TW201801896A - Exposure molding device and exposure molding method thereof - Google Patents

Exposure molding device and exposure molding method thereof Download PDF

Info

Publication number
TW201801896A
TW201801896A TW105122306A TW105122306A TW201801896A TW 201801896 A TW201801896 A TW 201801896A TW 105122306 A TW105122306 A TW 105122306A TW 105122306 A TW105122306 A TW 105122306A TW 201801896 A TW201801896 A TW 201801896A
Authority
TW
Taiwan
Prior art keywords
optical
exposure
light
component
transmission mechanism
Prior art date
Application number
TW105122306A
Other languages
Chinese (zh)
Other versions
TWI621520B (en
Inventor
陳鼎鈞
張昱仁
周根德
Original Assignee
東友科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東友科技股份有限公司 filed Critical 東友科技股份有限公司
Priority to TW105122306A priority Critical patent/TWI621520B/en
Priority to US15/263,295 priority patent/US10189238B2/en
Publication of TW201801896A publication Critical patent/TW201801896A/en
Application granted granted Critical
Publication of TWI621520B publication Critical patent/TWI621520B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/386Data acquisition or data processing for additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0833Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using actinic light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y99/00Subject matter not provided for in other groups of this subclass

Abstract

An exposure molding device comprises an exposure tank, a working platform, and an optical system. The exposure tank has a first surface and a second surface, for containing photosensitive liquid, the working platform is disposed relative to the first surface, and the optical system is disposed relative to the second surface. The optical system comprises a light emitting element and an optical assembly, and the light emitting element emits light along the optical path. The optical assembly comprises a light transmitting element, a first optical element and a first transmission mechanism. The light transmitting element is disposed on the optical path, the first optical element is disposed behind the light transmitting element on the optical path, the first transmission mechanism is disposed along a first direction, and the first transmission mechanism is connected with the first optical element for driving the first optical element to move along the first direction. Therefore, the molding range is expanded, and the advantages of increasing the molding accuracy and velocity are achieved.

Description

曝光成型裝置及其曝光成型方法Exposure molding device and exposure forming method thereof

本發明係關於一種曝光成型裝置,尤指一種使成型範圍擴大之曝光成型裝置及其曝光成型方法。The present invention relates to an exposure molding apparatus, and more particularly to an exposure molding apparatus which expands a molding range and an exposure molding method thereof.

近年來,隨著3D列印(3D printing),又稱積層製造(Additive Manufacturing,AM)的普及化,其中數位光處理式(Digital Light Processing,DLP)係廣泛應用於眾多市機台之中,此種類型之積層製造主要原理為利用投影技術,將物件之分層圖像依序投影在光固化樹脂上,如此層層堆疊成型。In recent years, with 3D printing, also known as the popularization of additive manufacturing (AM), digital light processing (DLP) is widely used in many market machines. The main principle of this type of laminated manufacturing is to use a projection technique to sequentially project a layered image of an object onto a photocurable resin, such that the layers are stacked and formed.

由於此技術之成品解析度與成型速度與投影光源有很大的關係,故市售機台投影範圍會縮小至一定範圍,以確保解析度與單位面積下的光功率,使物件可順利成型。因此,雖然DLP的成型精準度、解析度與速度皆優於其他積層製造技術,但成型範圍無法擴大,使DLP技術無法應用於大型物件。Since the resolution and molding speed of this technology have a great relationship with the projection light source, the projection range of the commercially available machine will be reduced to a certain range to ensure the resolution and the optical power per unit area, so that the object can be smoothly formed. Therefore, although DLP's molding accuracy, resolution and speed are superior to other laminated manufacturing technologies, the molding range cannot be expanded, making DLP technology impossible to apply to large objects.

現有技術中,係將大面積投影圖像分割成幾個子圖像,並藉由移動投影光源,經影像拼湊得到較大的投影面積,以擴大DLP技術的成型範圍。然而,由於投影光源之體積大且重,移動投影光源之速度及精準度較低,進而影響成型速度及精準度。並且,投影光源容易因移動慣性及振動而使影像拼湊產生誤差,造成成型之品質降低。In the prior art, a large-area projection image is segmented into several sub-images, and by moving the projection light source, a large projection area is obtained by image patching to expand the molding range of the DLP technology. However, due to the large and heavy volume of the projection light source, the speed and accuracy of moving the projection light source are low, thereby affecting the molding speed and accuracy. Further, the projection light source is liable to cause an error in the image patching due to the movement of inertia and vibration, resulting in a decrease in the quality of the molding.

是以,如何發展一種有別於往的曝光成型裝置及其曝光成型方法,以改善習知技術中的問題與缺點,擴大成型範圍,同時提高成型之精準度與速度,並提升成型品質,實為目前技術領域中的重點課題。Therefore, how to develop a different exposure molding device and its exposure molding method to improve the problems and shortcomings in the prior art, expand the molding range, improve the precision and speed of molding, and improve the molding quality. It is a key topic in the current technical field.

本案之主要目的為提供一種曝光成型裝置及其曝光成型方法,俾解決並改善前述先前技術之問題與缺點。The main object of the present invention is to provide an exposure forming apparatus and an exposure forming method thereof, which solve and ameliorate the problems and disadvantages of the aforementioned prior art.

本案之另一目的為提供一種曝光成型裝置及其曝光成型方法,藉由設置可移動的光學元件,以擴大成型範圍,同時確保成型之精準度、解析度與速度。Another object of the present invention is to provide an exposure forming apparatus and an exposure forming method thereof, which are provided with movable optical elements to expand the molding range while ensuring the precision, resolution and speed of molding.

本案之另一目的為提供一種曝光成型裝置及其曝光成型方法,經由設置光學補償元件,以補足光學元件因移動所產生之光程差,使投影區域不會產生扭曲或變形,以確保成型品質。Another object of the present invention is to provide an exposure forming apparatus and an exposure forming method thereof, by providing an optical compensation component to complement the optical path difference caused by the movement of the optical element, so that the projection area is not twisted or deformed to ensure the molding quality. .

本案之另一目的為提供一種曝光成型裝置及其曝光成型方法,透過移動輕盈之光學元件,並配合曝光時間計算其移動速度以及移動路徑,以提高成型之精準度與速度,達到提升成型品質之功效。Another object of the present invention is to provide an exposure forming apparatus and an exposure forming method thereof, which can improve the molding quality by moving the light optical component and calculating the moving speed and the moving path with the exposure time to improve the precision and speed of molding. efficacy.

為達上述目的,本案之一較佳實施例為提供一種曝光成型裝置,包括:一曝光槽,具有一第一表面及一第二表面,用以容納一光敏液;一工作平台,係相對該第一表面設置;以及一光學系統,係相對該第二表面設置,包括:一發光元件,提供一光線,該光線係沿一光路徑行進;以及一光學組件,包括:一透光元件,係設置於該光路徑上;一第一光學元件,係於該光路徑上設置於該透光元件之後;以及一第一傳動機構,係沿一第一方向設置,且與該第一光學元件相連接,以帶動該第一光學元件沿該第一方向移動;其中,該光線係於穿透該透光元件後,受該第一光學元件反射至該曝光槽,俾使該光敏液曝光成型於該工作平台。由該第一光學元件入射至該曝光槽,俾使該光敏液曝光成型於該工作平台。In order to achieve the above object, a preferred embodiment of the present invention provides an exposure forming apparatus comprising: an exposure groove having a first surface and a second surface for accommodating a photosensitive liquid; and a working platform opposite to the a first surface disposed; and an optical system disposed relative to the second surface, comprising: a light emitting element that provides a light that travels along a light path; and an optical component that includes: a light transmissive element Provided on the light path; a first optical component disposed on the light path after the light transmissive element; and a first transmission mechanism disposed along a first direction and coupled to the first optical component Connecting to move the first optical element in the first direction; wherein the light is transmitted through the light transmissive element, reflected by the first optical element to the exposure groove, and the photosensitive liquid is exposed to the exposure The work platform. The first optical element is incident on the exposure groove, and the photosensitive liquid is exposed to the working platform.

為達上述目的,本案之另一較佳實施例為提供一種曝光成型方法,包括:(a) 提供一曝光槽、一工作平台、一發光元件及一光學組件,其中該曝光槽係容納一光敏液,且該光學組件係包括一透光元件、一第一光學元件及一第一傳動機構;(b) 該發光元件發射一光線;(c) 使該光線穿透該透光元件,並受該第一光學元件反射至該曝光槽之一欲曝光區域;(d) 經過一曝光時間,使位於該欲曝光區域之該光敏液曝光成型於該工作平台;(e) 判斷是否繼續進行曝光成型動作;(f) 該第一傳動機構沿一第一方向移動該第一光學元件;以及(g) 完成該曝光成型動作;其中,當該步驟(e)之判斷結果為是,執行該步驟(f),並重新執行該步驟(b)至該步驟(e),且當該步驟(e)之判斷結果為否,執行該步驟(g)。In order to achieve the above object, another preferred embodiment of the present invention provides an exposure molding method comprising: (a) providing an exposure groove, a working platform, a light-emitting element, and an optical component, wherein the exposure groove accommodates a photosensitive And the optical component comprises a light transmitting component, a first optical component and a first transmission mechanism; (b) the light emitting component emits a light; (c) the light is transmitted through the light transmitting component, and The first optical component is reflected to one of the exposure grooves to be exposed; (d) exposing the photosensitive liquid located in the exposed area to the working platform after an exposure time; (e) determining whether to continue the exposure molding (f) the first transmission mechanism moves the first optical element in a first direction; and (g) completes the exposure forming operation; wherein, when the determination result of the step (e) is YES, the step is performed ( f), and repeating the step (b) to the step (e), and when the judgment result of the step (e) is NO, the step (g) is performed.

體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖式在本質上係當作說明之用,而非架構於限制本案。Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not intended to limit the scope of the invention.

請參閱第1圖、第2圖及第3圖,其中第1圖係顯示本案較佳實施例之曝光成型裝置之架構示意圖,第2圖係顯示本案另一實施例之曝光成型裝置之架構示意圖,以及第3圖係顯示第2圖所示之曝光成型裝置之光學系統之結構示意圖。如第1圖、第2圖及第3圖所示,本案之曝光成型裝置1係包括曝光槽2、工作平台3以及光學系統4,其中曝光槽2具有第一表面21及第二表面22,且係用以容納光敏液5,而工作平台3係相對第一表面21設置,光學系統4係相對第二表面22設置。Please refer to FIG. 1 , FIG. 2 and FIG. 3 , wherein FIG. 1 is a schematic structural view of an exposure molding apparatus according to a preferred embodiment of the present invention, and FIG. 2 is a schematic structural view showing an exposure molding apparatus according to another embodiment of the present disclosure. And Fig. 3 is a schematic view showing the structure of the optical system of the exposure molding apparatus shown in Fig. 2. As shown in FIG. 1 , FIG. 2 and FIG. 3 , the exposure forming apparatus 1 of the present invention includes an exposure groove 2 , a work platform 3 , and an optical system 4 , wherein the exposure groove 2 has a first surface 21 and a second surface 22 . And is used to accommodate the photosensitive liquid 5, and the working platform 3 is disposed opposite to the first surface 21, and the optical system 4 is disposed opposite to the second surface 22.

光學系統4係包括發光元件40及光學組件41,其中發光元件40提供光線400,光線400係沿光路徑P行進,其中發光元件40係為例如但不限於DLP、LED或LCD等陣列光源。光學組件41係包括透光元件410、第一光學元件411以及第一傳動機構4110。透光元件410係設置於光路徑P上,第一光學元件411係於光路徑P上設置於透光元件410之後,第一傳動機構4110係沿第一方向d1設置,且第一傳動機構4110係與第一光學元件411相連接,以帶動第一光學元件411沿第一方向d1移動。其中,光線400係於穿透透光元件410後,受第一光學元件411反射至曝光槽2,俾使光敏液5曝光成型於工作平台3。換言之,本案之光學系統4架構於移動投影區域A,使位於欲曝光區域B之光敏液5曝光成型於工作平台3(於第1圖中,投影區域A係與欲曝光區域B相同)。The optical system 4 includes a light-emitting element 40 that provides light ray 400, and an optical component 41 that travels along a light path P, wherein the light-emitting element 40 is an array light source such as, but not limited to, a DLP, LED, or LCD. The optical component 41 includes a light transmissive element 410, a first optical element 411, and a first transmission mechanism 4110. The light transmitting element 410 is disposed on the light path P, the first optical element 411 is disposed on the light path P after the light transmitting element 410, the first transmission mechanism 4110 is disposed along the first direction d1, and the first transmission mechanism 4110 The first optical element 411 is coupled to move the first optical element 411 in the first direction d1. The light 400 is transmitted through the light transmitting element 410, and is reflected by the first optical element 411 to the exposure groove 2, so that the photosensitive liquid 5 is exposed and formed on the working platform 3. In other words, the optical system 4 of the present invention is constructed in the moving projection area A, and the photosensitive liquid 5 located in the area B to be exposed is exposed and formed on the work platform 3 (in the first figure, the projection area A is the same as the area B to be exposed).

於一些實施例中,光學組件41更包括第二光學元件412以及第二傳動機構4120。其中第二光學元件412係於光路徑P上設置於透光元件410與第一光學元件411之間,而第二傳動機構4120係沿第二方向d2設置,且與第二光學元件412相連接,以帶動第二光學元件412沿第二方向d2移動。藉此,第一傳動機構4110及第二傳動機構4120可透過移動第一光學元件411及第二光學元件412,以改變光線400之光路徑P。In some embodiments, the optical assembly 41 further includes a second optical component 412 and a second transmission mechanism 4120. The second optical component 412 is disposed between the light transmissive element 410 and the first optical component 411 on the optical path P, and the second transmission mechanism 4120 is disposed along the second direction d2 and is connected to the second optical component 412. To move the second optical element 412 in the second direction d2. Thereby, the first transmission mechanism 4110 and the second transmission mechanism 4120 can transmit the first optical element 411 and the second optical element 412 to change the optical path P of the light 400.

根據本案之構思,曝光成型裝置1更包括第三傳動機構30以及注料裝置6。第三傳動機構30係與工作平台3相連接,以帶動工作平台3沿第三方向d3移動。注料裝置6係設置於曝光槽2,用以提供光敏液5。其中,第一方向d1、第二方向d2及第三方向d3係相互垂直,但不以此為限。According to the concept of the present invention, the exposure forming apparatus 1 further includes a third transmission mechanism 30 and a filling device 6. The third transmission mechanism 30 is coupled to the work platform 3 to drive the work platform 3 to move in the third direction d3. The filling device 6 is disposed in the exposure tank 2 for providing the photosensitive liquid 5. The first direction d1, the second direction d2, and the third direction d3 are perpendicular to each other, but are not limited thereto.

於一些實施例中,光學組件41更包括第一光學補償元件413及第二光學補償元件414,第一光學補償元件413及第二光學補償元件414係於光路徑P上設置於透光元件410與第二光學元件412之間,且第一光學補償元件413係與該第一光學元件411平行設置,第二光學補償元件414係與第二光學元件平行411設置。In some embodiments, the optical component 41 further includes a first optical compensation component 413 and a second optical compensation component 414. The first optical compensation component 413 and the second optical compensation component 414 are disposed on the light path P and disposed on the light transmissive component 410. Between the second optical element 412 and the first optical compensation element 413 is disposed in parallel with the first optical element 411, and the second optical compensation element 414 is disposed in parallel with the second optical element 411.

易言之,光線400係沿光路徑P行進,穿透透光元件410,且受第一光學補償元件413及第二光學補償元件414反射至第二光學元件412,再受第二光學元件412反射至第一光學元件411,接著受第一光學元件411反射至曝光槽2,且形成投影區域A,俾使光敏液5曝光成型於工作平台3。In other words, the light 400 travels along the light path P, penetrates the light transmissive element 410, and is reflected by the first optical compensation component 413 and the second optical compensation component 414 to the second optical component 412, and then by the second optical component 412. It is reflected to the first optical element 411, then reflected by the first optical element 411 to the exposure groove 2, and forms a projection area A for exposing the photosensitive liquid 5 to the work platform 3.

於一些實施例中,第一傳動機構4110、第二傳動機構4120以及第三傳動機構30係為例如但不限於使用螺桿、皮帶或鋼繩等方式以實現移動之動作。於另一些實施例中,透光元件410為例如但不限於聚焦透鏡,可使光線400聚集為平行光,且透光元件410之曲率及相對發光元件40之距離,係與投影區域A及解析度有關。並且,第一光學元件411、第二光學元件412、第一光學補償元件413及第二光學補償元件414係為反射鏡,但並不以此為限。In some embodiments, the first transmission mechanism 4110, the second transmission mechanism 4120, and the third transmission mechanism 30 are, for example, but not limited to, using a screw, a belt, or a steel cord to achieve a moving motion. In other embodiments, the light transmissive element 410 is, for example, but not limited to, a focusing lens that allows the light rays 400 to be concentrated into parallel light, and the curvature of the light transmissive element 410 and the distance from the light emitting element 40 are related to the projection area A and the resolution. Degree related. Moreover, the first optical element 411, the second optical element 412, the first optical compensation element 413, and the second optical compensation element 414 are mirrors, but are not limited thereto.

換言之,本案之曝光成型裝置藉由設置可移動的光學元件,以擴大成型範圍,同時確保成型之精準度、解析度與速度。並且,經由設置光學補償元件,以補足光學元件因移動所產生之光程差,使投影區域不會產生扭曲或變形,以確保成型品質。In other words, the exposure molding apparatus of the present invention expands the molding range by providing movable optical elements while ensuring the precision, resolution and speed of molding. Moreover, by providing an optical compensation element to compensate for the optical path difference caused by the movement of the optical element, the projection area is not distorted or deformed to ensure the molding quality.

請參閱第4圖並配合第1圖,其中第4圖係顯示本案較佳實施例之曝光成型裝置之曝光成型方法流程圖。如第1圖及第4圖所示,本案較佳實施例之曝光成型裝置1之曝光成型方法包括以下步驟:首先,如步驟S10所示,提供曝光槽2、工作平台3、發光元件40及光學組件41,其中曝光槽2係容納光敏液5,且光學組件41係包括透光元件410、第一光學元件411及第一傳動機構4110。Please refer to FIG. 4 and FIG. 1 , wherein FIG. 4 is a flow chart showing the exposure molding method of the exposure molding apparatus of the preferred embodiment of the present invention. As shown in FIG. 1 and FIG. 4, the exposure molding method of the exposure molding apparatus 1 of the preferred embodiment of the present invention includes the following steps: First, as shown in step S10, the exposure groove 2, the work platform 3, the light-emitting element 40, and The optical component 41, wherein the exposure groove 2 accommodates the photosensitive liquid 5, and the optical component 41 includes a light transmitting element 410, a first optical element 411, and a first transmission mechanism 4110.

其次,如步驟S20所示,發光元件40發射光線400,其中發光元件40係為例如但不限於DLP、LED或LCD等陣列光源。接著,如步驟S30所示,光線400穿透透光元件410,並受第一光學元件411反射至曝光槽2之欲曝光區域B。然後,如步驟S40所示,經過一曝光時間Te,使位於欲曝光區域B之光敏液5曝光成型於工作平台3。Next, as shown in step S20, the light-emitting element 40 emits light 400, wherein the light-emitting element 40 is an array light source such as, but not limited to, a DLP, an LED, or an LCD. Next, as shown in step S30, the light ray 400 penetrates the light transmitting element 410 and is reflected by the first optical element 411 to the area B to be exposed of the exposure groove 2. Then, as shown in step S40, the photosensitive liquid 5 located in the area B to be exposed is exposed to the work platform 3 after an exposure time Te.

接著,如步驟S50所示,判斷是否繼續進行曝光成型動作。當步驟S50之判斷結果為是,係執行步驟S60,並重新執行步驟S20至步驟S50。如步驟S60所示,第一傳動機構4110係沿第一方向d1移動第一光學元件411。當步驟S50之判斷結果為否,係執行步驟S70,完成曝光成型動作。Next, as shown in step S50, it is determined whether or not the exposure forming operation is continued. When the determined result at step S50 is YES, step S60 is performed, and steps S20 through S50 are re-executed. As shown in step S60, the first transmission mechanism 4110 moves the first optical element 411 in the first direction d1. When the result of the determination in the step S50 is NO, the step S70 is executed to complete the exposure forming operation.

請參閱第5圖及第6圖,並配合第2圖、第3圖及第4圖,其中第5圖係顯示第4圖所示之曝光成型方法之步驟S30之細部流程圖,以及第6圖係顯示第4圖所示之曝光成型方法之步驟S60之細部流程圖。如第2圖、第3圖、第4圖、第5圖及第6圖所示,本案較佳實施例之曝光成型方法之光學組件41更包括第二光學元件412、第一光學補償元件413及第二光學補償元件414,且步驟S30係可進一步包括子步驟如下:首先,如步驟S31所示,使光線400穿透透光元件410。其次,如步驟S32所示,光線400受第一光學補償元件413及第二光學補償元件414反射至第二光學元件412,再受第二光學元件412反射至第一光學元件411。接著,如步驟S33所示,光線400受第一光學元件411反射至曝光槽2之欲曝光區域B。Please refer to FIG. 5 and FIG. 6 and cooperate with FIG. 2, FIG. 3 and FIG. 4, wherein FIG. 5 is a detailed flowchart showing the step S30 of the exposure forming method shown in FIG. 4, and the sixth drawing. The figure shows a detailed flow chart of step S60 of the exposure forming method shown in Fig. 4. As shown in FIG. 2, FIG. 3, FIG. 4, FIG. 5 and FIG. 6, the optical component 41 of the exposure molding method of the preferred embodiment of the present invention further includes a second optical component 412 and a first optical compensation component 413. And the second optical compensation component 414, and the step S30 can further include the sub-step as follows: First, as shown in step S31, the light 400 is transmitted through the light-transmitting element 410. Next, as shown in step S32, the light ray 400 is reflected by the first optical compensation component 413 and the second optical compensation component 414 to the second optical component 412, and then reflected by the second optical component 412 to the first optical component 411. Next, as shown in step S33, the light ray 400 is reflected by the first optical element 411 to the area B to be exposed of the exposure bath 2.

本案較佳實施例之曝光成型方法中光學組件41更包括控制元件(未圖示)及第二傳動機構4120,且步驟S60係可進一步包括子步驟如下:首先,如步驟S61所示,控制元件根據欲曝光區域B計算移動路徑及移動速度。接著,如步驟S62所示,控制元件控制第一傳動機構4110根據移動路徑及移動速度沿第一方向d1移動第一光學元件411,且控制第二傳動機構4120根據移動路徑及移動速度沿第二方向d2移動第二光學元件412,其中第一方向d1係與第二方向d2相垂直。In the exposure molding method of the preferred embodiment of the present invention, the optical component 41 further includes a control component (not shown) and a second transmission mechanism 4120, and the step S60 may further include the following sub-steps as follows: First, as shown in step S61, the control component The moving path and the moving speed are calculated according to the area B to be exposed. Next, as shown in step S62, the control element controls the first transmission mechanism 4110 to move the first optical element 411 in the first direction d1 according to the moving path and the moving speed, and controls the second transmission mechanism 4120 to follow the moving path and the moving speed along the second The direction d2 moves the second optical element 412, wherein the first direction d1 is perpendicular to the second direction d2.

請參閱第7A圖、第7B圖、第7C圖及第7D圖,其中第7A圖係顯示應用本案曝光成型方法之一實施例示意圖,第7B圖係顯示應用本案曝光成型方法之另一實施例示意圖,第7C圖係顯示應用本案曝光成型方法之又一實施例示意圖,以及第7D圖係顯示應用本案曝光成型方法之再一實施例示意圖。如第7A圖、第7B圖、第7C圖及第7D圖所示,光線400係沿光路徑P行進,且受第二光學元件412反射至第一光學元件411,接著受第一光學元件411反射形成投影區域A,其中投影區域A係具有投影長度L及投影寬度W,成型區域C為W*L。於一些實施例中,藉由第一傳動機構4110帶動第一光學元件411沿第一方向d1移動第一長度L’,可使成型區域C擴大為W*L’。於另一些實施例中,藉由第二傳動機構4120帶動第二光學元件412沿第二方向d2移動第二長度W’,可使成型區域C擴大為W’*L。又於另一些實施例中,藉由第一傳動機構4110帶動第一光學元件411沿第一方向d1移動第一長度L’,以及第二傳動機構4120帶動第二光學元件412沿第二方向d2移動第二長度W’,可使成型區域C擴大為W’*L’。Please refer to FIG. 7A, FIG. 7B, FIG. 7C and FIG. 7D, wherein FIG. 7A is a schematic view showing an embodiment of an exposure forming method of the present application, and FIG. 7B is another embodiment showing an exposure forming method of the present application. Fig. 7C is a schematic view showing still another embodiment of the exposure forming method of the present invention, and Fig. 7D is a view showing still another embodiment of the exposure forming method of the present application. As shown in FIGS. 7A, 7B, 7C, and 7D, the light ray 400 travels along the optical path P and is reflected by the second optical element 412 to the first optical element 411, followed by the first optical element 411. The reflection forms a projection area A in which the projection area A has a projection length L and a projection width W, and the molding area C is W*L. In some embodiments, the first optical element 411 is moved by the first transmission mechanism 4110 to move the first length L' in the first direction d1, so that the molding area C can be enlarged to W*L'. In other embodiments, the second optical member 412 is moved by the second transmission mechanism 4120 to move the second length W' in the second direction d2 to enlarge the molding region C to W'*L. In still other embodiments, the first optical component 411 is moved by the first transmission mechanism 4110 to move the first length L' along the first direction d1, and the second transmission mechanism 4120 drives the second optical component 412 along the second direction d2. Moving the second length W', the molding area C can be enlarged to W'*L'.

請參閱第8A圖及第8B圖,其中第8A圖係顯示本案較佳實施例之曝光成型裝置以本案曝光成型方法進行曝光成型之一示意圖,以及第8B圖係顯示本案較佳實施例之曝光成型裝置以本案曝光成型方法進行曝光成型之另一示意圖。如第8A圖及第8B圖所示,當欲曝光區域B小於投影區域A時,即投影區域A可完全涵蓋欲曝光區域B時,第一傳動機構4110或第二傳動機構4120會靜止不動,將此欲曝光區域B先行曝光固化。固化成型後,第一傳動機構4110或第二傳動機構4120會將第一光學元件411或第二光學元件412快速移至下個欲曝光區域B,曝光固化此區域,直到所有欲曝光區域B皆固化成型後,便會進行換層作業,進行下一層之曝光成型。Please refer to FIG. 8A and FIG. 8B , wherein FIG. 8A is a schematic view showing the exposure forming apparatus of the preferred embodiment of the present invention in the exposure forming method of the present invention, and FIG. 8B is a view showing the exposure of the preferred embodiment of the present invention. Another schematic diagram of the molding apparatus performing exposure forming by the exposure molding method of the present invention. As shown in FIGS. 8A and 8B, when the area to be exposed B is smaller than the projection area A, that is, when the projection area A can completely cover the area B to be exposed, the first transmission mechanism 4110 or the second transmission mechanism 4120 may be stationary. The area to be exposed B is exposed and cured first. After curing, the first transmission mechanism 4110 or the second transmission mechanism 4120 will quickly move the first optical element 411 or the second optical element 412 to the next area to be exposed B, and expose the area until all areas to be exposed B are exposed. After the solidification is formed, the layer changing operation is performed, and the next layer of exposure molding is performed.

由於第一傳動機構4110或第二傳動機構4120移動時,光程長度D改變,較遠的光程,曝光光功率We會受介質影響而變小,使得曝光時間Te須配合延長。故不同欲曝光區域B,所需的曝光時間Te不同,假設曝光時間Te與曝光光功率We有一關係式F(D),此關係式與投影頻率、光源波長及介質傳導有關,其中D為光程長度,則:Te=F(D)*We且Te∝1/We。根據此關係式,控制元件會計算不同欲曝光區域B之下,曝光所需停留的曝光時間Te。When the first transmission mechanism 4110 or the second transmission mechanism 4120 moves, the optical path length D changes, and the optical path length We will be affected by the medium to become smaller, so that the exposure time Te must be extended. Therefore, different exposure time B is required, and the required exposure time Te is different. It is assumed that the exposure time Te has a relationship F(D) with the exposure light power We, which is related to the projection frequency, the wavelength of the light source, and the medium conduction, where D is light. The length of the process is: Te=F(D)*We and Te∝1/We. According to this relationship, the control element calculates the exposure time Te required to be exposed under the different exposure area B.

請參閱第9圖,其中第9圖係顯示本案另一較佳實施例之曝光成型裝置以本案曝光成型方法進行曝光成型之示意圖。如第9圖所示,若欲曝光區域B大於投影區域A,即投影區域A不可完全涵蓋欲曝光區域B,此時,第一傳動機構4110或第二傳動機構4120會配合曝光時間Te與曝光光功率We之關係式:Te=F(D)*We且Te∝1/We,以計算移動路徑、移動速度V及各像素必須投影時間Tep,進行連續曝光,其中移動路徑由每層切片截面決定。並且,定位精度PL 需與解析度大小R相同或為整數倍或整數分之一,即PL =R或PL =N*R或PL =R/N,其中N為整數。Please refer to FIG. 9 , wherein FIG. 9 is a schematic view showing the exposure molding apparatus of the preferred embodiment of the present invention in the exposure molding method of the present invention. As shown in FIG. 9, if the area to be exposed B is larger than the projection area A, that is, the projection area A cannot completely cover the area B to be exposed, at this time, the first transmission mechanism 4110 or the second transmission mechanism 4120 matches the exposure time Te and exposure. The relationship between the optical power We: Te=F(D)*We and Te∝1/We, for the calculation of the moving path, the moving speed V, and the projection time Tep of each pixel, for continuous exposure, wherein the moving path is sliced by each layer Decide. Moreover, the positioning accuracy P L needs to be the same as the resolution size R or an integer multiple or an integer, that is, P L =R or P L =N*R or P L =R/N, where N is an integer.

而移動速度V與發光元件40之更新頻率f及各像素曝光時間Tep有關,且移動速度V需為投影週期的整數倍,即V=P*f /N,其中N為整數。另外,投影區域A移動時,必須滿足各像素曝光時間Tep。舉例而言,像素p1為欲曝光區域B上之一點區域,投影寬度W以移動速度V進行連續移動曝光,此時:V≦W/Tep。而又因投影區域A為多像素同時曝光,各像素曝光時間Tep不同,故需滿足最長時間Tepl,即V≦W/Tepl且V=P*f/N,其中N為整數。換言之,曝光時間Te係與光線400之光程長度D成反比,且移動速度V係與曝光時間Te成反比。如上述關係,控制元件會根據欲曝光區域B計算出最佳移動路徑及最佳速度,將欲曝光區域B曝光一定時間,使光敏液5順利固化,直到所有欲曝光面積B曝光成型後,便會進行換層作業,進行下一層之曝光成型。The moving speed V is related to the update frequency f of the light-emitting element 40 and the exposure time Tep of each pixel, and the moving speed V needs to be an integral multiple of the projection period, that is, V=P*f /N, where N is an integer. In addition, when the projection area A moves, it is necessary to satisfy the exposure time Tep of each pixel. For example, the pixel p1 is a dot area on the area B to be exposed, and the projection width W is continuously moved and exposed at the moving speed V, at this time: V≦W/Tep. Moreover, since the projection area A is multi-pixel simultaneous exposure, the exposure time Tep of each pixel is different, so it is necessary to satisfy the longest time Tepl, that is, V≦W/Tepl and V=P*f/N, where N is an integer. In other words, the exposure time Te is inversely proportional to the optical path length D of the light ray 400, and the moving speed V is inversely proportional to the exposure time Te. According to the above relationship, the control component calculates the optimal moving path and the optimal speed according to the area B to be exposed, and exposes the area B to be exposed for a certain period of time, so that the photosensitive liquid 5 is smoothly cured until all the exposed areas B are exposed and formed. The layering operation will be carried out to perform the exposure molding of the next layer.

易言之,本案之曝光成型裝置及其曝光成型方法係透過移動輕盈之光學元件,並配合曝光時間計算其移動速度以及移動路徑,以提高成型之精準度與速度,達到提升成型品質之功效。In other words, the exposure forming apparatus and the exposure forming method thereof of the present invention improve the molding speed and the speed by moving the light optical component and adjusting the moving speed and the moving path with the exposure time, thereby improving the molding quality.

綜上所述,本案提供一種曝光成型裝置及其曝光成型方法,藉由設置可移動的光學元件,以擴大成型範圍,同時確保成型之精準度、解析度與速度。並且,經由設置光學補償元件,以補足光學元件因移動所產生之光程差,使投影區域不會產生扭曲或變形,以確保成型品質。同時,透過移動輕盈之光學元件,並配合曝光時間計算其移動速度以及移動路徑,以提高成型之精準度與速度,達到提升成型品質之功效。In summary, the present invention provides an exposure forming apparatus and an exposure forming method thereof, which are provided with movable optical components to expand the molding range while ensuring the precision, resolution and speed of molding. Moreover, by providing an optical compensation element to compensate for the optical path difference caused by the movement of the optical element, the projection area is not distorted or deformed to ensure the molding quality. At the same time, by moving the light optical components and calculating the moving speed and moving path with the exposure time, the precision and speed of the molding can be improved, and the molding quality can be improved.

縱使本案已由上述之實施例詳細敘述而可由熟悉本技藝之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。Even though the present invention has been described in detail by the above-described embodiments, it can be modified by those skilled in the art, and is not intended to be protected by the appended claims.

1‧‧‧曝光成型裝置
2‧‧‧曝光槽
21‧‧‧第一表面
22‧‧‧第二表面
3‧‧‧工作平台
30‧‧‧第三傳動機構
4‧‧‧光學系統
40‧‧‧發光元件
400‧‧‧光線
41‧‧‧光學組件
410‧‧‧透光元件
411‧‧‧第一光學元件
4110‧‧‧第一傳動機構
412‧‧‧第二光學元件
4120‧‧‧第二傳動機構
413‧‧‧第一光學補償元件
414‧‧‧第二光學補償元件
5‧‧‧光敏液
6‧‧‧注料裝置
A‧‧‧投影區域
B‧‧‧欲曝光區域
C‧‧‧成型區域
L‧‧‧投影長度
L’‧‧‧第一長度
W‧‧‧投影寬度
W’‧‧‧第二長度
P‧‧‧光路徑
d1‧‧‧第一方向
d2‧‧‧第二方向
d3‧‧‧第三方向
p1‧‧‧像素
S10、S20、S30、S40、S50、S60‧‧‧步驟
S31、S32、S33‧‧‧步驟
S61、S62‧‧‧步驟
1‧‧‧Exposure forming device
2‧‧‧Exposure slot
21‧‧‧ first surface
22‧‧‧ second surface
3‧‧‧Working platform
30‧‧‧ Third transmission mechanism
4‧‧‧Optical system
40‧‧‧Lighting elements
400‧‧‧Light
41‧‧‧Optical components
410‧‧‧Lighting components
411‧‧‧First optical component
4110‧‧‧First transmission
412‧‧‧Second optical component
4120‧‧‧second transmission mechanism
413‧‧‧First optical compensation component
414‧‧‧Second optical compensation component
5‧‧‧Photosensitive liquid
6‧‧‧Filling device
A‧‧‧projection area
B‧‧‧Exposure area
C‧‧‧ molding area
L‧‧‧projection length
L'‧‧‧ first length
W‧‧‧projection width
W'‧‧‧second length
P‧‧‧Light path
D1‧‧‧ first direction
D2‧‧‧second direction
D3‧‧‧ third direction
P1‧‧ ‧ pixels
S10, S20, S30, S40, S50, S60‧‧ steps
S31, S32, S33‧‧‧ steps
S61, S62‧‧‧ steps

第1圖係顯示本案較佳實施例之曝光成型裝置之架構示意圖。 第2圖係顯示本案另一實施例之曝光成型裝置之架構示意圖。 第3圖係顯示第2圖所示之曝光成型裝置之光學系統之結構示意圖。 第4圖係顯示本案較佳實施例之曝光成型方法流程圖。 第5圖係顯示第4圖所示之曝光成型方法之步驟S30之細部流程圖。 第6圖係顯示第4圖所示之曝光成型方法之步驟S60之細部流程圖。 第7A圖係顯示應用本案曝光成型方法之一實施例示意圖。 第7B圖係顯示應用本案曝光成型方法之另一實施例示意圖。 第7C圖係顯示應用本案曝光成型方法之又一實施例示意圖。 第7D圖係顯示應用本案曝光成型方法之再一實施例示意圖。 第8A圖係顯示本案較佳實施例之曝光成型裝置以本案曝光成型方法進行曝光成型之一示意圖。 第8B圖係顯示本案較佳實施例之曝光成型裝置以本案曝光成型方法進行曝光成型之另一示意圖。 第9圖係顯示本案另一較佳實施例之曝光成型裝置以本案曝光成型方法進行曝光成型之示意圖。Fig. 1 is a schematic view showing the structure of an exposure molding apparatus of a preferred embodiment of the present invention. Fig. 2 is a schematic view showing the structure of an exposure molding apparatus according to another embodiment of the present invention. Fig. 3 is a view showing the structure of an optical system of the exposure molding apparatus shown in Fig. 2. Figure 4 is a flow chart showing the exposure molding method of the preferred embodiment of the present invention. Fig. 5 is a detailed flow chart showing the step S30 of the exposure molding method shown in Fig. 4. Fig. 6 is a detailed flow chart showing the step S60 of the exposure molding method shown in Fig. 4. Fig. 7A is a view showing an embodiment of an exposure forming method of the present application. Fig. 7B is a view showing another embodiment of the exposure forming method of the present application. Fig. 7C is a view showing still another embodiment of the exposure molding method of the present application. Fig. 7D is a schematic view showing still another embodiment of the exposure forming method of the present application. Fig. 8A is a schematic view showing the exposure molding apparatus of the preferred embodiment of the present invention in the exposure molding method of the present invention. Fig. 8B is another schematic view showing the exposure molding apparatus of the preferred embodiment of the present invention in the exposure molding method of the present invention. Fig. 9 is a view showing the exposure molding apparatus of another preferred embodiment of the present invention, which is subjected to exposure forming by the exposure molding method of the present invention.

1‧‧‧曝光成型裝置 1‧‧‧Exposure forming device

2‧‧‧曝光槽 2‧‧‧Exposure slot

21‧‧‧第一表面 21‧‧‧ first surface

22‧‧‧第二表面 22‧‧‧ second surface

3‧‧‧工作平台 3‧‧‧Working platform

30‧‧‧第三傳動機構 30‧‧‧ Third transmission mechanism

40‧‧‧發光元件 40‧‧‧Lighting elements

400‧‧‧光線 400‧‧‧Light

410‧‧‧透光元件 410‧‧‧Lighting components

411‧‧‧第一光學元件 411‧‧‧First optical component

4110‧‧‧第一傳動機構 4110‧‧‧First transmission

412‧‧‧第二光學元件 412‧‧‧Second optical component

4120‧‧‧第二傳動機構 4120‧‧‧second transmission mechanism

413‧‧‧第一光學補償元件 413‧‧‧First optical compensation component

414‧‧‧第二光學補償元件 414‧‧‧Second optical compensation component

5‧‧‧光敏液 5‧‧‧Photosensitive liquid

6‧‧‧注料裝置 6‧‧‧Filling device

A‧‧‧投影區域 A‧‧‧projection area

B‧‧‧欲曝光區域 B‧‧‧Exposure area

P‧‧‧光路徑 P‧‧‧Light path

d1‧‧‧第一方向 D1‧‧‧ first direction

d2‧‧‧第二方向 D2‧‧‧second direction

d3‧‧‧第三方向 D3‧‧‧ third direction

Claims (10)

一種曝光成型裝置,包括: 一曝光槽,具有一第一表面及一第二表面,用以容納一光敏液; 一工作平台,係相對該第一表面設置;以及 一光學系統,係相對該第二表面設置,包括: 一發光元件,提供一光線,該光線係沿一光路徑行進;以及 一光學組件,包括: 一透光元件,係設置於該光路徑上; 一第一光學元件,係於該光路徑上設置於該透光元件之後;以及 一第一傳動機構,係沿一第一方向設置,且與該第一光學元件相連接,以帶動該第一光學元件沿該第一方向移動; 其中,該光線係於穿透該透光元件後,受該第一光學元件反射至該曝光槽,俾使該光敏液曝光成型於該工作平台。An exposure forming apparatus comprising: an exposure groove having a first surface and a second surface for accommodating a photosensitive liquid; a working platform disposed relative to the first surface; and an optical system opposite to the first The two surface arrangements include: a light emitting element that provides a light that travels along a light path; and an optical component that includes: a light transmissive element disposed on the light path; a first optical component Provided on the light path after the light transmissive element; and a first transmission mechanism disposed along a first direction and coupled to the first optical element to drive the first optical element along the first direction Moving, wherein the light is transmitted through the light transmissive element, reflected by the first optical element to the exposure groove, and the photosensitive liquid is exposed and formed on the working platform. 如申請專利範圍第1項所述之曝光成型裝置,其中該光學組件更包括: 一第二光學元件,係於該光路徑上設置於該透光元件與該第一光學元件之間;以及 一第二傳動機構,係沿一第二方向設置,且與該第二光學元件相連接,以帶動該第二光學元件沿該第二方向移動。The exposure molding apparatus of claim 1, wherein the optical component further comprises: a second optical component disposed between the light transmissive component and the first optical component in the light path; and a The second transmission mechanism is disposed along a second direction and coupled to the second optical component to drive the second optical component to move in the second direction. 如申請專利範圍第2項所述之曝光成型裝置,更包括: 一第三傳動機構,係與該工作平台相連接,以帶動該工作平台沿一第三方向移動;以及 一注料裝置,係設置於該曝光槽,用以提供該光敏液。The exposure forming apparatus of claim 2, further comprising: a third transmission mechanism connected to the working platform to drive the working platform to move in a third direction; and a filling device The exposure tank is disposed to provide the photosensitive liquid. 如申請專利範圍第3項所述之曝光成型裝置,其中該第一方向、該第二方向及該第三方向係相互垂直。The exposure molding apparatus of claim 3, wherein the first direction, the second direction, and the third direction are perpendicular to each other. 如申請專利範圍第2項所述之曝光成型裝置,其中該光學組件更包括一第一光學補償元件及一第二光學補償元件,該第一光學補償元件及該第二光學補償元件係於該光路徑上設置於該透光元件與該第二光學元件之間,且該第一光學補償元件係與該第一光學元件平行設置,該第二光學補償元件係與該第二光學元件平行設置。The exposure molding apparatus of claim 2, wherein the optical component further comprises a first optical compensation component and a second optical compensation component, wherein the first optical compensation component and the second optical compensation component are a light path is disposed between the light transmissive element and the second optical element, and the first optical compensation component is disposed in parallel with the first optical component, and the second optical compensation component is disposed in parallel with the second optical component . 如申請專利範圍第5項所述之曝光成型裝置,其中該透光元件為聚焦透鏡,該第一光學元件、該第二光學元件、該第一光學補償元件及該第二光學補償元件為反射鏡。The exposure molding apparatus of claim 5, wherein the light transmissive element is a focus lens, and the first optical element, the second optical element, the first optical compensation element, and the second optical compensation element are reflective mirror. 一種曝光成型方法,包括: (a) 提供一曝光槽、一工作平台、一發光元件及一光學組件,其中該曝光槽係容納一光敏液,且該光學組件係包括一透光元件、一第一光學元件及一第一傳動機構; (b) 該發光元件發射一光線; (c) 使該光線穿透該透光元件,並受該第一光學元件反射至該曝光槽之一欲曝光區域; (d) 經過一曝光時間,使位於該欲曝光區域之該光敏液曝光成型於該工作平台; (e) 判斷是否繼續進行曝光成型動作; (f) 該第一傳動機構沿一第一方向移動該第一光學元件;以及 (g) 完成該曝光成型動作; 其中,當該步驟(e)之判斷結果為是,執行該步驟(f),並重新執行該步驟(b)至該步驟(e),且當該步驟(e)之判斷結果為否,執行該步驟(g)。An exposure molding method comprising: (a) providing an exposure groove, a working platform, a light-emitting element, and an optical component, wherein the exposure groove receives a photosensitive liquid, and the optical component comprises a light-transmitting component, a first An optical component and a first transmission mechanism; (b) the light emitting component emits a light; (c) the light is transmitted through the light transmitting component, and is reflected by the first optical component to an exposed area of the exposure groove (d) exposing the photosensitive liquid located in the area to be exposed to the working platform after an exposure time; (e) determining whether to continue the exposure forming operation; (f) the first transmission mechanism is along a first direction Moving the first optical element; and (g) completing the exposure forming operation; wherein, when the determination result of the step (e) is YES, performing the step (f), and re-executing the step (b) to the step ( e), and when the judgment result of the step (e) is NO, the step (g) is performed. 如申請專利範圍第7項所述之曝光成型方法,其中該光學組件更包括一第二光學元件、一第一光學補償元件及一第二光學補償元件,且該步驟(c)更包括子步驟: (c1) 使該光線穿透該透光元件; (c2) 該光線受該第一光學補償元件及該第二光學補償元件反射至該第二光學元件,再受該第二光學元件反射至該第一光學元件;以及 (c3) 該光線受該第一光學元件反射至該曝光槽之一欲曝光區域。The exposure molding method of claim 7, wherein the optical component further comprises a second optical component, a first optical compensation component and a second optical compensation component, and the step (c) further comprises the substep (c1) passing the light through the light transmissive element; (c2) the light is reflected by the first optical compensating element and the second optical compensating element to the second optical element, and then reflected by the second optical element The first optical element; and (c3) the light is reflected by the first optical element to one of the exposure grooves to be exposed. 如申請專利範圍第8項所述之曝光成型方法,其中該光學組件更包括一控制元件及一第二傳動機構,且該步驟(f)更包括子步驟: (f1) 該控制元件根據該欲曝光區域計算一移動路徑及一移動速度;以及 (f2) 該控制元件控制該第一傳動機構根據該移動路徑及該移動速度沿一第一方向移動該第一光學元件,且控制該第二傳動機構根據該移動路徑及該移動速度沿一第二方向移動該第二光學元件,其中該第一方向係與該第二方向相垂直。The exposure molding method of claim 8, wherein the optical component further comprises a control component and a second transmission mechanism, and the step (f) further comprises the substep: (f1) the control component according to the desire The exposure area calculates a movement path and a movement speed; and (f2) the control element controls the first transmission mechanism to move the first optical element in a first direction according to the movement path and the movement speed, and control the second transmission The mechanism moves the second optical element in a second direction according to the moving path and the moving speed, wherein the first direction is perpendicular to the second direction. 如申請專利範圍第9項所述之曝光成型方法,其中該曝光時間係與該光線之一光程長度成反比,且該移動速度係與該曝光時間成反比。The exposure molding method of claim 9, wherein the exposure time is inversely proportional to an optical path length of the light, and the moving speed is inversely proportional to the exposure time.
TW105122306A 2016-07-14 2016-07-14 Exposure molding device and exposure molding method thereof TWI621520B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105122306A TWI621520B (en) 2016-07-14 2016-07-14 Exposure molding device and exposure molding method thereof
US15/263,295 US10189238B2 (en) 2016-07-14 2016-09-12 Exposure molding device and exposure molding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105122306A TWI621520B (en) 2016-07-14 2016-07-14 Exposure molding device and exposure molding method thereof

Publications (2)

Publication Number Publication Date
TW201801896A true TW201801896A (en) 2018-01-16
TWI621520B TWI621520B (en) 2018-04-21

Family

ID=60942363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105122306A TWI621520B (en) 2016-07-14 2016-07-14 Exposure molding device and exposure molding method thereof

Country Status (2)

Country Link
US (1) US10189238B2 (en)
TW (1) TWI621520B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109263040B (en) * 2018-10-22 2024-04-16 泰州职业技术学院 Quick 3D printing system with automatic exposure surface balance
CN112959661B (en) * 2021-01-26 2024-02-02 深圳市创必得科技有限公司 LCD photo-curing 3D printing uniform light optimization compensation method and device
CN115648629A (en) * 2022-10-24 2023-01-31 上海复志信息科技股份有限公司 LED light attenuation compensation device and method for DLP light machine

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5626919A (en) * 1990-03-01 1997-05-06 E. I. Du Pont De Nemours And Company Solid imaging apparatus and method with coating station
US5922364A (en) * 1997-03-03 1999-07-13 Young, Jr.; Albert C. Stereolithography layering control system
US6574523B1 (en) * 2000-05-05 2003-06-03 3D Systems, Inc. Selective control of mechanical properties in stereolithographic build style configuration
US6544465B1 (en) * 2000-08-18 2003-04-08 Micron Technology, Inc. Method for forming three dimensional structures from liquid with improved surface finish
US6572807B1 (en) * 2000-10-26 2003-06-03 3D Systems, Inc. Method of improving surfaces in selective deposition modeling
US20060078638A1 (en) * 2004-10-08 2006-04-13 3D Systems, Inc. Stereolithographic apparatus
US7757760B2 (en) * 2006-09-22 2010-07-20 Schlumberger Technology Corporation System and method for real-time management of formation fluid sampling with a guarded probe
JP4957242B2 (en) * 2006-12-28 2012-06-20 ソニー株式会社 Stereolithography equipment
EP2143141A4 (en) * 2007-04-18 2011-04-13 Invisage Technologies Inc Materials systems and methods for optoelectronic devices
US8743340B2 (en) * 2008-12-31 2014-06-03 Rolls-Royce Corporation System and method for imaging apparatus calibration
US11110648B2 (en) * 2012-07-31 2021-09-07 Makerbot Industries, Llc Build material switching
EP3083213B1 (en) * 2013-12-20 2020-11-04 Luxexcel Holding B.V. Method for printing a three-dimensional light guiding structure by curing droplets of a printing material by light irradiation
TWI526294B (en) * 2014-04-15 2016-03-21 三緯國際立體列印科技股份有限公司 Three dimensional printing apparatus
US9902112B2 (en) * 2015-04-07 2018-02-27 Global Filtration Systems Apparatus and method for forming three-dimensional objects using linear solidification and a vacuum blade
US10245822B2 (en) * 2015-12-11 2019-04-02 Global Filtration Systems Method and apparatus for concurrently making multiple three-dimensional objects from multiple solidifiable materials
US10583529B2 (en) * 2015-12-17 2020-03-10 Eos Of North America, Inc. Additive manufacturing method using a plurality of synchronized laser beams

Also Published As

Publication number Publication date
TWI621520B (en) 2018-04-21
US10189238B2 (en) 2019-01-29
US20180015642A1 (en) 2018-01-18

Similar Documents

Publication Publication Date Title
US11747609B2 (en) Optical path adjusting mechanism
US11890805B2 (en) Three-dimensional printing apparatus and three-dimensional printing method
US9632420B2 (en) Production of a volume object by lithography, having improved spatial resolution
KR101240221B1 (en) Optical sheet laminating method, optical sheet laminating device and program used therewith, and display device
WO2015081756A1 (en) Photo-curing 3d printing device and imaging system thereof
CN102944978B (en) Exposure system, calibration system, optical engines, exposure method, and production method
TWI621520B (en) Exposure molding device and exposure molding method thereof
KR20190010605A (en) A waveguide for a head-up display, comprising a reflective output coupling structure
WO2015180022A1 (en) 3d printing system
US20090140172A1 (en) Optical shaping apparatus and optical shaping method
JPH08192469A (en) Photo-setting resin curing method
US11828959B2 (en) Grating structure, manufacturing method thereof and display device
Wissmann et al. Fast and low-cost structured light pattern sequence projection
WO2016104331A1 (en) Projection lens barrel and projector
JP2008292916A (en) Image exposure device, microlens unit, and its manufacturing method
JP6494259B2 (en) Illumination optical apparatus and device manufacturing method
JP2023520296A (en) Predictive method and relative apparatus for isotropic stereolithography 3D printing with variable speed and power hybrid light source
WO2018025515A1 (en) Measuring device, exposure device, and method for manufacturing article
EP3470210B1 (en) Three-dimensional printing apparatus
CN107627600B (en) Exposure forming device and exposure forming method thereof
TW201823871A (en) Refractive laser direct imaging system
JP4063159B2 (en) Manufacturing method of fine structure element
JP2005121985A (en) Positioning tool for optical element, method of positioning, optical element, optical scanner and method of adhering
CN104669622A (en) Photocurable 3D (three-dimensional) printing device and imaging system thereof
KR20200044803A (en) Exposure equipment