TW201622519A - Manufacturing method of case of electronic device and case formed using the same - Google Patents

Abstract

A manufacturing method of a case of an electronic device and the case formed using the same are provided. The manufacturing method comprises the following steps. Firstly, a plate is provided, wherein the plate has a Metallography structure showing brittle grains. Then, the plate is stamped to form a casing, wherein case comprises a side plate and a covering plate, the covering plat is flat plate and has a first thickness, and the side plate has a second thickness. Then, the flat plate of the casing is machined, such that the first thickness is less than the second thickness of the side plate.

Description

Manufacturing method of casing of electronic device and casing formed by using same

The present invention relates to a method of manufacturing a casing of an electronic device and a casing formed using the same, and more particularly to a method of manufacturing a casing for an electronic device having a brittle chip and a casing formed using the same.

The casing of a conventional electronic device is usually formed by full mechanical cutting. However, mechanical cutting requires more cutting time for a curved-type casing contour, resulting in a decrease in process efficiency.

Therefore, how to overcome the above problems to reduce the process time is one of the goals of the industry.

The invention relates to a method for manufacturing a casing of an electronic device and a casing formed by the same, which can reduce the processing time of the casing and improve the process efficiency.

According to an embodiment of the present invention, a casing of an electronic device is proposed Manufacturing method. The manufacturing method includes the following steps. Providing a plate, wherein the plate has a metallurgical structure with a brittle grain; the plate is plated to form a casing, the casing comprises a side plate and a cover plate, the cover plate is a flat plate and has a first thickness, and The side panel has a second thickness; and the flat plate of the casing is machined such that the first thickness of the panel is less than the second thickness of the side panel.

According to another embodiment of the present invention, a housing for an electronic device is provided. The casing includes a cover plate and a side plate. The cover has a first thickness. The side panels connect the cover plates and have a second thickness. Wherein, the first thickness of the cover plate is smaller than the second thickness of the side plate, and the cover plate and the side plate have a metallographic structure with a brittle crystal grain.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

100‧‧‧Chassis

100’‧‧‧ plates

101‧‧‧ grain

102‧‧‧ lattice difference

110‧‧‧ side panels

120‧‧‧ cover

120a, 120b‧‧‧through holes

T1, T1'‧‧‧ first thickness

T2‧‧‧second thickness

T3‧‧‧ third thickness

Fig. 1A is a view showing the appearance of a board according to an embodiment of the present invention.

Fig. 1B is a cross-sectional view showing the substrate of Fig. 1A in the direction 1B-1B'.

Figure 1C is a metallographic view of the surface of the substrate of Figure 1B.

Figure 1D is a metallographic view of the cross section of the substrate of Figure 1B.

2A to 2B are views showing the appearance of the substrate after the stamping of the first drawing.

Fig. 3 is a cross-sectional view showing the substrate of Fig. 2A after machining.

4A and 4B are views showing the appearance of the casing of Fig. 3 after being embossed.

5A and 5B are views showing the appearance of the casing of Fig. 4A after machining.

Please refer to FIGS. 1A to 5B , which are diagrams showing a manufacturing process of a casing of an electronic device according to an embodiment of the invention.

1A to 1D, FIG. 1A is a cross-sectional view of the substrate according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view of the substrate of FIG. 1A along the direction 1B-1B'. A metallographic view of the surface of the substrate shown in Fig. 1B is shown, and Fig. 1D is a metallographic view of the cross section of the substrate of Fig. 1B. In this step, a sheet 100' is provided. The sheet 100' is formed by, for example, a rolling mill. During the rolling process, the sheet 100' is subjected to rolling pressure resulting in brittleness of the die 101 and resulting in poor misalignment, deformation and/or buildup. For example, as shown in the metallographic diagram of Fig. 1C, the sheet 100' has a metallographic structure of the brittle crystal grains 101; as shown in Fig. 1D, the lattice difference row 102 of the sheet 100' is misaligned and deformed. As shown in Fig. 1B, the sheet 100' has a third thickness T3. In one embodiment, the third thickness T3 can be between about 0.8 mm and about 3.0 mm. Since the sheet 100' is formed by roll rolling, the third thickness T3 can be thinner (compared to the cast block). Further, the material of the sheet 100' includes aluminum, magnesium, copper, titanium, zinc or a combination thereof. In addition, depending on the forming process of the sheet 100', the brittle grains 101 and/or the lattice difference row 102 may be distributed only on a partial surface or inside of the sheet 100', or distributed throughout the sheet 100', such as distributed over the sheet 100. The entire surface or interior of 'the embodiment of the invention does not limit the location and/or extent of the distribution of the brittle grains 101 and/or the lattice difference row 102.

As shown in Figs. 2A and 2B, Fig. 2A is a view showing the appearance of the substrate after embossing in Fig. 1A, and Fig. 2B is a cross-sectional view showing the substrate in Fig. 2A in the direction 2B-2B'. In this step, the sheet 100' of Figure 1A is stamped so that the sheet 100' forms the side panel 110 and the cover. 120. The cover plate 120 is a flat plate and has a first thickness T1, and the side plate 110 has a second thickness T2, wherein the first thickness T1, the second thickness T2 and the third thickness T3 are substantially equal; that is, the imprint process of this step Thereafter, the sheet 100' only changes its shape, and each partial sheet thickness remains substantially the same as the sheet thickness before the imprint process. In this way, the imprint process of this step can form the side plate 110 and the cover plate 120 with less labor (in comparison with changing the thickness of the plate 100').

As shown in Fig. 3, a cross-sectional view of the cover of Fig. 2A after machining is shown. In this step, the cover 120 of Fig. 2A can be machined such that the thickness of the cover 120 is reduced from the first thickness T1 to the first thickness T1', wherein the first thickness T1 is smaller than the second thickness T2 of the side plate 110. The above machining methods are, for example, mechanical cutting, grinding or other suitable machining techniques, etc., wherein the mechanical cutting is, for example, turning, milling, Computer Numerical Control (CNC) or other suitable machining technology. In one embodiment, the first thickness T1' can be between about 0.4 mm and about 0.7 mm, while the second thickness T2 of the side panel 110 remains between about 0.8 mm and about 3.0 mm. Compared with the machining of the cover plate 120 into a curved panel, since the cover plate 120 machined in this step is a flat plate and the machined cover plate 120 maintains the flat plate, a lot of processing time can be reduced, thereby improving the process efficiency. After the cover 120 is machined, the casing 100 can be formed.

As shown in Figs. 4A and 4B, Fig. 4A is a view showing the appearance of the casing after the embossing of Fig. 3, and Fig. 4B is a cross-sectional view of the casing of Fig. 4A in the direction 4B-4B'. In this step, the cover 120 of FIG. 3 can be embossed to form the cover 120 into a curved panel. Since the stamping object in this step is the thinned cover 120 (as shown in FIG. 3), the pressure can be reduced. Imprinting force of the printing plate (not shown) on the cover 120 to save energy. After the embossing, the second thickness T2 of the side panel 110 is still greater than the first thickness T1' of the cover 120, so that the strength of the side panel 110 is stronger than that of the cover 120. Since the side plate 110 has a sufficient thickness, the casing 100 has a sufficient strength to allow the casing 100 to be stably assembled to another casing to constitute an electronic device. The electronic device is, for example, a mobile phone, a computer, an audio player, a video player, and the like.

Further, the second thickness T2 of the side plate 110 of FIG. 4B is substantially maintained the same as the third thickness T3 of the sheet material 100' of FIG. 1B; therefore, the thickness of the sheet material 100' of the first panel B' can be selected from the side panel 110. The second thickness T2 is correct. For example, under the consideration of strength, if the second thickness T2 of the side panel 110 of Fig. 4B requires about 3 mm, a sheet 100' having a third thickness T3 of about 3 mm can be selected (Fig. 1B).

As shown in Figs. 5A and 5B, Fig. 5A is a view showing the appearance of the casing of Fig. 4A after machining, and Fig. 5B is a cross-sectional view of the casing of Fig. 5A taken along the direction 5B-5B'. In this step, the cover 120 and the side plate 110 of FIG. 4A can be machined. For example, the through holes 120a and 120b may be formed in the cover 120 by, for example, a drilling process.

In another embodiment, the cover 120 and the side plate 110 of FIG. 4A may be anodized to form an oxidized protective layer on the surface of the cover 120 and the surface of the side plate 110.

In addition, in other embodiments, the method of manufacturing the casing 100 may omit the steps of FIGS. 4A and 4B; or the steps of FIGS. 5A and 5B may be omitted.

In summary, the casing manufacturing method of the embodiment of the present invention has at least The following advantages:

(1) In an embodiment, the object (cover) on which the machining is performed is a flat plate, so that a lot of processing time can be reduced, thereby improving the process efficiency.

(2) In one embodiment, after one of the imprint processes, the sheet material only changes its shape, and the partial thickness of the sheet material remains substantially the same as the sheet thickness before the imprint process. In this way, the imprint process of this step can form the side plate and the cover plate with less labor.

(3) In an embodiment, the embossing object of one of the imprint processes is a thinned cover plate, thereby reducing the embossing force of the imprinting mold on the cover plate to save energy.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧Chassis

110‧‧‧ side panels

120‧‧‧ cover

T1’‧‧‧first thickness

T2‧‧‧second thickness

Claims (12)

A method for manufacturing a casing of an electronic device, comprising: providing a plate; stamping the plate to form a side plate and a cover plate, the cover plate is a flat plate and has a first thickness, and the side plate has a first plate a second thickness; and machining the plate such that the first thickness of the plate is less than the second thickness of the side plate. The manufacturing method of claim 1, wherein the first thickness of the plate is substantially equal to the second thickness of the side plate after the step of embossing the plate. The manufacturing method of claim 1, wherein in the step of providing the sheet, the sheet before the embossing has a third thickness; after the step of embossing the sheet, the first thickness and the The second thickness is substantially equal to the third thickness. The manufacturing method of claim 1, wherein in the step of providing the plate, the plate has a third thickness; after the step of machining the plate, the second thickness and the third thickness are substantially equal. The manufacturing method of claim 1, wherein the first thickness of the flat plate is between 0.4 mm and 0.7 mm after the step of machining the flat plate. And the second thickness of the side panel is between 0.8 mm and 3.0 mm. The manufacturing method of claim 1, wherein after the step of machining the flat plate, the manufacturing method further comprises: imprinting the cover plate to form the cover plate into a curved panel. The manufacturing method of claim 6, further comprising: machining at least one of the curved panel and the side panel. The manufacturing method of claim 7, wherein after the step of machining at least one of the curved panel and the side panel, the manufacturing method further comprises: performing an anodizing treatment on the curved panel and the side panel. The manufacturing method of claim 1, wherein the step of machining the flat plate is performed by mechanical cutting or grinding. A casing for an electronic device, comprising: a cover having a first thickness; and a side plate connecting the cover and having a second thickness; wherein the first thickness of the cover is smaller than the first of the side plates The thickness of the cover plate and the side plate have a metallographic structure of a brittle grain. The casing of claim 10, wherein the first thickness is between 0.4 mm and 0.7 mm and the second thickness is between 0.8 mm and 3.0 mm. The casing of claim 10, wherein the cover is a curved panel.