TW201547076A - Structure of organic light emitting diode and manufacturing method thereof and organic metal mask - Google Patents

Abstract

A structure of organic light emitting diode is disclosed. The structure of organic light emitting diode comprises a substrate; a first conductive layer and a conductive pad disposed on the substrate respectively; an organic emitting layer disposed on the first conductive layer and having a plurality of sides having at least one recess area and protrusion area respectively; and a second conductive layer disposed on the organic emitting layer. The protrusion area of the organic emitting layer covers a portion of the conductive pad, and the second conductive layer covers the conductive pad through both the recess area of the organic emitting layer and the partial protrusion area of the organic emitting layer, whereby the second conductive layer electrically connects the conductive pad.

Description

Organic light-emitting diode structure and manufacturing method thereof and organic layer metal mask 【0001】

The present invention relates to an organic light-emitting diode structure, and more particularly to an organic light-emitting diode structure that does not cause electrode breakage and does not require tolerances in the process.

【0002】

In recent years, the development of flat panel display technology has been continuously updated. Among them, organic light emitting diode (OLED), also known as organic electroluminescence (OEL), is an advantage that is difficult to achieve with other flat panel display technologies. New generation technology, including power saving, ultra-thin thickness, light weight, self-illumination, no viewing angle limitation, fast response speed, high photoelectric efficiency, no backlight structure and color filter structure, high contrast, high luminance efficiency, high brightness Multi-color and color (RGB) components manufacturing capabilities, a wide range of operating temperatures, etc., is considered to be one of the most promising flat display technologies in the future.

[0003]

The organic light emitting diode can be distinguished as a positive organic light emitting diode (normal OLED) and a reverse organic light emitting diode (inverted OLED). Taking a positive organic light-emitting diode as an example, as shown in FIG. 1, the structure of the forward organic light-emitting diode is sequentially an anode electrode (or a reflective anode), a hole injection/transport layer, a light-emitting layer, and an electron. The transport layer, the electron injection layer, and the cathode electrode are on the wafer substrate. When a voltage is applied to the anode electrode and the cathode electrode to cause a voltage difference, electrons and holes are combined in the light-emitting layer to generate light L. In general, the hole injection/transport layer, the light-emitting layer, the electron transport layer, and the electron injection layer are collectively referred to as an organic light-emitting layer.

[0004]

Fig. 2 is a schematic view showing a conventional vapor deposition organic light-emitting layer. (a) in Fig. 2 is an organic light-emitting layer mask, and the cross-sectional line T1-T1' in the figure (a) of Fig. 2 is the organic one shown in the second figure (b). The cross-sectional structure of the luminescent layer mask. Generally, as shown in FIG. 2, when the organic light-emitting layer is vapor-deposited, the organic light-emitting layer having a hollow rectangular shape as shown in FIG. 2(a) is usually placed on the substrate, and organically The vapor deposition source vapor-deposits the organic light-emitting material on the substrate and the anode electrode (wherein the substrate may be, for example, an inter-metal dielectric layer). Then, the cathode material mask (Fig. 3(a)) and the cathode vapor deposition source shown in Fig. 3 are used to vapor-deposit a cathode material having a specific pattern on the prepared organic light-emitting layer. The preparation of the organic light emitting diode structure is completed.

[0005]

However, as shown in FIG. 4, in the above-described process of the conventional organic light emitting diode structure, since the thickness of the cathode electrode is generally thin, the height difference between the cathode liner and the intermetal dielectric layer may be caused. The cathode electrode is broken in the region B. Alternatively, as shown in Fig. 5, if the thickness of the organic light-emitting layer is increased (for example, about 1000 angstroms) and covered on a portion of the cathode liner, the cathode electrode does not have a problem of disconnection. However, in the preparation process of the organic light-emitting diode, the technician must additionally consider the tolerance of the organic light-emitting layer mask and the cathode electrode mask and the cathode gasket, and the size of the cathode liner, which undoubtedly increases the complexity of the process.

[0006]

In view of the above problems in the prior art, an object of the present invention is to provide an organic light emitting diode structure to solve the problem that the conventional organic light emitting diode structure may cause the cathode electrode to be broken, the organic light emitting layer mask and the cathode electrode to be covered. The problem of tolerances between the cover and the cathode gasket.

【0007】

According to the foregoing objective, the present invention provides an organic light emitting diode structure comprising: a substrate; a first conductive layer and a conductive pad respectively disposed on the substrate; and an organic light emitting layer disposed on the first conductive layer and having a plurality of sides The plurality of sides respectively have at least one recessed area and a protruding area; and the second conductive layer is disposed on the organic light emitting layer. Wherein, the protruding region of the organic light emitting layer covers a portion of the conductive pad, and the second conductive layer covers the conductive pad via the recessed region of the organic light emitting layer and a protruding portion of the portion of the organic light emitting layer, so that the second conductive layer is electrically Electrically connected conductive pads.

[0008]

Wherein, the first conductive layer is an anode electrode and the second conductive layer is a cathode electrode, or the first conductive layer is a cathode electrode and the second conductive layer is an anode electrode.

【0009】

The organic light-emitting layer includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer which are sequentially arranged.

[0010]

Wherein, the substrate is an inter-metal dielectric layer.

[0011]

The invention further provides an organic layer metal mask for vapor-depositing the organic light-emitting layer in the organic light-emitting diode structure as described above.

[0012]

In addition, the present invention also provides a method for fabricating an organic light emitting diode structure, comprising: providing a substrate; respectively, disposing the first conductive layer and the conductive pad on the substrate; and disposing the organic light emitting layer on the first conductive layer, wherein the organic The light emitting layer has a plurality of sides, and the plurality of sides respectively have at least one recessed area and a protruding area; and the second conductive layer is disposed on the organic light emitting layer. Wherein, the protruding region of the organic light emitting layer covers a portion of the conductive pad, and the second conductive layer covers the conductive pad via the recessed region of the organic light emitting layer and a protruding portion of the portion of the organic light emitting layer, so that the second conductive layer is electrically Electrically connected conductive pads.

[0013]

Wherein, the first conductive layer is an anode electrode and the second conductive layer is a cathode electrode, or the first conductive layer is a cathode electrode and the second conductive layer is an anode electrode.

[0014]

The organic light-emitting layer includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer which are sequentially arranged.

[0015]

According to the above, the organic light emitting diode structure, the preparation method thereof and the organic layer metal mask according to the present invention may have one or more of the following advantages:

[0016]

(1) The organic light-emitting diode structure of the present invention and the manufacturing method thereof can avoid the problem that the organic light-emitting diode structure may cause the cathode electrode to be broken, and it is not necessary to consider the organic layer metal mask and the cathode electrode mask. The tolerance to the cathode liner and the size of the cathode liner, in turn, can reduce the size of the organic light-emitting diode structure to achieve narrow side width.

[0017]

(2) The organic light-emitting diode structure of the present invention and the method of manufacturing the same, since the organic light-emitting diode structure has a specific pattern, it is not necessary to consider the tolerance problem between the mask and the substrate in the process.

[0018]

(3) The organic layer metal mask of the present invention can be used to prepare an organic light-emitting layer in the above organic light-emitting diode structure.

[0037]

10‧‧‧Substrate

20‧‧‧First conductive layer

30‧‧‧Electrical gasket

40‧‧‧Organic light-emitting layer

50‧‧‧Second conductive layer

L‧‧‧Light

T1-T1', T2-T2', T3-T3'‧‧‧ hatching

B‧‧‧Area

M‧‧‧Organic metal mask

41, 42, 43, 44‧‧‧ side of the organic light-emitting layer

46‧‧‧ recessed area

48‧‧‧ protruding area

AA‧‧‧ action area

S10, S20, S30, S40‧‧‧ steps

[0019]

Figure 1 is a schematic diagram of a conventional light-emitting diode structure.

[0020]

Fig. 2 is a schematic view showing a conventional vapor deposition organic light-emitting layer.

[0021]

Figure 3 is a schematic view of a conventional vapor-deposited cathode electrode.

[0022]

Figure 4 is a schematic cross-sectional view of a conventional light-emitting diode structure.

[0023]

Figure 5 is another schematic cross-sectional view of a conventional light emitting diode structure.

[0024]

Figure 6 is a schematic view of the organic layer metal mask of the present invention.

[0025]

Fig. 7 is a schematic view showing an organic light-emitting layer obtained by masking the organic layer of the present invention.

[0026]

Figure 8 is a top view of the structure of the organic light-emitting diode of the present invention.

[0027]

Fig. 9 is a schematic cross-sectional view showing the structure of the organic light-emitting diode obtained along the section line T3-T3' of Fig. 8.

[0028]

Fig. 10 is a flow chart showing the manufacturing method of the organic light emitting diode structure of the present invention.

[0029]

Please refer to FIG. 6 to FIG. 9 together. FIG. 6 is a schematic view of the organic layer metal mask M of the present invention, and FIG. 7 is an organic light-emitting layer prepared by using the organic layer metal mask M of the present invention. 40 is a schematic view of the organic light-emitting diode structure of the present invention, and FIG. 9 is a schematic cross-sectional view of the organic light-emitting diode structure obtained along the cross-sectional line T3-T3' of FIG.

[0030]

As shown in FIGS. 8 and 9, the organic light emitting diode structure of the present invention comprises a substrate 10, a first conductive layer 20, a conductive spacer 30, an organic light emitting layer 40, and a second conductive layer 50. The first conductive layer 20 and the conductive pad 30 are respectively disposed on the substrate 10. The organic light emitting layer 40 is disposed on the first conductive layer 20 and has a plurality of sides 41, 42, 43, and 44 (see FIG. 7). Further, as shown in FIG. 7, the plurality of sides 41, 42, 43, and 44 respectively have at least one recessed portion 46 and a raised portion 48. The second conductive layer 50 is disposed on the organic light emitting layer 40. As shown in FIG. 7 to FIG. 9, in the organic light emitting diode structure of the present invention, the protruding region 48 of the organic light emitting layer 40 covers a portion of the conductive pad 30, and the second conductive layer 50 passes through the organic light emitting layer 40. The recessed region 46 and the protruding portion 48 of the portion of the organic light-emitting layer 40 cover the conductive pad 30 such that the second conductive layer 50 is electrically connected to the conductive pad 30.

[0031]

In the organic light emitting diode structure of the present invention, the first conductive layer 20 may be, for example, an anode electrode, and the second conductive layer 50 may be, for example, a cathode electrode. Alternatively, the first conductive layer 20 can be, for example, a cathode electrode and the second conductive layer 50 can be, for example, an anode electrode. The substrate 10 can be, for example, an inter-metal dielectric layer (IMD). The organic light-emitting layer 40 includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer which are sequentially arranged (refer to the organic light-emitting layer in FIG. 1). The layers included in the above organic light-emitting layer 40 are well known to those of ordinary skill in the art to which the present invention pertains, and thus will not be described herein.

[0032]

The organic light-emitting layer 40 in the above organic light-emitting diode structure of the present invention can be obtained, for example, by the organic layer metal mask M shown in Fig. 6. In detail, the user can set the organic layer metal mask M having a specific pattern as shown in FIG. 6 on the substrate 10, and has conventional knowledge in the technical field by evaporation, deposition or other fields to which the present invention pertains. The organic light-emitting layer material is disposed on the substrate 10 and the first conductive layer 20 by a method known, and the organic light-emitting layer 40 is formed to have a pattern as shown in FIG.

[0033]

Continuingly, as shown in FIG. 7, in a preferred embodiment of the organic light emitting diode structure of the present invention, the recessed region 46 of one of the plurality of sides 41, 42, 43 and 44 of the organic light emitting layer 40 For example, the convex regions 48 of the other of the plurality of sides 41, 42, 43 and 44 of the organic light-emitting layer 40 are opposed to each other. In addition, the positional relationship between the recessed area 46 and the protruding area 48 may also be changed according to actual needs, and is not limited to the aforementioned ones corresponding to each other. Therefore, when the organic layer metal mask M and the substrate 10 are misaligned, the recessed regions 46 and the protruding regions 48 of the organic light-emitting layer 4 opposite to each other can compensate for the misalignment problem of the recessed regions 46 and the protruding regions 48. The second conductive layer 50 is not broken, so that the tolerance problem between the organic layer metal mask M and the cathode electrode mask (i.e., the mask for preparing the second conductive layer 50) and the substrate 10 is not considered.

[0034]

Further, as shown in FIG. 10, the present invention also proposes a method of manufacturing an organic light emitting diode structure, comprising the following steps S10, S20, S30, and S40. In step S10, a substrate is provided; in step S20, a first conductive layer and a conductive pad are respectively disposed on the substrate; in step S30, an organic light-emitting layer is disposed on the first conductive layer; and in step S40, A second conductive layer is disposed on the organic light emitting layer. Moreover, as described in the organic light-emitting layer in the foregoing organic light-emitting diode structure, please refer to FIG. 7 together, the organic light-emitting layer 40 has a plurality of sides 41, 42, 43 and 44, and the plurality of sides 41, 42, 43 and 44 has at least one recessed area 46 and a raised area 48, respectively. In addition, as shown in FIG. 9, the protruding portion 48 of the organic light emitting layer 40 covers a portion of the conductive pad 30, and the second conductive layer 50 is convex through the recessed region 46 of the organic light emitting layer 40 and a portion of the organic light emitting layer 40. The conductive pad 30 is covered by the exit region 48 such that the second conductive layer 50 is electrically connected to the conductive pad 30. Since the manufacturing method of the organic light emitting diode structure proposed by the present invention is used to prepare the organic light emitting diode structure shown in the above FIGS. 7 to 9, the details are not described herein again.

[0035]

In summary, the present invention can complete the organic light-emitting diode structure claimed in the present invention by preparing the organic light-emitting layer 40 by a specific pattern of the organic layer metal mask M. Moreover, the organic light emitting diode structure of the present invention can avoid the tolerance problem between the mask and the substrate and the size of the cathode liner in the process, thereby reducing the size of the organic light emitting diode structure and achieving a narrow side width. The purpose, and also does not produce the problem that the conventional organic light-emitting diode structure may cause the cathode electrode to be broken.

[0036]

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

Domestic registration information [please note according to the registration authority, date, number order]

no

Foreign deposit information [please note according to the country, organization, date, number order]

no

no

10‧‧‧Substrate

20‧‧‧First conductive layer

30‧‧‧Electrical gasket

40‧‧‧Organic light-emitting layer

50‧‧‧Second conductive layer

Claims (10)

[Item 1] An organic light emitting diode structure comprising:
a substrate;
a first conductive layer and a conductive pad are respectively disposed on the substrate;
An organic light-emitting layer is disposed on the first conductive layer and has a plurality of sides, wherein the plurality of sides respectively have at least one recessed region and a protruding region; and a second conductive layer disposed on the organic light-emitting layer Wherein the protruding region of the organic light-emitting layer covers a portion of the conductive pad, and the second conductive layer covers the conductive liner via the recessed region of the organic light-emitting layer and the protruding portion of the portion of the organic light-emitting layer a pad such that the second conductive layer is electrically connected to the conductive pad. [Item 2] The organic light emitting diode structure of claim 1, wherein the first conductive layer is an anode electrode and the second conductive layer is a cathode electrode, or the first conductive layer is a cathode electrode and the first conductive layer is a cathode electrode The second conductive layer is an anode electrode. [Item 3] The organic light emitting diode structure according to claim 1, wherein the organic light emitting layer comprises a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron. Inject the layer. [Item 4] The organic light emitting diode structure according to claim 1, wherein the substrate is an intermetal dielectric layer. [Item 5] An organic layer metal mask for vapor-depositing the organic light-emitting layer in the organic light-emitting diode structure according to claim 1 of the patent application. [Item 6] A method for manufacturing an organic light emitting diode structure, comprising:
Providing a substrate;
A first conductive layer and a conductive pad are respectively disposed on the substrate;
An organic light emitting layer is disposed on the first conductive layer, wherein the organic light emitting layer has a plurality of sides, and the plurality of sides respectively have at least one recessed region and a protruding region; and a second conductive layer is disposed on the organic light emitting layer on, Wherein the protruding region of the organic light-emitting layer covers a portion of the conductive pad, and the second conductive layer covers the conductive liner via the recessed region of the organic light-emitting layer and the protruding portion of the portion of the organic light-emitting layer a pad such that the second conductive layer is electrically connected to the conductive pad. [Item 7] The method for manufacturing an organic light emitting diode structure according to claim 6, wherein the first conductive layer is an anode electrode and the second conductive layer is a cathode electrode, or the first conductive layer is a cathode The electrode and the second conductive layer is an anode electrode. [Item 8] The method for fabricating an organic light emitting diode structure according to claim 6, wherein the organic light emitting layer comprises a hole injection layer, a hole transport layer, a light emitting layer and an electron transport layer. And an electron injection layer.