TW201741952A - Storage system and method for controlling the storage system - Google Patents

Storage system and method for controlling the storage system Download PDF

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TW201741952A
TW201741952A TW105116405A TW105116405A TW201741952A TW 201741952 A TW201741952 A TW 201741952A TW 105116405 A TW105116405 A TW 105116405A TW 105116405 A TW105116405 A TW 105116405A TW 201741952 A TW201741952 A TW 201741952A
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storage cabinet
component
storage
module
axis direction
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TW105116405A
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TWI602131B (en
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李建法
黃俊榮
劉旭水
白峻榮
郭守文
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台灣積體電路製造股份有限公司
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Abstract

The disclosure provides a storage system. The storage system includes a number of racks and a transferring module which are arranged to be moveable along an X axis. The racks are configured to store at least one element. The transferring module includes a platform which is arranged to be moveable along a Z axis. The platform is selectively positioned between two neighboring racks. The storage system also includes a handling module and a positioning module both disposed on the platform. The handling module includes a holder to secure the element. The positioning module is used to detect the position of the handling module relative to the racks. The control apparatus controls the storage system according to the detected results from the positioning module.

Description

倉儲系統及倉儲系統控制方法 Warehousing system and storage system control method

本揭露係關於一種倉儲系統及控制該倉儲系統之方法,特別係關於一種用於儲存半導體加工設備之倉儲系統及該倉儲系統之控制方法。 The present disclosure relates to a storage system and a method of controlling the same, and more particularly to a storage system for storing semiconductor processing equipment and a control method for the storage system.

半導體裝置被用於多種電子應用,例如個人電腦、行動電話、數位相機以及其他電子設備。半導體裝置的製造通常是藉由在半導體基板上依序沉積絕緣或介電層材料、導電層材料以及半導體層材料,接著使用微影製程圖案化所形成的各種材料層,以形成電路組件和零件於此半導體基板之上。在積體電路之材料及其設計上的技術進步已發展出多個世代的積體電路。相較於前一個世代,每一世代具有更小更複雜的電路。然而,這些發展提昇了加工及製造積體電路的複雜度。為了使這些發展得以實現,在積體電路的製造以及生產上相似的發展也是必須的。 Semiconductor devices are used in a variety of electronic applications, such as personal computers, mobile phones, digital cameras, and other electronic devices. The semiconductor device is generally fabricated by sequentially depositing an insulating or dielectric layer material, a conductive layer material, and a semiconductor layer material on a semiconductor substrate, and then patterning the various material layers formed using a lithography process to form circuit components and parts. Above the semiconductor substrate. Technological advances in the materials and design of integrated circuits have led to the development of integrated circuits for many generations. Each generation has smaller and more complex circuits than the previous generation. However, these developments have increased the complexity of processing and manufacturing integrated circuits. In order for these developments to be realized, similar developments in the manufacture and production of integrated circuits are also necessary.

在半導體裝置的製造中,多種加工元件是依序被使用,以製造積體電路在半導體晶圓之上。舉例而言,具有不同圖案的光罩係被使用在多道光顯影步驟中。在光罩使用前及使用後是通常是被儲存至一倉儲系統加以儲藏並管理,以利後 續重複使用。由於現有的方法及廠房設備仍未全面滿足上述加工元件管理及儲存的需求,因此仍需一種新的倉儲系統以更高的效率完成倉儲管理。 In the fabrication of semiconductor devices, a variety of processing elements are used sequentially to fabricate integrated circuits over the semiconductor wafer. For example, reticles having different patterns are used in multiple light development steps. Before and after use, the reticle is usually stored in a storage system for storage and management. Continue to reuse. Since the existing methods and equipment still do not fully meet the above requirements for processing and storage of processing components, a new warehousing system is still needed to complete warehousing management with higher efficiency.

有鑑於此,本揭露之一目的在於提供一種倉儲系統,以更高的效率完成倉儲管理。 In view of this, one of the objects of the present disclosure is to provide a warehousing system that performs warehousing management with higher efficiency.

根據本揭露之一實施例,上述倉儲系統包括多個儲藏櫃及一移動模組。儲藏櫃與移動模組以可沿一X軸方向移動的方式設置。儲藏櫃各自配置用於儲存至少一元件。移動模組包括一可沿一Z軸方向移動之升降平台並可選擇性設置於相鄰儲存櫃之間。倉儲系統亦包括一抓取模組及一定位模組。抓取模組及定位模組設置於該升降平台上。抓取模組包括一用於抓取該元件之抓取組件。定位模組用於偵測該抓取模組相對該儲存櫃之位置。另外,倉儲系統包括一控制設備。控制設備根據來自該定位模組之偵測訊號調整該第一儲存櫃、該第二儲存櫃、該移動模組、或該抓取模組之作動。 According to an embodiment of the disclosure, the storage system includes a plurality of storage cabinets and a mobile module. The storage cabinet and the moving module are arranged to be movable in an X-axis direction. The storage cabinets are each configured to store at least one component. The mobile module includes a lifting platform movable along a Z-axis direction and selectively disposed between adjacent storage cabinets. The storage system also includes a grab module and a positioning module. The grabbing module and the positioning module are disposed on the lifting platform. The grab module includes a gripping assembly for gripping the component. The positioning module is configured to detect the position of the grab module relative to the storage cabinet. In addition, the storage system includes a control device. The control device adjusts the operation of the first storage cabinet, the second storage cabinet, the mobile module, or the capture module according to the detection signal from the positioning module.

在上述實施例中,該定位模組包括一攝影組件、一雷射測距組件、及一條碼掃描組件。攝影組件配置用於拍攝該第一儲存櫃或該第二儲存櫃之一影像。雷射測距組件配置用於偵測該抓取模組與該第一儲存櫃或該第二儲存櫃之距離。條碼掃描組件,配置用於讀取位於該第一儲存櫃或該第二儲存櫃之一位置條碼,或者用於讀取位於該元件之一辨別條碼。該控制設備根據所獲得之該影像與所偵測之該距離執行該抓取模組之定位。 In the above embodiment, the positioning module includes a camera assembly, a laser ranging component, and a code scanning component. The photographic component is configured to capture an image of the first storage cabinet or the second storage cabinet. The laser ranging component is configured to detect a distance between the capture module and the first storage cabinet or the second storage cabinet. A bar code scanning component configured to read a bar code located at a location of the first storage bin or the second storage bin, or to read a bar code located at one of the components. The control device performs positioning of the capture module according to the obtained image and the detected distance.

在上述實施例中,該移動模組包括一升降平台及一容置槽。該抓取模組以可沿一Y軸方向移動的方式設置於該升降平台。容置槽設置於該升降平台,並用於放置該元件。 In the above embodiment, the mobile module includes a lifting platform and a receiving slot. The gripping module is disposed on the lifting platform in such a manner as to be movable in a Y-axis direction. A receiving groove is disposed on the lifting platform and is used to place the component.

在上述實施例中,該抓取組件包括二個相對設置之桿件、一第一夾持件與一第二夾持件。第一夾持件與一第二夾持件分別設置於該二個桿件,並共同用於夾持該元件。該第二夾持件相對該桿件之角度係根據該元件之擺放角度而決定。 In the above embodiment, the gripping assembly includes two oppositely disposed lever members, a first clamping member and a second clamping member. The first clamping member and the second clamping member are respectively disposed on the two lever members and are used together for clamping the component. The angle of the second clamping member relative to the member is determined by the angle at which the member is placed.

本揭露之另一目的在於提供一倉儲系統的控制方法。該方法包括移動一第一儲存櫃與一第二儲存櫃。該方法更包括移動一乘載設備至定義於該第一儲存櫃與該第二儲存櫃之間的該作業空間。該方法亦包括執行一位置校正作業。另外,該方法包括掃描位於該第一儲存櫃或該第二儲存櫃之一位置條碼。並且,該方法包括自該第一儲存櫃或該第二儲存櫃抓取該元件,或放置一元件至該第一儲存櫃或該第二儲存櫃。 Another object of the present disclosure is to provide a method of controlling a storage system. The method includes moving a first storage cabinet and a second storage cabinet. The method further includes moving a passenger device to the work space defined between the first storage cabinet and the second storage cabinet. The method also includes performing a position correction operation. Additionally, the method includes scanning a bar code located at a location of the first storage bin or the second storage bin. And, the method includes grabbing the component from the first storage bin or the second storage bin, or placing an element to the first storage bin or the second storage bin.

在上述實施例中,在放置該元件至該第一儲存櫃或該第二儲存櫃之前,更包括針對該第一儲存櫃或該第二儲存櫃進行掃描,以確認該第一儲存櫃或該第二儲存櫃上之相對位置是否淨空。 In the above embodiment, before the component is placed in the first storage cabinet or the second storage cabinet, the scanning is further performed on the first storage cabinet or the second storage cabinet to confirm the first storage cabinet or the Whether the relative position on the second storage cabinet is empty.

在上述實施例中,該方法包括透過該乘載設備的一抓取模組抓取或放置該元件,且該方法包括在該作業空間中,沿一Y軸方向或沿一Z軸方向移動該抓取模組。在該抓取模組沿該Z軸方向移動前,偵測該抓取模組之下方一既定距離是否淨空,若有一阻礙物存在則停止沿該Z軸方向之移動。 In the above embodiment, the method includes grabbing or placing the component through a grab module of the carrier device, and the method includes moving the Y-axis direction or a Z-axis direction in the workspace Grab the module. Before the grab module moves in the Z-axis direction, it is detected whether a predetermined distance below the grab module is clear, and if there is an obstacle, the movement in the Z-axis direction is stopped.

在上述實施例中,在放置該元件至該第一儲存櫃 或該第二儲存櫃之前,以及在自該第一儲存櫃或該第二儲存櫃抓取該元件之後,該元件係放置於該乘載設備位於該作業空間內的一容置槽中。 In the above embodiment, the component is placed to the first storage cabinet Or before the second storage cabinet, and after the component is picked up from the first storage cabinet or the second storage cabinet, the component is placed in a receiving slot of the loading device in the working space.

在上述實施例中,該位置校正作業包括根據一影像與該乘載設備與該第一儲存櫃或該第二儲存櫃間的一偵測距離,對該第一儲存櫃、該第二儲存櫃、或該乘載設備之位置進行調整。 In the above embodiment, the position correction operation includes the first storage cabinet and the second storage cabinet according to an image and a detection distance between the loading device and the first storage cabinet or the second storage cabinet. Or adjust the position of the carrier device.

1‧‧‧倉儲系統 1‧‧ ‧ warehousing system

10‧‧‧第一儲存櫃 10‧‧‧First storage cabinet

110‧‧‧儲存格 110‧‧‧ cells

20‧‧‧第二儲存櫃 20‧‧‧Second storage cabinet

210‧‧‧儲存格 210‧‧‧ cells

30‧‧‧乘載設備 30‧‧‧Loading equipment

31‧‧‧移動模組 31‧‧‧Mobile Module

311‧‧‧龍門 311‧‧‧Longmen

312‧‧‧升降平台 312‧‧‧ Lifting platform

313‧‧‧平台本體 313‧‧‧ platform ontology

314‧‧‧軌道 314‧‧‧ Track

315‧‧‧容置槽 315‧‧‧ accommodating slots

33‧‧‧抓取模組 33‧‧‧Grab module

331‧‧‧機械手臂 331‧‧‧ Robotic arm

332‧‧‧抓取組件 332‧‧‧Grab components

333‧‧‧桿件 333‧‧‧ rods

334‧‧‧桿件 334‧‧‧ rods

335‧‧‧驅動單元 335‧‧‧ drive unit

336‧‧‧第一夾持件 336‧‧‧First clamping part

337‧‧‧第二夾持件 337‧‧‧Second grip

338‧‧‧樞轉軸 338‧‧‧ pivot shaft

339‧‧‧殼體 339‧‧‧Shell

35‧‧‧定位模組 35‧‧‧ Positioning Module

351‧‧‧攝影組件 351‧‧‧Photographic components

353‧‧‧雷射測距組件 353‧‧‧Laser ranging components

355‧‧‧條碼掃描組件 355‧‧‧Barcode scanning component

40‧‧‧控制設備 40‧‧‧Control equipment

50‧‧‧元件 50‧‧‧ components

60‧‧‧方法 60‧‧‧ method

61-66‧‧‧操作 61-66‧‧‧ operation

70‧‧‧方法 70‧‧‧ method

71-76‧‧‧操作 71-76‧‧‧ operations

S1-S5‧‧‧箭頭 S1-S5‧‧‧ arrow

根據以下的詳細說明並配合所附圖式做完整揭露。應注意的是,根據本產業的一般作業,圖示並未必按照比例繪製。事實上,可能任意的放大或縮小元件的尺寸,以做清楚的說明。 The full disclosure is based on the following detailed description and in conjunction with the drawings. It should be noted that the illustrations are not necessarily drawn to scale in accordance with the general operation of the industry. In fact, it is possible to arbitrarily enlarge or reduce the size of the component for a clear explanation.

第1圖顯示本揭露之部分實施例之倉儲系統之示意圖,其中一乘載設備位於二個儲存櫃定義之作業空間外部。 Figure 1 is a schematic illustration of a storage system of some embodiments of the present disclosure, wherein a ride device is located outside of the work space defined by the two storage cabinets.

第2圖顯示本揭露之部份實施例之乘載設備之示意圖。 Figure 2 is a schematic diagram showing the ride device of some embodiments of the present disclosure.

第3圖顯示本揭露之部分實施例中對一元件執行一抓取作業之方法之流程圖。 Figure 3 is a flow chart showing a method of performing a grab operation on a component in some embodiments of the present disclosure.

第4圖顯示本揭露之部分實施例之倉儲系統之示意圖,其中一乘載設備位於二個儲存櫃定義之作業空間內部。 Figure 4 is a schematic illustration of a storage system of some embodiments of the present disclosure, wherein a loading device is located within the working space defined by the two storage cabinets.

第5圖顯示本揭露之部分實施例中執行一位置校正作業之方法之示意圖。 Figure 5 is a diagram showing a method of performing a position correction operation in some embodiments of the present disclosure.

第6圖顯示本揭露之部分實施例中對一元件執行一放置作業之方法之流程圖。 Figure 6 is a flow chart showing a method of performing a placement operation on a component in some embodiments of the present disclosure.

以下將特舉數個具體之較佳實施例,並配合所附圖式做詳細說明,圖上顯示數個實施例。然而,本揭露可以許多不同形式實施,不局限於以下所述之實施例,在此提供之實施例可使得揭露得以更透徹及完整,以將本揭露之範圍完整地傳達予同領域熟悉此技藝者。 In the following, a number of specific preferred embodiments will be described in detail with reference to the accompanying drawings, which illustrate several embodiments. However, the present disclosure can be implemented in many different forms, and is not limited to the embodiments described below, and the embodiments provided herein may be made to provide a more thorough and complete disclosure of the scope of the disclosure. By.

而且,為便於描述,在此可以使用諸如“在...之下”、“在...下方”、“下部”、“在...之上”、“上部”等的空間相對術語,以描述如圖所示的一個元件或部件與另一個(或另一些)元件或部件的關係。除了圖中所示的方位外,空間相對術語旨在包括器件在使用或操作中的不同方位。裝置可以以其他方式定向(旋轉90度或在其他方位上),而本文使用的空間相對描述符可以同樣地作相應的解釋。應該理解,可以在方法之前、期間和之後提供額外的操作,並且對於方法的其他實施例,可以替換或消除一些描述的操作。 Moreover, for convenience of description, spatially relative terms such as "under", "below", "lower", "above", "upper", etc. may be used herein. To describe the relationship of one element or component to another (or other) element or component as illustrated. Spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly. It should be understood that additional operations may be provided before, during, and after the method, and that some of the described operations may be substituted or eliminated for other embodiments of the method.

必需了解的是,為特別描述或圖示之元件可以此技術人士所熟知之各種形式存在。此外,當某元件在其它元件「上」時,有可能是指「直接」在其它元件上,或之間夾設有其它元件。 It is to be understood that the elements specifically described or illustrated may be in various forms well known to those skilled in the art. In addition, when an element is "on" another element, it may mean "directly" to the other element or the other element is interposed.

此外,實施例中可能使用相對性的用語,例如「較低」或「底部」及「較高」或「頂部」,以描述圖示的一個元件對於另一元件的相對關係。能理解的是,如果將圖示的裝置翻轉使其上下顛倒,則所敘述在「較低」側的元件將會成為在「較高」側的元件。 In addition, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one element to another. It will be understood that if the illustrated device is flipped upside down, the component described on the "lower" side will be the component on the "higher" side.

在此,「約」、「大約」之用語通常表示在一給 定值或範圍的20%之內,較佳是10%之內,且更佳是5%之內。在此給定的數量為大約的數量,意即在沒有特定說明的情況下,仍可隱含「約」、「大約」之含義。 Here, the terms "about" and "about" are usually expressed in a given Within 20% of the set value or range, preferably within 10%, and more preferably within 5%. The quantity given here is an approximate quantity, meaning that the meaning of "about" or "about" may be implied without specific explanation.

第1圖顯示本揭露之部分實施例之倉儲系統之示意圖。根據本揭露之部分實施例,倉儲系統1包括複數個儲存櫃,例如:第一儲存櫃10、第二儲存櫃20,一乘載設備30、及一控制設備40。倉儲系統1之元件數量可以增加或減少,並不僅以此實施例為限。 Figure 1 shows a schematic diagram of a storage system of some embodiments of the present disclosure. According to some embodiments of the present disclosure, the storage system 1 includes a plurality of storage cabinets, such as a first storage cabinet 10, a second storage cabinet 20, a passenger loading device 30, and a control device 40. The number of components of the warehousing system 1 can be increased or decreased, and is not limited to this embodiment.

第一儲存櫃10、第二儲存櫃20係分別配置用於儲存一或多個用於半導體晶圓加工的元件(例如:光罩)。第一儲存櫃10、第二儲存櫃20在X軸之相對二側可分別包括複數個儲存格,例如儲存格110、210。儲存格係沿Y軸及Z軸矩陣排列。每一儲存格可供至少一元件設置於其中。每一儲存格之底面可相對X方向傾斜,以避免設置於儲存格當中的元件因意外而墜落。在部分實施例中,第一儲存櫃10、第二儲存櫃20在Z軸上具有相同高度。 The first storage cabinet 10 and the second storage cabinet 20 are respectively configured to store one or more components (for example, a photomask) for semiconductor wafer processing. The first storage cabinet 10 and the second storage cabinet 20 may respectively include a plurality of storage cells, such as the storage cells 110, 210, on opposite sides of the X-axis. The storage grids are arranged along the Y-axis and Z-axis matrix. Each cell is provided with at least one component disposed therein. The bottom surface of each cell can be tilted relative to the X direction to prevent components placed in the cell from falling due to accident. In some embodiments, the first storage cabinet 10 and the second storage cabinet 20 have the same height on the Z-axis.

在部分實施例中,第一儲存櫃10、第二儲存櫃20係沿一X軸方向設置,並且第一儲存櫃10、第二儲存櫃20可分別沿X軸方向移動,以改變彼此之間距。舉例而言,在一儲藏狀態下,第一儲存櫃10與第二儲存櫃20之間具有一相當小的間距,例如:小於10公分之間距。在一作業狀態下,該第一儲存櫃10與第二儲存櫃20之間定義出一作業空間W,如第1圖所示,以容置乘載設備30在其間進行作業。 In some embodiments, the first storage cabinet 10 and the second storage cabinet 20 are disposed along an X-axis direction, and the first storage cabinet 10 and the second storage cabinet 20 are respectively movable along the X-axis direction to change the distance between each other. . For example, in a storage state, there is a relatively small spacing between the first storage cabinet 10 and the second storage cabinet 20, for example, less than 10 cm. In a working state, a working space W is defined between the first storage cabinet 10 and the second storage cabinet 20, as shown in FIG. 1 to accommodate the loading device 30 to perform work therebetween.

在部分實施例中,自該儲藏狀態改變至該作業狀 態之過程中,第一儲存櫃10固定不動,且第二儲存櫃20沿X軸方向遠離第一儲存櫃10,如第1圖箭頭S1所示。或者,第二儲存櫃20固定不動,且第一儲存櫃10沿X軸方向離第二儲存櫃20。或者,第一儲存櫃10與第二儲存櫃20同時朝二個遠離彼此的相反方向移動。第一儲存櫃10與第二儲存櫃20之底部可包括驅動組件(例如:電動馬達)。驅動組件與控制設備40以有線或無線之方式進行連結,並根據來自控制設備40之訊號驅動第一儲存櫃10與第二儲存櫃20進行移動。 In some embodiments, changing from the storage state to the operation state During the state, the first storage cabinet 10 is stationary, and the second storage cabinet 20 is away from the first storage cabinet 10 in the X-axis direction, as indicated by an arrow S1 in FIG. Alternatively, the second storage cabinet 20 is stationary, and the first storage cabinet 10 is separated from the second storage cabinet 20 in the X-axis direction. Alternatively, the first storage cabinet 10 and the second storage cabinet 20 are simultaneously moved in opposite directions away from each other. The bottom of the first storage cabinet 10 and the second storage cabinet 20 may include a drive assembly (eg, an electric motor). The driving component and the control device 40 are connected in a wired or wireless manner, and the first storage cabinet 10 and the second storage cabinet 20 are driven to move according to signals from the control device 40.

乘載設備30係配置用於承載並配送元件往來於儲存櫃10、20與一工作區域(圖未示)之間。在部分實施例中,乘載設備30包括一移動模組31、一抓取模組33、及一定位模組35(第2圖)。乘載設備30之元件數量可以增加或減少,並不僅以此實施例為限。 The carrier device 30 is configured to carry and dispense components between the storage cabinets 10, 20 and a work area (not shown). In some embodiments, the carrying device 30 includes a moving module 31, a grabbing module 33, and a positioning module 35 (Fig. 2). The number of components of the carrier device 30 can be increased or decreased, and is not limited to this embodiment.

在部分實施例中,移動模組31包括一龍門311、一升降平台312、及至少一個容置槽315。龍門311係以可沿該X軸方向移動的方式設置,如第1圖箭頭S2所示。在部分實施例中,龍門311包括二個柱狀結構,其中二個柱狀結構在Y軸方向上之間距,係大於第一儲存櫃10或第二儲存櫃20在Y軸方向上之寬度。 In some embodiments, the mobile module 31 includes a gantry 311, a lifting platform 312, and at least one receiving slot 315. The gantry 311 is provided to be movable in the X-axis direction as indicated by an arrow S2 in FIG. In some embodiments, the gantry 311 includes two columnar structures, wherein the two columnar structures are spaced apart in the Y-axis direction by a width greater than the width of the first storage cabinet 10 or the second storage cabinet 20 in the Y-axis direction.

升降平台312以可沿一Z軸方向移動的方式設置於龍門311之上。升降平台312包括一平台本體313以及一軌道314。平台本體313連結於龍門311。軌道314沿Y軸方向延伸於平台本體313之上。 The lifting platform 312 is disposed above the gantry 311 in such a manner as to be movable in a Z-axis direction. The lifting platform 312 includes a platform body 313 and a track 314. The platform body 313 is coupled to the gantry 311. The track 314 extends above the platform body 313 in the Y-axis direction.

在部分實施例中,軌道314在X軸方向上之二側分 別具有複數個沿Y軸方向排列的容置槽315。容置槽315係配置以容置元件50。各個容置槽315之大小可以相同或相異,以容置不同尺寸之元件。值得注意的是,雖然在第1圖顯示之實施例中,軌道314在X軸方向上之二側皆有容置槽315設置,但本揭露並不僅此為限。容置槽315可僅設置於軌道314之單一側。或者,在二排容置槽315同時設置於軌道314之單一側。 In some embodiments, the track 314 is divided into two sides in the X-axis direction. There is a plurality of accommodating grooves 315 arranged along the Y-axis direction. The accommodating groove 315 is configured to accommodate the component 50. Each of the accommodating grooves 315 may be the same size or different to accommodate different sized components. It should be noted that, in the embodiment shown in FIG. 1, the track 314 is provided with the receiving groove 315 on both sides of the X-axis direction, but the disclosure is not limited thereto. The accommodating groove 315 may be disposed only on a single side of the track 314. Alternatively, the two rows of receiving slots 315 are simultaneously disposed on a single side of the track 314.

抓取模組33配置用於運送元件50,以移動元件50於容置槽315與第一、二儲存櫃10、20之間。在部分實施例中,抓取模組33係以可沿Y軸方向移動的方式設置於軌道314之上,如第1圖箭頭S3所示。 The gripping module 33 is configured to transport the component 50 to move the component 50 between the receiving slot 315 and the first and second storage cabinets 10, 20. In some embodiments, the gripping module 33 is disposed above the rail 314 so as to be movable in the Y-axis direction, as indicated by arrow S3 in FIG.

第2圖顯示本揭露之部分實施例之乘載設備之示意圖。在部分實施例中,抓取模組33包括一機械手臂331及一抓取組件332。機械手臂331可為一六軸機械手臂,並配置用於改變抓取組件332之位置。 Figure 2 is a schematic diagram showing the ride device of some embodiments of the present disclosure. In some embodiments, the gripping module 33 includes a robot arm 331 and a gripping assembly 332. The robotic arm 331 can be a six-axis robotic arm configured to change the position of the grasping assembly 332.

在部分實施例中,抓取組件332包括一殼體339、二個桿件333、334、一驅動單元335、一第一夾持件336、及一第二夾持件337。 In some embodiments, the gripping assembly 332 includes a housing 339, two lever members 333, 334, a driving unit 335, a first clamping member 336, and a second clamping member 337.

殼體339設置於機械手臂331之末端。桿件333、334分別連結殼體339之相反二側,其中桿件333透過驅動單元335連結殼體339。桿件333透過驅動單元335之驅動以沿箭頭S4標示之方向相對殼體339移動,以改變二個桿件333、334之間距。第一、二夾持件336、337分別設置於二個桿件333、334之末端,且第一、二夾持件336、337可分別包括一止滑塊。 The housing 339 is disposed at the end of the robot arm 331. The rods 333 and 334 are respectively connected to opposite sides of the casing 339, wherein the rod 333 is coupled to the casing 339 through the driving unit 335. The lever member 333 is moved relative to the housing 339 by the driving of the driving unit 335 to change the distance between the two lever members 333, 334 in the direction indicated by the arrow S4. The first and second clamping members 336 and 337 are respectively disposed at the ends of the two rod members 333 and 334, and the first and second clamping members 336 and 337 respectively include a stopping slider.

在部分實施例中,為了適應以不同角度放置於儲 存櫃之元件50,抓取組件336係透過一樞轉軸338連結於桿件333,以沿箭頭S5所標示之方向相對桿件333進行樞轉。然而本揭露並不僅此為限,抓取組件336亦可直接固定於桿件333之末端。 In some embodiments, in order to accommodate placement at different angles The component 50 of the storage cabinet, the gripping assembly 336 is coupled to the rod 333 via a pivot shaft 338 for pivoting relative to the rod 333 in the direction indicated by arrow S5. However, the present disclosure is not limited thereto, and the grasping assembly 336 may also be directly fixed to the end of the rod 333.

定位模組35配置用於偵測該抓取模組33相對第一儲存櫃10或第二儲存櫃20之位置。在部分實施例中,定位模組35設置於抓取模組33之上,且包括一攝影組件351、一雷射測距組件353、及一條碼掃描組件355。 The positioning module 35 is configured to detect the position of the grab module 33 relative to the first storage cabinet 10 or the second storage cabinet 20. In some embodiments, the positioning module 35 is disposed on the capture module 33 and includes a camera assembly 351, a laser ranging component 353, and a code scanning component 355.

攝影組件351可包括一感光耦合元件(Charge-coupled Device,CCD),並配置用於拍攝第一儲存櫃10或第二儲存櫃20之一影像。雷射測距組件353可包括一雷射發射器及一雷射接收器。雷射發射器朝一目標物發射一雷射訊號,且雷射接收器接收自該目標物反射之雷射訊號。雷射測距組件353根據該雷射訊號傳送之時間計算抓取模組33與第一儲存櫃10或第二儲存櫃20之距離。條碼掃描組件355係配置用於讀取條碼。 The photographing assembly 351 can include a Charge-coupled Device (CCD) and is configured to capture an image of the first storage cabinet 10 or the second storage cabinet 20. The laser ranging component 353 can include a laser emitter and a laser receiver. The laser emitter emits a laser signal toward a target, and the laser receiver receives a laser signal reflected from the target. The laser ranging component 353 calculates the distance between the grab module 33 and the first storage cabinet 10 or the second storage cabinet 20 according to the time of the laser signal transmission. The barcode scanning component 355 is configured to read a barcode.

攝影組件351、雷射測距組件353、及條碼掃描組件355皆可以有線或無線之方式訊號連結置控制設備40(第1圖),以傳送所產生之訊號至控制設備40或接收來自控制設備40之控制訊號。 The photographing component 351, the laser ranging component 353, and the barcode scanning component 355 can be connected to the control device 40 (Fig. 1) by wire or wirelessly to transmit the generated signal to the control device 40 or receive the control device. 40 control signals.

另一方面,攝影組件351、雷射測距組件353、及條碼掃描組件355可以如第2圖所示皆設置於殼體339之上。或者,攝影組件351、雷射測距組件353、及條碼掃描組件355可設置於平台本體313、機械手臂331、或者殼體339其中任一者 之上。 On the other hand, the photographing component 351, the laser ranging component 353, and the barcode scanning component 355 can be disposed on the casing 339 as shown in FIG. Alternatively, the photographing component 351, the laser ranging component 353, and the barcode scanning component 355 may be disposed on any one of the platform body 313, the robot arm 331, or the housing 339. Above.

第3圖是根據部分實施例顯示控制倉儲系統1以放置一元件於儲存櫃的方法60流程圖。為了說明,該流程圖將與第1、2、4、5圖中所示的示意圖一起描述。對於不同的實施例,可以替換或消除描述的一些操作。可以將額外的部件添加到倉儲系統1。對於不同的實施例,可以替換或消除描述的一些部件。 3 is a flow chart showing a method 60 of controlling a storage system 1 to place an element in a storage cabinet in accordance with some embodiments. For purposes of illustration, the flowchart will be described in conjunction with the schematics shown in Figures 1, 2, 4, and 5. Some of the operations described may be replaced or eliminated for different embodiments. Additional components can be added to the storage system 1. Some of the components described may be replaced or eliminated for different embodiments.

方法60開始於操作61,其中,移動二個相鄰的儲存櫃(例如:第一儲存櫃10、第二儲存櫃20),以定義一作業空間於其間。舉例而言,如第1圖所示,第一儲存櫃10以及/或者第二儲存櫃20係沿X軸方向移動,以定義作業空間W於其間。上述作業空間係指第一儲存櫃10與第二儲存櫃20之間存在有一可容置升降平台312進入之間距。 The method 60 begins at operation 61 in which two adjacent storage cabinets (e.g., the first storage cabinet 10, the second storage cabinet 20) are moved to define a work space therebetween. For example, as shown in FIG. 1, the first storage cabinet 10 and/or the second storage cabinet 20 are moved in the X-axis direction to define a work space W therebetween. The above working space means that there is a distance between the first storage cabinet 10 and the second storage cabinet 20 for accommodating the lifting platform 312.

方法60繼續至操作62,移動乘載設備(例如:承載設備30)至上述作業空間W內。在部分實施例中,承載設備30的龍門311係沿X軸方向移動,使升降平台312對齊於作業空間W之上方,如第1圖所示。接著,升降平台312沿Z軸方向下降並進入作業空間W內,如第4圖所示。升降平台312下降之高度係依照所需抓取/放置之元件所在之儲存格之位置而定。 The method 60 continues to operation 62 by moving the ride device (e.g., the carrier device 30) into the workspace W described above. In some embodiments, the gantry 311 of the carrying device 30 is moved in the X-axis direction such that the lifting platform 312 is aligned above the working space W, as shown in FIG. Next, the lifting platform 312 descends in the Z-axis direction and enters the working space W as shown in FIG. The height at which the lifting platform 312 descends is determined by the location of the cell in which the component to be grasped/placed is located.

在部分實施例中,在執行上述下降升降平台312之作業之前或者執行上述下降升降平台312之過程當中,一設置於升降平台312上之偵測器係持續偵測升降平台312下方之既定距離(例如:5公分)內是否存在有障礙物。若偵測有障礙物則停止上述下降升降平台312之操作,以保護升降平台312與 其他元件產生碰撞,或者避免位於升降平台312下方之人員受傷。 In some embodiments, during the execution of the operation of the descending lifting platform 312 or during the execution of the descending lifting platform 312, a detector disposed on the lifting platform 312 continuously detects a predetermined distance below the lifting platform 312 ( For example: 5 cm) Is there an obstacle? If the obstacle is detected, the operation of the descending lifting platform 312 is stopped to protect the lifting platform 312 and Other components create a collision or avoid injury to personnel located below the lifting platform 312.

方法60繼續至操作63,執行一位置校正作業,以校正乘載設備30相對第一、二儲存櫃10、20之位置。在部分實施例中,如第5圖所示,位置校正作業包括以攝影組件351朝一目標儲存格110進行攝影,並將影像回送至控制設備40(第1圖)。控制設備40將接收之影像與一既定影像進行比對,以計算抓取模組33在Y軸方向上以及Z軸方向之位置。根據計算之結果,若抓取模組33在Y軸方向上以及Z軸方向之位置與既定位置相異,則驅動升降平台312移動,以調整升降平台312在Z軸方向之位置,或者驅動抓取模組33移動,以調整抓取模組33在Y軸方向上的位置。 The method 60 continues to operation 63 by performing a position correction operation to correct the position of the ride device 30 relative to the first and second storage cabinets 10, 20. In some embodiments, as shown in FIG. 5, the position correction operation includes photographing the camera unit 351 toward a target cell 110 and returning the image to the control device 40 (FIG. 1). The control device 40 compares the received image with a predetermined image to calculate the position of the grab module 33 in the Y-axis direction and the Z-axis direction. According to the calculation result, if the position of the gripping module 33 in the Y-axis direction and the Z-axis direction is different from the predetermined position, the lifting platform 312 is driven to move to adjust the position of the lifting platform 312 in the Z-axis direction, or to drive the gripping. The module 33 is moved to adjust the position of the gripping module 33 in the Y-axis direction.

另外,位置校正作業更包括以雷射測距組件353偵測目標儲存格110與抓取模組33之間距,並將所偵測之距離回送至控制設備。控制設備40將接收之偵測距離與一既定距離進行比對。若偵測距離相異於既定距離,則驅動龍門311移動以調整龍門311在X軸方向的位置,或者驅動第一儲存櫃10以及/或者第二儲存櫃20移動,以調整第一儲存櫃10以及/或者第二儲存櫃20在X軸方向上的位置。 In addition, the position correction operation further includes detecting the distance between the target cell 110 and the grab module 33 by the laser ranging component 353, and sending the detected distance back to the control device. The control device 40 compares the received detection distance with a predetermined distance. If the detection distance is different from the predetermined distance, the driving gantry 311 moves to adjust the position of the gantry 311 in the X-axis direction, or drives the first storage cabinet 10 and/or the second storage cabinet 20 to move to adjust the first storage cabinet 10 And/or the position of the second storage cabinet 20 in the X-axis direction.

位置校正作業之執行可以在每次升降平台312自作業空間W上方進入作業空間W之後執行一次。或者,位置校正作業可以在升降平台312位於作業空間W內時,週期性的執行。或者,位置校正作業可以在升降平台312位於作業空間W內時,且在抓取/放置一既定數量之元件之後執行。 Execution of the position correction job may be performed once each time the lifting platform 312 enters the work space W from above the work space W. Alternatively, the position correction work may be performed periodically when the lifting platform 312 is located within the working space W. Alternatively, the position correction job may be performed when the lifting platform 312 is located within the working space W and after grabbing/placement of a predetermined number of components.

位置校正作業之執行可避免後續抓取/放置元件時,抓取模組33碰撞第一儲存櫃10或第二儲存櫃20的情況發生,並且可以增加抓取/放置元件之效率。 The execution of the position correction operation can avoid the occurrence of the gripping module 33 colliding with the first storage cabinet 10 or the second storage cabinet 20 when the component is subsequently grasped/placed, and the efficiency of grasping/placement of the components can be increased.

方法60繼續至操作64,對位於第一儲存櫃10或者第二儲存櫃20之位置條碼進行掃描,以確認乘載設備30位於作業位置。舉例而言,如第5圖所示,為了確認乘載設備30之抓取模組33是位於正確的作業位置,位於第一儲存櫃10上對應至儲存格110的位置條碼112是透過條碼掃描組件355進行掃描。條碼掃描組件355將掃描結果回送至控制設備40(第1圖),且控制設備40將接收之掃描結果與一資料進行比對。若兩者相符,則判斷抓取模組33到達正確的作業位置。反之,若兩者相異,判斷抓取模組33到達錯誤的作業位置。透過此步驟可避免元件放置於錯誤的儲存格當中。 The method 60 continues to operation 64 by scanning a location bar code located at the first storage cabinet 10 or the second storage cabinet 20 to confirm that the ride device 30 is in the work position. For example, as shown in FIG. 5, in order to confirm that the gripping module 33 of the carrying device 30 is located at the correct working position, the position bar code 112 corresponding to the storage cell 110 on the first storage cabinet 10 is scanned by the bar code. Component 355 scans. The barcode scanning component 355 sends the scan result back to the control device 40 (Fig. 1), and the control device 40 compares the received scan result with a data. If the two match, it is judged that the capture module 33 reaches the correct working position. On the other hand, if the two are different, it is judged that the capture module 33 reaches the wrong work position. This step prevents components from being placed in the wrong cell.

方法60繼續至操作65,對位於第一儲存櫃10或者第二儲存櫃20上的儲存格進行掃描,以確認儲存格是否淨空。舉例而言,條碼掃描組件355係針對目標儲存格110進行掃描。若目標儲存格內放置有元件,則放置於目標儲存格內的元件的辨別條碼將被條碼掃描組件355所偵測。此時,條碼掃描組件355將掃描結果回送至控制設備40。控制設備40停止放置元件的動作,以避免元件碰撞。在部分實施例中,省略操作65。在元建設置於儲存格110之後,控制設備40即已記錄儲存格110內是否有放置元件50。在完成操作64之後,產生重複元件於單一儲存格的問題不致發生。 The method 60 continues to operation 65 by scanning a cell located on the first storage bin 10 or the second storage bin 20 to confirm whether the cell is empty. For example, barcode scanning component 355 scans for target cell 110. If a component is placed in the target cell, the identification bar code of the component placed in the target cell will be detected by the bar code scanning component 355. At this time, the barcode scanning component 355 sends back the scan result to the control device 40. The control device 40 stops the action of placing the components to avoid component collisions. In some embodiments, operation 65 is omitted. After the meta-construction is placed in the cell 110, the control device 40 has recorded whether there is a placement component 50 within the cell 110. After completing operation 64, the problem of generating duplicate elements in a single cell does not occur.

方法60繼續至操作66,放置元件50至儲存格110 中。在部分實施例中,在元件50被抓取組件332抓取前是擺放於容置槽315當中。接著,抓取組件332自容置槽315抓取元件50並將元件50放置在目標儲存格110內。藉由儲存槽315的設置,乘載設備30可以將多個元件50一次地移入至作業空間W當中,並待所有元件50都放置於第一儲存櫃10以及/或者第二儲存櫃20之後,再自作業空間W移出。於是,放置元件50的效率可以獲得提昇。 The method 60 continues to operation 66 by placing the component 50 to the cell 110 in. In some embodiments, the component 50 is placed in the receiving slot 315 before being grasped by the gripping assembly 332. Next, the gripping assembly 332 grips the component 50 from the receiving slot 315 and places the component 50 within the target cell 110. By the arrangement of the storage tank 315, the loading device 30 can move the plurality of components 50 into the working space W at a time, and after all the components 50 are placed behind the first storage cabinet 10 and/or the second storage cabinet 20, Then it is removed from the work space W. Thus, the efficiency of placing the component 50 can be improved.

第6圖是根據部分實施例顯示控制倉儲系統1以自儲存櫃抓取一元件的方法70流程圖。為了說明,該流程圖將與第1、2、4、5圖中所示的示意圖一起描述。對於不同的實施例,可以替換或消除描述的一些操作。可以將額外的部件添加到倉儲系統1。對於不同的實施例,可以替換或消除描述的一些部件。 Figure 6 is a flow chart showing a method 70 of controlling the storage system 1 to grab a component from a storage cabinet in accordance with some embodiments. For purposes of illustration, the flowchart will be described in conjunction with the schematics shown in Figures 1, 2, 4, and 5. Some of the operations described may be replaced or eliminated for different embodiments. Additional components can be added to the storage system 1. Some of the components described may be replaced or eliminated for different embodiments.

在方法70中,操作71-74相似於方法60之操作61-64,為了簡化內容,操作71-74省略說明。 In method 70, operations 71-74 are similar to operations 61-64 of method 60, and operations 71-74 are omitted for simplicity of the description.

方法70之操作75接續於操作74之後。在操作75當中,對位於第一儲存櫃10或第二儲存櫃20的元件50的辨識條碼進行掃描,以確認目標儲存格內的元件50為待抓取之目標元件。在部分實施例中,條碼掃描組件355係針對單一儲存格110進行掃描,在偵測元件50之辨識條碼後,條碼掃描組件355將掃描結果回送至控制設備40。控制設備40將所偵測之條碼與資料進行比對,若兩者相符,則判斷儲存格內的元件50為待抓取之目標元件。反之,若兩者相異,則判斷儲存格內的元件50並非待抓取之目標元件。在部分實施例中,省略操作75。元件50 的條碼資訊以及元件50所放置的儲存格110的條碼資訊,在元件50置入儲存格110當下即已透過控制設備40進行記錄。在完成操作74之後,抓取錯誤元件之情況將不致發生。 Operation 75 of method 70 continues after operation 74. In operation 75, the identification bar code of the component 50 located in the first storage cabinet 10 or the second storage cabinet 20 is scanned to confirm that the component 50 in the target storage cell is the target component to be captured. In some embodiments, the barcode scanning component 355 scans for a single cell 110. After the barcode is detected by the component 50, the barcode scanning component 355 sends the scan result back to the control device 40. The control device 40 compares the detected barcode with the data. If the two match, it is determined that the component 50 in the storage cell is the target component to be captured. Conversely, if the two are different, it is determined that the component 50 in the cell is not the target component to be captured. In some embodiments, operation 75 is omitted. Element 50 The bar code information and the bar code information of the cell 110 placed on the component 50 are recorded by the control device 40 when the component 50 is placed in the cell 110. After the operation 74 is completed, the capture of the wrong component will not occur.

方法70繼續至操作76,抓取儲存格110內之元件50。在部分實施例中,在元件50自儲存格110移出後是先放置在容置槽315當中。當所有待抓取之元件50皆放置於容置槽315內之後,乘載設備30再一次性地將所有元件50自作業空間W移出。於是,抓取元件50的效率可以獲得提昇。 The method 70 continues to operation 76 by grabbing the component 50 within the cell 110. In some embodiments, the component 50 is placed in the receiving slot 315 after being removed from the cell 110. After all the components 50 to be grasped are placed in the accommodating groove 315, the loading device 30 removes all the components 50 from the work space W at one time. Thus, the efficiency of the gripping element 50 can be improved.

在部分實施例中,抓取或放置元件50之作業係在乘載設備30進入作業空間W後一次性執行。倉儲系統1之控制方法並不限制於上述方法60或70。 In some embodiments, the operation of grasping or placing the component 50 is performed once after the loading device 30 enters the workspace W. The control method of the storage system 1 is not limited to the above method 60 or 70.

多種倉儲系統及其控制方法的實施例揭露如上,倉儲系統中承載設備可選擇性進入位於二個相鄰儲藏櫃之間的作業空間,以抓取或放置元件至儲藏櫃。透過執行位置校正作業,承載設備與儲藏櫃間的相對位置可以獲得確認,減少裝置間因對位失準所產生之碰撞。另外,倉儲系統透過在儲藏櫃以及元件上設置條碼進行管理,有效增加元件移動之正確性及效率。上述倉儲系統具有自動對位校正及移動之技術,由於不需人力參與,於是大幅降低人力成本並避免人為因素所產生之失誤。 Embodiments of various warehousing systems and methods of controlling the same are disclosed above. In the warehousing system, the carrying device can selectively enter a work space between two adjacent storage cabinets to grab or place components to the storage cabinet. By performing the position correction operation, the relative position between the carrying device and the storage cabinet can be confirmed, and the collision between the devices due to misalignment is reduced. In addition, the storage system manages the bar code on the storage cabinet and components to effectively increase the correctness and efficiency of component movement. The above-mentioned storage system has the technology of automatic alignment correction and movement. Since no human intervention is required, the labor cost is greatly reduced and the mistakes caused by human factors are avoided.

以上雖然詳細描述了實施例及它們的優勢,但應該理解,在不背離所附申請專利範圍限定的本揭露的精神和範圍的情況下,對本揭露可作出各種變化、替代和修改。此外,本申請的範圍不旨在限制於說明書中所述的製程、機器、製 造、物質組成、工具、方法和步驟的特定實施例。作為本領域的普通技術人員將容易地從本揭露中理解,根據本揭露,可以利用現有的或今後將被開發的、執行與在本揭露所述的對應實施例基本相同的功能或實現基本相同的結果的製程、機器、製造、物質組成、工具、方法或步驟。因此,所附申請專利範圍旨在將這些製程、機器、製造、物質組成、工具、方法或步驟包括它們的範圍內。此外,每一個申請專利範圍構成一個單獨的實施例,且不同申請專利範圍和實施例的組合都在本揭露的範圍內。 The embodiments and their advantages are described in detail above, and it is understood that various changes, substitutions and modifications may be made in the present disclosure without departing from the spirit and scope of the disclosure. Moreover, the scope of the present application is not intended to be limited to the processes, machines, and systems described in the specification. Specific embodiments of construction, material composition, tools, methods, and procedures. It will be readily apparent to those skilled in the art from this disclosure that, in accordance with the present disclosure, substantially the same functions or implementations as those of the corresponding embodiments described herein may be utilized. The resulting process, machine, manufacturing, material composition, tool, method or procedure. Therefore, the scope of the appended claims is intended to cover such processes, machines, manufacture, compositions of matter, tools, methods or steps. In addition, each patent application scope constitutes a separate embodiment, and combinations of different application patent scopes and embodiments are within the scope of the disclosure.

1‧‧‧倉儲系統 1‧‧ ‧ warehousing system

10‧‧‧第一儲存櫃 10‧‧‧First storage cabinet

110‧‧‧儲存格 110‧‧‧ cells

20‧‧‧第二儲存櫃 20‧‧‧Second storage cabinet

210‧‧‧儲存格 210‧‧‧ cells

30‧‧‧乘載設備 30‧‧‧Loading equipment

31‧‧‧移動模組 31‧‧‧Mobile Module

311‧‧‧龍門 311‧‧‧Longmen

312‧‧‧升降平台 312‧‧‧ Lifting platform

313‧‧‧平台本體 313‧‧‧ platform ontology

314‧‧‧軌道 314‧‧‧ Track

315‧‧‧容置槽 315‧‧‧ accommodating slots

33‧‧‧抓取模組 33‧‧‧Grab module

40‧‧‧控制設備 40‧‧‧Control equipment

50‧‧‧元件 50‧‧‧ components

S1‧‧‧箭頭 S1‧‧‧ arrow

S2‧‧‧箭頭 S2‧‧‧ arrow

S3‧‧‧箭頭 S3‧‧‧ arrow

W‧‧‧作業空間 W‧‧‧Workspace

Claims (10)

一種倉儲系統,包括:一第一儲存櫃;一第二儲存櫃,其中該第一儲存櫃與該第二儲存櫃係以可沿一X軸方向移動的方式設置,且各自配置用於儲存至少一元件;一移動模組,以可沿該X軸方向移動的方式設置,且包括一可沿一Z軸方向移動之升降平台,以設置於該第一儲存櫃與該第二儲存櫃之間;一抓取模組,設置於該升降平台,且包括至少一個用於抓取該元件之抓取組件;一定位模組,設置於該升降平台,並配置用於偵測該抓取模組相對該第一儲存櫃或該第二儲存櫃之位置;以及一控制設備,配置用於根據來自該定位模組之偵測訊號調整該第一儲存櫃、該第二儲存櫃、該移動模組、或該抓取模組之作動。 A storage system includes: a first storage cabinet; a second storage cabinet, wherein the first storage cabinet and the second storage cabinet are arranged to be movable along an X-axis direction, and each configured to store at least a moving module disposed in the X-axis direction and including a lifting platform movable along a Z-axis direction to be disposed between the first storage cabinet and the second storage cabinet a grabbing module disposed on the lifting platform and including at least one gripping component for gripping the component; a positioning module disposed on the lifting platform and configured to detect the grabbing module The first storage cabinet, the second storage cabinet, and the mobile module are configured to adjust the first storage cabinet, the second storage cabinet, and the mobile module according to the detection signal from the positioning module. Or the action of the capture module. 如申請專利範圍第1項所述之倉儲系統,其中該定位模組包括:一攝影組件,配置用於拍攝該第一儲存櫃或該第二儲存櫃之一影像;以及一雷射測距組件,配置用於偵測該抓取模組與該第一儲存櫃或該第二儲存櫃之距離;其中該控制設備根據所獲得之該影像與所偵測之該距離執行該抓取模組之定位。 The warehousing system of claim 1, wherein the positioning module comprises: a photographic component configured to capture an image of the first storage cabinet or the second storage cabinet; and a laser ranging component Configuring a distance between the capture module and the first storage cabinet or the second storage cabinet; wherein the control device executes the capture module according to the obtained image and the detected distance Positioning. 如申請專利範圍第1項所述之倉儲系統,其中該定位模組包括一條碼掃描組件,配置用於讀取位於該第一儲存櫃或該第二儲存櫃之一位置條碼,或者用於讀取位於該元件之一辨別條碼。 The storage system of claim 1, wherein the positioning module comprises a code scanning component configured to read a bar code located at a position of the first storage cabinet or the second storage cabinet, or for reading Take one of the components to identify the barcode. 如申請專利範圍第1項所述之倉儲系統,其中該移動模組包括:一升降平台,其中該抓取模組以可沿一Y軸方向移動的方式設置於該升降平台;以及一容置槽,設置於該升降平台,並用於放置該元件。 The storage system of claim 1, wherein the mobile module comprises: a lifting platform, wherein the capturing module is disposed on the lifting platform in a manner movable in a Y-axis direction; and an accommodation a slot is provided on the lifting platform and is used to place the component. 如申請專利範圍第1項所述之倉儲系統,其中該抓取組件包括:二個相對設置之桿件;以及一第一夾持件與一第二夾持件,分別設置於該二個桿件,並共同用於夾持該元件,其中該第二夾持件相對該桿件之角度係根據該元件之擺放角度而決定。 The storage system of claim 1, wherein the gripping assembly comprises: two oppositely disposed rod members; and a first clamping member and a second clamping member respectively disposed on the two rods And jointly used to clamp the component, wherein the angle of the second clamping member relative to the lever is determined according to the angle at which the component is placed. 一種倉儲系統控制方法,包括:移動一第一儲存櫃與一第二儲存櫃;移動一乘載設備至定義於該第一儲存櫃與該第二儲存櫃之間的一作業空間;執行一位置校正作業;掃描位於該第一儲存櫃或該第二儲存櫃之一位置條碼;以及自該第一儲存櫃或該第二儲存櫃抓取一元件,或放置一元件至該第一儲存櫃或該第二儲存櫃。 A storage system control method includes: moving a first storage cabinet and a second storage cabinet; moving a loading device to a working space defined between the first storage cabinet and the second storage cabinet; performing a position Correcting a job; scanning a bar code at a location of the first storage bin or the second storage bin; and grabbing a component from the first storage bin or the second storage bin, or placing a component to the first storage bin or The second storage cabinet. 如申請專利範圍第6項所述之方法,其中在放置該元件至該第一儲存櫃或該第二儲存櫃之前,更包括針對該第一儲存櫃或該第二儲存櫃進行掃描,以確認該第一儲存櫃或該第二儲存櫃上之相對位置是否淨空。 The method of claim 6, wherein before the component is placed in the first storage cabinet or the second storage cabinet, scanning is further performed on the first storage cabinet or the second storage cabinet to confirm Whether the relative position on the first storage cabinet or the second storage cabinet is empty. 如申請專利範圍第6項所述之方法,更包括:透過該乘載設備的一抓取模組抓取或放置該元件;以及在該作業空間中,沿一Y軸方向或沿一Z軸方向移動該抓取模組,其中在該抓取模組沿該Z軸方向移動前,偵測該抓取模組之下方一既定距離是否淨空,若有一阻礙物存在則停止沿該Z軸方向之移動。 The method of claim 6, further comprising: grasping or placing the component through a grabbing module of the carrying device; and in the working space, along a Y-axis direction or along a Z-axis Moving the grabbing module in a direction, wherein before the grabbing module moves along the Z-axis direction, detecting whether a predetermined distance below the grabbing module is clear, and if there is an obstruction, stopping along the Z-axis direction Move. 如申請專利範圍第6項所述之方法,其中在放置該元件至該第一儲存櫃或該第二儲存櫃之前,以及在自該第一儲存櫃或該第二儲存櫃抓取該元件之後,該元件係放置於該乘載設備位於該作業空間內的一容置槽中。 The method of claim 6, wherein the component is placed before the first storage cabinet or the second storage cabinet, and after the component is grasped from the first storage cabinet or the second storage cabinet The component is placed in a receiving slot of the carrying device in the working space. 如申請專利範圍第6項所述之方法,其中該位置校正作業包括根據一影像以及該乘載設備與該第一儲存櫃或該第二儲存櫃間的一偵測距離,對該第一儲存櫃、該第二儲存櫃、或該乘載設備之位置進行調整。 The method of claim 6, wherein the position correction operation comprises the first storage according to an image and a detection distance between the loading device and the first storage cabinet or the second storage cabinet The position of the cabinet, the second storage cabinet, or the carrying device is adjusted.
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