TW201639425A - Printed circuit board assembly - Google Patents
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- TW201639425A TW201639425A TW104113554A TW104113554A TW201639425A TW 201639425 A TW201639425 A TW 201639425A TW 104113554 A TW104113554 A TW 104113554A TW 104113554 A TW104113554 A TW 104113554A TW 201639425 A TW201639425 A TW 201639425A
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Abstract
Description
本發明是有關一種電路板組件。 The present invention is directed to a circuit board assembly.
一般而言，將晶片、載板或電路板或由以上任一或組成之模組固定於另一電路板的方式有兩種方式，一種是使用拉桿與壓板固定，另一種是使用錫膏、金屬凸塊以回焊(reflow)的方式固定。 In general, there are two ways to fix a wafer, a carrier board or a circuit board or a module of any one or the other of the above to another circuit board, one is to use a tie rod to fix the pressure plate, and the other is to use solder paste, The metal bumps are fixed in a reflow manner.
當使用拉桿與壓板固定模組時，需先將拉桿抬起，接著將模組的電性接腳插入電路板的導電孔，最後再下壓拉桿使連接拉桿的壓板壓住模組，使模組固定於電路板上。又或者，先使用錫膏塗佈於模組的電性接腳，接著將模組的電性接腳對準於電路板的導電孔，並以回焊製程熔化錫膏。待錫膏泥凝固後，模組便可固定於電路板上。 When using the tie rod and the pressure plate to fix the module, the lever should be lifted first, then the electrical pin of the module is inserted into the conductive hole of the circuit board, and then the pull rod is pressed down to press the pressure plate connecting the rod to the module to make the mold The group is fixed to the board. Alternatively, the solder paste is first applied to the electrical pins of the module, and then the electrical pins of the module are aligned with the conductive holes of the circuit board, and the solder paste is melted by a reflow process. After the solder paste is solidified, the module can be fixed on the circuit board.
然而，若電路板需具有拉桿與壓板才可固定模組，則不僅會增加材料與組裝的成本，拉桿與壓板還會占用電路板的空間，不利於線路佈局(layout)。此外，不同使用者操作拉桿的力量不同，使得模組有被壓板壓壞的風險。另一方面，回焊製程屬於表面接合技術(Surface Mount Technology；SMT)的一環，需專門的設備才可施行，因此會增加電路板組件的製造成本。 However, if the circuit board needs to have a tie rod and a pressure plate to fix the module, the cost of materials and assembly will not only increase, but the tie rod and the pressure plate also occupy the space of the circuit board, which is not conducive to the layout of the circuit. In addition, different users operate the levers with different forces, which makes the module risk of being crushed by the platen. On the other hand, the reflow process belongs to the surface bonding technology (Surface Mount) A part of Technology; SMT) requires specialized equipment to be implemented, thus increasing the manufacturing cost of the board assembly.
本發明之一技術態樣為一種電路板組件。 One aspect of the present invention is a circuit board assembly.
根據本發明一實施方式，一種電路板組件包含電路板、磁性件、模組與金屬散熱件。電路板具有第一表面，且第一表面具有複數個導電孔。磁性件位於電路板上或電路板中。模組位於電路板的第一表面上。模組具有複數個電性接腳，且電性接腳分別耦合導電孔。金屬散熱件位於模組上，且模組位於金屬散熱件與磁性件之間。金屬散熱件被磁性件吸附而使模組固定於電路板上。 According to an embodiment of the invention, a circuit board assembly includes a circuit board, a magnetic member, a module, and a metal heat sink. The circuit board has a first surface and the first surface has a plurality of conductive holes. The magnetic components are located on the circuit board or in the circuit board. The module is located on the first surface of the circuit board. The module has a plurality of electrical pins, and the electrical pins are respectively coupled to the conductive holes. The metal heat sink is located on the module, and the module is located between the metal heat sink and the magnetic member. The metal heat sink is attracted by the magnetic member to fix the module to the circuit board.
在本發明一實施方式中，上述磁性件至少部分從電路板的第一表面裸露，且磁性件與電路板的第一表面共平面。 In an embodiment of the invention, the magnetic member is at least partially exposed from the first surface of the circuit board, and the magnetic member is coplanar with the first surface of the circuit board.
在本發明一實施方式中，上述電路板包覆磁性件。 In an embodiment of the invention, the circuit board is covered with a magnetic member.
在本發明一實施方式中，上述電路板具有背對第一表面的第二表面，且磁性件位於電路板的第二表面上。 In an embodiment of the invention, the circuit board has a second surface facing away from the first surface, and the magnetic member is located on the second surface of the circuit board.
在本發明一實施方式中，上述金屬散熱件在電路板的第一表面的正投影與磁性件在電路板的第一表面的正投影至少部分重疊。 In an embodiment of the invention, the orthographic projection of the metal heat sink on the first surface of the circuit board at least partially overlaps the orthographic projection of the magnetic member on the first surface of the circuit board.
在本發明一實施方式中，上述電路板具有凹部，且電路板的第一表面為凹部的底面。 In an embodiment of the invention, the circuit board has a recess, and the first surface of the circuit board is a bottom surface of the recess.
在本發明一實施方式中，上述電路板具有開口，且此開口連通於凹部。電路板組件更包含軟性電路板。軟性電路板電性連接模組，且軟性電路板穿過電路板的開口。 In an embodiment of the invention, the circuit board has an opening, and the opening communicates with the recess. The board assembly also includes a flexible circuit board. The flexible circuit board is electrically connected to the module, and the flexible circuit board passes through the opening of the circuit board.
在本發明一實施方式中，上述磁性件的形狀包含矩形、圓形或多邊形。 In an embodiment of the invention, the shape of the magnetic member includes a rectangle, a circle, or a polygon.
在本發明一實施方式中，當磁性件的形狀為矩形時，磁性件的位置對應模組的邊緣。 In an embodiment of the invention, when the shape of the magnetic member is a rectangle, the position of the magnetic member corresponds to the edge of the module.
在本發明一實施方式中，當磁性件的形狀為圓形時，磁性件的位置對應模組的角落。 In an embodiment of the invention, when the shape of the magnetic member is circular, the position of the magnetic member corresponds to a corner of the module.
在本發明一實施方式中，上述磁性件為包含稀土元素的磁鐵。 In an embodiment of the invention, the magnetic member is a magnet containing a rare earth element.
在本發明一實施方式中，上述金屬散熱件的材質包含鐵、鎳、鉬或矽鋼。 In an embodiment of the invention, the material of the metal heat sink comprises iron, nickel, molybdenum or niobium steel.
在本發明上述實施方式中，由於電路板組件包含磁性件與金屬散熱件且模組位於金屬散熱件與磁性件之間，因此當模組的電性接腳分別耦合電路板的導電孔時，金屬散熱件可被磁性件吸附而使模組固定於電路板上。也就是說，模組的相對兩側分別為金屬散熱件與磁性件，金屬散熱件會被磁性件吸引而將模組往電路板的方向壓，使模組不會從電路板脫離，進而增加模組的電性接腳與電路板的導電孔之間的密合度。 In the above embodiment of the present invention, since the circuit board assembly includes the magnetic component and the metal heat sink and the module is located between the metal heat sink and the magnetic component, when the electrical pins of the module are respectively coupled to the conductive holes of the circuit board, The metal heat sink can be attracted by the magnetic member to fix the module to the circuit board. That is to say, the opposite sides of the module are respectively a metal heat sink and a magnetic member, and the metal heat sink is attracted by the magnetic member to press the module toward the circuit board, so that the module does not detach from the circuit board, thereby increasing The tightness between the electrical pins of the module and the conductive holes of the board.
100~100f‧‧‧電路板組件 100~100f‧‧‧Board components
110‧‧‧電路板 110‧‧‧Circuit board
112‧‧‧第一表面 112‧‧‧ first surface
114‧‧‧導電孔 114‧‧‧Electrical hole
116‧‧‧第二表面 116‧‧‧ second surface
118‧‧‧凹部 118‧‧‧ recess
119‧‧‧開口 119‧‧‧ openings
120~120c‧‧‧磁性件 120~120c‧‧‧Magnetic parts
130、130a‧‧‧模組 130, 130a‧‧‧ modules
132、132a‧‧‧電性接腳 132, 132a‧‧‧Electrical pins
140、140a‧‧‧金屬散熱件 140, 140a‧‧‧ metal heat sink
150‧‧‧軟性電路板 150‧‧‧Soft circuit board
3-3‧‧‧線段 3-3‧‧‧ segments
D‧‧‧方向 D‧‧‧ Direction
第1圖繪示根據本發明一實施方式之電路板組件的立體圖。 1 is a perspective view of a circuit board assembly in accordance with an embodiment of the present invention.
第2圖繪示第1圖之電路板組件的分解圖。 Figure 2 is an exploded view of the circuit board assembly of Figure 1.
第3圖繪示第1圖之電路板組件沿線段3-3的剖面圖。 Figure 3 is a cross-sectional view of the circuit board assembly of Figure 1 taken along line 3-3.
第4圖繪示根據本發明一實施方式之電路板組件的剖面圖，其剖面位置與第3圖相同。 Fig. 4 is a cross-sectional view showing a circuit board assembly according to an embodiment of the present invention, the cross-sectional position of which is the same as that of Fig. 3.
第5圖繪示根據本發明一實施方式之電路板組件的剖面圖，其剖面位置與第3圖相同。 Fig. 5 is a cross-sectional view showing a circuit board assembly according to an embodiment of the present invention, the cross-sectional position of which is the same as that of Fig. 3.
第6圖繪示根據本發明一實施方式之電路板組件的分解圖。 Figure 6 is an exploded view of a circuit board assembly in accordance with an embodiment of the present invention.
第7圖繪示根據本發明一實施方式之電路板組件的分解圖。 Figure 7 is an exploded view of a circuit board assembly in accordance with an embodiment of the present invention.
第8圖繪示根據本發明一實施方式之電路板組件的分解圖。 Figure 8 is an exploded view of a circuit board assembly in accordance with an embodiment of the present invention.
第9圖繪示根據本發明一實施方式之電路板組件的分解圖。 Figure 9 is an exploded view of a circuit board assembly in accordance with an embodiment of the present invention.
以下將以圖式揭露本發明之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖繪示根據本發明一實施方式之電路板組件100的立體圖。第2圖繪示第1圖之電路板組件100的分解圖。同時參閱第1圖與第2圖，電路板組件100包含電路板110、磁性件120、模組130與金屬散熱件140。其中，電路板110具有第一表面112，且電路板110的第一表面112具有複數個導電孔114。磁性件120位於電路板110上或電路板110中。模組130位於電路板110的第一表面112上。模組130具有複數個電性接腳132，且模組130的電性接腳132可分別耦合電路板110的導電孔114，使得模組130電性連接電路板110。金屬散熱件140位於模組130上，且模組130位於金屬散熱件140與磁性件120之間。 1 is a perspective view of a circuit board assembly 100 in accordance with an embodiment of the present invention. 2 is an exploded view of the circuit board assembly 100 of FIG. 1. Referring also to FIGS. 1 and 2, the circuit board assembly 100 includes a circuit board 110, a magnetic member 120, a module 130, and a metal heat sink 140. The circuit board 110 has a first surface 112, and the first surface 112 of the circuit board 110 has a plurality of conductive holes 114. The magnetic member 120 is located on the circuit board 110 or in the circuit board 110. The module 130 is located on the first surface 112 of the circuit board 110. The module 130 has a plurality of electrical pins 132 , and the electrical pins 132 of the module 130 are respectively coupled to the conductive holes 114 of the circuit board 110 , so that the module 130 is electrically connected to the circuit board 110 . The metal heat sink 140 is located on the module 130, and the module 130 is located between the metal heat sink 140 and the magnetic member 120.
當模組130與金屬散熱件140以方向D安裝於電路板110上時，金屬散熱件140會被磁性件120吸附而使模組130固定於電路板110上。模組130的相對兩側分別為金屬散熱件140與磁性件120，金屬散熱件140會被磁性件120吸引而將模組130往電路板110的方向(即方向D)壓，使模組130不會從電路板110脫離，進而增加模組130的電性接腳132與電路板110的導電孔114之間的密合度。 When the module 130 and the metal heat sink 140 are mounted on the circuit board 110 in the direction D, the metal heat sink 140 is attracted by the magnetic member 120 to fix the module 130 to the circuit board 110. The opposite sides of the module 130 are respectively a metal heat sink 140 and a magnetic member 120. The metal heat sink 140 is attracted by the magnetic member 120 to press the module 130 toward the circuit board 110 (ie, direction D), so that the module 130 is pressed. The detachment from the circuit board 110 does not occur, thereby increasing the adhesion between the electrical pins 132 of the module 130 and the conductive holes 114 of the circuit board 110.
本發明的電路板組件100不需使用習知的拉桿與壓板固定模組130，因此能節省電路板110的材料成本與組裝的人力，且磁性件120的位置對應模組130的位置，不會占用額外的電路板110空間，有利於線路佈局(layout)。此外，電路板組件100是利用磁性件120與金屬散熱件140之間產生的磁力壓合模組130，與使用者的力量無關，可避免模組130被 習知壓板壓壞的風險。再者，電路板組件100不需經表面接合技術(Surface Mount Technology；SMT)就可將模組130固定在電路板110上，可節省電路板組件100的製造成本。 The circuit board assembly 100 of the present invention does not need to use the conventional tie rod and the plate fixing module 130, so the material cost of the circuit board 110 and the manpower of the assembly can be saved, and the position of the magnetic member 120 corresponds to the position of the module 130, and Taking up extra board space 110 facilitates line layout. In addition, the circuit board assembly 100 utilizes a magnetic compression module 130 generated between the magnetic member 120 and the metal heat sink 140. Regardless of the strength of the user, the module 130 can be prevented from being The risk of crushing the platen is known. Moreover, the circuit board assembly 100 can fix the module 130 on the circuit board 110 without using Surface Mount Technology (SMT), which can save the manufacturing cost of the circuit board assembly 100.
第3圖繪示第1圖之電路板組件100沿線段3-3的剖面圖。同時參閱第2圖與第3圖，磁性件120內嵌於電路板110中。在本實施方式中，磁性件120至少部分從電路板110的第一表面112裸露，且磁性件120與電路板110的第一表面112共平面。這樣的設計，當模組130安裝於電路板110上時，模組130能平整地接觸磁性件120與電路板110的第一表面112，可提升模組130與電路板110之間的密合度。磁性件120的形狀可以為矩形，但並不以矩形為限。當磁性件120的形狀為矩形時，磁性件120的位置可對應模組130的邊緣。 Figure 3 is a cross-sectional view of the circuit board assembly 100 of Figure 1 taken along line 3-3. Referring also to FIGS. 2 and 3, the magnetic member 120 is embedded in the circuit board 110. In the present embodiment, the magnetic member 120 is at least partially exposed from the first surface 112 of the circuit board 110 and the magnetic member 120 is coplanar with the first surface 112 of the circuit board 110. In this design, when the module 130 is mounted on the circuit board 110, the module 130 can smoothly contact the magnetic member 120 and the first surface 112 of the circuit board 110, and the adhesion between the module 130 and the circuit board 110 can be improved. . The shape of the magnetic member 120 may be a rectangle, but is not limited to a rectangle. When the shape of the magnetic member 120 is a rectangle, the position of the magnetic member 120 may correspond to the edge of the module 130.
在本實施方式中，模組130可以為單純的中央處理器(Central Processing Unit；CPU)、微處理器(MPU)、微電路(microcircuit)、APU(Accelerated Processing Unit)或顯示晶片(GPU)，或是由以上提到的多個元件組成的模組，也可以是另一載板或電路基板，在此並不用以限制本發明。電性接腳132在本實施例是以針腳型式為例，但亦可以是凸塊接墊或是其他形式，本發明並不以此為限。磁性件120可以為包含稀土元素的鐵磁性(Ferromagnetism)材料，可具有1000高斯以上的磁力。磁性件120的數量可以為二，且分別抵接模組130的相對兩邊緣，但並不用以限制本發明。金屬散熱件140的材質可以為含鐵、鎳、鈷等過渡金屬元素為主，但並不以上述金 屬為限，只要金屬散熱件140所選用的材質具有鐵磁性可被磁鐵吸附即可，例如鉬或矽鋼。 In this embodiment, the module 130 can be a simple central processing unit (CPU), a microprocessor (MPU), a microcircuit, an APU (Accelerated Processing Unit), or a display chip (GPU). The module, which is composed of the above-mentioned plurality of components, may also be another carrier or circuit substrate, and is not intended to limit the present invention. In the embodiment, the electrical pin 132 is exemplified by a pin type, but may be a bump pad or other forms, and the invention is not limited thereto. The magnetic member 120 may be a ferromagnetic material containing a rare earth element and may have a magnetic force of 1000 gauss or more. The number of the magnetic members 120 may be two and respectively abut the opposite edges of the module 130, but is not intended to limit the present invention. The metal heat sink 140 may be made of a transition metal element such as iron, nickel or cobalt, but not in the above gold. The genus is limited, as long as the material selected for the metal heat sink 140 has ferromagnetism and can be adsorbed by the magnet, such as molybdenum or niobium steel.
應瞭解到，在以下敘述中，已敘述過的元件材料與元件連接關係將不再重複贅述，合先敘明。在以下敘述中，將說明其他型式的電路板組件。 It should be understood that in the following description, the relationship between the component materials and the components that have been described will not be repeated, and will be described first. In the following description, other types of circuit board assemblies will be described.
第4圖繪示根據本發明一實施方式之電路板組件100a的剖面圖，其剖面位置與第3圖相同。電路板組件100a包含電路板110、磁性件120a、模組130與金屬散熱件140。與第3圖實施方式不同的地方在於：磁性件120a位於電路板110中，且電路板110包覆磁性件120a。在本實施方式中，金屬散熱件140可被磁性件120a吸附而使模組130固定於電路板110上。 Fig. 4 is a cross-sectional view showing a circuit board assembly 100a according to an embodiment of the present invention, the cross-sectional position of which is the same as that of Fig. 3. The circuit board assembly 100a includes a circuit board 110, a magnetic member 120a, a module 130, and a metal heat sink 140. The difference from the embodiment of Fig. 3 is that the magnetic member 120a is located in the circuit board 110, and the circuit board 110 covers the magnetic member 120a. In the present embodiment, the metal heat sink 140 can be adsorbed by the magnetic member 120a to fix the module 130 to the circuit board 110.
第5圖繪示根據本發明一實施方式之電路板組件100b的剖面圖，其剖面位置與第3圖相同。電路板組件100b包含電路板110、磁性件120b、模組130與金屬散熱件140。電路板110具有背對第一表面112的第二表面116。與第3圖實施方式不同的地方在於：磁性件120b位於電路板110的第二表面116上。這樣的設計，金屬散熱件140可被磁性件120b吸附而使模組130固定於電路板110上。 Fig. 5 is a cross-sectional view showing a circuit board assembly 100b according to an embodiment of the present invention, the cross-sectional position of which is the same as that of Fig. 3. The circuit board assembly 100b includes a circuit board 110, a magnetic member 120b, a module 130, and a metal heat sink 140. Circuit board 110 has a second surface 116 that faces away from first surface 112. The difference from the embodiment of FIG. 3 is that the magnetic member 120b is located on the second surface 116 of the circuit board 110. With such a design, the metal heat sink 140 can be attracted by the magnetic member 120b to fix the module 130 to the circuit board 110.
在本實施方式中，金屬散熱件140在電路板110的第一表面112的正投影與磁性件120b在電路板110的第一表面112的正投影至少部分重疊。 In the present embodiment, the orthographic projection of the metal heat sink 140 at the first surface 112 of the circuit board 110 at least partially overlaps the orthographic projection of the magnetic member 120b at the first surface 112 of the circuit board 110.
應瞭解到，在以下實施方式中，磁性件120在電路板110的位置可如第3圖至第6圖所示，可依設計者需求而定。 It should be understood that in the following embodiments, the position of the magnetic member 120 on the circuit board 110 can be as shown in FIGS. 3 to 6 and can be determined according to the needs of the designer.
第6圖繪示根據本發明一實施方式之電路板組件100c的分解圖。電路板組件100c包含電路板110、磁性件120、模組130與金屬散熱件140。磁性件120內嵌於電路板110中。與第2圖實施方式不同的地方在於：電路板110還具有凹部118，且電路板110的第一表面112為凹部118的底面。這樣的設計，金屬散熱件140可被磁性件120吸附而使模組130固定於電路板110上，且該凹部118的設計使得模組130的固定位置更精確。 Figure 6 is an exploded view of a circuit board assembly 100c in accordance with an embodiment of the present invention. The circuit board assembly 100c includes a circuit board 110, a magnetic member 120, a module 130, and a metal heat sink 140. The magnetic member 120 is embedded in the circuit board 110. The difference from the embodiment of FIG. 2 is that the circuit board 110 further has a recess 118, and the first surface 112 of the circuit board 110 is the bottom surface of the recess 118. With such a design, the metal heat sink 140 can be attracted by the magnetic member 120 to fix the module 130 to the circuit board 110, and the recess 118 is designed to make the fixed position of the module 130 more precise.
第7圖繪示根據本發明一實施方式之電路板組件100d的分解圖。電路板組件100d包含電路板110、磁性件120c、模組130與金屬散熱件140。模組130具有電性接腳132a。與第2圖實施方式不同的地方在於：電性接腳132a為凸點型式，例如錫球陣列(Ball Grid Array；BGA)，且磁性件120c的形狀為圓形或多邊形。這樣的設計，金屬散熱件140可被磁性件120c吸附而使模組130固定於電路板110上。 FIG. 7 is an exploded view of a circuit board assembly 100d according to an embodiment of the present invention. The circuit board assembly 100d includes a circuit board 110, a magnetic member 120c, a module 130, and a metal heat sink 140. The module 130 has an electrical pin 132a. The difference from the embodiment of FIG. 2 is that the electrical pins 132a are of a bump type, such as a Ball Grid Array (BGA), and the shape of the magnetic member 120c is circular or polygonal. With such a design, the metal heat sink 140 can be attracted by the magnetic member 120c to fix the module 130 to the circuit board 110.
在本實施方式中，當磁性件120c的形狀為圓形時，磁性件120c的位置對應模組130的角落。磁性件120c的數量可以為四，且分別抵接模組130的四角落，但並不用以限制本發明。 In the present embodiment, when the shape of the magnetic member 120c is circular, the position of the magnetic member 120c corresponds to the corner of the module 130. The number of the magnetic members 120c may be four and respectively abut the four corners of the module 130, but is not intended to limit the present invention.
第8圖繪示根據本發明一實施方式之電路板組件100e的分解圖。電路板組件100e包含電路板110、磁性件 120c、模組130與金屬散熱件140。磁性件120c內嵌於電路板110中。與第7圖實施方式不同的地方在於：電路板110還具有凹部118，且電路板110的第一表面112為凹部118的底面。這樣的設計，金屬散熱件140可被磁性件120c吸附而使模組130固定於電路板110上。 Figure 8 is an exploded view of a circuit board assembly 100e in accordance with an embodiment of the present invention. The circuit board assembly 100e includes a circuit board 110 and magnetic components 120c, module 130 and metal heat sink 140. The magnetic member 120c is embedded in the circuit board 110. The difference from the embodiment of FIG. 7 is that the circuit board 110 further has a recess 118, and the first surface 112 of the circuit board 110 is the bottom surface of the recess 118. With such a design, the metal heat sink 140 can be attracted by the magnetic member 120c to fix the module 130 to the circuit board 110.
第9圖繪示根據本發明一實施方式之電路板組件100f的分解圖。電路板組件100f包含電路板110、磁性件120、模組130與金屬散熱件140。磁性件120內嵌於電路板110中。與第8圖實施方式不同的地方在於：電路板110具有開口119，且電路板110的開口119連通於凹部118。此外，磁性件120為矩形。 Figure 9 is an exploded view of a circuit board assembly 100f in accordance with an embodiment of the present invention. The circuit board assembly 100f includes a circuit board 110, a magnetic member 120, a module 130, and a metal heat sink 140. The magnetic member 120 is embedded in the circuit board 110. The difference from the embodiment of FIG. 8 is that the circuit board 110 has an opening 119, and the opening 119 of the circuit board 110 communicates with the recess 118. Further, the magnetic member 120 is rectangular.
在本實施方式中，電路板組件100f還可包含軟性電路板150。軟性電路板150的兩端分別電性連接模組130、130a，且金屬散熱件140、140a分別位於模組130、130a上。這樣的設計，金屬散熱件140可被磁性件120吸附而使模組130固定於電路板110上。當模組130安裝於電路板110上時，軟性電路板150可穿過電路板110的開口119，可提升整個電路板組件100f的平整性。 In the present embodiment, the circuit board assembly 100f may further include a flexible circuit board 150. The two ends of the flexible circuit board 150 are electrically connected to the modules 130 and 130a, respectively, and the metal heat sinks 140 and 140a are respectively located on the modules 130 and 130a. With such a design, the metal heat sink 140 can be attracted by the magnetic member 120 to fix the module 130 to the circuit board 110. When the module 130 is mounted on the circuit board 110, the flexible circuit board 150 can pass through the opening 119 of the circuit board 110, which can improve the flatness of the entire circuit board assembly 100f.
本發明之電路板組件與習知技術相較，具有以下優點： Compared with the prior art, the circuit board assembly of the present invention has the following advantages:
1.由於電路板組件包含磁性件與金屬散熱件且模組位於金屬散熱件與磁性件之間，因此當模組的電性接腳分別耦合電路板的導電孔時，金屬散熱件可被磁性件吸附而使模組固定於電路板上。 1. Since the circuit board assembly includes the magnetic component and the metal heat sink and the module is located between the metal heat sink and the magnetic component, the metal heat sink can be magnetic when the electrical pins of the module are respectively coupled to the conductive holes of the circuit board. The component is adsorbed to fix the module to the circuit board.
2.電路板組件不需使用習知的拉桿與壓板固定模組，因此能節省電路板的材料成本與組裝的人力，且磁性件的位置對應模組的位置，不會占用額外的電路板空間，有利於線路佈局。 2. The circuit board assembly does not need to use the conventional tie rod and the pressure plate fixing module, so the material cost of the circuit board and the manpower of the assembly can be saved, and the position of the magnetic component corresponds to the position of the module, and does not occupy additional circuit board space. , is conducive to the layout of the line.
3.電路板組件是利用磁性件與金屬散熱件之間產生的磁力壓合模組，與使用者的力量無關，可避免模組被習知壓板壓壞的風險。 3. The circuit board assembly is a magnetic compression module generated between the magnetic member and the metal heat sink, which has nothing to do with the strength of the user, and can avoid the risk that the module is crushed by the conventional pressure plate.
4.電路板組件不需經表面接合技術就可將模組固定在電路板上，可節省電路板組件的製造成本。 4. The circuit board assembly can be fixed on the circuit board without surface bonding technology, which can save the manufacturing cost of the circuit board assembly.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧電路板組件 100‧‧‧Board components
110‧‧‧電路板 110‧‧‧Circuit board
112‧‧‧第一表面 112‧‧‧ first surface
114‧‧‧導電孔 114‧‧‧Electrical hole
120‧‧‧磁性件 120‧‧‧Magnetic parts
130‧‧‧模組 130‧‧‧Module
132‧‧‧電性接腳 132‧‧‧Electrical pins
140‧‧‧金屬散熱件 140‧‧‧Metal heat sink
D‧‧‧方向 D‧‧‧ Direction
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104113554A TW201639425A (en) | 2015-04-28 | 2015-04-28 | Printed circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104113554A TW201639425A (en) | 2015-04-28 | 2015-04-28 | Printed circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201639425A true TW201639425A (en) | 2016-11-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW104113554A TW201639425A (en) | 2015-04-28 | 2015-04-28 | Printed circuit board assembly |
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| Country | Link |
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| TW (1) | TW201639425A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107296A1 (en) * | 2018-11-28 | 2020-06-04 | 威刚科技股份有限公司 | Dynamic random access memory device having heat dissipation function |
-
2015
- 2015-04-28 TW TW104113554A patent/TW201639425A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107296A1 (en) * | 2018-11-28 | 2020-06-04 | 威刚科技股份有限公司 | Dynamic random access memory device having heat dissipation function |
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