TW201544760A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
TW201544760A
TW201544760A TW104127698A TW104127698A TW201544760A TW 201544760 A TW201544760 A TW 201544760A TW 104127698 A TW104127698 A TW 104127698A TW 104127698 A TW104127698 A TW 104127698A TW 201544760 A TW201544760 A TW 201544760A
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Taiwan
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light
illuminating
heat
wavelength conversion
pedestal
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TW104127698A
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Chinese (zh)
Inventor
Cheng-Yen Chen
Yi-Fan Li
Han-Min Wu
Kuan-Chieh Huang
Tung-Lin Chuang
sheng-yuan Sun
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Genesis Photonics Inc
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Priority to TW104127698A priority Critical patent/TW201544760A/en
Publication of TW201544760A publication Critical patent/TW201544760A/en

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Abstract

A light emitting device including a base, at least one light emitting element, a wavelength transferring cover and a heat conductive structure is provided. The light emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light emitting element. The heat conductive structure is disposed on the base and directly connects to the wavelength transferring cover.

Description

發光裝置 Illuminating device

本發明是有關於一種發光裝置,且特別是有關於一種具有較佳散熱效果的發光裝置。 The present invention relates to a light-emitting device, and more particularly to a light-emitting device having a preferred heat-dissipating effect.

隨著光電技術的演進,發光元件的發光機制也從熱致發光(thermoluminescence)演進為電致發光(electroluminescence,EL)。電致發光機制的發光元件為了達到不同的發光顏色,採用螢光粉體來轉換發光元件所發出的光的波長為其中一種常用的方法。 With the evolution of photovoltaic technology, the light-emitting mechanism of light-emitting elements has also evolved from thermoluminescence to electroluminescence (EL). Light-emitting elements of electroluminescence mechanism In order to achieve different light-emitting colors, it is a common method to use a phosphor powder to convert the wavelength of light emitted by the light-emitting elements.

以發光二極體燈具而言,為了達到不同發光顏色,通常會將波長轉換罩配置於發光二極體光源模組的上方。當發光二極體光源模組所發出的光照射至波長轉換罩時,則開始進行白光轉換。然而,發光二極體光源模組所產生的熱能以及白光轉換過程中所產生的熱能皆會累積於波長轉換罩上,進而造成波長轉換罩的溫度上升。由於波長轉換罩是由螢光粉體與高分子材料或玻璃所組成,而螢光粉體遇高溫會產生熱消光現象(Thermal Quenching Of Luminescence),因此將造成波長轉換罩的螢光轉換效能降低, 進而產生色偏現象。 In the case of a light-emitting diode lamp, in order to achieve different light-emitting colors, the wavelength conversion cover is usually disposed above the light-emitting diode light source module. When the light emitted by the light-emitting diode light source module is irradiated to the wavelength conversion cover, white light conversion is started. However, the thermal energy generated by the LED light source module and the thermal energy generated during the white light conversion process are accumulated on the wavelength conversion cover, thereby causing the temperature of the wavelength conversion cover to rise. Since the wavelength conversion cover is composed of a phosphor powder and a polymer material or glass, and the phosphor powder generates a thermal quenching phenomenon (Thermal Quenching Of Luminescence), the conversion efficiency of the wavelength conversion cover is lowered. , In turn, a color shift phenomenon occurs.

本發明提供一種發光裝置,其導熱結構直接接觸波長轉換罩,以將發光元件所產生的熱快速帶走,可有效降低波長轉換罩的熱消光現象。 The invention provides a light-emitting device, wherein the heat-conducting structure directly contacts the wavelength conversion cover to quickly remove the heat generated by the light-emitting element, thereby effectively reducing the thermal extinction phenomenon of the wavelength conversion cover.

本發明的發光裝置包括基座、波長轉換結構以及至少一發光元件。導熱結構包括多個容置空間,波長轉換材料容置於這些容置空間中。發光元件配置於基座上,其中基座連接導熱結構,且波長轉換結構覆蓋發光元件。 The light emitting device of the present invention includes a susceptor, a wavelength converting structure, and at least one light emitting element. The heat conducting structure includes a plurality of accommodating spaces, and the wavelength converting materials are accommodated in the accommodating spaces. The light emitting element is disposed on the base, wherein the base is connected to the heat conducting structure, and the wavelength converting structure covers the light emitting element.

本發明的發光裝置包括基座、網狀導熱支架以及多個波長轉換塊。基座包括至少一發光元件安裝其上,網狀導熱支架連接基座。這些波長轉換塊嵌入網狀導熱支架的多個網眼中,且這些波長轉換塊及網狀導熱支架覆蓋發光元件。 The light emitting device of the present invention includes a susceptor, a mesh heat conductive support, and a plurality of wavelength conversion blocks. The base includes at least one light emitting component mounted thereon, and the mesh heat conducting bracket is coupled to the base. The wavelength conversion blocks are embedded in a plurality of meshes of the mesh heat-conducting bracket, and the wavelength conversion blocks and the mesh heat-conducting bracket cover the light-emitting elements.

本發明的發光裝置包括基座、波長轉換層以及透光導熱體。基座包括至少一發光元件安裝其上,且透光導熱體連接基座。透光導熱體被覆並攜帶波長轉換層,且波長轉換層及透光導熱體覆蓋發光元件。 The light-emitting device of the present invention includes a susceptor, a wavelength conversion layer, and a light-transmitting heat conductor. The pedestal includes at least one illuminating element mounted thereon, and the light transmissive heat conductor is coupled to the pedestal. The light-transmitting heat conductor covers and carries the wavelength conversion layer, and the wavelength conversion layer and the light-transmitting heat conductor cover the light-emitting element.

本發明的發光裝置包括發光基座、波長轉換材料以及導熱載體。波長轉換材料覆蓋發光基座,且適於讓光束穿透的導熱載體連接發光基座及波長轉換材料。 The light emitting device of the present invention includes a light emitting base, a wavelength converting material, and a heat conductive carrier. The wavelength converting material covers the light emitting base, and is adapted to connect the heat conducting carrier through which the light beam penetrates to the light emitting base and the wavelength converting material.

基於上述,由於本發明的導熱結構配置於基座上且直接 接觸波長轉換罩,因此導熱結構可將發光元件所產生的熱經由基座快速帶走,而不會使發光元件所產生的熱集中於波長轉換罩上,可有效降低波長轉換罩的熱消光現象。簡言之,本發明的發光裝置可具有較佳的散熱效果且可有效避免產生熱消光現象。 Based on the above, since the heat conducting structure of the present invention is disposed on the pedestal and directly Contacting the wavelength conversion cover, the heat conduction structure can quickly remove the heat generated by the light-emitting element through the susceptor without concentrating the heat generated by the light-emitting element on the wavelength conversion cover, thereby effectively reducing the thermal extinction phenomenon of the wavelength conversion cover. . In short, the light-emitting device of the present invention can have a better heat dissipation effect and can effectively avoid the occurrence of thermal extinction.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

100a、100a’、100b、100b1、100b2、100b3、100c、100d、100e‧‧‧發光裝置 100a, 100a', 100b, 100b1, 100b2, 100b3, 100c, 100d, 100e‧‧‧ illuminating device

110‧‧‧基座 110‧‧‧Base

112‧‧‧散熱座 112‧‧‧ Heat sink

120‧‧‧發光元件 120‧‧‧Lighting elements

130a、130a’、130b、130b1、130b2、130b3‧‧‧波長轉換罩 130a, 130a', 130b, 130b1, 130b2, 130b3‧‧‧ wavelength conversion cover

131a‧‧‧弧形頂蓋 131a‧‧‧ curved top cover

132a‧‧‧內表面 132a‧‧‧ inner surface

132b‧‧‧第一內表面 132b‧‧‧First inner surface

133a‧‧‧側牆 133a‧‧‧Side wall

134a‧‧‧外表面 134a‧‧‧ outer surface

134b‧‧‧第一外表面 134b‧‧‧First outer surface

135a‧‧‧頂點 135a‧‧‧ apex

140a、140b、140c、140d‧‧‧導熱結構 140a, 140b, 140c, 140d‧‧‧ heat conduction structure

142d‧‧‧第二內表面 142d‧‧‧second inner surface

144d‧‧‧第二外表面 144d‧‧‧second outer surface

150‧‧‧反射材料層 150‧‧‧reflective material layer

D‧‧‧最大垂直距離 D‧‧‧Maximum vertical distance

H1、H2‧‧‧高度 H1, H2‧‧‧ height

圖1A繪示為本發明的一實施例的一種發光裝置的局部剖面立體示意圖。 FIG. 1A is a partial cross-sectional perspective view of a light emitting device according to an embodiment of the invention.

圖1B繪示為本發明的另一實施例的一種發光裝置的局部剖面立體示意圖。 FIG. 1B is a partial cross-sectional perspective view of a light emitting device according to another embodiment of the present invention.

圖2繪示為本發明的另一實施例的一種發光裝置的局部剖面立體示意圖。 2 is a partial cross-sectional perspective view of a light emitting device according to another embodiment of the present invention.

圖3A繪示為本發明的另一實施例的一種發光裝置的局部剖面立體示意圖。 3A is a partial cross-sectional perspective view of a light emitting device according to another embodiment of the present invention.

圖3B繪示為本發明的另一實施例的一種發光裝置的局部剖面立體示意圖。 3B is a partial cross-sectional perspective view of a light emitting device according to another embodiment of the present invention.

圖3C繪示為本發明的另一實施例的一種發光裝置的局部剖面立體示意圖。 3C is a partial cross-sectional perspective view of a light emitting device according to another embodiment of the present invention.

圖4繪示為本發明的另一實施例的一種發光裝置的局部剖面 立體示意圖。 4 is a partial cross-sectional view of a light emitting device according to another embodiment of the present invention; Stereoscopic view.

圖5繪示為本發明的另一實施例的一種發光裝置的局部剖面立體示意圖。 FIG. 5 is a partial cross-sectional perspective view of a light emitting device according to another embodiment of the present invention.

圖6繪示為本發明的另一實施例的一種發光裝置的局部剖面立體示意圖。 6 is a partial cross-sectional perspective view of a light emitting device according to another embodiment of the present invention.

圖1A繪示為本發明的一實施例的一種發光裝置的局部剖面立體示意圖。請參考圖1A,在本實施例中,發光裝置100a包括一基座110、至少一發光元件120(圖1A中僅示意地繪示一個)、一波長轉換罩130a以及一導熱結構140a。詳細來說,發光元件120配置於基座110上且與基座110電性連接。波長轉換罩130a配置於基座110上且覆蓋發光元件120。導熱結構140a配置於基座110上且直接接觸波長轉換罩130a。 FIG. 1A is a partial cross-sectional perspective view of a light emitting device according to an embodiment of the invention. Referring to FIG. 1A, in the embodiment, the light-emitting device 100a includes a susceptor 110, at least one light-emitting element 120 (only one is schematically shown in FIG. 1A), a wavelength conversion cover 130a, and a heat-conducting structure 140a. In detail, the light emitting element 120 is disposed on the susceptor 110 and electrically connected to the susceptor 110 . The wavelength conversion cover 130a is disposed on the susceptor 110 and covers the light emitting element 120. The heat conducting structure 140a is disposed on the susceptor 110 and directly contacts the wavelength conversion cover 130a.

具體來說,本實施例之發光元件120例如是一發光二極體,用以產生光線。波長轉換罩130a具有彼此相對的一內表面132a與一外表面134a,其中導熱結構140a直接接觸波長轉換罩130a的內表面132a。如圖1A所示,本實施例之導熱結構140a例如是一網狀導熱結構,其中網狀導熱結構的網狀圖案例如是矩形,但並不以此為限。較佳地,本實施例之導熱結構140a佔波長轉換罩130a的內表面132a表面積的5%至40%,其中若小於5%會使導熱效果不佳,而若大於40%則會造成遮光,影響出光效率。特別是, 波長轉換罩上的一頂點135a至基座110上的最大垂直距離D與導熱結構140a的高度H1的比值介於0.9至2之間,視實際需求去設置導熱結構的高度H1,以獲得較佳的導熱效果又不至於影響出光。此處,導熱結構140a的材質可選擇自具有高導熱效果及高反射率的材質,例如是銀、金、銅、鉑、錫以及鋁至少其中之一;或者是,可選擇自導熱率較佳的材質,例如是奈米碳管或石墨烯。如此一來,導熱結構140a除了可快速將發光元件120所產生的熱經由基座110快速帶走,而不會集中或停留於波長轉換罩130a上之外,導熱結構140a的結構設計以及材料選擇亦可增加發光元件120的出光效果,進而提高整體發光裝置100a的出光效率。 Specifically, the light-emitting element 120 of the embodiment is, for example, a light-emitting diode for generating light. The wavelength conversion mask 130a has an inner surface 132a and an outer surface 134a opposite to each other, wherein the heat conducting structure 140a directly contacts the inner surface 132a of the wavelength conversion mask 130a. As shown in FIG. 1A, the heat conducting structure 140a of the present embodiment is, for example, a mesh heat conducting structure, wherein the mesh pattern of the mesh heat conducting structure is, for example, rectangular, but is not limited thereto. Preferably, the heat conducting structure 140a of the embodiment occupies 5% to 40% of the surface area of the inner surface 132a of the wavelength conversion cover 130a. If less than 5%, the heat conduction effect is not good, and if it is greater than 40%, the light shielding is caused. Affects light extraction efficiency. especially, The ratio of the maximum vertical distance D of the apex 135a on the wavelength conversion cover to the height H1 of the heat conducting structure 140a is between 0.9 and 2. The height H1 of the heat conducting structure is set according to actual requirements to obtain a better The thermal conductivity does not affect the light. Here, the material of the heat conducting structure 140a may be selected from materials having high thermal conductivity and high reflectivity, such as at least one of silver, gold, copper, platinum, tin, and aluminum; or, the self-thermal conductivity may be selected. The material is, for example, a carbon nanotube or graphene. In this way, the heat conducting structure 140a can quickly carry away the heat generated by the light emitting element 120 through the susceptor 110 without being concentrated or staying on the wavelength conversion cover 130a, and the structural design and material selection of the heat conductive structure 140a. The light-emitting effect of the light-emitting element 120 can also be increased, thereby improving the light-emitting efficiency of the overall light-emitting device 100a.

圖1B繪示為本發明的另一實施例的一種發光裝置的局部剖面立體示意圖。請參考圖1B,在本實施例中之發光裝置100a’與圖1A之發光裝置100a相似,差異之處僅在於:本實施例之發光裝置100a’更包括一散熱座112,其中基座110配置於散熱座112上。透過散熱座112和導熱結構140a的設置,使得導熱結構140a可將發光元件120所產生的熱經由散熱座112快速散至外界且可以導到外部的其他導熱構件例如散熱鰭片上(圖未繪示)。較佳地,散熱座112的材料係選自於鋁、錫、銅、銀、金以及陶瓷至少其中之一,可有效提高發光裝置100a’的散熱效率。更特別地是,散熱座112因為具有一高度,可墊高配置於基座110上的發光元件120,使出光角度可以更大(即全周角)。 FIG. 1B is a partial cross-sectional perspective view of a light emitting device according to another embodiment of the present invention. Referring to FIG. 1B, the illuminating device 100a' in this embodiment is similar to the illuminating device 100a of FIG. 1A, except that the illuminating device 100a' of the embodiment further includes a heat sink 112, wherein the pedestal 110 is configured. On the heat sink 112. Through the arrangement of the heat sink 112 and the heat conducting structure 140a, the heat conducting structure 140a can quickly dissipate the heat generated by the light emitting element 120 to the outside through the heat sink 112 and can be guided to other external heat conducting members such as heat sink fins (not shown). ). Preferably, the material of the heat sink 112 is selected from at least one of aluminum, tin, copper, silver, gold and ceramics, which can effectively improve the heat dissipation efficiency of the light-emitting device 100a'. More specifically, since the heat sink 112 has a height, the light emitting element 120 disposed on the susceptor 110 can be raised to make the light exit angle larger (ie, the full circumference angle).

需說明的是,本實施例並不限定導熱結構140a與波長轉 換罩130a之間的相對配置關係。於其他實施例中,請參考圖2,本實施例之波長轉換罩130a’例如是由一弧型頂蓋131a以及一側牆133a所組成,其中側牆133a連接於弧型頂蓋131a與基座110之間,且側牆133a垂直立於基座110並圍繞發光元件120。發光裝置100b的導熱結構140b例如是一網狀導熱結構,例如是具有矩形的網狀圖案的網狀導熱結構,其配置於波長轉換罩130a’的內表面132a上且僅位於側牆133a上。意即,導熱結構140b的高度H2小於波長轉換罩130a’的頂點135a至基座110上的最大垂直距離D。此處,最大垂直距離D與高度H2的比值較佳是2,也就是導熱結構140b的高度只有波長轉換罩130a’的頂點135a至基座110上的最大垂直距離D的一半。此設計可使導熱效果和不遮光的設計達到最佳平衡。 It should be noted that the embodiment does not limit the heat conduction structure 140a and the wavelength conversion. The relative arrangement relationship between the masks 130a is changed. In other embodiments, referring to FIG. 2, the wavelength conversion cover 130a' of the present embodiment is composed of, for example, an arc-shaped top cover 131a and a side wall 133a, wherein the side wall 133a is connected to the curved top cover 131a and the base. Between the seats 110, and the side wall 133a stands perpendicular to the base 110 and surrounds the light emitting element 120. The heat conducting structure 140b of the light emitting device 100b is, for example, a mesh heat conducting structure, for example, a mesh heat conducting structure having a rectangular mesh pattern disposed on the inner surface 132a of the wavelength conversion cover 130a' and located only on the side wall 133a. That is, the height H2 of the heat conducting structure 140b is smaller than the maximum vertical distance D of the apex 135a of the wavelength conversion cover 130a' to the susceptor 110. Here, the ratio of the maximum vertical distance D to the height H2 is preferably 2, that is, the height of the heat conducting structure 140b is only half of the maximum vertical distance D of the apex 135a of the wavelength conversion cover 130a' to the susceptor 110. This design provides the best balance between thermal conductivity and non-shading design.

當然,本實施例不限定波長轉換罩130a’的樣態,除了例如圖2般具有弧型頂蓋131a和側牆133a的子彈型外,波長轉換罩也可以例如為圖3A發光裝置100b1中的波長轉換罩130b1的外形輪廓為半球型;或者是,如圖3B發光裝置100b2中的波長轉換罩130b2的外形輪廓為球型;或者是,如圖3C發光裝置100b3中的波長轉換罩130b3的外形輪廓具有大體上球體及窄頸部分的型態,可視實際情況需求,於此並不加以限定。 Of course, the embodiment does not limit the aspect of the wavelength conversion cover 130a'. In addition to the bullet type having the curved top cover 131a and the side wall 133a as shown in FIG. 2, the wavelength conversion cover may also be, for example, the light-emitting device 100b1 of FIG. 3A. The outline of the wavelength conversion cover 130b1 is hemispherical; or, the outline of the wavelength conversion cover 130b2 in the light-emitting device 100b2 of FIG. 3B is spherical; or, the shape of the wavelength conversion cover 130b3 in the light-emitting device 100b3 of FIG. 3C The contour has a shape of a substantially spherical body and a narrow neck portion, which may be required according to actual conditions, and is not limited herein.

或者是,請參考圖4,發光裝置100c的導熱結構140c例如是一網狀導熱結構,例如是類三角形的網狀圖案之網狀導熱結構,其配置於波長轉換罩130a的外表面134a上,其中三角形的 網狀圖案可有效減少遮光。此處,導熱結構140a佔波長轉換罩130a的外表面134a表面積的5%至40%。或者是,於其他未繪示的實施例中,導熱結構亦可同時配置於波長轉換罩的內表面與外表面上。 Alternatively, referring to FIG. 4, the heat conducting structure 140c of the light emitting device 100c is, for example, a mesh heat conducting structure, such as a mesh-like heat conducting structure of a triangular-like mesh pattern, which is disposed on the outer surface 134a of the wavelength conversion cover 130a. Triangle The mesh pattern is effective in reducing shading. Here, the thermally conductive structure 140a occupies 5% to 40% of the surface area of the outer surface 134a of the wavelength conversion mask 130a. Alternatively, in other embodiments not shown, the heat conducting structure may be simultaneously disposed on the inner and outer surfaces of the wavelength conversion cover.

或者是,請參考圖5,發光裝置100d的導熱結構140d例如是一網狀導熱結構,且具有彼此相對的一第二內表面142d以及一第二外表面144d。波長轉換罩130b具有彼此相對的一第一內表面132b以及一第一外表面134b。特別是,導熱結構140d的第二內表面142d與第二外表面144d分別和波長轉換罩130b的第一內表面132b與第一外表面134b實質上共平面。意即,導熱結構140d與波長轉換罩130b相互嵌合。如此一來,發光元件120所產生的熱除了可直接由導熱結構140d傳遞至外界外,亦可由導熱結構140d經由基座110快速帶走,而不會集中或停留於波長轉換罩130b上。 Alternatively, referring to FIG. 5, the heat conducting structure 140d of the light emitting device 100d is, for example, a mesh heat conducting structure, and has a second inner surface 142d and a second outer surface 144d opposite to each other. The wavelength conversion cover 130b has a first inner surface 132b and a first outer surface 134b opposite to each other. In particular, the second inner surface 142d and the second outer surface 144d of the thermally conductive structure 140d and the first inner surface 132b of the wavelength conversion shroud 130b are substantially coplanar with the first outer surface 134b, respectively. That is, the heat conductive structure 140d and the wavelength conversion cover 130b are fitted to each other. In this way, the heat generated by the light-emitting element 120 can be quickly carried away by the heat-conducting structure 140d via the susceptor 110, except that it can be directly transmitted from the heat-conducting structure 140d to the outside, without being concentrated or staying on the wavelength conversion cover 130b.

當然,本實施例亦不限定導熱結構140a、140b、140c、140d的結構形態,雖然此處所提及的導熱結構140a、140b、140c、140d具體化為網狀導熱結構,即具有較大的散熱表面積。但於其他未繪示的實施例中,導熱結構亦可為一片狀導熱結構、一管狀導熱結構,或者是一由多角狀片體(例如五角形片體或六角形片體)所組成的導熱結構,此仍屬於本發明可採用的技術方案,不脫離本發明所欲保護的範圍。 Of course, this embodiment also does not limit the structural form of the heat conductive structures 140a, 140b, 140c, 140d, although the heat conductive structures 140a, 140b, 140c, 140d mentioned herein are embodied as a mesh heat conductive structure, that is, have a larger Heat dissipation surface area. However, in other embodiments not shown, the heat conducting structure may also be a sheet-like heat conducting structure, a tubular heat conducting structure, or a heat conduction composed of a polygonal sheet body (for example, a pentagonal sheet or a hexagonal sheet). The structure, which still belongs to the technical solution that can be adopted by the present invention, does not depart from the scope of the present invention.

此外,為了更進一步提高發光元件120的出光效果,請 參考圖6,本實施例之發光裝置100e亦可更包括一反射材料層150,其中反射材料層150配置於導熱結構140a上。此處,反射材料層150的材質例如係選自於銀、鉻、鎳以及鋁至少其中之一;或者是,反射材料層150為一布拉格反射鏡。 In addition, in order to further improve the light-emitting effect of the light-emitting element 120, please Referring to FIG. 6, the light emitting device 100e of the present embodiment may further include a reflective material layer 150, wherein the reflective material layer 150 is disposed on the heat conductive structure 140a. Here, the material of the reflective material layer 150 is selected, for example, from at least one of silver, chromium, nickel, and aluminum; or, the reflective material layer 150 is a Bragg mirror.

綜上所述,由於本發明的導熱結構配置於基座上且直接接觸波長轉換罩,因此導熱結構可將發光元件所產生的熱快速帶走,而不會使發光元件所產生的熱集中於波長轉換罩上,可有效降低波長轉換罩的熱消光現象。簡言之,本發明的發光裝置可具有較佳的散熱效果且可有效避免產生熱消光現象。 In summary, since the heat conducting structure of the present invention is disposed on the pedestal and directly contacts the wavelength conversion cover, the heat conducting structure can quickly remove the heat generated by the illuminating element without concentrating the heat generated by the illuminating element. On the wavelength conversion cover, the thermal extinction of the wavelength conversion cover can be effectively reduced. In short, the light-emitting device of the present invention can have a better heat dissipation effect and can effectively avoid the occurrence of thermal extinction.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100a‧‧‧發光裝置 100a‧‧‧Lighting device

110‧‧‧基座 110‧‧‧Base

120‧‧‧發光元件 120‧‧‧Lighting elements

130a‧‧‧波長轉換罩 130a‧‧‧wavelength conversion cover

132a‧‧‧內表面 132a‧‧‧ inner surface

134a‧‧‧外表面 134a‧‧‧ outer surface

135a‧‧‧頂點 135a‧‧‧ apex

140a‧‧‧導熱結構 140a‧‧‧thermal structure

D‧‧‧最大垂直距離 D‧‧‧Maximum vertical distance

H1‧‧‧高度 H1‧‧‧ Height

Claims (10)

一種發光裝置,包括:一基座;一波長轉換結構,包括:一導熱結構,包括多個容置空間;以及波長轉換材料,容置於該些容置空間中;以及至少一發光元件,配置於該基座上,其中該基座連接該導熱結構,且該波長轉換結構覆蓋該發光元件。 A light-emitting device comprising: a susceptor; a wavelength conversion structure comprising: a heat-conducting structure comprising a plurality of accommodating spaces; and a wavelength-converting material housed in the accommodating spaces; and at least one illuminating element, configured On the pedestal, the susceptor is connected to the heat conducting structure, and the wavelength conversion structure covers the illuminating element. 如申請專利範圍第1項所述的發光裝置,其中該波長轉換材料佔該波長轉換結構的表面積的60%至95%。 The illuminating device of claim 1, wherein the wavelength converting material accounts for 60% to 95% of the surface area of the wavelength converting structure. 如申請專利範圍第1項所述的發光裝置,更包括:一反射材料層,配置於該導熱結構上。 The illuminating device of claim 1, further comprising: a reflective material layer disposed on the heat conducting structure. 一種發光裝置,包括:一基座,包括至少一發光元件安裝其上;一網狀導熱支架,連接該基座;以及多個波長轉換塊,嵌入該網狀導熱支架的多個網眼中,該些波長轉換塊及該網狀導熱支架覆蓋該發光元件。 A illuminating device comprising: a pedestal including at least one illuminating element mounted thereon; a mesh heat conducting bracket connected to the pedestal; and a plurality of wavelength converting blocks embedded in the plurality of meshes of the mesh heat conducting bracket, The wavelength conversion block and the mesh heat conducting bracket cover the light emitting element. 如申請專利範圍第4項所述的發光裝置,更包括:一反射材料層,配置於該網狀導熱支架上。 The illuminating device of claim 4, further comprising: a reflective material layer disposed on the mesh heat conducting bracket. 一種發光裝置,包括:一基座,包括至少一發光元件安裝其上;一波長轉換層;以及 一透光導熱體,連接該基座,其中該透光導熱體被覆並攜帶該波長轉換層,且該波長轉換層及該透光導熱體覆蓋該發光元件。 A light emitting device comprising: a susceptor including at least one illuminating element mounted thereon; a wavelength conversion layer; a light-transmissive heat-conducting body is connected to the pedestal, wherein the light-transmissive heat-conducting body is covered and carries the wavelength conversion layer, and the wavelength conversion layer and the light-transmitting heat-conducting body cover the light-emitting element. 如申請專利範圍第6項所述的發光裝置,更包括:一反射材料層,配置於該透光導熱體上。 The illuminating device of claim 6, further comprising: a reflective material layer disposed on the transparent heat conductor. 一發光裝置,包括:一發光基座;一波長轉換材料,覆蓋該發光基座;以及一導熱載體,連接該發光基座及該波長轉換材料,且該導熱載體適於讓光束穿透。 An illuminating device comprises: an illuminating pedestal; a wavelength converting material covering the illuminating base; and a heat conducting carrier connecting the illuminating pedestal and the wavelength converting material, and the heat conducting carrier is adapted to allow a light beam to penetrate. 如申請專利範圍第8項所述的發光裝置,其中該發光基座包括:一基座;以及至少一發光元件,配置於該基座上,其中該基座連接該反射導熱體,且該波長轉換材料及該導熱載體覆蓋該發光元件。 The illuminating device of claim 8, wherein the illuminating base comprises: a pedestal; and at least one illuminating element disposed on the pedestal, wherein the pedestal is connected to the reflective thermal conductor, and the wavelength The conversion material and the thermally conductive carrier cover the light emitting element. 如申請專利範圍第8項所述的發光裝置,更包括:一反射材料層,配置於該導熱載體上。 The illuminating device of claim 8, further comprising: a reflective material layer disposed on the thermally conductive carrier.
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