TW201721386A - Touch panel - Google Patents
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- TW201721386A TW201721386A TW105129569A TW105129569A TW201721386A TW 201721386 A TW201721386 A TW 201721386A TW 105129569 A TW105129569 A TW 105129569A TW 105129569 A TW105129569 A TW 105129569A TW 201721386 A TW201721386 A TW 201721386A
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- Position Input By Displaying (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Abstract
Description
本發明係有關一種可用指尖多點檢測之投影型電容式的觸控面板。 The invention relates to a projection type capacitive touch panel which can be detected by multi-point detection of a fingertip.
近年來,在行動電話、智慧型裝置(例如平板式終端機或電子書閱讀器等)、汽車導航系統等的電子裝置中,作為一種介面形態,配備有具備以可直觀的操作、耐久性優異為優點的觸控面板功能的顯示裝置(具有觸控面板的顯示裝置:觸控面板裝置)。 In recent years, electronic devices such as mobile phones, smart devices (such as tablet terminals or e-book readers), and car navigation systems have been designed as an interface to provide intuitive operation and excellent durability. A display device having a touch panel function (a display device having a touch panel: a touch panel device).
觸控面板係為檢測手指或觸控筆等的指示體的觸控,來特定其觸控位置的座標之位置輸入裝置。觸控面板的檢測方式大致分為:包含類比電阻膜式及矩陣電阻膜式的電阻膜式、包含表面型電容式及投影型電容式的電容式、包含紅外線掃描式及回歸反射式的光學式、包含表面彈性波式及板波式的超音波式,各種方式的觸控面板均已被實用化。 The touch panel is a position input device that detects a touch of a pointer such as a finger or a stylus pen to specify a coordinate of the touch position. The detection methods of the touch panel are roughly classified into a resistive film type including an analog resistive film type and a matrix resistive film type, a capacitive type including a surface type capacitive type and a projected type capacitive type, and an optical type including an infrared scanning type and a retroreflective type. Including the surface acoustic wave type and the plate wave type ultrasonic type, various types of touch panels have been put into practical use.
惟近年來,上述的檢測方式中,特別是投影型電容式的觸控面板的需求逐漸增加。投影型電容式的觸控面板係為指尖一靠近,即檢測指尖附近的電極的電容 變化,從縱橫的2個電極列檢測觸控面板上之位置座標者。 However, in recent years, the demand for the above-described detection methods, particularly the projection type capacitive touch panel, has been increasing. The projection type capacitive touch panel is such that the fingertip is close, that is, the capacitance of the electrode near the fingertip is detected. Change, detecting the positional coordinates on the touch panel from the two electrode columns in the vertical and horizontal directions.
第5圖係顯示此種投影型電容式的觸控面板之一例的部分剖面圖。第5圖的投影型電容式的觸控面板51係以下述構成為基本構造而製造:在具有透光性的1片基板52的單面(與成為操作面側之表面相反向的背面)形成具備電極部53的感測部54,該電極部53係將由延伸於第1方向(例如橫向)之透明導電膜所構成的複數列的第1電極(例如X電極)及由延伸於與第1電極交叉的第2方向(例如縱向)之透明導電膜所構成的複數列的第2電極(例如Y電極)予以積層而成者,並在框體部55的卡合凹部55a經由雙面膠帶等黏接材56包夾感測部54而成的構成。 Fig. 5 is a partial cross-sectional view showing an example of such a projection type capacitive touch panel. The projection type capacitive touch panel 51 of the fifth embodiment is manufactured by the following configuration: a single surface of one of the light-transmitting substrates 52 (the back surface opposite to the surface on the operation surface side) is formed. The sensor unit 54 including the electrode unit 53 that extends from the first electrode (for example, the X electrode) in a plurality of rows of transparent conductive films extending in the first direction (for example, the lateral direction) The second electrode (for example, the Y electrode) of the plurality of rows of the transparent conductive film in the second direction (for example, the longitudinal direction) in which the electrodes intersect is laminated, and the engagement recess 55a of the frame portion 55 is passed through a double-sided tape or the like. The adhesive member 56 has a configuration in which the sensing portion 54 is sandwiched.
又,在基板52,隔著裝飾層58形成有由電極部(第1電極、第2電極)53的各個端部拉出之拉出配線部57。另外,以覆蓋感測部54的電極部53及拉出配線部57整體的方式形成有包含透明絕緣膜的保護層59。然後,在與基板52的感測部54相對向的位置,例如藉由透明黏接膠帶等黏接材61黏接固定有液晶顯示裝置等的顯示裝置60。此種投影型電容式的觸控面板,已知為例如下述專利文獻1所揭示者。 Further, on the substrate 52, a pull-out wiring portion 57 which is pulled out from each end portion of the electrode portion (first electrode, second electrode) 53 is formed via the decorative layer 58. Further, a protective layer 59 including a transparent insulating film is formed to cover the electrode portion 53 of the sensing portion 54 and the entire pull-out wiring portion 57. Then, a display device 60 such as a liquid crystal display device is bonded and fixed to the position facing the sensing portion 54 of the substrate 52 by, for example, a bonding material 61 such as a transparent adhesive tape. Such a projection type capacitive touch panel is known, for example, as disclosed in Patent Document 1 below.
專利文獻1:日本特開2011-90443號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-90443
專利文獻1所揭示的觸控面板係在操作區域以外的區域(外圍)配置設於基板52的背面之電極部53的拉出配線部57,並設有以使用者不會從觸控面板的操作面側看見之方式予以隱藏的裝飾層58。 In the touch panel disclosed in Patent Document 1, the pull-out wiring portion 57 of the electrode portion 53 provided on the back surface of the substrate 52 is disposed in a region (outer periphery) other than the operation region, and is provided so as not to be removed from the touch panel by the user. The decorative layer 58 is hidden in a manner seen on the side of the operation surface.
但是,為了不妨礙配備觸控面板的電子裝置的設計,裝飾層58的顏色必須依據框體部55的顏色搭配,材質不同的零件的顏色要彼此搭配,在作業上非常困難。此外,也有為了設置裝飾層58而使觸控面板的製造步驟增加,製造成本提高的問題。 However, in order not to hinder the design of the electronic device equipped with the touch panel, the color of the decorative layer 58 must be matched according to the color of the frame portion 55, and the colors of the parts having different materials are matched with each other, which is very difficult in operation. Further, there is a problem in that the manufacturing steps of the touch panel are increased in order to provide the decorative layer 58, and the manufacturing cost is increased.
另外,由於專利文獻1的觸控面板係在框體部55嵌入感測部54並透過黏接材61予以黏接固定的構造,受到落下等較強的衝擊時,會有感測部54從框體部脫落的問題。 Further, the touch panel of Patent Document 1 is a structure in which the frame portion 55 is fitted into the sensing portion 54 and is adhered and fixed by the adhesive member 61, and when a strong impact such as dropping occurs, the sensing portion 54 may be The problem of the frame body falling off.
又,觸控面板51的感測部54的電極部(第1電極、第2電極)53雖經由拉出配線部57從端部與未圖示的控制IC連接,但是拉出配線部57外露而暴露於空氣中容易產生腐蝕,並有斷線之虞,以往的對策是以覆蓋拉出配線部57的全面的方式形成由透明絕緣膜構成的保護層59。 Further, the electrode portion (first electrode, second electrode) 53 of the sensing portion 54 of the touch panel 51 is connected to a control IC (not shown) from the end portion via the pull-out wiring portion 57, but the pull-out wiring portion 57 is exposed. On the other hand, in the case where it is exposed to the air, corrosion is likely to occur, and the wire is broken. Conventionally, the protective layer 59 made of a transparent insulating film is formed so as to cover the entire portion of the drawn wiring portion 57.
然而,在高溫高濕(例如85℃、85%)的條件下對形成有透明絕緣膜的保護層59的觸控面板51進行性能評價測試後,可知根據保護層的規格,隨著時間的過去,外來的濕氣會通過具有透濕性的保護層59而到達拉出配 線部57,拉出配線部57會有被腐蝕之虞。因此,需要對僅以保護層59覆蓋拉出配線部57的構造提升拉出配線部57的耐腐蝕性。 However, after the performance evaluation test of the touch panel 51 on which the protective layer 59 having the transparent insulating film is formed under conditions of high temperature and high humidity (for example, 85 ° C, 85%), it is understood that, according to the specifications of the protective layer, over time The foreign moisture will reach the pull-out through the moisture-permeable protective layer 59. In the wire portion 57, the wire portion 57 is pulled out and corroded. Therefore, it is necessary to improve the corrosion resistance of the pull-out wiring portion 57 with the configuration in which the pull-out wiring portion 57 is covered only by the protective layer 59.
本發明係鑑於上述課題而完成者,其目的在於提供一種耐衝擊性優異,且無需設置裝飾部,操作面側的設計性優越之觸控面板。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a touch panel which is excellent in impact resistance and which does not require a decorative portion and has excellent design on the operation surface side.
為達成上述目的,本發明之第1形態的觸控面板係在具備:使各自包含複數個電極列的第1電極與第2電極互相交叉,以使其交叉部分絕緣的方式在具有透光性之基板的背面形成有前述第1電極與前述第2電極的感測部;以及在包夾該感測部的狀態被嵌入射出成型的框體部的投影型電容式的觸控面板中,以避開前述第1電極及前述第2電極的拉出配線部而至少覆蓋前述操作區域的一部分的方式在前述基板的表面設置有覆蓋構件,前述框體部係以使前述覆蓋構件與前述基板之間無段差並與前述覆蓋構件成為同一平面的方式,藉由樹脂材料被嵌入射出成型成從上下包夾前述基板的外緣部。 In order to achieve the above object, a touch panel according to a first aspect of the present invention includes a first electrode and a second electrode each including a plurality of electrode rows, and is insulated from each other so as to be insulated. a sensing portion of the first electrode and the second electrode is formed on the back surface of the substrate; and a projection type capacitive touch panel in which the frame portion of the injection molding is embedded in the state in which the sensing portion is sandwiched, a cover member is provided on a surface of the substrate so as to cover at least a part of the operation region, so that the cover member and the substrate are The resin material is embedded and injection-molded so as to have an outer edge portion of the substrate from the upper and lower sides so as to have no difference between the cover members and the cover member.
本發明之第2形態的觸控面板係在第1形態的觸控面板中,前述框體部係以至少覆蓋前述拉出配線部的表面的方式成型。 In the touch panel of the first aspect of the invention, in the touch panel of the first aspect, the frame portion is formed to cover at least the surface of the drawn wiring portion.
本發明之第3形態的觸控面板係在第1或第2形態的觸控面板中,前述覆蓋構件為玻璃材料。 A touch panel according to a third aspect of the present invention is the touch panel of the first or second aspect, wherein the covering member is a glass material.
本發明之第4形態的觸控面板係在第1或第 2形態的觸控面板中,前述覆蓋構件為透明樹脂材料。 The touch panel of the fourth aspect of the present invention is in the first or the In the touch panel of the second aspect, the covering member is a transparent resin material.
本發明之第5形態的觸控面板係在第4形態的觸控面板中,在前述覆蓋構件之與前述框體部的抵接部分形成有突起。 In the touch panel of the fourth aspect of the invention, in the touch panel of the fourth aspect, a protrusion is formed in a contact portion of the cover member with the frame portion.
根據本發明,由於無需設置使拉出配線部從外部無法辨識的方式予以遮蔽的裝飾部,而可遮蔽拉出配線部,所以製造成本降低。又,因為使框體部相對於基板進行嵌入射出成型,所以不需擔心落下等較強的衝擊會使基板從框體部脫離,可提供信賴度高的觸控面板。此外,若將覆蓋構件的形狀設計成圓形或多角形等任意的形狀,則在維持感測部之一般化下僅變更覆蓋構件的形狀即可任意變更設計。 According to the present invention, since it is not necessary to provide a decorative portion that shields the drawn wiring portion from the outside, the wiring portion can be shielded, and the manufacturing cost is lowered. Further, since the frame portion is inserted and molded with respect to the substrate, the substrate can be detached from the frame portion without a strong impact such as dropping, and a highly reliable touch panel can be provided. Further, when the shape of the covering member is designed to be any shape such as a circular shape or a polygonal shape, the design can be arbitrarily changed by merely changing the shape of the covering member while maintaining the generality of the sensing portion.
又,以至少覆蓋各電極之拉出配線部的區域的方式對框體部進行嵌入射出成型,因為拉出配線部整體被樹脂覆蓋,所以外來的濕氣不易通過,可充分發揮防止拉出配線部腐蝕的效果。 In addition, the frame body portion is inserted and injection-molded so as to cover at least the region where the electrode is pulled out of the wiring portion, and since the entire pull-out wiring portion is covered with the resin, external moisture is hard to pass, and the pull-out prevention wiring can be sufficiently exhibited. The effect of corrosion.
1‧‧‧觸控面板 1‧‧‧ touch panel
2‧‧‧感測部 2‧‧‧Sensing Department
3‧‧‧框體部 3‧‧‧ Frame Department
3a‧‧‧表面 3a‧‧‧ surface
3b‧‧‧操作按鈕 3b‧‧‧ operation button
11‧‧‧基板 11‧‧‧Substrate
11a‧‧‧背面(操作相對面) 11a‧‧‧Back (opposite side of operation)
11b‧‧‧表面(操作面) 11b‧‧‧Surface (operation surface)
12‧‧‧電極部 12‧‧‧Electrode
13‧‧‧第1電極 13‧‧‧1st electrode
14‧‧‧第2電極 14‧‧‧2nd electrode
14a‧‧‧電極膜 14a‧‧‧Electrode film
15‧‧‧交叉部 15‧‧‧Intersection
16‧‧‧絕緣層 16‧‧‧Insulation
17‧‧‧橋配線 17‧‧‧Bridge wiring
18‧‧‧拉出配線部 18‧‧‧ Pull out the wiring department
19‧‧‧覆蓋構件 19‧‧‧ Covering components
19a‧‧‧突起 19a‧‧‧ Protrusion
20‧‧‧黏接層 20‧‧‧bonding layer
21‧‧‧黏羧層 21‧‧‧Carbon layer
22‧‧‧顯示裝置 22‧‧‧ display device
51‧‧‧觸控面板 51‧‧‧ touch panel
52‧‧‧基板 52‧‧‧Substrate
53‧‧‧電極部 53‧‧‧Electrode
54‧‧‧感測部 54‧‧‧Sense Department
55‧‧‧框體部 55‧‧‧ Frame Department
55a‧‧‧卡合凹部 55a‧‧‧Pocket recess
56‧‧‧黏接材 56‧‧‧Adhesive
57‧‧‧拉出配線部 57‧‧‧ Pull out the wiring department
58‧‧‧裝飾層 58‧‧‧Decorative layer
59‧‧‧保護層 59‧‧‧Protective layer
60‧‧‧顯示裝置 60‧‧‧ display device
61‧‧‧黏接材 61‧‧‧Adhesive
E1‧‧‧操作區域 E1‧‧‧Operating area
E2‧‧‧拉出配線區域 E2‧‧‧ Pull out the wiring area
第1圖(a)係從背面側看到本發明之觸控面板的感測部的平面圖,(b)係(a)的A-A線放大剖面圖。 Fig. 1(a) is a plan view showing a sensing portion of the touch panel of the present invention from the back side, and (b) is an enlarged cross-sectional view taken along line A-A of (a).
第2圖(a)係顯示本發明之觸控面板的平面之一例圖,(b)係(a)的B-B線部分放大剖面圖。 Fig. 2(a) is a view showing an example of a plane of the touch panel of the present invention, and Fig. 2(b) is an enlarged cross-sectional view showing a portion B-B of the line (a).
第3圖係顯示於覆蓋構件已設置防止脫落用的突起時 之形態例的圖。 Fig. 3 is a view showing when the covering member is provided with a projection for preventing falling off A diagram of a morphological example.
第4圖(a)、(b)係顯示形成在基板的缺口部之形成例的圖。 Fig. 4 (a) and (b) are views showing an example of formation of a notch portion formed in a substrate.
第5圖係顯示以往的觸控面板的安裝構造之一例的部分放大剖面圖。 Fig. 5 is a partially enlarged cross-sectional view showing an example of a mounting structure of a conventional touch panel.
以下,參照添附圖面詳細說明用來實施本發明的形態。本發明並不限定於該實施形態,所屬技術領域的技術人員根據該形態能想到之其他可實施的形態、實施例及運用技術等,均包含在本發明的範疇。 Hereinafter, embodiments for carrying out the invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the embodiment, and other embodiments, embodiments, and operating techniques that can be conceived by those skilled in the art based on this aspect are included in the scope of the present invention.
另外,本說明書中,參照添附各圖做的以下說明,為顯示方向或位置所使用之上、下、左、右的用語係如圖面所示,與使用者觀看的上、下、左、右方向一致。 In addition, in the present specification, the following descriptions are attached with reference to the accompanying drawings, and the terms of the top, bottom, left, and right used for the display direction or position are as shown in the figure, and the upper, lower, and left views of the user are viewed. The right direction is the same.
本實施形態之觸控面板1係採用指尖一靠近,即檢測指尖附近的電極的電容變化,從縱橫的2個電極列檢測觸控面板1上之位置座標之可用指尖多點檢測的投影型電容式觸控面板。 In the touch panel 1 of the present embodiment, the fingertips are close to each other, that is, the capacitance change of the electrodes near the fingertips is detected, and the positional coordinates of the position coordinates on the touch panel 1 are detected from the two vertical and horizontal electrode columns. Projected capacitive touch panel.
首先,參照第1圖至第3圖說明本發明之觸控面板1的構造。此外,本實施形態之觸控面板1係以長方形做為平面觀看的形狀來圖示進行說明,但其形狀並不限定為長方形,例如正方形、圓形、橢圓形、多角形等形狀亦可。 First, the configuration of the touch panel 1 of the present invention will be described with reference to Figs. 1 to 3 . Further, the touch panel 1 of the present embodiment is illustrated by a rectangular shape as a plan view. However, the shape is not limited to a rectangular shape, and may be a shape such as a square, a circle, an ellipse or a polygon.
如第1圖、第2圖之任一圖面所示,本實施 形態之觸控面板1的大致構成係具備:包含形成在具有透光性之基板11的背面(與成為操作面的表面相反向的面)的第1電極13與第2電極14的電極部12被配置而成的感測部2;以及使感測部2在上下方向被包夾的狀態進行嵌入射出成型的框體部3。 As shown in any of the first and second figures, the present embodiment The schematic configuration of the touch panel 1 includes the first electrode 13 and the electrode portion 12 of the second electrode 14 which are formed on the back surface of the substrate 11 having light transmissivity (the surface opposite to the surface on which the operation surface is opposed). The sensor unit 2 that is disposed; and the frame portion 3 that is inserted into the injection molding in a state in which the sensor unit 2 is sandwiched in the vertical direction.
感測部2係如第1圖(a)所示,以矩形板狀的基板11做為基部。基板11係以具有透光性的絕緣性材料形成,例如可使用玻璃式或薄膜式。玻璃式的基板11,例如使用無鹼玻璃、鈉鈣玻璃、鋁矽酸鹽玻璃等。此外,薄膜式的基板11,例如使用聚對苯二甲酸乙二醇酯(PET)等樹脂製的薄膜。 The sensor unit 2 has a rectangular plate-shaped substrate 11 as a base as shown in Fig. 1(a). The substrate 11 is formed of an insulating material having light transmissivity, and for example, a glass type or a film type can be used. As the glass substrate 11, for example, an alkali-free glass, a soda lime glass, an aluminosilicate glass or the like is used. Further, as the film type substrate 11, for example, a film made of a resin such as polyethylene terephthalate (PET) is used.
在基板11的背面(與以指尖操作之面相反向之相反側的面,以下稱做操作相對面)11a形成有作為電極部12的第1電極13和第2電極14。第1電極13係例如將ITO(銦錫氧化物,Indium Tin Oxide)等的透明導電膜以光刻技術等使抗蝕膜圖案化之後進行蝕刻處理,例如在第1圖的縱向(X方向)形成複數排列的列電極。 The first electrode 13 and the second electrode 14 as the electrode portion 12 are formed on the back surface of the substrate 11 (the surface opposite to the surface opposite to the surface operated by the fingertip, hereinafter referred to as the operation opposing surface) 11a. In the first electrode 13 , for example, a transparent conductive film such as ITO (Indium Tin Oxide) is patterned by a photolithography technique or the like, and then an etching process is performed, for example, in the longitudinal direction (X direction) of FIG. 1 . A plurality of column electrodes are arranged.
第2電極14係與第1電極13相同,例如將ITO(Indium Tin Oxide)等的透明導電膜以光刻技術等使抗蝕膜圖案化之後進行蝕刻處理,例如在第1圖的橫向(Y方向)形成複數排列的列電極。 The second electrode 14 is the same as the first electrode 13. For example, a transparent conductive film such as ITO (Indium Tin Oxide) is patterned by a photolithography technique or the like, and then an etching process is performed, for example, in the lateral direction of FIG. The direction) forms a plurality of column electrodes arranged in series.
接著針對電極部12的形成方法進行說明。首先,相對於基板11的操作相對面11a形成延伸於第1圖(a)的縱向(X方向)的複數個第1電極13、及在分離狀態配 置於第1圖(a)的橫向(Y方向)的複數個電極膜14a。其次,在第1電極13和第2電極14的交叉部15的第1電極13上形成絕緣層16。絕緣層16係使第1電極13與第2電極14之間電性絕緣者,例如由丙烯酸樹脂等的絕緣材料構成。然後,如第1圖(b)所示,跨越第1電極13而在第1圖(a)的橫向(Y方向)以橋配線(跨接配線)17連接複數個電極膜14a,形成第2電極14。此時,連接構成第2電極14的電極膜14a、14a之間的橋配線17係以通過絕緣層16上的方式配線。而且,在本例中,將形成有由第1電極13與第2電極14所得的電極部12之第2圖(a)的內側的矩形部分做為感測部2的操作區域E1。 Next, a method of forming the electrode portion 12 will be described. First, a plurality of first electrodes 13 extending in the longitudinal direction (X direction) of FIG. 1(a) are formed with respect to the operation opposing surface 11a of the substrate 11, and are disposed in a separated state. The plurality of electrode films 14a are placed in the lateral direction (Y direction) of Fig. 1(a). Next, an insulating layer 16 is formed on the first electrode 13 of the intersection portion 15 of the first electrode 13 and the second electrode 14. The insulating layer 16 is electrically insulated from the first electrode 13 and the second electrode 14, and is made of, for example, an insulating material such as an acrylic resin. Then, as shown in FIG. 1(b), a plurality of electrode films 14a are connected to the first electrode 13 in the lateral direction (Y direction) of FIG. 1(a) by bridge wiring (jumping wiring) 17, and the second electrode layer 14a is formed. Electrode 14. At this time, the bridge wiring 17 connecting the electrode films 14a and 14a constituting the second electrode 14 is wired so as to pass through the insulating layer 16. Further, in this example, the rectangular portion on the inner side of the second figure (a) of the electrode portion 12 obtained by the first electrode 13 and the second electrode 14 is formed as the operation region E1 of the sensing portion 2.
此外,上述之電極部12的形成方法中,係在第2電極14使用橋配線17,但亦可設成使第1電極13與第2電極14反轉的構造,而在第1電極13使用橋配線17。又,由於第1電極13與第2電極14至少在交叉部15絕緣即可,故亦可設成在一側的電極(第1電極13或第2電極14)全面形成絕緣層16,在絕緣層16上形成另一側的電極(第2電極14或第1電極13)的構造。 In the method of forming the electrode portion 12 described above, the bridge wire 17 is used for the second electrode 14. However, the first electrode 13 and the second electrode 14 may be reversed, and the first electrode 13 may be used. Bridge wiring 17. Further, since the first electrode 13 and the second electrode 14 are insulated at least at the intersection portion 15, the electrode (the first electrode 13 or the second electrode 14) on one side may be integrally formed with the insulating layer 16 and insulated. The structure of the other electrode (the second electrode 14 or the first electrode 13) is formed on the layer 16.
以上述的形成方法在基板11形成的第1電極13與第2電極14係如第1圖(a)所示,藉由拉出配線部18使各自的端部被拉出至基板11的端部,與未圖示的控制IC(控制電路)配線連接。 The first electrode 13 and the second electrode 14 formed on the substrate 11 by the above-described forming method are pulled out of the wiring portion 18 so that the respective end portions are pulled out to the end of the substrate 11 as shown in Fig. 1(a). The unit is connected to a control IC (control circuit) not shown.
拉出配線部18係如第2圖(a)所示,在操作區域E1的外側的ㄈ字型部分的拉出配線區域E2(圖中的影 線區域)中,為從第1電極13與第2電極14各自的端部拉出的配線,例如將MAM(Mo/Al/Mo)、APC(Ag.Pd.Cu等)等的金屬膜藉由濺鍍法成膜,並藉由蝕刻法形成預定的圖案至基板11的端部為止。 The pull-out wiring portion 18 is a pull-out wiring region E2 of the U-shaped portion outside the operation region E1 as shown in Fig. 2(a) (image in the figure) In the line region, the wiring drawn from the end portions of the first electrode 13 and the second electrode 14 is, for example, a metal film such as MAM (Mo/Al/Mo) or APC (Ag. Pd. Cu). A film is formed by sputtering, and a predetermined pattern is formed by etching to the end of the substrate 11.
以此方式,感測部2為了保持作為位置感測器的精確度,由直線狀電極構成的第1電極13與第2電極14係在被電性絕緣的狀態,於基板11上配置成XY的矩陣狀,且並非檢測是在哪個電極的哪邊附近,而是獨立檢測為哪個X方向電極及哪個Y方向電極,可由其交叉點算出位置。 In this manner, in order to maintain the accuracy of the position sensor, the first electrode 13 and the second electrode 14 each composed of a linear electrode are electrically insulated, and are disposed on the substrate 11 as XY. In the matrix form, it is not detected which side of which electrode is in the vicinity, but which X-direction electrode and which Y-direction electrode are independently detected, and the position can be calculated from the intersection.
又,對框體部3進行嵌入射出成型時,以至少覆蓋與拉出配線部18相反向的基板11的操作面11b側以在基板11的表面側(基板11的操作面11b側)避開拉出配線部18的拉出配線區域E2之方式,經由黏接層20在比拉出配線區域E2更內側的位置配置覆蓋構件19。 When the frame portion 3 is subjected to the injection molding, the operation surface 11b side of the substrate 11 facing at least the opposite side of the pull-out wiring portion 18 is covered so as to avoid the surface side of the substrate 11 (the operation surface 11b side of the substrate 11). The cover member 19 is disposed at a position inside the pull-out wiring region E2 via the adhesive layer 20 so that the wiring portion 18 of the wiring portion 18 is pulled out.
覆蓋構件19係在將框體部3嵌入射出成型時,配置為具有避開設置於操作對向面11a側的拉出配線區域E2的形狀者。由於將覆蓋構件19配置在基板11的操作面11b上,故與基板11的操作面11b之間會產生段差部分,在進行嵌入射出成型時,可使框體部3的樹脂材料進入以填埋該段差部分。藉此,在成為觸控面板1時,由於可以框體部3覆蓋拉出配線區域E2,在成為觸控面板1時,無需設置基板11本身的加工或裝飾層,而能夠與以往的製品同樣地從外部遮蔽拉出配線部18。 The cover member 19 is arranged to have a shape that avoids the pull-out wiring area E2 placed on the side of the operation opposing surface 11a when the frame portion 3 is fitted into the injection molding. Since the covering member 19 is disposed on the operation surface 11b of the substrate 11, a step portion is formed between the operation surface 11b of the substrate 11, and the resin material of the frame portion 3 can be entered for landfill when the injection molding is performed. The difference between the sections. Therefore, when the touch panel 1 is used, the frame portion 3 can cover the drawn wiring region E2, and when the touch panel 1 is used, it is not necessary to provide the processing or decorative layer of the substrate 11 itself, and the same as the conventional product. The wiring portion 18 is pulled out from the outside.
以玻璃材料形成覆蓋構件19的情形,其優點為:透明度高且根據玻璃的質感(硬度、接觸時的冰涼感)可獲得高級感、以及可對應耐藥品性、耐氣候性、耐摩損性等的種種使用環境。 The case where the cover member 19 is formed of a glass material has the advantages of high transparency and high-grade feeling according to the texture of the glass (hardness, cold feeling at the time of contact), and resistance to chemical resistance, weather resistance, abrasion resistance, and the like. a variety of use environments.
又,以透明樹脂材料(例如:聚碳酸酯、三乙酸纖維素、丙烯酸樹脂等)形成覆蓋構件19時,就比起玻璃材料,因掉落破損等造成之碎片不容易飛散之點,容易在構件表面形成各種塗層(例如:AR塗層(防止反射塗層)、AG塗層(防眩塗層)、AFP塗層(防指紋塗層)等)的點,以及框體部3由於為樹脂材料所以樹脂之間的親和性佳之點而言,係較為優異。 Further, when the cover member 19 is formed of a transparent resin material (for example, polycarbonate, cellulose triacetate, acrylic resin, or the like), it is easier to scatter the fragments due to breakage or the like than the glass material. The surface of the member forms various coatings (for example, AR coating (anti-reflective coating), AG coating (anti-glare coating), AFP coating (anti-fingerprint coating), etc.), and the frame portion 3 is The resin material is excellent in that the affinity between the resins is good.
此外,在覆蓋構件19使用透明樹脂材料時,如第3圖所示,與框體部3抵接的部分藉由樹脂成型可容易以任意的形狀形成突起19a,該突起19a具有作為覆蓋構件19與框體部3之嵌合部的功能。以此方式,由於設置突起19a藉以增加與框體部3的接合區域(接觸面積),在觸控面板1落下時,可防止覆蓋構件19從框體部3脫落。又,第3圖所示之突起19a的形狀及個數係為一例,只要可達到與框體部3嵌合並防止脫落的效果,突起19a的形狀、尺寸、個數並無特別限定。 Further, when a transparent resin material is used for the covering member 19, as shown in Fig. 3, the portion abutting on the frame portion 3 can be easily formed into a projection 19a having a shape as a covering member 19 by resin molding. The function of the fitting portion with the frame portion 3. In this way, since the attachment protrusion 19a is provided to increase the joint area (contact area) with the frame portion 3, when the touch panel 1 is dropped, the cover member 19 can be prevented from falling off from the frame portion 3. Moreover, the shape and the number of the projections 19a shown in FIG. 3 are an example, and the shape, the size, and the number of the projections 19a are not particularly limited as long as they are fitted to the frame portion 3 and are prevented from falling off.
在基板11上配置覆蓋構件19時,為避免觸控面板1本身變得太厚,可依據觸控面板1的厚度適當地調整基板11的厚度與覆蓋構件19的厚度。例如:以往的基板11的厚度設為1.1mm時,若將基板11的厚度設為 0.5mm,覆蓋構件19的厚度設為0.6mm,合計厚度為1.1mm,與一般所使用之基板11的厚度相同。又,覆蓋構件19不限定為1片,分成複數片(例如目標厚度設為0.6mm時,可使用3片0.2mm的覆蓋構件)層疊亦可。 When the cover member 19 is disposed on the substrate 11, in order to prevent the touch panel 1 itself from becoming too thick, the thickness of the substrate 11 and the thickness of the cover member 19 can be appropriately adjusted according to the thickness of the touch panel 1. For example, when the thickness of the conventional substrate 11 is 1.1 mm, the thickness of the substrate 11 is set to 0.5 mm, the thickness of the covering member 19 is set to 0.6 mm, and the total thickness is 1.1 mm, which is the same as the thickness of the substrate 11 generally used. Further, the covering member 19 is not limited to one sheet, and may be laminated in a plurality of sheets (for example, when the target thickness is 0.6 mm, three sheets of 0.2 mm covering members may be used).
以此方式,在基板11的操作面11b側,至少避開拉出配線區域E2而在比拉出配線區域E2更內側的位置配置覆蓋構件19,藉此將框體部3嵌入射出成型時,該覆蓋構件19與基板11之間產生的段差部分由樹脂材料覆蓋,因此,無需如以往的裝置設置用來遮蔽拉出配線部18的裝飾層,即可獲得與設置裝飾層的裝置同樣的效果。又,由於可使樹脂材料進入因覆蓋構件19產生的段差部分,所以覆蓋構件19的表面與框體部3可成為同一平面且無縫隙。 In this manner, at least on the side of the operation surface 11b of the substrate 11, the cover member 19 is disposed at a position further inside than the pull-out wiring region E2, and the frame portion 3 is inserted into the injection molding. The step portion generated between the covering member 19 and the substrate 11 is covered with a resin material. Therefore, it is not necessary to provide a decorative layer for shielding the drawn wiring portion 18 as in the conventional device, and the same effect as that of the device for providing the decorative layer can be obtained. . Further, since the resin material can enter the step portion generated by the covering member 19, the surface of the covering member 19 and the frame portion 3 can be flush with each other.
另外,關於覆蓋構件19,只要在進行嵌入射出成型時,將加工成至少拉出配線區域E2會被框體部3的樹脂材料覆蓋的形狀者配置於基板11的操作面11b上即可,惟亦可例如第4圖(a)所示,配置加工成框體部3的樹脂材料及於操作區域E1的形狀者。 In addition, the covering member 19 may be placed on the operation surface 11b of the substrate 11 by being formed so that at least the drawn wiring region E2 is covered by the resin material of the frame portion 3 when the insertion/ejection molding is performed. For example, as shown in FIG. 4( a ), the resin material processed into the frame portion 3 and the shape of the operation region E1 may be arranged.
由於框體部3所使用之樹脂材料的電容率高,即使從及於操作區域E1上之框體部3的表面3a也可藉由電極部12檢測指尖的位置。因此,如第4圖(a)所示配置覆蓋構件19時,操作區域E1的一部分以框體部3的樹脂材料覆蓋,於已覆蓋操作區域E1的部分,如第4圖(b)所示,印刷操作按鈕3b的標記,藉由設定電極部12使各 按鈕發揮功能,則無需在框體部3另外成型壓下按鈕,可容易追加操作功能。 Since the resin material used for the frame portion 3 has a high permittivity, the position of the fingertip can be detected by the electrode portion 12 even from the surface 3a of the frame portion 3 on the operation region E1. Therefore, when the covering member 19 is disposed as shown in Fig. 4(a), a part of the operation region E1 is covered with the resin material of the frame portion 3, and the portion covering the operation region E1 is as shown in Fig. 4(b). , the mark of the print operation button 3b is set by the electrode portion 12 When the button functions, it is not necessary to form a press button in the frame portion 3, and the operation function can be easily added.
又,由於覆蓋構件19的形狀可設計成圓形或多角形等任意的形狀,故可在維持感測部2之一般化的情況下,僅變更覆蓋構件19的形狀則可任意變更設計。 Further, since the shape of the covering member 19 can be designed to have any shape such as a circular shape or a polygonal shape, the design of the covering member 19 can be arbitrarily changed while maintaining the general shape of the sensing portion 2.
框體部3例如由廣泛使用的塑膠、工程塑膠等熱可塑性的合成樹脂構成。框體部3係以成為感測部2的操作區域E1(指尖所操作的區域)的操作面11b側作為表面,以覆蓋因配置在基板11的操作面11b上之覆蓋構件19產生的段差部分之方式,從上下(表面及背面)包夾基板11的外緣端部,藉由樹脂材料進行嵌入射出成型,框體部3的表面3a與覆蓋構件19的表面可成為同一平面且無縫隙。 The frame portion 3 is made of, for example, a thermoplastic resin such as a widely used plastic or engineering plastic. The frame portion 3 serves as a surface on the side of the operation surface 11b which serves as the operation region E1 (the region where the fingertip is operated) of the sensing portion 2 to cover the step difference caused by the covering member 19 disposed on the operation surface 11b of the substrate 11. In part, the outer edge of the substrate 11 is sandwiched from the upper and lower sides (front and back) by insert molding, and the surface 3a of the frame portion 3 and the surface of the covering member 19 can be flush and seamless. .
另外,框體部3係以至少覆蓋形成於基板11的操作對向面11a側的電極部12(第1電極13、第2電極14)之拉出配線部18的拉出配線區域E2的方式進行嵌入射出成型。藉此,由於藉由框體部3直接覆蓋拉出配線部18,故即使如性能評價試驗般嚴苛的條件,也能夠保證產品的信賴性。 In addition, the frame portion 3 covers at least the lead-out wiring region E2 of the lead-out wiring portion 18 of the electrode portion 12 (the first electrode 13 and the second electrode 14) formed on the operation opposing surface 11a side of the substrate 11 Perform embedded injection molding. Thereby, since the lead wire portion 18 is directly covered by the frame portion 3, the reliability of the product can be ensured even under severe conditions as in the performance evaluation test.
而且,上述構成的觸控面板1係如第2圖(b)所示,基板11的操作對向面11a(形成有感測部2的面)例如經由透明黏接膠布等黏接層21黏接固定於顯示裝置(例如:液晶顯示裝置、EL顯示裝置等的各種顯示裝置)22。 Further, in the touch panel 1 having the above configuration, as shown in FIG. 2(b), the operation opposing surface 11a of the substrate 11 (the surface on which the sensing portion 2 is formed) is adhered, for example, via the adhesive layer 21 such as a transparent adhesive tape. It is fixed to a display device (for example, various display devices such as a liquid crystal display device and an EL display device) 22 .
藉此,以觸控面板1做為輸入裝置的一種形 態配備在顯示裝置22,可使顯示裝置22具備具有觸控面板之顯示裝置(觸控面板裝置)的功能。 Thereby, the touch panel 1 is used as a form of an input device The state is provided on the display device 22, and the display device 22 can be provided with a function of a display device (touch panel device) having a touch panel.
如以上說明,本實施形態之觸控面板1係在基板11的操作面11b上,以避開第1電極13及第2電極14的拉出配線部18的拉出配線區域E2且至少覆蓋操作區域E1的一部分的方式配置覆蓋構件19,藉由樹脂材料進行嵌入射出成型至因配置該覆蓋構件19與基板11產生的段差部分為止,而從上下包夾基板11的外緣端部而進行製作,以使覆蓋構件19的表面與框體部3的表面3a成為同一平面。 As described above, the touch panel 1 of the present embodiment is disposed on the operation surface 11b of the substrate 11 so as to avoid the pull-out wiring region E2 of the pull-out wiring portion 18 of the first electrode 13 and the second electrode 14 and to cover at least the operation. The cover member 19 is disposed in a part of the region E1, and is formed by insert molding of a resin material into a step portion where the cover member 19 and the substrate 11 are disposed, and the outer edge portion of the substrate 11 is sandwiched from the upper and lower sides. The surface of the covering member 19 and the surface 3a of the frame portion 3 are flush with each other.
藉此,由於無需設置使拉出配線部從外部無法辨識的方式予以遮蔽的裝飾部,即可遮蔽拉出配線部,所以製造成本降低,而且不需擔心像以往的裝置的黏接層造成的包夾構造因落下等較強的衝擊會使基板11從框體部3脫離之問題,可提供可靠度高的觸控面板。 In this way, since it is not necessary to provide a decorative portion that shields the drawn wiring portion from the outside, the wiring portion can be shielded from the wiring portion, so that the manufacturing cost is lowered, and there is no need to worry about the adhesion layer of the conventional device. The sandwich structure has a problem that the substrate 11 is detached from the frame portion 3 due to a strong impact such as dropping, and a touch panel having high reliability can be provided.
另外,若將覆蓋構件19的形狀設計成圓形或多角形等任意的形狀,則維持感測部之一般化的情形下,僅變更覆蓋構件19的形狀即可任意變更設計。 In addition, when the shape of the covering member 19 is designed to have an arbitrary shape such as a circular shape or a polygonal shape, when the generality of the sensing portion is maintained, the design of the covering member 19 can be arbitrarily changed.
又,框體部3係以至少覆蓋第1電極13及第2電極14的各電極之拉出配線部18的區域的方式被嵌入射出成型,由於拉出配線部18整體被樹脂覆蓋,外來的濕氣不易通過,可充分發揮防止拉出配線部18腐蝕的效果。 In addition, the frame portion 3 is inserted into the injection molding so as to cover at least the region of the lead-out wiring portion 18 of each of the electrodes of the first electrode 13 and the second electrode 14, and the entire pull-out wiring portion 18 is covered with a resin. The moisture is hard to pass, and the effect of preventing the corrosion of the wiring portion 18 can be sufficiently exerted.
此外,以往的構造為使拉出配線部18從外 部無法辨識而設置裝飾部,覆蓋構件19的外形必須擴大至裝飾部的位置,但在本發明中,以框體部3覆蓋拉出配線部18的一部分,使覆蓋構件19包夾而製造,故可以縮小覆蓋構件19的尺寸。 Further, the conventional structure is such that the pull-out wiring portion 18 is externally The decorative portion is not provided, and the outer shape of the covering member 19 must be enlarged to the position of the decorative portion. However, in the present invention, the frame portion 3 covers a part of the drawn wiring portion 18, and the covering member 19 is sandwiched and manufactured. Therefore, the size of the covering member 19 can be reduced.
尤其是覆蓋構件19為玻璃材料時,雖有一片至複數片的玻璃板要處理,但由於可使覆蓋構件19本身變小,因此可以處理的數量增加,可降低製造成本。 In particular, when the covering member 19 is made of a glass material, although one to a plurality of glass sheets are to be treated, since the covering member 19 itself can be made small, the number of processes that can be handled is increased, and the manufacturing cost can be reduced.
另外,在覆蓋構件19使用透明樹脂材料時,與框體部3抵接的部分藉由樹脂成型可容易以任意的形狀形成具有作為與框體部3之嵌合部的功能的突起19a,故藉由突起19a增加與框體部3的接合區域(接觸面積),在觸控面板1落下時,可防止覆蓋構件19從框體部3脫落。 In addition, when a transparent resin material is used for the covering member 19, the portion abutting on the frame portion 3 can be easily formed into a shape having a projection 19a having a function as a fitting portion with the frame portion 3 by resin molding. When the protrusion 19a is added to the joint region (contact area) of the frame portion 3, when the touch panel 1 is dropped, the cover member 19 can be prevented from falling off from the frame portion 3.
1‧‧‧觸控面板 1‧‧‧ touch panel
3‧‧‧框體部 3‧‧‧ Frame Department
3a‧‧‧框體部的表面 3a‧‧‧ Surface of the frame body
11‧‧‧基板 11‧‧‧Substrate
11b‧‧‧操作面 11b‧‧‧Operation surface
12‧‧‧電極部 12‧‧‧Electrode
18‧‧‧拉出配線部 18‧‧‧ Pull out the wiring department
19‧‧‧覆蓋構件 19‧‧‧ Covering components
20‧‧‧黏接層 20‧‧‧bonding layer
21‧‧‧黏接層 21‧‧‧Adhesive layer
22‧‧‧顯示裝置 22‧‧‧ display device
E1‧‧‧操作區域 E1‧‧‧Operating area
E2‧‧‧拉出配線區域 E2‧‧‧ Pull out the wiring area
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JP2015189970 | 2015-09-28 | ||
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JP2016044586A JP2017068819A (en) | 2015-09-28 | 2016-03-08 | Touch panel |
JP2016-044586 | 2016-03-08 |
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TW201721386A true TW201721386A (en) | 2017-06-16 |
TWI613576B TWI613576B (en) | 2018-02-01 |
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CN (1) | CN206532278U (en) |
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WO2019003304A1 (en) * | 2017-06-27 | 2019-01-03 | マクセル株式会社 | Projection image display system |
WO2019127163A1 (en) * | 2017-12-27 | 2019-07-04 | 深圳市柔宇科技有限公司 | Curved-surface touch-control sensing device and moulding method therefor |
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CN103974570A (en) * | 2013-01-25 | 2014-08-06 | 云辉科技股份有限公司 | Composite molded window protection structure and electronic device composed of composite molded window protection structure |
CN104635974A (en) * | 2013-11-07 | 2015-05-20 | 胜华科技股份有限公司 | Touch control device |
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TWI613576B (en) | 2018-02-01 |
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