TW201636791A - Touch panel and bonding structure thereof - Google Patents

Abstract

A bonding structure is applied to a touch panel. The bonding structure includes a plurality of first bonding pads and a plurality of second bonding pads. The first bonding pads are disposed on the bonding zone arranged in a first direction sequentially. The second bonding pads arranged in the first direction sequentially and the first bonding pads are disposed on the bonding zone alternately. The second bonding pads and the first bonding pads are insulated to each other. The projection positions of the first bonding pads and the second bonding pads in the first direction are overlapped or tangent.

Description

Touch panel and joint structure thereof

The present invention relates to a touch panel and an engaging structure thereof.

With the rapid development of technology, touch technology has become common in life, such as cash machines, electronic ticket vending machines, information inquiry systems or access control identification systems, and even portable electronic devices such as smart phones, tablets or notebooks. computer.

In the current common touch technology, the signal in the touch sensing area is transmitted to the circuit board through the wire, and then the signal is transmitted to the controller through the circuit board, so that the controller can perform subsequent processing of the touch signal. The circuit board is usually electrically connected to the wires through a bonding pad attached to the touch panel. If the board does not fit snugly on the bond pad, the touch panel will not function properly. The conventional bonding pads are long strips, single widths and sequentially spaced, and the difference in tensile force between the bonding pads and the adjacent bonding pads is large, and the tensile value is not uniform, resulting in bonding strength between the bonding pads and the circuit board. not enough. Therefore, how to improve the bonding strength between the bonding pad and the circuit board has become one of the important issues.

In view of the above problems, an object of the present invention is to provide a touch panel and a bonding structure thereof which can improve the bonding strength between a bonding pad and a circuit board.

To achieve the above object, a joint structure according to the present invention includes a plurality of first joint pads and a plurality of second bond pads. The first bonding pads are disposed in a bonding area and are sequentially arranged along a first direction. The second bonding pad and the first bonding pads are alternately arranged in the bonding region, and are sequentially arranged in the first direction. The second bonding pads and the first bonding pads are electrically insulated from each other. The first bonding pads adjacent to each other partially overlap or are tangent to the projection positions of the second bonding pads in the first direction.

In an embodiment, the first bonding pads have at least a first portion and a second portion The first portion extends along the first direction, and the second portion extends along a second direction and is coupled to the first portion, and the width of the first portion in the first direction is greater than the second portion The width of the portion in the first direction.

In an embodiment, the first portion is located at one end of the second portion.

In an embodiment, the second bonding pads have at least one third portion and a fourth portion, the third portion extends along the first direction, the fourth portion extends along the second direction, and the first portion a three-part connection, and a width of the third portion in the first direction is greater than a width of the fourth portion in the first direction, and the adjacent first portion and the third portion are in the second direction The projection positions do not overlap, and the projected positions of the adjacent first portion and the third portion in the first direction partially overlap or are tangent.

In an embodiment, the third portion is located at one end of the fourth portion.

In an embodiment, the distance between each of the first portion and each of the fourth portions in the first direction is between 0.05 mm and 0.5 mm.

In an embodiment, the width of each of the first portion and the third portion in the first direction is between 0.35 mm and 0.5 mm, and the second portion and the fourth portion are at the first side. The upward width is between 0.1 mm and 0.2 mm.

In an embodiment, the first bonding pads adjacent to each other are centrally symmetrical with the shapes of the second bonding pads.

In an embodiment, the shapes of the first bonding pads or the second bonding pads include a triangle, a trapezoid, a cross, a T-shape, a dry shape, or an I-shape.

In an embodiment, a single or a plurality of the second bonding pads are disposed between the adjacent first bonding pads.

In one embodiment, the first bonding pads and the second bonding pads respectively have a first end and a second end, the first end is opposite to the second end, and the first bonding pads Each of the first ends and the first ends of the second bonding pads are projected in the same position in a second direction.

In an embodiment, an angle between the first direction and the second direction is greater than or equal to 90 degrees.

In an embodiment, the first bonding pads have at least one recess, and the second The bonding pad has at least one convex portion, and the concave portion of the adjacent first bonding pad is complementarily embedded with the convex portion of the second bonding pad.

In an embodiment, the distance between the first bonding pads and the second bonding pads adjacent to each other in the first direction is between 0.05 mm and 0.5 mm.

To achieve the above object, a touch panel according to the present invention includes a sensing region, a peripheral region, a bonding structure, and a plurality of wires. The surrounding area is located around the sensing area. The peripheral zone has a joint area. The bonding structure includes a plurality of first bonding pads and a plurality of second bonding pads. The first bonding pads are disposed on the bonding area and are sequentially arranged along a first direction. The second bonding pad and the first bonding pads are alternately arranged in the bonding region, and are sequentially arranged in the first direction. The second bonding pads and the first bonding pads are electrically insulated from each other. The first bonding pads adjacent to each other are partially overlapped or tangential to the projection positions of the second bonding pads in the first direction, wherein the first bonding pads and the second bonding pads respectively have a first And a second end, the first end is opposite to the second end. The wires are disposed in the peripheral region, and electrically connected to the first bonding pads and the second bonding pads respectively.

In an embodiment, the first bonding pads have at least a first portion and a second portion, the first portion extends along the first direction, and the second portion extends along a second direction, and The first portion is connected, and the width of the first portion in the first direction is greater than the width of the second portion in the first direction; the second bonding pads have at least a third portion and a fourth portion. The third portion extends along the first direction, the fourth portion extends along the second direction, and is connected to the third portion, and the width of the third portion in the first direction is greater than the fourth portion a width in the first direction, the projected positions of the adjacent first portion and the third portion in the second direction do not overlap, and the adjacent first portion and the third portion are in the first direction The positions are partially overlapping or tangent.

As described above, the touch panel of the present invention and the bonding structure thereof are partially overlapped or tangential to each other by the projection positions of the first bonding pads adjacent to each other and the second bonding pads in the first direction. In the conventional strip-shaped, single-width and sequentially arranged bonding pads, the bonding pads of the present invention are closer to each other, and the bonding area per unit area can be increased, and the adjacent bonding pads are not in the second direction. In the case of a pure space, the value of the tensile force generated by the gap between the bonding pad and the adjacent bonding pad can be more uniform, and the bonding force of the bonding structure and the circuit board is improved, so that the circuit board and the bonding structure are less likely to be separated.

1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h‧‧‧ touch panel

2‧‧‧Wire

31, 31a, 31b, 31c, 31d, 31e, 31f, 31g, 31h‧‧‧ first joint pad

311, 311a, 311b, 311c, 311d, 311e‧‧‧ first

311h‧‧‧ recess

321h‧‧‧ convex

312, 312a, 312b, 312c, 312d, 312e‧‧‧ second

32, 32a, 32b, 32c, 32d, 32e, 32f, 32g, 32h‧‧‧ second bonding pad

321, 321, 321b, 321c, 321d, 321e‧‧‧ third

322, 322a, 322b, 322c, 322d, 322e‧‧‧ fourth

4‧‧‧ boards

BS‧‧‧ joint structure

BZ‧‧‧ joint area

D1‧‧‧ first direction

D2‧‧‧ second direction

E1‧‧‧ first end

E2‧‧‧ second end

IL‧‧‧ imaginary line

M‧‧‧ spacing

SA‧‧ Sensing Area

PA‧‧‧ surrounding area

W1, W2‧‧‧ width

FIG. 1A is a schematic diagram of a touch panel 1 according to a first embodiment of the present invention.

FIG. 1B is a partially enlarged schematic view of the touch panel 1 illustrated in FIG. 1A.

FIG. 2 is a graph showing the tensile force values of the joint structure and the circuit board shown in FIG. 1A.

FIG. 3 is a partially enlarged schematic view of a touch panel 1a according to a second embodiment of the present invention.

FIG. 4 is a partially enlarged schematic view of a touch panel 1b according to a third embodiment of the present invention.

FIG. 5 is a partially enlarged schematic view of a touch panel 1c according to a fourth embodiment of the present invention.

FIG. 6 is a partially enlarged schematic view of a touch panel 1d according to a fifth embodiment of the present invention.

FIG. 7 is a partially enlarged schematic view of a touch panel 1e according to a sixth embodiment of the present invention.

FIG. 8 is a partially enlarged schematic view of a touch panel 1f according to a seventh embodiment of the present invention.

FIG. 9 is a partially enlarged schematic view of a touch panel 1g according to an eighth embodiment of the present invention.

10A and 10B are respectively partially enlarged schematic views of a touch panel 1h according to a ninth embodiment of the present invention.

Hereinafter, a touch panel and a joint structure thereof according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

1A is a schematic view of a touch panel 1 according to a first embodiment of the present invention, and FIG. 1B is a partially enlarged schematic view of the touch panel 1 shown in FIG. 1A. Referring to FIG. 1A and FIG. 1B simultaneously, the touch panel 1 includes a sensing area SA, a peripheral area PA, a bonding structure BS, and a plurality of wires 2. The touch panel 1 can use a resistive, capacitive, optical, or other touch technology. The sensing area SA can be correspondingly changed according to the above touch technology, and is not limited thereto. In addition, the "touch panel" as referred to herein may include a touch panel or a touch display panel. The "joining structure" is applicable not only to the touch panel but also to other electronic devices such as display devices. The structure and composition of the sensing area SA are not shown in order to simplify the drawing for convenience in explaining a touch panel of the preferred embodiment of the present invention.

The peripheral area PA is located around the sensing area SA, that is, the peripheral area PA may be located on at least one side of the sensing area SA, wherein the peripheral area PA has a bonding area BZ. In this embodiment The sensing area SA is substantially a quadrangular shape, and the peripheral area PA is provided with a sensing area SA, and the bonding area BZ is disposed at the peripheral area PA and located at one side of the sensing area SA. It is to be noted that in other implementations, the peripheral area PA may also be located on one side or opposite sides of the sensing area SA, and the peripheral area PA may be configured according to requirements, and the invention is not limited thereto.

The wires 2 are disposed in the peripheral area PA, and each of the wires 2 can be collected to the bonding area BZ through the wiring design. The wires 2 are electrically connected to some sensing elements (not shown) of the sensing area SA to transmit the sensing signals generated by the sensing elements of the sensing area SA to the circuit board 4 via the wires 2. Here, the bonding region BZ is a region where the wire 2 overlaps the circuit board 4, and the circuit board 4 is affixed to the bonding structure BS of the bonding region BZ through the anisotropic conductive adhesive.

The joint structure BS includes a plurality of first joint pads 31 and a plurality of second joint pads 32 disposed in the joint region BZ. The first bonding pads 31 are sequentially arranged along a first direction D1, and the second bonding pads 32 and the first bonding pads 31 are alternately arranged in the bonding region BZ, and are also sequentially arranged in the first direction D1. It should be noted that “alternating arrangement” herein means that one or more second bonding pads 32 are disposed between two adjacent bonding pads 31 adjacent to each other, or two second bonding pads 32 adjacent to each other. One or more first bonding pads 31 are disposed therebetween, and the present embodiment is exemplified by providing a second bonding pad 32. The first direction D1 is, for example, a direction parallel to one of the sides of the sensing area SA.

The first bonding pad 31 and the second bonding pad 32 are electrically connected to the wires 2 one by one. In this embodiment, each of the first bonding pads 31 and the second bonding pads 32 are spaced apart from each other and electrically insulated from each other. The first bonding pad 31 and the second bonding pad 32 may be, for example, a material such as molybdenum, aluminum, copper, gold, silver, or the like, or a combination of the plurality of layers of the foregoing different materials. However, the present invention does not limit the material of the bonding structure BS. In order to be able to electrically connect the wire 2 to the circuit board 4 as a consideration.

Each of the first bonding pads 31 and each of the second bonding pads 32 has a first end E1 and a second end E2, wherein the first end E1 is, for example, one end of the connecting wire 2, and the first end E1 is opposite to the second end E2. Settings. In this embodiment, the first end E1 of each of the first bonding pads 31 and the first end E1 of each of the second bonding pads 32 have the same projection position in a second direction D2, wherein the first direction D1 and the second direction are D2 is, for example, perpendicular to each other. In other words, the first bonding pads 31 and the first bonding ends E1 of the second bonding pads 32 are arranged in line. In addition, the wires 2 of the embodiment are respectively connected The first end E1 of the first bonding pad 31 and the second bonding pad 32 are connected to the first end E1 of the first bonding pad 31. The second end E2 of 32.

Further, the first bonding pads 31 adjacent to each other and the projection positions of the second bonding pads 32 in the first direction D1 partially overlap or are tangent. That is, the adjacent first bonding pads 31 and the second bonding pads 32 are not disposed in a pure space, and a first direction D1 is disposed between the adjacent first bonding pads 31 and the second bonding pads 32. When the vertical imaginary line IL is present, the imaginary line IL will pass through the first bonding pad 31 and the second bonding pad 32 at the same time (when the projection position partially overlaps), or the tangent of the first bonding pad 31 and the second bonding pad 32 ( When the projection position is tangent). As a result, the first bonding pad 31 and the second bonding pad 32 of the present embodiment are closer to each other than the conventional elongated strip, single width and sequentially arranged bonding pads, and the spacing between them is small. Thereby, the area occupied by the joint structure BS in the peripheral area PA is reduced. At the same time, the joint area in the unit area can be increased, and the tensile force at the gap between the first joint pad 31 and the second bond pad 32 and the adjacent first bond pad 31 and the second bond pad 32 can be more uniform. The bonding force of the joint structure BS and the circuit board 4 is increased, making the circuit board 4 and the joint structure BS less likely to be separated. Especially in the case of the narrow frame design of the electronic device such as the touch panel, the bonding area BZ is getting smaller and smaller, and the area of the corresponding bonding structure BS is getting smaller and smaller, usually the bonding force between the bonding structure BS and the circuit board 4 is The design of the present invention can significantly reduce the area occupied by the joint structure BS in the peripheral area PA, while improving the bonding force of the joint structure BS and the circuit board 4, making the circuit board 4 and the joint structure BS less likely to be separated.

In the embodiment, the first bonding pad 31 has a first portion 311 and a second portion 312. The first portion 311 extends along the first direction D1, and the second portion 312 extends along the second direction D2 and is coupled to the first portion 311, and the first portion 311 is located at one end of the second portion 312, and the first portion 311 is The width in the first direction D1 is greater than the width of the second portion 312 in the first direction D1, wherein the first direction D1 and the second direction D2 are, for example, perpendicular to each other, preferably between the first direction D1 and the second direction D2. The angle of the insertion is greater than 90 degrees to further increase the overlapping position of the projection positions of the adjacent first bonding pads 31 and the second bonding pads 32 in the first direction D1, thereby improving the bonding force of the bonding structure BS and the circuit board 4. For example, the shape of the first bonding pad 31 is T-shaped. Similarly, the second bonding pad 32 has a third portion 321 and a fourth portion 322. The third portion 321 is in the first direction The D1 extends, the fourth portion 322 extends along the second direction D2, and is connected to the third portion 321 , and the third portion 321 is located at one end of the fourth portion 322 , and the width of the third portion 321 in the first direction D1 is greater than The width of the four portions 322 in the first direction D1. For example, the shape of the second bonding pad 32 is an inverted T-shape, that is, a T-shaped bonding pad whose shape is the same as that of the first bonding pad 31 but reversely arranged in the second direction D2. Adjacent first bonding pads 31 and second bonding pads 32, the first portion 311 and the third portion 321 are substantially parallel, the second portion 312 is substantially parallel to the fourth portion 322, and the adjacent first portions 311 and third The projections of the portion 321 in the first direction D1 are partially overlapped or tangential, and the projections of the first and second bonding pads 31 and 32, the first portion 311 and the third portion 321 are in the second direction D2. The locations do not overlap.

FIG. 2 is a graph showing the tensile force values of the joint structure and the circuit board shown in FIG. 1A. Referring to FIG. 2, it is shown that the width W1 of the first joint portion 311 and the third portion 321 extending in the first direction D1 is 0.45 mm, and each second portion is set in the joint structure BS. The tensile test performed under the condition that the width W2 extending in the first direction D1 is 0.15 mm, wherein the horizontal axis of FIG. 2 is a coordinate position, and the vertical axis is a tensile force value (unit is Newton). As can be seen from FIG. 2, the joint structure BS of the above design has an average tensile force distribution and an average tensile force value of about 0.8 Newton to 0.9 Newton, which improves the tensile characteristics of the joint structure BS and the entire circuit board 4. The balance is considered to be the bonding strength between the bonding structure BS and the circuit board 4 and the area occupied by the bonding structure BS. The width W1 is preferably 0.35 mm to 0.5 mm, and the width W2 is preferably 0.1 mm to 0.2 mm.

Other variations of the first bonding pad and the second bonding pad will be described in the following description, wherein the drawings are all illustrated by a partially enlarged schematic view of the touch panel.

Please refer to FIG. 3 , which is a partially enlarged schematic view of a touch panel 1 a according to a second embodiment of the present invention. In this embodiment, each of the first bonding pads 31a has a first portion 311a and a second portion 312a. The first portion 311a extends along the first direction D1, and the second portion 312a extends along the second direction D2. The first portion 311a is connected. Each of the second bonding pads 32a has a third portion 321a and a fourth portion 322a. The third portion 321a extends in the first direction D1, and the fourth portion 322a extends in the second direction D2 and is connected to the third portion 321a. This embodiment is different from the first embodiment in that the first portion 311a is not located at one end of the second portion 312a and is located at any middle position of the second portion 312a, and the third portion 321a is not located at one end of the fourth portion 322a. And located in any middle position of the fourth portion 322a. For example, the first bonding pad 31a and the second bonding pad 32a respectively exhibit a cross shape. The first portion 311a is substantially parallel to the third portion 321a, the second portion 312a is substantially parallel to the fourth portion 322a, and the projection portions of the adjacent first portion 311a and the third portion 321a in the first direction D1 are partially overlapped or tangential. And the projection positions of the adjacent first portion 311a and the third portion 321a in the second direction D2 do not overlap.

Referring to FIG. 4, it is a partially enlarged schematic view of a touch panel 1b according to a third embodiment of the present invention. The difference between this embodiment and the first and second embodiments described above is that the first portion 311b of the first bonding pad 31b is located at one end of the second portion 312b, and the third portion 321b of the second bonding pad 32b is not located at the fourth portion. One end of the 322b is located at any middle position of the fourth portion 322b, for example, the first bonding pad 31b has a T-shape, and the second bonding pad 32b has a cross shape. The first portion 311b is substantially parallel to the third portion 321b, the second portion 312b is substantially parallel to the fourth portion 322b, and the projection portions of the adjacent first portion 311b and the third portion 321b in the first direction D1 are overlapped or tangential. The projection positions of the adjacent first portion 311b and the third portion 321b in the second direction D2 do not overlap.

FIG. 5 is a partially enlarged schematic view of a touch panel 1c according to a fourth embodiment of the present invention. In this embodiment, the first bonding pad 31c has two first portions 311c and a second portion 312c. The first portions 311c extend along the first direction D1, and the second portions 312c extend along the second direction D2 and are connected to the first portion 311c, and the first portions 311c are respectively located at opposite ends of the second portion 312c, so that The first bonding pad 31c has an I-like or I-shaped shape. The second bonding pad 32c has a third portion 321c and a fourth portion 322c. The third portion 321c extends in the first direction D1, the fourth portion 322c extends in the second direction D2, and is connected to the third portion 321c, and the third portion 321c is not located at one end of the fourth portion 322c and is located at the fourth portion 322b. In any one of the middle positions, the second bonding pad 32c is shaped like a cross. The projection portions of the adjacent first portion 311c and the third portion 321c in the first direction D1 are partially overlapped or tangential, and the projection positions of the adjacent first portion 311c and the third portion 321c in the second direction D2 do not overlap. .

Referring to FIG. 6 , it is a partially enlarged schematic view of a touch panel 1 d according to a fifth embodiment of the present invention. In the present embodiment, the first bonding pad 31d includes three first portions 311d, two of which are respectively located at two ends of the second portion 312d, and one of which is located at any middle position of the second portion 312d. The second bonding pad 32d includes two third portions 321d, and the third portion 321d is not located at both ends of the fourth portion 322d and is located at any middle position of the fourth portion 322d. a projection portion of each of the first first portion 311d and each of the third portions 321d of the second bonding pad 32d in the first direction D1 The points are overlapped or tangent, and the projected positions of the adjacent first portion 311d and the third portion 321d in the second direction D2 do not overlap.

Please refer to FIG. 7 , which is a partially enlarged schematic view of a touch panel 1 e according to a sixth embodiment of the present invention. In this embodiment, the first bonding pad 31e has two first portions 311e and a second portion 312e, wherein one first portion 311e is located at one end of the second portion 312e, and the other first portion 311e is not located at the second portion. One end of the 312e is located at any middle position of the second portion 312e, for example, the first bonding pad 31e has a substantially dry shape. The second bonding pad 32e has two third portions 321e and a fourth portion 322e, wherein one third portion 321e is located at one end of the fourth portion 322e, and the other third portion 321e is not located at one end of the fourth portion 322e. The middle portion of any of the four portions 322e, for example, the second bonding pad 32e is similar to a soil or a zigzag shape. The projected portions of the adjacent first portion 311e and the third portion 321e in the first direction D1 are partially overlapped or tangential, and the projected positions of the adjacent first portion 311e and third portion 321e in the second direction D2 do not overlap. .

In all of the above embodiments, the first bonding pad and the second bonding pad are respectively extended in two directions, for example, at least one first portion and third portion along the first direction D1, and extending along the second direction D2. The second and fourth parts. Wherein the projection positions of the adjacent first and third portions in the first direction D1 are partially overlapped or tangential, and the projection positions of the adjacent first and third portions in the second direction D2 do not overlap, That is, the first part and the third part are parallel and not collinear. Here, as shown in FIG. 1B, the spacing m between the first bonding pad and the second bonding pad refers to the distance between the first portion to the fourth portion in the first direction D1, or the second portion to the first portion The distance between the three parts, and the spacing m is between 0.05 mm and 0.5 mm.

Please refer to FIG. 8 , which is a partially enlarged schematic view of a touch panel 1 f according to a seventh embodiment of the present invention. In the present embodiment, the first bonding pads 31f and the second bonding pads 32f are alternately arranged in the bonding region BZ, and are sequentially arranged in the first direction D1. The difference between the present embodiment and the first embodiment is that the shapes of the first bonding pads 31f and the second bonding pads 32f adjacent to each other are center-symmetrical, for example, the first bonding pads 31f of the embodiment are triangular, and the first The shape of the two bonding pads 32f is completely overlapped after the first bonding pads 31f are rotated by 180 degrees with respect to the center of symmetry, and the projection positions of the first bonding pads 31f and the second bonding pads 32f adjacent to each other in the first direction D1 are partially overlapped. Overlap or tangency. In addition, the spacing m between the first bonding pad 31f and the second bonding pad 32f is between 0.05 mm and 0.5 mm, wherein the spacing m refers to the first bonding pad 31f and the second bonding pad. The shortest distance between 32f.

Please refer to FIG. 9 , which is a partially enlarged schematic view of a touch panel 1g according to an eighth embodiment of the present invention. This embodiment is substantially the same as the seventh embodiment, except that the first bonding pad 31g and the second bonding pad 32g of the present embodiment have a trapezoidal shape, and the shape thereof is also center-symmetrical. For the rest, the seventh embodiment can be referred to. The details are not described herein.

Further, in the embodiment of FIG. 1B, FIG. 3 and FIG. 7, the first bonding pad and the second bonding pad have the same central symmetrical characteristics from the viewpoint of "central symmetry". Here, the shape of the first bonding pad or the second bonding pad may include a triangle, a trapezoid, a cross, a T-shape, a dry shape, or an I-shape, which all satisfy the "central symmetry" feature.

In addition, please refer to FIG. 10A and FIG. 10B , which are partially enlarged schematic views of a touch panel 1 h according to a ninth embodiment of the present invention. In this embodiment, the shapes of the first bonding pads 31h and the second bonding pads 32h are matched with each other, and the second bonding pads 32h have at least one convex portion 321h. This embodiment is illustrated by two oppositely disposed convex portions 321h. For example, the second bonding pad 32h is a structure having a narrow intermediate width at both ends, such as a diamond shape (as shown in FIG. 10A) or a polygon (FIG. 10B), and the first bonding pad 31h has at least one concave portion 311h, which is two relative in this embodiment. The recess 311h is provided as an example. For example, the first bonding pad 31h has a structure in which the width of both ends is narrow, so that the convex portions 321h of the two adjacent second bonding pads 32h are complementarily embedded with the concave portions 311h of the first bonding pads 31h. As a result, the projection positions of the first bonding pads 31h and the second bonding pads 32h adjacent to each other in the first direction D1 partially overlap or are tangent. The relatively wider portion of the adjacent first bonding pads 31h does not overlap the projection position of the convex portions 321h of the second bonding pads 32h in the second direction D2. In addition, the first end E1 and the second end E2 of the first bonding pad 31h and the second bonding pad 32h may be aligned, as shown in FIG. 10B.

In summary, the bonding structure and the touch panel of the present invention are partially overlapped or tangential to each other by the projection positions of the first bonding pads adjacent to each other and the second bonding pads in the first direction. Conventional strip-shaped, single-width and sequentially arranged bond pads, the bond pads of the present invention are closer to each other, and the spacing between them is smaller, thereby reducing the area occupied by the joint structure in the peripheral area, and at the same time, within the unit area The joint area can be increased accordingly, and the adjacent bond pads are not disposed in a pure direction in the second direction, and the tension between the bond pads and the adjacent bond pads can be more uniform, and the joint structure and the circuit board are improved. The bonding force makes the board and the joint structure more incompatible Easy to separate.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1‧‧‧ touch panel

2‧‧‧Wire

31‧‧‧First joint pad

311‧‧‧ first

312‧‧‧ Second

32‧‧‧Second joint pad

321‧‧‧ Third

322‧‧‧Fourth

BS‧‧‧ joint structure

BZ‧‧‧ joint area

D1‧‧‧ first direction

D2‧‧‧ second direction

E1‧‧‧ first end

E2‧‧‧ second end

IL‧‧‧ imaginary line

M‧‧‧ spacing

SA‧‧ Sensing Area

PA‧‧‧ surrounding area

W1, W2‧‧‧ width

Claims (17)

A bonding structure includes: a plurality of first bonding pads disposed in a bonding region and sequentially arranged along a first direction; and a plurality of second bonding pads disposed alternately with the first bonding pads And sequentially arranging along the first direction, the second bonding pads and the first bonding pads are electrically insulated from each other, and the first bonding pads adjacent to each other and the second bonding pads are The projection positions in the first direction are partially overlapped or tangent. The joint structure of claim 1, wherein the first joint pads have at least a first portion and a second portion, the first portion extends along the first direction, and the second portion extends along the first portion The second direction extends and is coupled to the first portion, and a width of the first portion in the first direction is greater than a width of the second portion in the first direction. The joint structure of claim 2, wherein the first portion is located at one end of the second portion. The joint structure of claim 2, wherein the second joint pads have at least a third portion and a fourth portion, the third portion extending along the first direction, the fourth portion The second direction extends and is connected to the third portion, and the width of the third portion in the first direction is greater than the width of the fourth portion in the first direction, the adjacent first portion and the The projection positions of the third portion in the second direction do not overlap, and the projected positions of the adjacent first portion and the third portion in the first direction partially overlap or are tangent. The joint structure of claim 4, wherein the third portion is located at one end of the fourth portion. The joint structure of claim 4, wherein a distance between each of the first portion and each of the fourth portions in the first direction is between 0.05 mm and 0.5 mm. The joint structure according to Item 4 or 6, wherein the width of each of the first portion and the third portion in the first direction is between 0.35 mm and 0.5 mm, each of the The width of the second portion and the fourth portion in the first direction is between 0.1 mm and 0.2 mm. The joint structure of claim 1, wherein the first joint pads adjacent to each other are centrally symmetrical with the shape of the second bond pads. The joint structure of claim 7, wherein the first joint pads or the first The shape of the two bonding pads includes a triangle, a trapezoid, a cross, a T-shape, a dry shape, or an I-shape. The joint structure of claim 1, wherein a single or a plurality of the second joint pads are disposed between the adjacent first joint pads. The bonding structure of claim 1, wherein the first bonding pads and the second bonding pads respectively have opposite first ends and a second end, and each of the first bonding pads The first end is the same as the projection position of each of the first ends of the second bonding pads in a second direction. The joint structure according to claim 11, wherein an angle between the first direction and the second direction is greater than or equal to 90 degrees. The bonding structure of claim 1, wherein the first bonding pads have at least one recess, the second bonding pads have at least one convex portion, adjacent concave portions of the first bonding pad and the first The convex portions of the two bonding pads are complementarily inlaid. The joint structure of claim 1, wherein the distance between the first joint pads and the second joint pads adjacent to each other in the first direction is between 0.05 mm and 0.5 mm. A touch panel includes: a sensing area; a peripheral area located around the sensing area, the peripheral area having a bonding area; and an engaging structure comprising: a plurality of first bonding pads disposed in the bonding area, And sequentially arranged along a first direction; and a plurality of second bonding pads alternately disposed in the bonding region along the first bonding pads, and sequentially arranged along the first direction, the second bonding pads and the The first bonding pads are electrically insulated from each other, and the first bonding pads adjacent to each other partially overlap or are tangent with the projection positions of the second bonding pads in the first direction, wherein the first The bonding pad and the second bonding pads respectively have a first end and a second end, the first end is opposite to the second end; and a plurality of wires are disposed in the peripheral area, and are respectively electrically connected The first bonding pads and the second bonding pads are connected. The touch panel of claim 15, wherein the first bonding pads have at least a first portion and a second portion, the first portion extending along the first direction, and the second portion a second direction extends and is coupled to the first portion, and a width of the first portion in the first direction is greater than a width of the second portion in the first direction. The touch panel of claim 16, wherein the second bonding pads have at least a third portion and a fourth portion, the third portion extending along the first direction, the fourth portion along the first Extending in a second direction and connected to the third portion, and a width of the third portion in the first direction is greater than a width of the fourth portion in the first direction, adjacent to the first portion and the third portion The projection positions of the portion in the second direction do not overlap, and the positions of the adjacent first portion and the third portion in the first direction partially overlap or are tangent.