TW201723033A - Dielectric film and making method thereof, display and making method thereof, composition, and touch panel - Google Patents

Dielectric film and making method thereof, display and making method thereof, composition, and touch panel Download PDF

Info

Publication number
TW201723033A
TW201723033A TW104142655A TW104142655A TW201723033A TW 201723033 A TW201723033 A TW 201723033A TW 104142655 A TW104142655 A TW 104142655A TW 104142655 A TW104142655 A TW 104142655A TW 201723033 A TW201723033 A TW 201723033A
Authority
TW
Taiwan
Prior art keywords
particles
siloxane
substrate
nitride
group
Prior art date
Application number
TW104142655A
Other languages
Chinese (zh)
Other versions
TWI691527B (en
Inventor
朱哈 連達拉
亞克 海基寧
劍倪 其瑪
Original Assignee
英克倫股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英克倫股份有限公司 filed Critical 英克倫股份有限公司
Priority to TW104142655A priority Critical patent/TWI691527B/en
Publication of TW201723033A publication Critical patent/TW201723033A/en
Application granted granted Critical
Publication of TWI691527B publication Critical patent/TWI691527B/en

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

A dielectric film and making method thereof, a display and making method thereof, a composition and a touch panel are provided. The method for making a dielectric film includes providing a substrate on which is deposited a siloxane starting material and particles, wherein the siloxane starting material has a siloxane polymer, a siloxane oligomer and/or silane monomers, and wherein the particles have an average particle size of less than 400 nm. After deposition, heat and/or electromagnetic energy is applied to the siloxane particle layer so as to cure the layer and form a dielectric film on the substrate. The formed film is optically transmissive to visible light and transmits at least 80% of the visible light incident thereon, and is electrically insulating and has a sheet resistance of 1000 [Omega]/sq or more.

Description

介電矽氧烷粒子膜及具有該膜的裝置Dielectric siloxane oxide particle film and device having the same

本發明是關於介電膜。特定言之,本發明是關於含有粒子之矽氧烷膜、生產此類膜之方法、包括所述膜之顯示器以及生產此類顯示器之方法。This invention relates to dielectric films. In particular, the present invention relates to a membrane-containing alkane membrane, a method of producing such a membrane, a display comprising the membrane, and a method of producing such a display.

LED及LCD出現於自照明燈具(LED)至顯示器(LED及LCD兩者)之多種產品中,諸如消費產品及家庭或商業中之智慧型手機、平板電腦、膝上型電腦、電腦監視器、電視、顯示器以及觸控螢幕等。LEDs and LCDs appear in a variety of products, from lighting fixtures (LEDs) to displays (both LEDs and LCDs), such as consumer products and smart phones, tablets, laptops, computer monitors in homes or businesses. TV, monitor, and touch screen.

LED裝置及LCD裝置均可包含介電層。此類介電層可以LED裝置或LCD裝置內之鈍化層、密封劑、厚膜或薄膜介電質等形式出現。其出現之一個區域為顯示器之觸控螢幕部分中之兩個導電層之間。Both the LED device and the LCD device may include a dielectric layer. Such dielectric layers can be in the form of passivation layers, encapsulants, thick films or thin film dielectrics in LED devices or LCD devices. One area that appears is between the two conductive layers in the touch screen portion of the display.

介電膜材料揭示於US 2011051064、US 5645901以及KR 20120119020中。仍需要具有穩定性及延長之存放期特性之經改良材料。Dielectric film materials are disclosed in US 2011051064, US 5645901, and KR 20120119020. Improved materials with stability and extended shelf life characteristics are still needed.

本發明之一個目標為解決至少一部分與已知材料相關之問題。It is an object of the present invention to address at least some of the problems associated with known materials.

本發明之一個目標為提供一種包括矽氧烷聚合物及矽氧烷聚合物內之粒子之介電膜。It is an object of the present invention to provide a dielectric film comprising a siloxane polymer and particles in a siloxane polymer.

本發明之另一目標為提供一種生產矽氧烷聚合物膜之方法。Another object of the present invention is to provide a method of producing a silicone polymer film.

本發明之第三目標為提供一種顯示器。A third object of the invention is to provide a display.

本發明之第四目標為提供一種製造顯示器之方法。A fourth object of the present invention is to provide a method of manufacturing a display.

本發明之第五目標為提供一種包括具有[-Si-O-Si-O]n重複主鏈之矽氧烷聚合物及粒子之組成物。A fifth object of the present invention is to provide a composition comprising a pyrithione polymer having a [-Si-O-Si-O]n repeating main chain and particles.

本發明之第六目標為提供一種觸控面板。A sixth object of the present invention is to provide a touch panel.

根據本發明,提供介電膜,其包括形成於支撐基板上的介電層,所述介電層包括矽氧烷聚合物及在矽氧烷聚合物內且平均粒度小於1微米之粒子;其中所述介電層對可見光為光學透射的且透射至少75%的入射於其上之光;且 其中介電層為電絕緣的且薄層電阻為1000 Ω/sq或更大。According to the present invention, there is provided a dielectric film comprising a dielectric layer formed on a support substrate, the dielectric layer comprising a siloxane polymer and particles having an average particle size of less than 1 micron in the siloxane polymer; The dielectric layer is optically transmissive to visible light and transmits at least 75% of the light incident thereon; and wherein the dielectric layer is electrically insulating and has a sheet resistance of 1000 Ω/sq or greater.

通常,矽氧烷聚合物之分子量為300公克/莫耳至10,000公克/莫耳;且 其中組成物在5 rpm黏度計及25℃下之黏度為1000兆帕-秒至75,000兆帕-秒;且其中實質上不含-OH基團。Typically, the molecular weight of the siloxane polymer is from 300 gram per mole to 10,000 gram per mole; and wherein the composition has a viscosity of from 5 MPa to 75,000 MPa-second at a viscosity of 5 rpm and at 25 ° C; And wherein it is substantially free of -OH groups.

更特定言之,本發明藉由獨立申請專利範圍中陳述之內容表徵。More specifically, the invention is characterized by what is stated in the scope of the independent patent application.

實現相當大的優勢。因此,揭示光學透明、電絕緣、奈米粒子-矽氧烷複合介電質,連同含有其之裝置。非導電粒子可為球形、分支、片狀或線材,其沈積於矽氧烷複合物內或經其圍繞。在所有情況下,在1.2與2.0之間的折射率下達成高光學透射。Achieve considerable advantages. Thus, optically transparent, electrically insulating, nanoparticle-heloxane composite dielectrics are disclosed, along with devices containing the same. The non-conductive particles can be spherical, branched, flake or wire deposited within or surrounded by the oxoxane composite. In all cases, high optical transmission was achieved at a refractive index between 1.2 and 2.0.

塗層亦可根據本文所揭示之各種圖案化方法圖案化。形成之透明電絕緣介電質較佳包括至少一種類型之電絕緣粒子,諸如高縱橫比粒子,例如薄片,及至少一種類型之矽氧烷聚合物。必要時,可包含額外低縱橫比粒子(例如奈米粒子),以調節膜之折射率、熱導率、電導率、機械特性、熱穩定性或耐化學性。The coating can also be patterned according to various patterning methods disclosed herein. The formed transparent electrically insulating dielectric preferably comprises at least one type of electrically insulating particles, such as high aspect ratio particles, such as flakes, and at least one type of hafoxygen polymer. Additional low aspect ratio particles (eg, nanoparticles) may be included as necessary to adjust the refractive index, thermal conductivity, electrical conductivity, mechanical properties, thermal stability, or chemical resistance of the film.

如本文中所揭示,透明絕緣介電質可為觸控感測器、顯示器、OLED裝置、垂直發射極InGaN LED、IME遮罩之一部分或可為受益於電絕緣膜及透明膜之任何其他裝置之一部分。As disclosed herein, the transparent insulating dielectric can be a touch sensor, a display, an OLED device, a vertical emitter InGaN LED, a portion of an IME mask, or any other device that can benefit from an electrically insulating film and a transparent film. Part of it.

自結合隨附圖式獲取之以下實施方式將更清楚地理解實例實施例,在所述隨附圖式中:Example embodiments will be more clearly understood from the following description taken in conjunction with the accompanying drawings in which:

將在下文中參看繪示一些實例實施例的隨附圖式以更充分地描述各種實例實施例。然而,本發明概念可以許多不同形式體現,且不應被理解為限於本文所闡述的實例實施例。相反地,提供此等實例實施例以使得本說明書將為透徹且完整的,且將向本領域的技術人員充分傳達本發明概念之範疇。在圖式中,為了清楚起見,可能會誇大層及區域的大小及相對大小。Various example embodiments will be described more fully hereinafter with reference to the accompanying drawings. However, the inventive concept may be embodied in many different forms and should not be construed as being limited to the example embodiments set forth herein. Rather, the example embodiments are provided so that this description will be thorough and complete, and the scope of the inventive concept will be fully conveyed by those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

應理解,當一元件或層被稱作在另一元件或層「上」、「連接至」或「耦接至」另一元件或層時,所述元件或層可直接在另一元件或層上、直接連接至或耦合至另一元件或層,或可能存在介入元件或層。相較之下,當元件被稱作「直接在另一元件或層上」、「直接連接至另一元件或層」或「直接耦接至另一元件或層」時,不存在介入元件或層。全文中類似標號是指類似元件。如本文中所使用,術語「及/或」包含相關聯所列項目中之一或多者之任何及所有組合。It will be understood that when an element or layer is referred to as "on", "connected" or "coupled" to another element or layer, the element or layer can be Layers, directly connected to or coupled to another element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as "directly on another element or layer" or "directly connected to another element or layer" or "directly coupled to another element or layer," Floor. Like reference numerals refer to like elements throughout. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

亦應理解,儘管可能在本文中使用術語第一、第二、第三等描述各種元件、組件、區域、層及/或區段,但此等元件、組件、區域、層及/或區段不應受此等術語限制。此等術語僅用以將一個元件、組件、區域、層或區段與另一元件、組件、區域、層或區段區別。因此,在不脫離本發明概念的教示的情況下,下文論述的第一元件、組件、區域、層或區段可被稱為第二元件、組件、區域、層或區段。It will also be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, such elements, components, regions, layers and/or sections It should not be limited by these terms. The terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below may be referred to as a second element, component, region, layer or section, without departing from the teachings of the invention.

本文所用之術語僅出於描述特定實施例之目的且並不意欲為限制性的。如本文所使用,除非上下文另作明確指示,否則單數形式「一」及「所述」意欲亦包含複數形式。應進一步理解,術語「包含」或「包括」在用於本說明書中時指定所陳述特徵、區域、整數、步驟、操作、元件及/或組件的存在,但不排除一或多個其他特徵、區域、整數、步驟、操作、元件、組件及/或其群組的存在或添加。The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms "" It is to be understood that the term "comprises" or "comprising", when used in the specification, is used in the context of the specification of the claimed features, regions, integers, steps, operations, components and/or components, but does not exclude one or more other features, The presence or addition of regions, integers, steps, operations, components, components, and/or groups thereof.

此外,相對術語,諸如「下部」或「底部」及「上部」或「頂部」可在本文中用於描述一個元件與另一元件之關係,如圖式中所說明。將理解,相對術語意欲涵蓋除圖式中所描繪的定向以外的裝置的不同定向。舉例而言,若一個圖式中之裝置翻轉,則描述成位於其他元件之「下部」側面上之元件將接著定向於所述其他元件之「上部」側面上。因此,例示性術語「下部」可因此取決於圖式之特定定向而涵蓋「下部」及「上部」之定向。類似地,若將圖式中之一者中的裝置翻轉,則描述為在其他元件「下方」或「之下」的元件將定向於其他元件「上方」。因此,例示性術語「下方」或「之下」可涵蓋上方及下方兩種定向。In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as illustrated in the drawings. It will be understood that the relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the drawings. For example, if the device in one of the figures is turned over, the elements described as being located on the "lower" side of the other elements will then be directed to the "upper" side of the other elements. Thus, the exemplary term "lower" may thus encompass the orientation of "lower" and "upper" depending on the particular orientation of the drawings. Similarly, elements that are described as "below" or "beneath" other elements will be "above" the other elements. Thus, the exemplary term "below" or "beneath" can encompass both the top and the bottom.

應注意,除非上下文另外明確規定,否則如本文所用,單數形式「一」及「所述」包含複數個指示物。另外應理解,當術語「包括」用於本說明書中時,指定所陳述特徵、步驟、操作、元件及/或組件之存在,但不排除添加一或多個其他特徵、步驟、操作、元件組件及/或其族群。It should be noted that as used herein, the singular forms "" In addition, it should be understood that the term "comprising", when used in the specification, is intended to mean the existence of the stated features, steps, operations, components and/or components, but does not exclude the addition of one or more other features, steps, operations, components And / or its ethnic groups.

用於單體及聚合物之下式中之小寫字母尤其表示整數。The lower case letters used in the formulas of monomers and polymers in particular represent integers.

除非另有定義,否則本文使用的全部術語(包含技術及科學術語)的意義與本發明所屬領域的一般技術者通常理解的意義相同。應進一步理解,術語(諸如,常用詞典中所定義之術語)應解釋為具有與其在相關技術及本發明之上下文中的意義一致之意義,且除非本文中明確地如此定義,否則將不以理想化或過度形式化意義進行解釋。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning meaning It should be further understood that the terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the related art and the present invention, and will not be ideal unless explicitly defined herein. Interpretation of meaning or over-formalization.

如本文中所揭示,在可見光譜內為光學透射且電絕緣之新穎矽氧烷粒子組成物可用於利用電絕緣層之半導體裝置及微電子及光電子裝置,諸如顯示器(例如LED顯示器,諸如OLED/AMOLED或LCD顯示器)中。特定言之,但不限於此,為觸控螢幕顯示器,諸如用於智慧型手機、平板電腦、膝上型電腦以及筆記型電腦、電腦監視器之電阻或電容觸控螢幕,以及數位相機、攝錄影機、攜帶型遊戲裝置、個人多媒體播放機、電子書閱讀器、印刷機、汽車顯示器、GPS/PND導航裝置等上之觸控螢幕,以及零售、商業以及工業環境中之觸控螢幕。As disclosed herein, novel siloxane oxide particle compositions that are optically transmissive and electrically insulating in the visible spectrum can be used in semiconductor devices utilizing electrically insulating layers and in microelectronic and optoelectronic devices, such as displays (eg, LED displays, such as OLED/ In AMOLED or LCD display). Specifically, but not limited to, touch screen displays, such as resistive or capacitive touch screens for smart phones, tablets, laptops and notebooks, computer monitors, and digital cameras, Touch screens for video recorders, portable gaming devices, personal media players, e-book readers, printing presses, car displays, GPS/PND navigation devices, and touch screens in retail, commercial and industrial environments.

然而,此類產品之非觸控螢幕型式亦可受益於如本文中所揭示之矽氧烷粒子絕緣及透光材料。However, non-touch screen versions of such products may also benefit from the siloxane oxide insulating and light transmissive materials as disclosed herein.

如上文所論述,LED裝置及LCD裝置均可包含介電層。此類介電層可以鈍化層、密封劑、厚膜或薄膜介電質等形式出現在LED裝置或LCD裝置內。其出現之一個區域為顯示器之觸控螢幕部分中之兩個導電層之間。以下實例是關於觸控螢幕顯示器,然而,如本文中所揭示之介電材料可用於需要介電材料區域之任何地方,特定言之,可用於需要透明絕緣材料之光電裝置中。As discussed above, both the LED device and the LCD device can comprise a dielectric layer. Such dielectric layers may be present in the LED device or LCD device in the form of a passivation layer, encapsulant, thick film or thin film dielectric. One area that appears is between the two conductive layers in the touch screen portion of the display. The following examples are directed to touch screen displays, however, dielectric materials as disclosed herein can be used anywhere in a region where a dielectric material is desired, and in particular, in photovoltaic devices that require a transparent insulating material.

在電阻型觸控螢幕中,可撓性透明頂部基板(例如塑膠膜,諸如聚酯)與更剛性底部基板(例如玻璃基板)間隔開地安置,其間具有氣隙。當使用者之手指觸控可撓性頂部基板時,其彎曲以與底部基板發生接觸。可量測接觸點之電壓及計算接觸點之位置。在電容型觸控面板中,在顯示器(例如LCD或LED像素之陣列)上連接額外一或多個基板,其可為任何適合之材料,諸如玻璃、聚酯、丙烯酸系物等。基板具有導電線矩陣,其間具有介電層。頂蓋透鏡經黏結以封閉整個組件。當使用者之手指觸控覆蓋基板時,其增加最接近觸控點之電極之量測電容,其中可量測電容之改變且用於計算觸控位置。表面電容或投射電容實例均可包含如本文中所揭示之導電材料。各種基板為顯示器之一部分,諸如在上面形成濾色器之基板、在上面形成TFT陣列之基板、覆蓋基板等,且藉由較佳絕緣且對可見光高度透射之接著劑黏結在一起。無論層為兩個導電層之間的介電質充當電容器、鈍化層或密封層、接著劑等,如本文中所揭示之矽氧烷粒子透明及絕緣膜可適用。In a resistive touch screen, a flexible transparent top substrate (eg, a plastic film, such as polyester) is placed spaced apart from a more rigid bottom substrate (eg, a glass substrate) with an air gap therebetween. When the user's finger touches the flexible top substrate, it bends to make contact with the bottom substrate. The voltage at the contact point can be measured and the position of the contact point calculated. In a capacitive touch panel, an additional one or more substrates are attached to a display (eg, an array of LCDs or LED pixels), which may be any suitable material, such as glass, polyester, acrylic, and the like. The substrate has a matrix of conductive lines with a dielectric layer therebetween. The cap lens is bonded to enclose the entire assembly. When the user's finger touches the substrate, it increases the measurement capacitance of the electrode closest to the touch point, wherein the change of the capacitance can be measured and used to calculate the touch position. Examples of surface capacitance or projected capacitance can include conductive materials as disclosed herein. The various substrates are part of a display, such as a substrate on which a color filter is formed, a substrate on which a TFT array is formed, a cover substrate, etc., and are bonded together by an adhesive which is preferably insulated and highly transparent to visible light. Regardless of whether the layer serves as a capacitor, a passivation layer or a sealing layer, an adhesive, or the like, the dielectric between the two conductive layers, a transparent and insulating film of a siloxane oxide particle as disclosed herein is applicable.

圖1為單元上觸控螢幕電容型顯示器之截面圖。如此圖中可見,基板2(其可為適合透明基板,諸如玻璃或聚合物)上具有偏光器層1。在玻璃上形成薄膜電晶體陣列3,及液晶單元陣列4。在玻璃基板7上安置VCOM層5(共同電極)及濾色器6。裝置之觸敏式部分由圖案化導電層8、絕緣層9以及圖案化導電層10形成。在圖樣化層10中,圖案線自頁面中出來,而在層8中,圖案與層10中之線正交(亦即在頁面上沿左-右方向水平地)運行。安置於兩個導電層8與10之間的為介電層9。第二偏光器顯示為層11,且蓋玻璃13經由接著劑層12黏結至結構之其餘部分。Figure 1 is a cross-sectional view of a touch screen capacitive display on a unit. As can be seen in this figure, the substrate 2 (which may be suitable for a transparent substrate such as glass or polymer) has a polarizer layer 1 thereon. A thin film transistor array 3 and a liquid crystal cell array 4 are formed on the glass. A VCOM layer 5 (common electrode) and a color filter 6 are placed on the glass substrate 7. The touch sensitive portion of the device is formed from a patterned conductive layer 8, an insulating layer 9, and a patterned conductive layer 10. In the patterned layer 10, the pattern lines emerge from the page, and in layer 8, the pattern runs orthogonally to the lines in layer 10 (i.e., horizontally in the left-right direction on the page). Disposed between the two conductive layers 8 and 10 is a dielectric layer 9. The second polarizer is shown as layer 11, and cover glass 13 is bonded to the remainder of the structure via adhesive layer 12.

在圖1中,介電層9及接著劑層12可為具有相同或不同調配物之如下文中所揭示之矽氧烷粒子透明及絕緣層。儘管介電層可不含粒子,其較佳包括粒子,諸如平均粒度小於1微米之陶瓷粒子。取決於選擇之矽氧烷材料及粒子材料及尺寸(如下文將論述),可調諧透明度及折射率。亦有可能的是裝置中之導電部分,諸如圖案化層8及圖案化層10亦由矽氧烷粒子材料製成,如將在下文中更深入論述。對於裝置中電絕緣以及導電之多個層使用相同或類似材料幫助匹配CTE與折射率且可改良裝置之總體光學及使用期限品質。In FIG. 1, dielectric layer 9 and adhesive layer 12 can be transparent and insulating layers of siloxane oxide particles as disclosed herein having the same or different formulations. Although the dielectric layer may be free of particles, it preferably includes particles such as ceramic particles having an average particle size of less than 1 micron. The transparency and refractive index can be tuned depending on the selected alkane material and the particle material and size (as discussed below). It is also possible that the conductive portions of the device, such as patterned layer 8 and patterned layer 10, are also made of a siloxane oxide material, as will be discussed in greater depth below. The use of the same or similar materials for multiple layers of electrical insulation and electrical conduction in the device helps match the CTE and refractive index and can improve the overall optical and end-of-life quality of the device.

圖2為單元內觸控螢幕電容型顯示器之截面圖。如圖2中可見,在玻璃基板22上提供偏光層21及薄膜電晶體陣列23。在其上提供顯示器之電容觸控螢幕部分,其中在導電層24及導電層26之間具有絕緣層25。在此實例中,層26中之圖案化電線自頁面突出,而層24之圖案化線在頁面上從左向右水平地運行。亦說明透明基板29上之LCD單元層27及濾色器28。另外提供偏光層30及接著劑層31,用於在頂部上黏結額外透明基板32。圖1及圖2中之透明基板可獨立地由玻璃或聚合物(聚酯/聚對苯二甲酸伸乙酯、丙烯酸/聚甲基丙烯酸甲酯等)或其他適合透光基板製成。如同圖1,接著劑層31及絕緣層25可由絕緣且透光之矽氧烷粒子材料製成。另外,導電層24及導電層26亦可由導電且對可見光高度透射之矽氧烷粒子材料製成,如下文中將另外論述。2 is a cross-sectional view of a touch screen capacitive display in a cell. As can be seen in FIG. 2, a polarizing layer 21 and a thin film transistor array 23 are provided on the glass substrate 22. A capacitive touch screen portion of the display is provided thereon with an insulating layer 25 between the conductive layer 24 and the conductive layer 26. In this example, the patterned wires in layer 26 protrude from the page, while the patterned lines of layer 24 run horizontally from left to right on the page. The LCD unit layer 27 and the color filter 28 on the transparent substrate 29 are also explained. Further, a polarizing layer 30 and an adhesive layer 31 are provided for bonding the additional transparent substrate 32 on the top. The transparent substrate of Figures 1 and 2 can be independently made of glass or polymer (polyester/polyethylene terephthalate, acrylic/polymethyl methacrylate, etc.) or other suitable light transmissive substrate. As with FIG. 1, the adhesive layer 31 and the insulating layer 25 may be made of an insulating and light-transmitting aluminoxane particle material. Additionally, conductive layer 24 and conductive layer 26 may also be made of a material that is electrically conductive and highly transparent to visible light, as will be discussed further below.

如圖3中可見,例示性電容觸控顯示器1之截面以放大形式說明。如圖3、圖9中所示為液晶顯示層(液晶材料、濾色器、支撐基板等)之簡化視圖。在其上安置透光基板8,其可為任何適合之材料,諸如玻璃、聚酯、丙烯酸等。在基板8上的為導電圖案7,其為延伸出圖3平面之線且視情況由如上所述之導電矽氧烷粒子材料製成。此等導電帶跨越顯示器之長度延伸。形成於導電帶上的為電容器層-絕緣層6,其可經沈積以填充導電帶7之間的空間且在上面形成絕緣層。此絕緣層較佳為如上所述之矽氧烷粒子材料,較佳具有選擇之粒子以提供電絕緣層,諸如陶瓷粒子(例如氧化物粒子或氮化物粒子)及可見光譜內之光學透明度。導電帶7及介電層6均應對可見光為透射的,較佳各自透射至少70%,但更佳至少80%,且更佳至少90%、至少92.5%或至少95%的入射於其上之可見光。As seen in Figure 3, the cross-section of an exemplary capacitive touch display 1 is illustrated in an enlarged form. A simplified view of the liquid crystal display layer (liquid crystal material, color filter, support substrate, etc.) is shown in FIGS. 3 and 9. A light transmissive substrate 8 is disposed thereon, which may be any suitable material such as glass, polyester, acrylic, or the like. On the substrate 8 is a conductive pattern 7, which is a line extending from the plane of Figure 3 and optionally made of a conductive siloxane oxide particle material as described above. These conductive strips extend across the length of the display. Formed on the conductive strip is a capacitor layer-insulating layer 6, which can be deposited to fill the space between the conductive strips 7 and form an insulating layer thereon. The insulating layer is preferably a siloxane oxide material as described above, preferably having selected particles to provide an electrically insulating layer, such as ceramic particles (e.g., oxide particles or nitride particles) and optical clarity in the visible spectrum. Both the conductive strip 7 and the dielectric layer 6 should be transmissive to visible light, preferably each having at least 70%, but more preferably at least 80%, and more preferably at least 90%, at least 92.5% or at least 95% incident thereon. Visible light.

如圖3中另外可見,提供額外圖案化導電帶層5。在此狀況下,導電帶形成為與介電層5之對邊上之帶7垂直(或以其他方式不平行)延伸之條帶。傳導線5可為顯示器之驅動線且傳導線7可為感測線。亦顯示上部透光基板3,其可為玻璃、聚酯、丙烯酸或其他透射可見光譜內之光之適合材料。基板3經由亦應透射可見光之接著劑4接著,且其可藉由如本文中所揭示之矽氧烷材料(其中具有或不具有粒子)製得。對於裝置中之多個層使用相同或類似材料幫助匹配CTE與折射率且可改良裝置之總體光學及使用期限品質。As further seen in Figure 3, an additional patterned conductive strip layer 5 is provided. In this case, the conductive strips are formed as strips that are perpendicular (or otherwise non-parallel) to the strips 7 on opposite sides of the dielectric layer 5. The conductive line 5 can be the drive line of the display and the conductive line 7 can be the sense line. Also shown is an upper light transmissive substrate 3 which may be glass, polyester, acrylic or other suitable material that transmits light in the visible spectrum. Substrate 3 is then passed through an adhesive 4 which should also transmit visible light, and which may be made by a oxoxane material (with or without particles) as disclosed herein. The use of the same or similar materials for multiple layers in the device helps match the CTE and refractive index and can improve the overall optical and end-of-life quality of the device.

導電帶5(及/或導電帶7)之間的區域可為電絕緣且光學透射的如本文中所揭示之具有粒子之矽氧烷材料。應注意區域9可為除LCD像素以外的顯示像素(電漿、LED等),且導電區域可併入液晶顯示器9內,諸如在如上所述之單元內觸控顯示器之情況下。單元上、單元內以及單元外(out-cell)觸控顯示器可全部使用如本文中所揭示之電絕緣矽氧烷粒子材料,亦可使用其中利用介電膜之非觸控螢幕顯示器。The region between the conductive strips 5 (and/or the conductive strips 7) may be an electrically insulating and optically transmissive paraxane material having particles as disclosed herein. It should be noted that the area 9 may be a display pixel (plasma, LED, etc.) other than the LCD pixels, and the conductive area may be incorporated into the liquid crystal display 9, such as in the case of a touch display in the unit as described above. The on-cell, in-cell, and out-cell touch displays may all use an electrically insulating siloxane particle material as disclosed herein, or a non-touch screen display in which a dielectric film is utilized.

玻璃上觸控螢幕顯示器說明於圖4之截面中。如圖4中所示,在透光基板50上安置透明導電層51、導電跨接線52以及介電層53(例如UV固化絕緣層)。亦說明金屬跡線54、導電圖案55、鈍化層56以及額外介電外塗層57。層52可在高溫下沈積,層55沈積於低溫下。導電層可提供為如本文中所揭示之矽氧烷聚合物,但具有金屬粒子以在熱固化之後製造導電層,而介電層可提供為如本文中所揭示之矽氧烷材料,具有陶瓷粒子,諸如氧化物或氮化物粒子,且藉由熱處理或UV處理固化。The touch screen display on the glass is illustrated in the cross section of Figure 4. As shown in FIG. 4, a transparent conductive layer 51, a conductive jumper 52, and a dielectric layer 53 (for example, a UV-curable insulating layer) are disposed on the light-transmitting substrate 50. Metal traces 54, conductive patterns 55, passivation layer 56, and an additional dielectric overcoat 57 are also illustrated. Layer 52 can be deposited at elevated temperatures and layer 55 can be deposited at low temperatures. The conductive layer can be provided as a siloxane polymer as disclosed herein, but having metal particles to form a conductive layer after thermal curing, and the dielectric layer can be provided as a siloxane material as disclosed herein, having a ceramic Particles, such as oxide or nitride particles, are cured by heat treatment or UV treatment.

儘管應用矽氧烷組成物不需要溶劑,但若需要極薄層,則可能需要添加非極性或極性(質子性或非質子性)的有機溶劑,而以低黏度液體形式提供矽氧烷材料以使沈積層之厚度最小化。降低為組成物之一部分之矽氧烷聚合物之分子量,或使用單體(例如第一化合物、第二化合物及/或第三化合物)替代組成物中之矽氧烷聚合物可降低黏度且在必要時幫助使膜厚度最小化(且因此增加光透射率)。可添加使矽氧烷組成物在曝露於UV光時能夠反應之界面活性劑及UV敏感添加劑。將官能性反應性基團選擇為丙烯酸酯可幫助在UV光下聚合。Although the use of a decane composition does not require a solvent, if a very thin layer is required, it may be necessary to add a non-polar or polar (protic or aprotic) organic solvent to provide the siloxane material in a low viscosity liquid form. Minimize the thickness of the deposited layer. Lowering the molecular weight of the oxirane polymer as part of the composition, or using a monomer (eg, the first compound, the second compound, and/or the third compound) in place of the siloxane polymer in the composition reduces viscosity and Helps minimize film thickness (and therefore light transmission) if necessary. A surfactant and a UV-sensitive additive capable of reacting the oxoxane composition upon exposure to UV light may be added. The choice of a functional reactive group as an acrylate helps to polymerize under UV light.

如圖5a至圖5d中可見,說明UV可圖案化沈積方法。在圖5a中,可提供基板70,其為任何適合之基板,諸如玻璃、石英、藍寶石、聚合物、半導體、陶瓷、金屬等。在基板70上沈積如本文中所揭示且較佳包括如上文所揭示之粒子之矽氧烷組成物。矽氧烷粒子組成物可沈積為流體,例如液體或凝膠,較佳藉由諸如注射器沈積或網板印刷之方法分配。可使用其他沈積法,諸如旋塗、浸漬、噴墨、簾幕式塗佈、滴瀝、凹版印刷、反向偏移、擠壓塗佈、狹縫塗佈、噴塗、柔性版等。另外,基板70可自晶圓單粒化或可尚未自晶圓單粒化,但可替代地為整個晶圓,或為自大型薄片(諸如用於顯示面板、太陽能電池或類似物之大型玻璃片)切割之部分。在捲軸式(roll to roll)方法中沈積於大型薄片上為可能的。此外,基板70可以晶圓級接著至支撐基板,兩個基板一起單粒化為個別晶粒。對於顯示器或光電池,較佳為可併入至捲軸式方法中之沈積法。As can be seen in Figures 5a to 5d, a UV patternable deposition method is illustrated. In Figure 5a, a substrate 70 can be provided that is any suitable substrate, such as glass, quartz, sapphire, polymer, semiconductor, ceramic, metal, and the like. A oxoxane composition as disclosed herein and preferably comprising particles as disclosed above is deposited on substrate 70. The oxoxane particle composition can be deposited as a fluid, such as a liquid or gel, preferably by a method such as syringe deposition or screen printing. Other deposition methods can be used, such as spin coating, dipping, ink jet, curtain coating, drip, gravure, reverse offset, extrusion coating, slit coating, spray coating, flexographic, and the like. Additionally, the substrate 70 may be singulated from the wafer or may not have been singulated from the wafer, but may alternatively be the entire wafer, or from a large sheet such as a large glass for a display panel, solar cell or the like. Piece) the part of the cut. It is possible to deposit on a large sheet in a roll to roll process. Further, the substrate 70 may be wafer level followed by a support substrate, and the two substrates are singulated into individual crystal grains together. For displays or photovoltaic cells, a deposition process that can be incorporated into a roll-to-roll process is preferred.

如圖5b中可見,與矽氧烷層相鄰安置遮罩75且UV光經由遮罩中之孔提供至矽氧烷層。UV光固化及硬化曝露區72a中之矽氧烷層,而未曝露區72b保持軟性,如圖5c中所說明。如圖5d中可見,顯影劑用於移除未曝露區72b,將圖案72a留在原地。可使用各種烘烤或乾燥步驟,諸如在初始應用矽氧烷材料72之後的軟烘烤,及移除未曝露區72b之後的硬烘烤。As can be seen in Figure 5b, a mask 75 is placed adjacent to the siloxane layer and UV light is provided to the oxane layer via the holes in the mask. The UV light cures and hardens the siloxane layer in the exposed zone 72a while the unexposed zone 72b remains soft, as illustrated in Figure 5c. As can be seen in Figure 5d, the developer is used to remove the unexposed regions 72b leaving the pattern 72a in place. Various baking or drying steps can be used, such as soft bake after initial application of the decane material 72, and hard bake after removal of the unexposed regions 72b.

作為如上文所論述之使用遮罩對矽氧烷材料直接圖案化之替代方案,亦有可能經由沈積於上面的光致抗蝕劑層對矽氧烷材料圖案化。在此類方法中,在沈積及軟烘烤矽氧烷層之後,光致抗蝕劑層沈積於其上。光致抗蝕劑可為任何適合之光致抗蝕劑材料,包含正性光致抗蝕劑,其中曝露於光之光致抗蝕劑部分變得對光致抗蝕劑顯影劑可溶,且其中不曝露於光之光致抗蝕劑部分仍對顯影劑不溶。或者,可使用負性光致抗蝕劑,其中曝露於光之光致抗蝕劑部分變得對顯影劑不溶,且光致抗蝕劑之未曝光部分對顯影劑可溶。可使用任何適合之光致抗蝕劑,諸如SU-8、PMMA、DNQ/酚醛、PMGI等。無論使用何種類型的光致抗蝕劑,當圖案形成於光致抗蝕劑材料內時,圖案充當選擇性地曝露底層矽氧烷材料之UV之遮罩,以形成圖案化矽氧烷層。As an alternative to using a mask to directly pattern the siloxane material as discussed above, it is also possible to pattern the siloxane material via the photoresist layer deposited thereon. In such a method, a photoresist layer is deposited thereon after deposition and soft baking of the siloxane layer. The photoresist can be any suitable photoresist material, including a positive photoresist, wherein the portion of the photoresist exposed to light becomes soluble to the photoresist developer, And the photoresist portion which is not exposed to light is still insoluble to the developer. Alternatively, a negative photoresist can be used in which the portion of the photoresist exposed to light becomes insoluble to the developer and the unexposed portion of the photoresist is soluble to the developer. Any suitable photoresist can be used, such as SU-8, PMMA, DNQ/phenolic, PMGI, and the like. Regardless of the type of photoresist used, when the pattern is formed within the photoresist material, the pattern acts as a UV mask that selectively exposes the underlying siloxane material to form a patterned siloxane layer. .

如上文所提及,矽氧烷粒子層較佳為電絕緣、光學透射且可圖案化的。然而,考慮到消費裝置及其他裝置中之熱積聚之一般問題,亦有可能提供用於熱耗散之矽氧烷粒子層。矽氧烷層可因此提供為導熱層,諸如光學透射、圖案化或非圖案化且電絕緣或非電絕緣之導熱層。可基於熱傳導特性而不是電絕緣特性對粒子進行選擇,粒子為電絕緣材料(如本文中所提及之各種氮化物、氧化物等)。當然,若基板並非光學透射的,或裝置內之位置不需要可見光譜內的高光學透射率,則熱傳導及電絕緣層可取決於選擇之粒子(類型、量以及尺寸)而為光反射或光吸收的。As mentioned above, the layer of siloxane oxide particles is preferably electrically insulating, optically transmissive and patternable. However, in view of the general problems of heat accumulation in consumer devices and other devices, it is also possible to provide a layer of aerobicane particles for heat dissipation. The siloxane layer can thus be provided as a thermally conductive layer, such as a thermally transmissive, patterned or unpatterned and electrically or non-electrically insulating thermally conductive layer. The particles may be selected based on thermal conduction characteristics rather than electrical insulation properties, the particles being electrically insulating materials (such as the various nitrides, oxides, etc. mentioned herein). Of course, if the substrate is not optically transmissive, or where the position within the device does not require high optical transmittance in the visible spectrum, the thermally conductive and electrically insulating layer may be light reflected or light depending on the selected particles (type, amount, and size). Absorbed.

另外,介電矽氧烷層可提供為固體膜,不經圖案化,而是僅曝露於UV光以固化為連續膜。膜可在不施加任何熱的情況下僅藉由UV交聯,或其可藉由UV及熱之組合固化,諸如其中對於熱敏性裝置,熱低於120℃或甚至低於100℃。在一些情況下,可能需要UV誘導之自由基或光酸產生劑在介電膜中側向移動至非曝露區域,以引起非曝露區域中之交聯及固化,諸如在非UV透明蓋玻璃框下。Additionally, the dielectric siloxane layer can be provided as a solid film, without patterning, but only exposed to UV light to cure into a continuous film. The film can be cured only by UV without applying any heat, or it can be cured by a combination of UV and heat, such as where the heat is below 120 ° C or even below 100 ° C for heat sensitive devices. In some cases, it may be desirable for the UV-induced free radical or photoacid generator to move laterally into the non-exposed regions in the dielectric film to cause cross-linking and curing in the non-exposed regions, such as in a non-UV transparent cover glass frame. under.

矽氧烷組成物可包括如本文中所揭示之偶合劑、固化劑、抗氧化劑、接著促進劑以及類似物。特定言之,矽氧烷材料包括當施加入射UV光時具反應性之Si-O主鏈上之反應性基團。顯影劑可為任何適合之顯影劑,諸如TMAH、KOH、NaOH等。亦有可能藉由雷射圖案化而非UV光對矽氧烷材料進行圖案化。The oxoxane composition can include a coupling agent, a curing agent, an antioxidant, an adhesion promoter, and the like as disclosed herein. In particular, the oxoxane material includes a reactive group on the Si-O backbone that is reactive when incident UV light is applied. The developer can be any suitable developer such as TMAH, KOH, NaOH, and the like. It is also possible to pattern the siloxane material by laser patterning instead of UV light.

如圖6中可見,說明提供電絕緣材料圖案之替代方法。如圖6a中所示,在基板80上沈積導電層82。導電層可為任何適合之導電膜,但較佳為如本文中所揭示之矽氧烷材料,其中具有粒子。若存在粒子,則其應為提供導電特性之粒子-例如金屬粒子。如圖6b中所示,層82諸如藉由UV光圖案化。圖案化亦可藉由雷射圖案化或其他適合方法,諸如熱壓印。一旦層82經由遮罩85曝露於UV光86(如圖6c中所示),移除未曝光部分以在基板80上留下空區域或凹槽82b及導電部分82a(圖6d)。此後,將如本文中所揭示之電絕緣材料提供至空區域,以在基板80上提供電絕緣圖案。As seen in Figure 6, an alternative method of providing a pattern of electrically insulating material is illustrated. A conductive layer 82 is deposited on the substrate 80 as shown in Figure 6a. The conductive layer can be any suitable conductive film, but is preferably a oxoxane material as disclosed herein having particles therein. If particles are present, they should be particles that provide electrically conductive properties - such as metal particles. As shown in Figure 6b, layer 82 is patterned, such as by UV light. Patterning can also be by laser patterning or other suitable methods, such as hot stamping. Once layer 82 is exposed to UV light 86 via mask 85 (as shown in Figure 6c), the unexposed portions are removed to leave empty areas or grooves 82b and conductive portions 82a on substrate 80 (Fig. 6d). Thereafter, an electrically insulating material as disclosed herein is provided to the void region to provide an electrically insulating pattern on the substrate 80.

對於圖6,沈積於形成之凹槽或線中之電絕緣材料較佳為如本文中所揭示之矽氧烷粒子材料,且其中粒子較佳為陶瓷粒子,諸如二氧化矽、石英、氧化鋁、氮化鋁、塗佈有二氧化矽之氮化鋁、硫酸鋇、三水合氧化鋁、氮化硼、或鈦、鉭、鋁、鋯、鉿或硒之氧化物。矽氧烷粒子材料可用於導電部分及電絕緣部分兩者,在一個實例中,兩種矽氧烷具有類似或較佳相同的有機取代基,例如第一化合物SiR1 a R2 4-a 之R2 基團,其中a為1至3,R1 為反應性基團,且R2 為烷基或芳基,如上文所提及,或相同單體SiR1 a R2 4-a 用於針對導電材料及電絕緣材料兩者製造矽氧烷聚合物。此有助於導電部分及絕緣部分之膜穩定性及較接近CTE值。另外,在電絕緣材料安置於與導電材料不同之層中之實例中,諸如對於電容觸控螢幕顯示器中之圖案化導電層之間的電容器部分,可使用相同R2 基團及/或相同起始單體。For Figure 6, the electrically insulating material deposited in the formed grooves or lines is preferably a siloxane oxide material as disclosed herein, and wherein the particles are preferably ceramic particles such as cerium oxide, quartz, alumina. Aluminum nitride, aluminum nitride coated with cerium oxide, barium sulfate, alumina trihydrate, boron nitride, or an oxide of titanium, lanthanum, aluminum, zirconium, hafnium or selenium. The siloxane oxide material can be used for both the conductive portion and the electrically insulating portion. In one example, the two oxoxanes have similar or preferably identical organic substituents, such as the first compound SiR 1 a R 2 4-a R 2 group, wherein a is 1 to 3, R 1 is a reactive group, and R 2 is an alkyl group or an aryl group, as mentioned above, or the same monomer SiR 1 a R 2 4-a is used for A siloxane polymer is produced for both conductive materials and electrically insulating materials. This contributes to the film stability of the conductive portion and the insulating portion and is closer to the CTE value. Additionally, in instances where the electrically insulating material is disposed in a different layer than the electrically conductive material, such as for a capacitor portion between patterned conductive layers in a capacitive touch screen display, the same R 2 groups and/or the same can be used Starting monomer.

形成圖案化導電層之替代方法,有可能首先與矽氧烷材料分開地將粒子沈積至基板上。在此情況下,粒子可沈積於有機溶劑或水性溶劑溶液或其他載劑中以在基板上形成奈米線「矩陣」。在乾燥或移除溶劑之其他適合方法之後,保留粒子「膜」。在其上沈積如本文中所揭示之矽氧烷材料。矽氧烷材料可與溶劑一起沈積,另外乾燥及聚合(例如施加熱及/或UV光)矽氧烷,以形成組合之最後固化的矽氧烷奈米線層。或者,矽氧烷可在不添加任何溶劑的情況下以提供所需黏度之所需分子量沈積,接著施加熱或UV光以硬化及固化矽氧烷材料。亦有可能在此階段提供含矽單體(例如第一化合物、第二化合物或其他視情況選用之組分,例如視情況選用之第三化合物、偶合劑等),接著施加熱及/或UV光至包括粒子及聚合矽氧烷之層。Instead of forming a patterned conductive layer, it is possible to first deposit particles onto the substrate separately from the siloxane material. In this case, the particles may be deposited in an organic solvent or aqueous solvent solution or other carrier to form a "matrix" of nanowires on the substrate. The particle "film" is retained after drying or removing other suitable methods of solvent. A oxoxane material as disclosed herein is deposited thereon. The decane material can be deposited with a solvent, additionally dried and polymerized (e.g., with heat and/or UV light) to form a combined final cured layer of siloxane. Alternatively, the decane can be deposited with the desired molecular weight to provide the desired viscosity without the addition of any solvent, followed by application of heat or UV light to harden and cure the siloxane material. It is also possible to provide a halogen-containing monomer at this stage (for example, a first compound, a second compound or other optional components, such as a third compound, a coupling agent, etc., optionally used), followed by application of heat and/or UV. Light to a layer comprising particles and a polymeric alkane.

如本文中所揭示之電絕緣層可提供為裝置內之多個層,諸如第一圖案化電絕緣矽氧烷粒子層,及第二電絕緣層(圖案化或未圖案化)。亦有可能在同一層內之電絕緣部分之間具有為相同或類似矽氧烷材料但具有提供電導率之粒子之區域。另外,介入導電層可提供於複數個電絕緣矽氧烷層之間。在導電部分及電絕緣部分由相同或類似的如本文中所揭示之矽氧烷材料製得之情況下,可降低CTE失配之問題。The electrically insulating layer as disclosed herein can be provided as a plurality of layers within the device, such as a first patterned electrically insulating siloxane layer, and a second electrically insulating layer (patterned or unpatterned). It is also possible to have regions of the same or similar helium oxide material but with particles providing conductivity between the electrically insulating portions within the same layer. Additionally, an intervening conductive layer can be provided between the plurality of electrically insulating siloxane layers. In the case where the conductive portion and the electrically insulating portion are made of the same or similar siloxane materials as disclosed herein, the problem of CTE mismatch can be reduced.

更特定言之,關於上文提及之矽氧烷粒子組成物,在提供矽氧烷聚合物的情況下製得組成物。較佳地,聚合物具有氧化矽主鏈,其具有芳基(或烷基)取代基以及官能性交聯取代基。填充劑材料與矽氧烷聚合物混合。填充劑材料較佳為包括平均粒度為100微米或小於100微米,較佳10微米或小於10微米之粒子之粒狀材料。添加催化劑,當向組成物提供熱或UV光(或其他活化方法)時,催化劑與矽氧烷聚合物中之官能性交聯基團反應。More specifically, with respect to the above-mentioned azoxysilane particle composition, a composition is obtained in the case of providing a siloxane polymer. Preferably, the polymer has a ruthenium oxide backbone having an aryl (or alkyl) substituent and a functional crosslinker. The filler material is mixed with the siloxane polymer. The filler material is preferably a particulate material comprising particles having an average particle size of 100 microns or less, preferably 10 microns or less. The catalyst is added, and when heat or UV light (or other activation method) is provided to the composition, the catalyst reacts with a functional crosslinking group in the siloxane polymer.

單體(或寡聚)偶合劑包含於組成物中,較佳具有如同在矽氧烷聚合物中,當施加熱或光時同樣具反應性之官能性交聯基團。取決於組成物之最終用途,亦可添加額外材料,諸如穩定劑、抗氧化劑、分散劑、接著促進劑、塑化劑、軟化劑以及其他可能組分。儘管可添加溶劑,但在一較佳實施例中,組成物不含溶劑且為無溶劑之黏滯流體,所述組成物照此儲存及運送。The monomer (or oligomer) coupling agent is included in the composition, preferably having a functional cross-linking group which is also reactive when heat or light is applied, as in the siloxane polymer. Additional materials such as stabilizers, antioxidants, dispersants, adhesion promoters, plasticizers, softeners, and other possible components may also be added depending on the end use of the composition. Although a solvent may be added, in a preferred embodiment, the composition is solvent free and is a solvent free viscous fluid which is stored and transported as such.

如上文所指出,如本文中所揭示製造之組成物包括矽氧烷聚合物。為了製造矽氧烷聚合物,提供具有化學式SiR1 a R2 4-a 之第一化合物,其中a為1至3,R1 為反應性基團,且R2 為烷基或芳基。亦提供具有化學式SiR3 b R4 c R5 4-(b+c) 之第二化合物,其中R3 為交聯官能基,R4 為反應性基團,且R5 為烷基或芳基,且其中b=1至2,且c=1至(4-b)。連同第一化合物及第二化合物提供視情況選用之第三化合物以與其聚合。第三化合物可具有化學式SiR9 f R10 g ,其中R9 為反應性基團且f=1至4,且其中R10 為烷基或芳基且g=4-f。第一化合物、第二化合物以及第三化合物可以任何順序提供,且可提供這些化合物中之任一者之寡聚部分聚合型式來替代上文所提及之單體。As indicated above, the compositions made as disclosed herein include a decane polymer. To produce a siloxane polymer, a first compound of the formula SiR 1 a R 2 4-a is provided wherein a is 1 to 3, R 1 is a reactive group, and R 2 is an alkyl group or an aryl group. A second compound having the formula SiR 3 b R 4 c R 5 4-(b+c) wherein R 3 is a crosslinking functional group, R 4 is a reactive group, and R 5 is an alkyl group or an aryl group is also provided. And wherein b=1 to 2, and c=1 to (4-b). A third compound, optionally selected, is used in conjunction with the first compound and the second compound to polymerize therewith. The third compound may have the formula SiR 9 f R 10 g wherein R 9 is a reactive group and f=1 to 4, and wherein R 10 is an alkyl group or an aryl group and g=4-f. The first compound, the second compound, and the third compound may be provided in any order, and an oligomeric partial polymerization pattern of any of these compounds may be provided in place of the above-mentioned monomers.

第一化合物、第二化合物及第三化合物以及下文中敍述的任何化合物,若此類化合物具有多於一個單一類型之「R」基團,諸如複數個芳基或烷基,或複數個反應性基團,或複數個交聯官能基等,則獨立地選擇多個R基團以在每次出現時相同或不同。舉例而言,若第一化合物為SiR1 2 R2 2 ,則獨立地選擇多個R1 基團以使彼此相同或不同。同樣,獨立地選擇多個R2 基團以使彼此相同或不同。除非另外明確陳述,否則本文中提及之任何其他化合物為相同情況。a first compound, a second compound, and a third compound, and any compound described hereinafter, if such a compound has more than one single type of "R" group, such as a plurality of aryl or alkyl groups, or a plurality of reactivity A group, or a plurality of cross-linking functional groups, etc., independently select a plurality of R groups to be the same or different at each occurrence. For example, if the first compound is SiR 1 2 R 2 2 , a plurality of R 1 groups are independently selected to be the same or different from each other. Also, a plurality of R 2 groups are independently selected to be the same or different from each other. Unless otherwise stated explicitly, any other compounds mentioned herein are the same.

亦提供催化劑。催化劑可為鹼催化劑,或如下文所提及之其他催化劑。提供之催化劑應能夠將第一化合物及第二化合物聚合在一起。如上所述,添加化合物及催化劑之次序可為任何所需次序。一起提供之各種組分經聚合以產生具有所需分子量及黏度之矽氧烷聚合物材料。在聚合之後,添加粒子,諸如微米粒子、奈米粒子或其他所需粒子,連同其他視情況選用之組分,諸如偶合劑、催化劑、穩定劑、接著促進劑以及類似物。組成物之組分之組合可按任何所需次序進行。Catalysts are also provided. The catalyst can be a base catalyst or other catalyst as mentioned below. The catalyst provided should be capable of polymerizing the first compound and the second compound together. As noted above, the order in which the compound and catalyst are added can be in any desired order. The various components provided together are polymerized to produce a naphthenic polymer material having the desired molecular weight and viscosity. After polymerization, particles such as microparticles, nanoparticles or other desired particles are added, along with other optional components such as coupling agents, catalysts, stabilizers, subsequent promoters, and the like. The combination of the components of the composition can be carried out in any desired order.

更特定言之,在一個實例中,藉由聚合第一化合物及第二化合物製造矽氧烷聚合物,其中第一化合物具有化學式SiR1 a R2 4-a ,其中a為1至3,R1 為反應性基團,且R2 為烷基或芳基,且第二化合物具有化學式SiR3 b R4 c R5 4-(b+c) ,其中R3 為交聯官能基,R4 為反應性基團,且R5 為烷基或芳基,且其中b=1至2,且c=1至(4-b)。More specifically, in one example, a siloxane polymer is produced by polymerizing a first compound and a second compound, wherein the first compound has the formula SiR 1 a R 2 4-a , wherein a is 1 to 3, R 1 is a reactive group, and R 2 is an alkyl group or an aryl group, and the second compound has the formula SiR 3 b R 4 c R 5 4-(b+c) wherein R 3 is a crosslinking functional group, R 4 Is a reactive group, and R 5 is an alkyl group or an aryl group, and wherein b = 1 to 2, and c = 1 to (4-b).

第一化合物可具有1至3個結合至化合物中之矽之烷基或芳基(R2 )。不同烷基之組合、不同芳基之組合或烷基及芳基兩者之組合為可能的。在烷基之情況下,烷基較佳含有1至18個,更佳1至14個且尤其更佳1至12個碳原子。預想較短烷基,諸如1至6個碳(例如2至6個碳原子)。烷基可與一或多個,較佳兩個C1至C6烷基在α位置或β位置處分支。特定言之,烷基為含有1至6個碳原子之低碳數烷基,其視情況攜有1至3個選自甲基及鹵素之取代基。甲基、乙基、正丙基、異丙基、正丁基、異丁基以及第三丁基尤其更佳。環烷基亦為可能的,如環己基、金剛烷基、降冰片烯或降冰片烷基。The first compound may have 1 to 3 alkyl or aryl groups (R 2 ) bonded to the oxime in the compound. Combinations of different alkyl groups, combinations of different aryl groups, or combinations of both alkyl and aryl groups are possible. In the case of an alkyl group, the alkyl group preferably has 1 to 18, more preferably 1 to 14, and particularly more preferably 1 to 12 carbon atoms. Shorter alkyl groups are contemplated, such as from 1 to 6 carbons (e.g., from 2 to 6 carbon atoms). The alkyl group may be branched at one or the beta position with one or more, preferably two, C1 to C6 alkyl groups. Specifically, the alkyl group is a lower alkyl group having 1 to 6 carbon atoms, and optionally has 1 to 3 substituents selected from a methyl group and a halogen. Methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl and tert-butyl are especially preferred. Cycloalkyl groups are also possible, such as cyclohexyl, adamantyl, norbornene or norbornyl.

若R2 為芳基,則芳基可為苯基,其視情況在環上攜有1至5個選自鹵素、烷基或烯基之取代基,或萘基,其視情況在環結構上攜有1至11個選自鹵素烷基或烯基之取代基,所述取代基視情況經氟化(包含全氟化或部分氟化)。若芳基為多環芳基,則多環芳基可例如為蒽、萘、菲、并四苯,其視情況可攜有1-8個取代基或亦可視情況藉由含有1至12個碳之烷基、烯基、炔基或芳基與矽原子「間隔開」。諸如苯基之單環結構亦可以此方式與矽原子間隔開。If R 2 is aryl, the aryl group may be phenyl, which optionally carries from 1 to 5 substituents selected from halogen, alkyl or alkenyl, or naphthyl, optionally on the ring structure. Carrying from 1 to 11 substituents selected from haloalkyl or alkenyl groups, which are optionally fluorinated (including perfluorinated or partially fluorinated). If the aryl group is a polycyclic aryl group, the polycyclic aryl group may be, for example, anthracene, naphthalene, phenanthrene or tetracene, which may optionally carry 1-8 substituents or, as the case may be, 1 to 12 The alkyl, alkenyl, alkynyl or aryl group of the carbon is "interleaved" from the ruthenium atom. A single ring structure such as a phenyl group may also be spaced apart from the germanium atom in this manner.

藉由在第一化合物與第二化合物之間進行聚合反應(較佳鹼催化之聚合反應)製得矽氧烷聚合物。如下文闡述之視情況選用之額外化合物可包含為聚合反應的一部分。The oxirane polymer is obtained by conducting a polymerization reaction between the first compound and the second compound, preferably a base-catalyzed polymerization. Additional compounds, as exemplified below, may be included as part of the polymerization reaction.

第一化合物可具有任何適合之反應性基團R1 ,諸如羥基、鹵素、烷氧基、羧基、胺或醯氧基。若舉例而言,第一化合物中之反應性基團為-OH基團,則第一化合物之更特定實例可包含矽烷二醇,尤其為諸如二苯基矽烷二醇、二甲基矽烷二醇、二異丙基矽烷二醇、二正丙基矽烷二醇、二正丁基矽烷二醇、二-第三丁基矽烷二醇、二異丁基矽烷二醇、苯基甲基矽烷二醇以及二環己基矽烷二醇。The first compound may have any suitable reactive group R 1 such as a hydroxyl group, a halogen, an alkoxy group, a carboxyl group, an amine or a decyloxy group. By way of example, where the reactive group in the first compound is an -OH group, a more specific example of the first compound may comprise a decane diol, especially such as diphenyl decane diol, dimethyl decane diol. , diisopropyl decanediol, di-n-propyl decane diol, di-n-butyl decane diol, di-tert-butyl decane diol, diisobutyl decane diol, phenyl methyl decane diol And dicyclohexyldecanediol.

第二化合物可具有任何適合之反應性基團R4 ,諸如羥基、鹵素、烷氧基、羧基、胺或醯氧基,其可與第一化合物中之反應性基團相同或不同。基團R5 若完全存在於第二化合物中,則獨立地為烷基或芳基,諸如針對第一化合物中之基團R2 。烷基或芳基R5 可與第一化合物中之基團R2 相同或不同。The second compound may have any suitable reactive group R 4 such as a hydroxyl group, a halogen, an alkoxy group, a carboxyl group, an amine or a decyloxy group which may be the same as or different from the reactive group in the first compound. If the group R 5 is completely present in the second compound, it is independently an alkyl or aryl group, such as for the group R 2 in the first compound. The alkyl or aryl R 5 may be the same as or different from the group R 2 in the first compound.

第二化合物之交聯反應性基團R3 可為任何可藉由酸、鹼、自由基或熱催化之反應交聯之官能基。此等官能基可例如為任何環氧化物、環氧丙烷(oxetane)、丙烯酸酯、烯基或炔基。The crosslinking reactive group R 3 of the second compound may be any functional group which can be crosslinked by an acid, base, radical or thermal catalyzed reaction. Such functional groups can be, for example, any epoxide, oxetane, acrylate, alkenyl or alkynyl group.

在環氧基團之情況下,其可為具有三個可使用酸、鹼以及熱催化之反應交聯之環原子之環醚。此等含有交聯基團的環氧化物之實例為縮水甘油氧基丙基及(3,4-環氧環己基)乙基(僅舉數例)。In the case of an epoxy group, it may be a cyclic ether having three ring atoms crosslinkable using an acid, a base, and a thermally catalyzed reaction. Examples of such epoxides containing a crosslinking group are glycidoxypropyl and (3,4-epoxycyclohexyl)ethyl, to name a few.

在環氧丙烷基團之情況下,其可為具有四個可使用酸、鹼以及熱催化之反應交聯之環原子之環醚。此類含有環氧丙烷之矽烷之實例包含3-(3-乙基-3-氧雜環丁基甲氧基)丙基三乙氧基矽烷、3-(3-甲基-3-氧雜環丁基甲氧基)丙基三乙氧基矽烷、3-(3-乙基-3-氧雜環丁基甲氧基)丙基三甲氧基矽烷或3-(3-甲基-3-氧雜環丁基甲氧基)丙基三甲氧基矽烷(僅舉數例)。In the case of a propylene oxide group, it can be a cyclic ether having four ring atoms which can be crosslinked using an acid, a base and a thermally catalyzed reaction. Examples of such propylene oxide-containing decanes include 3-(3-ethyl-3-oxetanylmethoxy)propyltriethoxydecane, 3-(3-methyl-3-oxetanylmethyl) Oxy)propyltriethoxydecane, 3-(3-ethyl-3-oxetanylmethoxy)propyltrimethoxydecane or 3-(3-methyl-3-oxetanylmethoxy) Propyltrimethoxydecane (to name a few).

在烯基之情況下,此類基團可具有較佳2至18個、更佳2至14個且尤其更佳2至12個碳原子。烯系(亦即與雙鍵鍵結之兩個碳原子)基團較佳位於相對於分子中之Si原子之位置2或更高位置。分支鏈烯基較佳在α位置或β位置與一個且更佳兩個C1至C6烷基、烯基或炔基、視情況存在之氟化或全氟化烷基、烯基或炔基分支。In the case of alkenyl groups, such groups may have from 2 to 18, more preferably from 2 to 14, and especially more preferably from 2 to 12 carbon atoms. The olefinic (i.e., two carbon atoms bonded to the double bond) group is preferably located at a position 2 or higher relative to the position of the Si atom in the molecule. Branched alkenyl is preferably at the alpha or beta position with one and more preferably two C1 to C6 alkyl, alkenyl or alkynyl, optionally fluorinated or perfluorinated alkyl, alkenyl or alkynyl branches .

在炔基之情況下,其可具有較佳2至18個、更佳2至14個且尤其更佳2至12個碳原子。炔系基團(亦即與參鍵鍵結之兩個碳原子)較佳位於相對於分子中之Si原子或M原子之位置2或更高位置。分支鏈炔基較佳在α位置或β位置與一個且更佳兩個C1至C6烷基、烯基或炔基、視情況存在之全氟化烷基、烯基或炔基分支。In the case of an alkynyl group, it may have preferably 2 to 18, more preferably 2 to 14, and especially more preferably 2 to 12 carbon atoms. The acetylene group (i.e., the two carbon atoms bonded to the bond) is preferably located at a position 2 or higher relative to the position of the Si atom or the M atom in the molecule. The branched alkynyl group is preferably at the alpha position or the beta position with one and more preferably two C1 to C6 alkyl, alkenyl or alkynyl groups, optionally a perfluorinated alkyl, alkenyl or alkynyl group.

在巰基之情況下,其可為任何含有碳鍵結之硫氫基之有機硫化合物。含巰基之矽烷之實例為3-巰基丙基三甲氧基矽烷及3-巰基丙基三乙氧基矽烷。In the case of a fluorenyl group, it may be any organic sulfur compound containing a carbon-bonded sulfhydryl group. Examples of decyl-containing decanes are 3-mercaptopropyltrimethoxydecane and 3-mercaptopropyltriethoxydecane.

第二化合物中之反應性基團可為烷氧基。烷氧基之烷基殘基可為直鏈或分支鏈的。較佳地,烷氧基由具有1至6個碳原子之低碳數烷氧基(諸如甲氧基、乙氧基、丙氧基以及第三丁氧基組成)。第二化合物之特定實例為矽烷,尤其為諸如2-(3,4-環氧環己基)乙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三乙氧基矽烷、3-(三甲氧基矽基)甲基丙烯酸丙酯、3-(三甲氧基矽基)丙烯酸丙酯、(3-縮水甘油基氧基丙基)三甲氧基矽烷或3-縮水甘油氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷。The reactive group in the second compound may be an alkoxy group. The alkyl residue of the alkoxy group can be straight or branched. Preferably, the alkoxy group consists of a lower alkoxy group having 1 to 6 carbon atoms such as a methoxy group, an ethoxy group, a propoxy group and a third butoxy group. A specific example of the second compound is decane, especially such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltriethoxydecane. , 3-(trimethoxydecyl)propyl methacrylate, 3-(trimethoxydecyl)propyl acrylate, (3-glycidyloxypropyl)trimethoxynonane or 3-glycidoxy Propyltriethoxydecane, 3-methacryloxypropyltrimethoxydecane, 3-propenyloxypropyltrimethoxydecane.

第三化合物可連同第一化合物及第二化合物提供以與其聚合。第三化合物可具有以下化學式:SiR9 f R10 g ,其中R9 為反應性基團,且f=1至4,且其中R10 為烷基或芳基,且g=4-f。一個此類實例為四甲氧基矽烷。其他實例尤其包含苯基甲基二甲氧基矽烷、三甲基甲氧基矽烷、二甲基二甲氧基矽烷矽烷、乙烯基三甲氧基矽烷、烯丙基三甲氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三丙氧基矽烷、丙基乙基三甲氧基矽烷、乙基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷。The third compound can be provided in conjunction with the first compound and the second compound to polymerize therewith. The third compound may have the formula: SiR 9 f R 10 g wherein R 9 is a reactive group, and f = 1 to 4, and wherein R 10 is an alkyl group or an aryl group, and g = 4-f. One such example is tetramethoxynonane. Other examples include, in particular, phenylmethyldimethoxydecane, trimethylmethoxydecane, dimethyldimethoxydecane, vinyltrimethoxydecane, allyltrimethoxydecane, methyltrimethyl Oxy decane, methyl triethoxy decane, methyl tripropoxy decane, propyl ethyl trimethoxy decane, ethyl triethoxy decane, vinyl trimethoxy decane, vinyl triethoxy Decane.

儘管第一化合物及第二化合物之聚合可使用酸催化劑進行,鹼催化劑為較佳的。用於第一化合物與第二化合物之間的鹼催化聚合之鹼催化劑可為任何適合之鹼性化合物。此等鹼性化合物之實例尤其為任何胺,如三乙胺,及任何鋇氫氧化物,如氫氧化鋇、單水合氫氧化鋇、八水合氫氧化鋇。其他鹼性催化劑包含氧化鎂、氧化鈣、氧化鋇、氨、過氯酸銨、氫氧化鈉、氫氧化鉀、咪唑或正丁胺。在一個特定實例中,鹼催化劑為Ba(OH)2 。可相對於在一起的第一化合物及第二化合物以小於0.5%之重量%,或以較低量,諸如以小於0.1%之重量%提供鹼催化劑。Although the polymerization of the first compound and the second compound can be carried out using an acid catalyst, a base catalyst is preferred. The base catalyst for base-catalyzed polymerization between the first compound and the second compound may be any suitable basic compound. Examples of such basic compounds are, in particular, any amine, such as triethylamine, and any barium hydroxide such as barium hydroxide, barium hydroxide monohydrate, barium hydroxide octahydrate. Other basic catalysts include magnesium oxide, calcium oxide, barium oxide, ammonia, ammonium perchlorate, sodium hydroxide, potassium hydroxide, imidazole or n-butylamine. In a particular example, the base catalyst is Ba(OH) 2 . The base catalyst can be provided in a weight ratio of less than 0.5% by weight relative to the first compound and the second compound together, or in a lower amount, such as less than 0.1% by weight.

聚合可在熔融相或液體介質中進行。溫度在約20℃到200℃,通常約25℃到160℃,尤其約40℃到120℃範圍內。總體上,聚合在環境壓力下進行且最大溫度藉由使用之任何溶劑之沸點設定。聚合可在回流條件下進行。其他壓力及溫度亦為可能的。第一化合物與第二化合物之莫耳比可為95:5至5:95,尤其90:10至10:90,較佳80:20至20:80。在一較佳實例中,第一化合物與第二化合物(或第二化合物加上參與聚合反應之其他化合物-參見下文)之莫耳比為至少40:60,或甚至45:55或更高。The polymerization can be carried out in a molten phase or a liquid medium. The temperature is in the range of from about 20 ° C to 200 ° C, usually from about 25 ° C to 160 ° C, especially from about 40 ° C to 120 ° C. In general, the polymerization is carried out under ambient pressure and the maximum temperature is set by the boiling point of any solvent used. The polymerization can be carried out under reflux conditions. Other pressures and temperatures are also possible. The molar ratio of the first compound to the second compound may range from 95:5 to 5:95, especially from 90:10 to 10:90, preferably from 80:20 to 20:80. In a preferred embodiment, the molar ratio of the first compound to the second compound (or the second compound plus other compounds involved in the polymerization - see below) is at least 40:60, or even 45:55 or higher.

在一個實例中,第一化合物具有-OH基團作為反應性基團且第二化合物具有烷氧基作為反應性基團。較佳地,就添加之第一化合物之量而言-OH基團之總數不大於第二化合物中之反應性基團(例如烷氧基)之總數,且較佳小於第二化合物中(或第二化合物加上與烷氧基一起添加之任何其他化合物,例如添加之四甲氧基矽烷或聚合反應中涉及之其他第三化合物(如本文所提及)中)之反應性基團之總數。在烷氧基數目超過羥基的情況下,所有或基本上所有-OH基團將反應且自矽氧烷移除,諸如甲醇(若烷氧基矽烷為甲氧基矽烷)、乙醇(若烷氧基矽烷為乙氧基矽烷)等。儘管第一化合物中之-OH基團之數目及第二化合物中之反應性基團(較佳除-OH基團以外)之數目可基本上相同,較佳的是第二化合物中之反應性基團之總數在數目上超過第一化合物中之-OH基團10%或更多,較佳25%或更多。在一些實施例中,第二化合物反應性基團之數目超過第一化合物-OH基團40%或更多,或甚至60%或更多,75%或更多,或高達100%或更多。在聚合之後移除甲醇、乙醇或聚合反應之其他副產物(取決於所選化合物),較佳在乾燥腔室蒸發出。In one example, the first compound has an -OH group as a reactive group and the second compound has an alkoxy group as a reactive group. Preferably, the total number of -OH groups in the amount of the first compound added is not greater than the total number of reactive groups (eg, alkoxy groups) in the second compound, and preferably less than in the second compound (or The total number of reactive groups of the second compound plus any other compound added with the alkoxy group, such as added tetramethoxynonane or other third compound (as referred to herein) involved in the polymerization reaction) . In the case where the number of alkoxy groups exceeds the hydroxyl group, all or substantially all of the -OH groups will be reacted and removed from the oxirane, such as methanol (if the alkoxy decane is methoxy decane), ethanol (if alkoxylated) The decane is ethoxy decane) and the like. Although the number of -OH groups in the first compound and the number of reactive groups in the second compound (preferably other than the -OH group) may be substantially the same, it is preferred that the reactivity in the second compound The total number of groups is more than 10% or more, preferably 25% or more, in number to the -OH group in the first compound. In some embodiments, the number of reactive groups of the second compound exceeds 40% or more of the first compound-OH group, or even 60% or more, 75% or more, or up to 100% or more . Removal of methanol, ethanol or other by-products of the polymerization (depending on the selected compound) after polymerization is preferably carried out in a drying chamber.

獲得之矽氧烷聚合物具有任何所需(重量平均)分子量,諸如500公克/莫耳至100,000公克/莫耳。分子量可在此範圍之下端(例如500公克/莫耳至10,000公克/莫耳或更佳500公克/莫耳至8,000公克/莫耳)或有機矽氧烷材料之分子量可在此範圍之上端(諸如10,000公克/莫耳至100,000公克/莫耳或更佳15,000公克/莫耳至50,000公克/莫耳)。可能需要將具有較低分子量之聚合物有機矽氧烷材料與具有較高分子量之有機矽氧烷材料混合。The obtained alkane polymer has any desired (weight average) molecular weight, such as from 500 g/m to 100,000 g/m. The molecular weight may be at the lower end of the range (for example, 500 g/m to 10,000 g/mole or more preferably 500 g/m to 8,000 g/mole) or the molecular weight of the organosiloxane material may be above the range ( Such as 10,000 gram/mole to 100,000 gram/mole or better 15,000 gram/mole to 50,000 gram/mole. It may be desirable to mix a polymer organic siloxane material having a lower molecular weight with an organic siloxane material having a higher molecular weight.

取決於聚合物之最終所需用途,獲得之矽氧烷聚合物可接著與額外組分組合。較佳地,矽氧烷聚合物與填充劑組合以形成組成物,諸如具有平均粒度小於100微米,較佳小於50微米,包含小於20微米之粒子之微粒填充劑。額外組分可為組成物之一部分,諸如催化劑或固化劑、一或多種偶合劑、分散劑、抗氧化劑、穩定劑、接著促進劑及/或其他所需組分,其取決於矽氧烷材料之最終所需用途。在一個實例中,包含可將氧化表面還原為其金屬形式之還原劑。還原劑可在粒子為具有表面氧化之金屬粒子之情況下自粒子移除氧化,及/或自例如金屬接合墊或已經氧化之其他金屬或導電區域移除氧化,以改良矽氧烷粒子材料與其所沈積或接著之表面之間的電連接。還原劑或穩定劑可包含乙二醇、β-D-葡萄糖、聚環氧乙烷、甘油、1,2-丙二醇、N,N二甲基甲醯胺、聚-丙烯酸鈉(PSA)、具有聚丙烯酸之β-環糊精、二羥基苯、聚乙烯醇、1,2-丙二醇、肼、硫酸肼、硼氫化鈉、抗壞血酸、對苯二酚家族、五倍子酸、連苯三酚、乙二醛、乙醛、戊二醛、脂族二醛家族、三聚甲醛、錫粉、鋅粉、甲酸。亦可添加添加劑,諸如穩定劑,例如抗氧化劑,諸如豔佳諾克司(Irganox)(如下文中所提及)或二嗪衍生物。The naphthenic polymer obtained can then be combined with additional components depending on the final desired use of the polymer. Preferably, the decane polymer is combined with a filler to form a composition, such as a particulate filler having particles having an average particle size of less than 100 microns, preferably less than 50 microns, comprising less than 20 microns. The additional component may be part of a composition such as a catalyst or curing agent, one or more coupling agents, a dispersing agent, an antioxidant, a stabilizer, a subsequent accelerator, and/or other desired components depending on the siloxane material The final desired use. In one example, a reducing agent is included that reduces the oxidized surface to its metallic form. The reducing agent may remove oxidation from the particles if the particles are metal particles having surface oxidation, and/or remove oxidation from, for example, metal bonding pads or other metals or conductive regions that have been oxidized to improve the siloxane oxide material and Electrical connection between the deposited or subsequent surfaces. The reducing agent or stabilizer may comprise ethylene glycol, β-D-glucose, polyethylene oxide, glycerin, 1,2-propanediol, N,N-dimethylformamide, sodium polyacrylate (PSA), Polyacrylic acid β-cyclodextrin, dihydroxybenzene, polyvinyl alcohol, 1,2-propanediol, hydrazine, barium sulfate, sodium borohydride, ascorbic acid, hydroquinone family, gallic acid, pyrogallol, ethylene Aldehyde, acetaldehyde, glutaraldehyde, aliphatic dialdehyde family, trioxane, tin powder, zinc powder, formic acid. Additives such as stabilizers such as antioxidants such as Irganox (as mentioned below) or diazine derivatives may also be added.

交聯矽或非矽類樹脂及寡聚物可用於增強矽氧烷聚合物之間的交聯。藉由矽氧烷聚合物之官能性選擇添加之交聯寡聚物或樹脂之官能性。若舉例而言,在矽氧烷聚合物之聚合期間使用環氧類烷氧基矽烷,則可使用環氧官能性寡聚物或樹脂。環氧寡聚物或樹脂可為任何二官能性、三官能性、四官能性或更高官能性環氧寡聚物或樹脂。此等環氧寡聚物或樹脂之實例可為1,3-雙2-(3,4-環氧環己基)乙基1,1,3,3-四甲基二矽氧烷、1,3-雙環氧丙氧基丙基1,1,3,3-四甲基二矽氧烷、己二酸雙(3,4-環氧環己基甲基)酯、3,4-環氧基環己烷甲酸3,4-環氧環己基甲酯、1,4-環己烷二甲醇二縮水甘油醚、雙酚A二縮水甘油醚、1,2-環己烷二甲酸二縮水甘油酯(僅舉數例)。Crosslinked ruthenium or non-ruthenium resins and oligomers can be used to enhance cross-linking between the siloxane polymers. The functionality of the crosslinked oligomer or resin added is selected by the functionality of the siloxane polymer. By way of example, an epoxy-based alkoxysilane may be used during the polymerization of the siloxane polymer, and an epoxy-functional oligomer or resin may be used. The epoxy oligomer or resin can be any difunctional, trifunctional, tetrafunctional or higher functional epoxy oligomer or resin. An example of such an epoxy oligomer or resin may be 1,3-bis 2-(3,4-epoxycyclohexyl)ethyl 1,1,3,3-tetramethyldioxane, 1, 3-diglycidoxypropyl 1,1,3,3-tetramethyldioxane, bis(3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy 3,4-epoxycyclohexylmethyl chlorocyclohexane, 1,4-cyclohexanedimethanol diglycidyl ether, bisphenol A diglycidyl ether, 1,2-cyclohexanedicarboxylic acid diglycidyl Ester (to name a few).

添加至最終調配物之固化劑為可起始及/或加速矽氧烷聚合物中之官能基之固化過程之任何化合物。此等固化劑可為熱及/或UV活化的。如上所述之矽氧烷聚合物中之交聯基團較佳為環氧化物、環氧丙烷、丙烯酸酯、烯基或炔基。基於矽氧烷聚合物中之交聯基團選擇固化劑。The curing agent added to the final formulation is any compound that initiates and/or accelerates the curing process of the functional groups in the siloxane polymer. These curing agents can be thermally and/or UV activated. The crosslinking group in the siloxane polymer as described above is preferably an epoxide, propylene oxide, acrylate, alkenyl or alkynyl group. The curing agent is selected based on the crosslinking group in the siloxane polymer.

在一個實施例中,用於環氧基及環氧丙烷基團之固化劑可選自顯示經阻斷或減少之活性之含氮固化劑,諸如一級胺及/或二級胺。定義「顯示經阻斷或減少之反應性之一級胺或二級胺」應意指由於化學或物理阻斷而不能與樹脂組分反應或僅具有與樹脂組分反應之極低能力,但可在釋放胺之後再生其反應性,例如藉由在升高之溫度下使其熔化、藉由移除外鞘或塗層、藉由壓力或超音波或其他能量類型之作用,開始樹脂組分之固化反應之彼等胺。In one embodiment, the curing agent for the epoxy and propylene oxide groups may be selected from nitrogen-containing curing agents that exhibit blocked or reduced activity, such as primary amines and/or secondary amines. The definition "displays a blocked or reduced reactivity of a primary amine or a secondary amine" shall mean an extremely low ability to react with a resin component or only react with a resin component due to chemical or physical blocking, but may Regenerating the reactivity after releasing the amine, for example by melting it at elevated temperatures, by removing the outer sheath or coating, by pressure or by ultrasonic or other energy type, starting the resin component The amines of the curing reaction.

熱可活化固化劑之實例包含至少一種有機硼烷或硼烷與至少一種胺之複合物。胺可為複合有機硼烷及/或硼烷且可在必要時解複合以釋放有機硼烷或硼烷之任何類型。胺可包括多種結構,例如任何一級胺或二級胺或含有一級胺及/或二級胺之多元胺。有機硼烷可選自烷基硼烷。此等熱可活化、尤其更佳硼烷化合物之實例為三氟化硼。適合之胺/(有機)硼烷複合物購自諸如金氏工業(King Industries)、空氣產品(Air products)以及ATO技術公司(ATO-Tech)之商業來源。Examples of thermally activatable curing agents comprise at least one organoborane or a complex of borane with at least one amine. The amine can be a complex organoborane and/or borane and can be decomposed as necessary to release any type of organoborane or borane. The amine can include a variety of structures, such as any primary or secondary amine or a polyamine containing a primary amine and/or a secondary amine. The organoborane can be selected from the group consisting of alkylboranes. An example of such thermally activatable, especially preferred borane compounds is boron trifluoride. Suitable amine/(organo)borane complexes are commercially available from commercial sources such as King Industries, Air products, and ATO-Tech.

用於環氧基之其他熱活化固化劑為熱酸產生劑,其可在高溫下釋放強酸以催化環氧基之交聯反應。此等熱酸產生劑可例如為具有BF4 - 、PF6 - 、SbF6 - 、CF3 SO3 - 以及(C6 F5 )4 B- 型複合陰離子之任何鎓鹽,如硫鎓鹽及碘鎓鹽。此等熱酸產生劑之商業實例為金氏工業製造之K-PURE CXC-1612及K-PURE CXC-1614。Other heat activated curing agents for epoxy groups are thermal acid generators which release a strong acid at elevated temperatures to catalyze the crosslinking reaction of the epoxy groups. These thermal acid generating agent may be, for example, 4 having a BF -, PF 6 -, SbF 6 -, CF 3 SO 3 - and (C 6 F 5) 4 B - anion of any compound of onium salt type, such as sulfonium salts and Iodine salt. Commercial examples of such thermal acid generators are K-PURE CXC-1612 and K-PURE CXC-1614 manufactured by King's Industrial.

另外,就含有聚合物之環氧化物及/或環氧丙烷而言,可使用經設計以參與或促進接著劑調配物之固化之固化劑、共固化劑、催化劑、引發劑或其他添加劑,如酸酐、胺、咪唑、硫醇、羧酸、酚、二氰二胺、脲、肼、醯肼、胺基-甲醛樹脂、三聚氰胺-甲醛樹脂、四級銨鹽、四級鏻鹽、三芳基硫鎓鹽、二芳基碘鎓鹽、重氮鹽以及類似物。In addition, in the case of epoxides and/or propylene oxide containing polymers, curing agents, co-curing agents, catalysts, initiators or other additives designed to participate in or promote curing of the adhesive formulation may be used, such as Anhydride, amine, imidazole, thiol, carboxylic acid, phenol, dicyandiamide, urea, hydrazine, hydrazine, amine-formaldehyde resin, melamine-formaldehyde resin, quaternary ammonium salt, quaternary phosphonium salt, triaryl sulphur Onium salts, diaryliodonium salts, diazonium salts, and the like.

對於丙烯酸酯,烯基及炔基交聯基團固化劑可為熱或UV活化的。熱活化之實例為過氧化物及偶氮化合物。過氧化物為含有不穩定氧-氧單鍵之化合物,所述單鍵易於經由溶血性裂解拆分成反應性自由基。偶氮化合物具有可分解為氮氣及兩個有機自由基之R-N=N-R官能基。在此兩種情況下,自由基均可催化丙烯酸酯、烯基及炔基鍵之聚合。過氧化物及偶氮化合物之實例為二-第三丁基過氧化物、2,2-雙(第三丁基過氧基)丁烷、過乙酸第三丁酯、2,5-二(第三丁基過氧基)-2,5-二甲基-3-己炔、過氧化二異丙苯、過氧化苯甲醯、二-第三戊基過氧化物、過氧基苯甲酸第三丁酯、4,4'-偶氮雙(4-氰基戊酸)、2,2'-偶氮雙(2-甲脒基丙烷)二鹽酸鹽、二苯基二氮烯、偶氮二甲酸二乙酯以及1,1'-偶氮雙(環己烷甲腈)(僅舉數例)。For acrylates, alkenyl and alkynyl crosslinking group curing agents can be thermally or UV activated. Examples of thermal activation are peroxides and azo compounds. Peroxides are compounds containing labile oxygen-oxygen single bonds that are readily resolved into reactive free radicals via hemolytic cleavage. The azo compound has an R-N=N-R functional group which is decomposable into nitrogen and two organic radicals. In both cases, the free radicals catalyze the polymerization of acrylate, alkenyl and alkynyl linkages. Examples of peroxides and azo compounds are di-tert-butyl peroxide, 2,2-bis(t-butylperoxy)butane, tert-butyl peracetate, 2,5-di ( Tert-butylperoxy)-2,5-dimethyl-3-hexyne, dicumyl peroxide, benzammonium peroxide, di-third amyl peroxide, peroxybenzoic acid Third butyl ester, 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobis(2-methylamidinopropane) dihydrochloride, diphenyldiazenene, Diethyl azodicarboxylate and 1,1'-azobis(cyclohexanecarbonitrile), to name a few.

光引發劑為當曝露於光時分解為自由基且因此可促進丙烯酸酯、烯基以及炔基化合物之聚合之化合物。此等光引發劑之商業實例為由巴斯夫(BASF)製造之豔佳固(Irgacure)149、豔佳固184、豔佳固369、豔佳固500、豔佳固651、豔佳固784、豔佳固819、豔佳固907、豔佳固1700、豔佳固1800、豔佳固1850、豔佳固2959、豔佳固1173、豔佳固4265。Photoinitiators are compounds which, upon exposure to light, decompose into free radicals and thus promote the polymerization of acrylate, alkenyl and alkynyl compounds. Commercial examples of such photoinitiators are Irgacure 149, Yanjiagu 184, Yanjiagu 369, Yanjiagu 500, Yanjiagu 651, Yanjiagu 784, Yan, manufactured by BASF. Jiagu 819, Yan Jiagu 907, Yan Jiagu 1700, Yan Jiagu 1800, Yan Jiagu 1850, Yan Jiagu 2959, Yan Jiagu 1173, Yan Jiagu 4265.

將固化劑併入至系統之一種方法為將固化劑或可充當固化劑之官能基附接至矽烷單體。因此,固化劑將加速矽氧烷聚合物之固化。附接至矽烷單體之此等種類之固化劑之實例為γ-咪唑基丙基三乙氧基矽烷、γ-咪唑基丙基三甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-(三乙氧基矽基)丙基丁二酸酐、3-(三甲氧基矽基)丙基丁二酸酐、3-胺基丙基三甲氧基矽烷以及3-胺基丙基三乙氧基矽烷(僅舉數例)。One method of incorporating a curing agent into the system is to attach a curing agent or a functional group that can act as a curing agent to the decane monomer. Therefore, the curing agent will accelerate the curing of the siloxane polymer. Examples of such types of curing agents attached to decane monomers are γ-imidazolylpropyltriethoxydecane, γ-imidazolylpropyltrimethoxydecane, 3-mercaptopropyltrimethoxydecane, 3 - mercaptopropyltriethoxydecane, 3-(triethoxyindolyl)propyl succinic anhydride, 3-(trimethoxyindolyl)propyl succinic anhydride, 3-aminopropyltrimethoxy Decane and 3-aminopropyltriethoxydecane, to name a few.

接著促進劑可為組成物之一部分且可為可增強固化產品與已塗覆產品之表面之間的接著之任何適合之化合物。最常用之接著促進劑為官能性矽烷,其中包含烷氧基矽烷及1至3個官能基。用於晶粒附接產物中之接著促進劑之實例可為辛基三乙氧基矽烷、巰基丙基三乙氧基矽烷、氰基丙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三乙氧基矽烷、3-(三甲氧基矽基)甲基丙烯酸丙酯、3-(三甲氧基矽基)丙烯酸丙酯、(3-縮水甘油基氧基丙基)三甲氧基矽烷或3-縮水甘油氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷以及3-丙烯醯氧基丙基三甲氧基矽烷。The promoter can then be part of the composition and can be any suitable compound that enhances the adhesion between the cured product and the surface of the coated product. The most commonly used promoter is a functional decane comprising an alkoxydecane and from 1 to 3 functional groups. Examples of the subsequent promoter for use in the die attach product may be octyltriethoxydecane, mercaptopropyltriethoxydecane, cyanopropyltrimethoxydecane, 2-(3,4-ring) Oxycyclohexyl)ethyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltriethoxydecane, 3-(trimethoxyindolyl)propyl methacrylate, 3-(trimethyl) Ethyl methoxy) propyl acrylate, (3-glycidyloxypropyl) trimethoxy decane or 3-glycidoxy propyl triethoxy decane, 3-methyl propylene methoxy propyl trimethyl Oxydecane and 3-propenyloxypropyltrimethoxydecane.

形成之聚合矽氧烷將具有[Si-O-Si-O]n重複主鏈,其上的有機官能基取決於含矽起始材料。然而,亦有可能達成[Si-O-Si-C]n或甚至[Si-O-Me-O]n(其中Me為金屬)主鏈。The resulting polymeric oxane will have a [Si-O-Si-O]n repeating backbone on which the organic functional groups will depend on the ruthenium containing starting material. However, it is also possible to achieve [Si-O-Si-C]n or even [Si-O-Me-O]n (where Me is a metal) backbone.

為了獲得[Si-O-Si-C]主鏈,具有以下式之化學品: R2 3-a R1 a SiR11 SiR1 b R2 3-b 其中 a為1至3, b為1至3, R1 為如上文解釋之反應性基團, R2 為烷基、烯基、炔基、醇、羧酸、二羧酸、芳基、聚芳基、多環烷基、雜環脂族基、雜環狀芳族基且 R11 獨立地為烷基或芳基, 或其分子量小於1000公克/莫耳之寡聚物, 可與如上所述之第一化合物、第二化合物以及第三化合物或此等的任何組合一起聚合。In order to obtain the [Si-O-Si-C] backbone, a chemical having the formula: R 2 3-a R 1 a SiR 11 SiR 1 b R 2 3-b wherein a is 1 to 3 and b is 1 to 3, R 1 is a reactive group as explained above, R 2 is alkyl, alkenyl, alkynyl, alcohol, carboxylic acid, dicarboxylic acid, aryl, polyaryl, polycycloalkyl, heterocyclic a group-based, heterocyclic aromatic group and R 11 is independently an alkyl or aryl group, or an oligomer having a molecular weight of less than 1000 g/mole, which may be combined with the first compound, the second compound, and the The tri compound or any combination of these is polymerized together.

此等化合物之實例為1,2-雙(二甲基羥基矽烷基)乙烷、1,2-雙(三甲氧基矽烷基)乙烷、1,2-雙(二甲氧基甲基矽烷基)乙烷、1,2-雙(甲氧基二甲基矽烷基)乙烷、1,2-雙(三乙氧基矽烷基)乙烷、1,3-雙(二甲基羥基矽烷基)丙烷、1,3-雙(三甲氧基矽烷基)丙烷、1,3-雙(二甲氧基甲基矽烷基)丙烷、1,3-雙(甲氧基二甲基矽烷基)丙烷、1,3-雙(三乙氧基矽烷基)丙烷、1,4-雙(二甲基羥基矽烷基)丁烷、1,4-雙(三甲氧基矽烷基)丁烷、1,4-雙(二甲氧基甲基矽烷基)丁烷、1,4-雙(甲氧基二甲基矽烷基)丁烷、1,4-雙(三乙氧基矽烷基)丁烷、1,5-雙(二甲基羥基矽烷基)戊烷、1,5-雙(三甲氧基矽烷基)戊烷、1,5-雙(二甲氧基甲基矽烷基)戊烷、1,5-雙(甲氧基二甲基矽烷基)戊烷、1,5-雙(三乙氧基矽烷基)戊烷、1,6-雙(二甲基羥基矽烷基)己烷、1,6-雙(三甲氧基矽烷基)己烷、1,6-雙(二甲氧基甲基矽烷基)己烷、1,6-雙(甲氧基二甲基矽烷基)己烷、1,6-雙(三乙氧基矽烷基)己烷、1,4-雙(三甲氧基矽烷基)苯、雙(三甲氧基矽烷基)萘、雙(三甲氧基矽烷基)蒽、雙(三甲氧基矽烷基)菲、雙(三甲氧基矽烷基)降冰片烯、1,4-雙(二甲基羥基矽烷基)苯、1,4-雙(甲氧基二甲基矽烷基)苯以及1,4-雙(三乙氧基矽基)苯(僅舉數例)。Examples of such compounds are 1,2-bis(dimethylhydroxydecyl)ethane, 1,2-bis(trimethoxydecyl)ethane, 1,2-bis(dimethoxymethyldecane). Ethylene, 1,2-bis(methoxydimethyldecyl)ethane, 1,2-bis(triethoxydecyl)ethane, 1,3-bis(dimethylhydroxydecane) Propane, 1,3-bis(trimethoxydecyl)propane, 1,3-bis(dimethoxymethyldecyl)propane, 1,3-bis(methoxydimethyldecyl) Propane, 1,3-bis(triethoxydecyl)propane, 1,4-bis(dimethylhydroxydecyl)butane, 1,4-bis(trimethoxydecyl)butane, 1, 4-bis(dimethoxymethyldecyl)butane, 1,4-bis(methoxydimethyldecyl)butane, 1,4-bis(triethoxydecyl)butane, 1,5-bis(dimethylhydroxydecyl)pentane, 1,5-bis(trimethoxydecyl)pentane, 1,5-bis(dimethoxymethyldecyl)pentane, 1 , 5-bis(methoxydimethylalkylalkyl)pentane, 1,5-bis(triethoxydecyl)pentane, 1,6-bis(dimethylhydroxydecyl)hexane, 1 ,6-bis(trimethoxydecyl)hexane, 1,6-bis(dimethoxymethyldecyl)hexane, 1,6-double (methoxy methoxy decyl) hexane, 1,6-bis(triethoxydecyl) hexane, 1,4-bis(trimethoxydecyl)benzene, bis(trimethoxydecyl) Naphthalene, bis(trimethoxydecyl)phosphonium, bis(trimethoxydecyl)phenanthrene, bis(trimethoxydecyl)norbornene, 1,4-bis(dimethylhydroxydecyl)benzene, 1,4-bis(methoxydimethylalkyl)benzene and 1,4-bis(triethoxyindenyl)benzene, to name a few.

在一個實施例中,為了獲得[Si-O-Si-C]主鏈,具有下式之化合物 R5 3-(c+d) R4 d R3 c SiR11 SiR3 e R4 f R5 3-(e+f) 其中 R3 為交聯官能基, R4 為反應性基團,且 R5 為烷基、烯基、炔基、醇、羧酸、二羧酸、芳基、聚芳基、多環烷基、雜環脂族基、雜環芳族基, R12 獨立地為烷基或芳基,且其中 c=1至2,d=1至(3-c),e=1至2,且f=1至(3-e), 或其分子量小於1000公克/莫耳之寡聚物,與本文中如所提及之第一化合物、第二化合物、第三化合物或此等之任何組合一起聚合。In one embodiment, in order to obtain a [Si-O-Si-C] backbone, a compound of the formula R 5 3-(c+d) R 4 d R 3 c SiR 11 SiR 3 e R 4 f R 5 3-(e+f) wherein R 3 is a crosslinking functional group, R 4 is a reactive group, and R 5 is an alkyl group, an alkenyl group, an alkynyl group, an alcohol, a carboxylic acid, a dicarboxylic acid, an aryl group, a poly Aryl, polycycloalkyl, heterocycloaliphatic, heterocyclic aromatic, R 12 is independently alkyl or aryl, and wherein c = 1 to 2, d = 1 to (3-c), e =1 to 2, and f=1 to (3-e), or an oligomer having a molecular weight of less than 1000 g/mole, and a first compound, a second compound, a third compound or Any combination of these is aggregated together.

此等化合物之實例為1,2-雙(乙烯基二甲氧基矽烷基)乙烷、1,2-雙(乙炔基二甲氧基矽烷基)乙烷、1,2-雙(乙炔基二甲氧基)乙烷、1,2-雙(3-縮水甘油氧基丙基二甲氧基矽烷基)乙烷、1,2-雙[2-(3,4-環氧環己基)乙基二甲氧基矽烷基]乙烷、1,2-雙(甲基丙烯酸丙酯二甲氧基矽烷基)乙烷、1,4-雙(乙烯基二甲氧基矽烷基)苯、1,4-雙(乙炔基二甲氧基矽烷基)苯、1,4-雙(乙炔基二甲氧基矽烷基)苯、1,4-雙(3-縮水甘油氧基丙基二甲氧基矽烷基)苯、1,4-雙[2-(3,4-環氧環己基)乙基二甲氧基矽烷基]苯、1,4-雙(甲基丙烯酸丙酯二甲氧基矽烷基)苯(僅舉數例)。Examples of such compounds are 1,2-bis(vinyldimethoxydecyl)ethane, 1,2-bis(ethynyldimethoxydecyl)ethane, 1,2-bis(ethynyl) Dimethoxy)ethane, 1,2-bis(3-glycidoxypropyldimethoxydecyl)ethane, 1,2-bis[2-(3,4-epoxycyclohexyl) Ethyldimethoxydecyl]ethane, 1,2-bis(propyl methacrylate dimethoxydecyl)ethane, 1,4-bis(vinyldimethoxydecyl)benzene, 1,4-bis(ethynyldimethoxydecyl)benzene, 1,4-bis(ethynyldimethoxydecyl)benzene, 1,4-bis(3-glycidoxypropyldimethyl) Oxyalkylene)benzene, 1,4-bis[2-(3,4-epoxycyclohexyl)ethyldimethoxydecyl]benzene, 1,4-bis(propyl methacrylate) Base alkyl) benzene (to name a few).

在一個實施例中,具有以下分子式之矽氧烷單體 R1 a R2 b R3 3-(a+b) Si-O-SiR2 2 -O-Si R1 a R2 b R3 3-(a+b) 其中 R1 為如上文解釋之反應性基團, R2 為如上文解釋之烷基或芳基, R3 為如上文解釋之交聯官能基,且 a=0至3,b=0至3, 與先前提及之矽烷聚合或作為添加劑添加至最終調配物。In one embodiment, the oxoxane monomer R 1 a R 2 b R 3 3-(a+b) Si-O-SiR 2 2 -O-Si R 1 a R 2 b R 3 3 - (a + b) wherein R 1 is a reactive group as explained above, R 2 is an alkyl or aryl group as explained above, R 3 is a cross-linking functional group as explained above, and a = 0 to 3 , b = 0 to 3, polymerized with the previously mentioned decane or added as an additive to the final formulation.

此等化合物之實例為1,1,5,5-四甲氧基-1,5-二甲基-3,3-二苯基三矽氧烷、1,1,5,5-四甲氧基-1,3,3,5-四苯基三矽氧烷、1,1,5,5-四乙氧基-3,3-二苯基三矽氧烷、1,1,5,5-四甲氧基-1,5-二乙烯基-3,3-二苯基三矽氧烷、1,1,5,5-四甲氧基-1,5-二甲基-3,3-二異丙基三矽氧烷、1,1,1,5,5,5-六甲氧基-3,3-二苯基三矽氧烷、1,5-二甲基-1,5-二乙氧基-3,3-二苯基三矽氧烷、1,5-雙(巰基丙基)-1,1,5,5-四甲氧基-3,3-二苯基三矽氧烷、1,5-二乙烯基-1,1,5,5-四甲氧基-3-苯基-3-甲基三矽氧烷、1,5-二乙烯基-1,1,5,5-四甲氧基-3-環己基-3-甲基三矽氧烷、1,1,7,7-四甲氧基-1,7-二乙烯基-3,3,5,5-四甲基四矽氧烷、1,1,5,5-四甲氧基-3,3-二甲基三矽氧烷、1,1,7,7-四乙氧基-3,3,5,5-四甲基四矽氧烷、1,1,5,5-四乙氧基-3,3-二甲基三矽氧烷、1,1,5,5-四甲氧基-1,5-[2-(3,4-環氧環己基)乙基]-3,3-二苯基三矽氧烷、1,1,5,5-四甲氧基-1,5-(3-縮水甘油氧基丙基)-3,3-二苯基三矽氧烷、1,5-二甲基-1,5-二甲氧基-1,5-2-(3,4-環氧環己基)乙基]-3,3-二苯基三矽氧烷、1,5-二甲基-1,5-二甲氧基-1,5-(3-縮水甘油氧基丙基)-3,3-二苯基三矽氧烷(僅舉數例)。Examples of such compounds are 1,1,5,5-tetramethoxy-1,5-dimethyl-3,3-diphenyltrioxane, 1,1,5,5-tetramethoxy 1,3,3,5-tetraphenyltrioxane, 1,1,5,5-tetraethoxy-3,3-diphenyltrioxane, 1,1,5,5 -tetramethoxy-1,5-divinyl-3,3-diphenyltrioxane, 1,1,5,5-tetramethoxy-1,5-dimethyl-3,3 -diisopropyltrioxane, 1,1,1,5,5,5-hexamethoxy-3,3-diphenyltrioxane, 1,5-dimethyl-1,5- Diethoxy-3,3-diphenyltrioxane, 1,5-bis(mercaptopropyl)-1,1,5,5-tetramethoxy-3,3-diphenyltriazole Oxane, 1,5-divinyl-1,1,5,5-tetramethoxy-3-phenyl-3-methyltrioxane, 1,5-divinyl-1,1, 5,5-tetramethoxy-3-cyclohexyl-3-methyltrioxane, 1,1,7,7-tetramethoxy-1,7-divinyl-3,3,5, 5-tetramethyltetraoxane, 1,1,5,5-tetramethoxy-3,3-dimethyltrioxane, 1,1,7,7-tetraethoxy-3, 3,5,5-tetramethyltetraoxane, 1,1,5,5-tetraethoxy-3,3-dimethyltrioxane, 1,1,5,5-tetramethoxy Base-1,5-[2-(3,4-epoxycyclohexyl)ethyl]-3,3-diphenyltrioxane, 1,1,5,5-tetramethoxy-1, 5-(3-glycidyloxygen Propyl)-3,3-diphenyltrioxane, 1,5-dimethyl-1,5-dimethoxy-1,5-2-(3,4-epoxycyclohexyl) -3,3-diphenyltrioxane, 1,5-dimethyl-1,5-dimethoxy-1,5-(3-glycidoxypropyl)-3,3 - Diphenyltrioxane, to name a few.

添加至組成物(在聚合如上文所指出之矽氧烷材料之後)之添加劑可為具有下式之矽烷化合物: R1 a R2 b SiR3 4-(a+b) 其中 R1 為反應性基團,如羥基、烷氧基或乙醯氧基, R2 為烷基或芳基, R3 為交聯化合物,如環氧基、環氧丙烷、烯基、丙烯酸酯或炔基, a=0至1且b=0至1。The additive added to the composition (after polymerization of the oxoxane material as indicated above) may be a decane compound having the formula: R 1 a R 2 b SiR 3 4-(a+b) wherein R 1 is reactive a group such as a hydroxyl group, an alkoxy group or an ethoxy group, R 2 is an alkyl group or an aryl group, and R 3 is a crosslinking compound such as an epoxy group, a propylene oxide group, an alkenyl group, an acrylate group or an alkynyl group, a =0 to 1 and b=0 to 1.

此類添加劑之實例為三-(3-縮水甘油氧基丙基)苯基矽烷、三-[2-(3,4-環氧環己基)乙基]苯基矽烷、三-(3-甲基丙烯醯氧基)苯基矽烷、三-(3-丙烯醯氧基)苯基矽烷、四-(3-縮水甘油氧基丙基)矽烷、四-[2-(3,4-環氧環己基)乙基]矽烷、四-(3-甲基丙烯醯氧基)矽烷、四-(3-丙烯醯氧基)矽烷、三-(3-縮水甘油氧基丙基)對甲苯基矽烷、三-[2-(3,4-環氧環己基)乙基]對甲苯基矽烷、三-(3-甲基丙烯醯氧基)對甲苯基矽烷、三-(3-丙烯醯氧基)對甲苯基矽烷、三-(3-縮水甘油氧基丙基)羥基矽烷、三-[2-(3,4-環氧環己基)乙基]羥基矽烷、三-(3-甲基丙烯醯氧基)羥基矽烷、三-(3-丙烯醯氧基)羥基矽烷。Examples of such additives are tris-(3-glycidoxypropyl)phenylnonane, tris-[2-(3,4-epoxycyclohexyl)ethyl]phenylnonane, tris-(3-methyl) Propylene oxy)phenyl decane, tris-(3-propenyl oxy)phenyl decane, tetra-(3-glycidoxypropyl) decane, tetra-[2-(3,4-epoxy) Cyclohexyl)ethyl]decane, tetrakis-(3-methylpropenyloxy)decane, tetrakis-(3-propenyloxy)decane, tris-(3-glycidoxypropyl)-p-tolyldecane , tris-[2-(3,4-epoxycyclohexyl)ethyl]p-tolyldecane, tris-(3-methylpropenyloxy)p-tolyldecane, tris-(3-propenyloxyl) P-tolyldecane, tris-(3-glycidoxypropyl)hydroxydecane, tris-[2-(3,4-epoxycyclohexyl)ethyl]hydroxydecane, tris-(3-methylpropene)醯oxy)hydroxydecane, tris-(3-propenyloxy)hydroxydecane.

添加劑亦可為任何有機或矽酮聚合物,其可與主要聚合物基質反應或可不與主要聚合物基質反應,因此充當塑化劑、軟化劑或基質改質劑,如矽酮。添加劑亦可為無機聚縮合物,諸如SiOx、TiOx、AlOx、TaOx、HfOx、ZrOx、SnOx、聚矽氮烷。The additive may also be any organic or fluorenone polymer that may or may not react with the primary polymer matrix and thus act as a plasticizer, softener or matrix modifier such as anthrone. The additive may also be an inorganic polycondensate such as SiOx, TiOx, AlOx, TaOx, HfOx, ZrOx, SnOx, polyazane.

對於圖案化或非圖案化的介電層,添加至矽氧烷組成物之粒子可由不導電材料(諸如塗佈有二氧化矽、硫酸鋇、三水合氧化鋁、氮化硼之二氧化矽、石英、氧化鋁、氮化鋁、氮化鋁等)形成。填充劑可呈粒子或片狀形式,且可為微米尺寸或奈米尺寸。填充劑可包括為金屬或半金屬之氮化物、氮氧化物、碳化物以及碳氧化物之陶瓷化合物粒子為可能的。特定言之,填充劑可為粒子,所述粒子為矽、鋅、鋁、釔、鐿、鎢、鈦矽、鈦、銻、釤、鎳、鎳鈷、鉬、鎂、錳、鑭系元素、鐵、銦錫、銅、鈷鋁、鉻、銫或鈣之氧化物之陶瓷粒子。粒子可替代地為氮化物粒子,諸如氮化鋁、氮化鉭、氮化硼、氮化鈦、氮化銅、氮化鉬、氮化鎢、氮化鐵、氮化矽、氮化銦、氮化鎵或氮化碳。For a patterned or unpatterned dielectric layer, the particles added to the decane composition may be made of a non-conductive material such as cerium oxide coated with cerium oxide, cerium sulfate, alumina trihydrate, boron nitride, Quartz, alumina, aluminum nitride, aluminum nitride, etc. are formed. The filler may be in the form of particles or flakes and may be in micron size or nanometer size. Fillers may include ceramic compound particles which are nitrides of metal or semimetal, nitrogen oxides, carbides, and carbon oxides. In particular, the filler may be particles, which are cerium, zinc, aluminum, lanthanum, cerium, tungsten, titanium lanthanum, titanium, lanthanum, cerium, nickel, nickel cobalt, molybdenum, magnesium, manganese, lanthanides, Ceramic particles of iron, indium tin, copper, cobalt aluminum, chromium, barium or calcium oxides. The particles may alternatively be nitride particles such as aluminum nitride, tantalum nitride, boron nitride, titanium nitride, copper nitride, molybdenum nitride, tungsten nitride, iron nitride, tantalum nitride, indium nitride, Gallium nitride or carbon nitride.

粒子填充劑亦可由導電材料(諸如用於相同裝置內之導電層或其他層),諸如碳黑、石墨、石墨烯、金、銀、銅、鉑、鈀、鎳、鋁、鍍銀銅、鍍銀鋁、鉍、錫、鉍-錫合金、鍍銀纖維、鍍鎳銅、鍍銀及鎳之銅、鍍金銅、鍍金及鎳之銅,或其可為鍍金、銀-金、銀、鎳、錫、鉑、鈦之聚合物,諸如聚丙烯酸酯、聚苯乙烯或矽酮,但不限於此。填充劑亦可為半導體材料,諸如矽、n型或p型摻雜矽、GaN、InGaN、GaAs、InP、SiC,但不限於此。此外,填充劑可為量子點或表面電漿子粒子或磷光體粒子。其他半導體粒子或量子點,諸如Ge、GaP、InAs、CdSe、ZnO、ZnSe、TiO2 、ZnS、CdS、CdTe等亦為可能的。The particle filler may also be made of a conductive material (such as a conductive layer or other layer used in the same device) such as carbon black, graphite, graphene, gold, silver, copper, platinum, palladium, nickel, aluminum, silver plated copper, plated. Silver aluminum, tantalum, tin, antimony-tin alloy, silver-plated fiber, nickel-plated copper, silver-plated and nickel-copper, gold-plated copper, gold-plated and nickel-copper, or it may be gold-plated, silver-gold, silver, nickel, A polymer of tin, platinum, or titanium, such as polyacrylate, polystyrene or anthrone, but is not limited thereto. The filler may also be a semiconductor material such as germanium, n-type or p-type doped germanium, GaN, InGaN, GaAs, InP, SiC, but is not limited thereto. Further, the filler may be a quantum dot or a surface plasmonic particle or a phosphor particle. Other semiconductor particles or quantum dots such as Ge, GaP, InAs, CdSe, ZnO, ZnSe, TiO 2 , ZnS, CdS, CdTe, etc. are also possible.

或者,用於例如導電層之填充劑可為粒子,其為任何適合之金屬或半金屬粒子,諸如選自金、銀、銅、鉑、鈀、銦、鐵、鎳、鋁、碳、鈷、鍶、鋅、鉬、鈦、鎢、鍍銀銅、鍍銀鋁、鉍、錫、鉍-錫合金、鍍銀纖維或其之合金或組合。預想為過渡金屬粒子(無論前過渡金屬或後過渡金屬)之金屬粒子,如同半金屬及類金屬一樣。預想半金屬或非金屬粒子,諸如砷、銻、碲、鍺、矽以及鉍。Alternatively, the filler for, for example, a conductive layer may be a particle which is any suitable metal or semi-metal particle such as selected from the group consisting of gold, silver, copper, platinum, palladium, indium, iron, nickel, aluminum, carbon, cobalt, Niobium, zinc, molybdenum, titanium, tungsten, silver plated copper, silver plated aluminum, tantalum, tin, bismuth-tin alloy, silver plated fiber or alloys or combinations thereof. It is expected to be a metal particle of a transition metal particle (whether a front transition metal or a late transition metal), like a semimetal and a metalloid. Semi-metallic or non-metallic particles such as arsenic, antimony, bismuth, antimony, bismuth and antimony are envisioned.

亦可能的為包括碳之粒子且選自碳黑、石墨、石墨烯、金剛石、碳氮化矽、碳氮化鈦、碳奈米芽(nanobud)以及碳奈米管。填充劑之粒子可為碳化物粒子,諸如碳化鐵、碳化矽、碳化鈷、碳化鎢、碳化硼、碳化鋯、碳化鉻、碳化鈦或碳化鉬。It is also possible to include particles of carbon and selected from the group consisting of carbon black, graphite, graphene, diamond, niobium carbonitride, titanium carbonitride, nanobud, and carbon nanotubes. The particles of the filler may be carbide particles such as iron carbide, tantalum carbide, cobalt carbide, tungsten carbide, boron carbide, zirconium carbide, chromium carbide, titanium carbide or molybdenum carbide.

取決於最終應用,可使用任何適合尺寸之粒子。在許多情況下,使用平均粒度小於100微米,且較佳小於50微米或甚至20微米之小粒子。然而,為了獲得較高光學透射率,亦預想亞微米粒子,諸如小於1微米,或例如1奈米至500奈米,諸如小於200奈米,諸如1奈米至100奈米,或甚至小於10奈米之粒子。在其他實例中,提供平均粒度為5奈米至50奈米、或15奈米至75奈米、小於100奈米或50奈米至500奈米之粒子。合意的為平均粒度小於50奈米,例如小於25奈米之奈米粒子。一般而言,對於改良之光學透射率,可能需要提供平均粒度小於自其穿過之電磁輻射之波長的粒子。對於具有400奈米至700奈米內之可見光之可見光裝置(顯示器、燈等),較佳的是粒子之平均粒度小於700奈米且更佳小於400奈米。Depending on the end application, any suitable size of particles can be used. In many cases, small particles having an average particle size of less than 100 microns, and preferably less than 50 microns or even 20 microns, are used. However, in order to achieve higher optical transmittance, submicron particles are also envisioned, such as less than 1 micron, or such as 1 nanometer to 500 nanometers, such as less than 200 nanometers, such as 1 nanometer to 100 nanometers, or even less than 10 Nano particles. In other examples, particles having an average particle size of from 5 nanometers to 50 nanometers, or from 15 nanometers to 75 nanometers, less than 100 nanometers, or from 50 nanometers to 500 nanometers are provided. Desirable are nanoparticles having an average particle size of less than 50 nanometers, such as less than 25 nanometers. In general, for improved optical transmission, it may be desirable to provide particles having an average particle size that is less than the wavelength of the electromagnetic radiation passing therethrough. For visible light devices (displays, lamps, etc.) having visible light in the range of 400 nm to 700 nm, it is preferred that the particles have an average particle size of less than 700 nm and more preferably less than 400 nm.

並非細長,例如實質上球形或正方形之粒子,或具有扁平盤形外觀(具有平滑邊緣或粗糙邊緣)之薄片為可能的,如同細長晶鬚、圓筒、導線以及其他細長粒子,諸如具有5:1或更大,或10:1或更大之縱橫比的粒子。極細長粒子,諸如具有極高縱橫比之奈米線及奈米管亦為可能的,但出於光學透射率目的,小於400奈米之最大平均尺度為較佳的。H奈米線或奈米管之高縱橫比可為25:1或更大、50:1或更大或甚至100:1或更大。奈米線或奈米管之平均粒度是參考最小尺寸(寬度或直徑),因為長度可相當長,甚至達至幾公分長。如本文所用,術語「平均粒度」是指50體積%之粒子之直徑小於所述值之累積體積分佈曲線處之D50值。Not elongated, such as substantially spherical or square particles, or sheets having a flat disc-like appearance (with smooth edges or rough edges), such as elongated whiskers, cylinders, wires, and other elongated particles, such as having 5: Particles of 1 or greater, or an aspect ratio of 10:1 or greater. Very elongated particles, such as nanowires and nanotubes having extremely high aspect ratios, are also possible, but for optical transmission purposes, a maximum average size of less than 400 nm is preferred. The high aspect ratio of the H nanowire or nanotube can be 25: 1 or greater, 50: 1 or greater or even 100: 1 or greater. The average particle size of the nanowire or nanotube is the reference minimum size (width or diameter) because the length can be quite long, even up to several centimeters. As used herein, the term "average particle size" means that the diameter of 50% by volume of the particles is less than the D50 value at the cumulative volume distribution curve of the value.

為了增強與填充劑及矽氧烷聚合物之偶合,可使用偶合劑。此偶合劑將增加填充劑與聚合物之間的接著且因此可增加最終產物之導熱性及/或導電性。偶合劑可為任何具有下式之矽烷單體: R13 h R14 i SiR15 j 其中 R13 為反應性基團,如鹵素、羥基、烷氧基、乙醯基或乙醯氧基, R14 為烷基或芳基,且 R15 為包含如環氧基、酸酐、氰基、環氧丙烷、胺、巰基、烯丙基、烯基或炔基之官能基, h=0至4,i=0至4,j=0至4且h+i+j=4。In order to enhance the coupling with the filler and the siloxane polymer, a coupling agent can be used. This coupling agent will increase the adhesion between the filler and the polymer and thus increase the thermal conductivity and/or conductivity of the final product. The coupling agent may be any decane monomer having the formula: R 13 h R 14 i SiR 15 j wherein R 13 is a reactive group such as a halogen, a hydroxyl group, an alkoxy group, an ethyl fluorenyl group or an ethoxylated group, R 14 is an alkyl group or an aryl group, and R 15 is a functional group containing an epoxy group, an acid anhydride, a cyano group, a propylene oxide, an amine, a decyl group, an allyl group, an alkenyl group or an alkynyl group, h=0 to 4, i = 0 to 4, j = 0 to 4 and h + i + j = 4.

偶合劑可在製備最終產物時直接與填充劑、矽氧烷聚合物、固化劑以及添加劑混合,或填充劑粒子可在其與粒子混合之前藉由偶合劑處理。The coupling agent can be directly mixed with the filler, the siloxane polymer, the curing agent, and the additive in the preparation of the final product, or the filler particles can be treated with a coupling agent before it is mixed with the particles.

粒子可在具有或不具有表面處理之情況下提供至矽氧烷材料。若首先經處理表面,則表面可塗佈有有機材料,諸如羧酸、PVP或PVA,且可為胺、硫醇、矽烷或其組合。The particles can be provided to the oxoxane material with or without surface treatment. If the surface is first treated, the surface may be coated with an organic material such as a carboxylic acid, PVP or PVA, and may be an amine, a thiol, a decane or a combination thereof.

若粒子在用於最終調配物之前以偶合劑處理,則可使用不同方法,如自醇溶液沈積、自水溶液沈積、大量沈積至填充劑上以及無水液相沈積。在自醇溶液沈積中,製備醇/水溶液且將溶液pH調節至略微酸性(pH 4.5-5.5)。將矽烷添加至此溶液且混合幾分鐘以允許部分水解。接著,添加填充劑粒子且持續不同時間段自室溫至回流溫度混合溶液。在混合之後,過濾粒子,用乙醇沖洗且在烘箱中乾燥以藉由偶合劑獲得表面處理之粒子。自水溶液沈積類似於自醇溶液沈積,但使用純水而非醇作為溶劑。若使用非胺官能化,則藉由酸再次調節pH。在將粒子與水/矽烷混合物混合之後,過濾粒子,沖洗且乾燥。If the particles are treated with a coupling agent prior to use in the final formulation, different methods can be used, such as deposition from an alcohol solution, deposition from aqueous solution, bulk deposition onto a filler, and anhydrous liquid phase deposition. In the deposition from the alcohol solution, an alcohol/water solution was prepared and the pH of the solution was adjusted to be slightly acidic (pH 4.5-5.5). Oxane was added to this solution and mixed for a few minutes to allow partial hydrolysis. Next, the filler particles are added and the solution is mixed from room temperature to reflux temperature for various periods of time. After mixing, the particles were filtered, rinsed with ethanol and dried in an oven to obtain surface treated particles by coupling agent. The deposition from aqueous solution is similar to the deposition from an alcohol solution, but using pure water instead of alcohol as a solvent. If a non-amine functionalization is used, the pH is again adjusted by the acid. After mixing the particles with the water/decane mixture, the particles are filtered, rinsed and dried.

大量沈積方法為矽烷偶合劑與溶劑在無任何水或pH調節的情況下混合之方法。使用如噴塗之不同方法使填充劑粒子塗佈有矽烷醇溶液且接著在烘箱中乾燥。A large number of deposition methods are methods in which the decane coupling agent is mixed with the solvent without any water or pH adjustment. The filler particles are coated with a solution of stanol using different methods such as spraying and then dried in an oven.

在無水液相沈積中,矽烷與如甲苯、四氫呋喃或烴之有機溶劑混合,填充劑粒子在此溶液中回流且藉由真空或過濾移除額外溶劑。粒子亦可隨後在烘箱中乾燥,但由於回流條件下粒子與填充劑之間的直接反應,其有時不需要。In anhydrous liquid phase deposition, decane is mixed with an organic solvent such as toluene, tetrahydrofuran or a hydrocarbon, the filler particles are refluxed in this solution and the additional solvent is removed by vacuum or filtration. The particles can then be dried in an oven, but sometimes not required due to the direct reaction between the particles and the filler under reflux conditions.

此類矽烷偶合劑之實例為雙(2-羥乙基)-3-胺基丙基三乙氧基矽烷、烯丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、3-胺基丙基甲基二乙氧基矽烷、3-胺基丙基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、(N-三甲氧基矽烷基丙基)聚乙二亞胺、三甲氧基矽烷基丙基二伸乙基三胺、苯基三乙氧基矽烷、苯基三甲氧基矽烷、3-氯丙基三甲氧基矽烷、1-三甲氧基矽基-2(對,間氯甲基)苯乙烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、異氰酸丙酯三乙氧基矽烷、雙[3-(三乙氧基矽基)丙基]四硫化物、3-巰基丙基甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、2-(二苯膦基)乙基三乙氧基矽烷、1,3-二乙烯基四甲基二矽氮烷、六甲基二矽氮烷、3-(N-苯乙烯基甲基-2-胺基乙胺基)丙基三甲氧基矽烷、N-(三乙氧基矽烷基丙基)脲、1,3-二乙烯基四甲基二矽氮烷、乙烯基三乙氧基矽烷以及乙烯基三甲氧基矽烷(僅舉數例)。Examples of such decane coupling agents are bis(2-hydroxyethyl)-3-aminopropyltriethoxydecane, allyltrimethoxydecane, N-(2-aminoethyl)-3- Aminopropylmethyldimethoxydecane, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane, 3-aminopropylmethyldiethoxydecane, 3- Aminopropyltriethoxydecane, 3-aminopropyltrimethoxydecane, (N-trimethoxydecylpropyl)polyethylenediamine, trimethoxydecylpropyldiethylidene Amine, phenyltriethoxydecane, phenyltrimethoxydecane, 3-chloropropyltrimethoxydecane, 1-trimethoxyindolyl-2(p-,i-chloromethyl)phenylethane, 2- (3,4-epoxycyclohexyl)ethyltrimethoxydecane, 3-glycidoxypropyltrimethoxydecane, propyl isocyanate triethoxydecane, bis[3-(triethoxy) Mercapto)propyl]tetrasulfide, 3-mercaptopropylmethyldimethoxydecane, 3-mercaptopropyltrimethoxydecane, 3-methylpropenyloxypropyltrimethoxydecane, 2- (diphenylphosphino)ethyltriethoxydecane, 1,3-divinyltetramethyldiazepine, hexamethyldioxane, 3-(N-phenylethyl) Alkenylmethyl-2-aminoethylamino)propyltrimethoxydecane, N-(triethoxydecylpropyl)urea, 1,3-divinyltetramethyldiazepine, ethylene Triethoxy decane and vinyl trimethoxy decane, to name a few.

取決於添加之粒子之類型,矽氧烷-粒子固化最終產物可為熱傳導層或膜,諸如在最終熱固化或UV固化之後具有大於0.5瓦/公尺·克耳文(kelvin)(W/(m·K))之熱導率。取決於選擇之粒子之類型,較高熱導率材料為可能的。矽氧烷組成物中之金屬粒子可產生熱導率大於2.0瓦/公尺·克耳文,諸如大於4.0瓦/公尺·克耳文或甚至大於10.0瓦/公尺·克耳文之固化最終膜。然而,在其他應用中,可選擇粒子以在必要時產生具有低熱導率之材料,諸如用於如本文中所揭示之透明介電層。Depending on the type of particles added, the siloxane-particle-cured final product can be a thermally conductive layer or film, such as having a kelvin of greater than 0.5 watts per meter after final thermal or UV curing (W/( m·K)) Thermal conductivity. Higher thermal conductivity materials are possible depending on the type of particles selected. The metal particles in the oxane composition can produce a thermal conductivity greater than 2.0 watts per meter per gram, such as greater than 4.0 watts per meter per gram of gram or even greater than 10.0 watts per meter per gram of solidification. The final film. However, in other applications, the particles may be selected to produce a material having a low thermal conductivity, such as for a transparent dielectric layer as disclosed herein, if desired.

對於具有高電阻率之介電層,例如大於之薄層電阻。另外,必要時,最終固化產物可具有高電阻率,諸如大於1×103 Ω/sq,較佳大於1×103 Ω/sq,諸如大於1×105 Ω/sq,或甚至更高,例如大於1×105 Ω/sq。如本文中所提及,絕緣層亦可與矽氧烷粒子導電層結合使用,在此情況下,此類層將較佳具有200 Ω/sq或更小,較佳100 Ω/sq,例如50 Ω/sq之薄層電阻。For a dielectric layer having a high resistivity, for example, greater than the sheet resistance. Further, if necessary, the final cured product may have a high electrical resistivity such as greater than 1 × 10 3 Ω/sq, preferably greater than 1 × 10 3 Ω/sq, such as greater than 1 × 10 5 Ω/sq, or even higher, For example, it is larger than 1 × 10 5 Ω/sq. As mentioned herein, the insulating layer may also be used in combination with a conductive layer of a siloxane oxide particle, in which case such layer will preferably have 200 Ω/sq or less, preferably 100 Ω/sq, such as 50. Ω/sq sheet resistance.

在一些情況下,在諸如顯示器之LED或LCD裝置中或在絕緣矽氧烷組成物將塗覆於需要光學特徵之裝置中之情況下,儘管在一些情況下可能需要最終固化矽氧烷具有光學吸收或光學反射特性,更可能的是材料將合意地高度透射可見光譜內(或操作最終裝置之光譜內)的光。作為透明材料之實例,厚度為1微米至50微米之最終固化層將透射至少85%之垂直入射至其之可見光,或較佳透射至少90%,更佳至少92.5%且最佳至少95%。作為反射層之實例,最終固化層可反射至少85%的入射至其之光,較佳反射至少95%以90度之角入射至其之光。In some cases, in an LED or LCD device such as a display or in the case where an insulating siloxane composition will be applied to a device that requires optical features, although in some cases it may be desirable to have a final curing siloxane having optical Absorptive or optically reflective properties, and more likely the material will desirably be highly transmissive to light in the visible spectrum (or within the spectrum of the final device). As an example of a transparent material, a final cured layer having a thickness of from 1 micron to 50 microns will transmit at least 85% of visible light incident thereto, or preferably at least 90%, more preferably at least 92.5% and most preferably at least 95%. As an example of a reflective layer, the final cured layer can reflect at least 85% of the light incident thereon, preferably reflecting at least 95% of the light incident thereon at an angle of 90 degrees.

本發明之材料亦可含有穩定劑及/或抗氧化劑。添加此等化合物以保護材料免於由藉由諸如熱、光或來自原料之殘餘催化劑之物質誘導的與氧氣之反應而引起之降解。The materials of the invention may also contain stabilizers and/or antioxidants. These compounds are added to protect the material from degradation caused by reaction with oxygen induced by materials such as heat, light or residual catalyst from the feedstock.

本文中可適用的穩定劑或抗氧化劑中的為高分子量受阻酚及多官能性酚,諸如含硫及磷之酚。受阻酚已為本領域的技術人員所熟知,且可表徵為亦含有與其酚類羥基非常接近之立體大型(sterically bulky)自由基之酚類化合物。特定言之,第三丁基一般在相對於酚類羥基之至少一個鄰位取代至苯環上。羥基附近之此等立體大型經取代自由基之存在用以延緩其拉伸頻率,且相應地延緩其反應性;此位阻因此提供具有其穩定化特性之酚類化合物。代表性受阻酚包含:1,3,5-三甲基-2,4,6-三-(3,5-二-第三丁基-4-羥基苯甲基)-苯;四-3(3,5-二-第三丁基-4-羥基苯基)-丙酸異戊四醇酯;3(3,5-二-第三丁基-4-羥基苯基)-丙酸正十八烷酯;4,4'-亞甲基雙(2,6-第三丁基-酚);4,4'-硫基雙(6-第三丁基鄰甲酚);2,6-二-第三丁基酚;6-(4-羥基苯氧基)-2,4-雙(正辛基-硫基)-1,3,5三嗪;3,5-二-第三丁基-4-羥基-苯甲酸二正辛硫基)乙酯;以及山梨糖醇六[3-(3,5-二-第三丁基-4-羥基-苯基)-丙酸酯]。抗氧化劑之商業實例為例如由巴斯夫製造之豔佳諾克司1035、豔佳諾克司1010、豔佳諾克司1076、豔佳諾克司1098、豔佳諾克司3114、豔佳諾克司PS800、豔佳諾克司PS802、豔佳諾克司168。Among the stabilizers or antioxidants which may be used herein are high molecular weight hindered phenols and polyfunctional phenols such as sulfur and phosphorus containing phenols. Hindered phenols are well known to those skilled in the art and can be characterized as sterically bulky free radical phenolic compounds which also have very close proximity to their phenolic hydroxyl groups. In particular, the third butyl group is typically substituted on the phenyl ring with at least one ortho position relative to the phenolic hydroxyl group. The presence of such three-dimensionally large substituted radicals in the vicinity of the hydroxyl group serves to retard the stretching frequency and correspondingly retard its reactivity; this steric hindrance thus provides a phenolic compound having its stabilizing properties. Representative hindered phenols include: 1,3,5-trimethyl-2,4,6-tris-(3,5-di-t-butyl-4-hydroxybenzyl)-benzene; tetra-3( 3,5-di-t-butyl-4-hydroxyphenyl)-isopretide propionate; 3 (3,5-di-t-butyl-4-hydroxyphenyl)-propionic acid Octacol ester; 4,4'-methylenebis(2,6-tert-butyl-phenol); 4,4'-thiobis(6-tert-butyl-o-cresol); 2,6- Di-tert-butylphenol; 6-(4-hydroxyphenoxy)-2,4-bis(n-octyl-thio)-1,3,5 triazine; 3,5-di-third 4-hydroxy-benzoic acid di-n-octylthio)ethyl ester; and sorbitol hexa[3-(3,5-di-t-butyl-4-hydroxy-phenyl)-propionate]. Commercial examples of antioxidants are, for example, Yanjia Knox 1035, Yanjia Knox 1010, Yana Knox 1076, Yana Knox 1098, Yana Knox 3114, Yana Knox PS800, Yan Jianuo Kesi PS802, Yan Jianuokesi 168.

取決於產物之最終用途,矽氧烷聚合物與填充劑之間的重量比在100:0至5:95之間。矽氧烷聚合物與交聯矽或非矽類樹脂或寡聚物之間的比率在100:0至75:25之間。計算自矽氧烷聚合物量之固化劑之量為0.1%至20%。基於調配物之總量之接著促進劑之量為0至10%。基於調配物之總重量之抗氧化劑之量為0至5%。The weight ratio between the siloxane polymer and the filler is between 100:0 and 5:95, depending on the end use of the product. The ratio between the siloxane polymer and the crosslinked ruthenium or non-ruthenium resin or oligomer is between 100:0 and 75:25. The amount of the curing agent calculated from the amount of the decane polymer is from 0.1% to 20%. The amount of the adhesion promoter based on the total amount of the formulation is from 0 to 10%. The amount of antioxidant based on the total weight of the formulation is from 0 to 5%.

矽氧烷-粒子組成物可用於多個領域。其可用於電子學或光電子學封裝、LED及OLED前端及後端處理、3D、光伏打及顯示器鈍化及絕緣中之接著劑或密封劑以及用於封裝、印刷電子裝置、功率電子裝置及EMI、觸控感測器及其他顯示器以及熱或UV可固化密封劑或介電質中。The decane-particle composition can be used in a variety of fields. It can be used in electronics or optoelectronic packaging, LED and OLED front-end and back-end processing, 3D, photovoltaic and display passivation and insulation in the adhesive or sealant and for packaging, printed electronics, power electronics and EMI, Touch sensors and other displays as well as thermal or UV curable sealants or dielectrics.

取決於固化機制及催化劑活化之類型,最終調配物通常藉由加熱材料至較高溫度固化。舉例而言,若使用熱酸產生劑,則將材料置於烘箱中特定時段。亦可能的為藉由電磁輻射,諸如UV光固化。Depending on the curing mechanism and the type of catalyst activation, the final formulation typically cures by heating the material to a higher temperature. For example, if a thermal acid generator is used, the material is placed in an oven for a specific period of time. It is also possible to cure by electromagnetic radiation, such as UV light.

由聚合第一化合物及第二化合物形成之矽氧烷聚合物之分子量為約300公克/莫耳至10,000公克/莫耳,較佳約400公克/莫耳至5000公克/莫耳,且更佳約500公克/莫耳至2000公克/莫耳。聚合物與任何所需尺寸之粒子組合,平均粒度較佳小於100微米,更佳小於50微米,或甚至小於20微米。矽氧烷聚合物以10%至90%之重量%添加,且粒子以1%至90%之重量%添加。若矽氧烷材料之最終用途需要光學透明度,則粒子可為以較低重量%,諸如1重量%至20重量%添加之陶瓷粒子。然而,若粒子之平均粒度小於可見光之波長,例如較佳小於400奈米(例如小於200奈米,或甚至更小,諸如小於100奈米或小於50奈米平均粒度),則較高重量百分比負載為可能的,諸如20%至50%,或大於50%,大於75%,或甚至大於90%,同時仍達成所需光學透明度(例如甚至在75%之負載下,對於可見光之光學透射率可大於90%或甚至大於95%)。The molecular weight of the alkane polymer formed from the polymerized first compound and the second compound is from about 300 g/m to 10,000 g/mole, preferably from about 400 g/m to 5,000 g/mole, and more preferably About 500 grams / mole to 2000 grams / mole. The polymer is combined with particles of any desired size and preferably has an average particle size of less than 100 microns, more preferably less than 50 microns, or even less than 20 microns. The siloxane polymer is added in an amount of 10% to 90% by weight, and the particles are added in an amount of 1% to 90% by weight. If the end use of the decane material requires optical clarity, the particles can be ceramic particles added at a lower weight percent, such as from 1% to 20% by weight. However, if the average particle size of the particles is less than the wavelength of visible light, for example preferably less than 400 nanometers (eg less than 200 nanometers, or even smaller, such as less than 100 nanometers or less than 50 nanometer average particle size), then a higher weight percentage The load is possible, such as 20% to 50%, or greater than 50%, greater than 75%, or even greater than 90%, while still achieving the desired optical transparency (eg, even at 75% load, optical transmittance for visible light) Can be greater than 90% or even greater than 95%).

進行第一及第二化合物之聚合,且粒子與其混合以形成黏度為50兆帕-秒至100,000兆帕-秒,較佳1000兆帕-秒至75,000兆帕-秒且更佳5000兆帕-秒至50,000兆帕-秒之黏滯流體。黏度可藉由黏度計,諸如布氏(Brookfield)黏度計或科爾-帕默(Cole-Parmer)黏度計量測,所述黏度計旋轉流體樣品中之圓盤或圓筒且量測克服針對誘導運動之黏滯抗性所需的扭矩。可以任何所需速率,諸如1 rpm至30 rpm,較佳5 rpm,且較佳在材料在25℃下量測之情況下旋轉。Polymerization of the first and second compounds is carried out, and the particles are mixed therewith to form a viscosity of from 50 MPa to 2,000 MPa, preferably from 1,000 MPa to 5,000 MPa to 5,000 MPa. Viscous fluid from seconds to 50,000 MPa-sec. Viscosity can be measured by a viscometer, such as a Brookfield viscometer or Cole-Parmer viscosity meter, which rotates a disk or cylinder in a fluid sample and measures against The torque required to induce viscous resistance to exercise. It can be rotated at any desired rate, such as from 1 rpm to 30 rpm, preferably 5 rpm, and preferably measured at 25 °C.

在聚合之後,可添加任何額外所需組分至組成物,諸如粒子、偶合劑、固化劑等。組成物以無需冷卻或冷凍而在環境溫度下運送之容器中之黏滯材料形式運送給客戶。作為最終產物,材料可應用於上文所提及之多種用途中,通常經熱固化或UV固化以形成固體固化聚合矽氧烷層。After the polymerization, any additional desired components may be added to the composition, such as particles, couplers, curing agents, and the like. The composition is delivered to the customer in the form of a viscous material in a container that is shipped at ambient temperature without cooling or freezing. As a final product, the materials can be used in a variety of applications as mentioned above, typically by thermal or UV curing to form a solid cured polymeric siloxane layer.

如本文中所揭示之組成物較佳無任何實質性溶劑。可臨時添加溶劑,諸如用於將固化劑或其他添加劑與聚合黏滯材料混合。在此情況下,例如固化劑與溶劑混合以形成可隨後與黏滯矽氧烷聚合物混合之流體材料。然而,由於有時可能需要將實質上無溶劑之組成物運送給客戶,及隨後應用於客戶裝置上,在乾燥腔室中移除已臨時添加之溶劑。然而,儘管組成物實質上不含溶劑,可能存在不能夠在乾燥過程期間移除之痕量殘留溶劑。藉由減少最終固化過程期間之收縮以移除此溶劑,有助於本文所揭示之組成物的沈積,在裝置使用期限期間內隨時間推移使收縮最小化,並在裝置使用期限期間內有助於材料之熱穩定性。然而,如上文所提及,儘管應用矽氧烷組成物不需要溶劑,但若需要極薄層,則可能需要添加非極性或極性(質子性或非質子性)的有機溶劑,而以低黏度液體形式提供矽氧烷材料以使沈積層之厚度最小化。The compositions as disclosed herein are preferably free of any substantial solvent. A solvent may be temporarily added, such as for mixing a curing agent or other additive with a polymeric viscous material. In this case, for example, a curing agent is mixed with a solvent to form a fluid material that can be subsequently mixed with the viscous siloxane polymer. However, since it may sometimes be necessary to transport the substantially solvent-free composition to the customer and subsequently to the customer device, the temporarily added solvent is removed in the drying chamber. However, although the composition is substantially free of solvent, there may be trace amounts of residual solvent that cannot be removed during the drying process. The removal of this solvent by reducing shrinkage during the final curing process aids in the deposition of the compositions disclosed herein, minimizes shrinkage over time during the life of the device, and aids during the life of the device The thermal stability of the material. However, as mentioned above, although the application of the decane composition does not require a solvent, if a very thin layer is required, it may be necessary to add a non-polar or polar (protic or aprotic) organic solvent with a low viscosity. The liquid form provides a siloxane material to minimize the thickness of the deposited layer.

知道組成物之最終應用、組成物之所需黏度以及待包含之粒子,有可能精細調諧矽氧烷聚合物(起始化合物、分子量、黏度等),以使得當併入具有粒子及其他組分之組成物中時,達成就後續傳遞給客戶而言之所需最終特性。由於組成物之穩定性,有可能無需分子量或黏度之任何實質性改變而在環境溫度下運送組成物,即使在製造後一週或甚至一個月至客戶最終使用時也是如此。 實例:Knowing the final application of the composition, the desired viscosity of the composition, and the particles to be included, it is possible to fine tune the siloxane polymer (starting compound, molecular weight, viscosity, etc.) so that when incorporated with particles and other components In the composition, the final characteristics required for subsequent delivery to the customer are achieved. Due to the stability of the composition, it is possible to transport the composition at ambient temperature without any substantial change in molecular weight or viscosity, even one week after manufacture or even one month until the end of the customer's use. Example:

提供以下矽氧烷聚合物實例以說明本發明,且不意欲為限制性的。The following examples of naphthenic polymers are provided to illustrate the invention and are not intended to be limiting.

藉由布氏黏度計(主軸14)量測矽氧烷聚合物之黏度。藉由安捷倫(Agilent)GPC量測聚合物之分子量。The viscosity of the siloxane polymer was measured by a Brookfield viscometer (spindle 14). The molecular weight of the polymer was measured by Agilent GPC.

矽氧烷聚合物i:以二苯基矽烷二醇(60公克,45莫耳%)、2-(3,4-環氧環己基)乙基]三甲氧基矽烷(55.67公克,36.7莫耳%)以及四甲氧基矽烷(17.20公克,18,3莫耳%)填充具有攪拌棒及回流冷凝器之500毫升圓底燒瓶。燒瓶在氮氣氛圍下加熱至80℃且將0.08公克溶解於1毫升甲醇中之單水合氫氧化鋇逐滴添加至矽烷之混合物中。在二苯基矽烷二醇與烷氧基矽烷反應期間在80℃下攪拌矽烷混合物30分鐘。在30分鐘之後,在真空下蒸發出形成之甲醇。矽氧烷聚合物之黏度為1000 mPas且Mw為1100。Alkane polymer i: diphenyldecanediol (60 g, 45 mol%), 2-(3,4-epoxycyclohexyl)ethyl]trimethoxydecane (55.67 g, 36.7 mol) %) and tetramethoxynonane (17.20 grams, 18,3 mole %) were filled with a 500 ml round bottom flask with a stir bar and reflux condenser. The flask was heated to 80 ° C under a nitrogen atmosphere and 0.08 g of cesium hydroxide monohydrate dissolved in 1 ml of methanol was added dropwise to the mixture of decane. The decane mixture was stirred at 80 ° C for 30 minutes during the reaction of diphenyl decanediol with alkoxy decane. After 30 minutes, the formed methanol was evaporated under vacuum. The siloxane polymer has a viscosity of 1000 mPas and a Mw of 1100.

矽氧烷聚合物ii:以二苯基矽烷二醇(30公克,45莫耳%)、2-(3,4-環氧環己基)乙基]三甲氧基矽烷(28.1公克,37莫耳%)以及二甲基二甲氧基矽烷(6.67公克,18莫耳%)填充具有攪拌棒及回流冷凝器之250毫升圓底燒瓶。燒瓶在氮氣氛圍下加熱至80℃且將0.035公克溶解於1毫升甲醇中之單水合氫氧化鋇逐滴添加至矽烷之混合物中。在二苯基矽烷二醇與烷氧基矽烷反應期間在80℃下攪拌矽烷混合物30分鐘。在30分鐘之後,在真空下蒸發形成之甲醇。矽氧烷聚合物之黏度為2750 mPas且Mw為896。Alkane polymer ii: diphenyldecanediol (30 g, 45 mol%), 2-(3,4-epoxycyclohexyl)ethyl]trimethoxydecane (28.1 g, 37 mol) %) and dimethyldimethoxydecane (6.67 g, 18 mol%) were filled with a 250 ml round bottom flask with a stir bar and reflux condenser. The flask was heated to 80 ° C under a nitrogen atmosphere and 0.035 g of cesium hydroxide monohydrate dissolved in 1 ml of methanol was added dropwise to the mixture of decane. The decane mixture was stirred at 80 ° C for 30 minutes during the reaction of diphenyl decanediol with alkoxy decane. After 30 minutes, the methanol formed was evaporated under vacuum. The siloxane polymer has a viscosity of 2,750 mPas and a Mw of 896.

矽氧烷聚合物iii:以二苯基矽烷二醇(24.5公克,50莫耳%)、2-(3,4-環氧環己基)乙基]三甲氧基矽烷(18.64公克,33.4莫耳%)以及四甲氧基矽烷(5.75公克,16.7莫耳%)填充具有攪拌棒及回流冷凝器之250毫升圓底燒瓶。燒瓶在氮氣氛圍下加熱至80℃且將0.026公克溶解於1毫升甲醇中之單水合氫氧化鋇逐滴添加至矽烷之混合物中。在二苯基矽烷二醇與烷氧基矽烷反應期間在80℃下攪拌矽烷混合物30分鐘。在30分鐘之後,在真空下蒸發形成之甲醇。矽氧烷聚合物之黏度為7313 mPas且Mw為1328。Alkoxylate polymer iii: diphenyldecanediol (24.5 g, 50 mol%), 2-(3,4-epoxycyclohexyl)ethyl]trimethoxydecane (18.64 g, 33.4 mol) %) and tetramethoxynonane (5.75 g, 16.7 mol%) were filled with a 250 ml round bottom flask with a stir bar and reflux condenser. The flask was heated to 80 ° C under a nitrogen atmosphere and 0.026 g of cesium hydroxide monohydrate dissolved in 1 ml of methanol was added dropwise to the mixture of decane. The decane mixture was stirred at 80 ° C for 30 minutes during the reaction of diphenyl decanediol with alkoxy decane. After 30 minutes, the methanol formed was evaporated under vacuum. The viscosity of the siloxane polymer was 7313 mPas and the Mw was 1328.

矽氧烷聚合物iv:以二苯基矽烷二醇(15公克,50莫耳%)、2-(3,4-環氧環己基)乙基]三甲氧基矽烷(13.29公克,38.9莫耳%)以及雙(三甲氧基矽基)乙烷(4.17公克,11.1莫耳%)填充具有攪拌棒及回流冷凝器之250毫升圓底燒瓶。燒瓶在氮氣氛圍下加熱至80℃且將0.0175公克溶解於1毫升甲醇中之單水合氫氧化鋇逐滴添加至矽烷之混合物中。在二苯基矽烷二醇與烷氧基矽烷反應期間在80℃下攪拌矽烷混合物30分鐘。在30分鐘之後,在真空下蒸發形成之甲醇。矽氧烷聚合物之黏度為1788 mPas且Mw為1590。Alkane polymer iv: diphenyldecanediol (15 g, 50 mol%), 2-(3,4-epoxycyclohexyl)ethyl]trimethoxydecane (13.29 g, 38.9 mol) %) and bis(trimethoxyindenyl)ethane (4.17 g, 11.1 mol%) were filled with a 250 ml round bottom flask with a stir bar and reflux condenser. The flask was heated to 80 ° C under a nitrogen atmosphere and 0.0175 g of cesium hydroxide monohydrate dissolved in 1 ml of methanol was added dropwise to the mixture of decane. The decane mixture was stirred at 80 ° C for 30 minutes during the reaction of diphenyl decanediol with alkoxy decane. After 30 minutes, the methanol formed was evaporated under vacuum. The siloxane polymer has a viscosity of 1788 mPas and a Mw of 1590.

矽氧烷聚合物v:以二苯基矽烷二醇(15公克,45莫耳%)、2-(3,4-環氧環己基)乙基]三甲氧基矽烷(13.29公克,35莫耳%)以及乙烯基三甲氧基矽烷(4.57公克,20莫耳%)填充具有攪拌棒及回流冷凝器之250毫升圓底燒瓶。燒瓶在氮氣氛圍下加熱至80℃且將0.018公克溶解於1毫升甲醇中之單水合氫氧化鋇逐滴添加至矽烷之混合物中。在二苯基矽烷二醇與烷氧基矽烷反應期間在80℃下攪拌矽烷混合物30分鐘。在30分鐘之後,在真空下蒸發出形成之甲醇。. 矽氧烷聚合物之黏度為1087 mPas且Mw為1004。Alkoxysilane polymer v: diphenyldecanediol (15 g, 45 mol%), 2-(3,4-epoxycyclohexyl)ethyl]trimethoxydecane (13.29 g, 35 mol) %) and vinyltrimethoxydecane (4.57 g, 20 mol%) were filled with a 250 ml round bottom flask with a stir bar and reflux condenser. The flask was heated to 80 ° C under a nitrogen atmosphere and 0.018 g of cesium hydroxide monohydrate dissolved in 1 ml of methanol was added dropwise to the mixture of decane. The decane mixture was stirred at 80 ° C for 30 minutes during the reaction of diphenyl decanediol with alkoxy decane. After 30 minutes, the formed methanol was evaporated under vacuum. The viscosity of the siloxane polymer is 1087 mPas and the Mw is 1004.

矽氧烷聚合物vi:以二異丙基矽烷二醇(20.05公克,55.55莫耳%)、2-(3,4-環氧環己基)乙基]三甲氧基矽烷(20.0公克,33.33莫耳%)以及雙(三甲氧基矽基)乙烷(7.3公克,11.11莫耳%)填充具有攪拌棒及回流冷凝器之250毫升圓底燒瓶。燒瓶在氮氣氛圍下加熱至80℃且將0.025公克溶解於1毫升甲醇中之單水合氫氧化鋇逐滴添加至矽烷之混合物中。在二苯基矽烷二醇與烷氧基矽烷反應期間在80℃下攪拌矽烷混合物30分鐘。在30分鐘之後,在真空下蒸發出形成之甲醇。矽氧烷聚合物之黏度為150 mPas且Mw為781。The decane polymer vi: diisopropyl decanediol (20.05 g, 55.55 mol%), 2-(3,4-epoxycyclohexyl)ethyl]trimethoxydecane (20.0 g, 33.33 Mo) Ear %) and bis(trimethoxydecyl)ethane (7.3 g, 11.11 mol%) were filled with a 250 ml round bottom flask with a stir bar and reflux condenser. The flask was heated to 80 ° C under a nitrogen atmosphere and 0.025 g of cesium hydroxide monohydrate dissolved in 1 ml of methanol was added dropwise to the mixture of decane. The decane mixture was stirred at 80 ° C for 30 minutes during the reaction of diphenyl decanediol with alkoxy decane. After 30 minutes, the formed methanol was evaporated under vacuum. The siloxane polymer has a viscosity of 150 mPas and a Mw of 781.

矽氧烷聚合物vii:以二異丁基矽烷二醇(18.6公克,60莫耳%)及2-(3,4-環氧環己基)乙基]三甲氧基矽烷(17.32公克,40莫耳%)填充具有攪拌棒及回流冷凝器之250毫升圓底燒瓶。燒瓶在氮氣氛圍下加熱至80℃且將0.019公克溶解於1毫升甲醇中之單水合氫氧化鋇逐滴添加至矽烷之混合物中。在二苯基矽烷二醇與烷氧基矽烷反應期間在80℃下攪拌矽烷混合物30分鐘。在30分鐘之後,在真空下蒸發出形成之甲醇。矽氧烷聚合物之黏度為75 mPas且Mw為710。 封端材料之實例: 實例1The siloxane polymer vii: diisobutyl decanediol (18.6 g, 60 mol%) and 2-(3,4-epoxycyclohexyl)ethyl]trimethoxydecane (17.32 g, 40 mol) Ear %) was filled with a 250 ml round bottom flask with a stir bar and reflux condenser. The flask was heated to 80 ° C under a nitrogen atmosphere and 0.019 g of cesium hydroxide monohydrate dissolved in 1 ml of methanol was added dropwise to the mixture of decane. The decane mixture was stirred at 80 ° C for 30 minutes during the reaction of diphenyl decanediol with alkoxy decane. After 30 minutes, the formed methanol was evaporated under vacuum. The siloxane polymer has a viscosity of 75 mPas and a Mw of 710. Example of a capping material: Example 1

將含二苯基矽烷二醇(100.0公克,0.46莫耳)、3-(三甲氧基矽基)甲基丙烯酸丙酯(62.6公克,0.25莫耳)、甲基三甲氧基矽烷(17.2公克,0.13莫耳)以及BaO(0.1公克)之甲醇置於500毫升燒瓶中且回流1小時。在減壓下蒸發揮發物且獲得透明樹脂。Will contain diphenylnonanediol (100.0 grams, 0.46 moles), 3-(trimethoxydecyl)propyl methacrylate (62.6 grams, 0.25 moles), methyltrimethoxydecane (17.2 grams, Methanol (0.13 mol) and BaO (0.1 g) were placed in a 500 ml flask and refluxed for 1 hour. The volatiles were evaporated under reduced pressure and a transparent resin was obtained.

藉由安捷倫(Agilent)GPC量測聚合物之重量平均分子量(Mw)。聚矽氧烷E1之Mw為1530公克/莫耳。進行FTIR分析以偵測OH-基團及甲氧基。聚矽氧烷E1實質上不含-OH基團(在3390公分-1 之Si-OH頻帶處未觀測到峰)。其餘的烷氧基可觀測為2840公分-1 處之Si-OCH3 頻帶。 實例2The weight average molecular weight (Mw) of the polymer was measured by Agilent GPC. The Mw of polyoxyalkylene E1 was 1530 g/mole. FTIR analysis was performed to detect the OH-group and the methoxy group. The polyoxyalkylene E1 was substantially free of -OH groups (no peak was observed at the Si-OH band of 3390 cm -1 ). The remaining alkoxy groups were observed to be in the Si-OCH 3 band at 2840 cm -1 . Example 2

25公克獲自實例1之聚合物樹脂溶解於50公克丙酮。添加0.01 M HCl直至溶液混濁。在室溫下繼續攪拌8小時。添加過量水以沈澱聚合物且此後分離及乾燥獲得之聚合物。聚合物溶解於30公克甲基第三丁基醚(MTBE)中且添加5公克六甲基二矽氮烷,接著添加0.05公克吡啶鹽酸鹽。在室溫下繼續攪拌24小時。在減壓下蒸發非反應組分且藉由使用MTBE-水提取洗滌獲得之樹脂。在減壓下蒸發溶劑且獲得透明樹脂(22.9公克)。25 grams of the polymer resin obtained from Example 1 was dissolved in 50 grams of acetone. Add 0.01 M HCl until the solution is cloudy. Stirring was continued for 8 hours at room temperature. Excess water is added to precipitate the polymer and the obtained polymer is thereafter separated and dried. The polymer was dissolved in 30 g of methyl tert-butyl ether (MTBE) and 5 g of hexamethyldioxane was added followed by 0.05 g of pyridine hydrochloride. Stirring was continued for 24 hours at room temperature. The non-reactive components were evaporated under reduced pressure and the obtained resin was washed by using MTBE-water extraction. The solvent was evaporated under reduced pressure and a transparent resin (22.9 g) was obtained.

聚矽氧烷E2之Mw為1670公克/莫耳。進行FTIR分析以偵測OH-基團及甲氧基。在FTIR分析中,聚矽氧烷E2實質上不含-OH基團,且2840公分-1 處之Si-OCH3 峰已消失。 組成物實例The Mw of polyoxyalkylene E2 was 1670 g/mole. FTIR analysis was performed to detect the OH-group and the methoxy group. In the FTIR analysis, the polyoxyalkylene E2 was substantially free of -OH groups, and the Si-OCH 3 peak at 2840 cm -1 had disappeared. Composition example

提供以下組成物實例以說明本發明,且不意欲為限制性的。The following composition examples are provided to illustrate the invention and are not intended to be limiting.

比較例1,銀填充接著劑:使用高剪切混合器將具有環氧基作為交聯官能基之矽氧烷聚合物(18.3公克,18.3%)、平均尺寸(D50)為4微米之銀片(81公克,81%)3-甲基丙烯酸丙酯三甲氧基矽烷(0.5公克,0.5%)以及金氏工業K-PURE CXC-1612熱酸產生劑(0.2%)混合在一起。組成物之黏度為15000 mPas。Comparative Example 1, silver-filled adhesive: a silver plate having a cyclooxy group as a crosslinking functional group (18.3 g, 18.3%) and an average size (D50) of 4 μm using a high shear mixer (81 g, 81%) 3-propyl methacrylate trimethoxy decane (0.5 g, 0.5%) and Jinshi Industrial K-PURE CXC-1612 thermal acid generator (0.2%) were mixed together. The composition has a viscosity of 15,000 mPas.

比較例2,氧化鋁填充接著劑:使用三輥研磨機將具有環氧基作為交聯官能基之矽氧烷聚合物(44.55公克,44.45%)、平均尺寸(D50)為0.9微米之氧化鋁(53公克,53%)、3-甲基丙烯酸丙酯三甲氧基矽烷(1公克,1%)、豔佳諾克司1173(1公克,1%)以及金氏工業K-PURE CXC-1612熱酸產生劑(0.45公克,0.45%)混合在一起。組成物之黏度為20000 mPas。Comparative Example 2, alumina-filled adhesive: an aluminoxane polymer having an epoxy group as a crosslinking functional group (44.55 g, 44.45%) and an average size (D50) of 0.9 μm using a three-roll mill (53 grams, 53%), 3-propyl methacrylate trimethoxy decane (1 gram, 1%), Yanjia Nokesi 1173 (1 gram, 1%) and Jinshi Industrial K-PURE CXC-1612 heat The acid generator (0.45 grams, 0.45%) was mixed together. The composition has a viscosity of 20,000 mPas.

比較例3,BN填充接著劑:使用三輥研磨機將具有環氧基作為交聯官能基之矽氧烷聚合物(60公克,60%)、平均尺寸(D50)為15微米之氮化硼薄片(35公克,35%)、豔佳諾克司1173(1.3公克,1.3%)、2-(3,4-環氧環己基)乙基三甲氧基矽烷(3.4公克,3.4%)以及金氏工業K-PURE CXC-1612熱酸產生劑(0.3公克,0.3%)混合在一起。組成物之黏度為25000 mPas。Comparative Example 3, BN-filled adhesive: boron nitride polymer (60 g, 60%) having an epoxy group as a crosslinking functional group and boron nitride having an average size (D50) of 15 μm using a three-roll mill Sheet (35 g, 35%), Yanka Nok 1173 (1.3 g, 1.3%), 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane (3.4 g, 3.4%) and Jinshi Industrial K-PURE CXC-1612 hot acid generator (0.3 g, 0.3%) was mixed together. The composition has a viscosity of 25,000 mPas.

比較例4,半透明材料:使用三輥研磨機將具有甲基丙烯酸酯作為官能基之矽氧烷聚合物(89公克,89%)、平均尺寸(D50)為0.007微米之煙霧狀二氧化矽(5公克,5%)、豔佳諾克司1173(2公克,2%)以及豔佳固917光引發劑(4公克,4%)混合在一起。組成物之黏度為25,000 mPas。Comparative Example 4, translucent material: a haze-like cerium oxide having a methacrylate-functional oxirane polymer (89 g, 89%) and an average size (D50) of 0.007 μm using a three-roll mill (5 grams, 5%), Yanjia Nokesi 1173 (2 grams, 2%) and Yanjiagu 917 photoinitiator (4 grams, 4%) mixed together. The composition has a viscosity of 25,000 mPas.

比較例5,透明材料:將含二苯基矽烷二醇(20.0公克,92毫莫耳)、9-菲基三甲氧基矽烷(16.6公克,56毫莫耳)、3-甲基丙烯醯氧基丙基三甲氧基矽烷(9.2公克,37毫莫耳)以及BaO(25毫克)之甲醇置於100毫升燒瓶中且回流1小時。減壓蒸發揮發物。獲得透明聚合物樹脂(37公克)。Comparative Example 5, transparent material: diphenyldecanediol (20.0 g, 92 mmol), 9-phenanthryl trimethoxydecane (16.6 g, 56 mmol), 3-methylpropene oxime Propyltrimethoxydecane (9.2 g, 37 mmol) and BaO (25 mg) in methanol were placed in a 100 mL flask and refluxed for 1 hour. The volatiles were evaporated under reduced pressure. A clear polymer resin (37 grams) was obtained.

比較例6,高折射率材料:將8.6公克如實例X1中所描述製備之具有高折射率之聚合物樹脂於5.7公克ZrO2 奈米粒子溶液在固體含量為50%之1,2-丙二醇單甲醚乙酸酯(PGMEA)中摻合。0.26公克光引發劑(巴斯夫之達若可(Darocur)1173)、0.4公克作為接著促進劑之寡聚3-甲基丙烯醯氧基丙基三甲氧基矽烷以及20毫克界面活性劑(畢克化學(BYK Chemie)之BYK-307)添加至溶液中。Comparative Example 6, high refractive index material: 8.6 g of a polymer resin having a high refractive index prepared as described in Example X1 in a solution of 5.7 g of ZrO 2 nanoparticle particles at a solid content of 50% of 1,2-propanediol Blend in methyl ether acetate (PGMEA). 0.26 g of photoinitiator (Darocur 1173), 0.4 g of oligomeric 3-methacryloxypropyltrimethoxydecane as a promoter, and 20 mg of surfactant (Bick Chemical BYK-307) (BYK Chemie) was added to the solution.

所獲得之材料以2000 rpm旋塗於100毫米矽晶圓上。膜在80℃下在熱板上烘烤5分鐘且以3000毫焦/平方公分之劑量經UV固化。藉由更改聚合物樹脂與ZrO2 奈米粒子之重量比調節折射率。 The material obtained was spin coated onto a 100 mm tantalum wafer at 2000 rpm. The film was baked on a hot plate at 80 ° C for 5 minutes and UV cured at a dose of 3000 mJ/cm 2 . The refractive index is adjusted by changing the weight ratio of the polymer resin to the ZrO 2 nanoparticle.

必要時,可基於選擇之矽氧烷粒子材料選擇折射率。可提供1.25至2.0,例如1.4至1.7,或其他所需數值(1.5至1.9、1.5至1.65等)之折射率,折射率於632.8奈米波長下量測。可藉由提供聚合至矽氧烷聚合物中之含金屬單體達成較高折射率,例如高於玻璃,諸如1.6至2.0之折射率。如上所述,有可能獲得[Si-O-Me-O]n(其中Me為金屬)主鏈。尤其具有諸如鈦、鉭、鋁、鋯、鉿或硒之金屬之含金屬單體可幫助增加折射率。此類含金屬單體可替代如上文所提及之第一化合物、第二化合物或第三化合物使用,或額外使用。If necessary, the refractive index can be selected based on the selected alkane particle material. A refractive index of 1.25 to 2.0, such as 1.4 to 1.7, or other desired values (1.5 to 1.9, 1.5 to 1.65, etc.) may be provided, and the refractive index is measured at a wavelength of 632.8 nm. A higher refractive index can be achieved by providing a metal-containing monomer polymerized into the siloxane polymer, for example, higher than glass, such as a refractive index of 1.6 to 2.0. As described above, it is possible to obtain a [Si-O-Me-O]n (where Me is a metal) main chain. Metal-containing monomers having a metal such as titanium, tantalum, aluminum, zirconium, hafnium or selenium in particular can help increase the refractive index. Such a metal-containing monomer may be used in place of the first compound, the second compound or the third compound as mentioned above, or may be additionally used.

另外,有可能基於粒子之選擇增加折射率(替代地或除將金屬併入至如上所述之矽氧烷聚合物中之外)。特定氧化物粒子,尤其諸如鈦、鉭、鋁、鋯、鉿或硒之氧化物可幫助增加折射率。另外,可選擇改良將粒子併入至矽氧烷聚合物中之偶合劑以幫助增加折射率。作為一個實例,偶合劑具有化學式(R16 Ar)i SiR1 j ,其中i=1或2,且j=4-i,其中R16 為當施加熱或UV光時與矽氧烷聚合物經歷交聯之官能性交聯基團,其中Ar為芳基,且其中R1 為反應性基團,諸如羥基、鹵素、烷氧基、羧基、胺或醯氧基。因此,化合物包括結合至一個或兩個芳基(所述芳基具有交聯取代基)之矽原子且矽原子亦結合至兩個或三個反應性基團,較佳烷氧基。芳基可為苯基、萘、菲、蒽等且R16 官能性交聯基團可為環氧基、丙烯酸酯、乙烯基、烯丙基、乙炔、醇、胺、硫醇、矽烷醇等。亦可選擇偶合劑以具有金屬原子,諸如鈦、鉭、鋁、鋯、鉿或硒等來替代矽。In addition, it is possible to increase the refractive index based on the choice of particles (alternatively or in addition to incorporating the metal into the oxoxane polymer as described above). Certain oxide particles, particularly oxides such as titanium, tantalum, aluminum, zirconium, hafnium or selenium, can help increase the refractive index. Additionally, a coupling agent that incorporates particles into the siloxane polymer can be selected to help increase the refractive index. As an example, the coupling agent has the formula (R 16 Ar) i SiR 1 j , wherein i=1 or 2, and j=4-i, wherein R 16 is an experience with the siloxane polymer when heat or UV light is applied A cross-linked functional crosslinking group wherein Ar is an aryl group, and wherein R 1 is a reactive group such as a hydroxyl group, a halogen, an alkoxy group, a carboxyl group, an amine or a decyloxy group. Thus, a compound includes a deuterium atom bonded to one or two aryl groups (the aryl group has a crosslinking substituent) and the deuterium atom is also bonded to two or three reactive groups, preferably an alkoxy group. The aryl group may be phenyl, naphthalene, phenanthrene, anthracene or the like and the R 16 functional crosslinking group may be an epoxy group, an acrylate, a vinyl group, an allyl group, an acetylene, an alcohol, an amine, a thiol, a decyl alcohol or the like. The coupling agent may also be selected to have a metal atom such as titanium, ruthenium, aluminum, zirconium, hafnium or selenium instead of ruthenium.

如圖7中可見,相對於光之波長標繪如本文中所揭示之固化矽氧烷粒子材料之折射率,且每一圖具有不同量的作為矽氧烷材料之一部分之粒子,其中自無粒子添加至組成物至75%粒子負載。如圖7中可見,在無粒子之情況下可達成可見光譜內之1.60或更大之折射率,且在此實例中在具有粒子之情況下可達成可見光譜內1.70或更大之折射率。如圖8中可見,相對於光之波長標繪矽氧烷材料之透射率%。如此圖中所說明,標繪自無粒子至75%之不同粒子負載,且在可見光譜內具有大於90%(實際上大於95%)之可見光之透射率%。因此,即便負載有高百分比之粒子之矽氧烷材料亦為極透明的且適用於多種光學應用。As can be seen in Figure 7, the refractive index of the cured siloxane oxide material as disclosed herein is plotted against the wavelength of the light, and each of the figures has a different amount of particles as part of the decane material, wherein Particles were added to the composition to 75% particle loading. As can be seen in Figure 7, a refractive index of 1.60 or greater in the visible spectrum can be achieved without particles, and in this example a refractive index of 1.70 or greater in the visible spectrum can be achieved with particles. As can be seen in Figure 8, the % transmittance of the siloxane material is plotted against the wavelength of the light. As illustrated in this figure, it is plotted from no particles to 75% different particle loadings and has a % transmittance of visible light greater than 90% (actually greater than 95%) in the visible spectrum. Thus, even a paraxane material loaded with a high percentage of particles is extremely transparent and suitable for a variety of optical applications.

考慮到揭示之方法及材料,形成穩定組成物。組成物可有一部分為具有[-Si-O-Si-O]n重複主鏈之矽氧烷聚合物,所述主鏈上具有烷基或芳基,且所述主鏈上具有官能性交聯基團,且有另一部分為與矽氧烷材料混合之粒子,其中粒子之平均粒度小於100微米,粒子為任何適合之粒子但較佳為陶瓷粒子,諸如氮化物或氧化物粒子,且較佳為平均粒度小於可見光之範圍-例如小於400奈米之奈米粒子。運送給客戶之組成物可具有300公克/莫耳至10,000公克/莫耳之分子量,及在5 rpm黏度計下1000兆帕-秒至75,000兆帕-秒之黏度。A stable composition is formed in consideration of the disclosed methods and materials. The composition may have a portion of a siloxane polymer having a [-Si-O-Si-O]n repeating backbone having an alkyl or aryl group and having functional crosslinks on the backbone a group, and another portion being particles mixed with a decane material, wherein the particles have an average particle size of less than 100 microns, and the particles are any suitable particles, but are preferably ceramic particles, such as nitride or oxide particles, and are preferably. It is a nanoparticle having an average particle size smaller than the range of visible light, for example, less than 400 nm. The composition delivered to the customer may have a molecular weight of from 300 gram/mol to 10,000 gram/mol and a viscosity of from 1000 MPa to 75,000 MPa-second at a 5 rpm viscometer.

黏滯(或液體)矽氧烷聚合物實質上不含-OH基團,因此提供延長之存放期,且允許必要時在環境溫度下儲存或運送。較佳地,矽氧烷材料不具有可自FTIR分析偵測之-OH峰。形成之矽氧烷材料之穩定性增加以允許在使用之前儲存,其中在儲存期間黏度(交聯)的增加幅度最小,諸如在室溫下儲存2週時段小於25%,較佳經2週時段小於15%,且更佳小於10%。另外,儲存、運送以及隨後由客戶應用可全部在不存在溶劑的情況下進行(除了在乾燥以移除溶劑之後保留的可能的微量殘餘物),避免隨後形成於最終產物的層中之溶劑捕獲(solvent capture)、聚合期間之收縮、裝置使用期間隨時間推移質量損失等問題。在不施加較佳高於100℃之熱或UV光的情況下,在運送及儲存期間不出現實質性交聯。組成物以及最後實質上不存在Si-H鍵。The viscous (or liquid) siloxane polymer is substantially free of -OH groups, thus providing an extended shelf life and allowing storage or transport at ambient temperatures if necessary. Preferably, the decane material does not have a -OH peak detectable by FTIR analysis. The stability of the formed naphthenic material is increased to allow storage prior to use, wherein the increase in viscosity (crosslinking) during storage is minimal, such as less than 25% during 2 weeks of storage at room temperature, preferably over 2 weeks Less than 15%, and more preferably less than 10%. In addition, storage, shipping and subsequent application by the customer can all be carried out in the absence of solvent (except for possible traces of residue remaining after drying to remove the solvent), avoiding solvent trapping subsequently formed in the layer of the final product. (solvent capture), shrinkage during polymerization, loss of quality over time during use of the device, etc. No substantial cross-linking occurs during shipping and storage without the application of heat or UV light preferably above 100 °C. The composition and finally the Si-H bond is substantially absent.

當組成物經沈積及聚合(例如藉由施加熱或UV光)時,觀測到質量之極小收縮或減少。圖9中,x軸為時間(以分鐘為單位),左y軸為就起始質量之%而言之層之質量,且右y軸為以攝氏度為單位之溫度。如圖9中可見,如本文中所揭示之矽氧烷粒子混合物快速加熱至150℃,接著在150℃保持大致30分鐘。在此實例中,矽氧烷粒子具有具有苯基及環氧基之Si-O主鏈,且粒子為銀粒子。在經此時段之熱固化之後,質量損失小於1%。合意地,質量損失通常小於4%,且一般小於2%。然而,在許多情況下,固化之前與之後間的矽氧烷粒子組成物之質量差異小於1%。固化溫度一般小於175℃,儘管較高固化溫度為可能的。通常,固化溫度將為160℃或更低,更通常150℃或更低。然而,較低固化溫度為可能的,諸如125℃或更低。When the composition is deposited and polymerized (e.g., by application of heat or UV light), minimal shrinkage or reduction in mass is observed. In Figure 9, the x-axis is time (in minutes), the left y-axis is the mass of the layer in terms of % of the starting mass, and the right y-axis is the temperature in degrees Celsius. As can be seen in Figure 9, the mixture of oxoxane particles as disclosed herein was rapidly heated to 150 °C, followed by holding at 150 °C for approximately 30 minutes. In this example, the siloxane oxide particles have a Si-O backbone having a phenyl group and an epoxy group, and the particles are silver particles. After heat curing over this period, the mass loss is less than 1%. Desirably, the mass loss is typically less than 4%, and typically less than 2%. However, in many cases, the mass difference of the siloxane oxide particle composition before and after curing is less than 1%. The curing temperature is generally less than 175 ° C, although higher curing temperatures are possible. Typically, the curing temperature will be 160 ° C or less, more typically 150 ° C or less. However, lower curing temperatures are possible, such as 125 ° C or lower.

如圖10中可見,無論上文所揭示之組成物用作接著劑、導熱層、密封劑、圖案化導電層、圖案化介電層、透明層、光反射層等,一旦組成物經沈積及聚合以及視需要硬化,矽氧烷粒子層或質量為極熱穩定的。舉例而言,在藉由熱聚合或UV聚合硬化之後以每分鐘升高10℃之升溫速率將原位材料加熱至600℃,在200℃及300℃兩者下觀測到小於4.0%,較佳小於2.0%,例如小於1.0%之質量損失(通常在200℃觀測到小於0.5%之質量損失,或如同圖10之實例中,在200℃觀測到小於0.2%之質量損失)。在300℃下,在圖10之實例中觀測到小於1%,或更特定言之小於0.6%之質量損失。可藉由僅在200℃或300℃下加熱聚合材料1小時觀測到類似結果。藉由在375℃或高於375℃加熱聚合沈積材料至少1小時導致小於1%質量損失之結果為可能的。如圖10中可見,甚至在高於500℃之溫度下觀測到5%或小於5%之質量損失。此類熱穩定材料為所需的,特定言之可在低溫(例如低於175℃,較佳低於150℃,或低於130℃,30分鐘固化/烘烤時間)下沈積,或可藉由UV光聚合如本文中所揭示之熱穩定材料。As can be seen in Figure 10, the composition disclosed above is used as an adhesive, a thermally conductive layer, a sealant, a patterned conductive layer, a patterned dielectric layer, a transparent layer, a light reflective layer, etc., once the composition has been deposited and The polymerization and, if desired, hardening, the layer or mass of the siloxane layer is extremely thermally stable. For example, the in-situ material is heated to 600 ° C at a temperature increase rate of 10 ° C per minute after thermal polymerization or UV polymerization hardening, and less than 4.0% is observed at 200 ° C and 300 ° C, preferably. A mass loss of less than 2.0%, such as less than 1.0% (typically a mass loss of less than 0.5% is observed at 200 °C, or as in the example of Figure 10, a mass loss of less than 0.2% is observed at 200 °C). At 300 ° C, a mass loss of less than 1%, or more specifically less than 0.6%, was observed in the example of Figure 10. Similar results were observed by heating the polymeric material for only 1 hour at 200 ° C or 300 ° C. It is possible to result in less than 1% mass loss by heating the polymeric deposition material at 375 ° C or above 375 ° C for at least 1 hour. As can be seen in Figure 10, a mass loss of 5% or less was observed even at temperatures above 500 °C. Such thermally stable materials are desirable, and in particular may be deposited at low temperatures (eg, below 175 ° C, preferably below 150 ° C, or below 130 ° C, 30 minutes curing / baking time), or may be borrowed The thermally stable material as disclosed herein is polymerized by UV light.

前述內容說明實例實施例,且並非解釋為限制性的。儘管已描述了數個實例實施例,但本領域的技術人員將易於瞭解,在實質上不偏離新穎教示內容及優點的情況下,在實例實施例中許多修改有可能。因此,所有此類修改意欲包含於如申請專利範圍中所界定的本發明之範疇內。因此,應理解,前述內容說明各種實例實施例但不應解釋為限於所揭示的特定實施例,且對所揭示實施例以及其他實施例的修改意欲包含在隨附申請專利範圍的範疇內。 工業適用性The foregoing description illustrates example embodiments and is not to be construed as limiting. Although a few example embodiments have been described, it will be apparent to those skilled in the art that many modifications are possible in the example embodiments without departing from the novel teachings. Accordingly, all such modifications are intended to be included within the scope of the invention as defined in the scope of the claims. Therefore, the present invention is to be understood as being limited to the specific embodiments of the invention, and the modifications of the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims. Industrial applicability

本發明組成物可用於半導體裝置及微電子及光電子裝置,諸如顯示器,例如LED顯示器,諸如OLED/AMOLED及LCD顯示器。實例包含觸控螢幕顯示器,諸如用於智慧型手機、平板電腦、膝上型電腦以及筆記型電腦、電腦監視器之電阻或電容觸控螢幕,以及數位相機、攝錄影機、攜帶型遊戲裝置、個人多媒體播放機、電子書閱讀器、印刷機、汽車顯示器、GPS/PND導航裝置等上之觸控螢幕,以及零售、商業以及工業環境中之觸控螢幕。然而,非觸控螢幕型式受益於如本文中所揭示之矽氧烷粒子絕緣及透光材料。 引用清單 專利文獻 US 2011051064 US 5645901 KR 20120119020The compositions of the present invention are useful in semiconductor devices and microelectronic and optoelectronic devices, such as displays, such as LED displays, such as OLED/AMOLED and LCD displays. Examples include touch screen displays, such as resistive or capacitive touch screens for smartphones, tablets, laptops and laptops, computer monitors, and digital cameras, camcorders, portable gaming devices Touch screens on personal media players, e-book readers, printers, car displays, GPS/PND navigation devices, and touch screens in retail, commercial and industrial environments. However, the non-touch screen type benefits from the siloxane oxide insulating and light transmissive materials as disclosed herein. Citation List Patent Literature US 2011051064 US 5645901 KR 20120119020

1‧‧‧偏光器層
2、70、80‧‧‧基板
3‧‧‧薄膜電晶體陣列
4‧‧‧液晶單元陣列
5‧‧‧VCOM層
6‧‧‧濾色器
7、22‧‧‧玻璃基板
8、10‧‧‧圖案化導電層
9、25‧‧‧絕緣層
11‧‧‧層
12、31‧‧‧接著劑層
13‧‧‧蓋玻璃
21、30‧‧‧偏光層
23‧‧‧薄膜電晶體陣列
24、26、82‧‧‧導電層
27‧‧‧LCD單元
28‧‧‧濾色器
29‧‧‧透明基板
32‧‧‧額外透明基板
50‧‧‧透光基板
51‧‧‧透明導電層
52‧‧‧導電跨接線
53‧‧‧介電層
54‧‧‧金屬跡線
55‧‧‧導電圖案
56‧‧‧鈍化層
57‧‧‧額外介電外塗層
72‧‧‧矽氧烷材料
72a‧‧‧曝露區
72b‧‧‧未曝露區
75、85‧‧‧遮罩
82a‧‧‧導電部分
82b‧‧‧凹槽
86‧‧‧UV光
1‧‧‧ polarizer layer
2, 70, 80‧‧‧ substrate
3‧‧‧Thin-film array
4‧‧‧Liquid Crystal Cell Array
5‧‧‧VCOM layer
6‧‧‧ color filter
7, 22‧‧‧ glass substrate
8, 10‧‧‧ patterned conductive layer
9, 25‧‧‧ insulation
11 ‧ ‧ layer
12, 31‧‧‧ adhesive layer
13‧‧‧ Cover glass
21, 30‧‧‧ polarizing layer
23‧‧‧Thin Film Array
24, 26, 82‧‧‧ conductive layer
27‧‧‧LCD unit
28‧‧‧ color filter
29‧‧‧Transparent substrate
32‧‧‧Additional transparent substrate
50‧‧‧Transparent substrate
51‧‧‧Transparent conductive layer
52‧‧‧Electrical jumper
53‧‧‧ dielectric layer
54‧‧‧Metal traces
55‧‧‧ conductive pattern
56‧‧‧ Passivation layer
57‧‧‧Additional dielectric top coat
72‧‧‧Oxysiloxane materials
72a‧‧‧ Exposure area
72b‧‧‧Unexposed areas
75, 85‧‧‧ mask
82a‧‧‧Electrical part
82b‧‧‧ Groove
86‧‧‧UV light

圖1為單元上(on-cell)觸控電容面板顯示裝置之截面圖。 圖2為單元內(in-cell)電容觸控面板顯示裝置之截面圖。 圖3為觸控面板顯示裝置之簡化視圖。 圖4為玻璃上(on-glass)電容觸控面板顯示裝置之截面圖。 圖5a至圖5d說明一種對絕緣矽氧烷粒子膜進行圖案化之方法。 圖6a至圖6d說明對絕緣矽氧烷粒子膜進行圖案化之替代方法。 圖7顯示不同粒子負載之折射率相對於波長之圖。 圖8為透射率相對於粒子負載之圖。 圖9說明在熱誘導聚合期間之矽氧烷聚合物之質量改變。 圖10說明在沈積及聚合之後的矽氧烷材料之熱穩定性。1 is a cross-sectional view of an on-cell touch capacitive panel display device. 2 is a cross-sectional view of an in-cell capacitive touch panel display device. 3 is a simplified view of a touch panel display device. 4 is a cross-sectional view of an on-glass capacitive touch panel display device. Figures 5a through 5d illustrate a method of patterning an insulating aluminoxane particle film. Figures 6a through 6d illustrate an alternative method of patterning an insulating aluminoxane particle film. Figure 7 shows a plot of refractive index versus wavelength for different particle loadings. Figure 8 is a graph of transmittance versus particle loading. Figure 9 illustrates the mass change of the siloxane polymer during the thermally induced polymerization. Figure 10 illustrates the thermal stability of the siloxane material after deposition and polymerization.

1‧‧‧偏光器層 1‧‧‧ polarizer layer

2‧‧‧基板 2‧‧‧Substrate

3‧‧‧薄膜電晶體陣列 3‧‧‧Thin-film array

4‧‧‧液晶單元陣列 4‧‧‧Liquid Crystal Cell Array

5‧‧‧VCOM層 5‧‧‧VCOM layer

6‧‧‧濾色器 6‧‧‧ color filter

7‧‧‧玻璃基板 7‧‧‧ glass substrate

8、10‧‧‧圖案化導電層 8, 10‧‧‧ patterned conductive layer

9‧‧‧絕緣層 9‧‧‧Insulation

11‧‧‧層 11 ‧ ‧ layer

12‧‧‧接著劑層 12‧‧‧ adhesive layer

13‧‧‧蓋玻璃 13‧‧‧ Cover glass

Claims (20)

一種介電膜,包括: 形成於支撐基板上之介電層,包括矽氧烷聚合物及在所述矽氧烷聚合物內且平均粒度小於1微米之粒子, 其中所述介電層對可見光為光學透射的且透射至少75%的入射於其上之光,且 其中所述介電層為電絕緣的且薄層電阻為1000 Ω/sq或更大。A dielectric film comprising: a dielectric layer formed on a support substrate, comprising a siloxane polymer and particles having an average particle size of less than 1 micrometer in the siloxane polymer, wherein the dielectric layer is visible light Light that is optically transmissive and transmits at least 75% of the light incident thereon, and wherein the dielectric layer is electrically insulating and has a sheet resistance of 1000 Ω/sq or greater. 如申請專利範圍第1項所述之介電膜,其中陶瓷粒子為氮化物粒子。The dielectric film of claim 1, wherein the ceramic particles are nitride particles. 如前述申請專利範圍中任一項所述之介電膜,其中所述粒子為氮化鋁、氮化鉭、氮化硼、氮化鈦、氮化銅、氮化鉬、氮化鎢、氮化鐵、氮化矽、氮化銦、氮化鎵或氮化碳。The dielectric film according to any one of the preceding claims, wherein the particles are aluminum nitride, tantalum nitride, boron nitride, titanium nitride, copper nitride, molybdenum nitride, tungsten nitride, nitrogen. Iron, tantalum nitride, indium nitride, gallium nitride or carbon nitride. 如前述申請專利範圍中任一項所述之介電膜,其中所述矽氧烷聚合物包括有機芳基。A dielectric film according to any one of the preceding claims, wherein the siloxane polymer comprises an organic aryl group. 一種製造介電膜之方法,包括: 提供基板;以及 在所述基板上沈積具有矽氧烷起始材料及粒子之組成物, 其中所述矽氧烷起始材料包括矽氧烷聚合物、矽氧烷寡聚物及/或矽烷單體,且 其中所述粒子之平均粒度小於400奈米; 其中將熱能及/或電磁能施加至所述矽氧烷粒子層以固化所述層且在所述基板上形成介電膜; 其中所述膜對可見光為光學透射的且透射至少80%的入射於其上之可見光; 且其中所述膜為電絕緣的且薄層電阻為1000 Ω/sq或更大。A method of fabricating a dielectric film, comprising: providing a substrate; and depositing on the substrate a composition having a siloxane starting material and particles, wherein the siloxane starting material comprises a siloxane polymer, ruthenium An oxane oligomer and/or a decane monomer, and wherein said particles have an average particle size of less than 400 nm; wherein thermal energy and/or electromagnetic energy is applied to said layer of siloxane oxide to cure said layer and Forming a dielectric film on the substrate; wherein the film is optically transmissive to visible light and transmits at least 80% of visible light incident thereon; and wherein the film is electrically insulating and has a sheet resistance of 1000 Ω/sq or Bigger. 如申請專利範圍第5項所述之製造介電膜之方法,其中所述粒子之平均粒度小於50奈米,特定言之所述粒子之平均粒度小於25奈米。The method of producing a dielectric film according to claim 5, wherein the particles have an average particle size of less than 50 nm, and in particular, the particles have an average particle size of less than 25 nm. 如申請專利範圍第5項或第6項所述之製造介電膜之方法,其中所述矽氧烷起始材料包括苯基及甲基丙烯酸酯官能性反應性基團,且其中所述粒子為陶瓷氧化物奈米粒子且平均粒度小於400奈米。The method of producing a dielectric film according to claim 5, wherein the oxane starting material comprises a phenyl group and a methacrylate functional reactive group, and wherein the particles are It is a ceramic oxide nanoparticle and has an average particle size of less than 400 nm. 一種顯示器,包括: 矩陣中之複數個像素,所述像素各自包括: 液晶層及/或發光二極體層; 複數個基板,其對可見光為光學透射;以及 接著劑,將第一基板黏結至第二基板且為形成之導電材料,所述導電材料的薄層電阻大於1000 Ω/sq且包括矽氧烷材料及平均粒度小於400奈米之粒子, 且其中所述電絕緣材料為熱穩定的,其中若加熱至至少200℃,將具有小於2%之質量損失。A display comprising: a plurality of pixels in a matrix, each of the pixels comprising: a liquid crystal layer and/or a light emitting diode layer; a plurality of substrates that are optically transmissive to visible light; and an adhesive that bonds the first substrate to the first a second substrate and forming a conductive material, the conductive material having a sheet resistance greater than 1000 Ω/sq and comprising a siloxane material and particles having an average particle size of less than 400 nm, wherein the electrically insulating material is thermally stable, Wherein if heated to at least 200 ° C, there will be a mass loss of less than 2%. 如申請專利範圍第8項所述之顯示器,其中所述粒子為選自以下之氮化物粒子:氮化鋁、氮化鉭、氮化硼、氮化鈦、氮化銅、氮化鉬、氮化鎢、氮化鐵、氮化矽、氮化銦、氮化鎵或氮化碳;或 所述粒子為氧化物奈米粒子,包括矽、鋅、鋁、釔、鐿、鎢、鈦矽、鈦、銻、釤、鎳、鎳鈷、鉬、鎂、錳、鑭系元素、鐵、銦錫、銅、鈷鋁、鉻、銫或鈣之氧化物;或 所述粒子包括鈦、鉭、鋁、鋯、鉿或硒之氧化物,且折射率為1.6至1.9。The display of claim 8, wherein the particles are nitride particles selected from the group consisting of aluminum nitride, tantalum nitride, boron nitride, titanium nitride, copper nitride, molybdenum nitride, and nitrogen. Tungsten, iron nitride, tantalum nitride, indium nitride, gallium nitride or carbon nitride; or the particles are oxide nanoparticles, including bismuth, zinc, aluminum, lanthanum, cerium, tungsten, titanium, Titanium, niobium, tantalum, nickel, nickel cobalt, molybdenum, magnesium, manganese, lanthanide, iron, indium tin, copper, cobalt aluminum, chromium, niobium or calcium oxide; or the particles include titanium, tantalum, aluminum An oxide of zirconium, hafnium or selenium with a refractive index of 1.6 to 1.9. 如申請專利範圍第8項或第9項所述之顯示器,其中所述矽氧烷材料為包括芳基或烷基之矽氧烷聚合物,所述粒子包括過渡金屬氧化物且平均粒度小於100奈米。The display of claim 8 or 9, wherein the siloxane material is a siloxane or an alkyl group comprising a siloxane or an alkyl group, the particles comprising a transition metal oxide and having an average particle size of less than 100 Nano. 如申請專利範圍第8項至第10項中任一項所述之顯示器,其中所述複數個基板包括上面具有液晶元件之第一基板、上面包括電容式觸控感測器之第二基板以及第三基板,所述第三基板為覆蓋基板。The display of any one of the preceding claims, wherein the plurality of substrates comprises a first substrate having a liquid crystal element thereon, a second substrate including a capacitive touch sensor thereon, and a third substrate, the third substrate being a cover substrate. 一種製造顯示器之方法,包括: 提供上面具有像素元件的陣列之第一基板,其中所述像素元件各自包括液晶材料及/或發光二極體材料; 提供第二基板,所述第二基板為覆蓋基板;以及 藉由接著劑將所述第一基板及所述第二基板接著在一起, 其中所述接著劑包含電絕緣材料,所述電絕緣材料的電阻率大於1000 Ω/sq且包括矽氧烷材料及平均粒度小於400奈米之粒子; 其中藉由施加熱及/或UV光使在所述第一基板及所述第二基板之間的所述矽氧烷材料固化及硬化,以使所述第一基板及所述第二基板黏結在一起。A method of manufacturing a display, comprising: providing a first substrate having an array of pixel elements thereon, wherein the pixel elements each comprise a liquid crystal material and/or a light emitting diode material; providing a second substrate, the second substrate being covered Substrate; and bonding the first substrate and the second substrate together by an adhesive, wherein the adhesive comprises an electrically insulating material having a resistivity greater than 1000 Ω/sq and including xenon oxide An alkane material and particles having an average particle size of less than 400 nm; wherein the siloxane material between the first substrate and the second substrate is cured and hardened by applying heat and/or UV light to The first substrate and the second substrate are bonded together. 如申請專利範圍第12項所述之製造顯示器之方法,其中固化包括軟烘烤所述矽氧烷粒子材料、對所述矽氧烷粒子材料進行UV圖案化以及選擇性地移除部分所述矽氧烷粒子材料以留下電絕緣圖案。The method of manufacturing a display of claim 12, wherein curing comprises soft baking the siloxane oxide particle material, UV patterning the siloxane oxide particle material, and selectively removing a portion of the method The siloxane oxide material leaves an electrically insulating pattern. 如申請專利範圍第12項或第13項中任一項所述之製造顯示器之方法,其中所述矽氧烷起始材料實質上不含-OH基團。The method of producing a display according to any one of claims 12 to 13, wherein the oxirane starting material is substantially free of -OH groups. 如申請專利範圍第12項至第14項中任一項所述之製造顯示器之方法,其中所述矽氧烷起始材料實質上不含Si-H鍵。A method of manufacturing a display according to any one of claims 12 to 14, wherein the siloxane starting material is substantially free of Si-H bonds. 如申請專利範圍第12項至第15項中任一項所述之製造顯示器之方法,其中所述矽氧烷材料包括有機芳基或烷基。The method of manufacturing a display according to any one of claims 12 to 15, wherein the siloxane material comprises an organic aryl group or an alkyl group. 如申請專利範圍第12項至第16項中任一項所述之製造顯示器之方法,其中所述矽氧烷材料包括芳基但不包括烷基。The method of manufacturing a display according to any one of claims 12 to 16, wherein the decyl alkane material comprises an aryl group but does not include an alkyl group. 如申請專利範圍第12項至第17項中任一項所述之製造顯示器之方法,其中所述芳基為直接結合至所述矽氧烷材料中之矽之苯基。The method of manufacturing a display according to any one of claims 12 to 17, wherein the aryl group is a phenyl group directly bonded to the oxime in the oxoxane material. 一種組成物,包括: 具有[-Si-O-Si-O]n的重複主鏈之矽氧烷聚合物,所述重複主鏈上具有a)烷基或芳基,且所述重複主鏈上具有b)官能性交聯基團;以及 粒子,所述粒子為平均粒度小於400奈米之氧化物奈米粒子或氮化物奈米粒子, 其中所述矽氧烷聚合物之分子量為300公克/莫耳至10,000公克/莫耳,且 其中所述組成物在5 rpm黏度計及25℃下之黏度為1000兆帕-秒至75,000兆帕-秒,且 其中所述矽氧烷聚合物中實質上不含-OH基團。A composition comprising: a hafnoxy polymer having a repeating backbone of [-Si-O-Si-O]n having a) an alkyl or aryl group on the repeating backbone, and the repeating backbone Having b) a functional crosslinking group; and particles which are oxide nanoparticles or nitride nanoparticles having an average particle size of less than 400 nm, wherein the molecular weight of the siloxane polymer is 300 gram / Mohr to 10,000 g/mole, and wherein the composition has a viscosity of 5 MPa to 75,000 MPa-sec at a 5 rpm viscometer and at 25 ° C, and wherein the siloxane polymer is substantially There is no -OH group on it. 一種觸控面板,包括: 透明基板; 第一導電層; 介電層,其包括矽氧烷聚合物及平均粒度為400奈米或更小之粒子;以及 第二導電層, 其中所述矽氧烷聚合物包括芳基且實質上不含-OH基團, 且其中所述矽氧烷聚合物加熱至200℃時具有小於1%之質量損失, 且其中所述介電層之電阻率為1000 Ω/sq或更大, 且其中所述介電層對於可見光之光學透射率為至少85%。A touch panel comprising: a transparent substrate; a first conductive layer; a dielectric layer comprising a siloxane polymer and particles having an average particle size of 400 nm or less; and a second conductive layer, wherein the cesium oxide The alkane polymer comprises an aryl group and is substantially free of -OH groups, and wherein the siloxane polymer has a mass loss of less than 1% when heated to 200 ° C, and wherein the dielectric layer has a resistivity of 1000 Ω/sq or greater, and wherein the dielectric layer has an optical transmittance of at least 85% for visible light.
TW104142655A 2015-12-18 2015-12-18 Dielectric film and making method thereof, display and making method thereof, composition, and touch panel TWI691527B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104142655A TWI691527B (en) 2015-12-18 2015-12-18 Dielectric film and making method thereof, display and making method thereof, composition, and touch panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104142655A TWI691527B (en) 2015-12-18 2015-12-18 Dielectric film and making method thereof, display and making method thereof, composition, and touch panel

Publications (2)

Publication Number Publication Date
TW201723033A true TW201723033A (en) 2017-07-01
TWI691527B TWI691527B (en) 2020-04-21

Family

ID=60047953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142655A TWI691527B (en) 2015-12-18 2015-12-18 Dielectric film and making method thereof, display and making method thereof, composition, and touch panel

Country Status (1)

Country Link
TW (1) TWI691527B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI744051B (en) 2020-10-26 2021-10-21 欣興電子股份有限公司 Touch display device and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008189917A (en) * 2007-01-11 2008-08-21 Sekisui Chem Co Ltd Thermosetting composition for optical semiconductor, die bonding material for optical semiconductor element, underfill material for optical semiconductor element, sealant for optical semiconductor element and optical semiconductor element
JP2010192378A (en) * 2009-02-20 2010-09-02 Jsr Corp Flat panel display member forming composition
JP5423802B2 (en) * 2009-09-29 2014-02-19 東レ株式会社 Positive photosensitive resin composition, cured film and optical device using the same

Also Published As

Publication number Publication date
TWI691527B (en) 2020-04-21

Similar Documents

Publication Publication Date Title
US10502995B2 (en) Dielectric siloxane particle films, and devices having the same
US11084928B2 (en) Transparent siloxane encapsulant and adhesive
KR102454572B1 (en) Composition having siloxane polymer and particle
US11289666B2 (en) Electrically conductive siloxane particle films, and devices with the same
US11001674B2 (en) Method of making a siloxane polymer composition
US20190061236A1 (en) Three dimensional printing materials and method for making a 3D printed article
US11592945B2 (en) Dielectric siloxane particle films and devices having the same
TW201723033A (en) Dielectric film and making method thereof, display and making method thereof, composition, and touch panel
TWI694112B (en) Composition having siloxane polymer and process for producing siloxane particulate composition
TW201723133A (en) Composition, siloxane polymer film and method for making siloxane particle film
TWI785389B (en) Siloxane polymer composition and manufacturing method thereof
TWI746428B (en) Siloxane polymer composition and manufacturing method thereof