TW201727677A - Build-up substrate structure having magnetic induction coils and flexible printed circuit boards capable of dramatically improving the entire magnetic induction effect - Google Patents

Abstract

The present invention relates to a build-up substrate structure having magnetic induction coils and flexible printed circuit boards, includes at least a first build-up body, at least a second build-up body and/or at least a third build-up body having stackable and modulization features, wherein the build-up bodies are separated from each other by an electrically insulated coating layer and each of the build-up bodies has middle holes aligned with each other; and a plurality of flexible printed circuit boards, wherein each of the flexible printed circuit board is embedded with a plurality of magnetic induction coils which surround the middle holes and are electrically connected with each other through connecting pads. Therefore, any number of the first build-up body, the second build-up body and the third build-up body of the present invention are easily stacked in any order, such that the plurality of magnetic induction coils contained in the entire build-up substrate structure can provide synergistic magnetic induction, so as to dramatically improve the entire magnetic induction effect.

Description

Layered carrier structure with magnetic induction coil and soft board

The invention relates to a build-up carrier structure with a magnetic induction coil and a soft board, in particular, the stackable modularity of the first build-up body, the second build-up body and the third build-up body is easy. Stacking any number of the first build-up layer, the second build-up layer, and the third build-up layer in any order, so that the plurality of magnetic induction coils included in the build-up carrier structure can substantially enhance the overall magnetic induction of the build-up carrier structure efficacy.

As is well known, general electrical products can use hard circuit boards to provide electronic components to carry and connect functions. The most commonly used carrier materials are highly electrically insulating epoxy substrates and have been widely used. However, although the rigid circuit board has good mechanical strength, the rigid circuit board itself is flat, cannot be easily bent, and is damaged to the internal electrical circuit, so that it is difficult to apply to a space where the space is rather limited, such as a mobile phone. Or other portable ideas. Therefore, the industry has successfully developed a flexible flexible circuit board, that is, a soft board, to meet the needs of the market. Recently, the production and quality of soft boards have been quite mature and stable.

Coils are often required on electrical circuits to provide inductive functions, such as magnetic induction coils. Traditional techniques use metallic copper or copper alloys to form spiral patterns by etching or electroplating, as coils, and by chemical etching, machining, or laser. Drill holes to form holes.

Since the existing coils and flexible boards are made by different manufacturers, and the coils and the flexible boards are already punched at the factory, it is necessary to perform the lamination processing, and the coils and the soft boards are attached to each other to complete the required carrier boards, and the production procedure is increased. Moreover, when the coil and the flexible board are attached, it is easy to cause a problem of alignment tolerance between the hole of the coil and the hole of the soft board, that is, the alignment is not accurate, which affects the electrical characteristics of the overall carrier.

Therefore, there is a need for a new build-up carrier structure without alignment problems, utilizing at least one first build-up body comprising at least a plurality of magnetic induction coils, at least one second build-up body and/or to The first layer of the third layered body has the characteristics of stacking and modularization, and it is convenient to stack any number of the first layered body, the second layered body and the third layered body in any order, so that the whole layer is loaded. All magnetic induction coils of the plate structure can individually provide additive magnetic induction, which greatly enhances the overall magnetic induction effect, thereby solving the above problems of the conventional technology.

The main purpose of the present invention is to provide a build-up carrier structure with a magnetic induction coil and a soft board, which mainly comprises at least one of a first build-up unit, a second build-up unit and a third build-up unit, wherein the first increase The layer unit comprises at least one first layered body, the second layered unit comprises at least one second layered body, and the third layered unit comprises at least one third layered body, in particular the first layered body is a two layer structure Body, the second layered body is a three-layer structure, and the third layered body is a four-layer structure, and each of the first layered body, the second layered body and the third layered body can be stacked in any order And stack one by one. Each of the first buildup body, the second buildup body, and the third buildup body has a plurality of magnetic induction coils for respectively providing an additive magnetic induction effect. Furthermore, each of the first buildup body, the second buildup body, and the third buildup body has intermediate holes and are arranged to be aligned with each other, wherein the first buildup body, the second buildup body, and the third buildup body The insulation between the two is separated by an electrically insulating coating.

Specifically, the first build-up layer includes a first upper flexible board, a plurality of magnetic induction coils, a dielectric layer, a plurality of connection pads, and a first lower flexible board, wherein the first upper flexible board, the dielectric layer, and the first lower layer The soft board is stacked from top to bottom, and the magnetic induction coils are respectively embedded in the first upper soft board or the first lower soft board, and the magnetic induction coils in the first upper soft board are exposed on the first upper soft board. On the upper surface of the board, the magnetic induction coil in the first lower flexible board is exposed on the lower surface of the first lower flexible board. In addition, the connection pad is configured to electrically connect the corresponding magnetic induction coil embedded by the first upper flexible board and the corresponding magnetic induction coil embedded by the first lower flexible board through the dielectric layer, and the first upper flexible board and the first The magnetic induction coils in the lower flexible board are arranged in a spiral shape parallel to each other in a corresponding horizontal plane.

The individual magnetic induction coils have the function of providing magnetic induction and are additive, so that the magnetic induction of the first build-up body can be enhanced.

Similar to the configuration of the first build-up body, the second build-up body includes a second upper soft board, a second middle soft board, a second lower soft board, a plurality of magnetic induction coils, a dielectric layer and a plurality of connection pads, wherein The second upper soft board, the dielectric layer, the second middle soft board and the second lower soft board are sequentially stacked from top to bottom, and magnetic The induction coil is embedded in the second upper soft board, the second middle soft board or the second lower soft board, and the magnetic induction coil in the second upper soft board is exposed on the upper surface of the second upper soft board, and the second The magnetic induction coil in the middle soft board is exposed on the lower surface of the second middle soft board, and the magnetic induction coil in the second lower soft board is exposed on the lower surface of the second lower soft board.

In addition, the magnetic induction coil in the second middle flexible board and the magnetic induction coil in the second lower flexible board are not in contact, and the magnetic induction coil in the second upper flexible board is electrically connected to the dielectric layer through the corresponding connection pad. The magnetic induction coil in the second middle soft board, and the magnetic induction coil in the second middle soft board is a magnetic induction coil electrically connected to the second lower soft board by a corresponding connection pad. In particular, the magnetic induction coils in the second upper soft board, the second middle soft board, and the second lower soft board are all arranged in a spiral shape parallel to each other in a corresponding horizontal plane.

The third layered body mainly includes a third upper soft board, a third soft board, a third middle soft board and a third lower soft board, a plurality of magnetic induction coils, a first dielectric layer, and a second dielectric layer. And a plurality of connection pads, wherein the third upper flexible board, the first dielectric layer, the third soft board, the third middle soft board, the second dielectric layer and the third lower soft board are sequentially stacked from top to bottom And the magnetic induction coil is embedded in the third upper soft board, the third soft board, the third middle soft board or the third lower soft board, and the magnetic induction coil in the third upper soft board is exposed to the third upper soft On the upper surface of the board, the magnetic induction coil in the third soft board is exposed on the lower surface of the third soft board, and the magnetic induction coil in the third medium board is exposed on the upper surface of the third medium board, and The magnetic induction coil in the three lower soft plates is exposed on the lower surface of the third lower soft board.

In addition, the magnetic induction coil in the third soft board and the magnetic induction coil in the third middle soft board are not in contact, and the magnetic induction coil in the third upper flexible board is electrically connected through the first dielectric layer through the corresponding connection pad. Connected to the magnetic induction coil in the third soft board, the magnetic induction coil in the third upper flexible board and the magnetic induction coil in the third middle flexible board penetrate the first dielectric layer and the third soft board through the corresponding connection pads And electrically connected, the magnetic induction coil in the third middle flexible board is electrically connected to the magnetic induction coil in the third lower flexible board through the corresponding connection pad through the second dielectric layer. In particular, the magnetic induction coils in the third upper flexible board, the third upper soft board, the third middle soft board, and the third lower soft board are spirally arranged to be parallel to each other in a corresponding horizontal plane.

The magnetic induction coils embedded in the first layered body, the second layered body and the third layered body are surrounded by corresponding intermediate holes.

Since the first layered body, the second layered body, and the third layered body have a stackable modular structure, it is easy to apply any number of the first layered body, the second layered body, and the third layered layer. The stacked bodies are stacked in any order to have a build-up structure having desired magnetic induction characteristics, so that the plurality of magnetic induction coils included in the build-up carrier structure of the present invention can effectively greatly enhance the overall magnetic induction efficiency, especially to improve operational reliability, and Expand the application area.

10‧‧‧First layered body

12‧‧‧Dielectric layer

12A‧‧‧First dielectric layer

12B‧‧‧Second dielectric layer

14‧‧‧Connecting mat

10T‧‧‧first soft board

10B‧‧‧First soft board

20‧‧‧Second layered body

20T‧‧‧Second upper soft board

20M‧‧‧Second medium soft board

20B‧‧‧Second lower soft board

30‧‧‧ Third layered body

30T‧‧‧ third soft board

30P‧‧‧ third soft board

30M‧‧‧ Third Soft Board

30B‧‧‧ Third soft board

40‧‧‧coating

40A‧‧‧ additional cover

40B‧‧‧Adding cover

H‧‧‧Intermediate hole

L‧‧‧Magnetic induction coil

U1‧‧‧First Addition Unit

U2‧‧‧Second layering unit

U3‧‧‧ third layering unit

The first figure shows a perspective view of a build-up carrier structure with a magnetic induction coil and a soft board in accordance with an embodiment of the present invention.

The second figure shows a cross-sectional view of a build-up carrier structure with a magnetic induction coil and a soft board in accordance with an embodiment of the present invention.

The third figure shows a detailed cross-sectional view of the first buildup body in accordance with the present invention.

The fourth figure shows a detailed cross-sectional view of the second buildup body in accordance with the present invention.

The fifth figure shows a detailed cross-sectional view of the third buildup body in accordance with the present invention.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

Referring to the first and second figures, respectively, a perspective view and a cross-sectional view of a build-up board structure of a magnetic induction coil and a soft board according to a first embodiment of the present invention are shown. As shown in the first and second figures, the build-up board structure of the magnetic induction coil and the soft board according to the first embodiment of the present invention mainly includes a first build-up unit U1, a second build-up unit U2, and a third build-up unit. At least one of U3, and the first build-up unit U1 includes at least one first build-up body 10, the second build-up unit U2 includes at least one second build-up body 20, and the third build-up unit U3 includes at least one The third build-up body 30, wherein the first build-up body 10 is a two-layer structure, the second build-up body 20 is a three-layer structure, and the third build-up body 30 is a four-layer structure, and each first The layered body 10, the second layered body 20, and the third layered body 30 are stacked one on another in any stacking order, in particular, each of the first layered body 10, the second layered body 20, and the third added The layer bodies 30 all have intermediate holes H and are arranged such that each of the intermediate holes H is aligned with each other. Further, the first buildup body 10, the second buildup body 20, and the third buildup body 30 are separated from each other by the electrically insulating coating layer 40.

It should be noted that the first figure and the second figure are only for convenience of explaining the features of the present invention. It is shown that the two first build-up bodies 10, the second second build-up bodies 20, and the second third build-up bodies 30 are exemplary examples of stacking from top to bottom, and are not intended to limit the scope of the present invention, that is, The build-up carrier structure of the embodiment of the invention may substantially comprise any number of first build-up bodies 10, any number of second build-up bodies 20 or any number of third build-up bodies 30, and may be stacked in any order. , where any number is any positive integer. For example, the first build-up body 10 or the third build-up body 30 may also be configured to be sandwiched, and the build-up carrier structure of the present invention may also include any number of first build-up bodies 10, any number. One or two of the second buildup body 20 and any number of third buildup bodies 30.

Regarding the detailed configuration of the first buildup body 10, reference may be made to the third diagram, but for the sake of clarity, the third diagram only shows that the first buildup body 10 in the first figure is located on the left side of the intermediate hole H, because the first increase The right side portion of the layer body 10 has a technical feature similar to the left side portion.

As shown in the third figure, the first build-up body 10 mainly includes a first upper flexible board 10T, a plurality of magnetic induction coils L, a dielectric layer 12, a plurality of connection pads 14 and a first lower flexible board 10B, wherein the first layer The upper flexible board 10T, the dielectric layer 12, and the first lower flexible board 10B are sequentially stacked from top to bottom, and the magnetic induction coils L are respectively embedded in the first upper flexible board 10T or the first lower flexible board. 10B, and the magnetic induction coil L in the first upper flexible board 10T is exposed on the upper surface of the first upper flexible board 10T, and the magnetic induction coil L in the first lower flexible board 10B is exposed to the first lower flexible board 10B. lower surface. It is to be noted that the third figure shows only an example of a single connection pad 14, but is not intended to limit the scope of the invention. In addition, each of the connection pads 14 is disposed to penetrate the dielectric layer 12 to electrically connect the corresponding magnetic induction coil L embedded by the first upper flexible board 10T and the corresponding magnetic induction coil L embedded by the first lower flexible board 10B.

Further, the magnetic coils L in the first upper flexible plate 10T and the first lower flexible plate 10B are arranged in a spiral shape so as to be parallel to each other in a corresponding horizontal plane.

The first build-up body 10 can form a cover layer 40 on the upper surface and/or the lower surface, respectively, in accordance with the actual configuration requirements of the build-up carrier structure of the present invention to provide mutual isolation. For example, when the first buildup body 10 is disposed to be sandwiched between the second buildup body 20 and the third buildup body 30, a coating layer 40 is formed on the upper surface and the lower surface, so that the first buildup body 10 is separated from the second buildup body 20 and the third buildup body 30, respectively.

Referring to the fourth figure, only the second layered body 20 in the first figure is shown in the middle. The left part of the hole H. In the first embodiment of the present invention, the second build-up body 20 includes a second upper flexible board 20T, a second middle soft board 20M, a second lower soft board 20B, a plurality of magnetic induction coils L, a dielectric layer 12, and a plurality of connection pads. 14. The second upper flexible board 20T, the dielectric layer 12, the second middle soft board 20M, and the second lower soft board 20B are sequentially stacked from top to bottom, and the magnetic induction coil L is embedded in the second upper soft board. 20T, the second middle soft board 20M or the second lower soft board 20B, and the magnetic induction coil L in the second upper soft board 20T is exposed on the upper surface of the second upper soft board 20T, and the second middle soft board 20M is inside. The magnetic induction coil L is exposed on the lower surface of the second middle flexible board 20M, and the magnetic induction coil L in the second lower flexible board 20B is exposed on the lower surface of the second lower flexible board 20B. In particular, the magnetic induction coil L in the second middle soft board 20M and the magnetic induction coil L in the second lower soft board 20B are not in contact.

In addition, the magnetic induction coil L in the second upper flexible board 20T is electrically connected to the magnetic induction coil L in the second middle soft board 20M through the corresponding connection pad 14 through the dielectric layer 12, and the second middle soft board 20M is inside. The magnetic induction coil L is further electrically connected to the magnetic induction coil L in the second lower flexible board 20B by the corresponding connection pad 14.

Furthermore, as in the first build-up body 10 of the third figure, the magnetic coils L in the second upper flexible board 20T, the second middle soft board 20M and the second lower soft board 20B of the second build-up body 20 are also They are arranged in a spiral shape parallel to each other in a corresponding horizontal plane.

Referring further to the fifth figure, only the third layered body 30 in the first figure is located on the left side of the intermediate hole H. In the first embodiment of the present invention, the third build-up body 30 includes a third upper soft board 30T, a third soft board 30P, a third middle soft board 30M and a third lower soft board 30B, a plurality of magnetic induction coils L, and a first The dielectric layer 12A, the second dielectric layer 12B and the plurality of connection pads 14, wherein the third upper flexible board 30T, the first dielectric layer 12A, the third soft board 30P, the third medium soft board 30M, and the second medium The electric layer 12B and the third lower soft board 30B are sequentially stacked from top to bottom. Further, the magnetic induction coils L are embedded in the third upper soft board 30T, the third soft board 30P, the third middle soft board 30M or the third lower soft board 30B, in particular, the third upper soft board 30T The magnetic induction coil L is exposed on the upper surface of the third upper flexible board 30T, and the magnetic induction coil L in the third soft board 30P is exposed on the lower surface of the third soft board 30P, and the third middle soft board 30M is inside. The magnetic induction coil L is exposed on the upper surface of the third middle soft board 30M, and the magnetic induction coil L in the third lower soft board 30B is exposed on the lower surface of the third lower soft board 30B.

In addition, the magnetic induction coil L and the third medium soft board in the third soft board 30P The magnetic induction coil L within 30M is not in contact. The magnetic induction coil L in the third upper flexible board 30T is electrically connected to the magnetic induction coil L in the third soft board 30P through the corresponding connection pad 14 through the first dielectric layer 12A, and the third upper flexible board 30T The magnetic induction coil L and the magnetic induction coil L in the third middle soft board 30M are electrically connected through the first connection layer 14 through the first dielectric layer 12A and the third soft board 30P, and the magnetic induction in the third middle soft board 30M The coil L is electrically connected to the magnetic induction coil L in the third lower flexible board 30B through the corresponding connection pad 14 through the second dielectric layer 12B.

Like the second build-up body 20 of the fourth figure, the magnetic induction coils of the third upper soft board 30T, the third soft board 30P, the third middle soft board 30M, and the third lower soft board 30B of the third build-up body 30 L is arranged in a spiral shape parallel to each other in a corresponding horizontal plane.

More specifically, in the present invention, the magnetic induction coils L embedded in the first build-up body 10, the second build-up body 20, and the third build-up body 30 are substantially surrounded by the intermediate hole H, and are provided. The magnetic induction effect of the addition, therefore, the build-up carrier structure of the present invention has a relatively strong magnetic induction effect, and has a simple overall structure and high operational reliability.

Preferably, the first buildup body 10, the second buildup body 20, and the third buildup body 30 may have a cylindrical appearance, and the first buildup body 10, the second buildup body 20, and the third buildup layer The intermediate hole H of the body 30 may be a circular hole.

The magnetic induction coil L and the connection pad 14 are made of the same or different conductive materials, and the first upper flexible board 10T, the first lower flexible board 10B, the second upper soft board 20T, and the second middle soft board 20M, The second lower flexible board 20B, the third upper soft board 30T, the third soft board 30P, the third middle board 30M, and the third lower board 30B are made of a soft electrical insulating material. Furthermore, the dielectric layer 12, the first dielectric layer 12A and the second dielectric layer 12B are made of a dielectric material, and the cladding layer 40 is made of a light-transmitting or opaque electrically insulating material.

Furthermore, the present invention may further comprise two additional cladding layers 40A, 40B for respectively covering the upper surface and the lower surface of the build-up carrier structure of the present invention for protection and as an electrical component having magnetic induction function. It can be easily attached to other electrical components, such as another magnetic sensing component with different shapes, which can be combined into an integrated single component, simplifying the structure, facilitating the terminal application and expanding the application field.

In summary, the present invention is characterized by utilizing a plurality of magnetic induction coils included in different stacking portions in the build-up structure to substantially enhance the magnetic induction effect of the overall build-up carrier structure, in particular Therefore, each of the magnetic induction coils is arranged in a spiral shape parallel to each other on a horizontal plane, so that the magnetic induction of the individual magnetic induction coils has an additive effect, which can increase the sensitivity of the magnetic induction.

Furthermore, another feature of the present invention is that each of the first buildup body, the second buildup body, and the third buildup body are independent units, and may increase the first increase within an allowable range of the appearance size. The number of the layer body, the second layering body, and the third layering body can reach the required magnetic induction size, so it is convenient to implement and is quite industrially usable.

The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.

10‧‧‧First layered body

10T‧‧‧first soft board

10B‧‧‧First soft board

20‧‧‧Second layered body

20T‧‧‧Second upper soft board

20M‧‧‧Second medium soft board

20B‧‧‧Second lower soft board

30‧‧‧ Third layered body

30T‧‧‧ third soft board

30P‧‧‧ third soft board

30M‧‧‧ Third Soft Board

30B‧‧‧ Third soft board

40‧‧‧coating

40A‧‧‧ additional cover

40B‧‧‧Adding cover

H‧‧‧Intermediate hole

U1‧‧‧First Addition Unit

U2‧‧‧Second layering unit

U3‧‧‧ third layering unit

Claims (7)

A build-up carrier structure having a magnetic induction coil and a flexible board, comprising at least one of a first build-up unit, a second build-up unit, and a third build-up unit, and the first build-up unit includes at least one of a first build-up layer, the second build-up unit comprises at least one second build-up body, and the third build-up unit comprises at least one third build-up body, wherein the first build-up layer has an intermediate hole, And comprising a first upper flexible board, a plurality of magnetic induction coils, a dielectric layer, a plurality of connection pads and a first lower flexible board, wherein the first upper flexible board, the dielectric layer and the first lower flexible board are The magnetic induction coils are respectively embedded in the first upper flexible board or the first lower flexible board, and the magnetic induction coils in the first upper flexible board are exposed to the same. An upper surface of the first upper flexible board, the magnetic induction coil in the first lower flexible board is exposed on a lower surface of the first lower flexible board, and the connection pad is configured to electrically connect the first upper layer through the dielectric layer Corresponding magnetic induction coil embedded in the soft board and corresponding magnetic induction line embedded in the first lower flexible board The first upper flexible board and the magnetic induction coils in the first lower flexible board are arranged in a spiral shape parallel to each other in a corresponding horizontal plane; wherein the second build-up system has an intermediate hole and includes a second upper layer a soft board, a second middle soft board, a second lower soft board, a plurality of magnetic induction coils, a dielectric layer and a plurality of connection pads, the second upper soft board, the dielectric layer, and the second medium soft board And the second lower flexible board is sequentially stacked from top to bottom, and the magnetic induction coils are embedded in the second upper soft board, the second middle soft board or the second lower soft board, and the first The magnetic induction coil in the upper soft board is exposed on the upper surface of the second upper soft board, and the magnetic induction coil in the second middle soft board is exposed on the lower surface of the second middle soft board, the second lower soft The magnetic induction coil in the board is exposed on the lower surface of the second lower flexible board, and the magnetic induction coil in the second middle flexible board and the magnetic induction coil in the second lower flexible board are not in contact, and the second upper flexible board The magnetic induction coil is electrically connected to the second middle soft board through the corresponding connection layer through the dielectric layer Magnetic induction coil, and the magnetic induction coil in the second soft plate further by the corresponding connection pad and electrically connected to the magnetic induction coil at the second flexible circuit board, the second soft plate, The magnetic coils in the second middle soft board and the second lower soft board are arranged in a spiral shape parallel to each other in a corresponding horizontal plane; wherein the third build-up body has an intermediate hole and includes a third upper layer a soft board, a third soft board, a third middle soft board and a third lower soft board, a plurality of magnetic induction coils, a first dielectric layer, a second dielectric layer and a plurality of connection pads, the first The three upper flexible boards, the first dielectric layer, the third soft board, the third medium soft board, the second dielectric layer and the third lower soft board are sequentially stacked from top to bottom, and the like The magnetic induction coil is embedded in the third upper soft board, the third soft board, the third middle soft board or the third lower soft board, and the magnetic induction coil in the third upper soft board is exposed to the The upper surface of the third upper flexible board, the magnetic induction coil in the third soft board is exposed on the lower surface of the third soft board, and the magnetic induction coil in the third middle soft board is exposed to the third medium soft The upper surface of the board, and the magnetic induction coil in the third lower flexible board is exposed on the lower surface of the third lower flexible board, and the magnetic induction in the third soft board The magnetic induction coil in the ring and the third middle flexible board is not in contact, and the magnetic induction coil in the third upper flexible board is electrically connected to the third soft board through the corresponding connection layer through the first dielectric layer The magnetic induction coil in the third upper flexible board and the magnetic induction coil in the third upper flexible board are electrically connected through the first dielectric layer and the third soft board through corresponding connection pads The magnetic induction coil in the third middle flexible board is electrically connected to the magnetic induction coil in the third lower flexible board through the corresponding connection pad, the third upper soft board, the third The magnetic induction coils in the intermediate soft board, the third middle soft board and the third lower soft board are spirally arranged parallel to each other in a corresponding horizontal plane, and wherein the first build-up body and the second build-up body And the intermediate holes of the third layered body are arranged to be aligned with each other, and the magnetic induction coils embedded by the first layered body, the second layered body and the third layered body are surrounded by corresponding Around the intermediate hole, each of the at least one first buildup body, The at least one second buildup body and each of the at least one third buildup body are stacked one on another in any stacking order, each of the at least one first buildup body, each of the at least one second buildup layer The body and each of the at least one third buildup body are separated by a corresponding coating layer, and the cover layer is electrically insulated. The build-up carrier structure according to claim 1, wherein the magnetic induction coil and the connection pad are made of the same or different conductive materials. The build-up carrier structure according to claim 1, wherein the first upper flexible board, the first lower soft board, the second upper soft board, the second middle soft board, and the second lower soft board The plate, the third upper flexible plate, the third intermediate soft plate, the third intermediate soft plate, and the third lower flexible plate are made of a soft electrical insulating material. The build-up carrier structure of claim 1, wherein the dielectric layer, the first dielectric layer and the second dielectric layer are made of a dielectric material. The build-up carrier structure according to claim 3, wherein the cover layer is made of an electrically insulating material that is translucent or opaque. The build-up carrier structure according to claim 3, wherein the intermediate hole is a circular hole, and the first build-up body, the second build-up body and the third build-up body have a cylinder Shaped appearance. According to the build-up carrier structure of claim 1, further comprising two additional cladding layers, and the two additional cladding layers respectively cover an upper surface and a lower surface of the build-up carrier structure.