TW201626516A - Packaging structure for fingerprint detector and method for packaging fingerprint detector - Google Patents

Abstract

A packaging structure for a fingerprint detector and method for packaging a fingerprint detector are provided in the present invention. The packaging structure includes a plurality of metal leads, a metal plate, a specific wavelength light sensor IC, a specific wavelength light emitting circuit and a specific molding layer. The specific wavelength light sensor IC and the specific wavelength light emitting circuit are disposed on the metal plate. The specific wavelength light emitting circuit is disposed beside the specific wavelength light sensor IC. The specific molding layer is disposed on the metal plate to cover the specific wavelength light sensor IC and the specific wavelength light emitting circuit. The specific wavelength light emitting circuit is for emitting the specific wavelength light. The specific wavelength light can pass through the specific molding layer.

Description

Fingerprint identification package structure and fingerprint identification packaging method

The present invention relates to a fingerprint identification technology, and further, the present invention relates to a fingerprint identification package structure and a fingerprint identification package method.

Fingerprint recognition technology is a biometric technology. The fingerprint recognition system is a set of pattern recognition systems including fingerprint image acquisition, processing, feature extraction and comparison. Fingerprint recognition is often used in places that require identification of personnel such as access control systems, time and attendance systems, notebook computers, bank internal processing, and bank payments. Because of their individual differences and stability, fingerprints have been used for identity verification in ancient times. In the 1960s, with the development of computer technology, the US Federal Bureau of Investigation and the French Paris Police Department began to study computer fingerprint recognition technology. In the 1990s, the automatic fingerprint identification system for personal identification was developed and promoted.

FIG. 1 is a schematic structural view of a fingerprint identification device in the prior art. Referring to FIG. 1 , the fingerprint identification device includes a light source 101 , an optical component 102 , and a receiver 103 . Light source 101 To emit light in a specific frequency band. The optical component 102 is configured to direct the light emitted by the light source 101 to the finger contact surface. The receiver 103 is used to receive reflected light from the finger contact surface. When a fingerprint scan is performed, light of a specific wavelength emitted by the light source 101 is illuminated by the periphery of the finger and scattered in the finger. In the raised portion of the finger, since the light directly hits the finger contact surface of the optical element 102, the image is brighter; on the contrary, in the concave portion of the finger, the light is scattered in the air layer, so that it is formed. The image is darker.

However, the fingerprint identification device of the prior art has the optical component 102, so that the volume of the fingerprint identification device is limited by the optical component 102, so that the volume of the entire fingerprint identification device cannot be reduced, thereby affecting the range of application of the product.

An object of the present invention is to provide a fingerprint identification package structure and a fingerprint identification package method for miniaturizing a fingerprint identification device and simplifying the routing of the fingerprint identification device.

In view of the above, the present invention provides a fingerprint identification package structure including a plurality of metal pins, a metal platform, a specific frequency band light sensing integrated circuit, a specific frequency band light emitting circuit, and a specific sealing material. Material layer. The specific frequency band optical sensing integrated circuit is disposed on the metal platform and has a plurality of pads, wherein each of the specific frequency band optical sensing integrated circuits is coupled to a plurality of the plurality of metal pins. Specific metal pins. The above specific frequency band light source is emitted The circuit is disposed on the metal platform and disposed on one side of the specific frequency sensing integrated circuit, and has a first pad and a second pad, wherein the first pad of the specific band light source transmitting circuit is coupled to the metal The platform provides grounding capabilities. The second pad of the specific band light source transmitting circuit is coupled to the specific band of the specific band light sensing integrated circuit to provide intensity control of the specific band source. A specific layer of encapsulant material is disposed on the metal platform and covers a specific frequency band light sensing integrated circuit and a specific frequency band light emitting circuit. The specific frequency band light emitting circuit is configured to emit a specific frequency band light source. The specific layer of encapsulant described above allows a particular band of light source to pass.

The present invention further provides a fingerprint identification packaging method, the fingerprint identification packaging method comprising the steps of: providing a metal platform, wherein the metal platform surrounds a plurality of metal pins; and configuring a specific frequency band light sensing integrated circuit to the metal platform Configuring a specific frequency band light emitting circuit to the metal platform, wherein the specific frequency band light emitting circuit is disposed on one side of the specific frequency band optical sensing integrated circuit; performing a wire connection, wherein the specific frequency band is light Each of the pads of the sensing integrated circuit is coupled to a plurality of first specific metal pins of the plurality of metal pins, wherein the first pad of the specific band light emitting circuit is coupled to the metal platform, wherein a second pad of the specific band light source transmitting circuit is coupled to the specific band of the specific light sensing integrated circuit to provide intensity control of the specific band source; performing a packaging process for configuring a specific a layer of sealing material on the metal platform, covering the specific frequency band light sensing integrated circuit and the above A light source emitting a given frequency band circuit, wherein the specific frequency band emitting light source circuit To emit a specific frequency band light source. In addition, the above specific sealing material layer can pass the above specific frequency band light source.

According to a preferred embodiment of the present invention, a fingerprint identification package structure and a fingerprint identification package method further include a specific band light absorbing coating layer between the specific frequency band light sensing integrated circuit and the specific frequency band light emitting circuit. It is used to absorb light of a specific frequency band, and to avoid the specific frequency band light from interfering with the specific frequency band light sensing integrated circuit due to reflection. In another preferred embodiment, a light blocking component is further included between the specific frequency band light sensing integrated circuit and the specific frequency band light emitting circuit to block a specific frequency band light emitted by the specific frequency band light emitting circuit. To avoid the light of a specific frequency band from interfering with the specific band light sensing integrated circuit due to direct radiation.

According to the fingerprint identification package structure and the fingerprint identification package method of the preferred embodiment of the present invention, the metal platform further includes a padding platform, wherein the specific band light source transmitting circuit is disposed on the padding platform to avoid the specific frequency band. The light interferes with the specific frequency band light sensing integrated circuit due to direct sunlight. In another preferred embodiment, the metal platform further includes a recess structure, wherein the specific frequency band light emitting circuit is disposed in the pit structure, and the specific frequency band light sensing integrated circuit is disposed in In addition to the above-described pit structure, the surface of the pit structure is used to collectively reflect light of a specific frequency band emitted by a specific band light source transmitting circuit. In another preferred embodiment, the metal platform further includes a tilted reflector structure, wherein the specific frequency band light emitting circuit is disposed in the tilted reflective pit structure, and the specific frequency band light sensing integrated circuit configuration Outside the inclined reflective pit structure, wherein the oblique reflective pit knot The surface of the structure is used to collectively reflect the specific band light emitted by the light source transmitting circuit of the specific frequency band. Furthermore, in another preferred embodiment, the specific frequency band light source is infrared light.

The spirit of the present invention lies in that a specific frequency band light sensing integrated circuit and a specific frequency band light emitting circuit are thinly packaged by a semiconductor packaging technology and arranged in the same integrated circuit. The encapsulated layer of encapsulant material is also implemented using special materials through which a particular band of light sources can pass. The foregoing structure can achieve specular reflection of the surface of the encapsulant layer and the photo-sensing integrated circuit of a specific frequency band; therefore, the prior art special optical element can be removed. In addition, the bottom material of the package is a metal platform, and the metal has the advantage of easy heat dissipation, whereby a large amount of thermal energy of the specific frequency band light emitting circuit can be easily directed to the outside, which is advantageous for the specific frequency band light sensing integrated circuit to sense the fingerprint.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

101‧‧‧Light source

102‧‧‧Optical components

103‧‧‧ Receiver

201‧‧‧Metal pins

202‧‧‧Metal platform

203‧‧‧Specific frequency band photo-sensing integrated circuit

204‧‧‧Specific band light source transmitting circuit

205‧‧‧layer of sealing material

210‧‧‧Bonding Wire

301‧‧‧Infrared absorption layer

401‧‧‧ shading elements

501‧‧‧High platform

601‧‧‧ pit structure

701‧‧‧Sloping reflection pit structure

S801~S806, S901, S1001, S1101, S1201, S1301‧‧‧ steps of the embodiment of the present invention

FIG. 1 is a schematic structural view of a fingerprint identification device in the prior art.

2 is a cross-sectional view showing the structure of a fingerprint identification package structure according to a preferred embodiment of the present invention.

FIG. 3 is a cross-sectional view showing the structure of a fingerprint identification package having a specific band light source absorbing layer 301 according to a preferred embodiment of the present invention.

4 is a cross-sectional view showing the structure of a fingerprint identification package having a light shielding member 401 according to a preferred embodiment of the present invention.

FIG. 5 is a cross-sectional view showing the structure of a fingerprint identification package having a pad platform 501 according to a preferred embodiment of the present invention.

FIG. 6 is a cross-sectional view showing the structure of a fingerprint identification package structure having a pit structure 601 according to a preferred embodiment of the present invention.

FIG. 7 is a cross-sectional view showing the structure of a fingerprint identification package structure having a slanted pit structure 701 according to a preferred embodiment of the present invention.

FIG. 8 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 2 according to a preferred embodiment of the present invention.

FIG. 9 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 3 according to a preferred embodiment of the present invention.

FIG. 10 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 4 according to a preferred embodiment of the present invention.

FIG. 11 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure according to FIG. 5 according to a preferred embodiment of the present invention.

FIG. 12 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 6 according to a preferred embodiment of the present invention.

Figure 13 is a diagram of a preferred embodiment of the present invention FIG. 7 is a flow chart of a fingerprint identification packaging method of the fingerprint identification package structure.

2 is a cross-sectional view showing the structure of a fingerprint identification package structure according to a preferred embodiment of the present invention. Referring to FIG. 2, the fingerprint identification package structure includes a plurality of metal pins 201, a metal platform 202, a specific frequency band optical sensing integrated circuit 203, a specific frequency band light emitting circuit 204, and a specific sealing material. Material layer 205. The specific frequency band light sensing integrated circuit 203 and the specific frequency band light emitting circuit 204 are disposed on the metal platform 202, wherein the first bonding pad of the specific frequency band light emitting circuit 204 is coupled to the metal platform 202 for performing Ground. The purpose of the metal pin 201 is mainly to use the above-mentioned specific frequency band optical sensing integrated circuit 203 wafer and the metal pad on the wafer of the specific frequency band light emitting circuit 204, via a bonding wire 210, and the above. The corresponding pins on the metal pins 201 are electrically connected. The second pad of the specific band light source transmitting circuit 204 is coupled to a specific pad of the specific band light sensing integrated circuit 203, whereby the specific band light sensing integrated circuit 203 can emit the specific band light source. Circuit 204 performs intensity control of a particular band of light sources. In addition, the sealing material layer 205 is for covering the specific frequency band light sensing integrated circuit 203 wafer and the specific frequency band light emitting circuit 204 wafer.

In this embodiment, it is assumed that the specific band light source transmitting circuit 204 is an infrared emitting circuit 204, and the specific frequency band is light. The sensing integrated circuit 203 is also an infrared sensing integrated circuit 203, which may be a strip sensor or an area sensor. More specifically, in this embodiment, the sealant layer 205 is made of an infrared permeable sealant. Therefore, when the fingerprint identification device of FIG. 2 starts to operate, the infrared ray emitting circuit 204 starts to emit infrared rays to the finger contact surface of the sealing material layer 205, and the infrared sensation integrated circuit 203 receives the reflected infrared ray to determine the fingerprint. .

In addition, in order to avoid the infrared light interference detection result reflected by the metal platform 202 between the specific frequency band light sensing integrated circuit 203 and the specific frequency band light emitting circuit 204, the present invention further provides a fingerprint identification package structure. FIG. 3 is a cross-sectional view showing the structure of a fingerprint identification package having a light absorption layer of a specific frequency band according to a preferred embodiment of the present invention. Referring to FIG. 2 and FIG. 3, in this embodiment, portions of the bonding wires 210 are hidden. Above the metal platform 202, an infrared absorbing layer (IR Cut) 301 is coated. Thus, the infrared light emitted by the infrared ray emitting circuit 204 is absorbed by the infrared ray absorbing layer (IR Cut) 301 to prevent the infrared light emitted from the infrared ray emitting circuit 204 from interfering with the infrared ray sensing integrated circuit 203.

4 is a cross-sectional view showing the structure of a fingerprint identification package having a light shielding member 401 according to a preferred embodiment of the present invention. Referring to FIG. 2 and FIG. 4, in this embodiment, a light blocking element 401 is disposed between the specific band light sensing integrated circuit 203 and the specific band light source transmitting circuit 204. As such, the infrared emitting circuit 204 The emitted infrared light is shielded by the above-described shading element 401 to prevent the infrared light emitted from the infrared ray emitting circuit 204 from interfering with the operation of the infrared sensation integrated circuit 203 due to direct sunlight.

FIG. 5 is a cross-sectional view showing the structure of a fingerprint identification package having a pad platform 501 according to a preferred embodiment of the present invention. Referring to FIG. 2 and FIG. 5, in this embodiment, a padding platform 501 is disposed on one side of the specific band light sensing integrated circuit 203, and then the specific band light source transmitting circuit 204 is It is disposed on the pad platform 501. Thereby, the infrared light emitted from the infrared ray emitting circuit 204 is prevented from interfering with the operation of the infrared sensation integrated circuit 203 due to direct sunlight.

FIG. 6 is a cross-sectional view showing the structure of a fingerprint identification package structure having a pit structure 601 according to a preferred embodiment of the present invention. Referring to FIG. 2 and FIG. 6, in this embodiment, a pit structure 601 is disposed on one side of the specific band light sensing integrated circuit 203. This pit structure 601 deforms the above-described metal platform 202, for example, by pressure. Thereafter, the specific band light source emitting circuit 204 is disposed in the pit structure 601. In this embodiment, the surface of the pit structure 601, because it is a metal structure, can be used to reflect the infrared light emitted by the specific band light source emitting circuit 204, and thus has a concentrated light effect. Light can be concentrated to the finger contact surface of the layer of sealing material 205.

FIG. 7 is a cross-sectional view showing the structure of a fingerprint identification package structure having a tilted reflective pit structure 701 according to a preferred embodiment of the present invention. Referring to FIG. 2 and FIG. 7, in this embodiment, a tilted reflective pit structure is disposed on one side of the specific frequency band light sensing integrated circuit 203. 701. The inclined reflecting pit structure 701 is relocated to the metal stage 202, for example, in a meandering manner. Thereafter, the specific band light source emitting circuit 204 is disposed in the oblique reflecting pit structure 701. In this embodiment, the surface of the oblique reflecting pit structure 701, because it is a metal structure, can be used to reflect the infrared light emitted by the specific band light source emitting circuit 204, and thus has a concentrated light effect. Due to this tilting design, it is more accurate to concentrate the infrared light emitted by the specific band light source emitting circuit 204 to the finger contact surface of the sealing material layer 205.

According to the structure of the above embodiment, the present invention further provides a fingerprint identification packaging method. FIG. 8 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 2 according to a preferred embodiment of the present invention. Please refer to FIG. 8. The fingerprint identification packaging method includes the following steps:

Step S800: Start.

Step S801: Providing a metal platform 202, wherein the metal platform 202 surrounds a plurality of metal pins 201.

Step S802: Configuring a specific frequency band light sensing integrated circuit 203 onto the metal platform 202. As shown in Figure 2.

Step S803: Configuring a specific band light source transmitting circuit 204 to the metal platform 202, wherein the specific band light source transmitting circuit 204 is disposed on one side of the specific band light sensing integrated circuit 203.

Step S804: performing a wire connection, wherein each of the specific frequency band light sensing integrated circuits is coupled to the plurality of metal pins, wherein the first pad of the specific frequency band light emitting circuit is coupled to the metal The platform is grounded, and the above specific frequency band emits electricity The second pad of the circuit is coupled to the specific band light sensing integrated circuit, whereby the specific band light sensing integrated circuit can perform intensity control of the specific band light emitted by the specific band light source transmitting circuit. .

Step S805: Perform a packaging process for configuring a layer of adhesive material on the metal platform to cover the specific frequency band optical sensing integrated circuit and the specific frequency band light emitting circuit. In this embodiment, the layer of encapsulating material can pass the light source of the specific frequency band. In the above embodiments, it is specifically referred to as infrared rays. However, those of ordinary skill in the art should know that other light can also be used for fingerprint recognition. Therefore, the invention is not limited thereto.

Step S806: End.

The above embodiment is an example of the manufacturing process of the fingerprint identification package structure according to the second embodiment of the present invention. To create the fingerprint identification package structure of the third embodiment of the present invention, the steps of the above FIG. 8 need to be increased. In one step, as shown in FIG. 9, FIG. 9 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 3 according to a preferred embodiment of the present invention. Please refer to Figure 9, this method includes the following steps:

Step S901: Before performing the packaging process, configuring a specific frequency band light absorbing layer for absorbing the specific frequency band light. In this way, it is possible to prevent the infrared rays emitted from the infrared ray transmitting circuit 204 from interfering with the specific band light sensing integrated circuit 203.

In the above embodiment, although step S901 is set between step S801 and step S802, those skilled in the art should know that step S901 can be performed in step S805 and step S804. Step S803 or before step S802. The cost is higher, and the cost of pre-configuring the specific band light absorbing layer is lower. However, the invention is not limited thereto.

The above embodiment is an example of the manufacturing process of the fingerprint identification package structure of the third embodiment of the present invention. To create the fingerprint identification package structure of the fourth embodiment of the present invention, the steps of the above FIG. 8 need to be increased. In one step, as shown in FIG. 10, FIG. 10 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 4 according to a preferred embodiment of the present invention. Please refer to Figure 10, this method includes the following steps:

Step S1001: Before performing the packaging process (Molding), a shading element is disposed to block the specific band light emitted by the specific band light source transmitting circuit. In this way, it is possible to prevent the infrared rays emitted from the infrared ray transmitting circuit 204 from interfering with the specific band light sensing integrated circuit 203.

In the above embodiment, although step S1001 is set between step S801 and step S802, those skilled in the art should know that step S1001 may be before step S805, step S804, step S803 or step S802. Therefore, the invention is not limited thereto.

The above embodiment is an example of the manufacturing process of the fingerprint identification package structure of the fourth embodiment of the present invention. To create the fingerprint identification package structure of the fifth embodiment of the present invention, the steps of the above FIG. 8 need to be increased. In one step, as shown in FIG. 11, FIG. 11 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure according to FIG. 5 according to a preferred embodiment of the present invention. Please refer to Figure 11, this method includes the following steps:

Step S1101: Configuring a padding platform 501. It Thereafter, in step S802 and step S803, the specific band light source transmitting circuit 204 is disposed on the above-mentioned pad platform.

The above embodiment is an example of the manufacturing process of the fingerprint identification package structure according to the fifth embodiment of the present invention. To create the fingerprint identification package structure of the sixth embodiment of the present invention, the steps of the above FIG. 8 need to be increased. In one step, as shown in FIG. 12, FIG. 12 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 6 according to a preferred embodiment of the present invention. Please refer to Figure 12, this method includes the following steps:

Step S1201: The metal platform 202 is presented with a pit structure 601 by using a pressure process. Thereafter, in step S802 and step S803, the specific band light source transmitting circuit 204 is disposed in the pit structure 601. By the surface of the pit structure, light of a particular frequency band can be concentrated to the finger contact surface of the layer of sealing material 205.

The above embodiment is an example of the manufacturing process of the fingerprint identification package structure of the sixth embodiment of the present invention. To create the fingerprint identification package structure of the seventh embodiment of the present invention, the steps of the above FIG. 8 need to be increased. In one step, as shown in FIG. 13, FIG. 13 is a flow chart showing a fingerprint identification and packaging method of the fingerprint identification package structure of FIG. 7 according to a preferred embodiment of the present invention. Please refer to Figure 13, this method includes the following steps:

Step S1301: The slanted reflective sump structure 701 is disposed to the metal platform 202 such that the metal platform 202 presents a slanted reflective pit structure 701. Thereafter, in step S802 and step S803, the specific band light source transmitting circuit is disposed in the inclined reflecting pit structure 701. Reflecting a specific frequency band light emitting circuit by tilting the surface of the reflective pit structure The specific band of light emitted. This oblique reflecting pit structure 701 has a concentrated light effect. In this way, the specific frequency band light emitted by the specific frequency band light emitting circuit 204 can be accurately made to the finger contact surface of the sealing material layer 205.

In summary, the spirit of the present invention resides in that a specific frequency band optical sensing integrated circuit and a specific frequency band light emitting circuit are disposed in the same integrated circuit by using a special package. The encapsulated layer of encapsulant material is also implemented using special materials through which a particular band of light sources can pass. Therefore, special optical components of the prior art can be removed. In addition, the bottom material of this package is a metal platform, and the metal is easy to dissipate heat. Thereby, the specific frequency band light source can be easily guided to the finger contact surface, which is advantageous for the specific frequency band light sensing integrated circuit to sense the fingerprint.

The specific embodiments of the present invention are intended to be illustrative only and not to limit the invention to the above embodiments, without departing from the spirit of the invention and the following claims. The scope of the invention and the various changes made are within the scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

201‧‧‧Metal pins

202‧‧‧Metal platform

203‧‧‧Specific frequency band photo-sensing integrated circuit

204‧‧‧Specific band light source transmitting circuit

205‧‧‧layer of sealing material

210‧‧‧Bonding Wire

Claims (14)

A fingerprint identification package structure includes: a plurality of metal pins; a metal platform; a specific frequency band optical sensing integrated circuit disposed on the metal platform, having a plurality of pads, wherein the specific frequency band light sensing product Each of the pads of the body circuit is coupled to the plurality of metal pins; a specific frequency band light emitting circuit is disposed on the metal platform and disposed on one side of the light sensing integrated circuit of the specific frequency band, having a first a pad and a second pad, wherein the specific band light emitting circuit is configured to emit a specific band light source, wherein a first pad of the specific band light source transmitting circuit is coupled to the metal platform to provide a grounding function The second pad of the specific band light source transmitting circuit is coupled to a specific pad of the specific band light sensing integrated circuit to provide the specific band light sensing integrated circuit to control the intensity of the specific band light source. a specific sealing material layer disposed on the metal platform and covering the specific frequency band light sensing integrated circuit and the specific frequency band light emitting circuit, wherein The sealant material layer allows the particular frequency band by the light source. The fingerprint identification package structure according to the first aspect of the invention, wherein the specific frequency band light sensing integrated circuit and the specific frequency band light emitting circuit further comprise: a specific frequency band light absorbing coating layer, Absorbing the light of the specific frequency band to prevent the light of the specific frequency band from interfering with the specific frequency band light sensing integrated body due to reflection Circuit. The fingerprint identification package structure of claim 1, wherein the specific frequency band optical sensing integrated circuit and the specific frequency band light emitting circuit further comprise: a light blocking component for shielding the specific The specific frequency band light emitted by the band light source transmitting circuit prevents the light of the specific frequency band from interfering with the specific frequency band light sensing integrated circuit due to direct light. The fingerprint identification package structure as described in claim 1, wherein the metal platform further comprises: a padding platform, wherein the specific band light source transmitting circuit is disposed on the padding platform to avoid the specific frequency band Directly interfering with the particular band of light sensing integrated circuits. The fingerprint identification package structure of claim 1, wherein the metal platform further comprises: a pit structure, wherein the specific frequency band light emitting circuit is disposed in the pit structure, and the specific The band light sensing integrated circuit is disposed outside the pit structure, wherein a surface of the pit structure is used to reflect the specific band light emitted by the specific band light source transmitting circuit. The fingerprint identification package as described in item 1 of the patent application scope The metal platform further includes: a tilted reflective pit structure, wherein the specific frequency band light emitting circuit is disposed in the inclined reflective pit structure, and the specific frequency band light sensing integrated circuit is disposed in the inclined reflective pit structure In addition, the surface of the inclined reflective pit structure is used to reflect the specific frequency band light emitted by the specific frequency band light emitting circuit. The fingerprint identification package structure according to claim 1, wherein the specific frequency band light source is infrared light. A fingerprint identification packaging method includes: providing a metal platform, wherein the metal platform surrounds a plurality of metal pins; and configuring a specific frequency band light sensing integrated circuit to the metal platform, wherein the specific frequency band light emitting circuit is used Transmitting a specific frequency band light source; arranging a specific frequency band light emitting circuit to the metal platform, wherein the specific frequency band light emitting circuit is disposed on one side of the specific frequency light sensing integrated circuit; and performing a wire connection, wherein Each of the specific frequency band light sensing integrated circuits is coupled to the plurality of metal pins, wherein a first pad of the specific frequency band light emitting circuit is coupled to the metal platform, wherein the specific frequency band is a second pad of the transmitting circuit is coupled to the specific band of the specific band light sensing integrated circuit, wherein the specific band photo sensing integrated circuit is controlled by the second pad of the specific band light emitting circuit The intensity of the light of the specific frequency band emitted by the light-emitting circuit of the specific frequency band; performing a packaging process for arranging a specific sealing material layer on the metal platform, covering the specific frequency band light sensing integrated circuit and the A particular frequency band light emitting circuit, wherein the particular layer of encapsulant material allows the particular band of light source to pass. The fingerprint identification and packaging method of claim 8, wherein before configuring a specific frequency band optical sensing integrated circuit and a specific frequency band light emitting circuit, the method further comprises: configuring a specific frequency band light absorbing coating layer, The light of the specific frequency band is absorbed to prevent the light of the specific frequency band from interfering with the light of the specific frequency band to sense the integrated circuit due to reflection. The fingerprint identification and packaging method of claim 8, wherein before configuring a specific frequency band optical sensing integrated circuit and the specific frequency band light emitting circuit, the method further includes: arranging a light blocking component to mask the specific The specific frequency band light emitted by the band light source transmitting circuit prevents the light of the specific frequency band from interfering with the specific frequency band light sensing integrated circuit due to direct light. The fingerprint identification and packaging method as described in claim 8 , further comprising: configuring a padding platform, wherein the specific band light source transmitting circuit is disposed on the padding platform to prevent the specific band of light from interfering with the direct band special Fixed-band optical sensing integrated circuit. The fingerprint identification and packaging method as described in claim 8 further includes: using a pressure process, the metal platform exhibits a pit structure, wherein the specific frequency band light emitting circuit is disposed in the pit structure. And the specific frequency band light sensing integrated circuit is disposed outside the pit structure, wherein a surface of the pit structure is used to reflect the specific frequency band light emitted by the specific frequency band light emitting circuit. The fingerprint identification and packaging method as described in claim 8 further includes: using a 預鑄 process, the metal platform is presented with a tilted reflective pit structure, wherein the specific frequency band light emitting circuit is disposed in the inclined reflective pit structure And the specific frequency band light sensing integrated circuit is disposed outside the inclined reflective pit structure, wherein a surface of the inclined reflective pit structure is used to reflect the specific frequency band light emitted by the specific frequency band light emitting circuit. The fingerprint identification packaging method of claim 8, wherein the specific frequency band light source is infrared light.