TW201612287A - Polishing agent for tungsten, stock solution for polishing agent, and polishing method - Google Patents

Polishing agent for tungsten, stock solution for polishing agent, and polishing method

Info

Publication number
TW201612287A
TW201612287A TW104125619A TW104125619A TW201612287A TW 201612287 A TW201612287 A TW 201612287A TW 104125619 A TW104125619 A TW 104125619A TW 104125619 A TW104125619 A TW 104125619A TW 201612287 A TW201612287 A TW 201612287A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing agent
tungsten
stock solution
agent
Prior art date
Application number
TW104125619A
Other languages
Chinese (zh)
Other versions
TWI670368B (en
Inventor
Makoto Mizutani
Hiroshi Ono
Takashi Yamashita
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201612287A publication Critical patent/TW201612287A/en
Application granted granted Critical
Publication of TWI670368B publication Critical patent/TWI670368B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A polishing agent for tungsten, the polishing agent containing abrasive grains, hydrogen peroxide, a silicomolybdic acid compound, and a water-soluble polymer.
TW104125619A 2014-08-07 2015-08-06 Polishing agent for tungsten, stock solution for polishing agent, and grinding method TWI670368B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-161561 2014-08-07
JP2014161561A JP6405776B2 (en) 2014-08-07 2014-08-07 Abrasive for tungsten, stock solution for abrasive, and polishing method

Publications (2)

Publication Number Publication Date
TW201612287A true TW201612287A (en) 2016-04-01
TWI670368B TWI670368B (en) 2019-09-01

Family

ID=55263965

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125619A TWI670368B (en) 2014-08-07 2015-08-06 Polishing agent for tungsten, stock solution for polishing agent, and grinding method

Country Status (3)

Country Link
JP (1) JP6405776B2 (en)
TW (1) TWI670368B (en)
WO (1) WO2016021708A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113993968A (en) * 2019-06-17 2022-01-28 福吉米株式会社 Polishing composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002080827A (en) * 2000-02-09 2002-03-22 Jsr Corp Aqueous dispersion for chemical and mechanical polishing
WO2003021651A1 (en) * 2001-08-16 2003-03-13 Asahi Kasei Chemicals Corporation Polishing fluid for metallic film and method for producing semiconductor substrate using the same
CN102690605B (en) * 2009-02-16 2015-01-21 日立化成株式会社 Polishing agent for copper polishing and polishing method using same
KR101330956B1 (en) * 2009-08-19 2013-11-18 히타치가세이가부시끼가이샤 Polishing solution for cmp and polishing method
JP6028432B2 (en) * 2012-07-17 2016-11-16 日立化成株式会社 Polishing liquid for CMP, storage liquid for polishing liquid for CMP, and polishing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113993968A (en) * 2019-06-17 2022-01-28 福吉米株式会社 Polishing composition

Also Published As

Publication number Publication date
TWI670368B (en) 2019-09-01
JP6405776B2 (en) 2018-10-17
JP2017183297A (en) 2017-10-05
WO2016021708A1 (en) 2016-02-11

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