TW201606021A - Adhesive composition, adhesive sheet, laminate, picture display device and output/input device - Google Patents

Adhesive composition, adhesive sheet, laminate, picture display device and output/input device Download PDF

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TW201606021A
TW201606021A TW104120483A TW104120483A TW201606021A TW 201606021 A TW201606021 A TW 201606021A TW 104120483 A TW104120483 A TW 104120483A TW 104120483 A TW104120483 A TW 104120483A TW 201606021 A TW201606021 A TW 201606021A
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component
adhesive composition
mass
adhesive
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TW104120483A
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TWI669364B (en
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金洋平
木口貴美子
清水政一
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綜研化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06Copolymers with styrene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02Homopolymers or copolymers of hydrocarbons
    • C09J125/04Homopolymers or copolymers of styrene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

This invention provides an adhesive composition, which includes (A) at least one of a block copolymer selected from an X-Y-X-type hydrogenated styrenic block copolymer and an X-Y-type hydrogenated styrenic block copolymer, (B) a softener as a liquid under room temperature (23 DEG C), (C) a terpene tackifier resin, and (D) an aromatic tackifier resin, wherein, with respect to the (A) block copolymer 100 parts by mass, the composition includes the (B) softener 10 parts by mass or more and 300 parts by mass or less, the (C) terpene tackifier resin 1 part by mass or more and 30 parts by mass or less, and the (D) aromatic tackifier resin 1 part by mass or more and 50 parts by mass or less, respectively. In addition, with respect to the content of the (B) softener, the content of the (C) terpene tackifier resin (the content of the (C) terpene tackifier resin / the content of the (B) softener) is 0.05 or more and 0.70 or less.

Description

黏著劑組成物、黏著片、積層體、畫像顯示裝置及輸出輸入裝置 Adhesive composition, adhesive sheet, laminated body, image display device, and output input device

本發明係有關黏著劑組成物、黏著片、積層體、畫像顯示裝置及輸出輸入裝置。 The present invention relates to an adhesive composition, an adhesive sheet, a laminate, an image display device, and an output input device.

近年來,正在積極地進行對黏著劑組成物賦予各種功能之開發(例如:專利公報1)。 In recent years, development of various functions for an adhesive composition has been actively carried out (for example, Patent Publication 1).

[先前技術文獻] [Previous Technical Literature]

[專利文獻1]日本特開2011-63639號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-63639

本案的發明人們發現,使用具有特定成分之黏著劑組成物所形成之黏著片,即使長期間保存亦難以發生黏著片之經時劣化(黏著力降低等),遂而完成本發明之低極性黏著劑組成物。本發明提供一種黏著劑組成物、使用該黏著劑組成物而得的黏著片、積層體、畫像顯示裝 置及輸出輸入裝置,該黏著劑組成物可長期間維持黏著力,並具有高透明性及低的介電常數,且可得到密接性、耐候性、柔軟性、可撓性、黏性、階差追隨性(step followability)及耐溼熱白化性優異之黏著劑層。 The inventors of the present invention have found that the use of an adhesive sheet formed of an adhesive composition having a specific composition makes it difficult to cause deterioration of the adhesive sheet over time (adhesion reduction, etc.) even after long-term storage, thereby completing the low-polarity adhesion of the present invention. Agent composition. The present invention provides an adhesive composition, an adhesive sheet, a laminate, and an image display device using the adhesive composition And an output input device, the adhesive composition can maintain adhesion for a long period of time, has high transparency and low dielectric constant, and can obtain adhesion, weather resistance, flexibility, flexibility, viscosity, and order Adhesive layer excellent in step followability and resistance to moist heat whitening.

1.本發明之一種態樣之黏著劑組成物,其包含:(A)選自X-Y-X型氫化苯乙烯系嵌段共聚物及X-Y型氫化苯乙烯系嵌段共聚物中之至少1種嵌段共聚物、(B)常溫(23℃)下為液體之軟化劑、(C)萜烯系增黏樹脂,及(D)芳香族系增黏樹脂,其中,相對於前述(A)嵌段共聚物100質量份,分別含有前述(B)軟化劑10質量份以上300質量份以下、前述(C)萜烯系增黏樹脂1質量份以上30質量份以下及前述(D)芳香族系增黏樹脂1質量份以上50質量份以下,且相對於前述(B)軟化劑之含量,前述(C)萜烯系增黏樹脂之含量(前述(C)萜烯系增黏樹脂之含量/前述(B)軟化劑之含量)為0.05以上0.70以下。 An adhesive composition according to an aspect of the invention comprising: (A) at least one block selected from the group consisting of an XYX type hydrogenated styrene block copolymer and an XY type hydrogenated styrene block copolymer. a copolymer, (B) a liquid softener at normal temperature (23 ° C), (C) a terpene tackifying resin, and (D) an aromatic tackifying resin, wherein the block copolymerization with respect to the above (A) 100 parts by mass of the above-mentioned (B) softener, 10 parts by mass or more and 300 parts by mass or less, and (C) a terpene-based tackifying resin: 1 part by mass or more and 30 parts by mass or less, and the (D) aromatic-based thickening layer 1 part by mass or more and 50 parts by mass or less of the resin, and the content of the (C) terpene-based tackifying resin relative to the content of the (B) softening agent (the content of the (C) terpene-based tackifying resin / the foregoing ( B) The content of the softening agent is 0.05 or more and 0.70 or less.

2.上述1記載之黏著劑組成物中,前述(A)嵌段共聚物可為X-Y-X型氫化苯乙烯系嵌段共聚物及X-Y型氫化苯乙烯系嵌段共聚物之混合物。 2. The adhesive composition according to the above 1, wherein the (A) block copolymer is a mixture of an X-Y-X type hydrogenated styrene block copolymer and an X-Y type hydrogenated styrene block copolymer.

3.上述1或2記載之黏著劑組成物中,前述(A)嵌段共聚物之苯乙烯含有率可為10質量%以上35質 量%以下。 3. The adhesive composition according to the above 1 or 2, wherein the (A) block copolymer has a styrene content of 10% by mass or more and 35 masses. The amount is below %.

4.上述1至3中任一項記載之黏著劑組成物中,由該黏著劑組成物所得之黏著劑層的相對介電常數可為1以上3.5以下。 4. The adhesive composition according to any one of the above 1 to 3, wherein the adhesive layer obtained from the adhesive composition has a relative dielectric constant of 1 or more and 3.5 or less.

5.上述1至4中任一項記載之黏著劑組成物中,由該黏著劑組成物所得之膜厚50μm的黏著劑層之水蒸氣穿透率可為在JIS Z0208、40℃×90%RH中未達100g/m2.日。 In the adhesive composition according to any one of the above 1 to 4, the water vapor permeability of the adhesive layer having a film thickness of 50 μm obtained from the adhesive composition may be JIS Z0208, 40 ° C × 90% Less than 100g/m 2 in RH. day.

6.上述1至5中任一項記載之黏著劑組成物,其可用於構成觸控面板式輸出輸入裝置的構件之貼合。 6. The adhesive composition according to any one of the above 1 to 5, which can be used for bonding a member constituting a touch panel type input/output device.

7.上述1至5中任一項記載之黏著劑組成物,其可用於構成有機EL顯示器的構件之貼合。 7. The adhesive composition according to any one of the above 1 to 5, which can be used for bonding a member constituting an organic EL display.

8.本發明之一種態樣之積層體,其包含由上述1至5中任一項記載之黏著劑組成物所形成之黏著劑層與阻隔膜。 8. The layered body according to one aspect of the invention, comprising the adhesive layer formed of the adhesive composition according to any one of the above 1 to 5, and a barrier film.

9.本發明之一種態樣之黏著片,係可將由上述1至5中任一項記載之黏著劑組成物所形成之膜進行乾燥而得。 An adhesive sheet according to an aspect of the present invention, which is obtained by drying a film formed of the adhesive composition according to any one of the above 1 to 5.

10.本發明之一種態樣之畫像顯示裝置,其包含使用上述1至5中任一項記載之黏著劑組成物所形成之黏著劑層。 An image display device according to an aspect of the invention, comprising the adhesive layer formed using the adhesive composition according to any one of the above 1 to 5.

11.本發明之一種態樣之輸出輸入裝置,其包含使用上述1至5中任一項記載之黏著劑組成物所形成之黏著劑層。 An output input device according to an aspect of the invention, comprising the adhesive layer formed using the adhesive composition according to any one of items 1 to 5 above.

依據上述1至5中任一項記載之黏著劑組成物,藉由以預定比率包含(經調配)前述(A)嵌段共聚物、前述(B)軟化劑、前述(C)萜烯系增黏樹脂及前述(D)芳香族系增黏樹脂,即可提供一種黏著性能優異,且作成黏著片時難以發生經時劣化的黏著劑組成物。 The adhesive composition according to any one of the above 1 to 5, which comprises (adapted) the (A) block copolymer, the (B) softener, and the (C) decene by a predetermined ratio. The adhesive resin and the (D) aromatic tackifying resin can provide an adhesive composition which is excellent in adhesive properties and which is less likely to deteriorate with time when the adhesive sheet is formed.

而且,上述黏著劑組成物係具有下述特徵:藉由以上述比率包含前述(A)嵌段共聚物、前述(B)軟化劑、前述(C)萜烯系增黏樹脂及前述(D)芳香族系增黏樹脂,因極性低且為疏水性,故所得黏著劑層之相對介電常數低,且水蒸氣阻隔性優異。 Further, the above-mentioned adhesive composition has the following feature: the (A) block copolymer, the (B) softener, the (C) terpene tackifying resin, and the above (D) are contained in the above ratio. Since the aromatic tackifying resin is low in polarity and hydrophobic, the obtained adhesive layer has a low relative dielectric constant and is excellent in water vapor barrier properties.

由此,使用上述黏著劑組成物所得之黏著劑層(黏著片)可在例如:構成觸控面板式輸出輸入裝置的構件之貼合、或要求水蒸氣阻隔性之用途(例如:有機EL顯示器等之畫像顯示裝置或輸出輸入裝置等對水具有脆弱性之用途)中使用。 Thus, the adhesive layer (adhesive sheet) obtained by using the above-described adhesive composition can be used, for example, for bonding a member constituting a touch panel type input/output device or for requiring water vapor barrier properties (for example, an organic EL display) It is used in applications such as image display devices or output input devices that are vulnerable to water.

以下,參照圖式,詳細說明本發明。此外,本發明中,除非特別另外指明,「份」意指「質量份」、「%」意指「質量%」。 Hereinafter, the present invention will be described in detail with reference to the drawings. Further, in the present invention, "parts" means "parts by mass" and "%" means "mass%" unless otherwise specified.

1、111‧‧‧基材 1, 111‧‧‧ substrate

2、12、14、17、30‧‧‧黏著劑層 2, 12, 14, 17, 30‧‧ ‧ adhesive layer

3‧‧‧有機EL元件 3‧‧‧Organic EL components

10‧‧‧液晶顯示裝置(LCD) 10‧‧‧Liquid Crystal Display Unit (LCD)

11、15‧‧‧偏光板 11, 15‧‧‧ polarizing plate

13‧‧‧液晶面板 13‧‧‧LCD panel

16‧‧‧防碎膜 16‧‧‧Smashproof film

18‧‧‧ITO層 18‧‧‧ITO layer

19‧‧‧玻璃面板 19‧‧‧ glass panel

20‧‧‧觸控面板部 20‧‧‧Touch Panel Department

21‧‧‧基材之第1層 21‧‧‧The first layer of the substrate

22‧‧‧基材之第2層 22‧‧‧The second layer of the substrate

100‧‧‧觸控面板式輸出輸入裝置 100‧‧‧Touch panel type input input device

110、120、130‧‧‧積層體 110, 120, 130‧‧ ‧ laminated body

第1圖係示意性地呈示本發明之一實施形態的輸出輸入裝置(觸控面板式輸出輸入裝置)之構成的剖面圖。 Fig. 1 is a cross-sectional view schematically showing the configuration of an input/output device (touch panel type input/output device) according to an embodiment of the present invention.

第2圖係示意性地呈示包含由本發明之一實施形態的 黏著劑組成物所形成之黏著劑層的水蒸氣阻隔性積層體之剖面圖。 Figure 2 is a schematic representation of an embodiment of the present invention. A cross-sectional view of a water vapor barrier laminate of an adhesive layer formed by an adhesive composition.

第3圖係示意性地呈示包含由本發明之一實施形態的黏著劑組成物所形成之黏著劑層的水蒸氣阻隔性積層體之剖面圖。 Fig. 3 is a cross-sectional view schematically showing a water vapor barrier layered product comprising an adhesive layer formed of an adhesive composition according to an embodiment of the present invention.

第4圖係示意性地呈示包含由本發明之一實施形態的黏著劑組成物所形成之黏著劑層的水蒸氣阻隔性積層體之剖面圖。 Fig. 4 is a cross-sectional view schematically showing a water vapor barrier layered product comprising an adhesive layer formed of an adhesive composition according to an embodiment of the present invention.

[用以實施發明之形態] [Formation for implementing the invention]

1.黏著劑組成物 Adhesive composition

本發明之一實施形態的黏著劑組成物,其包含:(A)選自X-Y-X型氫化(加氫:hydrogenated)苯乙烯系嵌段共聚物及X-Y型氫化苯乙烯系嵌段共聚物中之至少1種嵌段共聚物(以下,有時簡稱為「(A)成分」)、(B)常溫(23℃)下為液體之軟化劑(以下,有時簡稱為「(B)成分」)、(C)萜烯系增黏樹脂(以下,有時簡稱為「(C)成分」)及(D)芳香族系增黏樹脂(以下,有時簡稱為「(D)成分」)。 An adhesive composition according to an embodiment of the present invention, comprising: (A) at least one selected from the group consisting of an XYX type hydrogenated (hydrogenated) styrene block copolymer and an XY type hydrogenated styrene block copolymer; One type of block copolymer (hereinafter sometimes referred to as "(A) component"), (B) a liquid softener at normal temperature (23 ° C) (hereinafter, simply referred to as "(B) component"), (C) a terpene-based tackifying resin (hereinafter sometimes referred to simply as "(C) component") and (D) an aromatic tackifying resin (hereinafter, simply referred to as "(D) component").

本實施形態之黏著劑組成物,相對於(A)成分100質量份,分別含有(B)成分10質量份以上300質量份以下、(C)成分1質量份以上30質量份以下及(D)成分1質量份以上50質量份以下。 The adhesive composition of the present embodiment contains 10 parts by mass or more and 300 parts by mass or less of the component (B), and 1 part by mass or more and 30 parts by mass or less of the component (C), and (D), per 100 parts by mass of the component (A). The component is 1 part by mass or more and 50 parts by mass or less.

而且,本實施形態之黏著劑組成物,相對於(B)成分之含量,(C)成分之含量((C)成分之含量/(B)成分 之含量)為0.05以上0.70以下。 Further, in the adhesive composition of the present embodiment, the content of the component (C) (the content of the component (C) / the component (B) with respect to the content of the component (B) The content) is 0.05 or more and 0.70 or less.

本案的發明人們發現,本實施形態之黏著劑組成物所含的(C)成分可抑制黏著片之經時劣化。更具體而言,本案的發明人們發現,本實施形態之黏著劑組成物中,(C)成分可防止(B)成分往黏著劑層(黏著片)之表面移動,其結果可抑制黏著劑層(黏著片)的經時劣化。 The inventors of the present invention have found that the component (C) contained in the adhesive composition of the present embodiment can suppress deterioration of the adhesive sheet over time. More specifically, the inventors of the present invention have found that the component (C) in the adhesive composition of the present embodiment prevents the component (B) from moving toward the surface of the adhesive layer (adhesive sheet), and as a result, the adhesive layer can be suppressed. The (adhesive sheet) deteriorates with time.

其中,(B)成分為低分子量(例如:重量平均分子量為5,000以下)時,因為是低分子量而容易往黏著劑層(黏著片)之表面移動,故容易發生黏著劑層(黏著片)的經時劣化。此時,藉由在本實施形態之黏著劑組成物中調配(C)成分,可有效地抑制黏著劑層(黏著片)的經時劣化。 When the component (B) has a low molecular weight (for example, a weight average molecular weight of 5,000 or less), since it is a low molecular weight and easily moves toward the surface of the adhesive layer (adhesive sheet), the adhesive layer (adhesive sheet) is likely to occur. Deteriorated over time. In this case, by disposing the component (C) in the adhesive composition of the present embodiment, the deterioration of the adhesive layer (adhesive sheet) over time can be effectively suppressed.

(C)成分在抑制由本實施形態之黏著劑組成物所得之黏著片的經時劣化之機制雖未明確,惟可以認為(C)成分與(A)成分及(B)成分之相容性良好,及/或藉由使(C)成分配置在由本實施形態之黏著劑組成物所得之黏著劑層的表面,即可防止(B)成分往黏著劑層(黏著片)之表面移動。推測由此即可提供一種即使在長期保存時,黏著力等亦不會降低,且難以發生經時劣化的黏著片。 The mechanism for suppressing the deterioration of the adhesive sheet obtained by the adhesive composition of the present embodiment in the component (C) is not clear, but it is considered that the compatibility of the component (C) with the components (A) and (B) is good. And/or by disposing the component (C) on the surface of the adhesive layer obtained from the adhesive composition of the present embodiment, the component (B) can be prevented from moving toward the surface of the adhesive layer (adhesive sheet). It is presumed that it is possible to provide an adhesive sheet which does not deteriorate in adhesion or the like even when stored for a long period of time, and which is less likely to deteriorate with time.

而且,本案的發明人們發現,藉由使本實施形態之黏著劑組成物中的(C)成分之含量/(B)成分之含量成為0.05以上0.70以下,即可達成兼有黏著力的經時劣化之防止、與良好的階差追隨性及黏著力的表現。 Furthermore, the inventors of the present invention have found that the content of the component (C) in the adhesive composition of the present embodiment and the content of the component (B) are 0.05 or more and 0.70 or less, whereby the adhesiveness can be achieved. Deterioration prevention, good step followability and adhesion performance.

本發明中,「具有相容性(compatible)」或「相容compatibilizing)」係指在混合2種不同成分而得的混合 物中,因混濁或相分離而無法以肉眼確認之意。 In the present invention, "compatible" or "compatibilizing" means a mixture obtained by mixing two different components. In the case of turbidity or phase separation, it is not possible to confirm with the naked eye.

1.1.(A)成分 1.1. (A) component

(A)成分係選自X-Y-X型氫化苯乙烯系嵌段共聚物及X-Y型氫化苯乙烯系嵌段共聚物中之至少1種的嵌段共聚物。由於(A)成分為低極性及疏水性,故有助於由本實施形態之黏著劑組成物所形成的黏著劑層之低的相對介電常數及水蒸氣阻隔性。 The component (A) is a block copolymer selected from at least one of an X-Y-X type hydrogenated styrene block copolymer and an X-Y type hydrogenated styrene block copolymer. Since the component (A) has low polarity and hydrophobicity, it contributes to a low relative dielectric constant and water vapor barrier property of the adhesive layer formed of the adhesive composition of the present embodiment.

(A)成分之X-Y-X型氫化苯乙烯系嵌段共聚物及X-Y型氫化苯乙烯系嵌段共聚物係具有衍生自芳香族乙烯基單體之聚合物成分的硬片段(X)與衍生自共軛二烯單體之聚合物成分的軟片段(Y)之熱塑性彈性體。其中,更具體而言,芳香族乙烯基化合物係以苯乙烯、α-甲基苯乙烯為佳(以苯乙烯更佳)、共軛二烯化合物係以丁二烯、異戊二烯為佳。 The XYX type hydrogenated styrene block copolymer and the XY type hydrogenated styrene block copolymer of the component (A) are hard segments (X) having a polymer component derived from an aromatic vinyl monomer and are derived from a total of A thermoplastic elastomer of a soft segment (Y) of a polymer component of a conjugated diene monomer. More specifically, the aromatic vinyl compound is preferably styrene or α-methyl styrene (more preferably styrene), and the conjugated diene compound is preferably butadiene or isoprene. .

(A)成分之具體例方面,可列舉如:苯乙烯-(乙烯-丙烯)-苯乙烯型嵌段共聚物(SEPS)(苯乙烯-異戊二烯-苯乙烯型)嵌段共聚物(SIS)之氫化物)、苯乙烯-(乙烯-丁烯)-苯乙烯型嵌段共聚物(SEBS)(苯乙烯-丁二烯-苯乙烯型嵌段共聚物(SBS)之氫化物)、苯乙烯-(丁二烯-丁烯)-苯乙烯型嵌段共聚物(SBBS)(苯乙烯-丁二烯-苯乙烯型嵌段共聚物(SBS)之部分氫化物)等X-Y-X型三嵌段共聚物;苯乙烯-(乙烯-丙烯)型嵌段共聚物(SEP)(苯乙烯-異戊二烯型嵌段共聚物(SI)之氫加成物)、苯乙烯-(乙烯-丁烯)型嵌段共聚物(SEB)(苯乙烯-丁二烯型嵌段共聚物(SB)之氫加成物)等 X-Y型二嵌段共聚物。(A)成分係可將該等成分單獨地使用,或將2種以上混合使用。 Specific examples of the component (A) include a styrene-(ethylene-propylene)-styrene type block copolymer (SEPS) (styrene-isoprene-styrene type) block copolymer ( Hydride of SIS), styrene-(ethylene-butylene)-styrene block copolymer (SEBS) (hydride of styrene-butadiene-styrene block copolymer (SBS)), XYX type tri-embedded styrene-(butadiene-butene)-styrene block copolymer (SBBS) (partial hydride of styrene-butadiene-styrene block copolymer (SBS)) Segment copolymer; styrene-(ethylene-propylene) block copolymer (SEP) (hydrogen adduct of styrene-isoprene type block copolymer (SI)), styrene-(ethylene-butyl Alkene type block copolymer (SEB) (hydrogen addition product of styrene-butadiene type block copolymer (SB)), etc. X-Y type diblock copolymer. In the component (A), these components may be used singly or in combination of two or more.

而且,(A)成分為X-Y-X型三嵌段共聚物(以下,有時簡稱為「三嵌段共聚物」)及X-Y型二嵌段共聚物(以下,有時簡稱為「二嵌段共聚物」)之混合物時,相對於該混合物,三嵌段共聚物之含量係以20質量%以上95質量%以下為佳,以30質量%以上90質量%以下更佳。而且,相對於該混合物,二嵌段共聚物之含量係以5質量%以上80質量%以下為佳,以10質量%以上70質量%以下更佳。 Further, the component (A) is an XYX-type triblock copolymer (hereinafter sometimes referred to simply as "triblock copolymer") and an XY-type diblock copolymer (hereinafter sometimes referred to simply as "diblock copolymer". When the mixture is a mixture, the content of the triblock copolymer is preferably 20% by mass or more and 95% by mass or less, more preferably 30% by mass or more and 90% by mass or less. Further, the content of the diblock copolymer is preferably 5% by mass or more and 80% by mass or less based on the mixture, and more preferably 10% by mass or more and 70% by mass or less.

(A)成分方面,可使用市售之氫化嵌段共聚物,例如:SEP型的Septon 1001及1020,SEPS型的Septon 2002、2004、2005、2006、2007、2063及2104,SEBS型的Septon 8004、8006、8007、8076及8104(上述Septon系列均為Kuraray公司製造);SEBS型的Tuftec H1221、H1662、H1052、H1053、H1041、H1051、H1517、H1043、H1272及N504,SBBS型的Tuftec P1500、P2000及JT83X(上述Tuftec系列均為旭化成公司製造)等。 As the component (A), a commercially available hydrogenated block copolymer such as SEP type Septon 1001 and 1020, SEPS type Septon 2002, 2004, 2005, 2006, 2007, 2063 and 2104, SEBS type Septon 8004 can be used. , 8006, 8007, 8076, and 8104 (Septon series are manufactured by Kuraray Co., Ltd.); Tuftec H1221, H1662, H1052, H1053, H1041, H1051, H1517, H1043, H1272 and N504 of SEBS type, Tuftec P1500, P2000 of SBBS type And JT83X (the above-mentioned Tuftec series are manufactured by Asahi Kasei Corporation).

以對本實施形態之黏著劑組成物賦予耐熱性之觀點,(A)成分中之硬片段(X:例如苯乙烯)之含有率以10質量%以上35質量%以下為佳,以10質量%以上20質量%以下更佳。(A)成分中之硬片段(X)的含有率未達10質量%時之耐熱性較差,另一方面,超出35質量%時,會有黏著劑層變得過硬而與被黏物之密接性變差之情形。 The content of the hard segment (X: styrene) in the component (A) is preferably 10% by mass or more and 35% by mass or less, and more preferably 10% by mass or more, from the viewpoint of imparting heat resistance to the adhesive composition of the present embodiment. 20% by mass or less is more preferable. When the content of the hard segment (X) in the component (A) is less than 10% by mass, the heat resistance is inferior. On the other hand, when the content exceeds 35% by mass, the adhesive layer is too hard and adheres to the adherend. Sexual deterioration.

而且,從耐候性優異之觀點,構成(A)成分之共軛二烯單體的聚合物成分中所含的雙鍵之氫化度(氫化率)(以下亦簡稱為「氫化度」)係以90%以上為佳,以95%以上更佳(而且,氫化度雖以100%為理想,然亦可殘留痕量(例如:0.001%以上0.1%以下)的雙鍵)。亦即,本發明中,共軛二烯單體的聚合物成分中所含的雙鍵之氫化度係指,共軛二烯單體的聚合物成分所含的雙鍵中之通過氫化而飽和的比率。 In addition, the degree of hydrogenation (hydrogenation rate) of the double bond contained in the polymer component of the conjugated diene monomer of the component (A) (hereinafter also referred to simply as "hydrogenation degree") is based on the viewpoint of excellent weather resistance. 90% or more is preferable, and more preferably 95% or more (and, although the degree of hydrogenation is preferably 100%, a trace amount (for example, 0.001% or more and 0.1% or less) of a double bond may be left). That is, in the present invention, the degree of hydrogenation of the double bond contained in the polymer component of the conjugated diene monomer means that the double bond contained in the polymer component of the conjugated diene monomer is saturated by hydrogenation. The ratio.

以可對黏著劑層賦予適度的柔軟性、可撓性及階差追隨性之觀點,本實施形態之黏著劑組成物中的(A)成分之重量平均分子量係以1萬以上30萬以下(以5萬以上30萬以下更佳)為佳。而且,(A)成分如為上述三嵌段共聚物及二嵌段共聚物之混合物時,該(A)成分之重量平均分子量係指混合物之重量平均分子量。 The weight average molecular weight of the component (A) in the adhesive composition of the present embodiment is 10,000 or more and 300,000 or less, from the viewpoint of imparting appropriate flexibility, flexibility, and step followability to the adhesive layer. It is better to use 50,000 or more and 300,000 or less. Further, when the component (A) is a mixture of the above triblock copolymer and the diblock copolymer, the weight average molecular weight of the component (A) means the weight average molecular weight of the mixture.

1.2.(B)成分 1.2. (B) ingredients

(B)成分係常溫(23℃)下為液體之軟化劑。(B)成分具有與構成(A)成分之軟片段(Y)相容之性質。(B)成分有助於本實施形態之黏著劑組成物的柔軟性(潤濕性)。並且,由於(B)成分之因素,而可提高與被黏物之密接性及黏性,並可對使用該組成物而得之黏著劑層賦予可撓性。 The component (B) is a liquid softener at normal temperature (23 ° C). The component (B) has a property compatible with the soft segment (Y) constituting the component (A). The component (B) contributes to the flexibility (wettability) of the adhesive composition of the present embodiment. Further, due to the factor (B), adhesion to the adherend and adhesion can be improved, and flexibility can be imparted to the adhesive layer obtained by using the composition.

另外,本發明中之「液體」係包含黏稠的黏彈性(viscoelastic)液體及其它低黏度之液體。 Further, the "liquid" in the present invention contains a viscous viscoelastic liquid and other low viscosity liquids.

而且,(B)成分與前述(A)成分之軟片段(Y)是否相容,係使用與符合前述(A)成分之軟片段(Y)的成 分,亦即,使用僅由共軛二烯所合成之聚合物與(B)成分進行評定。 Further, whether or not the component (B) is compatible with the soft segment (Y) of the component (A) is a composition of a soft segment (Y) which conforms to the above component (A). The fraction, that is, the polymer synthesized from only the conjugated diene and the component (B) were evaluated.

更具體而言,當將僅由共軛二烯所聚合而成之聚合物與(B)成分,與依所需使用之溶劑混合而得的混合物中發生混濁,或者,含有該聚合物之相與含有(B)成分之相的相分離無法以肉眼觀察出時,係將(B)成分認作與前述(A)成分之軟片段(Y)相容者,另一方面,上述之混濁或相分離能以肉眼觀察出時,係將(B)成分認作與前述(A)成分之軟片段(Y)不相容者。 More specifically, when a polymer obtained by polymerizing only a conjugated diene and a component (B) are mixed with a solvent to be used, turbidity occurs, or a phase containing the polymer is contained. When the phase separation from the phase containing the component (B) is not visually observed, the component (B) is considered to be compatible with the soft segment (Y) of the component (A), and on the other hand, the above turbidity or When the phase separation can be observed with the naked eye, the component (B) is considered to be incompatible with the soft segment (Y) of the above component (A).

由於本實施形態之黏著劑組成物中所含的(B)成分與前述(A)成分之軟片段(Y)相容,故在提高該黏著劑層之潤濕性(wet-ability)的結果,可提高與被黏物的密接性及黏性,更可對使用該組成物而得的黏著劑層賦予可撓性。 Since the component (B) contained in the adhesive composition of the present embodiment is compatible with the soft segment (Y) of the component (A), the wettability of the adhesive layer is improved. The adhesiveness and adhesion to the adherend can be improved, and the adhesive layer obtained by using the composition can be made flexible.

(B)成分可為例如:包含聚丁烯系化合物、聚異丁烯系化合物及聚異戊二烯系化合物等脂肪族烴之軟化劑。 The component (B) may be, for example, a softener containing an aliphatic hydrocarbon such as a polybutene compound, a polyisobutylene compound or a polyisoprene compound.

可作為(B)成分使用之軟化劑方面,可使用市售之軟化劑,例如作為聚丁烯系化合物之Nisseki Polybutene LV-7、LV-50、LV-100、HV-15、HV-35、HV-50、HV-100、HV-300、HV-1900及SV-7000(均為JX日鑛日石能源公司製造);作為聚異丁烯系化合物之Tetrax 3T、4T、5T及6T、Himol 4H、5H、5.5H及6H(均為JX日鑛日石能源公司製造);作為聚異戊二烯系化合物之Kurapuren LIR-290(Kuraray公司製造)等。(B)成分可單獨使用1種,亦可將2種以上組合使用。 As the softener which can be used as the component (B), a commercially available softener such as Nisseki Polybutene LV-7, LV-50, LV-100, HV-15, HV-35 which is a polybutene compound, can be used. HV-50, HV-100, HV-300, HV-1900 and SV-7000 (all manufactured by JX Nippon Mining & Energy Co., Ltd.); Tetrax 3T, 4T, 5T and 6T, Himol 4H as polyisobutylene compounds, 5H, 5.5H and 6H (all manufactured by JX Nippon Mining & Energy Co., Ltd.); Kurapuren as a polyisoprene compound LIR-290 (manufactured by Kuraray Co., Ltd.) and the like. The component (B) may be used alone or in combination of two or more.

從可更提高與(A)成分之相容性之觀點,本實施形態之黏著劑組成物中的(B)成分之含量,相對於(A)成分100質量份,係以10質量份以上為佳,以15質量份以上更佳,以20質量份以上又更佳,另一方面,係以300質量份以下為佳,以250質量份以下更佳,以200質量份以下又更佳。 The content of the component (B) in the adhesive composition of the present embodiment is 10 parts by mass or more based on 100 parts by mass of the component (A), from the viewpoint of further improving the compatibility with the component (A). Preferably, it is more preferably 15 parts by mass or more, more preferably 20 parts by mass or more, and more preferably 300 parts by mass or less, more preferably 250 parts by mass or less, and even more preferably 200 parts by mass or less.

從使用本實施形態之黏著劑組成物可得到柔軟性更為優異之黏著劑層之觀點,(B)成分之分子量(數量平均分子量)係以5,000以下為佳,以500以上3,000以下更佳。 From the viewpoint of obtaining an adhesive layer having more excellent flexibility by using the adhesive composition of the present embodiment, the molecular weight (number average molecular weight) of the component (B) is preferably 5,000 or less, more preferably 500 or more and 3,000 or less.

1.3.(C)成分 1.3. (C) ingredients

作為(C)成分之萜烯系增黏樹脂係衍生自萜烯化合物之增黏樹脂(tackifier resin)。 The terpene-based tackifying resin as the component (C) is a tackifier resin derived from a terpene compound.

在混合(A)成分與(B)成分時,會有(B)成分往黏著劑層之表面移動之傾向。本實施形態之黏著劑組成物中,可藉由調配(C)成分來防止(B)成分往黏著劑層之表面移動。而且,(C)成分亦有助於本實施形態之黏著劑組成物的黏著物性(黏著力及黏性)的提高。 When the components (A) and (B) are mixed, the component (B) tends to move toward the surface of the adhesive layer. In the adhesive composition of the present embodiment, the component (B) can be prevented from moving toward the surface of the adhesive layer by blending the component (C). Further, the component (C) contributes to the improvement of the adhesiveness (adhesion and viscosity) of the adhesive composition of the present embodiment.

作為(C)成分之萜烯系增黏樹脂係具有與(A)成分相容之性質。更具體而言,(C)成分可與構成(A)成分之硬片段(X)及軟片段(Y)兩者相容。 The terpene-based tackifying resin as the component (C) has a property compatible with the component (A). More specifically, the component (C) is compatible with both the hard segment (X) and the soft segment (Y) constituting the component (A).

(C)成分與構成(A)成分之硬片段(X)及軟片 段(Y)兩者是否相容,係使用:符合前述構成(A)成分之硬片段(X)之成分,亦即,僅由芳香族乙烯基單體所合成之聚合物、與符合前述構成(A)成分之軟片段(Y)的成分,亦即,僅由共軛二烯單體所合成之聚合物,與(C)成分進行評定。 (C) component and hard segment (X) and film constituting component (A) Whether or not the segment (Y) is compatible, is a component which satisfies the hard segment (X) of the above-mentioned composition (A), that is, a polymer synthesized only from an aromatic vinyl monomer, and conforms to the above constitution The component of the soft segment (Y) of the component (A), that is, the polymer synthesized only from the conjugated diene monomer, and the component (C) were evaluated.

更具體而言,在(i)符合構成(A)成分之硬片段(X)之僅由芳香族乙烯基單體所合成之聚合物與(C)成分在必要時使用溶劑加以混合而得之混合物、(ii)符合構成(A)成分之軟片段(Y)之僅由共軛二烯單體所合成之聚合物與(C)成分在必要時使用溶劑加以混合而得之混合物、(iii)將(A)成分與(C)成分在必要時使用溶劑加以混合而得之混合物中,無法以肉眼觀察出混濁的發生或相分離時,認為(C)成分係與(A)成分相容,另一方面,上述(i)至(iii)之任意混合物中能以肉眼觀察出混濁或相分離時,認為(C)成分係與(A)成分不相容。 More specifically, (i) a polymer synthesized only from an aromatic vinyl monomer which conforms to the hard segment (X) constituting the component (A) and a component (C) are mixed with a solvent if necessary. a mixture, (ii) a mixture of a polymer synthesized only from a conjugated diene monomer and a component (C) which is a soft segment (Y) constituting the component (A), if necessary, a solvent, (iii) When the component (A) and the component (C) are mixed with a solvent if necessary, when the occurrence of turbidity or phase separation cannot be observed with the naked eye, it is considered that the component (C) is compatible with the component (A). On the other hand, when turbidity or phase separation can be observed with the naked eye in any of the above (i) to (iii), it is considered that the component (C) is incompatible with the component (A).

而且,(C)成分以具有與(B)成分相容之性質為佳。 Further, the component (C) is preferably one having a property compatible with the component (B).

更具體而言,將(B)成分與(C)成分在必要時使用溶劑加以混合而得之混合物中,無法以肉眼觀察出混濁的發生或含有(B)成分之相與含有(C)成分之相的相分離時,認為(C)成分係與(B)成分相容,另一方面,能以肉眼觀察出上述混濁或相分離時,認為(C)成分係與(B)成分不相容。 More specifically, in the mixture obtained by mixing the component (B) and the component (C) with a solvent, if necessary, the occurrence of turbidity or the phase containing the component (B) and the component containing (C) cannot be observed with the naked eye. When the phase of the phase is separated, it is considered that the component (C) is compatible with the component (B). On the other hand, when the turbidity or phase separation can be observed with the naked eye, it is considered that the component (C) is not in phase with the component (B). Rong.

(C)成分方面,可使用例如:YS樹脂PX1250(軟化點125±5℃)、YS樹脂PX1150(軟化點115±5 ℃)、YS樹脂PX1000(軟化點100±5℃)、YS樹脂PX1150N(軟化點115±5℃)、YS Polystar U130(軟化點130±5℃)、YS Polystar U115(軟化點115±5℃)、YS Polystar T160(軟化點160±5℃)、YS Polystar T145(軟化點145±5℃)、YS Polystar T130(軟化點130±5℃)、YS Polystar T115(軟化點115±5℃)、YS Polystar T100(軟化點100±5℃)、YS Polystar S145(軟化點145±5℃)、YS Polystar G150(軟化點150±5℃)、YS Polystar G125(軟化點125±5℃)、YS Polystar N125(軟化點125±5℃)、YS Polystar K140(軟化點140±5℃)、YS Polystar K125(軟化點125±5℃)、YS Polystar TH130(軟化點130±5℃)、YS Polystar UH115(軟化點115±5℃)、Clearon P150(軟化點152±5℃)、Clearon P135(軟化點135±5℃)、Clearon P125(軟化點125±5℃)、Clearon P115(軟化點115±5℃)、Clearon P105(軟化點105±5℃)、Clearon M125(軟化點125±5℃)、Clearon M115(軟化點115±5℃)、Clearon M105(軟化點105±5℃)、Clearon K100(軟化點100±5℃)、Clearon K4100(軟化點100±5℃)、YS樹脂TO125(軟化點125±5℃)、YS樹脂TO115(軟化點115±5℃)、YS樹脂TO105(軟化點105±5℃)及YS樹脂TR105(軟化點105±5℃)(均為Yasuhara(股)製造)。(C)成分可單獨使用,亦可將2種以上組合使用。 For the component (C), for example, YS resin PX1250 (softening point 125±5 ° C), YS resin PX1150 (softening point 115±5) can be used. °C), YS resin PX1000 (softening point 100±5°C), YS resin PX1150N (softening point 115±5°C), YS Polystar U130 (softening point 130±5°C), YS Polystar U115 (softening point 115±5°C) YS Polystar T160 (softening point 160±5°C), YS Polystar T145 (softening point 145±5°C), YS Polystar T130 (softening point 130±5°C), YS Polystar T115 (softening point 115±5°C), YS Polystar T100 (softening point 100±5°C), YS Polystar S145 (softening point 145±5°C), YS Polystar G150 (softening point 150±5°C), YS Polystar G125 (softening point 125±5°C), YS Polystar N125 (softening point 125±5°C), YS Polystar K140 (softening point 140±5°C), YS Polystar K125 (softening point 125±5°C), YS Polystar TH130 (softening point 130±5°C), YS Polystar UH115 (softening) Point 115±5°C), Clearon P150 (softening point 152±5°C), Clearon P135 (softening point 135±5°C), Clearon P125 (softening point 125±5°C), Clearon P115 (softening point 115±5°C) , Clearon P105 (softening point 105 ± 5 ° C), Clearon M125 (softening point 125 ± 5 ° C), Clearon M115 (softening point 115 ± 5 ° C), Clearon M105 (softening point 105 ± 5 ° C), Clearon K100 (softening point) 100±5°C), Cleanon K4100 ( 100100±5°C), YS resin TO125 (softening point 125±5°C), YS resin TO115 (softening point 115±5°C), YS resin TO105 (softening point 105±5°C) and YS resin TR105 (softening point) 105±5°C) (all manufactured by Yasuhara). The component (C) may be used singly or in combination of two or more.

從可更提高與(A)成分之相容性之觀點,本實施形態之黏著劑組成物中的(C)成分之含量,相對於(A)成分100質量份,係以1質量份以上為佳,以3質量份以 上更佳,以5質量份以上又更佳,另一方面,係以30質量份以下為佳,以25質量份以下更佳,以20質量份以下又更佳。 The content of the component (C) in the adhesive composition of the present embodiment is 1 part by mass or more based on 100 parts by mass of the component (A), from the viewpoint of further improving the compatibility with the component (A). Good, in 3 parts by mass More preferably, it is more preferably 5 parts by mass or more, and more preferably 30 parts by mass or less, more preferably 25 parts by mass or less, even more preferably 20 parts by mass or less.

從可更有效地抑制本實施形態之黏著劑組成物中的黏著力之經時劣化之觀點,相對於(B)成分之含量,(C)成分之含量((C)成分之含量/(B)成分之含量)以0.05以上為佳,以0.07以上更佳,以0.10以上又更佳,另一方面,以0.70以下為佳,以0.60以下更佳,以0.50以下又更佳。 From the viewpoint of more effectively suppressing the deterioration of the adhesive strength in the adhesive composition of the present embodiment, the content of the component (C) relative to the content of the component (B) (the content of the component (C) / (B) The content of the component is preferably 0.05 or more, more preferably 0.07 or more, still more preferably 0.10 or more, and further preferably 0.70 or less, more preferably 0.60 or less, and still more preferably 0.50 or less.

本實施形態之黏著劑組成物中,從可更提高(A)成分、(B)成分及(C)成分之相容性之觀點,(B)成分之含量及(C)成分之含量的總和,相對於(A)成分之含量100質量份,以11以上為佳,以18以上更佳,以25以上又更佳,另一方面,以330以下為佳,以275以下更佳,以220以下又更佳。 In the adhesive composition of the present embodiment, the sum of the content of the component (B) and the content of the component (C) can be further improved from the viewpoint of improving the compatibility of the component (A), the component (B) and the component (C). With respect to 100 parts by mass of the component (A), it is preferably 11 or more, more preferably 18 or more, and still more preferably 25 or more. On the other hand, preferably 330 or less, more preferably 275 or less, and 220 or more. The following is even better.

而且,本實施形態之黏著劑組成物中,從可更提高(D)成分、(B)成分及(C)成分之相容性之觀點,(B)成分之含量及(C)成分之含量的總和,相對於(D)成分之含量,可為0.5以上10.0以下,以0.7以上為佳,以0.8以上更佳,另一方面,以9.0以下為佳,以8.0以下更佳。 Further, in the adhesive composition of the present embodiment, the content of the component (B) and the content of the component (C) can be further improved from the viewpoint of improving the compatibility of the component (D), the component (B) and the component (C). The sum of the components (D) may be 0.5 or more and 10.0 or less, preferably 0.7 or more, more preferably 0.8 or more, and more preferably 9.0 or less, more preferably 8.0 or less.

從可賦予高接著力之觀點,(C)成分之軟化點以100℃以上為佳,以120℃以上更佳,以145℃以上(一般為300℃以下)又更佳。 From the viewpoint of imparting high adhesion, the softening point of the component (C) is preferably 100 ° C or more, more preferably 120 ° C or more, and still more preferably 145 ° C or more (generally 300 ° C or less).

從可進一步提高相容性之觀點,(C)成分之 重量平均分子量以200以上5,000以下為佳。 From the viewpoint of further improving compatibility, (C) The weight average molecular weight is preferably 200 or more and 5,000 or less.

1.4.(D)成分 1.4. (D) component

作為(D)成分之芳香族系增黏樹脂(具有芳香族環之增黏樹脂)係具有與構成(A)之硬片段(X)相容的性質,軟化點(Softening point)在80℃以上。(D)成分有助於本實施形態之黏著劑組成物的凝聚性及黏著物性(黏著力)之提升。 The aromatic tackifying resin (the tackifying resin having an aromatic ring) as the component (D) has a property compatible with the hard segment (X) of the composition (A), and the softening point is 80 ° C or higher. . The component (D) contributes to the improvement of the cohesiveness and adhesiveness (adhesion) of the adhesive composition of the present embodiment.

而且,(D)成分與構成前述(A)成分之硬片段(X)是否相容,係使用符合構成前述(A)成分之硬片段(X)之成分,亦即,僅由芳香族乙烯基單體所合成之聚合物,與(D)成分進行評定。 Further, whether or not the component (D) is compatible with the hard segment (X) constituting the component (A) is a component which satisfies the hard segment (X) constituting the component (A), that is, only an aromatic vinyl group. The polymer synthesized by the monomer is evaluated in accordance with the component (D).

更具體而言,將僅由芳香族乙烯基單體所聚合之聚合物與(D)成分在必要時使用溶劑加以混合而得之混合物中,無法以肉眼觀察出混濁的發生或含有該聚合物之相與含有(D)成分之相的相分離時,(D)成分係與構成前述(A)成分之硬片段(X)相容,另一方面,能以肉眼觀察出上述混濁或相分離時,(D)成分係與構成前述(A)成分之硬片段(X)不相容。 More specifically, in the mixture obtained by mixing only the polymer obtained by polymerizing the aromatic vinyl monomer and the component (D) with a solvent if necessary, the occurrence of turbidity or the presence of the polymer cannot be observed with the naked eye. When the phase is separated from the phase containing the component (D), the component (D) is compatible with the hard segment (X) constituting the component (A), and on the other hand, the turbidity or phase separation can be observed with the naked eye. In the case, the component (D) is incompatible with the hard segment (X) constituting the component (A).

由於本實施形態之黏著劑組成物中所含的(D)成分與構成前述(A)成分之硬片段(X)相容,因此,對由該黏著劑組成物所形成之黏著劑層賦予了一定程度的硬度,可提高該黏著劑層的耐熱性及黏著力。 Since the component (D) contained in the adhesive composition of the present embodiment is compatible with the hard segment (X) constituting the component (A), the adhesive layer formed of the adhesive composition is imparted. A certain degree of hardness can improve the heat resistance and adhesion of the adhesive layer.

可作為(D)成分使用之例方面,可列舉如:芳香族石油樹脂、苯乙烯系聚合物、α-甲基苯乙烯系聚合物、苯乙烯-(α-甲基苯乙烯)系共聚物、苯乙烯-脂肪族烴 系共聚物、苯乙烯-(α-甲基苯乙烯)-脂肪族烴系共聚物及苯乙烯-芳香族烴系共聚物等。更具體而言,亦可使用例如:市售之苯乙烯-芳香族烴系共聚物的FMR-0150(軟化點145℃,三井化學公司製造);苯乙烯-脂肪族烴系共聚物的FTR-6100(軟化點100℃,三井化學公司製造)、FTR-6110(軟化點110℃,三井化學公司製造)及FTR-6125(軟化點125℃,三井化學公司製造);苯乙烯-(α-甲基苯乙烯)-脂肪族烴系共聚物的FTR-7100(軟化點100℃,三井化學公司製造);苯乙烯系共聚物的FTR-8120(軟化點120℃,三井化學公司製造)及SX-100(軟化點100℃,Yasuhara Chemical公司製造);α-甲基苯乙烯系共聚物的FTR-0100(軟化點100℃,三井化學公司製造);苯乙烯-(α-甲基苯乙烯)系共聚物的FTR-2120(軟化點120℃,三井化學公司製造)、FTR-2140(軟化點145℃,三井化學公司製造)、Christa Rex 3100(軟化點100℃,Eastman Chemical公司製造)、Christa Rex 3085(軟化點85℃,Eastman Chemical公司製造)、Christa Rex 5140(軟化點140℃,Eastman Chemical公司製造)、Christa Rex 1120(軟化點120℃,Eastman Chemical公司製造)、Christa Rex F85(軟化點85℃,Eastman Chemical公司製造)、Christa Rex F100(軟化點100℃,Eastman Chemical公司製造)及Christa Rex F115(軟化點115℃,Eastman Chemical公司製造)等。(D)成分可單獨使用,亦可將2種以上組合使用。 Examples of the compound which can be used as the component (D) include aromatic petroleum resins, styrene polymers, α-methylstyrene polymers, and styrene-(α-methylstyrene) copolymers. Styrene-aliphatic hydrocarbon A copolymer, a styrene-(α-methylstyrene)-aliphatic hydrocarbon copolymer, a styrene-aromatic hydrocarbon copolymer, and the like. More specifically, for example, FMR-0150 (softening point 145 ° C, manufactured by Mitsui Chemicals, Inc.) of a commercially available styrene-aromatic hydrocarbon copolymer; FTR of a styrene-aliphatic hydrocarbon copolymer may also be used. 6100 (softening point 100 ° C, manufactured by Mitsui Chemicals Co., Ltd.), FTR-6110 (softening point 110 ° C, manufactured by Mitsui Chemicals, Inc.) and FTR-6125 (softening point 125 ° C, manufactured by Mitsui Chemicals, Inc.); styrene-(α-甲Ftyrene-based aliphatic hydrocarbon copolymer FTR-7100 (softening point 100 ° C, manufactured by Mitsui Chemicals Co., Ltd.); styrene copolymer FTR-8120 (softening point 120 ° C, manufactured by Mitsui Chemicals, Inc.) and SX- 100 (softening point 100 ° C, manufactured by Yasuhara Chemical Co., Ltd.); FTR-0100 of α-methylstyrene copolymer (softening point 100 ° C, manufactured by Mitsui Chemicals, Inc.); styrene-(α-methylstyrene) system Copolymer FTR-2120 (softening point 120 ° C, manufactured by Mitsui Chemicals Co., Ltd.), FTR-2140 (softening point 145 ° C, manufactured by Mitsui Chemicals, Inc.), Christa Rex 3100 (softening point 100 ° C, manufactured by Eastman Chemical Co., Ltd.), Christa Rex 3085 (softening point 85 ° C, manufactured by Eastman Chemical Co., Ltd.), Christa Rex 5140 (softening point 140 ° C , manufactured by Eastman Chemical Co., Ltd., Christa Rex 1120 (softening point 120 ° C, manufactured by Eastman Chemical Co., Ltd.), Christa Rex F85 (softening point 85 ° C, manufactured by Eastman Chemical Co., Ltd.), Christa Rex F100 (softening point 100 ° C, manufactured by Eastman Chemical Co., Ltd.) And Christa Rex F115 (softening point 115 ° C, manufactured by Eastman Chemical Co., Ltd.) and the like. The component (D) may be used singly or in combination of two or more.

對本實施形態之黏著劑組成物從賦予耐久 性而可更提高耐久性及黏著力之觀點,(D)成分之軟化點以80℃以上為佳,以100℃以上更佳,以120℃以上又更佳。 Adhesive composition of the present embodiment is endowed with durability The softening point of the component (D) is preferably 80 ° C or more, more preferably 100 ° C or more, and even more preferably 120 ° C or more.

從良好的相容性及黏著性之觀點,(D)成分之重量平均分子量係以5,000以下為佳,以500以上3,000以下更佳。 From the viewpoint of good compatibility and adhesion, the weight average molecular weight of the component (D) is preferably 5,000 or less, more preferably 500 or more and 3,000 or less.

從可提高與(A)成分之相容性之觀點,本實施形態之黏著劑組成物中的(D)成分之含量,相對於(A)成分100質量份,以1質量份以上為佳,以5質量份以上更佳,以10質量份以上又更佳,另一方面,以50質量份以下為佳,以40質量份以下更佳,以30質量份以下又更佳。 The content of the component (D) in the adhesive composition of the present embodiment is preferably 1 part by mass or more based on 100 parts by mass of the component (A), from the viewpoint of the compatibility with the component (A). It is more preferably 5 parts by mass or more, more preferably 10 parts by mass or more, and more preferably 50 parts by mass or less, more preferably 40 parts by mass or less, still more preferably 30 parts by mass or less.

而且,本實施形態之黏著劑組成物中,(A)成分、(B)成分、(C)成分及(D)成分之總含量係以70質量%以上為佳,以80質量%以上更佳(一般為100質量%以下)。 Further, in the adhesive composition of the present embodiment, the total content of the component (A), the component (B), the component (C), and the component (D) is preferably 70% by mass or more, more preferably 80% by mass or more. (generally 100% by mass or less).

1.5.組成物之形態 1.5. Form of composition

本實施形態之黏著劑組成物係可溶解於溶劑中使用。前述溶劑係以例如:至少1種選自在23℃為液體之脂肪族烴及/或芳香族烴為佳。 The adhesive composition of the present embodiment can be used by being dissolved in a solvent. The solvent is preferably, for example, at least one selected from the group consisting of aliphatic hydrocarbons and/or aromatic hydrocarbons which are liquid at 23 ° C.

可作為溶劑使用之脂肪族烴方面,可列舉例如:正戊烷、甲基戊烷、正己烷、異己烷、正庚烷、異庚烷、正辛烷及異辛烷等之直鏈狀或分支鏈狀脂肪族烴;環戊烷、環己烷及甲基環己烷等之環狀脂肪族烴。 Examples of the aliphatic hydrocarbon which can be used as a solvent include linear chains such as n-pentane, methylpentane, n-hexane, isohexane, n-heptane, isoheptane, n-octane, and isooctane, or Branched chain aliphatic hydrocarbon; cyclic aliphatic hydrocarbon such as cyclopentane, cyclohexane and methylcyclohexane.

並且,可作為溶劑使用之芳香族烴方面,其例可列舉如:甲苯、苯、鄰二甲苯、間二甲苯、對二甲苯、乙基苯、均三甲苯(mesitylene)、氯苯及硝基苯。溶劑 係可將脂肪族烴及芳香族烴中之1種或2種組合使用。另外,本實施形態之黏著劑組成物可含有作為溶劑之脂肪族烴及芳香族烴以外之溶劑(例如:乙酸乙酯、乙酸甲酯及乙酸丁酯等酯系溶劑;甲基乙基酮及丙酮等酮系溶劑;四氫呋喃及乙腈等之一般在黏著劑中所使用的有機溶劑)。 Further, examples of the aromatic hydrocarbon which can be used as a solvent include, for example, toluene, benzene, o-xylene, m-xylene, p-xylene, ethylbenzene, mesitylene, chlorobenzene and nitro group. benzene. Solvent One or two of an aliphatic hydrocarbon and an aromatic hydrocarbon may be used in combination. Further, the adhesive composition of the present embodiment may contain a solvent other than an aliphatic hydrocarbon or an aromatic hydrocarbon (for example, an ester solvent such as ethyl acetate, methyl acetate or butyl acetate; methyl ethyl ketone and A ketone solvent such as acetone; an organic solvent generally used in an adhesive such as tetrahydrofuran or acetonitrile).

使用溶劑時之含量,相對於本實施形態之黏著劑組成物全體100重量份,以1,000質量%以下為佳,以900質量%以下更佳。 The content of the solvent is preferably 1,000% by mass or less, and more preferably 900% by mass or less based on 100 parts by weight of the total of the adhesive composition of the present embodiment.

1.6.相對介電常數 1.6. Relative dielectric constant

由本實施形態之黏著劑組成物所得之黏著劑層的相對介電常數係頻率100Hz中所測的相對介電常數之值。由本實施形態之光學用黏著劑組成物所得之黏著劑層的相對介電常數係1以上3.5以下,以1以上3.2以下為佳,以1以上2.8以下更佳。 The relative dielectric constant of the adhesive layer obtained from the adhesive composition of the present embodiment is the value of the relative dielectric constant measured at a frequency of 100 Hz. The adhesive layer obtained from the optical adhesive composition of the present embodiment has a relative dielectric constant of 1 or more and 3.5 or less, preferably 1 or more and 3.2 or less, more preferably 1 or more and 2.8 or less.

如此,由本實施形態之光學用黏著劑組成物所得之黏著劑層在寬頻帶顯示低的相對介電常數,因此在設有該黏著劑層之畫像顯示裝置或輸出輸入裝置中,可防止高頻脈衝的操作失誤。 As described above, since the adhesive layer obtained from the optical adhesive composition of the present embodiment exhibits a low relative dielectric constant in a wide band, the image display device or the output/input device provided with the adhesive layer can prevent high frequency. The operation of the pulse is incorrect.

1.7.水蒸氣阻隔性 1.7. Water vapor barrier

由本實施形態之黏著劑組成物所形成之黏著劑層具有優異之水蒸氣阻隔性。更具體而言,本實施形態之黏著劑組成物中,由該黏著劑組成物所得之膜厚50μm的黏著劑層之水蒸氣穿透率,可為JIS Z0208、40℃×90%RH中之未達100g/m2.日者,以未達70g/m2.日者為佳,以未達 50g/m2.日者更佳,以未達40g/m2.日(一般為1×10-4g/m2.日以上)者又更佳。 The adhesive layer formed of the adhesive composition of the present embodiment has excellent water vapor barrier properties. More specifically, in the adhesive composition of the present embodiment, the water vapor permeability of the adhesive layer having a thickness of 50 μm obtained from the adhesive composition may be JIS Z0208 or 40 ° C × 90% RH. Not up to 100g/m 2 . Japanese, to less than 70g / m 2 . The Japanese are better, not to reach 50g/m 2 . The day is better, to less than 40g/m 2 . The day (generally 1 × 10 -4 g / m 2 . day or more) is even better.

本發明中,「黏著劑層之水蒸氣穿透率」係指膜厚調整為50μm的黏著劑單層在Z0208、40℃×90%RH中之水蒸氣穿透率的測定值(g/m2.日)。 In the present invention, the "water vapor transmission rate of the adhesive layer" means the measured value of the water vapor permeability of the adhesive single layer having a film thickness of 50 μm in Z0208 and 40 ° C × 90% RH (g/m). 2. Day).

1.8.黏著力之持久性 1.8. Persistence of adhesion

由本實施形態之黏著劑組成物所形成之黏著劑層(黏著片)亦具有即使已長期保存,黏著片仍難以發生經時劣化之性質。更具體而言,由本實施形態之黏著劑組成物所形成之膜厚50μm的黏著劑層在60℃、乾燥環境下放置1個月後之黏著力,相較於放置在該環境下之前的該黏著劑層之黏著力,為80%以上,以90%以上為佳。 The adhesive layer (adhesive sheet) formed of the adhesive composition of the present embodiment also has a property that the adhesive sheet is less likely to deteriorate over time even if it has been stored for a long period of time. More specifically, the adhesive layer of the film thickness of 50 μm formed by the adhesive composition of the present embodiment is placed at 60 ° C in a dry environment for one month, and the adhesive force is compared with that before being placed in the environment. The adhesion of the adhesive layer is 80% or more, preferably 90% or more.

1.9.用途 1.9. Use

本實施形態之黏著劑組成物的用途方面,只要為要求有密接性、透明性、柔軟性、可撓性、階差追隨性、水蒸氣等之氣體阻隔性或耐溼熱白化性之用途,即無特別限定。例如可在黏著片、黏著膠帶、標籤、壓敏片、表面保護膜/片或光學用途中使用。 The use of the adhesive composition of the present embodiment is intended to be used for the purpose of ensuring adhesion, transparency, flexibility, flexibility, step followability, gas barrier properties such as water vapor, or resistance to moist heat whitening. There is no special limit. For example, it can be used in adhesive sheets, adhesive tapes, labels, pressure sensitive sheets, surface protective films/sheets or optical applications.

成為使用本實施形態之黏著劑組成物所貼合的對象之構件,可為例如:光學構件(例如:選自包含偏光膜、相位差膜、橢圓偏光膜、抗反射膜、增亮膜、光擴散膜及硬塗膜之群組的光學膜)、ITO層等的金屬層,或者,包含玻璃或塑膠之基材。 The member to be bonded to the adhesive composition of the present embodiment may be, for example, an optical member (for example, selected from the group consisting of a polarizing film, a retardation film, an elliptically polarizing film, an antireflection film, a brightness enhancement film, and light). A metal film such as a group of a diffusion film and a hard coat film), a metal layer such as an ITO layer, or a substrate containing glass or plastic.

更具體而言,可將本實施形態之黏著劑組 成物在構成畫像顯示裝置(有機EL顯示器)或包含觸控面板之輸出輸入裝置的構件之貼合中使用。 More specifically, the adhesive group of the present embodiment can be used. The object is used for bonding of a member constituting an image display device (organic EL display) or an input/output device including a touch panel.

近年來,觸摸在操作時會有操作失誤之問題。由本實施形態之黏著劑組成物所得之黏著劑層,因相對介電常數低,故在構成觸控面板式輸出輸入裝置之構件的貼合中使用時,可防止觸控面板在操作時的操作失誤。 In recent years, there has been a problem of operational errors in the operation of the touch. Since the adhesive layer obtained from the adhesive composition of the present embodiment has a low relative dielectric constant, it can prevent the operation of the touch panel during operation when used in the bonding of the members constituting the touch panel type input/output device. Mistakes.

而且,例如:由於有機EL元件及有機薄膜太陽能電池容易受到水分的影響,因而要求在如此之有機EL元件及有機薄膜太陽能電池中使用的黏/接著性之樹脂材料需有高的水蒸氣阻隔性。對此,由本實施形態之黏著劑組成物所形成之黏著劑層因具有水蒸氣阻隔性,故藉由在有機EL元件及有機薄膜太陽能電池等對水具有脆弱性之用途中使用,即可防止水的滲入。 Further, for example, since the organic EL element and the organic thin film solar cell are easily affected by moisture, it is required that the adhesive/adhesive resin material used in such an organic EL element and an organic thin film solar cell has high water vapor barrier property. . On the other hand, since the adhesive layer formed of the adhesive composition of the present embodiment has water vapor barrier properties, it can be prevented by being used in applications such as organic EL devices and organic thin film solar cells that are vulnerable to water. Infiltration of water.

1.9.1.觸控面板用途 1.9.1. Touch panel use

在構成觸控面板式輸出輸入裝置之構件的貼合中使用由本實施形態之黏著劑組成物而得之黏著劑層(黏著片)之例,係參照第1圖進行說明。 An example of the adhesive layer (adhesive sheet) obtained by using the adhesive composition of the present embodiment in the bonding of the members constituting the touch panel type input/output device will be described with reference to Fig. 1 .

第1圖係示意地呈示本發明之一實施型態的輸出輸入裝置(觸控面板式輸出輸入裝置100)之構成的剖面圖。本發明之觸控面板式輸出輸入裝置100係包含液晶顯示裝置(LCD)10、觸控面板部20、LCD10與觸控面板部20之間所設置的黏著劑層30。黏著劑層30係使LCD10與觸控面板部20相貼合。 Fig. 1 is a cross-sectional view schematically showing the configuration of an input/output device (touch panel type output input device 100) according to an embodiment of the present invention. The touch panel type output input device 100 of the present invention includes a liquid crystal display device (LCD) 10, a touch panel portion 20, and an adhesive layer 30 disposed between the LCD 10 and the touch panel portion 20. The adhesive layer 30 bonds the LCD 10 to the touch panel portion 20.

黏著劑層30係例如將本實施形態之黏著劑 組成物塗佈在分離件(未圖示)的表面經乾燥而得之黏著片從分離件剝離後設置在LCD10與觸控面板部20之間者。 The adhesive layer 30 is, for example, an adhesive of the embodiment. The composition is coated on a surface of a separator (not shown) and dried, and the adhesive sheet is peeled off from the separator and disposed between the LCD 10 and the touch panel portion 20.

並且,如第1圖所示,LCD10係依序有層合偏光板11、黏著劑層12、液晶面板13、黏著劑層14及偏光板15之構成。黏著劑層12係使偏光板11與液晶面板13相貼合,黏著劑層14係使液晶面板13與偏光板15相貼合。 Further, as shown in Fig. 1, the LCD 10 has a laminated polarizing plate 11, an adhesive layer 12, a liquid crystal panel 13, an adhesive layer 14, and a polarizing plate 15, in this order. The adhesive layer 12 is such that the polarizing plate 11 and the liquid crystal panel 13 are bonded to each other, and the adhesive layer 14 is such that the liquid crystal panel 13 and the polarizing plate 15 are bonded to each other.

並且,如第1圖所示,觸控面板部20係依序有層合防碎膜16、黏著劑層17、ITO層18及玻璃面板19之構成。黏著劑層17係使防碎膜16與ITO層18相貼合。 Further, as shown in FIG. 1, the touch panel unit 20 is configured by laminating the shatterproof film 16, the adhesive layer 17, the ITO layer 18, and the glass panel 19 in this order. The adhesive layer 17 is such that the shatterproof film 16 is bonded to the ITO layer 18.

黏著劑層12、14及17係與黏著劑層30相同,可為將本實施形態之黏著劑組成物塗佈在分離件(未圖示)的表面,使揮發性成分乾燥而得之黏著片從分離件剝離所設置者。 The adhesive layers 12, 14 and 17 are the same as the adhesive layer 30, and may be an adhesive sheet obtained by applying the adhesive composition of the present embodiment to the surface of a separator (not shown) to dry the volatile components. The set is peeled off from the separator.

1.9.2.在水蒸氣阻隔性積層體之使用 1.9.2. Use of water vapor barrier laminates

由本實施形態之黏著劑組成物而得之黏著劑層(黏著片)可在水蒸氣阻隔性積層體用途中使用。亦即,本發明之一實施形態的積層體可包含由本實施形態之黏著劑組成物所得之黏著劑層與阻隔性膜。 The adhesive layer (adhesive sheet) obtained from the adhesive composition of the present embodiment can be used for the use of a water vapor barrier laminate. In other words, the laminate of one embodiment of the present invention may comprise an adhesive layer and a barrier film obtained from the adhesive composition of the present embodiment.

第2圖、第3圖及第4圖係分別示意地呈示本實施形態之黏著性水蒸氣阻隔性積層體之一例的剖面圖。 Fig. 2, Fig. 3, and Fig. 4 are each a schematic cross-sectional view showing an example of an adhesive water vapor barrier layered product of the present embodiment.

第2圖所示之黏著性水蒸氣阻隔性積層體 110係包含基材1及設在基材1上(基材1之表面)的黏著劑層2。基材1之材質可為玻璃等之無機材料;或以聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、聚酯及聚碳酸酯等之塑料為代表的有機材料。而且,第2圖係呈示基材1為單層時之情況。 Adhesive water vapor barrier layered body shown in Fig. 2 The 110 series includes a substrate 1 and an adhesive layer 2 provided on the substrate 1 (the surface of the substrate 1). The material of the substrate 1 may be an inorganic material such as glass; or an organic material represented by plastics such as polyethylene, polypropylene, polyethylene terephthalate, polymethyl methacrylate, polyester, and polycarbonate. material. Further, Fig. 2 shows a case where the substrate 1 is a single layer.

或者,基材1可為無機材料(例如:至少1種選自Si、Al、In、Sn、Zn及Ti之氧化物、氮化物或氮氧化物之層)。 Alternatively, the substrate 1 may be an inorganic material (for example, at least one layer selected from the group consisting of oxides, nitrides, or oxynitrides of Si, Al, In, Sn, Zn, and Ti).

第3圖所示之黏著性水蒸氣阻隔性積層體120係包含基材111與設在基材111之表面上的黏著劑層2。第3圖呈示基材111係由複數層構成之例。亦即,如第3圖所示,基材111包含第1層21、設在第1層21表面之其它層(第2層22),而該第2層22之上可設置黏著劑層2。 The adhesive water vapor barrier laminate 120 shown in FIG. 3 includes a substrate 111 and an adhesive layer 2 provided on the surface of the substrate 111. Fig. 3 shows an example in which the substrate 111 is composed of a plurality of layers. That is, as shown in FIG. 3, the substrate 111 includes a first layer 21, another layer (the second layer 22) provided on the surface of the first layer 21, and an adhesive layer 2 may be disposed on the second layer 22. .

第1層21之材質可為玻璃等之無機材料、作為基材1之上述例示的塑料等的有機材料。第2層22之材質並無特別限定,可為金屬、氧化矽、氮氧化矽及氮化矽等之陶瓷等的無機系阻隔性材料,亦可為作為基材1之上述例示的塑料等的有機材料。 The material of the first layer 21 may be an inorganic material such as glass or the like, or an organic material such as the above-exemplified plastics of the substrate 1. The material of the second layer 22 is not particularly limited, and may be an inorganic barrier material such as a metal such as a metal, cerium oxide, cerium oxynitride or tantalum nitride, or may be a plastic or the like exemplified as the substrate 1 described above. organic material.

更具體而言,第1層21或第2層22可為無機材料(例如:至少1種選自Si、Al、In、Sn、Zn及Ti之氧化物、氮化物或氮氧化物之層(例如在有機膜上蒸鍍的蒸鍍膜等))。 More specifically, the first layer 21 or the second layer 22 may be an inorganic material (for example, at least one layer selected from the group consisting of oxides, nitrides, or oxynitrides of Si, Al, In, Sn, Zn, and Ti ( For example, a vapor deposited film deposited on an organic film or the like)).

另外,第3圖中呈示黏著劑層2設在基材111之第2層22上之例,惟基材111之第1層21中,可在 設有第2層22之側的反側上設置黏著劑層2,亦可在第1層21與第2層22之間設置黏著劑層2。 Further, in Fig. 3, an example in which the adhesive layer 2 is provided on the second layer 22 of the substrate 111 is shown, but in the first layer 21 of the substrate 111, The adhesive layer 2 is provided on the reverse side of the side on which the second layer 22 is provided, and the adhesive layer 2 may be provided between the first layer 21 and the second layer 22.

第4圖係呈示作為圖像顯示裝置的積層體130包含有機EL元件3之例。亦即,如第4圖所示之積層體130係包含基材1、設在基材1上之有機EL元件3及在基材1上以包覆有機EL元件3之方式設置之黏著劑層2。 The fourth drawing shows an example in which the laminated body 130 as an image display device includes the organic EL element 3. In other words, the laminated body 130 shown in FIG. 4 includes the substrate 1, the organic EL element 3 provided on the substrate 1, and the adhesive layer provided on the substrate 1 so as to cover the organic EL element 3. 2.

依據第4圖所示之積層體130,黏著劑層2係以包覆有機EL元件3之方式設置,藉此而密封有機EL元件3,因此可阻斷水蒸氣滲入有機EL元件3。 According to the laminated body 130 shown in Fig. 4, the adhesive layer 2 is provided so as to cover the organic EL element 3, whereby the organic EL element 3 is sealed, so that the vapor of the organic EL element 3 can be blocked.

依據第2圖、第3圖及第4圖之積層體110、120及130,可阻斷水蒸氣從黏著劑層2之端面(第2圖、第3圖及第4圖之紙面橫向)滲入。而且,積層體110、120及130中,例如,如前述積層體之製造步驟途中,在黏著劑層2之表面上不設置其它層之狀態,亦可阻斷水蒸氣從黏著劑層2之表面與垂直方向(第2圖、第3圖及第4圖之紙面縱向)的滲入。 According to the laminates 110, 120, and 130 of Figs. 2, 3, and 4, water vapor can be blocked from infiltrating from the end faces of the adhesive layer 2 (the lateral direction of the paper of Figs. 2, 3, and 4). . Further, in the laminated bodies 110, 120, and 130, for example, in the middle of the manufacturing step of the laminated body, no other layer is provided on the surface of the adhesive layer 2, and the surface of the adhesive layer 2 may be blocked from water vapor. Infiltration with the vertical direction (the longitudinal direction of the paper in Figs. 2, 3, and 4).

第2圖、第3圖及第4圖之黏著劑層2係可藉由將後述之黏著劑組成物直接塗佈在基材1或基材111之表面而形成,惟亦可將形成在剝離性膜上之黏著劑層2轉貼在基材1或基材111之表面,藉此在基材1或基材111之表面形成黏著劑層2。基材1或基材111之水蒸氣穿透率在JIS Z0208、40℃×90%RH(濕杯法)(1976年版)中,可未達30g/m2.日,以未達10g/m2.日為佳,以未達1g/m2.日更佳(一般為1×10-6g/m2.日以上)。例如:基材 1、111之水蒸氣穿透率低於黏著劑層2之水蒸氣穿透率時(更具體而言,基材1、111具有水蒸氣阻隔性時(亦即,如為水蒸氣阻隔性膜時)),本發明之黏著劑層可抑制來自端面之水的滲入,因此,積層體110、120及130之水蒸氣穿透率實際上可成為基材1、111之水蒸氣穿透率。 The adhesive layer 2 of Fig. 2, Fig. 3, and Fig. 4 can be formed by directly applying an adhesive composition described later on the surface of the substrate 1 or the substrate 111, but it can also be formed in the peeling. The adhesive layer 2 on the film is transferred to the surface of the substrate 1 or the substrate 111, whereby the adhesive layer 2 is formed on the surface of the substrate 1 or the substrate 111. The water vapor permeability of the substrate 1 or the substrate 111 may be less than 30 g/m 2 in JIS Z0208, 40 ° C × 90% RH (wet cup method) (1976 edition). The day is less than 10g/m 2 . The day is better, less than 1g/m 2 . Better day (generally 1 × 10 -6 g / m 2 . day or more). For example, when the water vapor permeability of the substrate 1 and 111 is lower than the water vapor permeability of the adhesive layer 2 (more specifically, when the substrate 1 and 111 have water vapor barrier properties (that is, as water) In the vapor barrier film)), the adhesive layer of the present invention can suppress the infiltration of water from the end faces, and therefore, the water vapor permeability of the laminates 110, 120, and 130 can actually become the water vapor of the substrate 1, 111. Penetration rate.

基材1、111之膜厚,一般為1μm以上500μm以下,以5μm以上200μm以下為佳。 The film thickness of the base material 1 and 111 is generally 1 μm or more and 500 μm or less, and preferably 5 μm or more and 200 μm or less.

而且,本實施形態之黏著性水蒸氣阻隔性積層體在具有透明性時(例如:本實施形態之黏著性水蒸氣阻隔性積層體的全光線透光率在JIS K7361法(1997年版)中為85%以上時),基材1、111之全光線透光率在JIS K7361法中以85%以上(一般為100%以下)為佳,以87%以上更佳。 Further, when the adhesive water vapor barrier layered product of the present embodiment has transparency (for example, the total light transmittance of the adhesive water vapor barrier layered product of the present embodiment is JIS K7361 (1997 edition)) When it is 85% or more, the total light transmittance of the base materials 1 and 111 is preferably 85% or more (generally 100% or less) in the JIS K7361 method, and more preferably 87% or more.

1.10.作用效果 1.10. Effect

第1係本實施形態之黏著劑組成物由於(C)成分之因素而防止(B)成分往黏著劑層之表面移動,抑制由該黏著劑組成物所得的黏著片在長期保存時的經時劣化。 In the first embodiment, the adhesive composition of the present embodiment prevents the component (B) from moving toward the surface of the adhesive layer due to the component (C), and suppresses the elapsed time of the adhesive sheet obtained from the adhesive composition during long-term storage. Deterioration.

第2係本實施形態之黏著劑組成物為低極性且為疏水性,因此,由該黏著劑組成物所形成之黏著劑層的相對介電常數低且水蒸氣阻隔性優異。 In the second embodiment, the adhesive composition of the present embodiment has low polarity and is hydrophobic. Therefore, the adhesive layer formed of the adhesive composition has a low relative dielectric constant and excellent water vapor barrier properties.

第3係本實施形態之黏著劑組成物由於(B)成分之因素而使由該黏著劑組成物所形成之黏著劑層具有柔軟性(潤濕性)及可撓性,故階差追隨性優異。 In the adhesive composition of the third embodiment, the adhesive layer formed of the adhesive composition has flexibility (wettability) and flexibility due to the factor (B), so the step followability Excellent.

第4係本實施形態之黏著劑組成物藉由包含(C)成分及(D)成分而賦予黏著性,故由該黏著劑組成物 所形成之黏著劑層的黏著力及黏著力之經時安定性優異。 According to the fourth aspect, the adhesive composition of the present embodiment is provided with the component (C) and the component (D), and the adhesive composition is provided. The adhesion layer of the formed adhesive layer and the adhesion are excellent in stability over time.

第5係由本實施形態之黏著劑組成物而得的黏著劑層因(A)成分、(C)成分及(D)成分之因素而具有耐久性。 The fifth adhesive layer obtained from the adhesive composition of the present embodiment has durability due to factors (A), (C) and (D).

如此,由本實施形態之黏著劑組成物所形成的黏著劑層,係抑制由該黏著劑組成物而得的黏著片在長期保存時的黏著力之經時劣化,其相對介電常數低,且水蒸氣阻隔性、柔軟性、可撓性、階差追隨性、密接性及耐久性優異。因此,可適用在例如觸控面板式輸出輸入裝置或有機EL顯示器等中。 As described above, the adhesive layer formed of the adhesive composition of the present embodiment suppresses deterioration of the adhesive strength of the adhesive sheet obtained by the adhesive composition over a long period of time, and has a low relative dielectric constant. Excellent in water vapor barrier properties, flexibility, flexibility, step followability, adhesion and durability. Therefore, it can be applied to, for example, a touch panel type output input device or an organic EL display or the like.

2.黏著劑層(黏著片)及其製造方法 2. Adhesive layer (adhesive sheet) and manufacturing method thereof

本發明之一實施形態的黏著劑層(黏著片)係將本實施形態之黏著劑組成物所形成之膜進行乾燥而得。更具體而言,本發明之一實施形態的黏著劑層(黏著片)係包含(A)成分100質量份、(B)成分10質量份以上300質量份以下、(C)成分1質量份以上30質量份以下及(D)成分1質量份以上50質量份以下。此處,(C)成分之含量/(B)成分之含量為0.05以上0.70以下。 An adhesive layer (adhesive sheet) according to an embodiment of the present invention is obtained by drying a film formed of the adhesive composition of the present embodiment. More specifically, the adhesive layer (adhesive sheet) of one embodiment of the present invention contains 100 parts by mass of the component (A), 10 parts by mass or more and 300 parts by mass or less of the component (B), and 1 part by mass or more of the component (C). 30 parts by mass or less and (D) component 1 part by mass or more and 50 parts by mass or less. Here, the content of the component (C) / the content of the component (B) is 0.05 or more and 0.70 or less.

本實施形態之黏著劑層係可藉由將上述實施形態之黏著劑組成物溶解於溶劑中進行塗佈,再將該溶劑去除而得。亦即,本發明之一實施形態的黏著劑層(黏著片)之製造方法係包含:將溶解於溶劑中之上述實施形態之黏著劑組成物塗佈於基材上而得膜之步驟、與藉由使前述膜乾燥以去除溶劑而得到黏著劑層之步驟。 The adhesive layer of the present embodiment can be obtained by dissolving the adhesive composition of the above embodiment in a solvent, and then removing the solvent. That is, the method for producing an adhesive layer (adhesive sheet) according to an embodiment of the present invention includes a step of applying a pressure-sensitive adhesive composition of the above-described embodiment dissolved in a solvent to a substrate to obtain a film, and The step of obtaining an adhesive layer by drying the film to remove the solvent.

例如:將溶解於溶劑中之本實施形態的黏著劑組成物塗佈於剝離基材(分離件)之表面,例如藉由溶劑在蒸發溫度保持該分離件,即可得到本實施形態之黏著劑層(黏著片)。 For example, the adhesive composition of the present embodiment dissolved in a solvent is applied to the surface of a release substrate (separator), and the adhesive of the embodiment can be obtained by, for example, maintaining the separator at an evaporation temperature by a solvent. Layer (adhesive sheet).

更具體而言,在剝離基材上,將溶解於溶劑中之本實施形態的黏著劑組成物以凹版塗佈機、線棒式塗佈機、氣刀塗佈機及輥塗佈機等塗佈,將經塗佈之該黏著劑組成物在常溫(例如15℃以上40℃以下)下保持,或藉由適當地加熱(例如40℃以上200℃以下)使其乾燥,即可製作本實施形態之黏著劑層。 More specifically, the adhesive composition of the present embodiment dissolved in a solvent is coated on a release substrate by a gravure coater, a bar coater, an air knife coater, a roll coater or the like. The cloth can be prepared by holding the applied adhesive composition at a normal temperature (for example, 15° C. or higher and 40° C. or lower) or by appropriately heating (for example, 40° C. or higher and 200° C. or lower). Form of adhesive layer.

或者,亦可藉由將本實施形態之黏著劑組成物直接塗佈在被黏物上,即可製作本實施形態之黏著劑層。 Alternatively, the adhesive layer of the present embodiment can be produced by directly applying the adhesive composition of the present embodiment to the adherend.

本實施形態之黏著劑層,從透明性優異之觀點,全光線透光率在JIS K7361法中可為85%以上,以90%以上更佳。 In the adhesive layer of the present embodiment, the total light transmittance can be 85% or more in the JIS K7361 method from the viewpoint of excellent transparency, and more preferably 90% or more.

而且,本實施形態之黏著劑層,從耐久性及可撓性優異之觀點,在25℃、1Hz中的儲存彈性模數可為1×104Pa以上2×106Pa以下,以5×104Pa以上1×106Pa以下為佳。 Further, the adhesive layer of the present embodiment may have a storage elastic modulus at 25 ° C and 1 Hz from 1 × 10 4 Pa to 2 × 10 6 Pa or less, from the viewpoint of excellent durability and flexibility. It is preferable that 10 4 Pa or more and 1 × 10 6 Pa or less.

本實施形態之黏著劑層之膜厚一般為10μm以上500μm以下,以20μm以上300μm以下之範圍為佳。 The thickness of the adhesive layer of the present embodiment is generally 10 μm or more and 500 μm or less, and preferably 20 μm or more and 300 μm or less.

3.實施例 3. Embodiment

以下,根據下述實施例來說明本發明,惟本發明並不限於該等實施例。 Hereinafter, the present invention will be described based on the following examples, but the present invention is not limited to the examples.

3.1.黏著劑組成物之調製 3.1. Modulation of adhesive composition

通過表1所示配方混合各成分,分別調製實施例1至12及比較例1至3之黏著劑組成物。 The components of Examples 1 to 12 and Comparative Examples 1 to 3 were prepared by mixing the components in the formulations shown in Table 1.

亦即,使(A)成分及其它成分一起溶於溶劑(甲苯150質量份)中,分別調製實施例1至12及比較例1至3之黏著劑組成物。 In other words, the component (A) and the other components were dissolved in a solvent (150 parts by mass of toluene) to prepare the adhesive compositions of Examples 1 to 12 and Comparative Examples 1 to 3, respectively.

實施例1至12之黏著劑組成物中,以肉眼看不到固體在黏著劑組成物中,該黏著劑組成物中亦不出現暗沉或白濁,更且,以網眼1μm之濾紙過濾時不會導致堵塞,確認濾紙上並無殘渣。由此,確認實施例1至12及比較例1至3之黏著劑組成物中之(A)成分、(B)成分、(C)成分及(D)成分係溶解於溶劑中。 In the adhesive compositions of Examples 1 to 12, solids were not visible to the naked eye in the adhesive composition, and dull or white turbidity did not occur in the adhesive composition, and more, when filtered with a mesh filter of 1 μm. It does not cause clogging and confirms that there is no residue on the filter paper. Thus, it was confirmed that the components (A), (B), (C) and (D) in the adhesive compositions of Examples 1 to 12 and Comparative Examples 1 to 3 were dissolved in a solvent.

3.2.評定用黏著片之製造 3.2. Manufacture of adhesive sheets for evaluation

將實施例及比較例所得之黏著劑組成物溶液,使乾燥後之膜厚成為50μm之方式塗佈在經剝離處理之聚對苯二甲酸乙二酯膜上,以90℃之乾燥機去除有機溶劑(甲苯)。然後,將經剝離處理之聚對苯二甲酸乙二酯膜與黏著劑層之塗佈面貼合,得到膜厚50μm之評定用黏著片。 The adhesive composition solution obtained in the examples and the comparative examples was applied to the peeled polyethylene terephthalate film so that the film thickness after drying became 50 μm, and the organic film was removed by a dryer at 90 ° C. Solvent (toluene). Then, the peeled polyethylene terephthalate film was bonded to the coated surface of the pressure-sensitive adhesive layer to obtain an evaluation adhesive sheet having a film thickness of 50 μm.

3.3.評定方法 3.3. Assessment method

3.3.1.黏著力 3.3.1. Adhesion

(初期) (initial)

以上述3.2.欄記載之方法得到膜厚50μm之評定用黏 著片,剝離其一側之聚對苯二甲酸乙二酯膜,與膜厚100μm之聚對苯二甲酸乙二酯膜相貼合,裁為寬25mm作成試驗片。 The evaluation adhesive with a film thickness of 50 μm was obtained by the method described in the above column 3.2. The sheet was peeled off, and the polyethylene terephthalate film on one side was peeled off, and bonded to a polyethylene terephthalate film having a thickness of 100 μm, and cut into a test piece of 25 mm in width.

將玻璃片之經剝離處理的聚對苯二甲酸乙二酯膜剝離,將露出之黏著劑塗佈面以2kg之輥壓接玻璃。貼合20分鐘之後,將黏著片從玻璃板剝離(23℃、剝離角度180。、剝離速度300mm/分鐘),測定初期黏著力。 The peeled polyethylene terephthalate film of the glass piece was peeled off, and the exposed adhesive coated surface was pressure-bonded to the glass with a roll of 2 kg. After bonding for 20 minutes, the adhesive sheet was peeled off from the glass plate (23° C., peeling angle 180, peeling speed: 300 mm/min), and the initial adhesion was measured.

(老化後) (after aging)

以上述3.2.欄記載之方法得到膜厚50μm之評定用黏著片,剝離其一側之聚對苯二甲酸乙二酯膜,與膜厚100μm之聚對苯二甲酸乙二酯膜相貼合,以寬25mm裁切作成試驗片。 An evaluation adhesive sheet having a thickness of 50 μm was obtained by the method described in the above section 3.2. The polyethylene terephthalate film on one side was peeled off and bonded to a polyethylene terephthalate film having a thickness of 100 μm. The test piece was cut into a width of 25 mm.

將所得之試驗片在60℃、乾燥環境下放置1個月,再於23℃×50%RH環境下放置1小時後,剝離試驗片之經剝離處理的聚對苯二甲酸乙二酯膜,將露出之黏著劑塗佈面以2kg之輥來與玻璃壓接。貼合20分鐘之後,將黏著片從玻璃板剝離(23℃、剝離角度180°、剝離速度300mm/分鐘),測定老化後之黏著力。 The obtained test piece was allowed to stand at 60 ° C for 1 month in a dry environment, and then left to stand in an environment of 23 ° C × 50% RH for 1 hour, and then the peeled polyethylene terephthalate film of the test piece was peeled off. The exposed adhesive coated surface was crimped to the glass with a 2 kg roller. After bonding for 20 minutes, the adhesive sheet was peeled off from the glass plate (23° C., peeling angle: 180°, peeling speed: 300 mm/min), and the adhesive force after aging was measured.

3.3.2.階差追隨性 3.3.2. Step followability

將以上述3.2.欄記載之方法得到膜厚50μm之評定用黏著片轉貼至膜厚100μm之聚對苯二甲酸乙二酯膜,得到裁成50mm×50mm之評定試驗片。 The evaluation adhesive sheet having a film thickness of 50 μm was transferred to a polyethylene terephthalate film having a thickness of 100 μm by the method described in the above section 3.2. to obtain an evaluation test piece cut into 50 mm × 50 mm.

然後,將裁成15mm×15mm之膜厚25μm的聚對苯二甲酸乙二酯膜置於玻璃板上,以黏著劑層包覆玻 璃板上之聚對苯二甲酸乙二酯膜(15mm×15mm)之全部表面之方式貼合試驗片(50mm×50mm),經高壓釜處理(50℃、5atm、20分鐘)後,在常溫下放置1小時,以肉眼觀察階差部分之外觀。 Then, a polyethylene terephthalate film having a film thickness of 25 μm cut into 15 mm × 15 mm was placed on a glass plate, and the glass layer was coated with an adhesive layer. The test piece (50 mm × 50 mm) was attached to the entire surface of the polyethylene terephthalate film (15 mm × 15 mm) on the glass plate, and subjected to autoclaving (50 ° C, 5 atm, 20 minutes) at room temperature. After being left for 1 hour, the appearance of the step portion was observed with the naked eye.

基於上述內容,由黏著劑組成物而得的黏著劑層之階差追隨性係依以下之評定基準進行評定。 Based on the above, the step followability of the adhesive layer obtained from the adhesive composition was evaluated according to the following criteria.

(評定) (assessment)

○:在貼合的階差部分以肉眼看不出空隙或氣泡。 ○: No voids or bubbles were observed by the naked eye in the step portion of the bonding.

△:在貼合的階差部分以肉眼看出少許空隙或氣泡。 △: A small amount of voids or bubbles were visually observed in the step portion of the fit.

×:在貼合的階差部分看出明顯的空隙或氣泡。 ×: Obvious voids or bubbles were observed in the step portion of the fit.

3.3.3.初期黏性(探針黏性) 3.3.3. Initial viscosity (probe viscosity)

以上述3.2.欄記載之方法得到膜厚50μm之評定用黏著片,剝離其一側之聚對苯二甲酸乙二酯膜,與膜厚100μm之聚對苯二甲酸乙二酯膜相貼合作成試驗片,剝離試驗片之經剝離處理的聚對苯二甲酸乙二酯膜,測定露出之黏著劑塗佈面的探針黏性。探針係直徑5mm之SUS、接觸時間為1秒、探針速度為1cm/sec、負載20g。 An evaluation adhesive sheet having a thickness of 50 μm was obtained by the method described in the above section 3.2. The polyethylene terephthalate film on one side was peeled off and bonded to a polyethylene terephthalate film having a thickness of 100 μm. A test piece was prepared, and the peeled polyethylene terephthalate film of the test piece was peeled off, and the adhesive viscosity of the exposed adhesive-coated surface was measured. The probe was SUS having a diameter of 5 mm, the contact time was 1 second, the probe speed was 1 cm/sec, and the load was 20 g.

3.3.4.水蒸氣穿透率 3.3.4. Water vapor transmission rate

水蒸氣穿透率係按照JIS Z0208進行。亦即,以上述3.2.欄記載之方法得到膜厚50μm之評定用黏著片,剝離其兩面之聚對苯二甲酸乙二酯膜,與不織布貼合後,在裝有氯化鈣約10g之透濕杯(內徑60mm)上,以不織布夾包評定用黏著片,將四周密封。然後,將透濕杯靜置在40℃×90%RH環境下進行測定。 The water vapor transmission rate was carried out in accordance with JIS Z0208. That is, an adhesive sheet for evaluation having a film thickness of 50 μm was obtained by the method described in the above column 3.2, and the polyethylene terephthalate film on both sides thereof was peeled off, and after bonding with the non-woven fabric, about 10 g of calcium chloride was contained. On the moisture permeable cup (inner diameter 60 mm), the adhesive sheet was evaluated by a non-woven fabric, and the periphery was sealed. Then, the moisture permeable cup was allowed to stand in an environment of 40 ° C × 90% RH for measurement.

3.3.5.儲存彈性模數 3.3.5. Storage elastic modulus

將以上述3.2.欄記載之方法得到膜厚50μm之評定用黏著片在23℃×50%RH環境下互相貼合多次,在50℃×5atm之高壓釜中處理20分鐘,製作厚度1.0mm之黏著劑層。對該厚度1.0mm之黏著劑層,使用Anton Paar公司製造之「Physica MCR300」,根據JIS K7244之動態黏彈性測定法(溫度範圍-40℃至160℃、升溫速度3.67℃/分鐘、頻率1Hz的條件)測定黏彈性圖譜,決定溫度25℃中之儲存彈性模數。 The evaluation adhesive sheets having a film thickness of 50 μm obtained by the method described in the above section 3.2. were bonded to each other several times in an environment of 23 ° C × 50% RH, and treated in an autoclave at 50 ° C × 5 atm for 20 minutes to prepare a thickness of 1.0 mm. Adhesive layer. For the adhesive layer having a thickness of 1.0 mm, "Physica MCR300" manufactured by Anton Paar Co., Ltd., according to the dynamic viscoelasticity measurement method of JIS K7244 (temperature range -40 ° C to 160 ° C, temperature increase rate 3.67 ° C / minute, frequency 1 Hz) Condition) The viscoelastic spectrum was determined to determine the storage elastic modulus at a temperature of 25 °C.

3.3.6.相對介電常數 3.3.6. Relative dielectric constant

在膜厚100μm之銅箔上黏貼以上述3.2.欄記載之方法得到的膜厚50μm之評定用黏著片,進一步黏貼到膜厚100μm之銅箔作成測試樣品。使用Toyo公司製造之LCR測試儀6440B連接銅鉑,在頻率100Hz、23℃×65%RH之條件下求出相對介電常數。 The evaluation adhesive sheet having a film thickness of 50 μm obtained by the method described in the above section 3.2. was adhered to a copper foil having a thickness of 100 μm, and further adhered to a copper foil having a thickness of 100 μm to prepare a test sample. Copper/platinum was connected using an LCR tester 6440B manufactured by Toyo Corporation, and the relative dielectric constant was determined under the conditions of a frequency of 100 Hz and 23 ° C × 65% RH.

3.3.7.全光線透光率 3.3.7. Total light transmittance

以上述3.2.欄記載之方法得到膜厚50μm之評定用黏著片,剝離其一側之聚對苯二甲酸乙二酯膜,貼上玻璃作成試驗片。試驗片經高壓釜處理(50℃、5atm、20分鐘)後,去除另一面之聚對苯二甲酸乙二酯膜,將黏著劑層之全光線透光率以霧度計(型號名「HM-150」、村上色彩技術研究所公司製造)測定。 An evaluation adhesive sheet having a film thickness of 50 μm was obtained by the method described in the above section 3.2. The polyethylene terephthalate film on one side was peeled off, and glass was placed on it to prepare a test piece. After the test piece was autoclaved (50 ° C, 5 atm, 20 minutes), the other side of the polyethylene terephthalate film was removed, and the total light transmittance of the adhesive layer was measured by haze (model name "HM" -150", manufactured by Murakami Color Technology Research Institute Co., Ltd.).

此外,實施例及比較例中使用之各成分係如下所述。 Further, each component used in the examples and comparative examples is as follows.

▪(A)成分 ▪ (A) component

聚合物1:SEP(50質量%)與SEPS(50質量%)之混合物 Polymer 1: a mixture of SEP (50% by mass) and SEPS (50% by mass)

(苯乙烯含量15質量%、重量平均分子量150,000) (styrene content 15% by mass, weight average molecular weight 150,000)

聚合物2:SEP(50質量%)與SEPS(50質量%)之混合物 Polymer 2: a mixture of SEP (50% by mass) and SEPS (50% by mass)

(苯乙烯含量20質量%、重量平均分子量170,000) (styrene content 20% by mass, weight average molecular weight 170,000)

聚合物3:SEP(60質量%)與SEPS(40質量%)之混合物 Polymer 3: a mixture of SEP (60% by mass) and SEPS (40% by mass)

(苯乙烯含量15質量%、重量平均分子量130,000) (styrene content 15% by mass, weight average molecular weight 130,000)

聚合物4:SEP(30質量%)與SEPS(70質量%)之混合物 Polymer 4: a mixture of SEP (30% by mass) and SEPS (70% by mass)

(苯乙烯含量15質量%、重量平均分子量200,000) (styrene content 15% by mass, weight average molecular weight 200,000)

聚合物5:SEP(60質量%)與SEPS(40質量%)之混合物 Polymer 5: a mixture of SEP (60% by mass) and SEPS (40% by mass)

(苯乙烯含量35質量%、重量平均分子量130,000) (styrene content: 35 mass%, weight average molecular weight: 130,000)

另外,聚合物1至5中使用之SEP及SEPS之氫化度為90%以上。 Further, the degree of hydrogenation of SEP and SEPS used in the polymers 1 to 5 was 90% or more.

▪(B)成分 ▪ (B) ingredients

LV-100:聚丁烯(Mn=500)(JX日鑛日石能源(股)製造) LV-100: Polybutene (Mn=500) (manufactured by JX Nippon Mining & Energy Co., Ltd.)

HV-300:聚丁烯((Mn=1,400))(JX日鑛日石能源(股)製造) HV-300: Polybutene ((Mn=1,400)) (manufactured by JX Nippon Mining & Energy Co., Ltd.)

▪(C)成分 ▪ (C) ingredients

P-150:軟化點152±5℃之萜烯系樹脂(Yasuhara Chemical(股)製造) P-150: terpene resin having a softening point of 152 ± 5 ° C (manufactured by Yasuhara Chemical Co., Ltd.)

TH-130:軟化點130±5℃之萜烯酚型增黏樹脂(Yasuhara Chemical(股)製造) TH-130: terpene type tackifying resin with a softening point of 130±5°C (manufactured by Yasuhara Chemical Co., Ltd.)

▪(D)成分 ▪ (D) component

FMR-0150:軟化點145℃之芳香族系增黏樹脂(三井化學(股)製造、重量平均分子量:2,040) FMR-0150: Aromatic tackifying resin with a softening point of 145 ° C (manufactured by Mitsui Chemicals Co., Ltd., weight average molecular weight: 2,040)

FMR-6100:軟化點100℃之芳香族系增黏樹脂(三井化學(股)製造、重量平均分子量:1,210) FMR-6100: Aromatic tackifying resin with a softening point of 100 ° C (manufactured by Mitsui Chemicals Co., Ltd., weight average molecular weight: 1,210)

▪溶劑 ▪ Solvent

甲苯(三協化學公司製造) Toluene (made by Sankyo Chemical Co., Ltd.)

3.4.評定結果 3.4. Assessment results

由表1之結果得知,本案實施例1至12之黏著劑組成物係包含(A)成分、(B)成分、(C)成分及(D)成分,且相對於(B)成分之含量,(C)成分之含量((C)成分之含量/(B)成分之含量)為0.05以上0.70以下,藉此即可長期間維持黏著力,並具有高透明性及低的介電常數,且可得到密接性、耐候性、柔軟性、可撓性、黏性、階差追隨性及耐溼熱白化性優異之黏著劑層。 As is apparent from the results of Table 1, the adhesive compositions of Examples 1 to 12 of the present invention contained the components (A), (B), (C) and (D), and the content of the component (B). The content of the component (C) (the content of the component (C) / the content of the component (B)) is 0.05 or more and 0.70 or less, whereby the adhesive force can be maintained for a long period of time, and high transparency and a low dielectric constant are obtained. Further, an adhesive layer excellent in adhesion, weather resistance, flexibility, flexibility, viscosity, step followability, and wet heat whitening resistance can be obtained.

相對於此,如表1所示,可理解本案比較例1之組成物因不含(B)成分,使得階差追隨性低劣。而且,使用由本案比較例1之組成物而得之黏著劑層所得的黏著片,因黏性低而無法將膜厚50μm之黏著片層合並與1mm之厚度貼合。而且,可理解本案比較例2之組成物因不含(C)成分而使黏著力會經時劣化。又,可理解本案比較例3之組成物因不含(D)成分而使黏著力差。 On the other hand, as shown in Table 1, it can be understood that the composition of Comparative Example 1 of the present invention is inferior in step followability because it does not contain the component (B). Further, the adhesive sheet obtained by using the adhesive layer obtained from the composition of Comparative Example 1 of the present invention had a low adhesiveness, and it was impossible to bond the adhesive sheet having a thickness of 50 μm to the thickness of 1 mm. Further, it can be understood that the composition of Comparative Example 2 of the present invention deteriorates the adhesion over time due to the absence of the component (C). Further, it can be understood that the composition of Comparative Example 3 of the present invention is inferior in adhesion due to the absence of the component (D).

另外,經上述評定方法測定之由實施例1至12之黏著劑組成物所形成的上述黏著劑層之全光線透 光率均為92%。由此,可理解由實施例1至12之黏著劑組成物所形成的上述黏著劑層之透明性優異。 Further, the entire light of the above-mentioned adhesive layer formed of the adhesive compositions of Examples 1 to 12 measured by the above evaluation method The light rate is 92%. Thus, it can be understood that the above-mentioned adhesive layer formed of the adhesive compositions of Examples 1 to 12 is excellent in transparency.

10‧‧‧液晶顯示裝置(LCD) 10‧‧‧Liquid Crystal Display Unit (LCD)

11、15‧‧‧偏光板 11, 15‧‧‧ polarizing plate

12、14、17、30‧‧‧黏著劑層 12, 14, 17, 30‧‧‧ adhesive layer

13‧‧‧液晶面板 13‧‧‧LCD panel

16‧‧‧防碎膜 16‧‧‧Smashproof film

18‧‧‧ITO層 18‧‧‧ITO layer

19‧‧‧玻璃面板 19‧‧‧ glass panel

20‧‧‧觸控面板部 20‧‧‧Touch Panel Department

100‧‧‧觸控面板式輸出輸入裝置 100‧‧‧Touch panel type input input device

Claims (11)

一種黏著劑組成物,其包含:(A)選自X-Y-X型氫化苯乙烯系嵌段共聚物及X-Y型氫化苯乙烯系嵌段共聚物中之至少1種的嵌段共聚物、(B)常溫(23℃)下為液體之軟化劑、(C)萜烯系增黏樹脂,及(D)芳香族系增黏樹脂,其中,相對於前述(A)嵌段共聚物100質量份,分別含有前述(B)軟化劑10質量份以上300質量份以下、前述(C)萜烯系增黏樹脂1質量份以上30質量份以下及前述(D)芳香族系增黏樹脂1質量份以上50質量份以下,並且,相對於前述(B)軟化劑之含量,前述(C)萜烯系增黏樹脂之含量(前述(C)萜烯系增黏樹脂之含量/前述(B)軟化劑之含量)為0.05以上0.70以下。 An adhesive composition comprising: (A) a block copolymer selected from at least one of an XYX-type hydrogenated styrene block copolymer and an XY-type hydrogenated styrene block copolymer; (B) a room temperature (23) C is a liquid softener, (C) a terpene-based tackifying resin, and (D) an aromatic tackifying resin, each of which contains 100 parts by mass of the block copolymer (A). (B) the softening agent: 10 parts by mass or more and 300 parts by mass or less, (C) the terpene-based tackifying resin: 1 part by mass or more and 30 parts by mass or less, and the (D) aromatic-based tackifying resin: 1 part by mass or more and 50 parts by mass In the following, and the content of the (C) terpene-based tackifying resin relative to the content of the (B) softening agent (the content of the (C) terpene-based tackifying resin / the content of the aforementioned (B) softening agent ) is 0.05 or more and 0.70 or less. 如申請專利範圍第1項所述之黏著劑組成物,其中,前述(A)嵌段共聚物為X-Y-X型氫化苯乙烯系嵌段共聚物及X-Y型氫化苯乙烯系嵌段共聚物之混合物。 The adhesive composition according to claim 1, wherein the (A) block copolymer is a mixture of an X-Y-X type hydrogenated styrene block copolymer and an X-Y type hydrogenated styrene block copolymer. 如申請專利範圍第1或2項所述之黏著劑組成物,其中,前述(A)嵌段共聚物之苯乙烯含有率為10質量%以上35質量%以下。 The adhesive composition according to claim 1 or 2, wherein the styrene content of the (A) block copolymer is 10% by mass or more and 35% by mass or less. 如申請專利範圍第1至3項中任一項所述之黏著劑組成物,其中,由申請專利範圍第1至3項中任一項所 述之黏著劑組成物所得之黏著劑層的相對介電常數為1以上3.5以下。 The adhesive composition according to any one of claims 1 to 3, wherein any one of claims 1 to 3 is The adhesive layer obtained by the adhesive composition has a relative dielectric constant of 1 or more and 3.5 or less. 如申請專利範圍第1至4項中任一項所述之黏著劑組成物,其中,由申請專利範圍第1至4項中任一項所述之黏著劑組成物所得之膜厚50μm的黏著劑層之水蒸氣穿透率在JIS Z0208、40℃×90%RH中未達100g/m2.日。 The adhesive composition according to any one of claims 1 to 4, wherein the adhesive of the adhesive composition according to any one of claims 1 to 4 has a film thickness of 50 μm. The water vapor transmission rate of the agent layer is less than 100 g/m 2 in JIS Z0208, 40 ° C × 90% RH. day. 如申請專利範圍第1至5項中任一項所述之黏著劑組成物,其用於構成觸控面板式輸出輸入裝置的構件之貼合。 The adhesive composition according to any one of claims 1 to 5, which is used for constituting a member of a touch panel type input/output device. 如申請專利範圍第1至5項中任一項所述之黏著劑組成物,其用於構成有機EL顯示器的構件之貼合。 The adhesive composition according to any one of claims 1 to 5, which is used for constituting a member of an organic EL display. 一種積層體,其包含由申請專利範圍第1至5項中任一項所述之黏著劑組成物所得之黏著劑層與阻隔膜。 A laminate comprising an adhesive layer and a barrier film obtained from the adhesive composition according to any one of claims 1 to 5. 一種黏著片,其係將由申請專利範圍第1至5項中任一項所述之黏著劑組成物所形成之膜進行乾燥而得者。 An adhesive sheet obtained by drying a film formed of the adhesive composition according to any one of claims 1 to 5. 一種畫像顯示裝置,其包含使用申請專利範圍第1至5項中任一項所述之黏著劑組成物所形成之黏著劑層。 An image display device comprising an adhesive layer formed using the adhesive composition according to any one of claims 1 to 5. 一種輸出輸入裝置,其包含使用申請專利範圍第1至5項中任一項所述之黏著劑組成物所形成之黏著劑層。 An output input device comprising an adhesive layer formed using the adhesive composition according to any one of claims 1 to 5.
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