TW201819548A - Conductive nanoparticle dispersion primer composition and methods of making and using the same - Google Patents

Conductive nanoparticle dispersion primer composition and methods of making and using the same Download PDF

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TW201819548A
TW201819548A TW105137281A TW105137281A TW201819548A TW 201819548 A TW201819548 A TW 201819548A TW 105137281 A TW105137281 A TW 105137281A TW 105137281 A TW105137281 A TW 105137281A TW 201819548 A TW201819548 A TW 201819548A
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coating
primer
substrate
total weight
conductive
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TW105137281A
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Chinese (zh)
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大衛 克靈寧
馮威
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薩比克全球科技公司
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Abstract

A method of curing a coating includes forming a primer coating from a composition for use in a conductive nanoparticle composition, wherein the composition comprises a multifunctional acrylate oligomer; an acrylate monomer; a photoinitiator; and a solvent; wherein the primer composition includes a total weight, wherein 5 % to 20 % of the total weight comprises the multifunctional acrylate oligomer, wherein 15 % to 20% of the total weight comprises the acrylate monomer, wherein 1.5% to 6% of the total weight comprises the photoinitiator; and wherein 50 to 78% of the total weight comprises the solvent; applying the primer coating to a surface of a substrate to form a coated substrate; applying irradiation to the primer coating with an ultraviolet light lamp having a peak irradiance of at least 1500 milliWatts; and curing the coating.

Description

導電奈米粒子分散底漆組成物及其製造方法與使用  Conductive nano particle dispersing primer composition, manufacturing method and use thereof  

本文揭示底漆組成物。 The primer composition is disclosed herein.

塗佈方法可能需要在塗佈前處理基板以改進在塗層與基板之間的性質,諸如黏著性、表面潤濕和可相容性。可於塗佈前使用底漆組成物(primer composition)或其他處理(諸如電漿處理或紫外光輻射處理)來處理基板。該等處理可用於導電塗層,其本身可用於各種電子裝置。該等塗層可提供許多功能,諸如電磁干擾屏蔽和靜電消散(electrostatic dissipation)。該等塗層可用於許多應用,包括但不限於觸控式螢幕顯示器、無線電子板、光伏打裝置、導電紡織品和纖維、有機發光二極體、電致發光裝置和電泳顯示器諸如電子紙。 Coating methods may require processing the substrate prior to coating to improve properties between the coating and the substrate, such as adhesion, surface wetting, and compatibility. The substrate can be treated prior to coating using a primer composition or other treatment such as plasma treatment or ultraviolet radiation treatment. These processes can be used for conductive coatings, which are themselves useful in a variety of electronic devices. These coatings provide many functions such as electromagnetic interference shielding and electrostatic dissipation. Such coatings can be used in a variety of applications including, but not limited to, touch screen displays, wireless electronic boards, photovoltaic devices, conductive textiles and fibers, organic light emitting diodes, electroluminescent devices, and electrophoretic displays such as electronic paper.

底漆穩定性(stability)可在形成導電塗層時具有重要性,其可影響導電塗層對基板的黏著性。因此,本領域對具有更好的穩定性之底漆組成物有需求,其可助於 在導電塗層與基板之間提供強的黏著性。 Primer stability can be important in forming a conductive coating that can affect the adhesion of the conductive coating to the substrate. Accordingly, there is a need in the art for a primer composition having better stability which can provide a strong adhesion between the conductive coating and the substrate.

用於導電奈米粒子分散物(conductive nanoparticle dispersion)之底漆組成物,包含:多官能性丙烯酸酯寡聚物(multifunctional acrylate oligomer);及丙烯酸酯單體(acrylate monomer);及光引發劑(photoinitiator);及溶劑;其中,底漆組成物包括總重量,其中總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中總重量之15%至20%包含丙烯酸酯單體,其中總重量之1.5%至6%包含光引發劑;及其中總重量之50%至78%包含溶劑。 a primer composition for a conductive nanoparticle dispersion, comprising: a multifunctional acrylate oligomer; an acrylate monomer; and a photoinitiator ( Photoinitiator); and a solvent; wherein the primer composition comprises a total weight, wherein 5% to 20% by weight of the total weight comprises a polyfunctional acrylate oligomer, wherein 15% to 20% by weight of the total weight comprises acrylate monomer, Wherein 1.5% to 6% of the total weight comprises a photoinitiator; and 50% to 78% of the total weight thereof comprises a solvent.

固化(curing)塗料之方法,包含從用於導電奈米粒子組成物的組成物形成底漆塗料,其中組成物包含多官能性丙烯酸酯寡聚物;丙烯酸酯單體;光引發劑;及溶劑;其中,底漆組成物包括總重量,其中總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中總重量之15%至20%包含丙烯酸酯單體,其中總重量之1.5%至6%包含光引發劑;及其中總重量之50%至78%包含溶劑;施加該底漆塗料至基板表面以形成經塗佈之基板(coated substrate);以具有至少1500毫瓦特(milliWatt)之峰值輻照度(peak irradiance)的紫外光燈對該底漆塗料施加照射;以及固化該塗料。 A method of curing a coating comprising forming a primer coating from a composition for a conductive nanoparticle composition, wherein the composition comprises a polyfunctional acrylate oligomer; an acrylate monomer; a photoinitiator; and a solvent Wherein the primer composition comprises the total weight, wherein 5% to 20% by weight of the total weight comprises a polyfunctional acrylate oligomer, wherein 15% to 20% by weight of the total weight comprises acrylate monomer, wherein the total weight is 1.5 % to 6% comprises a photoinitiator; and 50% to 78% of the total weight thereof comprises a solvent; the primer coating is applied to the surface of the substrate to form a coated substrate; to have at least 1500 milliwatts (milliWatt a peak irradiance ultraviolet light to apply the primer to the primer coating; and to cure the coating.

導電片(sheet)或膜(film),包含經塗佈之基 板,其中經塗佈之基板包括第一表面和第二表面,其中底漆塗料係黏附於第一表面;以及,與底漆組成物相鄰的導電塗層,其中導電塗層包括以網狀(network)配置之奈米尺寸金屬粒子,且其中導電塗層具有小於或等於0.1Ohm/sq之表面電阻(surface resistance)。 a conductive sheet or film comprising a coated substrate, wherein the coated substrate comprises a first surface and a second surface, wherein the primer coating adheres to the first surface; and, is composed of a primer An adjacent conductive coating, wherein the conductive coating comprises nano-sized metal particles in a network configuration, and wherein the conductive coating has a surface resistance of less than or equal to 0.1 Ohm/sq.

上文說明的及其他的特點係藉由下列的圖及詳細說明舉例說明。 The above and other features are illustrated by the following figures and detailed description.

2,32‧‧‧導電片或膜 2,32‧‧‧conductive sheet or film

4,14‧‧‧導電塗層 4,14‧‧‧ Conductive coating

6,16‧‧‧底漆組成物塗料 6,16‧‧‧ Primer composition coating

8,20‧‧‧基板 8,20‧‧‧Substrate

10‧‧‧保護性部位 10‧‧‧Protective parts

22‧‧‧第一表面 22‧‧‧ first surface

24‧‧‧第二表面 24‧‧‧ second surface

18‧‧‧隨意的第一基板塗層 18‧‧‧ Random first substrate coating

26‧‧‧表面 26‧‧‧ Surface

28‧‧‧隨意的第二基板塗層 28‧‧‧Optional second substrate coating

現參考為示例性實施態樣之圖,且其中類似元件經一樣地編號。 Reference is now made to the accompanying drawings, in which

圖1係圖示包括底漆組成物塗層及轉移至其之導電塗層的導電片或膜之橫截面圖。 1 is a cross-sectional view showing a conductive sheet or film including a primer composition coating and a conductive coating transferred thereto.

圖2係圖示包括底漆組成物塗層、轉移至其的導電塗層及經塗佈之基板的一部分的導電片或膜之橫截面圖。 2 is a cross-sectional view of a conductive sheet or film including a primer composition coating, a conductive coating transferred thereto, and a portion of a coated substrate.

圖3係圖示製備導電片或膜之方法的一實施態樣之流程圖。 Figure 3 is a flow chart illustrating an embodiment of a method of making a conductive sheet or film.

圖4A至52B為表4至13中的各個實施例之影像。 4A to 52B are images of respective embodiments in Tables 4 to 13.

本文揭示底漆組成物,其與不同的底漆組成物相比,係可在導電塗層與基板之間提供增加的黏著性。 例如,底漆組成物可形成底漆塗層,其可藉由解決與來自底漆塗層中的底漆組成物之殘餘溶劑(其可在底漆塗層中造成多孔性(porosity)或溶劑起泡(solvent bubbling)問題)相關聯的各種問題而提供增加之基板對塗層的黏著性。 The primer compositions are disclosed herein to provide increased adhesion between the conductive coating and the substrate as compared to different primer compositions. For example, the primer composition can form a primer coating that addresses the residual solvent with the primer composition from the primer coating (which can cause porosity or solvent in the primer coating) The problem of solvent bubbling) provides an increased adhesion of the substrate to the coating.

用於導電奈米粒子分散物之底漆組成物可包含多官能性丙烯酸酯寡聚物、丙烯酸酯單體、隨意的(optional)黏著促進劑(adhesion promoter)、隨意的表面添加劑(surface additive)、光引發劑及溶劑。底漆組成物,與不同的底漆組成物相比,係可在導電塗層與基板之間提供增加的黏著性。底漆組成物可包括總重量。多官能性丙烯酸酯寡聚物可占總重量之5%至20%。丙烯酸酯單體可占總重量之15%至20%。隨意的黏著促進劑可占總重量之0.25%至2%。隨意的表面添加劑可占總重量之0.25%至2%。光引發劑可占總重量之1.5%至6%。溶劑可占總重量之50%至78%。底漆組成物能形成可助於在導電塗層與基板之間提供所欲黏著性的底漆組成物塗層。 The primer composition for the conductive nanoparticle dispersion may comprise a polyfunctional acrylate oligomer, an acrylate monomer, an optional adhesion promoter, and a random surface additive. , photoinitiators and solvents. The primer composition provides increased adhesion between the conductive coating and the substrate as compared to different primer compositions. The primer composition can include the total weight. The polyfunctional acrylate oligomer can comprise from 5% to 20% by weight of the total weight. The acrylate monomer may comprise from 15% to 20% by weight of the total weight. The optional adhesion promoter can comprise from 0.25% to 2% by weight of the total weight. Random surface additives can range from 0.25% to 2% by weight. The photoinitiator can comprise from 1.5% to 6% by weight of the total. The solvent may comprise from 50% to 78% by weight of the total weight. The primer composition is capable of forming a primer composition coating that assists in providing the desired adhesion between the conductive coating and the substrate.

本文揭示用於導電奈米粒子分散物之底漆組成物。底漆組成物可形成底漆組成物塗層,其可藉由解決與來自底漆組成物塗層中的底漆組成物之殘餘溶劑(其可在底漆組成物塗層中造成多孔性或溶劑起泡問題)相關聯的各種問題而提供增加之基板對塗層的黏著性。 A primer composition for a conductive nanoparticle dispersion is disclosed herein. The primer composition can form a primer composition coating that addresses the residual solvent with the primer composition from the primer composition coating (which can cause porosity in the primer composition coating or The problem of solvent blistering) provides an increased adhesion of the substrate to the coating.

用於導電奈米粒子分散物之底漆組成物可包含多官能性丙烯酸酯寡聚物、丙烯酸酯單體、光引發劑及溶劑。底漆組成物可包括總重量。多官能性丙烯酸酯寡聚 物可占總重量之5%至20%。丙烯酸酯單體可占總重量之15%至20%。光引發劑可占總重量之1.5%至6%。溶劑可占總重量之50%至78%。 The primer composition for the conductive nanoparticle dispersion may comprise a polyfunctional acrylate oligomer, an acrylate monomer, a photoinitiator, and a solvent. The primer composition can include the total weight. The polyfunctional acrylate oligomer can comprise from 5% to 20% by weight of the total weight. The acrylate monomer may comprise from 15% to 20% by weight of the total weight. The photoinitiator can comprise from 1.5% to 6% by weight of the total. The solvent may comprise from 50% to 78% by weight of the total weight.

底漆組成物塗層可與基板相鄰配置。底漆組成物塗層可配置在導電塗層與基板表面之間。底漆組成物塗層可黏附於導電塗層及基板表面,且可提供黏著力以連接與基板相鄰的導電塗層。底漆組成物塗層可夾在導電塗層與基板之間,使得其一側與基板表面而另一側與導電塗層相鄰配置。基板可包括基板塗層。底漆組成物塗層可直接黏附於基板表面。底漆組成物塗層可黏附於塗層表面,該塗層係黏附於基板表面。 The primer composition coating can be disposed adjacent to the substrate. The primer composition coating can be disposed between the conductive coating and the surface of the substrate. The primer composition coating adheres to the conductive coating and the substrate surface and provides adhesion to connect the conductive coating adjacent to the substrate. The primer composition coating may be sandwiched between the conductive coating and the substrate such that one side thereof is disposed adjacent to the substrate surface and the other side is adjacent to the conductive coating. The substrate can include a substrate coating. The primer composition coating adheres directly to the substrate surface. The primer composition coating adheres to the surface of the coating, which adheres to the surface of the substrate.

底漆組成物可包含多官能性丙烯酸酯寡聚物及丙烯酸酯單體。底漆組成物可包含光引發劑。多官能性丙烯酸酯寡聚物可包括脂族胺甲酸乙酯丙烯酸酯寡聚物(aliphatic urethane acrylate oligomer)、新戊四醇四丙烯酸酯(pentaerythritol tetraacrylate)、脂族胺甲酸乙酯丙烯酸酯(aliphatic urethane acrylate)、丙烯酸酯、二新戊四醇六丙烯酸酯(dipentaerythritol dexaacrylate)、丙烯酸酯化樹脂(acrylated resin)、三羥甲丙烷三丙烯酸酯(trimethylolpropane triacrylate)(TMPTA)、二新戊四醇五丙烯酸酯、或包含前述中之至少一者的組合。在一實施態樣中,多官能性丙烯酸酯寡聚物可包括DOUBLEMERTM 5272(DM5272)(在市場上可得自R.O.C.台灣台北之Double Bond Chemical Ind.,Co.,LTD.),其包括多官能 性丙烯酸酯之30重量百分比(重量%)至50重量%的脂族胺甲酸乙酯丙烯酸酯寡聚物量及多官能性丙烯酸酯之50重量%至70重量%的新戊四醇四丙烯酸酯量。多官能性丙烯酸酯寡聚物可包括GENOMERTM 4267(在市場上可得自Rahn USA Corp.)其為具有官能度(functionality)2的脂族胺甲酸乙酯丙烯酸酯,SARTOMERTM CN981(在市場上可得自SARTOMER Americas)其為CN981以脂族聚酯/聚醚為底質之胺甲酸乙酯二丙烯酸酯寡聚物其提供與固有的低黏度關聯之耐候性(weathering property),SARTOMERTM SR399(在市場上可得自SARTOMER Americas)其包含具有耐磨性(abrasion resistance)、有硬度的可撓性(flexibility)、及對紫外光和電子束固化之快速固化反應的二新戊四醇五丙烯酸酯。 The primer composition may comprise a polyfunctional acrylate oligomer and an acrylate monomer. The primer composition can comprise a photoinitiator. The polyfunctional acrylate oligomer may include an aliphatic urethane acrylate oligomer, a pentaerythritol tetraacrylate, an aliphatic urethane acrylate (aliphatic). Urethane acrylate), acrylate, dipentaerythritol dexaacrylate, acrylated resin, trimethylolpropane triacrylate (TMPTA), dipentaerythritol An acrylate, or a combination comprising at least one of the foregoing. In one embodiment aspect, a polyfunctional acrylate oligomer may comprise DOUBLEMER TM 5272 (DM5272) (commercially available from the Taiwan ROC Taipei Double Bond Chemical Ind., Co., LTD.), Which includes a plurality 30% by weight (% by weight) to 50% by weight of the aliphatic urethane acrylate oligomer of the functional acrylate and 50% to 70% by weight of the pentaerythritol tetraacrylate of the polyfunctional acrylate the amount. A polyfunctional acrylate oligomer may include GENOMER TM 4267 (commercially available from the Rahn USA Corp.) as having a functionality (Functionality) aliphatic urethane acrylate amines 2, SARTOMER TM CN981 (in the Market available from the SARTOMER Americas) which provides weathering resistance inherent low viscosity of association (weathering property), SARTOMER TM CN981 to as aliphatic polyester / polyether urethane amine of sediment diacrylate oligomer SR399 (available from SARTOMER Americas on the market) which contains di-n-pentaerythritol with abrasion resistance, flexibility, and rapid curing reaction for UV and electron beam curing. Pentaacrylate.

底漆組成物可包括聚合引發劑以促進丙烯酸酯組份之聚合反應。聚合引發劑可包括光引發劑,其在暴露於紫外光輻射時促進組成物組份之聚合反應。 The primer composition may include a polymerization initiator to promote polymerization of the acrylate component. The polymerization initiator may include a photoinitiator that promotes polymerization of the component components upon exposure to ultraviolet light.

底漆組成物可包括30重量%至90重量%之多官能性丙烯酸酯寡聚物量,例如30重量%至85重量%,或30重量%至80重量%;5重量%至65重量%之丙烯酸酯單體量,例如8重量%至65重量%,或15重量%至65重量%;及0重量%至10重量%之光引發劑量,例如2重量%至8重量%,或3重量%至7重量%,其中,重量係以底漆組成物塗料的總重量為基準計。多官能性丙烯酸酯寡聚物可包括脂族胺甲酸乙酯丙烯酸酯寡聚物及新戊四醇四 丙烯酸酯,其中多官能性丙烯酸酯寡聚物包括多官能性丙烯酸酯寡聚物重量,其中多官能性丙烯酸酯寡聚物重量之30%至50%包含脂族胺甲酸乙酯丙烯酸酯寡聚物,及其中多官能性丙烯酸酯寡聚物重量之50%至70%包含新戊四醇四丙烯酸酯。脂族胺甲酸乙酯丙烯酸酯寡聚物可包括2至15個丙烯酸酯官能基,例如2至10個丙烯酸酯官能基。丙烯酸酯單體(例如1,6-己二醇二丙烯酸酯(1,6-hexanediol diacrylate)、甲基(丙烯酸酯)單體)可包括1至5個丙烯酸酯官能基,例如1至3個丙烯酸酯官能基。在一實施態樣中,丙烯酸酯單體可為1,6-己二醇二丙烯酸酯(HDDA)。 The primer composition may comprise from 30% to 90% by weight of the polyfunctional acrylate oligomer, for example from 30% to 85% by weight, or from 30% to 80% by weight; from 5% to 5% by weight of acrylic acid An amount of the ester monomer, for example, 8% by weight to 65% by weight, or 15% by weight to 65% by weight; and 0% by weight to 10% by weight of the photoinitiating dose, for example, 2% by weight to 8% by weight, or 3% by weight to 7 wt%, wherein the weight is based on the total weight of the primer composition coating. The polyfunctional acrylate oligomer may include an aliphatic urethane acrylate oligomer and neopentyl alcohol tetraacrylate, wherein the polyfunctional acrylate oligomer comprises a polyfunctional acrylate oligomer weight, Wherein 30% to 50% by weight of the polyfunctional acrylate oligomer comprises an aliphatic urethane acrylate oligomer, and 50% to 70% by weight of the polyfunctional acrylate oligomer thereof comprises neopentylene Alcohol tetraacrylate. The aliphatic urethane acrylate oligomer may comprise from 2 to 15 acrylate functional groups, for example from 2 to 10 acrylate functional groups. The acrylate monomer (for example, 1,6-hexanediol diacrylate, methyl (acrylate) monomer) may include 1 to 5 acrylate functional groups, for example, 1 to 3 Acrylate functional group. In one embodiment, the acrylate monomer can be 1,6-hexanediol diacrylate (HDDA).

多官能性丙烯酸酯寡聚物可包括藉由以下所製造之化合物:使脂族異氰酸酯(aliphatic isocyanate)與寡聚物二醇(oligomeric diol)(諸如聚酯二醇(polyester diol)或聚醚二醇(polyether diol))反應以製造經異氰酸酯封端之寡聚物(isocyanate capped oligomer)。接著可使此寡聚物與丙烯酸羥乙酯(hydroxy ethyl acrylate)反應以製造胺甲酸乙酯丙烯酸酯(urethane acrylate)。多官能性丙烯酸酯寡聚物可為脂族胺甲酸乙酯丙烯酸酯寡聚物,例如以脂族多元醇(aliphatic polyol)(其係與脂族聚異氰酸酯(aliphatic polyisocyanate)反應且丙烯酸酯化(acrylate))為底質之完全脂族胺甲酸乙酯(甲基)丙烯酸酯寡聚物(wholly aliphatic urethane (meth)acrylate oligomer)。在一個實施態樣中,多官能性丙烯酸酯寡聚物可以多元醇醚主鏈(polyol ether backbone)為底質。例如,脂族胺甲酸乙酯丙烯酸酯寡聚物可為下列者之反應產物:(i)脂族多元醇;(ii)脂族聚異氰酸酯;及(iii)能夠供給反應性末端(reactive terminus)的封端單體(end capping monomer)。多元醇(i)可為脂族多元醇,其在固化時不會不利地影響組成物的性質。實例包括聚醚多元醇(polyether polyol)、烴多元醇(hydrocarbon polyol)、聚碳酸酯多元醇(polycarbonate polyol)、聚異氰酸酯多元醇(polyisocyanate polyol)、及彼之混合物。多官能性丙烯酸酯寡聚物可包括脂族胺甲酸乙酯四丙烯酸酯(亦即最大官能度(maximum functionality)為4),其可以丙烯酸酯單體(例如1,6-己二醇二丙烯酸酯(HDDA)、三丙二醇二丙烯酸酯(tripropyleneglycol diacrylate)(TPGDA)、或三羥甲丙烷三丙烯酸酯(trimethylolpropane triacrylate)(TMPTA))稀釋20重量%。可用於形成底漆組成物塗料之市場上可取得的胺甲酸乙酯丙烯酸酯可為EBECRYLTM 8405、EBECRYLTM8311或EBECRYLTM 8402,每一者係於市場上可得自Allnex。 The polyfunctional acrylate oligomer may include a compound produced by making an aliphatic isocyanate with an oligomeric diol such as a polyester diol or a polyether. A polyether diol is reacted to produce an isocyanate capped oligomer. This oligomer can then be reacted with hydroxy ethyl acrylate to produce urethane acrylate. The polyfunctional acrylate oligomer may be an aliphatic urethane acrylate oligomer, for example, an aliphatic polyol which is reacted with an aliphatic polyisocyanate and acrylated ( Acrylate)) is a complete aliphatic urethane (meth) acrylate oligomer. In one embodiment, the polyfunctional acrylate oligomer can be based on a polyol ether backbone. For example, the aliphatic urethane acrylate oligomer may be the reaction product of: (i) an aliphatic polyol; (ii) an aliphatic polyisocyanate; and (iii) capable of supplying a reactive terminus End capping monomer. The polyol (i) may be an aliphatic polyol which does not adversely affect the properties of the composition upon curing. Examples include polyether polyols, hydrocarbon polyols, polycarbonate polyols, polyisocyanate polyols, and mixtures thereof. The polyfunctional acrylate oligomer may comprise an aliphatic urethane tetraacrylate (ie, a maximum functionality of 4) which may be an acrylate monomer (eg, 1,6-hexanediol diacrylate) The ester (HDDA), tripropyleneglycol diacrylate (TPGDA), or trimethylolpropane triacrylate (TMPTA) was diluted 20% by weight. May be used to form the amine in the urethane acrylate coating of the primer composition may be obtained commercially EBECRYL TM 8405, EBECRYL TM 8311 or EBECRYL TM 8402, each based on the market available from Allnex.

可用於底漆組成物的一些市場上可取得的寡聚物可包括但不限於多官能性丙烯酸酯,其為下列家族的一部分:來自IGM Resins,Inc.,St.Charles,IL之PHOTOMERTM系列的脂族胺甲酸乙酯丙烯酸酯寡聚物;來自Sartomer Company,Exton,Pa.之Sartomer SR系列的脂族胺甲酸乙酯丙烯酸酯寡聚物;來自Echo Resins and Laboratory,Versailles,Mo.之Echo樹脂系列的脂族胺甲酸 乙酯丙烯酸酯寡聚物;來自Bomar Specialties,Winsted,Conn.之BR系列的脂族胺甲酸乙酯丙烯酸酯;及來自Allnex之EBECRYLTM系列的脂族胺甲酸乙酯丙烯酸酯寡聚物。例如,脂族胺甲酸乙酯丙烯酸酯可為KRM8452(10官能度,Allnex)、EBECRYLTM 1290(6官能度,Allnex)、EBECRYLTM 1290N(6官能度,Allnex)、EBECRYLTM 512(6官能度,Allnex)、EBECRYLTM 8702(6官能度,Allnex)、EBECRYLTM 8405(3官能度,Allnex)、EBECRYLTM 8402(2官能度,Allnex)、EBECRYLTM 284(3官能度,Allnex)、CN9010TM(Sartomer)、CN9013TM(Sartomer)、SR351(Sartomer)或Laromer TMPTA(BASF)、SR399(Sartomer)二新戊四醇五丙烯酸酯和二新戊四醇六丙烯酸酯DPHA(Allnex)、CN9010(Sartomer)。 Some commercially available oligomers can be used to obtain the primer composition may include, but are not limited to, polyfunctional acrylate, which is part of the following families: from IGM Resins, Inc., St.Charles, IL series of PHOTOMER TM Aliphatic urethane acrylate oligomer; aliphatic urethane acrylate oligomer from Sartomer SR series of Sartomer Company, Exton, Pa.; Echo from Echo Resins and Laboratory, Versailles, Mo. aliphatic amine urethane acrylate from Bomar Specialties, Winsted, Conn series of BR;; aliphatic amine resin series urethane acrylate oligomer. Allnex and the aliphatic amine from the urethane EBECRYL TM series Acrylate oligomer. For example, aliphatic amine urethane acrylate may be KRM8452 (10 functionality, Allnex), EBECRYL TM 1290 ( 6 functionality, Allnex), EBECRYL TM 1290N ( 6 functionality, Allnex), EBECRYL TM 512 ( 6 functionality , Allnex), EBECRYL TM 8702 ( 6 functionality, Allnex), EBECRYL TM 8405 ( 3 functionality, Allnex), EBECRYL TM 8402 ( 2 functionality, Allnex), EBECRYL TM 284 ( 3 functionality, Allnex), CN9010 TM (Sartomer), CN9013 TM (Sartomer ), SR351 (Sartomer) or Laromer TMPTA (BASF), SR399 ( Sartomer) two new pentaerythritol pentaacrylate and di-pentaerythritol hexaacrylate new DPHA (Allnex), CN9010 (Sartomer ).

底漆組成物的另一組份可為每單體分子具有一或多個丙烯酸酯或甲基丙烯酸酯部分(moiety)之丙烯酸酯單體。丙烯酸酯單體可為單-、二-、三-、四-或五官能性。在一個實施態樣中,就塗層的所欲可撓性及黏著性而使用二官能性單體(di-functional monomer)。單體可為直鏈或支鏈烷基、環狀、或部分芳族(partially aromatic)。反應性單體稀釋劑(reactive monomer diluent)亦可包含單體之組合,其總體而言導致塗料組成物在基板上的所欲黏著性,其中底漆組成物可固化以形成具有所欲性質的可撓性硬材料。 Another component of the primer composition can be an acrylate monomer having one or more acrylate or methacrylate moieties per monomer molecule. The acrylate monomer can be mono-, di-, tri-, tetra- or pentafunctional. In one embodiment, a di-functional monomer is used in terms of the desired flexibility and adhesion of the coating. The monomer may be a linear or branched alkyl group, a cyclic group, or a partially aromatic. The reactive monomer diluent may also comprise a combination of monomers which, in general, result in the desired adhesion of the coating composition to the substrate, wherein the primer composition is curable to form the desired properties. Flexible hard material.

丙烯酸酯單體可包括具有複數個丙烯酸酯或甲基丙烯酸酯部分(moiety)的單體。該等可為單-、二-、三-、四-或五官能性,尤其為二-官能性,以便增加經固化之塗料的交聯密度,且因此亦可增加模數(modulus)而不造成脆性(brittleness)。多官能性單體(polyfunctional monomer)的實例包括但不限於C6-C12烴二醇二丙烯酸酯或二甲基丙烯酸酯,諸如1,6-己二醇二丙烯酸酯(HDDA)及1,6-己二醇二甲基丙烯酸酯、三丙二醇二丙烯酸酯或二甲基丙烯酸酯、新戊二醇二丙烯酸酯(neopentyl glycol diacrylate)或二甲基丙烯酸酯、新戊二醇丙氧基化二丙烯酸酯(neopentyl glycol propoxylate diacrylate)或二甲基丙烯酸酯、新戊二醇乙氧基化二丙烯酸酯(neopentyl glycol ethoxylate diacrylate)或二甲基丙烯酸酯、2-苯氧基乙基(甲基)丙烯酸酯(2-phenoxylethyl (meth)acrylate)、烷氧基化脂族(甲基)丙烯酸酯(alkoxylated aliphatic (meth)acrylate)、聚乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸月桂酯(lauryl (meth)acrylate)、(甲基)丙烯酸異癸酯、(甲基)丙烯酸異莰酯(isobornyl (meth)acrylate)、(甲基)丙烯酸三癸酯、及包含前述單體中之至少一者的混合物。例如,丙烯酸酯單體可為1,6-己二醇二丙烯酸酯(HDDA),其為單獨或與另一單體之組合,諸如三丙二醇二丙烯酸酯(tripropyleneglycol diacrylate)(TPGDA)、三羥甲丙烷三丙烯酸酯(trimethylolpropane triacrylate)(TMPTA)、寡聚三丙烯酸酯(oligotriacrylate)(OTA 480)、或丙烯酸辛基/癸基 酯(octyl/decyl acrylate)(ODA)。例如,丙烯酸酯單體可為聚乙二醇丙烯酸酯。例如,丙烯酸酯單體可為單官能性甲氧基化聚乙二醇丙烯酸酯單體(monofunctional methoxylate polyethylene glycol acrylate monomer),例如SARTOMERTM CD553(在市場上可得自SARTOMER Americas)、乙氧基化三羥甲丙烷三丙烯酸酯(ethoxylate trimethrylolpropane triacrylate)例如SARTOMERTM SR454(在市場上可得自SARTOMER Americas)、3莫耳丙氧基化甘油三丙烯酸酯(propoxylated glyceryl triacrylate)之三官能性單體例如SARTOMERTM SR 9020(在市場上可得自SARTOMER Americas)、或聚乙二醇(600)二丙烯酸酯例如SARTOMERTM SR610(在市場上可得自SARTOMER Americas)。 The acrylate monomer can include a monomer having a plurality of acrylate or methacrylate moieties. These may be mono-, di-, tri-, tetra- or penta-functional, especially di-functional, in order to increase the crosslink density of the cured coating, and thus may also increase the modulus without Causes brittleness. Examples of polyfunctional monomers include, but are not limited to, C 6 -C 12 hydrocarbon diol diacrylates or dimethacrylates such as 1,6-hexanediol diacrylate (HDDA) and 1, 6-Hexanediol dimethacrylate, tripropylene glycol diacrylate or dimethacrylate, neopentyl glycol diacrylate or dimethacrylate, neopentyl glycol propoxylation Neopentyl glycol propoxylate diacrylate or dimethacrylate, neopentyl glycol ethoxylate diacrylate or dimethacrylate, 2-phenoxyethyl (methyl) ) 2-phenoxylethyl (meth)acrylate, alkoxylated aliphatic (meth)acrylate, polyethylene glycol (meth)acrylate, (meth)acrylic acid Lauryl (meth)acrylate, isodecyl (meth)acrylate, isobornyl (meth)acrylate, tridecyl (meth)acrylate, and the inclusion of the aforementioned monomers a mixture of at least one of them. For example, the acrylate monomer can be 1,6-hexanediol diacrylate (HDDA), either alone or in combination with another monomer, such as tripropyleneglycol diacrylate (TPGDA), trihydroxyl Trimethylolpropane triacrylate (TMPTA), oligotriacrylate (OTA 480), or octyl/decyl acrylate (ODA). For example, the acrylate monomer can be polyethylene glycol acrylate. For example, polyethylene glycol acrylate monomer may be an acrylate monomer (monofunctional methoxylate polyethylene glycol acrylate monomer) is a monofunctional methoxylated, e.g. SARTOMER TM CD553 (commercially available from the SARTOMER Americas), ethoxy trimethylol propane triacrylate (ethoxylate trimethrylolpropane triacrylate) e.g. SARTOMER TM SR454 (commercially available from the SARTOMER Americas), 3 mole propoxylated glycerol triacrylate (propoxylated glyceryl triacrylate) of trifunctional monomer For example SARTOMER TM SR 9020 (commercially available from the SARTOMER Americas), or polyethylene glycol (600) diacrylate e.g. SARTOMER TM SR610 (commercially available from the SARTOMER Americas).

底漆組成物的另一組份可為黏著促進劑(adhesion promoter),諸如包括1-甲氧基-2-丙醇(1-methoxy-2-propanol)之羥基官能性共聚物(hydroxy functional copolymer),例如BYK 4510(在市場上可得自ALTANA)。底漆組成物的另一組份可為表面添加劑(surface additive)諸如含有表面添加劑之交聯聚矽氧(cross-linking silicone),例如經聚醚改質之丙烯酸官能性矽氧烷(polyether modified,acryl functional siloxane),諸如BYK UV3530(在市場上可得自ALTANA)。底漆組成物的另一組份可為溶劑。溶劑可包括醇,諸如乙醇、乙酸乙酯、異丙醇、乙酸異丁酯、或包含前述中之至少一者的 組合。 Another component of the primer composition may be an adhesion promoter such as a hydroxy functional copolymer comprising 1-methoxy-2-propanol. ), such as BYK 4510 (available from ALTANA on the market). Another component of the primer composition may be a surface additive such as a cross-linking silicone containing a surface additive such as a polyether modified polyether modified polyether modified , acryl functional siloxane), such as BYK UV3530 (available from ALTANA on the market). Another component of the primer composition can be a solvent. The solvent may include an alcohol such as ethanol, ethyl acetate, isopropanol, isobutyl acetate, or a combination comprising at least one of the foregoing.

底漆組成物的另一組份可為聚合引發劑(polymerization initiator),諸如光引發劑,其中光引發劑為紫外光固化的(ultraviolet cured)。光引發劑可提供合理的固化速度而不造成底漆組成物的過早膠凝(premature gelation)。再者,可使用之而不干擾經固化之底漆組成物或自其製得之底漆組成物塗層的光學透明度(optical clarity)。又再者,光引發劑可為熱穩定、不黃化且有效的。光引發劑可包括但不限於下列者:α-羥酮(α-hydroxyketone);雙醯膦(bis acyl phosphine);二苯基酮(benzophenone);苯基雙雙(2,4,6-三甲基苄醯基)(phenyl bis bis(2,4,6-trimethyl benzoyl);1-羥基-環己基-苯基-酮(1-hydroxy-cyclohexyl-phenyl-ketone),二苯基酮,2-羥基-2-甲基-1-苯基-1-丙酮(2-hydroxy-2-methyl-1-phenyl-1-propanone);膦氧化物(phosphine oxide);羥基環己基苯基酮(hydroxycyclohexylphenyl ketone);羥基甲基苯基丙酮(hydroxymethylphenylpropanone);二甲氧基苯基苯乙酮(dimethoxyphenylacetophenone);2-甲基-1-[4-(甲硫基)苯基]-2-N-啉基丙酮-1(2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1);1-(4-異丙基苯基)-2-羥基-2-甲基丙-1-酮(1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one);1-(4-十二烷基苯基)-2-羥基-2-甲基丙-1-酮(1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one);4-(2-羥基乙氧基)苯基-(2-羥基-2-丙基)酮(4-(2- hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone);二乙氧基苯乙酮(diethoxyacetophenone);2,2-二-二級丁氧基苯乙酮(2,2-di-sec-butoxyacetophenone)、二乙氧基-苯基苯乙酮(diethoxy-phenyl acetophenone);雙(2,6-二甲氧基苄醯基)-2,4-,4-三甲基戊基氧化膦(bis(2,6-dimethoxybenzoyl)-2,4-,4-trimethylpentylphosphine oxide);2,4,6-三甲基苄醯基二苯基氧化膦(2,4,6-trimethylbenzoyldiphenylphosphine oxide);2,4,6-三甲基苄醯基乙氧基苯基氧化膦(2,4,6-trimethylbenzoylethoxyphenylphosphine oxide);及包含前述中之至少一者的組合。 Another component of the primer composition can be a polymerization initiator, such as a photoinitiator, wherein the photoinitiator is ultraviolet cured. The photoinitiator can provide a reasonable cure speed without causing premature gelation of the primer composition. Further, it can be used without interfering with the optical clarity of the cured primer composition or the coating of the primer composition prepared therefrom. Still further, the photoinitiator can be thermally stable, non-yellowing, and effective. Photoinitiators may include, but are not limited to, alpha-hydroxyketone; bis acyl phosphine; benzophenone; phenyl double (2,4,6-trimethyl) Phenyl bis bis(2,4,6-trimethyl benzoyl); 1-hydroxy-cyclohexyl-phenyl-ketone, diphenyl ketone, 2- Hydroxy-2-methyl-1-phenyl-1-propanone; phosphine oxide; hydroxycyclohexylphenyl ketone ); hydroxymethylphenylpropanone; dimethoxyphenylacetophenone; 2-methyl-1-[4-(methylthio)phenyl]-2-N- 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1); 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane- 1-keto (1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one); 1-(4-dodecylphenyl)-2-hydroxy-2-methylprop-1- Ketone (1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one); 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)one (4- (2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone); diethoxyacetophenone; 2,2-di-butoxybutyrophenone (2,2-di) -sec-butoxyacetophenone), diethoxy-phenyl acetophenone; bis(2,6-dimethoxybenzylidene)-2,4-,4-trimethylpentyl Bis(2,6-dimethoxybenzoyl-2,4-,4-trimethylpentylphosphine oxide); 2,4,6-trimethylbenzoyldiphenylphosphine oxide 2,4,6-trimethylbenzoylethoxyphenylphosphine oxide; and a combination comprising at least one of the foregoing.

示例性光引發劑可包括膦氧化物(phosphine oxide)光引發劑。此等光引發劑的實例包括可得自BASF Corp.之IRGACURETM、LUCIRINTM和DAROCURETM系列的膦氧化物光引發劑;可得自Allnex之ADDITOLTM系列;及來自Lamberti,s.p.a.之ESACURETM系列的光引發劑。其他有用的光引發劑包括以酮為底質之光引發劑,諸如羥基-和烷氧基烷基苯基酮及硫烷基苯基N-啉基烷基酮(thioalkylphenyl morpholinoalkyl ketone)。亦希望可為安息香醚(benzoin ether)光引發劑。具體的示例性光引發劑包括由BASF以IRGACURETM 819供應之雙(2,4,6-三甲基苄醯基)-苯基氧化膦(bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide)、或由Allnex以ADDITOL HDMAPTM供應之2-羥基-2-甲基-1-苯基-1-丙酮、或由 BASF以IRGACURETM 184供應之1-羥基-環己基-苯基-酮、或由Changzhou Runtecure chemical Co.Ltd供應之RUNTECURETM 1104、或由BASF以DAROCURETM 1173供應之2-羥基-2-甲基-1-苯基-1-丙酮。光引發劑可包括在市場上可得自Rahn USA Corp.之GENOCURETM LBC,二苯基酮液態光引發劑摻合物。可選擇光引發劑以使得固化能量(curing energy)小於每平方公分2.0焦耳(J/cm2),且尤其小於1.0J/cm2(當使用指定量的光引發劑時)。 Exemplary photoinitiators can include phosphine oxide photoinitiators. Examples of such photoinitiators include phosphine oxide photoinitiators available from BASF Corp.'s IRGACURE (TM) , LUCIRIN (TM) and DAROCURE ( TM) series; ADDITOL (TM) series available from Allnex; and ESACURE (TM) series from Lamberti, spa Photoinitiator. Other useful photoinitiators include ketone-based photoinitiators such as hydroxy- and alkoxyalkyl phenyl ketones and sulfanyl phenyl N-- Thioalkylphenyl morpholinoalkyl ketone. It is also desirable to be a benzoin ether photoinitiator. Specific Exemplary photoinitiators include bis by BASF supply of IRGACURE TM 819 (2,4,6-acyl-methylbenzyl) - phenyl phosphine oxide (bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide ), or 2-hydroxy supply them with a Allnex ADDITOL HDMAP TM -2- methyl-1-phenyl-1-propanone, 1-hydroxy or by BASF under the supply of IRGACURE TM 184 - cyclohexyl - phenyl - one, Co.Ltd RUNTECURE TM 1104 or by the supply of Changzhou Runtecure chemical, or consisting of 2- BASF supplied to DAROCURE TM 1173-methyl-1-phenyl-1-propanone. The photoinitiator may include commercially available from Rahn USA Corp. of GENOCURE TM LBC, a liquid benzophenone photoinitiator blend. The photoinitiator can be selected such that the curing energy is less than 2.0 joules per square centimeter (J/cm 2 ), and especially less than 1.0 J/cm 2 (when a specified amount of photoinitiator is used).

聚合引發劑可包括以過氧基(peroxy)為底質之引發劑,其可促進在熱活化(thermal activation)下之聚合反應。有用的過氧基引發劑(peroxy initiator)的實例包括過氧化苄醯(benzoyl peroxide)、過氧化二異丙苯(dicumyl peroxide)、過氧化丁酮(methyl ethyl ketone peroxide)、過氧化月桂基(lauryl peroxide)、過氧化環己酮(cyclohexanone peroxide)、過氧化三級丁醇(t-butyl hydroperoxide)、氫過氧化三級丁基苯(t-butyl benzene hydroperoxide)、2-乙基-己過氧酸三級丁酯(t-butyl peroctoate)、2,5-二氫過氧化-2,5-二甲基己烷(2,5-dimethylhexane-2,5-dihydroperoxide)、2,5-二甲基-2,5-二(三級丁過氧)-己-3-炔(2,5-dimethyl-2,5-di(t-butylperoxy)-hex-3-yne)、過氧化二-三級丁基(di-t-butylperoxide)、三級丁過氧異丙苯(t-butylcumyl peroxide)、α,α’-雙(三級丁過氧-間-異丙基)苯(alpha,alpha'-bis(t-butylperoxy-m-isopropyl)benzene)、2,5-二甲基-2,5-二(三級丁過氧)己烷 (2,5-dimethyl-2,5-di(t-butylperoxy)hexane)、過氧化二異丙苯(dicumylperoxide)、過氧異酞酸二(三級丁酯)(di(t-butylperoxy isophthalate)、過氧苯甲酸三級丁酯(t-butylperoxybenzoate)、2,2-雙(三級丁過氧)丁烷(2,2-bis(t-butylperoxy)butane)、2,2-雙(三級丁過氧)辛烷(2,2-bis(t-butylperoxy)octane)、2,5-二甲基-2,5-二(苄醯過氧)己烷(2,5-dimethyl-2,5-di(benzoylperoxy)hexane)、二(三甲基矽基)過氧化物(di (trimethylsilyl)peroxide)、三甲基矽基苯基三苯基矽基過氧化物(trimethylsilylphenyltriphenylsilyl peroxide)、及類似者、及包含前述聚合引發劑中至少一者之組合。 The polymerization initiator may include a peroxy-based initiator which promotes polymerization under thermal activation. Examples of useful peroxy initiators include benzoyl peroxide, dicumyl peroxide, methyl ethyl ketone peroxide, and lauryl peroxide ( Lauryl peroxide), cyclohexanone peroxide, t-butyl hydroperoxide, t-butyl benzene hydroperoxide, 2-ethyl-hexidine T-butyl peroctoate, 2,5-dimethylhexane-2,5-dihydroperoxide, 2,5-di Methyl-2,5-di(tris-butylperoxy)-hex-3-yne (2,5-dimethyl-2,5-di(t-butylperoxy)-hex-3-yne), diperoxide- Di-t-butylperoxide, tertiary t-butylcumyl peroxide, α,α'-bis(tris-butyl peroxy-m-isopropyl)benzene (alpha, Alpha'-bis(t-butylperoxy-m-isopropyl)benzene, 2,5-dimethyl-2,5-di(tri-butylperoxy)hexane (2,5-dimethyl-2,5-di (t-butylperoxy)hexane), dicumylperoxide, di(isobutyl isophthalate) (di(t-butylperoxy isophtha) Late), t-butylperoxybenzoate, 2,2-bis(t-butylperoxybutane), 2,2-double (2,2-bis(t-butylperoxy)octane), 2,5-dimethyl-2,5-di(benzylhydrazine peroxy)hexane (2,5-dimethyl -2,5-di(benzoylperoxy)hexane), di(trimethylsilyl)peroxide, trimethylsilylphenyltriphenylsilyl peroxide And the like, and a combination comprising at least one of the foregoing polymerization initiators.

如本文所述之底漆組成物塗層可具有電阻率(electrical resistivity)為小於或等於75歐姆,每平方(Ω/sq),例如小於或等於50Ω/sq,例如小於或等於25Ω/sq,例如小於或等於15Ω/sq。如本文所述之底漆組成物塗層可具有10至25Ω/sq之電阻率。電阻率通常係指材料有多強地阻礙(oppose)電流流動。較低的數值意謂著導電率(conductivity)增加。 The primer composition coating as described herein may have an electrical resistivity of less than or equal to 75 ohms per square ( Ω /sq), such as less than or equal to 50 Ω /sq, such as less than or equal to 25 Ω / Sq, for example less than or equal to 15 Ω /sq. The primer composition coating as described herein can have a resistivity of 10 to 25 Ω /sq. Resistivity generally refers to how strongly the material opposes current flow. Lower values mean an increase in conductivity.

本揭示內容提供在惰性氛圍(inert atmosphere)中固化塗料之方法,其中該方法包括從用於導電奈米粒子組成物的組成物形成底漆塗料,其中該組成物包含多官能性丙烯酸酯寡聚物、丙烯酸酯單體、光引發劑及溶劑;其中該底漆組成物包括總重量,其中總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中總重量之15%至20%包 含丙烯酸酯單體,其中總重量之1.5%至6%包含光引發劑,及其中總重量之50%至78%包含溶劑。將底漆塗料施加至基板表面以形成經塗佈之基板。使經塗佈之基板經受以微波動力紫外光(UV)燈的照射,其中照射係在惰性氛圍中施加,且使經塗佈之基板固化。惰性氛圍可包括氮氣、氬氣、氦氣、二氧化碳、或包含前述中之至少一者的組合。底漆塗料的厚度可為10微米至50微米,例如20微米至40微米,或20微米至30微米。 The present disclosure provides a method of curing a coating in an inert atmosphere, wherein the method comprises forming a primer coating from a composition for a conductive nanoparticle composition, wherein the composition comprises a polyfunctional acrylate oligomer And an acrylate monomer, a photoinitiator, and a solvent; wherein the primer composition comprises a total weight, wherein 5% to 20% by weight of the total weight comprises a polyfunctional acrylate oligomer, wherein the total weight is 15% to 20% % comprises an acrylate monomer, wherein 1.5% to 6% by weight of the total weight comprises a photoinitiator, and 50% to 78% of the total weight thereof comprises a solvent. A primer coating is applied to the surface of the substrate to form a coated substrate. The coated substrate is subjected to irradiation with a microwave powered ultraviolet (UV) lamp, wherein the illumination is applied in an inert atmosphere and the coated substrate is cured. The inert atmosphere can include nitrogen, argon, helium, carbon dioxide, or a combination comprising at least one of the foregoing. The primer coating may have a thickness of from 10 micrometers to 50 micrometers, such as from 20 micrometers to 40 micrometers, or from 20 micrometers to 30 micrometers.

基板可具有任何形狀。基板可具有第一表面和第二表面。基板可包括聚合物、玻璃、或聚合物與玻璃的組合。基板之第一表面可包含第一聚合物。基板的第二表面可包含第二聚合物。基板的第一表面可配置為相對於基板的第二表面。基板的第一表面可由第一聚合物所組成。基板的第二表面可由第二聚合物所組成。基板的第一表面可由第一聚合物所組成及基板的第二表面可由第二聚合物所組成。第一聚合物及第二聚合物可共同擠壓(co-extrude)以形成基板。第一聚合物及第二聚合物可為不同的聚合物,例如可包含不同的化學組成物。基板可為平坦的且可包括第一表面和第二表面,其中第二表面可配置為相對於第一表面,諸如共同擠壓以形成基板的相對側。基板可具有可撓性。基板的厚度可為150微米至250微米,例如150微米至200微米,或150微米至175微米。 The substrate can have any shape. The substrate can have a first surface and a second surface. The substrate can comprise a polymer, glass, or a combination of polymer and glass. The first surface of the substrate can comprise a first polymer. The second surface of the substrate can comprise a second polymer. The first surface of the substrate can be configured relative to the second surface of the substrate. The first surface of the substrate can be comprised of a first polymer. The second surface of the substrate can be comprised of a second polymer. The first surface of the substrate may be comprised of a first polymer and the second surface of the substrate may be comprised of a second polymer. The first polymer and the second polymer may be co-extruded to form a substrate. The first polymer and the second polymer can be different polymers, for example, can comprise different chemical compositions. The substrate can be flat and can include a first surface and a second surface, wherein the second surface can be configured relative to the first surface, such as co-extruded to form opposing sides of the substrate. The substrate can have flexibility. The thickness of the substrate can range from 150 microns to 250 microns, such as from 150 microns to 200 microns, or from 150 microns to 175 microns.

底漆塗料可藉由H-bulb使用各種峰值輻照度(peak irradiance)及使用微波UV處理器(Microwave UV processor)或弧燈UV處理器(Arc lamp UV processor)來固化。可使經塗佈之基板經受在380毫焦耳(milliJoule)(mJ)至650mJ之能量(energy)下的照射(irradiation)(例如暴露(exposure)),例如400mJ至600mJ,例如425mJ至475mJ。峰值輻照度係指所使用的燈之峰值瓦特數(peak wattage)。底漆可對峰值輻照度敏感。可使經塗佈之基板經受在1500毫瓦特(milliWatt)(mW)至2500mW之能量(power)下的照射,例如1900mW至2200mW,例如2000mW至2100mW。經塗佈之基板可經60秒、90秒或120秒固化。固化溫度可為125℃至200℃,例如140℃。另外,經塗佈之基板可在照射前暴露於25℃至100℃之溫度。暴露可經20至100秒,例如30至90秒,40至80秒,或50至70秒。 Primer coatings can be cured by H-bulb using various peak irradiances and using a Microwave UV processor or an Arc lamp UV processor. The coated substrate can be subjected to an irradiation (e.g., exposure) at an energy of 380 millijoules (mJ) to 650 mJ, such as 400 mJ to 600 mJ, such as 425 mJ to 475 mJ. Peak irradiance refers to the peak wattage of the lamp used. The primer is sensitive to peak irradiance. The coated substrate can be subjected to irradiation at a power of 1500 milliwatts (mW) to 2500 mW, such as 1900 mW to 2200 mW, such as 2000 mW to 2100 mW. The coated substrate can be cured in 60 seconds, 90 seconds, or 120 seconds. The curing temperature may range from 125 ° C to 200 ° C, for example 140 ° C. Additionally, the coated substrate can be exposed to temperatures between 25 ° C and 100 ° C prior to irradiation. The exposure may be for 20 to 100 seconds, such as 30 to 90 seconds, 40 to 80 seconds, or 50 to 70 seconds.

本揭示內容提供導電片(sheet)或膜(film),其包括經塗佈之基板及施加至底漆塗層之導電塗層。導電塗層可含有電磁屏蔽材料(electromagnetic shielding material)。導電塗層可包括導電材料。導電材料可包括純金屬(諸如銀(Ag)、鎳(Ni)、銅(Cu))、其金屬氧化物、包含前述中之至少一者的組合、或包含前述中之至少一者的金屬合金、或由美國專利第5,476,535號所述之冶金化學方法(Metallurgic Chemical Process)(MCP)所製造之金屬或金屬合金。導電塗層之金屬可為奈米尺寸,諸如其中90%之粒子可具有小於100奈米(nm)之等效球形直徑(equivalent spherical diameter)。金屬粒子可經燒結以形成 網狀互連之金屬軌線(interconnected metal trace)的網狀(network),其在施加其之基板表面上界定無規成形開口。導電塗層之燒結溫度可為300℃,其可超過一些基板材料之熱變形溫度(heat deflection temperature)。在燒結後,導電塗層之表面電阻(surface resistance)可小於或等於0.1ohm,每平方(ohm/sq)。導電塗層可具有之表面電阻為小於1/10之銦錫氧化物塗層(indium tin oxide coating)之表面電阻。導電塗層可為透明的。 The present disclosure provides a conductive sheet or film comprising a coated substrate and a conductive coating applied to the primer coating. The conductive coating may contain an electromagnetic shielding material. The conductive coating can include a conductive material. The conductive material may include a pure metal such as silver (Ag), nickel (Ni), copper (Cu), a metal oxide thereof, a combination comprising at least one of the foregoing, or a metal alloy comprising at least one of the foregoing. A metal or metal alloy produced by the Metallurgic Chemical Process (MCP) described in U.S. Patent No. 5,476,535. The metal of the conductive coating can be nanometer in size, such as where 90% of the particles can have an equivalent spherical diameter of less than 100 nanometers (nm). The metal particles can be sintered to form a network of interconnected metal traces that define a randomly shaped opening on the surface of the substrate to which they are applied. The sintering temperature of the conductive coating can be 300 ° C, which can exceed the heat deflection temperature of some substrate materials. After sintering, the surface resistance of the conductive coating can be less than or equal to 0.1 ohm per square (ohm/sq). The conductive coating may have a surface resistance of indium tin oxide coating having a surface resistance of less than 1/10. The conductive coating can be transparent.

與由奈米尺寸金屬線所形成的網不同,由奈米尺寸金屬粒子所形成的導電網(conductive network)可彎曲而不降低導電網之導電率及/或增加電阻。例如,金屬線之網在彎曲時可在接合點(junction)分離,這會降低線網之導電率,而奈米尺寸粒子之金屬網可以彈性變形而不使網之軌線(trace)分離,由此維持網之導電率。 Unlike a mesh formed of nano-sized metal wires, a conductive network formed of nano-sized metal particles can be bent without reducing the conductivity of the conductive mesh and/or increasing the electrical resistance. For example, the wire of the wire can be separated at the junction when bent, which reduces the conductivity of the wire, and the metal mesh of the nano-sized particles can be elastically deformed without separating the trace of the mesh. This maintains the conductivity of the network.

底漆組成物塗料可配置為相鄰於基板表面(例如分散在基板表面上)。底漆組成物塗料可鄰接基板表面。底漆組成物塗料可配置在基板表面上。底漆組成物塗料可施加至導電塗層。底漆組成物塗料可至少部分圍繞導電塗層。導電塗層可至少部分埋於底漆組成物塗料中,使得一部分的底漆組成物塗料可延伸至導電塗層之奈米金屬網的開口中。 The primer composition coating can be disposed adjacent to the surface of the substrate (eg, dispersed on the surface of the substrate). The primer composition coating can abut the substrate surface. The primer composition coating can be disposed on the surface of the substrate. The primer composition coating can be applied to the conductive coating. The primer composition coating can at least partially surround the conductive coating. The conductive coating can be at least partially embedded in the primer composition coating such that a portion of the primer composition coating can extend into the opening of the nanowire of the conductive coating.

基板可隨意地包括配置在基板表面上的基板塗層。基板塗層可配置在基板的兩個相對表面上。基板塗層可對基板提供保護性部位(protective portion)。保護性 部位(諸如丙烯酸硬塗層(acrylic hard coat))可對下方的基板提供耐磨性(abrasion resistance)。保護性部位可與基板表面相鄰配置。保護性部位可鄰接基板表面。保護性部位可配置在導電塗層的對面。保護性部位可包括聚合物。在一實施態樣中,基板塗層可包括聚合物塗層(polymeric coating),其供給良好的鉛筆硬度(pencil hardness)(例如根據ASTM D3363在聚甲基丙烯酸甲酯上所測量的4-5H或根據ASTM D3363在聚碳酸酯上所測量的HB-F)及耐化學/耐磨性連同所欲加工特徵。例如,基板塗層可包括塗層諸如在市場上可得自SABIC’s Innovative Plastics Business之LEXANTM OQ6DA膜或類似的以丙烯酸為底質(acrylic based)或以矽為底質(silicon based)之塗層、膜或塗膜,其可提供增強的鉛筆硬度、增強的耐化學性、各種光澤度(gloss)和印刷性(printability)、增強的可撓性(flexibility)及/或增強的耐磨性。塗層可具有0.1毫米(mm)至2mm厚度,例如o.25mm至1.5mm,或0.5mm至1.2mm厚度。塗層可施加至基板的一或多個面上。例如,基板塗層可包括丙烯酸硬塗層。 The substrate may optionally include a substrate coating disposed on the surface of the substrate. The substrate coating can be disposed on two opposing surfaces of the substrate. The substrate coating can provide a protective portion to the substrate. A protective site, such as an acrylic hard coat, can provide an abrasion resistance to the underlying substrate. The protective portion can be disposed adjacent to the surface of the substrate. The protective portion can abut the surface of the substrate. The protective portion can be disposed opposite the conductive coating. The protective site can include a polymer. In one embodiment, the substrate coating can comprise a polymeric coating that provides good pencil hardness (eg, 4-5H as measured on polymethyl methacrylate according to ASTM D3363). Or HB-F) and chemical/abrasion resistance measured on polycarbonate according to ASTM D3363, along with the desired processing characteristics. For example, the coated substrate may include a coating such as commercially available from SABIC's Innovative Plastics Business of LEXAN TM OQ6DA acrylic film or the like as a substrate mass (acrylic based) or as seeding silicon (silicon based) coating the A film or film that provides enhanced pencil hardness, enhanced chemical resistance, various gloss and printability, enhanced flexibility, and/or enhanced abrasion resistance. The coating may have a thickness of from 0.1 millimeters (mm) to 2 mm, such as from o.25 mm to 1.5 mm, or from 0.5 mm to 1.2 mm. The coating can be applied to one or more faces of the substrate. For example, the substrate coating can include an acrylic hardcoat.

圖1為圖示導電片或膜2。片或膜2可包括導電塗層4、底漆組成物塗料(primer composition coating)6(亦即底漆組成物塗層(primer composition coating layer))、基板8及保護性部位10。片或膜2可彎曲及/或成形(例如擠壓),此得片或膜形狀的深度D大於片或膜2的總厚度T。可從A點至B點測量導電片或膜32之導 電率。基板可包括第一表面22及第二表面24。基板8可包括共同擠壓的兩聚合物。基板可包括包含第一聚合物之第一表面22及包含第二聚合物之第二面24。經共同擠壓之基板可包括由第一聚合物所組成之第一表面22及由第二聚合物所組成之第二表面24。導電塗層4可與基板8的第一表面22相鄰配置。底漆組成物塗料6可直接施加至基板8的第一表面22或底漆組成物塗料6可施加至導電塗層4。底漆組成物塗料6可夾在導電塗層4與基板8的第一表面22之間。片或膜2可於至少一個維度(dimension)上彎曲,例如w軸維度。片或膜2可於至少兩個維度上彎曲,例如w軸及h軸維度。片或膜2可具有沿著w軸測量的寬度W。片或膜2可具有沿著d軸測量的深度D。片或膜2可具有沿著l軸測量的長度L。片或膜2可具有可撓性使得當整合導電膜(integrated conductive film)2彎曲時,電阻的變化(在A點至B點之間測量)可小於或等於1ohm。片或膜2的厚度T可為0.05mm至25mm,例如0.05mm至10mm,或0.1mm至5mm。片或膜2可彎曲。深度D可比片或膜2的總厚度T大兩倍。片或膜2可在沿著膜的任何地方具有最大的深度。導電塗層4可被部分的底漆組成物塗料6至少部分包圍,使得部分的底漆組成物塗料6可延伸至導電塗層4之奈米金屬網的開口中。 FIG. 1 is a diagram showing a conductive sheet or film 2. The sheet or film 2 may include a conductive coating 4, a primer composition coating 6 (i.e., a primer composition coating layer), a substrate 8 and a protective portion 10. The sheet or film 2 can be bent and/or shaped (e.g., extruded) such that the depth D of the sheet or film shape is greater than the total thickness T of the sheet or film 2. The conductivity of the conductive sheet or film 32 can be measured from point A to point B. The substrate can include a first surface 22 and a second surface 24. Substrate 8 can include two polymers that are coextruded. The substrate can include a first surface 22 comprising a first polymer and a second surface 24 comprising a second polymer. The coextruded substrate can include a first surface 22 comprised of a first polymer and a second surface 24 comprised of a second polymer. The conductive coating 4 can be disposed adjacent to the first surface 22 of the substrate 8. The primer composition coating 6 can be applied directly to the first surface 22 of the substrate 8 or the primer composition coating 6 can be applied to the conductive coating 4. The primer composition coating 6 can be sandwiched between the conductive coating 4 and the first surface 22 of the substrate 8. The sheet or film 2 can be curved over at least one dimension, such as the w-axis dimension. The sheet or film 2 can be curved in at least two dimensions, such as the w-axis and the h-axis dimension. The sheet or film 2 can have a width W measured along the w-axis. The sheet or film 2 can have a depth D measured along the d-axis. The sheet or film 2 may have a length L measured along the 1 axis. The sheet or film 2 may have flexibility such that when the integrated conductive film 2 is bent, the change in electrical resistance (measured between points A to B) may be less than or equal to 1 ohm. The thickness T of the sheet or film 2 may be from 0.05 mm to 25 mm, such as from 0.05 mm to 10 mm, or from 0.1 mm to 5 mm. The sheet or film 2 can be bent. The depth D can be twice as large as the total thickness T of the sheet or film 2. The sheet or film 2 can have the greatest depth anywhere along the film. The conductive coating 4 can be at least partially surrounded by a portion of the primer composition coating 6, such that a portion of the primer composition coating 6 can extend into the opening of the nanoweb of the conductive coating 4.

圖2為圖示導電片或膜32之一部分橫截面。導電片或膜32可包括導電塗層14、底漆組成物塗料16、 隨意的第一基板塗層18、隨意的第二基板塗層28及基板20。可從A點至B點測量導電片或膜32的導電率。隨意的第一基板塗層18可與基板20相鄰配置,使得底漆組成物塗料16可黏附於隨意的第一基板塗層18的表面26,且與基板20相鄰。導電塗層14可被部分的底漆組成物塗料16至少部分包圍,使得部分的底漆組成物塗料16可延伸至導電塗層14之奈米金屬網的開口中。片或膜32可包括隨意的第二基板塗層28,其配置在與隨意的第一基板塗層18配置之表面相對的表面上。 FIG. 2 is a partial cross-sectional view showing a conductive sheet or film 32. The conductive sheet or film 32 can include a conductive coating 14, a primer composition coating 16, a random first substrate coating 18, a random second substrate coating 28, and a substrate 20. The conductivity of the conductive sheet or film 32 can be measured from point A to point B. The optional first substrate coating 18 can be disposed adjacent to the substrate 20 such that the primer composition coating 16 can adhere to the surface 26 of the random first substrate coating 18 and adjacent the substrate 20. The conductive coating 14 can be at least partially surrounded by a portion of the primer composition coating 16 such that a portion of the primer composition coating 16 can extend into the opening of the nanoweb of the conductive coating 14. The sheet or film 32 can include a random second substrate coating 28 disposed on a surface opposite the surface on which the optional first substrate coating 18 is disposed.

圖3為圖示製備導電片或膜2之方法的一實施態樣,其中係提供基板8及將底漆塗料6施加至基板8表面。使底漆層經UV固化且老化(age),隨後將導電塗層4施加至底漆塗料6。使導電塗層4經熱固化以形成導電片或膜2。另一選擇地或另外,可將底漆組成物塗料6施加至基板8或導電塗層4,其中將底漆塗料6夾在基板8與導電塗層4之間,其中將底漆塗料6固化以使層黏附在一起。 3 is an embodiment illustrating a method of preparing a conductive sheet or film 2 in which a substrate 8 is provided and a primer coating 6 is applied to the surface of the substrate 8. The primer layer is UV cured and aged, and then the conductive coating 4 is applied to the primer coating 6. The conductive coating 4 is thermally cured to form a conductive sheet or film 2. Alternatively or additionally, the primer composition coating 6 can be applied to the substrate 8 or the electrically conductive coating 4, wherein the primer coating 6 is sandwiched between the substrate 8 and the electrically conductive coating 4, wherein the primer coating 6 is cured. To make the layers stick together.

底漆組成物塗層可透射(transmit)大於或等於50%(例如50%之透射率(transmittance))之入射可見光(例如具有430THz至790THz頻率之電磁輻射),例如60%至100%,或75%至100%,例如86%。透明度(Transparency)係由兩種參數描述:透射百分比及霧度百分比(percent haze)。實驗室規模的樣品之透射率百分比及霧度百分比可使用ASTM D1003程序A使用CIE標準光 源C利用Haze-Gard試驗裝置來測定。ASTM D1003(程序B,分光光度計,使用以單向觀察(unidirectional viewing)、具漫射照明(diffuse illumination)之光源C)係定義透射率百分比如下: The primer composition coating can transmit incident visible light (eg, electromagnetic radiation having a frequency of 430 THz to 790 THz) greater than or equal to 50% (eg, 50% transmittance), such as 60% to 100%, or 75% to 100%, for example 86%. Transparency is described by two parameters: percent transmission and percent haze. The percent transmittance and haze percentage of laboratory scale samples can be determined using ASTM D1003 Procedure A using a CIE Standard Light Source C using a Haze-Gard test apparatus. ASTM D1003 (Procedure B, Spectrophotometer, using unidirectional viewing, light source with diffuse illumination C) defines the percent transmittance as follows:

其中:I為通過試驗樣品之光強度及Io為入射光強度。 Where: I is the light intensity of the test sample and I o is the incident light intensity.

底漆組成物塗層可具有如根據ASTM D1003程序A使用CIE標準光源C所測量的小於或等於5%之霧度值(haze value),例如霧度值可小於或等於3%,例如霧度值可小於或等於2.5%。包括底漆組成物塗層之導電片或膜可具有如根據ASTM D1003程序A使用CIE標準光源C所測量的小於或等於6%之霧度,例如小於或等於5%,例如小於或等於2.5%。包括底漆組成物塗層之導電片或膜對具有430THz至790THz頻率之入射光可具有如根據ASTM D1003程序A使用CIE標準光源C所測量的大於或等於80%之透射率,例如大於或等於85%,例如大於或等於86%,例如大於或等於87%。包括底漆組成物塗層之導電片或膜可具有如根據ASTM D3363使用具有1公斤載重(loading)之Mitsubishi Uni鉛筆所測量的大於或等於H之鉛筆硬度。 The primer composition coating may have a haze value of less than or equal to 5% as measured according to ASTM D1003 Procedure A using a CIE standard source C, such as a haze value of less than or equal to 3%, such as haze. The value can be less than or equal to 2.5%. The conductive sheet or film comprising the primer composition coating may have a haze of less than or equal to 6% as measured according to ASTM D1003 Procedure A using a CIE standard source C, such as less than or equal to 5%, such as less than or equal to 2.5%. . A conductive sheet or film comprising a primer composition coating may have an incident light having a frequency of 430 THz to 790 THz having a transmittance greater than or equal to 80% as measured according to ASTM D1003 Procedure A using a CIE standard source C, such as greater than or equal to 85%, for example greater than or equal to 86%, such as greater than or equal to 87%. The conductive sheet or film comprising the primer composition coating may have a pencil hardness of greater than or equal to H as measured according to ASTM D3363 using a Mitsubishi Uni pencil having a loading of 1 kg.

可將形成底漆組成物塗料的底漆組成物固 化。固化底漆組成物塗料可包括等待、加熱、乾燥、暴露於電磁輻射(例如在UV光譜內的電磁輻射(EMR))、或前述中之一者的組合。 The primer composition forming the primer composition coating can be cured. The cured primer composition coating can include a combination of waiting, heating, drying, exposure to electromagnetic radiation (eg, electromagnetic radiation (EMR) in the UV spectrum), or one of the foregoing.

導電片或膜可包括基板(包括第一表面和第二表面)、黏附於第一表面的如本文所述之底漆組成物塗層、及與底漆組成物塗層相鄰的導電塗層,其中導電塗層包括以網狀配置之奈米尺寸金屬粒子,且其中導電塗層具有小於或等於0.1Ohm/sq之表面電阻。 The conductive sheet or film can include a substrate (including a first surface and a second surface), a primer composition coating as described herein adhered to the first surface, and a conductive coating adjacent to the primer composition coating. Wherein the conductive coating comprises nano-sized metal particles arranged in a network, and wherein the conductive coating has a surface resistance of less than or equal to 0.1 Ohm/sq.

導電片、膜或基板之聚合物或在製造導電片、膜或基板(例如基板、底漆組成物塗層、及隨意的基板塗層)所使用之聚合物,可包括熱塑性樹脂、熱固性樹脂、玻璃、或包含前述中之至少一者的組合。 a polymer used for a conductive sheet, a film or a substrate or a polymer used in the production of a conductive sheet, film or substrate (for example, a substrate, a primer composition coating, and a random substrate coating) may include a thermoplastic resin, a thermosetting resin, Glass, or a combination comprising at least one of the foregoing.

可能的熱塑性樹脂包括但不限於寡聚物、聚合物、離子聚合物(ionomer)、樹枝狀聚合物(dendrimer)、共聚物(諸如接枝共聚物(graft copolymer))、嵌段共聚物(例如星狀嵌段共聚物(star block copolymer)、無規共聚物(random copolymer)及類似者)、或包含前述中之至少一者的組合。此等熱塑性樹脂的實例包括但不限於聚碳酸酯(例如聚碳酸酯之摻合物(諸如聚碳酸酯-聚丁二烯摻合物、共聚酯聚碳酸酯(copolyester polycarbonate)))、聚苯乙烯(例如聚碳酸酯與苯乙烯之共聚物、聚伸苯醚-聚苯乙烯摻合物(polyphenylene ether-polystyrene blend))、聚醯亞胺(PI)(例如聚醚醯亞胺(PEI))、丙烯腈-苯乙烯-丁二烯(ABS)、聚甲基丙烯酸 烷酯(例如聚甲基丙烯酸甲酯(PMMA))、聚酯(例如共聚酯(copolyester)、聚硫酯(polythioester))、聚烯烴(例如聚丙烯(PP)和聚乙烯、高密度聚乙烯(HDPE)、低密度聚乙烯(LDPE)、線性低密度聚乙烯(linear low density polyethylene)(LLDPE))、聚對苯二甲酸乙二酯(polyethylene terephthalate)(PET)、聚醯胺(例如聚醯胺醯亞胺(polyamideimide))、聚芳基化物(polyarylate)、聚碸(例如聚芳基碸(polyarylsulfone)、聚磺醯胺(polysulfonamide))、聚苯硫(polyphenylene sulfide)、聚四氟乙烯(polytetrafluoroethylene)、聚醚(例如聚醚酮(polyether keton)(PEK)、聚醚醚酮(polyether etherketone)(PEEK)、聚醚碸(polyethersulfone)(PES))、聚丙烯酸(polyacrylics)、聚縮醛、聚苯并唑(polybenzoxazole)(例如聚苯并噻并啡噻(polybenzothiazinophenothiazine)、聚苯并噻唑(polybenzothiazole))、聚二唑(polyoxadiazole)、聚吡并喹啉(polypyrazinoquinoxaline)、聚均苯二甲醯亞胺(polypyromellitimide)、聚喹啉(polyquinoxaline)、聚苯并咪唑(polybenzimidazole)、聚吲哚酮(polyoxindole)、聚氧異吲哚啉(polyoxoisoindoline)(例如聚二氧異吲哚啉(polydioxoisoindoline))、聚三(polytriazine)、聚嗒(polypyridazine)、聚哌(polypiperazine)、聚吡啶(polypyridine)、聚哌啶(polypiperidine)、聚三唑(polytriazole)、聚吡唑(polypyrazole)、聚吡咯啶酮 (polypyrrolidone)、聚碳硼烷(polycarborane)、聚氧雜雙環壬烷(polyoxabicyclononane)、聚二苯并呋喃(polydibenzofuran)、聚酞醯胺(polyphthalamide)、聚縮醛(polyacetal)、聚酐(polyanhydride)、聚乙烯類(polyvinyl)(例如聚乙烯醚(polyvinyl ether)、聚乙烯硫醚(polyvinyl thioether)、聚乙烯醇(polyvinyl alcohol)、聚乙烯酮(polyvinyl ketone)、聚鹵化乙烯(polyvinyl halide)、聚乙烯腈(polyvinyl nitrile)、聚乙烯酯(polyvinyl ester)、聚氯乙烯)、聚磺酸酯(polysulfonate)、聚硫化物(polysulfide)、聚脲(polyurea)、聚磷腈(polyphosphazene)、聚矽氮烷(polysilazane)、聚矽氧烷、氟聚合物(fluoropolymer)(例如聚氟乙烯(polyvinyl fluouride)(PVF)、聚偏二氟乙烯(polyvinylidene fluoride)(PVDF)、氟化乙烯-丙烯(fluorinated ethylene-propylene)(FEP)、聚乙烯四氟乙烯(polyethylene tetrafluoroethylene)(ETFE))、聚萘二甲酸乙二酯(polyethylene naphthalate)(PEN)、環烯烴共聚物(cyclic olefin copolymer)(COC)、或包含前述中之至少一者的組合。 Possible thermoplastic resins include, but are not limited to, oligomers, polymers, ionomers, dendrimers, copolymers (such as graft copolymers), block copolymers (eg, A star block copolymer, a random copolymer, and the like, or a combination comprising at least one of the foregoing. Examples of such thermoplastic resins include, but are not limited to, polycarbonates (e.g., blends of polycarbonates (such as polycarbonate-polybutadiene blends, copolyester polycarbonate), poly Styrene (such as copolymer of polycarbonate and styrene, polyphenylene ether-polystyrene blend), polyimine (PI) (such as polyether sulfimine (PEI) )), acrylonitrile-styrene-butadiene (ABS), polyalkyl methacrylate (such as polymethyl methacrylate (PMMA)), polyester (such as copolyester, polythioester ( Polythioester)), polyolefins (such as polypropylene (PP) and polyethylene, high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE)), poly Polyethylene terephthalate (PET), polyamine (for example, polyimideimide), polyarylate, polyfluorene (for example, polyarylsulfone) , polysulfonamide, polyphenylene sulfide, polytetrafluoroethy Lene), polyether (such as polyether keton (PEK), polyether etherketone (PEEK), polyethersulfone (PES)), polyacrylics, polyacetal Polyphenylene Polybenzoxazole (eg polybenzoxazole) Phthalocyanine (polybenzothiazinophenothiazine), polybenzothiazole (polybenzothiazole), poly Polyoxadiazole, polypyridyl Quino Polypyrazinoquinoxaline, polypyromellitimide, polyquine Polyquinoxaline, polybenzimidazole, polyoxindole, polyoxoisoindoline (eg polydioxoisoindoline), poly3 (polytriazine) (polypyridazine) (polypiperazine), polypyridine, polypiperidine, polytriazole, polypyrazole, polypyrrolidone, polycarborane, polyoxagen Polyoxabicyclononane, polydibenzofuran, polyphthalamide, polyacetal, polyanhydride, polyvinyl (for example, polyvinyl ether (polyvinyl) Ether), polyvinyl thioether, polyvinyl alcohol, polyvinyl ketone, polyvinyl halide, polyvinyl nitrile, polyvinyl ester ), polyvinyl chloride), polysulfonate, polysulfide, polyurea, polyphosphazene, polysilazane, polyoxyalkylene, fluorine polymerization Fluoropolymer (such as polyvinyl fluouride (PVF), polyvinylidene fluoride (PVDF), fluorinated ethylene-propylene (FEP), polyethylene tetrafluoroethylene (p Olyethylene tetrafluoroethylene) (ETFE)), polyethylene naphthalate (PEN), cyclic olefin copolymer (COC), or a combination comprising at least one of the foregoing.

更具體地,熱塑性樹脂可包括但不限於聚碳酸酯樹脂(例如在市場上取自SABIC’s Innovative Plastics business的LEXANTM樹脂,包括LEXANTM CFR樹脂)、聚伸苯醚-聚苯乙烯樹脂(例如在市場上取自SABIC’s Innovative Plastics business的NORYLTM樹脂)、聚醚醯 亞胺樹脂(例如在市場上取自SABIC’s Innovative Plastics business的ULTEMTM樹脂)、聚對酞酸丁二酯-聚碳酸酯(polybutylene terephthalate-polycarbonate)樹脂(例如在市場上取自SABIC’s Innovative Plastics business的XENOYTM樹脂)、共聚酯碳酸酯樹脂(例如在市場上取自SABIC’s Innovative Plastics business的LEXANTM SLX樹脂)、或包含前述樹脂中之至少一者的組合。又更具體地,熱塑性樹脂可包括但不限於聚碳酸酯、聚酯、聚丙烯酸酯、聚醯胺、聚醚醯亞胺、聚伸苯醚、或包含前述樹脂中之至少一者的組合之均聚物和共聚物。聚碳酸酯可包括聚碳酸酯之共聚物(例如聚碳酸酯-聚矽氧烷,諸如聚碳酸酯-聚矽氧烷嵌段共聚物、聚碳酸酯-二甲基雙酚環己烷(dimethyl bisphenol cyclohexane)(DMBPC)聚碳酸酯共聚物(例如在市場上取自SABIC’s Innovative Plastics business的LEXANTM DMX和LEXANTM XHT樹脂)、聚碳酸酯-聚酯共聚物(例如在市場上取自SABIC’s Innovative Plastics business的XYLEXTM樹脂))、直鏈聚碳酸酯(linear polycarbonate)、支鏈聚碳酸酯(branched polycarbonate)、封端之聚碳酸酯(end-capped polycarbonate)(例如經腈封端之聚碳酸酯(nitrile end-capped polycarbonate))、或包含前述中之至少一者的組合,例如支鏈與直鏈聚碳酸酯的組合。 More specifically, the thermoplastic resin may include without limitation polycarbonate resin (e.g. from SABIC's Innovative Plastics business in the market LEXAN TM resins, resins including LEXAN TM CFR), poly phenylene oxide stretch - polystyrene resin (e.g. from SABIC's Innovative Plastics business market the resin NORYL TM), polyetherimide resins (e.g., ULTEM TM resin from SABIC's Innovative Plastics business in the market), polyethylene terephthalate, polybutylene terephthalate - polycarbonate (polybutylene terephthalate-polycarbonate) resin (e.g., from the market XENOY TM resin of SABIC's Innovative Plastics business), copolyestercarbonate resins (e.g. from SABIC's Innovative Plastics business of LEXAN TM SLX resins on the market), or the resin comprising a combination of at least one of them. Still more particularly, the thermoplastic resin may include, but is not limited to, polycarbonate, polyester, polyacrylate, polyamine, polyetherimide, polyphenylene oxide, or a combination comprising at least one of the foregoing resins. Homopolymers and copolymers. The polycarbonate may comprise a copolymer of polycarbonate (for example polycarbonate-polyoxyalkylene, such as polycarbonate-polyoxyalkylene block copolymer, polycarbonate-dimethylbisphenol cyclohexane (dimethyl) bisphenol cyclohexane) (DMBPC) polycarbonate copolymers (e.g. from SABIC's Innovative Plastics business in the market and LEXAN TM DMX LEXAN TM XHT resin), a polycarbonate - polyester copolymers (e.g. from SABIC's Innovative in the market the resin Plastics business XYLEX TM)), linear polycarbonate (linear polycarbonate), a branched polycarbonate (branched polycarbonate), the polycarbonate capped (end-capped polycarbonate) (e.g. via the nitrile-terminated polycarbonate A nitrile end-capped polycarbonate, or a combination comprising at least one of the foregoing, such as a combination of a branched chain and a linear polycarbonate.

如本文所使用的〝聚碳酸酯〞意指具有重複之下式的結構碳酸酯單元之聚合物或共聚物 As used herein, fluorene polycarbonate 〞 means a polymer or copolymer having structural carbonate units of the formula:

其中R1基團總數量的至少60%為芳族,或各R1含有至少一個C6-30芳族基團。聚碳酸酯及彼之製造方法為本領域中已知,其說明於例如WO 2013/175448 A1、US 2014/0295363和WO 2014/072923中。聚碳酸酯通常係自雙酚化合物製得,諸如2,2-雙(4-羥苯基)丙烷(〝雙酚-A〞或〝BPA〞),亦可使用3,3-雙(4-羥苯基)苄甲內醯胺(3,3-bis(4-hydroxyphenyl)phthalimidine)、1,1-雙(4-羥基-3-甲基苯基)環己烷、或1,1-雙(4-羥基-3-甲基苯基)-3,3,5-三甲基環己烷、或包含前述雙酚化合物中之至少一者的組合。在一具體的實施態樣中,聚碳酸酯為衍生自BPA之均聚物、衍生自BPA與另一雙酚或二羥基芳族化合物(諸如間苯二酚)之共聚物、或衍生自BPA與隨意的另一雙酚或二羥基芳族化合物之共聚物,且另外包含非碳酸酯單元,例如芳族酯單元(諸如間苯二酚對酞酸酯(terephthalate)或異酞酸酯(isophthalate))、以C6-20脂族二酸(aliphatic diacid)為底質之芳族-脂族酯單元(aromatic-aliphatic ester unit)、聚矽氧烷單元(諸如聚二甲基矽氧烷單元)、或包含前述中之至少一者的組合。 Wherein at least 60% of the total number of R 1 groups is aromatic, or each R 1 contains at least one C 6-30 aromatic group. The polycarbonates and their methods of manufacture are known in the art and are described, for example, in WO 2013/175448 A1, US 2014/0295363 and WO 2014/072923. Polycarbonates are usually prepared from bisphenol compounds, such as 2,2-bis(4-hydroxyphenyl)propane (〝 bisphenol-A 〞 or 〝BPA 〞), and 3,3-bis (4- 3,3-bis(4-hydroxyphenyl)phthalimidine, 1,1-bis(4-hydroxy-3-methylphenyl)cyclohexane, or 1,1-double (4-Hydroxy-3-methylphenyl)-3,3,5-trimethylcyclohexane, or a combination comprising at least one of the foregoing bisphenol compounds. In a specific embodiment, the polycarbonate is a homopolymer derived from BPA, a copolymer derived from BPA with another bisphenol or a dihydroxy aromatic compound such as resorcinol, or derived from BPA. Copolymer with optionally another bisphenol or dihydroxy aromatic compound, and additionally comprising non-carbonate units, such as aromatic ester units (such as resorcinol terephthalate or isophthalate) )), an aromatic-aliphatic ester unit with a C 6-20 aliphatic diacid as a substrate, a polyoxyalkylene unit (such as a polydimethyl siloxane unit) Or a combination comprising at least one of the foregoing.

導電片、膜或基板之聚合物或在製造導電片、膜或基板(例如基板、底漆組成物塗層及隨意的基板塗層)所使用之聚合物可包括慣常併入此類聚合物組成物中的各種添加劑,先決條件為添加劑經選擇而對聚合物組 成物之所欲性質沒有顯著不利的影響。此等添加劑可在混合用於形成組成物之組份期間於適合的時間混合。示例性添加劑包括填充劑、強化劑(reinforcing agent)、抗氧化劑、熱穩定劑、光穩定劑、紫外(UV)光穩定劑、可塑劑(plasticizer)、潤滑劑、脫模劑(mold release agent)、抗靜電劑、著色劑(諸如二氧化鈦、碳黑和有機染料)、表面效應添加劑(surface effect additive)、輻射穩定劑(radiation stabilizer)、阻燃劑和防滴劑(anti-drip agent)。可使用添加劑的組合,例如熱穩定劑、脫模劑與紫外光穩定劑的組合。添加劑(除了任何衝擊改質劑(impact modifier)、填充劑或強化劑以外)的總量,以組成物總重量為基準計,通常為0.01至5重量%。 Polymers of conductive sheets, films or substrates or polymers used in the manufacture of conductive sheets, films or substrates (eg, substrates, primer composition coatings, and random substrate coatings) may include conventionally incorporated into such polymer compositions. The various additives in the formulation, with the proviso that the additives are selected, have no significant adverse effect on the desired properties of the polymer composition. These additives may be mixed at a suitable time during mixing to form the components of the composition. Exemplary additives include fillers, reinforcing agents, antioxidants, heat stabilizers, light stabilizers, ultraviolet (UV) light stabilizers, plasticizers, lubricants, mold release agents Antistatic agents, colorants (such as titanium dioxide, carbon black, and organic dyes), surface effect additives, radiation stabilizers, flame retardants, and anti-drip agents. Combinations of additives can be used, such as heat stabilizers, combinations of mold release agents and ultraviolet light stabilizers. The total amount of the additive (other than any impact modifier, filler or reinforcing agent) is usually from 0.01 to 5% by weight based on the total weight of the composition.

基板可包括聚碳酸酯。基板可包括聚(甲基丙烯酸甲酯)(PMMA)。基板可包括經共擠壓(coextruded)之聚碳酸酯及聚(甲基丙烯酸甲酯)(PMMA)。基板可包括經共擠壓之聚碳酸酯及聚(甲基丙烯酸甲酯)(PMMA),其中基板的第一表面係由聚碳酸酯所組成及基板的第二表面係由PMMA所組成。基板可包括聚乙烯。基板可包括玻璃。基板可包括聚碳酸酯、聚(甲基丙烯酸甲酯)(PMMA)、聚乙烯、玻璃、或包含前述中之至少一者的組合。底漆組成物塗料可施加至包含聚碳酸酯之基板的表面。底漆組成物塗料可施加至由聚碳酸酯所組成之基板的表面。底漆組成物塗料可配置在導電塗層與包含聚碳酸酯之基板的表面之間。底漆組成物塗料可配置在導電塗層與 由聚碳酸酯所組成之基板的表面之間。 The substrate can include polycarbonate. The substrate may comprise poly(methyl methacrylate) (PMMA). The substrate may comprise coextruded polycarbonate and poly(methyl methacrylate) (PMMA). The substrate may comprise coextruded polycarbonate and poly(methyl methacrylate) (PMMA), wherein the first surface of the substrate is comprised of polycarbonate and the second surface of the substrate is comprised of PMMA. The substrate can include polyethylene. The substrate can include glass. The substrate can comprise polycarbonate, poly(methyl methacrylate) (PMMA), polyethylene, glass, or a combination comprising at least one of the foregoing. The primer composition coating can be applied to the surface of the substrate comprising polycarbonate. The primer composition coating can be applied to the surface of a substrate composed of polycarbonate. The primer composition coating can be disposed between the conductive coating and the surface of the substrate comprising the polycarbonate. The primer composition coating can be disposed between the conductive coating and the surface of the substrate comprised of polycarbonate.

實施例  Example  

測試本文所揭示之底漆組成物的許多組份之反應性。表1列示反應性調配物及在ARC UV燈(ARC UV lamp)下進行的試驗,而表3列示反應性調配物及在Fusion H bomb UV下進行的試驗。表2列示ARC UV燈性質。在表1中,P意指合格且意指在以手指碰觸時的無黏性表面(non-tacky surface),F意指不合格的樣品且在以手指碰觸時的黏性表面,G意指良好的反應性,VP意指非常差且無反應性。在該等實施例中,使用70%單體/寡聚物混合物加上30% HDDA及4%光引發劑製得樣品。使用棒塗法(bar coating)將底漆組成物塗料置於聚碳酸酯膜上。底漆組成物塗料具有約4μm厚度。將膜立即固化且接著測試黏性/無黏性表面。固化時間係取決於線速(line speed)(例如線速較高,則有較短的UV固化時間,而較慢的線速則反之)。在表1和3中所列示之材料已於本文先前說明了且為市場上可取得的組份。 The reactivity of the many components of the primer composition disclosed herein was tested. Table 1 lists the reactive formulations and tests conducted under an ARC UV lamp, while Table 3 lists the reactive formulations and tests conducted under Fusion H bomb UV. Table 2 lists the ARC UV lamp properties. In Table 1, P means qualified and means a non-tacky surface when touched with a finger, F means a sample that is unacceptable and a sticky surface when touched with a finger, G Means good reactivity, VP means very poor and non-reactive. In these examples, samples were prepared using a 70% monomer/oligomer mixture plus 30% HDDA and 4% photoinitiator. The primer composition coating was placed on the polycarbonate film using a bar coating. The primer composition coating has a thickness of about 4 μm. The film was immediately cured and then tested for a tacky/non-stick surface. The cure time is dependent on the line speed (eg, a higher line speed, a shorter UV cure time, while a slower line speed is the opposite). The materials listed in Tables 1 and 3 have been previously described herein and are commercially available components.

可如表1中所見,實施例編號1、2、4、5、8、10和11全部皆證明良好的反應性。在表3中,相同的實施例編號證明少於40%之可接受的抗刮擦性質(anti-scratch property)。 As can be seen in Table 1, all of Example Nos. 1, 2, 4, 5, 8, 10 and 11 demonstrated good reactivity. In Table 3, the same example numbers demonstrate less than 40% acceptable anti-scratch properties.

下列的實施例關於以底漆塗料施加至基板。在底漆塗層與聚碳酸酯基板層之間的黏著性可為底漆塗層膨脹(swelling)(或擴散(diffusion))至聚碳酸酯層中的作用(function),其中,擴散係促進在底漆層固化時之底漆塗層的鏈纏結錨固(chain entanglement anchorage)至聚碳酸酯層。然而,太多的底漆塗料擴散至基板會導致霧度增加,表示來自於底漆塗層中的溶劑或單體過度膨脹。 The following examples relate to the application of a primer coating to a substrate. The adhesion between the primer coating and the polycarbonate substrate layer can be a function of the swelling (or diffusion) of the primer coating into the polycarbonate layer, wherein the diffusion system promotes A chain entanglement anchorage of the primer coating to the polycarbonate layer as the primer layer cures. However, too much primer coating diffusing to the substrate can result in increased haze, indicating excessive expansion of the solvent or monomer from the primer coating.

另外,留在底漆層中的溶劑會導致底漆層的缺陷。例如,使用溶劑穿透(solvent penetration)描述溶劑通過底漆層擴散至聚碳酸酯膜的效應,其導致霧度增加。具言之,在UV固化點的經乾燥之底漆塗層中殘餘的溶劑可造成底漆塗層中的多孔性(porosity)或溶劑泡(solvent popping),其可降低底漆層對在後續施加的導電層乳液組(conductive layer emulsion package)中遭遇之甲苯的耐化學性。 In addition, the solvent remaining in the primer layer causes defects in the primer layer. For example, solvent penetration is used to describe the effect of solvent diffusion through the primer layer to the polycarbonate film, which results in increased haze. In other words, the residual solvent in the dried primer coating at the UV cure point can cause porosity or solvent popping in the primer coating, which can reduce the primer layer on subsequent The chemical resistance of toluene encountered in the applied conductive layer emulsion package.

為了減少保留在底漆塗層中的溶劑量,可使用更快蒸發的溶劑組,諸如那些由乙酸乙酯及乙酸異丁酯(70:30至80:20之體積比)所組成者。增加塗料厚度亦增加溶劑進入聚碳酸酯層的擴散時間。另外,可使溶劑在到達聚碳酸酯膜表面之前於乾燥過程中蒸發。減少保留的溶劑量之其他方法為在施加底漆塗料至基板期間使用較慢的線速,以便增加在UV處理之前於乾燥器中的停留時間,其中較長的停留時間有助於進一步的溶劑蒸發。表4至7說明不同的塗佈速度及老化時間的實施例。 To reduce the amount of solvent remaining in the primer coating, a faster evaporating solvent set can be used, such as those consisting of ethyl acetate and isobutyl acetate (70:30 to 80:20 by volume). Increasing the thickness of the coating also increases the diffusion time of the solvent into the polycarbonate layer. Alternatively, the solvent can be allowed to evaporate during the drying process before it reaches the surface of the polycarbonate film. Another method of reducing the amount of solvent retained is to use a slower line speed during application of the primer coating to the substrate in order to increase the residence time in the dryer prior to UV treatment, wherein a longer residence time contributes to further solvent evaporation. Tables 4 through 7 illustrate examples of different coating speeds and aging times.

具言之,表4至7說明施加底漆塗料至基板的各種實施例。在所有實施例中所使用的底漆塗料稱為PCC-1,包括脂族胺甲酸乙酯二甲基丙烯酸酯(aliphatic urethane dimethacrylate)、單官能性甲氧基化PEG丙烯酸酯單體(monofunctional methoxylated PEG acrylate monomer)、乙氧基化三羥甲丙烷三丙烯酸酯(ethoxylated trimethylolpropane triacrylate)、單體(M320和M286是什麼樣的單體?)、酸官能性矽烷(acid functional silane)、經聚醚改質之丙烯酸官能性聚二甲基矽氧化物(polyether modified acryl functional polydimethylsiloxide)之聚矽氧表面添加劑(silicone surface additive)、黏著促進劑、光引發劑及乙醇。為了達成2微米(μm)厚度的底漆塗料,則施加6μm厚度的濕底漆塗料組成物。將底漆塗料塗佈在178μm(0.178mm)聚碳酸酯基板(例如LEXANTM 8010)上。將底漆塗料使用Arc燈(1300mW,具260mJ)以2、4和6m/min塗佈。使所得膜經受25公斤達24和48小時的穩定性。 In other words, Tables 4 through 7 illustrate various embodiments of applying a primer coating to a substrate. The primer coating used in all the examples is called PCC-1, including aliphatic urethane dimethacrylate, monofunctional methoxy acrylate monomer. PEG acrylate monomer), ethoxylated trimethylolpropane triacrylate, monomer (What kind of monomer is M320 and M286?), acid functional silane, polyether A modified polyether modified acryl functional polydimethylsiloxide, a silicone surface additive, an adhesion promoter, a photoinitiator, and ethanol. In order to achieve a primer coating of 2 micrometers (μm) thickness, a wet primer coating composition having a thickness of 6 μm was applied. The primer coating was applied to 178μm (0.178mm) polycarbonate substrate (e.g., LEXAN TM 8010) on. The primer coating was applied at 2, 4 and 6 m/min using an Arc lamp (1300 mW with 260 mJ). The resulting film was subjected to 25 kg for 24 and 48 hours of stability.

接著將導電塗層施加至經固化之底漆層且隨後熱固化。所使用的導電塗層係於市場上取自CIMA(SANTETM),其使用自對準奈米技術(self-aligning nano-technology)在基板上獲得銀網(silver network)。SANTETM之透射率百分比為81.9%,霧度百分比為4.27,及電阻為47.1ΩA conductive coating is then applied to the cured primer layer and then thermally cured. Based conductive coating is used in the market from CIMA (SANTE TM), which is obtained from the use of silver (silver network) technology to Zhunnai Mi (self-aligning nano-technology) on the substrate. SANTE TM Percentage transmittance of 81.9%, was 4.27 percent haze, and resistance was 47.1 Ω.

在下列的實施例中,霧度係根據ASTM D1003 程序A使用CIE標準光源C利用Haze-Gard試驗裝置測試。在導電膜伸長百分比(elongation percentage)與表面電阻率(surface resistivity)之間的關係係以動態機械分析(Dynamic Mechanical Analysis)(DMA)方法特徵化。將導電膜切成5mm x 30mm樣品,接著固定在DMA儀器(TA Q800)的支架上。接著將溫度增加至130℃,接著將膜在特定的施力下拉伸且在特定的拉伸後測量表面電阻(R)。 In the following examples, haze was tested according to ASTM D1003 Procedure A using a CIE standard source C using a Haze-Gard test apparatus. The relationship between the elongation percentage and the surface resistivity of the conductive film is characterized by a Dynamic Mechanical Analysis (DMA) method. The conductive film was cut into 5 mm x 30 mm samples and then fixed on a holder of a DMA instrument (TA Q800). The temperature was then increased to 130 ° C, then the film was stretched under a specific applied force and the surface resistance (R) was measured after a specific stretching.

在表4至7中〝T%〞係指透射率百分比(percent transmittance),〝H%〞係指霧度百分比(percent haze),及〝R〞係指表面電阻。在表7中的〝OL〞係指超載(overload)(亦即無限電阻(infinite resistance),意指比儀表可測量的量更大,其中儀表通常測量至多1,000Ω/sq.)。圖係指對每一塗佈速度、每一流逝時間的照片集。例如,圖4A至4C對應於0分鐘的流逝時間,其中圖4A對應於2m/min之塗佈速度,圖4B對應於4m/min之塗佈速度,及圖4C對應於6m/min之塗佈速度。同樣地,例如圖5A至5C對應於在140℃下1分鐘的流逝時間,其中圖5A對應於2m/min之塗佈速度,圖5B對應於4m/min之塗佈速度,及圖5C對應於6m/min之塗佈速度。流逝之時間(time elapsed)表示在樣品以導電塗層塗佈及隨後經受透射率、霧度及電阻測試之前經過的時間量。 In Tables 4 to 7, 〝T% 〞 refers to percent transmittance, 〝H% 〞 refers to percent haze, and 〝R 〞 refers to surface resistance. The 〝OL〞 in Table 7 refers to the overload (that is, the infinite resistance, which means that the amount can be measured more than the meter, where the meter usually measures up to 1,000 Ω / sq.). The figure refers to a collection of photos for each coating speed, each elapsed time. For example, FIGS. 4A to 4C correspond to an elapsed time of 0 minutes, wherein FIG. 4A corresponds to a coating speed of 2 m/min, FIG. 4B corresponds to a coating speed of 4 m/min, and FIG. 4C corresponds to a coating of 6 m/min. speed. Similarly, for example, FIGS. 5A to 5C correspond to an elapsed time of 1 minute at 140 ° C, wherein FIG. 5A corresponds to a coating speed of 2 m/min, FIG. 5B corresponds to a coating speed of 4 m/min, and FIG. 5C corresponds to Coating speed of 6 m/min. The time elapsed represents the amount of time that elapses before the sample is coated with a conductive coating and subsequently subjected to transmission, haze and resistance tests.

如表4中所示,固化速度增加,胞元(cell)更大及膜性能改進。例如,以4及6m/min固化底漆調配物得到可接受的透射率及電阻值。2m/min之固化速度得到 穩定的底漆調配物,但是小的胞元(cell)尺寸及較不優的光學件。然而,如表5至7中所示,大於8m/min之固化時間導致溶劑穿透過底漆及增加霧度。 As shown in Table 4, the curing speed was increased, the cells were larger, and the film properties were improved. For example, curing the primer formulation at 4 and 6 m/min gives acceptable transmission and resistance values. A cure rate of 2 m/min resulted in a stable primer formulation, but a small cell size and less preferred optics. However, as shown in Tables 5 to 7, a curing time of more than 8 m/min caused the solvent to penetrate the primer and increase the haze.

例如藉由比較圖4B、5B和6B可看出底漆係隨時間而改變,且當輻射密度降低時,則胞元尺寸(cell size)增加。因為胞元尺寸在壓力下於24小時內改變,所以推斷出溶劑不是唯一負責底漆的穩定性。再者,如表7中所示,以8mps固化不是最優的,由於沒有黏著性且沒有可測量的片電阻的結果。 It can be seen, for example, by comparing Figures 4B, 5B, and 6B that the primer system changes over time, and as the radiation density decreases, the cell size increases. Since the cell size changes within 24 hours under pressure, it is concluded that the solvent is not the only one responsible for the stability of the primer. Again, as shown in Table 7, curing at 8 mps was not optimal, as there was no adhesion and no measurable sheet resistance results.

表8至13的下列實施例之導電片或膜係藉由施加12微米溼的底漆塗料PCC-1(得到2或4微米的乾厚度)至具有保護性塗料(亦即底漆)的0.178mm聚碳酸酯基板而製得。施加12微米溼的底漆塗料得到4微米的乾厚度。將具有底漆塗料之基板在60℃之溫度的乾燥烘箱中經受60秒持續時間的乾燥,然後使樣品進入UV處理器以固化。底漆塗料係以H-bulb固化,但是是於各種峰值輻照度下及使用微波UV(具有2000-2200mW之峰值輻照度的高強度光)處理器或Arc燈(具有600mW強度)UV處理器,如表中所示。當使用Arc燈時,可要求在惰性環境中施加底漆塗料。UV處理器的設定係根據毫焦耳及毫瓦特(mJ/mW)且在UV暴露前在50℃至60℃下進行60秒閃蒸(flash)。在樣品已用UV處理以加速經固化之底漆老化之後,將所有樣品在120至140℃下經1分鐘固化。 The conductive sheets or films of the following examples of Tables 8 to 13 were applied by applying a 12 micron wet primer coating PCC-1 (to give a dry thickness of 2 or 4 microns) to a 0.178 with a protective coating (ie, a primer). Manufactured from a polycarbonate substrate. A 12 micron wet primer coating was applied to give a dry thickness of 4 microns. The substrate with the primer coating was subjected to a drying in a drying oven at a temperature of 60 ° C for a duration of 60 seconds, and then the sample was passed to a UV processor for curing. Primer coatings are cured with H-bulb, but at various peak irradiances and using microwave UV (high intensity light with a peak irradiance of 2000-2200 mW) processor or Arc lamp (with 600 mW intensity) UV processor. As shown in the table. When using an Arc lamp, it may be desirable to apply a primer coating in an inert environment. The settings for the UV processor were based on millijoules and milliwatts (mJ/mW) and a 60 second flash at 50 °C to 60 °C prior to UV exposure. After the samples had been treated with UV to accelerate the aging of the cured primer, all samples were cured at 120 to 140 ° C for 1 minute.

接著將導電塗層以25μm厚度施加至底漆層 且隨後熱固化。所使用的導電塗層係在市場上取自CIMA(SANTETM),其使用自對準奈米技術在基板上獲得銀網。SANTETM之透射率百分比為81.9%,霧度百分比為4.27,及電阻為47.1ΩThe conductive coating was then applied to the primer layer at a thickness of 25 μm and then thermally cured. Based conductive coating is used in the market from CIMA (SANTE TM), which is obtained from the use of silver for Zhunnai Mi technology on the substrate. SANTE TM Percentage transmittance of 81.9%, was 4.27 percent haze, and resistance was 47.1 Ω.

圖案形成係在60℃至70℃下進行1分鐘且接著在120-140℃下燒結1分鐘。燒結可助於降低導電塗層的表面電阻。所得樣品的照片可參見圖11A至52B。尋找具有更高的LT及更低的霧度之條件。流逝之時間表示在導電塗層施加至底漆且所得導電膜經受透射率、霧度及電阻測試之前經過的時間量。 The pattern formation was carried out at 60 ° C to 70 ° C for 1 minute and then at 120-140 ° C for 1 minute. Sintering can help reduce the surface resistance of the conductive coating. A photograph of the obtained sample can be seen in Figures 11A to 52B. Look for conditions with higher LT and lower haze. The elapsed time represents the amount of time that elapses before the conductive coating is applied to the primer and the resulting conductive film is subjected to transmittance, haze, and resistance tests.

如表8至9中所示,可接受的導電膜係以低峰值輻照度燈以惰性環境(氮氣)及較高的塗料厚度獲得。例如,在惰性環境中所製造之導電膜具有比在空氣環境中所製造之導電膜更大的透射率百分比。再者,在惰性環境中所製造之膜的霧度明顯比那些在空氣環境中所形成之膜的霧度更低。另外,比較在表8中使用2μm之底漆塗料的實施例與在表9中使用4μm之底漆塗料的實施例,併入較厚的底漆塗料之導電膜得到改進之透射率百分比、霧度及電阻。 As shown in Tables 8 through 9, acceptable conductive films were obtained with a low peak irradiance lamp in an inert environment (nitrogen) and a higher coating thickness. For example, a conductive film fabricated in an inert environment has a greater percentage of transmittance than a conductive film fabricated in an air environment. Furthermore, the haze of films produced in an inert environment is significantly lower than that of those formed in an air environment. In addition, comparing the examples in which the 2 μm primer coating was used in Table 8 and the 4 μm primer coating in Table 9, the conductive film incorporating the thicker primer coating improved the transmittance percentage, fog. Degree and resistance.

與說明在惰性環境中固化之具有較厚的底漆塗料(4μm)之導電膜產生較高品質之導電膜的表8至9對照,表10至11說明使用較高動力微波UV燈暴露即使於空氣環境中固化較薄的底漆塗層(2μm)是可接受的。然而,較厚的(4μm)底漆塗層導致耐溶劑性(solvent resistance)增加。有利地,在表11中於空氣氛圍中固化之膜實施例隨時間穩定,其得到更經濟的導電膜,因為在惰性環境中固化顯然更昂貴。 Tables 8 to 9 show that a conductive film having a thicker primer coating (4 μm) cured in an inert environment produces a higher quality conductive film, and Tables 10 to 11 illustrate the use of a higher power microwave UV lamp to expose even A thinner primer coating (2 μm) is acceptable in an air environment. However, a thicker (4 [mu]m) primer coating resulted in an increase in solvent resistance. Advantageously, the film embodiments cured in an air atmosphere in Table 11 are stable over time, which results in a more economical conductive film because curing in an inert environment is significantly more expensive.

表12至13說明進一步增加峰值輻照度值的效應。當暴露時間增加時,膜溫度增加,其導致氧增加, 其導致有害的表面固化。然而,在表13中於惰性固化下的樣品得到最優的膜。 Tables 12 to 13 illustrate the effect of further increasing the peak irradiance value. As the exposure time increases, the film temperature increases, which results in an increase in oxygen which results in detrimental surface cure. However, the samples under inert curing in Table 13 gave the best film.

經觀察微波UV處理器得到比Arc燈UV處理器更好的結果,其中兩種系統使用H-bulb燈。不想受到理論的束縛,思量由Arc燈UV處理器所產生之IR能量的量可由於在UV暴露期間的潛蒸發(latent evaporation)而造成底漆塗料中的缺陷。 It was observed that the microwave UV processor gave better results than the Arc lamp UV processor, two of which used H-bulb lamps. Without wishing to be bound by theory, it is contemplated that the amount of IR energy produced by the Arc lamp UV processor can cause defects in the primer coating due to latent evaporation during UV exposure.

惰性固化條件得到比在相同的暴露及峰值輻照度水平下以空氣固化之樣品更高程度的穩定性、更低的霧度。然而,結果證明在RK塗佈器微波燈(RK coater microwave lamp)的暴露及峰值輻照度下固化之4微米塗料厚度得到最穩定的空氣固化條件,具有可接受的光學性質。 Inert curing conditions result in a higher degree of stability, lower haze than air cured samples at the same exposure and peak irradiance levels. However, the results demonstrate that the 4 micron coating thickness cured under exposure to RK coater microwave lamp and peak irradiance results in the most stable air cure conditions with acceptable optical properties.

可接受的導電膜通常具有大於75%,大於80%,大於85%,大於86%,或大於90%之透射率百分比(percent transmission);小於60歐姆/平方公分,例如小於55歐姆/平方公分,或50歐姆/平方公分之電阻;及小於5%,小於4%,小於3.5%,或小於3%之霧度百分比(percent haze)。 An acceptable conductive film typically has a transmittance of greater than 75%, greater than 80%, greater than 85%, greater than 86%, or greater than 90%; less than 60 ohms/cm 2 , such as less than 55 ohms per square centimeter , or a resistance of 50 ohms/cm 2 ; and a percentage haze of less than 5%, less than 4%, less than 3.5%, or less than 3%.

其中,圖18B為可接受的最優圖案之實施例。如以圖25A至31A和25B至31B,以及相符的表10中的透射率、霧度及電阻隨時間的值可觀察到,本發明的導電膜隨時間為穩定的。因此,黏附於基板的底漆塗層不必需立即以導電層塗佈。 Among them, FIG. 18B is an embodiment of an acceptable optimal pattern. As can be seen from the values of transmittance, haze and resistance with time in FIGS. 25A to 31A and 25B to 31B, and in accordance with Table 10, the electroconductive film of the present invention is stable over time. Therefore, the primer coating adhered to the substrate does not have to be coated immediately with the conductive layer.

除非在本文另有其他指定,否則任何述及之標準、測試方法及類似者(諸如ASTM D1003、ASTM D3359、ASTM D3363)係指在本案申請時為有效的標準或方法。 Unless otherwise specified herein, any reference to standards, test methods, and the like (such as ASTM D1003, ASTM D3359, ASTM D3363) refer to standards or methods that are effective at the time of this application.

所揭示之組成物及製造方法包括至少下列的實施態樣: The disclosed compositions and methods of manufacture include at least the following embodiments:

實施態樣1:用於導電奈米粒子分散物之底漆組成物,其包含:多官能性丙烯酸酯寡聚物;及丙烯酸酯單體;及光引發劑;及溶劑;其中底漆組成物包括總重量,其中總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中總重量之15%至20%包含丙烯酸酯單體,其中總重量之1.5%至6%包含光引發劑;及其中總重量之50%至78%包含溶劑。 Embodiment 1: a primer composition for a conductive nanoparticle dispersion, comprising: a polyfunctional acrylate oligomer; and an acrylate monomer; and a photoinitiator; and a solvent; wherein the primer composition Including the total weight, wherein 5% to 20% of the total weight comprises a polyfunctional acrylate oligomer, wherein 15% to 20% by weight of the total weight comprises acrylate monomers, wherein 1.5% to 6% of the total weight comprises photoinitiation 50% to 78% of the total weight of the agent; and the solvent thereof.

實施態樣2:實施態樣1之底漆組成物,其另外包含表面添加劑。 Embodiment 2: A primer composition of Embodiment 1, which additionally comprises a surface additive.

實施態樣3:實施態樣1至2中任一者之底漆組成物,其中多官能性丙烯酸酯寡聚物包括脂族胺甲酸乙酯丙烯酸酯寡聚物、新戊四醇四丙烯酸酯、脂族胺甲酸乙酯丙烯酸酯、丙烯酸酯、二新戊四醇六丙烯酸酯、丙烯酸酯化樹脂、三羥甲丙烷三丙烯酸酯(TMPTA)、二新戊四醇五丙烯酸酯、或包含前述中之至少一者的組合。 Embodiment 3: The primer composition of any one of Embodiments 1 to 2, wherein the polyfunctional acrylate oligomer comprises an aliphatic urethane acrylate oligomer, neopentyl alcohol tetraacrylate , an aliphatic urethane acrylate, an acrylate, dipentaerythritol hexaacrylate, an acrylated resin, trimethylolpropane triacrylate (TMPTA), dipentaerythritol pentaacrylate, or the like a combination of at least one of them.

實施態樣4:實施態樣1至3中任一者之底漆組成物,其中多官能性丙烯酸酯寡聚物包括脂族胺甲酸乙酯丙烯酸酯寡聚物及新戊四醇四丙烯酸酯,其中多官能性 丙烯酸酯寡聚物包括多官能性丙烯酸酯寡聚物重量,其中多官能性丙烯酸酯寡聚物重量之30%至50%包含脂族胺甲酸乙酯丙烯酸酯寡聚物,及其中多官能性丙烯酸酯寡聚物重量之50%至70%包含新戊四醇四丙烯酸酯。 Embodiment 4: The primer composition of any one of Embodiments 1 to 3, wherein the polyfunctional acrylate oligomer comprises an aliphatic urethane acrylate oligomer and neopentyl alcohol tetraacrylate Wherein the polyfunctional acrylate oligomer comprises a polyfunctional acrylate oligomer weight, wherein from 30% to 50% by weight of the polyfunctional acrylate oligomer comprises an aliphatic urethane acrylate oligomer, 50% to 70% by weight of the polyfunctional acrylate oligomer therein and neopentyl alcohol tetraacrylate.

實施態樣5:實施態樣1至4中任一者之底漆組成物,其中多官能性丙烯酸酯寡聚物包括丙烯酸酯化樹脂。 Embodiment 5: The primer composition of any of Embodiments 1 to 4, wherein the polyfunctional acrylate oligomer comprises an acrylated resin.

實施態樣6:實施態樣1至5中任一者之底漆組成物,其中光引發劑包括α-羥酮光引發劑、雙醯膦、二苯基酮光引發劑、或包含前述中之至少一者的組合。 Embodiment 6: The primer composition of any of Embodiments 1 to 5, wherein the photoinitiator comprises an α-hydroxyketone photoinitiator, a diphosphonium phosphine, a diphenyl ketone photoinitiator, or a combination of at least one of them.

實施態樣7:實施態樣6之底漆組成物,其中α-羥酮光引發劑為1-羥基-環己基-苯基-酮、二苯基酮、2-羥基-2-甲基-1-苯基-1-丙酮、或包含前述中之至少一者的組合。 Embodiment 7: The primer composition of Embodiment 6, wherein the α-hydroxyketone photoinitiator is 1-hydroxy-cyclohexyl-phenyl-ketone, diphenylketone, 2-hydroxy-2-methyl- 1-Phenyl-1-propanone, or a combination comprising at least one of the foregoing.

實施態樣8:實施態樣6之底漆組成物,其中光引發劑包括膦氧化物(phosphine oxide),苯基雙(2,4,6-三甲基苄醯基)(phosphine oxide,phenyl bis(2,4,6-trimethyl benzoyl))。 Embodiment 8: The primer composition of Embodiment 6 wherein the photoinitiator comprises phosphine oxide, phenylbis(2,4,6-trimethylbenzylidene) (phosphine oxide, phenyl) Bis(2,4,6-trimethyl benzoyl)).

實施態樣9:實施態樣1至8中任一者之底漆組成物,其中丙烯酸酯單體包括單丙烯酸酯、二丙烯酸酯、三丙烯酸酯、或包含前述中之至少一者的組合。 Embodiment 9: The primer composition of any of Embodiments 1 to 8, wherein the acrylate monomer comprises a monoacrylate, a diacrylate, a triacrylate, or a combination comprising at least one of the foregoing.

實施態樣10:實施態樣9之底漆組成物,其中丙烯酸酯單體包括聚乙二醇丙烯酸酯。 Embodiment 10: The primer composition of Embodiment 9, wherein the acrylate monomer comprises polyethylene glycol acrylate.

實施態樣11:實施態樣1至10中任一者之底 漆組成物,其中溶劑包括乙醇、乙酸乙酯、異丙醇、乙酸異丁酯、甲基乙酮(methyl ethyl ketone)、甲基異丁酮(methyl isobutyl ketone)、或包含前述中之至少一者的組合。 Embodiment 11: The primer composition of any of Embodiments 1 to 10, wherein the solvent comprises ethanol, ethyl acetate, isopropanol, isobutyl acetate, methyl ethyl ketone, A A methyl isobutyl ketone, or a combination comprising at least one of the foregoing.

實施態樣12:實施態樣1至11中任一者之底漆組成物,其中組成物具有如根據ASTM D1003程序A使用CIE標準光源C所測量的大於或等於75%之透射率。 Embodiment 12: The primer composition of any of Embodiments 1 to 11, wherein the composition has a transmittance of greater than or equal to 75% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C.

實施態樣13:實施態樣12之底漆組成物,其中透射率為大於或等於86%。 Embodiment 13: A primer composition of Embodiment 12, wherein the transmittance is greater than or equal to 86%.

實施態樣14:實施態樣1至13中任一者之底漆組成物,其中底漆組成物具有如根據ASTM D1003程序A使用CIE標準光源C所測量的小於或等於5%之霧度值。 Embodiment 14: The primer composition of any of Embodiments 1 to 13, wherein the primer composition has a haze value of less than or equal to 5% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C. .

實施態樣15:實施態樣14之底漆組成物,其中霧度為小於或等於3%。 Embodiment 15: The primer composition of Embodiment 14 wherein the haze is less than or equal to 3%.

實施態樣16:實施態樣1至15中任一者之底漆組成物,其中底漆組成物具有小於或等於75ohm/sq之電阻率。 The primer composition of any one of aspects 1 to 15, wherein the primer composition has a resistivity of less than or equal to 75 ohm/sq.

實施態樣17:實施態樣16之底漆組成物,其中電阻率為小於或等於50ohm/sq。 Embodiment 17: The primer composition of Embodiment 16 wherein the resistivity is less than or equal to 50 ohm/sq.

實施態樣18:實施態樣1至17中任一者之底漆組成物,其中底漆組成物可黏附於聚碳酸酯基板,具有如根據ASTM D3359所測量的大於或等於3B之黏著強 度。 Embodiment 18: The primer composition of any of Embodiments 1 to 17, wherein the primer composition is adhered to the polycarbonate substrate having an adhesion strength greater than or equal to 3B as measured according to ASTM D3359.

實施態樣19:實施態樣1至18中任一者之底漆組成物,其中底漆組成物可黏附於聚碳酸酯基板,具有如根據ASTM D3359所測量的大於或等於4B之黏著強度。 Embodiment 19: The primer composition of any of Embodiments 1 to 18, wherein the primer composition is adhered to the polycarbonate substrate having an adhesive strength of greater than or equal to 4B as measured according to ASTM D3359.

實施態樣20:實施態樣1至19中任一者之底漆組成物,其中底漆組成物可黏附於聚碳酸酯基板,具有如根據ASTM D3359所測量的5B之黏著強度。 Embodiment 20: The primer composition of any of Embodiments 1 to 19, wherein the primer composition is adhered to a polycarbonate substrate having an adhesive strength of 5B as measured according to ASTM D3359.

實施態樣20:導電片或膜,其包含:包括第一表面和第二表面的基板;附著於第一表面的實施態樣1至20中任一者之底漆組成物;及與底漆組成物相鄰的導電塗層,其中導電塗層包括以網狀配置之奈米尺寸金屬粒子,且其中導電塗層具有小於或等於0.1Ohm/sq之表面電阻。 Embodiment 20: a conductive sheet or film comprising: a substrate comprising a first surface and a second surface; a primer composition of any one of Embodiments 1 to 20 attached to the first surface; and a primer A conductive coating adjacent to the composition, wherein the conductive coating comprises nano-sized metal particles in a mesh configuration, and wherein the conductive coating has a surface resistance of less than or equal to 0.1 Ohm/sq.

實施態樣21:實施態樣21之導電片或膜,其中基板包括聚碳酸酯、聚(甲基丙烯酸甲酯)(PMMA)、聚乙烯、玻璃、或包含前述中之至少一者的組合。 Embodiment 21: The conductive sheet or film of Embodiment 21, wherein the substrate comprises polycarbonate, poly(methyl methacrylate) (PMMA), polyethylene, glass, or a combination comprising at least one of the foregoing.

實施態樣22:實施態樣21至22中任一者之導電片或膜,其中片或膜具有如根據ASTM D3363使用具有500公斤載重之Mitsubishi Uni鉛筆所測量的大於或等於B之鉛筆硬度。 Embodiment 22: The conductive sheet or film of any one of Embodiments 21 to 22, wherein the sheet or film has a pencil hardness of greater than or equal to B as measured according to ASTM D3363 using a Mitsubishi Uni pencil having a load of 500 kg.

實施態樣23:實施態樣21至23中任一者之導電片或膜,其中片或膜具有如根據ASTM D1003程序A使用CIE標準光源C所測量的小於或等於4%之霧度。 Embodiment 23: The conductive sheet or film of any one of Embodiments 21 to 23, wherein the sheet or film has a haze of less than or equal to 4% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C.

實施態樣24:實施態樣21至24中任一者之導電片或膜,其中片或膜對430THz至790THz頻率之入射光具有如根據ASTM D1003程序A使用CIE標準光源C所測量的大於或等於80%之透射率。 Embodiment 24: The conductive sheet or film of any of Embodiments 21 to 24, wherein the sheet or film has an incident light having a frequency of 430 THz to 790 THz having a greater than or greater than that measured according to ASTM D1003 Procedure A using CIE Standard Light Source C Equal to 80% transmittance.

實施態樣25:在惰性氛圍中固化塗料之方法,其包含:從用於導電奈米粒子組成物的組成物形成底漆塗料,其中該組成物包含多官能性丙烯酸酯寡聚物;丙烯酸酯單體;光引發劑;及溶劑;其中該底漆組成物包括總重量,其中總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中總重量之15%至20%包含丙烯酸酯單體,其中總重量之1.5%至6%包含光引發劑;及其中總重量之50%至78%包含溶劑;施加底漆塗料至基板表面以形成經塗佈之基板;以具有至少1500毫瓦特之峰值輻照度的紫外光燈對底漆塗料施加照射;以及固化該塗料。 Embodiment 25: A method of curing a coating in an inert atmosphere, comprising: forming a primer coating from a composition for a conductive nanoparticle composition, wherein the composition comprises a polyfunctional acrylate oligomer; an acrylate a monomer; a photoinitiator; and a solvent; wherein the primer composition comprises a total weight, wherein 5% to 20% by weight of the total weight comprises a polyfunctional acrylate oligomer, wherein 15% to 20% by weight of the total weight comprises acrylic acid The ester monomer, wherein 1.5% to 6% by weight of the total weight comprises a photoinitiator; and 50% to 78% of the total weight thereof comprises a solvent; applying a primer coating to the surface of the substrate to form a coated substrate; to have at least 1500 A milliwatt irradiance ultraviolet light applies an illumination to the primer coating; and cures the coating.

實施態樣26:實施態樣26之方法,其中峰值輻照度為1500-2500毫瓦特。 Embodiment 26: The method of Embodiment 26, wherein the peak irradiance is 1500-2500 milliwatts.

實施態樣27:實施態樣26至27中任一者之方法,其中固化時間為60秒至180秒。 The method of any one of aspects 26 to 27, wherein the curing time is from 60 seconds to 180 seconds.

實施態樣28:實施態樣28之方法,其中固化時間為120秒。 Embodiment 28: The method of Embodiment 28, wherein the curing time is 120 seconds.

實施態樣29:實施態樣26至29中任一者之方法,其中固化溫度為125℃至200℃。 The method of any one of aspects 26 to 29, wherein the curing temperature is from 125 ° C to 200 ° C.

實施態樣30:實施態樣30之方法,其中固化溫度為140℃。 Embodiment 30: The method of Embodiment 30, wherein the curing temperature is 140 °C.

實施態樣31:實施態樣26至31中任一者之方法,其中底漆塗料厚度為10微米至50微米。 The method of any one of aspects 26 to 31, wherein the primer coating has a thickness of from 10 micrometers to 50 micrometers.

實施態樣32:實施態樣32之方法,其中底漆塗料厚度為25微米。 Embodiment 32: The method of Embodiment 32, wherein the primer coating has a thickness of 25 microns.

實施態樣33:實施態樣26至33中任一者之方法,其中基板包括在與塗料之表面相對的表面上之保護性塗料(protective coating)。 The method of any one of aspects 26 to 33, wherein the substrate comprises a protective coating on a surface opposite the surface of the coating.

實施態樣34:實施態樣26至34中任一者之方法,其另外包含在照射前將經塗佈之基板暴露於25℃至100℃之溫度。 The method of any one of aspects 26 to 34, further comprising exposing the coated substrate to a temperature of from 25 ° C to 100 ° C prior to irradiation.

實施態樣35:實施態樣35之方法,其中暴露發生30秒至90秒。 Embodiment 35: The method of Embodiment 35, wherein the exposure occurs for 30 seconds to 90 seconds.

實施態樣36:實施態樣26至36中任一者之方法,其中基板厚度為150微米至250微米。 The method of any one of aspects 26 to 36, wherein the substrate has a thickness of from 150 micrometers to 250 micrometers.

實施態樣37:實施態樣37之方法,其中基板厚度為175微米。 Embodiment 37: The method of Embodiment 37, wherein the substrate has a thickness of 175 μm.

實施態樣38:實施態樣26至38中任一者之方法,其中經塗佈之基板在固化後具有如根據ASTM D1003程序A使用CIE標準光源C所測量的大於或等於75%之透射率。 The method of any one of aspects 26 to 38, wherein the coated substrate has a transmittance of greater than or equal to 75% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C, after curing. .

實施態樣39:實施態樣39之方法,其中透射率為大於或等於80%。 Embodiment 39: The method of Embodiment 39, wherein the transmittance is greater than or equal to 80%.

實施態樣40:實施態樣26至40中任一者之方法,其中經塗佈之基板在固化後具有如根據ASTM D1003程序A使用CIE標準光源C所測量的小於或等於5%之霧度值。 The method of any one of aspects 26 to 40, wherein the coated substrate has a haze of less than or equal to 5% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C, after curing. value.

實施態樣41:實施態樣41之方法,其中霧度為小於或等於3%。 Embodiment 41: The method of Embodiment 41, wherein the haze is less than or equal to 3%.

實施態樣42:實施態樣26至42中任一者之方法,其中經塗佈之基板在固化後具有小於或等於75Ohm/sq之電阻率。 The method of any one of aspects 26 to 42, wherein the coated substrate has a resistivity of less than or equal to 75 Ohm/sq after curing.

實施態樣43:實施態樣43之方法,其中電阻率為小於或等於50ohm/sq。 Embodiment 43: The method of Embodiment 43 wherein the resistivity is less than or equal to 50 ohm/sq.

實施態樣44:實施態樣26至44中任一者之方法,其中經塗佈之基板在固化後黏附於聚碳酸酯基板,具有如根據ASTM D3359所測量的大於或等於4B之黏著強度。 The method of any one of aspects 26 to 44, wherein the coated substrate adheres to the polycarbonate substrate after curing, having an adhesion strength greater than or equal to 4B as measured according to ASTM D3359.

實施態樣45:實施態樣26至45中任一者之方法,其中經塗佈之基板在固化後黏附於聚碳酸酯基板,具有如根據ASTM D3359所測量的5B之黏著強度。 The method of any one of aspects 26 to 45, wherein the coated substrate adheres to the polycarbonate substrate after curing, having an adhesive strength of 5B as measured according to ASTM D3359.

實施態樣46:導電片或膜,其包含:經塗佈之基板,其中經塗佈之基板包括第一表面和第二表面,其中底漆塗料黏附於第一表面;及與底漆組成物相鄰的導電塗層,其中導電塗層包括以網狀配置之奈米尺寸金屬粒子,且其中導電塗層具有小於或等於0.1Ohm/sq之表面電阻。 Embodiment 46: a conductive sheet or film comprising: a coated substrate, wherein the coated substrate comprises a first surface and a second surface, wherein a primer coating adheres to the first surface; and a primer composition Adjacent conductive coatings, wherein the conductive coating comprises nano-sized metal particles in a mesh configuration, and wherein the conductive coating has a surface resistance of less than or equal to 0.1 Ohm/sq.

實施態樣47:實施態樣47之導電片或膜,其中基板包括聚碳酸酯、聚(甲基丙烯酸甲酯)(PMMA)、聚 乙烯、玻璃、或包含前述中之至少一者的組合。 Embodiment 47: The conductive sheet or film of Embodiment 47, wherein the substrate comprises polycarbonate, poly(methyl methacrylate) (PMMA), polyethylene, glass, or a combination comprising at least one of the foregoing.

實施態樣48:實施態樣47至48中任一者之導電片或膜,其中片或膜具有如根據ASTM D3363使用具有1公斤載重之Mitsubishi Uni鉛筆所測量的大於或等於H之鉛筆硬度。 Embodiment 48: The conductive sheet or film of any one of Embodiments 47 to 48, wherein the sheet or film has a pencil hardness of greater than or equal to H as measured according to ASTM D3363 using a Mitsubishi Uni pencil having a 1 kg load.

實施態樣49:實施態樣47至49中任一者之導電片或膜,其中片或膜具有如根據ASTM D1003程序A使用CIE標準光源C所測量的小於或等於6%之霧度。 Embodiment 49: The conductive sheet or film of any of Embodiments 47 to 49, wherein the sheet or film has a haze of less than or equal to 6% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C.

實施態樣50:實施態樣47至50中任一者之導電片或膜,其中片或膜對430THz至790THz頻率之入射光具有如根據ASTM D1003程序A使用CIE標準光源C所測量的大於或等於80%之透射率。 Embodiment 50: The conductive sheet or film of any of Embodiments 47 to 50, wherein the sheet or film has an incident light having a frequency of 430 THz to 790 THz having a greater than or greater than that measured according to ASTM D1003 Procedure A using CIE Standard Light Source C Equal to 80% transmittance.

實施態樣51:實施態樣47至51中任一者之導電片或膜,其中片或膜在水中沸騰2小時後具有如根據ASTM D257所測量的小於或等於4歐姆之表面電阻變化。 Embodiment 51: The conductive sheet or film of any one of Embodiments 47 to 51, wherein the sheet or film has a surface resistance change of less than or equal to 4 ohms as measured according to ASTM D257 after boiling for 2 hours in water.

實施態樣52:形成實施態樣47至52中任一者之導電片或膜之方法,其包含:從用於導電奈米粒子組成物的組成物形成底漆塗料,其中該組成物包含多官能性丙烯酸酯寡聚物;丙烯酸酯單體;光引發劑;及溶劑;其中該底漆組成物包括總重量,其中總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中總重量之15%至20%包含丙烯酸酯單體,其中總重量之1.5%至6%包含光引發劑;及其中總重量之50%至78%包含溶劑;施加底漆塗料 至基板表面以形成經塗佈之基板;在惰性氛圍中以具有至少600毫瓦特之峰值輻照度的紫外光燈對底漆塗料施加照射;以及固化該塗料。 Embodiment 52: A method of forming a conductive sheet or film of any one of Embodiments 47 to 52, comprising: forming a primer coating from a composition for a conductive nanoparticle composition, wherein the composition comprises a plurality of a functional acrylate oligomer; an acrylate monomer; a photoinitiator; and a solvent; wherein the primer composition comprises a total weight, wherein 5% to 20% by weight of the total weight comprises a polyfunctional acrylate oligomer, wherein 15% to 20% by weight of the total acrylate monomer, wherein 1.5% to 6% by weight of the total weight comprises a photoinitiator; and 50% to 78% of the total weight thereof comprises a solvent; applying a primer coating to the surface of the substrate to form The coated substrate; applying an illumination to the primer coating in an inert atmosphere with an ultraviolet lamp having a peak irradiance of at least 600 milliwatts; and curing the coating.

實施態樣54:實施態樣53之方法,其中惰性氛圍包含選自氮氣、氬氣、氦氣、二氧化碳、或包含前述中之至少一者的組合之氣體。 Embodiment 54: The method of Embodiment 53 wherein the inert atmosphere comprises a gas selected from the group consisting of nitrogen, argon, helium, carbon dioxide, or a combination comprising at least one of the foregoing.

實施態樣55:實施態樣54之方法,其中惰性氛圍包含氮氣。 Embodiment 55: The method of Embodiment 54 wherein the inert atmosphere comprises nitrogen.

實施態樣56:形成實施態樣47至52中任一者之包括奈米粒子分散物的導電片或膜之方法,其包含:從用於導電奈米粒子組成物的組成物形成底漆塗料,其中組成物包含多官能性丙烯酸酯寡聚物;丙烯酸酯單體;光引發劑;及溶劑;其中底漆組成物包括總重量,其中總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中總重量之15%至20%包含丙烯酸酯單體,其中總重量之1.5%至6%包含光引發劑;及其中總重量之50%至78%包含溶劑;施加底漆塗料至基板之第一表面以形成經塗佈之基板;以微波動力紫外光燈對底漆塗料施加照射,其中照射係於惰性氛圍中施加;固化塗料以形成經固化之經塗佈之基板;老化經固化之經塗佈之基板;施加導電塗層至經塗佈之基板,於第一基板表面上;及將經塗佈之基板與導電塗層一起壓製以形成堆疊物,其中底漆塗料係配置在該二者之間;及將導電塗層藉由加熱堆疊物而固化至經塗佈之基板,其中底漆塗料及導電塗層保持黏附於經塗佈之基 板。 Embodiment 56: A method of forming a conductive sheet or film comprising a nanoparticle dispersion of any one of Embodiments 47 to 52, comprising: forming a primer coating from a composition for a conductive nanoparticle composition Wherein the composition comprises a polyfunctional acrylate oligomer; an acrylate monomer; a photoinitiator; and a solvent; wherein the primer composition comprises a total weight, wherein 5% to 20% by weight of the total comprises polyfunctional acrylate An oligomer, wherein 15% to 20% by weight of the total weight comprises an acrylate monomer, wherein 1.5% to 6% by weight of the total weight comprises a photoinitiator; and 50% to 78% of the total weight thereof comprises a solvent; applying a primer coating To the first surface of the substrate to form a coated substrate; applying a irradiation to the primer coating with a microwave powered ultraviolet lamp, wherein the irradiation is applied in an inert atmosphere; curing the coating to form a cured coated substrate; aging a cured coated substrate; applying a conductive coating to the coated substrate on the surface of the first substrate; and pressing the coated substrate with a conductive coating to form a stack, wherein the primer coating system Configured in both Between; and the conductive coating was cured by heating the stack to the coated substrate, wherein the primer coating and the conductive coating remains adhered to the substrate by the coating.

實施態樣57:實施態樣56之方法,其包含施加保護性材料至導電基板表面。 Embodiment 57: The method of Embodiment 56, comprising applying a protective material to a surface of a conductive substrate.

實施態樣58:實施態樣56至57中任一者之方法,其包含調平(trimming)導電基板。 The method of any one of aspects 56 to 57, comprising trimming a conductive substrate.

實施態樣59:實施態樣56至58中任一者之方法,其中壓製(pressing)包含輥壓(roller pressing)、帶壓(belt pressing)、雙帶壓(double belt pressing)、衝壓(stamping)、模壓(die pressing)、或包含前述中之至少一者的組合。 The method of any one of aspects 56 to 58, wherein the pressing comprises a press pressing, a belt pressing, a double belt pressing, and a stamping (stamping) ), die pressing, or a combination comprising at least one of the foregoing.

實施態樣60:實施態樣56至59中任一者之方法,其中加熱另外包含加熱至大於70℃。 The method of any one of aspects 56 to 59, wherein the heating further comprises heating to greater than 70 °C.

本發明通常可另外包含本文所述之任何適當的組份、由彼等組成、或基本上由彼等組成。本發明可另外或另選擇地調配,使得沒有或實質上不含先前技術組成物中所使用之任何組份、材料、成分、佐劑或物質,或除此之外對達成本發明的功能及/或目標並非必需者。 The invention may generally comprise, consist of, or consist essentially of any suitable components described herein. The invention may be additionally or alternatively formulated such that it does not, or is substantially free of, any of the components, materials, ingredients, adjuvants or substances used in the prior art compositions, or otherwise / or the goal is not required.

本文所揭示之所有範圍皆包括端點且端點可彼此獨立組合(例如〝至多25重量%,或更尤其為5重量%至20重量%〞之範圍係囊括端點及〝5重量%至25重量%〞之範圍內的所有中間值等等)。〝組合〞係囊括摻合物、混合物、合金、反應產物及類似者。此外,術語〝第一〞、〝第二〞及類似者在本文不代表任何次序、數量或重要性,而是用於代表不同的元件。術語〝一〞(〝a〞及 〝an〞)及〝該〞(〝the〞)在本文不代表數量的限制且應理解為囊括單數和複數二者,除非本文另有其他表明或顯然與上下文矛盾。如本文所使用的字尾〝(s)〞意欲包括其修飾之術語的單數及複數二者,由此包括該術語之一或多者(例如膜(s)包括一或多個膜)。在整個說明書中述及之〝一個實施態樣〞、〝另一實施態樣〞、〝一實施態樣〞等等意指關於實施態樣所述之特殊元素(例如特點、結構及/或特徵)包括在至少一個本文所述之實施態樣中,且可能或不可能存在於其他的實施態樣中。另外,應瞭解所述之元素可以任何適合的方式組合在各種實施態樣中。 All ranges disclosed herein are inclusive of the endpoints and the endpoints can be combined independently of each other (e.g., up to 25% by weight, or more particularly from 5% to 20% by weight, inclusive of the endpoints and from 5% to 25 percent by weight. All intermediate values in the range of % by weight, etc.). Tantalum combinations include blends, mixtures, alloys, reaction products, and the like. In addition, the terms "first", "second", and the like do not denote any order, quantity, or importance, and are used to represent different elements. The terms 〝 a 〞 〝 〝 〝 〝 〝 〝 〝 〝 〝 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 不 〝 〝 〝 〝 〝 〝 〝 〝 〝 〝 〝 〝 〝 〝 且 且 且 且 且 且Contradictory context. The suffix (s) as used herein is intended to include both the singular and the plural of the terms which are modified, and thus includes one or more of the terms (eg, the film (s) includes one or more films). Throughout the specification, an embodiment, an embodiment, an embodiment, and the like are meant to refer to particular elements (such as features, structures, and/or features) described in the embodiments. It is included in at least one of the embodiments described herein and may or may not be present in other embodiments. In addition, it is to be understood that the described elements may be combined in various embodiments in any suitable manner.

雖然已說明特定的實施態樣,但未於或可能未於目前預見的替代、修改、變化、改良及實質的等效物可由申請人或其他熟習本技術領域者發現。因此,如所申請且可經修正之所附申請專利範圍意欲包括所有此等替代、修改、變化、改良及實質的等效物。 Although specific implementations have been described, alternatives, modifications, variations, improvements and substantial equivalents that are not or may not be presently contemplated may be discovered by those skilled in the art. Accordingly, the appended claims are intended to cover all such alternatives, modifications, variations,

Claims (20)

一種用於導電奈米粒子分散物(conductive nanoparticle dispersion)之底漆(primer)組成物,其包含:多官能性丙烯酸酯寡聚物;及丙烯酸酯單體;及光引發劑;及溶劑;其中,該底漆組成物包括總重量,其中該總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中該總重量之15%至20%包含丙烯酸酯單體,其中該總重量之1.5%至6%包含光引發劑;及其中該總重量之50%至78%包含溶劑。  A primer composition for a conductive nanoparticle dispersion, comprising: a polyfunctional acrylate oligomer; and an acrylate monomer; and a photoinitiator; and a solvent; The primer composition includes a total weight, wherein 5% to 20% of the total weight comprises a polyfunctional acrylate oligomer, wherein 15% to 20% of the total weight comprises an acrylate monomer, wherein the total weight 1.5% to 6% of the photoinitiator is included; and 50% to 78% of the total weight thereof comprises a solvent.   根據申請專利範圍第1項之底漆組成物,其中,該多官能性丙烯酸酯寡聚物包括脂族胺甲酸乙酯丙烯酸酯寡聚物(aliphatic urethane acrylate oligomer)、新戊四醇四丙烯酸酯、脂族胺甲酸乙酯丙烯酸酯、丙烯酸酯、二新戊四醇六丙烯酸酯、丙烯酸酯化樹脂(acrylated resin)、三羥甲丙烷三丙烯酸酯(trimethylolpropane triacrylate)(TMPTA)、二新戊四醇五丙烯酸酯、或包含前述中之至少一者的組合,較佳地其中該多官能性丙烯酸酯寡聚物包括脂族胺甲酸乙酯丙烯酸酯寡聚物及新戊四醇四丙烯酸酯,其中該多官能性丙烯酸酯寡聚物包括多官能性丙烯酸酯寡聚物重量,其中該多官能性丙烯酸酯寡聚物重量之30%至50%包括脂族胺甲酸乙酯丙烯酸酯寡聚物,且其中該多官 能性丙烯酸酯寡聚物重量之50%至70%包括新戊四醇四丙烯酸酯,更佳地其中該多官能性丙烯酸酯寡聚物包括丙烯酸酯化樹脂。  The primer composition of claim 1, wherein the polyfunctional acrylate oligomer comprises an aliphatic urethane acrylate oligomer, neopentyl alcohol tetraacrylate , aliphatic urethane acrylate, acrylate, dipentaerythritol hexaacrylate, acrylated resin, trimethylolpropane triacrylate (TMPTA), dipentaerythritol An alcohol pentaacrylate, or a combination comprising at least one of the foregoing, preferably wherein the polyfunctional acrylate oligomer comprises an aliphatic urethane acrylate oligomer and neopentyl alcohol tetraacrylate, Wherein the polyfunctional acrylate oligomer comprises a polyfunctional acrylate oligomer weight, wherein from 30% to 50% by weight of the polyfunctional acrylate oligomer comprises an aliphatic urethane acrylate oligomer And wherein 50% to 70% by weight of the polyfunctional acrylate oligomer comprises pentaerythritol tetraacrylate, more preferably wherein the polyfunctional acrylate oligomer comprises an acrylated tree .   根據申請專利範圍第1至2項中任一項之底漆組成物,其中,該光引發劑包括α-羥酮光引發劑(α-hydroxyketone photoinitiator)、雙醯膦(bis acyl phosphine)、二苯基酮光引發劑(benzophenone photoinitiator)、或包含前述中之至少一者的組合。  The primer composition according to any one of claims 1 to 2, wherein the photoinitiator comprises an α-hydroxyketone photoinitiator, a bis acyl phosphine, and a second A benzophenone photoinitiator, or a combination comprising at least one of the foregoing.   根據申請專利範圍第1至3項中任一項之底漆組成物,其中,該丙烯酸酯單體包括單丙烯酸酯、二丙烯酸酯、三丙烯酸酯、或包含前述中之至少一者的組合,較佳地其中該丙烯酸酯單體包括聚乙二醇丙烯酸酯(polyethylene glycol acrylate)。  The primer composition according to any one of claims 1 to 3, wherein the acrylate monomer comprises a monoacrylate, a diacrylate, a triacrylate, or a combination comprising at least one of the foregoing, Preferably, the acrylate monomer comprises polyethylene glycol acrylate.   根據申請專利範圍第1至4項中任一項之底漆組成物,其中,該溶劑包括乙醇、乙酸乙酯、異丙醇、乙酸異丁酯、甲基乙酮(methyl ethyl ketone)、甲基異丁酮(methyl isobutyl ketone)、或包含前述中之至少一者的組合。  The primer composition according to any one of claims 1 to 4, wherein the solvent comprises ethanol, ethyl acetate, isopropanol, isobutyl acetate, methyl ethyl ketone, A methyl isobutyl ketone, or a combination comprising at least one of the foregoing.   根據申請專利範圍第1至5項中任一項之底漆組成物,其中,該組成物具有如根據ASTM D1003程序A使用CIE標準光源C所測量的大於或等於75%之透射率(transmission),較佳地其中該透射率為大於或等於86%。  The primer composition according to any one of claims 1 to 5, wherein the composition has a transmission greater than or equal to 75% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C. Preferably, the transmittance is greater than or equal to 86%.   根據申請專利範圍第1至6項中任一項之底漆組成物,其中,該底漆組成物具有如根據ASTM D1003程序 A使用CIE標準光源C所測量的小於或等於5%之霧度值(haze value),較佳地其中該霧度小於或等於3%。  The primer composition according to any one of claims 1 to 6, wherein the primer composition has a haze value of less than or equal to 5% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C. Haze value, preferably wherein the haze is less than or equal to 3%.   根據申請專利範圍第1至7項中任一項之底漆組成物,其中,該底漆組成物具有小於或等於75ohm/sq之電阻率(electrical resistivity),較佳地其中該電阻率小於或等於50ohm/sq。  The primer composition according to any one of claims 1 to 7, wherein the primer composition has an electrical resistivity of less than or equal to 75 ohm/sq, preferably wherein the resistivity is less than or Equal to 50 ohm/sq.   一種固化塗料之方法,其包含:從用於導電奈米粒子組成物的組成物形成底漆塗料,其中該組成物包含多官能性丙烯酸酯寡聚物、丙烯酸酯單體、光引發劑及溶劑;其中該底漆組成物包括總重量,其中該總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中該總重量之15%至20%包含丙烯酸酯單體,其中該總重量之1.5%至6%包含光引發劑;及其中該總重量之50%至78%包含溶劑;施加該底漆塗料至基板表面以形成經塗佈之基板;以具有至少1500毫瓦特之峰值輻照度的紫外光燈對該底漆塗料施加照射;以及固化該塗料。  A method of curing a coating comprising: forming a primer coating from a composition for a conductive nanoparticle composition, wherein the composition comprises a polyfunctional acrylate oligomer, an acrylate monomer, a photoinitiator, and a solvent Wherein the primer composition comprises a total weight, wherein 5% to 20% of the total weight comprises a polyfunctional acrylate oligomer, wherein 15% to 20% of the total weight comprises an acrylate monomer, wherein the total 1.5% to 6% by weight of the photoinitiator; and 50% to 78% of the total weight thereof comprises a solvent; applying the primer coating to the surface of the substrate to form a coated substrate; having a peak of at least 1500 milliwatts An irradiance ultraviolet lamp applies an illumination to the primer coating; and the coating is cured.   根據申請專利範圍第9項之方法,其中,該峰值輻照度為1500至2500毫瓦特。  The method of claim 9, wherein the peak irradiance is 1500 to 2500 milliwatts.   根據申請專利範圍第9至10項中任一項之方法,其中,固化時間為60秒至180秒,較佳地其中該固化時間為120秒。  The method according to any one of claims 9 to 10, wherein the curing time is from 60 seconds to 180 seconds, preferably wherein the curing time is 120 seconds.   根據申請專利範圍第9至11項中任一項之方 法,其中,固化溫度為125℃至200℃,較佳地其中該固化溫度為140℃。  The method according to any one of claims 9 to 11, wherein the curing temperature is from 125 ° C to 200 ° C, preferably wherein the curing temperature is 140 ° C.   根據申請專利範圍第9至12項中任一項之方法,其中,底漆塗料厚度為10微米至50微米,較佳地其中該底漆塗料厚度為25微米。  The method of any one of claims 9 to 12, wherein the primer coating has a thickness of from 10 micrometers to 50 micrometers, preferably wherein the primer coating has a thickness of 25 micrometers.   一種導電片或膜,其包含:經塗佈之基板,其中該經塗佈之基板包括第一表面和第二表面,其中底漆塗料係黏附於該第一表面;及與該底漆組成物相鄰的導電塗層,其中該導電塗層包括網狀(network)配置之奈米尺寸金屬粒子,且其中該導電塗層具有小於或等於0.1Ohm/sq之表面電阻(surface resistance)。  A conductive sheet or film comprising: a coated substrate, wherein the coated substrate comprises a first surface and a second surface, wherein a primer coating adheres to the first surface; and the primer composition An adjacent conductive coating, wherein the conductive coating comprises a nano-sized metal particle in a network configuration, and wherein the conductive coating has a surface resistance of less than or equal to 0.1 Ohm/sq.   根據申請專利範圍第14項之導電片或膜,其中,該基板包括聚碳酸酯、聚(甲基丙烯酸甲酯)(PMMA)、聚乙烯、玻璃、或包含前述中之至少一者的組合。  A conductive sheet or film according to claim 14 wherein the substrate comprises polycarbonate, poly(methyl methacrylate) (PMMA), polyethylene, glass, or a combination comprising at least one of the foregoing.   根據申請專利範圍第14至15項中任一項之導電片或膜,其中,該片或膜具有如根據ASTM D1003程序A使用CIE標準光源C所測量的小於或等於4%之霧度。  A conductive sheet or film according to any one of claims 14 to 15, wherein the sheet or film has a haze of less than or equal to 4% as measured according to ASTM D1003 Procedure A using CIE Standard Light Source C.   一種形成根據申請專利範圍第14至16項中任一項之導電片或膜之方法,其包含:從用於導電奈米粒子組成物的組成物形成底漆塗料,其中該組成物包含多官能性丙烯酸酯寡聚物、丙烯酸酯單體、光引發劑及溶劑;其中底漆組成物包括總重量,其中 該總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中該總重量之15%至20%包含丙烯酸酯單體,其中該總重量之1.5%至6%包含光引發劑;及其中該總重量之50%至78%包含溶劑;施加該底漆塗料至基板表面以形成經塗佈之基板;在惰性氛圍中以具有至少600毫瓦特之峰值輻照度的紫外光燈對該底漆塗料施加照射;以及固化該塗料。  A method of forming a conductive sheet or film according to any one of claims 14 to 16, comprising: forming a primer coating from a composition for a conductive nanoparticle composition, wherein the composition comprises a polyfunctional An acrylate oligomer, an acrylate monomer, a photoinitiator, and a solvent; wherein the primer composition comprises a total weight, wherein 5% to 20% of the total weight comprises a polyfunctional acrylate oligomer, wherein the total 15% to 20% by weight of the acrylate monomer, wherein 1.5% to 6% of the total weight comprises a photoinitiator; and 50% to 78% of the total weight thereof comprises a solvent; applying the primer coating to the surface of the substrate Forming a coated substrate; applying an illumination to the primer coating in an inert atmosphere with an ultraviolet lamp having a peak irradiance of at least 600 milliwatts; and curing the coating.   根據申請專利範圍第17項之方法,其中,該惰性氛圍包含選自氮氣、氬氣、氦氣、二氧化碳、或包含前述中之至少一者的組合之氣體,較佳地其中該惰性氛圍包含氮氣。  The method of claim 17, wherein the inert atmosphere comprises a gas selected from the group consisting of nitrogen, argon, helium, carbon dioxide, or a combination comprising at least one of the foregoing, preferably wherein the inert atmosphere comprises nitrogen. .   一種形成根據申請專利範圍第14至16項中任一項之包括奈米粒子分散物的導電片或膜之方法,其包含:從用於導電奈米粒子組成物的組成物形成底漆塗料,其中該組成物包含多官能性丙烯酸酯寡聚物、丙烯酸酯單體、光引發劑及溶劑;其中該底漆組成物包括總重量,其中該總重量之5%至20%包含多官能性丙烯酸酯寡聚物,其中該總重量之15%至20%包含丙烯酸酯單體,其中該總重量之1.5%至6%包含光引發劑;及其中該總重量之50%至78%包含溶劑;施加該底漆塗料至基板之第一表面以形成經塗佈之基板;以微波動力紫外光燈對該底漆塗料施加照射,其中, 照射係於惰性氛圍中施加;固化該塗料以形成經固化之經塗佈之基板;老化(aging)該經固化之經塗佈之基板;施加導電塗層至該經塗佈之基板,於基板之第一表面上;及將該經塗佈之基板與該導電塗層一起壓製以形成堆疊物,其中該底漆塗料係配置在該二者之間;及將該導電塗層藉由加熱該堆疊物而固化至該經塗佈之基板,其中該底漆塗料及該導電塗層保持黏附於該經塗佈之基板。  A method of forming a conductive sheet or film comprising a nanoparticle dispersion according to any one of claims 14 to 16, which comprises: forming a primer coating from a composition for a conductive nanoparticle composition, Wherein the composition comprises a polyfunctional acrylate oligomer, an acrylate monomer, a photoinitiator, and a solvent; wherein the primer composition comprises a total weight, wherein 5% to 20% of the total weight comprises polyfunctional acrylic acid An ester oligomer, wherein 15% to 20% by weight of the total weight comprises an acrylate monomer, wherein 1.5% to 6% of the total weight comprises a photoinitiator; and 50% to 78% of the total weight thereof comprises a solvent; Applying the primer coating to the first surface of the substrate to form a coated substrate; applying the irradiation to the primer coating with a microwave powered ultraviolet lamp, wherein the irradiation is applied in an inert atmosphere; curing the coating to form a cured a coated substrate; aging the cured coated substrate; applying a conductive coating to the coated substrate on the first surface of the substrate; and coating the coated substrate with The conductive coating is pressed together to Forming a stack, wherein the primer coating is disposed between the two; and curing the conductive coating to the coated substrate by heating the stack, wherein the primer coating and the conductive coating Keep adhering to the coated substrate.   根據申請專利範圍第19項之方法,其包含施加保護性材料至導電基板表面。  The method of claim 19, comprising applying a protective material to the surface of the conductive substrate.  
TW105137281A 2016-11-15 2016-11-15 Conductive nanoparticle dispersion primer composition and methods of making and using the same TW201819548A (en)

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