TW201612644A - Positive photosensitive resin composition and application thereof - Google Patents

Positive photosensitive resin composition and application thereof

Info

Publication number
TW201612644A
TW201612644A TW103131948A TW103131948A TW201612644A TW 201612644 A TW201612644 A TW 201612644A TW 103131948 A TW103131948 A TW 103131948A TW 103131948 A TW103131948 A TW 103131948A TW 201612644 A TW201612644 A TW 201612644A
Authority
TW
Taiwan
Prior art keywords
resin composition
positive photosensitive
photosensitive resin
application
nitrogen
Prior art date
Application number
TW103131948A
Other languages
Chinese (zh)
Other versions
TWI537683B (en
Inventor
Chi-Ming Liu
Chun-An Shih
Original Assignee
Chi Mei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chi Mei Corp filed Critical Chi Mei Corp
Priority to TW103131948A priority Critical patent/TWI537683B/en
Priority to CN201510555622.5A priority patent/CN105425545B/en
Publication of TW201612644A publication Critical patent/TW201612644A/en
Application granted granted Critical
Publication of TWI537683B publication Critical patent/TWI537683B/en

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The present invention relates to a positive photosensitive resin composition and an application thereof. The aforementioned positive photosensitive resin composition includes a novolac resin (A), an ester compound of an ortho-naphthoquinone diazidesulfonic acid (B), a nitrogen-containing compound having a hydroxy phenyl group and/or a nitrogen heterocyclic compound having a hydroxy group (C) and a solvent (D). There can be more available time to deal with development by adjusting kinds or amounts of the novolac resin (A) or the nitrogen-containing compound having the hydroxy phenyl group and/or the nitrogen heterocyclic compound having the hydroxy group (C) in the positive photosensitive resin composition.
TW103131948A 2014-09-16 2014-09-16 Positive photosensitive resin composition and application thereof TWI537683B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103131948A TWI537683B (en) 2014-09-16 2014-09-16 Positive photosensitive resin composition and application thereof
CN201510555622.5A CN105425545B (en) 2014-09-16 2015-09-02 Positive photosensitive resin composition and use thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103131948A TWI537683B (en) 2014-09-16 2014-09-16 Positive photosensitive resin composition and application thereof

Publications (2)

Publication Number Publication Date
TW201612644A true TW201612644A (en) 2016-04-01
TWI537683B TWI537683B (en) 2016-06-11

Family

ID=55503835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103131948A TWI537683B (en) 2014-09-16 2014-09-16 Positive photosensitive resin composition and application thereof

Country Status (2)

Country Link
CN (1) CN105425545B (en)
TW (1) TWI537683B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006225476A (en) * 2005-02-16 2006-08-31 Shin Etsu Chem Co Ltd Positive type resist material and pattern formation method
JP4657147B2 (en) * 2006-05-24 2011-03-23 住友化学株式会社 Colored photosensitive resin composition, color filter, image sensor and camera system
TWI435176B (en) * 2011-06-22 2014-04-21 Chi Mei Corp Positive photosensitive resin composition and method for forming patterns by using the same
TWI453543B (en) * 2012-05-16 2014-09-21 Chi Mei Corp Positive photosensitive resin composition and its application
US20140242504A1 (en) * 2013-02-22 2014-08-28 Chi Mei Corporation Positive photosensitive resin composition and method for forming patterns by using the same

Also Published As

Publication number Publication date
CN105425545A (en) 2016-03-23
TWI537683B (en) 2016-06-11
CN105425545B (en) 2019-11-08

Similar Documents

Publication Publication Date Title
CL2016002772A1 (en) Fast-acting insulin compositions
EA201992177A1 (en) COMPOSITIONS BASED ON NIRAPARIB
EP3241135A4 (en) Code instrumentation for runtime application self-protection
EP3281962A4 (en) Modified polycarbodiimide compound, curing agent, and thermosetting resin composition
BR112015002435A2 (en) method and device to notify app removal
EP3121651A4 (en) Radiation-sensitive resin composition and electronic component
BR112017008176A2 (en) Method of preparing glycolic acid carbonate.
EP3281963A4 (en) Modified polycarbodiimide compound, curing agent, and thermosetting resin composition
EP3613784A4 (en) Polycarbodiimide compound, production method therefor, and resin composition
EP3225662A4 (en) One-pack addition curable silicone composition, method for storing same, and method for curing same
EP3136173A4 (en) Radiation-sensitive resin composition, resin film, and electronic component
MX2016004885A (en) Functionalized polymer composition.
PH12016501252A1 (en) Novel tetrahydropyridopyrimidine compound or salt thereof
EP3121652A4 (en) Radiation-sensitive resin composition and electronic component
EP3279232A4 (en) Cyanic acid ester compound, curable resin composition containing said compound, and cured object obtained therefrom
PH12016501865A1 (en) Pyridine-2-amides useful as cb2 agonists
AU2017247004A1 (en) Method of treating atherosclerosis
TN2015000319A1 (en) Oxidatively curable coating composition
MX2017004621A (en) High edge cathodic epoxy electrocoat composition.
ZA201902996B (en) Stable solid composition based on an aromatic compound and uses thereof
NZ725417A (en) New sulfonylaminobenzamide compounds
GB2547812A (en) Proppant composition and method
EP3456784A4 (en) Composition for organic electronic element encapsulant, and encapsulant formed by using same
PH12016501704A1 (en) Method for producing 2-acyliminopyridine derivative
TN2015000318A1 (en) Oxidatively curable coating composition

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees