TW201612644A - Positive photosensitive resin composition and application thereof - Google Patents
Positive photosensitive resin composition and application thereofInfo
- Publication number
- TW201612644A TW201612644A TW103131948A TW103131948A TW201612644A TW 201612644 A TW201612644 A TW 201612644A TW 103131948 A TW103131948 A TW 103131948A TW 103131948 A TW103131948 A TW 103131948A TW 201612644 A TW201612644 A TW 201612644A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- positive photosensitive
- photosensitive resin
- application
- nitrogen
- Prior art date
Links
Landscapes
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The present invention relates to a positive photosensitive resin composition and an application thereof. The aforementioned positive photosensitive resin composition includes a novolac resin (A), an ester compound of an ortho-naphthoquinone diazidesulfonic acid (B), a nitrogen-containing compound having a hydroxy phenyl group and/or a nitrogen heterocyclic compound having a hydroxy group (C) and a solvent (D). There can be more available time to deal with development by adjusting kinds or amounts of the novolac resin (A) or the nitrogen-containing compound having the hydroxy phenyl group and/or the nitrogen heterocyclic compound having the hydroxy group (C) in the positive photosensitive resin composition.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103131948A TWI537683B (en) | 2014-09-16 | 2014-09-16 | Positive photosensitive resin composition and application thereof |
CN201510555622.5A CN105425545B (en) | 2014-09-16 | 2015-09-02 | Positive photosensitive resin composition and use thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103131948A TWI537683B (en) | 2014-09-16 | 2014-09-16 | Positive photosensitive resin composition and application thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201612644A true TW201612644A (en) | 2016-04-01 |
TWI537683B TWI537683B (en) | 2016-06-11 |
Family
ID=55503835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103131948A TWI537683B (en) | 2014-09-16 | 2014-09-16 | Positive photosensitive resin composition and application thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105425545B (en) |
TW (1) | TWI537683B (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006225476A (en) * | 2005-02-16 | 2006-08-31 | Shin Etsu Chem Co Ltd | Positive type resist material and pattern formation method |
JP4657147B2 (en) * | 2006-05-24 | 2011-03-23 | 住友化学株式会社 | Colored photosensitive resin composition, color filter, image sensor and camera system |
TWI435176B (en) * | 2011-06-22 | 2014-04-21 | Chi Mei Corp | Positive photosensitive resin composition and method for forming patterns by using the same |
TWI453543B (en) * | 2012-05-16 | 2014-09-21 | Chi Mei Corp | Positive photosensitive resin composition and its application |
US20140242504A1 (en) * | 2013-02-22 | 2014-08-28 | Chi Mei Corporation | Positive photosensitive resin composition and method for forming patterns by using the same |
-
2014
- 2014-09-16 TW TW103131948A patent/TWI537683B/en not_active IP Right Cessation
-
2015
- 2015-09-02 CN CN201510555622.5A patent/CN105425545B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN105425545A (en) | 2016-03-23 |
TWI537683B (en) | 2016-06-11 |
CN105425545B (en) | 2019-11-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |