TW201709013A - Computing device using bypass assembly - Google Patents

Abstract

A computing device includes a first connector near a first wall. The first connector is in communication with a chip package positioned apart for the first wall via a first cable. The chip package includes a chip supported by a support layer. The chip can be supported by a substrate and/or a circuit board. A second connector can be positioned near a second wall and can also be in communication with the chip package via a second cable. If desired, the substrate or circuit board can include a signal board connector that is configured to engage board connectors terminated to ends of the first and second cables.

Description

Computing device

The present invention relates to the field of high frequency signal transmission, and more particularly to a computing system positioned in a base.

Computing devices (such as routers, servers, switches, etc.) need to operate at high data transfer speeds to meet the increasing demand for bandwidth and streaming audio and video delivery in many end-user devices. . These devices include a base that supports a circuit board that in turn supports various circuits and that uses a master chip component (such as an application specific integrated circuit (ASIC)) mounted on the circuit board. A signal transmission line extending between a field programmable gate array (FPGA), a digital signal processor (DSP), and the like, and a connector mounted on the circuit board. These transmission lines are formed with conductive traces on the board or within the board and extend between the main wafer element and an external connector or circuit of the device.

As can be appreciated, integrated circuits (often referred to as wafers) are the heart of these electronic devices. These wafers typically include a processor having a die that is connectable to a substrate (package of the substrate) through conductive solder bumps. The package may include micro-vias or plated vias that extend through the substrate to the solder balls. These solder balls may include a ball grid array that is mounted to the circuit board through a ball grid array. The circuit board includes a plurality of traces designated to define a transmission line including a ground signal for differential signal pairs, associated with differential signal pairs, and various low speeds for power, clock, and other functions. Transmission line. These traces are routed from the ASIC to the device's I/O connector (external connector is connected to the I/O connector) and other traces are routed from the ASIC to the backplane connector (backplane connector) Allowing the device to be connected to an overall system (such as a network server, etc.) or other traces still arranged to be arranged from the ASIC to the electronic components and circuits on the motherboard or another circuit board of the device .

A typical circuit board is typically formed from an inexpensive material such as the well-known inexpensive FR4. Although FR4 is inexpensive, it is well known that FR4 will cause losses in high speed signal transmission lines that transmit data at rates of about 6 Gbps and higher (e.g., at signal transmission frequencies above 3 GHz). These losses increase with increasing frequency, and thus FR4 materials are unsatisfactory for high speed data transmission applications at signal transmission frequencies of about 10 GHz and above. In order to use FR4 as a board material for high frequency signal transmission lines, designers may have to employ amplifiers and equalizers, which increases the final cost of the device.

The overall length of the signal transmission line in the FR4 board can exceed threshold lengths (about 10 inches) and can include bends and turns that can create signal reflection and noise problems as well as additional losses. As mentioned above, losses can sometimes be corrected by using amplifiers, repeaters, and equalizers, but these components also add to the final cost of manufacturing the board and further complicate the layout of the board. Additionally, the arrangement of the signal transmission lines in the board may require multiple turns and/or transitions. These turns and transitions occurring at the termination points along the signal transmission line tend to reduce the signal to noise ratio. In addition, transitions and terminations tend to create impedance discontinuities, and impedance discontinuities cause reflections in the signal, which makes it difficult to overcome the signal to noise issue simply by increasing the power of the transmission. As a result, as data rates increase, the use of a circuit board (especially when using FR4) has become increasingly difficult to transmit signals over an excessive distance even with more expensive materials. As a result, some people will appreciate further improvements.

A bypass cable assembly is used to provide a high speed data transmission line extending between a chip or chip set of a device and a backplane or circuit board. The bypass cable assembly includes a cable containing a signal transmission line that avoids or circumvents the use of a supported circuit board regardless of the material of the structure.

In such an application, an integrated circuit in the form of a wafer, such as an application specific integrated circuit (ASIC) or field programmable gate array (FPGA), is provided as part of an overall chip package. The wafer can be mounted on a package substrate through a conventional solder bump or the like and can be enclosed in the substrate through an encapsulating material and integrated with the substrate, and the sealing material overlies the wafer. And a portion of the substrate. The package substrate can include traces or leads extending from the solder bumps on the bottom of the wafer to one end regions on the substrate. The substrate may also support a connector or contact pad or may alternatively be mounted on a circuit board that includes a contact pad that connects a communication point on the substrate to the circuit board. A first connector can then be mounted on the circuit board for interfacing with a cable assembly. The first connector can interface with a second connector if desired. The cable terminated to the first connector or the second connector extends to an external interface, such as an I/O connector and a backplane connector.

The wafer package may include a plurality of contacts in the form of solder bumps disposed on a lower side of the wafer package for providing slave logic circuits, clock circuits, power supply circuits, and low speed signal circuits as well as high speed signals The connection between the circuit to the traces on the motherboard of a device that uses a chip package. If the substrate directly supports a connection interface, the contacts associated with the high speed signal circuit of the wafer are removed from the bottom of the wafer package because the high speed traces are no longer arranged at the bottom of the wafer package. However, if the substrate is mounted on a circuit board, the high speed traces can be arranged on the board and extended a short distance to a suitable connector.

Cables for such assemblies can be designed for differential signaling and preferably biaxial cables that are encased in pairs of signal conductors within the dielectric cladding. To form two wires or a pair of signal wires. The first ends of the pair of wires are typically terminated to respective wafer packages and the second ends of the pairs of wires are directly terminated to the inlet or outlet connectors (such as I/O connectors and backplane connectors) Terminal.

The computing device of the present invention includes a housing having a first wall, a chip package including a wafer electrically coupled to a first signal board connector, and a first connector supported adjacent the first wall, The first connector includes a housing having a pair of interfaces and a base, the base supporting a first pair of terminals, each of the terminals of the first pair of terminals each having a contact portion in the docking interface a first cable having a pair of conductors, the cable comprising a first end and a second end, the first end of the cable being connected to the first pair of terminals; a first board connection The first board connector is terminated to the second end of the first cable and configured to interface with the first signal board connector; and an electronic component circuit that provides power to the wafer.

In some implementations, the wafer is supported by a signal board and the first signal board connector is mounted on the signal board.

In some implementations, the housing includes a second wall, the computing device includes a second connector supported adjacent the second wall, and the second connector is terminated to a second cable The first cable has a second end terminated by a second end of the second board connector, wherein the signal board supports a second signal board connector, and the second signal board is connected The device is electrically coupled to the wafer, and the second board connector is configured to interface with the second signal board connector.

In some implementations, the wafer package includes a substrate that supports the wafer.

In some implementations, the substrate is supported by a signal board that does not extend to the first connector.

In some implementations, the first connector is supported by a tray.

In some implementations, the wafer is electrically coupled to a plurality of signal board connectors, and the plurality of signal board connectors are each docked to a different first connector via a respective one of the board connectors.

The detailed description below describes exemplary embodiments and is not intended to be limited to such specifically disclosed combinations. Thus, the features disclosed herein may be combined together to form additional combinations that are not given for the purpose of the invention. Thus, reference to a feature or aspect is intended to illustrate a feature or aspect of an embodiment, and does not imply that each embodiment must have the features or aspects illustrated. In addition, it should be noted that the specification lists a number of features. Although certain features have been combined to illustrate possible system designs, those features are also applicable to other combinations that are not explicitly disclosed. Therefore, the combinations illustrated are not intended to be limiting unless otherwise stated.

In the embodiments illustrated in the figures, the directional representations (such as up, down, left, right, front and back) used to explain the structure and motion of the various components of the present invention are not absolute but relative. These representations are appropriate when the components are in the position shown in the figures. However, if the description of the location of the component changes, then these representations will change accordingly.

As can be appreciated, the following description relates to signal transmission. Depending on the data rate, those skilled in the art often refer to signals at low or high speeds (low data rates are referred to as low speed signals and high data rates are referred to as high speed signals). Although these terms are not technically the most accurate way to refer to these things, in order to be consistent with typical usage, low speed/high speed conventions are also used herein.

The embodiments described herein are suitable for use with high speed data signal transmission line systems that support high data rates from wafers or processors and the like to backplanes, motherboards or other boards with low loss. An assembly is disclosed that connects a device's chip package to an inlet connector (an inlet connector can be used to provide signals into or out of the device) without the need to significantly use traces on a circuit board, thereby reducing losses . If desired, an improved connector for use as an inlet connector is not connected to traces on the board but can be directly connected to a cable or wire to define the wafer and processor directly from the connector to the host device. Signal transmission line. Such a structure is helpful for considering high speed data applications (above 10 Gbps), and if NRZ coding is employed, the above would typically be beneficially used in systems operating above 15 Gbps. Since the receptacle connector can be entirely contained within the connector structure and does not need to be directly connected to a circuit board, the bottom wall of the cage can be continuous within the range of its fully sealed bottom of the housing, and thereby Can improve the EMI performance of the connector. The connector is also removed using a press-fit pin. The pair of connecting elements in the form of sheets are arranged to fit into an opening in the rear of the receptacle connector. A primary ground plane is disposed between the two connecting elements to prevent signal interference (such as crosstalk) between the signal terminals of the two connecting elements. Accordingly, the plurality of connectors can each be independently mounted to a panel or a wall of the main device, or even interconnected with other connectors to form an integral body of a plurality of connectors suitable for vertical or horizontal stacking. Components. In addition, if desired, the connector can be positioned within the host device as a connector that can be supported on a circuit board, supported on a standoff or other support, or stand alone. This configuration defines the connector as having a high speed connector that forms a signal transmission line for high speed data applications of 10 Gbps or more that bypasses circuit traces on the circuit board of the master device .

Devices using the above connectors have very high data rates (10 Gbps and often 20 Gbps+) and often, connectors are used in conjunction with active cable assemblies, which tend to generate significant heat during data transmission. The connector can also include a heat sink assembly that extends into an interior of the housing and that is configured to contact a docking module that is inserted into the housing. The housing includes a plurality of walls that together define the interior in which a receptacle connector is received. Since the housings are often mounted along a panel of the main device, a heat sink assembly is configured to include: a heat transfer portion in contact with the docking module inserted into the housing; and a heat sink portion, The heat transfer portion is connected, which is also shown spaced apart from the heat transfer portion in a horizontal direction. In this manner, the heat sink advantageously extends behind the shielded housing and will include a plurality of fins facing downward. It is assumed that the air flow configuration can be correspondingly provided, which utilizes the open space behind the housing and can provide a reduction in the overall height of the main equipment.

In an embodiment, the termination of the at least one set of connectors is configured as a second end of the pair of wires to emulate a manner and spacing of the ordered geometry of the cable, thereby Crosstalk and other harmful factors are kept to a minimum at the connector location. In this configuration, all of the connector terminals have the same length. The free ends of the pair of signal terminals are arranged at a desired interval and include associated grounding members such that the grounding members associated with the respective pairs of wires can be terminated to respective grounding bodies of the connector to define the entire cable The length and an associated ground that extends over the connector. A ground plane through which the signal terminals can be coupled in a common mode by a common mode coupling can provide shielding and reduce crosstalk. The termination of the cable conductors and the connectors can be carried out in such a way that a specific desired geometry of the signal conductors and ground conductors of the cable is maintained through the cable as much as possible The termination area is up to the connector.

A single wafer package can be configured to include an integrated circuit mounted to a substrate. The substrate has a termination end region of the first end termination of the plurality of twinaxial cables. The length of the cable can vary and the length will be long enough for some cables to be easily and reliably terminated to a first external interface in the form of a single or multiple I/O connectors (which is an inlet connector) And a portion of an external connector of either or both of the outlet connectors). These connectors may preferably be mounted to one side of the main device in a manner that allows an external connector, such as a plug connector or a pluggable module, to interface with it. The assembly may have a cable extending between an inlet connector of the device and a wafer package formed as an integral component, or the assembly may also be included in a wafer package and an outlet connector of the device Additional cables extending between. The first end of the bypass cable can be configured as a connector that can be inserted into the first end of the chip package to have a "plug and play" capability. In this manner, the external connector can be inserted into the master device as a single component or as a group of components (each component containing one or more signal transmission channels). The chip package can be supported within the housing of the device either alone or through standoffs or other similar attachments for a low cost, low speed motherboard.

Removing the signal transmission line from the wafer to the external connector of the motherboard in this manner releases the space on the motherboard, which space can accommodate additional functional components to provide additional equipment for the device The value and functionality while maintaining a low cost compared to devices that use motherboards for signal transmission lines. Moreover, incorporating the signal transmission line into the cable of the bypass assembly reduces the amount of power required to transmit high speed signals from the chip package to the external connector, thereby increasing the "green" value of the bypass assembly And reduce the operating costs of equipment using such a bypass assembly.

The cable extending between the connector and the chip package is preferably a "two-axis" type enclosed within a dielectric body in which two wires are disposed in each cable as a pair of signal conductors extending in the longitudinal direction of the wire. The pair of wires are preferably terminated at the proximal end of the cable to the socket connector and directly terminated at the distal end of the cable to the wafer package. The receptacle connector is preferably included in a connection structure (such as a housing, adapter frame, etc.) and mates with the attachment structure to define a shielded housing that is configured to receive an external connector (such as a Pluggable module). The second end of the cable conductor is directly terminated to the terminal of the receptacle connector and the grounding member, and the cable is preferably retained in the sheet-like support member to define a terminal strip on opposite sides of the card slot of the receptacle connector . A cable exits the connecting structure through a rear wall of the connecting structure.

Referring to the drawings, Figure 1 is a perspective view of a computing device 50 (such as a switch, router, server, etc.) with the top cover of the primary device removed. Computing device 50 is managed by one or more processors or integrated circuits in the form of wafers 52 (which may be one or more discrete wafers packaged together), which may be part of a total wafer package 54. Apparatus 50 has a pair of side walls 55, a first wall 56, and a second wall 57. A plurality of connectors 80 (which may be in the form of input/output or I/O connectors) are disposed on the first wall 56 of the primary device (which may be the front wall) such that opposing docking connections in the form of pluggable modules or the like The device can be plugged in to connect to the circuitry of device 50. The backplane connector 30 can be disposed on the second wall 57 (which can be a rear wall) for connecting the device 50 to a larger device (such as a server or the like, including a backplane for such a device) ). Apparatus 50 includes a power source 58 and a refrigeration assembly 59 and a motherboard 62 having various electronic components (such as capacitors, switches, smaller wafers, etc.) thereon.

3A is a cross-sectional view of a prior art conventional wafer package and motherboard assembly for a conventional device. Wafer 52 can be an ASIC or any other type of processor or integrated circuit (such as an FPGA) and can be one or more discrete integrated circuits that are positioned together. Accordingly, the term wafer will be used herein as a generic term for any suitable integrated circuit. As shown in FIG. 3A, wafer 52 has contacts in the form of solder bumps 45 on its underside that connect wafers 52 to associated contact pads of a supported substrate 47. Substrate 47 typically includes plated through vias, microvias or traces 48 that extend through the body of substrate 47 to the underside of the body of substrate 47. These elements 48 are connected to contacts 49 which are disposed on the underside 47a of the substrate 47, and these contacts 49 may typically take the form of a BGA, PGA or LGA or the like. The wafer 52, the solder bumps 45, the substrate 47, and the contacts 49 cooperate to define a wafer package 52-1. The chip package 52-1 is butted to a motherboard 52-2 through a socket (not shown) made of FR4 material and used for a device. The motherboard 62 has a plurality of long conductive traces 52a-c that extend from the chip package contacts 49 through the motherboard to other connectors, components, etc. of the device. For example, a pair of conductive traces 52a, 52b are required to define a differential signal transmission line, and a third conductive trace 52c provides an associated ground that follows the path of the signal transmission line. Each of such signal transmission lines is arranged through the motherboard or on the motherboard and this arrangement has certain disadvantages.

The FR4 board material loss is increasing and above 10Ghz, which is starting to become a problem. Additionally, these signal transmission line traces 52a-c typically require steering, bending, and intersection to route the transmission lines from the chip package contacts 49 to connectors or other components mounted on the motherboard 52-2. These changes in direction of traces 52a-c can create signal reflection and noise problems as well as additional losses. Losses can sometimes be corrected by using amplifiers, repeaters, and equalizers, but these components also add to the final cost of manufacturing circuit board 52-2. This complicates the layout of board 52-2 because additional board space will be required to accommodate these amplifiers and repeaters and this additional board space is not available under the intended size of the device. Custom materials for circuit boards that reduce this loss are available, but the price of these materials dramatically increases the cost of the boards and the cost of the electronic equipment from which they are used. Still, long circuit traces require increased power to drive high speed signals flowing through the circuit traces, and as such, they prevent designers from attempting to develop "green" (energy saving) devices.

FIG. 3B is a cross-sectional view of a wafer package 54 that can be used in the apparatus 50 of FIG. 1. The wafer 52 includes a high speed circuit, a low speed circuit, a clock circuit, a logic circuit, a power supply circuit, and other circuits connected to the substrate 53 of the chip package. The trace 54-1 of the wafer package 54 leads to an associated contact pad 54-2, which is disposed within the termination region 54-3, and the termination region 54-3 is preferably disposed at or near the edge of the substrate 53. Section 54-4. The wafer package 54 can also include an encapsulant (such as epoxy) 54-5 that secures the wafer 52 within the package 54 to integrate with the associated cable connector and its components. Component. As shown, the chip package 54 is partially connected to the motherboard through solder bumps 49, but such a connection means need not include a high speed signal transmission line located directly on the motherboard 62. However, as explained later with respect to Figures 22-29A, if the high speed transmission line is traveling over a short distance, the supported circuit board can include a high speed transmission line; for example, the traces 52a-c are just outside of the substrate 47. The connector is quickly terminated to a connector disposed on the circuit board 62.

If the cable is to be directly terminated to the substrate, the cable 60 can be terminated to the package contact pad 54-2 through a suitable wire-to-board connector or the like, and these cables 60 preferably have a dielectric cover 61. The biaxial structure of the two signal conductors 61 surrounded by -1. Cable 60 can also include an associated drain wire 61-2, an outer shield 61-3, and a final outer insulation skin 61-4. The use of one or more drain wires is optional as this is an outer shield (which may be in the form of a conductive wrap, braided shield, etc.). In some cases, the two conductors can be wrapped in a single dielectric cladding. The spacing and orientation of the two wires constituting each such pair of wires can be easily controlled in such a manner that the cables are separated from and separated from the board and can be in a wafer, wafer set, A transmission line extending between the electronic component and a connector location on the circuit board or between two locations on the circuit board. In some embodiments, the ordered geometry of the cable as a signal transmission member makes it easy to maintain a signal transmission line with acceptable loss and noise compared to the difficulties encountered with the signal transmission line of the board. .

As noted above, the cable 60 and its signal conductor pair define a high speed signal transmission line that leads from the wafer package 54 to the first (inlet) connector 80 or the second (outlet) connector 30. The ordered geometry of the cable remains at a predetermined interval as a pair of signal conductors to control the impedance across the cable. The use of cables as signal transmission lines eliminates the need to lay high speed signal transmission lines in the form of traces on the motherboard, thereby avoiding the high cost of foreign board materials and the losses associated with less expensive board materials such as FR4.

As shown in Figures 2 through 2C, the cable 60 has opposite first and second ends 163, 164 that are coupled to the chip package 54 and the I/O connector 80 (which may be the first connector) or the back, respectively. A board connector 30 (which may be a second connector) to define a high speed signal transmission line that bypasses the motherboard. The cable 60 maintains the ordered geometry of the signal conductor over the entire length of the signal conductor's traverse to and from the wafer via the external interface. The ordered geometry of multiple cables allows multiple cables to be diverted, bent or crossed in their path without introducing signal reflections or impedances in the transmission line that can cause problems in the signal transmission lines of the board. continuous. The cable 60 is arranged in a first set of cables and a second set of cables, wherein the first set of cables extends between the connector 80 and the wafer package 54, and the second set of cables are behind the wafer package 54 and the device The connectors 30 on the wall 57 extend between each other. The manner in which the signal conductors of cable 60 can be terminated to the wafer substrate can vary. As shown in FIG. 2C, the cable 60 can be terminated by a wire-to-board connector 66 that can interface with contacts on the chip package substrate 54 (which are removed for purposes of illustration). Connector 66 can also interface with a connector mounted on a surface of a circuit board (as shown in Figures 22-28). The heat sink 71 can be mounted to the surface of the wafer 52 as shown for heat dissipation, or can be integrated into the assembly through a sealing body. It should be noted that further details of possible configurations will be disclosed later for the embodiments shown in Figures 22-28.

The wafer, substrate, heat sink, and cable connector 66 can be held together by a seal or through other support structures as a single component, as shown in Figures 2 through 2C. This configuration allows a device designer to take full advantage of the space available on the motherboard 62 for additional components and circuitry, which adds value to the host device without complicating the design of the board. These integrated components can be inserted into the device by simply inserting the first and second connectors into corresponding openings in the front wall 374 and rear wall 57 of the main device 50. An auxiliary connector for connecting the chip package to other circuits of the device can be provided as shown in FIG. 3B. The components may also be provided in other forms such as, for example, 1) chipless package, but with a wafer packaged substrate; 2) chip packaged with a first connector or a second connector, respectively, in FIG. 2A at 200, 201 Marked; and 3) an inlet connector and an outlet connector having openings arranged to extend onto the front wall of the device, indicated at 202 in FIG. In this manner, components 200, 201, 202 can all be plugged into a basic device to provide functionality to the device without the need to design such functionality to host board 62 of host device 50. Additional details of a possible structure will be described later.

Referring to Figures 4, 7 and 8, an internal connector 70 is received in the connector 80 and the internal connector 70 includes a body 108 formed of an insulating material. The body 108 includes a card slot 109, and the card slot 109 Opening to the front of the connector 70 and the inlet 67 of the connector 80. The card slot 109 is an example of a mating interface, and although a card slot structure is preferred, other docking interface configurations are also suitable. The card slot 109 is located above a polarizing channel 110 formed by the legs 110a, 110b of the card slot 109 above the bottom wall 68 of the support connector 80 and prevents incorrectly positioned opposite docking connections The device is inserted into the card slot 109. The main body 108 has a plurality of terminal receiving cavities 111 which are aligned on opposite sides of the card slot 109 and accommodate contact portions of the cantilevered terminals 115a, 115b of the two connecting elements 104a, 104b. The connecting members 104a, 104b support the terminals 115a, 115b in the form of respective single row terminals, as shown in Figures 4A and 8C. The two connecting members 104a, 104b each have a sheet-like structure and can be inserted into the body 108 from the rear to complete the assembly of the inner connector. As shown, the terminal arrays of the respective connecting elements 104a, 104b are thus positioned on opposite sides of the card slot 109.

FIG. 8A shows the basic structure of a connecting member 104 for the connector 70. A plurality of twinaxial cables 60 and conventional wires 121 are arranged in an array extending in the lateral direction of the connector 70. The ends of the wires 121 and the cables 60 are stripped to expose the signal conductors 61 of the cable 60 and define the free ends 121a, 120a of the wires and cables, the free ends 121a, 120a being respectively terminated for the connector terminals 115a The corresponding tail 116 of 115b (Fig. 4A). In the illustrated embodiment, the outer ends of the array are positioned with pairs of twinaxial cables 60, and the drain wires 61-2 of the twinaxial cable 120 are simply bent upward and then bent again to level Lying on the grounding plate 125 associated with the drain wire 61-2. The terminals 115a, 115b are held together by a holding strip 124 in a lateral array of their own spacing. This greatly preserves the geometry of the cable when it is terminated at the connector.

The illustrated receptacle connector 70 has a structure that enhances the signal integrity of data signals through the receptacle connector 70 and provides circuitry for a circuit card that corresponds from the bypass cable conductor to an opposing docking connector. An impedance transition between. This transition is from 85 ohms to 100 ohms in a predetermined error level and is performed in multiple stages or three segments such that the transition transitions from an entry level impedance to a first transition impedance, followed by a second transition A gradual manner of shifting the impedance and ultimately transitioning to the final or third transition impedance is performed. In this manner, the impedance transition occurs in a slightly gradual manner over the entire length of the receptacle connector rather than at the tail or contact of that connector. In embodiments where no impedance transition is required, this transition can be omitted.

If a transition is set, the transition can be set by providing three different dielectric media through which the terminals of the receptacle connector extend. The first section medium is preferably a hot melt adhesive in which the impedance is increased by about 6 ohms from an incoming impedance of about 85 ohms, while the second section medium preferably comprises LCP (liquid crystal polymer). The impedance rises in the LCP by about another 6 ohms, and finally, the third section of the medium includes air, and the impedance in air rises to about 105 ohms, whereby the impedance transition is at an error level of about 5% ( Tolerance level). The change in the surrounding medium is also accompanied by a change in the width of the terminal (the width is widened or narrowed in different sections). The distance between the terminal and the associated ground plane can also contribute to this selected impedance tuning. This transition occurs over the length of the connector from the tail to the contact end to present a gradual increase over the overall length rather than just an increase at the terminal tail or contact.

Referring to Figures 8A-8D, the termination area of the cable 120/wire 121 and the terminals 115a, 115b is in a nest 130 that extends laterally and is made of an insulating material having a desired dielectric constant. form. The illustrated nest 130 has a U-shape and is positioned at a retaining strip 124 of an adjacent terminal. In this region, the drain wire 61-2 of the cable 60 can be bonded to the ground plate 125, which is above the cable 60 and vertically spaced from the tail 116 of the terminal and above the tail 116 of the terminal. The ground plate 125 has a plate body 125a having at least a portion of a flat surface that is contacted and soldered or otherwise joined by the drain wire 61-2.

The contact leg 126 is provided as part of the ground plate 125 to form a contact portion 128 of the ground plate 125, which is preferably connected to the tail portion 116 of the ground terminal of the connector 70. The contact leg 126 is vertically offset such that the ground plate 125 is spaced apart from at least a portion of the signal conductor and extends over the at least a portion to the tail of the signal terminal in a row of terminals associated with a respective connecting element. As shown in Figures 8B-8D, each ground plate 125 preferably includes three legs 126 that contact the connector in such a manner that the sides of the tails of any two signal terminals are two of the contact legs 126 therein. 70 ground terminal. From an impedance perspective, this arrangement allows the spacing between the signal terminals to approximately coincide with the signal conductor of the dual axis cable 60. In this manner, for the inner connector 70, a G-S-S-G pattern of the terminals 115a, 115b is held in the two rows of terminals on opposite sides of the card slot 109.

A rectangular frame 132 is disposed along the rear of each of the connecting elements 104a, 104b and includes four walls 133 (Fig. 8) joined together about a bottom wall 134 to at least partially define a hollow interior recess 138. The front and rear walls 133 of the frame 132 are shown with a plurality of openings 135 that are configured to receive a double in the longitudinal extent of the dual-axis cable 120 and the low-power logic control wires 121 through the frame 132. Axis cable 120 and low power logic control wire 121. The frame 132 is bonded to the nest 130 along the back of the nest 130 via an overmolded portion of the filled termination region. The frame 132 is formed from a conductive material, such as a metal, or may have an outer conductive coating such that when in the connector 80, the connecting members 104a, 104b form an electrical ground contact with the connector 80. Thus, the frame can provide a path to ground or other reference plane. The frame 132 of the connecting element is positioned adjacent the nest (Fig. 8C) and behind the nest and can be secured to the nest as will be described later.

The side wall 133 of the frame 132 can be provided with a vertical recess 136 as shown. These grooves 136 will engage the side walls 106a, 106b of the rear opening 106 of the connector 80, and because the frame is electrically conductive, the frame also mitigates EMI leakage from the rear opening 106 of the connector 80. The open recess 138 of the frame 132 of the connecting element through which the cable and wire extend is filled with a dielectric material, such as a liquid crystal polymer ("LCP"), the dielectric material that connects the cable/wire to the frame 132 of the connecting element and The nest that also houses a portion of the LCP is fixed in the recess 138. In this manner, the sheet-like shape of the connecting elements 104a, 104b is defined and this unitary structure provides a measure of strain relief of the twinaxial cable 60.

The bottom walls 134 of the two connecting members 104a, 104b abut each other and are engageable with each other by way of a cylinder 140 engaging the holes 141 as shown in FIG. In this manner, the two connecting members 104a, 104b can be inserted into a rear opening of the body 108 such that the contact portions of the terminals are aligned with each other and received in the terminal receiving cavity 111 of the body 108 of the connector to form an integrated connection. Component. As shown in FIG. 6, the connector assembly is pressed into the hollow interior of the connector 60 from below. An internal ground plane 142 is provided in the form of a flat conductive plate and is located between the two connecting elements 104a, 104b. The ground plane 142 extends from the rear end of the frame 132 of the connecting element to the leading edge of the nest 130. This ground plane 142 acts as a primary ground plane for preventing crosstalk between the pair of signal conductors within one connection element and the pair of signal conductors within the other connection element. The ground plate 125 serves as a secondary ground plate or busses for the signal conductor of the cable 120 and its terminating portion with the signal terminal 115a.

The recess 136 on the side wall of the connecting member 104a, 104b engages the side wall 106a, 106b of the rear opening 106 of the connector, and the two snaps 144 disposed on opposite outer sides of the body 108 of the connector are received in the side wall of the connector 80. Openings 146 of 64a, 64b. The buckle 144 can be oversized in size to deform when the connector assembly is inserted into the housing 63. The groove 136 can be shaped with a tip 148 that is directed inwardly or inwardly to ensure reliable contact with the connector 80 (Fig. 10).

The two EMI absorbing pads 102a, 102b can be disposed on opposite surfaces of the connecting elements 104a, 104b of the connector assembly before the connector assembly is pressed into the interior 61 of the connector 80 from below. As previously mentioned, the connecting member is vertically recessed to enable the connecting member to engage the side walls 106a, 106b of the rear wall opening 106 of the connector and cooperate with the EMI absorbing pad to provide EMI leakage protection around the four sides of the connecting member. . In effect, the rear wall of connector 80 is combined with conductive connecting elements 104a, 104b to form a fifth wall that prevents EMI leakage. The pads 102a, 102b seal the space between the connecting elements 104a, 104b and the opposing surfaces of the housing 63. These pads 102a, 102b occupy an open space above and below the connecting elements 104a, 104b (the two spaces are typically left blank in conventional connectors).

The EMI pads 102a, 102b are preferably aligned and over the area of the tail of the terminal of the connector 70 that terminates the cable wire of the connecting element. The bottom pad 102b is held between the bottom wall 68 and the bottom connecting member 104b, while the top pad 102a remains in place between the top connecting member 104a and the rear cover 90 of the housing. This is achieved by the ribs 103 formed on the bottom of the back cover 90 and extending downwardly into contact with the pad 102a as shown in Figure 13B. The connecting element, the EMI absorbing pad is thereby sandwiched between the top wall 66 and the bottom wall 68 of the housing and the pads 102a, 102b help ensure that EMI is reduced along the opening 106 of the rear wall of the housing.

In the case where the twinaxial cable 60 is directly terminated to the terminal of the connector 70, the connector 80 is configured to be mounted off and mounted on a circuit board or mounted on a panel or to become a host device. The setting of the free-standing connector. The connector 80 need not be mounted to a circuit board 62 in a one-end connection, but can be mounted to a circuit board 62 by fasteners extending through openings in the circuit board and into screw bosses. Thus, the beneficial sealing of the bottom of the connector and the need to eliminate the right angle connector not only eliminates the need to mount the connector on the motherboard 62, but also facilitates stacking multiple connections in a vertical and horizontal arrangement. Device.

Accordingly, the wires of the connector can be directly connected to components of the host device, such as a processor or a chip package of traces disposed on the bypass circuit board. Because it can be directly connected, the connector need not be mounted to a circuit board, but can be enclosed within a structure such as the disclosed connector 80 and the mounted panel. The connector 80 can be disposed on an adapter frame that can be constructed similarly to the housing if desired. Still further, the connector can be used as an internal connecting sleeve that is positioned within the main device and houses a plug connector. One end of the connector cable is terminated at the end of the terminal of the connection element such that the cable can be terminated at its other end to the chip package or processor of the host device. An integrated bypass assembly such as this can be installed and removed or replaced as a single piece, bypassed on the board and eliminates the loss associated with the FR4 material, thereby simplifying the design and lowering the board the cost of.

Referring now to Figures 4 through 9, a connector 80 is shown in Figures 5 and 5A which can be used as an external interface for receiving the inlet connector of the primary device. The connector 80 is disposed on the front wall 374 of the device 50 and houses opposing docking connectors (such as pluggable electronic modules, etc.) in the form of plug connectors. The connector 80 includes a conductive housing 63 that includes two side walls 64a, 64b, a rear wall 65, and a top wall 66 and a bottom wall 68. All of these walls together define a hollow interior 61 that receives a corresponding external docking connector that interfaces with an internal connector 70. All of the walls of the connector 80 can be formed together as a single piece of adapter frame, or all of the walls of the connector 80 can be separate components that are joined together to form an integrated assembly. It should be noted that the connector 80 is not limited in its operation to only accept the pluggable module, but can accommodate any suitable connector with a suitable configuration.

The walls 64-66 and wall 68 of the housing are both electrically conductive and provide shielding of the connection portions made within the connector 80. In this regard, the connector 80 is provided with a conductive bottom wall 68 that completely seals the bottom of the housing 63, whereas the known housing and frame are open at the bottom where they are mounted on the circuit board. The illustrated connector 80 includes an internal cable-direct connector 70 (Fig. 4), and the internal cable-direct connector 70 allows the wires to be directly connected to their terminals 115a, 115b and thus does not require A trace terminated on the motherboard 62 of the master device 50. Prior art connectors surrounded by a housing or frame are of the right angle type, which means that the connectors extend from their mating faces at right angles to the traces of the board and connector terminations. Right-angle connectors terminated on a board can cause signal integrity problems at high speeds due to varying lengths of terminals and bending of the terminals, such as capacitance increases in curved corners and characteristic impedance of the system in connectors and connections Jumps or dips at the interface of the device and the board. In addition, the cable coming out of the rear wall of the housing can potentially eliminate the need for press-fit pins as a means of mounting the connector to the board because common mounting holes can be used for threaded fasteners. This simplifies the overall design of the motherboard of a master device. As shown, the inner connector 70 terminates in the wires of the cable 60 and exits the rear wall 65 of the connector 80, thereby avoiding the aforementioned problems.

As shown in Figures 5-6B, the bottom wall 68 of the housing seals the bottom of the connector 80. The bottom wall 68 is shown formed from a sheet of sheet metal having a bottom plate 72 and two side attachment wings 73 that extend along the outer surfaces of the side walls 64a, 64b of the housing, respectively. The opening 74 in the connecting wing 73 engages the snap or tab 76 on the side walls 64a, 64b and holds the bottom plate 72 in place. Additional means of attachment may include an inner wing 75 that is also bent upwardly from the bottom plate 68 but positioned along the edge of the bottom plate 68 to extend along the inner surface of the side walls 64a, 64b to the inner hollow space 61. Two such inner wings 75 are shown in Figures 11 and 13A and each include a contact piece 75a that extends inwardly for contacting the opposite of an opposite connector inserted into the internal passage 61. side. Two flanges or flanges 77a, 77b may also be provided at opposite ends of the bottom plate 68, respectively, extending at an angle relative to the bottom plate 68 to engage the front and rear walls 65 of the housing 63 to form conductive contacts at these locations. It also provides EMI shielding. Covering the entire bottom with a bottom wall 68 significantly reduces EMI in this area. A plurality of standoffs 69 may be formed on the bottom wall 68 if desired. The multi-point contact between the bottom wall 68 and the housing 63 provides the internal connector 70 with a reliable EMI shielding gasket along the entire bottom of the connector 80.

Referring now to Figure 5, the top wall 66 preferably includes an access opening 81 that communicates with the hollow interior 61 and is aligned with the internal connector 70 (primarily the area of the front portion of the inner connector 70). A heat transfer element 82, shown as a heat sink in the form of a heat sink fin, can be configured to have a base 84 that extends at least partially into the access opening 81. The base 84 has a flat bottom contact surface 85 that contacts an opposing surface of a module that is inserted into the interior 61 of the housing. Two retaining members 86 are shown coupled to the top wall 66, and each retaining member 86 has a pair of preloaded contact arms 88 that apply a downward retaining force to a top plate 87 of the heat sink. An EMI gasket 89 is disposed to extend around the periphery of the opening 81 and sandwiched between the top wall 66 and the heat transfer element 82.

The connector 80 also includes a rear cover body portion 90 that extends over the rear of the interior 61 to cover a portion of the inner connector 70. A recess 91 may be formed in the rear cover 90 to receive a chevron-shaped EMI gasket 92 interposed between the opposite surfaces of the rear cover 90 and the top wall 66. It can be seen that the rear cover 90 includes an opening in the form of a recess 94. The top wall 66 (Fig. 13A) may include an engagement hook portion 95 as shown, the engagement hook portion 95 being received in the recess 94 such that the top wall 66 can slide forward so that the leading edge portion of the top wall 66 abuts the connection The front flange of the device 80 is such that the top wall 66 is joined to the housing 63, and the housing 63 can include a protruding tab 96 formed therewith that engages a corresponding recess 97 of the top wall 66 (Fig. 5A and Figure 13A). A fastener 99 (which may be a screw or other form of fastener) may be used to secure the top wall 66 to the housing 63 by engaging a threaded bore formed in the threaded boss 100 supported by the housing 63. In this manner, the housing 63 is sealed in a manner that significantly reduces EMI leakage.

Because the internal connector 70 is directly connected to the cable 60, the connector 80 is mounted to the motherboard 62 without direct termination, but can be supported by other structures or can pass through the opening 122 extending through the board and into the belt. The fasteners 120 in the screw bosses 100 are mounted. Sealing the bottom of the connector 80 and eliminating the right angle connector will eliminate the need to mount the connector 80 on the motherboard 62 and facilitate the placement of the stacked housings/connectors 80 in the vertical and horizontal directions. Figures 15 and 16 show only two different stacked forms. Figures 15 and 15A show a pair of connectors 80 in which their inlets 67 are all oriented horizontally and stacked vertically. The two connectors 80 are shown as being supported by a bottom screw 120 in an upward manner through an opening in the circuit board to engage the threaded boss 100 for support on a circuit board 62. A set of intervening screws 124 are provided to engage the threaded bosses 100 of the lower housing, and these screws 124 have threaded male ends and threaded female ends 126. The female end 126 engages screws 99, 128 that extend into the top of the housing with the screw boss 100 of the upper housing. Thus, the plurality of connectors 80 can be stacked in such a pattern without the need for complex high speed connection traces formed on the circuit board 62 and terminating the internal connector 70.

16 through 16A illustrate another manner in which a plurality of connectors 80 of the present invention can be arranged. This arrangement includes three housings erected along the front of the main unit but raised off a horizontally aligned row on the circuit board 62. Figure 15B shows a mounting nest 130 having a base 132 defining a recess and two extending sidewalls 133 that receive a connector 80. The mounting nest 130 has two attachment flanges 134 that can be mounted to a panel 136 by extensions 135 extending through the base 132 using fasteners as shown. A fastener can be used to attach the housing to the nest and the fastener extends through the opening 135 of the base and into the threaded boss 100. The top wall 66 of the connector 80 can be mounted to the housing 63 using the male-female end fasteners 126 described above such that adjacent connectors 80 can be assembled into an integrated arrangement and extended through the male fasteners. The base 132 of the nest 130 enters the female end 126 of the opposing fastener or enters the threaded boss 100 of the housing. The plurality of connectors 80 may also be closely spaced together as shown in FIGS. 14 to 15B because the heat transfer member 82 has its fins extended toward the rear of the housing as described below.

Accordingly, a free-standing connector/housing is configured to be mounted to an outer wall (such as a panel or bezel) of a main device or to a circuit board without requiring any end traces to be positioned below the housing. Such a self-standing connector does not have to be mounted on a circuit board, but can be mounted on a panel. The connector can take the form of an adapter frame, a shielded cover or a similar housing type. Still further, the connector can be used as an internal connection sleeve to provide an internal connector that is positioned within the main device and that houses a plug connector. The cable of the connector terminates at the proximal end of the cable at the end of the terminal of the connecting element, and the cable can be terminated at its distal end to the chip package or processor of the host device. An integrated bypass assembly such as this can be installed and removed or replaced as a single piece, bypassed on the board and eliminates the loss associated with the FR4 material, thereby simplifying the design and lowering the board the cost of.

The docking connector for connection to the I/O connector generates heat during operation and this heat must be removed to maintain efficient transmission and reception of signals during operation. High temperature can not only negatively affect the performance of the module, but also negatively affect the performance of the device using the module, so it is important to remove the heat generated by this operation. This heat removal is typically accomplished by the use of a heat sink that includes a solid base that contacts a selected surface of the module, typically the top surface. These heat sinks also have a plurality of fins that project upwardly from the base into the interior space of the device. The plurality of fins are spaced apart from one another such that air can flow over the fins and around the fins in a manner that dissipates heat from the fins into the surrounding interior atmosphere. The plurality of fins are mounted above the heat sink and the module and extend upwardly by a prescribed height to achieve a desired degree of heat exchange. However, the use of such a heat sink does not allow the designer to reduce the height of the device in which the module is employed, thereby reducing the likelihood of reducing the overall height of such a device.

In this regard, as shown in FIGS. 17 to 19G, a heat sink assembly 240 is disposed to include a heat transfer portion 241 having a solid base portion 242, and the solid base portion 242 is suspended to the inside of the housing/connector 222. In space 226. The base 242 of the heat transfer portion is complementary in shape to the opening 232 of the housing 222 such that the base 242 can extend through the opening 232 and into the interior space 226 for insertion into the front opening 230 of the interior pod 229 of the housing 222. The top or upper surface of a module is in thermal contact. The base 242 can further include a skirt or lip 244 that extends around at least a substantial portion of the perimeter of the base 242 and preferably extends around the entire perimeter of the base 242. This skirt 244 is received in a corresponding recess 246 formed in the top surface 233 of the housing 222 and preferably formed around the opening 232. A conductive EMI annular gasket 247 is disposed to fit within the recess 246 and surround the opening 232. The shim 247 has a plurality of resilient fingers 248 that provide a conductive seal between the skirt 244 of the heat transfer portion and the recess 246 at the top of the housing to prevent EMI from passing through the opening 232. Give way. The EMI gasket 247 fits within the recess 246 and surrounds the opening 232 while the plurality of resilient fingers 248 extend radially outwardly as shown and contact the bottom surface of the skirt 244. The opening 232 at the top of the housing 222 is considered a contact opening because it allows the heat transfer portion 241 to extend into the interior space 226 of the housing 222 and through a thermal contact surface 250 and any module heat inserted into the interior space 226. Transfer the contact (Fig. 19C).

The heat transfer portion 241 has a solid base 242 that preferably includes a flat thermal contact surface 250 (at the bottom of the base 242) that is configured to enter the contact opening of the frame and provide effective and reliable thermal contact The manner of contacting the top surface of a module inserted into the pod 229. The base 242 can include a beveled guide on its contact surface 250 to facilitate insertion of a module. The heat sink assembly 240 further includes a distinct heat dissipating portion 252 that transfers heat generated by the module and transmitted through the thermal contact surface 250 to an opposite top surface of the module to the heat transfer portion 241. Out. As shown in FIG. 18, this heat radiating portion 252 is significantly different from the heat transfer portion 241 and spaced apart from the heat transfer portion 241 in a longitudinal or horizontal direction.

The heat sink portion 252 includes a base portion 254 that extends from the heat transfer portion 241 along a similar longitudinal axis in a cantilevered fashion. A plurality of vertical fins 256 are disposed on the base 254 and extend vertically downward from the base 254 of the heat sink. As shown, the plurality of fins 256 are spaced apart from each other in the longitudinal direction (horizontal direction) to define a plurality of refrigerating passages 258 between the plurality of fins 256, the plurality of refrigerating passages 258 being longitudinally spaced apart The heat transfer portion 241 further extends longitudinally relative to the module. In order to maintain the heat transfer portion 241 in contact with a corresponding module and resist any torque that may occur due to the weight and/or length of the heat sink portion 252, a plurality of retainers 260 are shown. The retaining members 260 are mounted to the top surface 233 of the frame by means of fasteners, such as rivets 262. The fasteners can also be formed as part of the housing 222, essentially a vertical cylinder 263 in which the vertical cylinders 263 are received. Disposed in a corresponding opening 264 on the base 265 of the holder. The free ends of the posts 263 can be "dead-headed" or "mushroomed" to form a connection between the retainer 260 and the skirt 244. It can be seen that the retaining member 260 has a pair of cantilevered resilient arms 267 associated therewith that extend longitudinally from the base 265 as shown. The resilient arm 267 has a resilient arm that is flexible and formed to be biased downward in advance. The resilient arm 267 terminates at a free end 268 and the free end 268 extends at a downward angle to contact the skirt 244 of the heat transfer element. Four such contact points are provided to the heat sink assembly 240, as shown, and the four contact points will define a quadrilateral if connected in an imaginary line. However, these points of contact of the resilient arms 267 can vary at the locations shown, depending on the range of spaces available on the skirt 244 of the heat sink assembly 240.

The resiliency of the resilient arms 267 allows the designer to obtain a desired length by constructing the length of the resilient arms 267, the depth of the resilient arms 267 to sag into the recesses 246, and the height of the resilient arms 267 that are coupled to the stubs 269 of the retaining members 260. Contact pressure. The retaining member 260 is securely coupled to the skirt 244 such that the sides of the housing 222 need not be formed and employ attachments that will take up space and affect the spacing between the housings 222. The rivet 262 also has a low height such that the frame 226 does not excessively increase in any direction, including the vertical direction. The resilient arms 267 are relatively short in length and thereby contact the heat transfer portion 241 near its four corners to apply a reliable contact pressure to the heat transfer portion 241 to maintain the heat transfer portion 241 with any of the modules. Good heat transfer contact.

Uniquely, the plurality of fins 256 are not in intimate contact with the heat transfer portion 241 of the heat sink assembly 240. Instead, it is positioned at the heat dissipation portion 252 and extends downward from the heat dissipation portion 252. The plurality of fins 256 are longitudinally spaced away from the heat transfer portion 41 and its base 242. The plurality of fins 256 are also arranged on a series of planes, which are shown as a vertical plane F, a vertical plane F and a horizontal plane H1 (the skirt of the heat transfer portion extends along the horizontal plane H1) and a horizontal plane H2 (The thermal contact surface 250 extends along the horizontal plane H2) intersects. As shown in Fig. 19C, not only the vertical plane F intersects the two planes H1, H2, but also the plurality of fins themselves extend for height to intersect the two planes. In addition, adjacent fins 256 are separated by an intervening refrigeration passage or air passage through which air can circulate. The plurality of fins 256 and the plurality of refrigerating passages 258 extend perpendicular to a longitudinal axis of the heat sink assembly 240. In this manner, the plurality of fins 256 can occupy a space R behind the housing 222 and above the wires 272 that terminates with a receptacle connector 271 that is supported within the housing 222. Positioning the plurality of fins 256 in this manner will reduce the overall height of the apparatus employing such a housing structure to a height that is generally about the fins that will protrude upwardly from the housing. It is desirable to have the plurality of fins 256 not touch the wire 272 under this orientation. In this regard, the height of the fins 256 is preferably less than the height of the housing 222 as shown.

The heat transfer portion 241 and the heat radiating portion 252 are shown integrally formed as one piece to promote heat transfer from the heat transfer portion 241 to the heat radiating portion 252. However, it is conceivable that the two portions 241, 252 can be formed separately and then joined together if desired. In order to further increase the heat transfer from the heat transfer portion 241, a heat transfer member 274 is disposed to extend longitudinally along the heat transfer portion 241 and the heat radiating portion 252 and to contact the heat transfer portion 241 and the heat radiating portion 252. Such a transfer element 274 is shown in the drawings as a heat pipe 275 having a rectangular or elliptical cross-sectional shape including a major axis and a minor axis defining such a shape (Fig. 19D). The rectangular shaped heat pipe 275 increases the amount of contact area between the heat pipe 275 and the two portions 241, 252 of the heat sink assembly 240. Other non-circular structures (such as a rectangular inner cavity) or even cylindrical may be employed. The heat pipe 275 is received in a common groove 278 which also extends longitudinally along the heat sink assembly 240 and extends along the contour of the two portions 241, 252. Accordingly, the heat pipe 275 has an offset shape with two distinct portions 279, 280 that extend at different heights or height levels of the heat sink assembly 240.

The heat pipe 275 is a hollow member having a lumen 282 defined by a side wall 283 that is sealed at its ends and contains a two-phase (e.g., vaporizable) fluid within the lumen 282 of the heat pipe 275. Examples of two-phase fluids that may be present in embodiments of lumen 282 include purified water, chlorofluorocarbons, and the like. Heat pipe 275 and its walls 283 can be constructed of aluminum, copper or other thermally conductive material. The inner cavity 282 preferably includes an evaporation zone 279, an adjacent heat transfer portion 241, and a condensation zone 280 adjacent the heat sink 252. Heat is transferred from the heat transfer portion 241 through the bottom wall and side walls 283 of the heat pipe 275 into the inner cavity 282, which enables the two-phase fluid present in the evaporation zone 279 to evaporate. The steam can then be condensed into a liquid in the condensation zone 280. In the illustrated embodiment, the steam exotherms as it condenses, and the heat transmits through the wall 283 of the heat pipe 275 out of the interior cavity 282 into the base of the heat sink 252 and its associated fins 256. The inner chamber 282 can include a wick 284 to facilitate condensed liquid travel back along the wick to the evaporation zone 280 (Fig. 19D). The wick 284 may employ a groove-like passage on the inner surface of the inner cavity 282 or an extent of a mesh or the like.

As shown, the heat transfer portion 241 and the heat sink portion 252 of the heat sink assembly 240 extend longitudinally but extend at different height levels, with the heat sink portion 252 being elevated relative to the heat transfer portion 241. This difference in height level facilitates the movement of liquid vapor upward from the heat transfer portion 241 to the heat radiating portion 252 to some extent, but its main purpose is to accommodate the heat radiating portion 252 in the horizontal range of the housing 222 without The frame 222 is modified to accommodate the heat sink 252. If it is desired to extend the heat sink 252 at the same level of height as the heat transfer portion 241, portions of the back wall 224 and top surface 233 that are near them will need to be modified. A groove or recess may be formed in the two walls 224, 233 to receive a region of the heat sink assembly 40 between the heat transfer portion 241 and the heat sink portion 252. Moreover, although most of the heat pipes 275 are illustrated, it will be appreciated that a plurality of heat pipes (such as a pair of heat pipes 290, as shown in phantom in Figure 19E) may be arranged to be disposed within the grooves of the heat sink assembly. In this case, the pair of tubes may be sealed in a medium that facilitates heat transfer to compensate for loss of direct contact between a pair of heat pipes and a heat pipe in the shape of a single oblong shape as shown. the amount. A thermal paste or other compound can be placed on the heat pipe to increase heat transfer.

This heat sink assembly thermally engages the housing and uniquely transfers heat to the area behind the housing. With this configuration and its depending fins, the apparatus employing such a heat sink assembly can have a reduced height to allow additional equipment to be present in the closets and stacks. The plurality of fins are positioned such that the space between all of the fins is used for refrigeration because none of them have a light pipe or any other element extending through them. The heat sink of the heat sink extends horizontally but is spaced above the motherboard of the device so that the designer can use this open space for additional functional components without increasing the lateral dimensions and depth of the master. An example of a manner of a connector having a heat sink integrated with a connector can be arranged and mounted for a master device as shown in FIGS. 15 to 16A.

As described above, the housing of the connector 80 can be formed in a manner that allows the connector 80 to be positioned in a manner that the connector 80 is not supported by a circuit board but can be supported by other structures such as a conductive frame or an insulating frame. In such a configuration, all of the terminals are preferably connected to conductors in a cable so that signals (high speed and low speed) can be properly guided. In many such embodiments, the housing of the connector can be formed from a die cast material. Such a structure is not necessary as conventional stamped metal structures would also be suitable.

Although a housing can be supported by a separate structure, such as a frame, it should be noted that the connector can mount a circuit board in a more conventional manner. For example, the connector 80' of Figure 20 is formed from a stamped material and is configured to be press fit to a circuit board and to provide a plurality of ports 80a' in a group structure. The housing 63' includes a plurality of partition walls 63a' that help define the plurality of ports, and the housing 63' includes a plurality of tail portions 63b' configured to be pressed into a circuit board. For certain system configurations that wish to extend a circuit board to an edge of a box, it may be beneficial to have a connector 80' constructed so that it can be mounted in a press fit as shown. On the board. In such a configuration, it is contemplated that the high speed signal terminals are connected to the cable but the low speed signals are in a desired manner (e.g., a connector such as that given in PCT Application No. PCT/US2014/054100, the entire disclosure of which is incorporated herein by reference. It can be mounted on a cable and connected to a circuit board.

FIG. 21 illustrates an embodiment of a computing device 300. The device 300 includes a base 301 having a first wall 305a and a second wall 305b. As shown, the first wall 305a is a front wall and the second wall 305b is a rear wall (the first wall 305a and the second wall 305b are opposite), but the first wall 305a and the second wall 305b need not be in a relative The side and thus many of the structures are feasible.

The base 301 supports a main circuit board 312 that extends to the adjacent front wall 305a. A chip package 340 is disposed on the circuit board 312 and the plurality of first connectors 321 are connected to the chip package 340 through a plurality of cables 322 carrying high speed signals. A second connector 331 is positioned at the second wall 305b and is coupled to the wafer package 340 through a plurality of cables 332. Power is supplied to the circuit board 312 (and various electronic components supported by the circuit board 312) via a power connection 330. It should be noted that the distance between the first wall 305a and the second wall 305b can exceed 20 inches, but problems can arise if the board is used to transmit high speed signals, especially when the data rate is close to and exceeds 25 Gbps. The use of non-return-to-zero (NRZ) coding would require a signal transmission frequency of approximately 12.5 GHz and such frequencies would be less compatible with conventional FR4-based boards. In addition, as data rates approach 40 Gbps (and signal transmissions approach 20 GHz), even the use of foreign materials may not be sufficient to allow for the use of conventional board technology.

22-27 illustrate another embodiment of a computing device. Specifically, the computing device 400 includes a base 401 having a first wall 405a and a second wall 405b. A main circuit board 406 is provided, and the main circuit board includes electronic component circuits 407. The electronic component circuit 407 can include a power supply, a cooling fan, and various digital signal transmission wafers that do not need to operate at high frequencies to support the required bandwidth or only travel short distances. A support connection 408 (shown as a cable assembly for assembly but also a two board connector) can provide control signals and/or power signals to a signal Plate 410, signal board 410 supports one or more wafer packages 440.

A plurality of first connectors 421 are positioned along the first wall 405a to provide a plurality of ports 421a to the first wall 405a. Similarly, a plurality of second connectors 431 are positioned along the second wall 405b to define a suitable docking interface along the second wall 405b. However, as can be appreciated, the signal board 410 does not extend to the first connector or the second connector. Rather, the plurality of first connectors 421 are connected to the wafer package 440 via a plurality of cables 422 while the plurality of second connectors 431 are connected to the wafer package 440 via a plurality of cables 432. The first connector 421 can be formed in a manner similar to that described above and thus the intrinsic details of the connector 421 will not be repeated for the sake of brevity. Rather, it will only be noted that the above-described features of such a connector can be used herein in the desired manner and in the desired combination to provide a connector that meets system requirements.

As can be appreciated, the plurality of first connectors 421 can be supported by a front circuit board 411. Alternatively, the front circuit board may be omitted and a frame such as frame 132 (described above) may be used to support the plurality of first connectors 421. If the front circuit board 411 is employed, the connector support 411a can be used for The first connector 421 is fixed to the front circuit board 411.

The signal board 410 supports a wafer package 440 that includes a wafer 445 and is disposed around the wafer package 440 with a plurality of signal board connectors 426. In one embodiment, such as shown in Figure 27, the signal board connectors can be positioned on at least two sides of the wafer 445 and can also be positioned on four sides to increase system capacity. At least two signal board connectors can be disposed on each side of the wafer 445, if desired. Of course, if the signal board (or corresponding structure) has a wafer on both sides (e.g., the top side and the bottom side), a further increase in density can be provided.

In operation, the signal board 410 will be prepared (this may include a reflow operation) and then docked to the first connector 421. In order to consider such a mounting process, the cable 422 has a first end 422a terminated to the first connector 421 and a second end 422b terminated to the first board connector 423, and the plurality of first board connectors The 423 can interface with a plurality of signal board connectors 426. Similarly, the cable 432 can have a first end 432a that terminates in the second connector 431 and a second end 432b that terminates in the second board connector 433. Such a structure allows the signal board 410 to be mounted in the base 401 before being connected to the first connector 421 and the second connector 433. In operation, the signal board connector 426 will desirably include a base 426a that supports a plurality of terminals 429 that are soldered to the signal board 410. Of course, in an alternate embodiment, a signal board connector can be press fit onto the signal board 410. Since it is well known to mount a connector on a circuit board using soldering or press-fitting, a further description of the details of such a connector will not be provided herein.

Regardless of how the signal board connector 426 is mounted on the signal connector board 410, the connector 426 provides a dockable interface for the signal connector board 410. The signal connector board supports a wafer 445 (the wafer 445 will typically be on some nature carrier or substrate). The wafer 445 can be coupled to the signal circuit board 410 as described above and can be supported by a heat dissipation frame 442 that supports a cooling block 441. The refrigeration block 441, which may be in the form of a conventional heat sink, includes a refrigeration base 441a that will preferably be pressed against the wafer 445 and may include a cooling fin 441b to increase surface area and increase refrigeration of the wafer. As can be appreciated, a thermally conductive compound 443 thermally bonds the wafer 445 to the refrigeration base 441a.

The wafer 445 as described above can be any desired combination of an ASIC, DSP and/or controller and processor whereby the wafer 445 is coupled to the first connector 421 via a signal circuit board 410 via a very short path. And a second connector 431. Because signal loss is related to the traveled distance along the board, shortening the distance as shown allows for much lower losses than conventional systems, while allowing the use of conventional board materials and construction methods.

28A and 28B illustrate an alternate embodiment of a signal board connector and a first board connector. Specifically, a first board connector 523 includes a base 523a that supports one or more rows of cables 522. The base 523a of the first board connector 523 is butted to a signal board connector 526. The signal board connector 526 includes a base 527a in a housing 527b. The housing 527b has a leg portion 527c. The 527c helps to secure the housing 527b to the corresponding signal board. A pressure member 528a secures the first board connector 523 in the signal board connector 526 and includes an actuating element 528b that, when actuated, causes the first board connector 523 to be removed from the signal board connector 526. Move out.

Of course, other configurations of the first board connector and the signal board connector are also possible, and thus the illustrated embodiment is not intended to be limiting unless otherwise stated. Additionally, the first board connector and the second board connector may be the same or different to ensure that the correct connector cannot be installed in the wrong location. To further protect against potential installation problems, the first board connector and the second board connector can each be keyed differently so that only the required structure can be installed.

FIG. 29 shows an alternate embodiment of a wafer package 640. A support layer 614 is configured to support a flexible layer 690, which in turn supports a substrate 646, and a substrate 646 supports a wafer 645. Wafer 645 and substrate 646 can be as described above. Support layer 614 can be a circuit board or some other material. Although support layer 614 is shown as being comparable in size to wafer 645 and substrate 646, in practice, it is contemplated that the support layer will be larger than wafer 646 and substrate 646, to provide additional support. As can be appreciated, instead of using a circuit board to connect the wafer to a connector, the illustrated embodiment uses a flexible circuit to connect the connector 626 to the wafer 645. The entire wafer package 640 can be supported by a frame (not shown) or by a support layer 614, depending on the desired structure, and the entire wafer package 640 can include a heat sink to help dissipate heat from the wafer. In such a system, the support layer 614 can provide a mounting location similar to that described above for the heat sink.

The flexible circuits can be made in an intricate pattern because they can be multi-layer thick and the flexible circuit 690 can be terminated to a plurality of signal board connectors 626 (signal board connectors 626 can be configured to be coupled to respective first board connectors, Thus the rest of the system is basically the same). Thus, a soldered connection between the flexible circuit 690 and the substrate 646, or wafer 645 is feasible. Moreover, as can be appreciated, a flexible circuit can provide high performance relative to a circuit board. It should be noted that although the substrate 646 is shown as a separate component, in one embodiment, the flexible circuit 690 can be substituted for the substrate 646, and, therefore, the use of the substrate 646 is optional in the wafer package 640. Thus, as can be appreciated, a signal board connector can, but need not, be mounted on a circuit board.

It should also be noted that a flexible circuit that is often formed by KAPTON but can also be a rigid-flex circuit can be made of polyimide, acrylate adhesive, epoxy adhesive, fluoropolymer. A solution of a binder is formed. Thus, the choice of materials is not intended to be limiting, as the design of the system allows even relatively poor materials like FR4 to be effectively used. It is expected that the system will provide less loss than the 2dB loss due to the board, and in some cases, the loss between the wafer and the signal board connector can be less than 1 dB.

The description provided herein describes various features by means of its preferred and exemplary embodiments. Numerous other embodiments, modifications, and variations can be made by those skilled in the art in the scope of the appended claims.

30‧‧‧Second connector
45‧‧‧ solder bumps
47‧‧‧Substrate
47a‧‧‧Underside
48‧‧‧through holes, microvias or traces
49‧‧‧Contacts
50‧‧‧ Computing equipment
51‧‧‧ solder bumps
52‧‧‧ wafer
52-1‧‧‧ Chip package
52-2‧‧‧ motherboard
52a, 52b, 52c‧‧‧ conductive traces
53‧‧‧Substrate
54‧‧‧ Chip package
54-1‧‧‧ Traces
54-2‧‧‧Contact pads
54-3‧‧‧ Termination area
54-4‧‧‧Edge
54-5‧‧‧ Sealing body
55‧‧‧ side wall
56‧‧‧First Wall
57‧‧‧ second wall
58‧‧‧Power supply
59‧‧‧ Refrigeration components
60‧‧‧ Cable
61‧‧‧Signal conductor
61-1‧‧‧ dielectric coating
61-2‧‧‧Addition line
61-3‧‧‧ outer shield
61-4‧‧‧Outer insulation skin
62‧‧‧ motherboard
63‧‧‧Shell
63'‧‧‧Shell
63a'‧‧‧ partition wall
63b'‧‧‧ tail
64a, 64b‧‧‧ side wall
65‧‧‧ Back wall
66‧‧‧Wire-to-board connector
67‧‧‧ entrance
68‧‧‧ bottom wall
69‧‧‧ feet
70‧‧‧Socket connector
71‧‧‧ radiator
72‧‧‧floor
73‧‧‧ Side connecting wings
74‧‧‧ openings
75‧‧‧ inner wing
75a‧‧‧Contact sheet
76‧‧‧Snap or sheet
77a, 77b‧‧‧bump or flange
78‧‧‧Internal
79‧‧‧ top wall
80, 80'‧‧‧ first connector
Port 80a'‧‧‧
81‧‧‧ access opening
82‧‧‧heat transfer element
84‧‧‧ base
85‧‧‧Bottom contact surface
86‧‧‧ Holder
87‧‧‧ top board
88‧‧‧Contact arm
89‧‧‧EMI gasket
90‧‧‧Back cover
91‧‧‧ recess
92‧‧‧ Herringbone EMI Gasket
94‧‧‧ Groove
95‧‧‧Joint hook
96‧‧‧ highlight sheet
97‧‧‧ Groove
99‧‧‧fasteners
100‧‧‧With screw bosses
102a, 102b‧‧‧ EMI Absorbing Pad
103‧‧‧ ribs
104, 104a, 104b‧‧‧ connection elements
106‧‧‧After opening
106a, 106b‧‧‧ side wall
108‧‧‧Ontology
109‧‧‧ card slot
110‧‧‧Danger prevention channel
110a, 110b‧‧‧ legs
111‧‧‧Terminal receiving cavity
115a, 115b‧‧‧ terminals
116‧‧‧ tail
120‧‧‧ screws
121‧‧‧Wire
121a, 60a‧‧‧Free end
122‧‧‧ openings
123‧‧‧Interior screw
123a‧‧‧Female
124‧‧‧Retaining strip
125‧‧‧ Grounding plate
125a‧‧‧ board
126‧‧‧Contact leg
127‧‧‧ screws
128‧‧‧Contacts
130‧‧‧   nest
132‧‧‧Frame
133‧‧‧ wall
134‧‧‧ bottom wall
135‧‧‧ openings
136‧‧‧ Groove
138‧‧‧ recess
140‧‧‧Cylinder
141‧‧‧ hole
142‧‧‧ Ground plane
144‧‧‧ buckle
146‧‧‧ openings
148‧‧‧ top
150‧‧‧Installation of the nest
152‧‧‧ base
153‧‧‧Extended side wall
154‧‧‧Connection flange
155‧‧‧ openings
156‧‧‧ panel
163‧‧‧ first end
164‧‧‧ second end
200, 201, 202‧‧‧ components
222‧‧‧ housing
224‧‧‧ Back wall
226‧‧‧Internal space
229‧‧‧Internal cabin
230‧‧‧ front opening
232‧‧‧ openings
233‧‧‧ top surface
240‧‧‧heatsink assembly
241‧‧‧Heat Transfer Department
242‧‧‧ base
244‧‧‧ skirt
246‧‧‧ recess
247‧‧‧EMI gasket
248‧‧‧Flexible fingers
250‧‧‧ Thermal contact surface
252‧‧‧ Department of heat dissipation
254‧‧‧ base
256‧‧‧ Heatsink
258‧‧‧Refrigeration channel
260‧‧‧ Holder
262‧‧‧ Rivets
263‧‧‧Vertical column
264‧‧‧ openings
265‧‧‧ base
267‧‧‧Flexible arm
268‧‧‧Free end
269‧‧‧ root
271‧‧‧Socket connector
272‧‧‧ wire
274‧‧‧heat transfer element
275‧‧‧heat pipe
278‧‧‧ trench
279‧‧‧Evaporation zone
280‧‧‧Condensation zone
282‧‧‧ lumen
283‧‧‧ side wall
284‧‧‧ wick
290‧‧‧heat pipe
300‧‧‧ Computing equipment
301‧‧‧Base
305a‧‧‧ first wall
305b‧‧‧ second wall
312‧‧‧ main board
321‧‧‧First connector
322‧‧‧ Cable
330‧‧‧Power connection device
331‧‧‧Second connector
332‧‧‧ Cable
340‧‧‧ Chip package
400‧‧‧ Computing equipment
401‧‧‧Base
405a‧‧‧ first wall
405b‧‧‧ second wall
406‧‧‧ main board
407‧‧‧Electronic component circuit
408‧‧‧Support connection device
410‧‧‧Signal board
411‧‧‧ front board
411a‧‧‧Connector support
421‧‧‧First connector
Port 421a‧‧‧
422‧‧‧ Cable
422a‧‧‧ first end
422b‧‧‧ second end
423‧‧‧ first board connector
426‧‧‧Signal board connector
426a‧‧‧Base
429‧‧‧ terminals
431‧‧‧Second connector
432‧‧‧ Cable
432a‧‧‧ first end
432b‧‧‧second end
440‧‧‧ Chip package
441‧‧‧ Refrigeration seat
441a‧‧‧Refrigeration base
441b‧‧‧Refrigeration heat sink
442‧‧‧heating frame
443‧‧‧ Thermal compound
445‧‧‧ wafer
522‧‧‧ Cable
523‧‧‧ first board connector
523a‧‧‧Base
526‧‧‧Signal board connector
527a‧‧‧Base
527b‧‧‧shell
527c‧‧‧ legs
528a‧‧‧Pressure element
528b‧‧‧Actuating element
614‧‧‧Support layer
626‧‧‧Signal board connector
640‧‧‧chip package
645‧‧‧ wafer
646‧‧‧Substrate
690‧‧‧Flexible circuit
F‧‧‧vertical plane
H1, H2‧‧‧ water level
R‧‧‧ Space

The present invention is illustrated by way of example, and not limitation, in the FIG Where the top cover of the electronic device is removed and shows the overall layout of the components of the device and a bypass cable assembly is located within the device; Figure 2 is the same view as Figure 1, with the bypass assembly for clarity Figure 2A is a perspective view of the bypass only assembly of Figure 2; Figure 2B is the same view as Figure 2A, but with the wafer package substrate and/or seal removed for clarity; Figure 2C Is an enlarged detail view of the termination area around a wafer for the bypass assembly of FIG. 1; FIG. 2D is a perspective view of the end of a twinaxial cable for the bypass assembly; FIG. 3A is a known A schematic cross-sectional view of a structure conventionally used to connect a chip package to a host through an arrangement of wires disposed through a motherboard or on a motherboard in an electronic device (such as a router, switch, etc.) Board; Figure 3B is a schematic A cross-sectional view, similar to FIG. 1A, but showing the structure of a bypass assembly as shown in FIG. 1 for attaching a wafer package to a connector or other connector of the device of FIG. Thus, in the apparatus of FIG. 1, the use of conductive traces on the motherboard as signal transmission lines is eliminated as shown; FIG. 4 is a perspective view of a cable-direct connector assembly constructed in accordance with the principles; 4A is a cross-sectional view of the connector assembly of FIG. 4 taken along line AA thereof; FIG. 5 is an exploded view of a housing and the cable-direct connector assembly of FIG. 4; FIG. 5A is the same view as FIG. , wherein the receptacle connector is located within the housing and the bottom portion is secured to the side wall of the housing; FIG. 6 is a perspective view from below of the housing of FIG. 5 with the bottom wall removed and the connector assembly removed from the housing; Figure 6A is the same view as Figure 6, but with the connector assembly in the housing; Figure 6B is the same view as Figure 6A, but with the bottom wall in place to seal the cable direct connector assembly within the housing; Figure 7 is an exploded view of a portion of the connector assembly of Figure 4; 8 is a more exhaustive exploded view of the connector assembly of FIG. 7; FIG. 8A is an exploded view of a terminal array for the connector assembly of FIG. 4, its associated ground plate, and a corresponding set of cables and wires Figure 8B is the same view as Figure 8A but showing the components in an assembled state to form a basic connecting element; Figure 8C is the two basic connecting elements assembled to form a socket connector terminal array Figure 8D is an enlarged detail view of two of the plurality of cables in a connecting element, showing an elevated ground plate structure for use therewith; Figure 9 is a perspective view of the housing Front view showing a portion of the edge card in contact with the contact portion of the terminal of the connector assembly; Figure 10 is an enlarged detail view of the bottom of the rear end of a housing with the connector assembly in place; Figure 11 is a housing Figure 11A is a cross-sectional view of the connector of Figure 11 taken along line AA thereof; Figure 11B is a side view of Figure 11A; Figure 12 is the connector of Figure 11 a perspective view from the rear of the opposite side Figure 13 is a bottom plan view of the connector of Figure 6A with the bottom removed for clarity; Figure 13A is a cutaway view of an empty housing with internal connectors and heat transfer elements not in place; Figure 14 is a top plan view of the housing with the top wall removed from the housing and a portion of an edge card engaging the inner connector; Figure 14A is the same view as Figure 14, but at a height below the rear cover Divided horizontally to show the manner in which the inner connector and the inner connector engage the body of the housing; FIG. 14B is a vertical cross-sectional view of the front portion of the connector near the interior of the housing, wherein For the sake of clarity, a portion of the inner housing is removed to show the hollow interior of the housing and the ribs therein, the ribs contacting the connecting elements and holding an EMI absorbing pad within the housing; FIG. 15 is a a perspective view of the housing, wherein the heat transfer element and the light indicator are vertically stacked on a circuit board; FIG. 15A is an exploded view of FIG. 15; and FIG. 16 is a three-shell arrangement in a horizontal direction Vertically placed on three panels of a device (face pla Figure 16A is an exploded view of a vertical housing and panel mounting assembly: Figure 17 is a perspective view of a housing in which a modified heat sink assembly constructed in accordance with the principles is mounted Figure 18 is an exploded perspective view of the housing-heat sink assembly of Figure 17, with the heat sink assembly member removed from engagement with the top of the housing for clarity; Figure 18A is an exploded view of Figure 18 A side view in which the components shown herein are shown along line CC of Figure 17; Figure 19 is a front elevational view of the housing-heatsink assembly of Figure 17 taken along line 3-3 thereof; Figure 19A Figure 19B is a plan view of the housing-heatsink assembly of Figure 17; Figure 19C is a top view of the housing-heatsink assembly of Figure 17; Figure 19D is a transverse cross-sectional view taken from the heat transfer portion of the heat sink assembly of Figure 17 taken from the housing-heat sink assembly; Figure 19E is a cross-sectional view taken along the line DD of Figure 17 from the heat transfer portion of the heat sink assembly of Figure 17; Figure 19E is Figure 19E The same view, but for the sake of clarity, the heat pipe is removed from the heat sink assembly and its A pair of heat pipes of the alternative structure are shown in phantom; FIG. 19F is a lateral view taken from the rear of the heat sink of the heat sink assembly of FIG. 17 taken along the line FF of FIG. Figure 19G is a transverse cross-sectional view taken from the front of the housing-heat sink assembly taken along the line GG of Figure 17 from the heat sink of the heat sink assembly of Figure 17, showing the heat sink and connector wires Figure 20 is a perspective view of an alternative housing structure; Figure 21 is a perspective view of an embodiment of a computing device; Figure 22 is a perspective view of another embodiment of a computing device; Figure 22 is a simplified perspective view of an embodiment of a bypass system; Figure 25 is a simplified partial exploded view of an embodiment of a bypass system; Figure 26 is a wafer package Figure 27 is a simplified perspective view of an embodiment of a signal circuit board structure; Figure 28A is a perspective view of a connector system suitable for connection to a signal circuit board; a perspective view of an embodiment; 28B is another perspective view of the embodiment shown in Fig. 29A; and Fig. 29 is a schematic view of an alternative embodiment of a wafer package.

30‧‧‧Second connector

50‧‧‧ Computing equipment

52‧‧‧ wafer

54‧‧‧ Chip package

54-5‧‧‧ Sealing body

55‧‧‧ side wall

56‧‧‧First Wall

57‧‧‧ second wall

58‧‧‧Power supply

59‧‧‧ Refrigeration components

62‧‧‧ motherboard

80‧‧‧First connector

Claims (7)

A computing device comprising: a housing having a first wall; a chip package including a wafer electrically coupled to a first signal board connector; a first connector supported adjacent the first wall, The first connector includes a housing having a pair of interfaces and a base, the base supporting a first pair of terminals, each of the terminals of the first pair of terminals each having a contact in the docking interface a first cable having a pair of conductors, the cable includes a first end and a second end, the first end of the cable is connected to the first pair of terminals; a connector, the first board connector terminating at a second end of the first cable and configured to interface with the first signal board connector; and an electronic component circuit providing power to the wafer. The computing device of claim 1, wherein the wafer is supported by a signal board and the first signal board connector is mounted on the signal board. The computing device of claim 2, wherein the housing comprises a second wall, the computing device comprising a second connector supported adjacent the second wall, the second connector terminating a second end of the second cable, the second cable has a second end connected to a second board connector, wherein the signal circuit board supports a second signal board connector The second signal board connector is electrically connected to the wafer, and the second board connector is configured to interface with the second signal board connector. The computing device of claim 1 wherein the wafer package comprises a substrate supporting the wafer. The computing device of claim 4, wherein the substrate is supported by a signal board that does not extend to the first connector. The computing device of claim 5, wherein the first connector is supported by a tray. The computing device of claim 1, wherein the wafer is electrically coupled to a plurality of signal board connectors, and wherein the plurality of signal board connectors are each docked to a different first connection via a respective board connector Device.