TW201813745A - Cutting tool - Google Patents

Cutting tool Download PDF

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Publication number
TW201813745A
TW201813745A TW106125825A TW106125825A TW201813745A TW 201813745 A TW201813745 A TW 201813745A TW 106125825 A TW106125825 A TW 106125825A TW 106125825 A TW106125825 A TW 106125825A TW 201813745 A TW201813745 A TW 201813745A
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TW
Taiwan
Prior art keywords
cutting
cutting tool
diamond layer
base material
top surface
Prior art date
Application number
TW106125825A
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Chinese (zh)
Inventor
小林豊
風早克夫
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住友電工硬質合金股份有限公司
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Publication of TW201813745A publication Critical patent/TW201813745A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
    • B23B27/20—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/16—Milling-cutters characterised by physical features other than shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/02—Milling-cutters characterised by the shape of the cutter
    • B23C5/10—Shank-type cutters, i.e. with an integral shaft

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

A cutting tool according to an embodiment of the disclosure comprises: a rake face; a flank face continuous with the rake face; and a cutting edge constituted by a ridgeline between the rake face and the flank face. The cutting tool according to an embodiment of the disclosure comprises: a base material having a first face which is the face on the rake face side, and a second face which is the face on the flank face side; and a diamond layer covering the first face and the second face. A portion of the flank face is constituted by the base material. The portion of the flank face constituted by the base material is located between the diamond layer covering the first face and the diamond layer covering the second face.

Description

切削工具Cutting tool

本發明係關於一種切削工具。本案主張基於在2016年9月29日申請之日本專利申請案之特願2016-191641號之優先權。該日本專利申請案所記載之全部記載內容係藉由參照而援用於本說明書。The invention relates to a cutting tool. This case claims priority based on Japanese Patent Application No. 2016-191641 filed on September 29, 2016. All the contents described in this Japanese patent application are incorporated herein by reference.

自先前，作為以金剛石層被覆基材之切削工具，已知有日本專利特開2015-85462號公報(專利文獻1)所記載之切削工具。專利文獻1所記載之切削工具之工具本體具有後刀面、切削面、及形成於後刀面與切削面之交叉稜線之切削刃。工具本體係由硬質皮膜被覆。 於專利文獻1所記載之切削工具中，為了改善切削工具之鋒利度，藉由雷射等將被覆工具本體之切削面側之硬質皮膜除去。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2015-85462號公報Conventionally, as a cutting tool in which a base material is coated with a diamond layer, a cutting tool described in Japanese Patent Laid-Open No. 2015-85462 (Patent Document 1) is known. The tool body of the cutting tool described in Patent Document 1 includes a flank face, a cutting face, and a cutting edge formed at an intersection line between the flank face and the cutting face. The tool system is covered by a hard film. In the cutting tool described in Patent Document 1, in order to improve the sharpness of the cutting tool, a hard film covering the cutting surface side of the tool body is removed by laser or the like. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2015-85462

本發明之一態樣之切削工具具備切削面、與切削面相連之後刀面、及由切削面與後刀面之稜線構成之切削刃。本發明之一態樣之切削工具具備具有作為切削面側之面之第1面、及作為後刀面側之面之第2面的基材、以及被覆第1面及第2面之金剛石層。後刀面之一部分係由基材構成。由基材構成之後刀面之一部分係位於被覆第1面之金剛石層與被覆第2面之金剛石層之間。A cutting tool according to one aspect of the present invention includes a cutting surface, a cutting surface connected to the cutting surface, and a cutting edge composed of a ridge line between the cutting surface and the flank surface. A cutting tool according to one aspect of the present invention includes a base material having a first surface as a cutting surface side surface and a second surface as a flank surface side surface, and a diamond layer covering the first surface and the second surface. . A part of the flank face is composed of a base material. A part of the blade surface after being composed of the base material is located between the diamond layer covering the first surface and the diamond layer covering the second surface.

[本發明所欲解決之問題] 於專利文獻1所記載之切削工具中，係由硬質皮膜被覆工具本體之後刀面側。該硬質皮膜於切削加工時，因切削工具自被削材受到之主分力，容易自工具本體之後刀面側剝離。因此，專利文獻1所記載之切削工具之耐久性並不充分。 本發明係鑒於如上所述之先前技術之問題研究而成者。更具體而言，本發明提供一種能夠抑制被覆基材之後刀面側之面之金剛石層之剝離的切削工具。 [本發明之效果] 根據上述說明，可抑制被覆基材之後刀面側之面之金剛石層之剝離。 [本發明之實施形態之說明] 首先，列出本發明之實施態樣進行說明。 (1)本發明之一態樣之切削工具具備切削面、與切削面相連之後刀面、及由切削面與後刀面之稜線構成之切削刃。本發明之一態樣之切削工具具備具有作為切削面側之面之第1面、及作為後刀面側之面之第2面之基材、以及被覆第1面及第2面之金剛石層。後刀面之一部分係由基材構成。由基材構成之後刀面之一部分係位於被覆第1面之金剛石層與被覆第2面之金剛石層之間。 根據(1)之切削工具，可抑制被覆基材之後刀面側之面之金剛石層之剝離。 (2)於(1)之切削工具中，第1面亦可包含與第2面相連之第1頂面、及第2頂面，該第2頂面與第1頂面相連，且以於與第2面之間夾著第1頂面之方式配置。第1頂面與第2頂面所成之角度於與切削刃垂直之剖面中，亦可為負角。 根據(2)之切削工具，可進而抑制金剛石層之剝離。 (3)於(2)之切削工具中，在與切削刃垂直之剖面中，第1頂面與第2頂面之稜線、同切削刃之於與切削面平行之方向上之距離亦可為0.001 μm以上且5 μm以下。 根據(3)之切削工具，第1頂面上被金剛石層較厚地被覆，故而可抑制金剛石層之後刀面剝離。 (4)於(1)~(3)之切削工具中，被覆基材之第1面之金剛石層之厚度亦可為0.1 μm以上且50 μm以下。 根據(4)之切削工具，可進而抑制金剛石層之後刀面剝離。 (5)於(1)~(4)之切削工具中，切削刃前端之曲率半徑亦可為0.01 μm以上且10 μm以下。 根據(5)之切削工具，可抑制被覆基材之後刀面側之面之金剛石層之剝離，並可改善切削工具之鋒利度。 [本發明之實施形態之詳細] 以下，參照圖，對本發明之實施形態之詳細進行說明。再者，各圖中對於相同或相當之部分附加相同符號。又，亦可將以下記載之實施形態之至少一部分任意地組合。 (第1實施形態) 以下，對第1實施形態之切削工具之構成進行說明。 圖1係第1實施形態之切削工具之俯視圖。第1實施形態之切削工具具有前端部1、刀身部2、及刀柄部3。實施形態之切削工具為球形端銑刀。第1實施形態之切削工具並不限定於球形端銑刀。例如，第1實施形態之切削工具亦可為圓弧形端銑刀等。 圖2係圖1之區域II之放大俯視圖。如圖2所示，第1實施形態之切削工具於前端部1具有切削面11、及後刀面12(參照圖4)。切削面11與後刀面12相連。切削面11與後刀面12之稜線構成切削刃13。 圖3係使用有第1實施形態之切削工具之切削加工之模式圖。如圖3所示，第1實施形態之切削工具一面以中心軸A為中心旋轉，一面使切削刃13推向被削材。藉此，進行被削材之切削加工。 圖4係圖2之IV-IV之剖視圖。如圖4所示，第1實施形態之切削工具具有基材4、及金剛石層5。基材4具有第1面41(頂面)、及第2面42。第1面41係基材4之切削面11側之面。第2面42係基材4之後刀面12側之面。 基材4亦可具有第3面43。第3面43係與第1面41及第2面42相連，且配置於被第1面41與第2面42夾著之位置。第3面43與第1面41所成之角度為角度θ1。角度θ1大於0°且未達90°。 基材4係由金剛石層5被覆。更詳細而言，基材4之第1面41及第2面42由金剛石層5被覆，基材4之第3面43未被金剛石層5被覆。即，後刀面12之一部分由基材4(第3面43)構成。由基材4構成之後刀面12之一部分(第3面43)係位於被覆基材4之第1面之金剛石層5與被覆基材4之第2面之金剛石層5之間。 若自另一觀點來說明該情況，則被覆基材4之第1面41之金剛石層5、與被覆基材4之第2面42之金剛石層5並不連續。再者，被覆基材4之第1面41之金剛石層5、與被覆基材4之第2面42之金剛石層5於切削刃13之一部分不連續即可。尤其是，被覆基材4之第1面41之金剛石層5、與被覆基材4之第2面42之金剛石層5較佳為至少於位於實施形態之切削工具之前端1a附近之切削刃13處不連續。原因在於：於前端1a之附近，加工時周速接近零，切削時之負荷尤其大。 由基材4構成之後刀面12之一部分(第3面43)，較佳為與切削刃13相隔而配置為宜。 被覆基材4之第1面41之金剛石層5之厚度為厚度h。厚度h較佳為0.1 μm以上且50 μm以下。 基材4使用例如包含WC(碳化鎢)等之粉末、Co(鈷)等之結合劑之燒結體之超硬合金。再者，用於基材4之材料並不限定於此。 金剛石層5例如為含有金剛石晶體之層。金剛石層5例如為金剛石多晶膜。金剛石層5亦可含有非金剛石成分(例如非晶質成分)等。金剛石層5亦可不含有金剛石晶體。例如，金剛石層5亦可為DLC(Diamond Like Carbon)之層。 切削刃13前端之曲率半徑為曲率半徑R。曲率半徑R較佳為0.01 μm以上且10 μm以下。 以下，對第1實施形態之切削工具之製造方法進行說明。 圖5係第1實施形態之切削工具之製造方法之步驟圖。如圖5所示，第1實施形態之切削工具之製造方法具有金剛石層形成步驟S1、及金剛石層除去步驟S2。金剛石層除去步驟S2亦可包含切削面處理步驟S21、及後刀面處理步驟S22。 圖6係金剛石層形成步驟S1結束之後且金剛石層除去步驟S2進行之前之第1實施形態之切削工具之剖視圖。如圖6所示，於金剛石層形成步驟S1中，於基材4上成膜金剛石層5，由金剛石層5被覆基材4。該金剛石層5之成膜例如使用HFCVD(Hot Filament Chemical Vapor Deposition)進行。 再者，於該階段，第1實施形態之切削工具之前端周邊被圓化。此係於金剛石層5之成膜時，第1實施形態之切削工具之前端周邊之溫度高於其他部分，而促進金剛石層5之成膜所致。 於金剛石層除去步驟S2中，將被覆基材4之金剛石層5部分除去。於金剛石層除去步驟S2中，藉由除去被覆基材4之第2面42之金剛石層5，使基材4自後刀面12露出。 圖7係切削面處理步驟S21結束之後且後刀面處理步驟S22進行之前之第1實施形態之切削工具之剖視圖。如圖7所示，於切削面處理步驟S21中，將被覆基材4之第1面41之金剛石層5部分除去。藉由將被覆基材4之第1面41之金剛石層5部分除去，第1實施形態之切削工具之前端之切削面11側之圓形變得平坦化。 該金剛石層5之除去係藉由向切削面11側照射雷射而進行。金剛石層5之除去所用之雷射例如為YVО4 雷射之2倍高次諧波。 於後刀面處理步驟S22中，將被覆基材4之第2面42之金剛石層5部分除去。持續進行被覆基材4之第2面42之金剛石層5之部分除去，直至基材4自後刀面12露出。藉此，形成圖4所示之第1實施形態之切削工具之構造。 伴隨被覆基材4之第2面42之金剛石層5之部分除去，第1實施形態之切削工具之前端之後刀面側之圓形變得平坦化。藉此，第1實施形態之切削工具之切削刃13尖銳化，獲得具有0.01 μm以上且10 μm以下之曲率半徑R之切削刃13。 再者，被覆基材4之第2面42之金剛石層5之除去係藉由向後刀面12側照射雷射而進行。金剛石層5之除去所用之雷射例如為YVО4 雷射之2倍高次諧波。 (第2實施形態) 以下，對第2實施形態之切削工具之構成進行說明。再者，以下主要說明與第1實施形態之切削工具之不同點，關於相同之說明則不再重複。 圖8係與第2實施形態之切削工具之切削刃13垂直之剖面之剖視圖。如圖8所示，第2實施形態之切削工具具有切削面11、後刀面12、及切削刃13。第2實施形態之切削工具具有基材4、及金剛石層5。 於第2實施形態之切削工具中，基材4自後刀面12露出(即，後刀面12之一部分由基材4構成)，由基材4構成之後刀面12之一部分位於被覆基材4之第1面41之金剛石層5與被覆基材4之第2面42之金剛石層5之間。 該等方面上，第2實施形態之切削工具係與第1實施形態之切削工具共通。另一方面，第2實施形態之切削工具於以下所述之方面不同於第1實施形態之切削工具。 於第2實施形態之切削工具中，基材4之第1面41具有第1頂面41a及第2頂面41b。第1頂面41a與基材4之第2面42相連。第2頂面41b與第1頂面41a相連。第2頂面41b於與基材4之第2面42之間配置於夾著第1頂面41a之位置。 第1頂面41a與第2頂面41b所成之角度為角度θ2。角度θ2為負角。角度θ2為負角係指，當第2頂面41b朝上方、且切削刃13朝左側地配置切削工具時，第1頂面41a相對於第2頂面41b以第1頂面41a與第2頂面41b之交界線為中心逆時針旋轉之情形。自另一觀點而言，角度θ2為負角係指，當第2頂面41b朝上方、且切削刃13朝左側地配置切削工具時，第1頂面41a相對於第2頂面41b朝左下傾斜之情形。 被覆基材4之第1頂面41a之金剛石層5之厚度為厚度h1。厚度h1係第1頂面41a與第2面42之稜線、與切削面11之距離。被覆基材4之第2頂面41b之金剛石層5之厚度為厚度h2。厚度h2係第2頂面41b與切削面11之距離。由於角度θ2為負角，故而厚度h1＞厚度h2。 第1頂面41a與第2頂面41b之稜線、與切削刃13之距離為距離L。距離L係與切削刃13垂直之剖面上之與切削面11平行之方向之距離。距離L較佳為0.001 μm以上且5 μm以下。 以下，對第2實施形態之切削工具之製造方法進行說明。第2實施形態之切削工具之製造方法係與第1實施形態之切削工具之製造方法同樣地，具有金剛石層形成步驟S1、及金剛石層除去步驟S2，且金剛石層除去步驟S2具有切削面處理步驟S21、及後刀面處理步驟S22。 但，第2實施形態之切削工具之製造方法於使用之基材4之第1面41具有第1頂面41a及第2頂面41b之方面，不同於第1實施形態之切削工具之製造方法。 (第1實施形態之切削工具及第2實施形態之切削工具之效果) 以下，對第1實施形態之切削工具及第2實施形態之切削工具之效果進行說明。 首先，藉由與比較例進行對比來說明第1實施形態之切削工具之效果。圖9係與比較例之切削工具之切削刃13垂直之剖面之剖視圖。如圖9所示，比較例之切削工具具有切削面11、後刀面12、及切削刃13。比較例之切削工具具有基材4、及金剛石層5。 於比較例之切削工具中，金剛石層5被覆基材4之第1面41及第2面42，後刀面12並未自基材4露出。即，於比較例之切削工具中，金剛石層5係連續地(無切縫地)被覆基材4之第1面41上及第2面42上。 於使用比較例之切削工具進行切削加工時，切削面11之切削刃13附近自被削材被施加主分力(自切削面11朝向後刀面12之方向之切削力)。於比較例之切削工具中，由於金剛石層5係連續地(無切縫地)被覆基材4之第1面41及第2面42上，故而主分力容易作用於被覆基材4之第2面42之金剛石層5。其結果，於比較例之切削工具中，容易產生金剛石層5之後刀面剝離。 另一方面，如上所述般，於第1實施形態之切削工具中，後刀面12之一部分由基材4構成，由基材4構成之後刀面12之一部分係位於被覆基材4之第1面41之金剛石層5與被覆基材4之第2面之金剛石層5之間。即，被覆基材4之第1面41之金剛石層5與被覆基材4之第2面42之金剛石層5至少於切削刃13之一部分不連續。 因此，於第1實施形態之切削工具中，進行切削加工時在切削面11產生之主分力難以作用於被覆基材4之第2面42之金剛石層5。其結果，根據第1實施形態之切削工具，可抑制金剛石層5之後刀面剝離。 繼而，說明第2實施形態之切削工具之效果。如上所述，於第2實施形態之切削工具中，基材4之第1面41具有第1頂面41a、及第2頂面41b，角度θ2為負角。因此，於第2實施形態之切削工具中，與第1實施形態之切削工具相比，金剛石層5以更大之面積接觸基材4之第1面41。因此，根據第2實施形態之切削工具，可進而抑制金剛石層5之剝離。 如上所述，於第2實施形態之切削工具中，厚度h1＞厚度h2。因此，於第2實施形態之切削工具中，在切削刃13之附近可確保被覆基材4之第1面41之金剛石層5之厚度。因此，根據第2實施形態之切削工具，可進而抑制後刀面剝離。 應認識到本次所揭示之實施形態之所有方面均為例示，而非限制者。本發明之範圍並非由上述實施形態表示，而是由申請專利範圍表示，且包含與申請專利範圍均等之含義、及範圍內之所有變更。[Problems to be Solved by the Present Invention] In the cutting tool described in Patent Document 1, the blade surface side of the tool body is covered with a hard film. During the cutting process, the hard film is easily peeled off from the blade surface side of the tool body due to the main component force received by the cutting tool from the material to be cut. Therefore, the durability of the cutting tool described in Patent Document 1 is insufficient. The present invention has been made in view of the problems of the prior art as described above. More specifically, the present invention provides a cutting tool capable of suppressing peeling of a diamond layer on a blade side surface after coating a substrate. [Effects of the Present Invention] According to the above description, peeling of the diamond layer on the blade side surface after coating the substrate can be suppressed. [Explanation of the embodiment of the present invention] First, the embodiment of the present invention will be described. (1) A cutting tool according to one aspect of the present invention includes a cutting surface, a cutting surface connected to the cutting surface, and a cutting edge composed of a ridge line between the cutting surface and the flank surface. A cutting tool according to one aspect of the present invention includes a base material having a first surface as a cutting surface side surface and a second surface as a flank surface side surface, and a diamond layer covering the first surface and the second surface. . A part of the flank face is composed of a base material. A part of the blade surface after being composed of the base material is located between the diamond layer covering the first surface and the diamond layer covering the second surface. According to the cutting tool of (1), it is possible to suppress peeling of the diamond layer on the blade side surface after the substrate is covered. (2) In the cutting tool of (1), the first surface may include a first top surface and a second top surface connected to the second surface, and the second top surface is connected to the first top surface, and the It is arrange | positioned so that a 1st top surface may be interposed with a 2nd surface. The angle formed by the first top surface and the second top surface may be a negative angle in a cross section perpendicular to the cutting edge. According to the cutting tool of (2), peeling of the diamond layer can be further suppressed. (3) In the cutting tool of (2), in a cross section perpendicular to the cutting edge, the distance between the ridge line of the first top surface and the second top surface, and the same cutting edge in a direction parallel to the cutting surface may be 0.001 μm to 5 μm. According to the cutting tool of (3), since the first top surface is covered with the diamond layer thickly, the blade surface after the diamond layer can be suppressed from peeling off. (4) In the cutting tool of (1) to (3), the thickness of the diamond layer on the first surface of the covering substrate may be 0.1 μm or more and 50 μm or less. According to the cutting tool of (4), the blade surface can be further suppressed from peeling off after the diamond layer. (5) In the cutting tools (1) to (4), the radius of curvature of the cutting edge tip may be 0.01 μm or more and 10 μm or less. According to the cutting tool of (5), it is possible to suppress the peeling of the diamond layer on the blade side surface after covering the substrate, and to improve the sharpness of the cutting tool. [Details of the embodiment of the present invention] Hereinafter, details of the embodiment of the present invention will be described with reference to the drawings. It should be noted that the same reference numerals are assigned to the same or corresponding parts in each drawing. In addition, at least a part of the embodiments described below may be arbitrarily combined. (First Embodiment) Hereinafter, a configuration of a cutting tool according to a first embodiment will be described. Fig. 1 is a plan view of a cutting tool according to a first embodiment. The cutting tool of the first embodiment includes a tip portion 1, a blade portion 2, and a shank portion 3. The cutting tool of the embodiment is a spherical end mill. The cutting tool of the first embodiment is not limited to a spherical end mill. For example, the cutting tool of the first embodiment may be an arc-shaped end mill or the like. FIG. 2 is an enlarged plan view of a region II in FIG. 1. As shown in FIG. 2, the cutting tool according to the first embodiment includes a cutting surface 11 and a flank surface 12 at a front end portion 1 (see FIG. 4). The cutting surface 11 is connected to the flank surface 12. A ridge line between the cutting surface 11 and the flank surface 12 constitutes a cutting edge 13. Fig. 3 is a schematic view of cutting processing using the cutting tool of the first embodiment. As shown in FIG. 3, the cutting tool of the first embodiment rotates the cutting axis 13 toward the workpiece while rotating around the central axis A as a center. Thereby, cutting processing of a to-be-cut material is performed. FIG. 4 is a sectional view taken along the line IV-IV in FIG. 2. As shown in FIG. 4, the cutting tool of the first embodiment includes a base material 4 and a diamond layer 5. The base material 4 has a first surface 41 (top surface) and a second surface 42. The first surface 41 is a surface on the cutting surface 11 side of the base material 4. The second surface 42 is a surface on the side of the blade surface 12 after the base material 4. The base material 4 may have a third surface 43. The third surface 43 is connected to the first surface 41 and the second surface 42 and is disposed at a position sandwiched between the first surface 41 and the second surface 42. An angle formed by the third surface 43 and the first surface 41 is an angle θ1. The angle θ1 is greater than 0 ° and less than 90 °. The substrate 4 is covered with a diamond layer 5. More specifically, the first surface 41 and the second surface 42 of the base material 4 are covered with the diamond layer 5, and the third surface 43 of the base material 4 is not covered with the diamond layer 5. That is, a part of the flank face 12 is composed of the base material 4 (third surface 43). A part of the blade surface 12 (the third surface 43) formed by the substrate 4 is located between the diamond layer 5 on the first surface of the coating substrate 4 and the diamond layer 5 on the second surface of the coating substrate 4. To explain this from another point of view, the diamond layer 5 on the first surface 41 of the coated substrate 4 and the diamond layer 5 on the second surface 42 of the coated substrate 4 are not continuous. The diamond layer 5 on the first surface 41 of the coating substrate 4 and the diamond layer 5 on the second surface 42 of the coating substrate 4 may be discontinuous at a part of the cutting edge 13. In particular, the diamond layer 5 on the first surface 41 of the covering substrate 4 and the diamond layer 5 on the second surface 42 of the covering substrate 4 are preferably at least the cutting edge 13 located near the front end 1a of the cutting tool of the embodiment. Everywhere is discontinuous. The reason is that near the front end 1a, the peripheral speed is close to zero during processing, and the load during cutting is particularly large. It is preferable that one part (the third surface 43) of the rear blade surface 12 made of the base material 4 be disposed apart from the cutting edge 13. The thickness of the diamond layer 5 covering the first surface 41 of the substrate 4 is the thickness h. The thickness h is preferably 0.1 μm or more and 50 μm or less. The base material 4 is made of, for example, a cemented carbide containing a powder of WC (tungsten carbide) or a sintered body of a binder such as Co (cobalt). The material used for the substrate 4 is not limited to this. The diamond layer 5 is, for example, a layer containing a diamond crystal. The diamond layer 5 is, for example, a diamond polycrystalline film. The diamond layer 5 may contain a non-diamond component (for example, an amorphous component). The diamond layer 5 may not contain diamond crystals. For example, the diamond layer 5 may be a layer of DLC (Diamond Like Carbon). The radius of curvature of the front end of the cutting edge 13 is the radius of curvature R. The curvature radius R is preferably 0.01 μm or more and 10 μm or less. Hereinafter, a method for manufacturing a cutting tool according to the first embodiment will be described. Fig. 5 is a step diagram of a method for manufacturing a cutting tool according to the first embodiment. As shown in FIG. 5, the method for manufacturing a cutting tool according to the first embodiment includes a diamond layer forming step S1 and a diamond layer removing step S2. The diamond layer removing step S2 may include a cutting surface processing step S21 and a flank surface processing step S22. 6 is a cross-sectional view of a cutting tool of the first embodiment after the diamond layer forming step S1 is completed and before the diamond layer removing step S2 is performed. As shown in FIG. 6, in the diamond layer forming step S1, a diamond layer 5 is formed on the substrate 4, and the substrate 4 is covered with the diamond layer 5. The diamond layer 5 is formed using, for example, HFCVD (Hot Filament Chemical Vapor Deposition). At this stage, the periphery of the front end of the cutting tool of the first embodiment is rounded. This is because when the diamond layer 5 is formed, the temperature around the front end of the cutting tool of the first embodiment is higher than other parts, which promotes the formation of the diamond layer 5. In the diamond layer removing step S2, the diamond layer 5 of the coated substrate 4 is partially removed. In the diamond layer removing step S2, the substrate 4 is exposed from the flank 12 by removing the diamond layer 5 covering the second surface 42 of the substrate 4. FIG. 7 is a cross-sectional view of the cutting tool of the first embodiment after the cutting surface processing step S21 is completed and the flank surface processing step S22 is performed. As shown in FIG. 7, in the cutting surface processing step S21, the diamond layer 5 on the first surface 41 of the covering substrate 4 is partially removed. By partially removing the diamond layer 5 on the first surface 41 of the covering substrate 4, the circle on the cutting surface 11 side of the cutting tool front end of the first embodiment becomes flat. The diamond layer 5 is removed by irradiating the cutting surface 11 with a laser. The laser used for the removal of the diamond layer 5 is, for example, twice the harmonics of the YVО 4 laser. In the flank surface processing step S22, the diamond layer 5 of the second surface 42 of the coated substrate 4 is partially removed. The part of the diamond layer 5 covering the second surface 42 of the substrate 4 is continuously removed until the substrate 4 is exposed from the flank surface 12. Thereby, the structure of the cutting tool of the 1st embodiment shown in FIG. 4 is formed. With the removal of the part of the diamond layer 5 on the second surface 42 of the coating base material 4, the circular shape of the cutting surface side of the cutting tool of the first embodiment after the front end is flattened. Thereby, the cutting edge 13 of the cutting tool of the first embodiment is sharpened to obtain a cutting edge 13 having a curvature radius R of 0.01 μm or more and 10 μm or less. The removal of the diamond layer 5 on the second surface 42 of the coated substrate 4 is performed by irradiating a laser to the flank 12 side. The laser used for the removal of the diamond layer 5 is, for example, twice the harmonics of the YVО 4 laser. (Second Embodiment) The structure of a cutting tool according to a second embodiment will be described below. In the following, differences between the cutting tool and the cutting tool of the first embodiment will be mainly described, and the same description will not be repeated. Fig. 8 is a sectional view of a cross section perpendicular to the cutting edge 13 of the cutting tool of the second embodiment. As shown in FIG. 8, the cutting tool of the second embodiment includes a cutting surface 11, a flank surface 12, and a cutting edge 13. The cutting tool of the second embodiment includes a base material 4 and a diamond layer 5. In the cutting tool of the second embodiment, the base material 4 is exposed from the flank face 12 (that is, a part of the flank face 12 is composed of the base material 4), and a part of the back face 12 is formed on the coated substrate. The diamond layer 5 on the first surface 41 of 4 and the diamond layer 5 on the second surface 42 of the substrate 4 are covered. In these respects, the cutting tool of the second embodiment is common to the cutting tool of the first embodiment. On the other hand, the cutting tool of the second embodiment is different from the cutting tool of the first embodiment in the following points. In the cutting tool of the second embodiment, the first surface 41 of the base material 4 has a first top surface 41a and a second top surface 41b. The first top surface 41 a is connected to the second surface 42 of the base material 4. The second top surface 41b is continuous with the first top surface 41a. The second top surface 41b is disposed between the first top surface 41a and the second surface 42 of the base material 4. An angle formed by the first top surface 41a and the second top surface 41b is an angle θ2. The angle θ2 is a negative angle. The negative angle θ2 means that when the cutting tool is disposed with the second top surface 41b facing upward and the cutting edge 13 to the left, the first top surface 41a is divided by the first top surface 41a and the second top surface 41b. The boundary line of the top surface 41b is a case where the center rotates counterclockwise. From another point of view, the negative angle θ2 means that when the cutting tool is disposed with the second top surface 41b facing upward and the cutting edge 13 facing left, the first top surface 41a faces downward toward the second top surface 41b. Sloping situation. The thickness of the diamond layer 5 covering the first top surface 41a of the base material 4 is the thickness h1. The thickness h1 is the distance between the ridgeline of the first top surface 41 a and the second surface 42 and the cutting surface 11. The thickness of the diamond layer 5 covering the second top surface 41b of the base material 4 is the thickness h2. The thickness h2 is the distance between the second top surface 41b and the cutting surface 11. Since the angle θ2 is a negative angle, the thickness h1> thickness h2. The distance between the ridgeline of the first top surface 41 a and the second top surface 41 b and the cutting edge 13 is a distance L. The distance L is a distance in a direction parallel to the cutting surface 11 on a cross section perpendicular to the cutting edge 13. The distance L is preferably 0.001 μm or more and 5 μm or less. Hereinafter, a method for manufacturing a cutting tool according to the second embodiment will be described. The manufacturing method of the cutting tool of the second embodiment is the same as the manufacturing method of the cutting tool of the first embodiment, and includes a diamond layer forming step S1 and a diamond layer removing step S2, and the diamond layer removing step S2 includes a cutting surface processing step. S21 and the flank face processing step S22. However, the manufacturing method of the cutting tool of the second embodiment is different from the manufacturing method of the cutting tool of the first embodiment in that the first surface 41 of the substrate 4 used has a first top surface 41a and a second top surface 41b. . (Effects of the cutting tool of the first embodiment and the cutting tool of the second embodiment) Hereinafter, effects of the cutting tool of the first embodiment and the cutting tool of the second embodiment will be described. First, the effect of the cutting tool of the first embodiment will be described by comparison with a comparative example. FIG. 9 is a cross-sectional view of a cross section perpendicular to the cutting edge 13 of the cutting tool of the comparative example. As shown in FIG. 9, the cutting tool of the comparative example includes a cutting surface 11, a flank surface 12, and a cutting edge 13. The cutting tool of the comparative example includes a substrate 4 and a diamond layer 5. In the cutting tool of the comparative example, the diamond layer 5 covers the first surface 41 and the second surface 42 of the base material 4, and the flank surface 12 is not exposed from the base material 4. That is, in the cutting tool of the comparative example, the diamond layer 5 is continuously (without slits) covering the first surface 41 and the second surface 42 of the base material 4. When cutting is performed using the cutting tool of the comparative example, the main component force (the cutting force from the cutting surface 11 toward the flank 12) is applied from the material to be cut near the cutting edge 13 of the cutting surface 11. In the cutting tool of the comparative example, since the diamond layer 5 covers the first surface 41 and the second surface 42 of the substrate 4 continuously (without slits), the main component force easily acts on the first surface 41 of the substrate 4. 2 面 42 的 钻石 层 5。 5 diamond layer 5 on the surface 42. As a result, in the cutting tool of the comparative example, the blade surface was easily peeled after the diamond layer 5. On the other hand, as described above, in the cutting tool of the first embodiment, a part of the flank face 12 is composed of the base material 4, and a part of the flank face 12 composed of the base material 4 is located at the first position of the coated base material 4. Between the diamond layer 5 on the first side 41 and the diamond layer 5 on the second side of the covering substrate 4. That is, the diamond layer 5 on the first surface 41 of the covering substrate 4 and the diamond layer 5 on the second surface 42 of the covering substrate 4 are discontinuous at least in part of the cutting edge 13. Therefore, in the cutting tool of the first embodiment, it is difficult for the main component force generated on the cutting surface 11 during the cutting process to act on the diamond layer 5 of the second surface 42 of the covering substrate 4. As a result, according to the cutting tool of the first embodiment, peeling of the blade face after the diamond layer 5 can be suppressed. Next, the effect of the cutting tool of the second embodiment will be described. As described above, in the cutting tool of the second embodiment, the first surface 41 of the base material 4 has the first top surface 41a and the second top surface 41b, and the angle θ2 is a negative angle. Therefore, in the cutting tool of the second embodiment, the diamond layer 5 contacts the first surface 41 of the base material 4 with a larger area than the cutting tool of the first embodiment. Therefore, according to the cutting tool of the second embodiment, the peeling of the diamond layer 5 can be further suppressed. As described above, in the cutting tool of the second embodiment, the thickness h1> thickness h2. Therefore, in the cutting tool of the second embodiment, the thickness of the diamond layer 5 covering the first surface 41 of the base material 4 can be secured in the vicinity of the cutting edge 13. Therefore, according to the cutting tool of the second embodiment, it is possible to further suppress peeling of the flank face. It should be recognized that all aspects of the embodiments disclosed herein are illustrative and not restrictive. The scope of the present invention is not expressed by the above-mentioned embodiments, but is expressed by the scope of patent application, and includes the meaning equivalent to the scope of patent application and all changes within the scope.

1‧‧‧前端部1‧‧‧ front end

1a‧‧‧切削工具之前端1a‧‧‧ cutting tool front

2‧‧‧刀身部2‧‧‧Blade part

3‧‧‧刀柄部3‧‧‧ knife handle

4‧‧‧基材4‧‧‧ substrate

5‧‧‧金剛石層5‧‧‧ diamond layer

11‧‧‧切削面11‧‧‧cut surface

12‧‧‧後刀面12‧‧‧ flank

13‧‧‧切削刃13‧‧‧ cutting edge

41‧‧‧第1面41‧‧‧Part 1

41a‧‧‧第1頂面41a‧‧‧1st top surface

41b‧‧‧第2頂面41b‧‧‧ 2nd top surface

42‧‧‧第2面42‧‧‧ second side

43‧‧‧第3面43‧‧‧3rd

A‧‧‧中心軸A‧‧‧center axis

h、h1、h2‧‧‧厚度h, h1, h2‧‧‧thickness

L‧‧‧距離L‧‧‧ Distance

R‧‧‧曲率半徑R‧‧‧ radius of curvature

S1‧‧‧金剛石層形成步驟S1‧‧‧ diamond layer formation step

S2‧‧‧金剛石層除去步驟S2‧‧‧ diamond layer removal step

S21‧‧‧切削面處理步驟S21‧‧‧ Cutting surface processing steps

S22‧‧‧後刀面處理步驟S22‧‧‧Backface treatment steps

θ1、θ2‧‧‧角度θ1, θ2‧‧‧ angle

圖1係第1實施形態之切削工具之俯視圖。 圖2係圖1之區域II之放大俯視圖。 圖3係使用有第1實施形態之切削工具之切削加工之模式圖。 圖4係圖2之IV-IV之剖視圖。 圖5係第1實施形態之切削工具之製造方法之步驟圖。 圖6係於金剛石層形成步驟結束之後且金剛石層除去步驟進行之前之第1實施形態之切削工具之剖視圖。 圖7係切削面處理步驟結束之後且後刀面處理步驟進行之前之第1實施形態之切削工具之剖視圖。 圖8係與第2實施形態之切削工具之切削刃垂直之剖面之剖視圖。 圖9係與比較例之切削工具之切削刃垂直之剖面之剖視圖。Fig. 1 is a plan view of a cutting tool according to a first embodiment. FIG. 2 is an enlarged plan view of a region II in FIG. 1. Fig. 3 is a schematic view of cutting processing using the cutting tool of the first embodiment. FIG. 4 is a sectional view taken along the line IV-IV in FIG. 2. Fig. 5 is a step diagram of a method for manufacturing a cutting tool according to the first embodiment. 6 is a cross-sectional view of a cutting tool of the first embodiment after the diamond layer forming step is completed and before the diamond layer removing step is performed. FIG. 7 is a cross-sectional view of a cutting tool of the first embodiment after the cutting surface processing step is completed and before the flank surface processing step is performed. Fig. 8 is a sectional view of a cross section perpendicular to the cutting edge of the cutting tool of the second embodiment. 9 is a cross-sectional view of a cross section perpendicular to the cutting edge of the cutting tool of the comparative example.

Claims (5)

一種切削工具，其具備切削面、與上述切削面相連之後刀面、及由上述切削面與上述後刀面之稜線構成之切削刃，且具備： 基材，其具有作為上述切削面側之面之第1面、及作為上述後刀面側之面之第2面；及 金剛石層，其被覆上述第1面及上述第2面；且 上述後刀面之一部分由上述基材構成， 由上述基材構成之上述後刀面之上述一部分係位於被覆上述第1面之上述金剛石層與被覆上述第2面之上述金剛石層之間。A cutting tool includes a cutting surface, a cutting surface connected to the cutting surface, and a cutting edge composed of a ridge line between the cutting surface and the flank surface, and includes: a base material having a surface as the cutting surface A first surface and a second surface that is the side of the flank surface; and a diamond layer covering the first and second surfaces; and a part of the flank surface is composed of the base material and The part of the flank face made of the base material is located between the diamond layer covering the first surface and the diamond layer covering the second surface. 如請求項1之切削工具，其中上述第1面包含與上述第2面相連之第1頂面、及第2頂面，該第2頂面與上述第1頂面相連，且以於與上述第2面之間夾著上述第1頂面之方式配置， 於與上述切削刃垂直之剖面，上述第1頂面與上述第2頂面所成之角度為負角。For example, the cutting tool of claim 1, wherein the first surface includes a first top surface and a second top surface connected to the second surface, and the second top surface is connected to the first top surface, and is connected to the first surface. The second surface is arranged with the first top surface interposed therebetween, and in a cross section perpendicular to the cutting edge, an angle formed by the first top surface and the second top surface is a negative angle. 如請求項2之切削工具，其中於與上述切削刃垂直之剖面，上述第1頂面與上述第2頂面之稜線、與上述切削刃之於與上述切削面平行之方向上之距離為0.001 μm以上且5 μm以下。The cutting tool of claim 2, wherein the distance between the cross section perpendicular to the cutting edge, the ridge line between the first top surface and the second top surface, and the cutting edge in a direction parallel to the cutting surface is 0.001. μm or more and 5 μm or less. 如請求項1之切削工具，其中被覆上述基材之上述第1面之上述金剛石層之厚度為0.1 μm以上且50 μm以下。The cutting tool according to claim 1, wherein the thickness of the diamond layer covering the first surface of the base material is 0.1 μm or more and 50 μm or less. 如請求項1至4中任一項之切削工具，其中上述切削刃之前端之曲率半徑為0.01 μm以上且10 μm以下。The cutting tool according to any one of claims 1 to 4, wherein the radius of curvature of the front end of the cutting edge is 0.01 μm or more and 10 μm or less.
TW106125825A 2016-09-29 2017-08-01 Cutting tool TW201813745A (en)

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