TW201604748A - Touch panel - Google Patents

Abstract

A touch panel including a substrate, first conductive units, second conductive units and insulation patterns is provided. Each of the first conductive units includes first electrodes. Each of the second conductive units includes second electrodes. Each of the first electrodes includes a first sub-electrode and a second sub-electrode subsequently stacked on the substrate. Each of the second electrodes includes a third sub-electrode and a fourth sub-electrode subsequently stacked on the substrate. The first sub-electrode and the third sub-electrode belong to a first conductive layer, and the second sub-electrode and the fourth sub-electrode belong to a second conductive layer. The first conductive layer has a plurality of steps at least located at a border between the first conductive units and the insulation patterns.

Description

Touch panel

The present invention relates to a touch panel, and more particularly to a touch panel having low conduction resistance and good touch sensing sensitivity.

The capacitive touch panel generally includes a plurality of first conductive units disposed along a first direction (eg, a vertical direction) and a plurality of second conductive units disposed along a second direction (eg, a horizontal direction). The driver of the capacitive touch panel can output a driving signal to the first conductive unit and receive the corresponding sensing signal generated by the second conductive unit, and then the capacitive touch panel generates a touch position signal according to the received sensing signal. .

Generally, the first sensing unit and the second sensing unit of the capacitive touch panel are formed of a transparent conductive material. However, the resistance value of the transparent conductive material generally affects the touch sensing performance of the capacitive touch panel. In addition, if the conductive unit is formed of a non-transparent conductive material (for example, a thin metal wire), there is a problem of visual effect. If the effect is reduced by reducing the line width to reduce the visual effect, the line width may be Too small, there will be problems of increased resistance and low yield. Therefore, how to reduce the conduction resistance of the first conductive unit and the second conductive unit of the capacitive touch panel is A very important topic.

The present invention provides a touch panel having low impedance and good touch sensitivity.

The touch panel of the present invention includes a substrate, a plurality of first conductive units, a plurality of second conductive units, and a plurality of insulating patterns. The first conductive unit is disposed on the substrate. Each of the first conductive units includes a plurality of first electrodes and a plurality of first connections. The two adjacent first electrodes are electrically connected by at least one first connecting portion. Each of the first electrodes includes a first sub-electrode and a second sub-electrode that are sequentially stacked on the substrate. The second conductive unit is disposed on the substrate. Each of the second conductive units includes a plurality of second electrodes and a plurality of second connections. The two adjacent second electrodes are electrically connected by at least one second connecting portion. Each of the second electrodes includes a third sub-electrode and a fourth sub-electrode that are sequentially stacked on the substrate. The second conductive unit and the first conductive unit are electrically insulated from each other and are staggered with each other. The first connecting portion, the first sub-electrode and the third sub-electrode belong to a first conductive layer. The second connecting portion, the second sub-electrode and the fourth sub-electrode belong to a second conductive layer. The insulation pattern is disposed at an intersection of the first conductive unit and the second conductive unit. The insulating pattern covers the first connection portion, and each of the insulation patterns covers at least one of a portion of the first sub-electrode and a portion of the third sub-electrode. The first conductive layer has a plurality of breaks. These deviations are located at the boundary of the first conductive unit and the insulating pattern.

Based on the above, the touch panel of the present invention includes a plurality of conductive units, and each of the conductive units includes a plurality of electrodes and a plurality of connections, wherein the electrodes are The layer conductive structure is formed, so that the conductive impedance is low, thereby improving the touch sensitivity of the touch panel.

The above described features and advantages of the invention will be apparent from the following description.

100, 100a, 100b, 100c, 100d‧‧‧ touch panels

110‧‧‧Substrate

112‧‧‧visible area

114‧‧‧The surrounding area

120‧‧‧First Conductive Unit

122‧‧‧First electrode

124‧‧‧First connection

130‧‧‧Second conductive unit

132‧‧‧second electrode

134‧‧‧Second connection

140‧‧‧Insulation pattern

150‧‧‧ proposed pattern

160‧‧‧buffer layer

A-A’, B-B’, C-C’‧‧‧

C1‧‧‧First Conductive Layer

C2‧‧‧Second conductive layer

D1‧‧‧ first direction

D2‧‧‧second direction

E1‧‧‧ first subelectrode

E1a‧‧‧First protrusion

E1b‧‧‧First retraction

E2‧‧‧Second subelectrode

E3‧‧‧ third subelectrode

E3a‧‧‧Second protrusion

E3b‧‧‧Second indentation

E4‧‧‧ fourth subelectrode

F‧‧‧ edge

G1‧‧‧ first gap

G2‧‧‧Second gap

G3‧‧‧ gap

H1, h2‧‧‧

M‧‧‧ area

W1, W2‧‧‧ line width

FIG. 1 is a schematic top view of a touch panel according to an embodiment of the invention.

FIG. 2 is an enlarged schematic view of a region M of FIG. 1.

3, 4, and 5 illustrate the respective film layers of FIG. 2, respectively.

Fig. 6 is a cross-sectional view showing the line A-A' and B-B' in Fig. 2.

FIG. 7 is a schematic top view of a touch panel according to another embodiment of the invention.

FIG. 8 is a partial top plan view of the touch panel of FIG. 1. FIG.

Fig. 9 is a schematic cross-sectional view taken along line C-C' of Fig. 8.

FIG. 10 is a partial cross-sectional view of a touch panel according to another embodiment of the present invention.

FIG. 11 is a partial top plan view of a touch panel according to another embodiment of the invention.

12 is a schematic diagram of a first conductive layer of the touch panel of FIG.

FIG. 13 is a schematic diagram of a first conductive layer of a touch panel according to another embodiment of the present invention.

FIG. 14 is a partial top plan view of a touch panel according to another embodiment of the invention.

15 is a schematic diagram of a first conductive layer of the touch panel of FIG. 14.

FIG. 16 is a partial top plan view of a touch panel according to another embodiment of the invention.

17 is a schematic diagram of a first conductive layer of the touch panel of FIG. 16.

FIG. 18 is a partial top plan view of a touch panel according to another embodiment of the present invention.

19 is a schematic diagram of a first conductive layer of the touch panel of FIG. 18.

FIG. 1 is a schematic top view of a touch panel according to an embodiment of the invention. Referring to FIG. 1 , the touch panel 100 includes a substrate 110 , a plurality of first conductive units 120 , a plurality of second conductive units 130 , and a plurality of insulating patterns 140 (shown in FIG. 2 ). The substrate 110 includes a viewable area 112 and a peripheral area 114, wherein the peripheral area 114 is located on at least one side of the viewable area 112. In the present embodiment, the peripheral zone 114 surrounds the viewable area 112. The first conductive unit 120 and the second conductive unit 130 are disposed on the substrate 110 and at least in the visible region 112. In other words, the first conductive unit 120 and the second conductive unit 130 may also extend to the peripheral region 114. The peripheral zone 114 is, for example, a non-visible zone and can be used to set signal wires, pads or other components that are not intended to be viewed by a user, and the like. In addition, a decorative layer may also be disposed in the peripheral region 114 so that the electronic device having the touch panel 110 can have a good appearance and at the same time achieve the effect of the shielding member. The material of the decorative layer may be ceramic, diamond-like carbon, ink, photoresist or any combination of the above materials, but not limited thereto.

The substrate 110 can be a hard transparent substrate or a flexible transparent substrate, and the material thereof is, for example, glass, sapphire or plastic, but not limited thereto. The substrate 110 can be a substrate that is independent of the display or an element substrate that is integrated into the display. For example, the substrate 110 is, for example, a cover lens, which is high in mechanical strength. The rigid substrate has the function of covering the lower element. The cover plate may be a tempered glass, a composite laminate of poly(methyl methacrylate); PMMA and polycarbonate (Polycarbonate; PC), an ultraviolet curable resin (such as ORGA resin) or other hard light transmission. The material is protected from scratches and high mechanical strength. In addition, the material of the substrate 110 may also contain a high temperature resistant plastic such as a polyimide or a cyclic olefin copolymer. The side of the substrate 110 on which the conductive unit is not disposed may be provided with a film layer such as an anti-glare film or an anti-reflection film, or/and a buffer layer such as an inorganic film layer such as ruthenium oxide. Further, the side surface of the substrate 110 connected to the touch surface may have a curved structure or a trapezoidal structure. In addition, the substrate 110 may be a color filter substrate of a liquid crystal display, a package cover of an organic light emitting diode display, or the like, but is not limited thereto.

The first conductive units 120 extend along a first direction d1 and are electrically insulated from each other. The first conductive unit 120 includes a plurality of first electrodes 122 and a plurality of first connecting portions 124. The two adjacent first electrodes 122 are electrically connected by one of the first connecting portions 124. However, the present invention is not limited thereto. In other embodiments, the two adjacent first electrodes 122 may be electrically connected by a plurality of, for example, two first connecting portions 124. The second conductive units 130 extend along a second direction d2 and are electrically insulated from each other. The second conductive unit 130 includes a plurality of second electrodes 132 and a plurality of second connecting portions 134 , and the adjacent two second electrodes 132 are electrically connected by one of the second connecting portions 134 . However, the present invention is not limited thereto. In other embodiments, the adjacent two second electrodes 132 may also be electrically connected by a plurality of, for example, two second connecting portions 134. The first direction d1 intersects the second direction d2, preferably perpendicular to each other. The second conductive unit 130 and the first conductive The units 120 are electrically insulated from each other and staggered with each other. One of the first conductive unit 120 and the second conductive unit 130 is a driving unit, and the other is a sensing unit. According to the first conductive unit 120 and the second conductive unit 130, for example, a touch element can be formed. Sensing the location of the touch event.

FIG. 2 is an enlarged schematic view of a region M of FIG. 1. FIG. 2 is a schematic structural view of a portion where the first conductive unit 120 and the second conductive unit 130 are alternated. In order to explain the structure here in detail, FIG. 3, FIG. 4 and FIG. 5 respectively illustrate the respective film layers in FIG. Fig. 6 is a cross-sectional view showing the line A-A' and B-B' in Fig. 2. Referring to FIG. 2 to FIG. 6 , the first electrode 122 includes a first sub-electrode E1 and a second sub-electrode E2 , which are sequentially stacked on the substrate 110 . The first sub-electrode E1 is located on the substrate 110 and the second sub-electrode E2 . between. The first sub-electrode E1 and the second sub-electrode E2 are formed of different conductive layers, and the two overlap and contact. The two adjacent first sub-electrodes E1 are connected by the first connecting portion 124 and can be formed by the same conductive layer, so that the adjacent two first electrodes 122 are electrically connected through the first connecting portion 124. Since the first electrode 122 is formed of two conductive layers, it has a large thickness and can have a low conductive impedance.

The second electrode 132 includes a third sub-electrode E3 and a fourth sub-electrode E4 stacked on the substrate 110. The third sub-electrode E3 is located between the substrate 110 and the fourth sub-electrode E4. The third sub-electrode E3 and the fourth sub-electrode E4 are formed of different conductive layers, and the two overlap and contact. The two adjacent second sub-electrodes E4 are connected by the second connecting portion 134 and can be formed by the same conductive layer, so that the adjacent two second electrodes 132 are electrically connected through the second connecting portion 134. The first sub-electrode E1 and the third sub-electrode E3 may be formed by the same conductive layer, and the second sub-electrode E2 and the fourth sub-electrode E4 may be formed by the same conductive layer. form. Since the second electrode 132 is formed of two conductive layers, it has a large thickness and can have a low conduction resistance.

The insulating pattern 140 is located at the intersection of the first conductive unit 120 and the second conductive unit 130. In other words, the insulating pattern 140 is located between the first conductive unit 120 and the second conductive unit 130 to electrically insulate the two from each other. The insulation pattern 140 may cover the first connection portion 124. Moreover, the insulating pattern 140 may cover a portion of the first sub-electrode E1 and a portion of the third sub-electrode E3. However, the present invention is not limited thereto. In other embodiments, the insulating pattern 140 may cover only a portion of the first sub-electrode E1 or only a portion of the third sub-electrode E3. The second connection portion 134 is disposed on the insulation pattern 140, and a portion of the second sub-electrode E2 and a portion of the fourth sub-electrode E4 are disposed on the insulation pattern 140. However, the present invention is not limited thereto. In other embodiments, only a portion of the second sub-electrode E2 may be disposed on the insulating pattern 140, or only a portion of the fourth sub-electrode E4 may be disposed on the insulating pattern 140.

According to the present embodiment, the insulating pattern 140 covers a portion of the first sub-electrode E1 and exposes the other portion of the first sub-electrode E1. The insulating pattern 140 covers a portion of the third sub-electrode E3 and exposes another portion of the third sub-electrode E3. A first gap G1 is formed between the first sub-electrode E1 and the third sub-electrode E3 covered by the insulating pattern 140. A second gap G2 is formed between the first sub-electrode E1 and the third sub-electrode E3 that are not covered by the insulating pattern 140. The first gap G1 is different from the second gap G2, wherein the gap width of the first gap G1 may be smaller than the gap width of the second gap G2. However, the invention is not limited thereto. The gap width of the second gap G2 may be greater than 25 microns, preferably greater than 30 microns. In other words, there may be enough between the first electrode 122 and the second electrode 124. The gap size is to further ensure that a problem that there is no short circuit between the first electrode 122 and the second electrode 124 occurs.

From another point of view, the outlines of the first sub-electrode E1 and the second sub-electrode E2 that are not covered by the insulating pattern 140 are substantially the same, and the outlines of the third sub-electrode E3 and the fourth sub-electrode E4 that are not covered by the insulating pattern 140 Roughly the same. Moreover, the first sub-electrode E1 covered by the insulating pattern 140 has a different outline from the second sub-electrode E2 positioned on the insulating pattern 140, and the third sub-electrode E3 covered by the insulating pattern 140 and the first bit on the insulating pattern 140 The contours of the four sub-electrodes E4 are different. In more detail, the first sub-electrode E1 covered by the insulating pattern 140 has a first protrusion E1a and the first protrusion E1a protrudes beyond the second sub-electrode E2. The third sub-electrode E3 covered by the insulating pattern 140 has a second protrusion E3a and the second protrusion E3a protrudes beyond the fourth sub-electrode E4. As such, the edge of the first sub-electrode E1 may have a gap h1, and the hysteresis h1 is located at the edge of the insulating pattern 140. Similarly, the edge of the third sub-electrode E3 may have a gap h2, and the hysteresis h2 is located at the edge of the insulating pattern 140. However, the present invention is not limited thereto. In a case where the first gap G1 is not equal to the second gap G2, the sidewalls of the first sub-electrode E1 covered by the insulating pattern 140 and the sidewall of the second sub-electrode E2 positioned on the insulating pattern 140 may also be The outlines of the fourth sub-electrode E3 covered by the insulating pattern 140 and the side wall of the fourth sub-electrode E4 positioned on the insulating pattern 140 may be substantially the same in outline.

Referring to FIG. 2 and FIG. 3 again, in the embodiment, the first conductive layer C1 has a plurality of intervals (including a first step h1 and a second step h2), wherein the first step h1 is in the insulation pattern. a junction of 140 with the first conductive unit 120, and for example located On the first sub-electrode E1. However, the present invention is not limited thereto. In other embodiments, the first hysteresis h1 may be located on the first connecting portion 124 or at the boundary between the first sub-electrode E1 and the first connecting portion 124. Furthermore, the second hysteresis h2 is at the boundary of the insulating pattern 140 and the second conductive unit 130, and is located, for example, on the third sub-electrode E3. In all embodiments of the present invention, the partial contours of the first step h1 and the second step h2 are substantially formed along the contour of the insulating pattern 140, in other words, the portions of the first step h1 and the second step h2 The outline is conformal to a corresponding contour of the insulating pattern 140 stacked on the first conductive layer C1. Therefore, the shapes of the first step h1 and the second step h2 are not limited to the structures disclosed in the embodiments of the present invention, that is, the partial contours of the first step h1 and the second step h2 may be, for example, Arc, straight, wave, sawtooth, etc.

The manufacturing process of the touch panel of FIG. 2 will be briefly described below. First, referring to FIG. 2 and FIG. 3, a first conductive layer C1 may be formed on the substrate 110. The first conductive layer C1 includes a first connection portion 124, a first sub-electrode to be formed, and a third sub-electrode (not shown) to be formed. The first sub-electrode to be formed has a smooth edge F with the third sub-electrode to be formed (ie, has no hysteresis h1 and hysteresis h2), so the first sub-electrode to be formed and the third sub-electrode to be formed There is a single gap between them, that is, having a first gap G1. In other words, the first sub-electrode to be formed and the third sub-electrode to be formed have a wider distribution range than the formed first sub-electrode E1 and third sub-electrode E3, wherein the first sub-electrode to be formed and The edge F of the third sub-electrode to be formed is, for example, indicated by a broken line in FIG.

The first conductive layer C1 may be made of a transparent conductive material, such as Indium tin oxide (ITO), Indium-Zinc Oxide (IZO), and zinc gallium oxide. (GZO), Carbon Nanotube, nanowire (eg nanosilver, electrospinning), conducting polymers, graphene, terpene or other high conductivity The light-transmitting material or the like is formed, but not limited thereto. For example, an opaque metal conductive material may also be used. The shape of the first conductive layer C1 is preferably a continuous film, such as an ITO film, a nano silver film, an ITO/Ag/ITO film, etc.; of course, a mesh film may also be used, especially for a metal material. For example, metal mesh, but not limited to this.

Next, referring to FIGS. 2 to 4, a plurality of insulating patterns 140 are formed. The insulating pattern 140 covers the first connection portion 124, a portion of the first sub-electrode to be formed, and a portion of the third sub-electrode to be formed.

Referring to FIG. 2 to FIG. 5, a second conductive layer C2 is formed. The material of the second conductive layer C2 can refer to the material of the first conductive layer C1. The second conductive layer C2 includes a second connection portion 134, a second sub-electrode E2, and a fourth sub-electrode E4. The second conductive layer C2 is formed by, for example, forming a conductive material layer to completely cover the substrate 110, the first conductive layer C1, and the insulating pattern 140. Next, a patterning process is performed to form the second conductive layer C2. The gap between the second sub-electrode E2 and the fourth sub-electrode E4 is the second gap G2, and the gap width of the second gap G2 is larger than the gap width of the first gap G1. In other words, the pattern of the second sub-electrode E2 and the fourth sub-electrode E4 is smaller than the pattern of the first sub-electrode to be formed and the third sub-electrode to be formed, so when performing the above-mentioned patterning process, it is one and the part of the A conductive layer C1 and a second conductive layer C2 are removed. Moreover, since the second gap G2 is larger than the first gap G1, it is ensured that there is no film remaining between the first electrode E1 and the second electrode E1, thereby reducing the number of A situation occurs in which a conductive unit 120 is short-circuited with the second conductive unit 130 (shown in FIG. 1). Moreover, since the insulating pattern 140 covers a portion of the first sub-electrode to be formed and the third sub-electrode to be formed, a gap h1 and a gap h2 may be formed at a boundary between the first gap G1 and the second gap G2, wherein The removed first sub-electrode to be formed and the portion of the third sub-electrode to be formed form a first protrusion E1a and a second protrusion E3a.

Referring to FIG. 2 and FIG. 6, the first connecting portion 124 is formed by the first conductive layer C1, and the second connecting portion 134 is formed by the second conductive layer C2, wherein the first conductive layer C1 may be thicker than the second conductive layer. The thickness of C2. The thickness of the first conductive layer C1 is, for example, 1.05 to 8 times the thickness of the second conductive layer C2. The conductive impedance of the first conductive layer C1 may be smaller than the conductive impedance of the second conductive layer C2, so the line width W1 of the first connection portion 124 may be smaller than the line width W2 of the second connection portion 134. The first conductive unit 120 of the present embodiment is, for example, a sensing unit, and the second conductive unit 130 is, for example, a driving unit, wherein the length of the second connecting portion 134 of the second conductive unit 130 is longer than the first connecting portion of the first conductive unit 120. The length of the 124 is short, and the line width of the second connection portion 134 of the second conductive unit 130 is larger than the line width of the first connection portion 124 of the first conductive unit 120. As a result, the first conductive unit 120 can have a good sensing effect, and the second conductive unit 130 can have a good driving effect, but the invention is not limited thereto.

In another embodiment, the thickness of the first conductive layer C1 may also be smaller than the thickness of the second conductive layer C2, as shown in FIG. Optionally, in the embodiment of FIG. 7, based on the low conduction impedance consideration, the line width W1 of the first connection portion 124 belonging to the first conductive layer C1 in FIG. 2 may be greater than the second line belonging to the second conductive layer C2. Connection portion 134 Line width W2. However, the invention is not limited thereto. In addition, if the patterning process of patterning the second conductive layer C2 is an etching process, the thickness of the second conductive layer C2 is greater than the thickness of the first conductive layer C1, which will help the first conductive layer C1 to be reliably Remove. Alternatively, the crystallinity of the second conductive layer C2 is made larger than the crystallinity of the first conductive layer C1, that is, the crystal grain size of the second conductive layer C2 is larger than the crystal grain size of the first conductive layer C1, and can also contribute to the first conductive layer. Layer C1 can be surely removed during the etching process. The thickness of the second conductive layer C2 is, for example, 1.05 to 8 times the thickness of the first conductive layer C1. However, the invention is not limited thereto. In other embodiments, the second conductive layer C2 may also have a smaller crystal grain size than the first conductive layer C1.

FIG. 8 is a partial top plan view of the touch panel 100 of FIG. 1. Fig. 9 is a schematic cross-sectional view taken along line C-C' of Fig. 8. Referring to FIG. 8 and FIG. 9 , the touch panel 100 can selectively include a plurality of dummy patterns 150 . The dummy pattern 150 is disposed between the first electrode 122 and the second electrode 132, wherein the gap G3 between the dummy pattern 150 and the first electrode 122 is equal to the second gap G2, and the pattern 150 and the second electrode 132 are disposed. The gap G3 between is equal to the second gap G2. The setting of the map 150 can reduce the user's perception of the arrangement of the first electrode 122 and the second electrode 132, and thus can help improve the visual effect of the touch panel 100. The dummy pattern 150 may be composed of a portion of the first conductive layer C1 and a portion of the second conductive layer C2 to be a two-layer structure, but the present invention is not limited thereto. The dummy pattern 150 may also be composed of only a part of the second conductive layer C2 to have a single layer structure.

The touch panel 100 may further include a buffer layer 160 as shown in FIG. The buffer layer 160 covers the substrate 110 and is located between the substrate 110 and the first conductive layer C1. The buffer layer 160 can ensure that the first conductive layer C1 can be effectively removed in the etching process without being susceptible to film retention. The material of the buffer layer 160 includes an organic material or an inorganic material. The material of the buffer layer 160 preferably includes polyamine, epoxy resin, decane, acrylic resin or other transparent resin, but is not limited thereto, and for example, cerium oxide, cerium oxide (SiOx), or oxidation may also be used. Nitrogen or a combination of the above, such as yttria with nitrogen oxide, whereby the contour of the patterned conductive layer is less visible. Taking cerium oxide as an example, the thickness is between 300 angstroms (Angstrom, Å) and 1000 Å. In the case of a resin, the thickness is between 0.1 micrometers (μm) and 3 micrometers (μm).

FIG. 11 is a partial top plan view of a touch panel according to another embodiment of the invention. 12 is a schematic diagram of a first conductive layer of the touch panel of FIG. Referring to FIG. 11 and FIG. 12 , similar to the touch panel 100 , the touch panel 100 a is formed by, for example, a first conductive layer C1 , an insulating pattern 140 , and a second conductive layer C2 , wherein the first conductive layer C1 has multiple A gap h1 and a plurality of second gaps h2. Furthermore, the adjacent two first electrodes 122 of the embodiment are electrically connected by, for example, the two first connecting portions 124. Moreover, the adjacent two second electrodes 132 of the present embodiment are electrically connected by, for example, two second connecting portions 134. In addition, in this embodiment, the insulating pattern 140 covers, for example, the two first connecting portions 124 electrically connecting the adjacent two first electrodes 122, but the invention is not limited thereto. In other embodiments, one of the first connecting portions 124 may be covered by the two insulating patterns 140, as shown in FIG.

FIG. 14 is a partial top plan view of a touch panel according to another embodiment of the invention. 15 is a schematic diagram of a first conductive layer of the touch panel of FIG. 14. The touch panel 100b of the present embodiment is similar to the touch panel 100 described above, and the difference is that The insulating pattern 140 covers only a portion of the third sub-electrode E3 without covering a portion of the first sub-electrode E1, and the insulating pattern 140 completely covers the first connecting portion 124. Since the insulating pattern 140 covers the first connecting portion 124 and does not cover the first sub-electrode E1 and completely covers the first connecting portion 124, after the second conductive layer C2 is completed, the first step h1 is located at the first sub-electrode E1. The boundary with the first connecting portion 124.

FIG. 16 is a partial top plan view of a touch panel according to another embodiment of the invention. 17 is a schematic diagram of a first conductive layer of the touch panel of FIG. 16. The touch panel 100c of the present embodiment is similar to the touch panel 100 described above, except that the insulating pattern 140 covers only the third sub-electrode E3 without covering the first sub-electrode E1, and the insulating pattern 140 covers the first connection. A portion of portion 124 and exposing another portion of first connecting portion 124. Since the insulating pattern 140 does not cover the first sub-electrode E1 and a portion of the first connecting portion 124, the first gap h1 is located on the first connecting portion 124 after the second conductive layer C2 is completed.

FIG. 18 is a partial top plan view of a touch panel according to another embodiment of the present invention. Referring to FIG. 18, similar to the foregoing embodiment, the touch panel 100d is formed of, for example, a first conductive layer C1, an insulating pattern 140, and a second conductive layer C2. 19 is a schematic view of the first conductive layer of the touch panel of FIG. 18, and the structures of the insulating pattern 140 and the second conductive layer C2 of the touch panel 100d are the same as those of FIGS. 4 and 5. Referring to FIG. 18 and FIG. 19 simultaneously, the touch panel 100d is similar to the touch panel 100 except that the first gap G1 between the first sub-electrode E1 and the third sub-electrode E3 covered by the insulating pattern 140 is different. It is larger than the second gap G2 between the first sub-electrode E1 and the third sub-electrode E3 that are not covered by the insulating pattern 140. Specifically, the insulation map The first sub-electrode E1 covered by the case 140 has a first indented portion E1b and the first indented portion E1b is constricted within the second sub-electrode E2. The third sub-electrode E3 covered by the insulating pattern 140 has a second indented portion E3b and the second indented portion E3b is constricted within the fourth sub-electrode E4. In addition, the manufacturing process of the touch panel 100d is similar to that of the touch panel 100. Please refer to the foregoing embodiment, the difference is that the structure of the first conductive layer C1 is different. Specifically, in this embodiment, when the first conductive layer C1 is completed, there are two kinds of gaps between the first sub-electrode to be formed and the third sub-electrode to be formed, wherein it is expected to be covered by the insulating pattern 140. The gap is the first gap G1. In addition, the gap that is not expected to be covered by the insulating pattern 140 is, for example, smaller than the first gap G1 and larger than the second gap G2. Moreover, after the patterning process is performed to form the second conductive layer C2, the gap not covered by the insulating pattern 140 becomes the second gap G2.

In summary, the touch panel of the present invention includes a plurality of conductive units, and each of the conductive units includes a plurality of electrodes and a plurality of connecting portions, wherein the electrodes are composed of a double-layer conductive structure, and thus have a lower Conduction impedance, which in turn improves the touch sensitivity of the touch panel.

100‧‧‧ touch panel

122‧‧‧First electrode

124‧‧‧First connection

132‧‧‧second electrode

134‧‧‧Second connection

140‧‧‧Insulation pattern

A-A’, B-B’‧‧‧ cut line

G1‧‧‧ first gap

G2‧‧‧Second gap

H1, h2‧‧‧

Claims (22)

A touch panel includes: a substrate; a plurality of first conductive units disposed on the substrate, each of the first conductive units including a plurality of first electrodes and a plurality of first connecting portions, adjacent to the two first electrodes Electrically connected by the at least one first connecting portion, and each of the first electrodes includes a first sub-electrode and a second sub-electrode sequentially stacked on the substrate; and a plurality of second conductive units disposed on the substrate Each of the second conductive units includes a plurality of second electrodes and a plurality of second connecting portions, the adjacent two second electrodes are electrically connected by the at least one second connecting portion, and each of the second electrodes is included on the substrate a third sub-electrode and a fourth sub-electrode are sequentially stacked, and the second conductive unit and the first conductive unit are electrically insulated from each other and staggered with each other, and the first connecting portion and the first sub-electrode are The third sub-electrode belongs to a first conductive layer, the second connecting portion, the second sub-electrode and the fourth sub-electrode belong to a second conductive layer; and a plurality of insulating patterns are disposed on the first conductive layers Unit and the second conductive unit Wrongly, the insulating patterns cover the first connecting portions, and each of the insulating patterns covers at least one of a portion of the first sub-electrode and a portion of the third sub-electrode, wherein the first conductive layer has a plurality of And a gap that is at least at a boundary between the first conductive unit and the insulating patterns. The touch panel of claim 1, wherein the gaps are located at a boundary between the second conductive units and the insulating patterns. The touch panel of claim 1, wherein a part of the touch panel Some of the difference is located on the first sub-electrode. The touch panel of claim 1, wherein a part of the gaps are located on the third sub-electrode. The touch panel of claim 1, wherein a part of the gaps are located on the first connecting portion. The touch panel of claim 1, wherein the portion of the gap is located at a boundary between the first sub-electrode and the first connecting portion. The touch panel of claim 1, wherein the two adjacent first electrodes are electrically connected by the two first connecting portions. The touch panel of claim 1, wherein the two adjacent second electrodes are electrically connected by the two second connecting portions. The touch panel of claim 1, wherein the first sub-electrode covered by each of the insulating patterns and the third sub-electrode have a first gap, which is not covered by each of the insulating patterns. There is a second gap between the first sub-electrode and the third sub-electrode, wherein the first gap is different from the second gap. The touch panel of claim 9, wherein the first gap is smaller than the second gap. The touch panel of claim 9, wherein the first gap is larger than the second gap. The touch panel of claim 1, wherein each of the second connecting portions is disposed on one of the insulating patterns, and at least one of a portion of the second sub-electrode and a portion of the fourth sub-electrode Set in one of the insulation diagrams On the case. The touch panel of claim 1, wherein the first sub-electrode covered by each of the insulating patterns has a first protrusion and the first protrusion protrudes beyond the second sub-electrode The third sub-electrode covered by each of the insulating patterns has a second protrusion and the second protrusion protrudes beyond the fourth sub-electrode. The touch panel of claim 1, wherein the first sub-electrode covered by each of the insulating patterns has a first retracted portion and the first retracted portion is retracted within the second sub-electrode The third sub-electrode covered by each of the insulating patterns has a second indented portion and the second indented portion is constricted within the fourth sub-electrode. The touch panel of claim 1, wherein the first conductive layer has a thickness greater than a thickness of the second conductive layer. The touch panel of claim 15, wherein the first connecting portion belongs to the first conductive layer, the second connecting portion belongs to the second conductive layer, and a line width of the first connecting portion is smaller than the The line width of the second connecting portion. The touch panel of claim 1, wherein the first conductive layer has a thickness smaller than a thickness of the second conductive layer. The touch panel of claim 17, wherein the first connecting portion belongs to the first conductive layer, the second connecting portion belongs to the second conductive layer, and a line width of the first connecting portion is larger than the The line width of the second connecting portion. The touch panel of claim 1, wherein the second conductive layer has a crystal grain size larger than a crystal grain size of the first conductive layer. The touch panel of claim 1, wherein the second panel The gap is greater than 25 microns. The touch panel of claim 1, further comprising a buffer layer covering the substrate and located between the substrate and the first conductive layer. The touch panel of claim 1, further comprising a plurality of dummy patterns disposed between the first electrodes and the second electrodes.