TW201618617A - Circuit board holder - Google Patents

Circuit board holder Download PDF

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Publication number
TW201618617A
TW201618617A TW103139074A TW103139074A TW201618617A TW 201618617 A TW201618617 A TW 201618617A TW 103139074 A TW103139074 A TW 103139074A TW 103139074 A TW103139074 A TW 103139074A TW 201618617 A TW201618617 A TW 201618617A
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Taiwan
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hole
circuit board
magnetic body
carrier
depth
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TW103139074A
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Chinese (zh)
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TWI592076B (en
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吳俊錩
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棋荃精密科技有限公司
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Publication of TW201618617A publication Critical patent/TW201618617A/en
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Abstract

A circuit board holder includes a first carrier board, a second carrier board, and two magnetic attraction members. The first carrier board includes a first hole. The second carrier board includes a second hole. The two holes are respectively disposed in the first hole and the second hole. When the first carrier board and the second carrier board are stacked mutually, the two magnetic attraction members generate a magnetic attraction force to be attracted with each other so that a printed circuit board is allowed to be tightly sandwiched between the first carrier board and the second carrier board. At this moment, the printed circuit board is located between the two magnetic attraction members, and the magnetic attraction force is between 168 gauss and 550 gauss.

Description

電路板治具 Circuit board fixture

本發明係有關於一種電路板治具。 The present invention relates to a circuit board fixture.

由於目前印刷電路板會隨著應力變形及溫度變化,往往於加工時常會造成製程上之不便,必須藉助電路板治具將印刷電路板夾合其中,藉此壓迫印刷電路板使其無法翹曲、移位或變型,進而避免加工不易及零件裝著偏移不準確等問題。 Due to the stress deformation and temperature change of the printed circuit board, the process often causes inconvenience in the process, and the printed circuit board must be clamped by the circuit board fixture, thereby pressing the printed circuit board to make it unable to warp. , shifting or morphing, thus avoiding problems such as difficulty in machining and inaccurate offset of parts.

然而,由於目前的印刷電路板之電子電路相當精密,若電路板治具之夾合力量過大,都可能破壞電路板,造成印刷電路板上之電子電路設計的損壞。 However, since the electronic circuit of the current printed circuit board is quite precise, if the clamping force of the circuit board fixture is too large, the circuit board may be damaged, resulting in damage to the electronic circuit design on the printed circuit board.

有鑑於此,如何提供一種解決方案,可有效改善上述所帶來的缺失及不便,實乃相關業者目前刻不容緩之一重要課題。 In view of this, how to provide a solution that can effectively improve the above-mentioned shortcomings and inconveniences is an important issue that the relevant industry is currently unable to delay.

本發明是在提供一種電路板治具,用以解決以上先前技術所提到的不便與缺陷。 SUMMARY OF THE INVENTION The present invention is directed to a circuit board fixture for solving the inconveniences and drawbacks mentioned in the prior art.

此電路板治具包含一第一承載板、一第二承載 板、至少一第一磁性體與至少一第二磁性體。第一承載板具有至少一第一孔槽。第二承載板具有至少一第二孔槽。第一磁性體與第二磁性體分別配置於第一孔槽與第二孔槽內。如此,當第一承載板與第二承載板相互蓋合時,第一磁性體與第二磁性體相互磁吸,以致一印刷電路板能受夾合於第一承載板與第二承載板之間。此時,印刷電路板介於第一磁性體與第二磁性體之間。 The circuit board fixture includes a first carrier board and a second carrier a plate, at least one first magnetic body and at least one second magnetic body. The first carrier plate has at least one first slot. The second carrier plate has at least one second slot. The first magnetic body and the second magnetic body are disposed in the first and second holes, respectively. In this way, when the first carrier plate and the second carrier plate are covered with each other, the first magnetic body and the second magnetic body are magnetically attracted to each other, so that a printed circuit board can be clamped to the first carrier plate and the second carrier plate. between. At this time, the printed circuit board is interposed between the first magnetic body and the second magnetic body.

本發明之電路板治具利用磁性相吸原理使得第一承載板與第二承載板緊密吸合,因此壓迫印刷電路板使其無法翹曲、移位或變型,進而能有效改善印刷電路板翹曲、移位或變型等問題。 The circuit board jig of the invention utilizes the magnetic attraction principle to make the first carrier plate and the second carrier plate closely attract, so that the printed circuit board is pressed to make it unable to warp, shift or deform, thereby effectively improving the printed circuit board Problems such as songs, shifts or variants.

此外,由於發明人發現第一磁性體與第二磁性體相互磁吸所產生之磁吸力過大時,將導致印刷電路板遭到壓迫,甚至遭到破壞,造成印刷電路板上之電子電路設計的損壞。因此,發明人經多次試驗後,終於找出一旦第一磁性體與第二磁性體相互磁吸之磁吸力強度介於168高斯~550高斯之間,印刷電路板可以穩固地被夾合於第一承載板與第二承載板之間,但不致受到損壞。 In addition, since the inventors have found that the magnetic attraction generated by the magnetic interaction between the first magnetic body and the second magnetic body is too large, the printed circuit board is pressed or even damaged, resulting in the design of the electronic circuit on the printed circuit board. damage. Therefore, after many experiments, the inventors finally found out that once the magnetic attraction strength of the first magnetic body and the second magnetic body is between 168 gauss and 550 gauss, the printed circuit board can be firmly clamped to Between the first carrier plate and the second carrier plate, but not damaged.

依據本發明一或多個實施方式中,第一承載板具有二相對之第一面與第二面。第一孔槽位於第一承載板之第一面。第二承載板具有二相對之第三面與第四面。第二孔槽位於第二承載板之第三面。故,當第一承載板與第二承載板相互蓋合時,第一承載板之第一面與第二承載板之第三面分別觸壓印刷電路板。 In accordance with one or more embodiments of the present invention, the first carrier plate has two opposing first and second faces. The first hole slot is located on the first side of the first carrier plate. The second carrier plate has two opposite third and fourth faces. The second slot is located on the third side of the second carrier. Therefore, when the first carrier board and the second carrier board are covered with each other, the first side of the first carrier board and the third side of the second carrier board respectively touch the printed circuit board.

依據本發明一或多個實施方式中,第一承載板更具有至少一第一細孔。第一細孔位於第一承載板之第二面,且接通第一孔槽。第一細孔的口徑小於第一孔槽的口徑。 According to one or more embodiments of the present invention, the first carrier plate further has at least one first fine hole. The first fine hole is located on the second surface of the first carrier plate, and the first hole is opened. The diameter of the first pore is smaller than the diameter of the first orifice.

依據本發明一或多個實施方式中,第二承載板更具有至少一第二細孔,第二細孔位於第二承載板相對第四面,且接通第二孔槽。第二細孔的口徑小於第二孔槽的口徑。 According to one or more embodiments of the present invention, the second carrier plate further has at least one second hole, and the second hole is located on the opposite fourth side of the second carrier plate, and the second hole is opened. The diameter of the second pore is smaller than the diameter of the second orifice.

依據本發明一或多個實施方式中,第一承載板更具有至少一第一開口。第一開口貫通第一承載板之第一面與第二面。當印刷電路板受夾合於第一承載板與第二承載板之間時,第一開口暴露出部份之印刷電路板。 According to one or more embodiments of the present invention, the first carrier plate further has at least one first opening. The first opening penetrates the first surface and the second surface of the first carrier. When the printed circuit board is sandwiched between the first carrier and the second carrier, the first opening exposes a portion of the printed circuit board.

依據本發明一或多個實施方式中,第二承載板更具有至少一第二開口。第二開口貫通第二承載板之第三面與第四面。當印刷電路板受夾合於第一承載板與第二承載板之間時,第二開口暴露出部份之印刷電路板。 According to one or more embodiments of the present invention, the second carrier plate further has at least one second opening. The second opening penetrates through the third surface and the fourth surface of the second carrier plate. When the printed circuit board is sandwiched between the first carrier and the second carrier, the second opening exposes a portion of the printed circuit board.

依據本發明一或多個實施方式中,第一孔槽具有一第一深度。第二孔槽具有一第二深度。第一深度與第二深度分別位於2.1公釐~2.8公釐所形成之範圍中。 According to one or more embodiments of the present invention, the first aperture has a first depth. The second slot has a second depth. The first depth and the second depth are respectively in the range of 2.1 mm to 2.8 mm.

依據本發明一或多個實施方式中,第一磁性體具有一小於第一深度之第一厚度,第二磁性體具有一小於第二深度之第二厚度。第一厚度與第二厚度分別位於1.8公釐~2.0公釐所形成之範圍中。 In accordance with one or more embodiments of the present invention, the first magnetic body has a first thickness that is less than the first depth, and the second magnetic body has a second thickness that is less than the second depth. The first thickness and the second thickness are respectively in the range of 1.8 mm to 2.0 mm.

依據本發明一或多個實施方式中,第一孔槽具有 一第一深度,第一磁性體具有一小於第一深度之第一厚度,其中第一深度與第一厚度的相差值為位於0.3公釐~0.7公釐所形成之範圍中,且第一磁性體所產生之磁吸力強度的範圍為介於200高斯~260高斯之間。 According to one or more embodiments of the present invention, the first slot has a first depth, the first magnetic body has a first thickness smaller than the first depth, wherein the first depth and the first thickness are in a range of 0.3 mm to 0.7 mm, and the first magnetic body The magnetic attraction strength produced by the body ranges from 200 Gauss to 260 Gauss.

依據本發明一或多個實施方式中,第一磁性體與該第二磁性體相互面向之頂面彼此之間所間隔的最小直線距離位於0.6公釐~1.4公釐所形成之範圍中,且該第一磁性體所產生之磁吸力強度的範圍為介於200高斯~520高斯之間。 According to one or more embodiments of the present invention, the minimum linear distance between the top surfaces of the first magnetic body and the second magnetic body facing each other is in a range formed by 0.6 mm to 1.4 mm, and The magnetic attraction strength generated by the first magnetic body ranges from 200 gauss to 520 gauss.

依據本發明一或多個實施方式中,第一磁性體透過鉚合壓鑄的方式被匹配地嵌合於第一孔槽內。更具體地,第一孔槽之內壁抵壓於該第一磁性體露出該第一孔槽之一槽口的一面,其中該第一孔槽之該槽口的一最小直徑小於該第一磁性體的一最大寬度。 According to one or more embodiments of the present invention, the first magnetic body is matched and fitted into the first hole by means of riveting and die casting. More specifically, the inner wall of the first hole is pressed against a side of the first magnetic body exposing a notch of the first hole, wherein a minimum diameter of the notch of the first hole is smaller than the first A maximum width of the magnetic body.

依據本發明一或多個實施方式中,第二磁性體透過鉚合壓鑄的方式被匹配地嵌合於第二孔槽內。更具體地,第二孔槽之內壁抵壓於該第二磁性體露出該第二孔槽之一槽口的一面,其中該第二孔槽之該槽口的一最小直徑小於該第二磁性體的一最大寬度。 According to one or more embodiments of the present invention, the second magnetic body is matingly fitted into the second hole by means of riveting and die casting. More specifically, the inner wall of the second hole is pressed against the side of the second magnetic body exposing one of the slots of the second hole, wherein a minimum diameter of the notch of the second hole is smaller than the second A maximum width of the magnetic body.

10、11‧‧‧電路板治具 10, 11‧‧‧ circuit board fixture

100‧‧‧第一承載板 100‧‧‧First carrier board

110‧‧‧第一面 110‧‧‧ first side

120‧‧‧第二面 120‧‧‧ second side

130‧‧‧第一開口 130‧‧‧first opening

140‧‧‧第一孔槽 140‧‧‧First slot

141‧‧‧槽口 141‧‧‧ notch

150‧‧‧第一細孔 150‧‧‧ first pore

160‧‧‧第一磁性體 160‧‧‧First magnetic body

200‧‧‧第二承載板 200‧‧‧Second carrier board

210‧‧‧第三面 210‧‧‧ third side

220‧‧‧第四面 220‧‧‧ fourth side

230‧‧‧第二開口 230‧‧‧second opening

240‧‧‧第二孔槽 240‧‧‧Second hole

250‧‧‧第二細孔 250‧‧‧Second pores

260‧‧‧第二磁性體 260‧‧‧Second magnetic body

300‧‧‧印刷電路板 300‧‧‧Printed circuit board

A1‧‧‧第一深度 A1‧‧‧first depth

A2‧‧‧第二深度 A2‧‧‧second depth

T1‧‧‧第一厚度 T1‧‧‧first thickness

T2‧‧‧第二厚度 T2‧‧‧second thickness

W1‧‧‧第一寬度 W1‧‧‧ first width

W2‧‧‧第二寬度 W2‧‧‧ second width

第1圖係繪示本發明一實施方式之電路板治具之分解圖。 1 is an exploded view of a circuit board fixture according to an embodiment of the present invention.

第2圖係繪示第1圖之組合圖。 Fig. 2 is a combination diagram of Fig. 1.

第3圖係繪示第2圖之AA剖面圖。 Fig. 3 is a cross-sectional view taken along line AA of Fig. 2.

第4圖係繪示本發明另一實施方式之電路板治具之剖面圖,其剖面位置與第3圖相同。 Fig. 4 is a cross-sectional view showing a circuit board fixture according to another embodiment of the present invention, the cross-sectional position of which is the same as that of Fig. 3.

以下將以圖式及詳細說明清楚說明本發明之精神,任何所屬技術領域中具有通常知識者在瞭解本發明之較佳實施例後,當可由本發明所教示之技術,加以改變及修飾,其並不脫離本發明之精神與範圍。 The spirit and scope of the present invention will be apparent from the following description of the preferred embodiments of the invention. The spirit and scope of the invention are not departed.

為了解決習知印刷電路板翹曲、移位或變型等問題,本發明提供一電路板治具藉以有效改善此問題。第1圖係繪示本發明一實施方式之電路板治具10之分解圖。第2圖係繪示第1圖之組合圖。第3圖係繪示第2圖之AA剖面圖。 In order to solve the problems of warpage, displacement or modification of the conventional printed circuit board, the present invention provides a circuit board fixture to effectively improve the problem. 1 is an exploded view of a circuit board fixture 10 according to an embodiment of the present invention. Fig. 2 is a combination diagram of Fig. 1. Fig. 3 is a cross-sectional view taken along line AA of Fig. 2.

請同時參見第1圖、第2圖以及第3圖。此電路板治具10包含一第一承載板100、一第二承載板200、多個第一磁性體160與多個第二磁性體260。第一承載板100具有多個第一孔槽140。第二承載板200具有多個第二孔槽240。第一磁性體160與第二磁性體260分別配置於第一孔槽140與第二孔槽240內。當第一承載板100與第二承載板200相互蓋合時,第一磁性體160與第二磁性體260相互磁吸,以致至少一印刷電路板300能受夾合於第一承載板100與第二承載板200之間。此時,印刷電路板300介於第一磁性體160與第二磁性體260之間。如此,當印 刷電路板300隨著電路板治具10進行加工(例如通過錫爐)時,印刷電路板300便無法於第一承載板100與第二承載板200之間產生翹曲、移位或變型。通常而言,第一磁性體160與第二磁性體260皆是透過水膠(圖中未示)而分別黏合於第一孔槽140與第二孔槽240內,然而,本發明不限於此,第一磁性體160與第二磁性體260也可以不透過水膠而黏合於第一孔槽140與第二孔槽240內,僅靠磁性體於孔槽內的摩擦力。 Please also refer to Figure 1, Figure 2 and Figure 3. The circuit board fixture 10 includes a first carrier board 100, a second carrier board 200, a plurality of first magnetic bodies 160 and a plurality of second magnetic bodies 260. The first carrier plate 100 has a plurality of first aperture slots 140. The second carrier plate 200 has a plurality of second holes 240. The first magnetic body 160 and the second magnetic body 260 are disposed in the first hole 140 and the second hole 240, respectively. When the first carrier plate 100 and the second carrier plate 200 are covered with each other, the first magnetic body 160 and the second magnetic body 260 are magnetically attracted to each other, so that at least one printed circuit board 300 can be clamped to the first carrier plate 100 and Between the second carrier plates 200. At this time, the printed circuit board 300 is interposed between the first magnetic body 160 and the second magnetic body 260. So when printing When the brush circuit board 300 is processed (e.g., by a tin furnace) with the circuit board fixture 10, the printed circuit board 300 cannot be warped, displaced, or deformed between the first carrier board 100 and the second carrier board 200. Generally, the first magnetic body 160 and the second magnetic body 260 are respectively adhered to the first hole 140 and the second hole 240 through water glue (not shown), however, the invention is not limited thereto. The first magnetic body 160 and the second magnetic body 260 may also adhere to the first hole 140 and the second hole 240 without passing through the water glue, and only rely on the frictional force of the magnetic body in the hole.

本實施方式中,更具體地,如第2圖與第3圖所示,第一承載板100呈板狀,具有二相對之第一面110與第二面120。第一孔槽140位於第一承載板100之第一面110。第二承載板200呈板狀,具有二相對之第三面210與第四面220。第二孔槽240位於第二承載板200之第三面210。如此,當第一承載板100與第二承載板200相互蓋合時,第一承載板100之第一面110與第二承載板200之第三面210分別觸壓印刷電路板300。 In the present embodiment, more specifically, as shown in FIGS. 2 and 3, the first carrier plate 100 has a plate shape and has two opposing first faces 110 and second faces 120. The first hole 140 is located on the first face 110 of the first carrier plate 100. The second carrier plate 200 has a plate shape and has two opposite third faces 210 and fourth faces 220. The second hole 240 is located on the third surface 210 of the second carrier 200. As such, when the first carrier 100 and the second carrier 200 are in contact with each other, the first surface 110 of the first carrier 100 and the third surface 210 of the second carrier 200 respectively touch the printed circuit board 300.

本實施方式中,如第2圖與第3圖所示,第一承載板100更具有多個第一開口130。第一開口130貫通第一承載板100之第一面110與第二面120,且依據一陣列方式間隔地排列。同樣地,第二承載板200更具有多個第二開口230。第二開口230貫通第二承載板200之第三面210與第四面220,且依據一陣列方式間隔地排列。如此,當使用第一承載板100與第二承載板200夾持此印刷電路板300時,每一第一開口130對準對應的第二開口230, 且第一開口130暴露出部份之印刷電路板300,例如,印刷電路板300一面之部分區域上之電路,第二開口230暴露出部份之印刷電路板300,例如,印刷電路板300另面之部分區域上之電路。 In the present embodiment, as shown in FIGS. 2 and 3 , the first carrier plate 100 further has a plurality of first openings 130 . The first opening 130 penetrates the first surface 110 and the second surface 120 of the first carrier 100 and is spaced apart according to an array. Likewise, the second carrier plate 200 further has a plurality of second openings 230. The second opening 230 extends through the third surface 210 and the fourth surface 220 of the second carrier 200 and is spaced apart according to an array. As such, when the first carrier board 100 and the second carrier board 200 are used to clamp the printed circuit board 300, each of the first openings 130 is aligned with the corresponding second opening 230. And the first opening 130 exposes a portion of the printed circuit board 300, for example, a circuit on a portion of one side of the printed circuit board 300, and the second opening 230 exposes a portion of the printed circuit board 300, for example, the printed circuit board 300 The circuit on a part of the surface.

如此,當印刷電路板300隨著電路板治具10進行加工(例如通過錫爐)時,電子元件便可從其中一第一開口130及/或第二開口230所露出之電路連接至印刷電路板300上。在本實施方式中,第一開口130以及第二開口230均為矩形,然而,本發明並不侷限於此形狀。 Thus, when the printed circuit board 300 is processed along with the circuit board fixture 10 (for example, through a tin furnace), the electronic component can be connected to the printed circuit from a circuit in which the first opening 130 and/or the second opening 230 are exposed. On the board 300. In the present embodiment, the first opening 130 and the second opening 230 are both rectangular, however, the present invention is not limited to this shape.

此外,如第3圖所示,第一承載板100更具有至少一第一細孔150。第一細孔150位於第一承載板100之第二面120,且接通第一孔槽140。第一細孔150的口徑小於第一孔槽140的口徑。第二承載板200更具有至少一第二細孔250,第二細孔250位於第二承載板200相對第四面220,且接通第二孔槽240。第二細孔250的口徑小於第二孔槽240的口徑。本實施方式中,由於第一磁性體160或/及第二磁性體260呈圓餅形,第一孔槽140或/及第二孔槽240的形狀與第一磁性體160或/及第二磁性體260的形狀大致匹配。如此,當第一磁性體160或/及第二磁性體260裝入第一孔槽140或/及第二孔槽240時,第一孔槽140或/及第二孔槽240內的氣體可從第一細孔150或/及第二細孔250排除。此外,當第一磁性體160或/及第二磁性體260因為退磁或其它因素需要更換時,在移除第一磁性體160或/及第二磁性體260的考量上,以一針狀物(例如頂 針,圖中未示)伸入第一細孔150或/及第二細孔250,第一磁性體160或/及第二磁性體260便可分別從第一孔槽140或/及第二孔槽240脫離第一承載板100或/及第二承載板200。 In addition, as shown in FIG. 3, the first carrier plate 100 further has at least one first fine hole 150. The first fine hole 150 is located on the second surface 120 of the first carrier plate 100 and turns on the first hole 140. The diameter of the first fine hole 150 is smaller than the diameter of the first hole 140. The second carrier 200 further has at least one second hole 250. The second hole 250 is located on the opposite side of the second surface 220 of the second carrier 200 and is connected to the second slot 240. The diameter of the second pore 250 is smaller than the diameter of the second orifice 240. In this embodiment, since the first magnetic body 160 or/and the second magnetic body 260 are in the shape of a pie, the shape of the first hole 140 or/and the second hole 240 is different from the first magnetic body 160 or/and the second The shape of the magnetic body 260 is substantially matched. As such, when the first magnetic body 160 or/and the second magnetic body 260 are loaded into the first hole 140 or/and the second hole 240, the gas in the first hole 140 or/and the second hole 240 may be Exclusion from the first pores 150 or/and the second pores 250. In addition, when the first magnetic body 160 or/and the second magnetic body 260 need to be replaced due to demagnetization or other factors, in the consideration of removing the first magnetic body 160 or/and the second magnetic body 260, a needle is used. (eg top a needle (not shown) extends into the first hole 150 or/and the second hole 250, and the first magnetic body 160 or/and the second magnetic body 260 may be respectively from the first hole 140 or/and the second The slot 240 is disengaged from the first carrier plate 100 or/and the second carrier plate 200.

然而,本發明不限於此,其他實施方式中,第一細孔150或/及第二細孔250也可以被省略,使得第一孔槽140或/及第二孔槽240改為盲孔。此外,本發明也不侷限第一孔槽140或/及第二孔槽240以及第一磁性體160或/及第二磁性體260的形狀。 However, the present invention is not limited thereto. In other embodiments, the first fine holes 150 or/and the second fine holes 250 may also be omitted, so that the first holes 140 or/and the second holes 240 are changed to blind holes. Further, the present invention is not limited to the shape of the first hole 140 or/and the second hole 240 and the first magnetic body 160 or/and the second magnetic body 260.

由於電路板治具10夾合力量過大,而可能導致印刷電路板300上之電子電路設計的損壞,為此,發明人發現因為每組第一磁性體160與第二磁性體260相互磁吸所產生之磁吸力過大時,將導致印刷電路板300之對應區域遭到壓迫,甚至遭到破壞,造成印刷電路板300上之電子電路設計的損壞。因此,發明人經多次試驗後,終於找出一旦第一磁性體160與第二磁性體260相互磁吸之磁吸力強度位於168高斯~550高斯所形成之範圍中,印刷電路板300可以穩固地被夾合於第一承載板100與第二承載板200之間,但又不致因磁吸力過大而夾壞印刷電路板300。 Since the clamping force of the circuit board fixture 10 is too large, which may cause damage to the electronic circuit design on the printed circuit board 300, the inventors have found that each of the first magnetic body 160 and the second magnetic body 260 is magnetically attracted to each other. If the magnetic attraction generated is too large, the corresponding area of the printed circuit board 300 will be pressed or even damaged, resulting in damage to the electronic circuit design on the printed circuit board 300. Therefore, after many experiments, the inventors finally found out that once the magnetic attraction strength of the magnetic attraction between the first magnetic body 160 and the second magnetic body 260 is in the range of 168 Gauss to 550 Gauss, the printed circuit board 300 can be stabilized. The ground is sandwiched between the first carrier plate 100 and the second carrier plate 200, but the printed circuit board 300 is not damaged due to excessive magnetic attraction.

實作上,發明人透過調整磁性體的厚度或/及孔槽底部至印刷電路板300之最小直線距離(即孔槽深度)以控制第一磁性體160與第二磁性體260相互磁吸之磁吸力強度。孔槽底部至印刷電路板300之最小直線距離(即孔槽深度)與第一磁性體160與第二磁性體260相互磁吸之磁吸 力強度成反比。第一磁性體160與第二磁性體260的厚度與第一磁性體160與第二磁性體260相互磁吸之磁吸力強度大致上成正比。 In practice, the inventors control the magnetic interaction between the first magnetic body 160 and the second magnetic body 260 by adjusting the thickness of the magnetic body and/or the minimum linear distance from the bottom of the hole to the printed circuit board 300 (ie, the depth of the groove). Magnetic attraction strength. The minimum linear distance from the bottom of the slot to the printed circuit board 300 (ie, the depth of the slot) and the magnetic attraction of the first magnetic body 160 and the second magnetic body 260 The force strength is inversely proportional. The thickness of the first magnetic body 160 and the second magnetic body 260 is substantially proportional to the magnetic attraction strength of the magnetic attraction between the first magnetic body 160 and the second magnetic body 260.

具體地,如第3圖所示,第一孔槽140具有一第一深度A1。第一磁性體160具有一小於第一深度A1之第一厚度T1。第二孔槽240具有一第二深度A2。第二磁性體260具有一小於第二深度A2之第二厚度T2。 Specifically, as shown in FIG. 3, the first hole 140 has a first depth A1. The first magnetic body 160 has a first thickness T1 that is smaller than the first depth A1. The second hole 240 has a second depth A2. The second magnetic body 260 has a second thickness T2 that is smaller than the second depth A2.

如下表一為針對第一孔槽140之深度為2.1公釐~2.8公釐且第一磁性體160厚度為1.8公釐~2.0公釐所進行高斯儀的測試而得之各種磁吸力強度。由於表一可知,第一深度A1分別位於2.1公釐~2.8公釐所形成之範圍中。第一厚度T1分別位於1.8公釐~2.0公釐所形成之範圍中。 Table 1 below shows various magnetic attraction strengths obtained by testing the Gaussmeter for the depth of the first hole 140 from 2.1 mm to 2.8 mm and the thickness of the first magnetic body 160 to 1.8 mm to 2.0 mm. As can be seen from Table 1, the first depth A1 is in the range formed by 2.1 mm to 2.8 mm, respectively. The first thickness T1 is in the range of 1.8 mm to 2.0 mm, respectively.

由表一可知,舉例來說,當第一厚度T1為2.0公釐,且第一深度A1為2.5公釐時,磁吸力強度為250高斯,或是,磁吸力強度位於250高斯±10(即240高斯~260高斯)所形成之範圍中。舉另例來說,當第一厚度T1為1.8公釐,且第一深度A1為2.35公釐時,磁吸力強度為230高斯,或是,磁吸力強度位於230高斯±10(即220高斯~240高斯)所形成之範圍中。 As can be seen from Table 1, for example, when the first thickness T1 is 2.0 mm, and the first depth A1 is 2.5 mm, the magnetic attraction strength is 250 Gauss, or the magnetic attraction strength is 250 Gauss ± 10 (ie, 240 Gauss ~ 260 Gauss) in the range formed. For another example, when the first thickness T1 is 1.8 mm and the first depth A1 is 2.35 mm, the magnetic attraction strength is 230 Gauss, or the magnetic attraction strength is 230 Gauss ± 10 (ie 220 Gauss ~ 240 Gauss) is formed in the range.

本實施方式中,第一孔槽140與第二孔槽240的尺寸規格一致,且第一磁性體160與第二磁性體260的種類一致,則第二厚度T2與第二深度A2可近似第一厚度T1與第一深度A1的數據,故,參考表一之第一厚度T1與第一深度A1的數據後,由於第一磁性體160與第二磁性體260相互磁吸所產生之磁吸力強度大致介於第一磁性體160之磁吸力強度的1倍~2倍之間,故,由表一可推算出,第一磁性體160與第二磁性體260相互磁吸所產生之磁吸力強度的最高值大致視為275高斯~550之間(275*2),最低值大致視為168高斯~336高斯(168*2),即其最大範圍將可大致視為168高斯~550高斯。 In this embodiment, the first hole 140 and the second hole 240 have the same size specifications, and the second thickness T2 and the second depth A2 are similar to each other. The data of the thickness T1 and the first depth A1, so after referring to the data of the first thickness T1 and the first depth A1 of Table 1, the magnetic attraction generated by the mutual magnetic attraction of the first magnetic body 160 and the second magnetic body 260 The intensity is substantially between 1 and 2 times the magnetic attraction strength of the first magnetic body 160. Therefore, the magnetic attraction generated by the magnetic attraction between the first magnetic body 160 and the second magnetic body 260 can be derived from Table 1. The highest value of intensity is roughly regarded as 275 Gauss ~ 550 (275 * 2), the lowest value is roughly regarded as 168 Gauss ~ 336 Gauss (168 * 2), that is, its maximum range can be roughly regarded as 168 Gauss ~ 550 Gauss.

此外,當印刷電路板300的厚度小到可暫時忽略,且第一磁性體160與第二磁性體260的種類一致,則第一磁性體160與第二磁性體260相互面向之頂面彼此之間所間隔的最小直線距離可決定第一磁性體160與第二磁性體 260相互磁吸所產生之磁吸力強度。例如,第一磁性體160面向第二磁性體260之一面至第一承載板100面向第二承載板200之一面的最小直線距離位於0.3公釐~0.7公釐所形成之範圍中,換句話說,第一深度A1與第一厚度T1的相差為位於0.3公釐~0.7公釐所形成之範圍中,如此,第一磁性體160輸出磁吸力強度的範圍大致介於200高斯~260高斯之間。 In addition, when the thickness of the printed circuit board 300 is small enough to be temporarily ignored, and the types of the first magnetic body 160 and the second magnetic body 260 are identical, the top surfaces of the first magnetic body 160 and the second magnetic body 260 facing each other are mutually The minimum linear distance between the spaces may determine the first magnetic body 160 and the second magnetic body 260 The magnetic attraction strength generated by mutual magnetic attraction. For example, a minimum linear distance of the first magnetic body 160 facing one surface of the second magnetic body 260 to a surface of the first carrier plate 100 facing the second carrier plate 200 is in a range of 0.3 mm to 0.7 mm, in other words, The difference between the first depth A1 and the first thickness T1 is in a range of 0.3 mm to 0.7 mm. Thus, the range of the output magnetic strength of the first magnetic body 160 is substantially between 200 Gauss and 260 Gauss. .

藉於第一孔槽140與第二孔槽240的尺寸規格一致,且第二厚度T2近似第一厚度T1的數據,故,由於第一承載板100之第一深度A1與第一厚度T1的相差為介於0.3公釐~0.7公釐,可推算出第一磁性體160與第二磁性體260相互面向之頂面彼此之間所間隔的最小直線距離(亦即第一深度A1-第一厚度T1+第二深度A2-第二厚度T2)位於0.6公釐~1.4公釐所形成之範圍中。由於第一磁性體160輸出磁吸力強度的範圍大致介於200高斯~260高斯之間,同理,第一磁性體160與第二磁性體260相互磁吸所產生之磁吸力強度的最高值大致視為介於260高斯~520高斯(260*2)之間,最低值大致視為介於200高斯~400高斯之間(200*2)之間,即其最大範圍將可大致視為介於200高斯~520高斯之間。 Since the first hole 140 and the second hole 240 have the same size specifications, and the second thickness T2 approximates the data of the first thickness T1, the first depth A1 of the first carrier 100 and the first thickness T1 are The phase difference is between 0.3 mm and 0.7 mm, and the minimum linear distance between the top surfaces of the first magnetic body 160 and the second magnetic body 260 facing each other can be derived (that is, the first depth A1 - first The thickness T1 + the second depth A2 - the second thickness T2) is in a range formed by 0.6 mm to 1.4 mm. Since the range of the magnetic attraction strength of the first magnetic body 160 is substantially between 200 gauss and 260 gauss, the maximum value of the magnetic attraction strength generated by the magnetic interaction between the first magnetic body 160 and the second magnetic body 260 is substantially the same. Considered to be between 260 Gauss ~ 520 Gauss (260 * 2), the lowest value is roughly between 200 Gauss ~ 400 Gauss (200 * 2), that is, its maximum range can be roughly regarded as 200 Gauss ~ 520 Gauss.

由於第1圖之電路板治具10進行加工,例如通過錫爐時,上述水膠可能受高溫影響而無法於第一孔槽140與第二孔槽240內有效抓握第一磁性體160與第二磁性體260。對此,如第4圖所示,第4圖係繪示本發明另一實施 方式之電路板治具11之剖面圖,其剖面位置與第3圖相同。本實施方式之電路板治具11與第1圖之電路板治具10大致相同,其差異之一為,本實施方式是透過鉚合壓鑄的方式將第一磁性體160硬壓入第一孔槽140內,使得第一磁性體160被匹配地嵌合於第一孔槽140,進而無法脫離第一孔槽140。更具體地,將第一磁性體160硬壓入第一孔槽140內之後,第一孔槽140內壁抵壓於第一磁性體160露出第一孔槽140之槽口141的一面,意即,第一孔槽140之槽口141的最小寬度W2小於第一磁性體160的最大寬度W1。如此,無論第一磁性體160是否藉由水膠被固定於第一孔槽140內,第一磁性體160不會因磁性互吸而從槽口141脫離第一孔槽140。同樣地,第二磁性體也是透過鉚合壓鑄的方式被硬壓入第二孔槽內,請參閱上述另一實施方式,在此不再加以贅述。 Since the circuit board fixture 10 of FIG. 1 is processed, for example, by a tin furnace, the water gel may be affected by high temperature and cannot effectively grasp the first magnetic body 160 in the first hole 140 and the second hole 240. The second magnetic body 260. In this regard, as shown in FIG. 4, FIG. 4 illustrates another embodiment of the present invention. A cross-sectional view of the circuit board jig 11 of the mode has the same cross-sectional position as that of FIG. The circuit board jig 11 of the present embodiment is substantially the same as the circuit board jig 10 of the first embodiment. One of the differences is that the first magnetic body 160 is hard pressed into the first hole by riveting and die casting. In the groove 140, the first magnetic body 160 is fitted to the first hole 140 in a mating manner, so that the first hole 140 cannot be separated from the first hole 140. More specifically, after the first magnetic body 160 is hard pressed into the first hole 140, the inner wall of the first hole 140 is pressed against the side of the first magnetic body 160 exposing the notch 141 of the first hole 140, That is, the minimum width W2 of the notch 141 of the first hole 140 is smaller than the maximum width W1 of the first magnetic body 160. Thus, regardless of whether the first magnetic body 160 is fixed in the first hole 140 by water glue, the first magnetic body 160 is not detached from the notch 141 by the magnetic mutual attraction. Similarly, the second magnetic body is also hard pressed into the second hole by means of riveting and die casting. Please refer to the other embodiment described above, and no further details are provided herein.

須瞭解到,本實施例旨在說明孔槽與磁性體的數量,可依照製程時夾持印刷電路板所需要的夾合力而有所改變,意即,第一磁性體與第二磁性體的數量分別小於或等於第一孔槽與第二孔槽的數量,然而,本發明不限第一孔槽與第二孔槽的數量與第一磁性體與第二磁性體的數量相同或不相同。此外,上述磁性體,例如磁鐵,為永久超強磁性物質,可以是由亞鐵酸鍶、亞鐵酸鋇、釹鐵硼、鋁鎳鈷以及其它可被永久磁化的材料所製成。然而,本發明不限於磁性體的種類或材料。再者,第一承載板與第二承載板的材質為鋁,鋁跟印刷電路板的膨脹係數相似,因此 較能有效解決印刷電路板變形問題。應注意的是,以上列舉之第一承載板、第二承載板的材質選用僅為例示,非用以限定本發明,本發明所屬技術領域中具有通常知識者應視實際需要,選用適當之材質。 It should be understood that the present embodiment is intended to illustrate the number of holes and magnetic bodies, which may be changed according to the clamping force required to clamp the printed circuit board during the process, that is, the first magnetic body and the second magnetic body. The number is less than or equal to the number of the first hole and the second hole respectively. However, the present invention does not limit the number of the first hole and the second hole to be the same as or different from the number of the first magnetic body and the second magnetic body. . Further, the above-mentioned magnetic body, such as a magnet, is a permanent super-magnetic substance, and may be made of barium ferrite, barium ferrite, neodymium iron boron, aluminum nickel cobalt, and other materials which can be permanently magnetized. However, the invention is not limited to the kind or material of the magnetic body. Furthermore, the material of the first carrier plate and the second carrier plate is aluminum, and the expansion coefficient of the aluminum and the printed circuit board is similar, More effective in solving the problem of printed circuit board deformation. It should be noted that the materials of the first carrier board and the second carrier board listed above are merely exemplified, and are not intended to limit the present invention. Those having ordinary knowledge in the technical field of the present invention should select an appropriate material according to actual needs. .

雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

10‧‧‧電路板治具 10‧‧‧Circuit fixtures

100‧‧‧第一承載板 100‧‧‧First carrier board

140‧‧‧第一孔槽 140‧‧‧First slot

150‧‧‧第一細孔 150‧‧‧ first pore

160‧‧‧第一磁性體 160‧‧‧First magnetic body

200‧‧‧第二承載板 200‧‧‧Second carrier board

240‧‧‧第二孔槽 240‧‧‧Second hole

250‧‧‧第二細孔 250‧‧‧Second pores

260‧‧‧第二磁性體 260‧‧‧Second magnetic body

300‧‧‧印刷電路板 300‧‧‧Printed circuit board

A1‧‧‧第一深度 A1‧‧‧first depth

A2‧‧‧第二深度 A2‧‧‧second depth

T1‧‧‧第一厚度 T1‧‧‧first thickness

T2‧‧‧第二厚度 T2‧‧‧second thickness

Claims (14)

一種電路板治具,包含:一第一承載板,具有至少一第一孔槽;一第二承載板,具有至少一第二孔槽;至少一第一磁性體,配置於該第一孔槽內;以及至少一第二磁性體,配置於該第二孔槽內,其中,當該第一承載板與該第二承載板相互蓋合時,該第一磁性體與該第二磁性體相互磁吸以產生一磁吸力強度,以致一印刷電路板能受夾合於該第一承載板與該第二承載板之間,其中該印刷電路板介於該第一磁性體與該第二磁性體之間,且該磁吸力強度介於168高斯~550高斯之間。 A circuit board fixture comprising: a first carrier plate having at least one first slot; a second carrier having at least one second slot; at least one first magnetic body disposed in the first slot And the at least one second magnetic body is disposed in the second hole, wherein when the first carrier and the second carrier are covered with each other, the first magnetic body and the second magnetic body are mutually Magnetizing to generate a magnetic attraction strength such that a printed circuit board can be sandwiched between the first carrier plate and the second carrier plate, wherein the printed circuit board is interposed between the first magnetic body and the second magnetic body Between the bodies, and the magnetic attraction strength is between 168 Gauss and 550 Gauss. 如請求項1所述之電路板治具,其中該第一承載板具有二相對之第一面與第二面,該第一孔槽位於該第一承載板之該第一面,該第二承載板具有二相對之第三面與第四面,該第二孔槽位於該第二承載板之該第三面,其中當該第一承載板與該第二承載板相互蓋合時,該第一承載板之該第一面與該第二承載板之該第三面分別觸壓該印刷電路板。 The circuit board fixture of claim 1, wherein the first carrier has two opposite first and second faces, the first slot is located on the first side of the first carrier, the second The carrier plate has two opposite third and fourth faces, and the second hole is located on the third face of the second carrier, wherein when the first carrier and the second carrier are covered with each other, The first side of the first carrier board and the third side of the second carrier board respectively touch the printed circuit board. 如請求項2所述之電路板治具,其中該第一承載板更具有至少一第一細孔,該第一細孔位於該第一承載板之該第二面,且接通該第一孔槽,其中該第一細孔的口徑小 於該第一孔槽的口徑。 The circuit board fixture of claim 2, wherein the first carrier further has at least one first hole, the first hole is located on the second side of the first carrier, and the first is turned on a hole groove, wherein the first hole has a small diameter The diameter of the first hole. 如請求項2所述之電路板治具,其中該第二承載板更具有至少一第二細孔,該第二細孔位於該第二承載板相對該第四面,且接通該第二孔槽,其中該第二細孔的口徑小於該第二孔槽的口徑。 The circuit board fixture of claim 2, wherein the second carrier further has at least one second hole, the second hole is located on the second carrier opposite the fourth surface, and the second is turned on The hole groove, wherein the diameter of the second hole is smaller than the diameter of the second hole. 如請求項2所述之電路板治具,其中該第一承載板更具有至少一第一開口,該第一開口貫通該第一承載板之該第一面與該第二面,其中當該印刷電路板受夾合於該第一承載板與該第二承載板之間時,該第一開口暴露出部份之該印刷電路板。 The circuit board fixture of claim 2, wherein the first carrier plate further has at least one first opening, the first opening penetrating the first side and the second side of the first carrier board, wherein When the printed circuit board is sandwiched between the first carrier and the second carrier, the first opening exposes a portion of the printed circuit board. 如請求項2所述之電路板治具,其中該第二承載板更具有至少一第二開口,該第二開口貫通該第二承載板之該第三面與該第四面,其中當該印刷電路板受夾合於該第一承載板與該第二承載板之間時,該第二開口暴露出部份之該印刷電路板。 The circuit board fixture of claim 2, wherein the second carrier plate further has at least one second opening, the second opening extending through the third surface and the fourth surface of the second carrier board, wherein When the printed circuit board is sandwiched between the first carrier and the second carrier, the second opening exposes a portion of the printed circuit board. 如請求項1所述之電路板治具,其中該第一孔槽具有一第一深度,該第二孔槽具有一第二深度,該第一深度與該第二深度分別位於2.1公釐~2.8公釐所形成之範圍中。 The circuit board fixture of claim 1, wherein the first hole has a first depth, the second hole has a second depth, and the first depth and the second depth are respectively 2.1 mm. Within 2.8 mm of the range formed. 如請求項7所述之電路板治具,其中該第一磁性體具有一小於該第一深度之第一厚度,該第二磁性體具有一小於該第二深度之第二厚度,其中該第一厚度與該第二厚度分別位於1.8公釐~2.0公釐所形成之範圍中。 The circuit board fixture of claim 7, wherein the first magnetic body has a first thickness smaller than the first depth, and the second magnetic body has a second thickness smaller than the second depth, wherein the first A thickness and the second thickness are respectively in the range of 1.8 mm to 2.0 mm. 如請求項1所述之電路板治具,其中該第一孔槽具有一第一深度,該第一磁性體具有一小於該第一深度之第一厚度,其中該第一深度與該第一厚度的相差值為位於0.3公釐~0.7公釐所形成之範圍中,且該第一磁性體所產生之磁吸力強度的範圍為介於200高斯~260高斯之間。 The circuit board fixture of claim 1, wherein the first hole has a first depth, the first magnetic body has a first thickness smaller than the first depth, wherein the first depth and the first The difference in thickness is in the range of 0.3 mm to 0.7 mm, and the magnetic attraction force generated by the first magnetic body ranges from 200 gauss to 260 gauss. 如請求項1所述之電路板治具,其中該第一磁性體與該第二磁性體相互面向之頂面彼此之間所間隔的最小直線距離位於0.6公釐~1.4公釐所形成之範圍中,且該第一磁性體所產生之磁吸力強度的範圍為介於200高斯~520高斯之間。 The circuit board fixture of claim 1, wherein a minimum linear distance between the top surfaces of the first magnetic body and the second magnetic body facing each other is in a range of 0.6 mm to 1.4 mm. The magnetic attraction force generated by the first magnetic body ranges from 200 Gauss to 520 Gauss. 如請求項1所述之電路板治具,其中該第一磁性體透過鉚合壓鑄的方式被匹配地嵌合於第一孔槽內。 The circuit board fixture of claim 1, wherein the first magnetic body is matingly fitted into the first hole by means of riveting and die casting. 如請求項11所述之電路板治具,其中該第一孔槽之內壁抵壓於該第一磁性體露出該第一孔槽之一槽口的一面,其中該第一孔槽之該槽口的一最小直徑小於該第一磁性體的一最大寬度。 The circuit board fixture of claim 11, wherein the inner wall of the first hole is pressed against a side of the first magnetic body exposing a notch of the first hole, wherein the first hole is A minimum diameter of the slot is less than a maximum width of the first magnetic body. 如請求項1所述之電路板治具,其中該第二磁性體透過鉚合壓鑄的方式被匹配地嵌合於第二孔槽內。 The circuit board fixture of claim 1, wherein the second magnetic body is matingly fitted into the second hole by means of riveting and die casting. 如請求項13所述之電路板治具,其中該第二孔槽之內壁抵壓於該第二磁性體露出該第二孔槽之一槽口的一面,其中該第二孔槽之該槽口的一最小直徑小於該第二磁性體的一最大寬度。 The circuit board fixture of claim 13, wherein the inner wall of the second hole is pressed against a side of the second magnetic body that exposes a notch of the second hole, wherein the second hole A minimum diameter of the notch is less than a maximum width of the second magnetic body.
TW103139074A 2014-11-11 2014-11-11 Circuit board holder TWI592076B (en)

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