TW201611685A - Method of printing conductive metal circuit diagram on circuit substrate using lithography and printed product thereof - Google Patents

Method of printing conductive metal circuit diagram on circuit substrate using lithography and printed product thereof Download PDF

Info

Publication number
TW201611685A
TW201611685A TW103130676A TW103130676A TW201611685A TW 201611685 A TW201611685 A TW 201611685A TW 103130676 A TW103130676 A TW 103130676A TW 103130676 A TW103130676 A TW 103130676A TW 201611685 A TW201611685 A TW 201611685A
Authority
TW
Taiwan
Prior art keywords
printing
conductive metal
printed
color
ink
Prior art date
Application number
TW103130676A
Other languages
Chinese (zh)
Inventor
Yan-Shu Lin
Original Assignee
Bai Sha Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bai Sha Technology Co Ltd filed Critical Bai Sha Technology Co Ltd
Priority to TW103130676A priority Critical patent/TW201611685A/en
Publication of TW201611685A publication Critical patent/TW201611685A/en

Links

Abstract

The invention relates to a method of printing a conductive metal circuit diagram on a circuit substrate using lithography and its printed product. The required finished product is printed by a multicolor automatic printing machine and a plurality of printing templates, wherein the first printing ink seat of the multicolor automatic printing machine is filled with adhesive glue to form a glue ink seat. Next, the second printing ink seat is modified as cooling type gold stamping equipment and configured with drum type conductive metal foil material to form a gold stamping ink seat. Afterward each printing ink seat is respectively filled with each color printing ink based upon printing demand to form a colored ink seat. Moreover, the glue ink seat and the template of each colored ink seat are required to be configured with correspondingly printing templates, and each printing template is respectively etched with desirable figures of circuits, marks, symbols, and scripts to be printed. Therefore, after circuit substrate raw material is fed according to the automatic conveying path of the multicolor automatic printing machine, integrated conductive metal circuit diagram and related printed and colored process can be rapidly completed.

Description

利用平版印刷術以印製導電金屬電路圖於電路基板之方法及其印製品 Method for printing conductive metal circuit diagram on circuit substrate by lithography and printed product thereof

本發明係與一種利用平版印刷術以印製導電金屬電路圖於電路基板之方法及其印製品有關,更詳而言之,特別是指一種藉由先進印刷器械及創新印刷流程,俾以同線作業方式,快速印刷完成電路基板所需之導電金屬電路圖及相關印刷目的,並據以提高其製造效率及節省總體製造成本之新穎發明。 The present invention relates to a method for printing a conductive metal circuit pattern on a circuit substrate by using lithography and a printed product thereof, and more particularly, an advanced printing device and an innovative printing process, which are in the same line The operation method is to quickly print the conductive metal circuit diagram and related printing purposes required for the circuit substrate, and to improve the manufacturing efficiency and the overall manufacturing cost.

按,所謂『印刷電路板』乃係任一電子設備之基礎單元,其上有可導通電子電路之金屬電路圖,而後便可於其上之預訂電路位置或標記處,施予各種電子零件、微處理器或其他電子組配件的安裝與連結,從而做為一電子設備的基本核心;而,本發明所欲探究者,將只是專指於電路基板素材上製作金屬電路圖之初始製程,特先陳明,謹請鑑察。 The so-called "printed circuit board" is the basic unit of any electronic device, which has a metal circuit diagram that can conduct electronic circuits, and then can apply various electronic parts and micros at the position or mark of the reserved circuit on it. The installation and connection of the processor or other electronic component accessories is the basic core of an electronic device; however, the inventors of the present invention will only refer to the initial process for fabricating a metal circuit diagram on the circuit substrate material. Ming, I would like to ask for inspection.

茲以現今最被泛用之網版印刷製程論之,其首先係於一絕緣電路基板素材上貼上一層導電金屬層,之後再藉由網版印刷術於該導電金屬層上印上一層所需電路圖形之防蝕保護料,復再利用蝕刻、感光技術或雷射雕刻術將電路圖形之外的多餘金屬層予以去除,然後再將防蝕保護料加以清除,進而便可獲致一僅留有金屬電路圖之印刷電路板『半成品』。 In today's most widely used screen printing process, it first attaches a layer of conductive metal to an insulating circuit substrate material, and then prints a layer on the conductive metal layer by screen printing. The anti-corrosion protection material of the circuit pattern is required, and the excess metal layer except the circuit pattern is removed by etching, photo-sensing technology or laser engraving, and then the anti-corrosion protection material is removed, thereby obtaining a metal only The printed circuit board of the circuit diagram is "semi-finished product".

而之所以將該等已製成金屬電路圖之印刷電路板稱之為半成品,乃係因必須再於其端面上印製若干所需的其他標記、符號或文字等 重要印刷步驟,俾利於相關後續作業之順利進行。因此,殊不論此印刷電路板成品其後續相關作業又將如何繁複,單就其最初之黏貼金屬層、網印防蝕保護料、蝕刻、清洗、印刷、再清洗(去除多餘油墨)等等諸多基本製程步驟,相信任何人皆可輕易瞭解並洞悉其製程之繁瑣、費時及不符經濟與環保效益,故實乃有急於被加以改進之必要。 The reason why these printed circuit boards which have been fabricated into metal circuit diagrams are referred to as semi-finished products, is that they must be printed on the end faces of other required marks, symbols or characters. Important printing steps to facilitate the smooth follow-up of related operations. Therefore, no matter how complicated the subsequent related operations of the finished printed circuit board, the original adhesive layer, the screen printing anti-corrosion protection material, etching, cleaning, printing, re-cleaning (removing excess ink), etc. Process steps, I believe that anyone can easily understand and understand the cumbersome, time-consuming and economic and environmental benefits of the process, so it is necessary to be eager to be improved.

緣此,發明人有鑑於上述實情,遂憑其多年來熟執印刷事業之實務經驗,積極投入研發與創新,本發明乃得以及早問世;故,其主要係以單一平版印刷流程便印製出預期之導電金屬電路圖及印製標記、符號、文字,乃至於在導電金屬電路圖上分區上色之總體印製程序,藉以大幅提高製造效率並節省印刷工時及成本,乃是為本發明之主要目的者。 Therefore, in view of the above facts, the inventors have actively invested in R&D and innovation based on their practical experience in the printing business for many years, and the invention has been published early; therefore, it is mainly printed in a single lithographic process. The expected conductive metal circuit diagram and printed markings, symbols, texts, and even the overall printing process of partitioning and coloring on the conductive metal circuit diagram, thereby greatly improving manufacturing efficiency and saving printing man-hours and costs, is the main Target person.

是,其係藉由一多色自動印刷機及複數片以上之印刷模版而印製成所需成品,其中,多色自動印刷機之第一道印刷墨座係裝填有黏著用黏膠(以下均將簡稱為黏膠墨座),復將第二道印刷墨座改裝為冷式燙金設備並組設有滾筒狀導電金屬箔膜材料(以下均將簡稱為燙金墨座),而後之各印刷墨座則分別依印刷需求裝填有各色印刷油墨(以下均將簡稱為上色墨座),再且,於黏膠墨座及各上色墨座之模版座處皆得配置有相應之印刷模版,而每一印刷模版上皆又已分別刻製有所欲印刷之電路、標記、符號、文字等應有圖形,因此,當電路基板素材依多色自動印刷機之自動輸送路線送入後,便得以迅速完成完整導電金屬電路圖及相關印刷及上色製程為其特徵者。 Yes, it is printed by a multi-color automatic printing machine and a plurality of printing stencils, wherein the first printing ink holder of the multi-color automatic printing machine is filled with adhesive glue (hereinafter They will all be referred to as viscose ink holders, and the second printing ink holder will be converted into a cold bronzing equipment and set with a roller-shaped conductive metal foil film material (hereinafter referred to as bronzing ink seat), and then each printing Ink holders are loaded with printing inks of various colors according to printing requirements (hereinafter referred to as color ink holders respectively), and corresponding printing templates are arranged at the stencil holders of the viscous ink holders and the ink holders. And each of the printing stencils has been separately patterned for the circuit, mark, symbol, text, etc. to be printed, therefore, when the circuit substrate material is fed according to the automatic conveying route of the multicolor automatic printing machine, It is possible to quickly complete the complete conductive metal circuit diagram and related printing and coloring processes.

10‧‧‧多色自動印刷機 10‧‧‧Multicolor automatic printing machine

11‧‧‧黏膠墨座 11‧‧‧Adhesive ink seat

12‧‧‧燙金墨座 12‧‧‧Bronze ink seat

13、14、15‧‧‧上色墨座 13, 14, ‧ ‧ color ink seat

111、131、141、151‧‧‧模版座 111, 131, 141, 151‧‧ ‧ template seat

16、17‧‧‧預備墨座 16, 17‧‧‧ Prepared ink seat

20‧‧‧導電金屬箔膜材料 20‧‧‧ Conductive metal foil film material

30‧‧‧電路印刷模版 30‧‧‧Circuit printing template

31‧‧‧電路刻紋 31‧‧‧ circuit engraving

32、34、36‧‧‧上色印刷模版 32, 34, 36‧‧‧ color printing templates

33、35、37‧‧‧圖樣刻紋 33, 35, 37‧‧‧ pattern engraving

40‧‧‧電路基板素材 40‧‧‧ circuit board material

401‧‧‧印刷端面 401‧‧‧Printed end face

41‧‧‧黏膠層 41‧‧‧Adhesive layer

42‧‧‧導電金屬電路圖 42‧‧‧Electrical metal circuit diagram

43‧‧‧一般上色層 43‧‧‧General color layer

第一圖:為經發明人改裝後之多色自動印刷機示意圖。 First picture: Schematic diagram of a multi-color automatic printing machine modified by the inventor.

第二圖:為本發明之一較佳印製流程實施例圖。 Second: A diagram of an embodiment of a preferred printing process of the present invention.

第三圖:為本發明電路印刷模版之一較佳實施例圖。 Third: A diagram of a preferred embodiment of a circuit printing stencil of the present invention.

第四圖:為本發明一上色印刷模版之較佳實施例圖。 Fourth Figure: A preferred embodiment of a color printing stencil of the present invention.

第五圖:為本發明另一上色印刷模版之較佳實施例圖。 Fig. 5 is a view showing a preferred embodiment of another color printing template of the present invention.

第六圖:為本發明再一上色印刷模版之較佳實施例圖。 Figure 6 is a view showing a preferred embodiment of a further printing stencil of the present invention.

第七圖:為依本發明所述製程製成印刷電路板之一較佳實施例局部剖面放大示意圖。 Figure 7 is a partially enlarged cross-sectional view showing a preferred embodiment of a printed circuit board made in accordance with the process of the present invention.

第八圖:為經發明人改裝後之另一多色自動印刷機示意圖。 Figure 8: Schematic diagram of another multicolor automatic printing press modified by the inventor.

為使進一步深入暸解本發明之技術手段與特徵,茲配合若干簡圖詳述於后:如第一圖所示者,為一經發明人改裝後之一多色自動印刷機10示意圖,其第一道為黏膠墨座11,其內裝填有黏著用黏膠,其第二道為燙金墨座12,並組設有滾筒狀導電金屬箔膜材料20,而後為各上色墨座13、14、15,並分別依印刷需求裝填有各色印刷油墨,再且,於黏膠墨座11及各上色墨座13、14、15之模版座111、131、141、151處皆得配置有相應之電路印刷模版30及上色印刷模版32、34、36,而每一電路印刷模版30及上色印刷模版32上皆又已分別刻製有所欲印刷之電路、標記、符號、文字等應有電路刻紋31及圖樣刻紋33、35、37,因此,當電路基板素材40依多色自動印刷機10 之自動輸送路線送入後,便得以迅速完成完整導電金屬電路圖及相關印刷及上色製程為其特徵者。 In order to further understand the technical means and features of the present invention, it is described in detail with a number of schematic diagrams: as shown in the first figure, a schematic diagram of a multicolor automatic printing machine 10 modified by an inventor, first The track is an adhesive ink holder 11 filled with adhesive adhesive, the second of which is a hot stamping ink holder 12, and is provided with a roll-shaped conductive metal foil film material 20, and then each color ink holder 13 and 14 And 15, respectively, are loaded with printing inks of various colors according to printing requirements, and further, correspondingly disposed at the stencil holders 111, 131, 141, 151 of the ink stick 11 and the color ink holders 13, 14, 15 The circuit printing stencil 30 and the color printing stencils 32, 34, 36, and each of the circuit printing stencil 30 and the color printing stencil 32 have been respectively spliced with the circuit, mark, symbol, text, etc. to be printed. There are circuit engraving 31 and pattern engraving 33, 35, 37, therefore, when the circuit substrate material 40 is multicolor automatic printing machine 10 Once the automatic conveyor route is delivered, it is possible to quickly complete the complete conductive metal circuit diagram and related printing and coloring processes.

據此,茲請再配合第二圖所示之一較佳印製流程例圖、第三圖所示電路印刷模版例圖及第四、五、六圖所示各上色印刷模版例圖為例,以詳述其印製流程:首先,當電路基板素材40進入多色自動印刷機10之黏膠墨座11時,其將依據相應電路印刷模版30上之電路刻紋31而被塗上與該電路刻紋31相同之黏膠層41,復再進入燙金墨座12後,該黏膠層41將藉其黏力而將導電金屬箔膜材料20上之附著導電金屬黏走並因此而成為導電金屬電路圖42,而後再進入其後之各色上色墨座13、14、15,便可依據相應之上色印刷模版32、34、36圖樣刻紋33、35、37並形成一般上色層43,從而迅速印出預期所需之各式標記(圖中係以藍色表現之)、符號、文字(圖中係以紅色表現之)及色彩者。 Accordingly, please cooperate with one of the preferred printing process examples shown in the second figure, the circuit printing template example shown in the third figure, and the color printing template examples shown in the fourth, fifth and sixth figures. For example, to describe its printing process: first, when the circuit substrate material 40 enters the adhesive ink holder 11 of the multi-color automatic printing machine 10, it will be coated according to the circuit engraving 31 on the corresponding circuit printing stencil 30. The adhesive layer 41, which is the same as the circuit pattern 31, is re-entered into the gilding ink holder 12, and the adhesive layer 41 will adhere the conductive metal on the conductive metal foil film material 20 by its adhesive force and thus After forming the conductive metal circuit pattern 42, and then entering the subsequent color ink holders 13, 14, 15, the colored printing plates 32, 34, 36 can be patterned according to the corresponding patterns 33, 35, 37 and formed into general colors. Layer 43, thereby quickly printing out the various types of marks that are expected to be desired (indicated in blue in the figure), symbols, text (shown in red in the figure), and color.

之所以要在導電金屬電路圖42上施予局部或特定區域或特定線條處做上色或分色處理(圖中係以金黃色表現之),主要係為使本產品在被送到後端利用時(即諸如鑽孔、焊接、切割、封裝…等後端製程),讓後端利用人員可依據顏色之清楚顯示來做為加工位置之判別標的,除有加速作業效率之提升外,更有防止錯誤加工之絕佳效用者。 The reason why the local or specific area or specific lines are applied to the conductive metal circuit pattern 42 for coloring or color separation (in the figure is golden yellow) is mainly to make the product be used in the back end. When the back-end process (such as drilling, welding, cutting, packaging, etc.), the back-end user can use the clear display of the color as the discriminating target of the processing position, in addition to the improvement of the efficiency of the accelerated operation, A great utility for preventing erroneous processing.

前述之電路基板素材40可為電木板、玻璃纖維板或塑料基板等目前被泛用之各式硬、軟質印刷電路用絕緣板體者。 The circuit board material 40 described above may be an insulating board for various types of hard and soft printed circuits which are currently widely used, such as an electric wood board, a fiberglass board, or a plastic board.

再者,在最後端上色墨座15之後,將預留有若干預備墨座16、17,俾供做為更多印刷需求時之使用。 Furthermore, after the ink fountain 15 is finished at the last end, a plurality of preliminary ink holders 16, 17 will be reserved for use in more printing needs.

當然,為增加導電金屬電路圖42之金屬塗層厚度,以確保其 導電係數值能符合必要之導電需求,其得被重覆進行同一印刷面之上膠及燙金步驟;同理,該電路基板素材40也可被施以雙面印刷流程,惟此皆係屬相同的簡易轉用手法,故發明人將不予贅述。 Of course, in order to increase the thickness of the metal coating of the conductive metal circuit of Figure 42, to ensure its The conductivity value can meet the necessary electrical conductivity requirements, and it must be repeated for the same printing surface over the glue and bronzing step; similarly, the circuit substrate material 40 can also be applied to the double-sided printing process, but the same is the same The simple transfer method, so the inventor will not repeat them.

是,本發明利用多色自動印刷機10及適切的增設、改裝,除能充分運用既有印刷設備以提升其產業利用效能外,更可大幅減少印刷電路板之製作、印刷工時與成本者。 Therefore, the present invention utilizes the multi-color automatic printing machine 10 and the appropriate addition and modification, in addition to fully utilizing the existing printing equipment to enhance the industrial utilization efficiency, and can greatly reduce the production, printing time and cost of the printed circuit board. .

因此,利用本發明所述方法而獲致之印製品則如第七圖所示,其係包括:一電路基板素材40,可為電木板、玻璃纖維板或塑料基板等各式硬、軟質印刷電路用絕緣板體;一黏膠層41,塗佈於電路基板素材40之印刷端面401上,且其塗佈範圍即等同於導電金屬電路圖42圖樣;一導電金屬電路圖42,黏著於黏膠層41之上,且係為導電金屬所構成;一一般上色層43,具各種顏色,印製於電路基板素材40之印刷端面401或導電金屬電路圖42之上,使成各式標記、符號、文字或特定局部區塊或特定線條者。 Therefore, the printed product obtained by the method of the present invention is as shown in the seventh figure, and includes a circuit substrate material 40, which can be used for various hard and soft printed circuits such as electric wood, fiberglass or plastic substrates. An insulating plate body; an adhesive layer 41 is coated on the printing end surface 401 of the circuit substrate material 40, and the coating range thereof is equivalent to the conductive metal circuit pattern 42; a conductive metal circuit pattern 42 is adhered to the adhesive layer 41. The upper layer is formed of a conductive metal; a general color layer 43 having various colors is printed on the printed end surface 401 of the circuit substrate material 40 or the conductive metal circuit pattern 42 to form various marks, symbols, characters or Specific local block or specific line.

此外,在第八圖所顯示者,為另一種經發明人改裝後之多色自動印刷機10,其係為因應電路基板素材40有分為張頁式及捲筒式態樣,故以輪捲式送料及捲收電路基板素材40機制配合之,而其他印刷流程則不變,據以提高其普遍適用性者。 In addition, in the eighth figure, another multi-color automatic printing machine 10 modified by the inventor is in accordance with the circuit board material 40 divided into a sheet type and a roll type, so the wheel The roll feeding and retracting circuit substrate material 40 mechanism is coordinated, and other printing processes are unchanged, thereby improving the general applicability thereof.

又,本文中所指多色自動印刷機10,屬現有之印刷機具設備,其運作模式及流程,誠非屬本發明所欲訴求之特徵所在,故發明人亦 將不予贅述,併請鑑察。 Moreover, the multi-color automatic printing machine 10 referred to in the present invention belongs to the existing printing machine equipment, and its operation mode and flow are not the characteristics of the invention claimed, so the inventor also Will not repeat them, and please check.

綜觀以上所言,本發明其不僅係一利用自然法則所獲致之高度思想創作,更因而精進產業技術與運用範疇於無形,除未見於市售同類物品及相關刊物文獻外,更已具備『新穎』、『進步』的實用價值與積極效益,顯已符合專利申請要件,理當獲得專利法之保護,爰依法提出申請。 Looking at the above, the present invention is not only a high-level ideological creation obtained by utilizing natural laws, but also an intangible industrial technology and application category. In addition to not being found in similar articles and related publications in the market, it has already possessed novelty. The practical value and positive benefits of "progress" have been consistent with the requirements for patent applications, and it is reasonable to obtain the protection of the patent law and apply in accordance with the law.

10‧‧‧多色自動印刷機 10‧‧‧Multicolor automatic printing machine

11‧‧‧黏膠墨座 11‧‧‧Adhesive ink seat

12‧‧‧燙金墨座 12‧‧‧Bronze ink seat

13、14、15‧‧‧上色墨座 13, 14, ‧ ‧ color ink seat

111、131、141、151‧‧‧模版座 111, 131, 141, 151‧‧ ‧ template seat

16、17‧‧‧預備墨座 16, 17‧‧‧ Prepared ink seat

20‧‧‧導電金屬箔膜材料 20‧‧‧ Conductive metal foil film material

30‧‧‧電路印刷模版 30‧‧‧Circuit printing template

32、34、36‧‧‧上色印刷模版 32, 34, 36‧‧‧ color printing templates

40‧‧‧電路基板素材 40‧‧‧ circuit board material

Claims (4)

一種利用平版印刷術以印製導電金屬電路圖於電路基板之方法及其印製品,其係藉由一多色自動印刷機及複數片以上之印刷模版而印製成所需成品,其中,多色自動印刷機之第一道印刷墨座係裝填有黏著用黏膠,復將第二道印刷墨座改裝為冷式燙金設備並組設有滾筒狀導電金屬箔膜材料,而後之各印刷墨座則分別依印刷需求裝填有各色印刷油墨,再且,於黏膠墨座及各上色墨座之模版座處皆得配置有相應之印刷模版,而每一印刷模版上皆又已分別刻製有所欲印刷之電路、標記、符號、文字等應有圖形,是,當電路基板素材依多色自動印刷機之自動輸送路線送入後,便得以迅速完成完整導電金屬電路圖及相關印刷及上色製程為其特徵者。 A method for printing a conductive metal circuit pattern on a circuit substrate by using lithography, and a printed product thereof, which is printed by a multi-color automatic printing machine and a plurality of printing templates, wherein the multi-color is printed The first printing ink holder of the automatic printing machine is filled with adhesive glue, and the second printing ink holder is converted into a cold bronzing device and a roller-shaped conductive metal foil film material is set, and then each printing ink seat is assembled. The printing inks of each color are respectively loaded according to the printing requirements, and corresponding printing templates are arranged at the stencil holders of the ink sticks and the ink cups, and each printing stencil is separately spliced separately. The circuit, mark, symbol, text, etc. that you want to print should have graphics. When the circuit substrate material is fed according to the automatic conveying route of the multi-color automatic printing machine, the complete conductive metal circuit diagram and related printing and printing can be completed quickly. The color process is its characteristic. 如申請專利範圍第1項所述一種利用平版印刷術以印製導電金屬電路圖於電路基板之方法及其印製品,其多色自動印刷機得預留有預備墨座者。 A method for printing a conductive metal circuit pattern on a circuit substrate and a printed product thereof by using lithography as described in claim 1, wherein the multicolor automatic printing machine is provided with a reserve ink holder. 一種利用平版印刷術以印製導電金屬電路圖於電路基板之方法及其印製品,其係藉由一多色自動印刷機及複數片以上之印刷模版而印製成所需成品,其中,多色自動印刷機之第一道印刷墨座係裝填有黏著用黏膠,復將第二道印刷墨座改裝為冷式燙金設備並組設有滾筒狀導電金屬箔膜材料,而後之各印刷墨座則分別依印刷需求裝填有各色印刷油墨,再且,於黏膠墨座及各上色墨座之模版座處皆得配置有相應之印刷模版,而每一印刷模版上皆又已分別刻製有所欲印刷之電路、標記、符號、文字等應有圖形,是,當電路基板素材依多色自動印刷機之自動輸送路線送入後,便得以迅速完成完整導電金屬電路圖及相關印刷及上色製程,其印製品係包括有:一電路基板素材,可為電木板、玻璃纖維板或塑料基板等各式硬、軟 質印刷電路用絕緣板體;一黏膠層,塗佈於電路基板素材之印刷端面上,且其塗佈範圍即等同於導電金屬電路圖圖樣;一導電金屬電路圖,黏著於黏膠層之上,且係為導電金屬所構成;一一般上色層,具各種顏色,印製於電路基板素材之印刷端面或導電金屬電路圖之上,使成各式標記、符號、文字或特定局部區塊或特定線條者。 A method for printing a conductive metal circuit pattern on a circuit substrate by using lithography, and a printed product thereof, which is printed by a multi-color automatic printing machine and a plurality of printing templates, wherein the multi-color is printed The first printing ink holder of the automatic printing machine is filled with adhesive glue, and the second printing ink holder is converted into a cold bronzing device and a roller-shaped conductive metal foil film material is set, and then each printing ink seat is assembled. The printing inks of each color are respectively loaded according to the printing requirements, and corresponding printing templates are arranged at the stencil holders of the ink sticks and the ink cups, and each printing stencil is separately spliced separately. The circuit, mark, symbol, text, etc. that you want to print should have graphics. When the circuit substrate material is fed according to the automatic conveying route of the multi-color automatic printing machine, the complete conductive metal circuit diagram and related printing and printing can be completed quickly. Color process, the printed products include: a circuit substrate material, which can be hard, soft, such as electric wood, fiberglass board or plastic substrate An insulating plate body for a printed circuit; an adhesive layer coated on a printing end surface of the circuit substrate material, and the coating range is equivalent to a conductive metal circuit pattern; a conductive metal circuit pattern is adhered to the adhesive layer, And is composed of a conductive metal; a general color layer, with various colors, printed on the printed end face of the circuit substrate material or on the conductive metal circuit diagram, so as to make various marks, symbols, characters or specific local blocks or specific Lines. 如申請專利範圍第3項所述一種利用平版印刷術以印製導電金屬電路圖於電路基板之方法及其印製品,其電路基板素材得被雙面印刷施作者。 A method for printing a conductive metal circuit pattern on a circuit substrate and a printed product thereof by lithography as described in claim 3, wherein the circuit substrate material is printed by a double-sided printing application.
TW103130676A 2014-09-04 2014-09-04 Method of printing conductive metal circuit diagram on circuit substrate using lithography and printed product thereof TW201611685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103130676A TW201611685A (en) 2014-09-04 2014-09-04 Method of printing conductive metal circuit diagram on circuit substrate using lithography and printed product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103130676A TW201611685A (en) 2014-09-04 2014-09-04 Method of printing conductive metal circuit diagram on circuit substrate using lithography and printed product thereof

Publications (1)

Publication Number Publication Date
TW201611685A true TW201611685A (en) 2016-03-16

Family

ID=56085348

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103130676A TW201611685A (en) 2014-09-04 2014-09-04 Method of printing conductive metal circuit diagram on circuit substrate using lithography and printed product thereof

Country Status (1)

Country Link
TW (1) TW201611685A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106550547A (en) * 2016-10-17 2017-03-29 北京梦之墨科技有限公司 A kind of printed circuit color printing apparatus, method and printed circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106550547A (en) * 2016-10-17 2017-03-29 北京梦之墨科技有限公司 A kind of printed circuit color printing apparatus, method and printed circuit

Similar Documents

Publication Publication Date Title
CN103054284B (en) Metallic coin stamped with holographic anti-counterfeiting pattern and manufacturing method thereof
CN104924790A (en) High-precision overlay gold stamping paper and manufacturing method thereof
SE535467C2 (en) Method of printing product characteristics on a substrate sheet
WO2010039655A8 (en) Foiled articles and methods of making same
CN103950310A (en) Roller painting reaction and reverse glazing combined process
CN108583039B (en) Cold gold stamping process and instant lottery ticket adopting same
CN204109589U (en) A kind of transfer film of printable preparation
CN109466199B (en) Local adhesive pressing printing production process for multilayer label
CN103991325A (en) Method and system for 2D/3D microstructure texture decoration on surface of raw material
CN110789261A (en) Laser 3D holographic thermoprinting film and preparation process thereof
CN106852033A (en) High precision part very high current printed circuit board processing method
CN107089092A (en) A kind of electrochemical aluminium gold-stamped production technology
CN204936375U (en) A kind of noble metal frosted minute surface imitative print thin slice
CN106975893A (en) A kind of sheet material and preparation method thereof
TW201611685A (en) Method of printing conductive metal circuit diagram on circuit substrate using lithography and printed product thereof
CN105584242A (en) Method using lithography to print conductive metal circuit diagram on circuit board and printing product thereof
CN102501664A (en) Holographic dot printing method
CN102642367B (en) Gold-base paper ticket/card and manufacture method and application thereof
JP3193742U (en) Early-stage die-stamped printed matter with pseudo etching and ice pattern in the same production line by rotary printing and printing apparatus therefor
TW201231306A (en) Manufacturing method of leather printing body with color patterns
CN102501667B (en) Holographic dot printing paper
KR101094068B1 (en) Method for manufacturing three dimensions lens film
KR101079103B1 (en) Manufacturing method of a copper plate for printing design on a film applied to a panel of home appliances
KR20200057000A (en) Decorative prints
JP3193741U (en) Early-stage die-stamped printed matter in the same production line by rotary printing and printing apparatus therefor