TW201636793A - Tactile sensing device - Google Patents

Tactile sensing device Download PDF

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TW201636793A
TW201636793A TW104136343A TW104136343A TW201636793A TW 201636793 A TW201636793 A TW 201636793A TW 104136343 A TW104136343 A TW 104136343A TW 104136343 A TW104136343 A TW 104136343A TW 201636793 A TW201636793 A TW 201636793A
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haptic
buffer
compressible
buffer structures
tactile
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TW104136343A
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TWI573063B (en
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hong-jie Lu
yan-heng Huang
zong-kai Chen
li-ting Zheng
shi-jie Huang
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Interface Optoelectronics Shenzhen Co Ltd
Gen Interface Solution Ltd
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Abstract

The invention discloses a tactile sensing device. The tactile sensing device comprises an ultrasonic wave sensor, a plurality of tactile buffer structures and a plurality of compressible buffer structures. The ultrasonic wave sensor is provided with a surface, the surface is provided with a plurality of first units and a plurality of second units, and the first units and the second units are arranged alternately. The tactile buffer structures are located on the first units respectively, the compressible buffer structures are located on the second units respectively, and each tactile buffer structure is spaced from the compressible buffer structures adjacent to the tactile buffer structure. The thickness of the compressible buffer structures is larger than that of the tactile buffer structures, and when the compressible buffer structures and the tactile buffer structures suffer from external force, the thickness of the compressible buffer structures is smaller than or equal to the thickness of the tactile buffer structures. The buffer structures having high and low potential differences are arranged on the ultrasonic wave sensor so that protection and high resolution can be achieved at the same time.

Description

觸覺感測裝置Tactile sensing device

本發明係關於一種感測裝置,且特別關於一種觸覺感測裝置。The present invention relates to a sensing device, and more particularly to a tactile sensing device.

碰觸感測器是一種感測元件或是系統,例如是觸覺感測器。觸覺感測器的功用例如在於模仿生物皮膚上的觸覺。藉由感測器與待測物體的直接接觸,所產生的物理效應,可以測得接觸時的狀態與待測物體表面的物理性質,例如接觸時的作用力或壓力的大小與在空間上的分佈。物理性質又例如是待測物體的位置、待測物體的形狀、物體表面的紋路質地,溫度、硬/軟度或濕度等特性。The touch sensor is a sensing element or system, such as a tactile sensor. The function of the tactile sensor is, for example, to mimic the tactile sensation on the biological skin. By the physical contact between the sensor and the object to be tested, the physical state of the contact and the physical properties of the surface of the object to be tested can be measured, such as the force or pressure of the contact and the spatial space. distributed. The physical properties are, for example, the position of the object to be tested, the shape of the object to be tested, the texture of the surface of the object, temperature, hardness/softness or humidity.

單一的碰觸感測器可以用來做為開關。另外,若是二維的碰觸感測器就可以得到觸覺影像 (tactile image)。因此,碰觸感測器的應用領域非常地廣泛,例如在機器人上,碰觸感測器是控制機器人的動作,例如抓取物體,是運動時不可缺少的感測器。在資訊電腦領域方面,碰觸感測器結合顯示器,以用來做為觸控輸入裝置,目前已廣泛地應用於平板電腦(Tablet PC)或是個人數位助理(Personal Digital Assistant,PDA)上的觸控面板。此外,碰觸感測器也可以做為指紋辨識等用途。目前高解析度的碰觸感測器,如第1圖所示,主要是利用超音波感測器10搭配一不能太薄的緩衝層12,來達到保護作為壓力感測元件的超音波感測器10的目的,但若欲同時達到高解析力的壓力感測,此緩衝層12的厚度不能過厚,因為緩衝層12過厚會造成超音波感測器10收不到超音波被反射回來的訊號,亦達不到觸覺感測的效果。A single touch sensor can be used as a switch. In addition, a tactile image can be obtained if it is a two-dimensional touch sensor. Therefore, the application field of the touch sensor is very wide. For example, on the robot, the touch sensor is an action that controls the robot, such as grabbing an object, and is an indispensable sensor during exercise. In the field of information computers, touch sensors combined with displays for use as touch input devices have been widely used in tablet PCs or personal digital assistants (PDAs). Touch panel. In addition, the touch sensor can also be used for fingerprint recognition and the like. At present, the high-resolution touch sensor, as shown in FIG. 1 , mainly uses the ultrasonic sensor 10 with a buffer layer 12 that is not too thin to protect the ultrasonic sensing as a pressure sensing element. The purpose of the device 10, but if it is desired to simultaneously achieve high resolution pressure sensing, the thickness of the buffer layer 12 should not be too thick, because the buffer layer 12 is too thick, so that the ultrasonic sensor 10 does not receive the ultrasonic waves reflected back. The signal does not reach the effect of tactile sensing.

因此,本發明係在針對上述的困擾,提出一種觸覺感測裝置,以解決習知所產生的問題。Accordingly, the present invention has been made in view of the above-mentioned problems, and a tactile sensing device is proposed to solve the problems caused by the prior art.

本發明的主要目的,在於提供一種觸覺感測裝置,其係於超音波感測器上設有高低位差的緩衝結構,以達到具有保護元件及高解析力的能力,進而應用於機械人手指觸覺功能上。The main object of the present invention is to provide a tactile sensing device which is provided with a buffer structure with high and low level difference on the ultrasonic sensor to achieve the function of protecting components and high resolution, and is applied to a robot finger. Tactile function.

為達上述目的,本發明提供一種觸覺感測裝置,其係包含一超音波感測器、複數個觸覺緩衝結構與複數個可壓縮式緩衝結構。超音波感測器具有一表面,例如為平面,此表面具有複數個第一單元與複數個第二單元,複數個第一單元與複數個第二單元呈交替式排列。複數個觸覺緩衝結構分別位於複數個第一單元上,複數個可壓縮式緩衝結構分別位於複數個第二單元上,每一觸覺緩衝結構與其相鄰之可壓縮式緩衝結構相間隔,且複數個可壓縮式緩衝結構之厚度大於複數個觸覺緩衝結構之厚度。在複數個可壓縮式緩衝結構與複數個觸覺緩衝結構接受外力時,複數個可壓縮式緩衝結構之厚度小於或等於複數個觸覺緩衝結構之厚度。To achieve the above object, the present invention provides a tactile sensing device comprising an ultrasonic sensor, a plurality of tactile buffer structures and a plurality of compressible buffer structures. The ultrasonic sensor has a surface, such as a plane, having a plurality of first cells and a plurality of second cells, and the plurality of first cells and the plurality of second cells are alternately arranged. A plurality of haptic buffer structures are respectively located on the plurality of first units, and the plurality of compressible buffer structures are respectively located on the plurality of second units, and each of the haptic buffer structures is spaced apart from the adjacent compressible buffer structure, and the plurality of The thickness of the compressible buffer structure is greater than the thickness of the plurality of haptic buffer structures. When a plurality of compressible buffer structures and a plurality of haptic buffer structures receive an external force, the thickness of the plurality of compressible buffer structures is less than or equal to the thickness of the plurality of haptic buffer structures.

超音波感測器更包含一基板、一電極層與一壓電層,電極層設於基板上,壓電層設於電極層上,壓電層具有上述表面。The ultrasonic sensor further comprises a substrate, an electrode layer and a piezoelectric layer, the electrode layer is disposed on the substrate, the piezoelectric layer is disposed on the electrode layer, and the piezoelectric layer has the surface.

複數個觸覺緩衝結構之材質為有機材料、無機材料或有機無機混成材料。The material of the plurality of tactile buffer structures is an organic material, an inorganic material or an organic-inorganic hybrid material.

複數個可壓縮式緩衝結構之材質為有機材料、無機材料或有機無機混成材料。The material of the plurality of compressible buffer structures is an organic material, an inorganic material or an organic-inorganic hybrid material.

複數個觸覺緩衝結構與複數個可壓縮式緩衝結構之材質為聚二甲基矽氧烷(polydimethylsiloxane, PDMS)。The plurality of tactile buffer structures and the plurality of compressible buffer structures are made of polydimethylsiloxane (PDMS).

複數個第一單元與複數個第二單元呈棋盤式排列。The plurality of first units and the plurality of second units are arranged in a checkerboard pattern.

觸覺緩衝結構之面積大於或等於壓縮式緩衝結構之面積。The area of the haptic buffer structure is greater than or equal to the area of the compression buffer structure.

複數個觸覺緩衝結構在上述表面佔有之面積密度大於或等於壓縮式緩衝結構。The plurality of tactile buffer structures occupy an area density on the surface greater than or equal to the compression buffer structure.

複數個可壓縮式緩衝結構之厚度大於複數個觸覺緩衝結構之厚度時,複數個可壓縮式緩衝結構之厚度大於或等於3厘米。When the thickness of the plurality of compressible buffer structures is greater than the thickness of the plurality of tactile buffer structures, the thickness of the plurality of compressible buffer structures is greater than or equal to 3 cm.

複數個可壓縮式緩衝結構之厚度大於複數個觸覺緩衝結構之厚度時,複數個觸覺緩衝結構之厚度小於5厘米。When the thickness of the plurality of compressible buffer structures is greater than the thickness of the plurality of tactile buffer structures, the thickness of the plurality of tactile buffer structures is less than 5 cm.

觸覺緩衝結構為可壓縮式材質。The tactile buffer structure is a compressible material.

茲為使 貴審查委員對本發明的結構特徵及所達成的功效更有進一步的瞭解與認識,謹佐以較佳的實施例圖及配合詳細的說明,說明如後:In order to give your reviewers a better understanding and understanding of the structural features and efficacies of the present invention, the following is a description of the preferred embodiment and the detailed description.

目前觸覺感測器應用層面相當廣泛,除了可應用於機械手臂外,在生醫方面,若將觸覺感測器置於義肢的表面,當使用者碰觸物體時,則可得到近似於人體皮膚觸摸般的觸覺。觸覺感測器也可以應用於足部感測,當使用者站在觸覺感測器上時,根據受力分佈及受力大小就可以確切得知腳掌形狀、重心位置等。而為了因應工業界、娛樂或生醫環境中多變的彎曲表面,甚至要將觸覺感測器應用於軟性顯示器上,則元件尚有可撓曲及透明度的要求。本發明所介紹的觸覺感測裝置,除了能應用於機械人手指觸覺功能外,亦可應用於其他如工業、娛樂或生醫的領域中。At present, the application of tactile sensors is quite extensive. In addition to being applicable to mechanical arms, in the case of biomedicine, if the tactile sensor is placed on the surface of the prosthetic, when the user touches the object, it can be approximated to human skin. Touch-like touch. The tactile sensor can also be applied to the foot sensing. When the user stands on the tactile sensor, the shape of the sole, the position of the center of gravity, and the like can be accurately determined according to the distribution of the force and the magnitude of the force. In order to respond to the ever-changing curved surfaces in industrial, recreational or biomedical environments, even the use of tactile sensors on flexible displays requires flexibility and transparency. The tactile sensing device introduced by the present invention can be applied to other fields such as industrial, entertainment or biomedical in addition to the function of the finger touch of a robot.

首先介紹本發明之第一實施例,請參閱第2(a)圖。本發明之觸覺感測裝置包含一超音波感測器14、複數個觸覺緩衝結構16與複數個可壓縮式緩衝結構18,觸覺緩衝結構16與可壓縮式緩衝結構18之材質可相同亦可相異。觸覺緩衝結構16之材質為有機材料、無機材料、有機無機混成材料或可壓縮式材質,例如為聚二甲基矽氧烷(polydimethylsiloxane, PDMS)。可壓縮式緩衝結構18之材質為有機材料、無機材料或有機無機混成材料,例如為聚二甲基矽氧烷。超音波感測器14具有一表面,例如為一平面,此表面具有呈交替式排列之所有第一單元與所有第二單元,所有觸覺緩衝結構16分別位於所有第一單元上,所有可壓縮式緩衝結構18分別位於所有第二單元上。由於所有第一單元與所有第二單元呈交替式排列,故所有觸覺緩衝結構16與所有可壓縮式緩衝結構18亦呈交替式排列。此外,此交替式排列亦可以棋盤式排列呈現。且由於可壓縮式緩衝結構18在被施加外力時會產生形變,故每一觸覺緩衝結構16需與其相鄰之可壓縮式緩衝結構18相間隔。First, a first embodiment of the present invention will be described, see Fig. 2(a). The haptic sensing device of the present invention comprises an ultrasonic sensor 14, a plurality of haptic buffer structures 16 and a plurality of compressible buffer structures 18, and the materials of the haptic buffer structure 16 and the compressible buffer structure 18 can be the same or different. The material of the haptic buffer structure 16 is an organic material, an inorganic material, an organic-inorganic hybrid material or a compressible material, such as polydimethyl siloxane (PDMS). The material of the compressible buffer structure 18 is an organic material, an inorganic material or an organic-inorganic hybrid material, such as polydimethyl siloxane. The ultrasonic sensor 14 has a surface, such as a plane having all of the first cells and all of the second cells in an alternating arrangement, all of the tactile buffer structures 16 are located on all of the first cells, all compressible Buffer structures 18 are located on all of the second units, respectively. Since all of the first unit and all of the second units are alternately arranged, all of the haptic buffer structures 16 and all of the compressible buffer structures 18 are also alternately arranged. In addition, this alternate arrangement can also be presented in a checkerboard arrangement. And because the compressible buffer structure 18 deforms when an external force is applied, each of the haptic buffer structures 16 needs to be spaced apart from its adjacent compressible buffer structure 18.

本發明之第一實施例在尺寸上之設計中,觸覺緩衝結構16之面積大於或等於壓縮式緩衝結構18之面積,所有觸覺緩衝結構16在超音波感測器14之表面佔有之面積密度大於或等於所有壓縮式緩衝結構18在超音波感測器14之表面佔有之面積密度。在所有觸覺緩衝結構16與所有可壓縮式緩衝結構18未被施加外力時,所有可壓縮式緩衝結構18之厚度H2大於所有觸覺緩衝結構16之厚度H1,在實際製作上,所有可壓縮式緩衝結構18之厚度H2大於或等於3厘米,所有觸覺緩衝結構16之厚度H1則小於5厘米。因為觸覺緩衝結構16之厚度比較薄,保護能力較弱,所以設置更厚之可壓縮式緩衝結構18,以強化保護能力,但可壓縮式緩衝結構18並不是愈厚愈好,厚度太厚時,超音波之信號傳輸靈敏度會受影響,即可能會收不到超音波訊號。In a first embodiment of the present invention, the area of the tactile buffer structure 16 is greater than or equal to the area of the compression buffer structure 18, and the area density of all the tactile buffer structures 16 on the surface of the ultrasonic sensor 14 is greater than Or equal to the area density occupied by all of the compression buffer structures 18 on the surface of the ultrasonic sensor 14. When all of the haptic buffer structure 16 and all of the compressible buffer structures 18 are not subjected to an external force, the thickness H2 of all the compressible buffer structures 18 is greater than the thickness H1 of all the haptic buffer structures 16, and in actual production, all compressible buffers The thickness H2 of the structure 18 is greater than or equal to 3 cm, and the thickness H1 of all of the tactile cushioning structures 16 is less than 5 cm. Since the thickness of the haptic buffer structure 16 is relatively thin and the protection ability is weak, a thicker compressible buffer structure 18 is provided to enhance the protection capability, but the compressible buffer structure 18 is not as thick as possible, and when the thickness is too thick The signal transmission sensitivity of the ultrasonic wave will be affected, that is, the ultrasonic signal may not be received.

當所有觸覺緩衝結構16與所有可壓縮式緩衝結構18接受如按壓力之外力時,如第2(b)圖所示,所有可壓縮式緩衝結構18之厚度H4小於或等於所有觸覺緩衝結構16之厚度H3。本發明為了避免收不到超音波訊號,將觸覺緩衝結構16與可壓縮式緩衝結構18設計成厚度相異型態,只有觸覺緩衝結構16與可壓縮式緩衝結構18齊平時,超音波感測器14才能收到訊號。換句話說,本發明未被按壓時,厚度較厚之可壓縮式緩衝結構18提供極佳之保護作用,按壓後,觸覺緩衝結構16與可壓縮式緩衝結構18之厚度相同,信號傳輸就不受影響,達到高解析力之壓力感測,同時按壓力也得到平均。When all of the haptic buffer structures 16 and all of the compressible cushioning structures 18 are subjected to a force other than pressing, as shown in FIG. 2(b), the thickness H4 of all of the compressible buffer structures 18 is less than or equal to all of the haptic buffer structures 16 . The thickness H3. In order to avoid receiving the ultrasonic signal, the tactile buffer structure 16 and the compressible buffer structure 18 are designed to be different in thickness. When only the tactile buffer structure 16 is flush with the compressible buffer structure 18, the ultrasonic sensing is performed. The device 14 can receive the signal. In other words, when the present invention is not pressed, the thicker compressible buffer structure 18 provides excellent protection. After pressing, the tactile buffer structure 16 has the same thickness as the compressible buffer structure 18, and the signal transmission is not Affected, high-resistance pressure sensing is achieved, and pressure is also averaged.

以下介紹本發明之第二實施例,請參閱第3(a)圖。本發明之觸覺感測裝置包含一超音波感測器14、複數個觸覺緩衝結構16與複數個可壓縮式緩衝結構18。超音波感測器14更包含一基板20、一電極層22與一壓電層24,電極層22設於基板20上,壓電層24設於電極層22上,壓電層24具有上述表面。當電極層22對壓電層24施加電壓時,壓電層24根據壓電效應會產生振動,進而影響周邊空氣產生超音波。當超音波被反射回來,並入射至壓電層24時,根據壓電效應,壓電層24因受振動而產生電壓,以供電極層22接收。觸覺緩衝結構16與可壓縮式緩衝結構18之材質可相同亦可相異。觸覺緩衝結構16之材質為有機材料、無機材料、有機無機混成材料或可壓縮式材質,例如為聚二甲基矽氧烷(polydimethylsiloxane, PDMS)。可壓縮式緩衝結構18之材質為有機材料、無機材料或有機無機混成材料,例如為聚二甲基矽氧烷。超音波感測器14具有一表面,例如為一平面,此表面具有呈交替式排列之所有第一單元與所有第二單元,所有觸覺緩衝結構16分別位於所有第一單元上,所有可壓縮式緩衝結構18分別位於所有第二單元上。由於所有第一單元與所有第二單元呈交替式排列,故所有觸覺緩衝結構16與所有可壓縮式緩衝結構18亦呈交替式排列。此外,此交替式排列亦可以棋盤式排列呈現。且由於可壓縮式緩衝結構18在被施加外力時會產生形變,故每一觸覺緩衝結構16需與其相鄰之可壓縮式緩衝結構18相間隔。A second embodiment of the present invention will now be described, see Fig. 3(a). The haptic sensing device of the present invention includes an ultrasonic sensor 14, a plurality of haptic buffer structures 16 and a plurality of compressible buffer structures 18. The ultrasonic sensor 14 further includes a substrate 20, an electrode layer 22 and a piezoelectric layer 24. The electrode layer 22 is disposed on the substrate 20. The piezoelectric layer 24 is disposed on the electrode layer 22. The piezoelectric layer 24 has the surface. . When the electrode layer 22 applies a voltage to the piezoelectric layer 24, the piezoelectric layer 24 generates vibration according to the piezoelectric effect, thereby affecting the surrounding air to generate ultrasonic waves. When the ultrasonic wave is reflected back and incident on the piezoelectric layer 24, the piezoelectric layer 24 generates a voltage due to the vibration according to the piezoelectric effect, and is received by the electrode layer 22. The material of the haptic buffer structure 16 and the compressible buffer structure 18 may be the same or different. The material of the haptic buffer structure 16 is an organic material, an inorganic material, an organic-inorganic hybrid material or a compressible material, such as polydimethyl siloxane (PDMS). The material of the compressible buffer structure 18 is an organic material, an inorganic material or an organic-inorganic hybrid material, such as polydimethyl siloxane. The ultrasonic sensor 14 has a surface, such as a plane having all of the first cells and all of the second cells in an alternating arrangement, all of the tactile buffer structures 16 are located on all of the first cells, all compressible Buffer structures 18 are located on all of the second units, respectively. Since all of the first unit and all of the second units are alternately arranged, all of the haptic buffer structures 16 and all of the compressible buffer structures 18 are also alternately arranged. In addition, this alternate arrangement can also be presented in a checkerboard arrangement. And because the compressible buffer structure 18 deforms when an external force is applied, each of the haptic buffer structures 16 needs to be spaced apart from its adjacent compressible buffer structure 18.

本發明之第二實施例在尺寸上之設計中,觸覺緩衝結構16之面積大於或等於壓縮式緩衝結構18之面積,所有觸覺緩衝結構16在超音波感測器14之表面佔有之面積密度大於或等於所有壓縮式緩衝結構18在超音波感測器14之表面佔有之面積密度。在所有觸覺緩衝結構16與所有可壓縮式緩衝結構18未被施加外力時,所有可壓縮式緩衝結構18之厚度H2大於所有觸覺緩衝結構16之厚度H1,在實際製作上,所有可壓縮式緩衝結構18之厚度H2大於或等於3厘米,所有觸覺緩衝結構16之厚度H1則小於5厘米。因為觸覺緩衝結構16之厚度比較薄,保護能力較弱,所以設置更厚的可壓縮式緩衝結構18,以強化保護能力,但可壓縮式緩衝結構18並不是愈厚愈好,厚度太厚時,超音波之信號傳輸靈敏度會受影響,即可能會收不到超音波訊號。In a second embodiment of the present invention, the area of the tactile buffer structure 16 is greater than or equal to the area of the compression buffer structure 18, and the area density of all the tactile buffer structures 16 on the surface of the ultrasonic sensor 14 is greater than Or equal to the area density occupied by all of the compression buffer structures 18 on the surface of the ultrasonic sensor 14. When all of the haptic buffer structure 16 and all of the compressible buffer structures 18 are not subjected to an external force, the thickness H2 of all the compressible buffer structures 18 is greater than the thickness H1 of all the haptic buffer structures 16, and in actual production, all compressible buffers The thickness H2 of the structure 18 is greater than or equal to 3 cm, and the thickness H1 of all of the tactile cushioning structures 16 is less than 5 cm. Since the thickness of the haptic buffer structure 16 is relatively thin and the protection ability is weak, a thicker compressible buffer structure 18 is provided to enhance the protection capability, but the compressible buffer structure 18 is not as thick as possible, and when the thickness is too thick The signal transmission sensitivity of the ultrasonic wave will be affected, that is, the ultrasonic signal may not be received.

當所有觸覺緩衝結構16與所有可壓縮式緩衝結構18接受如按壓力之外力時,如第3(b)圖所示,所有可壓縮式緩衝結構18之厚度H4小於或等於所有觸覺緩衝結構16之厚度H3。本發明為了避免收不到超音波訊號,將觸覺緩衝結構16與可壓縮式緩衝結構18設計成厚度相異型態,只有觸覺緩衝結構16與可壓縮式緩衝結構18齊平時,超音波感測器14才能收到訊號。換句話說,本發明未被按壓時,厚度較厚之可壓縮式緩衝結構18提供極佳之保護作用,按壓後,觸覺緩衝結構16與可壓縮式緩衝結構18之厚度相同,信號傳輸就不受影響,達到高解析力之壓力感測,同時按壓力也得到平均。When all of the haptic buffer structures 16 and all of the compressible cushioning structures 18 are subjected to a force other than pressing, as shown in FIG. 3(b), the thickness H4 of all of the compressible cushioning structures 18 is less than or equal to all of the haptic buffer structures 16 . The thickness H3. In order to avoid receiving the ultrasonic signal, the tactile buffer structure 16 and the compressible buffer structure 18 are designed to be different in thickness. When only the tactile buffer structure 16 is flush with the compressible buffer structure 18, the ultrasonic sensing is performed. The device 14 can receive the signal. In other words, when the present invention is not pressed, the thicker compressible buffer structure 18 provides excellent protection. After pressing, the tactile buffer structure 16 has the same thickness as the compressible buffer structure 18, and the signal transmission is not Affected, high-resistance pressure sensing is achieved, and pressure is also averaged.

綜上所述,本發明於超音波感測器上安裝具有不同厚度之緩衝結構,以得到兼具保護能力與高解析力之觸覺感測裝置,並將其應用於機械人手指觸覺功能上,使機械人手指在不會損壞之前提下,達到高靈敏感測之能力。In summary, the present invention installs a buffer structure having different thicknesses on the ultrasonic sensor to obtain a tactile sensing device having both protection capability and high resolution, and applies it to the mechanical finger touch function. The robot's fingers are lifted before they are damaged, and the ability to measure sensitively is achieved.

10‧‧‧超音波感測器
12‧‧‧緩衝層
14‧‧‧超音波感測器
16‧‧‧觸覺緩衝結構
18‧‧‧可壓縮式緩衝結構
20‧‧‧基板
22‧‧‧電極層
24‧‧‧壓電層
10‧‧‧ Ultrasonic Sensor
12‧‧‧ Buffer layer
14‧‧‧Ultrasonic Sensor
16‧‧‧Touch buffer structure
18‧‧‧Compressible buffer structure
20‧‧‧Substrate
22‧‧‧Electrical layer
24‧‧‧ piezoelectric layer

第1圖為先前技術之碰觸感測器之結構示意圖。 第2(a)圖為本發明之第一實施例於未被施加外力時之結構示意圖。 第2(b)圖為本發明之第一實施例於被施加外力時之結構示意圖。 第3(a)圖為本發明之第二實施例於未被施加外力時之結構示意圖。 第3(b)圖為本發明之第二實施例於被施加外力時之結構示意圖。FIG. 1 is a schematic structural view of a touch sensor of the prior art. Fig. 2(a) is a schematic view showing the structure of the first embodiment of the present invention when no external force is applied. Fig. 2(b) is a schematic view showing the structure of the first embodiment of the present invention when an external force is applied. Fig. 3(a) is a schematic view showing the structure of the second embodiment of the present invention when no external force is applied. Fig. 3(b) is a schematic view showing the structure of the second embodiment of the present invention when an external force is applied.

14‧‧‧超音波感測器 14‧‧‧Ultrasonic Sensor

16‧‧‧觸覺緩衝結構 16‧‧‧Touch buffer structure

18‧‧‧可壓縮式緩衝結構 18‧‧‧Compressible buffer structure

Claims (11)

一種觸覺感測裝置,包含:   一超音波感測器,其係具有一表面,該表面具有複數個第一單元與複數個第二單元,該些第一單元與該些第二單元呈交替式排列;   複數個觸覺緩衝結構,其係分別位於該些第一單元上;以及   複數個可壓縮式緩衝結構,其係分別位於該些第二單元上,每一該觸覺緩衝結構與其相鄰之該可壓縮式緩衝結構相間隔,且該些可壓縮式緩衝結構之厚度大於該些觸覺緩衝結構之厚度,在該些可壓縮式緩衝結構與該些觸覺緩衝結構接受外力時,該些可壓縮式緩衝結構之厚度小於或等於該些觸覺緩衝結構之厚度。A tactile sensing device comprising: an ultrasonic sensor having a surface having a plurality of first cells and a plurality of second cells, wherein the first cells are alternated with the second cells Arranging; a plurality of haptic buffer structures respectively located on the first units; and a plurality of compressible buffer structures respectively located on the second units, each of the haptic buffer structures being adjacent thereto The compressible buffer structures are spaced apart, and the thickness of the compressible buffer structures is greater than the thickness of the tactile buffer structures. When the compressible buffer structures and the tactile buffer structures receive external forces, the compressible The thickness of the buffer structure is less than or equal to the thickness of the tactile buffer structures. 如請求項1所述之觸覺感測裝置,其中該超音波感測器更包含: 一基板; 一電極層,其係設於該基板上;以及 一壓電層,其係設於該電極層上,該壓電層具有該表面。The haptic sensor device of claim 1, wherein the ultrasonic sensor further comprises: a substrate; an electrode layer disposed on the substrate; and a piezoelectric layer disposed on the electrode layer The piezoelectric layer has the surface. 如請求項1所述之觸覺感測裝置,其中該些觸覺緩衝結構之材質為有機材料、無機材料或有機無機混成材料。The haptic sensing device of claim 1, wherein the haptic buffer structure is made of an organic material, an inorganic material or an organic-inorganic hybrid material. 如請求項1所述之觸覺感測裝置,其中該些可壓縮式緩衝結構之材質為有機材料、無機材料或有機無機混成材料。The haptic sensing device of claim 1, wherein the compressible buffer structure is made of an organic material, an inorganic material or an organic-inorganic hybrid material. 如請求項1所述之觸覺感測裝置,其中該些觸覺緩衝結構之材質為聚二甲基矽氧烷,該些可壓縮式緩衝結構之材質為聚二甲基矽氧烷。The haptic sensing device of claim 1, wherein the haptic buffer structure is made of polydimethyl siloxane, and the compressible buffer structure is made of polydimethyl siloxane. 如請求項1所述之觸覺感測裝置,其中該些第一單元與該些第二單元呈棋盤式排列。The haptic sensing device of claim 1, wherein the first units and the second units are arranged in a checkerboard manner. 如請求項1所述之觸覺感測裝置,其中該觸覺緩衝結構之面積大於或等於該壓縮式緩衝結構之面積。The haptic sensing device of claim 1, wherein an area of the haptic buffer structure is greater than or equal to an area of the compression buffer structure. 如請求項1所述之觸覺感測裝置,其中該些觸覺緩衝結構在該表面佔有之面積密度大於或等於該些壓縮式緩衝結構。The haptic sensing device of claim 1, wherein the haptic buffer structures occupy an area density on the surface greater than or equal to the compression buffer structures. 如請求項1所述之觸覺感測裝置,其中該些可壓縮式緩衝結構之厚度大於該複數個觸覺緩衝結構之厚度時,該些可壓縮式緩衝結構之厚度大於或等於3厘米。The haptic sensing device of claim 1, wherein the compressible buffer structures have a thickness greater than or equal to 3 cm when the thickness of the compressible buffer structures is greater than the thickness of the plurality of haptic buffer structures. 如請求項1所述之觸覺感測裝置,其中該些可壓縮式緩衝結構之厚度大於該些觸覺緩衝結構之厚度時,該些觸覺緩衝結構之厚度小於5厘米。The haptic sensing device of claim 1, wherein the thickness of the haptic buffer structures is less than 5 cm when the thickness of the compressible buffer structures is greater than the thickness of the haptic buffer structures. 如請求項1所述之觸覺感測裝置,其中該觸覺緩衝結構為可壓縮式材質。The haptic sensing device of claim 1, wherein the haptic buffer structure is a compressible material.
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