TW201813796A - Thermostat device for detecting a temperature of a mold - Google Patents

Abstract

A thermostat device includes a base, a first heating module, a fixing mechanism, a first detecting component, and a thermostat module. The base is used for supporting a mold. The first heating module is disposed above the base and spaced from the mold by a distance. The first heating module heats the mold in a non-contacting manner. The fixing mechanism is disposed above the base and for fixing the first heating module. A channel is formed inside the fixing mechanism. The first detecting component is disposed inside the channel. The first heating module is located between the first detecting component and the base. The first detecting component detects heat radiation with a heating radiation wave length emitting from the mold when the first heating module heats the mold. The thermostat module controls a temperature of the mold according to the heat radiation.

Description

Temperature control device for sensing mold temperature

The invention relates to a temperature control device for sensing and controlling the temperature of a mold, in particular to a temperature control device for sensing and controlling the temperature of a mold by using a non-contact method.

The existing mold heating device uses a heat conducting plate and an electric heating tube to heat the mold. The electric heating tube is embedded in the heat conducting plate, and the heat conducting plate directly contacts the mold when the electric heating tube is heated, so that the heat energy generated by the electric heating tube is evenly transferred to the mold. That is, the existing mold heating device indirectly heats the mold in a contact manner. However, the mold is not directly heated during the heating process. Therefore, the heating speed is limited by the material characteristics (thermal conductivity) of the heat conduction plate and there is no way to effectively Promotion. In addition, the existing mold heating device is further provided with a temperature sensing element, and the power of the electric heating tube is controlled according to the sensing result of the temperature sensing element to achieve the effect of controlling the mold temperature. However, the temperature sensing element is disposed on the heat conducting plate and not on the mold, so the temperature sensed by the temperature sensing element cannot truly reflect the actual temperature of the mold.

Therefore, the present invention provides a temperature control device to solve the above problems.

To achieve the above object, the present invention discloses a temperature control device for sensing a temperature of a mold. The temperature control device includes a base, a first heating module, a fixing mechanism, and a first sensing element. The base is used to support the mold, the first heating module is disposed above the base and is spaced from the mold, the first heating module heats the mold in a non-contact manner, and the fixing mechanism is disposed on the Above the base is used to fix the first heating module. A channel is formed in the fixing mechanism. The first sensing element is disposed in the channel. The first heating module is located on the first sensing element and the base. Between the seats, when the first heating module heats the mold, the first sensing element senses a thermal radiation emitted by the mold through the channel.

According to one embodiment of the present invention, the present invention further discloses that the temperature control device further includes a power driver coupled to the first heating module and used to supply power to the first heating module.

According to one embodiment of the present invention, the present invention further discloses that the temperature control device further includes a sensor and a temperature control module, the sensor is coupled to the first sensing element, and the temperature control module is coupled to the sensor. And the power driver, wherein the first sensing element is used for sensing the thermal radiation having a thermal radiation wavelength emitted by the mold and generating a corresponding signal, and the first sensing element is further used for the signal To the sensor, the sensor transmits the signal transmitted from the first sensing element to the temperature control module, and the temperature control module controls the power driver to supply power to the first according to the signal transmitted from the sensor Heating module.

According to one embodiment of the present invention, the present invention further discloses that the temperature control module calculates the temperature of the mold according to the signal transmitted from the sensor, and when the temperature control module judges that the temperature of the mold reaches a predetermined temperature At this time, the temperature control module controls the power driver to stop supplying power to the first heating module.

According to one embodiment of the present invention, the present invention further discloses that the channel has a first channel portion and a second channel portion, and the fixing mechanism includes a pipe member and a fixing seat, the pipe member is disposed above the base, and A first channel portion is formed in the tube, the first sensing element is disposed in the first channel portion, the fixing seat is disposed between the tube and the first heating module, and the second channel portion is formed in the fixing The seat is open in the side facing the base.

According to one embodiment of the present invention, the present invention further discloses that the temperature control device further includes a cooling water path, the cooling water path is connected to the fixing mechanism and used to cool the fixing mechanism.

According to one embodiment of the present invention, the present invention further discloses that the first heating module includes a plurality of infrared heating tubes, and the plurality of infrared heating tubes are used to emit infrared rays having an infrared wavelength to the mold.

According to one embodiment of the present invention, the present invention further discloses that the mold is heated by the infrared rays to generate thermal radiation having a thermal radiation wavelength.

According to one embodiment of the present invention, the present invention further discloses that the infrared wavelength is 1 to 4 microns, and the thermal radiation wavelength is 8 to 14 microns.

According to one embodiment of the present invention, the present invention further discloses that the temperature control device further includes a second heating module and a second sensing element. The second heating module is disposed in the base, wherein the first A heating module is used to heat an upper side of the mold, a second heating module is used to heat the lower side of the mold opposite to the upper side, the second sensing element is installed in the base, and the second sensing element When the mold is heated by the second heating module, the temperature of the mold is sensed.

According to one embodiment of the present invention, the present invention further discloses that the base includes a heat conducting plate and a frame, the heat conducting plate is used for uniformly transmitting thermal energy to the mold, and the second heating module is disposed in the frame.

According to one embodiment of the present invention, the present invention further discloses that the second heating module includes a plurality of infrared heating tubes, and the plurality of infrared heating tubes are used to emit infrared rays having an infrared wavelength to the frame.

According to one embodiment of the present invention, the present invention further discloses that the infrared wavelength is 1 to 4 microns.

According to one embodiment of the present invention, the present invention further discloses that the temperature control device further includes a plurality of electric heating pipes, and the plurality of electric heating pipes are buried in the base.

According to one embodiment of the present invention, the present invention further discloses that the temperature control device further includes an adjustment base, which is disposed above the fixing mechanism, and the adjustment base is used for driving the fixing mechanism to move to adjust the fixing mechanism and One of the bases is spaced.

In summary, the present invention uses a first heating module to heat the mold in a non-contact manner, and uses a first sensing element disposed in the channel to sense the thermal radiation with a thermal radiation wavelength emitted by the mold and reuse it. The temperature control module calculates the temperature of the mold based on the thermal radiation sensed by the first sensing element, so the present invention can not only heat the mold quickly at high temperature, but also accurately measure the temperature of the mold.

Please refer to FIG. 1 to FIG. 3. FIG. 1 is a schematic diagram of the appearance of the temperature control device 1 according to the first embodiment of the present invention, and FIG. 2 is a partial cross-sectional view of the temperature control device 1 according to the first embodiment of the present invention. Functional block diagram of the temperature control device 1 according to the first embodiment of the present invention. As shown in Figs. 1 to 3, the temperature control device 1 includes a base 10, a first heating module 11, a second heating module 12, a fixing mechanism 13, an adjustment base 14, and a first sensor. The measuring element 15, a second sensing element 16, a cooling water path 17, a sensor 18, a power driver 19 and a temperature control module 20.

The base 10 is used to support a mold 3. The first heating module 11 is disposed above the base 10 and spaced from the mold 3. The first heating module 11 heats an upper side 30 of one of the molds 3 in a non-contact manner and is fixed. The mechanism 13 is disposed above the base 10 and is used to fix the first heating module 11. The first sensing element 15 is disposed in the fixing mechanism 13 and used to sense a heat radiation H1 emitted from the upper side 31 of the mold 3. The second heating module 12 is disposed in the base 10 and heats the mold 3 opposite to the upper side 30 and the lower side 31 by indirect heating. The second sensing element 16 is installed in the base 10 and is used for indirect sensing. Temperature of the lower side 31 of the mold 3. The adjusting seat 14 is disposed above the fixing mechanism 13. The adjusting seat 14 is used to drive the fixing mechanism 13 to move to adjust a distance between the fixing mechanism 13 and the base 10 according to the height of the mold 3. The cooling water path 17 is connected to the fixing mechanism 13 and is used for The fixing mechanism 13 is cooled to avoid overheating damage of the first sensing element 15.

The sensor 18 is coupled to the first sensing element 15 and the temperature control module 19 and is used to transmit a signal generated by the first sensing element 15 to the temperature control module 19. The power driver 19 is coupled to the first heating module. The group 11 and the temperature control module 19 control the power supply driver 19 to supply power to the first heating module 11 according to the signal transmitted from the sensor 18. However, the connection relationship of the electrical components of the present invention is not limited to this. In other embodiments, the sensor 18 may also be coupled to the first sensing element 15, the second sensing element 16 and the temperature control module 19, and the power driver 19 may also be coupled to the first heating module 11 and the second The heating module 12 and the temperature control module 19 and the sensor 18 respectively transmit a first signal generated by the first sensing element 15 and a second signal generated by the second sensing element 16 to the temperature control module 19, The temperature control module 19 controls the power supply driver 19 to supply power to the first heating module 11 and the second heating module 12 according to the first signal and the second signal transmitted from the sensor 18.

In this embodiment, a channel 130 is formed in the fixing mechanism 13. The first sensing element 15 is disposed in the channel 130. The first heating module 11 is located between the first sensing element 15 and the base 10. When the measuring element 15 heats the mold 3 through the first heating module 11, it detects the heat radiation H1 emitted from the upper side 30 of the mold 3 through the channel 130. Specifically, the channel 130 has a first channel portion 1301 and a second channel portion 1302. The fixing mechanism 13 includes a pipe 131 and a fixing base 132. The pipe 131 is disposed above the base 10 and is located on the base 10 and the adjusting base. Between 14, the first channel portion 1301 is formed in the pipe member 131, the first sensing element 15 is disposed in the first channel portion 1301, and the fixing seat 132 is disposed between the pipe member 131 and the first heating module 11 and used for fixing. The first heating module 11 and the second channel portion 1302 are formed in the fixing base 132 and opened on the side facing the base 10. The first sensing element 15 senses the mold through the first channel portion 1301 and the second channel portion 1302. 3 The heat radiation H1 emitted from the upper side 30, the cooling water path 17 is connected to the fixing seat 132 of the fixing mechanism 13, during the heating process, the cooling water path 17 is passed with a cooling water to cool the fixing seat 132, thereby avoiding the first heating mold The thermal energy generated by the group 11 is conducted to the first sensing element 15 through the fixing seat 132 and the pipe 131, and the first sensing element 15 is damaged. In addition, in this embodiment, the first heating module 11 includes four infrared heating tubes 110, and the four infrared heating tubes 110 are respectively used to emit infrared rays to the upper side 30 of the mold 3. However, the first heating module of the present invention 11 is not limited to this, its end depends on design requirements.

Furthermore, the base 10 includes a heat conducting plate 100 and a frame 101. The second heating module 12 is disposed in the frame 101. The second heating module 12 heats the frame 101 in a non-contact manner. The thermal energy is evenly transmitted to the lower side 31 of the mold 3, that is, the second heating module 12 heats the lower side 31 of the mold 3 by indirect heating. The second sensing element 16 is disposed between the heat conducting plate 100 and the frame 101 to indirectly The temperature of the lower side 31 of the mold 3 is measured. In addition, in this embodiment, the second heating module 12 includes four infrared heating tubes 120, and the four infrared heating tubes 120 are respectively used to emit infrared rays to the frame 101. However, the second heating module 12 of the present invention does not Limited to this, its end depends on design requirements.

Please refer to FIG. 3 and FIG. 4. FIG. 4 is a schematic diagram of the temperature control device 1 in the operating state according to the first embodiment of the present invention. As shown in Figures 3 and 4, when the temperature control device 1 is used to heat the mold 3 to a predetermined temperature, the user can first operate the temperature control module 20 to control the power driver 19 to the first heating module 11 Power supply, the first heating module 11 emits infrared IR1 toward the mold 3 to heat the upper side 30 of the mold 3. At this time, the user can operate the second heating module 12 to emit infrared IR2 toward the frame 101 and indirectly heat through the heat conducting plate 100 Lower side 31 of the mold 3. As the temperature of the mold 3 gradually rises, the upper side 30 of the mold 3 emits heat radiation H1 corresponding to its temperature. The first sensing element 15 senses the heat radiation H1 through the first channel portion 1301 and the second channel portion 1302, and Generate a corresponding signal. Then, the first sensing element 15 transmits the signal to the sensor 18, and the sensor 18 transmits the signal transmitted by the first sensing element 15 to the temperature control module 20, and the temperature control module 20 transmits the signal according to the sensor 18 This signal calculates the temperature of the mold 3. In this way, the temperature control device 1 of the present invention can immediately grasp the temperature of the mold 3 at any time during the heating process, and adjust it according to the temperature control power driver 19 calculated by the temperature control module 20. Power of the first heating module 11. For example, when the temperature control module 20 judges that the temperature of the mold 3 is close to the predetermined temperature, the temperature control module 20 controls the power driver 19 to reduce the power of the first heating module 11; When the temperature reaches the predetermined temperature, the temperature control module 20 controls the power driver 19 to stop supplying power to the first heating module 11.

It is worth noting that because the first sensing element 15 is located in the channel 130, during the heating process, the infrared IR1 emitted by the first heating module 11 cannot easily affect the sensing of the first sensing element 15 through the channel 130. result. In addition, the infrared rays IR1 and IR2 emitted by the first heating module 11 and the second heating module 12 each have an infrared wavelength, and the infrared wavelength is preferably 1 to 4 micrometers, which is sensed by the first sensing element 15. The heat radiation H1 has a heat radiation wavelength, and the heat radiation wavelength is preferably 8 to 14 micrometers. In other words, the two infrared rays IR1, IR2, and the first infrared light emitted by the first heating module 11 and the second heating module 12 The thermal radiation H1 sensed by a sensing element 15 has a different wavelength range, so that even when the infrared IR1 is accidentally reflected into the channel 130, the first sensing element 15 can only detect 8 ~ Thermal radiation H1 in the 14 micron wavelength range makes its sensing results not affected by infrared IR1 and is more accurate.

Please refer to FIG. 5. FIG. 5 is a schematic diagram of an external appearance of a temperature control device 1 'according to a second embodiment of the present invention. The difference between the temperature control device 1 ′ of the second embodiment and the temperature control device 1 of the first embodiment is only that the temperature control device 1 ′ includes a plurality of electric heating pipes 12 ′ instead of the second heating module 12 and a plurality of heating devices. The tube 12 'is buried in the base 10, and the components with the same reference numerals in this embodiment have the same structures and functions as those in the previous embodiment, and details are not described herein again.

Compared with the prior art, the present invention uses a first heating module to heat the mold in a non-contact manner, and uses a first sensing element disposed in the channel to sense the heat radiation with a thermal radiation wavelength emitted by the mold, and then A temperature control module is used to calculate the temperature of the mold based on the thermal radiation sensed by the first sensing element. Therefore, the present invention can not only heat the mold quickly at high temperature, but also accurately measure the temperature of the mold, thereby achieving the effect of accurately controlling the temperature of the mold. The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the scope of the present invention.

1,1’‧‧‧Temperature control device

10‧‧‧ base

100‧‧‧Heat conduction plate

101‧‧‧Frame

11‧‧‧The first heating module

110‧‧‧ infrared heating tube

12‧‧‧Second heating module

120‧‧‧ Infrared heating tube

12’‧‧‧ electric heating tube

13‧‧‧ fixed institutions

130‧‧‧channel

1301‧‧‧First Channel Department

1302‧‧‧Second Channel Department

131‧‧‧Pipe Fittings

132‧‧‧Fixed

14‧‧‧Adjustment Block

15‧‧‧first sensing element

16‧‧‧Second sensing element

17‧‧‧ cooling water

18‧‧‧Sensor

19‧‧‧ Power Driver

20‧‧‧Temperature Control Module

3‧‧‧mould

30‧‧‧upside

31‧‧‧ underside

H1‧‧‧ heat radiation

IR1, IR2‧‧‧ infrared

FIG. 1 is a schematic diagram of an appearance of a temperature control device according to a first embodiment of the present invention. Fig. 2 is a partial sectional view of a temperature control device according to a first embodiment of the present invention. FIG. 3 is a functional block diagram of the temperature control device according to the first embodiment of the present invention. FIG. 4 is a schematic diagram of the temperature control device in an operating state according to the first embodiment of the present invention. FIG. 5 is a schematic diagram of an appearance of a temperature control device according to a second embodiment of the present invention.

Claims (15)

A temperature control device for sensing a temperature of a mold includes: a base for supporting the mold; a first heating module disposed above the base and spaced from the mold, the first The heating module heats the mold in a non-contact manner; a fixing mechanism is provided above the base and is used to fix the first heating module, a channel is formed in the fixing mechanism; and a first sensing element, Set in the channel, the first heating module is located between the first sensing element and the base, and the first sensing element senses the mold through the channel when the first heating module heats the mold. One of the thermal radiation emitted by the mold. The temperature control device according to claim 1, further comprising a power driver coupled to the first heating module and used to supply power to the first heating module. The temperature control device according to claim 2, further comprising: a sensor coupled to the first sensing element; and a temperature control module coupled to the sensor and the power driver, wherein the first sensing The element is used for sensing the thermal radiation with a thermal radiation wavelength emitted by the mold and generating a corresponding signal. The first sensing element is further used for transmitting the signal to the sensor, and the sensor transmits the first signal. The signal transmitted by the sensing element is transmitted to the temperature control module, and the temperature control module controls the power driver to supply power to the first heating module according to the signal transmitted from the sensor. The temperature control device according to claim 3, wherein the temperature control module calculates the temperature of the mold according to the signal transmitted from the sensor, and when the temperature control module judges that the temperature of the mold reaches a predetermined temperature , The temperature control module controls the power driver to stop supplying power to the first heating module. The temperature control device according to claim 1, wherein the channel has a first channel portion and a second channel portion, and the fixing mechanism includes: a pipe member disposed above the base, the first channel portion being formed on In the tube, the first sensing element is disposed in the first channel portion; and a fixing seat is disposed between the tube and the first heating module, and the second channel portion is formed in the fixing seat and opened On the side facing the base. The temperature control device according to claim 1, further comprising a cooling water channel connected to the fixing mechanism and used to cool the fixing mechanism. The temperature control device according to claim 1, wherein the first heating module includes a plurality of infrared heating tubes, and the plurality of infrared heating tubes are used to emit infrared rays having an infrared wavelength to the mold. The temperature control device according to claim 7, wherein the mold is heated by the infrared rays to generate thermal radiation having a thermal radiation wavelength. The temperature control device according to claim 8, wherein the infrared wavelength is 1 to 4 microns, and the heat radiation wavelength is 8 to 14 microns. The temperature control device according to claim 1, further comprising: a second heating module disposed in the base, wherein the first heating module is used to heat an upper side of the mold, and the second heating module For heating the mold opposite to one of the upper side and the lower side; and a second sensing element installed in the base, the second sensing element senses the mold when the second heating module heats the mold The temperature. The temperature control device according to claim 10, wherein the base includes a heat conducting plate and a frame, the heat conducting plate is used to uniformly conduct thermal energy to the mold, and the second heating module is disposed in the frame. The temperature control device according to claim 11, wherein the second heating module includes a plurality of infrared heating tubes, and the plurality of infrared heating tubes are used to emit infrared rays having an infrared wavelength to the frame. The temperature control device according to claim 12, wherein the infrared wavelength is 1 to 4 microns. The temperature control device according to claim 1, further comprising a plurality of electric heating pipes, which are buried in the base. The temperature control device according to claim 1, further comprising an adjustment base disposed above the fixing mechanism, the adjustment base is used to drive the fixing mechanism to move to adjust a distance between the fixing mechanism and the base .