TW201624139A - Organic vacuum coating system and thin-film formation method - Google Patents

Abstract

An organic vacuum coating system is disclosed, which comprises: a chamber, having a cavity to achieve vacuum; a carrier, disposed in the cavity of the chamber for the installation of an object to be coated; an evaporation source, disposed in the cavity of the chamber; an organic monomer supplying device, used for injecting organic monomer towards the evaporation source to evaporate the same onto the object to be coated; and a curing device, used to harden a thin film of the object to be coated. The present invention also provides a thin-film formation method of the organic vacuum coating system.

Description

Organic vacuum coating system and film forming method

The present invention relates to film formation, and more particularly to an organic vacuum coating system and a film forming method.

Conventional coating systems and film forming methods, if implemented in the atmosphere, cause a waste of solution volatilization; in order to solve such problems, some use clean room equipment, however, the cost is very high.

Furthermore, the above coating system and film forming method are required to achieve a flat surface, which is usually required to increase the film thickness, especially on uneven surfaces.

In addition, the organic liquid is not easily mixed and sprayed, so the performance of the coating film cannot be improved.

Therefore, the lack of an organic vacuum coating system and a film forming method is known to be improved.

In view of the above, the main object of the present invention is to provide an organic vacuum coating system and a film forming method, which can reduce the use of a solution, reduce the pinhole phenomenon, smooth the film, improve the hydrophobicity and hardness, and enhance the surface unevenness of the material. Coverage ability.

In order to achieve the above object, the present invention provides an organic vacuum coating system comprising a cavity having a chamber for vacuuming; a stage disposed in the chamber of the chamber for mounting a plated object; a source, disposed in a chamber of the chamber; an organic monomer supply device The organic monomer is sprayed to evaporate onto the object to be plated; and a hardening device hardens the film formed by the object to be plated.

The invention also provides a film shape using the organic vacuum coating system The method is as follows: carrying; vacuuming; pressure control; film formation; hardening; opening;

Preferably, the chamber of the chamber is evacuated such that the degree of vacuum is between 10 ^-1 torr and 10 ⁶ torr.

Preferably, the temperature of the evaporation source is set between 200 and 450 degrees Celsius.

Preferably, the film forming step and the hardening step are repeated.

Thereby, the evaporation source and the organic monomer supply device of the invention are all disposed in the cavity, so that the object to be plated does not need to be removed and moved into the cavity, so as to ensure that the coating is not affected by the outside and achieve better quality.

Detailed construction and features of the organic vacuum coating system and film forming method provided by the present invention will be described in detail in the following embodiments. However, it should be understood by those of ordinary skill in the art that the particular embodiments of the invention are described herein.

(10) ‧‧‧ cavity

(11) ‧ ‧ ‧ room

(20) ‧‧‧ stage

(30) ‧ ‧ evaporation source

(40) ‧‧‧Organic monomer supply unit

(50)‧‧‧ Hardening device

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of a preferred embodiment of the present invention.

Fig. 2 is a flow chart showing a method of forming a film of the present invention.

Figure 3 is another flow chart of the method of forming a film of the present invention.

The Applicant first describes here that the adjectives relating to directionality, such as inside, outside, up, and down, as referred to throughout the specification, are based on the directions in the drawings of the present invention.

The technical contents and features of the present invention will be described in detail below with reference to the accompanying drawings, in which: FIG. 1 shows an organic vacuum coating system according to a preferred embodiment of the present invention, including There is: a cavity (10) having a chamber (11) for evacuation.

A loading stage (20) is disposed in the chamber (11) of the cavity (10) for mounting the object to be plated. The stage (20) is displaceable and/or rotatable.

An evaporation source (30) is disposed at the bottom of the chamber (11) of the cavity (10).

An organic monomer supply device (40) ejects the organic monomer to the evaporation source (30) to evaporate onto the object to be plated.

A curing device (50) hardens the film formed by the object to be plated. In this embodiment, the curing device (50) is disposed around the circumference of the chamber (11) of the cavity (10), and the curing device (50) is an ultraviolet lamp.

As shown in Fig. 2, the film forming method of the organic vacuum coating system, that is, the film plating process, is described and illustrated as follows: Bearing: The object to be plated is placed on the stage (20).

Vacuuming: The chamber (11) of the chamber (10) is evacuated so that the degree of vacuum is between 10 ^-1 torr and 10 ^-6 torr.

Pressure Control: Maintain the aforementioned vacuum.

Film formation: The organic monomer is supplied to the evaporation source (30) by the organic monomer supply device (40) to evaporate onto the object to be plated to form a coating.

Hardening: The aforementioned coating is dried with the hardening device (50).

Open: the chamber (11) of the cavity (10).

Take out: Take the object to be plated.

Wherein, the temperature of the evaporation source (30) is set between 200 and 450 degrees Celsius.

As shown in Fig. 3, the film forming method using the organic vacuum coating system is substantially the same as described above except that the film forming and hardening steps are repeated once or more.

Wherein, the organic monomers of each time may be the same or different; thereby, the embodiment can prevent the object to be plated from moving into the cavity (10) for multiple coatings to ensure that the coating is not affected by external influences. Better quality.

Therefore, the following items can be achieved by the present invention:

1. Replace the current atmospheric spray system to reduce solution usage.

2. No need for clean room equipment to reduce dust can reduce operating costs.

3. The pinhole phenomenon can be reduced due to pumping in the vacuum.

4. It can reduce the thickness of the film to achieve a smooth and protective effect.

5. It can increase the mixing of organic liquid types and improve the hydrophobicity and hardness.

6. The film surface flattening function can enhance the coverage of the uneven surface of the material.

In summary, the organic vacuum coating system and film forming method of the present invention achieve the object of the present invention.

(10) ‧‧‧ cavity

(11) ‧ ‧ ‧ room

(20) ‧‧‧ stage

(30) ‧ ‧ evaporation source

(40) ‧‧‧Organic monomer supply unit

(50)‧‧‧ Hardening device

Claims (10)

An organic vacuum coating system comprising: a cavity (10) having a chamber (11) for evacuating; a stage (20) disposed in a chamber (11) of the chamber (10), Providing a plated object; an evaporation source (30) disposed in the chamber (11) of the cavity (10); and an organic monomer supply device (40) for spraying the organic sheet to the evaporation source (30) The body is evaporated onto the object to be plated; a curing device (50) hardens the film formed by the object to be plated. The organic vacuum coating system according to claim 1, wherein the evaporation source (30) is disposed at the bottom of the chamber (11) of the cavity (10). The organic vacuum coating system according to claim 2, wherein the hardening device (50) is disposed around the circumference of the chamber (11) of the cavity (10). The organic vacuum coating system according to claim 1, wherein the hardening device (50) is disposed around the circumference of the chamber (11) of the cavity (10). A film forming method using the organic vacuum coating system according to any one of claims 1 to 4, wherein the chamber (11) of the chamber (10) is evacuated so that the degree of vacuum is at 10 ^{- 1} torr~10 ^-6 torr. A film forming method according to claim 5, wherein the temperature of the evaporation source (30) is set between 200 and 450 degrees Celsius. A film forming method according to claim 5, comprising a film forming step and a hardening step, and repeating the film forming step and the hardening step. A film forming method using the organic vacuum coating system according to any one of claims 1 to 4, wherein the temperature of the evaporation source (30) is set between 200 and 450 degrees Celsius. A film forming method according to item 8 of the patent application, comprising a film forming step and a hardening step, and repeating the film forming step and the hardening step. A film forming method using the organic vacuum coating system according to any one of claims 1 to 4, further comprising a film forming step and a hardening step, and repeating the film forming step and the hardening step.