TW201811562A - Method of manufacturing resin laminate - Google Patents

Method of manufacturing resin laminate Download PDF

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Publication number
TW201811562A
TW201811562A TW106117160A TW106117160A TW201811562A TW 201811562 A TW201811562 A TW 201811562A TW 106117160 A TW106117160 A TW 106117160A TW 106117160 A TW106117160 A TW 106117160A TW 201811562 A TW201811562 A TW 201811562A
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Taiwan
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resin
mass
meth
manufacturing
thermoplastic
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TW106117160A
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Chinese (zh)
Inventor
大松一喜
大関美保
山下恭弘
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住友化學股份有限公司
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Publication of TW201811562A publication Critical patent/TW201811562A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/88Thermal treatment of the stream of extruded material, e.g. cooling
    • B29C48/911Cooling
    • B29C48/9135Cooling of flat articles, e.g. using specially adapted supporting means
    • B29C48/914Cooling of flat articles, e.g. using specially adapted supporting means cooling drums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B29C48/21Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention provides a method for producing a resin laminate excellent in transparency. The method for manufacturing resin laminate of the present invention has at least an intermediate layer (A), and thermoplastic resin layers (B) and (C) present on both sides of the intermediate layer (A); wherein the intermediate layer (A) is formed from a resin composition (a), the thermoplastic resin layers (B) and (C) are each formed from a thermoplastic resin (b) and (c); the method includes a step of discharging a molten resin laminate at least formed from the molten resin composition (a), thermoplastic resin (b) and (c), and cooling it; the resin composition (a) contains 10 to 90% by mass of (meth)acrylic resin and 90 to 10% by mass of vinylidene fluoride resin, based on the total resin contained in the resin composition (a), the weight average molecular weight (Mw) of the (meth)acrylic resin is 100,000 to 300,000; in the step, the average cooling rate from the discharge temperature to 100 DEG C is 2.5 DEG C/s or more.

Description

樹脂積層體的製造方法    Manufacturing method of resin laminated body   

本發明係關於例如適合使用於顯示裝置的樹脂積層體的製造方法。 This invention relates to the manufacturing method of the resin laminated body suitable for a display device, for example.

近年來,在智慧型手機、攜帶型遊戲機、音頻播放器、平板終端等顯示裝置,具備觸控螢幕者逐漸增加。在如此的顯示裝置的表面,通常使用玻璃片,但從顯示裝置的輕量化的傾向、加工性的點,正進行成為玻璃片的替代品之塑膠片的開發。例如,於專利文獻1,就成為玻璃片的替代品之塑膠片,揭示包含甲基丙烯酸樹脂與偏二氟乙烯樹脂的透明片及包含該透明片的多層片,且記載該等薄片充分滿足透明性及相對介電常數。 In recent years, display devices such as smart phones, portable game consoles, audio players, and tablet terminals have gradually increased the number of people with touch screens. A glass sheet is generally used on the surface of such a display device. However, from the viewpoint of the tendency of weight reduction and workability of the display device, the development of a plastic sheet as a substitute for the glass sheet is being carried out. For example, in Patent Document 1, a plastic sheet that has become a substitute for a glass sheet is disclosed as a transparent sheet including a methacrylic resin and a vinylidene fluoride resin, and a multilayer sheet including the transparent sheet, and it is described that these sheets sufficiently satisfy transparency And relative dielectric constant.

[先前技術文獻]     [Prior technical literature]     [專利文獻]     [Patent Literature]    

[專利文獻1]日本特開2013-244604號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2013-244604

依含有甲基丙烯酸樹脂與偏二氟乙烯樹脂 的透明片的製造方法而定,會有在樹脂積層體可見到部分的白濁,無法製造透明的樹脂積層體的情況。本發明人等,檢討藉由擠出成形的樹脂積層體的製造方法,結果得知將從模頭吐出的熔融樹脂積層體冷卻時,樹脂積層體有白濁,透明性降低的情況。 Depending on the method for producing a transparent sheet containing a methacrylic resin and a vinylidene fluoride resin, a part of white turbidity may be seen in the resin laminate, and a transparent resin laminate may not be produced. The present inventors reviewed a method for manufacturing a resin laminate by extrusion, and as a result, it was found that when the molten resin laminate discharged from a die is cooled, the resin laminate may become cloudy and the transparency may be reduced.

所以,本發明的目的在於提供透明性佳的樹脂積層體的製造方法。 Therefore, an object of the present invention is to provide a method for producing a resin laminate having excellent transparency.

本發明人等,為了解決上述課題,重複仔細檢討的結果,而完成本發明。亦即,本發明包含以下適合的態樣。 In order to solve the above problems, the present inventors repeated the results of careful review to complete the present invention. That is, the present invention includes the following suitable aspects.

[1]一種樹脂積層體的製造方法,其中,該樹脂積層體係至少具有中間層(A)以及分別存在於該中間層(A)的兩側的熱塑性樹脂層(B)及(C);該中間層(A)係由樹脂組成物(a)形成,該熱塑性樹脂層(B)及(C)係分別由熱塑性樹脂(b)及(c)形成;該製造方法包括:將至少由熔融的樹脂組成物(a)、熱塑性樹脂(b)及(c)所形成的熔融樹脂積層體從模頭吐出並冷卻的步驟;基於樹脂組成物(a)所含的全部樹脂而言,該樹脂組成物(a)包含10至90質量%的(甲基)丙烯酸樹脂及90至10質量%的偏二氟乙烯樹脂,該(甲基)丙烯酸樹脂的重量平均分子量(Mw)為100,000至300,000;於該步驟中,從吐出溫度至100℃為止的平均冷卻速 度為2.5℃/秒以上。 [1] A method for producing a resin laminate, wherein the resin laminate system has at least an intermediate layer (A) and thermoplastic resin layers (B) and (C) that are respectively present on both sides of the intermediate layer (A); the The intermediate layer (A) is formed of a resin composition (a), and the thermoplastic resin layers (B) and (C) are respectively formed of a thermoplastic resin (b) and (c); the manufacturing method includes: The step of ejecting and cooling the molten resin laminate formed from the resin composition (a), the thermoplastic resin (b), and (c) from the die; based on all the resins contained in the resin composition (a), the resin composition The object (a) contains 10 to 90% by mass of a (meth) acrylic resin and 90 to 10% by mass of a vinylidene fluoride resin, and the weight average molecular weight (Mw) of the (meth) acrylic resin is 100,000 to 300,000; and In this step, the average cooling rate from the discharge temperature to 100 ° C is 2.5 ° C / second or more.

[2]前述[1]所記載的方法,其係藉由冷卻滾輪冷卻前述熔融樹脂積層體。 [2] The method according to the above [1], wherein the molten resin laminate is cooled by a cooling roller.

[3]前述[1]或[2]所記載的方法,其中,前述吐出溫度為220至300℃。 [3] The method according to the above [1] or [2], wherein the discharge temperature is 220 to 300 ° C.

[4]前述[1]至[3]中任一項所記載的方法,其中,基於樹脂組成物(a)所含的全部樹脂而言,該樹脂組成物(a)包含35至45質量%的(甲基)丙烯酸樹脂及65至55質量%的偏二氟乙烯樹脂。 [4] The method according to any one of the above [1] to [3], wherein the resin composition (a) contains 35 to 45% by mass based on the entire resin contained in the resin composition (a) (Meth) acrylic resin and 65 to 55 mass% of vinylidene fluoride resin.

[5]前述[1]至[4]中任一項所記載的方法,其中,樹脂組成物(a)的鹼金屬的含量,基於該樹脂組成物(a)所含的全部樹脂而言為50ppm以下。 [5] The method according to any one of the above [1] to [4], wherein the content of the alkali metal in the resin composition (a) is based on all resins contained in the resin composition (a) 50ppm or less.

[6]前述[1]至[5]中任一項所記載的方法,其中,(甲基)丙烯酸樹脂為(a1)甲基丙烯酸甲酯的均聚物;及/或(a2)基於構成聚合物的全部構造單元而言包含50至99.9質量%的來自甲基丙烯酸甲酯的構造單元及0.1至50質量%的來自式(1)表示的(甲基)丙烯酸酯的至少一個構造單元的共聚物: [式中,R1表示氫原子或甲基,R1為氫原子時R2表示碳數1至8的烷基,R1為甲基時R2表示碳數2至8的烷基]。 [6] The method according to any one of the above [1] to [5], wherein the (meth) acrylic resin is a homopolymer of (a1) methyl methacrylate; and / or (a2) is based on a constitution The total structural unit of the polymer contains 50 to 99.9% by mass of a structural unit derived from methyl methacrylate and 0.1 to 50% by mass of at least one structural unit derived from a (meth) acrylate represented by formula (1). Copolymer: [Wherein, R 1 represents a hydrogen atom or a methyl group, R 1 is a hydrogen atom when R 2 represents an alkyl group having 1 to 8 carbon atoms, and R 1 is methyl R 2 represents an alkyl group having a carbon number of 2-8].

[7]前述[1]至[6]中任一項所記載的方法,其中,偏二氟乙烯樹脂為聚偏二氟乙烯。 [7] The method according to any one of the above [1] to [6], wherein the vinylidene fluoride resin is polyvinylidene fluoride.

[8]前述[1]至[7]中任一項所記載的方法,其中,偏二氟乙烯樹脂的熔體質量流動速率,在3.8kg負重、230℃下測定為0.1至40g/10分鐘。 [8] The method according to any one of the above [1] to [7], wherein the melt mass flow rate of the vinylidene fluoride resin is 0.1 to 40 g / 10 minutes measured at 230 ° C under a 3.8 kg load. .

[9]前述[1]至[8]中任一項所記載的方法,其中,樹脂積層體的膜厚的平均值為100至2000μm,熱塑性樹脂層(B)及(C)的膜厚的平均值分別為10至200μm。 [9] The method according to any one of the above [1] to [8], wherein the average film thickness of the resin laminate is 100 to 2000 μm, and the film thickness of the thermoplastic resin layers (B) and (C) The average values are 10 to 200 μm, respectively.

[10]前述[1]至[9]中任一項所記載的方法,其中,熱塑性樹脂(b)及(c)各自所含的樹脂的菲卡(Vicat)軟化溫度為100至160℃。 [10] The method according to any one of the above [1] to [9], wherein the Vicat softening temperature of the resin contained in each of the thermoplastic resins (b) and (c) is 100 to 160 ° C.

[11]前述[1]至[10]中任一項所記載的方法,其中,熱塑性樹脂(b)及(c)分別包含(甲基)丙烯酸樹脂或聚碳酸酯樹脂。 [11] The method according to any one of the above [1] to [10], wherein the thermoplastic resins (b) and (c) each contain a (meth) acrylic resin or a polycarbonate resin.

[12]前述[1]至[11]中任一項所記載的方法,其中,熱塑性樹脂(b)及(c)分別包含聚碳酸酯樹脂、以及基於各熱塑性樹脂(b)及(c)所含的全部樹脂而言為0.005至2.0質量%的紫外線吸收劑。 [12] The method according to any one of the above [1] to [11], wherein the thermoplastic resins (b) and (c) include a polycarbonate resin, and the thermoplastic resins (b) and (c) The total amount of the resin contained is 0.005 to 2.0% by mass of the ultraviolet absorber.

[13]前述[1]至[11]中任一項所記載的方法,其中,基於各熱塑性樹脂(b)及(c)所含的全部樹脂而言,熱塑性樹脂(b)及(c)分別包含50質量%以上的(甲基)丙烯酸樹脂。 [13] The method according to any one of the above [1] to [11], wherein the thermoplastic resins (b) and (c) are based on all the resins contained in each of the thermoplastic resins (b) and (c) Each contains 50% by mass or more of (meth) acrylic resin.

[14]前述[13]所記載的方法,其中,熱塑性樹脂(b)及(c)各自所含的(甲基)丙烯酸樹脂的重量平均分子量為50,000至300,000。 [14] The method according to the above [13], wherein the weight average molecular weight of the (meth) acrylic resin contained in each of the thermoplastic resins (b) and (c) is 50,000 to 300,000.

根據本發明的製造方法,可得到透明性佳的樹脂積層體。 According to the production method of the present invention, a resin laminate having excellent transparency can be obtained.

1‧‧‧擠出機 1‧‧‧ Extruder

2‧‧‧擠出機 2‧‧‧ Extruder

3‧‧‧擠出機 3‧‧‧ Extruder

4‧‧‧進料區塊 4‧‧‧Feed block

5‧‧‧多歧管型模頭 5‧‧‧Multi-manifold Die

6‧‧‧熔融樹脂積層體 6‧‧‧ Molten resin laminate

7‧‧‧第一冷卻滾輪 7‧‧‧The first cooling roller

8‧‧‧第二冷卻滾輪 8‧‧‧Second cooling roller

9‧‧‧第三冷卻滾輪 9‧‧‧Third cooling roller

10‧‧‧樹脂積層體 10‧‧‧Resin laminate

10A‧‧‧中間層(A) 10A‧‧‧Intermediate Level (A)

10B‧‧‧熱塑性樹脂層(B) 10B‧‧‧Thermoplastic resin layer (B)

10C‧‧‧熱塑性樹脂層(C) 10C‧‧‧Thermoplastic resin layer (C)

11‧‧‧偏光板 11‧‧‧ polarizing plate

12‧‧‧光學黏著層 12‧‧‧ Optical Adhesive Layer

13‧‧‧液晶單元 13‧‧‧LCD cell

14‧‧‧液晶顯示裝置 14‧‧‧ Liquid crystal display device

15‧‧‧單軸擠出機(擠出熱塑性樹脂b的熔融物) 15‧‧‧Single-screw extruder (extrusion of melt of thermoplastic resin b)

16‧‧‧單軸擠出機(擠出樹脂組成物a的熔融物) 16‧‧‧Single-screw extruder (extruded melt of resin composition a)

17‧‧‧單軸擠出機(擠出熱塑性樹脂c的熔融物) 17‧‧‧Single-screw extruder (extrusion of melt of thermoplastic resin c)

18‧‧‧進料區塊 18‧‧‧Feed block

19‧‧‧多歧管型模頭 19‧‧‧Multi-manifold Die

20‧‧‧膜狀的熔融樹脂積層體 20‧‧‧ film-like molten resin laminate

21‧‧‧第一冷卻滾輪 21‧‧‧The first cooling roller

22‧‧‧第二冷卻滾輪 22‧‧‧Second cooling roller

23‧‧‧第三冷卻滾輪 23‧‧‧Third cooling roller

24‧‧‧第四冷卻滾輪 24‧‧‧Fourth cooling roller

25‧‧‧第五冷卻滾輪 25‧‧‧Fifth cooling roller

26‧‧‧樹脂積層體 26‧‧‧Resin laminate

第1圖係表示藉由本發明的製造方法所得之樹脂積層體的製造裝置的一例的概略圖。 FIG. 1 is a schematic diagram showing an example of a manufacturing apparatus for a resin laminate obtained by the manufacturing method of the present invention.

第2圖係表示包含藉由本發明的製造方法所得之樹脂積層體的液晶顯示裝置的一態樣的剖面示意圖。 FIG. 2 is a schematic cross-sectional view showing an aspect of a liquid crystal display device including a resin laminate obtained by the manufacturing method of the present invention.

第3圖係表示使用於實施例的藉由本發明所得之樹脂積層體的製造裝置的概略圖。 Fig. 3 is a schematic view showing a manufacturing apparatus for a resin laminate obtained by the present invention and used in Examples.

本發明係製造至少具有中間層(A)以及分別存在於該中間層(A)的兩側的熱塑性樹脂層(B)及(C)的樹脂積層體的方法;該中間層(A)係由樹脂組成物(a)形成,該熱塑性樹脂層(B)及(C)係分別由熱塑性樹脂(b)及(c)形成。 The present invention is a method for manufacturing a resin laminate having at least an intermediate layer (A) and thermoplastic resin layers (B) and (C) that are present on both sides of the intermediate layer (A); the intermediate layer (A) is composed of The resin composition (a) is formed, and the thermoplastic resin layers (B) and (C) are each formed of a thermoplastic resin (b) and (c).

該樹脂組成物(a)包含(甲基)丙烯酸樹脂及偏二氟乙烯樹脂。 This resin composition (a) contains a (meth) acrylic resin and a vinylidene fluoride resin.

(甲基)丙烯酸樹脂,可舉例如(甲基)丙烯酸酯及(甲基)丙烯腈等(甲基)丙烯酸單體的均聚物、2種以上的(甲基)丙烯酸單體的共聚物、(甲基)丙烯酸單體與(甲基)丙烯酸單體以外的單體的共聚物等。再者,於本說明書中,所謂「(甲基)丙烯酸」的用語,係意指「丙烯酸」或「甲基丙烯酸」。 Examples of the (meth) acrylic resin include homopolymers of (meth) acrylic monomers such as (meth) acrylates and (meth) acrylonitrile, and copolymers of two or more (meth) acrylic monomers. , A copolymer of a (meth) acrylic monomer and a monomer other than the (meth) acrylic monomer, and the like. In addition, in this specification, the term "(meth) acrylic acid" means "acrylic acid" or "methacrylic acid."

從容易提高樹脂積層體的硬度、耐候性、 透明性的觀點來看,(甲基)丙烯酸樹脂較佳為甲基丙烯酸樹脂。甲基丙烯酸樹脂,係以甲基丙烯酸酯(甲基丙烯酸烷酯)為主體的單體的聚合物,可舉例如甲基丙烯酸酯的均聚物(聚甲基丙烯酸烷酯)、2種以上的甲基丙烯酸酯的共聚物、50質量%以上的甲基丙烯酸酯與50質量%以下的甲基丙烯酸酯以外的單體的共聚物等。就甲基丙烯酸酯與甲基丙烯酸酯以外的單體的共聚物而言,從容易提高樹脂積層體的光學特性、耐候性的觀點來看,較佳係相對於單體的總量而言70質量%以上的甲基丙烯酸酯與30質量%以下的其他單體的共聚物,更佳係90質量%以上的甲基丙烯酸酯與10質量%以下的其他單體的共聚物。 From the viewpoint of easily improving the hardness, weather resistance, and transparency of the resin laminate, the (meth) acrylic resin is preferably a methacrylic resin. The methacrylic resin is a polymer of monomers mainly composed of methacrylate (alkyl methacrylate), and examples thereof include a homopolymer of methacrylate (polyalkyl methacrylate) and two or more kinds Copolymers of methacrylates, copolymers of 50% by mass or more of methacrylates and monomers other than 50% by mass of methacrylates, and the like. The copolymer of a methacrylate and a monomer other than methacrylate is preferably 70 with respect to the total amount of the monomer from the viewpoint of easily improving the optical characteristics and weather resistance of the resin laminate. The copolymer of methacrylate and 30% by mass of other monomers is preferably a copolymer of 90% by mass or more of methacrylate and 10% by mass of other monomers.

甲基丙烯酸酯以外的單體,可舉例如丙烯酸酯、分子內具有1個聚合性的碳-碳雙鍵的單官能單體。 Examples of the monomer other than the methacrylate include acrylate and a monofunctional monomer having one polymerizable carbon-carbon double bond in the molecule.

單官能單體,可舉例如:苯乙烯、α-甲基苯乙烯及乙烯基甲苯等苯乙烯單體;丙烯腈及甲基丙烯腈等氰化烯;丙烯酸;甲基丙烯酸;馬來酸酐;N-取代馬來醯亞胺等。 Monofunctional monomers include, for example, styrene monomers such as styrene, α-methylstyrene, and vinyl toluene; cyanoolefins such as acrylonitrile and methacrylonitrile; acrylic acid; methacrylic acid; maleic anhydride; N-substituted maleimine and the like.

從耐熱性的觀點來看,(甲基)丙烯酸樹脂可與苯基馬來醯亞胺、環己基馬來醯亞胺及甲基馬來醯亞胺等N-取代馬來醯亞胺共聚合,也可於分子鏈中(亦稱為聚合物中的主骨架中或主鏈中)導入內酯環構造、戊二酸酐構造或戊二醯亞胺構造等。 From the viewpoint of heat resistance, (meth) acrylic resins can be copolymerized with N-substituted maleimines such as phenylmaleimide, cyclohexylmaleimide, and methylmaleimide. , It is also possible to introduce a lactone ring structure, a glutaric anhydride structure, or a glutarimide structure into the molecular chain (also referred to as the main skeleton or the main chain in the polymer).

從容易提高樹脂積層體的硬度、耐候性、透明性的觀點來看,(甲基)丙烯酸樹脂具體上較佳為: (a1)甲基丙烯酸甲酯的均聚物;及/或(a2)基於構成共聚物的全部構造單元而言包含50至99.9質量%、較佳為70.0至99.8質量%、更佳為80.0至99.7質量%的來自甲基丙烯酸甲酯的構造單元及0.1至50質量%、較佳為0.2至30質量%、更佳為0.3至20質量%的來自式(1)表示的(甲基)丙烯酸酯的至少一個構造單元的共聚物: [式中,R1表示氫原子或甲基,R1為氫原子時R2表示碳數1至8的烷基,R1為甲基時R2表示碳數2至8的烷基]。此處,各構造單元的含量,可藉由將所得的聚合物藉由熱分解氣相層析分析,測定對應各單體的峰面積而計算出。 From the viewpoint of easily improving the hardness, weather resistance, and transparency of the resin laminate, the (meth) acrylic resin is specifically preferably: (a1) a homopolymer of methyl methacrylate; and / or (a2) 50 to 99.9% by mass, preferably 70.0 to 99.8% by mass, more preferably 80.0 to 99.7% by mass, based on all the structural units constituting the copolymer, and 0.1 to 50% by mass , Preferably from 0.2 to 30% by mass, more preferably from 0.3 to 20% by mass, a copolymer derived from at least one structural unit of the (meth) acrylate represented by formula (1): [Wherein, R 1 represents a hydrogen atom or a methyl group, R 1 is a hydrogen atom when R 2 represents an alkyl group having 1 to 8 carbon atoms, and R 1 is methyl R 2 represents an alkyl group having a carbon number of 2-8]. Here, the content of each structural unit can be calculated by analyzing the obtained polymer by thermal decomposition gas chromatography and measuring the peak area corresponding to each monomer.

於式(1)中,R1表示氫原子或甲基,R1為氫原子時R2表示碳數1至8的烷基,R1為甲基時R2表示碳數2至8的烷基。碳數2至8的烷基,可舉例如乙基、丙基、異丙基、丁基、第二丁基、第三丁基、戊基、己基、庚基、辛基等。從耐熱性的觀點來看,R2較佳為碳數2至4的烷基,更佳為乙基。 In the formula (1), R 1 represents a hydrogen atom or a methyl group, R 1 is a hydrogen atom when R 2 represents an alkyl group of 1 to 8 carbon atoms, R 1 is a methyl group R 2 represents alkyl of 2-8 carbon atoms, base. Examples of the alkyl group having 2 to 8 carbon atoms include ethyl, propyl, isopropyl, butyl, second butyl, third butyl, pentyl, hexyl, heptyl, and octyl. From the viewpoint of heat resistance, R 2 is preferably an alkyl group having 2 to 4 carbon atoms, and more preferably an ethyl group.

樹脂組成物(a)所含的(甲基)丙烯酸樹脂的重量平均分子量(以下有時記載為Mw)為100,000至300,000。Mw低於上述下限時,暴露於高溫高濕環境下時的樹脂積層體的透明性不足,Mw高於上述上限時,無法 得到製造樹脂積層體時的成膜性。從容易提高暴露於高溫高濕環境下時的樹脂積層體的透明性的觀點來看,(甲基)丙烯酸樹脂的Mw較佳為120,000以上,更佳為150,000以上。從製造樹脂積層體時的成膜性的觀點來看,(甲基)丙烯酸樹脂的Mw較佳為250,000以下,更佳為200,000以下。重量平均分子量,係藉由凝膠滲透層析(GPC)測定。 The weight average molecular weight (hereinafter sometimes referred to as Mw) of the (meth) acrylic resin contained in the resin composition (a) is 100,000 to 300,000. When Mw is lower than the lower limit described above, the transparency of the resin laminate is insufficient when exposed to a high temperature and high humidity environment, and when Mw is higher than the upper limit described above, the film-forming property at the time of manufacturing the resin laminate cannot be obtained. From the viewpoint of easily improving the transparency of the resin laminate when exposed to a high temperature and high humidity environment, the Mw of the (meth) acrylic resin is preferably 120,000 or more, and more preferably 150,000 or more. From the viewpoint of film-forming properties when producing a resin laminate, the Mw of the (meth) acrylic resin is preferably 250,000 or less, and more preferably 200,000 or less. The weight average molecular weight was measured by gel permeation chromatography (GPC).

(甲基)丙烯酸樹脂,在3.8kg負重、230℃下測定,通常具有0.1至20g/10分鐘,較佳具有0.2至5g/10分鐘,更佳具有0.5至3g/10分鐘的熔體質量流動速率(以下有時記載為MFR)。因容易提高所得之膜的強度,所以較佳係MFR為上述上限以下,從樹脂積層體的成膜性的觀點來看,較佳係在上述下限以上。MFR可根據JIS K 7210:1999「塑膠-熱塑性塑膠的熔體質量流動速率(MFR)及熔體體積流動速率(MVR)的測試方法」所規定的方法測定。該JIS中規定,針對聚(甲基丙烯酸甲酯)系的材料,在溫度230℃、負重3.80kg(37.3N)測定。 (Meth) acrylic resin, measured at a load of 3.8 kg at 230 ° C, usually has 0.1 to 20 g / 10 minutes, preferably 0.2 to 5 g / 10 minutes, and more preferably 0.5 to 3 g / 10 minutes. Rate (hereinafter sometimes referred to as MFR). Since it is easy to increase the strength of the obtained film, the MFR is preferably at most the above upper limit, and from the viewpoint of the film-forming property of the resin laminate, it is preferably at least the above lower limit. MFR can be measured according to the method specified in JIS K 7210: 1999 "Test methods for the melt mass flow rate (MFR) and melt volume flow rate (MVR) of plastics-thermoplastics". The JIS provides that poly (methyl methacrylate) -based materials are measured at a temperature of 230 ° C and a load of 3.80 kg (37.3 N).

從耐熱性的觀點來看,(甲基)丙烯酸樹脂較佳具有90℃以上,更佳具有100℃以上,再更佳具有102℃以上的菲卡軟化溫度(以下有時記載為VST)。VST的上限,雖無特別限制,但通常為150℃以下。VST可根據JIS K 7206:1999,並由其中所記載的B50法測定。VST可藉由調整單體的種類及其比例,而調整為上述的範圍。 From the viewpoint of heat resistance, the (meth) acrylic resin preferably has a temperature of 90 ° C or higher, more preferably 100 ° C or higher, and even more preferably a Ficca softening temperature (hereinafter sometimes referred to as VST) of 102 ° C or higher. Although the upper limit of VST is not particularly limited, it is usually 150 ° C or lower. VST can be measured according to JIS K 7206: 1999 and the B50 method described therein. VST can be adjusted to the above range by adjusting the type of monomer and its ratio.

(甲基)丙烯酸樹脂,可將上述單體藉由懸浮聚合、總體(bulk)聚合等習知的方法聚合而調製。此時,藉 由添加適當的鏈轉移劑,可調整MFR、Mw、VST等為較佳的範圍。鏈轉移劑,可使用適當的市售品。鏈轉移劑的添加量,只要依據單體的種類及其比例、所要求的特性等而適當地決定即可。 The (meth) acrylic resin can be prepared by polymerizing the above-mentioned monomers by a known method such as suspension polymerization or bulk polymerization. In this case, MFR, Mw, VST, etc. can be adjusted to a preferable range by adding an appropriate chain transfer agent. As the chain transfer agent, an appropriate commercially available product can be used. The amount of the chain transfer agent to be added may be appropriately determined depending on the type of the monomer and its ratio, required characteristics, and the like.

樹脂組成物(a)所含的偏二氟乙烯樹脂,可舉例如偏二氟乙烯的均聚物、偏二氟乙烯與其他單體的共聚物。從容易提高所得之膜的透明性的觀點來看,偏二氟乙烯樹脂較佳為選自由三氟乙烯、四氟乙烯、六氟丙烯、氯三氟乙烯、全氟烷基乙烯基醚及乙烯所構成之群組的至少1種單體與偏二氟乙烯的共聚物,及/或偏二氟乙烯的均聚物(聚偏二氟乙烯),更佳為聚偏二氟乙烯。 Examples of the vinylidene fluoride resin contained in the resin composition (a) include a homopolymer of vinylidene fluoride and a copolymer of vinylidene fluoride and other monomers. From the viewpoint of easily improving the transparency of the obtained film, the vinylidene fluoride resin is preferably selected from the group consisting of trifluoroethylene, tetrafluoroethylene, hexafluoropropylene, chlorotrifluoroethylene, perfluoroalkyl vinyl ether, and ethylene. The copolymer of at least one of the monomers and vinylidene fluoride in the formed group, and / or a homopolymer of polyvinylidene fluoride (polyvinylidene fluoride), more preferably polyvinylidene fluoride.

樹脂組成物(a)所含的偏二氟乙烯樹脂的重量平均分子量(Mw),較佳為100,000至500,000,更佳為150,000至450,000,再更佳為200,000至450,000,特佳為350,000至450,000。因當將本發明的樹脂積層體暴露於高溫高濕環境下時(例如60℃、相對濕度90%)容易提高樹脂積層體的透明性,所以較佳係Mw為上述下限以上。而且,因容易提高樹脂積層體的成膜性,所以較佳係Mw為上述上限以下。重量平均分子量,係藉由凝膠滲透層析(GPC)測定。 The weight average molecular weight (Mw) of the vinylidene fluoride resin contained in the resin composition (a) is preferably 100,000 to 500,000, more preferably 150,000 to 450,000, even more preferably 200,000 to 450,000, and particularly preferably 350,000 to 450,000. . When the resin laminate of the present invention is exposed to a high-temperature and high-humidity environment (for example, 60 ° C. and a relative humidity of 90%), it is easy to improve the transparency of the resin laminate. Therefore, it is preferable that Mw is the above lower limit. Moreover, since it is easy to improve the film-forming property of a resin laminated body, it is preferable that Mw is below the said upper limit. The weight average molecular weight was measured by gel permeation chromatography (GPC).

偏二氟乙烯樹脂,在3.8kg負重、230℃下測定,較佳具有0.1至40g/10分鐘,更佳具有0.1至35g/10分鐘,再更佳具有0.1至30g/10分鐘的熔體質量流動速率(MFR)。MFR更佳為0.2g/10分鐘以上,再更佳為0.5g/10 分鐘以上。而且,MFR更佳為20g/10分鐘以下,再更佳為5g/10分鐘以下,特佳為2g/10分鐘以下。因容易抑制長時間使用樹脂積層體時的透明性的降低,所以較佳係MFR為上述上限以下,。因容易提高樹脂積層體的成膜性,所以較佳係MFR為上述下限以上。MFR可根據JIS K 7210:1999「塑膠-熱塑性塑膠的熔體質量流動速率(MFR)及熔體體積流動速率(MVR)的測試方法」所規定的方法測定。 The vinylidene fluoride resin, measured at 3.8 kg load and 230 ° C, preferably has a melt quality of 0.1 to 40 g / 10 minutes, more preferably 0.1 to 35 g / 10 minutes, and still more preferably 0.1 to 30 g / 10 minutes. Flow rate (MFR). The MFR is more preferably 0.2 g / 10 minutes or more, and even more preferably 0.5 g / 10 minutes or more. The MFR is more preferably 20 g / 10 minutes or less, even more preferably 5 g / 10 minutes or less, and particularly preferably 2 g / 10 minutes or less. Since it is easy to suppress a decrease in transparency when the resin laminate is used for a long time, it is preferable that the MFR is equal to or less than the above upper limit. Since it is easy to improve the film-forming property of the resin laminate, the MFR is preferably at least the above lower limit. MFR can be measured according to the method specified in JIS K 7210: 1999 "Test methods for the melt mass flow rate (MFR) and melt volume flow rate (MVR) of plastics-thermoplastics".

偏二氟乙烯樹脂,工業上係藉由懸浮聚合法或乳化聚合法製造。懸浮聚合法,係藉由以水為媒介,將單體以分散劑在媒介中分散為液滴,以溶解於單體中的有機過氧化物作為聚合引發劑進行聚合而實施,得到100至300μm的粒狀的聚合物。懸浮聚合物,由於與乳化聚合物相比,製造步驟簡單,粉體的操作性佳,而且不包括如乳化聚合物會包括的含有鹼金屬的乳化劑、鹽析劑,所以較佳。 The vinylidene fluoride resin is industrially manufactured by a suspension polymerization method or an emulsion polymerization method. Suspension polymerization method is carried out by using water as a medium, dispersing a monomer as a droplet in a medium with a dispersant, and polymerizing an organic peroxide dissolved in the monomer as a polymerization initiator to obtain 100 to 300 μm. Granular polymer. Suspended polymers are preferred because they have simpler manufacturing steps and better powder handling properties than emulsified polymers, and they do not include alkali metal-containing emulsifiers and salting-out agents, which would be included in emulsified polymers.

偏二氟乙烯樹脂,可使用市售品。較佳的市售品的例,可舉例如Kureha股份有限公司的「KF POLYMER(註冊商標)T#1300、T#1100、T#1000、T#850、W#850、W#1000、W#1100及W#1300」、Solvay公司製的「SOLEF(註冊商標)6012、6010及6008」。 A commercially available vinylidene fluoride resin can be used. Examples of preferred commercially available products include, for example, "KF POLYMER (registered trademark) T # 1300, T # 1100, T # 1000, T # 850, W # 850, W # 1000, W # 1100 and W # 1300 "and" SOLEF (registered trademark) 6012, 6010 and 6008 "manufactured by Solvay.

基於樹脂組成物(a)所含的全部樹脂而言,樹脂組成物(a)包含10至90質量%的前述(甲基)丙烯酸樹脂及90至10質量%的前述偏二氟乙烯樹脂。於(甲基)丙烯酸樹脂的量低於上述下限的情況,無法得到充分的透明性, 於(甲基)丙烯酸樹脂的量高於上述上限的情況,無法得到充分的介電常數。於偏二氟乙烯樹脂低於上述下限的情況,無法得到充分的介電常數,於偏二氟乙烯樹脂高於上述上限的情況,無法得到耐久性或無法得到充分的透明性。 The resin composition (a) contains 10 to 90% by mass of the aforementioned (meth) acrylic resin and 90 to 10% by mass of the aforementioned vinylidene fluoride resin based on the entire resin contained in the resin composition (a). When the amount of the (meth) acrylic resin is lower than the lower limit, sufficient transparency cannot be obtained, and when the amount of the (meth) acrylic resin is higher than the upper limit, sufficient dielectric constant cannot be obtained. When the vinylidene fluoride resin is below the lower limit, a sufficient dielectric constant cannot be obtained, and when the vinylidene fluoride resin is above the upper limit, durability or sufficient transparency cannot be obtained.

從容易提高介電常數、提高樹脂積層體的透明性的觀點來看,基於樹脂組成物(a)所含的全部樹脂而言,該樹脂組成物(a)較佳係包含30至60質量%的(甲基)丙烯酸樹脂及70至40質量%的偏二氟乙烯樹脂,更佳係包含35至45質量%的(甲基)丙烯酸樹脂及65至55質量%的偏二氟乙烯樹脂,再更佳係包含37至45質量%的(甲基)丙烯酸樹脂及63至55質量%的偏二氟乙烯樹脂,特佳係包含38至45質量%的(甲基)丙烯酸樹脂及62至55質量%的偏二氟乙烯樹脂,極佳係包含38至43質量%的(甲基)丙烯酸樹脂及62至57質量%的偏二氟乙烯樹脂。 From the viewpoint of easily increasing the dielectric constant and improving the transparency of the resin laminate, the resin composition (a) preferably contains 30 to 60% by mass based on the entire resin contained in the resin composition (a). (Meth) acrylic resin and 70 to 40 mass% of vinylidene fluoride resin, more preferably 35 to 45 mass% of (meth) acrylic resin and 65 to 55 mass% of vinylidene fluoride resin, and More preferably, it contains 37 to 45% by mass of (meth) acrylic resin and 63 to 55% by mass of vinylidene fluoride resin, and particularly preferred is 38 to 45% by mass of (meth) acrylic resin and 62 to 55% by mass % Vinylidene fluoride resin, an excellent system containing 38 to 43% by mass of (meth) acrylic resin and 62 to 57% by mass of vinylidene fluoride resin.

樹脂組成物(a)亦可再包含與(甲基)丙烯酸樹脂及偏二氟乙烯樹脂不同的其他樹脂。於含有其他樹脂的情況,只要無顯著損害樹脂積層體的透明性,則其種類無特別限制。從樹脂積層體的硬度及耐候性的觀點來看,基於該樹脂組成物(a)所含的全部樹脂而言,其他樹脂的量較佳為15質量%以下,更佳為10質量%以下,再更佳為5質量%以下。其他樹脂,可舉例如聚碳酸酯樹脂、聚醯胺樹脂、丙烯腈-苯乙烯共聚物、甲基丙烯酸甲酯-苯乙烯共聚物、聚對苯二甲酸乙二酯等。雖然樹脂組成物(a)可再包含其他樹脂,但從透明性的觀點來看,以其他樹脂的量為 1質量%以下為較佳,以樹脂組成物(a)所含的樹脂只有(甲基)丙烯酸樹脂與偏二氟乙烯樹脂為更佳。 The resin composition (a) may further include another resin different from the (meth) acrylic resin and vinylidene fluoride resin. When other resins are contained, the type of the resin laminate is not particularly limited as long as the transparency of the resin laminate is not significantly impaired. From the viewpoint of the hardness and weather resistance of the resin laminate, the amount of the other resins is preferably 15% by mass or less, more preferably 10% by mass or less, based on all the resins contained in the resin composition (a). Still more preferably, it is 5 mass% or less. Other resins include, for example, polycarbonate resin, polyamide resin, acrylonitrile-styrene copolymer, methyl methacrylate-styrene copolymer, polyethylene terephthalate, and the like. Although the resin composition (a) may further contain other resins, from the viewpoint of transparency, it is preferable that the amount of other resins is 1% by mass or less. The resin contained in the resin composition (a) is only (A). ) Acrylic resin and vinylidene fluoride resin are more preferred.

樹脂組成物(a),可在不阻礙本發明的效果的範圍下,再包含一般使用的各種添加劑。添加劑,可舉例如安定劑、抗氧化劑、紫外線吸收劑、光安定劑、發泡劑、潤滑劑、離型劑、抗靜電劑、阻燃劑、離型劑、聚合抑制劑、阻燃助劑、補強劑、成核劑、上藍劑(blueing agent)等著色劑等。 The resin composition (a) may further contain various additives that are generally used, as long as the effects of the present invention are not hindered. Additives include, for example, stabilizers, antioxidants, ultraviolet absorbers, light stabilizers, foaming agents, lubricants, release agents, antistatic agents, flame retardants, release agents, polymerization inhibitors, flame retardant additives , Reinforcing agents, nucleating agents, blueing agents and other coloring agents.

著色劑,可舉例如具有蒽醌骨架的化合物、具有酞青骨架的化合物等。該等之中,從耐熱性的觀點來看,較佳係具有蒽醌骨架的化合物。 Examples of the colorant include a compound having an anthraquinone skeleton and a compound having a phthalocyanine skeleton. Among these, from the viewpoint of heat resistance, a compound having an anthraquinone skeleton is preferred.

於樹脂組成物(a)再包含著色劑的情況,著色劑的含量,可依據目的、著色劑的種類等而適當地選擇。於使用上藍劑作為著色劑的情況,基於含有上藍劑的樹脂組成物(a)所含的全部樹脂而言,其含量可為0.01至10ppm左右。該含量,較佳為0.01ppm以上,更佳為0.05ppm以上,再更佳為0.1ppm以上,又較佳為7ppm以下,更佳為5ppm以下,再更佳為4ppm以下,特佳為3ppm以下。上藍劑,可適當地使用習知者,分別以商品名表示,可舉例如MACROLEX(註冊商標)Blue RR(Bayer公司製)、MACROLEX(註冊商標)Blue 3R(Bayer公司製)、Sumiplast(註冊商標)Violet B(Sumika Chemtex公司製)及Polysynthren(註冊商標)Blue RLS(Clariant公司製)、Diaresin Violet D、Diaresin Blue G、Diaresin Blue N(以上三菱化學股份有限公 司製)。 When the resin composition (a) further contains a colorant, the content of the colorant can be appropriately selected depending on the purpose, the type of the colorant, and the like. In the case where a bluing agent is used as the colorant, the content may be about 0.01 to 10 ppm based on the entire resin contained in the resin composition (a) containing the bluing agent. The content is preferably 0.01 ppm or more, more preferably 0.05 ppm or more, still more preferably 0.1 ppm or more, still more preferably 7 ppm or less, even more preferably 5 ppm or less, even more preferably 4 ppm or less, and particularly preferably 3 ppm or less. . The bluing agent can be appropriately used by a person skilled in the art, and is represented by a trade name, for example, MACROLEX (registered trademark) Blue RR (manufactured by Bayer), MACROLEX (registered trademark) Blue 3R (manufactured by Bayer), Sumiplast (registered (Trademark) Violet B (manufactured by Sumika Chemtex) and Polysynthren (registered trademark) Blue RLS (manufactured by Clariant), Diaresin Violet D, Diaresin Blue G, and Diaresin Blue N (manufactured by Mitsubishi Chemical Corporation).

紫外線吸收劑,無特別限制,可使用以往習知的各種紫外線吸收劑。可舉例如在200至320nm或320至400nm具有極大吸收的紫外線吸收劑。具體而言,可舉例如三系紫外線吸收劑、二苯甲酮系紫外線吸收劑、苯並三唑系紫外線吸收劑、苯甲酸酯系紫外線吸收劑、氰基丙烯酸酯系紫外線吸收劑。作為紫外線吸收劑,可將該等紫外線吸收劑的1種單獨使用或組合2種以上而使用。從可更有效地防禦因紫外線所致之傷害的觀點來看,較佳係併用在200至320nm具有極大吸收的至少一種紫外線吸收劑、與在320至400nm具有極大吸收的至少一種紫外線吸收劑。作為紫外線吸收劑,可使用市售品,可舉例如Chemipro化成股份有限公司製的「Kemisorb102」(2,4-雙(2,4-二甲基苯基)-6-(2-羥基-4-N-辛氧基苯基)-1,3,5-三)(吸光度0.1)、ADEKA股份有限公司製的「Adekastab LA-F70」(2,4,6-三(2-羥基-4-己氧基-3-甲基苯基)-1,3,5-三)(吸光度0.6)、「Adekastab LA-31、LA-31RG、LA-31G」(2,2’-亞甲基雙(4-(1,1,3,3-四甲基丁基)-6-(2H-苯並三唑-2-基)酚)(吸光度0.2)、ADEKA股份有限公司製的「Adekastab LA-46」(2-(4,6-二苯基-1,3,5-三-2-基)-5-(2-(2-乙基己醯氧基)乙氧基)酚)(吸光度0.05)或BASF日本股份有限公司製的「TINUVIN 1577」(2,4-二苯基-6-(2-羥基-4-己氧基苯基)-1,3,5-三)(吸光度0.1)等。例示的紫外線吸收劑的吸光度,係將紫外線吸收劑以10mg/L的濃度溶解於氯仿,並 使用HITACHI製分光光度計U-4100在380nm測定的數值。 The ultraviolet absorber is not particularly limited, and various conventionally known ultraviolet absorbers can be used. For example, an ultraviolet absorber having a great absorption at 200 to 320 nm or 320 to 400 nm can be mentioned. Specifically, for example, three UV absorber, benzophenone UV absorber, benzotriazole UV absorber, benzoate UV absorber, cyanoacrylate UV absorber. As an ultraviolet absorber, 1 type of these ultraviolet absorbers can be used individually or in combination of 2 or more types. From the viewpoint of more effective protection against damage caused by ultraviolet rays, it is preferable to use at least one ultraviolet absorber having a large absorption at 200 to 320 nm and at least one ultraviolet absorber having a maximum absorption at 320 to 400 nm. As the ultraviolet absorber, a commercially available product may be used, and for example, "Kemisorb 102" (2,4-bis (2,4-dimethylphenyl) -6- (2-hydroxy-4) manufactured by Chemipro Chemical Co., Ltd. may be used. -N-octyloxyphenyl) -1,3,5-tri ) (Absorbance 0.1), "Adekastab LA-F70" (2,4,6-tris (2-hydroxy-4-hexyloxy-3-methylphenyl) -1,3,5 manufactured by ADEKA Corporation -three ) (Absorbance 0.6), "Adekastab LA-31, LA-31RG, LA-31G"(2,2'-methylenebis (4- (1,1,3,3-tetramethylbutyl) -6 -(2H-benzotriazol-2-yl) phenol) (absorbance 0.2), "Adekastab LA-46" (2- (4,6-diphenyl-1,3,5- three 2-yl) -5- (2- (2-ethylhexyloxy) ethoxy) phenol) (absorbance 0.05) or "TINUVIN 1577" (2,4-diphenyl) manufactured by BASF Japan Co., Ltd. Phenyl-6- (2-hydroxy-4-hexyloxyphenyl) -1,3,5-tri ) (Absorbance 0.1) and so on. The absorbance of the exemplified ultraviolet absorber is a value obtained by dissolving the ultraviolet absorbent in chloroform at a concentration of 10 mg / L and measuring it at 380 nm using a spectrophotometer U-4100 manufactured by Hitachi.

於樹脂組成物(a)再包含紫外線吸收劑的情況,各層中的紫外線吸收劑的含量,可依據目的、紫外線吸收劑的種類等而適當地選擇。例如基於含有紫外線吸收劑的樹脂組成物(a)所含的全部樹脂而言,紫外線吸收劑的含量可為0.005至2.0質量%左右。紫外線吸收劑的含量,較佳為0.01質量%以上,更佳為0.02質量%以上,再更佳為0.03質量%以上。而且,紫外線吸收劑的含量,較佳為1.5質量%以下,更佳為1.0質量%以下。從容易提高紫外線吸收效果的觀點來看,較佳係紫外線吸收劑的含量為上述下限以上,因容易防止樹脂積層體的色調(例如黃色度YI)的變化,所以較佳係上述上限以下。例如較佳係以上述的量使用上述市售品的「Adekastab LA-31、LA-31RG、LA-31G」。 When the resin composition (a) further contains an ultraviolet absorber, the content of the ultraviolet absorber in each layer can be appropriately selected depending on the purpose, the type of the ultraviolet absorber, and the like. For example, the content of the ultraviolet absorber may be about 0.005 to 2.0% by mass based on the entire resin contained in the resin composition (a) containing the ultraviolet absorber. The content of the ultraviolet absorber is preferably 0.01% by mass or more, more preferably 0.02% by mass or more, and still more preferably 0.03% by mass or more. The content of the ultraviolet absorber is preferably 1.5% by mass or less, and more preferably 1.0% by mass or less. From the viewpoint of easily improving the ultraviolet absorbing effect, it is preferable that the content of the ultraviolet absorbent is not less than the above-mentioned lower limit, and since it is easy to prevent the color tone (for example, yellowness YI) of the resin laminate from changing, it is preferably not more than the above-mentioned upper limit. For example, it is preferable to use the above-mentioned "Adekastab LA-31, LA-31RG, LA-31G" in the aforementioned amount.

樹脂組成物(a)之鹼金屬的含量,基於樹脂組成物(a)所含的全部樹脂而言,較佳為50ppm以下,更佳為30ppm以下,再更佳為10ppm以下,特佳為1ppm以下。因容易抑制在高溫高濕環境下長時間使用樹脂積層體時的透明性的降低,所以較佳係樹脂組成物(a)之鹼金屬的含量為上述上限以下。樹脂組成物(a)之鹼金屬的含量的下限值為0,從容易抑制樹脂積層體的透明性的降低的觀點來看,以實質上不包含為極佳。此處,樹脂組成物(a)所含的(甲基)丙烯酸樹脂及/或偏二氟乙烯樹脂中,殘留製造步驟所使用的微量的乳化劑等。因此,來自殘留的乳化劑之鈉、 鉀等鹼金屬,例如以0.05ppm以上被包含於樹脂組成物(a)中。特別是樹脂組成物(a)所含的(甲基)丙烯酸樹脂及/或偏二氟乙烯樹脂為藉由乳化聚合而得者的情況,殘留於樹脂中的乳化劑的量變多,樹脂組成物(a)之鹼金屬的含量也變高。從容易抑制樹脂積層體的透明性的降低的觀點來看,較佳係使用鹼金屬的含量少的樹脂作為樹脂組成物(a)所含的(甲基)丙烯酸樹脂及/或偏二氟乙烯樹脂。 The content of the alkali metal in the resin composition (a) is preferably 50 ppm or less, more preferably 30 ppm or less, even more preferably 10 ppm or less, and particularly preferably 1 ppm based on the total resin contained in the resin composition (a). the following. Since it is easy to suppress a decrease in transparency when the resin laminate is used for a long time under a high temperature and high humidity environment, the content of the alkali metal in the resin composition (a) is preferably not more than the above upper limit. The lower limit value of the content of the alkali metal in the resin composition (a) is 0, and from the viewpoint of easily suppressing the decrease in the transparency of the resin laminate, it is excellent that it is not substantially contained. Here, the (meth) acrylic resin and / or vinylidene fluoride resin contained in the resin composition (a) contains a small amount of an emulsifier and the like used in the production step. Therefore, alkali metals such as sodium and potassium derived from the remaining emulsifier are contained in the resin composition (a) at, for example, 0.05 ppm or more. In particular, when the (meth) acrylic resin and / or vinylidene fluoride resin contained in the resin composition (a) is obtained by emulsion polymerization, the amount of the emulsifier remaining in the resin increases, and the resin composition The content of the alkali metal of (a) also becomes high. From the viewpoint of easily suppressing the decrease in the transparency of the resin laminate, it is preferable to use a resin having a low alkali metal content as the (meth) acrylic resin and / or vinylidene fluoride contained in the resin composition (a). Resin.

為了使樹脂中的鹼金屬的含量為上述範圍內,只要在樹脂的聚合時減少包含鹼金屬的化合物的使用量,或增加聚合後的洗淨步驟而除去包含鹼金屬的化合物即可。鹼金屬的含量,可藉由例如感應耦合電漿質譜分析法(ICP/MS)而求得。就感應耦合電漿質譜分析法而言,例如只要將測定樣品顆粒藉由高溫灰化熔解法、高溫灰化酸溶解法、添加Ca灰化酸溶解法、燃燒吸收法、低溫灰化酸溶解法等適當的方法,使樣品灰化,並使其溶解於酸,將該溶解液定容,使用感應耦合電漿質譜分析法,測定鹼金屬的含量即可。 In order to make the content of the alkali metal in the resin fall within the above range, it is only necessary to reduce the amount of the alkali metal-containing compound used during the polymerization of the resin or increase the washing step after the polymerization to remove the alkali metal-containing compound. The content of the alkali metal can be obtained by, for example, inductively coupled plasma mass spectrometry (ICP / MS). In the case of inductively coupled plasma mass spectrometry, for example, as long as the measurement sample particles are subjected to a high-temperature ash melting method, a high-temperature ash acid dissolution method, a Ca-added ash acid dissolution method, a combustion absorption method, and a low-temperature ash acid dissolution method The sample may be subjected to an appropriate method such as ashing, dissolving the sample in an acid, and measuring the volume of the dissolving solution. The content of the alkali metal may be measured using an inductively coupled plasma mass spectrometry.

樹脂組成物(a),通常可藉由將(甲基)丙烯酸樹脂及偏二氟乙烯樹脂混練而得。混練,可藉由例如包含在150至350℃的溫度,以10至1000/秒的剪切速率進行熔融混練的步驟的方法而實施。 The resin composition (a) is usually obtained by kneading a (meth) acrylic resin and a vinylidene fluoride resin. The kneading can be performed by a method including a step of melt-kneading at a temperature of 150 to 350 ° C. and a shear rate of 10 to 1000 / sec.

因可充分熔融樹脂、提升混合性,所以較佳係進行熔融混練時的溫度為150℃以上,因容易抑制樹脂的熱分解,所以較佳係350℃以下。再者,因可提高樹 脂的混合性,所以較佳係進行熔融混練時的剪切速率為10/秒以上,因容易抑制樹脂的分解,所以較佳係1000/秒以下。 Since the resin can be sufficiently melted and the miscibility can be improved, the temperature during melt-kneading is preferably 150 ° C or higher, and the thermal decomposition of the resin is easily suppressed, so it is preferably 350 ° C or lower. Furthermore, since the miscibility of the resin can be improved, the shear rate during melt-kneading is preferably 10 / sec or more, and the decomposition of the resin is easily suppressed, so it is preferably 1000 / sec or less.

為了得到樹脂、添加劑等更均質(或均勻)地混合的樹脂組成物(a),熔融混練較佳在180至300℃,更佳在200至300℃的溫度進行,且較佳以20至700/秒,更佳以30至500/秒的剪切速率進行。 In order to obtain a resin composition (a) which is more homogeneously (or uniformly) mixed with resins, additives, etc., the melt-kneading is preferably performed at a temperature of 180 to 300 ° C, more preferably 200 to 300 ° C, and preferably 20 to 700. / Sec, more preferably at a shear rate of 30 to 500 / sec.

就使用於熔融混練的機器而言,可使用通常的混合機、混練機。具體而言,可舉例如單軸混練機、多軸混練機(例如雙軸混練機等)、亨歇爾(Henschel)混合機、班布里(Banbury)混合機、捏合機、輥磨機等。而且,在上述範圍內使剪切速率變大的情況,可使用高剪切加工裝置等。 As a machine used for melt-kneading, a general mixer or kneader can be used. Specifically, for example, a single-shaft kneading machine, a multi-shaft kneading machine (e.g., a double-shaft kneading machine, etc.), a Henschel mixer, a Banbury mixer, a kneader, a roll mill, etc. . When the shear rate is increased within the above range, a high-shear processing device or the like can be used.

於樹脂組成物(a)含有添加劑的情況,添加劑可預先包含於樹脂組成物(a)所含的樹脂中,亦可在樹脂的熔融混練時添加,亦可在將樹脂熔融混練後添加,亦可在使用樹脂組成物(a)製作樹脂積層體時添加。 When the resin composition (a) contains an additive, the additive may be contained in the resin contained in the resin composition (a) in advance, or it may be added during the melt-kneading of the resin, or it may be added after the resin is melt-kneaded, or It can be added when a resin laminate is produced using the resin composition (a).

熔融混練所得之樹脂組成物(a),可直接供給至形成中間層(A)用的步驟,亦可在成形為顆粒狀、環狀、片(flake)狀、蜂巢狀等固體狀或粉狀等之後供給至形成中間層(A)用的步驟。再者,固體狀,可由慣用的方法,例如使用擠出造粒機等而成形。 The resin composition (a) obtained by melt-kneading can be directly supplied to the step for forming the intermediate layer (A), or it can be formed into solid, powdery shapes such as pellets, rings, flakes, honeycombs, etc. After that, it is supplied to the step for forming the intermediate layer (A). The solid state can be formed by a conventional method, for example, using an extrusion granulator or the like.

形成熱塑性樹脂層(B)及(C)的熱塑性樹脂(b)及(c),包含至少1種熱塑性樹脂。從容易提高成形加工性的觀點來看,基於各熱塑性樹脂(b)及(c)所含的全部樹脂而 言,熱塑性樹脂(b)及(c)較佳包含60質量%以上,更佳包含70質量%以上,再更佳包含80質量%以上的熱塑性樹脂。熱塑性樹脂的量的上限為100質量%。熱塑性樹脂,可舉例如(甲基)丙烯酸樹脂、聚碳酸酯樹脂、環烯烴樹脂等。從容易提高熱塑性樹脂層(B)及(C)與中間層(A)的接著性的觀點來看,熱塑性樹脂較佳為(甲基)丙烯酸樹脂或聚碳酸酯樹脂。熱塑性樹脂(b)及(c),可包含相同的熱塑性樹脂,亦可包含互異的熱塑性樹脂。從提高樹脂積層體的透明性的觀點及容易抑制彎曲的觀點來看,較佳係熱塑性樹脂(b)及(c)包含相同的熱塑性樹脂。 The thermoplastic resins (b) and (c) forming the thermoplastic resin layers (B) and (C) include at least one type of thermoplastic resin. From the viewpoint of easily improving the moldability, the thermoplastic resins (b) and (c) are preferably contained in an amount of 60% by mass or more based on all the resins contained in each of the thermoplastic resins (b) and (c), and more preferably 70% by mass or more, and more preferably 80% by mass or more of a thermoplastic resin. The upper limit of the amount of the thermoplastic resin is 100% by mass. Examples of the thermoplastic resin include (meth) acrylic resin, polycarbonate resin, and cycloolefin resin. From the viewpoint of easily improving the adhesion between the thermoplastic resin layers (B) and (C) and the intermediate layer (A), the thermoplastic resin is preferably a (meth) acrylic resin or a polycarbonate resin. The thermoplastic resins (b) and (c) may include the same thermoplastic resin or different thermoplastic resins. From the viewpoint of improving the transparency of the resin laminate and the viewpoint of easily suppressing bending, it is preferred that the thermoplastic resins (b) and (c) include the same thermoplastic resin.

從樹脂積層體的耐熱性的觀點來看,熱塑性樹脂(b)及(c)各自所含的樹脂較佳具有100至160℃,更佳具有102至155℃,再更佳具有102至152℃的菲卡軟化溫度。此處,上述的菲卡軟化溫度,當熱塑性樹脂包含1種樹脂時為該樹脂的菲卡軟化溫度,當熱塑性樹脂包含2種以上的樹脂時為複數個樹脂的混合物的菲卡軟化溫度。熱塑性樹脂(b)及(c)所含的樹脂的菲卡軟化溫度,係根據JIS K 7206:1999「塑膠-熱塑性塑膠-菲卡軟化溫度(VST)的測試方法」所規定的B50法測定。菲卡軟化溫度,可使用熱變形測試機(例如安田精機製作所股份有限公司製「148-6連型」)測定。測定可使用各原料壓製成形為3mm厚度的測試片而進行。 From the viewpoint of the heat resistance of the resin laminate, each of the resins contained in the thermoplastic resins (b) and (c) preferably has a temperature of 100 to 160 ° C, more preferably 102 to 155 ° C, and even more preferably 102 to 152 ° C. Fica softening temperature. Here, the above-mentioned Feika softening temperature is the Feika softening temperature of the resin when the thermoplastic resin contains one resin, and the Feika softening temperature of a mixture of a plurality of resins when the thermoplastic resin contains two or more resins. The Feika softening temperature of the resins contained in the thermoplastic resins (b) and (c) is measured in accordance with the B50 method specified in JIS K 7206: 1999 "Plastic-Thermoplastic-Feika Softening Temperature (VST) Test Method". The Ficca softening temperature can be measured using a thermal deformation tester (for example, "148-6 continuous type" manufactured by Yasuda Seiki Seisakusho Co., Ltd.). The measurement can be performed using each raw material by press-molding a test piece having a thickness of 3 mm.

熱塑性樹脂(b)及(c),在提高熱塑性樹脂層的強度、彈性等的目的下,可再包含熱塑性樹脂以外的其 他樹脂(例如填充劑、樹脂粒子等熱硬化性樹脂)。於該情況,基於各自的熱塑性樹脂(b)及(c)所含的全部樹脂而言,其他樹脂的量較佳為40質量%以下,更佳為30質量%以下,再更佳為20質量%以下。其他樹脂的量的下限為0質量%。 The thermoplastic resins (b) and (c) may further contain other resins (for example, thermosetting resins such as fillers and resin particles) other than the thermoplastic resin for the purpose of improving the strength and elasticity of the thermoplastic resin layer. In this case, based on all the resins contained in the respective thermoplastic resins (b) and (c), the amount of the other resins is preferably 40% by mass or less, more preferably 30% by mass or less, and still more preferably 20% by mass. %the following. The lower limit of the amount of other resins is 0% by mass.

熱塑性樹脂(b)及(c),可在不阻礙本發明的效果的範圍下,再包含一般使用的各種添加劑。各熱塑性樹脂(b)及(c)所含的添加劑及比例的範圍等,可與樹脂組成物(a)所含的添加劑及其比例的範圍相同,較佳的添加劑及比例的範圍也可相同。 The thermoplastic resins (b) and (c) may further contain various additives that are generally used, as long as the effects of the present invention are not hindered. The range of additives and ratios contained in each thermoplastic resin (b) and (c) may be the same as the range of additives and ratios contained in the resin composition (a), and the ranges of preferred additives and ratios may also be the same. .

從成形加工性良好且容易提高與中間層(A)的密合性的觀點來看,熱塑性樹脂(b)及(c)較佳為包含(甲基)丙烯酸樹脂或聚碳酸酯樹脂。 The thermoplastic resins (b) and (c) preferably contain a (meth) acrylic resin or a polycarbonate resin from the viewpoint of good moldability and easy improvement in adhesion with the intermediate layer (A).

以下說明熱塑性樹脂(b)及(c)包含(甲基)丙烯酸樹脂之本發明的一態樣。於該態樣中,熱塑性樹脂(b)及(c)分別包含1種以上的(甲基)丙烯酸樹脂。從熱塑性樹脂層(B)及(C)的表面硬度的觀點來看,基於各自的熱塑性樹脂(b)及(c)所含的全部樹脂而言,熱塑性樹脂(b)及(c)較佳含有50質量%以上,更佳含有60質量%以上,再更佳含有70質量%以上的(甲基)丙烯酸樹脂。 One aspect of the present invention in which the thermoplastic resins (b) and (c) include a (meth) acrylic resin will be described below. In this aspect, each of the thermoplastic resins (b) and (c) includes one or more (meth) acrylic resins. From the viewpoint of the surface hardness of the thermoplastic resin layers (B) and (C), the thermoplastic resins (b) and (c) are preferred based on all the resins contained in the respective thermoplastic resins (b) and (c). It contains 50 mass% or more, more preferably 60 mass% or more, and even more preferably 70 mass% or more (meth) acrylic resin.

(甲基)丙烯酸樹脂,可舉例如針對樹脂組成物(a)所含的(甲基)丙烯酸樹脂而記載的樹脂。針對樹脂組成物(a)而記載的較佳的(甲基)丙烯酸樹脂,在無特別說明下,就熱塑性樹脂(b)及(c)所含的(甲基)丙烯酸樹脂而言同 樣為較佳。熱塑性樹脂(b)及(c)所含的(甲基)丙烯酸樹脂,可與樹脂組成物(a)所含的(甲基)丙烯酸樹脂相同,亦可不同。 Examples of the (meth) acrylic resin include those described for the (meth) acrylic resin contained in the resin composition (a). The preferable (meth) acrylic resin described with respect to the resin composition (a) is similar to the (meth) acrylic resin contained in the thermoplastic resins (b) and (c) unless otherwise specified. good. The (meth) acrylic resin contained in the thermoplastic resins (b) and (c) may be the same as or different from the (meth) acrylic resin contained in the resin composition (a).

從成形加工性良好且容易提高力學強度的觀點來看,(甲基)丙烯酸樹脂的重量平均分子量(Mw)較佳為50,000至300,000,更佳為70,000至250,000。重量平均分子量,係藉由凝膠滲透層析(GPC)測定。 From the viewpoint of good molding processability and easy improvement of mechanical strength, the weight average molecular weight (Mw) of the (meth) acrylic resin is preferably 50,000 to 300,000, and more preferably 70,000 to 250,000. The weight average molecular weight was measured by gel permeation chromatography (GPC).

於該態樣中,熱塑性樹脂(b)及(c)可再包含1種以上的(甲基)丙烯酸樹脂以外的熱塑性樹脂。就(甲基)丙烯酸樹脂以外的熱塑性樹脂而言,以可與(甲基)丙烯酸樹脂相溶的熱塑性樹脂為較佳。具體而言,可舉例如甲基丙烯酸甲酯-苯乙烯-馬來酸酐共聚物(例如電氣化學工業製「RESISFY」)、甲基丙烯酸甲酯-甲基丙烯酸共聚物(例如ARKEMA公司製「ALTUGLAS HT121」)、聚碳酸酯樹脂。從耐熱性的觀點來看,(甲基)丙烯酸樹脂以外的熱塑性樹脂,較佳係根據JIS K7206:1999測定,較佳具有115℃以上,更佳具有117℃以上,再更佳具有120℃以上的菲卡軟化溫度。再者,從耐熱性及表面硬度的觀點來看,熱塑性樹脂(b)及(c)係以實質上不包含偏二氟乙烯樹脂為較佳。 In this aspect, the thermoplastic resins (b) and (c) may further include a thermoplastic resin other than a (meth) acrylic resin. The thermoplastic resin other than the (meth) acrylic resin is preferably a thermoplastic resin compatible with the (meth) acrylic resin. Specifically, for example, a methyl methacrylate-styrene-maleic anhydride copolymer (for example, "RESISFY" manufactured by Denki Chemical Industry), a methyl methacrylate-methacrylic acid copolymer (for example, "ALTUGLAS" manufactured by ARKEMA) HT121 "), polycarbonate resin. From the viewpoint of heat resistance, thermoplastic resins other than (meth) acrylic resins are preferably measured in accordance with JIS K7206: 1999, preferably 115 ° C or higher, more preferably 117 ° C or higher, and even more preferably 120 ° C or higher. Fica softening temperature. Furthermore, from the viewpoints of heat resistance and surface hardness, the thermoplastic resins (b) and (c) are preferably those which do not substantially contain vinylidene fluoride resin.

於該態樣中,從提高耐刮傷性的觀點來看,分別由熱塑性樹脂(b)及(c)所形成的熱塑性樹脂層(B)及(C)的鉛筆硬度較佳為HB以上,更佳為F以上,再更佳為H以上。 In this aspect, from the viewpoint of improving the scratch resistance, the pencil hardness of the thermoplastic resin layers (B) and (C) formed of the thermoplastic resins (b) and (c), respectively, is preferably HB or more. More preferably, it is F or more, and still more preferably H or more.

然後,以下說明熱塑性樹脂(b)及(c)包含聚 碳酸酯樹脂之本發明的另一態樣。於該態樣中,熱塑性樹脂(b)及(c)分別包含1種以上的聚碳酸酯樹脂。從耐衝擊性的觀點來看,基於各自的熱塑性樹脂(b)及(c)所含的全部樹脂而言,熱塑性樹脂(b)及(c)較佳含有60質量%以上,更佳含有70質量%以上,再更佳含有80質量%以上的聚碳酸酯樹脂。 Next, another aspect of the present invention in which the thermoplastic resins (b) and (c) include a polycarbonate resin will be described below. In this aspect, each of the thermoplastic resins (b) and (c) contains one or more polycarbonate resins. From the viewpoint of impact resistance, the thermoplastic resins (b) and (c) are preferably contained in an amount of 60% by mass or more, and more preferably 70%, based on all the resins contained in the respective thermoplastic resins (b) and (c). More than 80% by mass, and more preferably 80% by mass or more of a polycarbonate resin.

聚碳酸酯樹脂,可舉例如藉由使各種二羥基二芳香基化合物與光氣反應的光氣法、或使二羥基二芳香基化合物與碳酸二苯酯等碳酸酯反應的酯交換法而得之聚合物,具體上可舉例如從2,2-雙(4-羥基苯基)丙烷(通稱雙酚A)製造的聚碳酸酯樹脂。 The polycarbonate resin can be obtained, for example, by a phosgene method in which various dihydroxydiaryl compounds are reacted with phosgene, or a transesterification method in which dihydroxydiaryl compounds are reacted with carbonates such as diphenyl carbonate. Specific examples of the polymer include polycarbonate resins produced from 2,2-bis (4-hydroxyphenyl) propane (commonly referred to as bisphenol A).

上述二羥基二芳香基化合物,除了雙酚A之外,還可舉例如:如雙(4-羥基苯基)甲烷、1,1-雙(4-羥基苯基)乙烷、2,2-雙(4-羥基苯基)丁烷、2,2-雙(4-羥基苯基)辛烷、雙(4-羥基苯基)苯基甲烷、2,2-雙(4-羥基苯基-3-甲基苯基)丙烷、1,1-雙(4-羥基-3-第三丁基苯基)丙烷、2,2-雙(4-羥基-3-溴苯基)丙烷、2,2-雙(4-羥基-3,5-二溴苯基)丙烷、2,2-雙(4-羥基-3,5-二氯苯基)丙烷等雙(羥基芳香基)烷類;如1,1-雙(4-羥基苯基)環戊烷、1,1-雙(4-羥基苯基)環己烷等雙(羥基芳香基)環烷類;如4,4’-二羥基二苯基醚、4,4’-二羥基-3,3’-二甲基二苯基醚等二羥基二芳香基醚類;如4,4’-二羥基二苯基硫醚等二羥基二芳香基硫醚類;如4,4’-二羥基二苯基亞碸、4,4’-二羥基-3,3’-二甲基二苯基亞碸等二羥基二芳香基亞碸類;如4,4’-二羥基二苯基 碸、4,4’-二羥基-3,3’-二甲基二苯基碸等二羥基二芳香基碸類。 In addition to the bisphenol A, the dihydroxy diaryl compound may be, for example, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2- Bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, 2,2-bis (4-hydroxyphenyl- 3-methylphenyl) propane, 1,1-bis (4-hydroxy-3-tert-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2, 2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2-bis (4-hydroxy-3,5-dichlorophenyl) propane and other bis (hydroxyaryl) alkanes; such as Bis (hydroxyaromatic) cycloalkanes such as 1,1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-hydroxyphenyl) cyclohexane; such as 4,4'-dihydroxy Dihydroxy diaryl ethers such as diphenyl ether, 4,4'-dihydroxy-3,3'-dimethyldiphenyl ether; dihydroxy groups such as 4,4'-dihydroxydiphenyl sulfide Diaryl sulfides; such as 4,4'-dihydroxydiphenylsulfene, 4,4'-dihydroxy-3,3'-dimethyldiphenylsulfene, and other dihydroxydiarylsulfides Class; such as 4,4'-dihydroxydiphenylfluorene, 4,4'-dihydroxy-3,3'-dimethyldiphenylfluorene and other dihydroxydiaryl groups Class.

該等可單獨使用或混合2種以上而使用,除該等外,亦可混合哌(piperazine)、二哌啶基氫醌(dipiperidyl hydroquinone)、間苯二酚、4,4’-二羥基聯苯等並使用。 These can be used singly or as a mixture of two or more kinds. (piperazine), dipiperidyl hydroquinone, resorcinol, 4,4'-dihydroxybiphenyl and the like are used in combination.

再者,可將上述二羥基二芳香基化合物與如以下表示的3價以上的酚化合物混合使用。3價以上的酚,可舉例如間苯三酚、4,6-二甲基-2,4,6-三(4-羥基苯基)庚烯、2,4,6-二甲基-2,4,6-三(4-羥基苯基)庚烷、1,3,5-三(4-羥基苯基)苯、1,1,1-三(4-羥基苯基)乙烷及2,2-雙[4,4-(4,4’-二羥基二苯基)環己基]丙烷等。 The dihydroxydiaryl compound may be mixed with a trivalent or higher phenol compound as shown below. Examples of the trivalent or higher phenol include resorcinol, 4,6-dimethyl-2,4,6-tri (4-hydroxyphenyl) heptene, and 2,4,6-dimethyl-2 , 4,6-tris (4-hydroxyphenyl) heptane, 1,3,5-tris (4-hydroxyphenyl) benzene, 1,1,1-tris (4-hydroxyphenyl) ethane and 2 , 2-bis [4,4- (4,4'-dihydroxydiphenyl) cyclohexyl] propane and the like.

上述聚碳酸酯樹脂以外的聚碳酸酯樹脂,可舉例如由異山梨醇(Isosorbide)與芳香族二醇所合成的聚碳酸酯。該聚碳酸酯的例,可舉例如三菱化學製「DURABIO(註冊商標)」。 Examples of the polycarbonate resin other than the polycarbonate resin include a polycarbonate synthesized from isosorbide and an aromatic diol. Examples of the polycarbonate include "DURABIO (registered trademark)" manufactured by Mitsubishi Chemical Corporation.

作為聚碳酸酯樹脂,亦可使用市售品,例如SUMIKA STYRON POLYCARBONATE股份有限公司製「CALIBRE(註冊商標)301-4、301-10、301-15、301-22、301-30、301-40、SD2221W、SD2201W、TR2201」等。 As the polycarbonate resin, a commercially available product such as "CALIBRE (registered trademark) 301-4, 301-10, 301-15, 301-22, 301-30, 301-40" manufactured by SUMIKA STYRON POLYCARBONATE Co., Ltd. may also be used. , SD2221W, SD2201W, TR2201 ", etc.

於該態樣中,從容易提高耐衝擊性及成形加工性的觀點來看,聚碳酸酯樹脂的重量平均分子量(Mw)較佳為20,000至70,000,更佳為25,000至60,000。重量平均分子量,係藉由凝膠滲透層析(GPC)測定。 In this aspect, the weight average molecular weight (Mw) of the polycarbonate resin is preferably 20,000 to 70,000, and more preferably 25,000 to 60,000, from the viewpoint of easily improving impact resistance and molding processability. The weight average molecular weight was measured by gel permeation chromatography (GPC).

於該態樣中,熱塑性樹脂(b)及(c)所含的聚碳酸酯樹脂,在溫度300℃及負重1.2kg的條件下側定,較佳具有3至120cm3/10分鐘,更佳具有3至80cm3/10分鐘,更佳具有4至40cm3/10分鐘,特佳具有10至40cm3/10分鐘的熔體體積流動速率(以下亦稱為MVR)。MVR高於上述下限時,因流動性充分地高,於熔融共擠出成形等中容易成形加工,不易產生外觀不良,所以較佳。MVR低於上述上限時,因容易提高熱塑性樹脂層的強度等的機械特性,所以較佳。MVR可根據JIS K 7210,在負重1.2kg、300℃的條件下測定。 In this aspect, the thermoplastic resin (b) and (c) a polycarbonate resin contained in the set side and at a temperature of 300 deg.] C of 1.2kg weight, preferably having from 3 to 120cm 3/10 minutes, and more preferably having from 3 to 80cm 3/10 minutes, and more preferably having from 4 to 40cm 3/10 min and particularly preferably has a melt volume flow rate of 10 to 40cm 3/10 min (hereinafter, also referred to as MVR). When the MVR is higher than the lower limit described above, it is preferable because the fluidity is sufficiently high, and it is easy to be formed and processed in melt coextrusion molding, and it is unlikely to cause appearance defects. When the MVR is lower than the above upper limit, mechanical properties such as the strength of the thermoplastic resin layer can be easily improved, so it is preferable. The MVR can be measured in accordance with JIS K 7210 under conditions of a load of 1.2 kg and 300 ° C.

於該態樣中,熱塑性樹脂(b)及(c),可再包含1種以上的聚碳酸酯樹脂以外的熱塑性樹脂。就聚碳酸酯樹脂以外的熱塑性樹脂而言,較佳為可與聚碳酸酯樹脂相溶的熱塑性樹脂,更佳為(甲基)丙烯酸樹脂,再更佳為構造中具有芳香環或環烯烴的甲基丙烯酸樹脂。由於熱塑性樹脂(b)及(c)含有聚碳酸酯樹脂及上述(甲基)丙烯酸樹脂,與只包含聚碳酸酯樹脂的情況相比,可更提高分別由熱塑性樹脂(b)及(c)所形成的熱塑性樹脂層(B)及(C)的表面硬度,所以較佳。 In this aspect, the thermoplastic resins (b) and (c) may further include a thermoplastic resin other than a polycarbonate resin. The thermoplastic resin other than the polycarbonate resin is preferably a thermoplastic resin compatible with the polycarbonate resin, more preferably a (meth) acrylic resin, and even more preferably one having an aromatic ring or a cycloolefin in the structure. Methacrylic resin. Since the thermoplastic resins (b) and (c) contain a polycarbonate resin and the (meth) acrylic resin described above, the thermoplastic resins (b) and (c) can be improved more than when the polycarbonate resin is used only. The surface hardness of the formed thermoplastic resin layers (B) and (C) is preferred.

於本發明的另一態樣中,熱塑性樹脂(b)及(c)分別包含聚碳酸酯樹脂、以及基於各熱塑性樹脂(b)及(c)所含的全部樹脂而言為0.005至2.0質量%的紫外線吸收劑,從熱塑性樹脂層的耐光性的觀點來看為較佳。 In another aspect of the present invention, the thermoplastic resins (b) and (c) include a polycarbonate resin, respectively, and the mass is 0.005 to 2.0 mass based on the total resin contained in each of the thermoplastic resins (b) and (c). % Ultraviolet absorber is preferred from the viewpoint of light resistance of the thermoplastic resin layer.

當熱塑性樹脂(b)及(c)包含2種以上的樹 脂、添加劑等成分的情況,可將各熱塑性樹脂(b)及(c)所含的樹脂、添加劑等進行混合或混練,較佳為熔融混練,而得到熱塑性樹脂組成物(b)及(c)。熱塑性樹脂組成物(b)及(c),可直接供給至形成熱塑性樹脂層(B)及(C)用的步驟,亦可成形為例如顆粒狀、環狀、片狀、蜂巢狀等的固體狀或粉狀等後,供給至形成熱塑性樹脂層(B)及(C)用的步驟。固體狀,可由慣用的方法,例如使用擠出造粒機等而成形。而且,熔融溫度、熔融混練所使用的機器等,可與針對樹脂組成物(a)的熔融混練之上述記載的溫度、機器等相同,較佳的溫度、機器等也可相同。 When the thermoplastic resins (b) and (c) contain two or more components such as resins and additives, the resins and additives contained in each of the thermoplastic resins (b) and (c) may be mixed or kneaded. Melt-knead to obtain thermoplastic resin compositions (b) and (c). The thermoplastic resin composition (b) and (c) may be directly supplied to the step for forming the thermoplastic resin layers (B) and (C), or may be formed into solids such as pellets, rings, sheets, honeycombs, etc. After being shaped like powder or powder, it is supplied to the step for forming the thermoplastic resin layers (B) and (C). The solid state can be formed by a conventional method, for example, using an extrusion granulator or the like. The melting temperature and the equipment used for the melt-kneading may be the same as the temperature, equipment, and the like described above for the melt-kneading of the resin composition (a), and the preferred temperature, the equipment, and the like may also be the same.

再者,樹脂組成物(a)所含的樹脂及添加劑的比例,雖以樹脂組成物(a)所含的樹脂為基準而記載,但因為會從樹脂組成物(a)形成中間層(A),所以若換言之,則上述樹脂組成物(a)所含的樹脂及添加劑以及該等的比例,亦可以說是中間層(A)所含的樹脂及添加劑以及該等的比例。關於鹼金屬的含量也是相同情況,上述樹脂組成物(a)所含的鹼金屬量,也可以說是中間層(A)所含的鹼金屬量。而且,關於熱塑性樹脂(b)及(c)也是相同情況,上述的熱塑性樹脂(b)及(c)所含的樹脂及添加劑以及該等的比例,亦可以說是熱塑性樹脂層(B)及(C)所含的樹脂及添加劑以及該等的比例。 The ratio of the resin and the additive contained in the resin composition (a) is described based on the resin contained in the resin composition (a), but the intermediate layer (A) is formed from the resin composition (a). ), So in other words, the resin and additives contained in the above-mentioned resin composition (a) and the proportions thereof can also be said to be the resins and additives contained in the intermediate layer (A) and the proportions thereof. The same applies to the content of the alkali metal. The amount of the alkali metal contained in the resin composition (a) can also be said to be the amount of the alkali metal contained in the intermediate layer (A). The same applies to the thermoplastic resins (b) and (c). The resins and additives contained in the above-mentioned thermoplastic resins (b) and (c), and the ratios thereof can also be said to be the thermoplastic resin layers (B) and (C) The resins and additives contained and their proportions.

本發明的製造方法,包括將至少由熔融的前述樹脂組成物(a)、前述熱塑性樹脂(b)及(c)所形成的熔融樹脂積層體從模頭吐出並冷卻的步驟,於該步驟中,從吐 出溫度至100℃為止的平均冷卻速度為2.5℃/秒以上。如此的冷卻速度時,可有效地防止所得之樹脂積層體的白濁,可得到透明性佳的樹脂積層體。平均冷卻速度未達2.5℃/秒時,推估熔融樹脂積層體所含的結晶性樹脂的偏二氟乙烯樹脂,在熔融樹脂積層體的冷卻中結晶化(或析出),對樹脂積層體造成白濁。另一方面,平均冷卻速度為2.5℃/秒以上時,冷卻速度大於偏二氟乙烯樹脂的結晶化速度,推估因在偏二氟乙烯樹脂的結晶化前,熔融樹脂積層體冷卻固化,故可得到透明性佳的樹脂積層體。 The production method of the present invention includes a step of ejecting and cooling a molten resin laminate formed from at least the molten resin composition (a), the thermoplastic resin (b), and (c) from a die, and in this step, The average cooling rate from the discharge temperature to 100 ° C is 2.5 ° C / second or more. At such a cooling rate, white turbidity of the obtained resin laminate can be effectively prevented, and a resin laminate having excellent transparency can be obtained. When the average cooling rate is less than 2.5 ° C / sec, it is estimated that the vinylidene fluoride resin of the crystalline resin contained in the molten resin laminate is crystallized (or precipitated) during the cooling of the molten resin laminate, which may cause damage to the resin laminate. Cloudy. On the other hand, when the average cooling rate is 2.5 ° C / sec or more, the cooling rate is higher than the crystallization rate of the vinylidene fluoride resin. It is estimated that the molten resin laminate is cooled and solidified before the crystallization of the vinylidene fluoride resin. A resin laminate having excellent transparency can be obtained.

從模頭吐出的熔融樹脂積層體的吐出溫度,係依據熔融樹脂積層體所含的樹脂的種類而適當地選擇,較佳為220至300℃,更佳為220至290℃,再更佳為230至280℃。吐出溫度為上述上限值以上時,容易引起熔融的樹脂的分解,上述下限值以下時,成形加工性降低。再者,吐出溫度係表示模頭的吐出口(或剛吐出後)之熔融樹脂積層體的溫度。 The discharge temperature of the molten resin laminate discharged from the die is appropriately selected according to the kind of resin contained in the molten resin laminate, and is preferably 220 to 300 ° C, more preferably 220 to 290 ° C, and even more preferably 230 to 280 ° C. When the discharge temperature is equal to or higher than the above upper limit value, decomposition of the molten resin is liable to occur, and when the ejection temperature is equal to or lower than the lower limit value, molding processability is reduced. It should be noted that the discharge temperature refers to the temperature of the molten resin laminate at the discharge opening (or immediately after discharge) of the die.

從熔融樹脂積層體的吐出溫度至100℃為止的平均冷卻速度為2.5℃/秒以上,較佳為3.0℃/秒以上,更佳為3.5℃/秒以上,再更佳為4.0℃/秒以上。平均冷卻速度為上述值以上時,推估可更有效地抑制冷卻中的偏二氟乙烯樹脂的結晶化(或析出),可更提高樹脂積層體的透明性。而且,從熔融樹脂積層體的吐出溫度至100℃為止的平均冷卻速度,較佳為25℃/秒以下,更佳為20℃/秒以下,再更佳為17℃/秒以下,特佳為15℃/秒以下。平均冷 卻速度為上述值以下時,推估可抑制因急速冷卻而樹脂積層體殘留應變、產生彎曲。所以,前述平均冷卻速度,較佳為2.5至25℃/秒,更佳為3至20℃/秒,再更佳為3.5至17℃/秒,特佳為4至15℃/秒時,可得到透明性佳且彎曲少,較佳為無彎曲的樹脂積層體。再者,上述所示的平均冷卻速度(℃/秒)係將從熔融樹脂積層體的吐出溫度(℃)減去100(℃)而得的值除以從前述吐出溫度至100℃為止所需的時間(秒)的值。而且,吐出溫度,可在模頭的吐出口(或剛吐出後)設置溫度計(例如非接觸式溫度計)而測定,樹脂從吐出溫度至100℃為止所需的時間,可藉由於冷卻裝置(例如冷卻滾輪)中由溫度計(例如非接觸式溫度計)等找出熔融樹脂積層體成為100℃之處,並測定從模頭的吐出口至該處為止所需的時間而求得。例如實施例的方法等。 The average cooling rate from the molten resin laminate discharge temperature to 100 ° C is 2.5 ° C / sec or more, preferably 3.0 ° C / sec or more, more preferably 3.5 ° C / sec or more, and even more preferably 4.0 ° C / sec or more. . When the average cooling rate is at least the above value, it is estimated that the crystallization (or precipitation) of the vinylidene fluoride resin during cooling can be more effectively suppressed, and the transparency of the resin laminate can be further improved. The average cooling rate from the discharge temperature of the molten resin laminate to 100 ° C is preferably 25 ° C / second or less, more preferably 20 ° C / second or less, still more preferably 17 ° C / second or less, and particularly preferably 15 ° C / sec or less. When the average cooling rate is equal to or less than the above value, it is estimated that the residual strain of the resin laminated body due to rapid cooling and the occurrence of warpage can be suppressed. Therefore, the aforementioned average cooling rate is preferably 2.5 to 25 ° C / second, more preferably 3 to 20 ° C / second, even more preferably 3.5 to 17 ° C / second, and particularly preferably 4 to 15 ° C / second. A resin laminate having excellent transparency and less warpage is preferably obtained without warpage. It should be noted that the average cooling rate (° C / sec) shown above is a value obtained by subtracting 100 (° C) from the discharge temperature (° C) of the molten resin laminate and dividing it from the discharge temperature to 100 ° C. Time (in seconds). In addition, the discharge temperature can be measured by installing a thermometer (such as a non-contact thermometer) at the discharge port of the die (or immediately after discharge). The time required for the resin to reach 100 ° C from the discharge temperature can be measured by a cooling device (such as In a cooling roller), a thermometer (for example, a non-contact thermometer) or the like is used to find the place where the molten resin laminate becomes 100 ° C, and measures the time required to reach the place from the ejection port of the die. For example, the method of the embodiment.

參考圖式,說明本發明之樹脂積層體的製造方法的一實施態樣。第1圖係表示藉由本發明的製造方法所得之樹脂積層體的製造裝置的一例的概略圖。藉由該製造裝置,可得到具有中間層(A)以及分別存在於該中間層(A)的兩側的熱塑性樹脂層(B)及熱塑性樹脂層(C)的樹脂積層體。如第1圖所示,將樹脂組成物(a)、熱塑性樹脂(b)及熱塑性樹脂(c)分別在擠出機2、1、3中熔融混練,將熔融混練的樹脂組成物(a)、熱塑性樹脂(b)及熱塑性樹脂(c)供給至3種3層分配型進料區塊(feed block)4,以成為3層構成之方式分配之後,從多歧管型模頭5的模頭唇部吐出由熔融的樹脂組成物(a)、熱塑性樹脂(b)及熱塑性樹脂(c) 形成的熔融樹脂積層體6。然後,將吐出的熔融積層體6,夾入第一冷卻滾輪7與第二冷卻滾輪8之間,在捲繞於第二冷卻滾輪8的同時夾入第二冷卻滾輪8與第三冷卻滾輪9之間後,捲繞於第三冷卻滾輪9,冷卻,製造樹脂積層體10。 With reference to the drawings, an embodiment of a method for producing a resin laminate according to the present invention will be described. FIG. 1 is a schematic diagram showing an example of a manufacturing apparatus for a resin laminate obtained by the manufacturing method of the present invention. According to this manufacturing apparatus, a resin laminate having an intermediate layer (A) and a thermoplastic resin layer (B) and a thermoplastic resin layer (C) that are respectively present on both sides of the intermediate layer (A) can be obtained. As shown in FIG. 1, the resin composition (a), the thermoplastic resin (b), and the thermoplastic resin (c) are melt-kneaded in the extruder 2, 1, and 3 respectively, and the melt-kneaded resin composition (a) , Thermoplastic resin (b) and thermoplastic resin (c) are supplied to three types of three-layer distribution type feed blocks 4 and distributed in a three-layer configuration. A molten resin layered body 6 made of the molten resin composition (a), the thermoplastic resin (b), and the thermoplastic resin (c) is discharged from the head and lip portion. Then, the discharged molten laminated body 6 is sandwiched between the first cooling roller 7 and the second cooling roller 8, and is wound around the second cooling roller 8 while being sandwiched between the second cooling roller 8 and the third cooling roller 9 After that, it is wound around the third cooling roller 9 and cooled to produce a resin laminate 10.

從容易使樹脂組成物(a)熔融且提高混練性的觀點來看,將樹脂組成物(a)熔融的擠出機2的缸筒溫度(或樹脂組成物(a)的熔融溫度),例如為230至280℃,較佳為230至270℃,從容易使熱塑性樹脂(b)及(c)熔融的觀點來看,擠出機1及3的缸筒溫度(或熱塑性樹脂(b)及(c)的熔融溫度),例如為230至290℃,較佳為230至270℃。而且,從提高混練性的觀點來看,擠出機2中的樹脂組成物(a)的剪切速度,例如為10至1000/秒,較佳為10至500/秒,更佳為10至300/秒,從提高樹脂的混練性的觀點來看,擠出機1及3中的熱塑性樹脂(b)及(c)的剪切速度,例如為10至1000/秒,較佳為10至500/秒,更佳為10至300/秒。再者,剪切速度可藉由改變螺桿形狀、螺桿的長度(L)與螺桿直徑(D)的比(L/D)、螺桿旋轉數等的條件而控制。 From the viewpoint of easily melting the resin composition (a) and improving the kneading property, the cylinder temperature (or the melting temperature of the resin composition (a)) of the extruder 2 that melts the resin composition (a), for example, It is 230 to 280 ° C, preferably 230 to 270 ° C. From the viewpoint of easily melting the thermoplastic resins (b) and (c), the cylinder temperatures of the extruders 1 and 3 (or the thermoplastic resin (b) and The melting temperature of (c)) is, for example, 230 to 290 ° C, and preferably 230 to 270 ° C. Furthermore, from the viewpoint of improving the kneading property, the shear rate of the resin composition (a) in the extruder 2 is, for example, 10 to 1,000 / second, preferably 10 to 500 / second, and more preferably 10 to 300 / sec. From the viewpoint of improving the kneadability of the resin, the shear rate of the thermoplastic resins (b) and (c) in the extruders 1 and 3 is, for example, 10 to 1000 / sec, and preferably 10 to 1,000. 500 / second, more preferably 10 to 300 / second. The shear rate can be controlled by changing conditions such as the shape of the screw, the ratio (L / D) of the screw length (L) to the screw diameter (D), and the number of screw rotations.

擠出機,可為單軸擠出機或多軸擠出機(例如雙軸擠出機等)。而且,模頭的唇部間隔,通常可藉由在模頭的寬度方向排列設置的調節棒(choke bar)螺栓的開關而調節,以使樹脂積層體10的厚度成為後述的範圍內之方式適當地調整即可,相對於樹脂積層體10的厚度而言,較佳可調整為1.01至10倍,更佳為1.1至5倍。模頭的唇部 間隔可從一端至另一端為均勻,亦可具有於寬度方向的分佈。例如,使兩端的唇部間隔比中央部的唇部間隔窄時,可更有效地抑制拉伸共振現象。 The extruder may be a single-shaft extruder or a multi-shaft extruder (for example, a double-shaft extruder, etc.). In addition, the lip interval of the die can usually be adjusted by switching the choke bar bolts arranged in the width direction of the die so that the thickness of the resin laminated body 10 is within the range described later. It can be adjusted according to the ground, and is preferably 1.01 to 10 times, more preferably 1.1 to 5 times, with respect to the thickness of the resin laminated body 10. The lip interval of the die may be uniform from one end to the other end, or may have a distribution in the width direction. For example, when the lip interval at both ends is narrower than the lip interval at the center portion, the stretching resonance phenomenon can be more effectively suppressed.

於將樹脂組成物(a)、熱塑性樹脂(b)及(c)熔融的擠出機1至3,亦可設置:過濾、除去樹脂組成物(a)、熱塑性樹脂(b)及(c)中較大的異物等用的篩網;過濾、除去較小的異物、凝膠等用的聚合物過濾器;使擠出的樹脂組成物及熱塑性樹脂量安定定量化用的齒輪泵等。 For the extruder 1 to 3 which melts the resin composition (a), the thermoplastic resin (b), and (c), it may be provided to filter and remove the resin composition (a), the thermoplastic resin (b), and (c) Screens for medium and large foreign objects, polymer filters for filtering and removing small foreign materials, gels, etc .; gear pumps for quantifying the amount of resin composition extruded and thermoplastic resins.

從調整熔融樹脂積層體的吐出溫度,使後續的冷卻過程中之平均冷卻速度最佳化,而提高樹脂積層體的透明性的觀點來看,進料區塊4及多歧管型模頭5的溫度,例如為230至280℃,較佳為230至270℃,更佳為240至270℃。 From the viewpoint of adjusting the discharge temperature of the molten resin laminate, optimizing the average cooling rate in the subsequent cooling process, and improving the transparency of the resin laminate, the feed block 4 and the multi-manifold die 5 The temperature is, for example, 230 to 280 ° C, preferably 230 to 270 ° C, and more preferably 240 to 270 ° C.

從模頭(多歧管型模頭5)吐出的熔融樹脂積層體6的吐出溫度,例如可為上述例示的吐出溫度。 The discharge temperature of the molten resin laminate 6 discharged from the die (multi-manifold die 5) may be, for example, the discharge temperature exemplified above.

從多歧管型模頭5吐出的熔融樹脂積層體6,經由冷卻滾輪1至3冷卻、固化,可得到樹脂積層體10。此時,從熔融樹脂積層體的吐出溫度至100℃為止的平均冷卻速度,例如可為上述例示的平均冷卻速度。 The molten resin laminated body 6 discharged from the multi-manifold die 5 is cooled and solidified by the cooling rollers 1 to 3 to obtain a resin laminated body 10. At this time, the average cooling rate from the discharge temperature of the molten resin laminate to 100 ° C. may be, for example, the average cooling rate exemplified above.

藉由冷卻滾輪而冷卻熔融樹脂積層體時,容易控制熔融樹脂積層體的平均冷卻速度,可得到安定、透明性佳的樹脂積層體。 When the molten resin laminate is cooled by the cooling roller, it is easy to control the average cooling rate of the molten resin laminate, and a stable and transparent resin laminate can be obtained.

第一冷卻滾輪7、第二冷卻滾輪8及第三冷卻滾輪9(以下有總稱為冷卻滾輪的情況),例如可為金屬滾輪、彈性滾 輪(或金屬彈性滾輪)等。該等滾輪,可單獨使用或組合2種以上而使用,例如3個冷卻滾輪中可至少1個為彈性滾輪,較佳可為第一冷卻滾輪7及第三冷卻滾輪9設為彈性滾輪且第二冷卻滾輪8設為金屬滾輪的構成。 The first cooling roller 7, the second cooling roller 8, and the third cooling roller 9 (hereinafter collectively referred to as a cooling roller) may be, for example, a metal roller, an elastic roller (or a metal elastic roller), and the like. These rollers can be used alone or in combination of two or more. For example, at least one of the three cooling rollers can be an elastic roller. Preferably, the first cooling roller 7 and the third cooling roller 9 can be set as elastic rollers. The two cooling rollers 8 are configured as metal rollers.

就金屬滾輪而言,只要是高剛性即無特別限制,可舉例如鑽孔滾輪、螺旋滾輪等。金屬滾輪的表面狀態,無特別限制,例如可為鏡面,亦可為圖案、凹凸等。 The metal roller is not particularly limited as long as it has high rigidity, and examples thereof include a drilling roller and a spiral roller. The surface state of the metal roller is not particularly limited, and may be, for example, a mirror surface, or a pattern, unevenness, or the like.

彈性滾輪,例如由略圓柱狀的自由旋轉地設置的軸心滾輪、以覆蓋於該軸心滾輪的外周面之方式配置的接觸樹脂積層體的圓筒形金屬製薄膜、及密封在該軸心滾輪與金屬製薄膜之間的流體(例如水、油等)所構成,藉由該流體,彈性滾輪顯示彈性。該軸心滾輪,無特別限制,例如由不銹鋼等所構成。該金屬製薄膜,例如由不銹鋼等所構成,其厚度較佳為2至5mm左右。該金屬製薄膜,以具有彎曲性、可撓性等為較佳,以無焊縫部的無接縫構造為較佳。具備如此的金屬製薄膜的金屬彈性滾輪,在耐久性佳的同時,若使金屬製薄膜鏡面化則可與通常的鏡面滾輪同樣地處理,若對金屬製薄膜賦予圖案、凹凸,則因為成為可轉印其形狀的滾輪,故使用性良好。 The elastic roller includes, for example, a substantially cylindrical shaft-shaped roller that is rotatably provided, a cylindrical metal film that contacts the resin laminate and is disposed so as to cover the outer peripheral surface of the shaft-shaped roller, and is sealed to the shaft. The fluid (for example, water, oil, etc.) between the roller and the metal film is composed of the fluid, and the elastic roller exhibits elasticity. The axis roller is not particularly limited, and is made of, for example, stainless steel. The metal thin film is made of, for example, stainless steel, and its thickness is preferably about 2 to 5 mm. It is preferable that the metal thin film has flexibility, flexibility, and the like, and it is more preferable that it has a seamless structure without a welded portion. The metal elastic roller provided with such a metal film has excellent durability and can be treated in the same manner as a normal mirror roller if the metal film is mirror-finished. If a pattern or unevenness is provided on the metal film, it becomes possible because The shape transfer roller has good usability.

冷卻滾輪表面的形狀,可為平滑狀,亦可為凹凸(例如冷卻滾輪的兩端部的外周圍部有高低差部)。 The shape of the surface of the cooling roller may be smooth or uneven (for example, the outer peripheral portion of the both ends of the cooling roller may have stepped portions).

藉由調整第一冷卻滾輪與第二冷卻滾輪之間以及第二冷卻滾輪與第三冷卻滾輪之間的間隙(滾輪間隙),可設定施加於熔融樹脂積層體的壓力(或線壓),該壓 力(或線壓)可依據所期望的樹脂積層體的厚度而適當地調整。 By adjusting the gap (roller gap) between the first cooling roller and the second cooling roller and between the second cooling roller and the third cooling roller, the pressure (or line pressure) applied to the molten resin laminate can be set. The pressure (or linear pressure) can be appropriately adjusted according to the desired thickness of the resin laminate.

於較佳的態樣中,冷卻滾輪的至少一個,使用前述彈性滾輪。於該態樣中,可抑制施加於被夾入冷卻滾輪的樹脂積層體的應變的累積,即使施加衝擊,也不易發生破裂,可製造表面硬度佳的樹脂積層體。 In a preferred aspect, the aforementioned elastic roller is used for cooling at least one of the rollers. In this aspect, it is possible to suppress accumulation of strain applied to the resin laminated body sandwiched between the cooling rollers, and to prevent cracking easily even when an impact is applied, and it is possible to produce a resin laminated body with excellent surface hardness.

冷卻滾輪的大小,例如外徑為200至1000mm,較佳為250至700mm。而且,冷卻滾輪的表面溫度,較佳係相對於熔融樹脂積層體的玻璃轉化溫度(Th)而言設為(Th-20℃)≦Tr≦(Th+20℃),較佳為(Th-15℃)≦Tr≦(Th+10℃),更佳為(Th-10℃)≦Tr≦(Th+5℃)的範圍。表面溫度(Tr)為下限值以上時,可抑制因熔融樹脂積層體急速冷卻而樹脂積層體殘留應變、產生彎曲,上限值以下時,可抑制因平均冷卻速度變得不足,所得之樹脂積層體產生白濁而透明性降低。再者,就熔融樹脂積層體的玻璃轉化溫度(Th)而言,係以在熔融樹脂積層體所含的樹脂中最高的樹脂為基準。 The size of the cooling roller is, for example, 200 to 1000 mm, preferably 250 to 700 mm. The surface temperature of the cooling roller is preferably set to (Th-20 ° C) ≦ Tr ≦ (Th + 20 ° C) with respect to the glass transition temperature (Th) of the molten resin laminate, and more preferably (Th- 15 ° C) ≦ Tr ≦ (Th + 10 ° C), and more preferably (Th-10 ° C) ≦ Tr ≦ (Th + 5 ° C). When the surface temperature (Tr) is above the lower limit value, residual strain and bending of the resin laminate can be suppressed due to rapid cooling of the molten resin laminate. When the surface temperature (Tr) is below the upper limit value, the resin obtained can be prevented from becoming insufficient due to insufficient average cooling rate. The layered body was cloudy and decreased in transparency. The glass transition temperature (Th) of the molten resin laminate is based on the highest resin among the resins contained in the molten resin laminate.

於本發明的一實施態樣中,樹脂組成物(a)包含(甲基)丙烯酸樹脂及偏二氟乙烯樹脂,熱塑性樹脂(b)及(c)分別包含(甲基)丙烯酸樹脂的情況,冷卻滾輪的表面溫度,例如為30至130℃,較佳為60至130℃,更佳為80至130℃,再更佳為80至120℃。 In one embodiment of the present invention, when the resin composition (a) includes a (meth) acrylic resin and a vinylidene fluoride resin, and the thermoplastic resins (b) and (c) each include a (meth) acrylic resin, The surface temperature of the cooling roller is, for example, 30 to 130 ° C, preferably 60 to 130 ° C, more preferably 80 to 130 ° C, and even more preferably 80 to 120 ° C.

而且,於本發明的另一實施態樣中,樹脂組成物(a)包含(甲基)丙烯酸樹脂及偏二氟乙烯樹脂,熱塑 性樹脂(b)及(c)分別包含聚碳酸酯樹脂的情況,冷卻滾輪的表面溫度,例如為30至160℃,較佳為60至160℃,更佳為80至160℃,再更佳為80至140℃。再者,樹脂的玻璃轉化溫度(Th)可根據ASTM D-648而測定。 In another embodiment of the present invention, the resin composition (a) includes a (meth) acrylic resin and a vinylidene fluoride resin, and the thermoplastic resins (b) and (c) each include a polycarbonate resin. The surface temperature of the cooling roller is, for example, 30 to 160 ° C, preferably 60 to 160 ° C, more preferably 80 to 160 ° C, and even more preferably 80 to 140 ° C. The glass transition temperature (Th) of the resin can be measured in accordance with ASTM D-648.

各冷卻滾輪的表面溫度可為相同,但從容易控制平均冷卻速度為上述範圍的觀點來看,較佳係越遠離模頭的冷卻滾輪,表面溫度越低。亦即,較佳係表面溫度依第一冷卻滾輪、第二冷卻滾輪、第三冷卻滾輪之順序變低。 The surface temperature of each cooling roller may be the same, but from the viewpoint of easily controlling the average cooling rate to the above range, it is preferable that the further away from the cooling roller of the die, the lower the surface temperature. That is, it is preferable that the surface temperature becomes lower in the order of the first cooling roller, the second cooling roller, and the third cooling roller.

樹脂積層體捲繞於第三冷卻滾輪9後,可由拉取滾輪(未圖示)拉取而捲取成卷。可藉由調整該拉取滾輪的拉取速度、從模頭唇部吐出熔融樹脂積層體的吐出速度、前述冷卻滾輪的表面溫度等而控制前述平均冷卻速度。而且,樹脂積層體的厚度,也可藉由調整拉取速度、吐出速度而控制。拉取滾輪的拉取速度,較佳為0.5至10m/分鐘,更佳為1至9m/分鐘,再更佳為1.5至8m/分鐘。 After the resin laminated body is wound around the third cooling roller 9, it can be pulled by a pulling roller (not shown) and wound into a roll. The average cooling rate can be controlled by adjusting the pulling speed of the pulling roller, the discharging speed of the molten resin laminate discharged from the die lip, the surface temperature of the cooling roller, and the like. The thickness of the resin laminate can also be controlled by adjusting the drawing speed and the ejection speed. The pulling speed of the pulling roller is preferably 0.5 to 10 m / minute, more preferably 1 to 9 m / minute, and even more preferably 1.5 to 8 m / minute.

於第1圖中,說明本發明的一實施態樣,但本發明不限於該實施態樣。 In FIG. 1, an embodiment of the present invention is described, but the present invention is not limited to this embodiment.

於第1圖所示的製造方法中,於每一台擠出機中分別投入樹脂組成物(a)、熱塑性樹脂(b)及(c)並進行熔融混練,但只要是經由進料區塊等,可形成熔融樹脂積層體,則擠出機的數目沒有限制。例如於熱塑性樹脂(b)及(c)為相同的情況,也可在一台擠出機內熔融混練熱塑性樹脂(b)及(c),然後經由進料區塊等而分成2個,形成熔融樹脂積層體。 In the manufacturing method shown in FIG. 1, the resin composition (a), the thermoplastic resin (b), and (c) are put into each extruder and melt-kneaded. However, as long as the resin composition passes through the feed block, If a molten resin laminate can be formed, the number of extruders is not limited. For example, when the thermoplastic resins (b) and (c) are the same, the thermoplastic resins (b) and (c) can also be melt-kneaded in an extruder, and then divided into two via the feed block and the like to form Laminated body of molten resin.

而且,於第1圖所示的態樣中,使用進料區塊與多歧管型模頭,但亦可使用其他慣用的模頭,例如T型模頭、雙槽模頭等模頭。該等模頭只要可形成樹脂積層體,即可單獨使用,亦可組合使用。例如可將進料區塊與T型模頭組合而使用,亦可單獨使用多歧管型模頭。 Moreover, in the aspect shown in FIG. 1, the feed block and the multi-manifold die are used, but other conventional die such as a T die, a double groove die, and the like can also be used. These dies can be used alone or in combination as long as they can form a resin laminate. For example, the feed block can be used in combination with a T-die, or a multi-manifold die can be used alone.

積層各層的方式,可為將熔融的樹脂組成物(a)、熱塑性樹脂(b)及(c)以進料區塊分配為3層構造,流入T型模頭而成形的模頭前積層方式;亦可為將熔融的樹脂組成物(a)、熱塑性樹脂(b)及(c)分別流入多歧管型模頭,在模頭唇部前成形為3層構造的模頭內積層方式。 The method of laminating each layer may be a pre-lamination method in which a molten resin composition (a), thermoplastic resins (b), and (c) are distributed into a three-layer structure with a feed block and flowed into a T-die. ; It is also possible to laminate the molten resin composition (a), thermoplastic resin (b), and (c) into a multi-manifold die, and form a three-layer structure in the die in front of the die lip.

冷卻滾輪的數目,無特別限制,例如為1至10,較佳為2至5。而且,於冷卻滾輪為複數個的情況,冷卻滾輪的大小、冷卻滾輪的種類(例如彈性滾輪、金屬滾輪等),於各冷卻滾輪,可為相同或不同。而且,冷卻滾輪的配置,可如第1圖所示的橫向排列型配置,亦可為縱向排列型配置或傾斜排列型配置。 The number of the cooling rollers is not particularly limited, and is, for example, 1 to 10, and preferably 2 to 5. In the case where there are a plurality of cooling rollers, the size of the cooling roller and the type of the cooling roller (for example, an elastic roller, a metal roller, etc.) may be the same or different for each cooling roller. In addition, the arrangement of the cooling rollers may be a horizontal arrangement type arrangement as shown in FIG. 1, or a vertical arrangement type or an oblique arrangement type.

通過冷卻滾輪後,亦可設置加熱器,調整薄片的平均冷卻速度。 After passing the cooling roller, a heater can also be set to adjust the average cooling speed of the sheet.

雖然說明藉由冷卻滾輪的冷卻方法來作為較佳的實施態樣,但只要可將前述熔融樹脂積層體以上述冷卻速度冷卻,則亦可為與使用冷卻滾輪的方法不同的其他慣用的冷卻方法,例如藉由冷風、水冷等的冷卻方法。 Although a cooling method using a cooling roller is described as a preferred embodiment, as long as the molten resin laminate can be cooled at the cooling rate described above, it may be another conventional cooling method different from the method using a cooling roller. For example, cooling methods such as cold air and water cooling.

藉由本發明所得之樹脂積層體,係將如上述方式製造的積層體切割,以例如具有寬度500至 3000mm、長度500至3000mm之大小的樹脂積層體的形態配送。 With the resin laminate obtained by the present invention, the laminate manufactured as described above is cut and distributed in the form of a resin laminate having a width of 500 to 3000 mm and a length of 500 to 3000 mm, for example.

〈樹脂積層體〉 <Resin laminate>

從提高樹脂積層體的透明性的觀點及抑制彎曲的觀點來看,藉由本發明的製造方法所得之樹脂積層體,較佳係樹脂積層體的膜厚的平均值為100至2000μm,且熱塑性樹脂層(B)及(C)的膜厚的平均值分別為10至200μm。 From the viewpoint of improving the transparency of the resin laminate and suppressing the bending, the resin laminate obtained by the production method of the present invention preferably has an average film thickness of the resin laminate of 100 to 2000 μm, and a thermoplastic resin. The average values of the film thicknesses of the layers (B) and (C) are 10 to 200 μm, respectively.

從樹脂積層體的剛性的觀點來看,藉由本發明所得之樹脂積層體的膜厚的平均值,較佳為100μm以上,更佳為200μm以上,再更佳為300μm以上。而且,從透明性的觀點來看,較佳為2000μm以下,更佳為1500μm以下,再更佳為1000μm以下。樹脂積層體的膜厚,係藉由數位測微計測定。將在樹脂積層體的10處進行上述測定而得的平均值作為膜厚的平均值。 From the viewpoint of the rigidity of the resin laminate, the average value of the film thickness of the resin laminate obtained by the present invention is preferably 100 μm or more, more preferably 200 μm or more, and even more preferably 300 μm or more. From the viewpoint of transparency, the thickness is preferably 2000 μm or less, more preferably 1500 μm or less, and even more preferably 1000 μm or less. The film thickness of the resin laminate was measured by a digital micrometer. The average value obtained by performing the above-mentioned measurement at 10 locations of the resin laminate was taken as the average value of the film thickness.

從容易提高表面硬度的觀點來看,於藉由本發明所得之樹脂積層體中,熱塑性樹脂層(B)及(C)的膜厚的平均值,分別較佳為10μm以上,更佳為30μm以上,再更佳為50μm以上。而且,從介電常數的觀點來看,分別較佳為200μm以下,更佳為175μm以下,再更佳為150μm以下。熱塑性樹脂層的膜厚的平均值的測定方法,如同上述的方法。 From the viewpoint of easily improving the surface hardness, in the resin laminate obtained by the present invention, the average values of the film thicknesses of the thermoplastic resin layers (B) and (C) are preferably 10 μm or more, and more preferably 30 μm or more. And more preferably 50 μm or more. From the viewpoint of the dielectric constant, each is preferably 200 μm or less, more preferably 175 μm or less, and still more preferably 150 μm or less. The method of measuring the average film thickness of the thermoplastic resin layer is the same as the method described above.

從介電常數的觀點來看,於藉由本發明所得之樹脂積層體中,中間層(A)的膜厚的平均值,較佳為100μm以上,更佳為200μm以上,再更佳為300μm以 上。而且,從透明性的觀點來看,較佳為1500μm以下,更佳為1200μm以下,再更佳為1000μm以下。中間層(A)的膜厚的平均值,可用與熱塑性樹脂層的膜厚的平均值的測定相同的方法測定。 From the viewpoint of the dielectric constant, in the resin laminate obtained by the present invention, the average film thickness of the intermediate layer (A) is preferably 100 μm or more, more preferably 200 μm or more, and even more preferably 300 μm or more. . From the viewpoint of transparency, the thickness is preferably 1500 μm or less, more preferably 1200 μm or less, and even more preferably 1000 μm or less. The average value of the film thickness of the intermediate layer (A) can be measured by the same method as the measurement of the average value of the film thickness of the thermoplastic resin layer.

藉由本發明所得之樹脂積層體,較佳係以目視觀察時為透明。具體而言,藉由本發明所得之樹脂積層體,根據JIS K7361-1:1997測定,較佳具有85%以上,更佳具有88%以上,再更佳具有90%以上的全光線穿透率(Tt)。全光線穿透率的上限為100%。在60℃、相對濕度90%的環境下暴露120小時後的樹脂積層體,仍具有上述的範圍的全光線穿透率為較佳。 The resin laminate obtained by the present invention is preferably transparent when visually observed. Specifically, the resin laminate obtained by the present invention has a total light transmittance of at least 85%, more preferably at least 88%, and even more preferably at least 90%, as measured in accordance with JIS K7361-1: 1997. Tt). The upper limit of total light transmittance is 100%. After being exposed to the environment of 60 ° C. and a relative humidity of 90% for 120 hours, the resin laminate having the above-mentioned range still has a good total light transmittance.

藉由本發明所得之樹脂積層體,使用在60℃、相對濕度90%的環境下暴露120小時後的樹脂積層體,根據JIS K7136:2000測定,較佳具有2.0%以下,更佳具有1.8%以下,再更佳具有1.5%以下的霧度(Haze)。而且,藉由本發明所得之樹脂積層體,使用在60℃、相對濕度90%的環境下暴露120小時後的樹脂積層體,根據JIS Z8722:2009測定,較佳具有1.5以下,更佳具有1.4以下,再更佳具有1.3以下的黃色度(Yellow Index:YI值)。具有上述的霧度及黃色度的藉由本發明所得之樹脂積層體,由於即使在高溫高濕等的環境下使用,仍維持透明性,不易產生彎曲,容易抑制黃色化,所以較佳。 With the resin laminate obtained by the present invention, the resin laminate is used after being exposed to an environment of 60 ° C. and a relative humidity of 90% for 120 hours. According to JIS K7136: 2000, it is preferably 2.0% or less, and more preferably 1.8% or less. , And even more preferably with a haze of 1.5% or less. In addition, the resin laminate obtained by the present invention uses a resin laminate that has been exposed to an environment of 60 ° C. and a relative humidity of 90% for 120 hours. According to JIS Z8722: 2009, it is preferably 1.5 or less, and more preferably 1.4 or less. , And more preferably has a yellowness (Yellow Index: YI value) of 1.3 or less. The resin laminate obtained by the present invention having the above-mentioned haze and yellowness is preferable because it maintains transparency even when used in an environment such as high temperature and high humidity, and is less prone to warping and yellowing.

從使用於觸控面板等顯示裝置時得到充分功能的觀點來看,藉由本發明所得之樹脂積層體較佳具有 3.5以上,更佳具有4.0以上,再更佳具有4.1以上的介電常數。介電常數的上限值,無特別限制,但通常為20。介電常數,可藉由調整本發明的樹脂積層體的中間層(A)所含的偏二氟乙烯樹脂的種類、量,或藉由添加碳酸伸乙酯、碳酸伸丙酯等高介電常數的化合物,而調整為上述的範圍。介電常數,係根據JIS K6911:1995,將樹脂積層體在23℃、相對濕度50%的環境下靜置24小時,在該環境下以自動平衡電橋法在3V、100kHz下測定的值。測定時,可使用市售的機器,例如可使用安捷倫科技股份有限公司製的「precision LCR meter HP4284A」。 From the viewpoint of obtaining sufficient functions when used in a display device such as a touch panel, the resin laminate obtained by the present invention preferably has a dielectric constant of 3.5 or more, more preferably 4.0 or more, and even more preferably 4.1 or more. The upper limit of the dielectric constant is not particularly limited, but is usually 20. The dielectric constant can be adjusted by the type and amount of the vinylidene fluoride resin contained in the intermediate layer (A) of the resin laminate of the present invention, or by adding high dielectrics such as ethyl carbonate and propylene carbonate. A constant compound while adjusting to the above range. The dielectric constant is a value measured in accordance with JIS K6911: 1995 by leaving the resin laminate in an environment of 23 ° C. and a relative humidity of 50% for 24 hours, and measuring it at 3 V and 100 kHz by an automatic balance bridge method in this environment. For the measurement, a commercially available device can be used, for example, "precision LCR meter HP4284A" manufactured by Agilent Technologies, Inc. can be used.

藉由本發明所得之樹脂積層體,只要至少具有依序積層有熱塑性樹脂層(B)/中間層(A)/熱塑性樹脂層(C)的構成即可,除了中間層(A)、熱塑性樹脂層(B)及(C)之外,可再具有至少一功能層。功能層,較佳係存在於熱塑性樹脂層(B)及/或(C)的與中間層(A)為相反側的表面。功能層,可舉例如硬塗層、抗反射層、抗眩層、抗靜電層及抗指紋層等。該等功能層,可隔著黏著劑(pressure-sensitive adhesive)層而積層於樹脂積層體,亦可為藉由塗佈而積層的塗層。作為功能層,可使用例如日本特開2013-86273號公報所記載的硬化被覆膜。功能層,例如亦可為在選自由硬塗層、抗眩層、抗靜電層及抗指紋層所構成之群組的至少一功能層的單面或兩面,藉由塗佈法、濺鍍法、真空蒸鍍法等而進一步塗佈有抗反射層的層,亦可為在上述至少一功能層的單面或兩面貼合有抗反射性薄片的層。即使於 包含該等功能層的樹脂積層體的情況,藉由上述的成形法、熔融擠出成形法、溶液流鑄製膜法、熱壓法、射出成形法等,分別製作各層,將該等隔著例如黏著劑、接著劑貼合而製造;亦可藉由共擠出成形法積層一體化而製造。 The resin laminate obtained by the present invention may have at least a structure in which a thermoplastic resin layer (B) / intermediate layer (A) / thermoplastic resin layer (C) is sequentially laminated, except for the intermediate layer (A) and the thermoplastic resin layer. In addition to (B) and (C), there may be at least one functional layer. The functional layer is preferably present on the surface of the thermoplastic resin layer (B) and / or (C) on the side opposite to the intermediate layer (A). Examples of the functional layer include a hard coating layer, an anti-reflection layer, an anti-glare layer, an anti-static layer, and an anti-fingerprint layer. These functional layers may be laminated on a resin laminated body via a pressure-sensitive adhesive layer, or may be a coating layer laminated by coating. As the functional layer, for example, a hardened coating film described in Japanese Patent Application Laid-Open No. 2013-86273 can be used. The functional layer may be, for example, one side or both sides of at least one functional layer selected from the group consisting of a hard coating layer, an anti-glare layer, an antistatic layer, and an anti-fingerprint layer, by a coating method or a sputtering method. A layer further coated with an anti-reflection layer such as a vacuum deposition method or the like may be a layer in which an anti-reflection sheet is bonded to one or both sides of the at least one functional layer. Even in the case of a resin laminate including such functional layers, each layer is separately produced by the above-mentioned forming method, melt extrusion molding method, solution flow casting film method, hot pressing method, injection molding method, etc. It is manufactured by laminating through an adhesive and an adhesive, for example, and it can also be manufactured by lamination and integration by a co-extrusion molding method.

功能層的厚度,可依據各功能層的目的而適當地選擇,但從容易顯現功能的觀點來看,較佳為1μm以上,更佳為3μm以上,再更佳為5μm以上,從容易防止功能層的破裂的觀點來看,較佳為100μm以下,更佳為80μm以下,再更佳為70μm以下。 The thickness of the functional layer can be appropriately selected depending on the purpose of each functional layer, but from the viewpoint of easily expressing the function, it is preferably 1 μm or more, more preferably 3 μm or more, and still more preferably 5 μm or more. From the viewpoint of cracking the layer, the thickness is preferably 100 μm or less, more preferably 80 μm or less, and even more preferably 70 μm or less.

藉由本發明所得之樹脂積層體,可使用於各種顯示裝置。所謂顯示裝置,係具有顯示元件的裝置,且包含發光元件或發光裝置作為發光源。顯示裝置,可舉例如液晶顯示裝置、有機電激發光(EL)顯示裝置、無機電激發光(EL)顯示裝置、觸控面板顯示裝置、電子發射顯示裝置(例如電場發射顯示裝置(FED)、表面電場發射顯示裝置(SED))、電子紙(使用電子墨水、電泳元件的顯示裝置)、電漿顯示裝置、投射型顯示裝置(例如柵狀光閥(GLV)顯示裝置、具有數位微鏡裝置(DMD)的顯示裝置)及壓電陶瓷顯示器等。液晶顯示裝置,包括穿透型液晶顯示裝置、半穿透型液晶顯示裝置、反射型液晶顯示裝置、直視型液晶顯示裝置及投影型液晶顯示裝置等中的任一種。該等顯示裝置,可為顯示2維影像的顯示裝置,亦可為顯示3維影像的立體顯示裝置。藉由本發明所得之樹脂積層體,於該等顯示裝置中,適合使用來作為例如前面板或透明電極。 The resin laminate obtained by the present invention can be used in various display devices. The display device is a device having a display element and includes a light emitting element or a light emitting device as a light emitting source. The display device may be, for example, a liquid crystal display device, an organic electroluminescent (EL) display device, an inorganic electroluminescent (EL) display device, a touch panel display device, an electron emission display device (such as an electric field emission display device (FED), Surface electric field emission display device (SED)), electronic paper (display device using electronic ink, electrophoretic element), plasma display device, projection display device (e.g. grid light valve (GLV) display device, digital micromirror device (DMD) display devices) and piezoelectric ceramic displays. The liquid crystal display device includes any one of a transmissive liquid crystal display device, a transflective liquid crystal display device, a reflective liquid crystal display device, a direct-view liquid crystal display device, and a projection liquid crystal display device. These display devices may be display devices that display two-dimensional images or stereoscopic display devices that display three-dimensional images. The resin laminate obtained by the present invention is suitable for use in such display devices as, for example, a front panel or a transparent electrode.

將藉由本發明所得之樹脂積層體,使用來作為觸控面板等中的透明電極時,可在樹脂積層體的至少一表面形成透明導電膜而製造透明導電片,並從該透明導電片製造透明電極。 When the resin laminate obtained by the present invention is used as a transparent electrode in a touch panel or the like, a transparent conductive film can be formed on at least one surface of the resin laminate to produce a transparent conductive sheet, and a transparent conductive sheet can be produced from the transparent conductive sheet. electrode.

就形成透明導電膜於藉由本發明所得之樹脂積層體的至少一表面的方法而言,可直接形成透明導電膜於樹脂積層體的表面,亦可將預先形成有透明導電膜的塑膠膜積層於本發明的樹脂積層體的表面。 As for the method of forming a transparent conductive film on at least one surface of the resin laminate obtained by the present invention, a transparent conductive film can be directly formed on the surface of the resin laminate, or a plastic film formed with a transparent conductive film in advance can be laminated on The surface of the resin laminated body of this invention.

就預先形成有透明導電膜的塑膠膜的膜基材而言,只要是透明膜且可形成透明導電膜的基材即無特別限制,可舉例如聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚碳酸酯、丙烯酸樹脂、聚醯胺、該等的混合物或積層物等。而且,形成透明導電膜前,能以表面硬度的改良、牛頓環的防止、抗靜電性的賦予等作為目的而事先於上述膜施行塗佈。 As for the film substrate of the plastic film on which the transparent conductive film is formed in advance, there is no particular limitation as long as it is a transparent film and the substrate capable of forming the transparent conductive film, and examples thereof include polyethylene terephthalate and polynaphthalene. Ethylene formate, polycarbonate, acrylic resin, polyamide, mixtures or laminates thereof, etc. In addition, before forming a transparent conductive film, the film can be applied in advance for the purpose of improving surface hardness, preventing Newton's rings, and imparting antistatic properties.

將預先形成有透明導電膜的膜積層於本發明的樹脂積層體的表面的方法,只要是可得到無氣泡等、均勻的透明片的方法即可為任意方法。可採用使用藉由常溫、加熱、紫外線或可見光線而硬化的接著劑並積層的方法,亦可藉由透明的黏著帶貼合。 The method of laminating a film on which a transparent conductive film is formed in advance on the surface of the resin laminate of the present invention may be any method as long as it is a method capable of obtaining a uniform transparent sheet without bubbles or the like. A method of laminating an adhesive that is hardened by normal temperature, heating, ultraviolet rays, or visible light can be used, or it can be laminated by a transparent adhesive tape.

就透明導電膜的成膜方法而言,已知有真空蒸鍍法、濺鍍法、CVD法、離子鍍法、噴霧法等,可依據需要的膜厚而適當地使用該等方法。 As a method for forming a transparent conductive film, a vacuum evaporation method, a sputtering method, a CVD method, an ion plating method, a spray method, and the like are known, and these methods can be appropriately used depending on the required film thickness.

於濺鍍法的情況,可採用例如使用氧化物 靶的通常的濺鍍法、使用金屬靶的反應性濺鍍法等。此時,可導入氧氣、氮氣等作為反應性氣體,或併用添加臭氧、照射電漿、離子輔助等的手段。而且,依需要,亦可對基板施加直流、交流、高頻等的偏壓。使用於透明導電膜的透明導電性金屬氧化物,可舉例如氧化銦、氧化錫、氧化鋅、銦-錫複合氧化物、錫-銻複合氧化物、鋅-鋁複合氧化物、銦-鋅複合氧化物等。該等之中,從環境安定性、電路加工性的觀點來看,適合為銦-錫複合氧化物(ITO)。 In the case of the sputtering method, for example, a general sputtering method using an oxide target, a reactive sputtering method using a metal target, and the like can be used. At this time, oxygen, nitrogen, or the like may be introduced as a reactive gas, or means such as adding ozone, irradiating plasma, and ion assist may be used in combination. Furthermore, a DC, AC, or high frequency bias may be applied to the substrate as needed. Examples of the transparent conductive metal oxide used for the transparent conductive film include indium oxide, tin oxide, zinc oxide, indium-tin composite oxide, tin-antimony composite oxide, zinc-aluminum composite oxide, and indium-zinc composite. Oxides, etc. Among these, indium-tin composite oxide (ITO) is suitable from the viewpoint of environmental stability and circuit processability.

而且,作為形成透明導電膜的方法,亦可應用將包含可形成透明導電性被覆膜的各種導電性高分子的塗劑塗佈於本發明的樹脂積層體的表面,藉由熱或照射紫外線等游離輻射線而使塗層硬化的方法等。就導電性高分子而言,已知有聚噻吩、聚苯胺、聚吡咯等,可使用該等導電性高分子。 In addition, as a method for forming a transparent conductive film, a coating agent containing various conductive polymers capable of forming a transparent conductive coating film may be applied to the surface of the resin laminated body of the present invention, and heat or ultraviolet rays may be applied. A method of curing the coating by releasing radiation. As the conductive polymer, polythiophene, polyaniline, polypyrrole, and the like are known, and these conductive polymers can be used.

就透明導電膜的厚度而言,無特別限制,但於使用透明導電性的金屬氧化物的情況,通常為50至2000Å,較佳為70至1000Å。只要是該範圍,則導電性及透明性兩者皆佳。 The thickness of the transparent conductive film is not particularly limited, but when a transparent conductive metal oxide is used, it is usually 50 to 2000 Å, preferably 70 to 1000 Å. As long as it is within this range, both conductivity and transparency are good.

透明導電片的厚度,無特別限制,可依據顯示器的製品規格的要求而選擇最適合的厚度。 The thickness of the transparent conductive sheet is not particularly limited, and the most suitable thickness can be selected according to the requirements of the product specifications of the display.

使用藉由本發明所得之樹脂積層體作為顯示器面板,並使用由本發明的樹脂積層體製造的透明導電片作為觸控螢幕等的透明電極,可製造觸控感應面板。具體而言,可使用藉由本發明所得之樹脂積層體作為觸控螢 幕用視窗片,並使用透明導電片作為電阻膜方式、電容方式的觸控螢幕的電極基板。藉由將該觸控螢幕配置於液晶顯示裝置、有機EL顯示裝置等的前面,可得到具有觸控螢幕功能的外加型的觸控感應面板。 A touch sensing panel can be manufactured by using the resin laminated body obtained by the present invention as a display panel and using the transparent conductive sheet manufactured by the resin laminated body of the present invention as a transparent electrode of a touch screen or the like. Specifically, the resin laminate obtained by the present invention can be used as a window sheet for a touch screen, and a transparent conductive sheet can be used as an electrode substrate for a touch screen of a resistive film type or a capacitive type. By disposing the touch screen in front of a liquid crystal display device, an organic EL display device, or the like, an external touch sensing panel having a touch screen function can be obtained.

藉由本發明所得之樹脂積層體,可使用於例如上述的顯示裝置,亦即包含藉由本發明所得之樹脂積層體的顯示裝置,而且也可使用於積層有藉由本發明所得之樹脂積層體及偏光板的附樹脂積層體的偏光板、以及包含該附樹脂積層體的偏光板之顯示裝置。於附有藉由本發明所得之樹脂積層體的偏光板中,樹脂積層體係隔著例如接著劑及黏著劑等的光學黏接著劑而積層於偏光板。作為接著劑或黏著劑,只要使用適合的習知者即可。 The resin laminated body obtained by the present invention can be used in, for example, the above-mentioned display device, that is, a display device including the resin laminated body obtained by the present invention, and can also be used to laminate the resin laminated body and polarized light obtained by the present invention. A polarizing plate with a resin laminated body of the plate, and a display device including the polarizing plate with the resin laminated body. In the polarizing plate provided with the resin laminate obtained by the present invention, the resin laminated system is laminated on the polarizing plate with an optical adhesive such as an adhesive and an adhesive. As an adhesive agent or an adhesive agent, an appropriate one can be used.

於第2圖以剖面示意圖表示包含藉由本發明所得之樹脂積層體的液晶顯示裝置的一較佳態樣。藉由本發明所得之樹脂積層體10,隔著光學黏著層12,積層於偏光板11,該積層體可配置於液晶單元13的觀賞側。液晶單元13的背面側,通常配置偏光板11。液晶顯示裝置14,係由如此的構件構成。再者,第2圖係液晶顯示裝置的一例,本發明的顯示裝置不限於該構成。 A preferred aspect of a liquid crystal display device including a resin laminate obtained by the present invention is shown in a schematic cross-sectional view in FIG. 2. The resin laminated body 10 obtained by the present invention is laminated on the polarizing plate 11 via the optical adhesive layer 12, and the laminated body can be disposed on the viewing side of the liquid crystal cell 13. The polarizing plate 11 is usually arranged on the back side of the liquid crystal cell 13. The liquid crystal display device 14 is composed of such members. The second figure is an example of a liquid crystal display device, and the display device of the present invention is not limited to this configuration.

[實施例]     [Example]    

以下列舉實施例及比較例,具體地說明本發明,但本發明不限於該等實施例。 Examples and comparative examples are given below to specifically explain the present invention, but the present invention is not limited to these examples.

〔菲卡軟化溫度〕 [Fica softening temperature]

根據JIS K 7206:1999「塑膠-熱塑性塑膠-菲卡軟化 溫度(VST)的測試方法」所規定的B50法測定。菲卡軟化溫度,係使用熱變形測試機[安田精機製作所股份有限公司製的“148-6連型”]測定。此時的測試片係將各原料壓製成形為3mm厚度,進行測定。 It was measured according to the B50 method specified in JIS K 7206: 1999 "Test method for plastic-thermoplastic-fica softening temperature (VST)". The Ficca softening temperature was measured using a thermal deformation tester ["148-6 continuous type" manufactured by Yasuda Seiki Seisakusho Co., Ltd.]. The test piece at this time was measured by pressing each raw material into a thickness of 3 mm.

〔鹼金屬的含量〕 [Content of alkali metal]

藉由感應耦合電漿質譜分析法測定。 Determined by inductively coupled plasma mass spectrometry.

〔MFR〕 〔MFR〕

根據JIS K 7210:1999「塑膠-熱塑性塑膠的熔體質量流動速率(MFR)及熔體體積流動速率(MVR)的測試方法」所規定的方法測定。該JIS中規定,針對聚(甲基丙烯酸甲酯)系的材料,在溫度230℃、負重3.80kg(37.3N)下測定。 Measured in accordance with the method specified in JIS K 7210: 1999 "Test method for melt mass flow rate (MFR) and melt volume flow rate (MVR) of plastics-thermoplastics". The JIS specifies that poly (methyl methacrylate) -based materials are measured at a temperature of 230 ° C and a load of 3.80 kg (37.3 N).

〔全光線穿透率及霧度〕 [Total light transmittance and haze]

使用根據JIS K 7361-1:1997「塑膠-透明材料的全光線穿透率的測試方法-第1部:單光束法」的霧度穿透率計(村上色彩技術研究所股份有限公司製「HR-100」)測定。 A haze transmittance meter (Murakami Color Research Institute Co., Ltd., "manufactured by Murakami Color Institute" HR-100 ").

〔YI值〕 〔YI value〕

用日本電色工業股份有限公司製「Spectrophotometer SQ2000」測定。 Measured with "Spectrophotometer SQ2000" manufactured by Nippon Denshoku Industries Co., Ltd.

〔彎曲的評價〕 [Evaluation of Bending]

將片狀的樹脂積層體切為100mm×56mm的大小,調製彎曲評價用試料。彎曲評價,係將該試料的4端部以Keyence公司製高精度CCD測微器觀察,測定產生的彎曲的高度,算出4端部的彎曲的高度的平均值而進行。 The sheet-like resin laminate was cut into a size of 100 mm × 56 mm, and a sample for bending evaluation was prepared. The bending evaluation was performed by observing the 4 ends of the sample with a high-precision CCD micrometer manufactured by Keyence, measuring the height of the resulting bend, and calculating the average of the bending height of the 4 ends.

〔製造例1〕 [Manufacturing example 1]

混合甲基丙烯酸甲酯97.7質量份及丙烯酸甲酯2.3質量份,添加鏈轉移劑(辛硫醇)0.05質量份及離型劑(硬脂醇)0.1質量份,得到單體混合液。而且,於甲基丙烯酸甲酯100質量份添加聚合引發劑〔1,1-二(第三丁基過氧)3,3,5-三甲基環己烷〕0.036質量份,得到引發劑混合液。以使單體混合液與引發劑混合液的流量比成為8.8:1之方式連續供應至完全混合型聚合反應器,以平均滯留時間20分鐘、溫度175℃進行聚合直至平均聚合率54%為止,得到部分聚合物。將所得之部分聚合物加熱至200℃,導入至附通氣孔的去揮發擠出機,在240℃將未反應的單體從通氣孔進行去揮發的同時,去揮發後的聚合物係在熔融狀態下擠出,水冷卻後,切斷,得到顆粒狀的甲基丙烯酸樹脂(i)。 97.7 parts by mass of methyl methacrylate and 2.3 parts by mass of methyl acrylate were mixed, and 0.05 parts by mass of a chain transfer agent (octanethiol) and 0.1 parts by mass of a release agent (stearyl alcohol) were added to obtain a monomer mixed solution. Furthermore, 0.036 parts by mass of a polymerization initiator [1,1-bis (third butylperoxy) 3,3,5-trimethylcyclohexane] was added to 100 parts by mass of methyl methacrylate, and an initiator mixture was obtained. liquid. Continuously supplied the completely mixed polymerization reactor so that the flow ratio of the monomer mixed liquid to the initiator mixed liquid became 8.8: 1, and polymerized with an average residence time of 20 minutes and a temperature of 175 ° C until the average polymerization rate was 54%. Partial polymer was obtained. Part of the obtained polymer was heated to 200 ° C and introduced into a devolatization extruder with a vent hole. At 240 ° C, the unreacted monomer was devolatized from the vent hole, and the devolatized polymer was melted. It was extruded in a state, and after cooling with water, it was cut to obtain granular methacrylic resin (i).

將所得之顆粒狀的甲基丙烯酸樹脂組成物,在以下所示的條件下藉由熱分解氣相層析分析,測定對應甲基丙烯酸甲酯及丙烯酸酯的各峰面積。結果,甲基丙烯酸樹脂(i),來自甲基丙烯酸甲酯的構造單元為97.0質量%,來自丙烯酸甲酯的構造單元為3.0質量%。 The obtained particulate methacrylic resin composition was analyzed by thermal decomposition gas chromatography under the conditions shown below, and the respective peak areas corresponding to methyl methacrylate and acrylate were measured. As a result, in the methacrylic resin (i), the structural unit derived from methyl methacrylate was 97.0% by mass, and the structural unit derived from methyl acrylate was 3.0% by mass.

(熱分解條件) (Thermal decomposition conditions)

試料調製:精秤甲基丙烯酸樹脂組成物(標準2至3mg),放入細長槽形的金屬盒的中央部,折疊金屬盒,輕輕地以鉗子壓兩端,封緊。 Preparation of sample: Fine-scale methacrylic resin composition (standard 2 to 3 mg), put it in the center of the elongated groove-shaped metal box, fold the metal box, gently press both ends with pliers, and seal.

熱分解裝置:CURIE POINT PYROLYZER JHP-22(日本分析工業股份有限公司製) Thermal decomposition device: CURIE POINT PYROLYZER JHP-22 (manufactured by Japan Analytical Industry Co., Ltd.)

金屬盒:Pyrofoil F590(日本分析工業股份有限公司製) Metal box: Pyrofoil F590 (manufactured by Japan Analytical Industry Co., Ltd.)

恆溫槽的設定溫度:200℃ Setting temperature of thermostatic bath: 200 ℃

保溫管的設定溫度:250℃ Set temperature of insulation pipe: 250 ℃

熱分解溫度:590℃ Thermal decomposition temperature: 590 ° C

熱分解時間:5秒 Thermal decomposition time: 5 seconds

(氣相層析的分析條件) (Analysis conditions of gas chromatography)

氣相層析分析裝置:GC-14B(島津製作所股份有限公司製) Gas chromatography analysis device: GC-14B (manufactured by Shimadzu Corporation)

檢測方法:FID Detection method: FID

管柱:7G 3.2m×3.1mm(島津製作所股份有限公司製) String: 7G 3.2m × 3.1mm (Made by Shimadzu Corporation)

填充劑:FAL-M(島津製作所股份有限公司製) Filler: FAL-M (manufactured by Shimadzu Corporation)

載送氣體:Air/N2/H2=50/100/50(kPa)、80ml/分鐘 Carrier gas: Air / N2 / H2 = 50/100/50 (kPa), 80ml / min

管柱的升溫條件:在100℃保持15分鐘後,以10℃/分鐘升溫至150℃,在150℃保持14分鐘 Conditions for temperature rise of the column: After being held at 100 ° C for 15 minutes, the temperature was increased to 150 ° C at 10 ° C / minute, and held at 150 ° C for 14 minutes.

INJ溫度:200℃ INJ temperature: 200 ℃

DET溫度:200℃ DET temperature: 200 ℃

以上述熱分解條件使甲基丙烯酸樹脂組成物熱分解,測定出將產生的分解生成物以上述氣相層析的分析條件進行測定時所檢測出的對應甲基丙烯酸甲酯的峰面積(a1)及對應丙烯酸酯的峰面積(b1)。然後,從該等峰面積求得峰面積比A(=b1/a1)。另一方面,使丙烯酸酯單元對甲基丙烯酸甲酯單元的質量比為W0(已知)之甲基丙烯酸樹脂的標準品以上述熱分解條件熱分解,測定出將產生的分解生成物以上述氣相層析的分析條件進行測定時所檢測出的對應甲基丙烯酸甲酯的峰面積(a0)及對應丙烯酸酯的峰 面積(b0),從該等峰面積求得峰面積比A0(=b0/a0)。然後,從前述峰面積比A0及前述質量比W0,求得f係數(=W0/A0)。 The methacrylic resin composition was thermally decomposed under the above thermal decomposition conditions, and the peak area corresponding to methyl methacrylate (a1) was measured when the generated decomposition product was measured under the above-mentioned analysis conditions of gas chromatography. ) And the peak area (b1) of the corresponding acrylate. Then, a peak area ratio A (= b1 / a1) was obtained from the peak areas. On the other hand, a standard product of a methacrylic resin having a mass ratio of acrylate units to methyl methacrylate units of W 0 (known) was thermally decomposed under the above-mentioned thermal decomposition conditions, and the decomposition products to be generated were measured to The peak area (a 0 ) corresponding to methyl methacrylate and the peak area (b 0 ) corresponding to acrylate detected when the analysis conditions of the above-mentioned gas chromatography were measured, and the peak area ratio was obtained from the peak areas. A 0 (= b 0 / a 0 ). Then, an f coefficient (= W 0 / A 0 ) was obtained from the peak area ratio A 0 and the mass ratio W 0 .

藉由將前述峰面積比A乘以前述f係數,而求得前述甲基丙烯酸樹脂組成物所含的共聚物中之丙烯酸酯單元對甲基丙烯酸甲酯單元的質量比W,從該質量比W,算出相對於甲基丙烯酸甲酯單元與丙烯酸酯單元的合計而言甲基丙烯酸甲酯單元的比率(質量%)以及相對於前述合計而言丙烯酸酯單元的比率(質量%)。 The mass ratio W of the acrylate unit to the methyl methacrylate unit in the copolymer contained in the methacrylic resin composition is obtained by multiplying the peak area ratio A by the f coefficient. From this mass ratio, W calculates the ratio (mass%) of the methyl methacrylate unit with respect to the total of the methyl methacrylate unit and the acrylate unit, and the ratio (mass%) of the acrylate unit with respect to the total of the above.

〔製造例2〕 [Manufacture example 2]

除了變更為甲基丙烯酸甲酯98.9質量份、丙烯酸甲酯1.1質量份、鏈轉移劑0.16質量份以外,以與製造例1同樣方式得到顆粒狀的甲基丙烯酸樹脂(ii),測定構造單元的含量。甲基丙烯酸樹脂(ii),來自甲基丙烯酸甲酯的構造單元為97.5質量%,來自丙烯酸甲酯的構造單元為2.5質量%。 Except changing to 98.9 parts by mass of methyl methacrylate, 1.1 parts by mass of methyl acrylate, and 0.16 parts by mass of a chain transfer agent, granular methacrylic resin (ii) was obtained in the same manner as in Production Example 1, and the structural unit was measured. content. In the methacrylic resin (ii), the structural unit derived from methyl methacrylate is 97.5% by mass, and the structural unit derived from methyl acrylate is 2.5% by mass.

將製造例1及2所得之甲基丙烯酸樹脂(i)及(ii)的物性表示於表1。 The physical properties of the methacrylic resins (i) and (ii) obtained in Production Examples 1 and 2 are shown in Table 1.

〔製造例3〕 [Manufacture example 3]

除了為了使上藍劑母料(MB)化,將製造例1所得之甲基丙烯酸樹脂(i)99.99質量份、著色劑0.01質量份進行乾式摻合,使用40mm的單軸擠出機(田邊塑膠機械股份有 限公司製),在設定溫度250至260℃熔融混合,得到經著色的母料顆粒(MB(i))。作為著色劑,使用上藍劑(Sumika Chemtex股份有限公司製之「Sumiplast(註冊商標)Violet B」)。 Except for making the bluing agent masterbatch (MB), 99.99 parts by mass of the methacrylic resin (i) obtained in Production Example 1 and 0.01 parts by mass of the colorant were dry blended, and 40 mm was used. A single-shaft extruder (manufactured by Tanabe Plastic Machinery Co., Ltd.) was melt-mixed at a set temperature of 250 to 260 ° C to obtain colored masterbatch pellets (MB (i)). As the colorant, a bluing agent ("Sumiplast (registered trademark) Violet B" manufactured by Sumika Chemtex Co., Ltd.) was used.

於實施例及比較例中,使用以下所示的市售品作為偏二氟乙烯樹脂。將樹脂之物性表示於表2。偏二氟乙烯樹脂(i):藉由懸浮聚合製造的聚偏二氟乙烯偏二氟乙烯樹脂(ii):藉由乳化聚合製造的聚偏二氟乙烯 In Examples and Comparative Examples, commercially available products shown below were used as the vinylidene fluoride resin. The physical properties of the resin are shown in Table 2. Vinylidene fluoride resin (i): polyvinylidene fluoride made by suspension polymerization. Vinylidene fluoride resin (ii): polyvinylidene fluoride made by emulsion polymerization.

偏二氟乙烯樹脂的重量平均分子量(Mw)係以GPC測定。GPC的檢量線的製作,係使用聚苯乙烯作為標準試藥,從溶析時間與分子量製做出檢量線,測定各樹脂的重量平均分子量。具體而言,使樹脂40mg溶解於N-甲基吡咯啶酮(NMP)溶劑20ml,製作測定試料。測定裝置,係使用將Tosoh股份有限公司製的管柱「TSKgel SuperHM-H」2根及「SuperH2500」1根串聯設置並採用RI檢測器作為檢測器者。 The weight average molecular weight (Mw) of the vinylidene fluoride resin is measured by GPC. The production of the calibration curve of GPC uses polystyrene as a standard reagent, and a calibration curve is prepared from the dissolution time and molecular weight, and the weight average molecular weight of each resin is measured. Specifically, 40 mg of the resin was dissolved in 20 ml of an N-methylpyrrolidone (NMP) solvent to prepare a measurement sample. As the measuring device, two Columns "TSKgel SuperHM-H" and one "SuperH2500" made by Tosoh Co., Ltd. were used in series, and an RI detector was used as the detector.

〔實施例1〕 [Example 1]

以成為甲基丙烯酸樹脂(i)39質量份、偏二氟乙烯樹脂(i)60質量份及MB(i)1質量份之方式從各自的進料機供應至準備槽(1),在該準備槽內混合被進料的樹脂,傳送至準 備槽(2)。從該處投入至進料漏斗(hopper),使用46mm的雙軸造粒機,在真空條件下,以筒溫度230℃、旋轉數270rpm,充分地熔融混練,將熔融樹脂從模頭口吐出,冷卻所得之股線(strand)後,用切割器切斷,得到形成中間層(A)用的樹脂組成物(a)的顆粒。作為形成熱塑性樹脂層(B)及(C)用的熱塑性樹脂(b)及(c),使用表1所示的甲基丙烯酸樹脂(ii)。從該等的樹脂組成物(a)、熱塑性樹脂(b)及(c),使用第3圖所示的製造裝置,製造樹脂積層體。具體而言,將樹脂組成物(a)使用65mm的單軸擠出機16〔東芝機械股份有限公司製〕,將熱塑性樹脂(b)及(c)使用45mm的單軸擠出機15及17〔日立造船股份有限公司製〕,分別熔融。然後,將該等供應至設定溫度230至270℃的3種3層分配型進料區塊18,分配為3層構造後,從多歧管型模頭19〔日立造船股份有限公司製、分配2種3層〕擠出,得到膜狀的熔融樹脂積層體20。再者,於本實施例中,B層與C層為相同組成的層。然後,將所得之膜狀的熔融樹脂積層體20,夾入對向配置的第一冷卻滾輪21(直徑350mm)與第二冷卻滾輪22(直徑450mm)之間,然後捲繞於第二滾輪22的同時,夾入第二滾輪22與第三滾輪23之間後,捲繞於第三冷卻滾輪23(直徑450mm),進一步一邊捲繞於冷卻滾輪24及25一邊成形/冷卻,得到3層構成的樹脂積層體26。所得之樹脂積層體26,以目視觀察時為無色透明。而且,將冷卻滾輪的設定溫度、線速度(拉取速度)以及樹脂積層體26的總膜厚及各層的厚度表示於表3。 39 parts by mass of methacrylic resin (i), 60 parts by mass of vinylidene fluoride resin (i), and 1 part by mass of MB (i) were supplied from respective feeders to the preparation tank (1), where The fed resin is mixed in the preparation tank and transferred to the preparation tank (2). Drop into the feed hopper from here, use 46mm The double-shaft granulator was fully melted and kneaded at a cylinder temperature of 230 ° C. and a rotation number of 270 rpm under vacuum conditions. The molten resin was ejected from the die mouth, and the obtained strand was cooled and cut with a cutter. The resin composition (a) was used to form particles of the intermediate layer (A). As the thermoplastic resins (b) and (c) for forming the thermoplastic resin layers (B) and (C), a methacrylic resin (ii) shown in Table 1 was used. From these resin compositions (a), thermoplastic resins (b), and (c), a resin laminate is manufactured using the manufacturing apparatus shown in FIG. 3. Specifically, the resin composition (a) was 65 mm. Single-shaft extruder 16 [manufactured by Toshiba Machine Co., Ltd.] uses thermoplastic resins (b) and (c) at 45 mm The single-shaft extruders 15 and 17 (made by Hitachi Shipbuilding Co., Ltd.) were melted separately. Then, these are supplied to three types of three-layer distribution-type feed blocks 18 having a set temperature of 230 to 270 ° C, and are distributed into a three-layer structure. From the multi-manifold die 19 Two types and three layers] Extrusion to obtain a film-like molten resin laminate 20. Furthermore, in this embodiment, the B layer and the C layer are layers of the same composition. Then, the obtained film-like molten resin laminated body 20 is sandwiched between the first cooling roller 21 (diameter 350 mm) and the second cooling roller 22 (diameter 450 mm) disposed opposite to each other, and then wound around the second roller 22 At the same time, after being sandwiched between the second roller 22 and the third roller 23, it was wound around the third cooling roller 23 (450 mm in diameter), and further formed and cooled while being wound around the cooling rollers 24 and 25 to obtain a three-layer structure. 'S resin laminate 26. The obtained resin laminate 26 was colorless and transparent when visually observed. Table 3 shows the set temperature of the cooling rollers, the linear velocity (pulling speed), the total film thickness of the resin laminate 26, and the thickness of each layer.

〔實施例2、3、5及比較例1〕 [Examples 2, 3, and 5 and Comparative Example 1]

除了使用表3所示的冷卻滾輪的設定溫度及線速度以外,藉由與實施例1相同的方法,得到具有表3所示的總膜厚及各層的厚度之樹脂積層體。所得之樹脂積層體,以目視觀察時為無色透明。 A resin laminate having the total film thickness and the thickness of each layer shown in Table 3 was obtained by the same method as in Example 1 except that the set temperature and linear velocity of the cooling roller shown in Table 3 were used. The obtained resin laminate was colorless and transparent when visually observed.

〔實施例4〕 [Example 4]

除了使用偏二氟乙烯樹脂(ii)60質量份取代偏二氟乙烯樹脂(i)60質量份,並使用表3所示的冷卻滾輪的設定溫度及線速度以外,藉由與實施例1相同的方法,得到具有表3所示的總膜厚及各層的厚度之樹脂積層體。所得之樹脂積層體,以目視觀察時為無色透明。 Except that 60 parts by mass of vinylidene fluoride resin (ii) was used instead of 60 parts by mass of vinylidene fluoride resin (i), and the set temperature and linear velocity of the cooling roller shown in Table 3 were used, the same procedure as in Example 1 was used. Method to obtain a resin laminate having the total film thickness shown in Table 3 and the thickness of each layer. The obtained resin laminate was colorless and transparent when visually observed.

實施例及比較例的樹脂積層體的製造時,使用非接觸式溫度計,測定第3圖所示的4點的溫度,計算其冷卻溫度。 In the production of the resin laminates of the examples and comparative examples, a non-contact thermometer was used to measure the temperature at four points shown in FIG. 3 and calculate the cooling temperature.

‧測量點1:從模頭19剛吐出的樹脂溫度 ‧Measuring point 1: Temperature of resin just discharged from die 19

‧測量點2:第二冷卻滾輪22下 ‧Measuring point 2: 22 cooling rollers

‧測量點3:第三冷卻滾輪23上 ‧Measuring point 3: On the third cooling roller 23

‧測量點4:第四冷卻滾輪24下 ‧Measuring point 4: 24th cooling roller

將實施例1至5及比較例1的溫度測定結果,表示於 表4。將測量點間的薄片的傳送時間,表示於表5。將從表4所示的溫度及表5所示的傳送時間計算出的各測量點間的平均冷卻速度的結果,表示於表6。而且,藉由非接觸式溫度計等找出薄片(熔融樹脂積層體)變成100℃的點,將薄片(熔融樹脂積層體)由測量點1至變成100℃的點為止所需的時間,表示於表5,將該等之間的平均冷卻速度,表示於表6。 The temperature measurement results of Examples 1 to 5 and Comparative Example 1 are shown in Table 4. Table 5 shows the sheet transfer time between measurement points. Table 6 shows the results of the average cooling rate between the measurement points calculated from the temperatures shown in Table 4 and the transfer time shown in Table 5. Furthermore, the time required for the sheet (molten resin laminate) to become 100 ° C is found by a non-contact thermometer or the like, and the time required to change the sheet (molten resin laminate) from the measurement point 1 to the point of 100 ° C is shown in Table 5 shows the average cooling rate between these values.

於實施例1至5及比較例1的樹脂積層體中,中間層(A)的鹼金屬(Na及K)的含量,在實施例1至3、5及比較例1為0.3ppm,在實施例4為100ppm。 In the resin laminates of Examples 1 to 5 and Comparative Example 1, the content of the alkali metal (Na and K) in the intermediate layer (A) was 0.3 ppm in Examples 1 to 3, 5 and Comparative Example 1, and was implemented in Example 4 is 100 ppm.

以目視評價實施例1至5及比較例1的樹脂積層體的外觀。而且,使用實施例1至5及比較例1的樹脂積層體,進行全光線穿透率(Tt)、霧度(Haze)及彎曲的評價。再者,將實施例1至3及5的樹脂積層體,在60℃、相對濕度90%的環境下暴露120小時,針對耐久測試後的樹脂積層體,也同樣地進行全光線穿透率、霧度的評價。並且,也測定實施例1至5的樹脂積層體的介電常數。將所得的結果表示於表7。 The appearances of the resin laminates of Examples 1 to 5 and Comparative Example 1 were visually evaluated. In addition, the resin laminates of Examples 1 to 5 and Comparative Example 1 were used to evaluate the total light transmittance (Tt), haze (Haze), and bending. Furthermore, the resin laminates of Examples 1 to 3 and 5 were exposed to an environment of 60 ° C. and a relative humidity of 90% for 120 hours. The resin laminates after the endurance test were similarly subjected to full light transmittance, Evaluation of haze. In addition, the dielectric constants of the resin laminates of Examples 1 to 5 were also measured. The obtained results are shown in Table 7.

確認實施例1至5的樹脂積層體具有良好的透明性。特別是實施例1至4的樹脂積層體在成形後,也確認幾乎無彎曲。 It was confirmed that the resin laminates of Examples 1 to 5 had good transparency. In particular, after the resin laminates of Examples 1 to 4 were formed, it was confirmed that there was almost no bending.

Claims (14)

一種樹脂積層體的製造方法,其中,該樹脂積層體係至少具有中間層(A)以及分別存在於該中間層(A)的兩側的熱塑性樹脂層(B)及(C);該中間層(A)係由樹脂組成物(a)形成,該熱塑性樹脂層(B)及(C)係分別由熱塑性樹脂(b)及(c)形成;該製造方法,包括:將至少由熔融的樹脂組成物(a)、熱塑性樹脂(b)及(c)所形成的熔融樹脂積層體從模頭吐出並冷卻的步驟;基於樹脂組成物(a)所含的全部樹脂而言,該樹脂組成物(a)包含10至90質量%的(甲基)丙烯酸樹脂及90至10質量%的偏二氟乙烯樹脂,該(甲基)丙烯酸樹脂的重量平均分子量(Mw)為100,000至300,000;於該步驟中,從吐出溫度至100℃為止的平均冷卻速度為2.5℃/秒以上。     A method for manufacturing a resin laminate, wherein the resin laminate system has at least an intermediate layer (A) and thermoplastic resin layers (B) and (C) respectively present on both sides of the intermediate layer (A); the intermediate layer ( A) is formed of a resin composition (a), and the thermoplastic resin layers (B) and (C) are respectively formed of a thermoplastic resin (b) and (c); the manufacturing method includes: The step of ejecting and cooling the molten resin laminate formed from the object (a), the thermoplastic resin (b), and (c) from the die; based on all the resins contained in the resin composition (a), the resin composition ( a) containing 10 to 90 mass% of (meth) acrylic resin and 90 to 10 mass% of vinylidene fluoride resin, the weight average molecular weight (Mw) of the (meth) acrylic resin is 100,000 to 300,000; in this step The average cooling rate from the discharge temperature to 100 ° C was 2.5 ° C / second or more.     如申請專利範圍第1項所述的製造方法,其係藉由冷卻滾輪冷卻前述熔融樹脂積層體。     The manufacturing method according to item 1 of the scope of patent application, wherein the molten resin laminate is cooled by a cooling roller.     如申請專利範圍第1或2項所述的製造方法,其中,前述吐出溫度為220至300℃。     The manufacturing method according to item 1 or 2 of the patent application range, wherein the discharge temperature is 220 to 300 ° C.     如申請專利範圍第1項至第3項中任一項所述的製造方法,其中,基於樹脂組成物(a)所含的全部樹脂而言,該樹脂組成物(a)包含35至45質量%的(甲基)丙烯酸樹脂及65至55質量%的偏二氟乙烯樹脂。     The manufacturing method according to any one of claims 1 to 3, wherein the resin composition (a) contains 35 to 45 masses based on the entire resin contained in the resin composition (a). % Of (meth) acrylic resin and 65 to 55 mass% of vinylidene fluoride resin.     如申請專利範圍第1項至第4項中任一項所述的製造 方法,其中,樹脂組成物(a)的鹼金屬的含量,基於該樹脂組成物(a)所含的全部樹脂而言為50ppm以下。     The manufacturing method according to any one of claims 1 to 4, wherein the content of the alkali metal in the resin composition (a) is based on all resins contained in the resin composition (a). It is 50 ppm or less.     如申請專利範圍第1項至第5項中任一項所述的製造方法,其中,(甲基)丙烯酸樹脂為(a1)甲基丙烯酸甲酯的均聚物;及/或(a2)基於構成聚合物的全部構造單元而言包含50至99.9質量%的來自甲基丙烯酸甲酯的構造單元及0.1至50質量%的來自式(1)表示的(甲基)丙烯酸酯的至少一個構造單元的共聚物: 式中,R 1表示氫原子或甲基,R 1為氫原子時R 2表示碳數1至8的烷基,R 1為甲基時R 2表示碳數2至8的烷基。 The manufacturing method according to any one of claims 1 to 5, wherein the (meth) acrylic resin is a homopolymer of (a1) methyl methacrylate; and / or (a2) based on All the structural units constituting the polymer include 50 to 99.9% by mass of a structural unit derived from methyl methacrylate and 0.1 to 50% by mass of at least one structural unit derived from a (meth) acrylate represented by formula (1) Copolymer: In the formula, R 1 represents a hydrogen atom or a methyl group, R 1 is a hydrogen atom when R 2 represents an alkyl group having 1 to 8 carbon atoms, and R 1 is methyl R 2 represents alkyl having 2 to 8. 如申請專利範圍第1項至第6項中任一項所述的製造方法,其中,偏二氟乙烯樹脂為聚偏二氟乙烯。     The manufacturing method according to any one of claims 1 to 6, wherein the vinylidene fluoride resin is polyvinylidene fluoride.     如申請專利範圍第1項至第7項中任一項所述的製造方法,其中,偏二氟乙烯樹脂的熔體質量流動速率,在3.8kg負重、230℃下測定為0.1至40g/10分鐘。     The manufacturing method according to any one of claims 1 to 7, wherein the melt mass flow rate of the vinylidene fluoride resin is measured at 0.1 to 40 g / 10 under a 3.8 kg load at 230 ° C. minute.     如申請專利範圍第1項至第8項中任一項所述的製造方法,其中,樹脂積層體的膜厚的平均值為100至2000μm,熱塑性樹脂層(B)及(C)的膜厚的平均值分別為10至200μm。     The manufacturing method according to any one of claims 1 to 8 in the scope of patent application, wherein the average film thickness of the resin laminate is 100 to 2000 μm, and the film thicknesses of the thermoplastic resin layers (B) and (C) The average values are 10 to 200 μm, respectively.     如申請專利範圍第1項至第9項中任一項所述的製造方法,其中,熱塑性樹脂(b)及(c)各自所含的樹脂的菲卡軟化溫度為100至160℃。     The manufacturing method according to any one of claims 1 to 9 in the scope of the patent application, wherein each of the thermoplastic resins (b) and (c) contains a Ficca softening temperature of 100 to 160 ° C.     如申請專利範圍第1項至第10項中任一項所述的製造方法,其中,熱塑性樹脂(b)及(c)分別包含(甲基)丙烯酸樹脂或聚碳酸酯樹脂。     The manufacturing method according to any one of claims 1 to 10, wherein the thermoplastic resins (b) and (c) each contain a (meth) acrylic resin or a polycarbonate resin.     如申請專利範圍第1項至第11項中任一項所述的製造方法,其中,熱塑性樹脂(b)及(c)分別包含聚碳酸酯樹脂、以及基於各熱塑性樹脂(b)及(c)所含的全部樹脂而言為0.005至2.0質量%的紫外線吸收劑。     The manufacturing method according to any one of claims 1 to 11, wherein the thermoplastic resins (b) and (c) include a polycarbonate resin, and the thermoplastic resins (b) and (c) are based on the thermoplastic resins (b) and (c), respectively. The total amount of the resin contained in the) is 0.005 to 2.0% by mass of the ultraviolet absorber.     如申請專利範圍第1項至第11項中任一項所述的製造方法,其中,基於各熱塑性樹脂(b)及(c)所含的全部樹脂而言,熱塑性樹脂(b)及(c)分別包含50質量%以上的(甲基)丙烯酸樹脂。     The manufacturing method according to any one of claims 1 to 11 in the scope of patent application, wherein the thermoplastic resins (b) and (c) are based on all the resins contained in each of the thermoplastic resins (b) and (c). ) Each contains (meth) acrylic resin in an amount of 50% by mass or more.     如申請專利範圍第13項所述的製造方法,其中,熱塑性樹脂(b)及(c)各自所含的(甲基)丙烯酸樹脂的重量平均分子量為50,000至300,000。     The manufacturing method as described in claim 13 in which the weight average molecular weight of the (meth) acrylic resin contained in each of the thermoplastic resins (b) and (c) is 50,000 to 300,000.    
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