TW201637114A - Wafer cassette - Google Patents

Abstract

This application discloses a wafer cassette having two metal end plates, a position limiting unit and a support unit. The position limiting unit and the support unit are provided between the two metal end plates. The position limiting unit and the support unit respectively have at least a metal bar and a plastic layer covering outside the metal bar. The metal bar in each position limiting unit and support unit is bonded to the two metal end plates for raising strength of the position limiting unit and the support unit. The plastic layer covering outside the metal bar has acid resistance, alkali resistance, organic solution resistance and thermostability. Accordingly, the wafer cassette of the invention has good mechanical strength, and is able to tolerate acid, alkali, organic solution used in the manufacturing process and is thermostable. Furthermore, in the position limiting unit and the support unit, the plastic layer can be formed by plastic molding and penetrates the metal bar, or the plastic layer can be coated or covered on the surface of the metal bar and then assembled with the two metal end plates. Treatment could be made easier and manufacturing precision can be controlled better.

Description

Wafer

The present invention relates to a wafer crucible, and more particularly to a wafer crucible for carrying wafers and withstanding acid, alkali, organic solutions and high temperatures in the process.

In the semiconductor process, wafers are transported to various process stations for processing. The wafers are housed in a stack of wafers in batches, and the robotic and automated equipment are used to carry out a point-making process station for, for example, an etching process, a thin film process, and the like. Wafers should have good rigidity and mechanical strength to avoid the weight of the loaded wafer and deformation due to collision during the handling process. Moreover, the wafer crucible must be selected according to the process content. For example, some processes The medium uses acid, alkali, and organic solutions to process the wafer. Therefore, the wafer system used must be resistant to acid, alkali, or organic solutions. Or, in some processes, the high temperature process is required. High temperature resistance.

In the prior art, the wafer crucible used for the acid, alkali or organic solution in the process is usually made of quartz material or plastic material such as polytetrafluoroethylene, polyvinyl chloride, polypropylene or polyfluorinated ethylene. Among them, quartz materials have the characteristics of acid resistance, alkali resistance, organic solution resistance and high temperature resistance. The wafers made of quartz materials have the disadvantages of being incompatible with hydrofluoric acid solutions, high in cost and difficult to process, and quartz. Although the material has high hardness, it is brittle and not resistant to collision, and may be broken and damaged by impact or collision during the process or handling; in addition, it is made of polytetrafluoroethylene, polyvinyl chloride, polypropylene or polyfluorinated. Wafers made of plastic materials such as diethylene have a lack of rigidity for large-size wafers.

One of the objects of the present invention is to solve the problem in the prior art that a wafer made of quartz material is not resistant to hydrofluoric acid, is expensive, is difficult to process, and is not resistant to collision or polytetrafluoroethylene, polyvinyl chloride, polypropylene or poly. The problem of insufficient rigidity of wafers made of fluorinated divinyl materials.

In order to achieve the above and other objects, the present invention provides a wafer cassette for accommodating at least one wafer, comprising two metal end plates, a limiting unit and a supporting unit, wherein the two ends of the limiting unit are respectively connected to the a second metal end plate, the limiting unit includes a first limiting member and a second limiting member, and the first limiting member and the second limiting member have a plurality of first limiting slots. And the first limiting member and the second limiting member respectively have at least one metal bar and a plastic layer covering the outer metal bar; the two ends of the supporting unit are respectively connected to the two metal end plates, The support unit has a plurality of second limiting slots, and the second limiting slots are aligned with the first limiting slots; wherein the two metal end plates, the limiting unit and the supporting unit are defined The accommodating space of the at least one wafer is received, and each of the wafers is limited to the first limiting slot and the second limiting slot.

In the above wafer cassette, the support unit includes a first support member and a second support member disposed to support the at least one wafer, and the first support member and the second support member are attached to the second support member. The second limiting groove is formed, and the first supporting member and the second supporting member respectively have at least one metal bar and a plastic layer covering the outside of the at least one metal bar.

In the above wafer cassette, the plastic layers of the first limiting member and the second limiting member are plastically molded and internally disposed with the at least one metal rod, and the first supporting member and the second supporting member are The plastic layer is formed of plastic and is internally provided with the at least one metal rod.

In the above wafer cassette, the plastic layer of the first limiting member and the second limiting member is coated or coated on the surface of the at least one metal rod, and the plastic of the first supporting member and the second supporting member The layer is coated or coated on the surface of the at least one metal rod.

In the above wafer cassette, each of the metal end plates has a plurality of locking holes for locking the limiting unit and the supporting unit by screws.

In the wafer cassette, each of the metal end plates is provided with a sealing gasket on each of the locking holes for locking and tightening the sealing holes.

In the above wafer holder, the first limiting member and the second end of the metal rod in the second limiting member have a screw hole for locking by the screw to each of the locking holes and each In the screw hole.

In the above wafer raft, the two ends of the metal rods in the first support member and the second support member have a screw hole for locking the corresponding locking holes and the snails by screws. In the hole.

In the above wafer crucible, the material of the plastic layer is polytetrafluoroethylene, polyvinyl chloride, polypropylene or polyfluorinated ethylene.

In the above wafer defect, the first limiting member and the second limiting member respectively have two metal bars.

In the above wafer crucible, the material of the two metal end plates and the metal bars is stainless steel.

The wafer cassette has a metal end plate, a limiting unit and a supporting unit. The limiting unit and the supporting unit respectively have a metal rod and an acid-proof, alkali-resistant and anti-organic solution coated on the metal rod. And the plastic layer with high temperature resistance is used to improve the strength of the support unit and the support unit by the metal rod. Accordingly, the wafer crucible of the invention has good mechanical strength and can withstand the process used in the process. The acid, the alkali, the organic solution and the high temperature resistance. In addition, in the limiting unit and the supporting unit, the plastic layer can be formed by using a plastic and internally penetrating the metal rod, or the plastic layer can be coated or coated on the surface of the metal rod. It is assembled with two metal end plates, which is easier to process and has better manufacturing precision.

In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.

The wafer cassette of the embodiment of the invention is used for accommodating at least one wafer for mechanical arm grabbing or automated equipment transportation to a processing station such as an etching process or a thin film process, and the wafer system carries the wafer into the wafer. Among various process equipment.

As shown in FIG. 1 , the wafer cassette 1 of the embodiment includes two metal end plates 10 , 20 , a limiting unit 30 and a supporting unit 40 . The two metal end plates 10 , 20 are oppositely disposed. The two ends of the unit 30 are connected to the two metal end plates 10 and 20 respectively. The limiting unit 30 includes a first limiting member 30A and a second limiting member 30B. The first limiting member 30A and the second limiting member 30B are respectively disposed. The second limiting member 30B has a plurality of first limiting slots 33, and the first limiting member 30A and the second limiting member 30B respectively have at least one metal bar 34 and are coated on the at least one metal. a plastic layer 31, 32 outside the rod 34; the two ends of the supporting unit 40 are respectively connected to the two metal end plates 10, 20, the supporting unit 40 has a plurality of second limiting slots 43, the second limiting slots The 43 series is aligned with the first limit grooves 33.

As shown in FIG. 2 and FIG. 3, the two metal end plates 10, 20, the limiting unit 30 and the supporting unit 40 are defined to accommodate an accommodating space 50 of the at least one wafer 2, each of the crystals. The circle 2 is limited to the first limiting slots 33 and the second limiting slots 43.

In this embodiment, the supporting unit 40 can include a first supporting member 40A and a second supporting member 40B disposed to support the at least one wafer 2 . As an example, the distance between the first support member 40A and the second support member 40B may be smaller than the distance between the first limiting member 30A and the second limiting member 30B to enable the wafer. 2 is supported in the accommodating space 50.

The first limiting member 30A and the second limiting member 30B are formed with the first limiting slots 33 on the surface of the accommodating space 50, the first supporting member 40A and the second supporting member The second limiting groove 43 is formed on the surface of the accommodating space 50 of the 40B. a first limiting slot 33 on the first limiting member 30A, a first limiting slot 33 on the second limiting member 30B, a second limiting slot 43 on the first supporting member 40A, and the second The second limiting slots 43 on the support member 40B are aligned with each other one by one, and the first limiting slot 33 and the second limiting slot 43 are disposed to accommodate a wafer 2 together. The first limiting member 30A and the second limiting member 30B extend from the metal end plate 10 to the metal end plate 20 to cover all the wafers 2 arranged in the wafer cassette; the first supporting member 40A The second support member 40B extends from the metal end plate 10 to the metal end plate 20 to support all of the wafers 2 arranged in the wafer cassette.

In this embodiment, the first limiting member 30A has at least one metal bar 34 and a plastic layer 31 covering the outside of the at least one metal bar 34. The second limiting member 30B has two metal bars 34 and a package. The plastic layer 32 of the first limiting member 30A and the plastic layer 32 of the second limiting member 30B are plastically molded and internally provided with the at least one metal. a rod 34; the plastic layers 31, 32 are respectively formed with through holes corresponding to the number of metal rods 34, since the plastic layers 31, 32 are softer and more elastic than the metal rods 34, each of the metal rods The 34 series is tightly fitted into the through holes of the plastic layers 31, 32.

In addition, the manner in which the first limiting member and the second limiting member are formed is not limited thereto, and the plastic layer of the first limiting member and the plastic layer of the second limiting member may be coated or coated on the at least a metal rod surface, in which the surface of each of the metal rods is formed with the first limiting grooves, and the plastic layer is coated or coated with a plastic coating to form the plastic layer.

The materials of the plastic layers 31, 32 described above may be materials such as polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polypropylene (PP) or polyfluorinated diethylene (PVDF), which are resistant to acid, The alkali-resistance, the anti-organic solution and the high-temperature resistance feature prevent the acid, alkali and organic solution in the process from eroding the first limiting member 31 and the second limiting member 32. Moreover, the plastic layers 31, 32 are softer than the wafer, and the surface of the wafer 2 can be prevented from being damaged by contact or friction during loading into the wafer cassette 1.

In addition, the material of the metal bar 34 may be stainless steel, thereby increasing the strength of the first limiting member 30A and the second limiting member 30B.

Similar to the structure of the first limiting member 30A and the second limiting member 30B of the limiting unit 30, the first supporting member 40A has at least one metal rod 44 and is coated on the at least one metal. a plastic layer 41 outside the rod 44, the second support member 40B having at least one metal rod 44 and a plastic layer 42 covering the outside of the at least one metal rod 44. The material of the plastic layer 41, 42 may be Polytetrafluoroethylene, polyvinyl chloride, polypropylene or polyfluorinated dichloride, which are resistant to acids, alkalis, organic solvents and high temperature, while avoiding acid, alkali and organic solutions in the process. The first support member 40A and the second support member 40B are eroded. In addition, the interior of the first support member 40A and the second support member 40B may have at least one metal bar 44. The metal bar 44 may be made of stainless steel for improving the first support member 40A and the second member. The strength of the support member 40B. The plastic layers 41, 42 are respectively formed with through holes corresponding to the number of metal rods 44. Since the plastic layers 41 and 42 are made of a plastic material, each of the metal rods 44 is soft and elastic, and the metal is relatively flexible. The rods 44 are tightly fitted into the through holes of the first support member 41 and the second support member 42.

In addition, the manner of making the first support member and the second support member is not limited thereto, and the plastic layer of the first support member and the plastic layer of the second support member may be coated or coated on the surface of the at least one metal rod. In this aspect, the second limiting groove is formed on the surface of each of the metal rods, and the plastic layer is formed by coating or coating the surface of each metal rod with a plastic coating.

The metal end plates 10, 20 of the wafer cassette 1 have a plurality of locking holes 11, 21 for locking the limiting unit 30 and the supporting unit 40 by screws 60. The locking holes 11, 21 The position of the first limiting member 31 and the second limiting member 32 of the limiting unit 30 and the positions of the first supporting member 41 and the second supporting member 42 of the supporting unit 40 are transmitted through the screws 60. The two metal end plates 10, 20, the limiting unit 30 and the supporting unit 40 are assembled together.

The two ends of the metal rods 34 of the first limiting member 30A and the second limiting member 30B have a screw hole 35, and the two ends of the metal rods 34 are slightly protruded from the plastic layers. The end faces of the 31, 32 are fixed by the screws 60 in the corresponding locking holes 11 and the screw holes 35, thereby fixing the first limiting member 30A and the second limiting member 30B. Between the two metal end plates 10, 20. In this embodiment, the first limiting member 30A and the second limiting member 30B respectively have two metal bars, and each of the first limiting member 30A and the second limiting member 30B is provided on each end surface thereof. The two fixing members 30A and the second limiting member 30B are firmly fixed to the two metal end plates 10 and 20 to avoid the metal rod as the central axis. Rotate.

In addition, the two ends of the metal rods 44 in the first support member 40A and the second support member 40B have a screw hole 45, and the two ends of the metal rods 44 are slightly protruded from the plastic layers 41. The end surface of the 42 is fixed to the corresponding locking hole 11 and each of the screw holes 45 by screws 60, thereby fixing the first supporting member 40A and the second supporting member 40B to the second metal. Between the end plates 10, 20.

In this embodiment, each of the metal end plates 10, 20 is provided with a sealing gasket 70 on each of the locking holes 11, 21 for locking and tightening the screws 60 to seal the locking holes 11, 21, Thereby, acid, alkali and organic solutions are prevented from infiltrating into the respective locking holes 11, 21 and remaining in the structural gap.

The wafer cassette 1 of the embodiment of the invention has two metal end plates 10, 20, a limiting unit 30 and a supporting unit 40. The limiting unit 30 and the supporting unit 40 respectively have metal rods 34, 44 and are coated on The plastic layer 31, 32, 41, 42 which is resistant to acid, alkali and organic solution and high temperature resistance outside the metal rods 34, 44, is used to raise the limiting unit 30 and the support by the metal rods 34, 44 The strength of the unit 40, according to which the wafer crucible 1 of the embodiment of the invention has good mechanical strength and can withstand the acid, alkali, organic solution and high temperature resistance used in the process, and further, the limiting unit 30 and In the supporting unit 40, the plastic layer can be formed by using plastic and internally penetrating the metal rod, or the plastic layer can be coated or coated on the surface of the metal rod, and then assembled with the two metal end plates 10, 20, and the processing is further processed. Easy and more precise control of manufacturing.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

1‧‧‧ Wafer
10‧‧‧Metal end plates
11‧‧‧Lock hole
20‧‧‧Metal end plates
21‧‧‧Lock hole
30‧‧‧Limited unit
30A‧‧‧First limiter
30B‧‧‧second limiter
31‧‧‧ plastic layer
32‧‧‧Plastic layer
33‧‧‧First limit slot
34‧‧‧Metal rod
35‧‧‧ screw holes
40‧‧‧Support unit
40A‧‧‧First support
40B‧‧‧second support
41‧‧‧Plastic layer
42‧‧‧Plastic layer
43‧‧‧Second limit slot
44‧‧‧Metal rod
45‧‧‧ screw holes
50‧‧‧ accommodating space
60‧‧‧ screws
70‧‧‧Sealing washer
2‧‧‧ wafer

FIG. 1 is an exploded perspective view of a wafer cassette in an embodiment of the present invention. 2 is a schematic view of a wafer in a wafer cassette in an embodiment of the present invention. FIG. 3 is another schematic diagram of accommodating a wafer in a wafer cassette in the embodiment of the present invention.

1‧‧‧ Wafer

10‧‧‧Metal end plates

11‧‧‧Lock hole

20‧‧‧Metal end plates

30‧‧‧Limited unit

30A‧‧‧First limiter

30B‧‧‧second limiter

31‧‧‧ plastic layer

32‧‧‧Plastic layer

33‧‧‧First limit slot

34‧‧‧Metal rod

35‧‧‧ screw holes

40‧‧‧Support unit

40A‧‧‧First support

40B‧‧‧second support

41‧‧‧Plastic layer

42‧‧‧Plastic layer

43‧‧‧Second limit slot

44‧‧‧Metal rod

45‧‧‧ screw holes

50‧‧‧ accommodating space

60‧‧‧ screws

70‧‧‧Sealing washer

Claims (11)

A wafer cassette for accommodating at least one wafer, comprising: a metal end plate; a limiting unit, wherein the two ends are respectively connected to the two metal end plates, and the limiting unit comprises a first limit set apart And a second limiting member, the first limiting member and the second limiting member have a plurality of first limiting slots, and the first limiting member and the second limiting member respectively have At least one metal rod and a plastic layer covering the at least one metal rod; and a supporting unit, the two ends of which are respectively connected to the two metal end plates, the supporting unit has a plurality of second limiting slots, the first The second limiting slot is aligned with the first limiting slot; wherein the two metal end plates, the limiting unit and the supporting unit are defined for accommodating one of the at least one wafer accommodating space Each of the wafers is limited to the first limiting slots and the second limiting slots. The wafer cassette of claim 1, wherein the support unit comprises a first support member and a second support member disposed to support the at least one wafer, and the first support member is The second support member is formed with the second support groove, and the first support member and the second support member respectively have at least one metal bar and a plastic layer covering the at least one metal bar. The wafer cassette of claim 2, wherein the plastic layer of the first limiting member and the second limiting member is plastically molded and internally disposed with the at least one metal rod, the first supporting member The plastic layer of the second support member is plastically molded and internally provided with the at least one metal rod. The wafer cassette of claim 2, wherein the first limiting member and the plastic layer of the second limiting member are coated or coated on the surface of the at least one metal rod, the first supporting member and the first supporting member The plastic layer of the second support member is coated or coated on the surface of the at least one metal rod. The wafer cassette of claim 2, wherein each of the metal end plates has a plurality of locking holes for locking the limiting unit and the supporting unit by screws. The wafer cassette of claim 5, wherein each of the metal end plates has a sealing gasket disposed on each of the locking holes for locking and tightening the locking holes. The wafer cassette of claim 6, wherein the first limiting member and the second end of the metal rod in the second limiting member have a screw hole for locking by a screw Each of the locking holes and each of the screw holes. The wafer cassette of claim 6, wherein the first support member and the metal rod of the second support member have a screw hole at the two ends of the second support member for locking by the screw Locking holes and each of the screw holes. The wafer cassette according to any one of claims 2 to 8, wherein the plastic layer is made of polytetrafluoroethylene, polyvinyl chloride, polypropylene or polyfluorinated ethylene. The wafer cassette of claim 9, wherein the first limiting member and the second limiting member respectively have two metal bars. The wafer cassette of claim 10, wherein the two metal end plates and the metal rods are made of stainless steel.