TW201721077A - Guiding mechanism and heat dissipating device therewith - Google Patents

Abstract

A guiding mechanism includes a first guiding member and a second guiding member. The first guiding member is installed on a circuit board and includes a fixing portion, a guiding body, and a combining portion. The fixing portion is fixed on the circuit board. The guiding body is connected to the fixing portion and protrudes from the circuit board. The combining portion is connected to a side of the fixing portion opposite to the guiding body and fixed on the circuit board. The second guiding member is installed on and protrudes from a fan cage. The second guiding member cooperates with the first guiding member to guide a fan connector to align with a board connector when the fan cage moves in a direction toward the circuit board, which prevents the fan connector and the board connector from being damaged because of collision during connection.

Description

Guide mechanism and heat sink having guide mechanism

The invention relates to a guiding mechanism and a heat dissipating device having the guiding mechanism, in particular to a guiding mechanism suitable for guiding the heat dissipating module to be mounted at a fixed position and a heat dissipating device having the guiding mechanism.

With the advancement of technology, the size of electronic devices is getting smaller and smaller. However, high-power components in electronic devices generate a large amount of heat energy in a limited space when used, thereby increasing the temperature of the electronic device and reducing its efficiency. . Therefore, in general, a heat dissipation module capable of forming forced convection is generally used to forcibly discharge the generated thermal energy to the electronic device to reduce the temperature inside the electronic device housing. However, when the fan connector and the circuit board connector in the heat dissipation module are mounted on the circuit board, the terminal of the fan connector and the terminal of the circuit board connector may be collided. Fan connector bent pin issue.

The conventional heat dissipation module uses the two sides of the fan casing to cooperate with the fan bracket of the electronic device casing. When the fan casing moves relative to the electronic device casing, the guiding bracket can guide the fan casing. To the intended location. However, the guiding bracket is used to cooperate with both sides of the fan casing, so when the fan casing slides to the junction of the fan connector and the circuit board connector with the guiding brackets corresponding to the two sides thereof, the fan connector and the circuit The board connector still cannot be accurately aligned due to the displacement, so the terminal of the fan connector and the terminal of the board connector cannot be effectively prevented from being bent and deformed due to the collision.

In order to solve the above problems, the present invention provides a guiding mechanism for guiding a parallel fan connector and a circuit board connector and a heat dissipating device having the guiding mechanism to solve the above problems.

In order to achieve the above object, the present invention is directed to a guiding mechanism for guiding a heat dissipating module to be mounted in a fixed position. The guiding mechanism is disposed in a heat dissipating device having a circuit board and a circuit board connection. And a circuit board, the circuit board connector is disposed on the circuit board, and the circuit board is disposed in the chassis, the heat dissipation module includes a fan casing and a fan connector, and the fan connector is disposed on the fan casing The guiding mechanism comprises a first guiding member and a second guiding member. The first guiding member is mounted on the circuit board and includes a fixing portion, a guiding body and a joint portion. The fixing portion is fixed on the circuit board, and the guiding body is connected to the fixing portion and protrudes from the fixing portion. In the circuit board, the connecting portion is connected to a side of the fixing portion opposite to the guiding body and is fixed on the circuit board. The second guiding member is mounted on the fan housing and protrudes from the fan housing, and the second guiding member cooperates with the first guiding member during the approach of the fan housing toward the circuit board to The fan connector is directed to be aligned with the board connector.

According to another embodiment of the present invention, the guiding body is a guiding post, the second guiding member is formed with a guiding groove, and the first guiding member further comprises a guiding portion, which is formed The guide post is away from one end of the circuit board and is used to guide the guide post into the guide slot.

According to one embodiment of the present invention, the present invention further discloses that the cross-sectional area of the guiding portion is tapered in a direction away from one of the circuit boards.

According to another embodiment of the present invention, the binding portion is a locking structure protruding from a side of the circuit board opposite to the fixing portion for locking the fixing portion and the guiding body On the board.

According to another embodiment of the present invention, the circuit board connector protrudes from the circuit board, and a distance between the one end of the guiding body away from the circuit board and a surface of the circuit board is greater than the circuit board. The connector is remote from a distance between one end of the circuit board and the surface of the circuit board.

According to another embodiment of the present invention, the fan connector protrudes from the fan casing, and the second guiding member is away from a distance between one end of the fan casing and a surface of the fan casing. More than a distance between the second guide member and one end of the fan connector and the surface of the fan casing.

According to another embodiment of the present invention, the guiding mechanism further includes an outer rail member and an inner rail member. The outer rail member is disposed on the chassis, and the inner rail member is disposed on the fan casing. The inner rail member is slidably fitted to the outer rail member such that the fan casing approaches the circuit board in a first direction or the fan casing is moved away from a second direction opposite to the first direction The board.

According to another embodiment of the present invention, a heat dissipation device includes a chassis, a circuit board, a circuit board connector, a heat dissipation module, and a guiding mechanism. The circuit board is disposed in the chassis. The circuit board connector is disposed on the circuit board, and the heat dissipation module includes a fan housing and a fan connector. The fan casing is disposed in the casing so as to be movable relative to the circuit board. The fan connector is disposed on the fan casing, and the guiding mechanism includes a first guiding member and a second guiding member. The first guiding member is mounted on the circuit board and includes a fixing portion and a guiding body. The fixing portion is fixed on the circuit board, and the guiding body is connected to the fixing portion and protrudes from the circuit board. The second guiding member is mounted on the fan housing and protrudes from the fan housing, and the second guiding member cooperates with the first guiding member during the approach of the fan housing toward the circuit board to Directing the fan connector to be aligned with the circuit board connector, the guiding body being away from the one end of the circuit board and a distance between a surface of the circuit board being greater than the one end of the circuit board connector away from the circuit board and the circuit a distance between the surfaces of the board, and a distance between the one end of the second guiding member and the surface of the fan housing is greater than the fan connector is away from the fan housing and the fan a distance between the surfaces of the housing

According to another embodiment of the present invention, the guide body is a guide post, the second guide member is formed with a guide groove, and the first guide member further includes a guiding portion and a combination The guiding portion is formed at a side of the guiding column away from the circuit board for guiding the guiding post into the guiding slot, and a cross-sectional area of the guiding portion is tapered away from one direction away from the circuit board. The bonding portion is connected to a side of the fixing portion opposite to the guiding body and is fixed on the circuit board, and the bonding portion is a locking structure protruding from a side of the circuit board opposite to the fixing portion And locking the fixing portion and the guiding body to the circuit board.

According to another embodiment of the present invention, the guiding mechanism further includes an outer rail member and an inner rail member. The outer rail member is disposed on the chassis, and the inner rail member is disposed on the fan casing. The inner rail member is slidably fitted to the outer rail member such that the fan casing approaches the circuit board in a first direction or the fan casing is moved away from a second direction opposite to the first direction The board.

In summary, the present invention utilizes the first guiding member and the second guiding member of the guiding mechanism to cooperate with each other to guide the moving path of the fan housing of the heat dissipation module relative to the circuit board, thereby the fan connector Correctly located on the board connector, and thus ensure that the fan connector is docked with the board connector to prevent the terminal of the fan connector and the terminal of the board connector from being damaged by collision during the electrical conduction, greatly Improve the accuracy of mounting the fan case on the board and reduce the damage rate of the fan connector or board connector. The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention.

1 is a side view of a heat sink 3000 according to an embodiment of the present invention. The heat sink 3000 includes a chassis 6, a circuit board 1, a circuit board connector 4, a heat dissipation module 7, and a Guide mechanism 5. The heat dissipation module 7 includes a fan housing 2 and a fan connector 3, and the guiding mechanism 5 includes a first guiding member 50 and a second guiding member 51. The circuit board 1 is disposed in the chassis 6. The fan housing 2 is disposed in the chassis 6 so as to be movable relative to the circuit board 1. The chassis 6 can be a casing of the server or an outer casing of the electronic device, but is not limited thereto. . The fan connector 3 is disposed on the fan casing 2 and protrudes from the fan casing 2, and the circuit board connector 4 is disposed on the circuit board 1 and protrudes from the circuit board 1. The first guiding member 50 of the guiding mechanism 5 is mounted on the circuit board 1, and the second guiding member 51 is mounted on the fan housing 2 and protrudes from the fan housing 2.

In this embodiment, the guiding mechanism 5 can further include an outer rail member 52 and an inner rail member 53. The outer rail member 52 is disposed on the casing 6, and the inner rail member 53 is disposed on the fan casing 2, and the inner rail member is disposed. 53 is slidably fitted to the outer rail member 52 such that the fan housing 2 can be brought closer to the circuit board 1 in a first direction X or the fan housing 2 can be moved away from the second direction Y in a direction opposite to the first direction X. Circuit board 1. In other words, the inner rail member 53 and the outer rail member 52 can be used to restrict the linear movement of the fan casing 2, that is, the inner rail member 53 and the outer rail member 52 can be used to restrict the fan casing 2 in the straight line direction (ie, the first direction). X) is close to the circuit board 1, or away from the circuit board 1 in another linear direction (ie, the second direction Y).

Referring to FIG. 2, FIG. 2 is a partial view of the heat dissipating device 3000 of the embodiment of the present invention when the fan connector 3 and the circuit board connector 4 are not yet connected and the first guiding member 50 and the second guiding member 51 are not yet connected. Zoom in on the schematic. The first guiding member 50 includes a fixing portion 501 , a guiding body 502 , a guiding portion 503 and a joint portion 504 . The fixing portion 501 is fixed on the circuit board 1 , and the guiding body 502 is connected to the fixing portion 501 and protrudes from the circuit board 1 . In this embodiment, the guiding body 502 can be a guiding post, and the guiding portion 503 is formed on the guiding post (ie, the guiding body 502) away from one end of the circuit board 1, that is, the guiding portion 503 can be located at the guiding end. The body 502 is adjacent to one end of the fan housing 2. In this embodiment, the guiding portion 503 can be a lead-angle structure, and a cross-sectional area of the guiding structure (ie, the guiding portion 503) is gradually separated from one direction away from the circuit board (ie, the second direction Y). Shrink. The joint portion 504 is connected to the fixed portion 501 opposite to the side of the guide body 502 and is fixed on the circuit board 1 , that is, the joint portion 504 is located on the lower side of the circuit board 1 , whereby the joint portion 504 can abut against the chassis 6 . Furthermore, it is coupled to a ground potential.

A guide groove 511 is formed on the second guiding member 51, and the cross-sectional area of the guiding portion 503 is inserted into the guiding groove 511 of the second guiding member 51 along the first guiding member 50 (ie, the guiding post). The upper portion is tapered and the slot area of one of the guide slots 511 is larger than any one of the cross-sectional areas of the guiding portion 503, so that the guiding portion 503 can be used to guide the first guiding member 50 into the guiding slot 511, that is, when When a guiding member 50 and the second guiding member 51 are slightly misaligned with each other, the guiding portion 503 can be used to guide the guiding body 502 into the guiding slot 511 to align the guiding body 502 with the guiding slot 511. The first guiding member 50 on the circuit board 1 is disposed at one of the second guiding members 51 corresponding to the fan housing 2, and the circuit board connector 4 on the circuit board 1 is disposed corresponding to the fan housing 2 One of the fan connectors 3 on the top.

Referring to FIG. 2 to FIG. 4 , FIG. 3 is a schematic diagram of the heat dissipation device 3000 of the embodiment of the present invention. When the fan connector 3 and the circuit board connector 4 are not yet connected and the first guiding member 50 is docked with the second guiding member 51 , FIG. 4 is a partially enlarged schematic view showing the heat dissipating device 3000 of the embodiment of the present invention when the fan connector 3 is mated with the circuit board connector 4 and the first guiding member 50 is docked with the second guiding member 51. When the fan casing 2 is to be mounted on the circuit board 1, the fan casing 2 can be slid in the first direction X by the inner rail member 53 and the outer rail member 52 to approach the circuit board 1. At this time, the first guiding member The guiding portion 503 of the guide 50 can guide the guiding body 502 into the guiding slot 511 of the second guiding member 51 to ensure that the fan housing 2 can continuously slide in the first direction X and the fan connector 3 is accurately positioned. Board connector 4. In this way, the first guiding member 50 and the second guiding member 51 can ensure that the fan connector 3 does not collide with the circuit board connector 4 during the process of the fan casing 2 approaching the circuit board 1 in the first direction X. To avoid damage to the fan connector 3 or the board connector 4.

As shown in FIG. 2, the distance L1 between the one end 5020 of the guiding body 502 away from the circuit board 1 and one surface 10 of the circuit board 1 is greater than the surface of the circuit board connector 4 away from the one end 40 of the circuit board 1 and the surface 10 of the circuit board 1. The distance L4 between the second guiding member 51 and the one end 512 of the fan housing 2 and the surface 20 of the fan housing 2 is greater than the fan connector 3 away from the fan housing 2 at one end 30 and the fan housing. The distance L3 between the surfaces 20 of the second surface, whereby the contact of the first guiding member 50 with the second guiding member 51 precedes the fan connector 3 and the circuit board during the process of the fan casing 2 approaching the circuit board 1. Contact of the connector 4. In other words, the distance L1 between the end 5020 of the guiding body 502 and the surface 10 of the circuit board 1 is greater than the distance L4 between the end 40 of the circuit board connector 4 and the surface 10 of the circuit board 1 and the second guiding member. The structural design of the distance L2 between the end 512 of the 51 and the surface 20 of the fan casing 2 is greater than the distance L3 between the end 30 of the fan connector 3 and the surface 20 of the fan casing 2, such that the first guiding member 50 The guiding body 502 and the guiding groove 511 of the second guiding member 51 firstly cooperate to ensure the moving path of the fan casing 2 relative to the circuit board 1. Thereby, the fan connector 3 can be correctly positioned on the circuit board connector 4 to ensure that the fan connector 3 is docked to the circuit board connector 4 and the terminals of the fan connector 3 and the terminals of the circuit board connector 4 are electrically It is not damaged by collision during the conduction process. That is, the present invention can prevent the terminal of the fan connector 3 and the terminal of the circuit board connector 4 from being misaligned during the plugging process by the pre-positioning of the first guiding member 50 and the second guiding member 51. collision.

In addition, the joint portion 504 is connected to one side of the fixing portion 501 opposite to the guiding body 502 and is fixed on the circuit board 1 , that is, the joint portion 504 and the fixing portion 501 are respectively connected to each other on opposite sides of the circuit board 1 . As shown in FIG. 2 , the joint portion 504 is a locking structure disposed on a side of the circuit board 1 opposite to the guiding body 502 for locking the fixing portion 501 and the guiding body 502 to the circuit board 1 . The joint portion 504 can also be used for grounding. In this embodiment, the fixing portion 501 has a hole in the center and a groove in the guiding body 502 to provide the bonding portion 504 to be coupled to each other and fixed to the circuit board 1.

The guiding body 502 of the present invention is away from the distance L20 between the end 5020 of the circuit board 1 and the surface 10 of the circuit board 1. The second guiding member 51 is away from the end 512 of the fan casing 2 and the surface 20 of the fan casing 2. The distance L2, the distance L3 between the end 30 of the fan connector 2 away from the fan casing 2 and the surface 20 of the fan casing 2, and the surface of the circuit board connector 4 away from the circuit board 1 and the surface of the circuit board 1 The relationship of the distance L4 of 10 may not be limited to that shown in this embodiment.

For example, referring to FIG. 5 to FIG. 7 , FIG. 5 is a schematic diagram of a heat dissipating device 3000 ′ of a fan connector 3 ′ and a circuit board connector 4 ′ FIG. 6 is a partially enlarged view of the heat sink 3000' of the heat sink 3000' of the guide member 50' and the second guide member 51'. Partially enlarged schematic view of the butt joint and the first guiding member 50 ′ and the second guiding member 51 ′, FIG. 7 is a heat dissipating device 3000 ′ of the fan connector 3 ′ and the circuit board connector 4 according to another embodiment of the present invention. A partial enlarged view of the docking and the first guiding member 50' is docked with the second guiding member 51'. As shown in FIGS. 5-7, unlike the above embodiment, one of the first guiding members 50' guides the body 502' away from the one end 5020' of the circuit board 1 and the surface 10 of the circuit board 1. The distance L1' is greater than the distance L4' between the board connector 4' away from the one end 40' of the circuit board 1 and the surface 10 of the circuit board 1, and the second guiding member 51' is away from the fan housing 2 at one end 512' and the fan case The distance L2' between the surfaces 20 of the body 2 is smaller than the distance L3' between the fan connector 3' away from the one end 30' of the fan casing 2 and the surface 20 of the fan casing 2, and the guiding body 502' is away from the circuit board 1. The sum of the distance L1' between the end 5020' and the surface 10 of the circuit board 1 and the distance L2' between the end 512' of the second guiding member 51' away from the fan casing 2 and the surface 20 of the fan casing 2 is greater than The fan connector 3' is away from the distance L3' between the end 30' of the fan casing 2 and the surface 20 of the fan casing 2 and the surface of the circuit board connector 4' away from the end 40' of the circuit board 1 and the surface of the circuit board 1. The sum of the distances L4' of 10, whereby the first guiding member 50' and the second guiding member 51' are in the process of the fan casing 2 approaching the circuit board 1. The contact will still precede the contact of the fan connector 3' with the board connector 4' (as shown in Figure 6).

In other words, the distance L1' between the end 5020' of the guiding body 502' and the surface 10 of the circuit board 1 and the end 512' of the second guiding member 51' and the surface 20 of the fan casing 2 The sum of the distances L2' is greater than the distance L3' between the end 30' of the fan connector 3' and the surface 20 of the fan casing 2 and the end 40' of the circuit board connector 4' and the surface 10 of the circuit board 1. The total distance of the distance L4', the guiding body 502' of the first guiding member 50' and the guiding groove 511' of the second guiding member 51' will also cooperate with each other, thereby ensuring that the fan housing 2 is opposite to the fan housing 2 The path of movement of the board 1. Thereby, the fan connector 3' can be correctly positioned on the board connector 4' to ensure that the fan connector 3' is docked to the board connector 4' and the terminal of the fan connector 3' and the board connector 4 The terminal of the 'the terminal is not damaged by the collision during the electrical conduction, so the distance L1' between the end 5020' of the guiding body 502' and the surface 10 of the circuit board 1 and the second guiding member 51' The distance L2' between the end 512' and the surface 20 of the fan casing 2, the distance L3' between the end 30' of the fan connector 3' and the surface 20 of the fan casing 2, and the circuit board connector 4' The relationship between the end 40' and the distance L4' between the surface 10 of the circuit board 1 is not limited to the embodiment of the present invention, as long as the first guiding member 50' is in contact with the second guiding member 51'. Prior to the contact of the fan connector 3' with the board connector 4', it is within the scope of the present invention. In addition, the components of the embodiment having the same reference numerals as in the above embodiments have the same structural design and function principle, and are not described herein for the sake of brevity. Compared with the prior art, the present invention utilizes the first guiding member and the second guiding member of the guiding mechanism to cooperate with each other to guide the moving path of the fan housing of the heat dissipation module relative to the circuit board, whereby the fan connector is used. It can be correctly placed on the board connector, and thus ensure that the fan connector and the board connector are docked to prevent the terminal of the fan connector and the terminal of the board connector from being damaged by collision during the electrical conduction. Improve the accuracy of mounting the fan case on the board and reduce the damage rate of the fan connector or board connector. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

3000, 3000'‧‧‧ heat sink
1‧‧‧ boards
10‧‧‧ surface
2‧‧‧Fan housing
20‧‧‧ surface
3, 3'‧‧‧Fan Connector
30, 30'‧‧‧
4, 4'‧‧‧ Board Connector
40, 40'‧‧‧
5‧‧‧Guiding agency
50, 50'‧‧‧ first guide
501‧‧‧ Fixed Department
502, 502'‧‧‧ guidance ontology
5020, 5020'‧‧‧
503‧‧‧Guide
504‧‧‧Combination Department
51, 51 '‧‧‧ second guide
511, 511 '‧‧ ‧ guide slots
512, 512'‧‧‧
52‧‧‧ outer rail parts
53‧‧‧ inner rail parts
6‧‧‧Chassis
7‧‧‧ Thermal Module
L1, L2, L3, L4, L1', L2', L3', L4'‧‧‧ distance
X‧‧‧ first direction
Y‧‧‧second direction

FIG. 1 is a side view of a heat sink according to an embodiment of the present invention. FIG. 2 is a partially enlarged schematic view showing the heat dissipating device of the embodiment of the present invention when the fan connector and the circuit board connector are not yet connected, and the first guiding member and the second guiding member are not yet connected. FIG. 3 is a partially enlarged schematic view showing the heat dissipating device of the embodiment of the present invention when the fan connector and the circuit board connector are not yet connected, and the first guiding member and the second guiding member are butted. FIG. 4 is a partially enlarged schematic view showing the heat dissipating device of the embodiment of the present invention when the fan connector is mated with the circuit board connector and the first guiding member and the second guiding member are butted. FIG. 5 is a partially enlarged schematic view showing a heat dissipating device according to another embodiment of the present invention, when the fan connector and the circuit board connector are not yet connected, and the first guiding member and the second guiding member are not yet connected. FIG. 6 is a partially enlarged schematic view showing the heat dissipating device of the embodiment of the present invention when the fan connector and the circuit board connector are not yet connected and the first guiding member and the second guiding member are butted. FIG. 7 is a partially enlarged schematic view showing the heat dissipating device of the embodiment of the present invention when the fan connector is mated with the circuit board connector and the first guiding member and the second guiding member are butted.

3000‧‧‧heat sink

1‧‧‧ boards

2‧‧‧Fan housing

3‧‧‧Fan Connector

4‧‧‧Board Connector

5‧‧‧Guiding agency

50‧‧‧First guide

51‧‧‧Second guide

52‧‧‧ outer rail parts

53‧‧‧ inner rail parts

6‧‧‧Chassis

7‧‧‧ Thermal Module

X‧‧‧ first direction

Y‧‧‧second direction

Claims (10)

The guiding mechanism is configured to guide a heat dissipating module to be installed in a fixed position, the guiding mechanism is disposed in a heat dissipating device, the heat dissipating device has a circuit board, a circuit board connector and a chassis, The circuit board connector is disposed on the circuit board and the circuit board is disposed in the chassis. The heat dissipation module includes a fan housing and a fan connector. The fan connector is disposed on the fan housing. The mechanism comprises: a first guiding member mounted on the circuit board, the first guiding member comprises: a fixing portion fixed on the circuit board; a guiding body connected to the fixing And protruding from the circuit board; and a joint portion connected to the fixing portion opposite to the side of the guiding body and fixed on the circuit board; and a second guiding member mounted to the fan And surrounding the fan casing, the second guiding member cooperates with the first guiding member during the approach of the fan casing toward the circuit board to guide the fan connector to be aligned with the circuit Board connector. The guiding mechanism of claim 1, wherein the guiding body is a guiding post, the second guiding member is formed with a guiding groove, and the first guiding member further comprises: a guiding portion Formed on the guide post away from one end of the circuit board and used to guide the guide post into the guide slot. The guiding mechanism of claim 2, wherein a cross-sectional area of the guiding portion is tapered in a direction away from one of the circuit boards. The guiding mechanism of claim 1, wherein the engaging portion is a locking structure protruding from a side of the circuit board opposite to the fixing portion for locking the fixing portion and the guiding body to On the board. The guiding mechanism of claim 1, wherein the circuit board connector protrudes from the circuit board, and a distance between the one end of the guiding body away from the circuit board and a surface of the circuit board is greater than the circuit board connection The device is remote from a distance between one end of the circuit board and the surface of the circuit board. The guiding mechanism of claim 1, wherein the fan connector protrudes from the fan casing, and a distance between the one end of the second guiding member away from the fan casing and a surface of the fan casing is greater than The fan connector is remote from a distance between one end of the fan housing and the surface of the fan housing. The guiding mechanism of claim 1, further comprising: an outer rail member disposed on the chassis; and an inner rail member disposed on the fan housing, the inner rail member being slidably coupled to The outer rail member is such that the fan housing approaches the circuit board in a first direction or the fan housing is remote from the circuit board in a second direction opposite to the first direction. A heat sink comprising: a chassis; a circuit board disposed in the chassis; a circuit board connector disposed on the circuit board; a heat dissipation module comprising: a fan housing And being disposed in the chassis; the fan connector is disposed on the fan housing; and a guiding mechanism includes: a first guiding member mounted on the circuit board The first guiding member comprises: a fixing portion fixed on the circuit board; and a guiding body connected to the fixing portion and protruding from the circuit board; and a second guiding member Mounted on the fan casing and protruding from the fan casing, the second guiding member cooperates with the first guiding member during the approach of the fan casing toward the circuit board to guide the fan The connector is aligned with the circuit board connector; wherein a distance between the one end of the guiding body away from the circuit board and a surface of the circuit board is greater than the one end of the circuit board connector away from the circuit board and the circuit board a distance between the surfaces, and The second guide member away from the side of the fan housing with a distance between the one surface of the fan housing is greater than the fan away from the connector a distance between the surface of the one end of the fan case of the fan housing. The heat dissipation device of claim 8, wherein the guiding body is a guiding post, the second guiding member is formed with a guiding groove, and the first guiding member further comprises: a guiding portion, which is formed The guide post is away from one end of the circuit board and is used to guide the guide post into the guide slot, a cross-sectional area of the guide portion is tapered along a direction away from one of the circuit boards; and a joint portion is connected The fixing portion is opposite to the side of the guiding body and is fixed on the circuit board, and the bonding portion is a locking structure protruding from a side of the circuit board opposite to the fixing portion for The fixing portion and the guiding body are locked on the circuit board. The heat dissipation device of claim 8, wherein the guiding mechanism further comprises: an outer rail member disposed on the chassis; and an inner rail member disposed on the fan housing, the inner rail member Slidingly engaging the outer rail member such that the fan housing approaches the circuit board in a first direction or the fan housing is remote from the circuit board in a second direction opposite to the first direction.