There is a danger that the filling jaw seal 53 can be damaged or offset in situ, and the sound absorbing material 19 can be contaminated or can leak out of the rear volume. Thus, the casing 30 protects the loading jaw seal 53 and provides an aesthetically pleasing surface to the device purchaser. The PCB housing 31 is presented due to the electrical traces of the printed circuit board 32. 7 and 8 are views of the acoustic device 30 along section line BB. Referring to Figure 7, a wall opening 50 is disposed in the interior chamber wall 44. In the wall opening 50, an upper tab 46, a side tab 45 and a lower tab 47 are provided. The tabs can be a long piece of solid material (as shown in Figure 7) or can be a series of tabs that substantially occupy the same space as the long piece of solid material shown in Figure 7. The tabs 45, 46, 47 can be injection molded plastic, machined metal or other suitable material. A gas permeable insert 48 is disposed in the wall opening 50 and is held in this position by the upper tab 46, the side tab 45 and the lower tab 47. The gas permeable insert 48 holds the sound absorbing material 19 in a chamber bounded by the chamber wall 41, the interior chamber wall 44, and the gas permeable member 43. The breathable insert 48 also extends the amount of exposed surface area of the sound absorbing material 19. Therefore, gas exchange occurs through the gas permeable member 43 and the gas permeable insert 48, thereby improving the efficiency of the sound absorbing material 19. The gas permeable insert 48 can be made of the same material as that used for the gas permeable member 43 discussed above, and should have a sound resistance in MKS ray lower than the established threshold of the gas permeable member 43. . Referring to Figure 8, another embodiment of a gas permeable insert 48 is shown. In this embodiment, a gas impermeable material is etched, stamped, or otherwise machined to have a plurality of vents 49. The venting opening 49 is sized to prevent the sound absorbing material 19 from passing through the venting opening while allowing gas exchange between the trailing volume 35 and the sound absorbing material 19 to occur. Preferably, the polypropylene foil is used to create a gas permeable insert 48. There are several reasons for the ideal material of a polypropylene foil-based breathable insert 48. Polypropylene foils do not become brittle when they age, they are highly resistant to damaging ultraviolet light, and they resist damage from several types of chemicals. In general, polypropylene foil has less than 1 gram/cm 3 One is very low density and most foils are resistant to heat up to 140 degrees Celsius. Can also use such as Kapton ® Similar material. The vents 49 can be formed in a variety of geometries and sizes as long as the vents 49 do not exceed a predetermined acoustic resistance threshold (preferably 260 MKS). Referring to Figure 9, the embodiment illustrated herein is based on the embodiment of the interior chamber wall 44 shown in Figures 7 and 8. The chamber liner 37 has been expanded to include a portion disposed between the top portion of the interior chamber wall 44 and the printed circuit board 32. Since the wall opening 50 and the gas permeable insert 48 allow for the exchange of gas between the rear volume 35 and the sound absorbing material 19, the additional portion of the chamber liner 37 closes the acoustic path along the printed circuit board 32 and routes the gas to the wall. Opening 50. While it appears that the gas permeable member 43 is now redundant, it is still necessary to maintain the sound absorbing material 19 in its defined volume if it is desired to repair or replace the acoustic sensor 34. Referring to Figures 10A through 10B, a method for fabricating an audio device having a speaker housing as one of the integrated portions of its housing is disclosed. Preferably, although manual assembly of the audio device is also contemplated, the manufacturing method is implemented using computer control manufacturing equipment of maximum efficiency. More specifically, the description of the manufacturing process assumes that the audio device undergoing assembly has been placed in an assembly carrier that moves the audio device along an assembly track through one of a variety of computer controlled assembly stations. There may be other steps not described in the method of manufacture, such as interposing in a gasket or making an electrical connector. However, these types of steps are common to manufacturing procedures and are not part of the invention. Referring to Figures 10A and 10B, an embodiment of a method of fabricating an audio device having a speaker housing as one of the integrated portions of its housing will be described. In step S100, the shield 33 is placed in a mounting carrier and the dispensing funnel is aligned with the rear pocket 35 of the shroud 33. At this stage of the manufacturing process, the assembled audio device is positioned in a mounting carrier, and preferably, the mounting carrier assists in the alignment of the dispensing funnel with the trailing volume 35 in the shroud 33. Alternatively, the dispensing funnel can be manually aligned with the post volume 35 in the shroud 33. The purpose of the dispensing funnel is to ensure that all of the measured dose of sound absorbing material enters the post volume 35 in the shroud 33. Preferably, a zeolitic material having a substantially spherical shape is used as the sound absorbing material, and the form of the zeolitic material is preferably used to fill a closed volume of the closure shroud 33. In this phase of the manufacturing process of the acoustic device, it is assumed that no other components need to be installed in the shroud 33, except for the acoustic sensor 34. While additional components may be added after placing the sound absorbing material 19 in the post volume 35, there is a risk of interfering with or contaminating the sound absorbing material 19. In step S110, a predetermined amount of sound absorbing material is loaded to the compounding funnel. The amount of sound absorbing material that will be loaded into the shroud 33 after the volume 35 is determined based on the desired acoustic effect that the designer desires to achieve. For example, the amount of sound absorbing material deposited into the volume 35 in the shroud 33 depends on the amount by which the acoustic design engineer wishes to achieve one of the resonant displacements. The measurement of the amount of sound absorbing material 19 for insertion into the rear volume 35 in the shroud 33 is performed by volume or gravity. In step S120, the carrier of the acoustic device undergoing the dispensing is vibrated while the sound absorbing material 19 from the dispensing tank is poured into the dispensing funnel and subsequently poured into the shroud 33 to the volume 35. If the sound absorbing material 19 is in the form of powder, granules or granules, the shroud 33 is vibrated while the sound absorbing material 19 is poured through the dispensing funnel to the back volume 35 to allow the material to disperse relatively quickly and uniformly. In step S130, the carrier holding the shield 33 is stopped for a predetermined time. The stop of the vibration allows the sound absorbing material 19, which is now located inside the shroud 33, to settle inside the volume 35. The settling of the sound absorbing material 19 is important for measuring whether the post volume system has been properly filled. In step S140, the carrier holding the shield 33 is vibrated for a predetermined time. The repeated vibration of the shroud 33 during both the dispensing step and after the dispensing step ensures that the sound absorbing material 19 inside the rear volume 35 of the shroud 33 has reached all of the cavities within the rear volume 35. As previously indicated, the settling of the sound absorbing material 19 is important to measure whether the back volume 35 has been properly filled. When the second vibration of the shield 33 is over, the dispensing funnel is removed. In step S150, the level of the sound absorbing material 19 inside the volume 35 is measured after the shield 33 is placed. The measurement can be done visually. More preferably, the level measurement is performed using a laser that illuminates one of the sound absorbing materials 19. In step S160, the measurement level of the sound absorbing material 19 in the rear volume 35 is compared with the design requirements of the manufactured special shield 33. If the level of the sound absorbing material 19 is lower than the design specification, the shield 33 is rejected in step S170. If the level of the sound absorbing material 19 is within the design specifications, the manufacturing process moves to step S180. In step S180, the gas permeable member 43 is aligned with the top portion of the chamber wall 41 and the top portion of the interior chamber wall 44 and the gas permeable member 43 is attached to the top portion and the interior chamber wall of the chamber wall 41. The top part of 44. The gas permeable member 43 holds the sound absorbing material 19 in a designated volume within the rear volume 35. As shown, the gas permeable member 43 can be coupled to the top portion of the chamber wall 41 and the interior chamber wall 44 by gluing, crimping, stamping, stamping, heat sealing, or preferably by ultrasonic welding. The gas permeable member attachment point 42 on the top portion. If an adhesive is used, the adhesive preferably does not have any venting characteristics that can affect the performance of the sound absorbing material 19 in the back volume 35. In step S190, the chamber liner 37 is aligned with the chamber wall 41 in the shroud 33. The chamber liner 37 is aligned with the chamber wall 41 in the shroud 33. As shown in Figures 5, 6, and 9, the chamber liner is supported on the top portion of the chamber wall 41 and is positioned at the chamber wall 41 that is now attached to the gas permeable member attachment point 42. Above the gas permeable member 43. At the moment of the assembly process, the acoustic sensor 34 can be placed in position in the shroud 33. Alternatively, the acoustic sensor 34 can be mechanically attached to the printed circuit board 32, and then the acoustic sensor 34 is manipulated to a position when the printed circuit board 32 is joined to the shroud 33. In step S200, the printed circuit board 32 is aligned with the shield 33 and the two components are mated together to produce a finished acoustic device. Mechanical attachment of printed circuit board 32 and shroud 33 is achieved using fasteners, adhesives and/or interlocking tabs molded into the respective components. If an adhesive is used, the adhesive preferably does not have any venting characteristics that can affect the sound absorbing material 19 in the back volume 35. Attachment of printed circuit board 32 and shroud 33 creates a sealed acoustic chamber within the outer casing of acoustic sensor 34. In step S210, the complete acoustic device is removed from the assembly carrier and the complete acoustic device is tested to determine if it meets the design requirements of the acoustic device. Referring to Figures 11A-11B, another method for fabricating an audio device having a speaker housing as one of the integrated portions of its housing is disclosed. Preferably, although manual assembly of the audio device is also contemplated, the manufacturing method is implemented using computer control manufacturing equipment of maximum efficiency. More specifically, the description of the manufacturing process assumes that the audio device undergoing assembly has been placed in an assembly carrier that moves the audio device along an assembly track through one of a variety of computer controlled assembly stations. There may be other steps not described in the method of manufacture, such as inserting a gasket or making an electrical connector. However, these types of steps are common to manufacturing procedures and are not part of the invention. Referring to Figures 11A and 11B, another embodiment of a method of manufacturing an audio device having a speaker housing as one of the integrated portions of its housing will be described. In step S300, the shield 33 is placed in an assembly carrier. At this stage of the manufacturing process, the assembled audio device is positioned in a mounting carrier, and in some embodiments of the manufacturing process, it will be necessary to align the audio devices assembled at different angles during the manufacturing process. In step S310, the gas permeable member 43 is aligned with the top portion of the chamber wall 41 and the top portion of the interior chamber wall 44 and the gas permeable member 43 is attached to the top portion and the interior chamber wall of the chamber wall 41. The top part of 44. The gas permeable member 43 holds the sound absorbing material 19 in a designated volume within the rear volume 35. As shown, the gas permeable member 43 can be coupled to the top portion of the chamber wall 41 and the interior chamber wall 44 by gluing, crimping, stamping, stamping, heat sealing, or preferably by ultrasonic welding. The gas permeable member attachment point 42 on the top portion. If an adhesive is used, the adhesive preferably does not have any venting characteristics that can affect the performance of the sound absorbing material 19 in the back volume 35. In step S320, the shroud in the assembly carrier is realigned to expose the loading cartridge 52 such that the dispensing funnel can be aligned with the loading cartridge 52. Preferably, the assembly carrier assists in the alignment of the dispensing funnel with the loading pocket 52, which will allow the sound absorbing material 19 to enter the post volume 35 in the shroud 33. Alternatively, the dispensing funnel can be manually aligned with the loading weir 52 in the shroud 33. The purpose of the dispensing funnel is to ensure that all of the measured dose of sound absorbing material 19 enters the rear volume 35 in the shroud 33. Preferably, a zeolitic material having a substantially spherical shape is used as the sound absorbing material 19, and the form of the zeolitic material is preferably used to fill a closed volume of a closure shroud 33. In this phase of the manufacturing process of the acoustic device, it is assumed that no other components need to be installed in the shroud 33, except for the acoustic sensor 34. While additional components may be added after placing the sound absorbing material 19 in the post volume 35, there is a risk of interfering with or contaminating the sound absorbing material 19. In step S330, a predetermined amount of sound absorbing material is loaded to the dispensing funnel. The amount of sound absorbing material that will be loaded into the shroud 33 after the volume 35 is determined based on the desired acoustic effect that the designer desires to achieve. For example, the amount of sound absorbing material deposited into the volume 35 in the shroud 33 depends on the amount by which the acoustic design engineer wishes to achieve one of the resonant displacements. The measurement of the amount of sound absorbing material 19 for insertion into the rear volume 35 in the shroud 33 is performed by volume or gravity. In step S340, the carrier of the acoustic device undergoing the dispensing is vibrated while the sound absorbing material 19 from the dispensing tank is poured into the dispensing funnel and subsequently poured into the shroud 33 through the loading weir 52 to the volume 35. If the sound absorbing material 19 is in the form of powder, granules or granules, the vibrating shield 33 and the enthalpy 52 are allowed to disperse relatively quickly and evenly when the sound absorbing material 19 is poured into the rear volume 35 via the dispensing funnel. In step S350, the carrier holding the shield 33 is stopped for a predetermined time. The stop of the vibration allows the sound absorbing material 19, which is now located inside the shroud 33, to settle inside the volume 35. The settling of the sound absorbing material 19 is important for measuring whether the post volume system has been properly filled. In step S360, the carrier holding the shield 33 is vibrated for a predetermined time. The repeated vibration of the shroud 33 during both the dispensing step and after the dispensing step ensures that the sound absorbing material 19 inside the rear volume 35 of the shroud 33 has reached all of the cavities within the rear volume 35. As previously indicated, the settling of the sound absorbing material 19 is important to measure whether the back volume 35 has been properly filled. When the second vibration of the shield 33 is over, the dispensing funnel is removed. In step S370, the level of the sound absorbing material 19 inside the volume 35 is measured after the shield 33 is placed. The measurement can be done visually. More preferably, the level measurement is performed using a laser that illuminates one of the sound absorbing materials 19. In step S380, the measurement level of the sound absorbing material 19 in the rear volume 35 is compared with the design requirements of the manufactured special shield 33. If the level of the sound absorbing material 19 is lower than the design specification, the shield 33 is rejected in step S390. If the level of the sound absorbing material 19 is within the design specifications, the manufacturing process moves to step S400. In step S400, the loading pocket 52 is sealed using a loading jaw seal 53. The loading jaw seal 53 can be a foil or film that is assembled to one of the plugs 52 or glued or attached to the loading pocket 52. The foil or film can be self-adhesive. In step S410, the chamber liner 37 is aligned with the chamber wall 41 in the shroud 33. As shown in Figures 5, 6, and 9, the chamber liner is supported on the top portion of the chamber wall 41 and is positioned at the chamber wall 41 that is now attached to the gas permeable member attachment point 42. Above the gas permeable member 43. At the moment of the assembly process, the acoustic sensor 34 can be placed in position in the shroud 33. Alternatively, the acoustic sensor 34 can be mechanically attached to the printed circuit board 32, and then the acoustic sensor 34 is manipulated to a position when the printed circuit board 32 is joined to the shroud 33. Next, the printed circuit board 32 is aligned with the shield 33 and the two housings are mated together to produce a finished acoustic device. Mechanical attachment of printed circuit board 32 and shroud 33 is achieved using fasteners, adhesives and/or interlocking tabs molded into the assembly. If an adhesive is used, the adhesive preferably does not have any venting characteristics that can affect the sound absorbing material 19 in the back volume 35. Attachment of printed circuit board 32 and shroud 33 creates a sealed acoustic chamber within the outer casing of acoustic sensor 34. In step S420, the complete acoustic device is removed from the assembly carrier and the complete acoustic device is tested to determine if it meets the design requirements of the acoustic device. The foregoing description of the preferred embodiment of the invention has been shown The above description is not intended to be exhaustive or to limit the invention to the precise form disclosed. The embodiments were chosen and described in order to explain the principles of the invention and the embodiments of the invention It should be noted that any entity (e.g., speaker device, etc.) disclosed herein is not limited to one of the specialized entities as described in some embodiments. Rather, the disclosed invention can be implemented in various ways and with any degree of detail at the device level while still providing the desired functionality. It should be noted that the term "comprising" does not exclude other elements or steps and "a" does not exclude the plural. Furthermore, elements that are described in connection with different embodiments may be combined. It should also be noted that the component symbols in the scope of the patent application should not be construed as limiting the scope of the patent application. While a particular embodiment of the invention has been shown and described, it is to be understood that the scope of the scope of the present invention is limited by the scope of the appended claims. In addition, the abbreviations are used only to enhance the readability of the specification and the scope of the patent application. It should be noted that the acronyms are not intended to reduce the generality of the terms used and the acronyms are not to be construed as limiting the scope of the patent application to the embodiments described therein.

10‧‧‧揚聲器裝置10‧‧‧Speaker device

12‧‧‧聲學傳感器12‧‧‧Acoustic sensor

13‧‧‧上揚聲器外殼13‧‧‧Upper speaker housing

14‧‧‧下揚聲器外殼14‧‧‧ Lower speaker housing

15‧‧‧虛線15‧‧‧ dotted line

16‧‧‧吸音袋16‧‧‧Sound bag

17‧‧‧後置容積17‧‧‧post volume

18‧‧‧可透氣壁18‧‧‧ breathable wall

19‧‧‧吸音材料19‧‧‧ Sound absorbing materials

30‧‧‧罩殼/聲學裝置30‧‧‧Shell/acoustic device

31‧‧‧印刷電路板(PCB)殼體31‧‧‧Printed circuit board (PCB) housing

32‧‧‧印刷電路板32‧‧‧Printed circuit board

33‧‧‧護罩33‧‧‧Shield

34‧‧‧聲學傳感器34‧‧‧Acoustic sensor

35‧‧‧後置容積35‧‧‧post volume

36‧‧‧傳感器接點36‧‧‧ sensor contacts

37‧‧‧腔室襯墊37‧‧‧Cushion liner

38‧‧‧音埠襯墊38‧‧‧Acoustic pad

39‧‧‧音埠39‧‧‧Music

40‧‧‧前置容積40‧‧‧Pre-volume

41‧‧‧腔室壁41‧‧‧ chamber wall

42‧‧‧可透氣構件附接點42‧‧‧ Breathable member attachment points

43‧‧‧可透氣構件43‧‧‧breathable components

44‧‧‧內部腔室壁44‧‧‧Internal chamber wall

45‧‧‧側突片45‧‧‧ side tabs

46‧‧‧上突片46‧‧‧Upper film

47‧‧‧下突片47‧‧‧Under film

48‧‧‧可透氣嵌件48‧‧‧ breathable inserts

49‧‧‧通風孔49‧‧‧ventilation holes

50‧‧‧壁開口50‧‧‧ wall opening

51‧‧‧限制51‧‧‧Restrictions

52‧‧‧裝填埠52‧‧‧Loading

53‧‧‧裝填埠密封件53‧‧‧Loading seals

A-A‧‧‧截面線A-A‧‧‧ section line

B-B‧‧‧截面線B-B‧‧‧ section line

S100‧‧‧步驟S100‧‧‧ steps

S110‧‧‧步驟S110‧‧‧Steps

S120‧‧‧步驟S120‧‧‧ steps

S130‧‧‧步驟S130‧‧‧Steps

S140‧‧‧步驟S140‧‧‧Steps

S150‧‧‧步驟S150‧‧ steps

S160‧‧‧步驟S160‧‧‧ steps

S170‧‧‧步驟S170‧‧‧Steps

S180‧‧‧步驟S180‧‧‧Steps

S190‧‧‧步驟S190‧‧ steps

S200‧‧‧步驟S200‧‧‧ steps

S210‧‧‧步驟S210‧‧‧Steps

S300‧‧‧步驟S300‧‧‧ steps

S310‧‧‧步驟S310‧‧‧Steps

S320‧‧‧步驟S320‧‧‧Steps

S330‧‧‧步驟S330‧‧‧Steps

S340‧‧‧步驟S340‧‧‧Steps

S350‧‧‧步驟S350‧‧‧ steps

S360‧‧‧步驟S360‧‧‧Steps

S370‧‧‧步驟S370‧‧‧Steps

S380‧‧‧步驟S380‧‧‧Steps

S390‧‧‧步驟S390‧‧‧Steps

S400‧‧‧步驟S400‧‧‧Steps

S410‧‧‧步驟S410‧‧‧Steps

S420‧‧‧步驟S420‧‧‧ steps

併入且構成本說明書之一部分的附圖繪示本發明的實施例,且與「實施方式」一起用以解釋本發明之目的、優點及原理。在圖式中, 圖1係一聲學裝置內之用於安裝之一揚聲器裝置之一四分之三視圖; 圖2係具有包含吸音材料之一第一實施例之圖1之揚聲器裝置之一縱向橫截面圖; 圖3係具有包含吸音材料之一第二實施例之圖1之揚聲器裝置之一縱向橫截面圖; 圖4係一聲學裝置之一縱向橫截面圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室; 圖5係一聲學裝置之一縱向橫截面圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一第一實施例之吸音材料; 圖6係一聲學裝置之一縱向橫截面圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一第二實施例之吸音材料; 圖7係根據本發明之一內部腔室壁之一第一實施例之一橫截面圖; 圖8係根據本發明之一內部腔室壁之一第二實施例之一橫截面圖; 圖9係一聲學裝置之一縱向橫截面圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一第三實施例之吸音材料; 圖10A及圖10B係用於製造一聲學裝置之一程序流程圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一實施例之吸音材料;及 圖11A及圖11B係用於製造一聲學裝置之一程序流程圖,其中該聲學裝置之一護罩及一印刷電路板提供圍封聲學傳感器之聲學腔室及根據本發明之一實施例之吸音材料。 熟習技術者應瞭解圖中之元件僅為簡單及簡明而繪示。吾人應進一步瞭解可依發生之一特定順序來描述或描繪某些動作及/或步驟,同時熟習技術者應理解相對於次序之特定性實際上不是必須的。亦應理解本文所使用之術語及表達具有根據此等術語及表達相對於其各自對應調查及研究範圍之一般意義,其中本文另有闡述之特定意義除外。The accompanying drawings, which are incorporated in FIG. In the drawings, Figure 1 is a three-quarter view of one of the speaker devices in an acoustic device; Figure 2 is a longitudinal view of one of the speaker devices of Figure 1 having a first embodiment comprising sound absorbing material Figure 3 is a longitudinal cross-sectional view of the speaker device of Figure 1 having a second embodiment comprising a sound absorbing material; Figure 4 is a longitudinal cross-sectional view of one of the acoustic devices, wherein the acoustic device is protected The cover and a printed circuit board provide an acoustic chamber enclosing the acoustic sensor; FIG. 5 is a longitudinal cross-sectional view of one of the acoustic devices, wherein a shield of the acoustic device and a printed circuit board provide an acoustic cavity enclosing the acoustic sensor And a sound absorbing material according to a first embodiment of the present invention; FIG. 6 is a longitudinal cross-sectional view of an acoustic device, wherein a shield of the acoustic device and a printed circuit board provide an acoustic chamber enclosing the acoustic sensor And a sound absorbing material according to a second embodiment of the present invention; Fig. 7 is a cross-sectional view showing a first embodiment of an inner chamber wall according to the present invention; Fig. 8 is an internal chamber wall according to the present invention. A cross-sectional view of a second embodiment; FIG. 9 is a longitudinal cross-sectional view of an acoustic device, wherein a shield and a printed circuit board provide an acoustic chamber enclosing an acoustic sensor and in accordance with the present invention A sound absorbing material of a third embodiment; FIG. 10A and FIG. 10B are flowcharts of a process for manufacturing an acoustic device, wherein a shield of the acoustic device and a printed circuit board provide an acoustic chamber for enclosing the acoustic sensor And a sound absorbing material according to an embodiment of the present invention; and FIGS. 11A and 11B are flowcharts of a process for manufacturing an acoustic device, wherein a shield of the acoustic device and a printed circuit board provide a sealed acoustic sensor Acoustic chamber and sound absorbing material according to an embodiment of the invention. Those skilled in the art should understand that the components in the figures are only simple and concise. We should further understand that certain actions and/or steps may be described or depicted in a particular order, and that the skilled artisan should understand that the particularity of the order is not actually necessary. It is also to be understood that the terms and expressions used herein have the ordinary meaning of the terms and expressions and the scope of their respective corresponding

Claims (20)

一種用於一行動裝置之外殼,其包括: 一印刷電路基板; 一護罩,其經組態以與該印刷電路基板配合,以產生該行動裝置之該外殼,其中該護罩包括: 一腔室壁,其在與該印刷電路基板之一內表面接合時界定一實質上密封聲學腔室; 一聲學傳感器,其經安置於該聲學腔室內; 一音埠,其經聲學地耦合至該聲學傳感器; 一內部腔室壁,其經安置於該聲學腔室內且界定一後置容積; 大量吸音材料,其經安置於該後置容積內;及 一可透氣構件,其經機械地耦合至該腔室壁之一頂部部分及該內部腔室壁之一頂部部分,其中該可透氣構件將該吸音材料保持在該聲學腔室內之一界定容積中。An outer casing for a mobile device, comprising: a printed circuit substrate; a shield configured to cooperate with the printed circuit substrate to produce the outer casing of the mobile device, wherein the shield comprises: a cavity a chamber wall defining a substantially sealed acoustic chamber when engaged with an inner surface of the printed circuit substrate; an acoustic sensor disposed within the acoustic chamber; an acoustical acoustically coupled to the acoustic a sensor; an interior chamber wall disposed within the acoustic chamber and defining a rear volume; a plurality of sound absorbing materials disposed within the rear volume; and a gas permeable member mechanically coupled thereto A top portion of one of the chamber walls and a top portion of the inner chamber wall, wherein the gas permeable member retains the sound absorbing material in a defined volume within the acoustic chamber. 如請求項1之一行動裝置之外殼,其中該可透氣構件具有低聲阻,且包括一羊絨材料或一網狀材料之一或多者。The outer casing of the mobile device of claim 1, wherein the gas permeable member has a low acoustic resistance and comprises one or more of a cashmere material or a mesh material. 如請求項2之一行動裝置之外殼,其中該可透氣構件之該材料之孔徑經調適以小於該吸音顆粒之大小。The outer casing of the mobile device of claim 2, wherein the aperture of the material of the gas permeable member is adapted to be smaller than the size of the sound absorbing particles. 如請求項1之一行動裝置之外殼,其中該可透氣構件係藉由膠黏、捲邊、衝壓、壓印、熱封或超音波焊接而機械地附接至該腔室壁之該頂部部分及該內部腔室壁之該頂部部分。The outer casing of the mobile device of claim 1, wherein the gas permeable member is mechanically attached to the top portion of the chamber wall by gluing, crimping, stamping, stamping, heat sealing or ultrasonic welding. And the top portion of the inner chamber wall. 如請求項1之一行動裝置之外殼,進一步包括經插置在該印刷電路基板與該腔室壁之該頂部部分之間之一腔室襯墊,其中該腔室襯墊之一厚度判定通過其促進氣體交換之一限制的大小。An outer casing of the mobile device of claim 1, further comprising a chamber liner interposed between the printed circuit substrate and the top portion of the chamber wall, wherein a thickness of the chamber liner is determined by It promotes the size of one of the gas exchange limits. 如請求項1之一行動裝置之外殼,進一步包括經插置在該聲學傳感器與經安置於該護罩中之該音埠之間之一音埠襯墊,其中該音埠襯墊自該後置容積密封該前置容積。An outer casing of a mobile device of claim 1, further comprising a sound pad inserted between the acoustic sensor and the sound placed in the shield, wherein the sound pad is from the rear The volume is sealed to seal the front volume. 如請求項1之一行動裝置之外殼,其中該聲學腔室之該後置容積部分經部分地填充具有至少300微米之一最小直徑之實質上球形的沸石基吸音顆粒。The outer casing of the mobile device of claim 1, wherein the rear volume portion of the acoustic chamber is partially filled with substantially spherical zeolite-based sound absorbing particles having a minimum diameter of at least 300 microns. 一種用於一行動裝置之外殼,其包括: 一第一外殼元件,該第一外殼元件包括一印刷電路板,其具有經電及機械地耦合至該印刷電路板之一聲學傳感器; 一第二外殼元件,其經機械地耦合至該第一外殼元件以形成該行動裝置之該外殼,其中該第二外殼元件包括: 一連續垂直元件,其在與該第一外殼元件之該印刷電路板接合時界定一實質上密封之聲學腔室; 一音埠,其經安置於經聲學地耦合至該聲學傳感器之一傳感器空間; 一內部垂直元件,其經安置於該聲學腔室中且與該連續垂直元件相交以界定一後置容積; 大量吸音顆粒,其經安置於該後置容積內;及 一透聲材料,其經機械地耦合至該連續垂直元件之一頂部部分及該內部垂直元件之一頂部部分,其中該透聲材料將該吸音顆粒保持在該聲學腔室內之一界定空間中; 其中該聲學傳感器在該第一外殼元件及該第二外殼元件被耦合在一起時佔據該傳感器空間。A housing for a mobile device, comprising: a first housing component, the first housing component comprising a printed circuit board having an acoustic sensor electrically and mechanically coupled to the printed circuit board; a housing member mechanically coupled to the first housing member to form the housing of the mobile device, wherein the second housing member includes: a continuous vertical member that engages the printed circuit board of the first housing member Defining a substantially sealed acoustic chamber; a sound cartridge disposed to be acoustically coupled to one of the acoustic sensor sensor spaces; an internal vertical member disposed in the acoustic chamber and continuous with the acoustic chamber Vertical elements intersect to define a back volume; a plurality of sound absorbing particles disposed within the back volume; and a sound permeable material mechanically coupled to a top portion of the continuous vertical member and the internal vertical member a top portion, wherein the sound permeable material holds the sound absorbing particles in a defined space within the acoustic chamber; wherein the acoustic sensor is at the first Shell member and said second housing element are coupled together occupy the space of the sensor. 如請求項8之一行動裝置之外殼,其中該聲學腔室之該後置容積部分經部分地填充具有含至少200微米之一最小直徑之實質上球形顆粒之一沸石基吸音顆粒。The outer casing of the mobile device of claim 8, wherein the rear volume portion of the acoustic chamber is partially filled with a zeolite-based sound absorbing particle having substantially spherical particles having a minimum diameter of at least 200 microns. 如請求項8之一行動裝置之外殼,其中該聲學腔室之該後置容積部分經部分地填充具有含至少350微米之一最小直徑之實質上球形顆粒之一沸石基吸音顆粒。The outer casing of the mobile device of claim 8, wherein the rear volume portion of the acoustic chamber is partially filled with a zeolite-based sound absorbing particle having substantially spherical particles having a minimum diameter of at least 350 microns. 如請求項8之一行動裝置之外殼,進一步包括經插置在該印刷電路板與該連續垂直元件之該頂部部分之間之一腔室襯墊,其中該腔室襯墊之一厚度判定通過其促進氣體交換之一限制的大小。A housing for a mobile device of claim 8, further comprising a chamber liner interposed between the printed circuit board and the top portion of the continuous vertical member, wherein a thickness of the chamber liner is determined by It promotes the size of one of the gas exchange limits. 如請求項8之一行動裝置之外殼,其中該透聲材料係藉由膠黏或超音波焊接而機械地附接至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分。The outer casing of the mobile device of claim 8, wherein the sound permeable material is mechanically attached to the top portion of the continuous vertical member and the top portion of the inner vertical member by adhesive or ultrasonic welding. 如請求項8之一行動裝置之外殼,其中該內部垂直元件包括一開口,其經組態以促進該吸音顆粒之氣體交換,其中該開口包括具有實質上相同於經機械地耦合至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之該透聲材料之聲阻之一材料。The outer casing of the mobile device of claim 8, wherein the inner vertical member includes an opening configured to facilitate gas exchange of the sound absorbing particles, wherein the opening comprises substantially the same as being mechanically coupled to the continuous vertical a material of the acoustic resistance of the sound permeable material of the top portion of the component and the top portion of the inner vertical component. 如請求項13之一行動裝置之外殼,其中經安置於該內部垂直元件之該開口中之該此材料包括一羊絨材料或一網狀材料之一或多者。The outer casing of the mobile device of claim 13, wherein the material disposed in the opening of the inner vertical member comprises one or more of a cashmere material or a mesh material. 如請求項8之一行動裝置之外殼,其中該內部垂直元件包括一開口,其經組態以促進該吸音顆粒之氣體交換,其中該開口包括具有不同於經機械地耦合至該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之該透聲材料之一聲阻之一材料。The outer casing of the mobile device of claim 8, wherein the inner vertical member includes an opening configured to facilitate gas exchange of the sound absorbing particles, wherein the opening includes having a different electrical coupling than the continuous vertical member One of the acoustic resistance of the top portion and the top portion of the inner vertical member. 如請求項15之一行動裝置之外殼,其中經安置於該內部垂直元件之該開口中之該材料包括一可透氣材料,其包括經設定大小以將該吸音顆粒保持在該後置容積中之一界定區域中的多個孔徑。An outer casing of a mobile device of claim 15, wherein the material disposed in the opening of the inner vertical member comprises a gas permeable material comprising a size sized to retain the sound absorbing particles in the rear volume A plurality of apertures in a defined area. 如請求項8之一行動裝置之外殼,進一步包括經插置在該聲學傳感器與經安置於該第二外殼元件中之該音埠之間之一音埠襯墊,其中該音埠襯墊經組態以在將該第一外殼元件與該第二外殼元件接合時,自該後置容積密封該音埠。An outer casing of a mobile device of claim 8, further comprising a sound pad inserted between the acoustic sensor and the sound placed in the second outer casing member, wherein the sound pad is Configuring to seal the hammer from the rear volume when the first outer casing element is engaged with the second outer casing element. 一種用於一行動裝置之外殼,其包括: 一第一外殼元件,該第一外殼元件包括一印刷電路板,其具有經電及機械地耦合至該印刷電路板之一聲學傳感器; 一第二外殼元件,其經機械地耦合至該第一外殼元件,以形成該行動裝置之該外殼,其中該第二外殼元件包括: 一連續垂直元件,其在與該第一外殼元件之該印刷電路板接合時,界定一實質上密封之聲學腔室; 一音埠,其經安置於經聲學地耦合至該聲學傳感器之一傳感器空間; 一內部垂直元件,其經安置於該聲學腔室中,且與該連續垂直元件相交以界定一後置容積,其中該內部垂直元件進一步包括: 一開口,其經組態用於氣體交換;及 一低聲阻嵌件,其完全覆蓋該開口; 大量吸音顆粒,其經安置於該後置容積內;及 一透聲材料,其經機械地耦合至該連續垂直元件之一頂部部分及該內部垂直元件之一頂部部分,其中該透聲材料將該吸音顆粒保持在該聲學腔室內之一界定空間中;及 一腔室襯墊,其經插置在該印刷電路板與該連續垂直元件之該頂部部分及該內部垂直元件之該頂部部分之間; 其中該聲學傳感器在該第一外殼元件及該第二外殼元件被耦合在一起時佔據該傳感器空間。A housing for a mobile device, comprising: a first housing component, the first housing component comprising a printed circuit board having an acoustic sensor electrically and mechanically coupled to the printed circuit board; a housing component mechanically coupled to the first housing component to form the housing of the mobile device, wherein the second housing component comprises: a continuous vertical component on the printed circuit board with the first housing component When engaged, defining a substantially sealed acoustic chamber; a sound cartridge disposed to be acoustically coupled to one of the acoustic sensor sensor spaces; an internal vertical member disposed in the acoustic chamber, and Intersecting the continuous vertical member to define a rear volume, wherein the inner vertical member further comprises: an opening configured for gas exchange; and a low acoustic resistance insert that completely covers the opening; a plurality of sound absorbing particles Disposed within the rear volume; and a sound transmissive material mechanically coupled to a top portion of the continuous vertical member and the inner vertical element a top portion, wherein the sound permeable material holds the sound absorbing particles in a defined space within the acoustic chamber; and a chamber liner interposed on the printed circuit board and the top of the continuous vertical member And between the portion and the top portion of the inner vertical member; wherein the acoustic sensor occupies the sensor space when the first outer casing member and the second outer casing member are coupled together. 如請求項18之一行動裝置之外殼,其中該內部垂直元件中之該低聲阻嵌件及該透聲材料各包括一羊絨材料或一網狀材料之一或多者。The outer casing of the mobile device of claim 18, wherein the low acoustic resistance insert and the sound permeable material in the inner vertical member each comprise one or more of a cashmere material or a mesh material. 如請求項18之一行動裝置之外殼,其中該聲學腔室之該後置容積部分經部分地填充具有含至少300微米之一最小直徑及900微米之一最大直徑之實質上球形顆粒之一沸石基吸音顆粒。The outer casing of the mobile device of claim 18, wherein the rear volume portion of the acoustic chamber is partially filled with one of substantially spherical particles having a minimum diameter of at least 300 microns and a maximum diameter of 900 microns Base sound absorbing particles.
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