TW201633320A - Memory device and operating method of the same - Google Patents

Memory device and operating method of the same Download PDF

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Publication number
TW201633320A
TW201633320A TW104106800A TW104106800A TW201633320A TW 201633320 A TW201633320 A TW 201633320A TW 104106800 A TW104106800 A TW 104106800A TW 104106800 A TW104106800 A TW 104106800A TW 201633320 A TW201633320 A TW 201633320A
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Taiwan
Prior art keywords
access mode
command code
logic unit
array
read
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TW104106800A
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Chinese (zh)
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TWI602185B (en
Inventor
張坤龍
陳耕暉
謝明志
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旺宏電子股份有限公司
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Abstract

A memory device includes a memory array and a logic unit communicatively coupled to the memory array. The memory array includes a plurality of pages for storing array data and a plurality of extra arrays respectively corresponding to the plurality of pages for storing extra data. The logic unit is configured to receive a read instruction, and perform a read operation in a first access mode or in a second access mode. In the first access mode, the logic unit sequentially reads out the array data stored in the plurality of pages. In the second access mode, the logic unit sequentially reads out the array data stored in the plurality of pages and the extra data stored in the plurality of extra arrays.

Description

記憶體裝置及其操作方法Memory device and method of operating same 【0001】【0001】

本揭露書是有關於一種記憶體裝置及其操作方法。特別是有關於一種具有可重組尺寸之額外陣列(extra arrays of reconfigurable size)的記憶體裝置。The present disclosure relates to a memory device and a method of operating the same. In particular, there is a memory device having an extra arrays of reconfigurable size.

【0002】【0002】

記憶體裝置廣泛使用於不同電子應用之中。一記憶體裝置可以包括複數個分頁(pages)Memory devices are widely used in different electronic applications. A memory device can include a plurality of pages

【0003】[0003]

根據本文所揭露的一實施例,記憶體裝置包括一記憶體陣列(memory array),記憶體陣列包含有複數個用來儲存陣列資料(array data)的分頁,以及複數個額外陣列(extra array),分別對應這些分頁,用來儲額外資料(extra data)。此記憶體裝置也包括被連接到(communicatively coupled to)記憶體陣列的一邏輯單元(logic unit),邏輯單元被建構來接收一讀取指令(read instruction),並在一第一存取模式(first access mode)或一第二存取中執行一讀取操作(read operation)。在第一存取模式中,邏輯單元依序讀出(read out)儲存於這些分頁中的陣列資料。在第二存取模式中,邏輯單元依序讀出儲存於這些分頁中的陣列資料,以及儲存於額外陣列中的額外資料。According to an embodiment disclosed herein, a memory device includes a memory array including a plurality of pages for storing array data, and a plurality of extra arrays. , corresponding to these pages, used to store extra data. The memory device also includes a logic unit communicatively coupled to the memory array, the logic unit being configured to receive a read instruction and in a first access mode ( A read operation is performed in the first access mode or a second access. In the first access mode, the logic unit sequentially reads out the array data stored in the pages. In the second access mode, the logic unit sequentially reads the array data stored in the pages and the additional data stored in the additional array.

【0004】[0004]

根據本文所揭露的另一實施例,記憶體裝置包括一記憶體陣列,此記憶體陣列包含有複數個用來儲存陣列資料的分頁,以及複數個額外陣列,分別對應這些分頁,用來儲額外資料。此記憶體裝置也包括被連接到記憶體陣列的一邏輯單元,且邏輯單元被建構來接收一寫入指令(program instruction),此寫入指令包括被選擇分頁的位址(address)以及要被寫入的資料,並在一第一存取模式或一第二存取中執行一寫入操作(program operation)。在第一存取模式中,邏輯單元將接收到的資料寫入位於被選擇分頁中。在第二存取模式中,邏輯單元將接收到的資料寫入位於被選擇分頁以及對應被選擇分頁的額外陣列中。According to another embodiment disclosed herein, a memory device includes an array of memory, the memory array including a plurality of pages for storing array data, and a plurality of additional arrays corresponding to the pages for storing additional data. The memory device also includes a logic unit coupled to the memory array, and the logic unit is configured to receive a program instruction including an address of the selected page and an address to be The data is written and a program operation is performed in a first access mode or a second access. In the first access mode, the logic unit writes the received data in the selected page. In the second access mode, the logic unit writes the received data into an additional array located in the selected page and corresponding to the selected page.

【0005】[0005]

根據本文所揭露的又一實施例,提供一種記憶體裝置的操作方法。此一記憶體裝置包括複數個用來儲存陣列資料的陣列區塊(array blocks),以及複數個額外陣列區塊,分別對應這些陣列區塊,用來儲額外資料。此一方法包括接收包含讀取命令碼(read command code)的一讀取指令,以及判斷此讀取命令碼是第一讀取命令碼或是第二讀取命令碼。假如此讀取命令碼被判定為第一讀取命令碼,此一方法包括依序讀出儲存於這些陣列區塊中的陣列資料;假如此讀取命令碼被判定為第二讀取命令碼,此一方法包括依序讀出儲存於這些陣列區塊中的陣列資料以及儲存於這些額外陣列區塊的中額外資料。In accordance with yet another embodiment disclosed herein, a method of operating a memory device is provided. The memory device includes a plurality of array blocks for storing array data, and a plurality of additional array blocks corresponding to the array blocks for storing additional data. The method includes receiving a read command including a read command code and determining whether the read command code is a first read command code or a second read command code. If the read command code is determined as the first read command code, the method includes sequentially reading the array data stored in the array blocks; if so, the read command code is determined to be the second read command code. The method includes sequentially reading out array data stored in the array blocks and storing additional data stored in the additional array blocks.

【0006】[0006]

為了對本發明之上述實施例及其他目的、特徵和優點能更明顯易懂,特舉數個較佳實施例,並配合所附圖式,作詳細說明如下:The above-described embodiments and other objects, features and advantages of the present invention will become more apparent and understood.

【0030】[0030]

100‧‧‧記憶體裝置
110‧‧‧輸入/輸出介面
120‧‧‧邏輯單元
122‧‧‧處理電路
124‧‧‧內部寄存器
130‧‧‧記憶體陣列
140‧‧‧非揮發性記憶體
200‧‧‧陣列區塊
210‧‧‧額外陣列區塊
220‧‧‧分頁
230‧‧‧額外陣列
400‧‧‧讀取指令
500‧‧‧快速讀取指令
602‧‧‧是否有接收到讀取指令?
604‧‧‧第一或第二存取模式?
606‧‧‧第一存取模式
608‧‧‧根據第一存取模式進行讀取操作
610‧‧‧第二存取模式
612‧‧‧根據第二存取模式進行讀取操作
702‧‧‧將儲存於非揮發性記憶體中的存取資訊載入內部寄存器中
704‧‧‧根據內部寄存器中的存取資訊設定內建存取模式
706‧‧‧是否有接收到讀取指令?
708‧‧‧根據內建存取模式進行讀取操作
710‧‧‧是否接收到改變內部寄存器中存取資訊的指令?
712‧‧‧改變內部寄存器中的存取資訊
714‧‧‧根據內部寄存器中已改變的存取資訊設定內建存取模式
800‧‧‧分頁寫入指令
810‧‧‧分頁寫入指令
902‧‧‧是否有接收到寫入指令?
904‧‧‧第一或第二存取模式?
906‧‧‧第一存取模式
908‧‧‧根據第一存取模式進行寫入操作
910‧‧‧第二存取模式
912‧‧‧根據第二存取模式進行寫入操作
1002‧‧‧將儲存於非揮發性記憶體中的存取資訊載入內部寄存器中
1004‧‧‧根據內部寄存器中的存取資訊設定內建存取模式
1006‧‧‧是否有接收到寫入指令?
1008‧‧‧根據內建存取模式進行寫入操作
1010‧‧‧是否接收到改變內部寄存器中存取資訊的指令?
1012‧‧‧改變內部寄存器中的存取資訊
1014‧‧‧根據內部寄存器中已改變的存取資訊設定內建存取模式
1100‧‧‧抹除指令
A0-A23‧‧‧位址位元
AD1-AD3‧‧‧位址段
100‧‧‧ memory device
110‧‧‧Input/Output Interface
120‧‧‧Logical unit
122‧‧‧Processing Circuit
124‧‧‧Internal registers
130‧‧‧Memory array
140‧‧‧Non-volatile memory
200‧‧‧Array block
210‧‧‧Additional Array Blocks
220‧‧‧page
230‧‧‧Additional array
400‧‧‧Read instructions
500‧‧‧fast read command
602‧‧‧Is there a read command received?
604‧‧‧ First or second access mode?
606‧‧‧First access mode
608‧‧‧Read operation according to the first access mode
610‧‧‧Second access mode
612‧‧‧Read operation according to the second access mode
702‧‧‧Load access information stored in non-volatile memory into internal registers
704‧‧‧Set the built-in access mode based on the access information in the internal registers
706‧‧‧Is there a read command received?
708‧‧‧Read operations based on built-in access mode
710‧‧‧ Have you received an instruction to change the access information in the internal registers?
712‧‧‧Change access information in internal registers
714‧‧‧Set the built-in access mode based on the changed access information in the internal registers
800‧‧ ‧ page write command
810‧‧ ‧ page write command
902‧‧‧ Is there a write command received?
904‧‧‧ First or second access mode?
906‧‧‧First access mode
908‧‧‧Write operation according to the first access mode
910‧‧‧Second access mode
912‧‧‧Write operation according to the second access mode
1002‧‧‧Load access information stored in non-volatile memory into internal registers
1004‧‧‧Set the built-in access mode based on the access information in the internal registers
1006‧‧‧Is there a write command received?
1008‧‧‧Write operation according to built-in access mode
1010‧‧‧Do you receive an instruction to change the access information in the internal registers?
1012‧‧‧Change access information in internal registers
1014‧‧‧Set the built-in access mode based on the changed access information in the internal registers
1100‧‧‧Erase instructions
A0-A23‧‧‧ address bit
AD1-AD3‧‧‧ address segment

【0007】【0007】


第1圖係根據本發明的一實施例所繪示的一種具有可重組尺寸之額外陣列的記憶體裝置方塊示意圖;
第2圖係根據本發明的一實施例所繪示的記憶體陣列之陣列結構的方塊示意圖;
第3A圖係根據本發明的一實施例的第一存取模式,繪示第2圖之記憶體陣列的存取順序(access sequence);
第3B圖係根據本發明的一實施例的第二存取模式,繪示第2圖之記憶體陣列的存取順序;
第4圖係根據本發明的一實施例所繪示,用來執行讀取操作的讀取指令;
第5圖係根據本發明的一實施例繪示用來執行快速讀取操作的快速讀取指令;
第6圖係根據本發明的一實施例,繪示由邏輯單元所執行的讀取操作流程圖;
第7圖係根據本發明的另一實施例,繪示由邏輯單元所執行的讀取操作流程圖;
第8A圖係根據本發明的一實施例,繪示在第一存取模式中用來執行分頁寫入操作的分頁寫入指令;
第8B圖係根據本發明的一實施例,繪示在第二存取模式中用來執行分頁寫入操作的分頁寫入指令;
第9圖係根據本發明的又一實施例,繪示由邏輯單元所執行的寫入操作流程圖;
第10圖係根據本發明的再一實施例,繪示由邏輯單元所執行的寫入操作流程圖;以及
第11圖係根據本發明的一實施例,繪示用來執行抹除操作的抹除指令。

1 is a block diagram of a memory device having an additional array of resizable sizes according to an embodiment of the invention;
2 is a block diagram showing an array structure of a memory array according to an embodiment of the invention;
FIG. 3A is a first access mode according to an embodiment of the present invention, showing an access sequence of the memory array of FIG. 2;
FIG. 3B is a second access mode according to an embodiment of the present invention, showing an access sequence of the memory array of FIG. 2;
4 is a read instruction for performing a read operation according to an embodiment of the invention;
Figure 5 is a diagram showing a fast read command for performing a fast read operation in accordance with an embodiment of the present invention;
Figure 6 is a flow chart showing a read operation performed by a logic unit, in accordance with an embodiment of the present invention;
Figure 7 is a flow chart showing a read operation performed by a logic unit in accordance with another embodiment of the present invention;
8A is a diagram showing a page write instruction for performing a page write operation in a first access mode, in accordance with an embodiment of the present invention;
8B is a diagram illustrating a page write instruction for performing a page write operation in a second access mode, in accordance with an embodiment of the present invention;
Figure 9 is a flow chart showing a write operation performed by a logic unit in accordance with still another embodiment of the present invention;
10 is a flow chart showing a write operation performed by a logic unit according to still another embodiment of the present invention; and FIG. 11 is a view showing a wipe for performing an erase operation according to an embodiment of the present invention. Except instructions.

【0008】[0008]

本說明內容之實施例將配合所附圖式作詳細說明。在不同實施例與圖式之中,相同的元件,將盡可能地以相同的元件符號加以表示。The embodiments of the present description will be described in detail in conjunction with the drawings. In the different embodiments and the drawings, the same elements will be denoted by the same element symbols as much as possible.

【0009】【0009】

第1圖係根據本發明的一實施例所繪示的一種具有可重組尺寸之額外陣列的記憶體裝置100方塊示意圖。記憶體裝置100包括一輸入/輸出介面(input/output (I/O) interface)110、連接至輸入/輸出介面110的一邏輯單元120、連接至邏輯單元120的一記憶體陣列130,以及連接至邏輯單元120的一非揮發性記憶體(non-volatile memory)140。輸入/輸出介面110包括連接至一外部電路(未繪示)的複數個接腳(pins)(未繪示)。輸入/輸出介面110接收要被寫入,即要被從外部電路寫入記憶體陣列130,的不同指令和資料。輸入/輸出介面110也將讀取自記憶體陣列130的資料輸出至外部電路。邏輯單元120接收來自於輸入/輸出介面110的指令和資料,並根據所接收的指令在記憶體陣列130上進行不同操作(例如,讀取、寫入或抹除等)。邏輯單元120包括一處理電路(process circuit)122和一內部寄存器(internal register)124。處理電路122包括控制邏輯單元120之整體操作的邏輯電路。內部寄存器124儲存處理電路122所使用的暫時資料(temporary data)。內部寄存器124可以藉由揮發性記憶體,例如靜態隨機存取記憶體(static random-access memory,SRAM)、隨機存取記憶體(random-access memory,RAM)以及動態隨機存取記憶體(dynamic random-access memory,DRAM),來加以實現。非揮發性記憶體140儲存處理電路122所使用的永久資料(permanent data)。非揮發性記憶體140也儲存有關記憶體裝置100之晶片配置的資訊。非揮發性記憶體140可以藉由快閃記憶體(flash memory)、唯讀記憶體(read-only memory,ROM)、鐵電式隨機存取記憶體(ferroelectric random-access memory,F-RAM)、磁碟電腦儲存裝置(magnetic computer storage device)或光碟(optical disc)來加以實現。記憶體陣列130是一種非揮發性記憶體,例如快閃記憶體、唯讀記憶體、鐵電式隨機存取記憶體、磁碟電腦儲存裝置或光碟。1 is a block diagram of a memory device 100 having an additional array of resizable dimensions, in accordance with an embodiment of the invention. The memory device 100 includes an input/output (I/O) interface 110, a logic unit 120 connected to the input/output interface 110, a memory array 130 connected to the logic unit 120, and a connection. A non-volatile memory 140 to the logic unit 120. The input/output interface 110 includes a plurality of pins (not shown) connected to an external circuit (not shown). The input/output interface 110 receives different instructions and data to be written, i.e., to be written to the memory array 130 from an external circuit. The input/output interface 110 also outputs data read from the memory array 130 to an external circuit. Logic unit 120 receives instructions and data from input/output interface 110 and performs different operations (e.g., read, write, erase, etc.) on memory array 130 in accordance with the received instructions. The logic unit 120 includes a process circuit 122 and an internal register 124. Processing circuit 122 includes logic circuitry that controls the overall operation of logic unit 120. The internal register 124 stores the temporary data used by the processing circuit 122. The internal register 124 can be implemented by volatile memory such as static random access memory (SRAM), random-access memory (RAM), and dynamic random access memory (dynamic). Random-access memory, DRAM), to achieve. The non-volatile memory 140 stores the permanent data used by the processing circuit 122. The non-volatile memory 140 also stores information about the wafer configuration of the memory device 100. The non-volatile memory 140 can be a flash memory, a read-only memory (ROM), or a ferroelectric random-access memory (F-RAM). , magnetic computer storage device (magnetic computer storage device) or optical disc (optical disc) to achieve. The memory array 130 is a non-volatile memory such as a flash memory, a read only memory, a ferroelectric random access memory, a magnetic disk storage device, or a compact disk.

【0010】[0010]

在一些實施例中,邏輯單元120的內部寄存器124儲存複數個命令碼以及其所對應的操作。當邏輯單元120經由輸入/輸出介面110接收來自外部電路的指令時,邏輯單元120的處理電路122解析(pare)此指令以識別命令碼,將所識別的命令碼與儲存於內部寄存器124中的複數個命令碼加以比較,以尋找對應於所識別之命令碼的操作,並執行此一操作。In some embodiments, internal register 124 of logic unit 120 stores a plurality of command codes and their corresponding operations. When the logic unit 120 receives an instruction from an external circuit via the input/output interface 110, the processing circuit 122 of the logic unit 120 parses the instruction to identify the command code, and stores the identified command code in the internal register 124. A plurality of command codes are compared to find an operation corresponding to the recognized command code, and the operation is performed.

【0011】[0011]

第2圖係根據本發明的一實施例所繪示的記憶體陣列130之陣列結構的方塊示意圖。記憶體陣列130包括複數個陣列區塊200,以及複數個額外陣列區塊210。每一個額外陣列區塊210對應這些複數個陣列區塊200其中之一者。也就是說,額外陣列區塊0對應陣列區塊0;額外陣列區塊1對應於陣列區塊1....;以及額外陣列區塊n對應陣列區塊n。每一個陣列區塊200包括複數個,例如8個,分頁220。每一個額外陣列區塊210包括複數個,例如8個,額外陣列230。每一個額外陣列230對應這些複數個分頁220於其中之一者。也就是說,額外陣列區塊0對應分頁0;額外陣列區塊1對應於分頁1....;以及額外陣列區塊7對應分頁7。每一個分頁220具有固定尺寸,例如256個位元組(bytes)。每一個額外陣列230具有可重組的尺寸,例如1個、2個或8個位元組。這些複數個分頁220係用來儲存由使用者所定義的陣列資料。這些複數個額外陣列230係用來儲存被儲存於對應分頁220中與陣列資料相關聯的額外資料。例如,儲存於額外陣列0中的額外資料包括錯誤校驗和改正碼(Error Checking and Correcting code,ECC code)及/或安全內容(security content)等,被儲存於分頁0與陣列資料相關聯的額外資料。FIG. 2 is a block diagram showing an array structure of a memory array 130 according to an embodiment of the invention. The memory array 130 includes a plurality of array blocks 200, and a plurality of additional array blocks 210. Each additional array block 210 corresponds to one of the plurality of array blocks 200. That is, the additional array block 0 corresponds to the array block 0; the additional array block 1 corresponds to the array block 1....; and the additional array block n corresponds to the array block n. Each array block 200 includes a plurality of, for example, eight, page 220. Each additional array block 210 includes a plurality, for example, eight, additional arrays 230. Each additional array 230 corresponds to one of the plurality of pages 220. That is, the extra array block 0 corresponds to page 0; the extra array block 1 corresponds to page 1...; and the additional array block 7 corresponds to page 7. Each page 220 has a fixed size, such as 256 bytes. Each additional array 230 has a resizable size, such as 1, 2, or 8 bytes. These plurality of tabs 220 are used to store array data defined by the user. The plurality of additional arrays 230 are used to store additional data associated with the array data stored in the corresponding page 220. For example, additional data stored in the extra array 0 includes Error Checking and Correcting code (ECC code) and/or security content, etc., which are stored in the page 0 associated with the array data. Additional information.

【0012】[0012]

繪示於第2圖的陣列結構是記憶體陣列130的一種可被外部電路所使用的邏輯陣列結構。此邏輯陣列結構中的資料位址(稱為「邏輯位址(logical address)」),可藉由加密傳輸(scramble transfer)對映到(mapped to)實體陣列結構中的資料位址(稱為「實體位址(physical address)」)。因此,當記憶體陣列130的邏輯陣列結構包含尺寸可重組之額外陣列230時,記憶體陣列130的實體陣列結構也可藉由加密傳輸重新對映(remapped),而將額外陣列230納入其中。The array structure shown in FIG. 2 is a logic array structure of the memory array 130 that can be used by external circuits. The data address (called a "logical address") in the logical array structure can be mapped to the data address in the physical array structure by scramble transfer (called "physical address"). Thus, when the logical array structure of the memory array 130 includes an additional array 230 of resizable size, the physical array structure of the memory array 130 can also be re-applied by encrypted transmission, with the additional array 230 incorporated.

【0013】[0013]

第3A圖係根據本發明的一實施例的第一存取模式所繪示之記憶體陣列130的存取順序。在第一存取模式中,只有分頁220被依照分頁 0、分頁1、分頁2 . . . 、分頁n的順序存取。額外陣列230並未被存取。第一存取模式可以被採用於,當儲存於額外陣列230中的額外資料包括了與儲存於分頁220中之陣列資料相關連的安全內容時。FIG. 3A is an access sequence of the memory array 130 illustrated in the first access mode according to an embodiment of the invention. In the first access mode, only the page 220 is accessed in the order of page 0, page 1, page 2, . . . , page n. The extra array 230 is not accessed. The first access mode can be employed when additional material stored in the additional array 230 includes secure content associated with the array data stored in the page 220.

【0014】[0014]

第3B圖係根據本發明的一實施例的第二存取模式所繪示之記憶體陣列130的另一個存取順序。在第二存取模式中,分頁220和額外陣列230都被依照分頁 0、額外陣列0、分頁1、額外陣列1、分頁2、額外陣列2 . . . 、分頁n、額外陣列n的順序存取。FIG. 3B is another access sequence of the memory array 130 depicted in the second access mode in accordance with an embodiment of the present invention. In the second access mode, the page 220 and the additional array 230 are stored in the order of page 0, extra array 0, page 1, extra array 1, page 2, extra array 2 . . . , page n, and extra array n. take.

【0015】[0015]

為了在記憶體裝置100的第一存取模式或第二存取模式中實施讀取操作,可以根據本文的不同實施例而使用多種不同的介面協定(interface protocol)方法。在一個實施例中,記憶體裝置100的邏輯單元120可以接收一個包含有關於是否在第一存取模式或第二存取模式中進行存取操作之存取資訊的讀取指令。當邏輯單元120在第一存取模式中進行讀取操作時,邏輯單元120會依照分頁 0、分頁1、分頁2 . . . 、分頁n的順序,讀出儲存於分頁220中的陣列資料。儲存於額外陣列230中的額外資料,被排除於此一讀出順序之外。也就是說,儲存於額外陣列230中的額外資料並未被讀出。當邏輯單元120在第二存取模式中進行讀取操作時,邏輯單元120會依照分頁 0、額外陣列0、分頁1、額外陣列1、分頁2、額外陣列2 . . . 、分頁n、額外陣列n的順序,讀出儲存於分頁220中的陣列資料和儲存於額外陣列230中的額外資料。To implement a read operation in the first access mode or the second access mode of the memory device 100, a variety of different interface protocol methods can be used in accordance with different embodiments herein. In one embodiment, the logic unit 120 of the memory device 100 can receive a read command containing access information regarding whether an access operation is performed in the first access mode or the second access mode. When the logic unit 120 performs a read operation in the first access mode, the logic unit 120 reads the array data stored in the page 220 in the order of page 0, page 1, page 2, . . . , page n. Additional material stored in the additional array 230 is excluded from this readout sequence. That is, the additional data stored in the additional array 230 is not read. When the logic unit 120 performs a read operation in the second access mode, the logic unit 120 follows the page 0, the extra array 0, the page 1, the extra array 1, the page 2, the extra array 2 . . . , the page n, the extra The sequence of array n reads out the array data stored in page 220 and the additional data stored in additional array 230.

【0016】[0016]

第4圖係根據本發明的一實施例所繪示,用來執行讀取操作的讀取指令400。讀取指令400是發給邏輯單元120用以讀取儲存於記憶體陣列130中的資料。如第4圖所繪示,讀取指令400總共包含4個位元組,即第1位元組、第2位元組、第3位元組和第4位元組。第1位元組包括讀取命令碼,可以被預先定義,以指示邏輯單元120在第一存取模式或第二存取模式中進行讀取操作。且假如是在第二存取模式中進行時,會指定每一個額外陣列230的尺寸。第2位元組包括含有位址位元(address bits)A23到A16的第一位址段(address segment)AD1。第3位元組包括含有位址位元A15到A8的第二位址段AD2。第4位元組包括含有位址位元A7到A0的第三位址段AD3。第一位址段AD1、第二位址段AD2和第三位址段AD3建構了一個24位元的位址,其代表一個在記憶體陣列130中進行讀取操作的開始位址(starting address)。例如,一個十六進位(in hexadecimal)的讀取命令碼03 (以下稱作「03(hex)」)可以被預先定義,以指示邏輯單元120在第一存取模式中進行讀取操作。當邏輯單元120接收到包含03(hex)且附隨著一個24位元位址的指令時,邏輯單元120即在第一存取模式中進行如第3A所繪示的讀取操作,從具有此24位元位址的位置開始,依序讀出儲存於記憶體陣列130之分頁220中的陣列資料。在另一個實施例中,讀取命令碼66(hex)可以被預先定義,以指示邏輯單元120在第二存取模式中進行讀取操作,並指定每一個額外陣列230的尺寸為2個位元組。當邏輯單元120接收到包含66(hex)且附隨著一個24位元位址的指令時,邏輯單元120即根據第3B所繪示的第二存取模式進行讀取操作,從具有此24位元位址的位置開始,依序讀出儲存於記憶體陣列130之分頁220中的陣列資料以及儲存於每一個額外陣列230之2個位元組中的額外資料。在又一個實施例中,讀取命令碼68(hex)可以被預先定義,以指示邏輯單元120在第二存取模式中進行讀取操作,並指定每一個額外陣列230的尺寸為4個位元組。當邏輯單元120接收到包含68(hex)且附隨著一個24位元位址的指令時,邏輯單元120即根據第3B所繪示的第二存取模式進行讀取操作,從具有此24位元位址的位置開始,依序讀出儲存於記憶體陣列130之分頁220中的陣列資料以及儲存於記憶體陣列130每一個額外陣列230之4個位元組中的額外資料。Figure 4 is a diagram of a read command 400 for performing a read operation, in accordance with an embodiment of the present invention. The read command 400 is sent to the logic unit 120 for reading the data stored in the memory array 130. As shown in FIG. 4, the read command 400 includes a total of 4 bytes, namely a 1st byte, a 2nd byte, a 3rd byte, and a 4th byte. The first byte includes a read command code that can be pre-defined to instruct the logic unit 120 to perform a read operation in either the first access mode or the second access mode. And if it is done in the second access mode, the size of each additional array 230 is specified. The second byte includes a first address segment AD1 containing address bits A23 through A16. The third byte includes a second address segment AD2 containing address bits A15 through A8. The fourth byte includes a third address segment AD3 containing address bits A7 through A0. The first address segment AD1, the second address segment AD2, and the third address segment AD3 construct a 24-bit address that represents a start address for a read operation in the memory array 130 (starting address) ). For example, an in-hexadecimal read command code 03 (hereinafter referred to as "03 (hex)") may be pre-defined to instruct the logic unit 120 to perform a read operation in the first access mode. When the logic unit 120 receives an instruction including 03 (hex) and a 24-bit address, the logic unit 120 performs a read operation as shown in FIG. 3A in the first access mode, from having The location of the 24-bit address begins, and the array data stored in the page 220 of the memory array 130 is sequentially read. In another embodiment, the read command code 66 (hex) may be pre-defined to instruct the logic unit 120 to perform a read operation in the second access mode and specify that each additional array 230 has a size of 2 bits. Tuple. When the logic unit 120 receives an instruction including 66 (hex) and a 24-bit address, the logic unit 120 performs a read operation according to the second access mode illustrated in FIG. 3B, from having 24 The location of the bit address begins by sequentially reading the array data stored in the page 220 of the memory array 130 and the additional data stored in the 2 bytes of each additional array 230. In still another embodiment, the read command code 68 (hex) may be pre-defined to instruct the logic unit 120 to perform a read operation in the second access mode and specify that each additional array 230 has a size of 4 bits. Tuple. When the logic unit 120 receives an instruction including 68 (hex) and a 24-bit address, the logic unit 120 performs a read operation according to the second access mode illustrated in FIG. 3B, from having the 24 The location of the bit address begins by sequentially reading the array data stored in the page 220 of the memory array 130 and the additional data stored in the 4 bytes of each additional array 230 of the memory array 130.

【0017】[0017]

第5圖係根據本發明的一實施例繪示用來執行快速讀取操作的快速讀取指令500。快速讀取指令500是發給邏輯單元120用以快速讀取儲存於記憶體陣列130中的資料。與第4圖所繪示的讀取指令400相比,快速讀取指令500額外包含一個第5位元組,其為虛擬位元組(dummy byte)。虛擬位元組提供感測資料所需的額外時間裕度(time margin)。位於第1位元組中的讀取命令碼可以被預先定義,以指示邏輯單元120在第一存取模式或第二存取模式中進行快速讀取操作,並指定每一個額外陣列230的尺寸。例如,讀取命令碼0B(hex)可以被預先定義,以指示邏輯單元120在第一存取模式中進行快速讀取操作。當邏輯單元120接收到包含0B(hex)且附隨著一個24位元位址的指令時,邏輯單元120即在第一存取模式中進行如第3A所繪示的快速讀取操作,從具有此24位元位址的位置開始,依序讀出儲存於記憶體陣列130之分頁220中的陣列資料。在另一個實施例中,讀取命令碼67(hex)可以被預先定義,以指示邏輯單元120在第二存取模式中進行快速讀取操作,並指定每一個額外陣列230的尺寸為2個位元組。當邏輯單元120接收到包含67(hex)且附隨著一個24位元位址的指令時,邏輯單元120即在第二存取模式中進行如第3B所繪示的快速讀取操作,從具有此24位元位址的位置開始,依序讀出儲存於記憶體陣列130之分頁220中的陣列資料以及儲存於記憶體陣列130每一個額外陣列230之2個位元組中的額外資料。Figure 5 illustrates a fast read command 500 for performing a fast read operation in accordance with an embodiment of the present invention. The fast read command 500 is sent to the logic unit 120 for quickly reading the data stored in the memory array 130. In contrast to the read command 400 illustrated in FIG. 4, the fast read command 500 additionally includes a fifth byte, which is a dummy byte. The virtual byte provides the extra time margin required to sense the data. The read command code located in the 1st byte may be pre-defined to instruct the logic unit 120 to perform a fast read operation in the first access mode or the second access mode and specify the size of each additional array 230 . For example, the read command code 0B (hex) may be pre-defined to instruct the logic unit 120 to perform a fast read operation in the first access mode. When the logic unit 120 receives an instruction including 0B (hex) and a 24-bit address, the logic unit 120 performs a fast read operation as shown in FIG. 3A in the first access mode. Starting with the location of the 24-bit address, the array data stored in the page 220 of the memory array 130 is sequentially read. In another embodiment, the read command code 67 (hex) may be pre-defined to instruct the logic unit 120 to perform a fast read operation in the second access mode and specify that each additional array 230 has a size of two Bytes. When the logic unit 120 receives an instruction including 67 (hex) and a 24-bit address, the logic unit 120 performs the fast read operation as shown in FIG. 3B in the second access mode. Starting with the location of the 24-bit address, the array data stored in the page 220 of the memory array 130 and the additional data stored in the 2 bytes of each additional array 230 of the memory array 130 are sequentially read. .

【0018】[0018]

第6圖係根據本發明的一實施例,繪示由邏輯單元120所執行的讀取操作流程圖。當打開記憶體裝置100的電源時,邏輯單元120即判斷是否有接收到讀取指令(步驟602)。假如未接收到讀取指令(步驟602:No),邏輯單元120週期性地執行步驟602直到接收到讀取指令為止。假如接收到讀取指令(步驟602:Yes),邏輯單元120分析接收到的讀取指令,判斷此讀取指令是否指定第一存取模式或第二存取模式(步驟604)。例如邏輯單元120判斷讀取指令中的讀取命令碼究係03(hex)或是66(hex)。假如讀取命令碼為03(hex),邏輯單元120判斷此讀取指令指定第一存取模式(步驟606)。結果邏輯單元120在第一存取模式中進行讀取操作(步驟608)。假如讀取命令碼為66(hex),邏輯單元120判斷此讀取指令指定第二存取模式(步驟610)。結果邏輯單元120在第二存取模式中進行讀取操作(步驟612)。隨後,邏輯單元120回到步驟602判斷是否有接收到讀取指令。Figure 6 is a flow chart showing the read operation performed by logic unit 120, in accordance with an embodiment of the present invention. When the power of the memory device 100 is turned on, the logic unit 120 determines whether a read command has been received (step 602). If a read command is not received (step 602: No), logic unit 120 periodically performs step 602 until a read command is received. If a read command is received (step 602: Yes), logic unit 120 analyzes the received read command and determines whether the read command specifies a first access mode or a second access mode (step 604). For example, the logic unit 120 determines whether the read command code in the read command is 03 (hex) or 66 (hex). If the read command code is 03 (hex), logic unit 120 determines that the read command specifies the first access mode (step 606). The result logic unit 120 performs a read operation in the first access mode (step 608). If the read command code is 66 (hex), the logic unit 120 determines that the read command specifies the second access mode (step 610). The result logic unit 120 performs a read operation in the second access mode (step 612). Subsequently, logic unit 120 returns to step 602 to determine if a read command has been received.

【0019】[0019]

在一些實施例之中,邏輯單元120可以將有關於是否在第一存取模式或第二存取模式中進行記憶體存取操作,以及有關於每一個額外陣列230之尺寸的存取資訊,儲存於非揮發性記憶體140之中。第7圖係根據本發明的另一實施例,繪示由邏輯單元120所執行的讀取操作流程圖。In some embodiments, the logic unit 120 may be related to whether a memory access operation is performed in the first access mode or the second access mode, and access information regarding the size of each of the additional arrays 230, Stored in non-volatile memory 140. FIG. 7 is a flow chart showing a read operation performed by logic unit 120, in accordance with another embodiment of the present invention.

【0020】[0020]

請參照第7圖,當打開記憶體裝置100的電源時,邏輯單元120即將儲存於非揮發性記憶體140中的存取資訊載入(load)邏輯單元120的內部寄存器124中(步驟702)。邏輯單元120再根據內部寄存器124中的存取資訊,設定內建存取模式(default access mode) (步驟704)。例如,當內部寄存器124中的存取資訊指定內建存取模式為第3A圖所繪示的第一存取模式時,邏輯單元120設定其內建存取模式為第一存取模式。在另一個實施例中,當內部寄存器124中的存取資訊指定內建存取模式為第3B圖所繪示的第二存取模式,且每一個額外陣列230的尺寸為2個位元組時,邏輯單元120設定其內建存取模式為具有2個位元組之額外陣列230的第二存取模式。邏輯單元120即判斷是否有接收到讀取指令(步驟706)。假如未接收到讀取指令(步驟706:No),邏輯單元120直接移至步驟710。假如接收到讀取指令(步驟708:Yes),邏輯單元120根據內建存取模式進行讀取操作(步驟708)。由於內部寄存器124已經內含了關於是否在第一存取模式或第二存取模式中進行操作的存取資訊,在本實施例中,不需要讀取指令來指定是否在第一存取模式或第二存取模式中進行讀取操作。然後,邏輯單元120再判斷是否接收到一個改變內部寄存器124中存取資訊的讀取指令(步驟710)。假如,未接收到改變內部寄存器124中的存取資訊的讀取指令(步驟710:No),邏輯單元120回到步驟706判斷是否接收到一個讀取指令。假如,接收到改變內部寄存器124中的存取資訊的讀取指令(步驟710: Yes),邏輯單元120根據接收到的指令改變存取資訊(步驟712)。之後,邏輯單元120根據內部寄存器124中已改變的存取資訊,設定內建存取模式(步驟714)。例如步驟710所接收的讀取指令指示邏輯單元120變更存取資訊,由第一存取模式改為第二存取模式,邏輯單元120即將內部寄存器124中的內建存取模式,設定為第二存取模式。在此之後,邏輯單元120回到步驟706判斷是否接收到一個讀取指令。Referring to FIG. 7, when the power of the memory device 100 is turned on, the logic unit 120 loads the access information stored in the non-volatile memory 140 into the internal register 124 of the logic unit 120 (step 702). . The logic unit 120 then sets a default access mode based on the access information in the internal register 124 (step 704). For example, when the access information in the internal register 124 specifies that the built-in access mode is the first access mode illustrated in FIG. 3A, the logic unit 120 sets its built-in access mode to the first access mode. In another embodiment, the access information in the internal register 124 specifies that the built-in access mode is the second access mode illustrated in FIG. 3B, and each additional array 230 has a size of 2 bytes. Logic unit 120 sets its built-in access mode to a second access mode with an additional array 230 of 2 bytes. The logic unit 120 determines whether a read command has been received (step 706). If the read command is not received (step 706: No), the logic unit 120 moves directly to step 710. If a read command is received (step 708: Yes), logic unit 120 performs a read operation in accordance with the built-in access mode (step 708). Since the internal register 124 already contains access information about whether to operate in the first access mode or the second access mode, in this embodiment, no read instruction is required to specify whether it is in the first access mode. Or a read operation in the second access mode. The logic unit 120 then determines whether a read command to change the access information in the internal register 124 is received (step 710). If a read command to change the access information in the internal register 124 is not received (step 710: No), the logic unit 120 returns to step 706 to determine whether a read command has been received. If a read command to change the access information in the internal register 124 is received (step 710: Yes), the logic unit 120 changes the access information according to the received command (step 712). Thereafter, logic unit 120 sets the built-in access mode based on the changed access information in internal register 124 (step 714). For example, the read command received in step 710 instructs the logic unit 120 to change the access information, and the first access mode is changed to the second access mode. The logic unit 120 sets the built-in access mode in the internal register 124 to be the first. Two access modes. Thereafter, logic unit 120 returns to step 706 to determine if a read command has been received.

【0021】[0021]

在一些實施例中,為了在第一存取模式或第二存取模式中實施寫入操作,記憶體裝置100的邏輯單元120可以接收一個包含關於是否在第一存取模式或第二存取模式中進行寫入操作之存取資訊的寫入指令。In some embodiments, to perform a write operation in the first access mode or the second access mode, the logic unit 120 of the memory device 100 can receive a inclusion regarding whether in the first access mode or the second access. A write command to access information for a write operation in the mode.

【0022】[0022]

第8A圖係根據本發明的一實施例,繪示用來在第一存取模式中執行分頁寫入操作,即寫入分頁,的分頁寫入指令800。在本實施例之中,係假設每一個分頁220具有256個位元組的固定尺寸。如第8A圖所繪示,分頁寫入指令800總共具有256個位元組。第1位元組包括分頁寫入命令碼(page program command code),可以被預先定義,以指示邏輯單元120在第一存取模式中進行分頁寫入操作。第2至第4位元組分別包括AD1、AD2和AD3三個位址段。AD1、AD2和AD3三個位址段建構了一個24位元的位址,其代表一個被選定要進行寫入操作之分頁的位置。第5至第260位元組包括256個位元組要被寫入被選擇分頁的陣列資料。例如,寫入命令碼02(hex)可以被預先定義,以指示邏輯單元120在第一存取模式中進行分頁寫入操作。當邏輯單元120接收到包含02(hex)且附隨著一個24位元位址和256個位元組資料的指令時,邏輯單元120即在第一存取模式中進行分頁寫入操作,將此含有256個位元組的資料寫入記憶體陣列130具有該24位元位址的分頁220中。Figure 8A illustrates a paged write instruction 800 for performing a paged write operation, i.e., writing a page, in a first access mode, in accordance with an embodiment of the present invention. In the present embodiment, it is assumed that each page 220 has a fixed size of 256 bytes. As depicted in FIG. 8A, the page write instruction 800 has a total of 256 bytes. The first byte includes a page program command code, which may be pre-defined to instruct the logic unit 120 to perform a page write operation in the first access mode. The second to fourth bytes include three address segments AD1, AD2, and AD3, respectively. The three address segments AD1, AD2, and AD3 construct a 24-bit address that represents the location of a page that is selected for the write operation. The 5th to 260th byte includes 256 bytes to be written to the array data of the selected page. For example, the write command code 02 (hex) may be pre-defined to instruct the logic unit 120 to perform a page write operation in the first access mode. When the logic unit 120 receives an instruction including 02 (hex) and accompanying a 24-bit address and 256 byte data, the logic unit 120 performs a page write operation in the first access mode, This data containing 256 bytes is written into the page 220 of the memory array 130 having the 24-bit address.

【0023】[0023]

第8B圖係根據本發明的一實施例,繪示在第二存取模式中用來執行分頁寫入操作的分頁寫入指令810。在本實施例之中,係假設每一個分頁220的尺寸為256個位元組,每一個額外陣列230的尺寸為8個位元組。如第8B圖所繪示,分頁寫入指令810總共具有256個位元組。第1位元組包括分頁寫入命令碼,可以被預先定義,以指示邏輯單元120在第二存取模式中進行分頁寫入操作。第2至第4位元組分別包括AD1、AD2和AD3三個位址段。AD1、AD2和AD3三個位址段建構了一個24位元的位址,其代表一個被選定要進行寫入操作之分頁的位置。第5至第260位元組包括256個位元組要被寫入被選擇分頁的陣列資料;第261至第268位元組包括要被寫入附隨在被選擇分頁後之額外陣列230之8個位元組的額外資料。例如,寫入命令碼37(hex)可以被預先定義,以指示邏輯單元120在第二存取模式中進行分頁寫入操作。其中,每一個額外陣列230的尺寸為8個位元組。當邏輯單元120接收到包含37(hex)且附隨著一個24位元位址和256個位元組資料的指令時,邏輯單元120即在第二存取模式中進行分頁寫入操作,將所接收到的256個位元組資料寫入記憶體陣列130具有該24位元位址的分頁220中;並且將剩餘的8個位元組資料寫入對應於被選擇分頁220的額外陣列230中。FIG. 8B illustrates a page write instruction 810 for performing a page write operation in a second access mode, in accordance with an embodiment of the present invention. In the present embodiment, it is assumed that each page 220 has a size of 256 bytes, and each additional array 230 has a size of 8 bytes. As depicted in FIG. 8B, the page write instruction 810 has a total of 256 bytes. The first byte includes a page write command code, which may be pre-defined to instruct the logic unit 120 to perform a page write operation in the second access mode. The second to fourth bytes include three address segments AD1, AD2, and AD3, respectively. The three address segments AD1, AD2, and AD3 construct a 24-bit address that represents the location of a page that is selected for the write operation. The 5th to 260th byte includes 256 bytes to be written to the selected page data; the 261th to 268th bytes include to be written to the additional array 230 attached to the selected page. Additional information for 8 bytes. For example, the write command code 37 (hex) may be pre-defined to instruct the logic unit 120 to perform a page write operation in the second access mode. Each of the additional arrays 230 has a size of 8 bytes. When the logic unit 120 receives an instruction containing 37 (hex) and following a 24-bit address and 256 byte data, the logic unit 120 performs a page write operation in the second access mode, The received 256 byte data is written into the page 220 of the memory array 130 having the 24-bit address; and the remaining 8 byte data is written to the additional array 230 corresponding to the selected page 220. in.

【0024】[0024]

第9圖係根據本發明的又一實施例,繪示由邏輯單元120所執行的寫入操作流程圖。當打開記憶體裝置100的電源時,邏輯單元120即判斷是否有接收到寫入指令(步驟902)。假如未接收到寫入指令(步驟902:No),邏輯單元120週期性地執行步驟902直到接收到寫入指令為止。假如接收到寫入指令(步驟902:Yes),邏輯單元120分析接收到的寫入指令,判斷此寫入指令是否指定第一存取模式或第二存取模式(步驟904)。例如邏輯單元120判斷寫入指令中的寫入命令碼究係02(hex)或是37(hex)。假如寫入命令碼為02(hex),邏輯單元120判斷此寫入指令指定第一存取模式(步驟906)。結果邏輯單元120在第一存取模式中進行分頁寫入操作(步驟908)。假如讀取命令碼為37(hex),邏輯單元120判斷此寫入指令指定第二存取模式(步驟910)。結果邏輯單元120在第二存取模式中進行分頁寫入操作(步驟912)。隨後,邏輯單元120回到步驟902判斷是否有接收到讀取指令。FIG. 9 is a flow chart showing a write operation performed by logic unit 120, in accordance with yet another embodiment of the present invention. When the power of the memory device 100 is turned on, the logic unit 120 determines whether a write command has been received (step 902). If the write command is not received (step 902: No), logic unit 120 periodically performs step 902 until a write command is received. If a write command is received (step 902: Yes), logic unit 120 analyzes the received write command and determines whether the write command specifies a first access mode or a second access mode (step 904). For example, logic unit 120 determines that the write command code in the write command is 02 (hex) or 37 (hex). If the write command code is 02 (hex), logic unit 120 determines that the write command specifies the first access mode (step 906). The result logic unit 120 performs a page write operation in the first access mode (step 908). If the read command code is 37 (hex), the logic unit 120 determines that the write command specifies the second access mode (step 910). The result logic unit 120 performs a page write operation in the second access mode (step 912). Subsequently, logic unit 120 returns to step 902 to determine if a read command has been received.

【0025】[0025]

在一些實施例之中,邏輯單元120可以根據儲存於非揮發性記憶體140並載入內部寄存器124之中的存取資訊進行寫入操作。第10圖係根據本發明的再一實施例,繪示由邏輯單元120所執行的寫入操作流程圖。In some embodiments, logic unit 120 may perform a write operation based on access information stored in non-volatile memory 140 and loaded into internal registers 124. FIG. 10 is a flow chart showing a write operation performed by logic unit 120, in accordance with still another embodiment of the present invention.

【0026】[0026]

請參照第10圖,當打開記憶體裝置10 0的電源時,邏輯單元120即將儲存於非揮發性記憶體140中的存取資訊載入邏輯單元120的內部寄存器124中(步驟1002)。邏輯單元120再根據內部寄存器124中的存取資訊,設定內建存取模式(步驟1004)。邏輯單元120判斷是否有接收到寫入指令(步驟1006)。假如未接收到寫入指令(步驟1006:No),邏輯單元120直接移至步驟1010。假如接收到寫入指令(步驟1008:Yes),邏輯單元120根據內建存取模式進行寫入操作(步驟1008)。由於內部寄存器124已經內含了關於是否在第一存取模式或第二存取模式中進行操作的存取資訊,在本實施例中,不需要由寫入指令來指定是否在第一存取模式或第二存取模式中進行讀取操作。然後,邏輯單元120再判斷是否接收到一個改變內部寄存器124中的存取資訊的指令(步驟1010)。假如未接收到改變內部寄存器124中的存取資訊的指令(步驟1010:No),邏輯單元120回到步驟1006判斷是否接收到一個寫入指令。假如,接收到改變內部寄存器124中的存取資訊的指令(步驟1010: Yes),邏輯單元120根據接收到的指令改變存取資訊(步驟1012)。之後,邏輯單元120根據內部寄存器124中已改變的存取資訊,設定內建存取模式(步驟1014)。在此之後,邏輯單元120回到步驟1006判斷是否接收到一個寫入指令。Referring to FIG. 10, when the power of the memory device 100 is turned on, the logic unit 120 loads the access information stored in the non-volatile memory 140 into the internal register 124 of the logic unit 120 (step 1002). The logic unit 120 then sets the built-in access mode based on the access information in the internal register 124 (step 1004). The logic unit 120 determines whether a write command has been received (step 1006). If the write command has not been received (step 1006: No), the logic unit 120 moves directly to step 1010. If a write command is received (step 1008: Yes), logic unit 120 performs a write operation in accordance with the built-in access mode (step 1008). Since the internal register 124 already contains access information about whether to operate in the first access mode or the second access mode, in the present embodiment, it is not necessary to specify whether the first access is by the write command. The read operation is performed in the mode or the second access mode. The logic unit 120 then determines whether an instruction to change the access information in the internal register 124 is received (step 1010). If an instruction to change the access information in the internal register 124 is not received (step 1010: No), the logic unit 120 returns to step 1006 to determine whether a write command has been received. If an instruction to change the access information in the internal register 124 is received (step 1010: Yes), the logic unit 120 changes the access information according to the received instruction (step 1012). Thereafter, logic unit 120 sets the built-in access mode based on the changed access information in internal register 124 (step 1014). After that, the logic unit 120 returns to step 1006 to determine whether a write command has been received.

【0027】[0027]

在一些實施例之中,為了在包含有陣列區塊200和額外陣列區塊210的記憶體裝置100中進行抹除操作,記憶體裝置100的邏輯單元120可以接收一個包含有關於是否抹除一選定陣列區塊200、是否抹除一選定額外陣列區塊210或者是否同時抹除一選定陣列區塊200和一選定額外陣列區塊210之資訊的抹除指令。第11圖係根據本發明的一實施例,繪示用來執行抹除操作的抹除指令1100。In some embodiments, in order to perform an erase operation in the memory device 100 including the array block 200 and the additional array block 210, the logic unit 120 of the memory device 100 can receive one containing whether or not to erase one The selected array block 200, whether to erase a selected additional array block 210, or whether to erase the information of a selected array block 200 and a selected additional array block 210 at the same time. Figure 11 illustrates an erase command 1100 for performing an erase operation, in accordance with an embodiment of the present invention.

【0028】[0028]

如第11圖所繪示,讀取指令1100總共包含4個位元組,即第1位元組、第1位元組、第3位元組和第4位元組。第1位元組包括抹除命令碼,可以被預先定義,以指示邏輯單元120進行抹除操作,藉以抹除一選定陣列區塊200、抹除一選定額外陣列區塊210或者同時抹除一選定陣列區塊200和一選定額外陣列區塊210。第2至第4位元組分別包括AD1、AD2和AD3三個位址段。AD1、AD2和AD3三個位址段建構了一個24位元的位址,其代表一個被選定要被抹除之區塊的位置。例如,抹除命令碼52(hex)可以被預先定義,以指示邏輯單元120進行抹除操作,以抹除被選定的陣列區塊200。當邏輯單元120接收到包含52(hex)且附隨著一個24位元位址和256個位元組資料的指令時,邏輯單元120即進行抹除操作,將具有該24位元位址的陣列區塊200予以抹除。在另一個實施例中,抹除命令碼53(hex)可以被預先定義,以指示邏輯單元120進行抹除操作,以抹除被選定的額外陣列區塊210。當邏輯單元120接收到包含53(hex)且附隨著一個24位元位址的指令時,邏輯單元120即進行抹除操作,將具有該24位元位址的額外陣列區塊210予以抹除。在又一個實施例中,抹除命令碼54(hex)可以被預先定義,以指示邏輯單元120進行抹除操作,以同時抹除被選定的陣列區塊200以及對應於被選定之陣列區塊200的額外陣列區塊210。當邏輯單元120接收到包含54(hex)且附隨著一個24位元位址的指令時,邏輯單元120即進行以抹除操作,將具有該24位元位址的陣列區塊200以及對應於被選定之陣列區塊200的額外陣列區塊210予以抹除。As shown in FIG. 11, the read command 1100 includes a total of 4 bytes, namely a 1st byte, a 1st byte, a 3rd byte, and a 4th byte. The first byte includes an erase command code, which can be pre-defined to instruct the logic unit 120 to perform an erase operation, thereby erasing a selected array block 200, erasing a selected additional array block 210, or erasing one at the same time. Array block 200 and a selected additional array block 210 are selected. The second to fourth bytes include three address segments AD1, AD2, and AD3, respectively. The three address segments AD1, AD2, and AD3 construct a 24-bit address that represents the location of a block selected to be erased. For example, the erase command code 52 (hex) can be pre-defined to instruct the logic unit 120 to perform an erase operation to erase the selected array block 200. When the logic unit 120 receives an instruction containing 52 (hex) and accompanying a 24-bit address and 256 byte data, the logic unit 120 performs an erase operation, which will have the 24-bit address. Array block 200 is erased. In another embodiment, the erase command code 53 (hex) may be pre-defined to instruct the logic unit 120 to perform an erase operation to erase the selected additional array block 210. When the logic unit 120 receives an instruction containing 53 (hex) followed by a 24-bit address, the logic unit 120 performs an erase operation to erase the additional array block 210 having the 24-bit address. except. In yet another embodiment, the erase command code 54 (hex) may be pre-defined to instruct the logic unit 120 to perform an erase operation to simultaneously erase the selected array block 200 and corresponding to the selected array block. An additional array block 210 of 200. When the logic unit 120 receives an instruction including 54 (hex) and a 24-bit address, the logic unit 120 performs an erase operation, and the array block 200 having the 24-bit address and the corresponding The additional array block 210 of the selected array block 200 is erased.

【0029】[0029]

雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何該技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and it is to be understood by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

602‧‧‧是否有接收到讀取指令? 602‧‧‧Is there a read command received?

604‧‧‧第一或第二存取模式? 604‧‧‧ First or second access mode?

606‧‧‧第一存取模式 606‧‧‧First access mode

608‧‧‧根據第一存取模式進行讀取操作 608‧‧‧Read operation according to the first access mode

610‧‧‧第二存取模式 610‧‧‧Second access mode

612‧‧‧根據第二存取模式進行讀取操作 612‧‧‧Read operation according to the second access mode

Claims (16)

【第1項】[Item 1] 一種記憶體裝置,包括:
一記憶體陣列,包括複數個分頁,用來儲存陣列資料(array data),以及複數個額外陣列,分別對應該些分頁,用來儲額外資料;
一邏輯單元,被連接到該記憶體陣列,且被建構來:
接收一讀取指令(read instruction);以及
在一第一存取模式或一第二存取中執行一讀取操作(read operation);
其中,在該第一存取模式中,該邏輯單元將被儲存於該些分頁中的該陣列資料依序讀出;以及
在第二存取模式中,該邏輯單元將儲存於該些分頁中的該陣列資料以及儲存於該些額外陣列中的額外資料依序讀出。
A memory device comprising:
A memory array comprising a plurality of pages for storing array data and a plurality of additional arrays corresponding to respective pages for storing additional data;
A logic unit, connected to the memory array, is constructed to:
Receiving a read instruction; and performing a read operation in a first access mode or a second access;
In the first access mode, the logic unit sequentially reads the array data stored in the paging pages; and in the second access mode, the logic unit is stored in the paging pages. The array data and additional data stored in the additional arrays are sequentially read.
【第2項】[Item 2] 如申請專利範圍第1項所述之記憶體裝置,其中該讀取指令指定是否在該第一存取模式或該第二存取中執行該讀取操作;該讀取指令包括一讀取命令碼(read command code)和該讀取操作的一開始位址(starting address),且該讀取命令碼係一第一讀取命令碼和一第二讀取命令碼二者中的一者;其中該第一讀取命令碼係用來指定該第一存取模式;該第二讀取命令碼係用來指定該第二存取模式和每一該些額外陣列的一尺寸。
The memory device of claim 1, wherein the read instruction specifies whether the read operation is performed in the first access mode or the second access; the read command includes a read command a read command code and a starting address of the read operation, and the read command code is one of a first read command code and a second read command code; The first read command code is used to specify the first access mode; the second read command code is used to specify the second access mode and a size of each of the additional arrays.
【第3項】[Item 3] 如申請專利範圍第2項所述之記憶體裝置,其中該邏輯單元係被建構來:
判斷該讀取指令中的該讀取命令碼究係該第一讀取命令碼或是該第二讀取命令碼;
假如該讀取命令碼被判斷為該第一讀取命令碼,則在該第一存取模式中進行該讀取操作;以及
假如該讀取命令碼被判斷為該第二讀取命令碼,則在該第二存取模式中進行該讀取操作。
The memory device of claim 2, wherein the logic unit is constructed:
Determining, in the read command, the read command code is the first read command code or the second read command code;
If the read command code is determined to be the first read command code, the read operation is performed in the first access mode; and if the read command code is determined to be the second read command code, The read operation is then performed in the second access mode.
【第4項】[Item 4] 如申請專利範圍第1項所述之記憶體裝置,更包括一非揮發性記憶體(non-volatile memory),用來儲存可指定是否在該第一存取模式或該第二存取模式中進行一記憶體存取操作的存取資訊,該邏輯單元包括一內部寄存器(internal register),
其中該邏輯單元係被建構來:
將該存取資訊由該非揮發性記憶體載入該內部寄存器中;以及
根據該內部寄存器中的該存取資訊,設定一內建存取模式(default access mode)。
The memory device of claim 1, further comprising a non-volatile memory for storing whether the first access mode or the second access mode is specified Performing access information for a memory access operation, the logic unit including an internal register
Where the logical unit is constructed:
The access information is loaded into the internal register by the non-volatile memory; and a default access mode is set according to the access information in the internal register.
【第5項】[Item 5] 如申請專利範圍第4項所述之記憶體裝置,其中該邏輯單元係被建構來:
在該內建存取模式中執行該讀取操作;
接收改變該內部寄存器中的該存取資訊的一指令;
根據接收到的該指令改變該內部寄存器中的該存取資訊;以及
根據該內部寄存器中已改變的該存取資訊設定該內建存取模式。
The memory device of claim 4, wherein the logic unit is constructed:
Performing the read operation in the built-in access mode;
Receiving an instruction to change the access information in the internal register;
And changing the access information in the internal register according to the received instruction; and setting the built-in access mode according to the changed access information in the internal register.
【第6項】[Item 6] 如申請專利範圍第4項所述之記憶體裝置,其中該邏輯單元係被建構來:
接收一寫入指令(program instruction),其包括一被選擇分頁(selected page)的一位址(address)以及要被寫入的資料;以及
在該內建存取模式中執行一寫入操作(program operation)。
The memory device of claim 4, wherein the logic unit is constructed:
Receiving a program instruction including an address of a selected page and a material to be written; and performing a write operation in the built-in access mode ( Program operation).
【第7項】[Item 7] 如申請專利範圍第1項所述之記憶體裝置,其中該邏輯單元係被建構來:
接收一寫入指令,其包括一被選擇分頁的一位址以及要被寫入的資料;以及
在該第一存取模式或該第二存取中執行一寫入操作;
其中,在該第一存取模式中,該邏輯單元將所接收的該資料寫入該被選擇分頁中;以及
在第二存取模式中,該邏輯單元將所接收的該資料寫入該被選擇分頁以及對應該被選擇分頁的該額外陣列中。
The memory device of claim 1, wherein the logic unit is constructed:
Receiving a write command including a page address of the selected page and the material to be written; and performing a write operation in the first access mode or the second access;
Wherein, in the first access mode, the logic unit writes the received data into the selected page; and in the second access mode, the logic unit writes the received data to the Select the pagination and the additional array that should be selected for pagination.
【第8項】[Item 8] 如申請專利範圍第7項所述之記憶體裝置,其中該寫入指令包括一寫入命令碼(program command code);且該寫入命令碼係一第一寫入命令碼和一第二寫入命令碼二者中的一者;其中,該第一寫入命令碼係用來指定該第一存取模式;該第二寫入命令碼係用來指定該第二存取模式和每一該些額外陣列的一尺寸。
The memory device of claim 7, wherein the write command includes a program command code; and the write command code is a first write command code and a second write One of the command codes; wherein the first write command code is used to specify the first access mode; the second write command code is used to specify the second access mode and each One size of these additional arrays.
【第9項】[Item 9] 如申請專利範圍第8項所述之記憶體裝置,其中該邏輯單元係被建構來:
判斷該寫入指令中的該寫入命令碼究係該第一寫入命令碼或是該第二寫入命令碼;
假如該寫入命令碼被判斷為該第一寫入命令碼,則在該第一存取模式中進行該寫入操作;以及
假如該寫入命令碼被判斷為該第二寫入命令碼,則在該第二存取模式中進行該寫入操作。
The memory device of claim 8, wherein the logic unit is constructed:
Determining, by the write command code in the write command, the first write command code or the second write command code;
If the write command code is determined to be the first write command code, the write operation is performed in the first access mode; and if the write command code is determined to be the second write command code, The write operation is then performed in the second access mode.
【第10項】[Item 10] 如申請專利範圍第1項所述之記憶體裝置,其中該邏輯單元係被建構來:
接收一抹除指令,其包含一位址;
判斷該寫入指令是否指定抹除一選定陣列區塊、一選定額外陣列區塊或者是否同時抹除一選定陣列區塊和一選定額外陣列區塊;以及
根據該判斷執行一抹除操作。
The memory device of claim 1, wherein the logic unit is constructed:
Receiving a erase command that includes an address;
Determining whether the write command specifies to erase a selected array block, a selected additional array block, or whether to simultaneously erase a selected array block and a selected additional array block; and perform an erase operation according to the determination.
【第11項】[Item 11] 一種記憶體裝置,包括:
一記憶體陣列,包括複數個分頁,用來儲存陣列資料,以及複數個額外陣列,分別對應該些分頁,用來儲額外資料;
一邏輯單元,被連接到該記憶體陣列,且被建構來:
接收一寫入指令,其包括一被選擇分頁的一位址以及要被寫入的資料;以及
在一第一存取模式或一第二存取中執行一讀取操作;
其中,在該第一存取模式中,該邏輯單元將所接收的該資料寫入該被選擇分頁中;以及
在第二存取模式中,該邏輯單元將所接收的該資料寫入該被選擇分頁以及對應該被選擇分頁的該額外陣列中。
A memory device comprising:
A memory array comprising a plurality of pages for storing array data and a plurality of additional arrays corresponding to respective pages for storing additional data;
A logic unit, connected to the memory array, is constructed to:
Receiving a write command comprising a page address of the selected page and the data to be written; and performing a read operation in a first access mode or a second access;
Wherein, in the first access mode, the logic unit writes the received data into the selected page; and in the second access mode, the logic unit writes the received data to the Select the pagination and the additional array that should be selected for pagination.
【第12項】[Item 12] 如申請專利範圍第11項所述之記憶體裝置,其中該寫入指令指定是否在該第一存取模式或該第二存取中執行該寫入操作;該寫入指令包括一寫入命令碼;且該寫入命令碼係一第一寫入命令碼和一第二寫入命令碼二者中的一者;其中,該第一寫入命令碼係用來指定該第一存取模式;該第二寫入命令碼係用來指定該第二存取模式和每一該些額外陣列的一尺寸。
The memory device of claim 11, wherein the write instruction specifies whether the write operation is performed in the first access mode or the second access; the write command includes a write command And the write command code is one of a first write command code and a second write command code; wherein the first write command code is used to specify the first access mode The second write command code is used to specify the second access mode and a size of each of the additional arrays.
【第13項】[Item 13] 如申請專利範圍第12項所述之記憶體裝置,其中該邏輯單元係被建構來:
判斷該寫入指令中的該寫入命令碼究係該第一寫入命令碼或是該第二寫入命令碼;
假如該寫入命令碼被判斷為該第一寫入命令碼,則在該第一存取模式中進行該寫入操作;以及
假如該寫入命令碼被判斷為該第二寫入命令碼,則在該第二存取模式中進行該寫入操作。
The memory device of claim 12, wherein the logic unit is constructed:
Determining, by the write command code in the write command, the first write command code or the second write command code;
If the write command code is determined to be the first write command code, the write operation is performed in the first access mode; and if the write command code is determined to be the second write command code, The write operation is then performed in the second access mode.
【第14項】[Item 14] 如申請專利範圍第11項所述之記憶體裝置,更包括一非揮發性記憶體,用來儲存可指定是否在該第一存取模式或該第二存取模式中進行一記憶體存取操作的存取資訊;其中該邏輯單元包括一內部寄存器,且該邏輯單元係被建構來:
將該存取資訊由該非揮發性記憶體載入該內部寄存器中;
根據該內部寄存器中的該存取資訊,設定一內建存取模式;以及
根據該內建存取模式執行該寫入操作。
The memory device of claim 11, further comprising a non-volatile memory for storing whether to perform a memory access in the first access mode or the second access mode. Access information for operations; wherein the logic unit includes an internal register, and the logic unit is constructed to:
Loading the access information from the non-volatile memory into the internal register;
Setting a built-in access mode according to the access information in the internal register; and performing the write operation according to the built-in access mode.
【第15項】[Item 15] 如申請專利範圍第14項所述之記憶體裝置,其中該邏輯單元係被建構來:
接收改變該內部寄存器中的該存取資訊的一指令;
根據接收到的該指令改變該內部寄存器中的該存取資訊;以及
根據該內部寄存器中已改變的該存取資訊設定該內建存取模式。
The memory device of claim 14, wherein the logic unit is constructed:
Receiving an instruction to change the access information in the internal register;
And changing the access information in the internal register according to the received instruction; and setting the built-in access mode according to the changed access information in the internal register.
【第16項】[Item 16] 一種操作一記憶體裝置的方法,該記憶體裝置包括用來儲存陣列資料的複數個陣列區塊,以及複數個額外陣列區塊,分別對應該些陣列區塊,用來儲額外資料,該方法包括:
接收一讀取指令,其包括一讀取命令碼;
判斷此該讀取命令碼是一第一讀取命令碼或是一第二讀取命令碼;
假如該讀取命令碼被判定為該第一讀取命令碼,則依序讀出儲存於該些陣列區塊中的該陣列資料;以及
假如該讀取命令碼被判定為該第二讀取命令碼,則依序讀出儲存於該些陣列區塊中的該陣列資料以及儲存於該些額外陣列區塊中的該額外資料。
A method of operating a memory device, the memory device comprising a plurality of array blocks for storing array data, and a plurality of additional array blocks corresponding to the array blocks for storing additional data, the method include:
Receiving a read command including a read command code;
Determining whether the read command code is a first read command code or a second read command code;
If the read command code is determined to be the first read command code, sequentially reading the array data stored in the array blocks; and if the read command code is determined to be the second read The command code sequentially reads the array data stored in the array blocks and the additional data stored in the additional array blocks.
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