TW201600969A - Computer apparatus and method for keeping communication connection thereof - Google Patents

Computer apparatus and method for keeping communication connection thereof Download PDF

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TW201600969A
TW201600969A TW103120715A TW103120715A TW201600969A TW 201600969 A TW201600969 A TW 201600969A TW 103120715 A TW103120715 A TW 103120715A TW 103120715 A TW103120715 A TW 103120715A TW 201600969 A TW201600969 A TW 201600969A
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application processor
processor circuit
connection
communication
level
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TW103120715A
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聶劍揚
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宏碁股份有限公司
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Abstract

A computer apparatus and a method for keeping communication connection thereof are provided. The computer apparatus includes a communication module, an application processor circuit and a high-layer communication processor. The communication module is configured to establish a low-layer connection to an external server, wherein the low-layer connection includes a physical layer connection. The application processor circuit is configured to establish a high-layer connection through the communication module to the external server when the application processor circuit operates in a normal mode, wherein the high-layer connection includes a transport layer connection. The high-layer communication processor is configured to maintain the high-layer connection through the communication module to the external server when the application processor circuit operates in a power-saving mode.

Description

計算機裝置與其保持通訊連接方法 Computer device and communication connection method therefor

本發明是有關於一種具備網路通訊的電子裝置,且特別是有關於一種計算機裝置與其保持通訊連接方法。 The present invention relates to an electronic device having network communication, and more particularly to a method for maintaining a communication connection between a computer device.

在計算機(computer)結構中,連接至晶片組(chipset,例如南橋晶片)或中央處理器的通訊處理器(communication processor)可以提供網路通訊功能。通訊處理器只有提供低層連接(low layer connection)功能。所述低層連接包括開放式系統互聯通訊參考模型(Open System Interconnection Reference Model,簡稱OSI model或OSI/RM)所定義的第一層(即實體層或Physical Layer)連接與/或第二層(即資料鏈結層或Data link Layer)連接。 In a computer architecture, a communication processor connected to a chipset (such as a south bridge chip) or a central processing unit can provide network communication functions. The communication processor only provides a low layer connection function. The low-level connection includes a first layer (ie, a physical layer or a physical layer) and/or a second layer defined by an Open System Interconnection Reference Model (OSI model or OSI/RM) (ie, Data link layer or Data link Layer).

高層連接(high layer connection)功能則由運行於中央處理器(或晶片組)的韌體或軟體來提供。所述高層連接包括OSI model所定義的第三層(即網路層或Network Layer)連接與/或更高層連接。舉例來說,中央處理器(或晶片組)可以提供屬於OSI model第四層(即傳輸層或Transport Layer)的用戶數據報協議(User Datagram Protocol,UDP)功能,也可以提供屬於OSI model第七層(即應用層或Application Layer)的漫遊(roaming)、網際網路協定位址(Internet Protocol Address,簡稱IP位址)租借處理(leasing dealing)、動態主機設定協定(Dynamic Host Configuration Protocol,簡稱DHCP)或其他應用功能。 The high layer connection function is provided by firmware or software running on the central processor (or chipset). The high-level connection includes a third layer (ie, a network layer or a network layer) connection and/or a higher layer connection defined by the OSI model. For example, a central processing unit (or chipset) can provide OSI The User Datagram Protocol (UDP) function of the fourth layer of the model (ie, the transport layer or the Transport Layer) can also provide roaming and internet access belonging to the seventh layer of the OSI model (ie, the application layer or the application layer). Internet Protocol Address (IP address) leasing dealing, Dynamic Host Configuration Protocol (DHCP) or other application functions.

計算機的通訊處理器可以經由通訊網路而對外部伺服器建立低層連接,而計算機的中央處理器(或晶片組)可以經由通訊處理器與通訊網路而對所述外部伺服器建立高層連接。在計算機與外部伺服器之間的連接建立之後,計算機可以進入睡眠模式而停止供電給中央處理器(或晶片組),以便減少功耗。在計算機處於同一個網路路由器的服務範圍的狀況下,於睡眠模式中持續正常操作的通訊處理器可以保持對外部伺服器的低層連接。當計算機漫遊於不同網路路由器的服務範圍時,由於IP位址或其他高層通訊參數發生改變,於睡眠模式中的中央處理器(或晶片組)必須被喚醒,以便執行高層連接功能(例如租借新IP位址或其他連接維護)來維持對外部伺服器的高層連接。喚醒中央處理器(或晶片組)意謂者喚醒整個系統。然而,頻繁地喚醒中央處理器(或晶片組)將會增加功耗。對於可攜式計算機而言,頻繁地喚醒中央處理器(或晶片組)將會消耗電池的電量。 The communication processor of the computer can establish a low-level connection to the external server via the communication network, and the central processing unit (or chipset) of the computer can establish a high-level connection to the external server via the communication processor and the communication network. After the connection between the computer and the external server is established, the computer can enter sleep mode and stop supplying power to the central processor (or chipset) to reduce power consumption. In the case where the computer is in the service range of the same network router, the communication processor that continues to operate normally in the sleep mode can maintain a low-level connection to the external server. When a computer roams the service range of a different network router, the central processor (or chipset) in sleep mode must be woken up in order to perform high-level connectivity functions (such as renting) due to changes in IP addresses or other high-level communication parameters. New IP addresses or other connection maintenance) to maintain high-level connections to external servers. Wake up the central processor (or chipset) means that the entire system is woken up. However, frequently waking up the central processor (or chipset) will increase power consumption. For portable computers, frequently waking up the central processor (or chipset) will consume battery power.

本發明提供一種保持通訊連接的計算機裝置與其保持通訊連接方法,以在省電模式時可以對外部伺服器維持高層連接。 The present invention provides a computer device that maintains a communication connection with a communication connection method thereof to maintain a high-level connection to an external server in a power saving mode.

本發明的實施例所述一種保持通訊連接的計算機裝置,包括通訊模組、應用處理器電路以及高層通訊處理器。通訊模組經組態以對外部伺服器建立低層連接(low layer connection),其中該低層連接包括實體層(Physical Layer)連接。應用處理器電路的第一資料端耦接至通訊模組的第一資料端。高層通訊處理器的第一資料端耦接至通訊模組的第二資料端。當應用處理器電路操作於正常模式時,應用處理器電路經組態以通過通訊模組對外部伺服器建立高層連接(high layer connection),其中高層連接包括傳輸層(Transport Layer)連接。當應用處理器電路操作於省電模式時,高層通訊處理器經組態以通過通訊模組對外部伺服器維持高層連接。 A computer device for maintaining a communication connection according to an embodiment of the present invention includes a communication module, an application processor circuit, and a high-level communication processor. The communication module is configured to establish a low layer connection to the external server, wherein the lower layer connection comprises a physical layer connection. The first data end of the application processor circuit is coupled to the first data end of the communication module. The first data end of the high-level communication processor is coupled to the second data end of the communication module. When the application processor circuit is operating in the normal mode, the application processor circuit is configured to establish a high layer connection to the external server via the communication module, wherein the high level connection comprises a transport layer connection. When the application processor circuit is operating in a power saving mode, the higher layer communication processor is configured to maintain a high level connection to the external server through the communication module.

本發明的實施例所述一種計算機裝置的保持通訊連接方法,包括:配置通訊模組於該計算機裝置中,其中該通訊模組經組態以對外部伺服器建立低層連接,而該低層連接包括實體層連接;配置應用處理器電路於該計算機裝置中,其中該應用處理器電路的第一資料端耦接至該通訊模組的第一資料端;配置高層通訊處理器於該計算機裝置中,其中該高層通訊處理器的第一資料端耦接至該通訊模組的第二資料端;當該應用處理器電路操作於正常模式時,由該應用處理器電路通過該通訊模組對該外部伺服器建立高層連接,其中該高層連接包括傳輸層連接;以及當該應 用處理器電路操作於省電模式時,由該高層通訊處理器通過該通訊模組對該外部伺服器維持該高層連接。 A method for maintaining a communication connection of a computer device according to an embodiment of the present invention includes: configuring a communication module in the computer device, wherein the communication module is configured to establish a low-level connection to an external server, and the low-level connection includes The physical layer is connected to the computer device, wherein the first data end of the application processor circuit is coupled to the first data end of the communication module; and the high-level communication processor is configured in the computer device. The first data end of the high-level communication processor is coupled to the second data end of the communication module; when the application processor circuit operates in the normal mode, the application processor circuit passes the communication module to the external The server establishes a high-level connection, wherein the high-level connection includes a transport layer connection; and when the response When the processor circuit is operated in the power saving mode, the high-level communication processor maintains the high-level connection to the external server through the communication module.

基於上述,本發明諸實施例所述計算機裝置可以不需喚醒應用處理器電路,而由高層通訊處理器執行高層連接功能(例如租借新IP位址或其他連接維護)來維持對外部伺服器的高層連接。 Based on the above, the computer device according to the embodiments of the present invention can perform high-level connection functions (such as renting a new IP address or other connection maintenance) by the high-level communication processor without waking up the application processor circuit to maintain the external server. High-rise connection.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

10‧‧‧網路 10‧‧‧Network

20‧‧‧外部伺服器 20‧‧‧External Server

100、300‧‧‧計算機裝置 100, 300‧‧‧ computer equipment

110‧‧‧顯示電路 110‧‧‧Display circuit

120、320‧‧‧應用處理器電路 120, 320‧‧‧Application Processor Circuit

130、330‧‧‧通訊模組 130, 330‧‧‧Communication Module

140‧‧‧感測器集線器 140‧‧‧Sensor Hub

150、630‧‧‧感測器 150, 630‧‧‧ sensor

310‧‧‧高層通訊處理器 310‧‧‧High-level communication processor

510‧‧‧切換器 510‧‧‧Switch

520、610‧‧‧網路晶片 520, 610‧‧‧ network chip

620、710‧‧‧感測器集線器 620, 710‧‧‧ sensor hub

711‧‧‧處理結果 711‧‧‧ Processing results

圖1是說明一種計算機裝置的電路方塊示意圖。 1 is a block diagram showing the circuitry of a computer device.

圖2是說明圖1所示應用處理器電路與通訊模組所運行的網路通訊模型示意圖。 2 is a schematic diagram showing a network communication model of the application processor circuit and the communication module shown in FIG.

圖3是依照本發明實施例說明一種保持通訊連接的計算機裝置的電路方塊示意圖。 3 is a block diagram showing the circuitry of a computer device that maintains a communication connection in accordance with an embodiment of the present invention.

圖4是依照本發明實施例說明圖3所示高層通訊處理器、應用處理器電路以及通訊模組所運行的網路通訊模型示意圖。 4 is a schematic diagram showing a network communication model of the high-level communication processor, the application processor circuit, and the communication module shown in FIG. 3 according to an embodiment of the invention.

圖5是依照本發明一實施例說明圖3所示計算機裝置的電路方塊示意圖。 FIG. 5 is a block diagram showing the circuit of the computer device shown in FIG. 3 according to an embodiment of the invention.

圖6是依照本發明另一實施例說明圖3所示計算機裝置的電路方塊示意圖。 FIG. 6 is a block diagram showing the circuit of the computer device shown in FIG. 3 according to another embodiment of the present invention.

圖7是依照本發明又一實施例說明圖3所示計算機裝置的電路方塊示意圖。 FIG. 7 is a block diagram showing the circuit of the computer device shown in FIG. 3 according to still another embodiment of the present invention.

在本案說明書全文(包括申請專利範圍)中所使用的「耦接」一詞可指任何直接或間接的連接手段。舉例而言,若文中描述第一裝置耦接於第二裝置,則應該被解釋成該第一裝置可以直接連接於該第二裝置,或者該第一裝置可以透過其他裝置或某種連接手段而間接地連接至該第二裝置。另外,凡可能之處,在圖式及實施方式中使用相同標號的元件/構件/步驟代表相同或類似部分。不同實施例中使用相同標號或使用相同用語的元件/構件/步驟可以相互參照相關說明。 The term "coupled" as used throughout the specification (including the scope of the patent application) may be used in any direct or indirect connection. For example, if the first device is described as being coupled to the second device, it should be construed that the first device can be directly connected to the second device, or the first device can be connected through other devices or some kind of connection means. Connected to the second device indirectly. In addition, wherever possible, the elements and/ Elements/components/steps that use the same reference numbers or use the same terms in different embodiments may refer to the related description.

圖1是說明一種計算機裝置100的電路方塊示意圖。計算機裝置100包括顯示電路110、應用處理器電路120、通訊模組130、感測器集線器(sensor hub)140與一個或多個感測器150。依照不同的設計需求,應用處理器電路120可能包括中央處理單元(或中央處理器)、微處理器、晶片組(例如南橋晶片)及/或其他運算電路。韌體及/或軟體可以運行於應用處理器電路120。所述韌體可能是基本輸入輸出系統(Basic Input/Output System,簡稱BIOS)。所述軟體可能是作業系統(operating system,簡稱OS)、驅動程式、應用程式及/或其他軟體。顯示電路110耦接至應用處理器電路120。應用處理器電路120可以經由顯示電路110呈現資 訊/畫面給使用者。 1 is a block diagram showing the circuitry of a computer device 100. The computer device 100 includes a display circuit 110, an application processor circuit 120, a communication module 130, a sensor hub 140, and one or more sensors 150. Depending on the design requirements, the application processor circuit 120 may include a central processing unit (or central processing unit), a microprocessor, a chipset (eg, a south bridge wafer), and/or other operational circuitry. The firmware and/or software can run on the application processor circuit 120. The firmware may be a Basic Input/Output System (BIOS). The software may be an operating system (OS), a driver, an application, and/or other software. Display circuit 110 is coupled to application processor circuit 120. The application processor circuit 120 can present the resource via the display circuit 110 The message/picture is given to the user.

感測器集線器140耦接至應用處理器電路120。依照不同的設計需求,感測器集線器140可能包含人機介面裝置(human interface device,簡稱HID)感測器控制器或是其他感測器控制電路。一個或多個感測器150耦接至感測器集線器140。依照不同的設計需求,感測器150可能包括加速度感測器(acceleration sensor 或g-sensor)、陀螺儀感測器(gyro sensor)、磁強計(magnetometer)、近接感測器(proximity sensor)、壓力感測器(pressure sensor)及/或其他感測器。感測器集線器140是個能獲取、整合並處理來自不同感測器150數據的微控制器。感測器集線器140處理感測器150的數據後,將處理結果提供給應用處理器電路120。因此,感測器集線器140能把這類任務移離應用處理器電路120以節省電力並提升效能。 The sensor hub 140 is coupled to the application processor circuit 120. Depending on the design requirements, sensor hub 140 may include a human interface device (HID) sensor controller or other sensor control circuit. One or more sensors 150 are coupled to the sensor hub 140. According to different design requirements, the sensor 150 may include an acceleration sensor or a g-sensor, a gyro sensor, a magnetometer, and a proximity sensor. , pressure sensor and / or other sensors. The sensor hub 140 is a microcontroller that can acquire, integrate, and process data from different sensors 150. After the sensor hub 140 processes the data of the sensor 150, the processing result is provided to the application processor circuit 120. Thus, sensor hub 140 can move such tasks away from application processor circuit 120 to conserve power and improve performance.

通訊模組130耦接至應用處理器電路120。依照不同的設計需求,通訊模組130可能包括有線網路介面(例如乙太網路介面或是其他區域網路介面)以及/或是無線網路介面(例如WiFi網路介面或是其他無線區域網路介面)。通訊模組130經組態而經由網路10對外部伺服器20建立低層連接(low layer connection),其中該低層連接包括實體層連接(physical layer connection)。應用處理器電路120經組態以通過通訊模組130與網路10對外部伺服器20建立高層連接(high layer connection),其中該高層連接包括傳輸層連接(transport layer connection)。所述網路10可以是 有線網路、無線網路及/或混合有線媒體與無線媒體之通訊網路。 The communication module 130 is coupled to the application processor circuit 120. According to different design requirements, the communication module 130 may include a wired network interface (such as an Ethernet interface or other regional network interface) and/or a wireless network interface (such as a WiFi network interface or other wireless area). Network interface). The communication module 130 is configured to establish a low layer connection to the external server 20 via the network 10, wherein the lower layer connection comprises a physical layer connection. The application processor circuit 120 is configured to establish a high layer connection to the external server 20 via the communication module 130 and the network 10, wherein the high level connection comprises a transport layer connection. The network 10 can be A wired, wireless, and/or hybrid network of wireless media and wireless media.

舉例來說,圖2是說明圖1所示應用處理器電路120與通訊模組130所運行的網路通訊模型示意圖。以開放式系統互聯通訊參考模型(Open System Interconnection Reference Model,簡稱OSI model或OSI/RM)為說明範例,通訊模組130可以經由網路10對外部伺服器20建立實體層(第一層)連接、資料鍊結層(data link layer,即第二層)連接與網路層(network layer,即第三層)連接,而應用處理器電路120可以經由通訊模組130與網路10對外部伺服器20建立網路層連接、傳輸層(第四層)連接、會議層(session layer,即第五層)連接、表現層(presentation layer,即第六層)連接與應用層(application layer,即第七層)連接。 For example, FIG. 2 is a schematic diagram illustrating a network communication model run by the application processor circuit 120 and the communication module 130 shown in FIG. Taking the Open System Interconnection Reference Model (OSI model or OSI/RM) as an illustrative example, the communication module 130 can establish a physical layer (first layer) connection to the external server 20 via the network 10. The data link layer (the second layer) is connected to the network layer (the third layer), and the application processor circuit 120 can connect to the external server via the communication module 130 and the network 10. The device 20 establishes a network layer connection, a transport layer (layer 4) connection, a session layer (the fifth layer) connection, a presentation layer (the sixth layer) connection, and an application layer (application layer). The seventh floor) is connected.

計算機裝置100與外部伺服器20之間的網路通訊模型不應被限制於上述OSI model。在其他實施例中,基於不同的應用需求,計算機裝置100與外部伺服器20之間可能採用其他的網路通訊模型。舉例來說,若以TCP/IP協定族(TCP/IP Protocol Suite或TCP/IP Protocols)為說明範例,則通訊模組130可以經由網路10對外部伺服器20建立實體層連接、資料鍊結層連接與網路層連接,而應用處理器電路120可以經由通訊模組130與網路10對外部伺服器20建立網路層連接、傳輸層連接與應用層連接。所述TCP/IP協定族是一個網路通訊模型,其包含傳輸控制協定(Transmission Control Protocol,TCP)和網際協定(Internet Protocol,IP)。 The network communication model between the computer device 100 and the external server 20 should not be limited to the above OSI model. In other embodiments, other network communication models may be employed between the computer device 100 and the external server 20 based on different application requirements. For example, if the TCP/IP protocol suite (TCP/IP Protocol Suite or TCP/IP Protocols) is used as an example, the communication module 130 can establish a physical layer connection and data link to the external server 20 via the network 10. The layer connection is connected to the network layer, and the application processor circuit 120 can establish a network layer connection, a transport layer connection and an application layer connection to the external server 20 via the communication module 130 and the network 10. The TCP/IP protocol suite is a network communication model including a Transmission Control Protocol (TCP) and an Internet Protocol (IP).

計算機裝置100與外部伺服器20之間的低層連接(例如實體層連接與資料鍊結層連接)是由通訊模組130負責建立,而計算機裝置100與外部伺服器20之間的高層連接(例如網路層連接、傳輸層連接、會議層連接、表現層連接與應用層連接)是由應用處理器電路120負責建立。舉例來說,應用處理器電路120可以提供屬於OSI model第四層(即傳輸層)的用戶數據報協議(User Datagram Protocol,UDP)連接功能,也可以提供屬於OSI model第七層(即應用層)的漫遊(roaming)、網際網路協定位址(Internet Protocol Address,簡稱IP位址)租借處理(leasing dealing)、動態主機設定協定(Dynamic Host Configuration Protocol,簡稱DHCP)或其他連接功能。 The low-level connection between the computer device 100 and the external server 20 (eg, physical layer connection and data link layer connection) is established by the communication module 130, and the high-level connection between the computer device 100 and the external server 20 (eg, The network layer connection, the transport layer connection, the conference layer connection, the presentation layer connection, and the application layer connection are all established by the application processor circuit 120. For example, the application processor circuit 120 can provide a User Datagram Protocol (UDP) connection function belonging to the fourth layer (ie, the transport layer) of the OSI model, and can also provide the seventh layer belonging to the OSI model (ie, the application layer). Roaming, Internet Protocol Address (IP address) leasing dealing, Dynamic Host Configuration Protocol (DHCP) or other connectivity functions.

在建立了計算機裝置100與外部伺服器20之間的連接之後,計算機裝置100便可以經由網路10而與外部伺服器20進行通訊。計算機裝置100可能會進入省電模式(例如睡眠模式或休眠模式)而停止供電給應用處理器電路120,以便減少功耗。於所述省電模式中,通訊模組130可以持續正常操作,以保持對外部伺服器20的低層連接。在計算機裝置100處於同一個網路路由器的服務範圍的狀況下,於省電模式中持續正常操作的通訊模組130可以保持對外部伺服器20的低層連接。當計算機裝置100漫遊於不同網路路由器的服務範圍時,由於IP位址或其他高層通訊參數發生改變,於省電模式中的應用處理器電路120必須被喚醒,以便執行高層連接功能(例如租借新IP位址或其他連接維護)來維 持對外部伺服器20的高層連接。喚醒應用處理器電路120意謂者喚醒整個系統。然而,頻繁地喚醒應用處理器電路120將會增加功耗。對於可攜式計算機而言,頻繁地喚醒應用處理器電路120將會消耗電池的電量。 After the connection between the computer device 100 and the external server 20 is established, the computer device 100 can communicate with the external server 20 via the network 10. The computer device 100 may enter a power saving mode (eg, a sleep mode or a sleep mode) and stop supplying power to the application processor circuit 120 to reduce power consumption. In the power saving mode, the communication module 130 can continue to operate normally to maintain a low level connection to the external server 20. In a situation where the computer device 100 is in the service range of the same network router, the communication module 130 that continues to operate normally in the power saving mode can maintain a low-level connection to the external server 20. When the computer device 100 roams the service range of different network routers, the application processor circuit 120 in the power saving mode must be woken up in order to perform high-level connection functions (such as renting) due to changes in IP addresses or other high-level communication parameters. New IP address or other connection maintenance) A high level connection to the external server 20 is maintained. Wake-up application processor circuit 120 means that the entire system is woken up. However, frequently waking up the application processor circuit 120 will increase power consumption. For a portable computer, frequently waking up the application processor circuit 120 will consume the battery's power.

圖3是依照本發明實施例說明一種保持通訊連接的計算機裝置300的電路方塊示意圖。計算機裝置300包括高層通訊處理器310、應用處理器電路320以及通訊模組330。依照不同的設計需求,應用處理器電路320可能包括中央處理單元(或中央處理器)、微處理器、晶片組(例如南橋晶片)及/或其他運算電路。韌體及/或軟體可以運行於應用處理器電路320。所述韌體可能是基本輸入輸出系統(BIOS)。所述軟體可能是作業系統(OS)、驅動程式、應用程式及/或其他軟體。 3 is a block diagram showing the circuitry of a computer device 300 that maintains a communication connection in accordance with an embodiment of the present invention. The computer device 300 includes a high layer communication processor 310, an application processor circuit 320, and a communication module 330. Depending on the design requirements, application processor circuit 320 may include a central processing unit (or central processing unit), a microprocessor, a chipset (eg, a south bridge wafer), and/or other operational circuitry. The firmware and/or software can run on the application processor circuit 320. The firmware may be a basic input/output system (BIOS). The software may be an operating system (OS), a driver, an application, and/or other software.

通訊模組330經組態以對外部伺服器20建立低層連接,其中所述低層連接包括實體層連接。通訊模組330的第一資料端耦接至應用處理器電路320的第一資料端。通訊模組330的第二資料端耦接至高層通訊處理器310的第一資料端。當應用處理器電路320操作於正常模式時,應用處理器電路320經組態以通過通訊模組330對外部伺服器20建立高層連接,其中所述高層連接包括傳輸層連接。當應用處理器電路320操作於省電模式時,高層通訊處理器310經組態以通過通訊模組330與網路10對外部伺服器20維持該高層連接。圖3所示網路10、外部伺服器20、計算機裝置300、應用處理器電路320以及通訊模組330的實施細節 可以參照圖1所示網路10、外部伺服器20、計算機裝置100、應用處理器電路120以及通訊模組130的相關說明而類推之,故不再贅述。 The communication module 330 is configured to establish a low layer connection to the external server 20, wherein the lower layer connection includes a physical layer connection. The first data end of the communication module 330 is coupled to the first data end of the application processor circuit 320. The second data end of the communication module 330 is coupled to the first data end of the high-level communication processor 310. When the application processor circuit 320 is operating in the normal mode, the application processor circuit 320 is configured to establish a high level connection to the external server 20 via the communication module 330, wherein the high level connection includes a transport layer connection. When the application processor circuit 320 is operating in the power save mode, the high level communication processor 310 is configured to maintain the high level connection to the external server 20 via the communication module 330 and the network 10. Implementation details of the network 10, the external server 20, the computer device 300, the application processor circuit 320, and the communication module 330 shown in FIG. The descriptions of the network 10, the external server 20, the computer device 100, the application processor circuit 120, and the communication module 130 shown in FIG. 1 can be referred to, and thus will not be described again.

圖4是依照本發明實施例說明圖3所示高層通訊處理器310、應用處理器電路320以及通訊模組330所運行的網路通訊模型示意圖。以OSI model為說明範例,通訊模組330可以經由網路10對外部伺服器20建立實體層(即OSI model第一層)連接、資料鍊結層(即OSI model第二層)連接與網路層(即OSI model第三層)連接。當應用處理器電路320操作於正常模式時,應用處理器電路320可以通過通訊模組330與網路10對外部伺服器20建立網路層(即OSI model第三層)連接、傳輸層(即OSI model第四層)連接、會議層(即OSI model第五層)連接、表現層(即OSI model第六層)連接與應用層(即OSI model第七層)連接。圖4所示應用處理器電路320以及通訊模組330的實施細節可以參照圖2所示應用處理器電路120以及通訊模組130的相關說明而類推之,故不再贅述。因此,操作於正常模式之計算機裝置100可以對外部伺服器20建立連接。 FIG. 4 is a schematic diagram of a network communication model executed by the high-level communication processor 310, the application processor circuit 320, and the communication module 330 of FIG. 3 according to an embodiment of the invention. Taking the OSI model as an illustrative example, the communication module 330 can establish a physical layer (ie, OSI model first layer) connection and a data link layer (ie, OSI model second layer) connection and network to the external server 20 via the network 10. The layer (ie the third layer of the OSI model) is connected. When the application processor circuit 320 is operating in the normal mode, the application processor circuit 320 can establish a network layer (ie, OSI model layer 3) connection and transmission layer to the external server 20 through the communication module 330 and the network 10. OSI model layer 4) connection, conference layer (ie OSI model fifth layer) connection, presentation layer (ie OSI model sixth layer) connection and application layer (ie OSI model seventh layer) connection. The implementation details of the application processor circuit 320 and the communication module 330 shown in FIG. 4 can be referred to the related descriptions of the application processor circuit 120 and the communication module 130 shown in FIG. 2, and thus will not be described again. Therefore, the computer device 100 operating in the normal mode can establish a connection to the external server 20.

圖4所示高層通訊處理器310的實施細節可以參照圖4所示應用處理器電路320的相關說明而類推之,故不再贅述。依照不同的設計需求,高層通訊處理器310可能包括鍵盤控制器(keyboard controller,簡稱KBC)、基板管理控制器(baseboard management controller,簡稱BMC)、感測器集線器(sensor hub) 或是其他嵌入式控制器(embedded controller,簡稱EC)。計算機裝置300可能會進入省電模式(例如睡眠模式或休眠模式)而停止供電給應用處理器電路320(或禁能應用處理器電路320),以便減少功耗。於所述省電模式中,通訊模組330可以持續正常操作,以保持對外部伺服器20的低層連接。當應用處理器電路320操作於省電模式時,應用處理器電路320無法針對網路10之環境變化而維持對外部伺服器20的連接。當應用處理器電路320操作於省電模式時,高層通訊處理器310可以持續正常操作,以通過通訊模組330與網路10對外部伺服器20維持網路層(即OSI model第三層)連接、傳輸層(即OSI model第四層)連接、會議層(即OSI model第五層)連接、表現層(即OSI model第六層)連接與應用層(即OSI model第七層)連接。 The implementation details of the high-level communication processor 310 shown in FIG. 4 can be referred to the related description of the application processor circuit 320 shown in FIG. 4, and thus will not be described again. According to different design requirements, the high-level communication processor 310 may include a keyboard controller (KBC), a baseboard management controller (BMC), and a sensor hub. Or other embedded controllers (EC). Computer device 300 may enter a power saving mode (eg, sleep mode or sleep mode) and stop supplying power to application processor circuit 320 (or disable application processor circuit 320) to reduce power consumption. In the power saving mode, the communication module 330 can continue to operate normally to maintain a low level connection to the external server 20. When the application processor circuit 320 is operating in the power save mode, the application processor circuit 320 is unable to maintain a connection to the external server 20 for environmental changes in the network 10. When the application processor circuit 320 operates in the power saving mode, the high-level communication processor 310 can continue to operate normally to maintain the network layer (ie, the OSI model layer 3) of the external server 20 through the communication module 330 and the network 10. The connection, the transport layer (ie, the OSI model layer 4) connection, the conference layer (ie, the OSI model layer 5) connection, the presentation layer (ie, the OSI model layer 6) connection, and the application layer (ie, the OSI model layer 7) are connected.

計算機裝置300與外部伺服器20之間的網路通訊模型不應被限制於上述OSI model。在其他實施例中,基於不同的應用需求,計算機裝置300與外部伺服器20之間可能採用其他的網路通訊模型。舉例來說,若以TCP/IP協定族為說明範例,則通訊模組330可以經由網路10對外部伺服器20建立實體層連接、資料鍊結層連接與網路層連接,而應用處理器電路320(高層通訊處理器310)可以經由通訊模組330與網路10對外部伺服器20建立網路層連接、傳輸層連接與應用層連接。 The network communication model between the computer device 300 and the external server 20 should not be limited to the above OSI model. In other embodiments, other network communication models may be employed between the computer device 300 and the external server 20 based on different application requirements. For example, if the TCP/IP protocol family is used as an example, the communication module 330 can establish a physical layer connection, a data link layer connection, and a network layer connection to the external server 20 via the network 10, and the application processor. The circuit 320 (the high-level communication processor 310) can establish a network layer connection, a transport layer connection and an application layer connection to the external server 20 via the communication module 330 and the network 10.

因此,計算機裝置300可以針對網路10之環境變化而維持對外部伺服器20的連接。例如,當進入省電模式的計算機裝置 300漫遊於不同網路路由器的服務範圍時,由於高層通訊處理器310可以執行高層連接功能(例如租借新IP位址或其他連接維護)來維持對外部伺服器20的高層連接,因此應用處理器電路320不須被喚醒而保持於省電模式中。也就是說,計算機裝置300可以減少應用處理器電路320的喚醒機率,進而降低功耗。對於可攜式計算機而言,減少應用處理器電路320的喚醒機率可以節省電池的電量。 Thus, computer device 300 can maintain a connection to external server 20 for changes in the environment of network 10. For example, when entering a power saving mode computer device 300 roaming in the service range of different network routers, since the high-level communication processor 310 can perform high-level connection functions (such as renting a new IP address or other connection maintenance) to maintain a high-level connection to the external server 20, the application processor Circuit 320 remains in the power save mode without being woken up. That is, the computer device 300 can reduce the wake-up probability of the application processor circuit 320, thereby reducing power consumption. For a portable computer, reducing the wake-up probability of the application processor circuit 320 can save battery power.

在此說明上述計算機裝置300的保持通訊連接方法。此保持通訊連接方法包括:配置通訊模組330於計算機裝置300中,其中通訊模組330經組態以對外部伺服器20建立低層連接,而該低層連接包括實體層連接;配置應用處理器電路320於計算機裝置300中,其中應用處理器電路320的第一資料端耦接至通訊模組330的第一資料端;配置高層通訊處理器310於計算機裝置300中,其中高層通訊處理器310的第一資料端耦接至通訊模組330的第二資料端;當應用處理器電路320操作於正常模式時,由應用處理器電路320通過通訊模組330對外部伺服器20建立高層連接,其中該高層連接包括傳輸層連接;以及當應用處理器電路320操作於省電模式時,由高層通訊處理器310通過通訊模組330對外部伺服器20維持該高層連接。 Here, a method of maintaining communication connection of the above computer device 300 will be described. The method of maintaining communication connection includes: configuring a communication module 330 in the computer device 300, wherein the communication module 330 is configured to establish a low-level connection to the external server 20, and the low-level connection includes a physical layer connection; configuring the application processor circuit In the computer device 300, the first data end of the application processor circuit 320 is coupled to the first data end of the communication module 330; the high-level communication processor 310 is configured in the computer device 300, wherein the high-level communication processor 310 The first data end is coupled to the second data end of the communication module 330; when the application processor circuit 320 is operating in the normal mode, the application processor circuit 320 establishes a high-level connection to the external server 20 through the communication module 330, wherein The high level connection includes a transport layer connection; and when the application processor circuit 320 operates in the power save mode, the high level communication processor 310 maintains the high level connection to the external server 20 via the communication module 330.

在一些實施例中,當計算機裝置300操作在省電模式(例如睡眠模式或休眠模式)時,禁能或停止供電該應用處理器電路320。 In some embodiments, when the computer device 300 is operating in a power saving mode (eg, a sleep mode or a sleep mode), the application processor circuit 320 is disabled or powered down.

圖5是依照本發明一實施例說明圖3所示計算機裝置300的電路方塊示意圖。圖5所示計算機裝置300的實施細節可以參照圖3與圖4的相關說明而類推之,故不再贅述。於圖5所示實施例中,通訊模組330包括切換器510以及網路晶片520。依照不同設計需求,網路晶片520可能包括有線網路通訊電路(例如乙太網路晶片或是其他區域網路晶片)以及/或是無線基頻電路(例如WiFi網路晶片或是其他無線區域網路晶片)。網路晶片520可以經由網路10對外部伺服器20建立低層連接,例如建立實體層連接與資料鍊結層連接。無論應用處理器電路320操作於正常模式或省電模式,網路晶片520均可以正常操作。圖5所示網路晶片520的操作可以參照圖3與圖4中所示通訊模組330的相關說明而類推之,故不再贅述。 FIG. 5 is a block diagram showing the circuit of the computer device 300 of FIG. 3 according to an embodiment of the invention. The implementation details of the computer device 300 shown in FIG. 5 can be referred to the related descriptions of FIG. 3 and FIG. 4, and thus will not be described again. In the embodiment shown in FIG. 5, the communication module 330 includes a switch 510 and a network chip 520. Depending on the design requirements, the network chip 520 may include wired network communication circuits (such as Ethernet chips or other area network chips) and/or wireless baseband circuits (such as WiFi network chips or other wireless areas). Network chip). The network chip 520 can establish a low-level connection to the external server 20 via the network 10, such as establishing a physical layer connection and a data link layer connection. Whether the application processor circuit 320 is operating in a normal mode or a power saving mode, the network die 520 can operate normally. The operation of the network chip 520 shown in FIG. 5 can be referred to the related description of the communication module 330 shown in FIG. 3 and FIG. 4, and therefore will not be described again.

如圖5所示,切換器510的第一選擇端耦接至應用處理器電路320的第一資料端,切換器510的第二選擇端耦接至高層通訊處理器310的第一資料端,而切換器510的共同端耦接至網路晶片520的資料端。當應用處理器電路320操作於正常模式時,切換器510將應用處理器電路320的第一資料端耦接至網路晶片520的資料端。因此,當應用處理器電路320操作於正常模式時,應用處理器電路320可以通過切換器510、網路晶片520與網路10而對外部伺服器20建立高層連接(例如傳輸層連接)。當應用處理器電路320操作於省電模式時,切換器510將高層通訊處理器310的第一資料端耦接至網路晶片520的資料端。因此,當應 用處理器電路320操作於省電模式時,高層通訊處理器310可以通過切換器510、網路晶片520與網路10而對外部伺服器20維持高層連接(例如傳輸層連接)。 As shown in FIG. 5, the first selection end of the switch 510 is coupled to the first data end of the application processor circuit 320, and the second selection end of the switch 510 is coupled to the first data end of the high-level communication processor 310. The common end of the switch 510 is coupled to the data end of the network chip 520. When the application processor circuit 320 operates in the normal mode, the switch 510 couples the first data end of the application processor circuit 320 to the data end of the network chip 520. Therefore, when the application processor circuit 320 operates in the normal mode, the application processor circuit 320 can establish a high-level connection (eg, a transport layer connection) to the external server 20 through the switch 510, the network chip 520, and the network 10. When the application processor circuit 320 operates in the power saving mode, the switch 510 couples the first data end of the high layer communication processor 310 to the data end of the network chip 520. Therefore, when When the processor circuit 320 is operating in the power saving mode, the higher layer communications processor 310 can maintain a high level connection (e.g., transport layer connection) to the external server 20 via the switch 510, the network chip 520, and the network 10.

圖6是依照本發明另一實施例說明圖3所示計算機裝置300的電路方塊示意圖。圖6所示計算機裝置300的實施細節可以參照圖3與圖4的相關說明而類推之,故不再贅述。於圖6所示實施例中,通訊模組330包括網路晶片610,而高層通訊處理器310包括感測器集線器(sensor hub)620。依照不同設計需求,網路晶片610可能包括有線網路通訊電路(例如乙太網路晶片或是其他區域網路晶片)以及/或是無線基頻電路(例如WiFi網路晶片或是其他無線區域網路晶片)。網路晶片610可以經由網路10對外部伺服器20建立低層連接,例如建立實體層連接與資料鍊結層連接。無論應用處理器電路320操作於正常模式或省電模式,網路晶片610均可以正常操作。 FIG. 6 is a block diagram showing the circuit of the computer device 300 of FIG. 3 according to another embodiment of the present invention. The implementation details of the computer device 300 shown in FIG. 6 can be referred to the related descriptions of FIG. 3 and FIG. 4, and thus will not be described again. In the embodiment shown in FIG. 6, the communication module 330 includes a network chip 610, and the high-level communication processor 310 includes a sensor hub 620. Depending on the design requirements, network chip 610 may include wired network communication circuits (such as Ethernet chips or other area network chips) and/or wireless baseband circuits (such as WiFi network chips or other wireless areas). Network chip). The network chip 610 can establish a low-level connection to the external server 20 via the network 10, such as establishing a physical layer connection and a data link layer connection. Whether the application processor circuit 320 is operating in a normal mode or a power saving mode, the network chip 610 can operate normally.

於圖6所示實施例中,計算機裝置300還配置了一個或多個感測器630。依照不同的設計需求,感測器630可能包括加速度感測器、陀螺儀感測器、磁強計、近接感測器、壓力感測器及/或其他感測器。感測器集線器620的第一資料端耦接至通訊模組330的網路晶片610的第二資料端。感測器集線器620是個能獲取、整合並處理來自不同感測器630數據的微控制器。感測器集線器620處理感測器630的數據後,將處理結果經由網路晶片610提供給應用處理器電路320。因此,感測器集線器620能把這類任 務移離應用處理器電路320以節省電力並提升效能。依照不同設計需求,感測器集線器620可以是任何類型的感測器控制/處理電路,例如人機介面裝置(HID)感測器控制器等。 In the embodiment shown in FIG. 6, computer device 300 is also configured with one or more sensors 630. Depending on various design requirements, sensor 630 may include an acceleration sensor, a gyro sensor, a magnetometer, a proximity sensor, a pressure sensor, and/or other sensors. The first data end of the sensor hub 620 is coupled to the second data end of the network chip 610 of the communication module 330. Sensor hub 620 is a microcontroller that can acquire, integrate, and process data from different sensors 630. After the sensor hub 620 processes the data of the sensor 630, the processing result is provided to the application processor circuit 320 via the network wafer 610. Therefore, the sensor hub 620 can put such a task The application processor circuit 320 is removed to save power and improve performance. Depending on the design requirements, sensor hub 620 can be any type of sensor control/processing circuit, such as a human interface device (HID) sensor controller or the like.

無論應用處理器電路320操作於正常模式或省電模式,感測器集線器620均可以正常操作。當應用處理器電路320操作於正常模式時,感測器集線器620經組態以處理一個或多個感測器630的資料,並將處理結果經由網路晶片610提供給應用處理器電路320。當應用處理器電路320操作於正常模式時,應用處理器電路320可以通過通訊模組330的網路晶片610對外部伺服器20建立高層連接(例如傳輸層連接),因此感測器集線器620的高層連接功能可以被暫時禁能。當應用處理器電路320操作於省電模式時,感測器集線器620的高層連接功能可以被致能,因此感測器集線器620經組態以通過通訊模組330的網路晶片610對外部伺服器20維持高層連接(例如傳輸層連接)。圖6所示網路晶片610與感測器集線器620的操作可以分別參照圖3與圖4中所示通訊模組330與高層通訊處理器310的相關說明而類推之,故不再贅述。 Whether the application processor circuit 320 is operating in a normal mode or a power saving mode, the sensor hub 620 can operate normally. When the application processor circuit 320 is operating in the normal mode, the sensor hub 620 is configured to process the data of one or more of the sensors 630 and provide the processing results to the application processor circuit 320 via the network wafer 610. When the application processor circuit 320 operates in the normal mode, the application processor circuit 320 can establish a high-level connection (eg, a transport layer connection) to the external server 20 through the network chip 610 of the communication module 330, thus the sensor hub 620 The high-level connection function can be temporarily disabled. When the application processor circuit 320 is operating in the power saving mode, the high level connection function of the sensor hub 620 can be enabled, and thus the sensor hub 620 is configured to externally servo through the network chip 610 of the communication module 330. The device 20 maintains a high level connection (e.g., a transport layer connection). The operation of the network chip 610 and the sensor hub 620 shown in FIG. 6 can be referred to the related descriptions of the communication module 330 and the high-level communication processor 310 shown in FIG. 3 and FIG. 4, respectively, and thus will not be described again.

因此,圖6所示計算機裝置300可以針對網路10之環境變化而維持對外部伺服器20的連接。例如,當進入省電模式的計算機裝置300漫遊於不同網路路由器的服務範圍時,由於感測器集線器620可以執行高層連接功能(例如租借新IP位址或其他連接維護)來維持對外部伺服器20的高層連接,因此應用處理器電 路320不須被喚醒而保持於省電模式中。也就是說,圖6所示計算機裝置300可以減少應用處理器電路320的喚醒機率,進而降低功耗。 Thus, computer device 300 of FIG. 6 can maintain a connection to external server 20 for changes in the environment of network 10. For example, when the computer device 300 entering the power saving mode roams the service range of different network routers, the sensor hub 620 can perform high-level connection functions (such as renting a new IP address or other connection maintenance) to maintain the external servo. Device 20's high-level connection, so the application processor The way 320 does not have to be woken up and remains in the power saving mode. That is, the computer device 300 shown in FIG. 6 can reduce the wake-up probability of the application processor circuit 320, thereby reducing power consumption.

圖7是依照本發明又一實施例說明圖3所示計算機裝置300的電路方塊示意圖。圖7所示計算機裝置300的實施細節可以參照圖3與圖4的相關說明而類推之,故不再贅述。於圖7所示實施例中,通訊模組330包括網路晶片610,而高層通訊處理器310包括感測器集線器710。圖7所示網路晶片610的實施細節可以參照圖6所示網路晶片610的相關說明。 FIG. 7 is a block diagram showing the circuit of the computer device 300 of FIG. 3 according to still another embodiment of the present invention. The implementation details of the computer device 300 shown in FIG. 7 can be referred to the related descriptions of FIG. 3 and FIG. 4, and thus will not be described again. In the embodiment shown in FIG. 7, the communication module 330 includes a network chip 610, and the high level communication processor 310 includes a sensor hub 710. For details of the implementation of the network chip 610 shown in FIG. 7, reference may be made to the related description of the network chip 610 shown in FIG.

於圖7所示實施例中,計算機裝置300還配置了一個或多個感測器630。圖7所示感測器630的實施細節可以參照圖6所示感測器630的相關說明。感測器集線器710的第一資料端耦接至通訊模組330的網路晶片610的第二資料端,而感測器集線器710的第二資料端耦接至應用處理器電路320的第二資料端。感測器集線器710是個能獲取、整合並處理來自不同感測器630數據的微控制器。感測器集線器710處理感測器630的數據後,將有關於感測器630的處理結果711提供給應用處理器電路320。因此,感測器集線器710能把這類任務移離應用處理器電路320以節省電力並提升效能。依照不同設計需求,感測器集線器710可以是任何類型的感測器控制/處理電路,例如人機介面裝置(HID)感測器控制器等。 In the embodiment shown in FIG. 7, computer device 300 is also configured with one or more sensors 630. For details of the implementation of the sensor 630 shown in FIG. 7, reference may be made to the related description of the sensor 630 shown in FIG. The first data end of the sensor hub 710 is coupled to the second data end of the network chip 610 of the communication module 330, and the second data end of the sensor hub 710 is coupled to the second end of the application processor circuit 320. Data side. Sensor hub 710 is a microcontroller that can acquire, integrate, and process data from different sensors 630. After the sensor hub 710 processes the data of the sensor 630, the processing result 711 regarding the sensor 630 is provided to the application processor circuit 320. Thus, sensor hub 710 can move such tasks away from application processor circuit 320 to conserve power and improve performance. Depending on the design requirements, sensor hub 710 can be any type of sensor control/processing circuit, such as a human interface device (HID) sensor controller or the like.

無論應用處理器電路320操作於正常模式或省電模式, 感測器集線器710均可以正常操作。當應用處理器電路320操作於正常模式時,感測器集線器710可以處理一個或多個感測器630的資料,並將有關於感測器630的處理結果711提供給應用處理器電路320。當應用處理器電路320操作於正常模式時,應用處理器電路320可以通過通訊模組330的網路晶片610對外部伺服器20建立高層連接(例如傳輸層連接),因此感測器集線器710的高層連接功能可以被暫時禁能。當應用處理器電路320操作於省電模式時,感測器集線器710的高層連接功能可以被致能,因此感測器集線器710可以經由通訊模組330的網路晶片610對外部伺服器20維持高層連接(例如傳輸層連接)。圖7所示網路晶片610與感測器集線器710的操作可以分別參照圖3與圖4中所示通訊模組330與高層通訊處理器310的相關說明而類推之,故不再贅述。 Regardless of whether the application processor circuit 320 is operating in a normal mode or a power saving mode, The sensor hub 710 can operate normally. When the application processor circuit 320 is operating in the normal mode, the sensor hub 710 can process the data of one or more of the sensors 630 and provide processing results 711 regarding the sensor 630 to the application processor circuit 320. When the application processor circuit 320 operates in the normal mode, the application processor circuit 320 can establish a high-level connection (eg, a transport layer connection) to the external server 20 through the network chip 610 of the communication module 330, and thus the sensor hub 710 The high-level connection function can be temporarily disabled. When the application processor circuit 320 operates in the power saving mode, the high level connection function of the sensor hub 710 can be enabled, so the sensor hub 710 can maintain the external server 20 via the network chip 610 of the communication module 330. High-level connections (such as transport layer connections). The operation of the network chip 610 and the sensor hub 710 shown in FIG. 7 can be referred to the related descriptions of the communication module 330 and the high-level communication processor 310 shown in FIG. 3 and FIG. 4, respectively, and thus will not be described again.

因此,圖7所示計算機裝置300可以針對網路10之環境變化而維持對外部伺服器20的連接。例如,當進入省電模式的計算機裝置300漫遊於不同網路路由器的服務範圍時,由於感測器集線器710可以執行高層連接功能(例如租借新IP位址或其他連接維護)來維持對外部伺服器20的高層連接,因此應用處理器電路320不須被喚醒而保持於省電模式中。 Thus, computer device 300 of FIG. 7 can maintain a connection to external server 20 for changes in the environment of network 10. For example, when the computer device 300 entering the power saving mode roams the service range of different network routers, the sensor hub 710 can perform high-level connection functions (such as renting a new IP address or other connection maintenance) to maintain the external servo. The high level connection of the device 20 is such that the application processor circuit 320 is maintained in the power saving mode without being woken up.

綜上所述,上述諸實施例所述計算機裝置300可以不需喚醒應用處理器電路320,而由高層通訊處理器310執行高層連接功能(例如租借新IP位址或其他連接維護)來維持對外部伺服器 20的高層連接。也就是說,計算機裝置300可以減少應用處理器電路320的喚醒機率,進而降低功耗。 In summary, the computer device 300 in the above embodiments may not need to wake up the application processor circuit 320, but the high-level communication processor 310 performs high-level connection functions (such as renting a new IP address or other connection maintenance) to maintain the pair. External server 20 high-rise connections. That is, the computer device 300 can reduce the wake-up probability of the application processor circuit 320, thereby reducing power consumption.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧網路 10‧‧‧Network

20‧‧‧外部伺服器 20‧‧‧External Server

300‧‧‧計算機裝置 300‧‧‧Computer equipment

310‧‧‧高層通訊處理器 310‧‧‧High-level communication processor

320‧‧‧應用處理器電路 320‧‧‧Application Processor Circuit

330‧‧‧通訊模組 330‧‧‧Communication Module

Claims (12)

一種保持通訊連接的計算機裝置,包括:一通訊模組,該通訊模組經組態以對一外部伺服器建立一低層連接,其中該低層連接包括一實體層連接;一應用處理器電路,其一第一資料端耦接至該通訊模組的一第一資料端,當該應用處理器電路操作於一正常模式時,該應用處理器電路經組態以通過該通訊模組對該外部伺服器建立一高層連接,其中該高層連接包括一傳輸層連接;以及一高層通訊處理器,其一第一資料端耦接至該通訊模組的一第二資料端,當該應用處理器電路操作於一省電模式時,該高層通訊處理器經組態以通過該通訊模組對該外部伺服器維持該高層連接。 A computer device for maintaining a communication connection, comprising: a communication module configured to establish a low-level connection to an external server, wherein the low-level connection comprises a physical layer connection; and an application processor circuit a first data end is coupled to a first data end of the communication module, and when the application processor circuit operates in a normal mode, the application processor circuit is configured to use the communication module to externally serve Establishing a high-level connection, wherein the high-level connection includes a transport layer connection; and a high-level communication processor, a first data end coupled to a second data end of the communication module, when the application processor circuit operates In a power saving mode, the high level communications processor is configured to maintain the high level connection to the external server via the communications module. 如申請專利範圍第1項所述的計算機裝置,其中該實體層連接包括一開放式系統互聯通訊參考模型的第一層連接,而該傳輸層連接包括該開放式系統互聯通訊參考模型的第四層連接。 The computer device of claim 1, wherein the physical layer connection comprises a first layer connection of an open system interconnection communication reference model, and the transport layer connection comprises a fourth of the open system interconnection communication reference model Layer connection. 如申請專利範圍第1項所述的計算機裝置,其中於該省電模式時,該應用處理器電路被禁能或被停止供電。 The computer device of claim 1, wherein the application processor circuit is disabled or powered off during the power saving mode. 如申請專利範圍第1項所述的計算機裝置,其中於該省電模式包括一睡眠模式或一休眠模式。 The computer device of claim 1, wherein the power saving mode comprises a sleep mode or a sleep mode. 如申請專利範圍第1項所述的計算機裝置,其中該通訊模組包括:一網路晶片;以及 一切換器,其一第一選擇端耦接至該應用處理器電路的該第一資料端,該切換器的一第二選擇端耦接至該高層通訊處理器的該第一資料端,該切換器的一共同端耦接至該網路晶片的一資料端,其中當該應用處理器電路操作於該正常模式時,該切換器將該應用處理器電路的該第一資料端耦接至該網路晶片的該資料端,當該應用處理器電路操作於該省電模式時,該切換器將該高層通訊處理器的該第一資料端耦接至該網路晶片的該資料端。 The computer device of claim 1, wherein the communication module comprises: a network chip; a first selection end of the switch is coupled to the first data end of the application processor circuit, and a second selection end of the switch is coupled to the first data end of the high-level communication processor, A common end of the switch is coupled to a data end of the network chip, wherein when the application processor circuit operates in the normal mode, the switch couples the first data end of the application processor circuit to The data end of the network chip, when the application processor circuit operates in the power saving mode, the switch couples the first data end of the high-level communication processor to the data end of the network chip. 如申請專利範圍第5項所述的計算機裝置,其中該網路晶片包括一無線基頻電路或一有線網路通訊電路。 The computer device of claim 5, wherein the network chip comprises a wireless baseband circuit or a wired network communication circuit. 如申請專利範圍第1項所述的計算機裝置,其中該高層通訊處理器包括:一感測器集線器,其一第一資料端耦接至該通訊模組的該第二資料端,該感測器集線器的一第二資料端耦接至該應用處理器電路的一第二資料端,其中當該應用處理器電路操作於該正常模式時,該感測器集線器經組態以處理至少一感測器的資料並將處理結果提供給該應用處理器電路,以及當該應用處理器電路操作於該省電模式時,該感測器集線器經組態以通過該通訊模組對該外部伺服器維持該高層連接。 The computer device of claim 1, wherein the high-level communication processor comprises: a sensor hub, a first data end coupled to the second data end of the communication module, the sensing A second data end of the hub is coupled to a second data end of the application processor circuit, wherein the sensor hub is configured to process at least one sense when the application processor circuit operates in the normal mode Detecting the data of the detector and providing the processing result to the application processor circuit, and when the application processor circuit is operating in the power saving mode, the sensor hub is configured to pass the communication module to the external server Maintain this high-level connection. 一種計算機裝置的保持通訊連接方法,包括:配置一通訊模組於該計算機裝置中,其中該通訊模組經組態以對一外部伺服器建立一低層連接,而該低層連接包括一實體層連接; 配置一應用處理器電路於該計算機裝置中,其中該應用處理器電路的一第一資料端耦接至該通訊模組的一第一資料端;配置一高層通訊處理器於該計算機裝置中,其中該高層通訊處理器的一第一資料端耦接至該通訊模組的一第二資料端;當該應用處理器電路操作於一正常模式時,由該應用處理器電路通過該通訊模組對該外部伺服器建立一高層連接,其中該高層連接包括一傳輸層連接;以及當該應用處理器電路操作於一省電模式時,由該高層通訊處理器通過該通訊模組對該外部伺服器維持該高層連接。 A method of maintaining a communication connection of a computer device, comprising: configuring a communication module in the computer device, wherein the communication module is configured to establish a low-level connection to an external server, and the low-level connection comprises a physical layer connection ; Configuring an application processor circuit in the computer device, wherein a first data end of the application processor circuit is coupled to a first data end of the communication module; and a high-level communication processor is disposed in the computer device, The first data end of the high-level communication processor is coupled to a second data end of the communication module; when the application processor circuit operates in a normal mode, the application processor circuit passes the communication module Establishing a high-level connection to the external server, wherein the high-level connection includes a transport layer connection; and when the application processor circuit operates in a power-saving mode, the high-level communication processor transmits the external servo through the communication module The device maintains the high level connection. 如申請專利範圍第8項所述的保持通訊連接方法,其中該實體層連接包括一開放式系統互聯通訊參考模型的第一層連接,而該傳輸層連接包括該開放式系統互聯通訊參考模型的第四層連接。 The method for maintaining a communication connection according to claim 8, wherein the physical layer connection comprises a first layer connection of an open system interconnection communication reference model, and the transmission layer connection comprises the open system interconnection communication reference model The fourth layer is connected. 如申請專利範圍第8項所述的保持通訊連接方法,更包括:於該省電模式時,禁能或停止供電該應用處理器電路。 The method for maintaining a communication connection as described in claim 8 further includes: in the power saving mode, disabling or stopping the supply of the application processor circuit. 如申請專利範圍第8項所述的保持通訊連接方法,其中該通訊模組包括一網路晶片以及一切換器,當該應用處理器電路操作於該正常模式時,由該切換器將該應用處理器電路的該第一資料端耦接至該網路晶片的該資料端,以及當該應用處理器電路操作於該省電模式時,由該切換器將該高層通訊處理器的該第一資料端耦接至該網路晶片的該資料端。 The method for maintaining a communication connection according to claim 8, wherein the communication module comprises a network chip and a switch, and when the application processor circuit operates in the normal mode, the application is applied by the switch The first data end of the processor circuit is coupled to the data end of the network chip, and when the application processor circuit is operated in the power saving mode, the first data of the high level communication processor is controlled by the switch The data end is coupled to the data end of the network chip. 如申請專利範圍第8項所述的保持通訊連接方法,其中該高層通訊處理器包括一感測器集線器,其中當該應用處理器電路操作於該正常模式時,由該感測器集線器處理該計算機裝置的至少一感測器的資料並將處理結果提供給該應用處理器電路,以及當該應用處理器電路操作於該省電模式時,由該感測器集線器經通過該通訊模組對該外部伺服器維持該高層連接。 The method of maintaining a communication connection according to claim 8, wherein the high-level communication processor includes a sensor hub, wherein when the application processor circuit operates in the normal mode, the sensor hub processes the Information of at least one sensor of the computer device and providing the processing result to the application processor circuit, and when the application processor circuit operates in the power saving mode, the sensor hub passes through the communication module pair The external server maintains the high level connection.
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