TW201628998A - Void structured film bonded through catalytic action and method for manufacturing same - Google Patents

Void structured film bonded through catalytic action and method for manufacturing same Download PDF

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TW201628998A
TW201628998A TW104143838A TW104143838A TW201628998A TW 201628998 A TW201628998 A TW 201628998A TW 104143838 A TW104143838 A TW 104143838A TW 104143838 A TW104143838 A TW 104143838A TW 201628998 A TW201628998 A TW 201628998A
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void structure
structure film
void
present
compound
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TW104143838A
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TWI692464B (en
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Daisuke Hattori
Hiromoto Haruta
Kozo Nakamura
Kazuki Uwada
Hiroyuki Takemoto
Nao Murakami
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Nitto Denko Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/24Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by surface fusion and bonding of particles to form voids, e.g. sintering
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/28Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Silicon Compounds (AREA)

Abstract

The purpose of the present invention is to provide, for example, a void structured film in which a porous structure with a high porosity is formed while preventing cracking and which has a high strength. The void structured film according to the present invention is characterized in that one or more kinds of structural units for forming a microvoid structure are chemically bonded together through a catalytic action. The void structured film according to the present invention has an excoriation resistance of 60-100% when measured by using, for example, BEMCOT (registered trademark) and the number of times of folding endurance in an MIT test of 100 or greater. The void structured film can be manufactured by forming a precursor of a porous silicone body with the use of, for example, a sol containing ground pieces of a gel-type silicon compound, and then chemically bonding the ground pieces contained in the precursor of the porous silicone body. It is preferred that the ground pieces are chemically bonded together through, for example, chemical cross-linking.

Description

經由觸媒作用結合之空隙結構薄膜及其製造方法 Void structure film combined by catalytic action and manufacturing method thereof 發明領域 Field of invention

本發明係關於經由觸媒作用結合之空隙結構薄膜及其製造方法。 The present invention relates to a void structure film bonded by a catalytic action and a method of producing the same.

發明背景 Background of the invention

關於多孔質結構可見多種採用各種材料及製法的範例,並且應用在廣泛領域的製品上,如低折射率層等光學構件、絕熱材、吸音材、再生醫療用基材等。於前述多孔質結構中,存有密閉性發泡(closed-cell)結構及開放性發泡(open-cell)結構等之以分散狀態呈現的定義,該密閉性發泡結構為單一空隙(空孔)分散形成者,該開放性發泡結構則為前述密閉性發泡結構緊連形成者。此外,也有以空隙大小、或各種多孔質結構之定義存在。 As for the porous structure, various examples of various materials and methods can be used, and they are applied to a wide range of products, such as optical members such as a low refractive index layer, a heat insulating material, a sound absorbing material, and a substrate for regenerative medical treatment. In the porous structure, there is a definition in a dispersed state in which a closed-cell structure and an open-cell structure are present, and the hermetic foamed structure is a single void (empty The pores are formed by dispersion, and the open foam structure is formed by the formation of the above-mentioned airtight foam structure. In addition, there are also definitions of void size or various porous structures.

製作此種多孔質結構之方法,可舉如:藉由將濕潤凝膠中所含溶劑在其超臨界條件下與氣體作取代,而獲得前述濕潤凝膠之骨架結構直接被凍結且無收縮的乾燥凝膠體之方法(例如參照專利文獻1)。於該乾燥凝膠體,可分為在常壓下緩慢地蒸發除去凝膠溶劑的乾凝膠及具有低體密度及高氣孔率之“宛如空氣的凝膠”即氣凝膠。 The method for producing such a porous structure is as follows: by substituting a solvent contained in the wet gel with a gas under supercritical conditions, the skeleton structure of the wet gel is directly frozen and not shrinked. A method of drying a gel (for example, refer to Patent Document 1). The dried gel body can be classified into a dry gel which slowly evaporates and removes the gel solvent under normal pressure, and an "air-like gel" which is a low bulk density and a high porosity, that is, an aerogel.

一般而言,在製作氣凝膠的多孔質結構時,其課題係在於如何在凝膠乾燥時不使凝膠體上產生龜裂。前述龜裂會因為乾燥中之凝膠體細孔中殘留的溶液藉由表面張力之毛細管力所引起的抗拉應力大於凝膠強度時產生。在超臨界條件下,雖可藉由表面張力消失獲得無龜裂的多孔質結構,但其後有可能在進行高溫燒結處理作為除去較大細孔之過程當中產生龜裂。為了抑制在這種高溫處理時產生龜裂,有些案例係使用沸點比水高且表面張力較小的溶劑或混入微粒子二氧化矽等(非專利文獻1)。 In general, when producing a porous structure of an aerogel, the problem is how to prevent cracking of the gel when the gel is dried. The above-mentioned cracking occurs when the tensile stress caused by the capillary force of the surface tension of the solution remaining in the pores of the gel in the drying is larger than the gel strength. Under the supercritical condition, although the crack-free porous structure can be obtained by the disappearance of the surface tension, it is possible to cause cracking during the high-temperature sintering treatment as a process of removing the large pores. In order to suppress the occurrence of cracks during such high-temperature treatment, in some cases, a solvent having a boiling point higher than that of water and having a small surface tension or a fine particle of cerium oxide is used (Non-Patent Document 1).

另一方面,形成高空隙率的結構體時,結構體骨架密度會降低,所以有強度顯著降低之課題。強度一降低,就有耐擦傷性變低等使用上的問題。針對此,例如已有文獻揭示在構成空隙結構之構成物質為聚矽氧多孔體時將聚矽氧多孔體予以燒成而提高強度之方法(例如參照專利文獻2~5)。然而,為了在燒成處理中長時間進行200℃以上的高溫處理,分批處理已為前提,所以無法在工業上進行連續生產。此外,在進行燒成處理時,二氧化矽凝膠之結晶穩定相一旦從低溫相相轉移成高溫相後,於燒結結束進行放冷時,有伴隨巨大的體積變化而產生龜裂的課題。同樣的現象不限於二氧化矽凝膠,可在各種形成空隙結構之構成物質確認。 On the other hand, when a structure having a high void ratio is formed, the skeleton density of the structure is lowered, so that the strength is remarkably lowered. As the strength is lowered, there is a problem in use such as low scratch resistance. In this regard, for example, a method of firing a polysiloxane porous body to increase the strength when the constituent material constituting the void structure is a polysiloxane porous material has been disclosed (see, for example, Patent Documents 2 to 5). However, in order to carry out high-temperature treatment at 200 ° C or higher for a long period of time in the firing treatment, batch processing is a prerequisite, and continuous production cannot be performed industrially. Further, when the calcination treatment is carried out, the crystal stable phase of the cerium oxide gel is transferred from the low-temperature phase phase to the high-temperature phase, and when the sintering is completed and the cooling is performed, there is a problem that cracks occur due to a large volume change. The same phenomenon is not limited to the cerium oxide gel, and can be confirmed by various constituent materials forming the void structure.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本專利特開2005-154195號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2005-154195

專利文獻2:日本專利特開2006-297329號公報 Patent Document 2: Japanese Patent Laid-Open No. 2006-297329

專利文獻3:日本專利特開2006-221144號公報 Patent Document 3: Japanese Patent Laid-Open No. 2006-221144

專利文獻4:日本專利特開2006-011175號公報 Patent Document 4: Japanese Patent Laid-Open No. 2006-011175

專利文獻5:日本專利特開2008-040171號公報 Patent Document 5: Japanese Patent Laid-Open Publication No. 2008-040171

非專利文獻 Non-patent literature

非專利文獻1:T. Adachi, J. Mater. Sci., 22.4407-4410(1987) Non-Patent Document 1: T. Adachi, J. Mater. Sci., 22.4407-4410 (1987)

發明概要 Summary of invention

爰此,本發明目的在於提供一種例如可抑制龜裂產生的同時又可形成高空隙率之多孔結構且亦兼具強度的空隙結構薄膜及其製造方法。 Accordingly, an object of the present invention is to provide a void structure film which can suppress the generation of cracks and which can form a porous structure having a high void ratio and which also has strength, and a method for producing the same.

為了達成前述目的,本發明之空隙結構薄膜的特徵在於:有一種或多種可形成微細空隙結構之構成單元彼此經由觸媒作用而化學結合。以下,主要針對聚矽氧之微細孔粒子彼此呈直接或間接性化學結合之多孔體的空隙層(空隙結構薄膜)加以說明。此外,以下,聚矽氧多孔體之本發明之空隙結構薄膜有時會稱為「本發明之聚矽氧多孔體」。 In order to achieve the above object, the void structure film of the present invention is characterized in that one or more constituent units capable of forming a fine void structure are chemically bonded to each other via a catalytic action. Hereinafter, a void layer (void structure film) of a porous body in which the microporous particles of polyoxymethylene are directly or indirectly chemically bonded to each other will be mainly described. In addition, the void structure film of the present invention of the porous polysiloxane body may be referred to as "the porous polysiloxane body of the present invention" hereinafter.

本發明之聚矽氧多孔體之製造方法的特徵在於包含下述步驟:製作含有矽化合物之微細孔粒子的液體; 於前述液體添加觸媒,該觸媒係用以使前述矽化合物之微細孔粒子彼此行化學結合;及使前述微細孔粒子彼此經由觸媒作用行化學結合的結合步驟。 The method for producing a polysiloxane porous body of the present invention is characterized by comprising the steps of: preparing a liquid containing fine pore particles of a ruthenium compound; The catalyst is added to the liquid, and the catalyst is used for chemically bonding the fine pore particles of the ruthenium compound to each other; and a bonding step of chemically bonding the microporous particles to each other via a catalyst.

惟,本發明之空隙結構薄膜及本發明之聚矽氧多孔體不受此製造方法限定,可藉由任意製造方法來製造。 However, the void structure film of the present invention and the polysiloxane porous body of the present invention are not limited by this production method, and can be produced by any production method.

本發明之空隙結構薄膜如前述,係有一種或多種可形成微細空隙結構之構成單元彼此經由觸媒作用而化學結合。例如,本發明之聚矽氧多孔體係使用前述矽化合物之微細孔粒子,藉由前述矽化合物之微細孔粒子彼此經由觸媒作用而化學結合,讓前述多孔結構固定化。藉此,可提供一種可抑制龜裂(裂痕)產生的同時又可形成高空隙率的多孔結構且亦兼具強度的空隙結構薄膜。 The void structure film of the present invention is as described above, and one or more constituent units capable of forming a fine void structure are chemically bonded to each other via a catalytic action. For example, in the porous polysiloxane system of the present invention, the fine pore particles of the ruthenium compound are used, and the microporous particles of the ruthenium compound are chemically bonded to each other via a catalyst to immobilize the porous structure. Thereby, it is possible to provide a void structure film which can suppress the generation of cracks (cracks) while forming a porous structure having a high void ratio and also having strength.

10‧‧‧基材 10‧‧‧Substrate

20‧‧‧多孔質結構 20‧‧‧Porous structure

20’‧‧‧塗覆膜(前驅層) 20'‧‧‧ coated film (precursor layer)

20”‧‧‧溶膠粒子液 20”‧‧‧Sol particle liquid

21‧‧‧強度增強之多孔質結構(多孔體) 21‧‧‧Strengthened porous structure (porous body)

101、201‧‧‧送出輥 101, 201‧‧‧Send rolls

102‧‧‧塗覆輥 102‧‧‧Application roller

105、251‧‧‧卷取輥 105, 251‧‧ ‧ take-up rolls

106‧‧‧輥件 106‧‧‧Roll parts

110、210‧‧‧烘箱區 110, 210‧‧‧ oven area

111、131、231‧‧‧熱風器(加熱機構) 111, 131, 231‧‧‧Hot air heaters (heating mechanism)

120、220‧‧‧化學處理區 120, 220‧‧ ‧ chemical treatment area

121、221‧‧‧燈(光照射機構)或熱風器(加熱機構) 121, 221‧‧‧ lamps (light irradiation mechanism) or air heater (heating mechanism)

130a、230a‧‧‧黏接著層塗覆區 130a, 230a‧‧‧ adhesive layer coating area

130、230‧‧‧中間層形成區 130, 230‧‧‧ intermediate formation area

131a、231a‧‧‧黏接著層塗覆機構 131a, 231a‧‧‧ adhesive layer coating mechanism

202‧‧‧儲液區 202‧‧‧Liquid storage area

203‧‧‧刮刀(doctor knife) 203‧‧‧Doctor knife

204‧‧‧微凹版 204‧‧‧ microgravure

211‧‧‧加熱機構 211‧‧‧ heating mechanism

圖1係一步驟截面圖,其示意顯示本發明中於基材10上形成聚矽氧多孔體20之方法一例。 Fig. 1 is a cross-sectional view showing an example of a method of forming a porous polysiloxane porous body 20 on a substrate 10 in the present invention.

圖2係示意顯示本發明空隙結構薄膜之製造方法中之步驟一部分及其使用之裝置一例之圖。 Fig. 2 is a view schematically showing a part of the steps in the method for producing the void structure film of the present invention and an example of the apparatus used therefor.

圖3係示意顯示本發明空隙結構薄膜之製造方法中之步驟一部分及其使用之裝置另一例之圖。 Fig. 3 is a view schematically showing a part of the steps in the method for producing the void structure film of the present invention and another example of the apparatus used therefor.

圖4係實施例之聚矽氧多孔體的截面SEM像。 Fig. 4 is a cross-sectional SEM image of the porous polysiloxane body of the example.

圖5係實施例之聚矽氧多孔體的微細孔粒子TEM像。 Fig. 5 is a TEM image of a fine pore particle of the porous polysiloxane porous body of the example.

圖6係一步驟截面圖,其示意顯示本發明中於基材上 形成聚矽氧多孔體之方法另一例。 Figure 6 is a cross-sectional view showing the present invention on a substrate Another example of a method of forming a polysiloxane porous body.

圖7係示意顯示本發明空隙結構薄膜之製造方法中之步驟一部分及其使用之裝置又另一例之圖。 Fig. 7 is a view schematically showing a part of the steps in the method for producing the void structure film of the present invention and another example of the apparatus used therefor.

圖8係示意顯示本發明空隙結構薄膜之製造方法中之步驟一部分及其使用之裝置又另一例之圖。 Fig. 8 is a view schematically showing a part of the steps in the method for producing the void structure film of the present invention and another example of the apparatus used therefor.

圖9係一步驟截面圖,其示意顯示本發明中於基材上形成聚矽氧多孔體之方法之又另一例。 Figure 9 is a cross-sectional view showing still another example of the method of forming a porous polysiloxane body on a substrate in the present invention.

圖10係示意顯示本發明空隙結構薄膜之製造方法中之步驟一部分及其使用之裝置又另一例之圖。 Fig. 10 is a view schematically showing a part of the steps in the method for producing the void structure film of the present invention and another example of the apparatus used therefor.

圖11係示意顯示本發明空隙結構薄膜之製造方法中之步驟一部分及其使用之裝置又另一例之圖。 Figure 11 is a view schematically showing a part of the steps in the method for producing the void structure film of the present invention and another example of the apparatus used therefor.

用以實施發明之形態 Form for implementing the invention

本發明之聚矽氧多孔體係例如其多孔質結構為孔結構連續構成的開放性發泡結構體。 The polyfluorene-containing porous system of the present invention has, for example, an open structure in which the porous structure is a continuous foamed structure in which a pore structure is continuously formed.

本發明之製造方法中,例如前述觸媒係促進矽化合物溶膠彼此交聯結合的觸媒。 In the production method of the present invention, for example, the catalyst is a catalyst that promotes crosslinking and bonding of the cerium compound sols to each other.

以下,針對本發明將舉例進一步具體說明。惟,本發明不受以下說明限定及限制。 Hereinafter, the present invention will be further specifically described by way of examples. However, the invention is not limited or limited by the following description.

在本發明之空隙結構薄膜中,例如前述構成單元彼此的結合鍵可含有氫鍵或共價鍵。形成本發明之空隙結構薄膜的構成單元例如可由具有粒子狀、纖維狀、平板狀之至少一種形狀的結構構成。前述粒子狀及平板狀之構成單元例如可由無機物構成。此外,前述粒子狀構成單元之 構成元素例如可含有選自於由Si、Mg、Al、Ti、Zn及Zr所構成群組中之至少一項元素。形成粒子狀之結構體(構成單元)可為實心粒子亦可為空心粒子,具體上可列舉聚矽氧粒子或具有微細孔之聚矽氧粒子、二氧化矽空心奈米粒子或二氧化矽空心奈米球(Nanoballoon)等。纖維狀之構成單元例如係直徑為奈米尺寸之奈米纖維,具體上可列舉纖維素奈米纖維或氧化鋁奈米纖維等。平板狀之構成單元可舉如奈米黏土,具體上可列舉奈米尺寸之膨土(例如Kunipia F[商品名])等。前述纖維狀之構成單元無特別限定,例如可為選自於由碳奈米纖維、纖維素奈米纖維、氧化鋁奈米纖維、甲殼質奈米纖維、甲殼素奈米纖維、聚合物奈米纖維、玻璃奈米纖維及二氧化矽奈米纖維所構成群組中之至少一種纖維狀物質。又,在本發明之空隙結構薄膜中含有下述部分:一種或多種可形成前述微細空隙結構之構成單元彼此經由觸媒作用而例如直接或間接性化學結合。此外,本發明之前述空隙結構薄膜中,前述一種或多種構成單元彼此之至少一部分係經由觸媒作用而化學結合即可。具體上,就像亦可存在即使構成單元彼此相互接觸也未經化學結合的部分。又,在本發明中,構成單元彼此「間接結合」意指構成單元彼此係透過構成單元量以下的少量黏結劑成分而結合。構成單元彼此「直接結合」意指構成單元彼此未透過黏結劑成分等即直接結合。 In the void structure film of the present invention, for example, the bond of the above constituent units may contain a hydrogen bond or a covalent bond. The constituent unit forming the void structure film of the present invention may be configured, for example, by a structure having at least one of a particle shape, a fiber shape, and a flat shape. The constituent elements of the particulate form and the flat shape may be made of, for example, an inorganic material. In addition, the aforementioned particulate constituent unit The constituent element may contain, for example, at least one element selected from the group consisting of Si, Mg, Al, Ti, Zn, and Zr. The structure in which the particles are formed (constituting unit) may be solid particles or hollow particles, and specifically, polyfluorene oxide particles or polycrystalline oxygen particles having fine pores, hollow cerium oxide nanoparticles or hollow cerium oxide may be mentioned. Nanoballoon and so on. The fibrous constituent unit is, for example, a nanofiber having a diameter of a nanometer, and specific examples thereof include cellulose nanofibers and alumina nanofibers. The structural unit of the flat plate may, for example, be a nano-clay, and specifically, a bentonite of a nanometer size (for example, Kunipia F [trade name]) may be mentioned. The fibrous constituent unit is not particularly limited, and may be, for example, selected from the group consisting of carbon nanofibers, cellulose nanofibers, alumina nanofibers, chitin nanofibers, chitin nanofibers, and polymer nanometers. At least one fibrous substance in the group consisting of fibers, glass nanofibers, and cerium oxide nanofibers. Further, the void structure film of the present invention contains a portion in which one or more constituent units capable of forming the aforementioned fine void structure are chemically bonded to each other via a catalytic action, for example, directly or indirectly. Further, in the above-described void structure film of the present invention, at least a part of the one or more constituent units may be chemically bonded via a catalytic action. Specifically, it is as if there is a portion where the constituent units are not chemically bonded even if they are in contact with each other. Further, in the present invention, the "indirect bonding" of the constituent units means that the constituent units are bonded to each other through a small amount of the binder component of the constituent unit or less. The "direct bonding" of the constituent units means that the constituent units are directly bonded to each other without being passed through the binder component or the like.

[1.空隙結構薄膜] [1. Void structure film]

以下,針對本發明之空隙結構薄膜主要以本發明之聚 矽氧多孔體為中心加以說明。惟,如前述,本發明之空隙結構薄膜不限於只有聚矽氧多孔體。此外如前述,本發明之空隙結構薄膜即使是聚矽氧多孔體以外之物,也如前述可發揮抑制龜裂(裂痕)產生又同時形成高空隙率的多孔結構,且兼具強度之效果。 Hereinafter, the void structure film of the present invention is mainly composed of the present invention. The porous oxygen-containing body is described as a center. However, as described above, the void structure film of the present invention is not limited to only the polysiloxane porous body. Further, as described above, the void structure film of the present invention has a porous structure having a high void ratio and suppressing the occurrence of cracks (cracks) as well as the above, and has an effect of strength.

如前述,本發明之聚矽氧多孔體的特徵在於含有矽化合物之微細孔粒子且前述矽化合物之微細孔粒子彼此經由觸媒作用形成化學結合。不過,在本發明中,「粒子」(例如,前述矽化合物之微細孔粒子等)之形狀並無特別限定,例如可為球狀亦可為非球狀系等。 As described above, the porous polysiloxane body of the present invention is characterized by containing fine pore particles of a ruthenium compound and the fine pore particles of the ruthenium compound are chemically bonded to each other via a catalyst. In the present invention, the shape of the "particles" (for example, the fine pore particles of the ruthenium compound) is not particularly limited, and may be, for example, a spherical shape or an aspherical system.

本發明之聚矽氧多孔體因前述矽化合物之微細孔粒子彼此經由觸媒作用化學結合(例如交聯)而形成有三維結構。藉由具有此種構成,本發明之聚矽氧多孔體雖為具有空隙之結構,但依舊可維持合計充分的強度及足以抑制龜裂產生的充分的可撓性。因此,本發明之聚矽氧多孔體可作為例如多孔結構之薄膜體使用於各種構件。具體上,本發明之聚矽氧多孔體例如可作為低折射率層等的光學構件、絕熱材、吸音材、再生醫療用基材、結露防止材、印墨影像接收材等使用。本發明之聚矽氧多孔體尤以乾凝膠為佳,惟可能依例如用途或目的而不同。習知,乾凝膠雖有優異的強度但空隙率很低,另一方面,氣凝膠則係空隙率高但強度很低。相對地,本發明之聚矽氧多孔體兼具高空隙率及強度。即,本發明之聚矽氧多孔體即使如乾凝膠,依舊可與氣凝膠同樣地實現高空隙率。此外,在本發 明之聚矽氧多孔體中,前述矽化合物之微細孔粒子以凝膠狀矽化合物的粉碎物為佳。藉由前述凝膠狀矽化合物之粉碎物,可形成與未粉碎之凝膠狀矽化合物截然不同的全新三維結構,且可形成前述粉碎物彼此之化學結合(例如交聯)。藉此,本發明之聚矽氧多孔體可發揮不同於未粉碎之凝膠狀矽化合物的物性(例如,前述的充分強度、充分的可撓性等)。又,在本發明中,前述矽化合物之微細孔粒子例如亦可為溶膠凝膠串珠狀粒子、奈米粒子(空心奈米二氧化矽‧奈米球粒子)、奈米纖維等。 The polyasperylene porous body of the present invention has a three-dimensional structure because the fine pore particles of the above ruthenium compound are chemically bonded (for example, crosslinked) via a catalyst. With such a configuration, the porous polysiloxane porous body of the present invention has a structure having a void, but can maintain a sufficient total strength and sufficient flexibility to suppress cracking. Therefore, the polysiloxane porous body of the present invention can be used for various members as a film body of a porous structure, for example. Specifically, the porous polysiloxane body of the present invention can be used, for example, as an optical member such as a low refractive index layer, a heat insulating material, a sound absorbing material, a substrate for regenerative medical treatment, a dew condensation preventing material, an ink image receiving material, or the like. The polysiloxane porous body of the present invention is particularly preferably a dry gel, but may differ depending on, for example, the use or purpose. Conventionally, although a dry gel has excellent strength but a low void ratio, on the other hand, an aerogel has a high void ratio but a low strength. In contrast, the porous polysiloxane body of the present invention has both high void ratio and strength. That is, the porous polysiloxane porous body of the present invention can achieve a high void ratio similarly to an aerogel even if it is a dry gel. In addition, in this issue In the polysiloxane porous body, the fine pore particles of the ruthenium compound are preferably a pulverized product of a gelatinous ruthenium compound. By the pulverized material of the gelatinous cerium compound, a completely new three-dimensional structure which is distinct from the unpulverized gelatinous quinone compound can be formed, and the pulverized materials can be chemically bonded to each other (for example, crosslinked). Thereby, the porous polysiloxane porous body of the present invention can exhibit physical properties different from those of the unpulverized gelatinous quinone compound (for example, the above-described sufficient strength, sufficient flexibility, and the like). Further, in the present invention, the fine pore particles of the ruthenium compound may be, for example, sol-gel beaded particles, nano particles (hollow nano cerium oxide/nanosphere particles), or nanofibers.

如前述,本發明之聚矽氧多孔體含有前述矽化合物之微細孔粒子(理想為凝膠狀矽化合物的粉碎物),且前述矽化合物之微細孔粒子彼此經由觸媒作用形成化學結合。在本發明之聚矽氧多孔體中,前述矽化合物之微細孔粒子彼此的化學結合(化學鍵)形態並無特別限制,前述化學鍵之具體例可舉如交聯鍵等。另外,使前述矽化合物之微細孔粒子彼此行化學結合之方法將在本發明之製造方法中詳述。 As described above, the porous polysiloxane body of the present invention contains fine pore particles (preferably a pulverized product of a gelatinous ruthenium compound) of the ruthenium compound, and the fine pore particles of the ruthenium compound are chemically bonded to each other via a catalyst. In the porous polysiloxane body of the present invention, the chemical bonding (chemical bond) form of the fine pore particles of the ruthenium compound is not particularly limited, and specific examples of the chemical bond include a crosslinking bond. Further, a method of chemically bonding the fine pore particles of the above ruthenium compound to each other will be described in detail in the production method of the present invention.

前述交聯鍵例如為矽氧烷鍵。惟,本發明之化學鍵不限於矽氧烷結構。前述矽氧烷鍵可舉如以下所示T2鍵、T3鍵、T4鍵。本發明之聚矽氧多孔體具有前述矽氧烷鍵時,例如可具有其中任一種鍵,可具有其中任二種鍵,也可具有三種全部的鍵。前述矽氧烷鍵中,T2及T3之比率愈多,愈富可撓性,也就愈可期待凝膠本來的特性,但強度會變弱。另一方面,前述矽氧烷鍵中T4比率一多,雖易 於顯現強度,但空隙大小會變小且可撓性變弱。因此,宜因應例如用途來改變T2、T3、T4比率。 The aforementioned crosslinking bond is, for example, a decane bond. However, the chemical bond of the present invention is not limited to the decane structure. The aforementioned oxane bond may be a T2 bond, a T3 bond or a T4 bond as shown below. When the polysiloxane porous body of the present invention has the aforementioned decane bond, for example, it may have any one of the bonds, may have any two of them, or may have all three of the bonds. Among the above-mentioned decane bonds, the more the ratio of T2 and T3, the more flexible and flexible, the more the original properties of the gel are expected, but the strength is weakened. On the other hand, the aforementioned ratio of T4 in the alkane bond is more than The intensity is revealed, but the gap size becomes small and the flexibility becomes weak. Therefore, the T2, T3, and T4 ratios should be changed depending on, for example, the use.

本發明之聚矽氧多孔體具有前述矽氧烷鍵時,T2、T3及T4的比例例如在相對以「1」表示T2時,T2:T3:T4=1:[1~100]:[0~50]、1:[1~80]:[0~40]、1:[5~60]:[0~30]。 When the polysiloxane porous body of the present invention has the above-mentioned decane bond, the ratio of T2, T3 and T4 is, for example, when T2 is expressed by "1", T2: T3: T4 = 1: [1 - 100]: [0 ~50], 1:[1~80]:[0~40], 1:[5~60]:[0~30].

此外,本發明之聚矽氧多孔體以例如所含矽原子呈矽氧烷鍵結為佳。就具體例而言,前述聚矽氧多孔體中所含總矽原子中未鍵結之矽原子(亦即殘留矽烷醇)的比率例如為:低於50%、30%以下、15%以下。 Further, the porous polysiloxane porous body of the present invention is preferably bonded to a helium atom, for example, by a helium atom. In a specific example, the ratio of the undoped ruthenium atoms (that is, the residual stanol) in the total ruthenium atoms contained in the porous polysiloxane porous body is, for example, less than 50%, 30% or less, and 15% or less.

前述矽化合物之微細孔粒子並無特別限定,如前述理想為凝膠狀矽化合物的粉碎物。前述凝膠狀矽化合物之凝膠形態並無特別限制。一般而言,「凝膠」係指溶質具有因相互作用失去獨立的運動性而集結成之結構,且呈現固化狀態。此外,凝膠中一般而言,濕凝膠係指含有分散介質且在分散介質中溶質採一樣的結構者,乾凝膠則指去除溶劑且溶質採具有空隙之網目結構者。在本發明中,前 述凝膠狀矽化合物宜使用例如濕凝膠。 The fine pore particles of the ruthenium compound are not particularly limited, and the pulverized product of the gelatinous ruthenium compound is preferably used as described above. The gel form of the gelled quinone compound is not particularly limited. In general, "gel" refers to a structure in which a solute has an independent kinetic activity due to interaction and is in a solidified state. Further, in the gel, in general, a wet gel refers to a structure containing a dispersion medium and having the same solute in a dispersion medium, and a dry gel means a solvent having a mesh structure in which a solvent is removed and a solute has a void. In the present invention, the former As the gelatinous quinone compound, for example, a wet gel is preferably used.

本發明之空隙結構薄膜(代表上為本發明之聚矽氧多孔體,以下皆同)例如具有孔結構,孔之空隙大小係指空隙(孔)之長軸直徑及短軸直徑中之前述長軸直徑。理想的空孔大小例如為5nm~10cm。前述空隙大小中,其下限例如為5nm以上、10nm以上、20nm以上,其上限例如為10cm以下、1mm以下、1μm以下,其範圍則例如為5nm~10cm、10nm~1mm、20nm~1μm。空隙大小係因應使用空隙結構之用途來決定適當的空隙大小,例如必須因應目的調整成期望的空隙大小。另外,本發明之空隙結構薄膜的孔結構之理想形態例就如後述實施例之圖4(截面SEM像)所示。惟,圖4為示例,絲毫不限定本發明。又,空隙大小例如可以下述方法作評估。 The void structure film of the present invention (representing the polyoxynitride porous body of the present invention, hereinafter the same) has, for example, a pore structure, and the pore size of the pores means the length of the major axis diameter and the minor axis diameter of the void (hole). Shaft diameter. The ideal pore size is, for example, 5 nm to 10 cm. The lower limit of the gap size is, for example, 5 nm or more, 10 nm or more, or 20 nm or more, and the upper limit thereof is, for example, 10 cm or less, 1 mm or less, or 1 μm or less, and the range thereof is, for example, 5 nm to 10 cm, 10 nm to 1 mm, and 20 nm to 1 μm. The size of the voids is determined by the use of the void structure to determine the appropriate void size, for example, the desired void size must be adjusted for the purpose. Further, a preferred embodiment of the pore structure of the void structure film of the present invention is shown in Fig. 4 (cross-sectional SEM image) of the later-described embodiment. However, FIG. 4 is an example and does not limit the present invention in any way. Further, the void size can be evaluated, for example, by the following method.

(空隙結構薄膜之截面SEM觀察) (SEM observation of cross section of void structure film)

在本發明中,空隙結構薄膜之形態可用SEM(掃描型電子顯微鏡)來進行觀察及解析。具體上,例如可將形成於樹脂薄膜上的矽烷醇多孔體試樣在冷卻下行FIB加工(加速電壓:30kV)後,針對獲得的截面試樣藉由FIB-SEM(FEI公司製:商品名Helios NanoLab 600、加速電壓:1kV)在觀察倍率100,000倍下取得截面電子像。 In the present invention, the morphology of the void structure film can be observed and analyzed by SEM (Scanning Electron Microscope). Specifically, for example, a porous stanol sample formed on a resin film can be processed by cooling down FIB (acceleration voltage: 30 kV), and the obtained cross-section sample is obtained by FIB-SEM (trade name: Helios, manufactured by FEI). NanoLab 600, acceleration voltage: 1 kV) Obtained cross-sectional electron image at an observation magnification of 100,000 times.

(空隙大小之評估) (evaluation of void size)

本發明中,前述空隙大小可藉由BET試驗法予以定量。具體上,係於比表面積測定裝置(Micromeritics Co.製:商品名ASAP2020)之毛細管投入試樣(本發明之空隙結 構薄膜)0.1g後,在室溫下進行減壓乾燥24小時,將空隙結構內之氣體脫氣。然後使氮氣吸附於前述試樣上,繪出吸附等溫線以求算細孔分布。藉此可評估空隙大小。 In the present invention, the aforementioned void size can be quantified by the BET test method. Specifically, it is a capillary input sample (a void junction of the present invention) of a specific surface area measuring device (manufactured by Micromeritics Co.: trade name: ASAP2020). After 0.1 g of the film structure, the film was dried under reduced pressure at room temperature for 24 hours to degas the gas in the void structure. Nitrogen gas was then adsorbed onto the aforementioned sample, and an adsorption isotherm was drawn to calculate the pore distribution. This allows the gap size to be evaluated.

本發明之空隙結構薄膜例如利用Bemcot(註冊商標)所得的耐擦傷性為60~100%。前述耐擦傷性係表示例如膜強度等之強度。本發明例如因為具有這種強度,所以在各種製程中皆具有卓越的耐擦傷性。本發明在例如製出前述空隙結構薄膜後的卷取及處置製品薄膜時的生產製程中具有耐刮性。此外,本發明之空隙結構薄膜例如可藉由調整膜密度來提高膜強度。具體上,可利用後述加熱步驟中之觸媒反應,使矽化合物之微細孔粒子(理想為二氧化矽溶膠微粒子,較理想為將凝膠狀二氧化矽化合物粉碎所得的二氧化矽溶膠微粒子)之矽烷醇基行交聯反應,來提高前述矽化合物之微細孔粒子彼此的結合力。藉由調整殘留矽烷醇基之量及交聯反應的平衡,可控制空孔率又同時可賦予膜強度。藉此,本發明之聚矽氧多孔體就可對例如本來脆弱的空隙結構賦予一定程度的強度。 The void structure film of the present invention has a scratch resistance of, for example, 60 to 100% by using Bemcot (registered trademark). The aforementioned scratch resistance means the strength of, for example, film strength. The present invention has excellent scratch resistance in various processes, for example, because of such strength. The present invention has scratch resistance in a production process for winding and handling a film of a product after the formation of the above-mentioned void structure film, for example. Further, the void structure film of the present invention can increase the film strength by, for example, adjusting the film density. Specifically, the microporous particles of the cerium compound (preferably cerium oxide sol fine particles, preferably cerium oxide sol fine particles obtained by pulverizing the gelled cerium oxide compound) can be used by the catalyst reaction in the heating step described later. The stanol group undergoes a crosslinking reaction to increase the binding force of the fine pore particles of the ruthenium compound. By adjusting the amount of residual stanol groups and the balance of the crosslinking reaction, the porosity can be controlled while imparting strength to the film. Thereby, the porous polysiloxane body of the present invention can impart a certain degree of strength to, for example, an originally weak void structure.

前述耐擦傷性中,其下限例如為60%以上、80%以上、90%以上,其上限例如為100%以下、99%以下、98%以下,其範圍則例如為60~100%、80~99%、90~98%。 The lower limit of the scratch resistance is, for example, 60% or more, 80% or more, or 90% or more, and the upper limit thereof is, for example, 100% or less, 99% or less, or 98% or less, and the range is, for example, 60 to 100% or 80%. 99%, 90~98%.

前述耐擦傷性例如可藉由以下方法進行測定。 The aforementioned scratch resistance can be measured, for example, by the following method.

(耐擦傷性之評估) (evaluation of scratch resistance)

(1)將塗覆‧成膜於丙烯酸薄膜上的空隙層(本發明之空隙結構薄膜)採樣出直徑15mm左右的圓狀物。 (1) A void layer (the void structure film of the present invention) which is coated and formed on an acrylic film is sampled into a round shape having a diameter of about 15 mm.

(2)接著針對前述試樣以螢光X射線(島津製作所公司製:ZSX PrimusII)鑑定矽以測定Si塗佈量(Si0)。然後就前述丙烯酸薄膜上的前述空隙層,從前述進行採樣的周遭將前述空隙層裁切成50mm×100mm並將其固定於玻璃板(厚3mm)後,以Bemcot(註冊商標)進行滑動試驗。滑動條件係設為砝碼100g、10往復。 (2) Next, 矽 was identified by fluorescent X-ray (ZSX Primus II, manufactured by Shimadzu Corporation) to measure the Si coating amount (Si 0 ). Then, the void layer on the acrylic film was cut into 50 mm × 100 mm from the circumference of the sample and fixed to a glass plate (thickness: 3 mm), and then subjected to a sliding test by Bemcot (registered trademark). The sliding condition is set to a weight of 100 g and 10 reciprocating.

(3)從結束滑動的前述空隙層以與前述(1)同樣的方式進行採樣及螢光X測定,測定擦傷試驗後的Si殘存量(Si1)。耐擦傷性係以Bemcot(註冊商標)進行滑動試驗前後的Si殘存率(%)為定義,可以下述式表示。 (3) Sampling and fluorescence X measurement were performed in the same manner as in the above (1) from the gap layer which was finished sliding, and the Si residual amount (Si 1 ) after the scratch test was measured. The scratch resistance is defined by the Si residual ratio (%) before and after the sliding test by Bemcot (registered trademark), and can be expressed by the following formula.

耐擦傷性(%)=[殘存Si量(Si1)/Si塗佈量(Si0)]×100(%) Scratch resistance (%) = [remaining Si amount (Si 1 ) / Si coating amount (Si 0 )] × 100 (%)

本發明之空隙結構薄膜例如利用MIT試驗所得的耐折次數為100次以上。前述耐折次數係表示可撓性,可撓性則意指例如物質的易變形性。本發明因為具有這種可撓性,所以可抑制如前述的龜裂產生,此外,例如在製造時的卷取或使用時等的處置性亦優異。 The void structure film of the present invention has a folding endurance of, for example, 100 times or more by the MIT test. The aforementioned number of folding resistances means flexibility, and flexibility means, for example, the deformability of the substance. Since the present invention has such flexibility, it is possible to suppress the occurrence of cracks as described above, and is excellent in handleability such as winding at the time of production or use.

在前述耐折次數,其下限例如為100次以上、500次以上、1000次以上,其上限並無特別限制,例如為10000次以下,其範圍則例如為100~10000次、500~10000次、1000~10000次。 The lower limit of the number of times of folding is, for example, 100 or more, 500 or more, or 1,000 or more, and the upper limit is not particularly limited, and is, for example, 10,000 or less, and the range is, for example, 100 to 10,000 times and 500 to 10,000 times. 1000~10000 times.

前述利用MIT試驗所得的耐折次數例如可藉由以下方法進行測定。 The number of folding end points obtained by the MIT test described above can be measured, for example, by the following method.

(耐折試驗之評估) (evaluation of the folding test)

將前述空隙層(本發明之空隙結構薄膜)裁切成 20mm×80mm的短條狀後,裝設於MIT耐折試驗機(TESTER SANGYO CO,.LTD.製:BE-202)上,並施加1.0N的荷重。包夾前述空隙層的夾頭部係使用R2.0mm,耐折次數最多進行10000次,並以前述空隙層破斷之時間點的次數作為耐折次數。 Cutting the aforementioned void layer (the void structure film of the present invention) into After a short strip of 20 mm × 80 mm, it was mounted on an MIT folding tester (BE-202, manufactured by TESTER SANGYO CO., LTD.), and a load of 1.0 N was applied. The chuck portion in which the gap layer is sandwiched is R2.0 mm, and the folding endurance is performed at most 10,000 times, and the number of times when the gap layer is broken is used as the folding end number.

在本發明之空隙結構薄膜中,膜密度無特別限制,其下限例如為1g/cm3以上、10g/cm3以上、15g/cm3以上,其上限例如為50g/cm3以下、40g/cm3以下、30g/cm3以下、2.1g/cm3以下,其範圍則例如為5~50g/cm3、10~40g/cm3、15~30g/cm3、1~2.1g/cm3。此外,在本發明之空隙結構薄膜中,按前述膜密度所得的空孔率無特別限制,其下限例如為40%以上、50%以上、70%以上、85%以上,其上限例如為98%以下、95%以下,其範圍則例如為40~98%、50~95%、70~95%、85~95%。 In the void structure film of the present invention, the film density is not particularly limited, and the lower limit thereof is, for example, 1 g/cm 3 or more, 10 g/cm 3 or more, 15 g/cm 3 or more, and the upper limit thereof is, for example, 50 g/cm 3 or less, 40 g/cm. 3 or less, 30 g/cm 3 or less, 2.1 g/cm 3 or less, and the range is, for example, 5 to 50 g/cm 3 , 10 to 40 g/cm 3 , 15 to 30 g/cm 3 , and 1 to 2.1 g/cm 3 . Further, in the void structure film of the present invention, the porosity obtained by the film density is not particularly limited, and the lower limit thereof is, for example, 40% or more, 50% or more, 70% or more, 85% or more, and the upper limit thereof is, for example, 98%. Hereinafter, the range is 95% or less, and the range is, for example, 40 to 98%, 50 to 95%, 70 to 95%, and 85 to 95%.

前述膜密度例如可藉由以下方法測定,空孔率則例如可按前述膜密度以下述方式算出。 The film density can be measured, for example, by the following method, and the porosity can be calculated, for example, in the following manner according to the film density.

(膜密度、空孔率之評估) (Evaluation of membrane density and porosity)

於基材(丙烯酸薄膜)上形成空隙層(本發明之空隙結構薄膜)後,針對該積層體的前述空隙層使用X射線繞射裝置(RIGAKU公司製:RINT-2000)測定全反射區的X射線反射率。接著在調配好Intensity(強度)與2θ以後,自前述積層體(空隙層‧基材)的全反射臨界角算出膜密度(g/cm3),再以下式算出空孔率(P%)。 After forming a void layer (the void structure film of the present invention) on the substrate (acrylic film), the X-ray diffraction apparatus (RINT-2000, manufactured by RIGAKU Co., Ltd.) was used to measure the X of the total reflection region with respect to the void layer of the laminate. Radiation reflectance. Then, after the Intensity and 2θ were prepared, the film density (g/cm 3 ) was calculated from the total reflection critical angle of the laminate (void layer ‧ substrate), and the porosity (P%) was calculated by the following formula.

空孔率(P%)=45.48×膜密度(g/cm3)+100(%) Porosity (P%) = 45.48 × film density (g / cm 3 ) + 100 (%)

本發明之空隙結構薄膜只要如前述具有孔結構(多孔質結構)即可,例如可為前述孔結構連續構成的開放性發泡結構體。前述開放性發泡結構體例如係表示在前述空隙結構薄膜中孔結構以三維型態連結,亦可說是前述孔結構之內部空隙連接在一起的狀態。多孔體具有開放性發泡結構時,藉此可提高空隙結構薄膜中所佔空孔率,惟使用如空心二氧化矽之類的密閉性發泡粒子時,無法形成開放性發泡結構。相對於此,本發明之聚矽氧多孔體因為前述矽化合物之微細孔粒子(理想為二氧化矽溶膠微粒子,較理想為形成溶膠之凝膠狀矽化合物之粉碎物的二氧化矽溶膠微粒子)具有三維的樹狀結構,所以例如在製造過程中可在塗覆膜(含有前述二氧化矽溶膠微粒子之溶膠的塗覆膜)中藉由前述樹狀粒子沉降‧堆積而輕易地形成開放性發泡結構。此外,本發明之空隙結構薄膜較理想係形成開放性發泡結構具有複數個細孔分布的單塊(monolith)結構。前述單塊結構係指例如具奈米尺寸之微細空隙的結構及以相同的奈米空隙集結成的開放性發泡結構存在的階層結構。形成前述單塊結構時,例如可藉微細的空隙賦予強度的同時,又可藉粗大的開放性發泡空隙賦予高空孔率,進而可使強度及高空孔率同時成立。為了形成其等的單塊結構,例如,首先宜在粉碎成前述二氧化矽溶膠微粒子之前階段的凝膠(凝膠狀矽化合物)中控制將生成之空隙結構的細孔分布。此外,在粉碎前述凝膠狀矽化合物時,例如將粉碎後的二氧化矽溶膠微粒子之粒度分布控制在期望的大小,便可形成 前述單塊結構。 The void structure film of the present invention may have a pore structure (porous structure) as described above, and may be, for example, an open foam structure in which the pore structure is continuously formed. The open foam structure is, for example, a state in which the pore structure is connected in a three-dimensional state in the void structure film, and it can be said that the internal pores of the pore structure are connected together. When the porous body has an open foam structure, the porosity of the void structure film can be increased, and when the airtight pores such as hollow cerium oxide are used, an open foam structure cannot be formed. On the other hand, in the porous polysiloxane body of the present invention, the fine pore particles of the cerium compound (ideally, the cerium oxide sol fine particles are preferably cerium oxide sol fine particles of the pulverized cerium compound forming a sol). Since the three-dimensional tree structure is provided, for example, in the coating process, the coating film (the coating film containing the sol of the cerium oxide sol fine particles) can be easily formed into an open hair by the deposition of the aforementioned dendritic particles. Bubble structure. Further, the void structure film of the present invention desirably forms a monolith structure in which an open foam structure has a plurality of pore distributions. The above monolithic structure refers to, for example, a structure having fine voids of a nanometer size and a hierarchical structure in which an open foamed structure formed by the same nanovoids exists. When the monolithic structure is formed, for example, the strength can be imparted by the fine voids, and the high porosity can be imparted by the coarse open foaming voids, and the strength and the high porosity can be simultaneously established. In order to form a monolithic structure such as, for example, it is preferable to first control the pore distribution of the void structure to be formed in the gel (gel-like cerium compound) in the stage before the pulverization into the cerium oxide sol fine particles. Further, when the gel-like cerium compound is pulverized, for example, the particle size distribution of the pulverized cerium oxide sol fine particles can be controlled to a desired size to form The aforementioned monolithic structure.

在本發明之空隙結構薄膜中,顯示透明性的霧度無特別限制,其下限例如為0.1%以上、0.2%以上、0.3%以上,其上限例如為30%以下、10%以下、3%以下,其範圍則例如為0.1~30%、0.2~10%、0.3~3%。 In the void structure film of the present invention, the haze exhibiting transparency is not particularly limited, and the lower limit thereof is, for example, 0.1% or more, 0.2% or more, or 0.3% or more, and the upper limit thereof is, for example, 30% or less, 10% or less, or 3% or less. The range is, for example, 0.1 to 30%, 0.2 to 10%, and 0.3 to 3%.

前述霧度例如可以下述方法測定。 The above haze can be measured, for example, by the following method.

(霧度之評估) (evaluation of haze)

將空隙層(本發明之空隙結構薄膜)裁切成50mm×50mm的大小並安裝於霧度計(村上色彩技術研究所公司製:HM-150)上,測定霧度。關於霧度值可以下式算出。 The void layer (the void structure film of the present invention) was cut into a size of 50 mm × 50 mm and attached to a haze meter (manufactured by Murakami Color Research Laboratory Co., Ltd.: HM-150), and the haze was measured. The haze value can be calculated by the following formula.

霧度(%)=[擴散透射率(%)/全光線透光率(%)]×100(%) Haze (%) = [Diffuse Transmittance (%) / Total Light Transmittance (%)] × 100 (%)

前述折射率一般係以真空中光波面的傳達速度與在媒質內的傳播速度之比,稱作其媒質之折射率。本發明之空隙結構薄膜的折射率無特別限制,其上限例如為1.25以下、1.20以下、1.15以下,其下限例如為1.05以上、1.06以上、1.07以上,其範圍則例如為1.05以上~1.25以下、1.06以上~1.20以下、1.07以上~1.15以下。 The refractive index is generally referred to as the ratio of the transmission speed of the light wave surface in the vacuum to the propagation speed in the medium, and is referred to as the refractive index of the medium. The refractive index of the void structure film of the present invention is not particularly limited, and the upper limit thereof is, for example, 1.25 or less, 1.20 or less, or 1.15 or less, and the lower limit thereof is, for example, 1.05 or more, 1.06 or more, or 1.07 or more, and the range is, for example, 1.05 or more and 1.25 or less. 1.06 or more ~ 1.20 or less, 1.07 or more and 1.15 or less.

本發明中,在未特別說明的前提下,前述折射率係指在波長550nm下測得的折射率。又,折射率之測定方法並無特別限定,例如可藉由下述方法測定。 In the present invention, the refractive index refers to a refractive index measured at a wavelength of 550 nm unless otherwise specified. Further, the method of measuring the refractive index is not particularly limited, and can be measured, for example, by the following method.

(折射率之評估) (evaluation of refractive index)

於丙烯酸薄膜形成空隙層(本發明之空隙結構薄膜)後,裁切成50mm×50mm的大小並將之以黏著層貼合於玻璃板(厚:3mm)的表面。將前述玻璃板的背面中央部(直徑 20mm左右)以黑色麥克筆塗黑調製出不會在前述玻璃板之背面反射的試樣。將前述試樣安裝於橢圓偏光計(J.A.Woollam Japan社製:VASE)上,在波長500nm且入射角50~80度之條件下測定折射率,並以其平均值作為折射率。 After forming a void layer (the void structure film of the present invention) on the acrylic film, it was cut into a size of 50 mm × 50 mm and adhered to the surface of the glass plate (thickness: 3 mm) with an adhesive layer. The center of the back surface of the aforementioned glass plate (diameter A sample of about 20 mm was blackened with a black microphone pen to prepare a sample that would not be reflected on the back surface of the glass plate. The sample was attached to an ellipsometer (manufactured by J.A. Woollam Japan Co., Ltd.: VASE), and the refractive index was measured under the conditions of a wavelength of 500 nm and an incident angle of 50 to 80 degrees, and the average value thereof was used as the refractive index.

本發明之空隙結構薄膜的厚度並無特別限制,其下限例如為1nm以上、10nm以上、50nm以上、100nm以上,其上限例如為1000μm以下、500μm以下、100μm以下、80μm以下,其範圍則例如為1nm~1000μm、10nm~500μm、50nm~100μm、100nm~80μm。當為薄膜體時,可依照用途或要求特性進行調整,例如在重視透射率的情況下,以0.01μm以上且10μm以下為佳;又例如在重視絕熱性的情況下以100μm以上且1m以下為佳。 The thickness of the void structure film of the present invention is not particularly limited, and the lower limit thereof is, for example, 1 nm or more, 10 nm or more, 50 nm or more, or 100 nm or more, and the upper limit thereof is, for example, 1000 μm or less, 500 μm or less, 100 μm or less, or 80 μm or less, and the range is, for example, 1 nm to 1000 μm, 10 nm to 500 μm, 50 nm to 100 μm, and 100 nm to 80 μm. In the case of a film body, it can be adjusted according to the use or required characteristics. For example, when the transmittance is important, it is preferably 0.01 μm or more and 10 μm or less. For example, when the heat insulating property is important, it is 100 μm or more and 1 m or less. good.

前述凝膠狀矽化合物可舉如使單體矽化合物凝膠化而成的凝膠化物。具體上,前述凝膠狀矽化合物可舉例如前述單體矽化合物彼此已鍵結的凝膠化物,具體例方面,可舉如前述單體矽化合物彼此已形成氫鍵或經分子間力結合的凝膠化物。前述結合可舉如藉脫水縮合所行之結合。前述凝膠化之方法將在本發明之製造方法中後述。 The gelled ruthenium compound may be a gelled product obtained by gelling a monomer ruthenium compound. Specifically, the gel-like ruthenium compound may, for example, be a gelled product in which the above-mentioned monomer ruthenium compounds are bonded to each other, and specific examples thereof may be such that the above-mentioned monomer ruthenium compounds form a hydrogen bond or an intermolecular force. Gelled. The foregoing combination may be exemplified by a combination of dehydration condensation. The method of gelling described above will be described later in the production method of the present invention.

在本發明中,前述單體矽化合物並無特別限制。前述單體矽化合物可舉如下述式(1)所示化合物。前述凝膠狀矽化合物如前述係單體矽化合物彼此氫結合或分子間力結合而成的凝膠化物時,式(1)之單體間例如可透過各個羥基行氫結合。 In the present invention, the above monomer ruthenium compound is not particularly limited. The monomer oxime compound may be a compound represented by the following formula (1). When the gelled quinone compound is a gelled product in which the above-mentioned monomer quinone compound is hydrogen-bonded or intermolecularly bonded to each other, the monomer of the formula (1) can be hydrogen-bonded, for example, through each of the hydroxyl groups.

前述式(1)中,例如X為2、3或4,R1為直鏈烷基或分枝烷基。前述R1之碳數例如為1~6、1~4、1~2。前述直鏈烷基可舉如甲基、乙基、丙基、丁基、戊基、己基等,前述分枝烷基可舉如異丙基、異丁基等。前述X例如為3或4。 In the above formula (1), for example, X is 2, 3 or 4, and R 1 is a linear alkyl group or a branched alkyl group. The carbon number of R 1 is , for example, 1 to 6, 1 to 4, or 1 to 2. The linear alkyl group may, for example, be a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group or a hexyl group. The branched alkyl group may, for example, be an isopropyl group or an isobutyl group. The aforementioned X is, for example, 3 or 4.

前述式(1)所示矽化合物的具體例可舉如X為3之下述式(1’)所示化合物。下述式(1’)中,R1與前述式(1)相同,例如為甲基。R1為甲基時,前述矽化合物即為參(羥)甲基矽烷。前述X為3時,前述矽化合物例如為具有3個官能基的3官能矽烷。 Specific examples of the oxime compound represented by the above formula (1) include a compound represented by the following formula (1') wherein X is 3. In the following formula (1'), R 1 is the same as the above formula (1), and is, for example, a methyl group. When R 1 is a methyl group, the above hydrazine compound is hydrazine (hydroxy)methyl decane. When X is 3, the above hydrazine compound is, for example, a trifunctional decane having three functional groups.

又,前述式(1)所示矽化合物之具體例可舉如X為4之化合物。此時,前述矽化合物例如為具有4個官能基的4官能矽烷。 Further, specific examples of the oxime compound represented by the above formula (1) include a compound wherein X is 4. In this case, the above hydrazine compound is, for example, a tetrafunctional decane having four functional groups.

前述單體矽化合物例如亦可為矽化合物前驅物之水解物。作為前述矽化合物前驅物,例如只要是可藉水解生成前述矽化合物者即可,就具體例而言可列舉下述式 (2)所示化合物。 The monomer oxime compound may be, for example, a hydrolyzate of a ruthenium compound precursor. As the precursor of the ruthenium compound, for example, the ruthenium compound can be produced by hydrolysis, and specific examples thereof include the following formula. (2) The compound shown.

前述式(2)中,例如X為2、3或4,R1及R2分別為直鏈烷基或分枝烷基,R1及R2可相同亦可互異,X為2時,R1可彼此相同亦可互異,R2可彼此相同亦可互異。 In the above formula (2), for example, X is 2, 3 or 4, and R 1 and R 2 are each a linear alkyl group or a branched alkyl group, and R 1 and R 2 may be the same or different, and when X is 2, R 1 may be the same or different from each other, and R 2 may be the same or different from each other.

前述X及R1例如與前述式(1)之X及R1相同。此外,前述R2例如可沿用式(1)之R1之示例。 X and R, for example, the same as in the above formula (1) of X 1 and R 1. Further, the aforementioned R 2 may be exemplified by, for example, R 1 of the formula (1).

前述式(2)所示矽化合物前驅物之具體例可舉如X為3之下述式(2’)所示化合物。下述式(2’)中,R1及R2分別與前述式(2)相同。R1及R2為甲基時,前述矽化合物前驅物即為三甲氧(甲基)矽烷(以下亦稱「MTMS」)。 Specific examples of the ruthenium compound precursor represented by the above formula (2) include a compound represented by the following formula (2') wherein X is 3. In the following formula (2'), R 1 and R 2 are each the same as the above formula (2). When R 1 and R 2 are a methyl group, the ruthenium compound precursor is trimethoxy(methyl)decane (hereinafter also referred to as "MTMS").

前述單體矽化合物無特別限制,例如可因應本發明之聚矽氧多孔體的用途適宜選擇。在本發明之聚矽氧多孔體中,例如在重視低折射率性的情況下,基於低折射率性佳的觀點,前述單體矽化合物以前述3官能矽烷為宜; 又,在重視強度(例如耐擦傷性)的情況下,基於耐擦傷性佳,前述單體矽化合物以前述4官能矽烷為佳。另一方面,欲賦予柔軟性時,基於可撓性佳,則以前述2官能矽烷為佳。此外,為前述凝膠狀矽化合物之原料的前述單體矽化合物例如可僅使用一種,亦可將二種以上併用。就具體例而言,作為前述單體矽化合物例如可僅含有前述3官能矽烷,亦可僅含有前述4官能矽烷,或可含有前述3官能矽烷及前述4官能矽烷兩者,更可含有其它的矽化合物。使用二種以上矽化合物作為前述單體矽化合物時,其比率並無特別限制,可適宜設定。 The monomer oxime compound is not particularly limited, and can be suitably selected, for example, according to the use of the polysiloxane porous body of the present invention. In the polyaluminum oxide porous body of the present invention, for example, in the case where the low refractive index property is emphasized, the monomeric ruthenium compound is preferably the above-mentioned trifunctional decane based on the viewpoint of good low refractive index; Moreover, when importance is attached to strength (for example, scratch resistance), it is preferable that the monomer bismuth compound is preferably the above-mentioned tetrafunctional decane based on the scratch resistance. On the other hand, when flexibility is desired, it is preferable to use the above-mentioned bifunctional decane based on flexibility. In addition, the monomer oxime compound which is a raw material of the above-mentioned gelatinous ruthenium compound may be used alone or in combination of two or more kinds. In a specific example, the monomer ruthenium compound may contain only the above-mentioned trifunctional decane, or may contain only the above-mentioned tetrafunctional decane, or may contain both the above-mentioned trifunctional decane and the above-mentioned tetrafunctional decane, and may further contain other矽 compound. When two or more kinds of hydrazine compounds are used as the monomer quinone compound, the ratio thereof is not particularly limited, and can be appropriately set.

在本發明之聚矽氧多孔體中,表示前述矽化合物之微細孔粒子(理想為凝膠狀二氧化矽化合物之粉碎物)的粒度偏差的體積平均粒徑無特別限制,其下限例如為0.05μm以上、0.10μm以上、0.20μm以上,其上限例如為2.00μm以下、1.50μm以下、1.00μm以下,其範圍則例如為0.05μm~2.00μm、0.10μm~1.50μm、0.20μm~1.00μm。前述粒度分布例如可藉由光離心沉降法、動態光散射法、雷射繞射法等粒度分布評估裝置、及掃描型電子顯微鏡(SEM)、穿透型電子顯微鏡(TEM)等電子顯微鏡等進行測定,但不受該等手法限定。又,本發明中,前述矽化合物之微細孔粒子可為定形亦可為不定形。此外,前述矽化合物之微細孔粒子的每一粒子宜具有單一或複數個微細孔。本發明中,前述矽化合物之微細孔粒子的適當形態就如同後述實施例之圖5(TEM像)所示。惟,圖5為示例,絲毫無法 限定本發明。又,本發明中,前述矽化合物之微細孔粒子的TEM像例如可藉由以下方法觀察。 In the porous polysiloxane body of the present invention, the volume average particle diameter indicating the particle size deviation of the fine pore particles (preferably the pulverized product of the gelled cerium oxide compound) of the cerium compound is not particularly limited, and the lower limit thereof is, for example, 0.05. The upper limit is, for example, 0.050 μm or less, 1.50 μm or less, or 1.00 μm or less, and the range is, for example, 0.05 μm to 2.00 μm, 0.10 μm to 1.50 μm, and 0.20 μm to 1.00 μm. The particle size distribution can be carried out, for example, by a particle size distribution evaluation device such as a light centrifugal sedimentation method, a dynamic light scattering method, or a laser diffraction method, an electron microscope such as a scanning electron microscope (SEM) or a transmission electron microscope (TEM). Determination, but not limited by these methods. Further, in the present invention, the fine pore particles of the ruthenium compound may be shaped or amorphous. Further, each of the fine pore particles of the above ruthenium compound preferably has a single or a plurality of fine pores. In the present invention, a suitable form of the fine pore particles of the ruthenium compound is as shown in Fig. 5 (TEM image) of the later-described embodiment. However, Figure 5 is an example. The invention is defined. Further, in the present invention, the TEM image of the fine pore particles of the ruthenium compound can be observed, for example, by the following method.

(微細孔粒子之TEM觀察) (TEM observation of microporous particles)

本發明中,矽化合物之微細孔粒子之形態可利用TEM(穿透型電子顯微鏡)進行觀察及解析。具體上,將前述矽化合物之微細孔粒子的分散液稀釋成適度的濃度後,再使其分散於碳支撐體上並乾燥而獲得微細孔粒子試樣。然後,將其試樣藉由TEM(日立製作所公司製、商品名H-7650、加速電壓:100kV)在觀察倍率100,000倍下取得電子像。 In the present invention, the form of the fine pore particles of the ruthenium compound can be observed and analyzed by TEM (transmission electron microscope). Specifically, the dispersion of the fine pore particles of the ruthenium compound is diluted to an appropriate concentration, and then dispersed on a carbon support and dried to obtain a sample of fine pore particles. Then, the sample was obtained by TEM (manufactured by Hitachi, Ltd., trade name H-7650, acceleration voltage: 100 kV) at an observation magnification of 100,000 times.

又,表示前述矽化合物之微細孔粒子之粒度偏差的粒度分布並無特別限制,例如粒徑0.4μm~1μm的粒子為50~99.9重量%、80~99.8重量%、90~99.7重量%,或者粒徑1μm~2μm的粒子為0.1~50重量%、0.2~20重量%、0.3~10重量%。前述粒度分布例如可藉由粒度分布評估裝置或電子顯微鏡測定。 Further, the particle size distribution indicating the particle size variation of the fine pore particles of the ruthenium compound is not particularly limited, and for example, particles having a particle diameter of 0.4 μm to 1 μm are 50 to 99.9% by weight, 80 to 99.8% by weight, and 90 to 99.7% by weight, or The particles having a particle diameter of 1 μm to 2 μm are 0.1 to 50% by weight, 0.2 to 20% by weight, and 0.3 to 10% by weight. The aforementioned particle size distribution can be determined, for example, by a particle size distribution evaluation device or an electron microscope.

本發明之空隙結構薄膜例如可含有觸媒,該觸媒係用以使形成前述微細空隙結構之一種或多種構成單元彼此行化學結合。前述觸媒之含有率並無特別限定,相對於前述構成單元的重量,例如為0.01~20重量%、0.05~10重量%或0.1~5重量%。 The void structure film of the present invention may, for example, contain a catalyst for chemically bonding one or more constituent units forming the aforementioned fine void structure to each other. The content of the catalyst is not particularly limited, and is, for example, 0.01 to 20% by weight, 0.05 to 10% by weight, or 0.1 to 5% by weight based on the weight of the constituent unit.

又,本發明之空隙結構薄膜例如更可含有交聯輔助劑,該交聯輔助劑係用以使形成前述微細空隙結構之一種或多種構成單元彼此間接結合。前述交聯輔助劑之含有 率並無特別限定,例如相對於前述構成單元的重量為0.01~20重量%、0.05~15重量%或0.1~10重量%。 Further, the void structure film of the present invention may further contain, for example, a crosslinking auxiliary agent for indirectly bonding one or more constituent units forming the aforementioned fine void structure to each other. The aforementioned crosslinking auxiliary agent The rate is not particularly limited, and is, for example, 0.01 to 20% by weight, 0.05 to 15% by weight or 0.1 to 10% by weight based on the weight of the constituent unit.

本發明之空隙結構薄膜的形態並無特別限制,例如為薄膜形狀即可。 The form of the void structure film of the present invention is not particularly limited, and may be, for example, a film shape.

本發明之空隙結構薄膜的製造方法並無特別限制,例如可藉由以下顯示之本發明之製造方法來製造。 The method for producing the void structure film of the present invention is not particularly limited, and can be produced, for example, by the production method of the present invention shown below.

[2.空隙結構薄膜之製造方法] [2. Method for producing void structure film]

以下針對本發明之空隙結構薄膜之製造方法主要以本發明之聚矽氧多孔體之製造方法為中心加以說明。如前述,本發明之聚矽氧多孔體之製造方法的特徵在於包含下述步驟:製作含有矽化合物之微細孔粒子的液體;於前述液體添加使前述微細孔粒子彼此行化學結合的觸媒;及使前述微細孔粒子彼此藉由觸媒作用行化學結合的結合步驟。前述含有矽化合物之微細孔粒子的液體並無特別限定,例如可為含有前述矽化合物之微細孔粒子的懸浮液。另外,如前述,前述矽化合物之微細孔粒子以凝膠狀二氧化矽化合物之粉碎物為佳。以下,主要針對前述矽化合物之微細孔粒子為凝膠狀二氧化矽化合物之粉碎物(以下有時僅稱為「粉碎物」)的情況加以說明。惟,本發明之聚矽氧多孔體之製造方法即使使用凝膠狀二氧化矽化合物之粉碎物以外的微粒子作為前述矽化合物之微細孔粒子,同樣可實行。此外,亦可採用由含有微細孔粒子之溶液以外物質來製作聚矽氧多孔體的方法,例如可使用像氣溶膠沉積(AD法)之乾式成膜法使粉碎物積層於基材上而獲得聚矽氧 多孔體。 Hereinafter, the method for producing the void structure film of the present invention will be mainly described focusing on the method for producing a porous porous oxygen body of the present invention. As described above, the method for producing a polysiloxane porous body according to the present invention includes the steps of: preparing a liquid containing fine pore particles of a ruthenium compound; and adding a catalyst for chemically bonding the fine pore particles to each other in the liquid; And a bonding step of chemically bonding the aforementioned fine pore particles to each other by a catalyst. The liquid containing the fine pore particles of the ruthenium compound is not particularly limited, and may be, for example, a suspension containing fine pore particles of the ruthenium compound. Further, as described above, the fine pore particles of the cerium compound are preferably a pulverized product of a gelled cerium oxide compound. In the following, the case where the fine pore particles of the cerium compound are a pulverized product of a gelled cerium oxide compound (hereinafter sometimes referred to simply as "pulverized material") will be described. In the method for producing a porous polysiloxane body of the present invention, fine particles other than the pulverized product of the gel-like cerium oxide compound can be used as the fine pore particles of the cerium compound. Further, a method of producing a porous polysiloxane material from a substance other than a solution containing fine pore particles may be employed. For example, a dry film formation method such as aerosol deposition (AD method) may be used to laminate a pulverized material on a substrate. Polyoxyl Porous body.

藉由本發明之製造方法,可形成一可抑制龜裂產生的同時又可形成高空隙率的多孔結構且兼具充分強度的聚矽氧多孔體。其理由推測如下,惟本發明不受此推測限制。 According to the production method of the present invention, a porous porous structure having a porous structure capable of suppressing generation of cracks while forming a high void ratio and having sufficient strength can be formed. The reason for this is presumed as follows, but the present invention is not limited by this speculation.

本發明之製造方法中使用的前述粉碎物係將前述凝膠狀矽化合物粉碎後的成品,因此前述粉碎前的凝膠狀矽化合物之三維結構係變成分散為三維基本結構的狀態。而且,在本發明之製造方法中係使用含有前述凝膠狀矽化合物之粉碎物的溶膠來堆積前述三維基本結構,而形成有以前述三維基本結構為主體的多孔結構。亦即,藉由本發明之製造方法可形成一種與前述凝膠狀矽化合物之三維結構截然不同且由前述三維基本結構的前述粉碎物形成的新型多孔結構。此外,在本發明之製造方法中,為了進一步使前述粉碎物彼此行化學結合,會將前述新型三維結構固定化。因此,藉由本發明之製造方法製得的前述聚矽氧多孔體雖為具有空隙之結構,依舊可維持抑制龜裂產生的同時又兼具充分強度的功效。藉由本發明之製造方法,例如亦可將前述聚矽氧多孔體形成為對應各種對象物的附加構件。藉由本發明製得的聚矽氧多孔體例如可作為利用空隙之構件在廣泛領域之製品上作應用,如低折射率層等之光學構件、絕熱材、吸音材、再生醫療用基材、結露防止材、印墨影像接收材等,此外也可用於製作賦予各種機能之積層薄膜。 In the pulverized product used in the production method of the present invention, the gel-like ruthenium compound is pulverized, and the three-dimensional structure of the gel-like ruthenium compound before the pulverization is dispersed into a three-dimensional basic structure. Further, in the production method of the present invention, the three-dimensional basic structure is deposited by using a sol containing the pulverized material of the gelatinous ruthenium compound, and a porous structure mainly composed of the three-dimensional basic structure is formed. That is, by the production method of the present invention, a novel porous structure which is distinct from the three-dimensional structure of the aforementioned gel-like cerium compound and which is formed of the aforementioned pulverized material of the above-described three-dimensional basic structure can be formed. Further, in the production method of the present invention, in order to further chemically bond the pulverized materials to each other, the novel three-dimensional structure is fixed. Therefore, the porous polysiloxane porous body obtained by the production method of the present invention has a structure having a void, and can still maintain the effect of suppressing the occurrence of cracks while achieving sufficient strength. According to the production method of the present invention, for example, the porous polysiloxane porous body can be formed as an additional member corresponding to various objects. The polysiloxane porous body obtained by the present invention can be applied, for example, as a member using voids in a wide range of articles, such as an optical member such as a low refractive index layer, a heat insulating material, a sound absorbing material, a regenerative medical substrate, and condensation. Preventing materials, ink image receiving materials, etc., can also be used to produce laminated films that impart various functions.

本發明之製造方法在未特別記述的前提下,可沿用前述本發明之聚矽氧多孔體的說明。本發明例如因應用途及目的可利用在任何一種凝膠製造上,且特別有利於製造乾凝膠。又如前述,藉由本發明之聚矽氧多孔體,即使如乾凝膠,也可如氣凝膠同樣地實現高空隙率。 The production method of the present invention can be followed by the description of the porous polysiloxane body of the present invention, unless otherwise specified. The present invention can be utilized in the manufacture of any gel, for example, depending on the purpose and purpose, and is particularly advantageous for the manufacture of xerogels. Further, as described above, with the porous polysiloxane porous body of the present invention, even if it is a dry gel, a high void ratio can be achieved similarly as an aerogel.

在本發明之製造方法中,前述凝膠狀矽化合物及其粉碎物、前述單體矽化合物及矽化合物前驅物都可沿用前述本發明之聚矽氧多孔體的說明。 In the production method of the present invention, the gel-like ruthenium compound and the pulverized product thereof, the monomer ruthenium compound and the ruthenium compound precursor may all be described in the above-described polyfluorinated porous body of the present invention.

本發明之製造方法如前述具有一製作含有前述矽化合物之微細孔粒子之液體(理想為含有前述凝膠狀矽化合物之粉碎物的溶膠)的步驟。前述粉碎物例如可將前述凝膠狀矽化合物粉碎而製得。如前述,藉由粉碎前述凝膠狀矽化合物,前述凝膠狀矽化合物的三維結構便會遭受破壞而分散成三維基本結構。 The production method of the present invention has a step of preparing a liquid (preferably a sol containing the pulverized product of the gelatinous ruthenium compound) containing the fine pore particles of the ruthenium compound. The pulverized material can be obtained, for example, by pulverizing the gelatinous quinone compound. As described above, by pulverizing the gelatinous quinone compound, the three-dimensional structure of the gelatinous quinone compound is destroyed and dispersed into a three-dimensional basic structure.

以下針對前述矽化合物藉凝膠化生成前述凝膠狀矽化合物及前述凝膠狀矽化合物藉粉碎調製出粉碎物的部分加以說明,惟本發明不受以下示例限制。 In the following, the gelatinized compound is produced by gelation of the above-mentioned hydrazine compound, and the gelled quinone compound is pulverized to prepare a pulverized product, but the present invention is not limited by the following examples.

前述矽化合物之凝膠化例如可藉由使前述單體矽化合物彼此行氫結合或行分子間力結合來實現。 The gelation of the aforementioned hydrazine compound can be achieved, for example, by hydrogen-bonding or inter-molecular force bonding of the above-mentioned monomer quinone compounds.

前述單體矽化合物可舉如前述本發明之聚矽氧多孔體中曾提及的前述式(1)所示矽化合物。 The above-mentioned monomer oxime compound may be an oxime compound represented by the above formula (1) which has been mentioned in the above-mentioned polyfluorene oxide porous body of the present invention.

前述式(1)之矽化合物具有羥基,因此前述式(1)之單體間例如可透過各自的羥基行氫結合或分子間力結合。 Since the oxime compound of the above formula (1) has a hydroxyl group, the monomers of the above formula (1) can be hydrogen-bonded or intermolecularly bonded, for example, through the respective hydroxyl groups.

又,前述矽化合物如前述亦可為前述矽化合物前驅物之水解物,例如可將前述本發明之聚矽氧多孔體中曾提及的前述式(2)所示矽化合物前驅物予以水解而生成。 Further, the ruthenium compound may be a hydrolyzate of the ruthenium compound precursor as described above, and for example, the ruthenium compound precursor represented by the above formula (2) mentioned in the above-mentioned polyfluorene oxide porous body of the present invention may be hydrolyzed. generate.

前述矽化合物前驅物的水解方法無特別限制,例如可藉由觸媒存在下之化學反應進行。前述觸媒可舉如草酸、乙酸等之酸等。前述水解反應例如可將草酸水溶液在室溫環境下緩慢地滴下混合至前述矽化合物與二甲亞碸之混合液(例如懸浮液)中以後,在此狀態下攪拌30分左右來進行。在水解前述矽化合物前驅物時,例如可將前述矽化合物前驅物之烷氧基完全水解,以便更有效率地顯現其後之凝膠化‧熟成‧空隙結構形成後的加熱‧固定化。 The hydrolysis method of the ruthenium compound precursor is not particularly limited, and for example, it can be carried out by a chemical reaction in the presence of a catalyst. The above catalyst may, for example, be an acid such as oxalic acid or acetic acid. The hydrolysis reaction can be carried out, for example, by slowly dropping and mixing an aqueous oxalic acid solution into a mixed liquid (for example, a suspension) of the above-mentioned hydrazine compound and dimethyl hydrazine at room temperature, followed by stirring for about 30 minutes in this state. When the precursor of the ruthenium compound is hydrolyzed, for example, the alkoxy group of the precursor of the ruthenium compound can be completely hydrolyzed to more effectively exhibit the subsequent gelation, aging, and heating after the formation of the void structure.

前述單體矽化合物之凝膠化例如可藉由前述單體間之脫水縮合反應進行。前述脫水縮合反應例如宜在觸媒存在下進行,前述觸媒可舉例如酸觸媒及鹼性觸媒等脫水縮合觸媒,前述酸觸媒有鹽酸、草酸、硫酸等,前述鹼 性觸媒有氨、氫氧化鉀、氫氧化鈉、氫氧化銨等。前述脫水縮合觸媒以鹼性觸媒尤佳。在前述脫水縮合反應中,相對於前述單體矽化合物之前述觸媒的添加量並無特別限制,相對於前述單體矽化合物1莫耳,觸媒例如為0.1~10莫耳、0.05~7莫耳、0.1~5莫耳。 The gelation of the above monomer ruthenium compound can be carried out, for example, by a dehydration condensation reaction between the aforementioned monomers. The dehydration condensation reaction is preferably carried out, for example, in the presence of a catalyst. The catalyst may, for example, be a dehydration condensation catalyst such as an acid catalyst or a basic catalyst, and the acid catalyst may be hydrochloric acid, oxalic acid, sulfuric acid or the like, and the base may be used. The catalysts include ammonia, potassium hydroxide, sodium hydroxide, ammonium hydroxide and the like. The aforementioned dehydration condensation catalyst is preferably a basic catalyst. In the dehydration condensation reaction, the amount of the catalyst added to the monomer ruthenium compound is not particularly limited, and the catalyst is, for example, 0.1 to 10 mol, 0.05 to 7 with respect to the monomer oxime compound 1 mol. Moer, 0.1~5 m.

前述單體矽化合物之凝膠化例如宜在溶劑中進行。前述溶劑之前述矽化合物的比例並無特別限制。前述溶劑可舉如二甲亞碸(DMSO)、N-甲基吡咯啶酮(NMP)、N,N-二甲基乙醯胺(DMAc)、二甲基甲醯胺(DMF)、γ-丁內酯(GBL)、乙腈(MeCN)、乙二醇乙基醚(EGEE)等。前述溶劑例如可為1種亦可將2種以上併用。用來進行前述凝膠化的溶劑以下亦稱作「凝膠化用溶劑」。 The gelation of the aforementioned monomer ruthenium compound is preferably carried out, for example, in a solvent. The ratio of the aforementioned hydrazine compound of the aforementioned solvent is not particularly limited. The aforementioned solvent may, for example, be dimethyl hydrazine (DMSO), N-methylpyrrolidone (NMP), N,N-dimethylacetamide (DMAc), dimethylformamide (DMF), γ- Butyrolactone (GBL), acetonitrile (MeCN), ethylene glycol ethyl ether (EGEE), and the like. The solvent may be used alone or in combination of two or more. The solvent used for the gelation described below is also referred to as "solvent for gelation" hereinafter.

前述凝膠化之條件並無特別限制。相對於含有前述矽化合物之前述溶劑的處理溫度例如為20~30℃、22~28℃、24~26℃,處理時間例如為1~60分、5~40分、10~30分。進行前述脫水縮合反應時,其處理條件並無特別限制,可沿用該等示例。藉由進行前述凝膠化,例如可使矽氧烷鍵結成長而形成二氧化矽一次粒子,再藉由反應進展,使前述一次粒子彼此連接成串珠狀而生成三維結構的凝膠。 The conditions of the gelation described above are not particularly limited. The treatment temperature with respect to the solvent containing the ruthenium compound is, for example, 20 to 30 ° C, 22 to 28 ° C, and 24 to 26 ° C, and the treatment time is, for example, 1 to 60 minutes, 5 to 40 minutes, or 10 to 30 minutes. When the dehydration condensation reaction described above is carried out, the treatment conditions thereof are not particularly limited, and the examples can be used. By performing the gelation described above, for example, a ceria can be bonded to form a ceria primary particle, and by the progress of the reaction, the primary particles can be connected to each other to form a bead to form a three-dimensional gel.

藉前述凝膠化獲得的前述凝膠狀矽化合物宜於凝膠化反應後施行熟成處理。藉由前述熟成處理,例如讓藉凝膠化獲得之具有三維結構的凝膠一次粒子進一步成長,可增加粒子本身的大小,結果可使粒子彼此相互接觸 之頸部的接觸狀態從點接觸擴增到面接觸。經過上述熟成處理的凝膠例如會增加凝膠本身的強度,結果便可提升粉碎後的三維基本結構之強度。藉此,例如在前述粉碎物塗覆後的乾燥步驟中,可抑制前述三維基本結構堆積而成的空隙結構之細孔大小隨乾燥過程之溶劑揮發而收縮。 The aforementioned gelatinous quinone compound obtained by the gelation described above is preferably subjected to a ripening treatment after the gelation reaction. By the aforementioned ripening treatment, for example, the gel primary particles having a three-dimensional structure obtained by gelation are further grown, the size of the particles themselves can be increased, and as a result, the particles can be brought into contact with each other. The contact state of the neck is expanded from point contact to face contact. The gel subjected to the above-mentioned ripening treatment, for example, increases the strength of the gel itself, and as a result, the strength of the three-dimensional basic structure after the pulverization can be enhanced. Thereby, for example, in the drying step after the application of the pulverized material, the pore size of the void structure in which the three-dimensional basic structure is deposited can be suppressed from shrinking as the solvent of the drying process volatilizes.

前述熟成處理例如可藉由在預定溫度且預定時間內,培育前述凝膠狀矽化合物而進行。前述預定溫度無特別限制,其下限例如為30℃以上、35℃以上、40℃以上,其上限例如為80℃以下、75℃以下、70℃以下,其範圍則例如為30~80℃、35~75℃、40~70℃。前述預定時間無特別限制,其下限例如為5小時以上、10小時以上、15小時以上,其上限例如為50小時以下、40小時以下、30小時以下,其範圍則例如為5~50小時、10~40小時、15~30小時。另外,關於熟成的最佳條件係條件的主要目的例如在於取得前述二氧化矽一次粒子大小之增大及頸部接觸面積之增大。此外,宜考量使用之溶劑的沸點,例如熟成溫度一旦過高,溶劑就會過度揮發,進而可能發生因塗覆液(凝膠液)濃度之濃縮使三維空隙結構之細孔閉口等不良情況。另一方面,例如熟成溫度一旦過低,不僅無法充分獲得藉前述熟成所得的效果,量產製程的歷時溫度偏差還會增大,可能製出品質不良的製品。 The aforementioned ripening treatment can be carried out, for example, by cultivating the gelatinous quinone compound at a predetermined temperature for a predetermined time. The predetermined temperature is not particularly limited, and the lower limit thereof is, for example, 30° C. or higher, 35° C. or higher, or 40° C. or higher, and the upper limit thereof is, for example, 80° C. or lower, 75° C. or lower, or 70° C. or lower, and the range is, for example, 30 to 80° C., 35 . ~75 ° C, 40 ~ 70 ° C. The predetermined time is not particularly limited, and the lower limit thereof is, for example, 5 hours or longer, 10 hours or longer, or 15 hours or longer, and the upper limit thereof is, for example, 50 hours or shorter, 40 hours or shorter, or 30 hours or shorter, and the range is, for example, 5 to 50 hours, 10 ~40 hours, 15~30 hours. Further, the main purpose of the optimum conditions for the ripening is, for example, to obtain an increase in the primary particle size of the ceria and an increase in the neck contact area. Further, it is preferable to consider the boiling point of the solvent to be used. For example, when the aging temperature is too high, the solvent is excessively volatilized, and further, problems such as concentration of the coating liquid (gel liquid) may cause the pores of the three-dimensional void structure to be closed. On the other hand, for example, if the aging temperature is too low, not only the effect obtained by the above-mentioned aging may not be sufficiently obtained, but the temperature deviation of the mass production process may increase, and a product having poor quality may be produced.

前述熟成處理例如可使用與前述凝膠化處理相同的溶劑,具體上宜對前述凝膠處理後的反應物(亦即,含有前述凝膠狀矽之前述溶劑)直接實施。結束凝膠化後之熟 成處理的前述凝膠(前述凝膠狀矽化合物)中所含殘留矽烷醇基的莫耳數係像令已添加之原材料(例如前述矽化合物前驅物)的烷氧基莫耳數為100時的殘留矽烷醇基所佔比率,其上限例如為50%以下、40%以下、30%以下,其下限例如為1%以上、3%以上、5%以上,其範圍則例如為1~50%、3~40%、5~30%。在提高凝膠硬度之目的下,例如殘留矽烷醇基之莫耳數愈低愈佳。矽烷醇基之莫耳數一旦過高,例如可能無法將空隙結構持續保持到使聚矽氧多孔體之前驅物進行交聯。另一方面,矽烷醇基之莫耳數一旦過低,例如在結合步驟中聚矽氧多孔體之前驅物可能無法進行交聯,進而無法賦予充分的強度。另外,上述為矽烷醇基之例,例如在單體矽化合物已以各種反應性官能基修飾過的情況下,對於各官能基亦可適用相同的現象。 For the aging treatment, for example, the same solvent as the gelation treatment described above can be used. Specifically, it is preferred to directly carry out the reaction after the gel treatment (that is, the solvent containing the gelatin enthalpy). Finished after gelation The molar number of the residual stanol group contained in the gel (the gel-like ruthenium compound) to be treated is such that the alkoxy number of the added raw material (for example, the aforementioned ruthenium compound precursor) is 100. The upper limit of the ratio of the residual stanol group is, for example, 50% or less, 40% or less, or 30% or less, and the lower limit thereof is, for example, 1% or more, 3% or more, or 5% or more, and the range is, for example, 1 to 50%. 3~40%, 5~30%. For the purpose of increasing the hardness of the gel, for example, the lower the molar number of the residual stanol group, the better. Once the molar number of the stanol group is too high, for example, the void structure may not be maintained until the precursor of the polysiloxane porous body is crosslinked. On the other hand, when the molar number of the stanol group is too low, for example, the precursor may not be crosslinked before the polysiloxane porous body is bonded in the bonding step, and thus sufficient strength cannot be imparted. Further, in the case where the above is a stanol group, for example, when the monomer ruthenium compound has been modified with various reactive functional groups, the same phenomenon can be applied to each functional group.

使前述單體矽化合物在前述凝膠化用溶劑中凝膠化後,將所得凝膠狀矽化合物粉碎。前述粉碎例如可對前述凝膠化用溶劑中之凝膠狀矽化合物直接施行粉碎處理,或可將前述凝膠化用溶劑換成其它溶劑後,對前述其它溶劑中之凝膠狀矽化合物施行粉碎處理。此外,像在凝膠化反應中所用之觸媒及所用之溶劑在熟成步驟後也會殘存,所以想降低液體歷時凝膠化(適用期)、及乾燥步驟時的乾燥效率時,宜換成其它溶劑。前述其它溶劑以下亦稱「粉碎用溶劑」。 After the monomer ruthenium compound is gelated in the solvent for gelation, the obtained gel-like ruthenium compound is pulverized. For the pulverization, for example, the gelatinous ruthenium compound in the solvent for gelation may be directly subjected to pulverization treatment, or the solvent for gelation may be replaced with another solvent, and then the gelatinous ruthenium compound in the other solvent may be subjected to the pulverization treatment. Crushing treatment. In addition, the catalyst used in the gelation reaction and the solvent used may remain after the ripening step. Therefore, when it is desired to reduce the gelation time (applicability period) of the liquid and the drying efficiency in the drying step, it is preferable to replace it with Other solvents. The other solvent described above is also referred to as "solvent solvent" hereinafter.

前述粉碎用溶劑無特別限制,例如可使用有機溶劑。前述有機溶劑可舉例沸點130℃以下、沸點100℃以下、 沸點85℃以下之溶劑。就具體例而言,可舉如異丙醇(IPA)、乙醇、甲醇、丁醇、丙二醇單甲基醚(PGME)、甲賽璐蘇、丙酮、二甲基甲醯胺(DMF)等。前述粉碎用溶劑例如可為1種亦可為2種以上之併用。 The solvent for pulverization is not particularly limited, and for example, an organic solvent can be used. The organic solvent may have a boiling point of 130 ° C or less and a boiling point of 100 ° C or less. A solvent having a boiling point of 85 ° C or less. Specific examples thereof include isopropyl alcohol (IPA), ethanol, methanol, butanol, propylene glycol monomethyl ether (PGME), acesulfame, acetone, dimethylformamide (DMF), and the like. The solvent for the pulverization may be used alone or in combination of two or more kinds.

前述凝膠化用溶劑與前述粉碎用溶劑之組合無特別限制,可舉如DMSO與IPA之組合、DMSO與乙醇、DMSO與甲醇、DMSO與丁醇之組合等。如此一來,藉由將前述凝膠化用溶劑換成前述粉碎用溶劑,例如可在後述之塗膜形成中形成較均一的塗覆膜。 The combination of the solvent for gelation and the solvent for pulverization is not particularly limited, and examples thereof include a combination of DMSO and IPA, a combination of DMSO and ethanol, DMSO and methanol, DMSO and butanol, and the like. In this way, by replacing the solvent for gelation with the solvent for pulverization, for example, a more uniform coating film can be formed in the formation of a coating film to be described later.

前述凝膠狀矽化合物之粉碎方法並無特別限制,但宜使用高壓無介質粉碎裝置。例如,可藉由以下裝置進行:超音波均質機、高速旋轉均質機、高壓擠出粉碎裝置、其它利用空蝕現象之濕式無介質粉碎裝置或是以高壓使液體彼此斜向衝擊的粉碎裝置等。球磨機等進行介質粉碎之裝置例如係在粉碎時以物理方式破壞凝膠之空隙結構,相對地,均質機等本發明偏好的空蝕方式粉碎裝置係藉由無介質方式,以高壓‧高速的剪切力將早已內包在凝膠三維結構中之鍵結較微弱的二氧化矽溶膠粒子接合面剝離,且不會伴隨媒質之物理的破壞現象。藉此,獲得之溶膠三維結構例如可保持在次微粒子區具有一定範圍之粒度分布的空隙結構,進而可藉由塗覆‧乾燥時的堆積再形成空隙結構。前述粉碎條件無特別限制,例如宜藉由瞬間賦予高速的流動,以不使溶劑揮發的方式將凝膠粉碎。例如,宜以成為如前述之粒度偏差(例如體積平均粒徑或粒度分 布)的粉碎物的方式進行粉碎。假設當粉碎時間‧強度等工作量不夠時,例如不僅會殘留粗粒無法形成緻密的細孔,還可能會增加外觀缺點,無法獲得高品質。另一方面,當工作量過多時,例如可能會形成比期望的粒度分布更微細的溶膠粒子,使塗覆‧乾燥後堆積而成的空隙大小變微細,而無法達成期望的空孔率。 The pulverization method of the gelled ruthenium compound is not particularly limited, but a high-pressure medium-free pulverization apparatus is preferably used. For example, it can be carried out by the following devices: an ultrasonic homogenizer, a high-speed rotary homogenizer, a high-pressure extrusion pulverizing device, other wet-type medium-free pulverizing devices using cavitation, or a pulverizing device that obliquely impacts liquids with each other at high pressure. Wait. A device for pulverizing a medium such as a ball mill or the like physically ruptures the void structure of the gel during pulverization. In contrast, a cavitation pulverizing device preferred by the present invention, such as a homogenizer, is a high-pressure ‧ high-speed shear by means of a medium-free method The shear force peels off the joint of the weaker cerium oxide sol particles which has been contained in the three-dimensional structure of the gel, and does not accompany the physical destruction of the medium. Thereby, the obtained three-dimensional structure of the sol can maintain a void structure having a certain range of particle size distribution in the sub-fine particle region, and further form a void structure by coating and drying. The pulverization conditions are not particularly limited. For example, it is preferred to pulverize the gel so as not to volatilize the solvent by instantaneously imparting a high-speed flow. For example, it is preferred to have a particle size deviation as described above (for example, a volume average particle size or a particle size fraction) The pulverized material of the cloth is pulverized. It is assumed that when the amount of work such as the pulverization time and the strength is insufficient, for example, not only the coarse particles but also the fine pores cannot be formed, and the appearance defects may be increased, and high quality may not be obtained. On the other hand, when the amount of work is too large, for example, sol particles which are finer than the desired particle size distribution may be formed, and the size of the voids which are deposited after the coating is dried may be fine, and the desired porosity may not be achieved.

以上述的方式可製作含有前述微細孔粒子(凝膠狀矽化合物之粉碎物)之液體(例如懸浮液)。此外,可在製作出含有前述微細孔粒子的液體後或是在製作過程當中,藉由添加使前述微細孔粒子彼此行化學結合之觸媒來製作含有前述微細孔粒子及前述觸媒的含有液。前述觸媒之添加量並無特別限定,相對於前述微細孔粒子(凝膠狀矽化合物之粉碎物)之重量,例如為0.01~20重量%、0.05~10重量%或0.1~5重量%。藉由該觸媒,例如可在後述之結合步驟中使前述微細孔粒子彼此行化學結合。前述觸媒亦可為例如促進前述微細孔粒子彼此交聯結合的觸媒。使前述微細孔粒子彼此行化學結合之化學反應宜利用二氧化矽溶膠分子中所含殘留矽烷醇基的脫水縮合反應。藉由前述觸媒促進矽烷醇基之羥基彼此的反應,可做到在短時間內使空隙結構硬化的連續成膜。前述觸媒可舉如光活性觸媒及熱活性觸媒。藉由前述光活性觸媒,例如不用加熱就可讓前述微細孔粒子彼此行化學結合(例如交聯結合)。藉此,例如就不容易因加熱產生收縮,所以可維持較高的空隙率。此外,除了前述觸媒以外,亦可使用可產生觸媒之物質(觸媒產生 劑)或取而代之。例如,亦可為前述觸媒是交聯反應促進劑,而前述觸媒產生劑是產生前述交聯反應促進劑之物質。例如,除了前述光活性觸媒以外,亦可使用藉由光產生觸媒之物質(光觸媒產生劑)或取而代之;或是除了前述熱活性觸媒以外,亦可使用藉由熱產生觸媒之物質(熱觸媒產生劑)或取而代之。前述酸或前述光觸媒產生劑並無特別限定,可舉如光鹼產生劑(藉由光照射產生鹼性觸媒之觸媒)、光酸產生劑(藉由光照射產生酸性觸媒之物質)等,且以光鹼劑為佳。前述光鹼產生劑可舉如:9-蒽基甲基N,N-二乙基胺甲酸酯(9-anthrylmethyl N,N-diethylcarbamate、商品名WPBG-018)、(E)-1-[3-(2-羥苯基)-2-丙烯醯基]哌啶((E)-1-[3-(2-hydroxyphenyl)-2-propenoyl]piperidine、商品名WPBG-027)、1-(蒽醌-2-基)乙基咪唑羧酸酯(1-(anthraquinon-2-yl)ethyl imidazolecarboxylate、商品名WPBG-140)、2-硝苯基甲基4-甲基丙烯醯氧基哌啶-1-羧酸酯(商品名WPBG-165)、1,2-二異丙基-3-[雙(二甲胺基)亞甲基]鈲2-(3-苯甲醯苯基)丙酸酯(商品名WPBG-266)、1,2-二環己基-4,4,5,5-四甲基雙鈲正丁基三苯基硼酸酯(商品名WPBG-300)、及2-(9-氧雜二苯并哌喃-2-基)丙酸1,5,7-三氮雜雙環[4.4.0]癸-5-烯(東京化成工業股份有限公司)、含4-哌啶甲醇之化合物(商品名HDPD-PB100:Heraeus公司製)等。另外,前述含有「WPBG」之商品名均為和光純藥工業股份有限公司之商品名。前述光酸產生劑可舉如芳香族鋶鹽(商品名SP-170:ADEKA公司)、三芳基鋶鹽(商品名 CPI101A:San-Apro Ltd.)、芳香族錪鹽(商品名Irgacure250:Ciba Japan K.K.)等。此外,使前述微細孔粒子彼此行化學結合之觸媒不限於前述光活性觸媒,例如亦可為像脲等熱活性觸媒。使前述微細孔粒子彼此行化學結合之觸媒可舉如氫氧化鉀、氫氧化鈉、氫氧化銨等鹼性觸媒、及鹽酸、乙酸、草酸等酸觸媒等。該等中又以鹼性觸媒為佳。使前述微細孔粒子彼此行化學結合之觸媒例如可在正要進行塗覆前才添加至含有前述粉碎物(微細孔粒子)之溶膠粒子液(例如懸浮液)中作使用,或可作成已將前述觸媒混合至溶劑中之混合液來使用。前述混合液例如可為:直接添加溶解於前述溶膠粒子液的塗覆液、使前述觸媒溶解於溶劑的溶液、或使前述觸媒分散於溶劑的分散液。前述溶劑無特別限制,可舉如各種有機溶劑、水、緩衝液等。此外,可形成前述微細孔粒子以外之空隙結構的液體中亦可含有前述酸或鹼以外之可藉由加熱或光照射產生自由基的觸媒,可因應空隙結構薄膜之構成單元選擇最佳的觸媒。 A liquid (for example, a suspension) containing the above-mentioned fine pore particles (pulverized product of a gelatinous ruthenium compound) can be produced in the above manner. Further, after the liquid containing the fine pore particles is produced or during the production process, a catalyst containing the fine pore particles and the catalyst can be prepared by adding a catalyst which chemically bonds the fine pore particles to each other. . The amount of the catalyst to be added is not particularly limited, and is, for example, 0.01 to 20% by weight, 0.05 to 10% by weight, or 0.1 to 5% by weight based on the weight of the fine pore particles (the pulverized product of the gelatinous cerium compound). By the catalyst, for example, the microporous particles can be chemically bonded to each other in a bonding step to be described later. The catalyst may be, for example, a catalyst that promotes cross-linking of the aforementioned fine pore particles to each other. The chemical reaction for chemically bonding the aforementioned fine pore particles to each other is preferably carried out by a dehydration condensation reaction of a residual stanol group contained in the cerium oxide sol molecule. By the reaction of the hydroxyl groups of the stanol groups by the above-mentioned catalyst, continuous film formation in which the void structure is hardened in a short time can be achieved. The aforementioned catalyst may be, for example, a photoactive catalyst and a thermally active catalyst. The aforementioned microporous particles can be chemically bonded to each other (for example, crosslinked bonding) by the aforementioned photoactive catalyst, for example, without heating. Thereby, for example, shrinkage due to heating is not easily caused, so that a high void ratio can be maintained. In addition, in addition to the aforementioned catalyst, a substance capable of generating a catalyst may be used (catalyst generation) Or) or replace it. For example, the catalyst may be a crosslinking reaction accelerator, and the catalyst generator may be a substance that generates the crosslinking reaction accelerator. For example, in addition to the photoactive catalyst described above, a substance (photocatalyst generator) which generates a catalyst by light may be used or replaced; or a substance which generates a catalyst by heat may be used in addition to the above-mentioned thermally active catalyst. (hot catalyst generator) or replace it. The acid or the photocatalyst generating agent is not particularly limited, and examples thereof include a photobase generator (catalyst which generates an alkaline catalyst by light irradiation) and a photoacid generator (a substance which generates an acid catalyst by light irradiation). Etc., and photobase agents are preferred. The aforementioned photobase generator may be, for example, 9-anthrylmethyl N, N-diethylcarbamate (trade name: WPBG-018), (E)-1-[ 3-(2-hydroxyphenyl)-2-propenyl] piperidine ((E)-1-[3-(2-hydroxyphenyl)-2-propenoyl]piperidine, trade name WPBG-027), 1-( 2-(anthraquinon-2-yl)ethyl imidazolecarboxylate (trade name: WPBG-140), 2-nitrophenylmethyl 4-methylpropenyloxypiperidine 1-carboxylic acid ester (trade name: WPBG-165), 1,2-diisopropyl-3-[bis(dimethylamino)methylene]fluorene 2-(3-benzhydrylphenyl)propene Acid ester (trade name: WPBG-266), 1,2-dicyclohexyl-4,4,5,5-tetramethylbis-n-butyltriphenyl borate (trade name: WPBG-300), and 2 -(9-oxadibenzopipene-2-yl)propionic acid 1,5,7-triazabicyclo[4.4.0]non-5-ene (Tokyo Chemical Industry Co., Ltd.), 4- A compound of piperidine methanol (trade name: HDPD-PB100: manufactured by Heraeus Co., Ltd.) or the like. In addition, the trade names containing "WPBG" mentioned above are the trade names of Wako Pure Chemical Industries Co., Ltd. The photoacid generator may, for example, be an aromatic onium salt (trade name: SP-170: ADEKA) or a triarylsulfonium salt (trade name). CPI101A: San-Apro Ltd.), an aromatic onium salt (trade name Irgacure 250: Ciba Japan K.K.), and the like. Further, the catalyst for chemically bonding the fine pore particles to each other is not limited to the photoactive catalyst, and may be, for example, a thermally active catalyst such as urea. The catalyst for chemically bonding the fine pore particles to each other may be an alkaline catalyst such as potassium hydroxide, sodium hydroxide or ammonium hydroxide, or an acid catalyst such as hydrochloric acid, acetic acid or oxalic acid. Among them, alkaline catalysts are preferred. The catalyst for chemically bonding the fine pore particles to each other, for example, may be added to a sol particle liquid (for example, a suspension) containing the pulverized material (microporous particles) before being coated, or may be used as The above mixture is mixed with a solvent and used in a solvent. The mixed liquid may be, for example, a coating liquid dissolved in the sol particle liquid, a solution in which the catalyst is dissolved in a solvent, or a dispersion in which the catalyst is dispersed in a solvent. The solvent is not particularly limited, and examples thereof include various organic solvents, water, and a buffer solution. Further, the liquid which can form the void structure other than the fine pore particles may contain a catalyst which can generate radicals by heating or light irradiation other than the above-mentioned acid or alkali, and can select the optimum unit in accordance with the constituent unit of the void structure film. catalyst.

此外,例如當前述矽化合物之微細孔粒子為凝膠狀矽化合物之粉碎物且該凝膠狀矽化合物係由至少含有3官能以下之飽和鍵結官能基的矽化合物製得時,可在製作出含有前述矽化合物之微細孔粒子的液體後或於製作步驟中進一步添加交聯輔助劑,該交聯輔助劑係用以使前述矽化合物之微細孔粒子彼此間接結合。該交聯輔助劑藉由進入粒子彼此之間,利用粒子與交聯輔助劑各自的相互作用或結合,可讓距離上稍顯分離的粒子彼此也得以結合,進 而可有效率地提升強度。前述交聯輔助劑以多交聯矽烷單體為佳。前述多交聯矽烷單體具體上具有例如2以上且3以下之烷氧矽基,且烷氧矽基間之鏈長可為碳數1以上且10以下,並可含有碳以外之元素。前述交聯輔助劑可舉如:雙(三甲氧矽基)乙烷、雙(三乙氧矽基)乙烷、雙(三甲氧矽基)甲烷、雙(三乙氧矽基)甲烷、雙(三乙氧矽基)丙烷、雙(三甲氧矽基)丙烷、雙(三乙氧矽基)丁烷、雙(三甲氧矽基)丁烷、雙(三乙氧矽基)戊烷、雙(三甲氧矽基)戊烷、雙(三乙氧矽基)己烷、雙(三甲氧矽基)己烷、雙(三甲氧矽基)-N-丁基-N-丙基-乙烷-1,2-二胺、參-(3-三甲氧矽基丙基)三聚異氰酸酯、參-(3-三乙氧矽基丙基)三聚異氰酸酯等。該交聯輔助劑之添加量並無特別限定,例如相對於前述矽化合物之微細孔粒子的重量為0.01~20重量%、0.05~15重量%或0.1~10重量%。 Further, for example, when the fine pore particles of the ruthenium compound are a pulverized product of a gelatinous ruthenium compound and the gelatinous ruthenium compound is obtained from a ruthenium compound containing at least a trifunctional or less saturated bond functional group, it can be produced. Further, after the liquid containing the fine pore particles of the above ruthenium compound, or in the production step, a crosslinking auxiliary agent for indirectly bonding the fine pore particles of the ruthenium compound to each other is further added. The cross-linking auxiliary agent allows particles which are slightly separated in distance to be combined with each other by entering the particles with each other and utilizing the interaction or combination of the particles and the cross-linking auxiliary agent. It can increase the strength efficiently. The crosslinking assistant is preferably a multi-crosslinked decane monomer. The multi-crosslinked decane monomer specifically has, for example, an alkoxyfluorenyl group of 2 or more and 3 or less, and a chain length between the alkoxy fluorenyl groups may be 1 or more and 10 or less carbon atoms, and may contain an element other than carbon. The crosslinking auxiliary agent may be exemplified by bis(trimethoxyindolyl)ethane, bis(triethoxyindenyl)ethane, bis(trimethoxyindenyl)methane, bis(triethoxyindenyl)methane, and a double (triethoxyindolyl)propane, bis(trimethoxyindolyl)propane, bis(triethoxyindenyl)butane, bis(trimethoxyindenyl)butane, bis(triethoxyindenyl)pentane, Bis(trimethoxyindolyl)pentane, bis(triethoxyindenyl)hexane, bis(trimethoxyindolyl)hexane, bis(trimethoxyindolyl)-N-butyl-N-propyl-B Alkenyl-1,2-diamine, cis-(3-trimethoxydecylpropyl)trimeric isocyanate, cis-(3-triethoxydecylpropyl)trimeric isocyanate, and the like. The amount of the crosslinking auxiliary agent to be added is not particularly limited, and is, for example, 0.01 to 20% by weight, 0.05 to 15% by weight or 0.1 to 10% by weight based on the weight of the fine pore particles of the cerium compound.

前述聚矽氧多孔體例如可藉由使用含有前述矽化合物之微細孔粒子的液體(理想為含有前述凝膠狀矽化合物之粉碎物的溶膠)形成塗覆膜而形成。前述矽化合物之微細孔粒子的塗覆例如可使用後述之各種塗覆方式,惟不受該等限定。又,藉由將含有前述粉碎物之溶劑直接塗覆於前述基材,可形成前述塗覆膜。此外,前述多孔體前驅物亦即後述之結合步驟前的前述塗覆膜例如亦可為與前述本發明之聚矽氧多孔體對應的前驅膜(或前驅層)。藉由形成前述塗覆膜,例如可讓破壞前述三維結構的前述粉碎物沉降‧堆積而構建出新的三維結構。 The porous polysiloxane porous body can be formed, for example, by forming a coating film using a liquid containing a fine pore particle of the above-described cerium compound (preferably a sol containing the pulverized product of the gelatinous cerium compound). The coating of the fine pore particles of the above-mentioned cerium compound can be carried out, for example, by various coating methods described later, but is not limited thereto. Further, the coating film can be formed by directly applying a solvent containing the pulverized material to the substrate. Further, the porous body precursor, that is, the coating film before the bonding step described later may be, for example, a precursor film (or a precursor layer) corresponding to the above-described polyfluorinated porous body of the present invention. By forming the aforementioned coating film, for example, the pulverized material which is damaging the three-dimensional structure can be deposited and deposited to form a new three-dimensional structure.

前述溶劑(以下亦稱「塗覆用溶劑」)無特別限制,例如可使用有機溶劑。前述有機溶劑可舉如沸點130℃以下的溶劑。就具體例而言,可舉如IPA、乙醇、甲醇、丁醇等,也可使用與前述粉碎用溶劑相同者。本發明包含粉碎前述凝膠狀矽化合物之步驟時,在前述塗覆膜之形成步驟中例如可直接使用含有前述凝膠狀矽化合物之粉碎物的前述粉碎用溶劑。 The solvent (hereinafter also referred to as "solvent for coating") is not particularly limited, and for example, an organic solvent can be used. The organic solvent may, for example, be a solvent having a boiling point of 130 ° C or lower. Specific examples thereof include IPA, ethanol, methanol, butanol, and the like, and the same as the solvent for pulverization described above. In the step of forming the coating film, for example, the pulverization solvent containing the pulverized material of the gelatinous cerium compound can be used as it is, in the step of forming the coating film.

在前述塗覆膜之形成步驟中,例如宜將已分散於前述溶劑之溶膠狀的前述矽化合物之微細孔粒子(以下亦稱「溶膠粒子液」)塗覆於前述基材上。本發明之溶膠粒子液例如可在塗覆於基材上並經乾燥後,藉由結合步驟進行化學交聯而連續成膜出具有一定程度以上之強度的空隙層。此外,本發明之「溶膠」係指將凝膠之三維結構予以粉碎,使保持空隙結構一部分的奈米三維結構之二氧化矽溶膠粒子分散於溶劑中並顯示流動性的狀態。 In the step of forming the coating film, for example, fine pore particles (hereinafter also referred to as "sol particle liquid") of the above-mentioned cerium compound dispersed in the solvent are preferably applied to the substrate. The sol particle liquid of the present invention can be continuously formed into a void layer having a strength of a certain degree or more, for example, after being applied onto a substrate and dried, and then chemically crosslinked by a bonding step. In addition, the "sol" of the present invention refers to a state in which the three-dimensional structure of the gel is pulverized, and the cerium oxide sol particles having a three-dimensional structure in which a part of the void structure is held are dispersed in a solvent to exhibit fluidity.

前述矽化合物之微細孔粒子在前述溶劑中的濃度並無特別限制,例如為0.3~80%(v/v)、0.5~40%(v/v)、1.0~10%(v/v)。前述粉碎物之濃度一旦過高,例如前述溶膠粒子液之流動性可能會顯著降低而產生塗覆時的凝結物‧塗痕。另一方面,前述矽化合物的微細孔粒子濃度一旦過低,不僅前述溶膠粒子液之溶劑乾燥需要耗費相當的時間,剛乾燥後的殘留溶劑也會增高,因而可能降低空孔率。 The concentration of the fine pore particles of the ruthenium compound in the solvent is not particularly limited, and is, for example, 0.3 to 80% (v/v), 0.5 to 40% (v/v), and 1.0 to 10% (v/v). When the concentration of the pulverized material is too high, for example, the fluidity of the sol particle liquid may be remarkably lowered to cause condensate/coating at the time of coating. On the other hand, when the concentration of the fine pore particles of the ruthenium compound is too low, it takes a considerable amount of time to dry the solvent of the sol particle liquid, and the residual solvent immediately after drying is also increased, so that the porosity may be lowered.

前述溶膠粒子液之物性並無特別限制。前述溶膠 粒子液之剪切黏度例如在1000l/s之剪切速度下,為黏度100cPa‧s以下、黏度10cPa‧s以下、黏度1cPa‧s以下。剪切黏度一旦過高,例如可能會產生塗痕,而出現凹版塗覆之轉印率降低等不良情況。相反地,剪切黏度一旦過低,例如可能無法加厚塗覆時的濕式塗佈厚度而無法於乾燥後獲得期望的厚度。 The physical properties of the sol particle liquid are not particularly limited. The aforementioned sol The shear viscosity of the particle liquid is, for example, at a shear rate of 1000 l/s, a viscosity of 100 cPa·s or less, a viscosity of 10 cPa·s or less, and a viscosity of 1 cPa·s or less. When the shear viscosity is too high, for example, a scratch may occur, and a problem that the transfer rate of the gravure coating is lowered may occur. Conversely, once the shear viscosity is too low, for example, the wet coating thickness at the time of coating may not be thickened and the desired thickness may not be obtained after drying.

前述矽化合物之微細孔粒子相對於前述基材的塗覆量無特別限制,例如可因應期望的前述聚矽氧多孔體之厚度等適宜設定。就具體例而言,在形成厚度0.1~1000μm之前述聚矽氧多孔體時,前述粉碎物相對於前述基材的塗覆量在前述基材之每面積1m2例如為0.01~60000g、0.1~5000g、1~50g。前述溶膠粒子液的理想塗覆量與例如液體濃度或塗覆方式等相關,因而難以作單一定義,若考慮生產性,則以盡可能塗以薄層為佳。塗佈量一旦過多,例如於溶劑揮發前在乾燥爐被乾燥的可能性會提高。藉此,奈米粉碎溶膠粒子在溶劑中沉降‧堆積形成空隙結構之前,可能因溶劑乾燥而阻礙空隙形成,使空孔率大幅降低。另一方面,塗佈量一旦過薄,因基材之凹凸‧親疏水性之偏差等,產生塗覆收縮(cissing)的風險可能大增。 The amount of the fine pore particles of the ruthenium compound to be coated with respect to the base material is not particularly limited, and can be appropriately set, for example, in accordance with the desired thickness of the porous porous siloxane material. In a specific example, when the polyaluminum oxide porous body having a thickness of 0.1 to 1000 μm is formed, the coating amount of the pulverized material with respect to the base material is, for example, 0.01 to 60000 g, 0.1 to 1 m 2 per area of the substrate. 5000g, 1~50g. The desired coating amount of the sol particle liquid is related to, for example, the liquid concentration or the coating method, and thus it is difficult to make a single definition. When productivity is considered, it is preferable to apply a thin layer as much as possible. When the amount of coating is too large, for example, the possibility of drying in a drying oven before the solvent is volatilized increases. Thereby, the nanosized pulverized sol particles are precipitated in a solvent, and before the formation of the void structure, the formation of the void structure may be hindered by the drying of the solvent, and the void ratio may be greatly lowered. On the other hand, when the coating amount is too small, the risk of coating shrinkage may increase due to the unevenness of the base material, the deviation of the hydrophilicity and the like, and the like.

將前述粉碎物塗覆於前述基材上以後,可對前述塗覆膜施行乾燥處理。本發明之乾燥處理溫度特徵在於可從較低的溫度開始處理,適合短時間的連續生產。藉由前述乾燥處理,不僅可去除前述塗覆膜中的前述溶劑(前述 溶膠粒子液中所含溶劑),目的更在於在乾燥處理中使溶膠粒子沉降‧堆積,以形成空隙結構。前述乾燥處理之溫度例如為50~200℃、60~150℃、70~130℃,前述乾燥處理之時間例如為0.1~30分、0.2~10分、0.3~3分。關於乾燥處理溫度及時間,例如在連續生產性或顯現高空孔率的關連下,以較低溫度且較短時間為佳。條件若過度嚴苛,例如在基材為樹脂薄膜的情況下,接近前述基材之玻璃轉移溫度時,前述基材會在乾燥爐中伸展而可能於剛塗覆後就在已形成的空隙結構產生裂痕等缺點。另一方面,條件若太過寬鬆,例如因為在離開乾燥爐的時間點含有殘留溶劑,所以在下一步驟中與輥件摩擦時可能發生混入刮傷等外觀上的不良情況。 After the pulverized material is applied onto the aforementioned substrate, the coating film may be subjected to a drying treatment. The drying treatment temperature of the present invention is characterized in that it can be processed from a lower temperature and is suitable for continuous production in a short time. By the aforementioned drying treatment, not only the aforementioned solvent in the aforementioned coating film can be removed (the aforementioned The purpose of the solvent contained in the sol particle liquid is to cause the sol particles to settle and deposit in the drying process to form a void structure. The temperature of the drying treatment is, for example, 50 to 200 ° C, 60 to 150 ° C, and 70 to 130 ° C, and the drying treatment time is, for example, 0.1 to 30 minutes, 0.2 to 10 minutes, or 0.3 to 3 minutes. With regard to the drying treatment temperature and time, for example, in the case of continuous productivity or the appearance of high porosity, it is preferred to use a lower temperature and a shorter time. If the conditions are excessively severe, for example, in the case where the substrate is a resin film, when the glass transition temperature of the substrate is close to the substrate, the substrate may be stretched in a drying oven and may be formed into a void structure immediately after coating. There are disadvantages such as cracks. On the other hand, if the conditions are too loose, for example, since the residual solvent is contained at the time of leaving the drying furnace, an appearance defect such as a scratch may occur when rubbing against the roller member in the next step.

另一方面,前述乾燥處理例如可為自然乾燥,可為加熱乾燥,亦可為減壓乾燥。前述乾燥方法無特別限制,例如可使用一般的加熱機構。前述加熱機構可舉如熱風器、加熱輥、遠紅外線加熱器等。其中,在以工業上連續生產為前提下,宜使用加熱乾燥。又,關於可使用的溶劑,當目的為抑制乾燥時隨溶劑揮發而產生的收縮應力以及隨之而來的空隙層(前述聚矽氧多孔體)之裂痕現象時,以表面張力低的溶劑為佳。前述溶劑可舉如以異丙醇(IPA)為代表之低級醇、己烷、全氟己烷等,惟不受該等限定。可按目的之矽烷醇多孔體的厚度、溶劑種類變更乾燥處理溫度‧時間。 On the other hand, the drying treatment may be, for example, natural drying, and may be heat drying or drying under reduced pressure. The aforementioned drying method is not particularly limited, and for example, a general heating mechanism can be used. The heating means may be, for example, a hot air blower, a heat roller, a far infrared heater or the like. Among them, under the premise of continuous production in the industry, it is preferred to use heat drying. Further, in the solvent which can be used, when the purpose is to suppress the shrinkage stress caused by the volatilization of the solvent during drying and the subsequent cracking phenomenon of the void layer (the porous polysiloxane porous body), the solvent having a low surface tension is good. The solvent may, for example, be a lower alcohol represented by isopropyl alcohol (IPA), hexane, perfluorohexane or the like, but is not limited thereto. The drying treatment temperature can be changed according to the thickness of the porous stanol porous body and the type of the solvent.

前述基材無特別限制,可因應目的之矽烷醇多 孔體的構成,分製不使用基材的多孔體或形成於基材上的多孔體。例如,適宜使用:熱可塑性樹脂製基材、玻璃製基材、以矽為代表的無機基板、以熱硬化性樹脂等成形的塑膠、半導體等元件、以奈米碳管為代表的碳纖維系材料等,惟不受該等限定。前述基材之形態可舉如薄膜、薄板等。前述熱可塑性樹脂可舉如聚對苯二甲酸乙二酯(PET)、丙烯酸、乙酸丙酸纖維素(CAP)、環烯烴聚合物(COP)、三乙酸酯(TAC)、聚萘二甲酸乙二酯(PEN)、聚乙烯(PE)、聚丙烯(PP)等高透明性的基材。 The foregoing substrate is not particularly limited, and the stanol can be used for the purpose. The structure of the pores is divided into a porous body which does not use a substrate or a porous body formed on a substrate. For example, a base material made of a thermoplastic resin, a base material made of glass, an inorganic substrate typified by ruthenium, a plastic such as a thermosetting resin, a semiconductor, or the like, and a carbon fiber material represented by a carbon nanotube are used. Etc., but not subject to such restrictions. The form of the substrate may be, for example, a film or a sheet. The thermoplastic resin may, for example, be polyethylene terephthalate (PET), acrylic acid, cellulose acetate propionate (CAP), cycloolefin polymer (COP), triacetate (TAC), polynaphthalene dicarboxylic acid. A highly transparent substrate such as ethylene glycol (PEN), polyethylene (PE), or polypropylene (PP).

在本發明之製造方法中,前述結合步驟係使前述塗覆膜中所含前述矽化合物之微細孔粒子彼此行化學結合的步驟,濕式處理及乾式處理兩者皆適宜處理。藉由前述結合步驟,例如可使前述多孔體之前驅物的前述矽化合物之微細孔粒子之三維結構固定化。以習知之燒結進行固定化時,例如係以施行200℃以上之高溫處理來激發矽烷醇基之脫水縮合,形成矽氧烷鍵結。在本發明之前述結合步驟中,例如當基材為樹脂薄膜時,藉由使催化上述脫水縮合反應之各種添加劑進行反應,既不會損傷前述基材,還可在100℃前後之較低的熱風乾燥溫度及僅數分鐘的短暫處理時間內進行濕式處理。又,亦可於前述乾燥步驟後進行紫外線照射,藉由光觸媒反應以短時間的乾式處理行鍵結反應,而連續形成空隙結構並予以固定化。濕式處理係在形成前述塗覆膜的同時引發交聯反應,因此具有僅以熱風乾燥步驟即可進行處理的優點,但是又因為在形成空 隙結構時同步引發交聯反應,而具有阻礙高空隙率形成的缺點。又,即使是先形成空隙結構以後再浸漬於觸媒溶液中以引發鍵結反應,依舊預料會有同樣的現象。相對地,乾式處理係在形成矽烷醇前驅物之高空隙結構後再引發交聯反應的2階段反應,因此具有不易阻礙高空隙結構形成的優點。故宜因應目的分別活用濕式處理及乾式處理。 In the production method of the present invention, the bonding step is a step of chemically bonding the fine pore particles of the cerium compound contained in the coating film to each other, and both the wet treatment and the dry treatment are suitably treated. By the above-described bonding step, for example, the three-dimensional structure of the fine pore particles of the ruthenium compound of the porous body precursor can be immobilized. When immobilization is carried out by conventional sintering, for example, a high temperature treatment at 200 ° C or higher is performed to excite dehydration condensation of a stanol group to form a siloxane coupling. In the above-mentioned bonding step of the present invention, for example, when the substrate is a resin film, by reacting various additives catalyzing the above-described dehydration condensation reaction, the substrate is not damaged, and the substrate can be low before and after 100 ° C. The hot air drying temperature and the short processing time of only a few minutes are wet-processed. Further, after the drying step, ultraviolet irradiation may be performed, and the bonding reaction may be carried out by a photocatalytic reaction in a short-time dry treatment to continuously form a void structure and fix it. The wet treatment initiates the crosslinking reaction while forming the aforementioned coating film, and therefore has the advantage that it can be processed only by the hot air drying step, but also because it is formed empty The gap structure simultaneously initiates a crosslinking reaction and has the disadvantage of hindering the formation of a high void ratio. Further, even if the void structure is formed first and then immersed in the catalyst solution to initiate the bonding reaction, the same phenomenon is expected. In contrast, the dry treatment has a two-stage reaction of initiating a crosslinking reaction after forming a high void structure of a stanol precursor, and thus has an advantage that it is difficult to hinder the formation of a high void structure. Therefore, wet treatment and dry treatment should be used separately for the purpose.

前述行化學結合之方法並無特別限制,例如可因應前述凝膠狀矽化合物之種類適宜決定。就具體例來說,前述化學結合例如可藉由前述矽化合物之微細孔粒子彼此的化學交聯結合來進行,其它例如在將氧化鈦等無機粒子等添加於前述矽化合物之微細孔粒子的情況下,可使前述無機粒子及前述矽化合物之微細孔粒子進行化學交聯結合。此外,在提供酵素等生物觸媒的情況下,亦有可能使與觸媒活性點不同的部位與前述粉碎物行化學交聯結合。因此,本發明不僅只例如以前述溶膠粒子彼此形成的空隙層(聚矽氧多孔體),也可擴展應用於有機無機混成空隙層、主客(host-guest)空隙層等,惟不受該等限定。 The method of chemically bonding is not particularly limited, and for example, it can be appropriately determined depending on the type of the gelatinous quinone compound. In a specific example, the chemical bonding can be carried out by chemical crosslinking of the fine pore particles of the ruthenium compound, for example, by adding inorganic particles such as titanium oxide to the fine pore particles of the ruthenium compound. Next, the inorganic particles and the fine pore particles of the above ruthenium compound may be chemically crosslinked. Further, in the case of providing a biocatalyst such as an enzyme, it is also possible to chemically crosslink the site different from the catalytic activity point to the pulverized material. Therefore, the present invention can be applied not only to the void layer (polyphosphorus oxide porous body) in which the sol particles are formed to each other, but also to the organic-inorganic hybrid void layer, the host-guest void layer, etc., but not to be such. limited.

前述結合步驟例如可因應前述矽化合物之微細孔粒子的種類,藉由觸媒存在下之化學反應進行。本發明之化學反應宜利用二氧化矽溶膠分子中所含殘留矽烷醇基的脫水縮合反應。藉前述觸媒促進矽烷醇基之羥基彼此的反應,可做到在短時間內使空隙結構硬化的連續成膜。惟,亦可使用將其它的反應性官能基予以有機修飾過的矽單體材料作為二氧化矽凝膠原料使用,在結合步驟中進行 反應的官能基並非只限定為矽烷醇基。前述觸媒可舉如氫氧化鉀、氫氧化鈉、氫氧化銨等鹼性觸媒及鹽酸、乙酸、草酸等酸觸媒等,惟不受該等限定。前述脫水縮合反應之觸媒以鹼性觸媒尤佳。此外,亦適宜使用藉由光(例如紫外線)照射來顯現觸媒活性的光酸產生觸媒、光鹼產生觸媒、光酸產生劑、光鹼產生劑等。光酸產生觸媒、光鹼產生觸媒、光酸產生劑及光鹼產生劑並無特別限定,如同前述。前述觸媒如同前述,宜於正要進行塗覆前才添加於含有前述粉碎物之溶膠粒子液中作使用,或宜作成已使前述觸媒混合於溶劑中之混合液來使用。前述混合液例如可為:直接添加溶解於前述溶膠粒子液的塗覆液、使前述觸媒溶解於溶劑的溶液、或使前述觸媒分散於溶劑的分散液。前述溶劑如前述並無特別限制,可舉如各種有機溶劑、水、緩衝液等。 The above-described bonding step can be carried out, for example, by a chemical reaction in the presence of a catalyst in accordance with the type of the fine pore particles of the above-mentioned cerium compound. The chemical reaction of the present invention preferably utilizes a dehydration condensation reaction of residual stanol groups contained in the cerium oxide sol molecule. By the above-mentioned catalyst, the reaction between the hydroxyl groups of the stanol groups can be promoted, and the continuous film formation in which the void structure is hardened in a short time can be achieved. However, it is also possible to use a ruthenium monomer material in which other reactive functional groups have been organically modified as a raw material for the cerium oxide gel, in the bonding step. The functional group of the reaction is not limited to only a stanol group. The catalyst may, for example, be an alkaline catalyst such as potassium hydroxide, sodium hydroxide or ammonium hydroxide, or an acid catalyst such as hydrochloric acid, acetic acid or oxalic acid, but is not limited thereto. The catalyst for the dehydration condensation reaction described above is preferably a basic catalyst. Further, a photoacid generating catalyst, a photobase generating catalyst, a photoacid generator, a photobase generator, and the like which exhibit photocatalytic activity by irradiation with light (for example, ultraviolet rays) are also suitably used. The photoacid generation catalyst, the photobase generating catalyst, the photoacid generator, and the photobase generator are not particularly limited as described above. The above-mentioned catalyst is preferably used in the sol particle liquid containing the pulverized material before being coated, or preferably as a mixed liquid in which the above-mentioned catalyst is mixed in a solvent. The mixed liquid may be, for example, a coating liquid dissolved in the sol particle liquid, a solution in which the catalyst is dissolved in a solvent, or a dispersion in which the catalyst is dispersed in a solvent. The solvent is not particularly limited as described above, and examples thereof include various organic solvents, water, and buffer solutions.

前述觸媒存在下之化學反應可藉由下述方式進行,例如:對含有事先已添加於前述溶膠粒子液之前述觸媒的前述塗覆膜進行光照射或加熱;或對前述塗覆膜噴附前述觸媒後進行光照射或加熱;又或是在噴附前述觸媒的同時進行光照射或加熱。例如當前述觸媒為光活性觸媒時,藉由光照射可使前述微細孔粒子彼此行化學結合而形成前述多孔體。又,當前述觸媒為熱活性觸媒時,藉由加熱可使前述微細孔粒子彼此行化學結合而形成前述多孔體。前述光照射之累積光量(能量)並無特別限定,在@ 360nm換算下例如為200~800mJ/cm2、250~600mJ/cm2或 300~400mJ/cm2。為了防止因為照射量不足使利用觸媒產生劑之光吸收的分解無法進展而效果不彰,以200mJ/cm2以上之累積光量為佳。此外,基於防止空隙層下之基材受損傷產生熱皺痕的觀點,以800mJ/cm2以下之累積光量為佳。前述加熱處理之條件無特別限制,前述加熱溫度例如為50~250℃、60~150℃、70~130℃,前述加熱時間例如為0.1~30分、0.2~10分、0.3~3分。此外,關於可使用的溶劑,例如當目的為抑制乾燥時隨溶劑揮發而產生的收縮應力、及隨之而來的空隙層之裂痕現象時,以低表面張力的溶劑為佳。可舉如以異丙醇(IPA)為代表的低級醇、己烷、全氟己烷等,惟不受該等限定。 The chemical reaction in the presence of the catalyst may be carried out by, for example, irradiating or heating the coating film containing the catalyst previously added to the sol particle liquid; or spraying the coating film. Light irradiation or heating is carried out after the above-mentioned catalyst is attached; or light irradiation or heating is performed while spraying the aforementioned catalyst. For example, when the catalyst is a photoactive catalyst, the microporous particles can be chemically bonded to each other by light irradiation to form the porous body. Further, when the catalyst is a thermally active catalyst, the microporous particles are chemically bonded to each other by heating to form the porous body. The cumulative light amount (energy) of the light irradiation is not particularly limited, and is, for example, 200 to 800 mJ/cm 2 , 250 to 600 mJ/cm 2 or 300 to 400 mJ/cm 2 in terms of @360 nm. In order to prevent the decomposition of light absorption by the catalyst generating agent from progressing due to insufficient irradiation amount, the effect is not satisfactory, and the cumulative light amount of 200 mJ/cm 2 or more is preferable. Further, it is preferable to use a cumulative amount of light of 800 mJ/cm 2 or less from the viewpoint of preventing the substrate under the void layer from being damaged by thermal wrinkles. The conditions of the heat treatment are not particularly limited, and the heating temperature is, for example, 50 to 250 ° C, 60 to 150 ° C, and 70 to 130 ° C, and the heating time is, for example, 0.1 to 30 minutes, 0.2 to 10 minutes, or 0.3 to 3 minutes. Further, as the solvent which can be used, for example, when the purpose is to suppress the shrinkage stress caused by the volatilization of the solvent during drying, and the subsequent cracking of the void layer, a solvent having a low surface tension is preferred. For example, a lower alcohol represented by isopropyl alcohol (IPA), hexane, perfluorohexane or the like can be used, but it is not limited thereto.

以上述方式可製造本發明之空隙結構薄膜,惟本發明之製造方法不受此限定。 The void structure film of the present invention can be produced in the above manner, but the production method of the present invention is not limited thereto.

此外,亦可對製得之本發明之空隙結構薄膜進行例如行加熱熟化等處理以提升強度的強度提升步驟(以下有時亦稱「熟化步驟」)。例如,在樹脂薄膜上積層有本發明之空隙結構薄膜的情況下,藉由前述強度提升步驟(熟化步驟)可提升相對於前述樹脂薄膜的黏著剝離強度。在前述強度提升步驟(熟化步驟)中,例如可將本發明之聚矽氧多孔體加熱。前述熟化步驟之溫度例如為40~80℃、50~70℃、55~65℃。前述反應之時間例如為5~30hr、7~25hr或10~20hr。在前述熟化步驟中,例如藉由將加熱溫度設為低溫,可抑制前述聚矽氧多孔體收縮的同時可提升黏著剝離強度,進而達成兼具高空隙率及強度兩者。 In addition, the obtained void structure film of the present invention may be subjected to a treatment such as heating and aging to increase the strength (hereinafter sometimes referred to as "curing step"). For example, in the case where the void structure film of the present invention is laminated on the resin film, the adhesion peeling strength with respect to the resin film can be improved by the strength increasing step (aging step). In the aforementioned strength increasing step (aging step), for example, the porous polysiloxane porous body of the present invention can be heated. The temperature of the ripening step is, for example, 40 to 80 ° C, 50 to 70 ° C, and 55 to 65 ° C. The time of the aforementioned reaction is, for example, 5 to 30 hr, 7 to 25 hr, or 10 to 20 hr. In the aging step, for example, by setting the heating temperature to a low temperature, it is possible to suppress the shrinkage of the porous polysiloxane porous body and to improve the adhesion peeling strength, thereby achieving both high void ratio and strength.

在前述強度提升步驟(熟化步驟)中萌發的現象及機制不明,吾等認為係因為例如藉由本發明之空隙結構薄膜中所含觸媒,使前述微細孔粒子彼此之化學結合(例如交聯反應)進一步發展而提升強度。就具體例而言,當前述微細孔粒子為矽化合物之微細孔粒子(例如凝膠狀二氧化矽化合物之粉碎體)且前述聚矽氧多孔體中有殘留矽烷醇基(OH基)存在時,前述殘留矽烷醇基彼此會藉由交聯反應進行化學結合。另外,本發明之空隙結構薄膜中所含觸媒並無特別限定,例如可為前述結合步驟中所採用的觸媒,亦可為前述結合步驟中所採用的光鹼產生觸媒藉由光照射所產生的鹼性物質,或可為前述結合步驟中所採用的光酸產生觸媒藉由光照射所產生的酸性物質等。惟,此說明為示例,不限制本發明。 The phenomenon and mechanism of germination in the strength-increasing step (aging step) are not known, and it is considered that the microporous particles are chemically bonded to each other (for example, by crosslinking reaction) by, for example, a catalyst contained in the void structure film of the present invention. ) Further development to increase strength. In a specific example, when the fine pore particles are fine pore particles of a ruthenium compound (for example, a pulverized body of a gel-like ruthenium dioxide compound) and a residual stanol group (OH group) is present in the polysiloxane porous body, The aforementioned residual stanol groups are chemically bonded to each other by a crosslinking reaction. Further, the catalyst contained in the void structure film of the present invention is not particularly limited, and may be, for example, a catalyst used in the above-mentioned bonding step, or may be a photobase generating catalyst used in the above-mentioned bonding step by light irradiation. The alkaline substance to be produced may be an acidic substance produced by light irradiation of a photoacid generating catalyst used in the above-mentioned bonding step, or the like. However, this description is by way of example and does not limit the invention.

此外,亦可於本發明之空隙結構薄膜上進一步形成黏接著層(黏接著層形成步驟)。具體上,例如亦可藉由於本發明之聚矽氧多孔體上塗佈(塗覆)黏著劑或接著劑而形成前述黏接著層。又,亦可將基材上積層有前述黏接著層之黏著膠帶等的前述黏接著層側貼合至本發明之聚矽氧多孔體上,藉此於本發明之聚矽氧多孔體上形成前述黏接著層。此時,前述黏著膠帶等之基材可直接維持在貼合的狀態下,亦可自前述黏接著層剝離。在本發明中,「黏著劑」及「黏著層」例如係指以被黏體之再剝離為前提之劑或層。本發明中,「接著劑」及「接著層」例如係指不以被黏體之再剝離為前提之劑或層。惟,本發明中,「黏 著劑」及「接著劑」並非可明確區別者,「黏著層」及「接著層」亦非可明確區別者。在本發明中,形成前述黏接著層之黏著劑或接著劑並無特別限定,例如可使用一般的黏著劑或接著劑等。前述黏著劑或接著劑可舉如丙烯酸系、乙烯醇系、聚矽氧系、聚酯系、聚胺甲酸乙酯系、聚醚系等聚合物製接著劑及橡膠系接著劑等。此外,亦可列舉由戊二醛、三聚氰胺、草酸等乙烯醇系聚合物之水溶性交聯劑等構成的接著劑等。該等黏著劑及接著劑可僅使用1種,亦可將複數種類併用(例如混合、積層等)。前述黏接著層之厚度並無特別限制,例如為0.1~100μm、5~50μm、10~30μm、或12~25μm。 Further, an adhesive layer (adhesive layer forming step) may be further formed on the void structure film of the present invention. Specifically, for example, the above-mentioned adhesive layer may be formed by coating (coating) an adhesive or an adhesive on the porous polysiloxane porous body of the present invention. Further, the adhesive layer side of the adhesive tape or the like in which the adhesive layer is laminated on the substrate may be bonded to the porous polysiloxane porous body of the present invention, thereby forming on the polysiloxane porous body of the present invention. The aforementioned adhesive layer. In this case, the base material such as the adhesive tape may be directly adhered to the bonded state, or may be peeled off from the adhesive layer. In the present invention, the "adhesive" and the "adhesive layer" mean, for example, an agent or a layer which is premised on the re-peeling of the adherend. In the present invention, the "adhesive agent" and the "adhesive layer" mean, for example, an agent or a layer which is not premised on the adherend. However, in the present invention, "sticky "Ingredients" and "adhesives" are not clearly distinguishable, and "adhesive layer" and "adhesive layer" are not clearly distinguishable. In the present invention, the adhesive or the adhesive for forming the adhesive layer is not particularly limited, and for example, a general adhesive or an adhesive can be used. Examples of the pressure-sensitive adhesive or the adhesive include a polymer-based adhesive such as an acrylic, vinyl alcohol, polyoxymethylene, polyester, polyurethane, or polyether, and a rubber-based adhesive. Further, an adhesive agent composed of a water-soluble crosslinking agent such as a vinyl alcohol polymer such as glutaraldehyde, melamine or oxalic acid may be used. These adhesives and adhesives may be used alone or in combination of plural types (for example, mixing, lamination, etc.). The thickness of the adhesive layer is not particularly limited and is, for example, 0.1 to 100 μm, 5 to 50 μm, 10 to 30 μm, or 12 to 25 μm.

另外,亦可使本發明之空隙結構薄膜與前述黏接著層進行反應,而形成配置在本發明之空隙結構薄膜與前述黏接著層之中間的中間層(中間層形成步驟)。藉由前述中間層,例如可使本發明之空隙結構薄膜不容易與前述黏接著層剝離。其理由(機制)不明,推測係因為前述中間層之投錨性(投錨效果)所致。前述投錨性(投錨效果)係指在前述空隙層與前述中間層之界面附近,前述中間層呈現嵌入前述空隙層內部之結構,因而使前述界面被牢固固定的現象(效果)。惟,其理由(機制)僅為推測之理由(機制)一例,無法限定本發明。本發明之聚矽氧多孔體與前述黏接著層之反應亦無特別限定,例如可為藉由觸媒作用之反應。前述觸媒亦可為例如本發明之聚矽氧多孔體中所含的觸媒。具體上,例如可為前述結合步驟中所採用的觸媒, 或可為前述結合步驟中所採用的光鹼產生觸媒藉由光照射所產生的鹼性物質,又或可為前述結合步驟中所採用的光酸產生觸媒藉由光照射所產生的酸性物質等。又,本發明之空隙結構薄膜與前述黏接著層之反應例如可為可生成新的化學鍵之反應(例如交聯反應)。前述反應之溫度例如為40~80℃、50~70℃、55~65℃。前述反應之時間例如為5~30hr、7~25hr或10~20hr。又,該中間層形成步驟亦可兼作用以提升本發明之聚矽氧多孔體強度的前述強度提升步驟(熟化步驟)。 Further, the void structure film of the present invention may be reacted with the adhesive layer to form an intermediate layer (intermediate layer forming step) disposed between the void structure film of the present invention and the adhesive layer. By the intermediate layer, for example, the void structure film of the present invention can be prevented from being peeled off from the above-mentioned adhesive layer. The reason (mechanism) is unknown, and it is presumed that it is due to the anchoring property (the anchoring effect) of the aforementioned intermediate layer. The anchoring property (anchoring effect) refers to a phenomenon in which the intermediate layer is embedded in the inside of the void layer in the vicinity of the interface between the void layer and the intermediate layer, so that the interface is firmly fixed (effect). However, the reason (mechanism) is only an example of the reason (mechanism) of speculation, and the present invention cannot be limited. The reaction of the porous polysiloxane porous body of the present invention and the above-mentioned adhesive layer is not particularly limited, and for example, it may be a reaction by a catalyst. The catalyst may be, for example, a catalyst contained in the porous polysiloxane body of the present invention. Specifically, for example, the catalyst used in the foregoing bonding step may be used. Or the alkaline substance generated by the photo-base generating catalyst used in the above-mentioned bonding step by light irradiation, or the acidity generated by the photo-acid generating catalyst used in the above-mentioned bonding step by light irradiation may be used. Substance and so on. Further, the reaction of the void structure film of the present invention with the above-mentioned adhesive layer may be, for example, a reaction (for example, a crosslinking reaction) in which a new chemical bond can be formed. The temperature of the above reaction is, for example, 40 to 80 ° C, 50 to 70 ° C, and 55 to 65 ° C. The time of the aforementioned reaction is, for example, 5 to 30 hr, 7 to 25 hr, or 10 to 20 hr. Further, the intermediate layer forming step may also serve to enhance the strength increasing step (aging step) of the strength of the polysiloxane porous body of the present invention.

以上述方式製得之本發明之空隙結構薄膜例如可進一步與其它薄膜(層)積層而形成含有前述多孔質結構的積層結構體。此時,在前述積層結構體中,各構成要素例如可藉黏著劑或接著劑積層。 The void structure film of the present invention obtained in the above manner can be further laminated with another film (layer) to form a laminated structure containing the porous structure. In this case, in the laminated structure, each constituent element may be laminated by, for example, an adhesive or an adhesive.

基於效率,前述各構成要素之積層例如可藉由使用長條薄膜的連續處理(所謂的輥對輥(Roll to Roll)等)進行積層,當基材為成形物‧元件等時,亦可將經過分批處理者予以積層。 The laminate of the above-described respective constituent elements can be laminated by, for example, a continuous treatment using a long film (so-called roll to roll), and the like, when the substrate is a molded article, a component, or the like, After batch processing, the layers are stacked.

以下針對於基材上形成前述本發明之空隙結構薄膜的方法,使用圖1~3舉例說明連續處理步驟。另外,在使用途1~3及後述之圖6~8及9~11的說明中,係以空隙結構薄膜為聚矽氧多孔體之情況為例作說明。但,本發明之空隙結構薄膜為聚矽氧多孔體以外之物時,亦可以同樣方式利用連續處理步驟製造。此外,關於圖2係顯示製出前述聚矽氧多孔體後貼合保護薄膜並予以卷取之步驟, 在對另一機能性薄膜進行積層時可使用上述手法,亦可在塗覆另一機能性薄膜並予以乾燥後,於正要卷取前才貼合上述成膜後的前述聚矽氧多孔體。另外,圖示之製膜方式僅為一例,不受該等限定。 Hereinafter, a continuous processing step will be exemplified using FIGS. 1 to 3 for the method of forming the above-described void structure film of the present invention on a substrate. In addition, in the description of the use of the first to third and the following FIGS. 6 to 8 and 9 to 11, the case where the void structure thin film is a polysiloxane porous body will be described as an example. However, when the void structure film of the present invention is a material other than the polysiloxane porous body, it can be produced in the same manner by a continuous treatment step. Further, FIG. 2 shows a step of laminating the protective film and winding it after the porous polysiloxane body is produced. When the other functional film is laminated, the above method may be used, or after the other functional film is coated and dried, the film-forming porous polysiloxane body may be bonded before the film is being wound up. . In addition, the film formation method shown in the figure is only an example, and is not limited to these.

於圖1之截面圖中示意顯示在前述基材上形成前述聚矽氧多孔體之方法的步驟一例。圖1中,前述聚矽氧多孔體之形成方法包含:塗覆步驟(1),係將矽化合物之微細孔粒子的溶膠粒子液20”塗覆於基材10上;塗覆膜形成步驟(乾燥步驟)(2),係使溶膠粒子液20”乾燥而形成塗覆膜20”該塗覆膜20’為前述聚矽氧多孔體之前驅層;及化學處理步驟(例如交聯處理步驟)(3),係對塗覆膜20’進行化學處理(例如交聯處理)而形成聚矽氧多孔體20。以此方式可如圖示,於基材10上形成聚矽氧多孔體20。另外,前述聚矽氧多孔體之形成方法可適宜包含或可不包含前述步驟(1)~(3)以外之步驟。 An example of the procedure of the method of forming the above-mentioned polyfluorinated porous body on the substrate is schematically shown in the cross-sectional view of Fig. 1. In Fig. 1, the method for forming a porous polysiloxane porous body comprises: a coating step (1) of applying a sol particle liquid 20" of fine pore particles of a cerium compound to a substrate 10; and a coating film forming step ( a drying step) (2), wherein the sol particle liquid 20" is dried to form a coating film 20", the coating film 20' is the precursor layer of the polyfluorene oxide body; and a chemical treatment step (for example, a crosslinking treatment step) (3) The chemical treatment (for example, cross-linking treatment) of the coating film 20' is performed to form the porous polysiloxane porous body 20. In this manner, the polysiloxane porous body 20 can be formed on the substrate 10 as shown. Further, the method for forming the porous polysiloxane porous body may or may not include the steps other than the above steps (1) to (3).

在前述塗覆步驟(1)中,溶膠粒子液20”之塗覆方法並無特別限定,可採用一般的塗覆方法。前述塗覆方法可舉如狹縫式模塗(slot die)法、反向凹版塗佈(reverse gravure coat)法、微凹版(micro gravure)法(微凹版塗佈(micro gravure coat)法)、浸漬法(浸漬塗佈法)、旋塗法、刷塗法、輥塗法、柔版印刷法、線棒塗佈法、噴塗法、擠壓塗佈法、淋幕式塗佈法、反向塗佈法等。該等中,基於生產性、塗膜之平滑性等觀點,以擠壓塗佈法、淋幕式塗佈法、輥塗法、微凹版塗佈法等為佳。前述溶膠粒子液 20”之塗覆量並無特別限定,例如可以使多孔質結構(聚矽氧多孔體)20成為適當厚度的方式予以適宜設定。多孔質結構(聚矽氧多孔體)20之厚度並無特別限定,可如同前述。 In the coating step (1), the coating method of the sol particle liquid 20" is not particularly limited, and a general coating method may be employed. The coating method may be, for example, a slot die method. Reverse gravure coat method, micro gravure method (micro gravure coat method), dipping method (dip coating method), spin coating method, brush coating method, roll Coating method, flexographic printing method, wire bar coating method, spray coating method, extrusion coating method, curtain coating method, reverse coating method, etc., among these, based on productivity, smoothness of coating film From the viewpoints of the extrusion coating method, the curtain coating method, the roll coating method, the micro gravure coating method, etc., the aforementioned sol particle liquid The coating amount of the 20" is not particularly limited. For example, the porous structure (polyphosphorus porous body) 20 can be appropriately set to have a suitable thickness. The thickness of the porous structure (polyphosphorus porous body) 20 is not particularly limited. Limited, as described above.

在前述乾燥步驟(2)中,將溶膠粒子液20”乾燥(即去除溶膠粒子液20”中所含分散介質)而形成塗覆膜(前驅層)20’。乾燥處理之條件並無特別限定,就如同前述。 In the drying step (2), the sol particle liquid 20" is dried (i.e., the dispersion medium contained in the sol particle liquid 20) is removed to form a coating film (precursor layer) 20'. The conditions of the drying treatment are not particularly limited as described above.

此外,在前述化學處理步驟(3)中,對塗覆前所添加之含有前述觸媒(例如,光活性觸媒或KOH等熱活性觸媒)的塗覆膜20’進行光照射或加熱,使塗覆膜(前驅物)20’中之前述粉碎物彼此行化學結合(例如進行交聯)而形成聚矽氧多孔體20。前述化學處理步驟(3)之光照射或加熱條件無特別限定,就如同前述。 Further, in the chemical treatment step (3), the coating film 20' containing the catalyst (for example, a photoactive catalyst or a thermally active catalyst such as KOH) added before the coating is irradiated or heated by light, The pulverized material in the coating film (precursor) 20' is chemically bonded to each other (for example, crosslinked) to form a polysiloxane porous body 20. The light irradiation or heating conditions of the chemical treatment step (3) are not particularly limited as described above.

接著,於圖2示意顯示狹縫式模塗法之塗覆裝置及使用其之前述聚矽氧多孔體之形成方法一例。另外,圖2雖為截面圖,但為了易讀性省略了影線。 Next, an example of a coating apparatus of a slit die coating method and a method of forming the above-mentioned polycrystalline oxygen porous body using the same will be schematically shown in Fig. 2 . In addition, although FIG. 2 is a cross-sectional view, hatching is omitted for ease of reading.

如圖示,使用該裝置之方法的各步驟係藉由輥件將基材10朝一方向搬送的同時一邊進行。搬送速度無特別限定,例如為1~100m/分、3~50m/分、5~30m/分。 As shown, each step of the method using the apparatus is carried out while the substrate 10 is being conveyed in one direction by a roll member. The transport speed is not particularly limited, and is, for example, 1 to 100 m/min, 3 to 50 m/min, and 5 to 30 m/min.

首先,從送出輥101旋出基材10的同時一邊進行搬送,並在塗覆輥102進行於基材10上塗覆溶膠粒子液20”的塗覆步驟(1)後,接著在烘箱區110內移到乾燥步驟(2)。在圖2之塗覆裝置中,係於塗覆步驟(1)後在乾燥步驟(2)前先進行預乾燥步驟。預乾燥步驟可不經過加熱,在室溫下 進行。在乾燥步驟(2)中會使用加熱機構111。加熱機構111如同前述,可適宜使用熱風器、加熱輥、遠紅外線加熱器等。此外,例如可將乾燥步驟(2)分成複數個步驟,令乾燥溫度隨著後續的乾燥步驟愈來愈高。 First, the transfer roller 101 is carried out while the substrate 10 is unscrewed, and after the coating roller 102 performs the coating step (1) of coating the sol particle liquid 20 on the substrate 10, it is then in the oven zone 110. Move to the drying step (2). In the coating device of Figure 2, the pre-drying step is performed before the drying step (2) after the coating step (1). The pre-drying step may be performed without heating, at room temperature. get on. The heating mechanism 111 is used in the drying step (2). As described above, the heating mechanism 111 can suitably use a hot air heater, a heating roller, a far infrared heater or the like. Further, for example, the drying step (2) can be divided into a plurality of steps such that the drying temperature becomes higher as the subsequent drying step becomes higher.

於乾燥步驟(2)後,在化學處理區120內進行化學處理步驟(3)。在化學處理步驟(3)中,例如當乾燥後之塗覆膜20’含有光活性觸媒時,係以配置在基材10上下的燈(光照射機構)121進行光照射。或者,例如在乾燥後之塗覆膜20’含有熱活性觸媒時,使用熱風器(加熱機構)取代燈(光照射裝置)121,以配置在基材10上下的熱風器121將基材10加熱。藉由此交聯處理,可引發塗覆膜20’中前述粉碎物彼此的化學結合,使聚矽氧多孔體20硬化‧強化。另外,亦適宜使用紫外線照射器來替代熱風器。然後,於化學處理步驟(3)後藉由卷取輥105卷取基材10上形成有聚矽氧多孔體20之積層體。另外,在圖2中,前述積層體之聚矽氧多孔體20係受由輥件106旋出之保護片被覆保護。在此,亦可使由長條薄膜形成的其它層積層於多孔質結構20上,來替代前述保護片。 After the drying step (2), the chemical treatment step (3) is carried out in the chemical treatment zone 120. In the chemical treatment step (3), for example, when the coated film 20' after drying contains a photoactive catalyst, light is irradiated with a lamp (light irradiation means) 121 disposed above and below the substrate 10. Alternatively, for example, when the coated film 20' after drying contains a thermally active catalyst, a heater (heating means) is used instead of the lamp (light irradiation means) 121 to arrange the substrate 10 on the upper and lower sides of the substrate 10 heating. By this crosslinking treatment, chemical bonding of the above-mentioned pulverized materials in the coating film 20' can be initiated, and the polysiloxane porous body 20 can be hardened and strengthened. In addition, it is also suitable to use an ultraviolet illuminator instead of the air blaster. Then, after the chemical treatment step (3), the laminate of the porous polysiloxane porous body 20 is wound up on the substrate 10 by the take-up roll 105. Further, in Fig. 2, the polycrystalline porous oxygen body 20 of the above-mentioned laminated body is covered and protected by a protective sheet which is unwound by the roller member 106. Here, other laminated layers formed of a long film may be laminated on the porous structure 20 instead of the protective sheet.

於圖3示意顯示微凹版法(微凹版塗佈法)之塗覆裝置及使用其之前述多孔質結構的形成方法一例。另外,同圖雖為截面圖,但為了易讀性省略了影線。 Fig. 3 is a view schematically showing an example of a coating apparatus for a micro gravure method (microgravure coating method) and a method for forming the above porous structure using the same. In addition, although the same figure is a cross-sectional view, hatching is omitted for ease of reading.

如圖示,使用該裝置之方法的各步驟與圖2同樣地係藉由輥件將基材10朝一方向搬送的同時一邊進行。搬送速度無特別限定,例如為1~100m/分、3~50m/分、5~ 30m/分。 As shown in the figure, each step of the method using the apparatus is carried out while the substrate 10 is being conveyed in one direction by a roller member as in the case of Fig. 2 . The transport speed is not particularly limited, and is, for example, 1 to 100 m/min, 3 to 50 m/min, and 5~ 30m/min.

首先,從送出輥201旋出基材10的同時一邊進行搬送,施行於基材10上塗覆溶膠粒子液20”的塗覆步驟(1)。溶膠粒子液20”之塗覆如圖示,係利用儲液區202、刮刀(doctor knife)203及微凹版204進行。具體上,使儲留在儲液區202中的溶膠粒子液20”附著於微凹版204表面,再以刮刀203控制成預定的厚度並同時以微凹版204塗覆於基材10表面。另外,微凹版204為示例,不受此限定,亦可使用其它的任意塗覆機構。 First, the coating step (1) of applying the sol particle liquid 20" to the substrate 10 is carried out while the substrate 10 is unscrewed from the delivery roller 201. The coating of the sol particle liquid 20" is as shown in the drawing. This is carried out using a reservoir area 202, a doctor knife 203, and a micro gravure 204. Specifically, the sol particle liquid 20" stored in the liquid storage area 202 is attached to the surface of the micro gravure 204, and then controlled to a predetermined thickness by the doctor blade 203 while being applied to the surface of the substrate 10 by the micro gravure 204. The micro gravure 204 is exemplified, and is not limited thereto, and any other coating mechanism may be used.

接下來進行乾燥步驟(2)。具體上,如圖示在烘箱區210中搬送已塗覆溶膠粒子液20”之基材10並藉由烘箱區210內之加熱機構211加熱、進行乾燥。加熱機構211例如亦可與圖2相同。又,例如亦可藉由將烘箱區210分成複數個區塊,使乾燥步驟(2)分成複數個步驟,令乾燥溫度隨著後續的乾燥步驟愈來愈高。於乾燥步驟(2)後,在化學處理區220內進行化學處理步驟(3)。在化學處理步驟(3)中,例如當乾燥後之塗覆膜20’含有光活性觸媒時,係以配置在基材10上下的燈(光照射機構)221進行光照射。或者,例如當乾燥後之塗覆膜20’含有熱活性觸媒時,會使用熱風器(加熱機構)來替代燈(光照射裝置)221,以配置在基材10下方的熱風器(加熱機構)221將基材10加熱。藉由該交聯處理,可激發塗覆膜20’中之前述粉碎物彼此的化學結合,形成聚矽氧多孔體20。 Next, the drying step (2) is carried out. Specifically, the substrate 10 coated with the sol particle liquid 20" is transported in the oven zone 210 and heated by the heating mechanism 211 in the oven zone 210. The heating mechanism 211 can be, for example, the same as in FIG. Moreover, for example, the drying step (2) can be divided into a plurality of steps by dividing the oven zone 210 into a plurality of blocks, so that the drying temperature is higher with the subsequent drying step. After the drying step (2) The chemical treatment step (3) is carried out in the chemical treatment zone 220. In the chemical treatment step (3), for example, when the dried coating film 20' contains a photoactive catalyst, it is disposed above and below the substrate 10. The lamp (light irradiation means) 221 performs light irradiation. Alternatively, for example, when the coated film 20' after drying contains a thermally active catalyst, a heater (heating means) is used instead of the lamp (light irradiation means) 221 to configure The substrate 10 is heated by a hot air heater (heating mechanism) 221 under the substrate 10. By the crosslinking treatment, the chemical combination of the pulverized materials in the coating film 20' can be excited to form the polysiloxane porous body 20 .

然後,於化學處理步驟(3)後藉由卷取輥251卷 取基材10上形成有聚矽氧多孔體20之積層體。其後,亦可於前述積層體上積層其它層。又,藉由卷取輥251卷取前述積層體之前,亦可於前述積層體積層其它層。 Then, after the chemical treatment step (3), the roll is taken up by the take-up roll 251. A laminate of the porous polysiloxane porous body 20 is formed on the substrate 10. Thereafter, other layers may be laminated on the laminate. Further, before the above-mentioned laminated body is wound up by the take-up roll 251, the other layers of the laminated volume layer may be formed.

另外,於圖6~8顯示形成本發明之聚矽氧多孔體之方法的連續處理步驟之另一例。如同圖6之截面圖顯示,此方法係於形成聚矽氧多孔體20之化學處理步驟(例如交聯處理步驟)(3)後進行強度提升步驟(熟化步驟)(4),除此以外與圖1~3顯示之方法相同。如圖6顯示,在強度提升步驟(熟化步驟)(4)中使聚矽氧多孔體20之強度提升,製出強度增強的聚矽氧多孔體21。強度提升步驟(熟化步驟)(4)並無特別限定,如同前言所述。 Further, another example of the continuous processing step of the method of forming the porous polysiloxane porous body of the present invention is shown in Figs. As shown in the cross-sectional view of FIG. 6, the method is performed after the chemical treatment step (for example, the crosslinking treatment step) (3) of forming the polysiloxane porous body 20, and then the strength upgrading step (aging step) (4) is performed. The methods shown in Figures 1~3 are the same. As shown in Fig. 6, in the strength increasing step (aging step) (4), the strength of the polysiloxane porous body 20 is increased to produce a strength-enhanced polysiloxane porous body 21. The strength increasing step (aging step) (4) is not particularly limited as described in the introduction.

圖7係一示意圖,其顯示有別於圖2之狹縫式模塗法之塗覆裝置及使用其之前述聚矽氧多孔體之形成方法的另一例。如同圖示,該塗覆裝置於進行化學處理步驟(3)之化學處理區120後緊接著具有進行強度提升步驟(熟化步驟)(4)的強度提升區(熟化區)130,除此以外與圖2之裝置相同。即,於化學處理步驟(3)後在強度提升區(熟化區)130內進行強度提升步驟(熟化步驟)(4),提升聚矽氧多孔體20相對於樹脂薄膜10的黏著剝離強度,而形成黏著剝離強度增強的聚矽氧多孔體21。強度提升步驟(熟化步驟)(4)例如亦可使用配置在基材10上下的熱風器(加熱機構)131,以前述方式將聚矽氧多孔體20加熱來進行。加熱溫度、時間等並無特別限定,如同前言所述。其後,與圖3同樣地藉由卷取輥105卷取在基材10上形成有聚矽氧多孔體21的積層 薄膜。 Fig. 7 is a schematic view showing another example of a coating apparatus different from the slit type die coating method of Fig. 2 and a method of forming the above-mentioned polyfluorinated porous body using the same. As shown, the coating device is followed by a chemical treatment zone 120 of the chemical treatment step (3) followed by a strength enhancement zone (maturing zone) 130 for performing a strength enhancement step (aging step) (4), in addition to The device of Figure 2 is identical. That is, after the chemical treatment step (3), a strength-increasing step (aging step) (4) is performed in the strength-enhancing region (curing zone) 130 to enhance the adhesion peel strength of the polysiloxane porous body 20 with respect to the resin film 10, and A polysiloxane porous body 21 having an enhanced adhesion peeling strength is formed. The strength increasing step (aging step) (4) can be carried out by heating the polysiloxane porous body 20 in the above-described manner using a hot air heater (heating means) 131 disposed above and below the substrate 10. The heating temperature, time, and the like are not particularly limited as described in the introduction. Thereafter, in the same manner as in Fig. 3, a laminate of the porous polysiloxane porous body 21 formed on the substrate 10 is taken up by the take-up roll 105. film.

圖8係一示意圖,其顯示有別於圖3之微凹版法(微凹版塗佈法)之塗覆裝置及使用其之前述多孔質結構之形成方法的另一例。如同圖示,該塗覆裝置於進行化學處理步驟(3)之化學處理區220後緊接著具有進行強度提升步驟(熟化步驟)(4)的強度提升區(熟化區)230,除此以外與圖3之裝置相同。即,於化學處理步驟(3)後在強度提升區(熟化區)230內進行強度提升步驟(熟化步驟)(4),提升聚矽氧多孔體20相對於樹脂薄膜10的黏著剝離強度,而形成黏著剝離強度增強的聚矽氧多孔體21。強度提升步驟(熟化步驟)(4)例如亦可使用配置在基材10上下的熱風器(加熱機構)231,以前述方式將聚矽氧多孔體20加熱來進行。加熱溫度、時間等並無特別限定,如同前言所述。其後,與圖3同樣地藉由卷取輥251卷取在基材10上形成有聚矽氧多孔體21的積層薄膜。 Fig. 8 is a schematic view showing another example of a coating apparatus different from the micro-gravure method (microgravure coating method) of Fig. 3 and a method of forming the above-described porous structure using the same. As shown, the coating device is followed by a chemical treatment zone 220 of the chemical treatment step (3) followed by a strength enhancement zone (maturing zone) 230 for performing a strength enhancement step (aging step) (4), in addition to The device of Figure 3 is the same. That is, after the chemical treatment step (3), a strength-increasing step (aging step) (4) is performed in the strength-enhancing region (aging zone) 230 to enhance the adhesion peeling strength of the polysiloxane porous body 20 with respect to the resin film 10, and A polysiloxane porous body 21 having an enhanced adhesion peeling strength is formed. The strength increasing step (aging step) (4) can be carried out by heating the polysiloxane porous body 20 in the above-described manner by using a hot air heater (heating means) 231 disposed above and below the substrate 10. The heating temperature, time, and the like are not particularly limited as described in the introduction. Thereafter, a laminated film in which the porous polysiloxane porous body 21 is formed on the substrate 10 is wound by the take-up roll 251 in the same manner as in FIG.

又,於圖9~11顯示形成本發明之聚矽氧多孔體之方法的連續處理步驟之另一例。如圖9之截面圖所示,此方法於形成聚矽氧多孔體20之化學處理步驟(例如交聯處理步驟)(3)後包含;於聚矽氧多孔體20上塗覆黏接著層30的黏接著層塗覆步驟(黏接著層形成步驟)(4)、及使聚矽氧多孔體20與黏接著層30起反應而形成中間層22的中間層形成步驟(5)。該等以外,圖9~11之方法與圖6~8顯示之方法相同。又,在圖9中,中間層形成步驟(5)兼作提升聚矽氧多孔體20之強度的步驟(強度提升步驟),於中間層形 成步驟(5)以後聚矽氧多孔體20即晉身為強度增強的聚矽氧多孔體21。惟,本發明不受此限定,例如在中間層形成步驟(5)後聚矽氧多孔體20也可沒有變化。黏接著層塗覆步驟(黏接著層形成步驟)(4)及中間層形成步驟(5)並無特別限定,如同前言所述。 Further, another example of the continuous processing step of the method of forming the porous polysiloxane porous body of the present invention is shown in Figs. As shown in the cross-sectional view of FIG. 9, the method is included after the chemical treatment step (for example, the crosslinking treatment step) (3) of forming the polysiloxane porous body 20; and the adhesive layer 30 is coated on the polysiloxane porous body 20. The adhesive layer coating step (adhesive layer formation step) (4), and the intermediate layer forming step (5) of reacting the polysiloxane porous body 20 with the adhesive layer 30 to form the intermediate layer 22. In addition to these, the methods of Figures 9-11 are the same as those shown in Figures 6-8. Further, in Fig. 9, the intermediate layer forming step (5) also serves as a step of increasing the strength of the polysiloxane porous body 20 (strength enhancing step) in the intermediate layer shape. After the step (5), the polysiloxane porous body 20 is promoted to be a strength-enhanced polysiloxane porous body 21. However, the present invention is not limited thereto, and for example, the polysiloxane porous body 20 may not be changed after the intermediate layer forming step (5). The adhesive adhesion layer coating step (adhesive layer formation step) (4) and the intermediate layer formation step (5) are not particularly limited as described in the introduction.

圖10係一示意圖,其顯示狹縫式模塗法之塗覆裝置及使用其之前述聚矽氧多孔體之形成方法的又另一例。如同圖示,該塗覆裝置於進行化學處理步驟(3)之化學處理區120後緊接著具有進行黏接著層塗覆步驟(4)之黏接著層塗覆區130a,除此以外與圖7之裝置相同。同圖中,緊接著配置在黏接著層塗覆區130a後方的中間層形成區(熟化區)130可藉由配置在基材10上下的熱風器(加熱機構)131,進行與圖7之強度提升區(熟化區)130同樣的加熱處理。即,在圖10之裝置中係於化學處理步驟(3)後進行黏接著層塗覆步驟(黏接著層形成步驟)(4),即,在黏接著層塗覆區130a內藉由黏接著層塗覆機構131a於聚矽氧多孔體20上塗佈(塗覆)黏著劑或接著劑,而形成黏接著層30。又,如同前述,亦可以具有黏接著層30之黏著膠帶等的貼合(貼附),來替代黏著劑或接著劑之塗佈(塗覆)。再來,在中間層形成區(熟化區)130內進行中間層形成步驟(熟化步驟)(5),使聚矽氧多孔體20與黏接著層30起反應而形成中間層22。又,如同前述,在此步驟中聚矽氧多孔體20會成為強度增強的聚矽氧多孔體21。利用熱風器(加熱機構)131的加熱溫度、時間等並無特別限定,如同前言所 述。 Fig. 10 is a schematic view showing still another example of a coating apparatus of a slit type die coating method and a method of forming the above-mentioned polyfluorinated porous body using the same. As shown, the coating apparatus is followed by the chemical treatment zone 120 of the chemical treatment step (3), followed by the adhesive layer coating zone 130a for the adhesive layer coating step (4), and FIG. 7 The device is the same. In the same figure, the intermediate layer forming region (curing zone) 130 disposed immediately behind the adhesive layer coating region 130a can be made to have the strength with FIG. 7 by a hot air heater (heating mechanism) 131 disposed above and below the substrate 10. The lifting zone (maturation zone) 130 is subjected to the same heat treatment. That is, in the apparatus of FIG. 10, after the chemical treatment step (3), an adhesive layer coating step (adhesive layer formation step) (4) is performed, that is, by adhering in the adhesive layer coating region 130a. The layer coating mechanism 131a coats (coats) an adhesive or an adhesive on the polysiloxane porous body 20 to form an adhesive layer 30. Further, as described above, it is also possible to have a bonding (attaching) of an adhesive tape or the like of the adhesive layer 30 instead of applying (coating) an adhesive or an adhesive. Then, an intermediate layer forming step (aging step) (5) is performed in the intermediate layer forming region (curing region) 130, and the polysiloxane porous body 20 is reacted with the adhesive layer 30 to form the intermediate layer 22. Further, as described above, in this step, the polysiloxane porous body 20 becomes the strength-enhanced polysiloxane porous body 21. The heating temperature, time, and the like by the hot air heater (heating means) 131 are not particularly limited, as in the preface Said.

圖11係一示意圖,其顯示微凹版法(微凹版塗佈法)之塗覆裝置及使用其之前述多孔質結構之形成方法的又另一例。如同圖示,該塗覆裝置在進行化學處理步驟(3)之化學處理區220後緊接著具有進行黏接著層塗覆步驟(4)之黏接著層塗覆區230a,除此以外與圖8之裝置相同。同圖中,緊接著配置在黏接著層塗覆區230a後方的中間層形成區(熟化區)230可藉由配置在基材10上下的熱風器(加熱機構)231,進行與圖8之強度提升區(熟化區)230同樣的加熱處理。即,圖11之裝置中係於化學處理步驟(3)後進行黏接著層塗覆步驟(黏接著層形成步驟)(4),即,在黏接著層塗覆區230a內藉由黏接著層塗覆機構231a於聚矽氧多孔體20上塗佈(塗覆)黏著劑或接著劑,而形成黏接著層30。又,如同前述,亦可以具有黏接著層30之黏著膠帶等的貼合(貼附),來替代黏著劑或接著劑之塗佈(塗覆)。再來,在中間層形成區(熟化區)230內進行中間層形成步驟(熟化步驟)(5),使聚矽氧多孔體20與黏接著層30起反應而形成中間層22。又,如同前述,在此步驟中聚矽氧多孔體20會成為強度增強的聚矽氧多孔體21。利用熱風器(加熱機構)231的加熱溫度、時間等並無特別限定,如同前言所述。 Fig. 11 is a schematic view showing still another example of a coating apparatus of a micro gravure method (microgravure coating method) and a method of forming the foregoing porous structure using the same. As shown, the coating apparatus is followed by the chemical treatment zone 220 of the chemical treatment step (3), followed by the adhesive layer coating zone 230a for the adhesive layer coating step (4), and FIG. 8 The device is the same. In the same figure, the intermediate layer forming region (curing zone) 230 disposed immediately behind the adhesive layer coating region 230a can be made to have the strength with FIG. 8 by a hot air heater (heating mechanism) 231 disposed above and below the substrate 10. The lifting zone (maturing zone) 230 is subjected to the same heat treatment. That is, in the apparatus of Fig. 11, after the chemical treatment step (3), an adhesive layer coating step (adhesion layer formation step) (4) is performed, that is, by adhering the layer in the adhesion layer coating region 230a. The coating mechanism 231a coats (coats) an adhesive or an adhesive on the polysiloxane porous body 20 to form an adhesive layer 30. Further, as described above, it is also possible to have a bonding (attaching) of an adhesive tape or the like of the adhesive layer 30 instead of applying (coating) an adhesive or an adhesive. Then, an intermediate layer forming step (aging step) (5) is performed in the intermediate layer forming region (curing zone) 230, and the polysiloxane porous body 20 is reacted with the adhesive layer 30 to form the intermediate layer 22. Further, as described above, in this step, the polysiloxane porous body 20 becomes the strength-enhanced polysiloxane porous body 21. The heating temperature, time, and the like by the air heater (heating means) 231 are not particularly limited as described in the introduction.

[3.空隙結構薄膜之用途] [3. Use of void structure film]

本發明之空隙結構薄膜如前述可發揮例如與空氣層相同程度的機能,因此可取代前述空氣層來利用在具有前述 空氣層的對象物上。在本發明中,其特徵在於含有前述本發明之空隙結構薄膜,其它構成則不受任何限制。 The void structure film of the present invention can exhibit the same function as the air layer as described above, and therefore can be used in place of the air layer described above. On the object of the air layer. In the present invention, it is characterized by containing the above-mentioned void structure film of the present invention, and other constitutions are not subject to any limitation.

本發明可列舉特徵為含有前述空隙結構薄膜之絕熱材、吸音材、結露防止材、低折射率層等的光學構件等。該等本發明之構件為透明時,例如可配置在需要空氣層的部位作使用。該等構件之形態無特別限制,例如可為薄膜。 In the present invention, an optical member such as a heat insulating material, a sound absorbing material, a dew condensation preventing material, a low refractive index layer or the like containing the void structure film may be cited. When the members of the present invention are transparent, they can be disposed, for example, at a portion where an air layer is required. The form of the members is not particularly limited and may be, for example, a film.

又,本發明可舉如特徵為含有前述空隙結構薄膜的再生醫療用基材。前述基材例如為支架材(scaffold material)。如前述,本發明之空隙結構薄膜具有可發揮與空氣層相同程度之機能的多孔結構。前述空隙結構薄膜之空隙例如適於用來保持細胞、營養源、空氣等,因此本發明之空隙結構薄膜可有效作為例如再生醫療用的支架。 Moreover, the present invention may be a substrate for regenerative medical treatment characterized by containing the void structure film. The aforementioned substrate is, for example, a scaffold material. As described above, the void structure film of the present invention has a porous structure which exhibits the same function as the air layer. The voids of the void structure film are suitable, for example, for holding cells, nutrient sources, air, etc., and therefore the void structure film of the present invention can be effectively used as a stent for regenerative medicine, for example.

含有本發明之空隙結構薄膜的構件除了上述該等以外,還可舉如全反射構件、印墨影像接收材、單層AR(減反射)、單層蛾眼(moth eye)、介電係數材等。 The member containing the void structure film of the present invention may be, for example, a total reflection member, an ink image receiving material, a single layer AR (anti-reflection), a single layer moth eye, or a dielectric constant material in addition to the above. Wait.

實施例 Example

接下來,針對本發明之實施例加以說明。惟,本發明不受以下實施例限定。 Next, an embodiment of the present invention will be described. However, the invention is not limited by the following examples.

(實施例1) (Example 1)

在本實施例中,係以下述方式製造本發明之多孔質結構。 In the present embodiment, the porous structure of the present invention is produced in the following manner.

(1)矽化合物之凝膠化 (1) Gelation of bismuth compounds

於DMSO 2.2g中溶解矽化合物之前驅物MTMS 0.95g。 於前述混合液添加0.01mol/L之草酸水溶液0.5g,在室溫下攪拌30分使MTMS水解而生成參(羥)甲基矽烷。 The ruthenium compound precursor MTMS 0.95g was dissolved in 2.2 g of DMSO. 0.5 g of a 0.01 mol/L aqueous oxalic acid solution was added to the above mixture, and the mixture was stirred at room temperature for 30 minutes to hydrolyze MTMS to form hydroxymethyl decane.

於DMSO 5.5g添加28%濃度之氨水0.38g及純水0.2g後,再追加添入前述經水解處理的前述混合液,在室溫下攪拌15分,進行參(羥)甲基矽烷之凝膠化而獲得凝膠狀矽化合物。 After adding 0.38 g of 28% aqueous ammonia and 0.2 g of pure water to 5.5 g of DMSO, the above-mentioned hydrolyzed mixture was further added thereto, and stirred at room temperature for 15 minutes to carry out coagulation of hydroxymethyl decane. Gelatinized to obtain a gelatinous quinone compound.

(2)熟成處理 (2) ripening treatment

將前述經凝膠化處理的混合液直接在40℃下培育20小時,進行熟成處理。 The gelled mixture was directly incubated at 40 ° C for 20 hours to carry out a ripening treatment.

(3)粉碎處理 (3) crushing treatment

接著,使用刮勺將前述經熟成處理的凝膠狀矽化合物粉碎成數mm~數cm大小的顆粒狀。於此添加IPA 40g,稍作攪拌後在室溫下靜置6小時,傾析出凝膠中之溶劑及觸媒。同樣的傾析處理重複3次後,結束溶劑取代。然後對前述混合液中之前述凝膠狀矽化合物進行高壓無介質粉碎。此粉碎處理係使用均質機(商品名UH-50、SMT公司製),於5cc之螺旋瓶中秤量凝膠1.18g及IPA 1.14g後,在50W、20kHz之條件下粉碎2分鐘。 Next, the gelled cerium compound which has been subjected to the aging treatment is pulverized into pellets having a size of several mm to several cm using a spatula. 40 g of IPA was added thereto, and after stirring for a while, it was allowed to stand at room temperature for 6 hours, and the solvent and the catalyst in the gel were decanted. After the same decantation treatment was repeated 3 times, the solvent substitution was terminated. Then, the aforementioned gelatinous cerium compound in the above mixture is subjected to high-pressure medium-free pulverization. In the pulverization treatment, a homogenizer (trade name: UH-50, manufactured by SMT Co., Ltd.) was used, and 1.18 g of gel and 1.14 g of IPA were weighed in a 5 cc spiral bottle, and then pulverized at 50 W and 20 kHz for 2 minutes.

藉由前述粉碎處理將前述混合液中之前述凝膠狀矽化合物粉碎後,前述混合液即成為前述粉碎物之溶膠粒子液。以動態光散射式Nanotrac粒度分析計(日機裝公司製、UPA-EX150型)確認體積平均粒徑的結果得0.50~0.70,前述體積平均粒徑係表示前述混合液中所含前述粉碎物之粒度偏差。再來準備0.3重量%之KOH水溶液,於前 述溶膠粒子液0.5g添加0.02g之觸媒KOH,調製出塗覆液。 After the gelatinous ruthenium compound in the mixed liquid is pulverized by the pulverization treatment, the mixed liquid is a sol particle liquid of the pulverized product. The volume average particle diameter was 0.50 to 0.70 as determined by a dynamic light scattering type Nanotrac particle size analyzer (manufactured by Nikkiso Co., Ltd., UPA-EX150 type), and the volume average particle diameter indicates the pulverized material contained in the mixed liquid. Particle size deviation. Prepare a 0.3% by weight aqueous solution of KOH, before 0.5 g of the sol particle liquid was added to 0.02 g of catalyst KOH to prepare a coating liquid.

(4)形成塗覆膜及形成聚矽氧多孔體 (4) forming a coating film and forming a polysilicon porous body

接著,藉由棒塗法將前述塗工液塗佈於聚對苯二甲酸乙二酯(PET)製基材之表面上,形成塗覆膜。前述塗佈係設為前述基材表面每1mm2有6μL之前述溶膠粒子液。將前述塗覆膜在溫度100℃下處理1分後,結束前述粉碎物彼此的交聯反應。藉此,於前述基材上形成前述粉碎物彼此化學結合而成之厚1μm的聚矽氧多孔體。如此,便製造出一空隙結構薄膜。 Next, the coating liquid was applied onto the surface of a polyethylene terephthalate (PET) substrate by a bar coating method to form a coating film. The coating system was prepared by using 6 μL of the sol particle liquid per 1 mm 2 of the surface of the substrate. After the coating film was treated at a temperature of 100 ° C for 1 minute, the crosslinking reaction of the pulverized materials was completed. Thereby, a porous polysiloxane body having a thickness of 1 μm in which the pulverized materials were chemically bonded to each other was formed on the substrate. Thus, a void structure film is produced.

(比較例1) (Comparative Example 1)

除了未於前述塗覆液添加觸媒KOH以外,以與實施例1同樣的方法形成多孔體。 A porous body was formed in the same manner as in Example 1 except that the catalyst KOH was not added to the coating liquid.

(5)確認多孔質結構的特性 (5) Confirmation of the characteristics of the porous structure

自前述基材剝離前述多孔體,並藉由前述方法確認強度(利用Bemcot(註冊商標)所得之耐擦傷性)。另外也測定了折射率、霧度及空隙率。 The porous body was peeled off from the substrate, and the strength (scratch resistance obtained by Bemcot (registered trademark)) was confirmed by the above method. The refractive index, haze and void ratio were also measured.

該等結果顯示於下述表1。 These results are shown in Table 1 below.

如前述表1顯示,製得之厚1μm的實施例1之聚 矽氧多孔體具有高空隙率的多孔結構,且經確認,兼具充分的強度及可撓性。因此可知,本發明之聚矽氧多孔體藉由使熟成二氧化矽化合物溶膠行交聯反應,可作為可兼具膜強度及可撓性的矽烷醇多孔體,非常有用。再者,實施例1之聚矽氧多孔體也兼具低折射率及低霧度的良好光學特性。此外,於圖4顯示實施例1之聚矽氧多孔體的截面SEM像。另,於圖5顯示實施例1之聚矽氧多孔體的微細孔粒子TEM像。 As shown in Table 1 above, the polymerization of Example 1 having a thickness of 1 μm was obtained. The porous oxygen-containing porous body has a porous structure having a high void ratio, and it has been confirmed that it has both sufficient strength and flexibility. Therefore, it is understood that the porous polysiloxane porous body of the present invention is useful as a porous stanol which can have both film strength and flexibility by crosslinking the cooked cerium oxide compound sol. Further, the porous tantalum porous body of Example 1 also had good optical characteristics of low refractive index and low haze. Further, a cross-sectional SEM image of the porous polysiloxane porous body of Example 1 is shown in Fig. 4 . Further, a TEM image of fine pore particles of the porous polysiloxane porous body of Example 1 is shown in Fig. 5 .

(實施例2) (Example 2)

在本實施例中,係以下述方式製造本發明之空隙結構薄膜(聚矽氧多孔體)。 In the present embodiment, the void structure film (polyoxynitride porous body) of the present invention is produced in the following manner.

首先,以與實施例1同樣的方式進行前述「(1)矽化合物之凝膠化」及「(2)熟成處理」。接著,於前述溶膠粒子液添加1.5重量%之光鹼產生觸媒(和光純藥工業股份有限公司:商品名WPBG266)的IPA(異丙醇)溶液來替代0.3重量%之KOH水溶液,除此以外以與實施例1同樣的方式進行前述「(3)粉碎處理」,調製出塗覆液。相對於前述溶膠粒子液0.75g,前述光鹼產生觸媒之IPA溶液的添加量係設定為0.031g。其後,以與實施例1同樣的方式進行前述「(4)形成塗覆膜及形成聚矽氧多孔體」。對以上述方式製得之乾燥後的多孔體照射UV。前述照射UV係照射波長360nm之光,且光照射量(能量)設為500mJ。再來,於照射UV後,在60℃下進行加熱熟化22hr而形成本實施例之多孔質結構。 First, the above "(1) gelation of bismuth compound" and "(2) aging treatment" were carried out in the same manner as in Example 1. Then, an IPA (isopropyl alcohol) solution of a catalyst (manufactured by Wako Pure Chemical Industries, Ltd.: trade name: WPBG266) was added to the sol particle liquid in an amount of 1.5% by weight to replace the 0.3% by weight aqueous KOH solution. The above "(3) pulverization treatment" was carried out in the same manner as in Example 1 to prepare a coating liquid. The amount of the IPA solution of the photobase generating catalyst was set to 0.031 g with respect to 0.75 g of the sol particle liquid. Then, the above "(4) formation of a coating film and formation of a porous polysiloxane body" was carried out in the same manner as in Example 1. The dried porous body obtained in the above manner was irradiated with UV. The irradiation of UV light irradiated light having a wavelength of 360 nm, and the amount of light irradiation (energy) was 500 mJ. Thereafter, after UV irradiation, the film was heated and aged at 60 ° C for 22 hours to form a porous structure of the present example.

(實施例3) (Example 3)

除了未於照射UV後進行加熱熟化以外,進行與實施例2同樣的操作,形成本實施例之多孔質結構。 The porous structure of this example was formed in the same manner as in Example 2 except that the heating and aging were not carried out after the irradiation of UV.

(實施例4) (Example 4)

添加光鹼產生觸媒之IPA溶液後,再於前述溶膠液0.75g加入0.018g之5重量%之雙(三甲氧)矽烷以調整塗覆液,除此以外進行與實施例2同樣的操作,形成本實施例之多孔質結構。 After the addition of the photobase to the IPA solution of the catalyst, the same operation as in Example 2 was carried out, except that 0.018 g of 5% by weight of bis(trimethoxy)decane was added to 0.75 g of the sol solution to adjust the coating liquid. The porous structure of this example was formed.

(實施例5) (Example 5)

相對於前述溶膠液0.75g令光鹼產生觸媒之IPA溶液的添加量為0.054g,除此以外進行與實施例2同樣的操作,形成本實施例之多孔質結構。 The porous structure of this example was formed in the same manner as in Example 2 except that the amount of the IPA solution of the photobase generating catalyst was changed to 0.74 g.

(實施例6) (Example 6)

以與實施例2同樣的方式對乾燥後之多孔體照射UV後,於加熱熟化前,在室溫下將單面塗有黏著劑(黏接著層)的PET薄膜之前述黏著劑側貼附於前述多孔體以後,在60℃下加熱熟化22hr。除此以外,進行與實施例2同樣的操作,形成本實施例之多孔質結構。 After the dried porous body was irradiated with UV in the same manner as in Example 2, the adhesive side of the PET film coated with the adhesive (adhesive layer) on one side was attached to the adhesive side at room temperature before the heating and aging. After the porous body described above, it was aged by heating at 60 ° C for 22 hr. Except for this, the same operation as in Example 2 was carried out to form a porous structure of the present example.

(實施例7) (Example 7)

除了未於貼附PET薄膜後進行加熱熟化以外,進行與實施例6同樣的操作,形成本實施例之多孔質結構。 The porous structure of this example was formed in the same manner as in Example 6 except that the PET film was not attached and then heated and aged.

(實施例8) (Example 8)

添加光鹼產生觸媒之IPA溶液後,再於前述溶膠液0.75g加入0.018g之5重量%之雙(三甲氧)矽烷以調整塗覆 液,除此以外進行與實施例6同樣的操作,形成本實施例之多孔質結構。 After adding the photobase to the IPA solution of the catalyst, 0.718 g of 5% by weight of bis(trimethoxy)decane was added to the above sol solution to adjust the coating. The same operation as in Example 6 was carried out, except that the liquid was used to form the porous structure of the present Example.

(實施例9) (Example 9)

相對於前述溶膠液0.75g令光鹼產生觸媒之IPA溶液的添加量為0.054g,除此以外進行與實施例6同樣的操作,形成本實施例之多孔質結構。 The porous structure of this example was formed in the same manner as in Example 6 except that the amount of the IPA solution of the photobase generating catalyst was changed to 0.74 g.

(實施例10) (Embodiment 10)

將MgF2與TEOS(四乙氧矽烷)混合替代MTMS來形成多孔質結構體以外,進行與實施例6同樣的操作而形成本實施例之多孔質結構。 The porous structure of this example was formed in the same manner as in Example 6 except that MgF 2 and TEOS (tetraethoxyoxane) were mixed in place of MTMS to form a porous structure.

針對實施例2~10之多孔質結構,藉由前述方法測定折射率及霧度,並將結果顯示於下述表2及3。 With respect to the porous structures of Examples 2 to 10, the refractive index and haze were measured by the above methods, and the results are shown in Tables 2 and 3 below.

如前述表2及3顯示,製得之厚1μm的實施例2~10之聚矽氧多孔體中,折射率都極低在1.14~1.18,且霧 度值也顯示出0.4之極低的數值,具有卓越的光學特性。另外,像上述折射率極低的狀況係表示空隙率很高。又,實際上如同表2及3顯示,也確認空隙率相當高。此外,亦確認實施例2~10之聚矽氧多孔體與實施例1同樣地兼具充分的強度及可撓性。另外,實施例2~10在塗覆液經過保存1週以後以目視觀察也未看到變化,由此也確認塗覆液之保存穩定性亦佳,可有效製造穩定品質的聚矽氧多孔體。 As shown in the above Tables 2 and 3, in the polyaluminum oxide porous bodies of Examples 2 to 10 which were obtained to have a thickness of 1 μm, the refractive index was extremely low at 1.14 to 1.18, and fog. The value also shows an extremely low value of 0.4 with excellent optical properties. Further, the state in which the refractive index is extremely low as described above indicates that the void ratio is high. Further, actually, as shown in Tables 2 and 3, it was confirmed that the void ratio was relatively high. Further, it was also confirmed that the porous polysiloxane bodies of Examples 2 to 10 had sufficient strength and flexibility as in Example 1. Further, in Examples 2 to 10, after the coating liquid was stored for one week, no change was observed by visual observation, and it was confirmed that the coating liquid was also excellent in storage stability, and it was possible to efficiently produce a stable quality polysiloxane porous body. .

產業上之可利用性 Industrial availability

如以上說明,本發明之空隙結構薄膜係有一種或多種可形成微細空隙結構之構成單元彼此經由觸媒作用而化學結合,例如本發明之聚矽氧多孔體含有前述凝膠狀矽化合物之粉碎物而形成具有空隙之多孔結構,又藉由該多孔質結構使前述粉碎物化學結合,讓前述多孔結構固定化。因此,本發明之空隙結構薄膜雖為具有空隙之結構,依舊可維持充分的強度及可撓性。所以,本發明之空隙結構薄膜可有效提供需要膜強度及可撓性的空隙結構。例如,作為利用空隙之構件亦可應用在廣泛領域的製品上,如低折射率層等光學構件、絕熱材或吸音材、印墨影像接收材等。 As described above, the void structure film of the present invention is characterized in that one or more constituent units capable of forming a fine void structure are chemically bonded to each other via a catalytic action, and for example, the porous polysiloxane porous body of the present invention contains the aforementioned pulverization of the gelatinous ruthenium compound. The porous structure having a void is formed, and the pulverized material is chemically bonded by the porous structure to fix the porous structure. Therefore, the void structure film of the present invention has a structure having a void and can maintain sufficient strength and flexibility. Therefore, the void structure film of the present invention can effectively provide a void structure which requires film strength and flexibility. For example, it can be applied to a wide range of articles as a member using voids, such as an optical member such as a low refractive index layer, a heat insulating material or a sound absorbing material, an ink image receiving material, or the like.

Claims (22)

一種空隙結構薄膜,其特徵在於有一種或多種可形成微細空隙結構之構成單元彼此經由觸媒作用而化學結合。 A void structure film characterized in that one or more constituent units capable of forming a fine void structure are chemically bonded to each other via a catalytic action. 如請求項1之空隙結構薄膜,其中前述構成單元彼此間含有直接性結合。 The void structure film of claim 1, wherein the aforementioned constituent units contain a direct bond with each other. 如請求項1或2之空隙結構薄膜,其中前述構成單元彼此間含有間接性結合。 The void structure film of claim 1 or 2, wherein the aforementioned constituent units have an indirect bond with each other. 如請求項1或2之空隙結構薄膜,其中前述構成單元彼此之結合包含氫鍵或共價鍵。 The void structure film of claim 1 or 2, wherein the combination of the aforementioned constituent units includes a hydrogen bond or a covalent bond. 如請求項1或2之空隙結構薄膜,其中前述構成單元係選自於由粒子狀、纖維狀及平板狀所構成群組中之至少一種形狀之構成單元。 The void structure film according to claim 1 or 2, wherein the constituent unit is selected from the group consisting of at least one of a group consisting of a particle shape, a fiber shape, and a flat shape. 如請求項5之空隙結構薄膜,其中前述粒子狀及平板狀之構成單元係由無機物所構成。 The void structure film of claim 5, wherein the particulate and flat constituent unit is composed of an inorganic material. 如請求項5之空隙結構薄膜,其中前述粒子狀構成單元之構成元素含有選自於由Si、Mg、Al、Ti、Zn及Zr所構成群組中之至少一項元素。 The void structure film according to claim 5, wherein the constituent element of the particulate constituent unit contains at least one element selected from the group consisting of Si, Mg, Al, Ti, Zn, and Zr. 如請求項5之空隙結構薄膜,其中前述粒子狀之構成單元含有矽化合物之微細孔粒子。 The void structure film according to claim 5, wherein the particulate constituent unit contains fine pore particles of a ruthenium compound. 如請求項8之空隙結構薄膜,其中前述微細孔粒子含有凝膠狀二氧化矽化合物之粉碎體。 The void structure film of claim 8, wherein the fine pore particles comprise a pulverized body of a gelatinous cerium oxide compound. 如請求項9之空隙結構薄膜,其係使前述凝膠狀二氧化矽化合物之粉碎體堆積於基材上來形成膜。 The void structure film of claim 9, wherein the pulverized body of the gelled cerium oxide compound is deposited on a substrate to form a film. 如請求項10之空隙結構薄膜,其中由前述二氧化矽化合物形成之膜中,顯示強度之利用Bemcot所得的耐擦傷性為60~100%,顯示可撓性之藉由MIT試驗所得的耐折次數為100次以上。 The void structure film of claim 10, wherein the film formed of the foregoing cerium oxide compound exhibits a scratch resistance of 60 to 100% by using Bemcot, and exhibits flexibility of the MIT test. The number of times is more than 100 times. 如請求項1或2之空隙結構薄膜,其更含有用來使前述構成單元彼此間接結合的交聯輔助劑。 The void structure film of claim 1 or 2 further comprising a crosslinking auxiliary agent for indirectly bonding the aforementioned constituent units to each other. 如請求項12之空隙結構薄膜,其中相對於前述構成單元的重量,前述交聯輔助劑之含有率為0.01~20重量%。 The void structure film of claim 12, wherein the content of the crosslinking auxiliary agent is 0.01 to 20% by weight based on the weight of the constituent unit. 一種如請求項8至13中任一項之空隙結構薄膜之製造方法,其特徵在於包含下述步驟:製作含有矽化合物之微細孔粒子的液體;於前述液體添加使前述矽化合物之微細孔粒子彼此行化學結合的觸媒;及使前述微細孔粒子彼此藉由觸媒作用行化學結合的結合步驟。 A method for producing a void structure film according to any one of claims 8 to 13, characterized by comprising the steps of: preparing a liquid containing fine pore particles of a cerium compound; and adding the fine pore particles of the cerium compound to the liquid a catalyst chemically bonded to each other; and a bonding step of chemically bonding the aforementioned microporous particles to each other by a catalytic action. 如請求項14之空隙結構薄膜之製造方法,其中在前述結合步驟的觸媒反應為濕式處理及/或乾式處理。 The method for producing a void structure film according to claim 14, wherein the catalyst reaction in the aforementioned bonding step is a wet treatment and/or a dry treatment. 如請求項14或15之空隙結構薄膜之製造方法,其中前述矽化合物之微細孔粒子含有二氧化矽溶膠微粒子。 The method for producing a void structure film according to claim 14 or 15, wherein the fine pore particles of the cerium compound contain cerium oxide sol fine particles. 如請求項16之空隙結構薄膜之製造方法,其中前述二氧化矽溶膠微粒子係將凝膠狀二氧化矽化合物粉碎而獲得。 The method for producing a void structure film according to claim 16, wherein the cerium oxide sol fine particle system is obtained by pulverizing a gelled cerium oxide compound. 如請求項17之空隙結構薄膜之製造方法,其中前述粉 碎係藉由高壓無介質粉碎進行。 The method for producing a void structure film according to claim 17, wherein the powder The broken system is carried out by high-pressure medium-free pulverization. 如請求項14或15之空隙結構薄膜之製造方法,其中在前述結合步驟中,前述化學結合為交聯結合。 The method of producing a void structure film according to claim 14 or 15, wherein in the aforementioned bonding step, the aforementioned chemical bond is a cross-linking bond. 如請求項14或15之空隙結構薄膜之製造方法,其中在前述結合步驟進行觸媒反應的乾燥溫度在50℃以上且低於200℃。 The method for producing a void structure film according to claim 14 or 15, wherein the drying temperature at which the catalyst reaction is carried out in the aforementioned bonding step is 50 ° C or more and less than 200 ° C. 如請求項14或15之空隙結構薄膜之製造方法,其更包含一於前述液體添加交聯輔助劑的步驟,該交聯輔助劑係用來使前述矽化合物之微細孔粒子彼此間接結合。 The method for producing a void structure film according to claim 14 or 15, further comprising the step of adding a crosslinking auxiliary agent to the liquid, the crosslinking auxiliary agent for indirectly bonding the microporous particles of the foregoing cerium compound to each other. 如請求項21之空隙結構薄膜之製造方法,其中相對於前述矽化合物之微細孔粒子的重量,前述交聯輔助劑之添加量為0.01~20重量%。 The method for producing a void structure film according to claim 21, wherein the crosslinking auxiliary agent is added in an amount of from 0.01 to 20% by weight based on the weight of the fine pore particles of the cerium compound.
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