TW201544770A - Air guiding duct - Google Patents

Abstract

An air guiding duct can be fixed on a cooling module. The air guiding duct and the cooling module are all received in a chassis. The air guiding duct includes a substrate and a buckling plate which is connected on the substrate. The substrate includes a stretch portion which can be elastically deformed. The buckling plate can buckle on the cooling module by the stretch portion. The substrate can rely on the chassis to prevent the hot airflow from reflowing.

Description

Wind shield

The present invention relates to an air hood, and more particularly to an air hood for an electronic device.

In the current heat dissipation mechanism inside the computer main body, an air-cooled heat sink is generally used to dissipate heat from electronic components such as a CPU. When the fan is working, the fan will generate airflow and blow cold air to the radiator. When the cold air takes away the heat of the radiator, its own temperature will also rise. Since the fan inlet is in a negative pressure state, the hot air is not discharged. In time, it is re-inhaled into the tuyere, thus forming a hot air return and being heated by the fan loop, thereby affecting the heat dissipation effect of the radiator.

In view of the above, it is necessary to provide an air hood that is heated by loopback to avoid hot air flowing back.

An air hood is fixedly mounted on a heat dissipation module, and the air hood and the heat dissipation module are respectively received in a casing, the air hood includes a substrate and a card vertically connected to the substrate The gusset plate includes an elastically deformable expansion and contraction portion. The zipper plate is elastically deformed by the expansion and contraction portion to be snapped onto the heat dissipation module, and the substrate abuts against the casing to prevent backflow of the hot air.

Preferably, a casing of the electronic component and the graphics card is disposed in the casing, and the heat dissipation module and the air guiding cover are both fixed on the motherboard.

Preferably, the substrate comprises two abutting plates, and the casing comprises four side plates, and the two abutting plates respectively abut against the graphics card and one of the side plates thereof.

Preferably, the substrate further includes a first connecting plate connecting the two resisting plates, and both ends of the first connecting plate are provided with fixing plates for fixing the heat dissipation module.

Preferably, the substrate further includes a second connecting plate connecting the two abutting plates, the second connecting plate is parallel to the first connecting plate, and the telescopic portion is formed on the second connecting plate.

Preferably, the two abutting plates, the first connecting plate and the second connecting plate together define a venting hole for allowing airflow.

Preferably, the shackle includes a top plate and two limiting plates connected to the two ends of the top plate. The two limiting plates form a gap between the two detaching plates. The air hood is mounted to the hood by the gap. On the cooling module.

Preferably, the limiting plate is provided with a first guiding plate, a second guiding plate and a third guiding plate for fixing the heat dissipation module, and the connection between the first guiding plate and the second guiding plate The direction of extension of the guiding limit plate is not on the same straight line.

Preferably, the heat dissipation module includes a fan bracket, and the fan bracket includes two frames, and the air duct is fixed to the two frames.

Preferably, the air hood comprises two mutually parallel limiting plates, and the frame comprises four equal length links, the distance between the two limiting plates being smaller than the connecting rod length.

In the above air hood, the second connecting plate of the substrate is provided with an elastically deformable expansion and contraction portion, and the zipper plate is tightly buckled by the elastic stretching of the elasticized portion. The fan bracket of the heat dissipation module facilitates the installation and disassembly of the air hood. At the same time, the abutting plates on both sides of the air hood respectively abut against the side plate and the graphics card to effectively prevent the heating phenomenon of the loop caused by the return of the hot air flow, thereby ensuring the heat dissipation effect of the heat dissipation module.

1 is an exploded perspective view of one of the air duct and a heat dissipation module of the present invention.

Figure 2 is a perspective view of one of the air hoods of Figure 1.

3 is an assembled, isometric view of the air hood and the heat dissipation module of FIG. 1.

4 is a perspective assembled view of another view of the air hood and the heat dissipation module of FIG. 1.

FIG. 5 is an assembled, isometric view of the air hood, the heat dissipation module, and a casing.

Referring to FIG. 1 , in a preferred embodiment of the present invention, an air hood 100 is used to guide airflow to a heat dissipation module 30 , and the heat dissipation module 30 is used for mounting a housing 50 (see FIG. 5 ). The internal electronic components (not shown) dissipate heat.

Referring to FIG. 1 and FIG. 2 , the air hood 100 includes a substrate 10 and a Snap Plate 20 vertically connected to the substrate 10 . The substrate 10 includes a first connecting plate 11 , a second connecting plate 12 , and two abutting plates 15 . The first connecting plate 11 and the second connecting plate 12 are parallel to each other. A connecting plate 11 and the second connecting plate 12 are connected to each other. The first connecting plate 11 , the second connecting plate 12 and the two abutting plates 15 collectively define a venting hole 16 for allowing air to enter the heat dissipation module 30 . . A fixing plate 111 is protruded from the two sides of the first connecting plate 11 toward the venting hole 16 , and the second connecting plate 12 includes an elastically deformable elasticizing portion 121 .

The shackle 20 is disposed around the venting hole 16 . The shackle 20 includes a top plate 21 and two limiting plates 22 connected to the two ends of the top plate 21 . The top plate 21 is vertically connected to the first connecting plate 11 . The two limiting plates 22 are vertically connected to the two abutting plates 15 respectively. A gap 23 is formed between the two limiting plates 22 away from the top plate 21 , and the air guiding cover 100 is mounted on the heat dissipation module 30 by the gap. A first guiding plate 221 is disposed at an end of the limiting plate 22 away from the top plate 21 . The second limiting plate 222 is disposed adjacent to the top plate 21 . The limiting plate 22 is disposed on the first guiding plate 221 . A third guiding plate 223 is further disposed between the second guiding plate 222. The first guiding plate 221 and the second guiding plate 222 are respectively disposed on a side of the limiting plate 22 away from the substrate 10, and the third guiding plate 223 is formed on the side of the limiting plate 22 near the substrate 10 The line connecting the first guiding plate 221 and the second guiding plate 222 is not in the same line as the extending direction of the third guiding plate 223. The first guiding plate 221, the second guiding plate 222 and the third guiding plate 223 on the two limiting plates 22 are both facing the venting opening 16. The two limiting plates 22 are further provided with an operating portion 225 on one side away from each other.

As shown in FIG. 1 , the heat dissipation module 30 includes a heat sink 31 , a fan 32 ( see FIG . 4 ) , and a fan bracket 33 for receiving the fan 32 . The heat sink 31 includes four mounting portions 311 through which a fastener 40 can pass to fix the heat sink 31 to a motherboard 55 (see FIG. 5). The fan 32 is fixed to the fan bracket 33. The airflow enters the fan 32 through an air inlet of the fan 32, and then passes through the heat sink 31 to take away heat, and finally is discharged from an air outlet of the fan 32. The fan frame 33 includes two frames. The two frames are respectively a first frame 331 and a second frame 332. The first frame 331 and the second frame 332 each include four links 333 of equal length. The first frame The 331 can be fixed to the heat sink 31. The distance between the two limiting plates 22 of the locking plate 20 is smaller than the length of the connecting rod 333. The air guiding cover 100 can be fixed to the second frame 332.

Referring to FIG. 5, the casing 50 includes a bottom plate 51 and four side plates 52 connected in sequence. The main board 55 is mounted on the bottom plate 51. The main board 55 is further provided with a plurality of graphics cards 551. An air outlet 521 is disposed on the side panel 52 corresponding to the air outlet of the heat dissipation module 30, and the airflow can discharge the casing 50 from the air outlet 521.

Referring to FIG. 3 to FIG. 5, the fan 32 is mounted on the fan bracket 33, and the first frame 331 of the fan bracket 33 is fixed to the heat sink 31. At this time, the heat dissipation module 30 is The assembly is complete. The heat dissipation module 30 is aligned with the electronic components on the motherboard 55, and the four mounting portions 311 of the heat dissipation module 30 are placed on the motherboard 55, and the mounting portion 311 is fixed to the motherboard The heat sink module 30 is fixed to the motherboard 55 on the motherboard 55. The notch 23 of the shackle plate 20 is aligned with the second frame 332, and the air hood 100 is pressed toward the main board 55. The elastic portion 121 of the second connecting plate 12 is elastically deformed to facilitate the second frame 332. The gap is inserted between the two limiting plates 22, and the air hood 100 is continuously pressed until the second frame 332 abuts against the top plate 21. The first guiding plate 221 and the second guiding plate 222 are fixed. On the side of the second frame 332, the third guiding plate 223 and the fixing plate 111 are fixed on the other side of the second frame 332. The two limiting plates 22 are blocked by the expansion and contraction portion 121 of the second connecting plate 12. The elastic stretch produces a restoring force against the second frame 332. At this time, the air hood 100 is fixed to the heat dissipation module 30. When the air hood 100 needs to be detached, the air damper 100 can be removed from the heat dissipation module by simply pulling the operation portion 225 of the two limiting plates 22 and pulling away from the motherboard 55. Remove it on 30.

Referring to FIG. 5, when the fan 32 is in operation, airflow passes through the venting holes 16 of the air hood 100 and enters the heat dissipation module 30 to dissipate heat from the electronic components. The plates 15 are respectively abutted against the one side plate 52 and the display card 551, so as to block the flow of the hot air from being sucked into the heat dissipation module 30 from the air inlet, and the hot air flow is directly discharged from the air outlet 521.

In the air hood 100, the second connecting plate 12 of the substrate 10 is provided with an elastically deformable elastic portion 121. The zipper plate 20 is tightly buckled by the restoring force generated by the elastic stretching of the elastic portion 121. The fan bracket 33 of the heat dissipation module 30 can be used for mounting and dismounting the air duct 100 without using tools. At the same time, the abutting plates 15 on both sides of the air hood 100 respectively abut against the side plates 52 and the graphics card 551 to effectively avoid the loop heating phenomenon caused by the return of the hot air flow, thereby ensuring the heat dissipation of the heat dissipation module 30. effect.

In summary, the present invention is in accordance with the conditions of the invention patent application, and the patent application is filed according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the following claims.

10‧‧‧Substrate

11‧‧‧First connection board

111‧‧‧Fixed plate

12‧‧‧Second connection plate

121‧‧‧Flexing Department

15‧‧‧stop board

16‧‧‧ventilation holes

20‧‧‧Snap plate

21‧‧‧ top board

22‧‧‧ Limit Board

221‧‧‧First Guide Board

222‧‧‧Second guide board

223‧‧‧ third guide board

225‧‧‧Operation Department

23‧‧‧ gap

30‧‧‧ Thermal Module

31‧‧‧ radiator

311‧‧‧Installation Department

32‧‧‧fan

33‧‧‧Fan bracket

331‧‧‧ first frame

332‧‧‧ second frame

333‧‧‧ linkage

40‧‧‧fasteners

50‧‧‧Chassis

51‧‧‧floor

52‧‧‧ side panels

521‧‧‧ exhaust vents

55‧‧‧ motherboard

551‧‧‧ graphics card

100‧‧‧wind hood

no

30‧‧‧ Thermal Module

40‧‧‧fasteners

50‧‧‧Chassis

51‧‧‧floor

52‧‧‧ side panels

521‧‧‧ exhaust vents

55‧‧‧ motherboard

551‧‧‧ graphics card

100‧‧‧wind hood

Claims (10)

An air hood is fixedly mounted on a heat dissipation module, and the air hood and the heat dissipation module are respectively received in a casing, the air hood includes a substrate and a card vertically connected to the substrate The gusset plate includes an elastically deformable expansion and contraction portion. The zipper plate is elastically deformed by the expansion and contraction portion to be snapped onto the heat dissipation module, and the substrate abuts against the casing to prevent backflow of the hot air. The air hood of claim 1, wherein the casing is provided with a motherboard on which the electronic component and the graphics card are mounted, and the heat dissipation module and the air hood are both fixed on the motherboard. The air hood of claim 2, wherein the substrate comprises two abutting plates, the casing comprising four side plates, the two abutting plates respectively abutting the graphics card and one of the side plates. The air hood of claim 3, wherein the substrate further comprises a first connecting plate connecting the two abutting plates, and the fixing plate for fixing the heat dissipating module is disposed at both ends of the first connecting plate . The air hood of claim 4, wherein the substrate further comprises a second connecting plate connecting the two abutting plates, the second connecting plate is parallel to the first connecting plate, and the telescopic portion is opened at the Second connection board. The air hood of claim 5, wherein the two abutting plates, the first connecting plate and the second connecting plate together define a venting hole for allowing airflow. The air hood of claim 1, wherein the shackle includes a top plate and two limiting plates connected to the two ends of the top plate, and the two limiting plates form a gap between the top plates and the top plate. The air hood is mounted to the heat dissipation module by the gap. The air deflector of claim 7, wherein the limiting plate is provided with a first guiding plate, a second guiding plate and a third guiding plate for fixing the heat dissipation module. The connecting line between a guiding plate and the second guiding plate is not in the same straight line as the extending direction of the third guiding plate. The air hood of claim 1, wherein the heat dissipation module comprises a fan bracket, the fan bracket includes two frames, and the air hood is fixed to the two frames. The air hood of claim 9, wherein the air hood comprises two mutually parallel limiting plates, the frame comprising four equal length links, the distance between the two limiting plates being smaller than the connecting rod length.