TW201621537A - Server - Google Patents

Abstract

A server includes a case, many mother board sets and many fans. The case includes a bottom plate, a first lateral plate and a second lateral plate. The first lateral plate and the second lateral plate respectively connect to the opposite two sides of the bottom plate. The bottom plate, the first lateral plate and the second lateral plate surround a space. The mother board sets locate in the space by two layers and slidably dispose on the case. The fans locate same side of the mother board sets in the space. The at least part of the fans and the bottom plate respectively keep different distances.

Description

server

The present invention relates to a server, and more particularly to a server having fan groups of different levels.

Compared with personal computers (such as desktop computers, notebook computers, etc.), server computers have more powerful computing power, and because server computers are mostly used in commercial, financial, and even meteorological, military, and other fields, they are reliable. Degree and stability requirements are higher than personal computers. Therefore, the server computer is more rigid than the personal computer in the design of hardware and software.

In the case of a 2U server, the 2U server has a dual-layer motherboard and a cooling fan for the corresponding motherboard. The motherboards are slidably disposed in the casing to facilitate the mounting and dismounting of the motherboards. The cooling fans are used to generate a heat dissipation airflow to dissipate the motherboards. When there is a problem with one of the motherboards in the server, in order to allow the remaining problem-free motherboard to continue to serve the consumer. Maintenance personnel generally do not turn off the entire server, and in the process of running the server, directly replace the problem board. However, during the replacement process of the motherboard, since the damaged motherboard is removed from the casing and the original airflow field inside the casing is destroyed, the cooling airflow generated by the fans is easily concentrated to flow through the originally evacuated host. The location where the board is stored. As a result, these fans can not play the original heat dissipation capability for the remaining problem-free motherboards, which leads to an increase in the operating temperature of the remaining motherboards and the risk of component damage.

The invention provides a server, so that when the damaged motherboard is pulled away from the casing and the original airflow field inside the casing is destroyed, the fans can also exert the original heat dissipation capability for the remaining problem-free motherboard. In turn, the problem of the risk of component damage due to an increase in the operating temperature of the remaining motherboards is avoided.

The server disclosed in the present invention comprises a casing, a plurality of motherboard components and a plurality of fans. The casing includes a bottom plate, a first side plate and a second side plate. The first side plate and the second side plate are respectively connected to opposite side edges of the bottom plate. The bottom plate, the first side plate and the second side plate together surround an accommodating space. The motherboard components are arranged in the at least two-layer arrangement in the accommodating space and slidably mounted on the casing. These fans are located in the accommodating space and are located on the same side of the motherboard components. At least some of the fans are kept at a different distance from the bottom plate.

According to the server disclosed in the above invention, since the fans are located on the same side of the motherboard components, the fans and the bottom plate are spaced apart from each other (i.e., arranged in a "V" shape or in a "V" shape). The height of the bottom edge of the first fan protruding from the third motherboard assembly is different, and the height of the second fan protruding from the bottom edge of the third motherboard assembly is different, so that at least one motherboard assembly is pumped When the air is removed from the casing, the airflow generated by these fans creates a turbulence in the accommodating space, forcing the airflow generated by the fans to be dispersed through the main board components, thereby greatly increasing the heat dissipation flow generated by the fans. The heat dissipation capability of the remaining motherboard components.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

10‧‧‧Server

100‧‧‧Chassis

110‧‧‧floor

120‧‧‧First side panel

130‧‧‧Second side panel

140‧‧‧ accommodating space

200‧‧‧ motherboard components

210‧‧‧First motherboard assembly

220‧‧‧Second motherboard components

230‧‧‧ Third motherboard assembly

231‧‧‧ bottom edge

240‧‧‧Fourth motherboard components

241‧‧‧ bottom edge

300‧‧‧fan

310‧‧‧First fan

320‧‧‧second fan

400‧‧‧Manage space

1 is a perspective view of a server according to a first embodiment of the present invention.

Figure 2 is a rear view of Figure 1.

Figure 3 is a perspective view of the server of Figure 1 with one of the motherboard components removed.

Figure 4 is a rear view of Figure 3.

Figure 5 is a perspective view of a server according to a second embodiment of the present invention.

Fig. 6 is a rear view showing the fifth drawing.

Please refer to Figure 1 and Figure 2. 1 is a perspective view of a server according to a first embodiment of the present invention. Figure 2 is a rear view of Figure 1.

The server 10 of this embodiment includes a casing 100, a plurality of motherboard assemblies 200, and a plurality of fans 300.

The casing 100 includes a bottom plate 110, a first side plate 120 and a second side plate 130. The first side plate 120 and the second side plate 130 are respectively connected to opposite side edges of the bottom plate 110. The bottom plate 110, the first side plate 120 and the second side plate 130 together surround an accommodating space 140.

The motherboard assemblies 200 are arranged in the housing space 140 in an at least two-layer arrangement and slidably mounted to the housing 100. In detail, the motherboard components 200 include a first motherboard component 210, a second motherboard component 220, a third motherboard component 230, and a fourth motherboard component 240. The first motherboard assembly 210 and the second motherboard assembly 220 are located above the base plate 110 in a horizontal side by side manner. The third motherboard assembly 230 and the fourth motherboard assembly 240 are located horizontally side by side above the first motherboard assembly 210 and the second motherboard assembly 220 to enable the first motherboard assembly 210, the second motherboard assembly 220, The third motherboard assembly 230 and the fourth motherboard assembly 240 are disposed in the accommodating space 140 in a two-by-two arrangement. In addition, the third motherboard assembly 230 and the fourth motherboard assembly 240 have bottom edges 231, 241 adjacent to the bottom plate 110, respectively.

In this embodiment, each of the motherboard assemblies 200 is slidably mounted in the casing 100 through the carrier tray. However, it is not limited thereto. In other embodiments, each of the motherboard components 200 may be directly screwed to the casing 100 without being transmitted through the carrier.

In addition, the number of the motherboard components 200 of the present embodiment is not limited to the present invention. In other embodiments, the number of the motherboard components 200 may also be six, and is, for example, arranged in a two-by-three arrangement. Within space 140.

These fans 300 are located in the accommodating space 140 and are located on the same side of the motherboard assemblies 200. Further, the rotation axes of these fans 300 are parallel to the bottom plate 110. These fans 300 include a plurality of first fans 310 and a plurality of second fans 320. The first fans 310 are arranged from the first side plate 120 toward the second side plate 130, and the distance between the first fan 310 and the bottom plate 110 decreases from the adjacent first side plate 120 toward the first side plate 120.

In detail, as shown in FIG. 2, the number of these first fans 310 is three. Among the three first fans 310, the first fan 310 closest to the first side plate 120 and the bottom plate 110 maintain a first spacing D1, and the second adjacent first fan 310 and the bottom plate 110 maintain a second spacing D2, farthest from the first The first fan 310 of the side panel 120 maintains a third spacing D3 with the bottom plate 110. Moreover, the first spacing D1 is greater than the second spacing D2, and the second spacing D2 is greater than the third spacing D3, such that the heights of the second fans 320 protruding from the bottom edge 231 of the third motherboard assembly 230 are different.

The second fans 320 are arranged from the second side plate 130 toward the first side plate 120, and the distance between the second fan 320 and the bottom plate 110 decreases from the adjacent second side plate 130 toward the second side plate 130.

In detail, as shown in FIG. 2, the number of these second fans 320 is three. Among the three second fans 320, the second fan 320 closest to the second side plate 130 and the bottom plate 110 maintain one The fourth spacing D4, the second adjacent fan 320 and the bottom plate 110 maintain a fifth spacing D5, and the second fan 320 farthest from the second side panel 130 maintains a sixth spacing D6 with the bottom plate 110. Moreover, the fourth pitch D4 is greater than the fifth pitch D5, and the fifth pitch D5 is greater than the sixth pitch D6, such that the heights of the second fans 320 protruding from the bottom edge 231 of the third motherboard assembly 230 are different. As a result, the fans 300 are arranged in the shape of an English letter "V" above the bottom plate 110.

In addition, in the first fan 310 and the second fans 320, the adjacent first fan 310 and the second fan 320 are separated to have a line space between the adjacent first fan 310 and the second fan 320. 400. The cable space 400 facilitates the transmission of a transmission line (not shown) connected to each of the motherboard components 200.

Please refer to Figures 3 and 4. Figure 3 is a perspective view of the server of Figure 1 with one of the motherboard components removed. Figure 4 is a rear view of Figure 3.

As shown in FIGS. 3 and 4, when the fourth motherboard assembly 240 needs to be replaced, the user needs to pull the fourth motherboard assembly 240 away from the casing 100. After the fourth motherboard assembly 240 is removed, the wind resistance at the fourth motherboard assembly 240 is less than the wind resistance at the other motherboard components 210, 220, and 230. Therefore, when the fans 300 are running, Most of the generated heat dissipation airflow will flow from the lower wind resistance (the position of the original fourth motherboard assembly 240) (as indicated by the arrow a), resulting in the generation of the heat dissipation air generated by the fans 300. The problem of the heat dissipation capability of the remaining motherboard components 210, 220, 230 is reduced. However, since the fans 300 of the present embodiment are arranged in the shape of the letter "V" above the bottom plate 110, when the fourth motherboard assembly 240 is removed, the airflow generated by the fans 300 will be in the accommodating space 140. A turbulence is formed therein to force the airflow generated by the fans 300 to be dispersed through the motherboard components 200, thereby greatly improving the heat dissipation capability of the heat dissipation airflow generated by the fans 300 for the remaining motherboard components 210, 220, and 230.

Please refer to Figure 5 and Figure 6. Figure 5 is a perspective view of a server according to a second embodiment of the present invention. Fig. 6 is a rear view showing the fifth drawing.

The server 10 of this embodiment includes a casing 100, a plurality of motherboard assemblies 200, and a plurality of fans 300.

The casing 100 includes a bottom plate 110, a first side plate 120 and a second side plate 130. The first side plate 120 and the second side plate 130 are respectively connected to opposite side edges of the bottom plate 110. The bottom plate 110, the first side plate 120 and the second side plate 130 together surround an accommodating space 140.

The motherboard assemblies 200 are arranged in the housing space 140 in an at least two-layer arrangement and slidably mounted to the housing 100. In detail, the motherboard components 200 include a first motherboard component 210, a second motherboard component 220, a third motherboard component 230, and a fourth motherboard component 240. The first motherboard assembly 210 and the second motherboard assembly 220 are located above the base plate 110 in a horizontal side by side manner. The third motherboard assembly 230 and the fourth motherboard assembly 240 are located horizontally side by side above the first motherboard assembly 210 and the second motherboard assembly 220 to enable the first motherboard assembly 210, the second motherboard assembly 220, The third motherboard assembly 230 and the fourth motherboard assembly 240 are disposed in the accommodating space 140 in a two-by-two arrangement.

In this embodiment, each of the motherboard assemblies 200 is slidably mounted in a slot (not shown) of the casing 100 through the carrier. However, it is not limited thereto. In other embodiments, each of the motherboard components 200 may be directly screwed to the casing 100 without being transmitted through the carrier.

In addition, the number of the motherboard components 200 of the present embodiment is not limited to the present invention. In other embodiments, the number of the motherboard components 200 may also be six, and is, for example, arranged in a two-by-three arrangement. Within space 140.

The fans 300 are located in the accommodating space 140 and located at the motherboard assembly 200 The same side. These fans 300 include a plurality of first fans 310 and a plurality of second fans 320. The first fans 310 are arranged from the first side plate 120 toward the second side plate 130, and the distance between the first fan 310 and the bottom plate 110 is increased from the adjacent first side plate 120 toward the first side plate 120.

In detail, as shown in Fig. 6, the number of these first fans 310 is three. The first fan 310 closest to the first side panel 120 and the bottom plate 110 maintain a seventh spacing D7, and the first adjacent first fan 310 and the bottom plate 110 maintain an eighth spacing D8, farthest from the first. The first fan 310 of the side panel 120 maintains a ninth spacing D9 from the bottom plate 110. Moreover, the seventh pitch D7 is smaller than the eighth pitch D8, and the eighth pitch D8 is smaller than the ninth pitch D9, so that the heights of the second fans 320 protruding from the bottom edge 231 of the third motherboard assembly 230 are different.

The second fans 320 are arranged from the second side plate 130 toward the first side plate 120, and the distance between the second fan 320 and the bottom plate 110 decreases from the adjacent second side plate 130 toward the second side plate 130.

In detail, as shown in Fig. 6, the number of these second fans 320 is three. The second fan 320, which is adjacent to the second side panel 130, maintains a tenth interval D10 with the bottom plate 110, and the second adjacent fan 320 and the bottom plate 110 maintain an eleventh distance D11, which is farthest from the first fan 320. The second fan 320 of the two side plates 130 maintains a twelfth pitch D12 with the bottom plate 110. Moreover, the tenth pitch D10 is smaller than the eleventh pitch D11, and the eleventh pitch D11 is smaller than the twelfth pitch D12, so that the heights of the second fans 320 protruding from the bottom edge of the third motherboard assembly 230 are different. As a result, the fans 300 are arranged in an inverted "V" shape on the bottom plate 110.

Since the fans 300 of the present embodiment are arranged in the V-shaped shape above the bottom plate 110, when the fourth motherboard assembly 240 is removed, the airflow generated by the fans 300 is in the accommodating space 140. Forming a turbulence to force the airflow generated by the fans 300 to disperse the flow Through the motherboard components 200, the heat dissipation capability of the heat dissipation airflow generated by the fans 300 for the remaining motherboard components 210, 220, and 230 can be greatly improved.

According to the server disclosed in the above invention, since the fans are located on the same side of the motherboard components, the fans and the bottom plate are spaced apart from each other (i.e., arranged in a "V" shape or in a "V" shape). The height of the bottom edge of the first fan protruding from the third motherboard assembly is different, and the height of the second fan protruding from the bottom edge of the third motherboard assembly is different, so that at least one motherboard assembly is pumped When the air is removed from the casing, the airflow generated by these fans creates a turbulence in the accommodating space, forcing the airflow generated by the fans to be dispersed through the main board components, thereby greatly increasing the heat dissipation flow generated by the fans. The heat dissipation capability of the remaining motherboard components.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

10‧‧‧Server

100‧‧‧Chassis

110‧‧‧floor

120‧‧‧First side panel

130‧‧‧Second side panel

140‧‧‧ accommodating space

200‧‧‧ motherboard components

210‧‧‧First motherboard assembly

220‧‧‧Second motherboard components

230‧‧‧ Third motherboard assembly

231‧‧‧ bottom edge

240‧‧‧Fourth motherboard components

241‧‧‧ bottom edge

300‧‧‧fan

310‧‧‧First fan

320‧‧‧second fan

400‧‧‧Manage space

Claims (10)

A server includes: a casing, a bottom plate, a first side plate and a second side plate, wherein the first side plate and the second side plate are respectively connected to opposite side edges of the bottom plate, the bottom plate, the first The side panel and the second side panel together surround an accommodating space; a plurality of motherboard components are arranged in the accommodating space in an at least two-layer arrangement, and are slidably mounted on the casing; and a plurality of fans The fan is located in the accommodating space and is located on the same side of the motherboard components, and the fans are spaced apart from the bottom plate. The server of claim 1, wherein the fans include a plurality of first fans and a plurality of second fans, the first fans are arranged from the first side plate toward the second side plate, and the plurality of The distance between the fan and the bottom plate is decreasing from the first side plate toward the first side plate, and the second fans are arranged from the second side plate toward the first side plate, and the second The distance between the fan and the bottom plate decreases from the second side plate adjacent to the second side plate. The server of claim 2, wherein among the first fan and the second fans, the adjacent first fan is separated from the second fan to cause the adjacent first fan and the first fan The two fans have a cable space. The server of claim 2, wherein the motherboard components comprise a first motherboard component, a second motherboard component, a third motherboard component, and a fourth motherboard component, the first motherboard The component and the second motherboard component are located above the bottom plate in a horizontal side by side manner, and the third motherboard component and the fourth motherboard component are located horizontally side by side on the first motherboard component and the second motherboard component Upper to make the first motherboard component, the second motherboard component, and the third host The board assembly and the fourth motherboard assembly are disposed in the accommodating space in a two-by-two arrangement. The server of claim 4, wherein the third motherboard assembly and the fourth motherboard assembly each have a bottom edge, the bottom edges have the same level, the first fan and the second fans And protruding from the bottom edge of the third motherboard assembly, and the heights of the bottom edges of the first fan and the second fans protruding from the third motherboard assembly are different. The server of claim 1, wherein the fans include a plurality of first fans and a plurality of second fans, the first fans are arranged from the first side plate toward the second side plate, and the plurality of The distance between the fan and the bottom plate is increased from the first side plate toward the first side plate, and the second fans are arranged from the second side plate toward the first side plate, and the second The distance between the fan and the bottom plate is increased from a direction adjacent to the second side plate toward the second side plate. The server of claim 6, wherein among the first fan and the second fans, the adjacent first fan is separated from the second fan to cause the adjacent first fan and the first fan The two fans have a cable space. The server of claim 6, wherein the motherboard components comprise a first motherboard component, a second motherboard component, a third motherboard component, and a fourth motherboard component, the first motherboard The component and the second motherboard component are located on the bottom plate in a horizontal side by side manner, and the third motherboard component and the fourth motherboard component are horizontally side by side at the first motherboard component and the second motherboard component The first motherboard assembly, the second motherboard assembly, the third motherboard assembly, and the fourth motherboard assembly are disposed in the accommodating space in a two-by-two arrangement. The server of claim 8, wherein the third motherboard component and the fourth motherboard component each have a bottom edge, the bottom edges have the same level, the first fan and the second fans Projecting from the bottom edge of the third motherboard assembly, and the first fan and the second fans protrude from the bottom The height of the bottom edge of the three motherboard components is different. The server of claim 1, wherein the fans are axial fans.