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Priority to TW103134591ApriorityCriticalpatent/TWI558284B/en
Publication of TW201615068ApublicationCriticalpatent/TW201615068A/en
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Publication of TWI558284BpublicationCriticalpatent/TWI558284B/en
Production Of Multi-Layered Print Wiring Board
(AREA)
Abstract
A method for manufacturing a circuit board element is provided. First a circuit board structure is provided, in which the circuit board structure includes a glass substrate and a first dielectric layer and a second dielectric layer respectively disposed on both sides of the glass substrate, and a first cut passage and a second cut passage opposite to the first cut passage are respectively disposed in the first dielectric layer and the second dielectric layer. Then, the glass substrate is cut, such that the circuit board structure becomes a plural of circuit board elements, in which a cut path passes the first cut passage and the second cut passage.
TW103134591A2014-10-032014-10-03Circuit board element and method for manufacturing the same
TWI558284B
(en)