TW201612340A - Thin film forming apparatus and thin film forming method thereof - Google Patents

Thin film forming apparatus and thin film forming method thereof

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Publication number
TW201612340A
TW201612340A TW103134086A TW103134086A TW201612340A TW 201612340 A TW201612340 A TW 201612340A TW 103134086 A TW103134086 A TW 103134086A TW 103134086 A TW103134086 A TW 103134086A TW 201612340 A TW201612340 A TW 201612340A
Authority
TW
Taiwan
Prior art keywords
thin film
film forming
chamber
storage room
forming apparatus
Prior art date
Application number
TW103134086A
Other languages
Chinese (zh)
Other versions
TWI564419B (en
Inventor
Qian-Cheng Guo
zheng-zhong Li
meng-qi Li
zheng-rong He
Original Assignee
Univ Nat Central
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Central filed Critical Univ Nat Central
Priority to TW103134086A priority Critical patent/TWI564419B/en
Publication of TW201612340A publication Critical patent/TW201612340A/en
Application granted granted Critical
Publication of TWI564419B publication Critical patent/TWI564419B/en

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Abstract

A thin film forming apparatus, comprises: a chamber, having a storage room for vacuum pumping; a platform provided in the storage room of the chamber for receiving articles to be plated; a gas supply device that provides oxygen and/or argon gas to the storage room of the chamber; an organic monomer supply device that provides organic monomers to the storage room of the chamber; a sputtering gun provided in the storage room of the chamber; a sputtering target provided in the storage room of the chamber to which the electricity from the sputtering gun is applied. In this invention also provides a thin film forming method by using above-described thin film forming apparatus.
TW103134086A 2014-09-30 2014-09-30 Film forming apparatus and film forming method TWI564419B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103134086A TWI564419B (en) 2014-09-30 2014-09-30 Film forming apparatus and film forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103134086A TWI564419B (en) 2014-09-30 2014-09-30 Film forming apparatus and film forming method

Publications (2)

Publication Number Publication Date
TW201612340A true TW201612340A (en) 2016-04-01
TWI564419B TWI564419B (en) 2017-01-01

Family

ID=56360773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103134086A TWI564419B (en) 2014-09-30 2014-09-30 Film forming apparatus and film forming method

Country Status (1)

Country Link
TW (1) TWI564419B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586823B (en) * 2016-11-25 2017-06-11 Nat Chung-Shan Inst Of Science And Tech Apparatus and method for quantifying the amount of solid matter deposited
CN110819947A (en) * 2018-08-10 2020-02-21 无锡变格新材料科技有限公司 Sputtering machine and sputtering process thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518403A (en) * 1978-07-25 1980-02-08 Toshiba Corp Formation of organic thin film
US6663713B1 (en) * 1996-01-08 2003-12-16 Applied Materials Inc. Method and apparatus for forming a thin polymer layer on an integrated circuit structure
JP2000017457A (en) * 1998-07-03 2000-01-18 Shincron:Kk Thin film forming apparatus and thin film forming method
US6656831B1 (en) * 2000-01-26 2003-12-02 Applied Materials, Inc. Plasma-enhanced chemical vapor deposition of a metal nitride layer
JP5741382B2 (en) * 2011-09-30 2015-07-01 東京エレクトロン株式会社 Thin film forming method and film forming apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586823B (en) * 2016-11-25 2017-06-11 Nat Chung-Shan Inst Of Science And Tech Apparatus and method for quantifying the amount of solid matter deposited
CN110819947A (en) * 2018-08-10 2020-02-21 无锡变格新材料科技有限公司 Sputtering machine and sputtering process thereof

Also Published As

Publication number Publication date
TWI564419B (en) 2017-01-01

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