TW201741057A - Laser cutting processing method and laser cutting processing apparatus for plated steel sheet - Google Patents

Laser cutting processing method and laser cutting processing apparatus for plated steel sheet Download PDF

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TW201741057A
TW201741057A TW106116112A TW106116112A TW201741057A TW 201741057 A TW201741057 A TW 201741057A TW 106116112 A TW106116112 A TW 106116112A TW 106116112 A TW106116112 A TW 106116112A TW 201741057 A TW201741057 A TW 201741057A
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laser
steel sheet
plated steel
laser cutting
cutting processing
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TW106116112A
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TWI630051B (en
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原英夫
伊藤雅仁
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天田控股股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting

Abstract

Provided is a laser cutting processing method for plated steel sheet, wherein the method generates plasma on the top surface of the laser cutting processing position of plated steel sheet to perform laser cutting processing when causing a part of plating material that is melted and/or evaporated by irradiation of laser light LB, to the cutting surface of the plated steel sheet W by assist gas ejected to laser processing portion, to coat the cutting surface with the plating material during performing lase cutting processing by irradiating laser light LB on the top surface of the plated steel sheet W.

Description

鍍覆鋼板之雷射切斷加工方法及雷射切斷加工裝置 Laser cutting processing method for plated steel plate and laser cutting processing device

本發明有關鍍覆鋼板之雷射切斷加工方法及雷射切斷加工裝置,詳言之,有關實施鍍覆鋼板之雷射切斷加工時,將因雷射光之照射而被熔融及/或蒸發之表面的鍍覆之一部分,藉由輔助氣體而往切斷面流動(引導),並藉由被熔融及/或蒸發之鍍覆金屬被覆切斷面時,產生電漿以進行雷射切斷加工之雷射切斷加工方法及雷射切斷加工裝置。 The laser cutting processing method and the laser cutting processing device for a plated steel sheet according to the present invention, in detail, when laser cutting processing for a plated steel sheet is performed, it is melted by irradiation of laser light and/or One part of the plating of the evaporated surface flows (guides) to the cut surface by the assist gas, and when the cut surface is covered by the molten metal which is melted and/or evaporated, plasma is generated to perform laser cutting Laser cutting processing method and laser cutting processing device for cutting processing.

以往,實施鍍覆鋼板等的工件之切斷加工之時,在去除工件表面的鍍覆之後再實施工件之雷射切斷加工(例如,參照專利文獻1)。 In the past, when a workpiece such as a plated steel sheet is cut, the laser cutting of the workpiece is performed after the surface of the workpiece is removed (see, for example, Patent Document 1).

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平7-236984號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 7-236984

若依據前述專利文獻1所記載之構成,因去除工件表面之鍍覆後實施雷射切斷加工之後,在欲提升工件的雷射切斷加工之效率上會有問題。又,若依據專利文獻1所記載之構成,由於經實施雷射切斷之切斷面係無被覆鍍覆之面,故有必須使用例如防鏽處理等適當的表面處理的問題。 According to the configuration described in the above Patent Document 1, after the laser cutting process is performed after the plating of the workpiece surface is removed, there is a problem in the efficiency of the laser cutting process for lifting the workpiece. Further, according to the configuration described in Patent Document 1, since the cut surface subjected to the laser cutting has no surface to be coated with plating, it is necessary to use a problem of appropriate surface treatment such as rustproof treatment.

本發明有鑑於如前述般之問題而成者,係一種鍍覆鋼板之雷射切斷加工方法,其為對鍍覆鋼板的上面照射雷射光以實施雷射切斷加工時,將因雷射光之照射而被熔融及/或蒸發之表面的鍍覆金屬之一部分,藉由對雷射加工部所噴出之輔助氣體,而往前述鍍覆鋼板的切斷面側引導,並於前述切斷面被覆鍍覆金屬時,使在前述鍍覆鋼板之雷射切斷加工部位之上面產生電漿以實施雷射切斷加工。 The present invention has been made in view of the above problems, and is a laser cutting processing method for a plated steel sheet, which is a laser beam when a laser beam is irradiated onto a surface of a plated steel sheet to perform laser cutting processing. One part of the plated metal on the surface that is melted and/or evaporated by irradiation is guided to the cut surface side of the plated steel sheet by the auxiliary gas sprayed from the laser processed portion, and is cut on the cut surface When the metal plating is applied, plasma is generated on the upper surface of the laser cutting portion of the plated steel sheet to perform laser cutting processing.

又,於前述鍍覆鋼板之雷射切斷加工方法中,於因對前述鍍覆鋼板之上面之雷射光之照射而被加熱蒸發之鍍覆的蒸氣內照射雷射光以產生電漿。 Further, in the laser cutting method of the plated steel sheet, the laser beam is irradiated with the laser light which is heated and evaporated by the irradiation of the laser light on the upper surface of the plated steel sheet to generate plasma.

又,於前述鍍覆鋼板之雷射切斷加工方法中,雷射光之焦點位置係在+0.5mm至-4.5mm之範圍內進行調節。 Further, in the laser cutting method of the plated steel sheet, the focus position of the laser light is adjusted within a range of +0.5 mm to -4.5 mm.

又,於前述鍍覆鋼板之雷射切斷加工方法中,將於雷射加工頭之噴嘴與鍍覆鋼板上面之間的噴嘴間隙在0.3mm至1.0mm之範圍內進行調節,且將輔助氣體壓力在0.5MPa至1.2MPa之範圍內進行調節。 Moreover, in the laser cutting processing method of the plated steel sheet, the nozzle gap between the nozzle of the laser processing head and the upper surface of the plated steel sheet is adjusted within a range of 0.3 mm to 1.0 mm, and the auxiliary gas is used. The pressure is adjusted in the range of 0.5 MPa to 1.2 MPa.

又,於前述鍍覆鋼板之雷射切斷加工方法中,將雷射切斷加工速度在1000mm/min至5000mm/min之範圍內進行調節。 Further, in the laser cutting processing method for the plated steel sheet, the laser cutting processing speed is adjusted in the range of 1000 mm/min to 5000 mm/min.

又,於前述鍍覆鋼板之雷射切斷加工方法中,噴出輔助氣體之噴嘴的口徑為2.0mm至7.0mm。 Further, in the laser cutting method of the plated steel sheet, the nozzle for discharging the assist gas has a diameter of 2.0 mm to 7.0 mm.

又,本發明之雷射切割加工裝置,其具備:支撐板狀的工件之工件工件台、對前述工件可朝X、Y、Z軸方向相對地自由決定移動位置之雷射加工頭、及用以控制前述雷射加工頭的動作之控制裝置; 前述控制裝置具備按每一種鍍覆鋼板的板厚及鍍覆厚度儲存有雷射切斷加工條件之切斷條件資料表,該雷射切斷加工條件係在對前述工件工作台上的鍍覆鋼板照射雷射光以實施雷射切斷時,用以將因雷射光之照射而被熔融及/或蒸發之鍍覆金屬之一部分,藉由對前述雷射加工部所噴出之輔助氣體而往鋼板的切斷面側引導,並使鍍覆金屬被覆於前述切斷面。 Further, the laser cutting apparatus of the present invention includes: a workpiece workpiece stage that supports a plate-shaped workpiece; and a laser processing head that can relatively freely determine a moving position in the X, Y, and Z axis directions of the workpiece; a control device for controlling the action of the aforementioned laser processing head; The control device includes a cutting condition data table in which a laser cutting processing condition is stored for each of the plated steel sheets and a plating thickness, and the laser cutting processing conditions are performed on the workpiece table. When the steel sheet is irradiated with laser light to perform laser cutting, one part of the plated metal to be melted and/or evaporated by the irradiation of the laser light is applied to the steel sheet by the auxiliary gas sprayed from the laser processing unit. The cut surface side is guided, and the plated metal is coated on the cut surface.

1‧‧‧雷射切斷加工裝置 1‧‧‧Laser cutting and processing device

3‧‧‧工件工作台 3‧‧‧Working table

5‧‧‧雷射加工頭 5‧‧‧Laser processing head

7‧‧‧定位馬達 7‧‧‧ Positioning motor

9‧‧‧Z軸馬達 9‧‧‧Z-axis motor

11‧‧‧雷射振盪器 11‧‧‧Laser oscillator

13‧‧‧反射鏡 13‧‧‧Mirror

15‧‧‧聚光透鏡 15‧‧‧ Concentrating lens

17‧‧‧光學裝置 17‧‧‧Optical device

19‧‧‧噴嘴 19‧‧‧ nozzle

21‧‧‧輔助氣體供給裝置 21‧‧‧Auxiliary gas supply device

23‧‧‧氮氣供給裝置 23‧‧‧Nitrogen supply device

25‧‧‧氧氣供給裝置 25‧‧‧Oxygen supply device

27‧‧‧混合器 27‧‧‧ Mixer

29‧‧‧壓力調節閥 29‧‧‧Pressure regulator

31‧‧‧控制裝置 31‧‧‧Control device

33‧‧‧切斷條件資料表 33‧‧‧Several Conditions Data Sheet

35‧‧‧輸入手段 35‧‧‧ Input means

W‧‧‧鍍覆鋼板 W‧‧‧ plated steel

LB‧‧‧照射雷射光 LB‧‧‧illuminated laser light

M‧‧‧鍍覆層 M‧‧‧ plating layer

第1圖係將有關本發明之實施狀態之雷射切斷加工裝置之構成概念性、概略性地表示之構成說明圖。 Fig. 1 is a schematic explanatory view showing the configuration of a laser cutting apparatus according to an embodiment of the present invention in a conceptual and schematic manner.

第2圖係於氧氣切斷、乾淨(clean)切斷、簡易切斷時之切斷面的EMPA分析結果。 Fig. 2 is a result of EMPA analysis of the cut surface at the time of oxygen cutting, clean cutting, and simple cutting.

第3圖(A)至(C)係表示於乾淨切斷、氧氣切斷以及簡易切斷時之切斷面的放大照片。 Fig. 3 (A) to (C) show enlarged photographs of the cut surface at the time of clean cutting, oxygen cutting, and simple cutting.

第4圖係表示於改變雷射切斷加工條件時之往切面之含有鍍覆層的金屬之被覆狀態之放大照片。 Fig. 4 is an enlarged photograph showing the state of coating of the metal containing the plating layer on the cut surface when the laser cutting processing conditions are changed.

第5圖係表示於改變雷射切斷加工條件時之往切斷面之含有鍍覆層的金屬之被覆態之放大照片。 Fig. 5 is an enlarged photograph showing the state of the coating of the metal containing the plating layer on the cut surface when the laser cutting processing conditions are changed.

第6圖係表示於改變雷射切斷加工條件時之往切斷面之含有鍍覆層的金屬之被覆狀態之放大照片。 Fig. 6 is an enlarged photograph showing the state of coating of the metal containing the plating layer on the cut surface when the laser cutting processing conditions are changed.

第7圖係表示於改變雷射切斷加工條件時之往切斷面之含有鍍覆層的金屬之被覆狀態之放大照片。 Fig. 7 is an enlarged photograph showing the state of coating of the metal containing the plating layer on the cut surface when the laser cutting processing conditions are changed.

第8圖係表示電漿之產生狀態之照片。 Fig. 8 is a photograph showing the state of generation of plasma.

第9圖係表示切斷面之耐蝕性評估結果之放大照片。 Fig. 9 is an enlarged photograph showing the results of evaluation of the corrosion resistance of the cut surface.

第10圖(A)至(C)係表示於電漿發生及曝露試驗時之評估結果之說明圖及照片。 Fig. 10 (A) to (C) are explanatory diagrams and photographs showing the evaluation results at the time of plasma generation and exposure test.

第11圖(A)至(C)係表示於電漿發生及曝露試驗時之評估結果之說明圖及照片。 Fig. 11 (A) to (C) are explanatory diagrams and photographs showing the evaluation results at the time of plasma generation and exposure test.

第12圖(A)至(C)係表示於電漿發生及曝露試驗時之評估結果之說明圖及照片。 Fig. 12 (A) to (C) are explanatory diagrams and photographs showing the evaluation results at the time of plasma generation and exposure test.

第13圖(A)至(C)係表示於電漿發生及曝露試驗時之評估結果之說明圖及照片。 Fig. 13 (A) to (C) are explanatory diagrams and photographs showing the evaluation results at the time of plasma generation and exposure test.

第14圖(A)至(C)係表示於電漿發生及曝露試驗時之評估結果之說明圖及照片。 Fig. 14 (A) to (C) are explanatory diagrams and photographs showing the evaluation results at the time of plasma generation and exposure test.

第15圖(A)至(C)係表示於電漿發生及曝露試驗時之評估結果之說明圖及照片。 Fig. 15 (A) to (C) are explanatory diagrams and photographs showing the evaluation results at the time of plasma generation and exposure test.

第16圖(A)至(D)係表示於電漿發生及曝露試驗時之評估結果之說明圖及照片。 Fig. 16 (A) to (D) are explanatory diagrams and photographs showing the evaluation results at the time of plasma generation and exposure test.

第17圖(A)至(C)係表示於電漿發生及曝露試驗時之評估結果之說明圖及照片。 Fig. 17 (A) to (C) are explanatory diagrams and photographs showing the evaluation results at the time of plasma generation and exposure test.

第18圖係表示於乾淨切斷及簡易切斷時之電漿發生與於曝露試驗中之鐵鏽發生之間的關係之說明圖。 Fig. 18 is an explanatory view showing the relationship between the occurrence of plasma at the time of clean cutting and simple cutting and the occurrence of rust in the exposure test.

第19圖係表示因加工速度之差異所引起之EDS分析結果及鐵鏽發生之差異之照片。 Fig. 19 is a photograph showing the difference between the EDS analysis result and the occurrence of rust caused by the difference in processing speed.

以下,採用圖面說明實施本發明之實施形態。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

第1圖,係將有關本發明之實施形態之雷射切斷加工裝置之構成概念性、概略性地表示之構成說明圖。 In the first embodiment, a configuration of a laser cutting apparatus according to an embodiment of the present invention is conceptually and conceptually shown.

參照第1圖時,有關本發明之實施形態之雷射切斷加工裝置1,係具備支撐板狀的工件W之工件工作台3之同時,具備有用以對前述工件W照射雷射光LB以實施工件W之雷射切斷加工之雷射加工頭5。前述工件工作台3係對前述雷射加工頭5相對性地朝X、Y軸方向自由移動地具備,並具備有用以將此工件工作台3相對性地朝X、Y軸方向進行移動定位之伺服馬達等般之定位馬達7。再者,具備有將前述雷射加工頭5對前述工件W相對性地朝接近離開之方向(Z軸方向)進行移動定位之Z軸馬達9。 Referring to Fig. 1, a laser cutting apparatus 1 according to an embodiment of the present invention is provided with a workpiece table 3 that supports a plate-shaped workpiece W, and is provided to irradiate the workpiece W with laser light LB. The laser processing head 5 of the laser cutting process of the workpiece W. The workpiece table 3 is provided to the laser processing head 5 so as to be relatively movable in the X and Y axis directions, and is provided to move the workpiece table 3 relative to each other in the X and Y axis directions. A positioning motor 7 like a servo motor. Further, a Z-axis motor 9 that moves and positions the laser processing head 5 in a direction in which the workpiece W is relatively moved away from the direction (Z-axis direction) is provided.

又,於前述雷射切斷加工裝置1中,具備有例如纖維雷射振盪器、CO2雷射振盪器等的雷射振盪器11。並且,於前述加工頭5中,具備從前述雷射振盪器11 所振盪之雷射光LB往前述工件W方向反射之反射鏡13,或實施雷射光LB之聚光之聚光透鏡15等的光學裝置17。又,於前述雷射加工頭5中,可裝卸交換地具備往前述工件W的雷射W的雷射切斷裝置噴出輔助氣體之噴嘴19。 Further, the laser cutting apparatus 1 includes a laser oscillator 11 such as a fiber laser oscillator or a CO 2 laser oscillator. Further, the processing head 5 includes an optical mirror 13 that reflects the laser beam LB oscillated by the laser oscillator 11 in the direction of the workpiece W, or an optical lens that condenses the laser beam LB. Device 17. Further, in the laser processing head 5, the nozzle 19 for discharging the assist gas by the laser cutting device having the laser beam W to the workpiece W is detachably exchangeable.

另一方面,就往雷射切斷加工部位噴出輔助氣體之構成而言,亦能作成為於雷射加工頭5上具備側噴嘴,並從此側噴嘴將輔助氣體朝向雷射加工部噴出之構成。 On the other hand, in the configuration in which the auxiliary gas is ejected to the laser cutting processing portion, the laser processing head 5 may be provided with a side nozzle, and the auxiliary gas may be ejected toward the laser processing unit from the side nozzle. .

再者,於前述雷射切斷加工裝置1中,具備輔助氣體供給裝置21。於此輔助氣體供給裝置21係供給例如氮氣約97%、氧氣約3%之混合氣體者,具備氮氣供給裝置23、氧氣供給源(空氣供給源)25以及生成混合氣體之混合器27。再者,於前述輔助氣體供給裝置21中,具備用以調節對前述雷射加工頭5供給輔助氣體之壓力的壓力調節閥29。又,使輔助氣體供給裝置21之氧氣供給源25停止,並僅使氮氣供給裝置23運轉時,則可對加工部供給作為僅氮氣之輔助氣體。 Further, the laser cutting apparatus 1 includes an assist gas supply device 21. The auxiliary gas supply device 21 supplies a mixed gas of, for example, about 97% of nitrogen gas and about 3% of oxygen, and includes a nitrogen gas supply device 23, an oxygen supply source (air supply source) 25, and a mixer 27 that generates a mixed gas. Further, the assist gas supply device 21 is provided with a pressure regulating valve 29 for adjusting the pressure of supplying the assist gas to the laser processing head 5. Further, when the oxygen supply source 25 of the assist gas supply device 21 is stopped and only the nitrogen gas supply device 23 is operated, the auxiliary gas which is only nitrogen gas can be supplied to the processing portion.

就以氮氣約97%、氧氣約3%之混合氣體作為輔助氣體而對雷射加工部供給之構成而言,不限於前述之構成,亦能作為另外之構成。亦即,例如專利第3291125號公報所記載般,亦能藉由利用中空絲膜之分離裝置,而將所供給之壓縮空氣中的氮氣及氧氣分離。又,將氮氣約97%(96%以上)、氧氣約3%(4%以下)之混合氣體使用為輔助氣體的雷射切斷加工之情形,以下,僅稱為簡易切斷。 The configuration in which the mixed gas having a nitrogen gas content of about 97% and an oxygen gas of about 3% is supplied as an assist gas to the laser processing unit is not limited to the above configuration, and may be configured separately. That is, for example, as described in Japanese Patent No. 3291125, nitrogen gas and oxygen gas in the supplied compressed air can be separated by the separation device of the hollow fiber membrane. Further, a mixed gas of about 97% (96% or more) of nitrogen gas and about 3% (4% or less of oxygen) is used as a laser cutting process for the assist gas, and hereinafter simply referred to as simple cutting.

又,於前述雷射切斷加工裝置1中,具備控制裝置31。該控制裝置31係由電腦所構成,而具有:實施對前述工件W之前述雷射加工頭5之相對性的移動定位之控制之功能、控制於前述雷射振盪器11中之雷射輸出之控制及對前述雷射加工頭5之輔助氣體之供給壓力之功能者。 Moreover, the laser cutting apparatus 1 is provided with the control apparatus 31. The control device 31 is constituted by a computer, and has a function of controlling the relative movement of the laser processing head 5 of the workpiece W, and a laser output controlled by the laser oscillator 11. The function of controlling and supplying pressure to the assist gas of the aforementioned laser processing head 5.

藉由前述構成,於工件台3上將工件W載置定位後,對工件W而將雷射加工頭5朝X、Y、Z軸方向進行相對性移動定位。又,從雷射振盪器11所振盪之雷射光LB,藉由聚光透鏡15進行聚光而照射至工件W。再者,將從輔助氣體供給裝置21對雷射加工頭15所供給之輔助氣體從噴嘴19往工件W的雷射加工部噴出,藉此實施工件W的雷射切斷加工。 According to the above configuration, after the workpiece W is placed on the workpiece table 3, the laser processing head 5 is relatively moved and positioned in the X, Y, and Z-axis directions with respect to the workpiece W. Further, the laser beam LB oscillated from the laser oscillator 11 is condensed by the condensing lens 15 to be irradiated onto the workpiece W. Further, the auxiliary gas supplied from the assist gas supply device 21 to the laser processing head 15 is ejected from the nozzle 19 to the laser processing portion of the workpiece W, whereby the laser cutting process of the workpiece W is performed.

如上述,實施工件W的雷射切斷加工時,前述工件W為鍍覆鋼板之情形,如前述專利文獻1的第21圖所記載般,有時鍍覆層的蒸發物質侵入於加工範圍,而於加工品質產生缺陷。因此,於前述專利文獻1之記載中,如專利文獻1的第1圖所示般,對鍍覆鋼板之表面照射雷射光以預先去除鍍覆層。然後,其次實施相同軌跡的雷射切斷加工者。 In the case of performing the laser cutting process of the workpiece W, the workpiece W is a plated steel sheet. As described in the 21st of the above-mentioned Patent Document 1, the evaporation material of the plating layer may enter the processing range. And the processing quality has defects. Therefore, in the description of Patent Document 1, as shown in Fig. 1 of Patent Document 1, the surface of the plated steel sheet is irradiated with laser light to remove the plating layer in advance. Then, the laser cutting processor of the same trajectory is implemented next.

若依照上述構成,由於在雷射切斷加工時並無鍍覆之蒸發,故雖然可實施加工品質之改善,惟必須有鍍覆層之去除加工與切斷加工之兩度的雷射加工。又,由於鍍覆鋼板的切斷面係仍然保持實施雷射切斷加工之狀 態,故有必須切斷面之防鏽處理等問題。 According to the above configuration, since there is no evaporation of the plating during the laser cutting process, the processing quality can be improved, but the laser processing of the plating layer removal and the cutting process must be performed twice. Moreover, since the cut surface of the plated steel sheet is still subjected to laser cutting processing State, there is a problem that it is necessary to cut off the surface of the rust-proof treatment.

本發明之實施形態,發現實施鍍覆鋼板之雷射切斷加工時,藉由進行鍍覆鋼板的上面之鍍覆層之熔融及/或蒸發,可將被熔融及/或蒸發之含有鍍覆層的金屬朝切斷面流動,且藉由所流動之含有鍍覆層之金屬而被覆切斷面。 In the embodiment of the present invention, it is found that during the laser cutting process of the plated steel sheet, the plating and/or evaporation of the plating layer on the upper surface of the plated steel sheet can be melted and/or evaporated. The metal of the layer flows toward the cut surface, and the cut surface is covered by the flowing metal containing the plating layer.

於本發明之實施形態中,作為鍍覆鋼板之一例,使用將鋁6%、鎂3%,其餘為鋅91%之鍍覆層被覆於鋼板表面之熔融鍍覆鋼板(以下,僅稱鍍覆鋼板)。 In the embodiment of the present invention, as an example of the plated steel sheet, a molten plated steel sheet in which a plating layer of 6% of aluminum, 3% of magnesium, and 91% of zinc is coated on the surface of the steel sheet (hereinafter referred to as plating) is used. Steel plate).

並且,於雷射切斷加工中一般實施之氧氣切割,係使用氧氣作為輔助氣體者。然後,實施切斷加工面之EPMA(Electron Probe Micro Analyzer,電子探桿顯微分析器)之分析,結果在氧切斷時,如第2圖表示,切斷面被氧化膜被覆。因此,可知當實施鍍覆鋼板之雷射切斷加工時,如欲以被熔融或者蒸發之含有鍍覆層之金屬被覆之情形,氧氣切割係在鍍覆鋼板之雷射切斷加工上不適當。 Further, oxygen cutting which is generally performed in laser cutting processing uses oxygen as an auxiliary gas. Then, an analysis of an EPMA (Electron Probe Micro Analyzer) for cutting the processed surface was carried out, and as a result of the oxygen cut, as shown in Fig. 2, the cut surface was covered with an oxide film. Therefore, it can be seen that when laser cutting of a plated steel sheet is performed, if it is intended to be coated with a metal containing a plating layer which is melted or evaporated, the oxygen cutting system is not suitable for laser cutting processing of the plated steel sheet. .

其次,在實施使用氮氣作為輔助氣體之雷射切斷加工方法(以下,簡稱乾淨切斷)之情形,視切斷條件之不同,如第3圖(A)之放大照片所示,於鍍覆鋼板之基材B的切斷面CF的雷射切斷加工係良好地實施。並且,於前述切斷面CF的上端部附近之上面的鍍覆層M係已被去除而成為極薄。並且,於切斷面CF上無氧化皮膜等,幾乎全部僅顯現鍍覆鋼板的原板成分(Fe)(參照第2圖)。又,切斷面CF的覆蓋層(鍍覆面)亦極薄。因此,於乾淨切 斷中,藉由適當的切斷條件,可藉由上面之經熔融之含有鍍覆地金屬而被覆切斷面CF,且有時不產生鏽(鐵鏽)。 Next, in the case of performing a laser cutting processing method using nitrogen gas as an auxiliary gas (hereinafter, simply referred to as clean cutting), depending on the cutting conditions, as shown in the enlarged photograph of FIG. 3(A), plating is performed. The laser cutting process of the cut surface CF of the base material B of the steel sheet is performed satisfactorily. Further, the plating layer M on the upper surface in the vicinity of the upper end portion of the cut surface CF is removed to be extremely thin. Further, there is no oxide film or the like on the cut surface CF, and almost all of the original plate component (Fe) of the plated steel sheet is exhibited (see FIG. 2). Moreover, the coating layer (plating surface) of the cut surface CF is also extremely thin. Therefore, in a clean cut In the middle of the break, the cut surface CF can be covered by the molten metal containing the plating by appropriate cutting conditions, and rust (rust) may not be generated.

其次,如實施前述之簡易切斷之情形,如第2圖、第3圖(C)所示,於切斷面上顯現薄的氧化被膜。 又,於切斷面之上部,顯現屬於鍍覆層M的成分之鋅、鋁、鎂。亦即,於切斷面CF之上端部附近已熔融之鍍覆層的一部分流入切斷面CF,已熔融之鍍覆層的流入之濃部分顯現為白色的條紋狀。再者,於上述條紋狀部分之間,薄薄地存在已熔融之鍍覆層。 Next, as in the case of performing the simple cutting described above, as shown in Fig. 2 and Fig. 3(C), a thin oxide film is formed on the cut surface. Further, zinc, aluminum, and magnesium which are components of the plating layer M are formed on the upper portion of the cut surface. That is, a part of the molten plating layer in the vicinity of the upper end portion of the cut surface CF flows into the cut surface CF, and the concentrated portion of the molten plating layer appears in a white stripe shape. Further, a molten plating layer exists thinly between the stripe-shaped portions.

亦即,發現於鋼板之雷射切斷加工方法中實施一般所採用之乾淨切斷或簡易切斷,藉此,使鍍覆層M的含有金屬廻繞進入於鍍覆鋼板(工件)W的切斷面,可進行切斷面CF覆蓋。 In other words, it has been found that the laser cutting process of the steel sheet is generally performed by a clean cutting or a simple cutting, whereby the metal containing the plating layer M is wound into the plated steel sheet (workpiece) W. By cutting the surface, the cut surface CF can be covered.

於是,將雷射加工時之切斷速度、聚光透鏡之焦點位置、輔助氣體之氣體壓力、於雷射光之脈衝之頻率等加工條件進行各種變更,而試驗對切斷面之鍍覆層的覆蓋狀態。又,試驗條件係如下所示。 Then, various processing conditions such as the cutting speed at the time of laser processing, the focus position of the condensing lens, the gas pressure of the assist gas, and the frequency of the pulse of the laser light are variously changed, and the test is performed on the plated layer of the cut surface. Coverage status. Further, the test conditions are as follows.

雷射切斷加工機:Amada(股)股份公司製,FOM2-3015R1 Laser cutting machine: Amada (share) company, FOM2-3015R1

材料:將鋁6%、鎂3%、餘量鋅91%之鍍覆被覆於表面之鍍覆鋼板、板厚t=2.3mm、K35(單側鍍覆金屬附著量175g/m2) Material: plated steel plate coated with 6% of aluminum, 3% of magnesium and 91% of residual zinc on the surface, plate thickness t=2.3mm, K35 (one-side plating metal adhesion 175g/m 2 )

切斷試樣形狀:130mm×30mm Cut sample shape: 130mm × 30mm

標準加工條件 Standard processing conditions

‧噴嘴直徑:D4.0(4.0mm) ‧Nozzle diameter: D4.0 (4.0mm)

‧切斷速度:F1600(1600mm/min) ‧ Cutting speed: F1600 (1600mm/min)

‧輔助氣體種類:EZ(表示前述之簡易切斷所使用之輔助氣體。此時之輔助氣體為氮氣約97%、氧氣3%之混合氣體) ‧Auxiliary gas type: EZ (indicates the auxiliary gas used for the simple cut-off described above. The auxiliary gas at this time is a mixed gas of about 97% nitrogen and 3% oxygen)

‧輔助氣體壓力:0.9MPa ‧Auxiliary gas pressure: 0.9MPa

‧噴嘴間隙:0.3mm(噴嘴與鍍覆鋼板上面之間隙) ‧ Nozzle gap: 0.3mm (the gap between the nozzle and the plated steel plate)

‧焦點位置:-4.5mm(以工件上面作為0而將上側設作+,將下側設作-) ‧ Focus position: -4.5mm (Set the upper side as + with the top of the workpiece as 0 and the lower side as -)

將上述標準加工條件之各條件改變而實施加工之結果係如下所述者。 The results of processing by changing the conditions of the above standard processing conditions are as follows.

從第4圖可知,將切斷速度在1120mm/min至3840mm/min之範圍調節時,對切斷面(切斷端面)之鍍覆金屬的被覆量,係速度愈大,被覆量逐漸增多。 As can be seen from Fig. 4, when the cutting speed is adjusted in the range of 1120 mm/min to 3840 mm/min, the coating amount of the plated metal on the cut surface (cut end surface) is increased, and the amount of coating is gradually increased.

由第5圖可知,將聚光透鏡的焦點位置在-6.5mm至+0.5mm之範圍調節時,並將焦點位置逐漸設作+側時,對切斷面之鍍覆金屬之被覆量逐漸增多。 As can be seen from Fig. 5, when the focus position of the condensing lens is adjusted in the range of -6.5 mm to +0.5 mm, and the focus position is gradually set to the + side, the coating amount of the plated metal on the cut surface is gradually increased. .

如第6圖所示,將輔助氣體壓力在0.5MPa至0.9MPa之範圍調節時,輔助氣體壓力愈低,對切斷端面之鍍覆之覆蓋量逐漸增多。 As shown in Fig. 6, when the assist gas pressure is adjusted in the range of 0.5 MPa to 0.9 MPa, the lower the assist gas pressure, the more the coating coverage of the cut end face is gradually increased.

如第7圖所示,將雷射光的脈衝頻率在800Hz至CW(連續)之範圍調節時,對切斷端面之鍍覆金屬的被覆量並未看到很大的變化。 As shown in Fig. 7, when the pulse frequency of the laser light was adjusted in the range of 800 Hz to CW (continuous), the amount of coating of the plated metal on the cut end face did not show a large change.

從第4圖至第7圖所示之結果可知,於簡易 切斷中,於對鍍覆鋼板之雷射切斷面之含有鍍覆層的金屬之被覆量,係切斷速度愈大(例如3840mm/min)愈多。又,焦點位置愈靠+側(例如,+0.5mm),含有鍍覆層的金屬之被覆量愈多。但,使焦點位置在(+)側增大時,由於在鍍覆鋼板之上面之能量密度變低,故於雷射切斷加工中,較佳為設定於-側者。再者,輔助氣體壓力愈低壓(例如0.5MPa),含有鍍覆層之金屬的被覆量愈多。再者,將雷射光調節為脈衝雷射、連續雷射時,在鍍覆金屬之被覆量看不出大的變化。 As can be seen from the results shown in Figures 4 to 7, In the cutting, the coating amount of the metal containing the plating layer on the laser cut surface of the plated steel sheet is increased as the cutting speed is increased (for example, 3840 mm/min). Further, the focus position is on the + side (for example, +0.5 mm), and the amount of metal containing the plating layer is increased. However, when the focus position is increased on the (+) side, since the energy density on the upper surface of the plated steel sheet is lowered, it is preferable to set it to the side in the laser cutting process. Further, the lower the auxiliary gas pressure (for example, 0.5 MPa), the more the coating amount of the metal containing the plating layer. Further, when the laser light is adjusted to a pulsed laser or a continuous laser, the amount of coating of the plated metal does not show a large change.

如已所理解地,於鍍覆鋼板之雷射切斷加工中,藉由簡易切斷而實施鍍覆鋼板之雷射切斷加工時,於雷射切斷加工條件中,例如,將切斷速度、聚光透鏡之焦點位置、輔助氣體壓力等各種變更,藉此,往鍍覆鋼板之雷射切斷面之含有鍍覆層的金屬之被覆量會變化者。再者,就雷射切斷加工條件而言,亦可考慮改變於雷射加工頭之噴嘴19與工件W的上面之間隔,亦即噴嘴間隙。 As is understood, in the laser cutting process of a plated steel sheet, when the laser cutting process of the plated steel sheet is performed by simple cutting, for example, the laser cutting process conditions are cut off. Various changes such as the speed, the focus position of the condensing lens, and the assist gas pressure change the amount of coating of the metal containing the plating layer on the laser cut surface of the plated steel sheet. Further, in terms of laser cutting processing conditions, it is also conceivable to change the interval between the nozzle 19 of the laser processing head and the upper surface of the workpiece W, that is, the nozzle gap.

亦即,發現對雷射切斷面之含有鍍覆層的金屬之被覆量,係依實施鍍覆鋼板之雷射切斷加工時之加工條件而異。換言之,於簡易切斷時,藉由將鍍覆鋼板之雷射切斷條件設為適當的切斷條件,可成為使含有鍍覆層的金屬適當地被覆於雷射切斷面者。 That is, it has been found that the coating amount of the metal containing the plating layer on the laser cut surface varies depending on the processing conditions at the time of laser cutting processing of the plated steel sheet. In other words, when the laser cutting conditions of the plated steel sheet are appropriately cut, the metal containing the plating layer is appropriately covered on the laser cut surface.

若依據簡易切斷,發現可將鍍覆鋼板之切斷面藉由含有鍍覆層的金屬而被覆蓋。 According to the simple cutting, it was found that the cut surface of the plated steel sheet can be covered by the metal containing the plating layer.

其次,為發現乾淨切斷時之適當的切斷條 件,藉由各種切斷條件而實施鍍覆鋼板之雷射切斷加工,並為觀察雷射切斷面的鐵鏽之產生狀態,實施曝露試驗。作為曝露試驗,係將已實施鍍覆鋼板之雷射切斷加工之雷射切斷加工品中之切斷面保持於上面,並放置於野外一個月。 Secondly, in order to find the appropriate cut strips when clean cutting The laser cutting process of the plated steel sheet was carried out by various cutting conditions, and an exposure test was performed to observe the state of occurrence of rust on the laser cut surface. In the exposure test, the cut surface of the laser cut processed product subjected to the laser cutting process of the plated steel sheet was held on the top and placed in the field for one month.

藉由乾淨切斷而從鍍覆鋼板切斷分離雷射切斷加工品時,如第8圖所示,有:於雷射切斷加工位置之上面產生電漿之情形,及不會產生之情形。並且,即使產生電漿之情形,仍可依目視而區別微弱的電漿之產生、強的電漿(不微弱的電漿)之產生之狀態。於是,在無產生電漿之情形設為「無」、在產生微弱的電漿之情形設為「p」、在產生強的電漿之情形設為「P」而予以區別。並且,切斷條件為不適合,且不能實施雷射切斷加工之情形,則設為「不」。 When the laser cut product is cut and separated from the plated steel sheet by clean cutting, as shown in Fig. 8, there is a case where plasma is generated on the laser cutting processing position, and it does not occur. situation. Further, even in the case where plasma is generated, the state of generation of weak plasma and generation of strong plasma (not weak plasma) can be distinguished by visual observation. Then, it is set to "none" in the case where no plasma is generated, "p" in the case where weak plasma is generated, and "P" in the case where strong plasma is generated. In addition, if the cutting condition is unsuitable and the laser cutting process cannot be performed, it is set to "No".

又,於一個月之曝露試驗中,如第9圖所示,在無鐵鏽發生之情形,設為「○」,而在產生鐵鏽之情形,設為「×」。在此,前述曝露試驗係在野外經過1個月之結果。因此,於雷射切斷加工品中,即使評估為「×」之情形,視所使用之環境之不同,仍為有可能使用之情形者。 Further, in the one-month exposure test, as shown in Fig. 9, "○" is set in the case where no rust occurs, and "x" is set in the case where rust is generated. Here, the aforementioned exposure test is a result of one month in the field. Therefore, in the laser cut processed product, even if it is evaluated as "X", depending on the environment used, it is still possible to use it.

其次,實施使用氮氣作為輔助氣體之乾淨切斷,並實施於鍍覆鋼板的板厚t=2.3mm、t=3.2mm、t=4.5mm、t=6.0mm之曝露試驗之結果,為如第10圖至第17圖所示者。於第10圖至第17圖中,K14、K27、K35分 別為鍍覆金屬之附著量表示記號,而各別之鍍覆金屬附著量係如下所示。亦即,K14(單側鍍覆金屬附著量70g/m2)、K27(單側鍍覆金屬附著量145g/m2)、K35(單側鍍覆金屬附著量175g/m2)。 Next, a clean cut using nitrogen gas as an auxiliary gas is carried out, and the result of the exposure test of the plated steel sheet having a thickness t=2.3 mm, t=3.2 mm, t=4.5 mm, and t=6.0 mm is performed as described above. 10 to 17 shown. In Figs. 10 to 17 , K14, K27, and K35 are indications of the adhesion amount of the plated metal, respectively, and the respective plating metal adhesion amounts are as follows. That is, K14 (one-side plating metal adhesion amount: 70 g/m 2 ), K27 (one-side plating metal adhesion amount: 145 g/m 2 ), and K35 (one-side plating metal adhesion amount: 175 g/m 2 ).

又,於第10圖至第17圖中,S表示單噴嘴、D表示雙噴嘴(double nozzle)。雙噴嘴係例如日本特開平11-90672號公報中所示,已為周知者。並且,S2.0、D4.0以及D7.0係分別表示噴嘴直徑(mm)。亦即,S2.0=2.0mm、D4.0=4.0mm、D7.0=7.0mm。並且,對應於各噴嘴之噴嘴間隙,係設定於S2.0時為0.3mm、D4.0時為0.5mm、D7.0時為1.0mm。亦即,如噴嘴直徑變大時,於雷射加工位置所產生之飛濺等容易進入噴嘴內,故噴嘴直徑愈大,使噴嘴間隙設定為愈大。 Further, in Figs. 10 to 17, S denotes a single nozzle, and D denotes a double nozzle. A double nozzle system is known as disclosed in Japanese Laid-Open Patent Publication No. Hei 11-90672. Further, S2.0, D4.0, and D7.0 represent the nozzle diameter (mm), respectively. That is, S2.0 = 2.0 mm, D4.0 = 4.0 mm, and D7.0 = 7.0 mm. Further, the nozzle gap corresponding to each nozzle was set to 0.3 mm at S2.0, 0.5 mm at D4.0, and 1.0 mm at D7.0. That is, when the diameter of the nozzle is increased, splashes or the like generated at the laser processing position are easily entered into the nozzle, so that the larger the nozzle diameter, the larger the nozzle gap is set.

又,所特別記載之參數以外之雷射加工的參數,係具有與前述標準加工條件的參數相同的值者。 Further, the parameters of the laser processing other than the parameters specifically described are those having the same values as those of the standard processing conditions described above.

再者,如參照第10圖,於焦點位置-0.5mm(焦點位置分別表示於各圖中)、板厚t=2.3mm且鍍覆金屬附著量K14之情形中,在噴嘴直徑S2.0之情形,於1000mm/min,輔助氣壓在0.9MPa、0.7MPa、0.5MPa中無電漿之發生。繼而,於曝露試驗中之評估係全部為「×」,全面性產生鐵鏽。又,如第11圖、第12圖、第13圖、第14圖以及第15圖所示,切斷速度1000mm/min之情形,於噴嘴直徑S2.0的噴嘴中,無關於輔助氣體壓力,並無電漿之發生。並且,於曝露試驗之評估為「×」,在切斷面之防 鏽效果中,不太值得期望。 Furthermore, as shown in FIG. 10, in the case where the focus position is -0.5 mm (the focus position is shown in each drawing), the plate thickness is t = 2.3 mm, and the plating metal adhesion amount K14 is applied, the nozzle diameter S2.0 is In the case, at 1000 mm/min, the auxiliary gas pressure does not occur in the plasma at 0.9 MPa, 0.7 MPa, and 0.5 MPa. Then, the evaluations in the exposure test were all "x", which produced rust comprehensively. Further, as shown in Fig. 11, Fig. 12, Fig. 13, Fig. 14, and Fig. 15, the cutting speed is 1000 mm/min, and in the nozzle having the nozzle diameter S2.0, there is no auxiliary gas pressure. There is no plasma. Also, the evaluation of the exposure test is "X", and the prevention of the cut surface The rust effect is not worth expecting.

因此,使用噴嘴直徑2.0的噴嘴,並按切斷速度1000mm/min實施鍍覆鋼板之雷射切斷加工時,在雷射切斷加工時經熔融及/或蒸發之含有鍍覆層的金屬於切斷面流動,難以被覆前述切斷面。 Therefore, when the nozzle having a nozzle diameter of 2.0 is used and the laser cutting process of the plated steel sheet is performed at a cutting speed of 1000 mm/min, the metal containing the plating layer which is melted and/or evaporated during the laser cutting process is The cut surface flows, and it is difficult to cover the cut surface.

其次,在第10圖、第11圖、第12圖中研究有關噴嘴直徑D4.0之情形,於第10圖、第11圖中並無電漿之發生,而曝露試驗之評估為「×」。但,於第11圖中輔助氣體壓力0.7MPa之時,改善為「○」。並且,在噴嘴直徑D7.0之情形,有微弱的電漿之發生。曝露試驗之評估係於第10圖中為「×」,惟於第11圖中為「○」、「×」。繼而,第12圖中為「×」。 Next, in the case of Fig. 10, Fig. 11, and Fig. 12, the case of the nozzle diameter D4.0 was investigated. In Figs. 10 and 11, there was no occurrence of plasma, and the evaluation of the exposure test was "x". However, when the assist gas pressure is 0.7 MPa in Fig. 11, the improvement is "○". Also, in the case of the nozzle diameter D7.0, there is a weak plasma. The evaluation of the exposure test is "X" in Figure 10, but it is "○" and "X" in Figure 11. Then, in the 12th figure, it is "X".

於第10圖至第17圖中,觀察曝露試驗之評估為「○」、「×」之部分時,有電漿產生(P)之情形,幾乎為「○」。因此,將鍍覆鋼板之雷射切斷加工以乾淨切斷實施時,為使熔融及/或蒸發之含有鍍覆層的金屬往切斷面流動,並使切斷面藉由經熔融及/或蒸發之含有鍍覆層的金屬被覆蓋,希望為一邊產生電漿,一邊進行雷射切斷加工者。 In the figures from Fig. 10 to Fig. 17, when the evaluation of the exposure test is "○" or "X", there is a case where plasma is generated (P), and it is almost "○". Therefore, when the laser cutting of the plated steel sheet is performed by clean cutting, the molten and/or evaporated metal containing the plating layer flows toward the cut surface, and the cut surface is melted and/or The evaporated metal containing the plating layer is covered, and it is desirable to perform the laser cutting process while generating plasma.

,如第11圖可知,於鍍覆金屬附著量K27、噴嘴直徑D4.0中,儘管無電漿之發生,但仍然有曝露試驗之評估為「○」之情形。又,於第10圖之噴嘴直徑D7.0、輔助氣體壓力0.9MPa中,雖然有稍微的電漿之發生,但前述評估為「×」。 As can be seen from Fig. 11, in the case of the plating metal adhesion amount K27 and the nozzle diameter D4.0, although no plasma occurred, the evaluation of the exposure test was "○". Further, in the nozzle diameter D7.0 and the assist gas pressure of 0.9 MPa in Fig. 10, although slight plasma generation occurred, the above evaluation was "x".

並且,於第10圖、第11圖、第12圖中,切斷速度在3000mm/min至5000mm/min之範圍中,於其全部中均可看到電漿之發生,並且,觀察之結果係切斷速度愈快,電漿之發生愈強。並且,於除了第10圖中之噴嘴直徑S2.0、輔助氣體壓力0.9MPa、0.7MPa(3000mm/min)以外之全域中之前述評估,全部為「○」。再者,於第10圖中,噴嘴直徑2.0mm、輔助氣體壓力0.7MPa之4000mm/min至5000mm/min中,成為「○」。 Further, in Fig. 10, Fig. 11, and Fig. 12, the cutting speed is in the range of 3000 mm/min to 5000 mm/min, and the occurrence of plasma can be seen in all of them, and the result of the observation is The faster the cutting speed, the stronger the plasma is. Further, the above evaluations in the entire range except the nozzle diameter S2.0, the assist gas pressure of 0.9 MPa, and the 0.7 MPa (3000 mm/min) in Fig. 10 are all "○". In addition, in Fig. 10, the nozzle diameter is 2.0 mm, and the assist gas pressure is 0.7 MPa from 4000 mm/min to 5000 mm/min, which is "○".

因此,為使曝露試驗之評估為「○」,於鍍覆鋼板之板厚t=2.3mm中,鍍覆金屬附著量K14係噴嘴直徑S2.0之情形,較佳為以輔助氣體壓力0.7MPa且切斷速度為4000mm/min至5000mm/min之範圍。並且,在輔助氣體壓力0.5MPa之情形,較佳為3000mm/min至5000mm/min之範圍。噴嘴直徑為D4.0、D7.0之情形,輔助氣體壓力並不局限於0.9MPa、0.7MPa、0.5MPa,較佳為切斷速度在3000mm/min至5000mm/min之範圍。 Therefore, in order to make the evaluation of the exposure test "○", in the case where the plate thickness of the plated steel sheet is t = 2.3 mm, and the plating metal adhesion amount K14 is the nozzle diameter S2.0, it is preferable that the auxiliary gas pressure is 0.7 MPa. And the cutting speed is in the range of 4000 mm/min to 5000 mm/min. Further, in the case where the assist gas pressure is 0.5 MPa, it is preferably in the range of 3000 mm/min to 5000 mm/min. In the case where the nozzle diameter is D4.0 or D7.0, the assist gas pressure is not limited to 0.9 MPa, 0.7 MPa, 0.5 MPa, and preferably the cutting speed is in the range of 3000 mm/min to 5000 mm/min.

如第11圖所示,於鍍覆鋼板為相同板(t=2.3mm)中,鍍覆金屬附著量成為K27而增多(增厚)時,則於噴嘴直徑D4.0、輔助氣體壓力0.7MPa、切斷速度1000mm/min之條件下,雖然並無電漿之發生,但評估為「○」。因此,若將鍍覆鋼板之板厚(t=2.3mm)、鍍覆金屬附著量K27、噴嘴直徑D4.0、輔助氣體壓力0.7MPa、切斷速度1000mm/min之各條件適當調和,即使不產生電漿,亦可使評估設為「○」。換言之,前述之各條件齊備時,即 使不產生電槳之情形,亦可使雷射切斷加工時經熔融及/或蒸發之含有鍍覆層的金屬於切斷面流動並被覆切斷面。 As shown in Fig. 11, in the case where the plated steel sheet is the same plate (t = 2.3 mm), when the amount of plating metal is K27 and increases (thickened), the nozzle diameter D4.0 and the assist gas pressure are 0.7 MPa. At the cutting speed of 1000 mm/min, although no plasma occurred, the evaluation was "○". Therefore, if the plated steel plate has a plate thickness (t=2.3 mm), a plated metal adhesion amount K27, a nozzle diameter D4.0, an assist gas pressure of 0.7 MPa, and a cutting speed of 1000 mm/min, the conditions are appropriately adjusted, even if not The plasma is generated and the evaluation can be set to "○". In other words, when the above conditions are met, In the case where the electric paddle is not generated, the metal containing the plating layer which is melted and/or evaporated during the laser cutting process may flow on the cut surface and cover the cut surface.

其次,參照第12圖時,儘管僅將鍍覆金屬附著量改變為K35,惟於切斷速度1000mm/min,於噴嘴直徑D4.0、輔助氣體壓力0.7MPa及噴嘴直徑D0.7、輔助氣體壓力0.9MPa、0.7MPa之條件下,雖然可看到稍微的電漿發生,惟評估為「×」。 Next, referring to Fig. 12, although only the plating metal adhesion amount is changed to K35, the cutting speed is 1000 mm/min, the nozzle diameter D4.0, the assist gas pressure 0.7 MPa, the nozzle diameter D0.7, and the assist gas. Under the conditions of a pressure of 0.9 MPa and 0.7 MPa, although a slight plasma generation was observed, the evaluation was "x".

一般而言,實施金屬板之雷射切斷加工時,若產生電漿,則電漿有吸收雷射光之特性,雷射光之照射係促進連續之電漿的產生。並且,已知電漿係使切斷面粗糙度惡化。然而,例如,於不鏽鋼之無氧化切斷時,有利用電漿的熱量之電漿切斷方法。在此情形,以能促進所發生之電漿之方式設定加工條件。 In general, when laser cutting is performed on a metal plate, if plasma is generated, the plasma has the property of absorbing laser light, and the irradiation of the laser light promotes the generation of continuous plasma. Further, it is known that the plasma system deteriorates the roughness of the cut surface. However, for example, in the case of non-oxidative cutting of stainless steel, there is a plasma cutting method using heat of plasma. In this case, the processing conditions are set in such a manner as to promote the generated plasma.

亦即,在上述之情形,(i)輔助氣體係設定為低壓。(ii)噴嘴與工件之間的噴嘴間隙係為形成電漿進行成長之空間,較通常之情形為稍增大。(iii)焦點位置的驅入量,係使較工件表面為更上方設為(+)方向,較工件表面為更下方設為(-)方向時,較通常之焦點位置之情形更朝(+)方向移動。(iv)為降低雷射光朝工件之入熱量,使切斷速度為更高速。上述(i)至(iv)之條件,係在實施金屬板的雷射切斷加工時,容易產生電漿之條件。 That is, in the above case, (i) the auxiliary gas system is set to a low pressure. (ii) The nozzle gap between the nozzle and the workpiece is a space for forming plasma to grow, which is slightly larger than usual. (iii) The amount of driving in the focus position is set to the (+) direction above the workpiece surface, and is set to the (-) direction lower than the workpiece surface, which is more toward the normal focus position (+ ) Move in the direction. (iv) In order to reduce the heat input of the laser light toward the workpiece, the cutting speed is made higher. The conditions (i) to (iv) described above are conditions in which plasma is likely to occur when laser cutting of a metal plate is performed.

若考量前述條件(i)至(iv)而觀看第10圖,則於鍍覆金屬附著量K14中,切斷速度在1000mm/min至2000mm/min之範圍中,電漿之產生係噴嘴直徑在D4.0者 較S2.0者為多,在D7.0者較D4.0者為多。又,切斷速度係在1000mm/min至5000mm/min中逐漸愈快,電漿之產生愈增強。然後,電漿之產生變強時,則曝露試驗之結果係「○」增多。再者,即使於第11圖、第12圖中,亦可看到同樣之趨勢。 If the above conditions (i) to (iv) are considered and the figure 10 is viewed, in the plating metal adhesion amount K14, the cutting speed is in the range of 1000 mm/min to 2000 mm/min, and the plasma generation nozzle diameter is D4.0 More than S2.0, more people in D7.0 than D4.0. Moreover, the cutting speed is gradually increased from 1000 mm/min to 5000 mm/min, and the generation of plasma is enhanced. Then, when the generation of the plasma becomes strong, the result of the exposure test is increased by "○". Furthermore, even in the 11th and 12th figures, the same tendency can be seen.

因此,在鍍覆鋼板之雷射切斷加工時,為使上面的經熔融及/或蒸發之含有鍍覆層之金屬往切斷面流動,並藉由此一部分之鍍覆金屬被覆切斷面,以產生電漿者為較佳。 Therefore, in the laser cutting process of the plated steel sheet, the molten metal containing the plating layer on the upper surface is caused to flow toward the cut surface, and the cut surface is covered by the part of the plated metal. It is preferred to produce a plasma.

第13圖、第14圖、第15圖係屬於乾淨切斷之情形,而鍍覆鋼板之板厚t=3.2mm,且鍍覆金屬附著量為於K14、K27、K35之情形的曝露試驗之結果。再者,於第13圖至第14圖中,「不」係表示不可能切斷者。亦即,切斷條件為不合適的情形。從第13圖至第15圖的結果亦很明顯地,可知輔助氣體壓力較低,且切斷速度較快者有不易產生電漿之傾向。 Fig. 13, Fig. 14 and Fig. 15 are the cases of clean cutting, and the plate thickness of the plated steel plate is t=3.2 mm, and the amount of plating metal adhesion is the exposure test in the case of K14, K27, K35. result. Furthermore, in the 13th to 14th drawings, "no" indicates that it is impossible to cut off. That is, the cutting condition is not suitable. The results from Fig. 13 to Fig. 15 are also apparent, and it is understood that the assist gas pressure is low, and those having a faster cutting speed tend to have less tendency to generate plasma.

第16圖、第17圖係屬於乾淨切斷之情形,而於板厚t=4.5mm、t=6.0mm之情形的曝露試驗結果,即使在此情形,亦有輔助氣體壓力愈係低壓,換言之,噴嘴直徑愈大,又切斷速度愈快速,電漿之產生愈強之傾向。並且,電漿之產生愈強,曝露試驗之結果愈有成為「○」之傾向。又,第16圖、第17圖中「d」係表示浮渣(dross)之附著量多者。 Fig. 16 and Fig. 17 are the cases of clean cutting, and the results of the exposure test in the case of the plate thickness t = 4.5 mm, t = 6.0 mm, even in this case, the auxiliary gas pressure is lower, in other words The larger the diameter of the nozzle, the faster the cutting speed and the stronger the generation of plasma. Further, the stronger the generation of the plasma, the more the result of the exposure test becomes "○". Further, in the sixteenth and seventeenthth drawings, "d" indicates that the amount of dross attached is large.

前述第10圖至第17圖所示之曝露試驗之結 果,係儲存於前述雷射切斷加工裝置1中之前述控制裝置31具備之切斷條件資料表33中。亦即,於上述切斷條件資料表33中,儲存:每一種鍍覆鋼板之板厚,於各板厚之每一鍍覆金屬附著量所適用之噴嘴直徑,於各噴嘴直徑之噴嘴間隙,適用於每一種板厚之焦點位置,以及切斷速度之加工條件資料。再者,於前述切斷條件資料表33中,合併儲存有:於鍍覆鋼板之雷射切斷加工時之電漿產生的資料以及實施曝露試驗之評估結果。又,於前述控制裝置31中,亦含有儲存有簡易切斷時之加工條件之切斷條件資料表者。 The knot of the exposure test shown in the above 10th to 17th The result is stored in the cutting condition data table 33 included in the control device 31 of the laser cutting apparatus 1 described above. That is, in the above-described cutting condition data table 33, the thickness of each of the plated steel sheets is applied, and the diameter of the nozzle to which the amount of plating metal is applied to each of the plate thicknesses is the nozzle gap of each nozzle diameter. Applicable to the focus position of each plate thickness, as well as the processing conditions of the cutting speed. Further, in the cutting condition data table 33, the data generated by the plasma during the laser cutting process of the plated steel sheet and the evaluation results of the exposure test are stored. Further, the control device 31 also includes a cutting condition data sheet in which processing conditions at the time of simple cutting are stored.

因此,從連接於前述控制裝置31之輸入手段35輸入各種之加工條件時,實施可獲得與第10圖至第17圖所示之評估相同評估之雷射切斷加工。亦即,例如在第10圖所示之板厚t=2.3mm中,將鍍覆金屬附著量K14、噴嘴直徑D4.0、輔助氣體壓力0.7MPa、切斷速度5000mm/min之條件從輸入手段35輸入於控制裝置31中而實施雷射切斷加工時,為產生電漿並進行雷射切斷加工者。並且,若實施1個月之曝露試驗,評估可獲得「○」。 Therefore, when various processing conditions are input from the input means 35 connected to the control device 31, the laser cutting process which can obtain the same evaluation as the evaluation shown in Figs. 10 to 17 is carried out. In other words, for example, in the plate thickness t=2.3 mm shown in FIG. 10, the conditions of the plating metal adhesion amount K14, the nozzle diameter D4.0, the assist gas pressure 0.7 MPa, and the cutting speed 5000 mm/min are input from the input means. When 35 is input to the control device 31 and laser cutting is performed, a plasma is generated and a laser cutting process is performed. Also, if a one-month exposure test is carried out, the evaluation can obtain "○".

再者,實施曝露試驗時,係有時視例如海洋之附近等之環境或氣象條件等而評估變化者。 Further, when the exposure test is carried out, the changer is sometimes evaluated depending on the environment or weather conditions such as the vicinity of the sea.

為實施鍍覆鋼板之雷射切斷,而將經熔融及/或蒸發之含有鍍覆層的金屬於切斷面流動,並被覆切斷面時,鍍覆金屬之熔融範圍雖然視工件之板厚、鍍覆金屬量以及雷射切斷條而定,惟從工件之切斷端面起在 0.03mm至0.5mm之範圍為較佳。 In order to perform laser cutting of the plated steel sheet, the melted and/or evaporated metal containing the plating layer flows on the cut surface, and when the cut surface is covered, the melting range of the plated metal is regarded as the sheet of the workpiece. Depending on the thickness of the plated metal and the laser cutting bar, it is only from the cut end of the workpiece. A range of 0.03 mm to 0.5 mm is preferred.

亦即,鍍覆層之被熔融及/或蒸發之範圍成為0.5mm以上之情形,係雷射切斷速度慢,且入熱量大之情形較多。此情形,認為係所熔融及/或蒸發之鍍覆金屬量變多,且對雷射切斷溝內之流入量變多。然而,由於雷射切斷速度慢,雷射光的照射時間長,加熱時間變長,而經熔融及/或蒸發之含有鍍覆層的金屬保持於高溫狀態之時間變長,且輔助氣體作用之時間變長,附著於切斷面而凝固之前,容易被輔助氣體吹散,對切斷面的經熔融及/或蒸發之含有鍍覆層的金屬之被覆量變少(例如,參照第12圖之D4.0、D7.0)。 That is, when the range in which the plating layer is melted and/or evaporated is 0.5 mm or more, the laser cutting speed is slow, and the amount of heat input is large. In this case, it is considered that the amount of plating metal which is melted and/or evaporated is increased, and the amount of inflow into the laser cutting groove is increased. However, since the laser cutting speed is slow, the irradiation time of the laser light is long, the heating time becomes long, and the molten and/or evaporated metal containing the plating layer is kept at a high temperature for a long time, and the auxiliary gas acts. The time becomes long, and it is easy to be blown off by the assist gas before adhering to the cut surface and solidified, and the amount of the metal containing the plating layer which is melted and/or evaporated on the cut surface is reduced (for example, refer to FIG. 12 D4.0, D7.0).

然而,鍍覆層的熔融及/或蒸發範圍為0.03mm的小範圍時,雷射切斷速度快,且入熱量小之情形較多。此情形,認為係所熔融及/或蒸發之量變少,對雷射切斷面之入熱量變少。 However, when the melting and/or evaporation range of the plating layer is in a small range of 0.03 mm, the laser cutting speed is fast, and the amount of heat input is small. In this case, it is considered that the amount of melting and/or evaporation is reduced, and the amount of heat input to the laser cut surface is reduced.

因此,鍍覆層的熔融及/或蒸發範圍,較佳為從切斷面起0.03mm至0.5mm的範圍者。於上述範圍中,雷射光之照射時間及輔助氣體作用之時間成為適當的時間,所熔融及/或蒸發之鍍覆金屬被輔助氣體吹散之量變少。因而,認為係被覆於切斷面而容易產生凝固,含有鍍覆層之金屬的覆蓋量變多(例如,參照第12圖之D4.0、D7.0)。 Therefore, the melting and/or evaporation range of the plating layer is preferably in the range of 0.03 mm to 0.5 mm from the cut surface. In the above range, the irradiation time of the laser light and the time of the auxiliary gas action become appropriate time, and the amount of the molten metal which is melted and/or evaporated is reduced by the assist gas. Therefore, it is considered that the solidified surface is easily covered by the cut surface, and the amount of the metal containing the plating layer is increased (for example, refer to D4.0 and D7.0 in Fig. 12).

如已瞭解,在實施鍍覆鋼板之雷射切斷加工時,實施使用氮氣作為輔助氣體之乾淨切斷、或使用氮 約97%、氧約3%之混合氣體作為輔助氣體之簡易切斷時,可以上面的含有鍍覆層的金屬被覆切斷面。而且,若在雷射切斷加工時產生電漿,發現可有效地進行前述被覆。 As is known, in the laser cutting process of a plated steel plate, a clean cut using nitrogen as an auxiliary gas or nitrogen is used. When a mixed gas of about 97% and about 3% of oxygen is simply cut off as an assist gas, the cut surface may be coated with the metal containing the plating layer. Further, if plasma is generated during the laser cutting process, it is found that the above coating can be effectively performed.

於是,實施板厚t=2.3mm的鍍覆鋼板之乾淨切斷及簡易切斷,並實施電漿發生,及1個月後之曝露試驗,可獲得如第18圖所示之結果。從第18圖所示之結果可知,若乾淨切斷及簡易切斷之兩者,都可產生電漿同時進行雷射切斷,則可藉由含有鍍覆層之金屬而將切斷面有效地被覆,並可防止鐵鏽之發生者。 Then, the clean cut and the simple cut of the plated steel sheet having the thickness t=2.3 mm, the plasma generation, and the exposure test one month later were carried out, and the results as shown in Fig. 18 were obtained. From the results shown in Fig. 18, it can be seen that both the net cutting and the simple cutting can generate the plasma while performing the laser cutting, and the cut surface can be effectively made by the metal containing the plating layer. The ground is covered and can prevent the occurrence of rust.

又,加工速度愈快,愈可有效進行藉由含有鍍覆層的金屬之切斷面之被覆,可防止鐵鏽之發生。於是,以加工速度2200mm/min、5000mm/min之條件,實施板厚t=2.3mm,鍍覆金屬附著量K14之雷射切斷時之切斷面的觀察結果,係如第19圖所示。 Further, the faster the processing speed, the more effectively the coating of the cut surface of the metal containing the plating layer can be effectively prevented, and the occurrence of rust can be prevented. Then, the observation result of the cut surface at the time of laser cutting of the plated metal adhesion amount K14 at a processing speed of 2200 mm/min and 5000 mm/min is shown in Fig. 19 .

由第19圖可知,加工速度為2200mm/min之情形,為有鐵鏽之發生者。然而,加工速度成為5000mm/min時,則可於切斷面全面檢測出含有鍍覆層的金屬成分,看不出鐵鏽之發生。此結果,係與第18圖所示之結果一致。 As can be seen from Fig. 19, the case where the processing speed is 2200 mm/min is the occurrence of rust. However, when the processing speed is 5000 mm/min, the metal component containing the plating layer can be completely detected on the cut surface, and the occurrence of rust is not observed. This result is consistent with the results shown in Figure 18.

從第19圖所示之雷射切斷面之EDS(Energy Dispersive X-ray Spectrometry)之分析結果及曝露試驗結果(4星期後),可知下列事項。於第2圖之乾淨切斷時,從雷射切斷面檢查出極為少量的含有鍍覆層的金屬。於是,將與第2圖之乾淨切斷條件略同等的加工速度2200mm/min 之雷射切斷面進行EDS分析時,可知Zn(鋅)、Al(鋁)、Mg(鎂)成分,亦即,含有鍍覆層之金屬係極微量且為照相攝影檢出量以下,幾乎雷射切斷面在含有鍍覆層之金屬未被覆。再者,藉由變更為合適的切斷條件如第19圖之加工速度5000mm/min之EDS分析結果照片所示般,可知於雷射切斷面全區域檢測出含有鍍覆金屬,且雷射切斷面全區域以含有鍍覆層之金屬被覆。亦即,依標準條件(加工速度:2200mm/min)的切斷面,係鐵成分約為90%(Fe的重量%:89.16),且鍍覆金屬成分(Zn、Al、Mg之值均在重量%:1.45以下)幾乎未被檢測出。因此,容易產生鐵鏽。相對於此,依此次之加工條件(加工速度:5000mm/min)進行切斷時,切斷面之鐵成分大幅降低至約30%(Fe之重量%:32.48),取而代之,在Zn係大幅增加至重量%:43.57,又即使於Al、Mg中亦增加至數倍以上,又可知鍍覆成分涵蓋切斷面全體且被覆其表面。因而,可知抑制鐵鏽之發生者係在雷射切斷加工時從上面流動,而為被覆切斷面表面之鍍覆金屬成分。 From the analysis results of the EDS (Energy Dispersive X-ray Spectrometry) and the exposure test results (after 4 weeks) of the laser cut surface shown in Fig. 19, the following items were known. At the time of clean cutting in Fig. 2, a very small amount of metal containing a plating layer was examined from the laser cut surface. Therefore, the processing speed which is slightly equivalent to the clean cutting condition of Fig. 2 is 2200 mm/min. When the laser cut surface was subjected to EDS analysis, it was found that the Zn (zinc), Al (aluminum), and Mg (magnesium) components, that is, the metal containing the plating layer were extremely small, and the amount of photodetection was less than or equal to that of the photographing image. The laser cut surface is uncovered on the metal containing the plating layer. In addition, as shown in the photograph of the EDS analysis result of the processing speed of 5000 mm/min as shown in Fig. 19, it is known that the plated metal is detected in the entire area of the laser cut surface, and the laser is detected. The entire area of the cut surface is covered with a metal containing a plating layer. That is, according to the cut surface of the standard condition (machining speed: 2200 mm/min), the iron content is about 90% (weight % of Fe: 89.16), and the metal components of the plating (Zn, Al, and Mg are all at Weight %: 1.45 or less) was hardly detected. Therefore, rust is easily generated. On the other hand, when cutting is performed according to the current processing conditions (processing speed: 5000 mm/min), the iron content of the cut surface is greatly reduced to about 30% (weight % of Fe: 32.48), and instead, the Zn system is greatly reduced. Increasing to % by weight: 43.57, even if it is increased by several times or more in Al and Mg, it is understood that the plating component covers the entire cut surface and covers the surface thereof. Therefore, it is understood that the person who suppresses the occurrence of rust flows from the top during the laser cutting process, and is a plated metal component covering the surface of the cut surface.

從如上述之實施形態之說明可理解,若對應於鍍覆鋼板之板厚、鍍覆金屬附著量,而以適當的加工條件進行雷射切斷加工,於電射切工時上面之經熔融及/或蒸發之含有鍍覆層的金屬會即流動至切斷面,而容易被覆切斷面。因此,於鍍覆鋼板之切斷面的上邊緣附近之鍍覆層的厚度,較從前述切斷面遠離之部位,亦即在雷射切斷時未受到會引起熔融及/或蒸發而產生鍍覆層之金屬流 動程度的熱影響之部位的鍍覆層厚度更薄。 As can be understood from the above description of the embodiment, the laser cutting process is performed under appropriate processing conditions in accordance with the thickness of the plated steel sheet and the amount of deposited metal, and the melting is performed on the upper surface during the electric cutting. And/or the evaporated metal containing the plating layer flows to the cut surface, and the cut surface is easily covered. Therefore, the thickness of the plating layer in the vicinity of the upper edge of the cut surface of the plated steel sheet is smaller than the portion away from the cut surface, that is, it is not subjected to melting and/or evaporation at the time of laser cutting. Metal flow of the plating layer The thickness of the plating layer at the portion of the thermal influence of the moving degree is thinner.

於前述說明中,係例示鋁6%、鎂3%,其餘鋅91%之鍍覆鋼板之情形。然而,作為鍍覆鋼板,並不限於前述之鍍覆鋼板,亦可適用於其他鍍覆鋼板之情形者。 In the foregoing description, the case of a plated steel sheet of 6% aluminum, 3% magnesium, and 91% of the remaining zinc is exemplified. However, the plated steel sheet is not limited to the above-described plated steel sheet, and may be applied to other cases of plated steel sheets.

再者,於鍍覆鋼板之雷射切斷加工方法中,較佳係板厚為2.3mm,鍍覆金屬附著量為K14,噴嘴直徑為2.0mm至7.0mm,輔助氣體壓力為0.5至0.9(MPa),切斷速度為3000至5000(mm/min)。 Further, in the laser cutting processing method of the plated steel sheet, the plate thickness is preferably 2.3 mm, the plating metal adhesion amount is K14, the nozzle diameter is 2.0 mm to 7.0 mm, and the assist gas pressure is 0.5 to 0.9 ( MPa), the cutting speed is 3000 to 5000 (mm/min).

又,於鍍覆鋼板之雷射切斷加工方法中,較佳係板厚為2.3mm,鍍覆金屬附著量為K27或K35,噴嘴直徑為2.0mm至7.0mm,輔助氣體壓力為0.5至0.9(MPa),切斷速度為3000至5000(mm/min)。 Further, in the laser cutting processing method for a plated steel sheet, the thickness of the plate is preferably 2.3 mm, the amount of plating metal is K27 or K35, the diameter of the nozzle is 2.0 mm to 7.0 mm, and the pressure of the auxiliary gas is 0.5 to 0.9. (MPa), the cutting speed is 3000 to 5000 (mm/min).

又,於鍍覆鋼板之雷射切斷加工方法中,較佳係板厚為3.2mm,鍍覆金屬附著量為K27或K35,噴嘴直徑為7.0MM,輔助氣體壓力為0.5至0.9(MPa),切斷速度為2000至3000(mm/min)。 Further, in the laser cutting method for a plated steel sheet, the thickness of the plate is preferably 3.2 mm, the amount of plating metal is K27 or K35, the diameter of the nozzle is 7.0 mm, and the pressure of the auxiliary gas is 0.5 to 0.9 (MPa). The cutting speed is 2000 to 3000 (mm/min).

又,於鍍覆鋼板之雷射切斷加工方法中,較佳係板厚為4.5mm,鍍覆金屬附著量為K27或K35,噴嘴直徑為7.0mm,輔助氣體壓力為0.7至0.9(MPa),切斷速度為1500至2000(mm/min)。 Further, in the laser cutting method for a plated steel sheet, the thickness of the plate is 4.5 mm, the amount of plating metal is K27 or K35, the diameter of the nozzle is 7.0 mm, and the pressure of the assist gas is 0.7 to 0.9 (MPa). The cutting speed is 1500 to 2000 (mm/min).

[產業上之可利用性] [Industrial availability]

若依據本發明,則可不去除鍍覆鋼板之鍍覆,而可實施雷射切斷加工。並且,進行鍍覆鋼板之雷射切斷時,可將經熔融及/或蒸發之表面的鍍覆金屬之一部 分於切斷面流動(引導),而被覆切斷面。因此,可效率佳地實施鍍覆鋼板之雷射切斷加工,同時在雷射切斷加工後,並不需要重新進行切斷面的防鏽處理。 According to the present invention, the laser cutting process can be performed without removing the plating of the plated steel sheet. Further, when performing laser cutting of the plated steel sheet, one part of the plated metal which is melted and/or evaporated may be used. It flows (guides) on the cut surface, and covers the cut surface. Therefore, it is possible to efficiently perform the laser cutting process of the plated steel sheet, and it is not necessary to perform the rustproof treatment of the cut surface after the laser cutting process.

1‧‧‧雷射切斷加工裝置 1‧‧‧Laser cutting and processing device

3‧‧‧工件工作台 3‧‧‧Working table

5‧‧‧雷射加工頭 5‧‧‧Laser processing head

7‧‧‧定位馬達 7‧‧‧ Positioning motor

9‧‧‧Z軸馬達 9‧‧‧Z-axis motor

11‧‧‧雷射振盪器 11‧‧‧Laser oscillator

13‧‧‧反射鏡 13‧‧‧Mirror

15‧‧‧聚光透鏡 15‧‧‧ Concentrating lens

17‧‧‧光學裝置 17‧‧‧Optical device

19‧‧‧噴嘴 19‧‧‧ nozzle

21‧‧‧輔助氣體供給裝置 21‧‧‧Auxiliary gas supply device

23‧‧‧氮氣供給裝置 23‧‧‧Nitrogen supply device

25‧‧‧氧氣供給裝置 25‧‧‧Oxygen supply device

27‧‧‧混合器 27‧‧‧ Mixer

29‧‧‧壓力調節閥 29‧‧‧Pressure regulator

31‧‧‧控制裝置 31‧‧‧Control device

33‧‧‧切斷條件資料表 33‧‧‧Several Conditions Data Sheet

35‧‧‧輸入手段 35‧‧‧ Input means

W‧‧‧鍍覆鋼板 W‧‧‧ plated steel

LB‧‧‧照射雷射光 LB‧‧‧illuminated laser light

M‧‧‧鍍覆層 M‧‧‧ plating layer

Claims (8)

一種鍍覆鋼板之雷射切斷加工方法,其係對鍍覆鋼板的上面照射雷射光以實施雷射切斷加工時,將因雷射光之照射而被熔融及/或蒸發之鍍覆金屬之一部分,藉由對雷射加工部所噴出之輔助氣體,而往前述鍍覆鋼板的切斷面側引導,並使鍍覆金屬被覆於前述切斷面時,使在前述鍍覆鋼板之雷射切斷加工部位之上面產生電漿以實施雷射切斷加工。 A laser cutting processing method for a plated steel sheet, which is a metal plated metal that is melted and/or evaporated by irradiation of laser light when the upper surface of the plated steel sheet is irradiated with laser light to perform laser cutting processing. A part of the laser beam is irradiated on the cut surface side of the plated steel sheet by the auxiliary gas discharged from the laser processing unit, and the plated metal is coated on the cut surface to provide a laser beam on the plated steel sheet. A plasma is generated on the upper surface of the cut processing portion to perform laser cutting processing. 如申請專利範圍第1項所述之鍍覆鋼板之雷射切斷加工方法,其中,於藉由對前述鍍覆鋼板之上面之雷射光的照射而被加熱蒸發之鍍覆金屬的蒸氣內照射雷射光以產生電漿。 The laser cutting processing method of the plated steel sheet according to the first aspect of the invention, wherein the vaporizing of the plated metal heated by evaporation of the laser light on the upper surface of the plated steel sheet is irradiated Laser light to produce plasma. 如申請專利範圍第1項或第2項所述之鍍覆鋼板之雷射切斷加工方法,其中,雷射光之焦點位置係在+0.5mm至-4.5mm之範圍進行調節。 The laser cutting processing method for a plated steel sheet according to the first or second aspect of the invention, wherein the focus position of the laser light is adjusted within a range of +0.5 mm to -4.5 mm. 如申請專利範圍第1項至第3項中任一項所述之鍍覆鋼板之雷射切斷加工方法,其中,將於雷射加工頭之噴嘴與鍍覆鋼板上面之間的噴嘴間隙,在0.3mm至1.0mm之範圍內進行調節,且將輔助氣體壓力在0.5MPa至1.2MPa之範圍內進行調節。 The laser cutting processing method for a plated steel sheet according to any one of the preceding claims, wherein the nozzle gap between the nozzle of the laser processing head and the upper surface of the plated steel sheet is The adjustment is carried out in the range of 0.3 mm to 1.0 mm, and the assist gas pressure is adjusted in the range of 0.5 MPa to 1.2 MPa. 如申請專利範圍第1項至第4項中任一項所述之鍍覆鋼板之雷射切斷加工方法,其中,將雷射切斷加工速度在1000mm/min至5000mm/min之範圍內進行調節。 The laser cutting processing method for a plated steel sheet according to any one of the preceding claims, wherein the laser cutting processing speed is in a range of from 1000 mm/min to 5000 mm/min. Adjustment. 如申請專利範圍第1項至第5項中任一項所述之鍍覆 鋼板之電射切斷加工方法,其中,噴出輔助氣體之噴嘴的口徑為2.0mm至7.0mm。 Plating as described in any one of claims 1 to 5 In the electric radiation cutting method of a steel sheet, the nozzle for discharging the assist gas has a diameter of 2.0 mm to 7.0 mm. 如申請專利範圍第1項至第6項中任一項所述之鍍覆鋼板之雷射切斷加工方法,其中,輔助氣體係氮氣或氮氣97%、氧氣3%之混合氣體。 The laser cutting processing method for a plated steel sheet according to any one of the preceding claims, wherein the auxiliary gas system is a mixed gas of nitrogen gas or nitrogen gas of 97% and oxygen gas of 3%. 一種雷射切斷加工裝置,其係具備:支撐板狀的工件之工件工作台、對前述工件可朝X、Y、Z軸方向相對地自由決定移動位置之雷射加工頭、及用以控制前述雷射加工頭的動作之控制裝置;前述控制裝置係具備按每一種鍍覆鋼板的板厚及鍍覆厚度儲存有雷射切斷加工條件之切斷條件資料表,該雷射切斷加工條件係在對前述工件工作台上的鍍覆鋼板照射雷射光以實施雷射切斷時,用以將因雷射光的照射而被熔融及/或蒸發之鍍覆金屬之一部分,藉由對雷射加工部所噴出之輔助氣體而往鋼板的切斷面側引導,並使鍍覆金屬被覆於前述切斷面。 A laser cutting processing apparatus comprising: a workpiece table that supports a plate-shaped workpiece; a laser processing head that can relatively freely determine a moving position in the X, Y, and Z-axis directions of the workpiece, and is used for controlling a control device for operating the laser processing head; the control device includes a cutting condition data table in which a laser cutting processing condition is stored for each of the plated steel sheets and a plating thickness, and the laser cutting processing is performed The condition is that when a plated steel plate on the workpiece table is irradiated with laser light to perform laser cutting, one part of the plated metal to be melted and/or evaporated by the irradiation of the laser light is used by the thunder The assist gas discharged from the shot processing unit is guided to the cut surface side of the steel sheet, and the plated metal is coated on the cut surface.
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