TW201641249A - Methods and apparatus for microwave batch curing process - Google Patents

Abstract

In some embodiments, a process chamber for a microwave batch curing process includes: an annular body having an outer surface and an inner surface defining a central opening of the annular body, wherein the inner surface comprises a plurality of angled surfaces defining a first volume; a first lip extending radially outward from the outer surface of the annular body proximate a first end of the annular body; a second lip extending radially outward from the outer surface of the annular body proximate a second end of the annular body; an exhaust disposed between the first lip and the second lip and fluidly coupled to the first volume, wherein the exhaust comprises a plurality of first openings; a plurality of second openings fluidly coupled to the first volume, wherein the plurality of second openings are configured to expose the first volume to microwave energy; and one or more ports fluidly coupled to the first volume.

Description

Method and apparatus for microwave batch curing treatment

Embodiments of the present disclosure generally relate to microwave batch curing processes.

Curing refers to the toughening or hardening of polymeric materials by cross-linking of polymer chains. Conventional curing is accomplished by curing in a furnace that cures at a higher temperature than microwave curing. Conventional curing typically requires more than 6 hours at 220 degrees Celsius. However, the inventors have observed that the microwave curing treatment can be completed in less than one hour at 200 degrees Celsius. Although the oven curing phase is slower than microwave curing, since the conventional curing chamber can handle a large number of semiconductor wafers, it is known that the curing chamber has a faster yield of microwave curing. The inventors therefore believe that it is necessary to have a microwave compatible batch chamber that can match the conventional cure yield without compromising the cure uniformity within the batch.

Thus, the inventors have developed improved methods and apparatus for microwave batch curing processes.

Methods and apparatus for microwave batch curing processes are provided herein. In some embodiments, a processing chamber for a microwave batch curing process includes an annular body having an outer surface and an inner surface defining a central opening of the annular body, wherein the inner surface includes a plurality of slopes a surface, the inclined surface defining a first volume; a first lip extending radially outward from an outer surface of the annular body adjacent the first end of the annular body; a second lip, the first a second lip extending radially outward from an outer surface of the annular body adjacent the second end of the annular body; an exhausting device disposed between the first lip and the second lip and fluidly coupled To a first volume, wherein the venting means includes a plurality of first openings; a plurality of second openings fluidly coupled to the first volume, wherein the plurality of second openings are configured to expose the first volume At the microwave energy; and one or more ports, the port is fluidly coupled to the first volume.

In some embodiments, a processing chamber for a microwave batch curing process includes a plurality of annular bodies configured in a stack, wherein each annular body includes an outer surface and an inner surface defining a center of the annular body An opening, wherein the inner surface includes a plurality of inclined surfaces defining a first volume; a first lip that is radially outward from an outer surface of the annular body adjacent the first end of the annular body Extending; a second lip extending radially outward from an outer surface of the annular body adjacent the second end of the annular body; an exhausting device disposed at the first lip and the second Between the lips, and fluidly coupled to the first volume, wherein the venting means includes a plurality of first openings; a plurality of second openings, the second openings being fluidly coupled to the first volume, wherein the plurality of second The opening is configured to expose the first volume to microwave energy; and one or more ports fluidly coupled to the first volume.

In some embodiments, a method of performing a microwave batch curing process includes the steps of providing a plurality of substrates to a processing chamber, the processing chamber comprising: an annular body having an outer surface and an inner surface, the inner surface Defining a central opening of the annular body, wherein the inner surface includes a plurality of inclined surfaces defining a first volume; a first lip from the annular body adjacent the first end of the annular body An outer surface extending radially outward; a second lip extending radially outward from an outer surface of the annular body adjacent the second end of the annular body; an exhaust device disposed at the first Between a lip and a second lip, and fluidly coupled to the first volume, wherein the venting means includes a plurality of first openings; a plurality of second openings, the second openings being fluidly coupled to the first volume, Where the plurality of second openings are configured to expose the first volume to microwave energy; and one or more ports that are fluidly coupled to the first volume; forming a true ; And a plurality of substrates in the device is exposed to microwaves.

Other and further embodiments of the present disclosure are described below.

Methods and apparatus for improved microwave batch curing processes are provided herein. The present disclosure provides an improved microwave batch curing apparatus that can be used with a variety of microwave frequencies for semiconductor processing. Apparatus embodiments of the present disclosure may advantageously provide one or more of: uniformly diffusing microwaves throughout the device; minimizing or eliminating microwave leakage from the device, achieving appropriate vacuum conditions, or minimizing particle generation Or eliminate. Moreover, the device embodiments of the present disclosure may be utilized in an elastic configuration that advantageously provides for varying amounts of substrate processing.

1 and 2 depict schematic diagrams of a processing chamber 132 for a microwave batch curing process, in accordance with some embodiments of the present disclosure. Processing chamber 132 includes an annular body 100. The annular body has a thickness sufficient for use as a microwave chamber and for assembly and for batch processing of substrates, as disclosed herein. In some embodiments, the annular body 100 has a thickness of approximately 1 inch. In some embodiments, the annular body 100 has an outer dimension of about 22 inches by 22 inches by 8 inches, although other dimensions can be used, for example, when processing substrates having smaller or larger dimensions. In some embodiments, the annular body 100 is constructed of aluminum. For example, in some embodiments, the annular body 100 is constructed of alimex material.

In some embodiments, the processing chamber includes one or more cooling passages to circulate a cooling fluid (eg, a coolant) to control the temperature of the processing chamber during use. For example, as depicted in FIG. 9, in some embodiments, the processing chamber 132 includes a plurality of channels 900 within the annular body 100 to circulate cooling fluid. The plurality of channels 900 includes an inlet 902 and an outlet 904 to facilitate circulation of cooling fluid (provided from a source of cooling fluid) to prevent the outer surface of the annular body 100 from exceeding a predetermined temperature. In some embodiments, the predetermined temperature is approximately 65 degrees Celsius.

The annular body 100 includes an outer surface 102 and an inner surface 104. The inner surface 104 is defined at the central opening 106 of the annular body 100. The inner surface 104 includes a plurality of inclined surfaces 110 that define a first volume 112. Each of the inclined surfaces may be planar and parallel to the central axis of the annular body 100. Each of the inclined surfaces can be arranged to have the same inclusion angle between each pair of adjacent inclined surfaces. One or more substrates, such as semiconductor wafers or other substrates having materials to be microwave cured, may be disposed within the first volume 112 during the curing operation. In some embodiments, the interior surface 104 has five (5) or more inclined surfaces. In some embodiments, as depicted in Figures 1-3, the interior surface 104 has eight (8) sloped surfaces. In some embodiments, for the inner surface 104 having eight inclined surfaces, the angle 105 between each inclined surface 110 (ie, between the inclined surface 110 and the adjacent inclined surface 110) is approximately 135. degree. In some embodiments, such as Figure 8, inner surface 104 has twelve (12) inclined surfaces. In some embodiments, for the inner surface 104 having 12 inclined surfaces, the angle 105 between each inclined surface 110 (ie, between the inclined surface 110 and the adjacent inclined surface) is approximately 150 degrees. The inventors have observed that an inner surface 104 having a plurality of inclined surfaces advantageously provides a more uniform reflection of the microwave energy and a more uniform distribution, unlike a completely circular inner surface that will impart microwave energy. Gathered in the center of the first volume 112. For example, the inventors have observed that a processing chamber 132 having an interior surface 104 having, for example, eight inclined surfaces or twelve inclined surfaces advantageously distributes microwaves evenly throughout the first volume 112 to provide uniformity within the first volume 112. The substrate is cured. Other numbers of inclined surfaces may also be used, including more than 12 inclined surfaces, although increasing the number of inclined surfaces may begin to approximate a circular inner surface.

The annular body 100 further includes a first lip 114 (or first flange) and a second lip 118 (or second flange). The first lip 114 extends radially outward from the outer surface 102 of the annular body 100 proximate the first end point 116 of the annular body 100. The second lip 118 extends radially outward from the outer surface 102 of the annular body 100 adjacent the second end point 120 of the annular body 100.

In some embodiments, the first lip 114 includes a first slot 128 that is disposed within the first surface 130 of the first lip 114. In some embodiments, the first groove 128 is annular or nearly annular. In some embodiments, the first slot 128 has an opening that has a width of approximately 0.27 inches. The first slot 128 is configured to retain a seal, such as an O-ring or similar gasket material, to form a seal when the plurality of processing chambers 132 are in a stacked configuration, as described below with respect to FIG. In some embodiments, as depicted in FIG. 2, the second lip 118 includes a second slot 210 that is disposed within the first surface 212 of the second lip 118. In some embodiments, the second slot 210 is annular or nearly annular. In some embodiments, the second slot 210 has an opening that has a width of approximately 0.094 inches. In some embodiments, the second slot 210 holds a conductive spacer to more reliably ground the processing chamber 132 when the plurality of processing chambers 132 are in a stacked configuration, as described below with respect to FIG.

The annular body 100 further includes an exhaust device 122 disposed between the first lip portion 114 and the second lip portion 118. Exhaust device 122 is fluidly coupled to first volume 112. The venting device 122 can generally have any shape and size that promotes sufficient flow to maintain processing parameters, such as desired pressure, in the chamber. In some embodiments, as depicted in Figures 1-3, the venting device 122 can be rectangular, for example, having a dimension of about 11 inches by about 4 inches. In some embodiments, as depicted in Figure 8, the exhaust device 122 can be circular in shape. The exhaust device 122 includes a plurality of first openings 124 that are fluidly coupled to the first volume 112. In some embodiments, each of the plurality of first openings 124 includes a diameter of less than about 10 mm.

The processing chamber 132 is adapted to receive microwave energy of varying frequencies having a frequency of less than about 6.9 GHz, such as from about 4.5 GHz to about 6.9 GHz. In some embodiments, the processing chamber 132 utilizes 4096 frequencies that sweep across the chamber in a frequency range of about 5.8 GHz to about 6.9 GHz in about 0.1 seconds. The inventors have observed that any opening in the processing chamber 132 that is greater than about a half of the microwave wavelength will undesirably leak out of the opening of the processing chamber 132. Thus, a plurality of first openings 124 having a diameter of less than about 10 mm advantageously discharge gas from within the first volume 112 while preventing leakage of microwaves from the first volume 112. In some embodiments, the number of first openings 124 is selected to match the conductivity of a turbo pump (not shown) that is coupled to the processing chamber 132 for pumping.

The annular body 100 further includes a plurality of second openings 126 that are fluidly coupled to the first volume 112. The plurality of second openings 126 facilitate transfer of microwave energy to the first volume 112. For example, each of the second openings 126 can be rectangular. In some embodiments, each of the second openings 126 can include a sloped sidewall that magnifies an opening on a side of the opening that faces the first volume 112. In some embodiments, the second opening 126 is disposed along the interior surface 104. In some embodiments, the second openings 126 are staggered along the interior surface 104, or spaced apart. For example, in some embodiments depicted in FIGS. 1 and 2, the annular body 100 includes two second openings 126, wherein the two second openings 126 are disposed opposite each other along the interior surface 104. For example, in some embodiments depicted in FIG. 8 , the annular body 100 includes four second openings 126 , wherein two of the four second openings 126 are disposed opposite one another along the interior surface 104 and the second opening 126 The other two are disposed opposite each other along the inner surface 104, but not relative to the first two second openings 126. For example, each of the second openings 126 can be equally spaced around the annular body 100 (eg, separated by approximately 90 degrees in the embodiment depicted in FIG. 8). In some embodiments, such as depicted in FIGS. 1 and 2, each second opening 126 is a single opening of the interior surface 104. In some embodiments, such as depicted in FIG. 8, each second opening 126 includes a plurality of openings at the interior surface 104.

As depicted in FIG. 2, the annular body 100 includes one or more ports 200 that pass from the exterior surface 102 through the interior surface 104 and are fluidly coupled to the first volume 112. In some embodiments, one or more ports 200 include a first port 202 and a second port 204 that are less than about 10 mm in diameter. As noted above, a diameter of less than about 10 mm prevents leakage of microwaves from the first volume 112 through the one or more ports 200.

In some embodiments, as depicted in FIG. 2, a temperature sensor 206 is disposed within the first port 202 to measure the temperature within the first volume 112. FIG. 5 depicts a schematic cross-sectional view of temperature sensor 206 coupled to annular body 100 through first port 202.

In some embodiments, as depicted in FIG. 2, pressure sensor 208 is coupled to annular body 100 to measure pressure within first volume 112 through second port 204. FIG. 4 depicts a schematic cross-sectional view of a pressure sensor 208 coupled to the isolation valve 500 through a clamp 502. Isolation valve 500 is coupled to annular body 100 at second port 204.

In some embodiments, as depicted in FIG. 3, a plurality of processing chambers 132 can be coupled in a stacked configuration. For example, as depicted in FIG. 3, the two processing chambers 132 can be coupled in a stacked configuration. In some embodiments, as depicted in FIG. 3, the second lip 118 of the top body 300 is coupled to the first lip 114 of the bottom body 302. In some embodiments, the top body 300 is coupled to the bottom body 302 by a suitable fixture, such as a bolt or screw. In the stacked configuration depicted in FIG. 3, the first volume 112 of the top body 300 is fluidly coupled to the first volume 112 of the bottom body 302. The first volume 112 of each body can hold up to, for example, up to about 10 semiconductor wafers or other suitable substrates. The inventors have observed that the stackable configuration of the processing chamber, as depicted in Figure 3, advantageously provides the ability to process batch wafers and provides a choice to be processed by correspondingly increasing or decreasing the processing chamber volume accordingly. The elasticity of the number of substrates. The flexibility of the processing chamber volume allows for optimization of the substrate cycle time, which depends on the substrate loading. The topmost processing chamber in the stacked configuration, such as top body 300 in FIG. 3, includes an upper cover 304 to seal the first volume 112. The topmost processing chamber has an upper cover 304 disposed above the processing chamber to seal the first volume 112.

In some embodiments, one or more processing chambers as described above may be stacked over the substrate transfer apparatus 610 for transporting a plurality of substrates into and out of the processing chamber. For example, Figures 6A and 6B depict a substrate transfer apparatus 610 having a lower chamber 600. As depicted in Figure 6A, the lower chamber 600 holds a plurality of substrates 602. In some embodiments, the plurality of substrates 602 are aligned in parallel with each other in a stacked configuration. One or more processing chambers as described above are disposed above the lower chamber 600.

The topmost processing chamber of one or more processing chambers 608 has an upper cover 304 disposed over the processing chamber to seal the first volume 112 in a manner as discussed above with respect to FIG. Although FIGS. 6A and 6B depict three process chambers 608 stacked and aligned above the lower chamber 600 as described above, more or less than three process chambers 608 may depend on the number of substrates to be processed. use.

As depicted in FIG. 6B, a plurality of substrates 602 can be positioned within the first volume 112 of one or more processing chambers 608. A lift mechanism 604 is provided to raise a plurality of substrates 602 from the lower chamber 600 into the first volume 112 of one or more processing chambers 608. The lift mechanism 604 can be any suitable lift mechanism, such as an actuator, motor, or the like. In some embodiments, the lift mechanism is coupled to a substrate support 612 that can be disposed in the lower chamber 600 or moved into the interior volume of the one or more processing chambers 608. A plurality of movable mounts 614 are movably coupled to the side walls 616 of the substrate transfer apparatus 610. The plurality of arms 618 have a first end point coupled to the substrate support 612 and a second end end coupled to the movable mount 614. The movable mount 614 moves linearly along the sidewall 616 of the substrate transfer apparatus 610 to raise or lower the substrate support 612 through the plurality of arms 618. Once the plurality of substrates 602 are raised into the first volume 112, the lower plate 606 coupled to the substrate support 612 seals the volume of the lower chamber 600 from the first volume 112 to prevent microwave leakage and is maintained in the first volume 112. Scheduled pressure. The lower sheet 606 is butted against the adapter 613 such that there are no gaps or small gaps between the lower sheet 606 and the adapter 613, thus sealing the first volume 112. The adapter 613 is coupled to an interior surface of the lower chamber 600. FIG. 11 depicts a schematic view of the lower sheet material 606 and adapter 613 forming a seal to prevent microwaves from escaping and maintaining a predetermined pressure in the first volume 112. As depicted in Figure 11, the lower sheet 606 includes a first portion 1102 that forms a seal with the first portion 1104 of the adapter. The lower sheet 606 further includes an edge portion 1106 having an annular opening 1114, such as a groove or groove having a predetermined width. The annular opening 1114 includes one or more protrusions 1108 that extend away from the surface 1110 of the annular opening 1114 toward the surface 1112 of the adapter. In some embodiments, the plurality of protrusions 1108 can be separated by a slit of a predetermined size (not shown). In some embodiments, the protrusion 1108 can extend perpendicular to the surface 1110 of the annular opening 1114. In some embodiments, the protrusion 1108 can extend at a predetermined angle against the surface 1110 of the annular opening 1114.

Figure 10 depicts a schematic diagram of a plurality of processing chamber devices 1000 for microwave batch curing processes, in accordance with some embodiments of the present disclosure. 10 depicts one or more processing chambers 1004 as described above stacked on a substrate transfer apparatus 610 for transporting a plurality of substrates into and out of the processing chamber. The substrate transfer apparatus 610 includes a lower chamber 600 to hold a plurality of substrates 602. As explained above with respect to FIG. 6B, a plurality of substrates 602 can be transferred from the lower chamber 600 to the first volume 112 of the one or more chambers 1004. The topmost processing chamber 1004 of one or more chambers 1004 has an upper cover 304 disposed over the processing chamber 1004 to seal the first volume 112 in a manner discussed above with respect to FIG. Although FIG. 10 depicts three processing chambers 1004 stacked above the lower chamber 600 as described above, more or less than three processing chambers 1004 may be utilized depending on the number of substrates to be processed. FIG. 10 further depicts an exhaust system 1002 coupled to an exhaust device 122 of each processing chamber 1004.

FIG. 7 depicts a flow diagram of a method 700 for performing a microwave batch curing process, in accordance with some embodiments of the present disclosure. At 702, as depicted in Figures 6A and 6B, a plurality of substrates 602 are provided to a first volume 112 of one or more processing chambers 608 that are aligned in a stack and have the features described above. As depicted in FIGS. 6A-6B, a plurality of substrates 602 can be provided from the lower chamber 600 to the first volume 112 of the processing chamber 608 through the lift mechanism 604. Next, at 704, a vacuum is created within the first volume 112 by exhausting gas through the exhaust device 122. Next, at 706, the plurality of substrates 602 within the first volume 112 are exposed to microwave energy for a suitable amount of time to undergo a microwave curing process. As described above, the angle of inclination of the interior surface 104 advantageously provides for uniform reflection and uniform distribution of microwave energy to cure a plurality of substrates 602. After the curing process, a plurality of substrates 602 are lowered from the first volume 112 into the lower chamber 600 and removed for further semiconductor processing.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope of the disclosure.

100‧‧‧ ring body
102‧‧‧External surface
104‧‧‧Internal surface
105‧‧‧ Angle
106‧‧‧Central opening
110‧‧‧Sloping surface
112‧‧‧First volume
114‧‧‧First lip
116‧‧‧First Endpoint
118‧‧‧Second lip
120‧‧‧second endpoint
122‧‧‧Exhaust device
124‧‧‧ first opening
126‧‧‧ second opening
128‧‧‧first slot
130‧‧‧ first surface
132‧‧‧Processing chamber
200‧‧‧port
202‧‧‧First port
204‧‧‧Second port
206‧‧‧temperature sensor
208‧‧‧pressure sensor
210‧‧‧second trough
212‧‧‧ first surface
300‧‧‧Top subject
302‧‧‧ bottom body
304‧‧‧上盖
500‧‧‧Isolation valve
502‧‧‧ fixture
600‧‧‧lower chamber
602‧‧‧Substrate
604‧‧‧ Lifting mechanism
606‧‧‧lower plate
608‧‧‧Processing chamber
610‧‧‧Substrate transfer equipment
612‧‧‧Substrate support
613‧‧‧Adapter
614‧‧‧ movable support
616‧‧‧ side wall
618‧‧‧ Arm
700‧‧‧ method
702‧‧‧Steps
704‧‧‧Steps
706‧‧‧Steps
900‧‧‧ channel
902‧‧‧ entrance
904‧‧‧Export
1000‧‧‧Processing chamber equipment
1002‧‧‧Exhaust system
1004‧‧‧Processing chamber
1102‧‧‧Part 1
1104‧‧‧Part 1
1106‧‧‧Edge section
1108‧‧‧ protrusion
1110‧‧‧ surface
1112‧‧‧ surface
1114‧‧‧Circular opening

The embodiments of the present disclosure, which are briefly summarized above and discussed in more detail below, may be understood by reference to the exemplary embodiments of the present disclosure. However, the drawings are merely illustrative of typical embodiments of the present disclosure and are therefore not to be considered as limiting.

1 depicts a schematic diagram of a processing chamber for a microwave batch curing process, in accordance with some embodiments of the present disclosure.

2 depicts a schematic diagram of a processing chamber for a microwave batch curing process, in accordance with some embodiments of the present disclosure.

3 depicts a schematic diagram of two processing chambers for a microwave batch curing process, in accordance with some embodiments of the present disclosure.

4 depicts a schematic diagram of a pressure sensor coupled to a processing chamber for a microwave batch curing process, in accordance with some embodiments of the present disclosure.

5 depicts a schematic diagram of a temperature sensor coupled to a processing chamber for a microwave batch curing process, in accordance with some embodiments of the present disclosure.

6A-6B depict schematic side views of a plurality of processing chambers for microwave batch curing processes, respectively, in accordance with some embodiments of the present disclosure.

7 depicts a flow chart of a method for performing a microwave batch curing process, in accordance with some embodiments of the present disclosure.

8 depicts a schematic diagram of a processing chamber for a microwave batch curing process, in accordance with some embodiments of the present disclosure.

9 depicts a cross-sectional view of a processing chamber for a microwave batch curing process, in accordance with some embodiments of the present disclosure.

Figure 10 depicts a schematic diagram of a plurality of processing chamber devices for microwave batch curing processes, in accordance with some embodiments of the present disclosure.

11 depicts a cross-sectional view of a processing chamber for a microwave batch curing process, in accordance with some embodiments of the present disclosure.

To facilitate understanding, the same reference symbols are used where possible to designate the same elements that are common in the drawings. The drawings are not drawn to scale and may be simplified for clarity. The elements and features of one embodiment may be beneficially incorporated in other embodiments without further elaboration.

Domestic deposit information (please note according to the order of the depository, date, number)

Foreign deposit information (please note in the order of country, organization, date, number)

(Please change the page separately) No

100‧‧‧ ring body

102‧‧‧External surface

104‧‧‧Internal surface

105‧‧‧ Angle

106‧‧‧Central opening

110‧‧‧Sloping surface

112‧‧‧First volume

114‧‧‧First lip

116‧‧‧First Endpoint

118‧‧‧Second lip

120‧‧‧second endpoint

122‧‧‧Exhaust device

124‧‧‧ first opening

126‧‧‧ second opening

128‧‧‧first slot

130‧‧‧ first surface

132‧‧‧Processing chamber

Claims (20)

A processing chamber for a microwave batch curing process, the processing chamber comprising: an annular body having an outer surface and an inner surface defining a central opening of the annular body, wherein The inner surface includes a plurality of inclined surfaces defining a first volume; a first lip from the outer surface of the annular body adjacent a first end of the annular body Extending radially outward; a second lip extending radially outward from the outer surface of the annular body adjacent a second end of the annular body; an exhaust device, the exhaust a device disposed between the first lip and the second lip and fluidly coupled to the first volume, wherein the venting device includes a plurality of first openings; a plurality of second openings, the second openings Fluidly coupled to the first volume, wherein the plurality of second openings are configured to expose the first volume to microwave energy; and one or more ports that are fluidly coupled to the first volume. The processing chamber of claim 1 wherein the interior surface comprises eight inclined surfaces. The processing chamber of claim 1 wherein the interior surface comprises 12 inclined surfaces. The processing chamber of claim 1 wherein the annular body has a thickness of about 1 inch. The processing chamber of claim 1 wherein the annular body comprises aluminum. The processing chamber of claim 1, wherein the plurality of first openings comprise a diameter of less than about 10 mm. The processing chamber of claim 1, wherein the one or more ports comprise a first port and a second port, the first port and the second port having a diameter of less than about 10 mm. The processing chamber of claim 7, further comprising a temperature sensor disposed within the first port. The processing chamber of claim 7, further comprising a pressure sensor disposed within the second port. The processing chamber of claim 1, further comprising a first groove disposed in a first surface of the first lip. The processing chamber of claim 1, further comprising a second groove disposed in a first surface of the second lip. The processing chamber of claim 1 further comprising a plurality of channels located within the annular body and configured to circulate a cooling fluid. A processing chamber for a microwave batch curing process, the processing chamber comprising: a plurality of annular bodies arranged in a stack, wherein each annular body comprises: an outer surface and an inner surface, The inner surface defines a central opening of the annular body, wherein the inner surface includes a plurality of inclined surfaces defining a first volume; a first lip having a first lip at the annular body A first end portion extends radially outward from the outer surface of the annular body; a second lip portion from the outer surface of the annular body near a second end of the annular body Extending outwardly; an exhausting device disposed between the first lip and the second lip and fluidly coupled to the first volume, wherein the exhausting device comprises a plurality of first An opening; a plurality of second openings fluidly coupled to the first volume, wherein the plurality of second openings are configured to expose the first volume to microwave energy; and one or more ports, Port fluidly coupled to the first volume. The processing chamber of claim 13 wherein the interior surface comprises eight inclined surfaces. The processing chamber of claim 13 wherein the interior surface comprises 12 inclined surfaces. The processing chamber of claim 13 wherein the plurality of first openings comprise a diameter of less than about 10 mm. The processing chamber of claim 13 wherein the one or more ports comprise a first port and a second port, the first port and the second port having a diameter of less than about 10 mm. The processing chamber of claim 17, further comprising a temperature sensor and a pressure sensor, the temperature sensor being disposed in the first port, the pressure sensor being disposed in the second port . A method for performing a microwave batch curing process, the method comprising the steps of: inserting a plurality of substrates into a processing chamber, the processing chamber comprising: an annular body having an outer surface and an inner portion a surface defining a central opening of the annular body, wherein the inner surface includes a plurality of inclined surfaces defining a first volume; a first lip, the first lip being in the ring A first end of the body extends radially outward from the outer surface of the annular body; a second lip from the annular body adjacent the second end of the annular body An outer surface extending radially outwardly; an exhausting device disposed between the first lip and the second lip and fluidly coupled to the first volume, wherein the exhausting device comprises a plurality of a first opening; a plurality of second openings, the second openings being fluidly coupled to the first volume, wherein the plurality of second openings are configured to expose the first volume to microwave energy; and one or more a plurality of ports fluidly coupled to the first volume; forming a vacuum within the processing chamber; and exposing the plurality of substrates within the processing chamber to microwaves. The method of claim 19, wherein the inner surface has five or more inclined surfaces.