TW201707819A - A method for manufacturing a resin diamond wire saw and a resin diamond wire saw - Google Patents

Abstract

A method for manufacturing a resin diamond wire saw includes obtaining a modified composite diamond, obtaining a modified composite silicon carbide, performing a mixing step and performing a coating step. Performing the mixing step is fully mixing the modified composite diamond, the modified composite silicon carbide, a thermosetting phenolic resin, a silicone coupling agent and a water to obtain a coating composite. Performing the coating step is coating uniformly the coating composite on an etched carbon steel wire and baking heat cured to obtain the resin diamond wire saw. The method for manufacturing the resin diamond wire saw of the disclosure of the present invention is characterized in increasing the adhesion between the coating composite and the etched carbon steel wire so as to enhance the cutting ability and the cutting life of the resin diamond wire saw.

Description

Resin diamond wire saw manufacturing method and resin diamond Wire saw

The invention relates to a method for manufacturing a resin diamond wire saw and a resin diamond wire saw, in particular to a method for manufacturing a resin diamond wire saw for cutting a wafer wafer or a sapphire substrate, and a resin diamond wire saw.

The wire cutting machine that cuts the twin column into a wafer wafer is one of the main equipments in the solar and semiconductor industries. The wire cutting machine is not only a device with high loss rate, but also a traditional carbonized wire cutting machine component. It is easy to be out of stock due to foreign material control, which will make the solar and semiconductor industry production lines face the dilemma. Therefore, in recent years, the solar and semiconductor industries at home and abroad have been actively evaluating cutting machines that introduce resin diamond wire saws.

The resin diamond wire saw cutting machine has the advantages of low production cost and fast production speed. The resin diamond wire saw on the general market usually has a carbon steel wire surface covering a resin composite containing a resin, a solvent, a filler, a coupling agent and the like. And the diamond is adhered to the resin composite for wafer wafer cutting. However, the resin composite of such a resin diamond wire saw is respectively between carbon steel wire and diamond. The adhesiveness is not good, and the structural strength, mechanical properties, heat resistance and thermal conductivity of the resin composite itself are insufficient, so that the resin diamond wire saw itself is easily caused by the friction and heat generated by the cutting process to make the diamond and the resin composite from carbon. The steel wire is peeled off and cannot be cut, which affects the cutting ability and cutting life of the resin diamond wire saw, thereby reducing the cutting capacity of the wafer wafer and increasing the production cost.

Therefore, in the current resin and diamond wire saw market, we are introducing a resin diamond wire saw manufacturing method and a resin diamond wire saw. By using the resin diamond wire saw manufacturing method, a resin diamond capable of maintaining cutting ability and extending cutting life can be obtained. Wire saw.

The invention provides a method for manufacturing a resin diamond wire saw, which comprises the steps of forming a modified composite diamond and forming a modified tantalum carbide, wherein a step of forming an etched carbon steel wire is added to increase the coating composition and the etched carbon steel. The adhesion between the wires and the coating itself, and the overall structural strength, heat resistance and thermal conductivity of the coating composition are enhanced. Therefore, the resin diamond wire saw obtained by the method for manufacturing a resin diamond wire saw according to the present invention is less likely to cause peeling of the modified composite diamond or the coating composition in the coating composition during the cutting process, thereby improving the cutting of the resin diamond wire saw. Ability and cutting life.

One embodiment of the present invention provides a method for producing a resin diamond wire saw, comprising forming a modified composite diamond, forming a modified tantalum carbide, performing a mixing step, and performing a coating step. Forming a modified composite diamond system, mixing the composite diamond, the decane coupling agent and water at 50 to 90 ° C for 3 to 6 hours, and drying at 90 to 150 ° C to obtain a modified composite diamond, wherein the composite diamond has The metal plating layer has a composite diamond of 100 parts by weight, a decane coupling agent of 5 to 20 parts by weight, and water of 400 to 800 parts by weight. Forming a modified tantalum carbide system, the carbonized niobium particles, the decane coupling agent and water are stirred at 50 to 90 ° C for 3 to 6 hours, and dried at 90 to 150 ° C to obtain a modified niobium carbide, wherein the niobium carbide particles are 100 parts by weight, the decane coupling agent is 5 to 20 parts by weight, and the water is 400 to 800 parts by weight. In the mixing step, the modified composite diamond, the modified tantalum carbide, the thermosetting phenolic resin, the decane coupling agent and the water are thoroughly stirred to obtain a coating composition, wherein the modified composite diamond is 80 to 180 parts by weight, and the carbonization is modified. The hydrazine is 30 to 90 parts by weight, the thermosetting phenol resin is 100 parts by weight, the decane coupling agent is 1 to 10 parts by weight, and the water is 10 to 100 parts by weight. The coating step is performed by uniformly coating the coating composition on an etched carbon steel wire, and baking and curing at 180 to 250 ° C for 7 to 10 hours to obtain a resin diamond wire saw.

According to the foregoing embodiment, the present invention increases the adhesion between the coating composition and the etched carbon steel wire and the coating composition itself by forming the modified composite diamond and forming the modified cerium carbide, and enhancing the coating. The overall structural strength, heat resistance and thermal conductivity of the composition.

In an embodiment, the method for manufacturing the resin diamond wire saw may further comprise forming an etched carbon steel wire by immersing the carbon steel wire in an acid etching solution at 30 to 60 ° C for 5 to 10 seconds and baking at 150 to 200 ° C. Dry to obtain an etched carbon steel wire. The method for manufacturing the resin diamond wire saw may further comprise forming an etched carbon steel wire by immersing the carbon steel wire in an acid etching solution at 30 to 60 ° C for 5 to 10 seconds, rinsing with deionized water for 20 to 40 seconds, and at 150 Dry at ~200 °C to obtain an etched carbon steel wire. The acid etching solution may be an aqueous solution of an acidic substance and hydrogen peroxide, and the weight concentration of the acidic substance and hydrogen peroxide is 1 to 10%. The aforementioned acidic substance may be HCl or H ₂ SO ₄ . The composite diamond may have a particle diameter of 0.5 μm to 30 μm. The metal plating of the aforementioned composite diamond may comprise nickel, copper, titanium or a combination thereof. The aforementioned decane coupling agent may comprise an epoxy group, an amine group, an isocyanato group, a phosphorus group, a sulfur group or a combination thereof. The particle size of the foregoing cerium carbide particles may be from 0.05 μm to 0.5 μm.

Another embodiment of the present invention is a resin diamond wire saw which is a resin diamond wire saw obtained by the above-described method of manufacturing a resin diamond wire saw.

According to the foregoing embodiment, the resin diamond wire saw obtained by the method for producing a resin diamond wire saw of the present invention is less likely to cause peeling of the modified composite diamond or the coating composition in the coating composition during the cutting process to enhance the resin diamond. The cutting ability and cutting life of the wire saw.

S100‧‧‧ steps

S200‧‧‧ steps

S300‧‧‧ steps

S400‧‧‧Steps

S500‧‧‧Steps

600‧‧‧Resin Diamond Wire Saw

610‧‧‧Cover composition

611‧‧‧Modified composite diamond

620‧‧‧etched carbon steel wire

1 is a flow chart showing a method of manufacturing a resin diamond wire saw according to a first embodiment of the present invention; and FIG. 2 is a view showing a resin diamond wire saw obtained by the method for manufacturing a resin diamond wire saw according to a first embodiment of the present invention. FIG. 3A is a scanning electron microscope image of a composite diamond according to a first embodiment of the present invention; FIG. 3B is a scanning electron microscope image of the modified composite diamond according to the first embodiment of the present invention; 3C is a thermogravimetric analysis map of the composite diamond of the first embodiment of the present invention; 3D is a thermogravimetric analysis map of the modified composite diamond according to the first embodiment of the present invention; FIG. 4A is a 3D optical microscope image of the etched carbon steel wire according to the first embodiment of the present invention; 3 is a three-dimensional optical microscope image of a resin diamond wire saw according to a first embodiment of the present invention; and FIG. 5 is another flow chart showing a method for manufacturing a resin diamond wire saw according to a first embodiment of the present invention; The three-dimensional optical microscope image of the carbon steel wire according to the first embodiment of the present invention is shown; FIG. 6B is a three-dimensional optical microscope image of the etched carbon steel wire according to the first embodiment of the present invention; Another image of the three-dimensional optical microscope of the etched carbon steel wire according to the first embodiment of the present invention; FIG. 6D is a scanning electron microscope image of the carbon steel wire of the first embodiment of the present invention; FIG. 6E is a diagram Scanning electron microscope image of the etched carbon steel wire according to the first embodiment of the present invention; FIG. 6F is another image of the scanning electron microscope of the etched carbon steel wire according to the first embodiment of the present invention; The resin diamond wire saw of the first embodiment of the present invention is shown Three-dimensional optical microscope image of the cut front; of FIG. 7B shows a resin-based diamond wire saw of the first embodiment of the present invention is a three-dimensional image of the broken optical microscope; 8A is a three-dimensional optical microscope image of a resin diamond wire saw of a comparative example before being cut; FIG. 8B is a three-dimensional optical microscope image of a resin diamond wire saw of a comparative example after being broken; 9 is a view showing the depth of cut and time chart of the resin diamond wire saw of the first embodiment and the comparative example of the present invention.

<First Embodiment>

1 and 2, FIG. 1 is a flow chart showing a method of manufacturing a resin diamond wire saw 600 according to a first embodiment of the present invention, and FIG. 2 is a view showing a resin diamond according to a first embodiment of the present invention. A schematic view of a resin diamond wire saw 600 obtained by the method of manufacturing the wire saw 600. The manufacturing method of the resin diamond wire saw 600 of the first embodiment includes the step of forming the modified composite diamond 611 in the step S100, the formation of the modified carbonized niobium in the step S200, the mixing step in the step S300, and the coating step in the step S500.

The modified composite diamond 611 in step S100 is compounded with a composite diamond, a decane coupling agent and water at 50 to 90 ° C for 3 to 6 hours, and dried at 90 to 150 ° C to obtain a modified composite diamond 611, wherein The composite diamond has a metal plating layer, and the composite diamond is 100 parts by weight, the decane coupling agent is 5 to 20 parts by weight, and the water is 400 to 800 parts by weight.

Step S200 forms a modified tantalum carbide system. The lanthanum carbide (SiC) particles, the decane coupling agent and water are stirred at 50 to 90 ° C for 3 to 6 hours, and dried at 90 to 150 ° C to obtain a modified tantalum carbide. Where the niobium carbide particles are 100 The decane coupling agent is 5 to 20 parts by weight, and the water is 400 to 800 parts by weight. The steps S100 and S200 have no fixed sequence, that is, the sequence of steps S100 and S200 can be reversed.

The step of mixing in step S300 is to thoroughly mix the modified composite diamond 611, the modified tantalum carbide, the thermosetting phenolic resin, the decane coupling agent and water to obtain a coating composition 610, wherein the modified composite diamond 611 is 80-180. The weight of the modified tantalum carbide is 30 to 90 parts by weight, the thermosetting phenol resin is 100 parts by weight, the decane coupling agent is 1 to 10 parts by weight, and the water is 10 to 100 parts by weight. Compared with the thermoplastic phenolic resin commonly used in resin diamond wire saws on the market, the thermosetting phenolic resin used in the present invention has better heat resistance and mechanical strength, so that the modified composite diamond 611 is not easily peeled off by the coating composition 610. .

The present invention uses a composite diamond having a metal plating layer, which can improve the wettability of the modified composite diamond 611 in step S300 due to the rough surface of the metal plating layer, and the modified composite diamond 611 is pretreated with a decane coupling agent to be modified. The thin layer of the decane coupling agent formed on the surface of the composite diamond 611 contains an organic functional group which can form a chemical bond with the thermosetting phenol resin. The decane coupling agent has a chemical formula of YSiX ₃ , wherein the Y-based non-hydrolyzable group can produce an organic functional group after mixing water, an X-based hydrolyzable group, and X can be each independently. The coated composition 610 of the present invention and the modified composite diamond 611 therein have better adhesion and bonding ability to each other than the diamond of the resin diamond wire saw on the market is not modified as in the step S100.

Please refer to FIG. 3A, FIG. 3B, FIG. 3C and FIG. 3D. FIG. 3A is a diagram showing the scanning electron of the composite diamond according to the first embodiment of the present invention. Microscope (SEM) image, FIG. 3B is a scanning electron microscope image of the modified composite diamond 611 of the first embodiment of the present invention, and FIG. 3C is a diagram showing the heat of the composite diamond of the first embodiment of the present invention. The re-analysis map, the 3D diagram shows the thermogravimetric analysis map of the modified composite diamond 611 of the first embodiment of the present invention. Both Fig. 3A and Fig. 3B are images of 8000 times that of a scanning electron microscope (SEM), compared with the composite diamond of Fig. 3A, and Fig. 3B is modified by the pretreatment of the decane coupling agent in step S100. The surface of diamond 611 forms a thin layer of a decane coupling agent that contains an organic functional group that can chemically bond with the thermosetting phenolic resin. 3C and 3D, it can be seen that the modified composite diamond 611 after the step S100 in FIG. 3D shows the adhesion amount of the decane coupling agent by thermogravimetric analysis (TGA) as compared with the composite diamond of FIG. 3C. It is 1.24% by weight.

Furthermore, since the modified tantalum carbide has good thermal conductivity and heat resistance, it is advantageous to improve the structural strength, heat resistance and thermal conductivity of the coating composition 610. And the modified tantalum carbide is pretreated with a decane coupling agent, so that the thin layer of the decane coupling agent formed on the surface of the modified tantalum carbide contains an organic functional group, and can form a chemical bond with the thermosetting phenolic resin, so the coating of the present invention The composition 610 has better adhesion and bonding ability to each other.

In addition, the appropriate ratio between the modified composite diamond 611, the modified tantalum carbide, the thermosetting phenolic resin, the decane coupling agent and the water of the present invention can effectively improve the cutting ability and the cutting life of the resin diamond wire saw 600.

The coating step of step S500 is performed by uniformly coating the coating composition 610 on the etched carbon steel wire 620, and baking and curing at 180 to 250 ° C for 7 to 10 hours to obtain a resin diamond wire saw 600. By the modification of step S200 The modification function of the cerium carbide to the thermosetting phenolic resin, the decane coupling agent of the step S100, the step S200 and the step S300 is used to increase the thermosetting phenolic resin and the inorganic substance (etched carbon steel wire 620, modified composite diamond 611, modified strontium carbide) The compatibility between the structural composition, the mechanical properties, the heat resistance properties, and the thermal conductivity of the coating composition 610 is improved. Compared with the resin and diamond wire saw of the market, the diamond and the resin are not modified as in step S100 and step S200, and the resin diamond wire saw 600 obtained by the manufacturing method of the resin diamond wire saw 600 of the present invention can effectively reduce defects. The coating composition 610 and the modified composite diamond 611 produced by the force and heat during the wafer cutting process are peeled off by the etched carbon steel wire 620, so that the resin diamond wire saw 600 has superior cutting ability and Long cutting life.

Please refer to FIG. 4A and FIG. 4B , FIG. 4A is a three-dimensional optical microscope image of the etched carbon steel wire 620 according to the first embodiment of the present invention, and FIG. 4B is a resin diamond according to the first embodiment of the present invention. A three-dimensional optical microscope image of a wire saw 600. 4A and 4B are 1000-times images of a three-dimensional optical microscope, wherein the etched carbon steel wire 620 of FIG. 4A is obtained by the resin diamond wire saw 600 in step S500, as shown in FIG. 4B.

In detail, please refer to FIG. 5, which is another flow chart showing a method of manufacturing the resin diamond wire saw 600 according to the first embodiment of the present invention. The manufacturing method of the resin diamond wire saw 600 of the first embodiment further comprises forming the etched carbon steel wire 620 in step S400 by immersing the carbon steel wire in an acid etching solution at 30 to 60 ° C for 5 to 10 seconds, and at 150 to 200. Dry at °C to obtain an etched carbon steel wire 620. Step S400 forms an etched carbon steel wire, and can be immersed in an acid etchant at 30-60 ° C for 5-10 seconds after carbon steel wire, and rinsed with deionized water. After 20 to 40 seconds, it is dried at 150 to 200 ° C to obtain an etched carbon steel wire 620. There is no fixed sequence of steps S400 and S100, and steps S200 and S300. Step S400 only needs to be before step S500. Compared with the carbon steel wire of the resin diamond wire saw on the market, which is not etched as in step S400, the present invention performs acid etching pretreatment on the carbon steel wire in step S400 to peel off the copper covered by the surface of the carbon steel wire and carbon. The surface of the steel wire is roughened to form an etched carbon steel wire 620, so that the coating composition 610 can have better wettability on the surface of the etched carbon steel wire 620, thereby improving the mechanical anchoring effect between the two, thereby increasing the coating composition. The adhesion between the object 610 and the etched carbon steel wire 620 prevents the cladding composition 610 from being easily peeled off by the etched carbon steel wire 620 during the cutting process.

In step S400, the acid etching solution may be an aqueous solution of an acidic substance and hydrogen peroxide, and the weight concentration of the acidic substance and hydrogen peroxide (H ₂ O ₂ ) is 1 to 10%, wherein the acidic substance may be HCl or H ₂ SO. ₄ . Thereby, it is advantageous to increase the adhesion between the coating composition 610 and the etched carbon steel wire 620, so that the coating composition 610 is not easily peeled off by the etched carbon steel wire 620 during the cutting process.

Please refer to FIG. 6A, FIG. 6B, FIG. 6C, FIG. 6D, FIG. 6E and FIG. 6F. FIG. 6A is a three-dimensional optical microscope image of the carbon steel wire according to the first embodiment of the present invention. 6B is a three-dimensional optical microscope image of the etched carbon steel wire 620 according to the first embodiment of the present invention, and FIG. 6C is another image of the three-dimensional optical microscope of the etched carbon steel wire according to the first embodiment of the present invention. 6D is a scanning electron microscope image of a carbon steel wire according to a first embodiment of the present invention, and FIG. 6E is a scanning electron microscope image of the etched carbon steel wire 620 according to the first embodiment of the present invention. Fig. 6F is another image of a scanning electron microscope of the etched carbon steel wire of the first embodiment of the present invention. Figures 6A and 6D show carbon steel wires without step S400. The first picture shows 6B through FIG. 6E second step of etching the carbon steel wire 620 S400, and the acid etchant is HCl and hydrogen peroxide (H ₂ O ₂₎ aqueous solution. 6C and 6F are etched carbon steel wires through step S400, wherein the acid etching solution is an aqueous solution of H ₂ SO ₄ and hydrogen peroxide (H ₂ O ₂ ).

The composite diamond may have a particle diameter of 0.5 μm to 30 μm. Thereby, the resin diamond wire saw 600 is favorably provided with good cutting ability and maintains a stable adhesive force with the coating composition 610.

The metal plating of the composite diamond may comprise nickel, copper, titanium or a combination of the foregoing. Thereby, the modified composite diamond 611 can be improved in wettability in step S300 due to the rough surface of the metal plating layer, which is advantageous for the coating composition 610 and the modified composite diamond 611 therein to have better adhesion and bonding ability to each other.

The decane coupling agent may comprise an epoxy group, an amine group, an isocyanato group, a phosphorus group, a thio group or a combination of the foregoing. Thereby, the thin layer of the decane coupling agent formed on the surface of the modified composite diamond 611 and the modified tantalum carbide can contain an organic functional group to generate a chemical bond with the thermosetting phenol resin, which is advantageous for coating the composition 610 with The modified composite diamond 611 has better adhesion and bonding ability to each other.

The particle size of the niobium carbide particles may be from 0.05 μm to 0.5 μm. Thereby, the particle size of the cerium carbide particles used in the resin diamond wire saw on the market is more than 2 μm, and the dispersibility thereof is not good. The present invention forms the modified cerium carbide with the particle size of the smaller cerium carbide particles. Therefore, it is advantageous to improve the structural strength, heat resistance and thermal conductivity of the coating composition 610.

According to the above, the parameters of the respective steps in the method of manufacturing the resin diamond wire saw 600 according to the first embodiment of the present invention are described in the following Table 1.

<Second embodiment>

The manufacturing method of the resin diamond wire saw of the second embodiment of the present invention is the same as that of the first embodiment, and will not be described herein. The parameters of each step are described in the following Table 2.

<Third embodiment>

The manufacturing method of the resin diamond wire saw of the third embodiment of the present invention is the same as that of the first embodiment, and the details of each step are described in the following Table 3.

<Fourth embodiment>

The manufacturing method of the resin diamond wire saw of the fourth embodiment of the present invention is the same as that of the fourth embodiment, and the details of each step are described in the following Table 3.

<Comparative example>

The comparative example is a resin diamond wire saw on the market, which is obtained without the steps S100, S200, S300, S400 and S500 of the method for manufacturing the resin diamond wire saw of the present invention, that is, the composite diamond of the resin diamond wire saw of the comparative example has not been obtained. The modification, the carbonized niobium particles are not modified, the carbon steel wire is not etched, the composition and ratio of the resin composite are not within the scope of the present invention, and the manufacturing steps are different from the manufacturing method of the resin diamond wire saw of the present invention. .

Please refer to FIG. 7A, FIG. 7B, FIG. 8A and FIG. 8B. FIG. 7A is a three-dimensional optical microscope image of the resin diamond wire saw 600 of the first embodiment of the present invention before being cut, FIG. 7B A three-dimensional optical microscope image of the resin diamond wire saw 600 of the first embodiment of the present invention after disconnection is shown, and FIG. 8A is a three-dimensional optical microscope image of the resin diamond wire saw of the comparative example before being cut. Fig. 8B is a three-dimensional optical microscope image of the resin diamond wire saw of the comparative example after the disconnection. 7A, 7B, 8A, and 8B are 1000-times images of a three-dimensional optical microscope. Compared with the resin diamond wire saw after the cutting to the disconnection of the comparative example of FIG. 8B, the resin composition of the resin diamond saw 600 of the first embodiment of FIG. 7B after cutting to the broken line and the modification thereof The composite diamond 611 is more than the resin composite and diamond of the resin diamond wire saw of the comparative example of Fig. 8B.

Please refer to FIG. 9. FIG. 9 is a drawing showing the depth of cut and time chart of the resin diamond wire saw of the first embodiment and the comparative example of the present invention. Referring to Table 4 below, FIG. 9 and Table 4 show that the resin diamond wire saw 600 of the first embodiment of the present invention has a cutting life of 38 (minutes), which is a cutting life of the resin diamond wire saw of the comparative example of 29 (minutes). ) is long. Furthermore, the resin diamond wire saw 600 of the first embodiment of the present invention has a depth of cut of 28.0 (mm), which is deeper than the depth of cut of 12.5 (mm) of the resin diamond wire saw of the comparative example, so that the resin diamond wire saw of the present invention Has a superior cutting ability. Accordingly, the resin diamond wire saw obtained by the method for manufacturing a resin diamond wire saw according to the present invention is less likely to cause the peeling of the modified composite diamond or the coating composition in the coating composition during the cutting process, so that the resin diamond wire can be lifted. The cutting life and cutting capacity of the saw.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

S100‧‧‧ steps

S200‧‧‧ steps

S300‧‧‧ steps

S500‧‧‧Steps

Claims (10)

The invention relates to a method for manufacturing a resin diamond wire saw, comprising: forming a plurality of modified composite diamonds, wherein a plurality of composite diamonds, a decane coupling agent and water are stirred at 50 to 90 ° C for 3 to 6 hours, and at 90 to 150 ° C. Drying to obtain the modified composite diamonds, wherein the composite diamonds have a metal plating layer, and the composite diamonds are 100 parts by weight, the decane coupling agent is 5-20 parts by weight, and the water is 400-800 weights. A plurality of modified tantalum carbides are formed by mixing a plurality of carbonized niobium particles, a decane coupling agent and water at 50 to 90 ° C for 3 to 6 hours, and drying at 90 to 150 ° C to obtain the modifications. a cerium carbide, wherein the cerium carbide particles are 100 parts by weight, the decane coupling agent is 5 to 20 parts by weight, and the water is 400 to 800 parts by weight; and a mixing step is performed to modify the composite diamonds, The modified tantalum carbide, thermosetting phenolic resin, decane coupling agent and water are thoroughly stirred to obtain a coating composition, wherein the modified composite diamonds are 80 to 180 parts by weight, and the modified tantalum carbide is 30 ~90 parts by weight, the thermosetting phenolic resin is 100 parts by weight, and the decane coupling agent is 1 to 10 weights The water is 10 to 100 parts by weight; and a coating step is performed by uniformly coating the coating composition on an etched carbon steel wire and baking and curing at 180 to 250 ° C for 7 to 10 hours. Get a resin diamond wire saw. The method for manufacturing a resin diamond wire saw according to claim 1, further comprising: The etched carbon steel wire is formed by immersing a carbon steel wire in an acid etching solution at 30 to 60 ° C for 5 to 10 seconds, and drying at 150 to 200 ° C to obtain the etched carbon steel wire. The method for manufacturing a resin diamond wire saw according to claim 1, further comprising: forming the etched carbon steel wire by immersing a carbon steel wire in an acid etching solution at 30 to 60 ° C for 5 to 10 seconds. Rinse with deionized water for 20 to 40 seconds and dry at 150 to 200 ° C to obtain the etched carbon steel wire. The method for producing a resin diamond wire saw according to the second or third aspect of the invention, wherein the acid etching solution is an aqueous solution of an acidic substance and hydrogen peroxide, and the weight concentration of the acidic substance and the hydrogen peroxide is 1~. 10%. The method for producing a resin diamond wire saw according to claim 4, wherein the acidic substance is HCl or H ₂ SO ₄ . The method for producing a resin diamond wire saw according to the first aspect of the invention, wherein the composite diamond has a particle diameter of 0.5 μm to 30 μm. The method of manufacturing a resin diamond wire saw according to claim 1, wherein the metal plating layer of the composite diamonds comprises nickel, copper, titanium or a combination thereof. The method for producing a resin diamond wire saw according to claim 1, wherein the decane coupling agent comprises an epoxy group, an amine group, an isocyanate group, a phosphorus group, a sulfur group or a combination thereof. The method for producing a resin diamond wire saw according to claim 1, wherein the niobium carbide particles have a particle diameter of 0.05 μm to 0.5 μm. A resin diamond wire saw obtained by the method for producing a resin diamond wire saw according to any one of claims 1 to 9.