TW201621747A - Detection apparatus for fingerprint verification chip and method of operating the same - Google Patents

Abstract

A detection apparatus for a fingerprint verification chip includes a chip guide plate with a chip containing slot, a finger-touching simulation plate, a press plate with a plurality of conductive needles, and a fingerprint verification chip. The finger-touching simulation plate is attached on the chip guide plate and fully covered on the chip containing slot. The fingerprint verification chip is contained in the chip containing slot, and has a finger-touching surface and a detecting surface corresponding to the finger-touching surface. The detecting surface provides a plurality of pins, and one of the pins is set as a pulse signal pin for generating a pulse signal. The pulse signal is transmitted to the finger-touching simulation plate to simulate the operation of touching on the finger-touching surface when the press plate is pressed on the detecting surface, thereby detecting contact identification quality of the fingerprint verification chip.

Description

Fingerprint identification wafer detecting device and operating method thereof 【0001】

The invention relates to a wafer detecting device and an operating method thereof, in particular to a fingerprint identifying wafer detecting device and an operating method thereof.

【0002】

The current fingerprint identification wafer production test process is as follows: The wafers produced from the fab are first tested before packaging (the CP Test is not packaged). The wafer is then ground and cut to remove good dies, followed by assembly and post-package testing (Final Test).

[0003]

Because the fingerprint identification chip is a sensing chip, it is generally considered that the test machine cannot fully detect the fingerprint identification chip, so that the actual use of the wafer after shipment may still cause problems. In view of this, an additional subsystem level test (module level test) is usually added to improve the fingerprint test wafer test yield. However, relatively, the time required for the module-level test is long, and therefore, the direct impact of the increase in labor costs, but also delays the shipment time.

[0004]

Furthermore, in the current module level test technology, the manual is mainly performed, that is, the tester directly touches the sensing surface of the wafer with a finger to judge the quality and capability of the wafer. In this way, for the induction identification yield test of the same wafer, the manual test is performed by different testers, and the difference between the pressure channel and the sliding speed of the finger contact surface on the wafer sensing surface will affect the identification of the wafer. Quality and ability. Moreover, it also increases the time cost of labor costs and output.

[0005]

Therefore, how to design a fingerprint identification wafer detecting device and its operation method, through an automatic detection program, to shorten the sensing identification yield test time of a large number of fingerprint identification chips, reduce test cost, early shipping time, and improve sensing for the wafer Identifying yield and reducing labor costs is a major issue that the creators of this case have to overcome and solve.

[0006]

Therefore, how to design a grounding impedance measuring device and its operation method, utilizing the characteristic that the total DC component of the AC power supply circuit is zero, and the DC voltage difference between the input end of the measuring device and the grounding point of the device is equal to the DC impedance. The voltage, together with the generated known voltage source or current source, can accurately calculate the grounding impedance between the grounding point of the equipment and the grounding point of the remote power supply, which is the one that the creator of the case wants to overcome and solve. Big topic.

【0007】

In order to solve the above problems, the present invention provides a fingerprint recognition wafer detecting apparatus to overcome the problems of the prior art. Therefore, the fingerprint identification wafer detecting device of the present invention comprises a wafer guide, a finger touch simulation plate, a pressing plate and a fingerprint recognition chip. The wafer guide has an opposite first surface and a second surface, and the wafer guide is provided with a wafer receiving groove extending through the first surface and the second surface. The finger touch simulation board is attached to the second surface of the wafer guide and completely covers the wafer receiving groove. The pressure plate has a plurality of guide pins. The fingerprint identification chip is disposed in the wafer receiving groove; the fingerprint identification chip has a relative touch sensing surface and a needle contact surface, and the needle contact surface provides a plurality of pins, wherein the pin position is A pulse signal pin that generates an output pulse signal. When the pressing plate abuts the contact surface of the needle, the guiding pins correspondingly contact the pin positions, and at the same time, the finger touch sensing surface is pressed against the finger touch analog plate; the pin signal output is transmitted through the pulse signal The pulse signal is applied to the finger touch simulation board to simulate the action of the finger touching the finger touch sensing surface, thereby detecting the contact recognition quality and capability of the fingerprint identification chip.

[0008]

In order to solve the above problems, the present invention provides a method of operating a fingerprint identification wafer detecting apparatus to overcome the problems of the prior art. Therefore, the method for fingerprint identification wafer detecting apparatus of the present invention comprises the steps of: (a) providing a wafer guide; the wafer guide has an opposite first surface and a second surface, and is provided through the first a surface of the second surface of a wafer receiving groove; (b) providing a finger touch analog board; the finger touch analog board is attached to the second surface of the wafer guide, and completely covers the wafer a grooved plate; (c) providing a pressure-receiving plate; the pressure-receiving plate has a plurality of guide pins; (d) providing a fingerprint identification wafer; the fingerprint identification chip is disposed in the wafer receiving groove, and has an opposite one a touch sensing surface and a pin contact surface, the pin contact surface provides a plurality of pin positions, wherein one pin position is a pulse signal pin position, the pulse signal pin position is to generate a pulse signal; and (e) When the pressing plate abuts the contact surface of the needle, the guiding pins correspondingly contact the pin positions, and at the same time, the finger touch sensing surface is pressed against the finger touch analog plate; the pin signal output through the pulse signal pin Pulse signal to the finger touch analog board to simulate the action of the finger touching the finger touch sensing surface The fingerprint detector further wafer contact recognition quality and capacity.

【0009】

In order to further understand the technology, the means and the effect of the present invention in order to achieve the intended purpose, refer to the following detailed description of the invention and the accompanying drawings. The detailed description is to be understood as illustrative and not restrictive.

[0041]

﹝this invention﹞

[0042]

10‧‧‧ wafer guide

[0043]

20‧‧‧Touching analog board

[0044]

30‧‧‧Pressing board

[0045]

40‧‧‧Fingerprinting chip

[0046]

50‧‧‧Relay circuit

[0047]

101‧‧‧ first surface

[0048]

102‧‧‧ second surface

[0049]

103‧‧‧ wafer receiving slot

[0050]

31~3N‧‧·guide pin

[0051]

401‧‧・needle touch

[0052]

402‧‧‧Finger-sensitive surface

[0053]

41~4N‧‧‧ feet

[0054]

4P‧‧‧ pulse signal pin

[0055]

SP‧‧‧ pulse signal

[0056]

502‧‧‧Switch unit

[0057]

504‧‧‧ coil unit

[0058]

100‧‧‧ Activities Department

[0059]

200‧‧‧ fixed department

[0060]

3~5‧‧‧Endpoint

[0061]

S10~S50‧‧‧Steps

[0010]

1 is a perspective view of a fingerprint identification wafer detecting device of the present invention;

[0011]

2 is a partial exploded view of the fingerprint identification wafer detecting device of the present invention;

[0012]

3 is a side view of the fingerprint identification wafer detecting device of the present invention;

[0013]

4 is a side view showing the state in which the fingerprint identification wafer detecting device of the present invention is closed;

[0014]

Figure 5 is a bottom view of the fingerprint identification wafer detecting device of the present invention;

[0015]

6 is a schematic diagram of contact identification detection of the fingerprint identification wafer detecting device of the present invention; and

[0016]

7 is a flow chart of a method for operating a fingerprint identification wafer detecting device of the present invention.

[0017]

The technical content and detailed description of the present invention are as follows:

[0018]

1 and 2 are respectively a perspective view and a partial exploded view of the fingerprint identification wafer detecting device of the present invention. The fingerprint identification wafer detecting device comprises a wafer guide 10, a finger touch simulation board 20, a pressing plate 30 and a fingerprint recognition wafer 40. The wafer guide 10 has a first surface 101 and a second surface 102 opposite to each other, and the wafer guide 10 is provided with a wafer receiving groove 103 penetrating the first surface 101 and the second surface 102, that is, the wafer capacity The groove 103 is a through groove. In the present embodiment, the first surface 101 is an upper surface (position relative to the fingerprint recognition wafer detecting device), and the second surface 102 is a lower surface. In addition, the wafer guide 10 is a plate of a conductive material.

[0019]

The finger touch simulation board 20 is attached to the second surface 102 of the wafer guide 10 and completely covers the wafer receiving groove 103. Therefore, when the finger touch simulation board 20 is attached to the lower surface of the wafer guide 10, a partial area of the finger touch simulation board 20 is exposed in an area where the wafer guide 10 is emptied, that is, the touch panel 20 is touched. The local area is exposed in the through-groove. Therefore, when the finger touch simulation board 20 is attached to the second surface 102 of the wafer guide 10, the transparent area of the wafer guide 10 having a thickness and the finger touch simulation board 20 exposed in the transparent area form an accommodation. The space, that is, the wafer receiving groove 103.

[0020]

The pressure-receiving plate 30 has a plurality of (n) guide pins 31 to 3N, and the guide pins 31 to 3N are needle-like bodies having electrical conductivity and elasticity. As shown in FIG. 1 , the guide pins 31 to 3N are protruded from the pressing plate 30 , and the guide pins 31 to 3N are arranged on a surface of the pressing plate 30 in an elliptical arrangement. However, the above embodiments are merely examples and are not intended to limit the technical scope of the present invention.

[0021]

The fingerprint recognition wafer 40 is housed in the wafer receiving groove 103. As described above, before the fingerprint identification wafer 40 is ready for electrical characteristic testing and sensing identification yield detection, it is placed in a transparent area having a thickness of the wafer guide 10 and a finger touch simulation board 20 exposed in the transparent area. Formed in the accommodating space. The fingerprint recognition wafer 40 has an opposite finger-sensing surface 402 and a needle contact surface 401. The finger touch sensing surface 402 is a contact surface of the fingerprint recognition wafer 40 that is touched by the user's finger. The needle contact surface 401 is a signal input and power supply surface of the fingerprint recognition wafer 40. More specifically, the pin contact surface 401 provides a plurality of (n) pins 41 to 4N, one of which is defined as a pulse signal pin 4P. The pulse signal pin 4P is used to output a pulse signal SP. Similarly, the feet 41 to 4N on the needle contact surface 401 are arranged in an elliptical arrangement. Furthermore, the manner and position of the pins 41~4N are completely arranged corresponding to the guide pins 31~3N on the pressing plate 30. In other words, if the guide pins 31 to 3N are arranged in a circular or other geometric shape on the surface of the pressing plate 30, the manner and position of the pins 41 to 4N are arranged, and the guide pins 31 should be completely ~3N is configured.

[0022]

After the fingerprint identification wafer 40 is placed in the wafer receiving slot 103, it is ready to perform electrical characteristic testing and sensing identification yield detection. Please refer to 3 for a side view of the fingerprint identification wafer detecting device of the present invention. It can be clearly seen from FIG. 3 that the fingerprint identification wafer detecting device mainly includes a movable portion 100 and a fixed portion 200, and the movable portion 100 is pivotally connected to the fixed portion 200. In conjunction with the foregoing FIGS. 1 and 2, the wafer guide 10, the finger touch simulation board 20, and the fingerprint recognition wafer 40 are included in the fixed portion 200, and the pressing plate 30 is included in the movable portion 100.

[0023]

More specifically, the fixing portion 200 is electrically disposed on a substrate, and the substrate may be a printed circuit board (PCB) to provide an electrical circuit required for fingerprint identification of the wafer detecting device. In addition, the movable portion 100 can be pivotally connected to the fixed portion 200 to achieve a pivotable manner of movement. In other words, as shown in the angle of FIG. 3, the movable portion 100 is pivoted in the clockwise direction to cover the fixed portion 200; further, the movable portion 100 is pivoted in the counterclockwise direction to be separated from the fixed portion 200. 4 and 5 are respectively a side view and a bottom view of the cover state of the fingerprint identification wafer detecting device of the present invention. When the movable portion 100 is pivoted in the clockwise direction and is attached to the fixed portion 200, the pressing plate 30 abuts against the needle contact surface 401. Furthermore, since the manner and position of the pins 41~4N are arranged, the guide pins 31~3N should be completely disposed. Therefore, the guide pins 31~3N are electrically connected to the pins 41~. 4N. When the pressing plate 30 abuts against the needle contact surface 401, it is pressed against the finger touch simulation board 20 to simulate the action of the user's finger touching the finger sensing surface 402. The operation instructions of the fingerprint identification wafer detecting device will be described in detail later.

[0024]

Please refer to FIG. 6 , which is a schematic diagram of contact identification detection of the fingerprint identification wafer detecting device of the present invention. The fingerprint identification wafer detecting device further includes a relay circuit 50. The relay circuit 50 is electrically connected between the finger touch simulation board 20 and the fingerprint recognition chip 40. The relay circuit 50 provides a switch unit 502 and a coil unit 504. The pulse signal pin 4P of the fingerprint recognition chip 40 is connected to an end point 5 of the switch unit 502, and the finger touch analog board 20 is connected to the other end point 3 of the switch unit 502.

[0025]

When the fingerprint recognition wafer 40 is placed in the wafer receiving groove 103 and is ready for detection, the end point 3 of the switching unit 502 is connected to the other end 4 of the switching unit 502. In other words, before the detection, the pulse signal pin 4P and The finger touch simulation board 20 is in an open, non-conducting state. When the detection is started, the system generates a detection confirmation signal. In this embodiment, for example, the system can generate a 5 volt voltage signal +5 V to the coil unit 504. Once the voltage signal is applied across the coil unit 504, the switch is made. End point 3 of unit 502 is coupled to end point 5 such that pulse signal pin 4P is electrically coupled to finger touch analog board 20.

[0026]

When the pulse signal pin 4P is electrically connected to the finger touch analog board 20, the pulse signal SP generated by the pulse signal pin 4P is output to the finger touch simulation board 20. Moreover, since the finger touch simulation board 20 is pressed against the finger touch sensing surface 402 of the fingerprint recognition chip 40, the pulse signal SP is projected from the finger touch simulation board 20 onto the finger touch sensing surface 402, so that it can be simulated. The finger of the person is in contact with the finger-sensitive surface 402 of the fingerprint recognition wafer 40.

[0027]

It is worth mentioning that the pin touch surface 401 on the fingerprint recognition chip 40 is electrically connected and signaled to the external circuit through the provided pins 41~4N. After the action of the simulated finger contact on the finger-sensing surface 402 is initiated, the digital signal command can be transmitted to the fingerprint-recognition wafer 40 via an external automatic test equipment (ATE) for inductive identification quality testing. More specifically, the automated test machine can transmit a test signal to one of the pins 41~4N by serially transmitting a digital signal command through a serial peripheral interface (SPI). The fingerprint identification wafer 40 is then tested. Moreover, after the test, the fingerprint identification chip 40 is further transmitted back to the automated testing machine through the other one of the pins 41~4N, and the automated testing machine compares the test results according to the returned signals. The sensing quality of the fingerprint recognition wafer 40 is judged.

[0028]

Please refer to FIG. 7 and refer to FIG. 1 to FIG. 6. FIG. 7 is a flowchart of a method for operating a fingerprint identification wafer detecting apparatus according to the present invention. The detection device operation method includes the following steps:

[0029]

First, in step S10, a wafer guide 10 is provided; the wafer guide 10 has opposite first and second surfaces 101 and 102, and is provided with a wafer through the first surface 101 and the second surface 102. Slot 103. In this embodiment, the wafer guide 10 is a plate of a conductive material.

[0030]

Next, in step S20, a finger touch simulation board 20 is provided; the finger touch simulation board 20 is attached to the second surface 102 of the wafer guide 10 and completely covers the wafer receiving groove 103. When the finger touch simulation board 20 is attached to the second surface 102 of the wafer guide 10, a partial area of the finger touch simulation board 20 is exposed in a region where the wafer guide 10 is emptied, that is, a part of the touch simulation board 20. The area is exposed in the venting trough. Therefore, when the finger touch simulation board 20 is attached to the second surface 102 of the wafer guide 10, the transparent area of the wafer guide 10 having a thickness and the finger touch simulation board 20 exposed in the transparent area form an accommodation. The space, that is, the wafer receiving groove 103.

[0031]

Thereafter, in step S30, a pressing plate 30 is provided; the pressing plate 30 has a plurality of guiding pins 31~3N. The guide pins are needle-like bodies having electrical conductivity. As shown in FIG. 1, the guide pins 31 to 3N are protruded from the pressing plate 30, and are arranged on a surface of the pressing plate 30 in an elliptical arrangement. However, the above embodiments are merely examples and are not intended to limit the technical scope of the present invention.

[0032]

Then, in step S40, a fingerprint identification wafer 40 is provided; the fingerprint recognition wafer 40 is received in the wafer receiving groove 103, and has a corresponding touch sensing surface 402 and a needle contact surface 401, and the needle contact surface 401 The system provides a plurality of pins 41~4N, wherein one pin is a pulse signal pin 4P, and the pulse signal pin is to output a pulse signal SP. Before the fingerprint identification wafer 40 is ready for the electrical characteristic test and the induction identification yield detection, the space is formed in the transparent area of the thickness of the wafer guide 10 and the accommodation space formed by the finger touch simulation board 20 exposed in the transparent area. Inside. The finger touch sensing surface 402 is a contact surface of the fingerprint recognition wafer 40 that is touched by the user's finger. The needle contact surface 401 is a contact surface provided for performing the sensing identification yield detection of the fingerprint recognition wafer 40. Similarly, the feet 41 to 4N on the needle contact surface 401 are arranged in an elliptical arrangement. Furthermore, the manner and position of the pins 41~4N are completely arranged corresponding to the guide pins 31~3N on the pressing plate 30. In other words, if the guide pins 31 to 3N are arranged in a circular or other geometric shape on the surface of the pressing plate 30, the manner and position of the pins 41 to 4N are arranged, and the guide pins 31 should be completely ~3N is configured.

[0033]

Finally, in step S50, after the fingerprint recognition wafer 40 is placed in the wafer receiving groove 103, preparation for electrical characteristic testing and sensing identification yield detection can be started. When the pressing plate 30 abuts the needle contact surface 401, the guiding pins 31~3N correspondingly contact the pin positions 41~4N, and at the same time, the finger sensing surface 402 is pressed against the finger touch simulation board 20; The pulse signal pin 4P outputs the pulse signal SP to the finger touch analog board 20 to simulate the action of the finger touching the finger touch sensing surface 402, thereby detecting the sensing recognition yield of the fingerprint recognition wafer 40 (S50).

[0034]

It is worth mentioning that the pin touch surface 401 on the fingerprint recognition chip 40 is electrically connected and signaled to the external circuit through the provided pins. After the action of the simulated finger contact on the finger-sensitive surface is activated, the digital signal command can be transmitted to the fingerprint recognition chip 40 through an external automatic test equipment (ATE) for the sensing quality test. More specifically, the automated test machine can transmit a test signal to one of the pins by serially transmitting a digital signal command through a serial peripheral interface (SPI). The fingerprint identification wafer 40 is tested. And, after the test, the fingerprint identification chip 40 is further transmitted back to the automated testing machine through the other one of the pins, and the automatic testing machine compares the test results according to the returned signals to determine The fingerprint recognition wafer 40 is inductively identified.

[0035]

In summary, the present invention has the following features and advantages:

[0036]

1. Shorten the sensing identification yield test time of a large number of fingerprint identification wafers 40, and reduce the test cost, so the shipment time can be early;

[0037]

2. The fingerprint identification wafer 40 of different appearances is subjected to the induction identification yield test, and only the corresponding wafer guide 10 and the pressing plate 30 need to be replaced, and the wafer receiving groove 103 having the same outer shape as the fingerprint identification wafer 40 is opened. Therefore, the mold required for the fingerprint identification wafer detecting device can be reduced, thereby greatly reducing the cost;

[0038]

3. Providing an automatic non-manual test program through the fingerprint identification wafer detecting device, which can avoid the result of contact identification affected by different testers' test habits and methods, thereby improving the sensing recognition yield for the fingerprint identification chip 40, and Reduce labor costs; and

[0039]

4. The fingerprint identification wafer detecting device can provide a function of simultaneously detecting the electrical characteristics of the fingerprint recognition wafer 40 and the sensing recognition yield.

[0040]

However, the above description is only for the detailed description and the drawings of the preferred embodiments of the present invention, and the present invention is not limited thereto, and is not intended to limit the present invention. The scope of the patent application is intended to be included in the scope of the present invention, and any one skilled in the art can readily appreciate it in the field of the present invention. Variations or modifications may be covered by the patents in this case below.

10‧‧‧ wafer guide

20‧‧‧Touching analog board

30‧‧‧Pressing board

31~3N‧‧·guide pin

Claims (12)

[Item 1] A fingerprint identification wafer detecting device includes:
a wafer guide having an opposite first surface and a second surface, the wafer guide having a wafer receiving groove extending through the first surface and the second surface;
a touch-sensitive analog board is attached to the second surface of the wafer guide and completely covers the wafer receiving groove;
a pressure-receiving plate having a plurality of guide pins; and a fingerprint identification chip disposed in the wafer receiving groove; the fingerprint identification chip having a relative touch-sensitive surface and a needle contact surface The surface system provides a plurality of pins, wherein one of the pins is a pulse signal pin, and the pulse signal pin is used to generate a pulse signal;
When the pressing plate abuts the contact surface of the needle, the guiding pins correspondingly contact the pin positions, and at the same time, the finger touch sensing surface is pressed against the finger touch analog plate; the pin signal output is transmitted through the pulse signal The pulse signal is applied to the finger touch simulation board to simulate the action of the finger touching the finger touch sensing surface, thereby detecting the contact recognition quality and capability of the fingerprint identification chip. [Item 2] The fingerprint identification wafer detecting device of claim 1, wherein the fingerprint identification wafer detecting device is detected by a test signal generated by an external testing device; wherein the test signal is transmitted through the needle contact surface. At least one pin is transmitted to the finger-sensitive surface for detection. [Item 3] The fingerprint identification wafer detecting device of claim 2, wherein the fingerprint identification chip transmits a detection result to another external testing device through another pin on the needle contact surface for comparison, to detect the fingerprint identification. The wafer's sensing identifies the yield. [Item 4] The fingerprint identification wafer detecting device of claim 1, further comprising a relay circuit, the relay circuit comprising:
a switch unit having at least a first end and a second end point; the first end point is electrically connected to the pulse signal pin, the two end points are electrically connected to the finger touch analog board; and a coil unit , electrically connected to the switch unit. [Item 5] The fingerprint identification wafer detecting device of claim 4, wherein when the coil unit is driven by a voltage signal, the first end point is electrically connected to the second end point, so that the pulse signal foot is generated. The pulse signal is output to the finger touch analog board. [Item 6] The fingerprint identification wafer detecting device of claim 5, wherein when the finger touch sensing surface is pressed against the finger touch analog board, the pulse signal generated by the pulse signal pin is output to the finger touch analog board. . [Item 7] A method for operating a fingerprint identification wafer detecting device includes
(a) providing a wafer guide; the wafer guide has an opposite first surface and a second surface, and is provided with a wafer receiving groove extending through the first surface and the second surface;
(b) providing a finger touch simulation board; the finger touch analog board is attached to the second surface of the wafer guide and completely covering the wafer receiving groove;
(c) providing a pressure plate; the pressure plate has a plurality of guide pins;
(d) providing a fingerprint identification chip; the fingerprint identification chip is disposed in the wafer receiving groove, and has an opposite touch sensing surface and a needle contact surface, wherein the needle contact surface provides a plurality of pins, wherein One pin is a pulse signal pin, and the pulse signal pin is used to generate a pulse signal;
(e) when the pressing plate abuts the needle contact surface, the guiding pins correspondingly contact the pin positions, and at the same time, the finger touch sensing surface is pressed against the finger touch analog plate; The bit outputs the pulse signal to the finger touch simulation board to simulate the action of the finger touching the finger touch sensing surface, thereby detecting the contact recognition quality and capability of the fingerprint identification chip. [Item 8] The method for operating a fingerprint identification wafer detecting device according to claim 7, wherein the fingerprint identification wafer detecting device is detected by a test signal generated by an external testing device; wherein the test signal passes through the needle contact surface At least one of the upper feet is transmitted to the finger-sensitive surface for detection. [Item 9] The method for operating a fingerprint identification wafer detecting device according to claim 8, wherein the fingerprint identification chip transmits a detection result to another external device through the other pin on the needle contact surface for comparison, to detect the Fingerprint identification of the wafer to identify the yield. [Item 10] The method for operating a fingerprint identification wafer detecting device according to claim 7, further comprising providing a relay circuit, the relay circuit comprising:
a switch unit having at least a first end point and a second end point; the first end point is electrically connected to the pulse signal pin, and the two end points are electrically connected to the finger touch analog board; The coil unit is electrically connected to the switch unit. [Item 11] The method for operating a fingerprint identification wafer detecting device according to claim 10, wherein when the coil unit is driven by a voltage signal, the first end point is electrically connected to the second end point, so that the pulse signal pin The generated pulse signal is output to the finger touch simulation board. [Item 12] The method for operating a fingerprint identification wafer detecting device according to claim 11, wherein when the finger touch sensing surface is pressed against the finger touch analog board, the pulse signal generated by the pulse signal pin is output to the finger touch Analog board.