TW201544330A - Transparent sheet material with pressure-sensitive adhesive layer, display device, production processes therefor, and pressure-sensitive adhesive sheet - Google Patents

Transparent sheet material with pressure-sensitive adhesive layer, display device, production processes therefor, and pressure-sensitive adhesive sheet Download PDF

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Publication number
TW201544330A
TW201544330A TW104112486A TW104112486A TW201544330A TW 201544330 A TW201544330 A TW 201544330A TW 104112486 A TW104112486 A TW 104112486A TW 104112486 A TW104112486 A TW 104112486A TW 201544330 A TW201544330 A TW 201544330A
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adhesive layer
surface material
transparent surface
oligomer
resin composition
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TW104112486A
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Chinese (zh)
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Hiroshi Sakamoto
Akinobu Nakahara
Toyokazu Suzuki
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Asahi Glass Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/40Layered products comprising a layer of synthetic resin comprising polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

Provided are: a transparent sheet material coated with a pressure-sensitive adhesive layer, the sheet material, when adhered to an adherend, being capable of making bubbles remaining at the interface between the adherend and the pressure-sensitive adhesive layer rapidly disappear; a display device in which the display panel is protected by the transparent sheet material; processes for producing the transparent sheet material coated with a pressure-sensitive adhesive layer and the display device; and a pressure-sensitive adhesive sheet. The transparent sheet material (1) coated with a pressure-sensitive adhesive layer comprises a transparent sheet material (10) and, formed on at least one surface of the transparent sheet material (10), a pressure-sensitive adhesive layer (14) constituted of a cured object formed from a curable resin composition, wherein the pressure-sensitive adhesive layer (14) has a concentration of hydroxy groups of 100 * 10<SP>-6</SP> to 600 * 10<SP>-6</SP> mol/g and a concentration of urethane bonds of 0 to 150 * 10<SP>-6</SP> mol/g.

Description

附黏著層之透明面材、顯示裝置及彼等之製造方法、以及黏著片 Transparent surface material with adhesive layer, display device, and manufacturing method thereof, and adhesive sheet

本發明係關於一種附黏著層之透明面材、由透明面材保護顯示面板之顯示裝置及彼等之製造方法、以及黏著片。 The present invention relates to a transparent surface material with an adhesive layer, a display device for protecting a display panel with a transparent surface material, a method for manufacturing the same, and an adhesive sheet.

作為由透明面材保護顯示面板之顯示裝置,例如已知有下述者。 As a display device which protects a display panel with a transparent surface material, the following are known, for example.

(1)將顯示面板與透明面材經由黏著片貼合而成之顯示裝置(參照專利文獻1、2)。 (1) A display device in which a display panel and a transparent surface material are bonded via an adhesive sheet (see Patent Documents 1 and 2).

(2)將顯示面板與附黏著層之透明面材以黏著層接觸於顯示面板之方式貼合而成之顯示裝置(參照專利文獻3~5)。 (2) A display device in which a display panel and a transparent surface material with an adhesive layer are bonded to the display panel with an adhesive layer (see Patent Documents 3 to 5).

製造(1)之顯示裝置時,採用如下方法,即以於顯示面板與黏著片之界面、及透明面材與黏著片之界面不殘留氣泡(空隙)之方式,於減壓環境下將顯示面板與透明面材經由黏著片而貼合後,將其放回至大氣壓環境下。 When the display device of (1) is manufactured, the display panel is used in a decompression environment so that the interface between the display panel and the adhesive sheet and the interface between the transparent surface material and the adhesive sheet do not leave air bubbles (voids). After bonding with the transparent face material via the adhesive sheet, it is returned to the atmospheric pressure environment.

又,製造(2)之顯示裝置時,採用如下方法,即以於顯示面板與黏著層之界面不殘留氣泡(空隙)之方式,於減壓環境下將顯示面板與附黏著層之透明面材以黏著層接觸於顯示面板之方式貼合後,將其放回至大氣壓環境下。 Moreover, in the case of manufacturing the display device of (2), a transparent surface material of the display panel and the adhesive layer is provided in a reduced pressure environment so that no air bubbles (voids) remain at the interface between the display panel and the adhesive layer. After the adhesive layer is attached to the display panel, it is placed back to the atmospheric pressure environment.

根據彼等方法,即便於上述界面殘留有氣泡,亦可藉由將減壓環境下之顯示裝置放回至大氣壓環境下,而利用氣泡內之壓力(即, 減壓狀態之壓力)與施加於黏著片或黏著層之壓力(即,大氣壓)的差壓使氣泡體積減少,從而使氣泡消失。 According to the methods, even if bubbles are left at the interface, the pressure in the bubble can be utilized by returning the display device in a reduced pressure environment to the atmospheric pressure environment (ie, The pressure difference between the pressure in the decompressed state and the pressure applied to the adhesive sheet or the adhesive layer (i.e., atmospheric pressure) causes the bubble volume to decrease, thereby causing the bubble to disappear.

然而,於使用先前之黏著片或附黏著層之透明面材之情形時,殘留於上述界面之氣泡消失耗費時間。若殘留於上述界面之氣泡消失耗費時間,則顯示裝置之生產性降低。 However, in the case of using the previous adhesive sheet or the transparent face material with the adhesive layer, it is time consuming to disappear the bubbles remaining at the above interface. If the bubble remaining in the above interface disappears, it takes time, and the productivity of the display device is lowered.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本專利特開2006-290960號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2006-290960

專利文獻2:日本專利特開2009-263502號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2009-263502

專利文獻3:國際公開第2011/148990號 Patent Document 3: International Publication No. 2011/148990

專利文獻4:國際公開第2012/077726號 Patent Document 4: International Publication No. 2012/077726

專利文獻5:國際公開第2012/077727號 Patent Document 5: International Publication No. 2012/077727

本發明提供一種將被貼合物與透明面材經由黏著層而貼合時,殘留於被貼合物與黏著層之界面之氣泡可迅速消失之附黏著層之透明面材;製造將被貼合物與透明面材經由黏著層而貼合時,殘留於被貼合物與黏著層之界面之氣泡可迅速消失之附黏著層之透明面材的方法;可抑制氣泡殘留於顯示面板與黏著層之界面之顯示裝置;生產性良好地製造可抑制氣泡殘留於顯示面板與黏著層之界面之顯示裝置的方法;及與被貼合物貼合時,殘留於被貼合物與黏著片之界面之氣泡可迅速消失之黏著片。 The present invention provides a transparent surface material which adheres to an adhesive layer which can be quickly disappeared at the interface between the adherend and the adhesive layer when the adherend and the transparent surface material are bonded via the adhesive layer; the manufacturing will be pasted When the transparent surface material and the transparent surface material are bonded via the adhesive layer, the method of leaving the transparent surface material of the adhesive layer which can be quickly disappeared at the interface between the adhesive composition and the adhesive layer can suppress the residual air bubbles on the display panel and the adhesion. a display device for the interface of the layer; a method for producing a display device capable of suppressing bubbles remaining at the interface between the display panel and the adhesive layer with good productivity; and remaining in the adherend and the adhesive sheet when bonded to the adherend The bubbles on the interface can quickly disappear into the adhesive sheet.

本發明者等人對黏著層之特性、與殘留於被貼合物與黏著層之界面之氣泡之消失速度的關係進行努力研究,結果發現:於黏著層中之羥基濃度或胺基甲酸酯鍵濃度較多的情形時,氣泡消失耗費時間。 The inventors of the present invention conducted an effort to study the relationship between the characteristics of the adhesive layer and the disappearance rate of the bubbles remaining at the interface between the adherend and the adhesive layer, and found that the concentration of the hydroxyl group or the urethane in the adhesive layer was found. When the concentration of the key is large, it takes time to disappear the bubble.

本發明之附黏著層之透明面材具有透明面材、與形成於上述透明面材之至少一表面之包含硬化性樹脂組合物之硬化物的黏著層,且上述黏著層中之羥基濃度為100×10-6~600×10-6mol/g,上述黏著層中之胺基甲酸酯鍵濃度為0~150×10-6mol/g。 The transparent surface material with an adhesive layer of the present invention has a transparent surface material and an adhesive layer formed on the hard surface of the curable resin composition formed on at least one surface of the transparent surface material, and the hydroxyl group concentration in the adhesive layer is 100. ×10 -6 to 600×10 -6 mol/g, and the concentration of the urethane bond in the above adhesive layer is 0 to 150×10 -6 mol/g.

上述黏著層中之羥基濃度與上述黏著層中之胺基甲酸酯鍵濃度之合計較佳為100×10-6~750×10-6mol/g。 The total concentration of the hydroxyl groups in the adhesive layer and the concentration of the urethane bond in the adhesive layer is preferably from 100 × 10 -6 to 750 × 10 -6 mol/g.

上述黏著層之溶解度參數較佳為17.5~18.5(J/cm3)1/2The solubility parameter of the above adhesive layer is preferably from 17.5 to 18.5 (J/cm 3 ) 1/2 .

上述硬化性樹脂組合物較佳為包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、與具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B),且上述硬化性低聚物(A)及上述低分子量聚合性化合物(B)中之任一者或兩者具有羥基。上述硬化性低聚物(A)及上述低分子量聚合性化合物(B)中之任一者或兩者亦可具有胺基甲酸酯鍵。 The curable resin composition preferably contains a curable oligomer (A) having an addition polymerizable unsaturated double bond and a low molecular weight polymerizable compound (B) having an addition polymerizable unsaturated double bond, and Either or both of the curable oligomer (A) and the low molecular weight polymerizable compound (B) have a hydroxyl group. Either or both of the curable oligomer (A) and the low molecular weight polymerizable compound (B) may have a urethane bond.

上述硬化性樹脂組合物較佳為包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B)、及不具有加成聚合性不飽和雙鍵之非硬化性低聚物(C),且上述硬化性低聚物(A)、上述低分子量聚合性化合物(B)及上述非硬化性低聚物(C)中之至少一者具有羥基。上述硬化性低聚物(A)、上述低分子量聚合性化合物(B)及上述非硬化性低聚物(C)中之至少一者亦可具有胺基甲酸酯鍵。 The curable resin composition preferably contains a curable oligomer (A) having an addition polymerizable unsaturated double bond, a low molecular weight polymerizable compound (B) having an addition polymerizable unsaturated double bond, and a non-curable oligomer (C) having an addition polymerizable unsaturated double bond, and the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curing oligomer (C) At least one of them has a hydroxyl group. At least one of the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C) may have a urethane bond.

本發明之附黏著層之透明面材較佳為進而具有覆蓋上述黏著層之表面之可剝離之保護膜。 The transparent surface material of the adhesive layer of the present invention preferably further has a peelable protective film covering the surface of the adhesive layer.

本發明之附黏著層之透明面材之製造方法係製造本發明之附黏著層之透明面材的方法,且具有下述步驟(α)及下述步驟(γ)。 The method for producing a transparent face material with an adhesive layer of the present invention is a method for producing a transparent face material with an adhesive layer of the present invention, and has the following step (α) and the following step (γ).

(α)向上述透明面材之表面供給液狀之上述硬化性樹脂組合物,視需要使上述硬化性樹脂組合物部分地硬化而製成部分硬化物之步驟; (γ)使上述硬化性樹脂組合物或上述部分硬化物硬化而形成上述黏著層之步驟。 (α) a step of supplying the curable resin composition in a liquid form to the surface of the transparent surface material, and partially curing the curable resin composition to form a partially cured product, if necessary; (γ) A step of curing the curable resin composition or the partially cured product to form the adhesive layer.

本發明之附黏著層之透明面材之製造方法較佳為進而具有下述步驟(β)。 The method for producing a transparent surface material with an adhesive layer of the present invention preferably further has the following step (β).

(β)利用保護膜覆蓋上述硬化性樹脂組合物或上述部分硬化物之表面之步驟。 (β) A step of covering the surface of the curable resin composition or the partially cured product with a protective film.

較佳為上述步驟(α)為下述步驟(α1),上述步驟(β)為下述步驟(β1),上述步驟(γ)為下述步驟(γ1)。 Preferably, the above step (α) is the following step (α1), the step (β) is the following step (β1), and the step (γ) is the following step (γ1).

(α1)向上述透明面材之表面以層狀之方式供給液狀之上述硬化性樹脂組合物,使供給至上述透明面材之表面之上述硬化性樹脂組合物部分地硬化而形成部分硬化物之層的步驟; (β1)利用保護膜覆蓋上述部分硬化物之層之表面之步驟;(γ1)使上述部分硬化物之層進一步硬化而形成上述黏著層之步驟。 (α1) The liquid curable resin composition is supplied to the surface of the transparent surface material in a layered manner, and the curable resin composition supplied to the surface of the transparent surface material is partially cured to form a partially cured product. Step of the layer; (β1) a step of covering the surface of the partially cured layer with a protective film; (γ1) a step of further hardening the layer of the partially cured product to form the adhesive layer.

又,較佳為上述步驟(α)為下述步驟(α21)及下述步驟(α22),上述步驟(β)為下述步驟(β2),上述步驟(γ)為下述步驟(γ21)及下述步驟(γ22)。 Further, preferably, the step (α) is the following step (α21) and the following step (α22), the step (β) is the following step (β2), and the step (γ) is the following step (γ21). And the following steps (γ22).

(α21)於上述透明面材之表面之周緣部形成框狀之堰之步驟;(α22)向被上述堰包圍之區域供給上述硬化性樹脂組合物之步驟;(β2)於減壓環境下,將附保護膜之支持面材以上述保護膜接觸於上述硬化性樹脂組合物之層之表面的方式重疊於上述硬化性樹脂組合物之層上,而獲得上述硬化性樹脂組合物之層被上述透明面材、上述保護膜及上述堰密封之積層體的步驟;(γ21)於將上述積層體放置於較上述步驟(β2)高之壓力環境下之狀態下,使上述硬化性樹脂組合物之層硬化而形成上述黏著層之步驟; (γ22)上述步驟(γ21)後,將上述支持面材自上述保護膜剝離之步驟。 (α21) a step of forming a frame shape on a peripheral portion of the surface of the transparent face material; (α22) a step of supplying the curable resin composition to a region surrounded by the crucible; (β2) in a reduced pressure environment; The support surface material with a protective film is superposed on the surface of the layer of the curable resin composition so that the protective film is in contact with the surface of the layer of the curable resin composition, and the layer of the curable resin composition is obtained as described above. a step of forming a transparent surface material, the protective film, and the laminate of the above-mentioned ruthenium seal; (γ21), wherein the laminate is placed in a pressure environment higher than the above step (β2), and the curable resin composition is allowed to be a step of hardening the layer to form the above adhesive layer; (γ22) After the above step (γ21), the support surface material is peeled off from the protective film.

本發明之顯示裝置具有:顯示面板、與本發明之附黏著層之透明面材,其以上述黏著層接觸於上述顯示面板之方式貼合於上述顯示面板。 A display device according to the present invention includes a display panel and a transparent surface material attached to the adhesive layer of the present invention, and the adhesive layer is bonded to the display panel so that the adhesive layer contacts the display panel.

本發明之顯示裝置之製造方法係製造本發明之顯示裝置的方法,且於減壓環境下,將上述顯示面板與上述附黏著層之透明面材以上述黏著層接觸於上述顯示面板之方式重疊並貼合。 The manufacturing method of the display device of the present invention is a method for manufacturing the display device of the present invention, and the display panel and the transparent surface material of the adhesive layer are overlapped in such a manner that the adhesive layer contacts the display panel in a reduced pressure environment. And fit.

本發明之黏著片係包含硬化性樹脂組合物之硬化物者,且上述黏著片中之羥基濃度為100×10-6~600×10-6mol/g,上述黏著片中之胺基甲酸酯鍵濃度為0~150×10-6mol/g。 The adhesive sheet of the present invention comprises a cured product of a curable resin composition, and the hydroxyl group concentration in the adhesive sheet is 100×10 -6 to 600×10 -6 mol/g, and the urethane in the adhesive sheet is used. The ester bond concentration is 0 to 150×10 -6 mol/g.

上述黏著片中之羥基濃度與上述黏著片中之胺基甲酸酯鍵濃度之合計較佳為100×10-6~750×10-6mol/g。 The hydroxyl group concentration of the adhesive sheet and the adhesive sheet of the above total concentration of urethane bond of the ester is preferably 100 × 10 -6 ~ 750 × 10 -6 mol / g.

上述硬化性樹脂組合物之硬化物之溶解度參數較佳為17.5~18.5(J/cm3)1/2The solubility parameter of the cured product of the curable resin composition is preferably from 17.5 to 18.5 (J/cm 3 ) 1/2 .

上述硬化性樹脂組合物較佳為包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、與具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B),且上述硬化性低聚物(A)及上述低分子量聚合性化合物(B)中之任一者或兩者具有羥基。 The curable resin composition preferably contains a curable oligomer (A) having an addition polymerizable unsaturated double bond and a low molecular weight polymerizable compound (B) having an addition polymerizable unsaturated double bond, and Either or both of the curable oligomer (A) and the low molecular weight polymerizable compound (B) have a hydroxyl group.

上述硬化性低聚物(A)及上述低分子量聚合性化合物(B)中之任一者或兩者亦可具有胺基甲酸酯鍵。 Either or both of the curable oligomer (A) and the low molecular weight polymerizable compound (B) may have a urethane bond.

上述硬化性樹脂組合物較佳包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B)、及不具有加成聚合性不飽和雙鍵之非硬化性低聚物(C),且上述硬化性低聚物(A)、上述低分子量聚合性化合物(B)及上述非硬化性低聚物(C)中之至少一者具有羥基。上述硬化性低聚物(A)、上述低 分子量聚合性化合物(B)及上述非硬化性低聚物(C)中之至少一者亦可具有胺基甲酸酯鍵。 The curable resin composition preferably contains a curable oligomer (A) having an addition polymerizable unsaturated double bond, a low molecular weight polymerizable compound (B) having an addition polymerizable unsaturated double bond, and does not have a non-curable oligomer (C) having a polymerizable unsaturated double bond, and the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C) At least one of them has a hydroxyl group. The above curable oligomer (A), the above low At least one of the molecular weight polymerizable compound (B) and the non-curable oligomer (C) may have a urethane bond.

本發明之附保護膜之黏著片具有本發明之黏著片、與覆蓋上述黏著片之至少一表面之可剝離之保護膜。 The adhesive sheet with a protective film of the present invention has the adhesive sheet of the present invention and a peelable protective film covering at least one surface of the adhesive sheet.

根據本發明之附黏著層之透明面材,將被貼合物與透明面材經由黏著層而貼合時,殘留於被貼合物與黏著層之界面之氣泡可迅速地消失。 According to the transparent surface material with an adhesive layer of the present invention, when the adherend and the transparent surface material are bonded via the adhesive layer, the bubbles remaining at the interface between the adherend and the adhesive layer can be quickly disappeared.

根據本發明之附黏著層之透明面材之製造方法,可製造將被貼合物與透明面材經由黏著層而貼合時,殘留於被貼合物與黏著層之界面之氣泡可迅速地消失的附黏著層之透明面材。 According to the method for producing a transparent surface material with an adhesive layer according to the present invention, when the adhesive composition and the transparent surface material are bonded together via the adhesive layer, the bubbles remaining at the interface between the adhesive composition and the adhesive layer can be quickly formed. The disappearing transparent surface material with adhesive layer.

本發明之顯示裝置成為可抑制氣泡殘留於顯示面板與黏著層之界面者。 The display device of the present invention is capable of suppressing air bubbles from remaining on the interface between the display panel and the adhesive layer.

根據本發明之顯示裝置之製造方法,可生產性良好地製造可抑制氣泡殘留於顯示面板與黏著層之界面的顯示裝置。 According to the method of manufacturing a display device of the present invention, a display device capable of suppressing the remaining bubbles at the interface between the display panel and the adhesive layer can be produced with good productivity.

根據本發明之黏著片,將黏著片貼合於被貼合物時,殘留於被貼合物與黏著片之界面之氣泡可迅速地消失。 According to the adhesive sheet of the present invention, when the adhesive sheet is attached to the adherend, the bubbles remaining at the interface between the adhesive and the adhesive sheet can be quickly disappeared.

1‧‧‧附黏著層之透明面材 1‧‧‧Transparent surface material with adhesive layer

2‧‧‧附黏著層之透明面材 2‧‧‧Transparent surface material with adhesive layer

3‧‧‧顯示裝置 3‧‧‧Display device

10‧‧‧透明面材 10‧‧‧Transparent surface material

12‧‧‧遮光印刷部 12‧‧‧Lighting Printing Department

14‧‧‧黏著層 14‧‧‧Adhesive layer

15‧‧‧堰 15‧‧‧堰

16‧‧‧保護膜 16‧‧‧Protective film

18‧‧‧第一組合物 18‧‧‧First composition

20‧‧‧部分硬化物之層 20‧‧‧layer of partially hardened

22‧‧‧未硬化之堰 22‧‧‧Unhardened

24‧‧‧區域 24‧‧‧Area

26‧‧‧第一組合物 26‧‧‧First composition

28‧‧‧下壓盤 28‧‧‧Unloading plate

30‧‧‧分注器 30‧‧‧ Dispenser

32‧‧‧進給螺桿 32‧‧‧feed screw

34‧‧‧進給螺桿 34‧‧‧feed screw

36‧‧‧支持面材 36‧‧‧Support surface material

38‧‧‧減壓裝置 38‧‧‧Reducing device

40‧‧‧吸附墊 40‧‧‧Adsorption pad

42‧‧‧上壓盤 42‧‧‧Upper platen

44‧‧‧下壓盤 44‧‧‧Unloading plate

46‧‧‧氣缸 46‧‧‧ cylinder

48‧‧‧真空泵 48‧‧‧vacuum pump

50‧‧‧顯示面板 50‧‧‧ display panel

52‧‧‧透明基板 52‧‧‧Transparent substrate

54‧‧‧透明基板 54‧‧‧Transparent substrate

56‧‧‧液晶層 56‧‧‧Liquid layer

58‧‧‧偏光板 58‧‧‧Polar plate

60‧‧‧軟性印刷佈線板 60‧‧‧Soft printed wiring board

62‧‧‧模嘴塗佈機 62‧‧‧Mouth coating machine

64‧‧‧LED光源 64‧‧‧LED light source

M1、M2‧‧‧氣泡 M1, M2‧‧‧ bubbles

圖1係表示本發明之附黏著層之透明面材之第1實施形態的剖面圖。 Fig. 1 is a cross-sectional view showing a first embodiment of a transparent surface material with an adhesive layer of the present invention.

圖2係表示本發明之附黏著層之透明面材之第2實施形態的剖面圖。 Fig. 2 is a cross-sectional view showing a second embodiment of the transparent surface material with an adhesive layer of the present invention.

圖3係對第1實施形態之附黏著層之透明面材之製造中的步驟(α1)進行說明之俯視圖。 Fig. 3 is a plan view for explaining a step (α1) in the production of the transparent surface material with an adhesive layer according to the first embodiment.

圖4係對第1實施形態之附黏著層之透明面材之製造中的步驟(α1)進行說明之剖面圖。 Fig. 4 is a cross-sectional view for explaining the step (α1) in the production of the transparent surface material with the adhesive layer of the first embodiment.

圖5係對第1實施形態之附黏著層之透明面材之製造中的步驟(β1)進行說明之剖面圖。 Fig. 5 is a cross-sectional view for explaining a step (β1) in the production of the transparent surface material with an adhesive layer according to the first embodiment.

圖6係對第2實施形態之附黏著層之透明面材之製造中的步驟(α21)進行說明之俯視圖。 Fig. 6 is a plan view for explaining a step (α21) in the production of the transparent surface material with an adhesive layer according to the second embodiment.

圖7係對第2實施形態之附黏著層之透明面材之製造中的步驟(α21)進行說明之剖面圖。 Fig. 7 is a cross-sectional view for explaining a step (α21) in the production of the transparent surface material with an adhesive layer according to the second embodiment.

圖8係對第2實施形態之附黏著層之透明面材之製造中的步驟(α22)進行說明之俯視圖。 Fig. 8 is a plan view for explaining a step (α22) in the production of the transparent surface material with an adhesive layer according to the second embodiment.

圖9係對第2實施形態之附黏著層之透明面材之製造中的步驟(α22)進行說明之剖面圖。 Fig. 9 is a cross-sectional view for explaining a step (α22) in the production of the transparent surface material with an adhesive layer according to the second embodiment.

圖10係對第2實施形態之附黏著層之透明面材之製造中的步驟(β2)進行說明之剖面圖。 Fig. 10 is a cross-sectional view for explaining a step (β2) in the production of the transparent surface material with an adhesive layer according to the second embodiment.

圖11係表示本發明之顯示裝置之一例之剖面圖。 Figure 11 is a cross-sectional view showing an example of a display device of the present invention.

圖12係表示將透明面材與顯示面板經由黏著層而貼合時之顯示面板與黏著層之界面中的氣泡情況之立體圖。 Fig. 12 is a perspective view showing the state of air bubbles in the interface between the display panel and the adhesive layer when the transparent surface material and the display panel are bonded via the adhesive layer.

圖13係表示例1~3中之黏著層中之羥基濃度與消泡時間的關係之圖表。 Fig. 13 is a graph showing the relationship between the concentration of hydroxyl groups in the adhesive layer in Examples 1 to 3 and the defoaming time.

圖14係表示例1~3中之黏著層中之羥基濃度及胺基甲酸酯鍵濃度之合計與消泡時間的關係之圖表。 Fig. 14 is a graph showing the relationship between the total of the hydroxyl group concentration and the urethane bond concentration in the adhesive layer in Examples 1 to 3 and the defoaming time.

圖15係表示例4~6中之黏著層中之羥基濃度與消泡時間之關係的圖表。 Fig. 15 is a graph showing the relationship between the concentration of the hydroxyl group in the adhesive layer in Examples 4 to 6 and the defoaming time.

圖16係表示例4~6中之黏著層中之羥基濃度及胺基甲酸酯鍵濃度之合計與消泡時間的關係之圖表。 Fig. 16 is a graph showing the relationship between the total of the hydroxyl group concentration and the urethane bond concentration in the adhesive layer in Examples 4 to 6 and the defoaming time.

以下用語之定義係應用於整個本說明書及申請專利範圍。 The following terms are used throughout this specification and the scope of the patent application.

透明面材中之所謂「透明」,意指如下樣態,即將面材與顯示面 板之顯示面經由黏著層以沒有氣泡及/或空隙之方式貼合後,顯示面板之顯示圖像之整體或一部分未遭受光學變形而通過面材可視認。因此,只要即便自顯示面板向面材入射之光之一部分被面材吸收、反射,或者由於光學相位之變化等而面材之可見光線透過率較低,亦可通過面材而視認沒有光學變形之顯示面板之顯示圖像,則可稱為「透明」。 The so-called "transparent" in transparent surface material means the following pattern, that is, the surface material and the display surface. After the display surface of the panel is bonded via the adhesive layer without air bubbles and/or voids, the entire or a part of the display image of the display panel is not visually deformed by optical deformation. Therefore, even if a part of the light incident from the display panel to the face material is absorbed or reflected by the face material, or the visible light transmittance of the face material is low due to a change in optical phase or the like, the optical component can be visually recognized by the face material. The display image of the display panel can be referred to as "transparent".

所謂「液狀之硬化性樹脂組合物」,意指硬化性樹脂組合物於不包含溶劑之狀態下為液狀。 The "liquid curable resin composition" means that the curable resin composition is in a liquid state without containing a solvent.

所謂「硬化性樹脂組合物之硬化物」,意指使硬化性樹脂組合物硬化直至35℃下之儲存剪切模數成為目標之黏著層於35℃下之儲存剪切模數者。 The "cured material of the curable resin composition" means a case where the curable resin composition is cured until the storage shear modulus at 35 ° C is the target of the storage layer at 35 ° C.

所謂「部分硬化物」,意指使硬化性樹脂組合物硬化直至35℃下之儲存剪切模數成為目標之黏著層於35℃下之儲存剪切模數之1/200~1/5者。 The term "partially cured product" means a case where the curable resin composition is cured until the storage shear modulus at 35 ° C is 1 / 200 to 1 / 5 of the storage shear modulus of the adhesive layer at 35 ° C.

所謂「低聚物」,意指具有包含重複結構單元(氧伸烷基單元、二烯單元等)之分子鏈之化合物,且數量平均分子量為1,000~100,000者。 The "oligomer" means a compound having a molecular chain containing a repeating structural unit (oxyalkylene unit, diene unit, etc.) and having a number average molecular weight of 1,000 to 100,000.

所謂「低分子量聚合性化合物」,意指具有加成聚合性不飽和雙鍵之分子量為600以下之化合物。 The "low molecular weight polymerizable compound" means a compound having an addition polymerizable unsaturated double bond having a molecular weight of 600 or less.

所謂「(甲基)丙烯酸酯」,意指丙烯酸酯或甲基丙烯酸酯。 The term "(meth) acrylate" means acrylate or methacrylate.

「黏度」係25℃下使用E型黏度計而測得之值。 "Viscosity" is a value measured using an E-type viscometer at 25 °C.

「硬化性低聚物(A)之數量平均分子量」係藉由凝膠滲透層析法(以下,記載為GPC)而求出之聚苯乙烯換算之數量平均分子量。再者,於GPC中出現未反應之低分子量成分(單體等)之波峰之情形時,將該波峰除外而求出數量平均分子量。 The "number average molecular weight of the curable oligomer (A)" is a polystyrene-equivalent number average molecular weight determined by gel permeation chromatography (hereinafter referred to as GPC). In the case where a peak of an unreacted low molecular weight component (monomer or the like) occurs in GPC, the number average molecular weight is determined by excluding the peak.

「非硬化性低聚物(C1)之數量平均分子量」係利用下式,自依據 JIS K 1557-1:2007而測得之羥值A(KOH mg/g)及非硬化性低聚物(C)之1分子內之羥基數B而算出之值。 "The number average molecular weight of non-hardening oligomers (C1)" is based on the following formula. The value calculated from the hydroxyl value A (KOH mg/g) measured in JIS K 1557-1:2007 and the hydroxyl number B in one molecule of the non-curable oligomer (C).

‧非硬化性低聚物(C)之數量平均分子量=56.1×B×1000/A ‧ Non-curable oligomer (C) number average molecular weight = 56.1 × B × 1000 / A

「黏著層之溶解度參數」(以下,亦記載為SP值)係使用Fedors之計算式而算出之硬化性樹脂組合物之硬化物的溶解度參數。關於具體之算出方法,參照下述文獻。 The "solubility parameter of the adhesive layer" (hereinafter also referred to as the SP value) is a solubility parameter of the cured product of the curable resin composition calculated using the calculation formula of Fedors. For the specific calculation method, refer to the following documents.

山本秀樹著,「SP值基礎‧應用與計算方法」,股份有限公司資訊機構。 Yamamoto Hideki, "SP value basis ‧ application and calculation method", company information agency.

關於「黏著層(或堰)於35℃下之儲存剪切模數」,使用流變計(Anton Paar公司製造,模組流變計Physica MCR-301),使測定軸與透光性之定板之間隙與黏著層(或堰)之厚度相同,於該間隙配置未硬化之硬化性樹脂組合物,一面向未硬化之硬化性樹脂組合物施加硬化所必需之熱或光,一面於測定頻率:1Hz下測定硬化過程之儲存剪切模數,將形成黏著層(或堰)時之硬化條件下之測量值設為黏著層(或堰)之儲存剪切模數。 Regarding the "storage modulus of the adhesive layer (or crucible) at 35 ° C", a rheometer (manufactured by Anton Paar, module rheometer Physica MCR-301) was used to determine the measurement axis and the light transmittance. The gap between the sheets is the same as the thickness of the adhesive layer (or crucible), and the uncured curable resin composition is disposed in the gap, and heat or light necessary for hardening is applied to the uncured curable resin composition, and the measurement frequency is The storage shear modulus of the hardening process was measured at 1 Hz, and the measured value under the hardening condition when the adhesive layer (or enamel) was formed was set as the storage shear modulus of the adhesive layer (or 堰).

<附黏著層之透明面材> <Transparent surface material with adhesive layer>

本發明之附黏著層之透明面材具有透明面材、與形成於透明面材之表面之包含黏著層形成用硬化性樹脂組合物之硬化物之黏著層。黏著層可形成於透明面材之至少一表面,亦可形成於透明面材之兩面。 The transparent surface material with an adhesive layer of the present invention has a transparent surface material and an adhesive layer formed on the surface of the transparent surface material and comprising a cured product of the curable resin composition for forming an adhesive layer. The adhesive layer may be formed on at least one surface of the transparent surface material, or may be formed on both sides of the transparent surface material.

本發明之附黏著層之透明面材亦可視需要而進而具有以接觸於黏著層之周緣之狀態包圍黏著層的框狀之堰。 The transparent surface material with an adhesive layer of the present invention may have a frame-like shape that surrounds the adhesive layer in a state of being in contact with the periphery of the adhesive layer, as needed.

本發明之附黏著層之透明面材亦可視需要而進而具有覆蓋黏著層之表面之可剝離之保護膜。 The transparent surface material of the adhesive layer of the present invention may also have a peelable protective film covering the surface of the adhesive layer as needed.

(透明面材) (transparent surface material)

作為透明面材之形態,可列舉:設置於顯示面板之圖像顯示面 側(視認側)而保護顯示面板之保護板;設置於觸控面板等座標輸入裝置之被接觸側(視認側)而保護座標輸入裝置之保護板;附觸控面板之顯示裝置中之構成觸控面板部分之附透明電極之基板等。 As a form of a transparent surface material, the image display surface provided in the display panel is mentioned. Protecting the protection panel of the display panel on the side (viewing side); protecting the protection panel of the coordinate input device on the contact side (viewing side) of the coordinate input device such as the touch panel; and forming a touch in the display device with the touch panel A substrate with a transparent electrode attached to the panel portion.

作為透明面材,可列舉:玻璃板、或透明樹脂板。就對來自顯示面板之出射光或反射光之透明性較高之方面而言,當然玻璃板最佳,但就具有耐光性、低雙折射性、較高之平面精度、耐表面損傷性、較高之機械強度之方面而言,亦最佳為玻璃板。就於下述之製造過程中,使用以使光硬化性樹脂組合物硬化之光充分透過之方面而言,亦較佳為玻璃板。 As a transparent surface material, a glass plate or a transparent resin board is mentioned. In terms of high transparency to the emitted or reflected light from the display panel, the glass plate is of course the best, but has light resistance, low birefringence, high planar precision, and surface damage resistance. In terms of high mechanical strength, it is also optimal as a glass plate. In the production process described below, a glass plate is also preferred in terms of sufficiently transmitting light that hardens the photocurable resin composition.

作為玻璃板之材料,可列舉鈉鈣玻璃等玻璃材料,更加為鐵分更低,發藍較少之高透過玻璃(亦稱為白板玻璃)。為了提高安全性,亦可使用強化玻璃。尤其是使用較薄之玻璃板之情形時,較佳為使用實施過化學強化之玻璃板。作為透明樹脂板之材料,可列舉:透明性較高之樹脂材料(聚碳酸酯、聚甲基丙烯酸甲酯等)。 Examples of the material of the glass plate include a glass material such as soda lime glass, and a high-permeability glass (also referred to as white glass) having a lower iron content and less blue light. For added safety, tempered glass can also be used. Especially in the case of using a thin glass plate, it is preferred to use a glass plate which has been subjected to chemical strengthening. The material of the transparent resin sheet is a resin material (polycarbonate, polymethyl methacrylate or the like) having high transparency.

針對透明面材,為了提高與黏著層之密接性,亦可實施表面處理。作為表面處理之方法,可列舉:利用矽烷偶合劑對透明面材之表面進行處理之方法、藉由火焰燃燒器之氧化焰而形成氧化矽之薄膜之方法等。 For the transparent surface material, in order to improve the adhesion to the adhesive layer, a surface treatment can also be performed. Examples of the surface treatment method include a method of treating the surface of a transparent surface material with a decane coupling agent, a method of forming a thin film of cerium oxide by an oxidizing flame of a flame burner, and the like.

(黏著層) (adhesive layer)

黏著層係包含使液狀之黏著層形成用硬化性樹脂組合物硬化而成之透明樹脂之層。 The adhesive layer is a layer of a transparent resin obtained by curing a curable resin composition for forming a liquid adhesive layer.

黏著層中之羥基濃度為100×10-6~600×10-6mol/g,較佳為250×10-6~550×10-6mol/g,更佳為300×10-6~500×10-6mol/g。若黏著層中之羥基濃度為100×10-6mol/g以上,則黏著層與透明面材之密接性、及黏著層與被貼合物(顯示面板等)之密接性變良好。 The concentration of the hydroxyl group in the adhesive layer is 100×10 -6 to 600×10 -6 mol/g, preferably 250×10 -6 to 550×10 -6 mol/g, more preferably 300×10 -6 to 500. ×10 -6 mol/g. When the concentration of the hydroxyl group in the adhesive layer is 100 × 10 -6 mol/g or more, the adhesion between the adhesive layer and the transparent surface material, and the adhesion between the adhesive layer and the adherend (display panel or the like) become good.

尤其是若黏著層中之羥基濃度為250×10-6mol/g以上,則於附黏 著層之透明面材與被貼合物(顯示面板等)之貼合失敗之情形時,為了再利用被貼合物而自被貼合物將附黏著層之透明面材剝離時,黏著層難以凝集破壞,而黏著層之一部分難以殘留於被貼合物。於黏著層即便較少殘留於被貼合物之情形時,亦無法再利用被貼合物。 In particular, when the concentration of the hydroxyl group in the adhesive layer is 250 × 10 -6 mol/g or more, in the case where the bonding of the transparent surface material with the adhesive layer and the adherend (display panel or the like) fails, in order to reuse When the transparent surface material with the adhesive layer is peeled off from the adherend by the adhesive composition, the adhesive layer is less likely to aggregate and break, and it is difficult for one part of the adhesive layer to remain on the adherend. When the adhesive layer is less likely to remain in the adhesive composition, the applied composition cannot be reused.

若黏著層中之羥基濃度為600×10-6mol/g以下,則將附黏著層之透明面材與被貼合物貼合時,殘留於被貼合物與黏著層之界面之氣泡可迅速地消失。 When the concentration of the hydroxyl group in the adhesive layer is 600×10 -6 mol/g or less, when the transparent surface material with the adhesive layer is attached to the adherend, the bubbles remaining at the interface between the adhesive and the adhesive layer may be Disappeared quickly.

黏著層中之羥基濃度係藉由計算,自下述之硬化性低聚物(A)、低分子量聚合性化合物(B)、非硬化性低聚物(C)等第一組合物之各原料中之羥基濃度及各原料之調配比而求出。 The concentration of the hydroxyl group in the adhesive layer is calculated from the raw materials of the first composition such as the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C) described below. The concentration of the hydroxyl group in the medium and the blending ratio of each raw material were determined.

硬化性低聚物(A)及非硬化性低聚物(C)之羥基濃度係藉由計算,自合成低聚物時之原料之莫耳比而求出。低分子量聚合性化合物(B)之羥基濃度係藉由計算,自分子量及官能基數而求出。 The hydroxyl group concentration of the curable oligomer (A) and the non-curable oligomer (C) was determined by calculating the molar ratio of the raw material at the time of synthesizing the oligomer. The hydroxyl group concentration of the low molecular weight polymerizable compound (B) was determined from the molecular weight and the number of functional groups by calculation.

黏著層中之羥基濃度可藉由調整下述之硬化性低聚物(A)、低分子量聚合性化合物(B)、非硬化性低聚物(C)等第一組合物之各原料中之羥基濃度及各原料之調配比而調整為上述範圍內。 The concentration of the hydroxyl group in the adhesive layer can be adjusted in each of the raw materials of the first composition such as the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C) described below. The hydroxyl group concentration and the blending ratio of each raw material were adjusted to the above range.

黏著層中之胺基甲酸酯鍵濃度為0~150×10-6mol/g,較佳為30×10-6~95×10-6mol/g,更佳為50×10-6~90×10-6mol/g。尤其是若黏著層中之胺基甲酸酯鍵濃度為30×10-6mol/g以上,則自被貼合物將附黏著層之透明面材剝離時,黏著層難以凝集破壞,而黏著層之一部分難以殘留於被貼合物。若黏著層中之胺基甲酸酯鍵濃度為150×10-6mol/g以下,則將附黏著層之透明面材與被貼合物貼合時,殘留於被貼合物與黏著層之界面之氣泡可迅速地消失。 The concentration of the urethane bond in the adhesive layer is 0 to 150 × 10 -6 mol / g, preferably 30 × 10 -6 to 95 × 10 -6 mol / g, more preferably 50 × 10 -6 ~ 90 × 10 -6 mol / g. In particular, if the concentration of the urethane bond in the adhesive layer is 30×10 -6 mol/g or more, when the transparent surface material of the adhesive layer is peeled off from the adherend, the adhesive layer is hard to be agglomerated and destroyed, and adhered. It is difficult for a part of the layer to remain on the adherend. When the concentration of the urethane bond in the adhesive layer is 150×10 -6 mol/g or less, the transparent surface material with the adhesive layer adheres to the adherend and remains on the adhesive layer and the adhesive layer. The bubbles at the interface can disappear quickly.

再者,就氣泡之消失之方面而言,黏著層較佳為不具有胺基甲酸酯鍵者,於欲使硬化性低聚物(A)之硬化速度變快之情形時,黏著層較佳為具有胺基甲酸酯鍵者。 Further, in terms of the disappearance of the bubble, the adhesive layer preferably has no urethane bond, and when the curing rate of the curable oligomer (A) is to be made faster, the adhesive layer is more It is preferred to have a urethane bond.

黏著層中之胺基甲酸酯鍵濃度係藉由計算,自下述之硬化性低聚物(A)、低分子量聚合性化合物(B)、非硬化性低聚物(C)等第一組合物之各原料中之胺基甲酸酯鍵濃度及各原料之調配比而求出。 The concentration of the urethane bond in the adhesive layer is calculated from the following first, such as the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C). The concentration of the urethane bond in each raw material of the composition and the blending ratio of each raw material were determined.

硬化性低聚物(A)及非硬化性低聚物(C)之胺基甲酸酯鍵濃度係藉由計算,自合成低聚物時之原料之莫耳比而求出。低分子量聚合性化合物(B)之胺基甲酸酯鍵濃度係藉由計算,自分子量及官能基數而求出。 The urethane bond concentration of the curable oligomer (A) and the non-curable oligomer (C) is calculated from the molar ratio of the raw material at the time of synthesizing the oligomer. The urethane bond concentration of the low molecular weight polymerizable compound (B) is determined from the molecular weight and the number of functional groups by calculation.

黏著層中之胺基甲酸酯鍵濃度可藉由調整下述之硬化性低聚物(A)、低分子量聚合性化合物(B)、非硬化性低聚物(C)等第一組合物之各原料中之胺基甲酸酯鍵濃度及各原料之調配比而調整為上述範圍內。 The concentration of the urethane bond in the adhesive layer can be adjusted by adjusting the first composition such as the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C) described below. The concentration of the urethane bond in each raw material and the blending ratio of each raw material are adjusted to the above range.

其中,於為硬化性低聚物(A1)、低分子量聚合性化合物(B1)、非硬化性低聚物(C1)之組合之情形時,可藉由調整硬化性低聚物(A1)所包含之胺基甲酸酯鍵濃度、與各原料之調配比兩者而調整為上述範圍內。 In the case where the curable oligomer (A1), the low molecular weight polymerizable compound (B1), and the non-curable oligomer (C1) are combined, the curable oligomer (A1) can be adjusted. The concentration of the urethane bond contained and the blending ratio of each raw material are adjusted to the above range.

黏著層中之羥基濃度與黏著層中之胺基甲酸酯鍵濃度的合計較佳為100×10-6~750×10-6mol/g,更佳為250×10-6~600×10-6mol/g。若黏著層中之羥基濃度與黏著層中之胺基甲酸酯鍵濃度的合計為100×10-6mol/g以上,則硬化性低聚物(A)之硬化速度較速,且黏著層與透明面材之密接性、及黏著層與被貼合物(顯示面板等)之密接性變良好。 The concentration of the hydroxyl group in the adhesive layer and the concentration of the urethane bond in the adhesive layer are preferably 100 × 10 -6 to 750 × 10 -6 mol / g, more preferably 250 × 10 -6 to 600 × 10 -6 mol/g. If the total concentration of the hydroxyl groups in the adhesive layer and the concentration of the urethane bond in the adhesive layer are 100×10 -6 mol/g or more, the hardening oligomer (A) has a faster curing speed and an adhesive layer. The adhesion to the transparent surface material and the adhesion between the adhesive layer and the adherend (display panel, etc.) become good.

尤其是若黏著層中之羥基濃度與黏著層中之胺基甲酸酯鍵濃度之合計為250×10-6mol/g以上,則自被貼合物將附黏著層之透明面材剝離時,黏著層難以凝集破壞,而黏著層之一部分難以殘留於被貼合物。若黏著層中之羥基濃度與黏著層中之胺基甲酸酯鍵濃度之合計為600×10-6mol/g以下,則將附黏著層之透明面材與被貼合物貼合時, 殘留於被貼合物與黏著層之界面之氣泡可進一步迅速地消失。 In particular, when the total concentration of the hydroxyl groups in the adhesive layer and the concentration of the urethane bond in the adhesive layer are 250 × 10 -6 mol/g or more, the transparent surface material of the adhesive layer is peeled off from the adherend. The adhesive layer is difficult to aggregate and damage, and it is difficult for a part of the adhesive layer to remain on the adherend. When the total concentration of the hydroxyl groups in the adhesive layer and the concentration of the urethane bond in the adhesive layer are 600×10 -6 mol/g or less, when the transparent surface material with the adhesive layer is attached to the adherend, The bubbles remaining at the interface between the adherend and the adhesive layer can be further quickly disappeared.

黏著層(即黏著層形成用硬化性樹脂組合物之硬化物)之溶解度參數較佳為17.5~18.5(J/cm3)1/2,更佳為18.0~18.45(J/cm3)1/2。若溶解度參數為17.5(J/cm3)1/2以上,則黏著層與透明面材之密接性、及黏著層與被貼合物(顯示面板等)之密接性變良好。若溶解度參數為18.5(J/cm3)1/2以下,則將附黏著層之透明面材與被貼合物貼合時,殘留於被貼合物與黏著層之界面之氣泡可進一步迅速地消失。 The solubility parameter of the adhesive layer (i.e., the cured product of the curable resin composition for forming an adhesive layer) is preferably from 17.5 to 18.5 (J/cm 3 ) 1/2 , more preferably from 18.0 to 18.45 (J/cm 3 ) 1/. 2 . If the solubility parameter of 17.5 (J / cm 3) 1/2 or more, the adhesion between the adhesive layer and the transparent plate, and the adhesive layer is affixed to the compound (a display panel) The adhesiveness becomes good. When the solubility parameter is 18.5 (J/cm 3 ) 1/2 or less, when the transparent surface material with the adhesive layer is bonded to the adherend, the bubbles remaining at the interface between the adhesive and the adhesive layer can be further rapidly formed. The land disappears.

黏著層於35℃下之儲存剪切模數較佳為1×103~300×103Pa,更佳為1×103~100×103Pa,進而較佳為1×103~50×103Pa。若儲存剪切模數為1×103Pa以上,則可維持黏著層之形狀。又,即便於黏著層之厚度相對較厚之情形時,亦可以黏著層整體均勻地維持厚度,而將附黏著層之透明面材與顯示面板貼合時,於顯示面板與黏著層之界面難以產生氣泡。若儲存剪切模數為300×103Pa以下,則於與顯示面板貼合之情形時黏著層可發揮良好之密接性。 The storage shear modulus of the adhesive layer at 35 ° C is preferably from 1 × 10 3 to 300 × 10 3 Pa, more preferably from 1 × 10 3 to 100 × 10 3 Pa, and still more preferably from 1 × 10 3 to 50 ×10 3 Pa. If the storage shear modulus is 1 × 10 3 Pa or more, the shape of the adhesive layer can be maintained. Moreover, even when the thickness of the adhesive layer is relatively thick, the thickness of the adhesive layer can be uniformly maintained as a whole, and when the transparent surface material with the adhesive layer is bonded to the display panel, the interface between the display panel and the adhesive layer is difficult. Create bubbles. When the storage shear modulus is 300 × 10 3 Pa or less, the adhesive layer can exhibit good adhesion when it is bonded to the display panel.

又,構成黏著層之第一組合物之硬化物之分子移動性相對較高,因此於減壓環境下將顯示面板與附黏著層之透明面材貼合後,將其放回至大氣壓環境下時,由於氣泡內之壓力(即,減壓環境之減壓狀態之壓力)、與施加於黏著層之壓力(即,放回至大氣壓環境下時之大氣壓)之差壓而氣泡的體積變得容易減少,又,體積減少之氣泡內之氣體容易溶解於黏著層而被黏著層吸收。 Moreover, since the cured product of the first composition constituting the adhesive layer has relatively high molecular mobility, the display panel and the transparent surface material with the adhesive layer are bonded together under a reduced pressure environment, and then returned to the atmospheric pressure environment. At the time, the volume of the bubble becomes the pressure due to the pressure in the bubble (that is, the pressure in the decompressed state of the reduced pressure environment) and the pressure applied to the adhesive layer (that is, the atmospheric pressure when placed in the atmospheric pressure environment). It is easy to reduce, and the gas in the bubble whose volume is reduced is easily dissolved in the adhesive layer and absorbed by the adhesive layer.

黏著層之厚度較佳為0.03~2mm,更佳為0.1~0.8mm。若黏著層之厚度為0.03mm以上,則黏著層有效地緩衝由來自透明面材側之外力引起之衝擊等,而可保護顯示面板等。又,於顯示裝置之製造方法中,即便未超過黏著層之厚度之異物混入顯示面板與附黏著層之透明面材之間,黏著層之厚度亦不會大幅變化,而對光透過性能之影響較少。 The thickness of the adhesive layer is preferably from 0.03 to 2 mm, more preferably from 0.1 to 0.8 mm. When the thickness of the adhesive layer is 0.03 mm or more, the adhesive layer can effectively absorb the impact or the like caused by a force from the side of the transparent surface material, and can protect the display panel or the like. Further, in the method of manufacturing a display device, even if foreign matter that does not exceed the thickness of the adhesive layer is mixed between the display panel and the transparent surface material of the adhesive layer, the thickness of the adhesive layer does not largely change, and the light transmission property is affected. less.

若黏著層之厚度為2mm以下,則氣泡難以殘留於黏著層,又,顯示裝置之整體之厚度無需變厚。作為調整黏著層之厚度之方法,可列舉:調節供給於透明面材之表面之液狀之黏著層形成用硬化性樹脂組合物的供給量之方法、調節堰之厚度之方法等。 When the thickness of the adhesive layer is 2 mm or less, it is difficult for the bubbles to remain in the adhesive layer, and the thickness of the entire display device does not need to be thick. The method of adjusting the thickness of the adhesive layer to be applied to the surface of the transparent surface material, the method of adjusting the supply amount of the curable resin composition for forming the adhesive layer on the surface of the transparent surface material, and the method of adjusting the thickness of the crucible.

(黏著層形成用硬化性樹脂組合物) (curable resin composition for forming an adhesive layer)

黏著層形成用硬化性樹脂組合物只要為可形成黏著層者即可,並無特別限定。作為黏著層形成用硬化性樹脂組合物,就黏著層與透明面材或被貼合物之密接性、殘留於被貼合物與黏著層之界面之氣泡消失之速度的方面而言,較佳可列舉下述之第一組合物。 The curable resin composition for forming an adhesive layer is not particularly limited as long as it can form an adhesive layer. The curable resin composition for forming an adhesive layer is preferably in terms of the adhesion between the adhesive layer and the transparent face material or the adherend, and the speed at which the bubbles remaining at the interface between the adherend and the adhesive layer disappear. The following first composition can be mentioned.

(第一組合物) (first composition)

第一組合物係包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B)、及視需要之不具有加成聚合性不飽和雙鍵之非硬化性低聚物(C)者。 The first composition contains a curable oligomer (A) having an addition polymerizable unsaturated double bond, a low molecular weight polymerizable compound (B) having an addition polymerizable unsaturated double bond, and optionally having no A non-curable oligomer (C) having a polymerizable unsaturated double bond added thereto.

於不包含非硬化性低聚物(C)之情形時,硬化性低聚物(A)及低分子量聚合性化合物(B)中之任一者或兩者具有羥基。硬化性低聚物(A)及低分子量聚合性化合物(B)中之任一者或兩者亦可具有胺基甲酸酯鍵。 When the non-curable oligomer (C) is not contained, either or both of the curable oligomer (A) and the low molecular weight polymerizable compound (B) have a hydroxyl group. Either or both of the curable oligomer (A) and the low molecular weight polymerizable compound (B) may have a urethane bond.

於包含非硬化性低聚物(C)之情形時,硬化性低聚物(A)、低分子量聚合性化合物(B)及非硬化性低聚物(C)中之至少一者具有羥基。硬化性低聚物(A)、低分子量聚合性化合物(B)及非硬化性低聚物(C)中之至少一者亦可具有胺基甲酸酯鍵。 When the non-curable oligomer (C) is contained, at least one of the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C) has a hydroxyl group. At least one of the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C) may have a urethane bond.

第一組合物可為光硬化性樹脂組合物,亦可為熱硬化性樹脂組合物。作為第一組合物,就可於低溫下硬化,且硬化速度較快之方面而言,較佳為進而調配有光聚合起始劑(D)之光硬化性樹脂組合物。又,若第一組合物為光硬化性樹脂組合物,則硬化無需較高之溫度,因此由高溫引起之顯示面板等之損傷之虞亦較少。 The first composition may be a photocurable resin composition or a thermosetting resin composition. The first composition is preferably a photocurable resin composition which is further cured with a photopolymerization initiator (D) in terms of being cured at a low temperature and having a high curing rate. Further, when the first composition is a photocurable resin composition, the curing does not require a high temperature, and thus the damage of the display panel or the like due to the high temperature is also small.

於第一組合物中,亦可視需要而調配添加劑。 In the first composition, additives may also be formulated as needed.

關於硬化性低聚物(A): About the curable oligomer (A):

作為硬化性低聚物(A)之加成聚合性不飽和雙鍵,就第一組合物之硬化性之方面而言,較佳為丙烯醯氧基或甲基丙烯醯氧基,尤佳為丙烯醯氧基。 The addition polymerizable unsaturated double bond of the curable oligomer (A) is preferably an acryloxy group or a methacryloxy group in terms of the hardenability of the first composition, and particularly preferably Acryloxy.

硬化性低聚物(A)之黏度較佳為1~800Pa‧s,更佳為2~600Pa‧s。若硬化性低聚物(A)之黏度為上述範圍內,則容易將第一組合物之黏度調整為下述之範圍。 The viscosity of the curable oligomer (A) is preferably from 1 to 800 Pa s, more preferably from 2 to 600 Pa s. When the viscosity of the curable oligomer (A) is within the above range, the viscosity of the first composition is easily adjusted to the following range.

硬化性低聚物(A)可單獨使用1種,亦可併用2種以上。 The curable oligomer (A) may be used alone or in combination of two or more.

作為硬化性低聚物(A),就第一組合物之硬化性及黏著層之機械特性之方面而言,較佳為調配有數量平均分子量為1,000~100,000,且加成聚合性不飽和雙鍵之平均數為1.8~4之硬化性低聚物(A1)者。 As the curable oligomer (A), in terms of the hardenability of the first composition and the mechanical properties of the adhesive layer, it is preferred to formulate a number average molecular weight of 1,000 to 100,000, and addition polymerization unsaturated double The average number of bonds is 1.8 to 4 of the curable oligomer (A1).

作為硬化性低聚物(A),就殘留於被貼合物與黏著層之界面之氣泡可進一步迅速地消失之方面及抑制顯示裝置之顯示不均的方面而言,較佳為調配有數量平均分子量為1,000~20,000,且加成聚合性不飽和雙鍵之平均數為0.5~1之硬化性低聚物(A2)者。 The curable oligomer (A) is preferably formulated in such a manner that the bubbles remaining at the interface between the adherend and the adhesive layer can be further quickly disappeared and the display unevenness of the display device is suppressed. A curable oligomer (A2) having an average molecular weight of 1,000 to 20,000 and an average of addition polymerizable unsaturated double bonds of 0.5 to 1.

作為硬化性低聚物(A),更佳為調配有硬化性低聚物(A1)與硬化性低聚物(A2)者。 As the curable oligomer (A), a curable oligomer (A1) and a curable oligomer (A2) are more preferably formulated.

硬化性低聚物(A1): Hardening oligomer (A1):

硬化性低聚物(A1)之數量平均分子量為1,000~100,000,較佳為10,000~80,000。若硬化性低聚物(A1)之數量平均分子量為上述範圍內,則容易將第一組合物之黏度調整為下述之範圍,而容易形成顯示不均得到抑制之黏著層。 The curable oligomer (A1) has a number average molecular weight of 1,000 to 100,000, preferably 10,000 to 80,000. When the number average molecular weight of the curable oligomer (A1) is within the above range, it is easy to adjust the viscosity of the first composition to the following range, and it is easy to form an adhesive layer in which display unevenness is suppressed.

關於硬化性低聚物(A1)之加成聚合性不飽和雙鍵之平均數,就第一組合物之硬化性及黏著層之機械特性之方面而言,為1.8~4,較佳為1.8~3。 The average number of addition polymerizable unsaturated double bonds of the curable oligomer (A1) is from 1.8 to 4, preferably 1.8, in terms of the hardenability of the first composition and the mechanical properties of the adhesive layer. ~3.

作為硬化性低聚物(A1),通常較佳為一分子中加成聚合性不飽和雙鍵之數為2~4者,但有於製造硬化性低聚物(A1)時,產生加成聚合性不飽和雙鍵之數未達2之副產物之情況。因此,作為亦包含副產物者,硬化性低聚物(A1)之加成聚合性不飽和雙鍵之平均數係設為1.8~4。 As the curable oligomer (A1), it is usually preferred that the number of addition polymerizable unsaturated double bonds in one molecule is 2 to 4, but when the curable oligomer (A1) is produced, an addition is produced. The case where the number of polymerizable unsaturated double bonds is less than 2 by-products. Therefore, the average number of addition polymerizable unsaturated double bonds of the curable oligomer (A1) is set to 1.8 to 4 as a by-product.

作為硬化性低聚物(A1),就柔軟性、耐濕熱性之方面而言,較佳為具有聚氧伸烷基鏈或聚二烯鏈者,更佳為具有聚氧伸烷基鏈者。 The curable oligomer (A1) is preferably a polyoxyalkylene chain or a polydiene chain, and more preferably a polyoxyalkylene chain, in terms of flexibility and heat and humidity resistance. .

作為具有聚二烯鏈之硬化性低聚物(A1),可列舉:聚異戊二烯聚合物之順丁烯二酸酐加成物與甲基丙烯酸2-羥基乙酯之酯化物(Kuraray公司製造,UC102(數量平均分子量:17,000,加成聚合性不飽和雙鍵之平均數:2)、UC203(數量平均分子量:35,000,加成聚合性不飽和雙鍵之平均數:3)、UC-1(數量平均分子量:約25,000))、聚丁二烯骨架之(甲基)丙烯酸酯系低聚物等。 Examples of the curable oligomer (A1) having a polydiene chain include an ester of a maleic anhydride adduct of a polyisoprene polymer and 2-hydroxyethyl methacrylate (Kuraray Co., Ltd.) Manufactured, UC102 (number average molecular weight: 17,000, average of addition polymerizable unsaturated double bonds: 2), UC203 (number average molecular weight: 35,000, average of addition polymerizable unsaturated double bonds: 3), UC- 1 (number average molecular weight: about 25,000)), a (meth) acrylate type oligomer of a polybutadiene skeleton, or the like.

硬化性低聚物(A1)可單獨使用1種,亦可併用2種以上。 The curable oligomer (A1) may be used alone or in combination of two or more.

作為硬化性低聚物(A1),就柔軟性之方面而言,尤佳為下述之硬化性低聚物(A11)或硬化性低聚物(A12)。關於硬化性低聚物(A12)如下敘述。 The curable oligomer (A1) is preferably a curable oligomer (A11) or a curable oligomer (A12) described below in terms of flexibility. The curable oligomer (A12) is as follows.

硬化性低聚物(A11):使多元醇與聚異氰酸酯反應而獲得於末端具有異氰酸酯基之預聚物後,使該預聚物之異氰酸酯基與下述單體(a1)反應而獲得之丙烯酸胺基甲酸酯低聚物。 Curable oligomer (A11): Acrylic acid obtained by reacting a polyol with a polyisocyanate to obtain a prepolymer having an isocyanate group at the terminal, and reacting the isocyanate group of the prepolymer with the following monomer (a1) A urethane oligomer.

單體(a1):分子量為125~600,且具有1個以上之丙烯醯氧基,並且具有1個與異氰酸酯基反應之基之單體。 Monomer (a1): a monomer having a molecular weight of from 125 to 600 and having one or more acryloxy groups and having one reactive group with an isocyanate group.

作為單體(a1),可列舉:具有活性氫之基(羥基、胺基等)及具有丙烯醯氧基之單體。 Examples of the monomer (a1) include a group having an active hydrogen (hydroxy group, an amine group, etc.) and a monomer having an acryloxy group.

作為單體(a1)之具體例,可列舉:具有碳數2~6之羥基烷基之丙烯酸羥基烷基酯(丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、丙烯酸2-羥 基丁酯、丙烯酸4-羥基丁酯等)等。 Specific examples of the monomer (a1) include a hydroxyalkyl acrylate having a hydroxyalkyl group having 2 to 6 carbon atoms (2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxy acrylate). Butyl ester, 4-hydroxybutyl acrylate, etc.).

作為單體(a1),較佳為具有碳數2~4之羥基烷基之丙烯酸羥基烷基酯。 The monomer (a1) is preferably a hydroxyalkyl acrylate having a hydroxyalkyl group having 2 to 4 carbon atoms.

單體(a1)可單獨使用1種,亦可併用2種以上。 The monomer (a1) may be used alone or in combination of two or more.

作為多元醇之具體例,可列舉:聚氧伸烷基多元醇(聚氧乙二醇、聚氧丙烯多元醇等)、聚酯多元醇、聚碳酸酯多元醇等。作為多元醇,就柔軟性之方面而言,較佳為聚氧伸烷基多元醇,更佳為聚氧丙烯多元醇。 Specific examples of the polyhydric alcohol include polyoxyalkylene polyols (polyoxyethylene glycol, polyoxypropylene polyol, etc.), polyester polyols, and polycarbonate polyols. As the polyol, from the viewpoint of flexibility, a polyoxyalkylene polyol is preferable, and a polyoxypropylene polyol is more preferable.

又,就提高第一組合物與其他成分之相溶性之方面而言,進而較佳為具有氧伸丙基及氧伸乙基之聚氧伸烷基多元醇。又,就於低溫區域中亦容易獲得柔軟性較高之硬化物之方面而言,尤佳為具有僅包含氧伸乙基及氧伸丙基之聚氧伸烷基鏈之聚氧伸烷基多元醇。 Further, in terms of improving the compatibility of the first composition with other components, a polyoxyalkylene polyol having an oxygen-extended propyl group and an oxygen-extended ethyl group is further preferred. Further, in terms of easily obtaining a cured product having high flexibility in a low temperature region, it is particularly preferred to have a polyoxyalkylene group having a polyoxyalkylene chain containing only an oxygen-extended ethyl group and an oxygen-extended propyl group. Polyol.

關於多元醇之數量平均分子量,就使第一組合物中之胺基甲酸酯鍵濃度變低之方面而言,較佳為4,000以上,更佳為8,000以上。關於多元醇之數量平均分子量,就容易使第一組合物之黏度為下述範圍之方面而言,較佳為45,000以下,更佳為35,000以下。 The number average molecular weight of the polyol is preferably 4,000 or more, and more preferably 8,000 or more in terms of lowering the concentration of the urethane bond in the first composition. The number average molecular weight of the polyol is preferably 45,000 or less, and more preferably 35,000 or less, from the viewpoint that the viscosity of the first composition is in the following range.

多元醇可單獨使用1種,亦可併用2種以上。 The polyol may be used alone or in combination of two or more.

作為聚異氰酸酯,較佳為選自由脂肪族二異氰酸酯、脂環式二異氰酸酯及無黃變性芳香族二異氰酸酯所組成之群中之至少1種之二異氰酸酯。 The polyisocyanate is preferably at least one diisocyanate selected from the group consisting of aliphatic diisocyanates, alicyclic diisocyanates, and non-yellowing aromatic diisocyanates.

作為脂肪族聚異氰酸酯,可列舉:六亞甲基二異氰酸酯、2,2,4-三甲基-六亞甲基二異氰酸酯、2,4,4-三甲基-六亞甲基二異氰酸酯等。 Examples of the aliphatic polyisocyanate include hexamethylene diisocyanate, 2,2,4-trimethyl-hexamethylene diisocyanate, and 2,4,4-trimethyl-hexamethylene diisocyanate. .

作為脂環式聚異氰酸酯,可列舉:異佛爾酮二異氰酸酯、亞甲基雙(異氰酸4-環己酯)等。 Examples of the alicyclic polyisocyanate include isophorone diisocyanate and methylene bis(4-cyclohexyl isocyanate).

作為無黃變性芳香族二異氰酸酯,可列舉:苯二甲基二異氰酸 酯等。 As the non-yellowing aromatic diisocyanate, benzodimethyl diisocyanate may be mentioned. Ester and the like.

聚異氰酸酯可單獨使用1種,亦可併用2種以上。 The polyisocyanate may be used alone or in combination of two or more.

於多元醇、與聚異氰酸酯之反應中,異氰酸酯基之莫耳數與羥基之莫耳數之比(異氰酸酯基/羥基)較佳為1/1以上且1.8/1以下,更佳為1.05/1以上且1.5/1以下。若異氰酸酯基/羥基為上述範圍內,則容易將第一組合物之黏度調整為下述之範圍。 In the reaction of a polyol and a polyisocyanate, the ratio of the number of moles of the isocyanate group to the number of moles of the hydroxyl group (isocyanate group / hydroxyl group) is preferably 1/1 or more and 1.8/1 or less, more preferably 1.05/1. Above and below 1.5/1. When the isocyanate group/hydroxy group is in the above range, the viscosity of the first composition is easily adjusted to the following range.

作為將硬化性低聚物(A11)之加成聚合性不飽和雙鍵之平均數調整為1.8~4之方法,可列舉:調整硬化性低聚物(A11)之製造所使用之原料之調配比的方法,例如可列舉:下述之(i)(ii)之方法。 The method of adjusting the average number of the addition polymerizable unsaturated double bonds of the curable oligomer (A11) to 1.8 to 4 is to adjust the blending of the raw materials used for the production of the curable oligomer (A11). The method of the ratio can be exemplified by the following methods (i) and (ii).

(i)於加成聚合性不飽和雙鍵之平均數為1.8~2之硬化性低聚物(A11)之情形時: (i) When the addition of the polymerizable unsaturated double bond is an average of 1.8 to 2 of the curable oligomer (A11):

為如下方法:使羥基之平均數為1.8~2之多元醇、與異氰酸酯基之平均數為2之聚異氰酸酯反應,而獲得異氰酸酯基之平均數為1.8~2之預聚物後,使之與1分子中具有加成聚合性不飽和雙鍵及羥基各1個之單體(a11)以異氰酸酯基/羥基之莫耳數比成為1/1的方式反應。 The method is as follows: a polyol having an average number of hydroxyl groups of 1.8 to 2 and a polyisocyanate having an average number of isocyanate groups of 2 are obtained, and a prepolymer having an average number of isocyanate groups of 1.8 to 2 is obtained, and then The monomer (a11) having an addition polymerizable unsaturated double bond and one hydroxyl group in one molecule is reacted so that the isocyanate group/hydroxyl molar ratio becomes 1/1.

(ii)於加成聚合性不飽和雙鍵之平均數為2~4之硬化性低聚物(A11)之情形時: (ii) When the addition of the polymerizable unsaturated double bond is 2 to 4 in the case of the curable oligomer (A11):

為如下方法:使羥基之平均數為2之多元醇、與異氰酸酯基之平均數為2之聚異氰酸酯反應,而獲得異氰酸酯基之平均數為2之預聚物後,使之與1分子中具有1個羥基,且具有1個以上之加成聚合性不飽和雙鍵之單體(a12)以異氰酸酯基/羥基之莫耳數比成為1/1且加成聚合性不飽和雙鍵之平均數成為2~4的方式反應。 In the following method, a polyol having an average number of hydroxyl groups of 2 and a polyisocyanate having an average number of isocyanate groups of 2 are reacted to obtain a prepolymer having an average number of isocyanate groups of 2, and then having 1 molecule; The monomer (a12) having one hydroxyl group and having one or more addition polymerizable unsaturated double bonds is 1/1 of the isocyanate group/hydroxyl molar ratio and the average number of addition polymerizable unsaturated double bonds Become a 2~4 way of reaction.

硬化性低聚物(A12)係下述之低聚物。 The curable oligomer (A12) is an oligomer described below.

硬化性低聚物(A12):使多元醇、與具有異氰酸酯基及加成聚合性雙鍵各1個之化合物反應而獲得之丙烯酸胺基甲酸酯低聚物。 The curable oligomer (A12): an urethane urethane oligomer obtained by reacting a polyol with a compound having one of an isocyanate group and an addition polymerizable double bond.

作為多元醇,可使用與硬化性低聚物(A11)之製造所使用者相同 者。 As the polyol, it can be used in the same manner as the user of the curable oligomer (A11). By.

作為具有異氰酸酯基及加成聚合性雙鍵各1個之化合物,例如尤佳為CH2=C(R)C(O)O-R1-NCO所表示之化合物(其中,R為氫原子或甲基,R1為碳數1~6之伸烷基)。作為此種化合物,可列舉:Karenz MOI(註冊商標)(昭和電工公司製造,R為甲基,R1之碳數為2)、Karenz AOI(註冊商標)(昭和電工公司製造,R為氫原子,R1之碳數為2)等。 As a compound having one of an isocyanate group and an addition polymerizable double bond, for example, a compound represented by CH 2 =C(R)C(O)OR 1 -NCO (wherein R is a hydrogen atom or a methyl group) is preferable. , R 1 is an alkylene group having 1 to 6 carbon atoms). As such a compound, Karenz MOI (registered trademark) (manufactured by Showa Denko Co., Ltd., R is a methyl group, the carbon number of R 1 is 2), Karenz AOI (registered trademark) (manufactured by Showa Denko, R is a hydrogen atom) , the carbon number of R 1 is 2) and the like.

硬化性低聚物(A2): Hardening oligomer (A2):

硬化性低聚物(A2)之數量平均分子量為1,000~20,000,較佳為2,000~10,000。若硬化性低聚物(A2)之數量平均分子量為該範圍,則容易形成容易將第一組合物之黏度調整為下述範圍之黏著層。 The curable oligomer (A2) has a number average molecular weight of 1,000 to 20,000, preferably 2,000 to 10,000. When the number average molecular weight of the curable oligomer (A2) is in this range, it is easy to form an adhesive layer which is easy to adjust the viscosity of the first composition to the following range.

藉由硬化性低聚物(A)包含硬化性低聚物(A2),而容易將第一組合物之黏度調整為下述之範圍。硬化性低聚物(A2)實質上不具有羥基,因此不會對氣泡之消失性造成不良影響,而可調整第一組合物之黏度。 When the curable oligomer (A) contains the curable oligomer (A2), the viscosity of the first composition can be easily adjusted to the following range. Since the curable oligomer (A2) does not substantially have a hydroxyl group, it does not adversely affect the disappearance of the bubble, and the viscosity of the first composition can be adjusted.

作為硬化性低聚物(A2)所具有之加成聚合性不飽和雙鍵,可列舉丙烯醯氧基、甲基丙烯醯氧基等。作為硬化性低聚物(A2)之加成聚合性不飽和雙鍵,就硬化速度較快之方面及形成透明性較高之黏著層之方面而言,較佳為丙烯醯氧基或甲基丙烯醯氧基,就硬化性低聚物(A2)與低分子量聚合性化合物(B)之加成聚合性不飽和雙鍵之反應性之差變小,而形成均質之黏著層之方面而言,尤佳為丙烯醯氧基。 Examples of the addition polymerizable unsaturated double bond of the curable oligomer (A2) include an acryloxy group and a methacryloxy group. The addition polymerizable unsaturated double bond of the curable oligomer (A2) is preferably an acryloxy group or a methyl group in terms of a faster curing rate and an adhesive layer having a higher transparency. The propylene oxime group has a small difference in reactivity between the curable oligomer (A2) and the addition polymerizable unsaturated double bond of the low molecular weight polymerizable compound (B), and forms a homogeneous adhesive layer. Especially preferred is propylene oxime.

關於硬化性低聚物(A2)之加成聚合性不飽和雙鍵之平均數,就第一組合物之硬化性及黏著層之機械特性之方面而言,為0.5~1,較佳為0.7~1。若加成聚合性不飽和雙鍵之數超過1,則成為具有交聯性之低聚物,而硬化性樹脂組合物之硬化物之儲存剪切模數變得容易提高。因此,向與黏著層貼合之顯示面板施加之應力變大,而容易出現 顯示裝置之顯示不均。 The average number of the addition polymerizable unsaturated double bonds of the curable oligomer (A2) is from 0.5 to 1, preferably 0.7, in terms of the hardenability of the first composition and the mechanical properties of the adhesive layer. ~1. When the number of addition polymerizable unsaturated double bonds exceeds 1, the crosslinkable oligomer is formed, and the storage shear modulus of the cured product of the curable resin composition is easily improved. Therefore, the stress applied to the display panel attached to the adhesive layer becomes large, and is likely to occur. The display device is unevenly displayed.

又,黏著層之流動性喪失,從而貼合時產生於黏著層與顯示面板之界面之氣泡容易殘留。因此,較佳為以不包含加成聚合性不飽和雙鍵之數超過1者之方式選擇硬化性低聚物(A2)之製造時的原料。 Further, the fluidity of the adhesive layer is lost, so that bubbles which are generated at the interface between the adhesive layer and the display panel at the time of bonding tend to remain. Therefore, it is preferred to select a raw material for production of the curable oligomer (A2) so that the number of the addition polymerizable unsaturated double bonds is not more than one.

硬化性低聚物(A2)可單獨使用1種,亦可併用2種以上。 The curable oligomer (A2) may be used alone or in combination of two or more.

作為硬化性低聚物(A2),就柔軟性之方面而言,較佳為下述之硬化性低聚物(A21)。 The curable oligomer (A2) is preferably a curable oligomer (A21) described below in terms of flexibility.

硬化性低聚物(A21):使單醇與聚異氰酸酯反應而獲得僅於一末端具有異氰酸酯基之預聚物後,使該預聚物之異氰酸酯基與單體(a1)反應而獲得之單丙烯酸胺基甲酸酯低聚物。 Curable oligomer (A21): a single obtained by reacting a monool with a polyisocyanate to obtain a prepolymer having an isocyanate group at only one end, and reacting the isocyanate group of the prepolymer with the monomer (a1) Acryl acrylate oligomer.

作為硬化性低聚物(A21)之製造所使用之單體(a1)、聚異氰酸酯,可列舉與硬化性低聚物(A11)之製造所使用者相同者,較佳之態樣亦相同。作為單醇,可列舉除羥基數外,與硬化性低聚物(A11)之製造所使用者相同者,較佳之態樣亦相同。關於單醇之較佳之羥基數,於1分子中為0.5~1個,更佳為0.7~1個。 The monomer (a1) and the polyisocyanate used for the production of the curable oligomer (A21) are the same as those of the user of the curable oligomer (A11), and the preferred embodiment is also the same. The monool may be the same as the user of the curable oligomer (A11) except for the number of hydroxyl groups, and the preferred embodiment is also the same. The number of preferred hydroxyl groups of the monool is 0.5 to 1 in a molecule, and more preferably 0.7 to 1.

作為將硬化性低聚物(A21)之加成聚合性不飽和雙鍵之平均數調整為0.5~1之方法,可列舉:調整硬化性低聚物(A21)之製造所使用之原料之調配比的方法,例如可列舉:下述之(iii)、(iv)之方法。 The method of adjusting the average number of addition polymerizable unsaturated double bonds of the curable oligomer (A21) to 0.5 to 1 is to adjust the blending of raw materials used for the production of the curable oligomer (A21). The method of the ratio is, for example, the following methods (iii) and (iv).

(iii)係如下方法:使單醇與二異氰酸酯以異氰酸酯基/羥基之莫耳數比成為1/1~2/1之比例反應,而獲得異氰酸酯基之平均數為0.5~1之預聚物後,使之與單體(a1)以異氰酸酯基/與異氰酸酯基反應之基的莫耳數比成為1/1之方式反應。 (iii) is a method in which a monool and a diisocyanate are reacted in a ratio of an isocyanate group/hydroxyl molar ratio of 1/1 to 2/1 to obtain a prepolymer having an average number of isocyanate groups of 0.5 to 1. Thereafter, it is reacted in such a manner that the molar ratio of the monomer (a1) to the isocyanate group/isocyanate group is 1/1.

(iv)係如下方法:使單醇、與1分子中具有丙烯醯氧基與異氰酸酯基各1個之化合物以異氰酸酯基/羥基之莫耳數比成為1/2~1/1的比例反應,而獲得丙烯醯氧基之平均數為0.5~1之化合物。 (iv) a method in which a monool and a compound having one each of an acryloxy group and an isocyanate group in one molecule are reacted at a ratio of a mole ratio of an isocyanate group to a hydroxyl group of 1/2 to 1/1. The compound having an average of propylene decyloxy groups of 0.5 to 1 is obtained.

關於低分子量聚合性化合物(B): Regarding the low molecular weight polymerizable compound (B):

低分子量聚合性化合物(B)之分子量為600以下,較佳為140~400。低分子量聚合性化合物(B)之分子量越小,黏著層與透明面材之密接性、及黏著層與被貼合物(顯示面板等)之密接性變得越良好。若低分子量聚合性化合物(B)之分子量為140以上,則藉由下述方法而可抑制製造附黏著層之透明面材或顯示裝置時之低分子量聚合性化合物(B)之揮發。 The molecular weight of the low molecular weight polymerizable compound (B) is 600 or less, preferably 140 to 400. The smaller the molecular weight of the low molecular weight polymerizable compound (B), the better the adhesion between the adhesive layer and the transparent surface material, and the adhesion between the adhesive layer and the adherend (display panel or the like). When the molecular weight of the low molecular weight polymerizable compound (B) is 140 or more, the volatilization of the low molecular weight polymerizable compound (B) in the production of the transparent surface material or the display device with the adhesive layer can be suppressed by the following method.

低分子量聚合性化合物(B)之加成聚合性不飽和雙鍵之數較佳為1~3,更佳為1~2。作為低分子量聚合性化合物(B),較佳為併用加成聚合性不飽和雙鍵為1個之化合物、與加成聚合性不飽和雙鍵為2個以上之化合物者。 The number of addition polymerizable unsaturated double bonds of the low molecular weight polymerizable compound (B) is preferably from 1 to 3, more preferably from 1 to 2. The low molecular weight polymerizable compound (B) is preferably one in which a compound having an addition polymerizable unsaturated double bond is used in combination, and a compound having an addition polymerizable unsaturated double bond is two or more.

作為低分子量聚合性化合物(B)之加成聚合性不飽和雙鍵,可列舉:丙烯醯氧基、甲基丙烯醯氧基等。作為低分子量聚合性化合物(B)之加成聚合性不飽和雙鍵,就硬化速度較快之方面及形成透明性較高之黏著層之方面而言,較佳為丙烯醯氧基或甲基丙烯醯氧基,就硬化速度較快之方面而言,尤佳為丙烯醯氧基。 Examples of the addition polymerizable unsaturated double bond of the low molecular weight polymerizable compound (B) include an acryloxy group and a methacryloxy group. The addition polymerizable unsaturated double bond of the low molecular weight polymerizable compound (B) is preferably an acryloxy group or a methyl group in terms of a faster curing rate and an adhesive layer having a higher transparency. The propylene oxime group is particularly preferably an acryloxy group in terms of a faster curing rate.

低分子量聚合性化合物(B)可單獨使用1種,亦可併用2種以上。 The low molecular weight polymerizable compound (B) may be used alone or in combination of two or more.

低分子量聚合性化合物(B1): Low molecular weight polymerizable compound (B1):

作為低分子量聚合性化合物(B),就黏著層與透明面材之密接性、及黏著層與被貼合物(顯示面板等)之密接性變良好之方面、及容易獲得黏著層中之下述之非硬化性低聚物(C1)之分散穩定化效果的方面而言,較佳為調配有具有加成聚合性不飽和雙鍵及鍵結於碳原子之羥基之低分子量聚合性化合物(B1)者。 As the low molecular weight polymerizable compound (B), the adhesion between the adhesive layer and the transparent surface material, the adhesion between the adhesive layer and the adherend (display panel, etc.) are improved, and the adhesive layer is easily obtained. In terms of the dispersion stabilizing effect of the non-curable oligomer (C1), it is preferred to formulate a low molecular weight polymerizable compound having an addition polymerizable unsaturated double bond and a hydroxyl group bonded to a carbon atom ( B1).

關於低分子量聚合性化合物(B1)之羥基之數,就黏著層與透明面材或被貼合物之密接性、殘留於被貼合物與黏著層之界面之氣泡之消失速度的方面而言,較佳為1或2,尤佳為1。 The number of hydroxyl groups of the low molecular weight polymerizable compound (B1) is in terms of the adhesion between the adhesive layer and the transparent face material or the adherend, and the rate of disappearance of the bubbles remaining at the interface between the adherend and the adhesive layer. Preferably, it is 1 or 2, and particularly preferably 1.

作為具有1個羥基之低分子量聚合性化合物(B1),可列舉:(甲 基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯、甲基丙烯酸6-羥基己酯、苯基縮水甘油醚丙烯酸酯等。 As the low molecular weight polymerizable compound (B1) having one hydroxyl group, (A) 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl methacrylate , phenyl glycidyl ether acrylate, and the like.

作為具有2個羥基之低分子量聚合性化合物(B1),可列舉:甘油單丙烯酸酯、丙烯酸2,3-二羥基丙酯等。 Examples of the low molecular weight polymerizable compound (B1) having two hydroxyl groups include glycerin monoacrylate and 2,3-dihydroxypropyl acrylate.

作為低分子量聚合性化合物(B1),就黏著層與透明面材或被貼合物之密接性之方面而言,較佳為具有碳數3~8之羥基烷基之甲基丙烯酸羥基烷基酯(甲基丙烯酸2-羥基丙酯、甲基丙烯酸2-羥基丁酯、甲基丙烯酸4-羥基丁酯等)或苯基縮水甘油醚丙烯酸酯,尤佳為苯基縮水甘油醚丙烯酸酯。 The low molecular weight polymerizable compound (B1) is preferably a methacrylic acid hydroxyalkyl group having a hydroxyalkyl group having 3 to 8 carbon atoms in terms of adhesion between the adhesive layer and the transparent surface material or the adherend. Ester (2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, 4-hydroxybutyl methacrylate, etc.) or phenyl glycidyl ether acrylate, more preferably phenyl glycidyl ether acrylate.

低分子量聚合性化合物(B1)可單獨使用1種,亦可併用2種以上。 The low molecular weight polymerizable compound (B1) may be used alone or in combination of two or more.

低分子量聚合性化合物(B2): Low molecular weight polymerizable compound (B2):

低分子量聚合性化合物(B)亦可為進而調配有具有加成聚合性不飽和雙鍵且不具有羥基之低分子量聚合性化合物(B2)者。 The low molecular weight polymerizable compound (B) may be a low molecular weight polymerizable compound (B2) having an addition polymerizable unsaturated double bond and having no hydroxyl group.

關於非硬化性低聚物(C): About non-hardening oligomer (C):

非硬化性低聚物(C)係第一組合物之硬化時與硬化性低聚物(A)、低分子量聚合性化合物(B)不反應者。非硬化性低聚物(C)可具有羥基,亦可不具有羥基。 The non-curable oligomer (C) is one which does not react with the curable oligomer (A) or the low molecular weight polymerizable compound (B) during curing of the first composition. The non-curable oligomer (C) may or may not have a hydroxyl group.

非硬化性低聚物(C)可單獨使用1種,亦可併用2種以上。 The non-curable oligomer (C) may be used alone or in combination of two or more.

若於第一組合物中包含非硬化性低聚物(C),則第一組合物之流動性提高,而降低黏著層之儲存剪切模數。因此,非硬化性低聚物(C)有助於縮短減壓環境下將附黏著層之透明面材與被貼合物貼合後放回至大氣壓環境下時產生於被貼合物與黏著層之界面的氣泡消失所必需之時間。 If the non-curable oligomer (C) is contained in the first composition, the fluidity of the first composition is improved, and the storage shear modulus of the adhesive layer is lowered. Therefore, the non-hardening oligomer (C) contributes to shortening of the adhesive surface and adhesion when the transparent surface material of the adhesive layer is bonded to the adherend after being placed in an atmosphere under reduced pressure. The time necessary for the bubbles at the interface of the layer to disappear.

又,非硬化性低聚物(C)可抑制於透明面材之表面塗佈第一組合物,使第一組合物硬化時施加於透明面材之應力。 Further, the non-curable oligomer (C) can suppress the stress applied to the transparent surface material when the first composition is applied to the surface of the transparent surface material and the first composition is cured.

非硬化性低聚物(C)可以少量發揮上述效果,但有如下之虞,即於具有堰之情形時,引起非硬化性低聚物(C)自黏著層向堰之擴散,因此成為由黏著層與堰之界面中之變形(例如,階差)產生引起之與被貼合物之貼合時的氣泡產生或殘留之主要原因。因此,非硬化性低聚物(C)較佳為以下述量之範圍使用。 The non-curable oligomer (C) can exhibit the above effects in a small amount, but it is caused by the fact that when the ruthenium is present, the non-curable oligomer (C) is diffused from the adhesive layer to the ruthenium, and thus The deformation (for example, the step) in the interface between the adhesive layer and the crucible causes the generation or residual of the bubble when it is bonded to the adherend. Therefore, the non-curable oligomer (C) is preferably used in the range of the following amounts.

非硬化性低聚物(C1): Non-hardening oligomer (C1):

作為非硬化性低聚物(C),就黏著層與透明面材之密接性、及黏著層與被貼合物(顯示面板等)之密接性變良好之方面而言,較佳為調配有非硬化性低聚物(C1)者。 The non-curable oligomer (C) is preferably formulated in terms of adhesion between the adhesive layer and the transparent surface material, and adhesion between the adhesive layer and the adherend (display panel or the like). Non-hardening oligomer (C1).

關於非硬化性低聚物(C1)之羥基之平均數,就相溶性、殘留於被貼合物與黏著層之界面之氣泡之消失速度的方面而言,較佳為0.8~3個,更加為1.8~2.3個。 The average number of hydroxyl groups of the non-curable oligomer (C1) is preferably 0.8 to 3 in terms of compatibility and the rate of disappearance of bubbles remaining at the interface between the adherend and the adhesive layer. It is 1.8~2.3.

非硬化性低聚物(C1)之每個羥基之數量平均分子量較佳為400~8,000,更佳為600~5,000。若每個羥基之數量平均分子量為400以上,則非硬化性低聚物(C1)之極性變得過高,而容易獲得與硬化性低聚物(A)、低分子量聚合性化合物(B)及其他非硬化性低聚物(C)之良好之相溶性。 The number average molecular weight of each of the hydroxyl groups of the non-curable oligomer (C1) is preferably from 400 to 8,000, more preferably from 600 to 5,000. When the number average molecular weight of each of the hydroxyl groups is 400 or more, the polarity of the non-curable oligomer (C1) becomes too high, and the curable oligomer (A) and the low molecular weight polymerizable compound (B) are easily obtained. Good compatibility with other non-hardening oligomers (C).

若每個羥基之數量平均分子量為8,000以下,則藉由源自低分子量聚合性化合物(B1)之羥基、與非硬化性低聚物(C1)之羥基之間之相互作用,而容易獲得硬化後之黏著層中之非硬化性低聚物(C1)之分散穩定化效果。對於該相互作用而言,推測其與氫鍵相關。 When the number average molecular weight of each of the hydroxyl groups is 8,000 or less, the hardening is easily obtained by the interaction between the hydroxyl group derived from the low molecular weight polymerizable compound (B1) and the hydroxyl group of the non-hardenable oligomer (C1). The dispersion stabilizing effect of the non-hardening oligomer (C1) in the subsequent adhesive layer. For this interaction, it is presumed to be related to hydrogen bonding.

非硬化性低聚物(C1)可單獨使用1種,亦可併用2種以上。 The non-hardening oligomer (C1) may be used alone or in combination of two or more.

作為非硬化性低聚物(C1),可列舉:高分子量之多元醇等。作為非硬化性低聚物(C1),就柔軟性、相溶性之方面而言,較佳為聚氧伸烷基多元醇、聚酯多元醇、聚碳酸酯多元醇、聚丁二烯多元醇。 Examples of the non-curable oligomer (C1) include high molecular weight polyols and the like. The non-curable oligomer (C1) is preferably a polyoxyalkylene polyol, a polyester polyol, a polycarbonate polyol, or a polybutadiene polyol in terms of flexibility and compatibility. .

又,於硬化性低聚物(A)為使用聚氧伸烷基多元醇作為原料之丙 烯酸胺基甲酸酯之情形時,作為非硬化性低聚物(C1),就相溶性變得更良好之方面而言,更佳為聚氧伸烷基多元醇。 Further, in the curable oligomer (A), a polyoxyalkylene polyol is used as a raw material. In the case of the ureic acid urethane, the non-curable oligomer (C1) is more preferably a polyoxyalkylene polyol in terms of compatibility.

作為聚氧伸烷基多元醇,可列舉:聚氧乙二醇、聚氧丙二醇、聚氧丙三醇、聚氧四亞甲基二醇等聚氧伸烷基二醇。 Examples of the polyoxyalkylene polyol include polyoxyalkylene glycols such as polyoxyethylene glycol, polyoxypropylene glycol, polyoxypropylene glycol, and polyoxytetramethylene glycol.

作為非硬化性低聚物(C1),就黏著層之儲存剪切模數容易變低之方面而言,較佳為聚氧伸烷基多元醇,尤佳為聚氧伸丙基多元醇。又,作為非硬化性低聚物(C1),亦可使用具有氧伸丙基及氧伸乙基之聚氧伸烷基多元醇。 As the non-curable oligomer (C1), a polyoxyalkylene polyol is preferable, and a polyoxyalkylene polyol is preferable in terms of the fact that the storage shear modulus of the adhesive layer is likely to be low. Further, as the non-curable oligomer (C1), a polyoxyalkylene polyol having an oxygen-extended propyl group and an oxygen-extended ethyl group can also be used.

非硬化性低聚物(C2): Non-hardening oligomer (C2):

非硬化性低聚物(C)亦可為進而調配有不具有羥基之非硬化性低聚物(C2)者。 The non-curable oligomer (C) may be further formulated with a non-curable oligomer (C2) having no hydroxyl group.

非硬化性低聚物(C2)之數量平均分子量較佳為1,000~8,000。若非硬化性低聚物(C2)之數量平均分子量為1,000以上,則非硬化性低聚物(C2)難以逸出。若非硬化性低聚物(C2)之數量平均分子量為8,000以下,則變得容易將第一組合物之黏度調整為下述範圍。 The number average molecular weight of the non-curable oligomer (C2) is preferably from 1,000 to 8,000. When the number average molecular weight of the non-curable oligomer (C2) is 1,000 or more, the non-curable oligomer (C2) hardly escapes. When the number average molecular weight of the non-curable oligomer (C2) is 8,000 or less, it becomes easy to adjust the viscosity of the first composition to the following range.

作為非硬化性低聚物(C2),可列舉:非硬化性低聚物(C1)之羥基經與丙烯醯基不具有反應性之基取代之化合物、高分子量之聚二烯等。作為聚二烯,可列舉:聚丁二烯、聚異戊二烯、聚丁二烯之氫化物、聚丁烯等。作為非硬化性低聚物(C1)之羥基經與丙烯醯基不具有反應性之基取代之化合物,可列舉:聚氧伸烷基多元醇之烷氧化物、單羧酸化物、鹵化乙醯化物、酯化物等。 Examples of the non-curable oligomer (C2) include a compound in which a hydroxyl group of the non-curable oligomer (C1) is substituted with a group which is not reactive with an acryloyl group, a polydiene having a high molecular weight, and the like. Examples of the polydiene include polybutadiene, polyisoprene, a hydrogenated product of polybutadiene, and polybutene. Examples of the compound in which the hydroxyl group of the non-curable oligomer (C1) is substituted with a group having no reactivity with the acryloyl group may, for example, be an alkoxide of a polyoxyalkylene polyol, a monocarboxylate or an oxiranide. Compounds, esterates, and the like.

關於硬化性低聚物(A)與非硬化性低聚物(C)之組合: Regarding the combination of the curable oligomer (A) and the non-curable oligomer (C):

就使硬化前之第一組合物之混合狀態穩定,且抑制非硬化性低聚物(C)自黏著層分離之方面而言,硬化性低聚物(A)及非硬化性低聚物(C)較佳為具有相同結構或類似結構之分子鏈。 The curable oligomer (A) and the non-hardening oligomer are stabilized in terms of stabilizing the mixed state of the first composition before hardening and suppressing the separation of the non-curable oligomer (C) from the adhesive layer ( C) is preferably a molecular chain having the same structure or a similar structure.

具體而言,較佳為使用具有羥基之化合物(以下,記載為含羥基 之化合物)作為硬化性低聚物(A)之原料,並且使用相同之含羥基之化合物作為非硬化性低聚物(C)。 Specifically, it is preferred to use a compound having a hydroxyl group (hereinafter, it is described as having a hydroxyl group) The compound is used as a raw material of the curable oligomer (A), and the same hydroxyl group-containing compound is used as the non-curable oligomer (C).

於第一組合物中,硬化性低聚物(A)為將聚氧伸烷基多元醇及聚異氰酸酯用於原料而合成之丙烯酸胺基甲酸酯低聚物,就相溶性之方面而言,較佳為非硬化性低聚物(C)為聚氧伸烷基多元醇。 In the first composition, the curable oligomer (A) is an urethane urethane oligomer synthesized by using a polyoxyalkylene polyol and a polyisocyanate as a raw material, in terms of compatibility. Preferably, the non-curing oligomer (C) is a polyoxyalkylene polyol.

即便於用作硬化性低聚物(A)之原料之含羥基之化合物、與用作非硬化性低聚物(C)之含羥基之化合物並不相同之情形時,彼等含羥基之化合物較佳為相互具有分子鏈具有共同之結構單元(氧伸烷基單元、二烯單元等)等部分共同之結構,且極性為相同程度。若硬化性低聚物(A)與非硬化性低聚物(C)部分具有相同之分子結構,則第一組合物中之非硬化性低聚物(C)之相溶性更為提高。 That is, when a hydroxyl group-containing compound which is convenient as a raw material of the curable oligomer (A) is not the same as a hydroxyl group-containing compound used as the non-hardenable oligomer (C), the hydroxyl group-containing compound It is preferred that the molecular chain has a structure in which a molecular unit has a common structural unit (oxyalkylene unit, diene unit, etc.) and the like, and the polarity is the same. When the curable oligomer (A) and the non-curable oligomer (C) have the same molecular structure, the compatibility of the non-curable oligomer (C) in the first composition is further improved.

作為用作硬化性低聚物(A)之原料之含羥基之化合物、與用作非硬化性低聚物(C)之含羥基之化合物並不相同之情形時的較佳組合,可列舉下述之組合。 A preferred combination of the hydroxyl group-containing compound used as a raw material of the curable oligomer (A) and the hydroxyl group-containing compound used as the non-curable oligomer (C) is exemplified. The combination described.

係如下組合,即硬化性低聚物(A)為將氧伸丙基之一部分經氧伸乙基取代之聚氧伸丙基多元醇、與聚異氰酸酯用於原料而合成之丙烯酸胺基甲酸酯低聚物;非硬化性低聚物(C)為不具有氧伸乙基之聚氧伸丙基多元醇,且為每個羥基之分子量小於硬化性低聚物(A)所使用之多元醇之聚氧伸丙基多元醇。 The combination is as follows, that is, the curable oligomer (A) is a polyoxypropyl propyl polyol in which one part of an oxygen-extended propyl group is substituted by an oxygen-extended ethyl group, and an acrylic acid carboxylic acid synthesized using a polyisocyanate as a raw material. Ester oligomer; non-curable oligomer (C) is a polyoxypropyl propylene polyol having no oxygen-extended ethyl group, and the molecular weight of each hydroxyl group is smaller than that of the curable oligomer (A) A polyoxyl extended propylene polyol of an alcohol.

作為硬化性低聚物(A)與非硬化性低聚物(C)之組合,尤佳為下述之組合。 The combination of the curable oligomer (A) and the non-curable oligomer (C) is particularly preferably the combination described below.

係如下組合,即硬化性低聚物(A)為使具有氧伸丙基及氧伸乙基之聚氧伸烷基二醇、與聚異氰酸酯反應而獲得於末端具有異氰酸酯基之預聚物後,使之與單體(a1)反應而獲得之丙烯酸胺基甲酸酯低聚物;非硬化性低聚物(C)為與硬化性低聚物(A)所使用者相同,具有氧伸丙基及氧伸乙基之聚氧伸烷基二醇、或者具有氧伸丙基之聚氧丙烯 二醇,且為分子量小於硬化性低聚物(A)所使用之二醇之聚氧丙烯二醇。 The combination is as follows, that is, the curable oligomer (A) is obtained by reacting a polyoxyalkylene glycol having an oxygen-extended propyl group and an oxygen-extended ethyl group with a polyisocyanate to obtain a prepolymer having an isocyanate group at the terminal. An urethane urethane oligomer obtained by reacting with the monomer (a1); the non-curable oligomer (C) is the same as the user of the curable oligomer (A), and has an oxygen extension a polyoxyalkylene glycol having a propyl group and an oxygen-extended ethyl group, or a polyoxypropylene having an oxygen-extended propyl group A diol which is a polyoxypropylene diol having a molecular weight smaller than that of the diol used in the curable oligomer (A).

關於光聚合起始劑(D): About photopolymerization initiator (D):

作為光聚合起始劑(D),可列舉:苯乙酮系、縮酮系、安息香系、安息香醚系、氧化膦系、二苯甲酮系、9-氧硫系、醌系等光聚合起始劑。作為光聚合起始劑(D),較佳為氧化膦系、9-氧硫系之光聚合起始劑,就光聚合反應後抑制著色之方面而言,尤佳為氧化膦系。 Examples of the photopolymerization initiator (D) include an acetophenone system, a ketal system, a benzoin system, a benzoin ether system, a phosphine oxide system, a benzophenone system, and a 9-oxosulfuric acid. Photopolymerization initiators such as lanthanum and lanthanide. As the photopolymerization initiator (D), a phosphine oxide system or a 9-oxosulfurate is preferred. The photopolymerization initiator is preferably a phosphine oxide system in terms of suppressing coloration after photopolymerization.

關於添加劑: About additives:

作為添加劑,可列舉:聚合抑制劑、光硬化促進劑、鏈轉移劑、光穩定劑(紫外線吸收劑、自由基捕獲劑等)、抗氧化劑、阻燃化劑、密接性提高劑(矽烷偶合劑等)、顏料、染料等。作為添加於第一組合物之添加劑,較佳為聚合抑制劑、光穩定劑。尤其是藉由含有較聚合起始劑少之量之聚合抑制劑,而可改善第一組合物之儲藏穩定性,亦可調整第一組合物之硬化物之分子量。 Examples of the additive include a polymerization inhibitor, a photocuring accelerator, a chain transfer agent, a light stabilizer (a UV absorber, a radical scavenger, etc.), an antioxidant, a flame retardant, and an adhesion improver (a decane coupling agent). Etc.), pigments, dyes, etc. As the additive to be added to the first composition, a polymerization inhibitor and a light stabilizer are preferred. In particular, the storage stability of the first composition can be improved by containing a polymerization inhibitor in an amount smaller than that of the polymerization initiator, and the molecular weight of the cured product of the first composition can also be adjusted.

作為聚合抑制劑,可列舉:對苯二酚系(2,5-二-第三丁基對苯二酚等)、鄰苯二酚系(對第三丁基鄰苯二酚等)、蒽醌系、酚噻嗪系、羥基甲苯系等聚合抑制劑。 Examples of the polymerization inhibitor include hydroquinone (2,5-di-t-butyl hydroquinone, etc.), catechol (p-butyl catechol, etc.), and hydrazine. A polymerization inhibitor such as an anthraquinone, a phenothiazine or a hydroxytoluene.

作為光穩定劑,可列舉:紫外線吸收劑(苯并三唑系、二苯甲酮系、水楊酸酯系等)、自由基捕獲劑(受阻胺系)等。 Examples of the light stabilizer include an ultraviolet absorber (such as a benzotriazole system, a benzophenone system, and a salicylate system), a radical scavenger (hindered amine), and the like.

作為抗氧化劑,可列舉:受阻酚系、磷系、硫系之化合物等。 Examples of the antioxidant include hindered phenol-based, phosphorus-based, and sulfur-based compounds.

關於各原料之調配比: About the blending ratio of each raw material:

關於第一組合物中之低分子量聚合性化合物(B)之比例,於硬化性低聚物(A)及低分子量聚合性化合物(B)之合計(100質量%)中較佳為1~80質量%,更佳為3~70質量%。 The ratio of the low molecular weight polymerizable compound (B) in the first composition is preferably from 1 to 80 in the total (100% by mass) of the curable oligomer (A) and the low molecular weight polymerizable compound (B). The mass% is more preferably 3 to 70% by mass.

若低分子量聚合性化合物(B1)之比例為上述下限值以上,則第一組合物之儲藏穩定性變良好,且黏著層與透明面材之密接性、及黏著 層與被貼合物(顯示面板等)之密接性變良好。 When the ratio of the low molecular weight polymerizable compound (B1) is at least the above lower limit value, the storage stability of the first composition becomes good, and the adhesion between the adhesive layer and the transparent surface material and adhesion are obtained. The adhesion between the layer and the adherend (display panel, etc.) becomes good.

關於低分子量聚合性化合物(B2)之比例,於第一組合物中之硬化性低聚物(A)及低分子量聚合性化合物(B)之合計(100質量%)中較佳為50質量%以下,更佳為40質量%以下。 The ratio of the low molecular weight polymerizable compound (B2) is preferably 50% by mass in the total (100% by mass) of the curable oligomer (A) and the low molecular weight polymerizable compound (B) in the first composition. Hereinafter, it is more preferably 40% by mass or less.

再者,於硬化性低聚物(A11)或硬化性低聚物(A21)之合成中,與預聚物之異氰酸酯基反應之單體(a1)作為硬化性低聚物(A)之一部分存在,因此並不包含於低分子量聚合性化合物(B)之比例中。另一方面,於硬化性低聚物(A11)或硬化性低聚物(A21)之合成時或合成後,視需要添加之作為稀釋劑之低分子量聚合性化合物(其中,與預聚物不反應者)屬於低分子量聚合性化合物(B)的情形時,該低分子量聚合性化合物包含於低分子量聚合性化合物(B)之比例中。 Further, in the synthesis of the curable oligomer (A11) or the curable oligomer (A21), the monomer (a1) which reacts with the isocyanate group of the prepolymer is used as a part of the curable oligomer (A). It exists and is therefore not included in the ratio of the low molecular weight polymerizable compound (B). On the other hand, in the synthesis of the curable oligomer (A11) or the curable oligomer (A21) or after the synthesis, a low molecular weight polymerizable compound as a diluent is added as needed (wherein, unlike the prepolymer) When the reactant is a low molecular weight polymerizable compound (B), the low molecular weight polymerizable compound is contained in the ratio of the low molecular weight polymerizable compound (B).

於第一組合物包含非硬化性低聚物(C)之情形時,非硬化性低聚物(C)之比例於第一組合物(100質量%)中較佳為1~60質量%。若非硬化性低聚物(C)之比例為上述下限值以上,則於黏著層與被貼合物之間難以殘留氣泡。若非硬化性低聚物(C)之比例為上述上限值以下,則只要黏著層充分硬化,就變得容易將保護膜自黏著層剝離。 In the case where the first composition contains the non-curable oligomer (C), the ratio of the non-curable oligomer (C) is preferably from 1 to 60% by mass in the first composition (100% by mass). When the ratio of the non-curable oligomer (C) is at least the above lower limit value, bubbles are less likely to remain between the adhesive layer and the adherend. When the ratio of the non-curable oligomer (C) is at most the above upper limit value, the protective film is easily peeled off from the adhesive layer as long as the adhesive layer is sufficiently cured.

於第一組合物包含非硬化性低聚物(C)之情形時,硬化性低聚物(A)、低分子量聚合性化合物(B)及非硬化性低聚物(C)之合計(100質量%)中,較佳為硬化性低聚物(A)為6~80質量%,低分子量聚合性化合物(B)為3~70質量%,非硬化性低聚物(C)為1~60質量%;更佳為硬化性低聚物(A)為6~60質量%,低分子量聚合性化合物(B)為3~55質量%,非硬化性低聚物(C)為1~60質量%。 When the first composition contains the non-curable oligomer (C), the total of the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-hardenable oligomer (C) (100) In the mass%), the curable oligomer (A) is preferably 6 to 80% by mass, the low molecular weight polymerizable compound (B) is 3 to 70% by mass, and the non-curable oligomer (C) is 1 to 1. 60% by mass; more preferably, the curable oligomer (A) is 6 to 60% by mass, the low molecular weight polymerizable compound (B) is 3 to 55% by mass, and the non-curable oligomer (C) is 1 to 60%. quality%.

關於第一組合物中之光聚合起始劑(D)之調配量,相對於硬化性低聚物(A)及低分子量聚合性化合物(B)之合計100質量份,較佳為0.01~10質量份,更佳為0.1~5質量份。 The amount of the photopolymerization initiator (D) in the first composition is preferably 0.01 to 10 parts by mass based on 100 parts by mass of the total of the curable oligomer (A) and the low molecular weight polymerizable compound (B). The mass part is more preferably 0.1 to 5 parts by mass.

關於第一組合物中之添加劑之調配量,相對於硬化性低聚物(A) 及低分子量聚合性化合物(B)之合計100質量份,較佳為10質量份以下,更佳為5質量份以下。 Regarding the amount of the additive in the first composition, relative to the curable oligomer (A) The total amount of the low molecular weight polymerizable compound (B) is 100 parts by mass, preferably 10 parts by mass or less, more preferably 5 parts by mass or less.

關於第一組合物之黏度: Regarding the viscosity of the first composition:

第一組合物之黏度較佳為0.05~50Pa‧s,更佳為1~20Pa‧s。若第一組合物之黏度為0.05Pa‧s以上,則於形成黏著層時,保持第一組合物之塗佈形狀。若第一組合物之黏度為50Pa‧s以下,則容易向透明面材之表面供給第一組合物,而附黏著層之透明面材之生產性良好。 The viscosity of the first composition is preferably from 0.05 to 50 Pa‧s, more preferably from 1 to 20 Pa‧s. If the viscosity of the first composition is 0.05 Pa‧s or more, the coating shape of the first composition is maintained when the adhesive layer is formed. When the viscosity of the first composition is 50 Pa‧s or less, the first composition is easily supplied to the surface of the transparent surface material, and the productivity of the transparent surface material with the adhesive layer is good.

(堰) (weir)

堰係包含塗佈液狀之堰形成用硬化性樹脂組合物並硬化而成之透明樹脂之部分。 The oxime system is a part of a transparent resin obtained by coating and curing a curable resin composition for forming a liquid.

藉由於黏著層之周緣具有堰,而抑制黏著層之周緣部向外側擴展而周緣部之厚度變薄,而可將黏著層之整體之厚度保持為均勻。藉由使黏著層之整體之厚度變均勻,而於與被貼合物(例如,顯示面板等)之貼合中,容易抑制氣泡殘留於該界面,故而較佳。 By the fact that the periphery of the adhesive layer has flaws, the peripheral portion of the adhesive layer is prevented from expanding outward and the thickness of the peripheral portion is reduced, so that the thickness of the entire adhesive layer can be kept uniform. By making the thickness of the entire adhesive layer uniform, it is preferable to prevent the bubbles from remaining at the interface in the bonding with the adherend (for example, a display panel or the like).

於具有堰之情形時,堰之厚度較黏著層之厚度略厚。即便黏著層之表面不平坦,黏著層之厚度不一定,於堰與黏著層接近之區域之至少一部分中,亦較佳為堰之厚度較黏著層之厚度略厚。 In the case of flaws, the thickness of the crucible is slightly thicker than the thickness of the adhesive layer. Even if the surface of the adhesive layer is not flat, the thickness of the adhesive layer is not necessarily the same. In at least a portion of the region where the adhesive layer is close to the adhesive layer, it is preferable that the thickness of the adhesive layer is slightly thicker than the thickness of the adhesive layer.

關於堰之厚度,較佳為與將堰與黏著層接近之區域除去之黏著層之平均厚度大致相等,或者如上述般,比黏著層之厚度厚0.005~0.05mm,更佳為厚0.01~0.03mm。 The thickness of the crucible is preferably substantially equal to the average thickness of the adhesive layer removed from the region where the crucible is adjacent to the adhesive layer, or as described above, is thicker than the thickness of the adhesive layer by 0.005 to 0.05 mm, more preferably 0.01 to 0.03 thick. Mm.

顯示面板之圖像顯示區域之外側之區域相對較窄,因此堰之寬度較佳為變狹。堰之寬度較佳為0.5~2mm,更佳為0.8~1.6mm。 The area on the outer side of the image display area of the display panel is relatively narrow, so that the width of the crucible is preferably narrowed. The width of the crucible is preferably 0.5 to 2 mm, more preferably 0.8 to 1.6 mm.

堰於35℃下之儲存剪切模數較佳為大於黏著層於35℃下之儲存剪切模數。若堰之儲存剪切模數大於黏著層之儲存剪切模數,則將被貼合物與附黏著層之透明面材貼合時,即便於黏著層之周緣部,於被 貼合物與黏著層之界面殘留有氣泡,氣泡亦難以向外部打開,而容易成為獨立之氣泡。 The storage shear modulus at 35 ° C is preferably greater than the storage shear modulus of the adhesive layer at 35 ° C. If the storage shear modulus of the crucible is larger than the storage shear modulus of the adhesive layer, the laminate is bonded to the transparent surface material of the adhesive layer, even at the peripheral portion of the adhesive layer. There are bubbles remaining at the interface between the laminate and the adhesive layer, and the bubbles are difficult to open to the outside, and are easily become independent bubbles.

因此,於減壓環境下將被貼合物與附黏著層之透明面材貼合後,將其放回至大氣壓環境下時,由於氣泡內之壓力(即,減壓環境之減壓狀態之壓力)與施加於黏著層之壓力(即,放回至大氣壓環境下時之大氣壓)之差壓而氣泡之體積減少,從而氣泡容易消失。 Therefore, when the adherend is bonded to the transparent surface material of the adhesive layer in a reduced pressure environment and then returned to the atmospheric pressure environment, the pressure in the bubble (ie, the decompressed state of the reduced pressure environment) The pressure is reduced by the pressure applied to the pressure of the adhesive layer (i.e., the atmospheric pressure when returned to the atmospheric pressure environment), and the volume of the bubble is reduced, so that the bubble easily disappears.

又,藉由使堰之儲存剪切模數大於黏著層之儲存剪切模數,而於堰與黏著層接近之區域之至少一部分中,堰之厚度略大於黏著層之厚度,而變得容易製造附黏著層之透明面材。 Moreover, by making the storage shear modulus of the crucible larger than the storage shear modulus of the adhesive layer, the thickness of the crucible is slightly larger than the thickness of the adhesive layer in at least a portion of the region close to the adhesive layer, and is easy A transparent face material with an adhesive layer is produced.

(堰形成用硬化性樹脂組合物) (curable resin composition for bismuth formation)

作為堰形成用硬化性樹脂組合物,例如可列舉:包含聚矽氧樹脂(有機聚矽氧烷)、胺基甲酸酯低聚物、丙烯酸胺基甲酸酯低聚物等之組合物。 Examples of the curable resin composition for forming a crucible include a composition comprising a polyfluorene oxide resin (organopolyoxyalkylene oxide), a urethane oligomer, and an urethane acrylate oligomer.

作為堰形成用硬化性樹脂組合物,就柔軟性、硬化速度之方面而言,較佳為包含低聚物(F)及單體(G)之組合物(以下,記載為第二組合物)。 The curable resin composition for forming a crucible preferably has a composition of an oligomer (F) and a monomer (G) (hereinafter referred to as a second composition) in terms of flexibility and curing rate. .

(第二組合物) (second composition)

第二組合物可為光硬化性樹脂組合物,亦可為熱硬化性樹脂組合物。作為第二組合物,就可於低溫下硬化,且硬化速度較快之方面而言,較佳為進而調配有光聚合起始劑(E)之光硬化性樹脂組合物。又,若第二組合物為光硬化性樹脂組合物,則硬化無需較高之溫度,因此由高溫引起之顯示面板之損傷之虞亦較少。 The second composition may be a photocurable resin composition or a thermosetting resin composition. The second composition is preferably a photocurable resin composition which is further cured with a photopolymerization initiator (E) in terms of curing at a low temperature and a faster curing rate. Further, when the second composition is a photocurable resin composition, the curing does not require a high temperature, and thus the damage of the display panel caused by the high temperature is also small.

又,亦可使用與第一組合物相同之組成者作為第二組合物。於該情形時,於下述之步驟(α21)中,將第二組合物塗佈於透明面材之表面之周緣部,進行半硬化而製成堰。 Further, the same composition as the first composition may be used as the second composition. In this case, in the following step (α21), the second composition is applied to the peripheral portion of the surface of the transparent surface material, and semi-hardened to form a crucible.

第二組合物中,亦可視需要而調配添加劑。 In the second composition, additives may also be formulated as needed.

又,為了保持透明面材與顯示面板之間隔,亦可將特定粒徑之間隔粒子調配於第二組合物。 Further, in order to maintain the distance between the transparent face material and the display panel, spacer particles having a specific particle diameter may be blended in the second composition.

關於低聚物(F): About oligomer (F):

低聚物(F)係具有加成聚合性不飽和雙鍵,且數量平均分子量為30,000~100,000之化合物。 The oligomer (F) is a compound having an addition polymerizable unsaturated double bond and having a number average molecular weight of 30,000 to 100,000.

作為低聚物(F)所具有之加成聚合性不飽和雙鍵,可列舉:丙烯醯氧基、甲基丙烯醯氧基等。作為低聚物(F)之加成聚合性不飽和雙鍵,就硬化速度較快之方面及獲得透明性較高之堰之方面而言,較佳為丙烯醯氧基或甲基丙烯醯氧基。又,就低聚物(F)與單體(G)之加成聚合性不飽和雙鍵之反應性之差變小,而可形成均質之堰之方面而言,尤佳為低聚物(F)所具有之加成聚合性不飽和雙鍵為丙烯醯氧基,單體(G)所具有之加成聚合性不飽和雙鍵為甲基丙烯醯氧基。 Examples of the addition polymerizable unsaturated double bond of the oligomer (F) include an acryloxy group and a methacryloxy group. The addition polymerizable unsaturated double bond of the oligomer (F) is preferably an acryloxy group or a methacryloxy group in terms of a faster curing rate and a higher transparency. base. Further, the difference in reactivity between the oligomeric (F) and the monomer (G) addition polymerizable unsaturated double bond becomes small, and in terms of homogenization, it is particularly preferable to be an oligomer ( F) The addition polymerizable unsaturated double bond is an acryloxy group, and the addition polymerizable unsaturated double bond of the monomer (G) is a methacryloxy group.

低聚物(F)之數量平均分子量為30,000~100,000,較佳為40,000~80,000,更佳為50,000~65,000。若低聚物(F)之數量平均分子量為上述範圍內,則容易將第二組合物之黏度調整為下述之範圍。 The oligomer (F) has a number average molecular weight of 30,000 to 100,000, preferably 40,000 to 80,000, more preferably 50,000 to 65,000. When the number average molecular weight of the oligomer (F) is within the above range, the viscosity of the second composition is easily adjusted to the following range.

關於低聚物(F)之加成聚合性不飽和雙鍵之平均數,就第二組合物之硬化性及堰之機械特性之方面而言,較佳為1.8~4。 The average number of the addition polymerizable unsaturated double bonds of the oligomer (F) is preferably from 1.8 to 4 in terms of the hardenability of the second composition and the mechanical properties of the crucible.

作為低聚物(F),可列舉:具有胺基甲酸酯鍵之胺基甲酸酯低聚物、聚氧伸烷基多元醇之聚(甲基)丙烯酸酯、聚酯多元醇之聚(甲基)丙烯酸酯等。 Examples of the oligomer (F) include a urethane oligomer having a urethane bond, a poly(meth) acrylate of a polyoxyalkylene polyol, and a polycondensation of a polyester polyol. (Meth) acrylate, etc.

就藉由胺基甲酸酯鏈之分子設計等而可廣範圍地調整硬化後之堰之機械特性、與透明面材之密接性等方面而言,較佳為將多元醇及聚異氰酸酯用於原料而合成之胺基甲酸酯低聚物,更佳為利用下述之合成方法所獲得之低聚物(F1)。作為多元醇,更佳為聚氧伸烷基多元醇。 It is preferred to use a polyol and a polyisocyanate in terms of broadly adjusting the mechanical properties of the crucible after hardening, the adhesion to the transparent face material, and the like by molecular design of the urethane chain or the like. The urethane oligomer synthesized by the raw material is more preferably an oligomer (F1) obtained by the following synthesis method. As the polyol, a polyoxyalkylene polyol is more preferable.

低聚物(F1): Oligomer (F1):

數量平均分子量為30,000~100,000範圍之低聚物(F1)因成為高黏度,故利用通常之方法難以合成,即便可合成,亦難以與單體(G)混合。 Since the oligomer (F1) having a number average molecular weight of 30,000 to 100,000 is highly viscous, it is difficult to synthesize by a usual method, and it is difficult to mix with the monomer (G) even if it can be synthesized.

因此,較佳為利用使用單體(G)(下述之單體(G1)及單體(G2))之合成方法而合成低聚物(F1)後,將所獲得之產物直接用作第二組合物,或者進而利用單體(G)(下述之單體(G1)~單體(G3)等)稀釋所獲得之產物而用作第二脂組合物。 Therefore, it is preferred to synthesize the oligomer (F1) by a synthesis method using the monomer (G) (the monomer (G1) and the monomer (G2) described below), and the obtained product is directly used as the first The second composition is further used as a second fat composition by diluting the obtained product with the monomer (G) (monomer (G1) to monomer (G3) or the like described below).

單體(G1):單體(G)中,具有加成聚合性不飽和雙鍵,且不具有與異氰酸酯基反應之基之單體。 Monomer (G1): a monomer having an addition polymerizable unsaturated double bond in the monomer (G) and having no reaction with an isocyanate group.

單體(G2):單體(G)中,具有加成聚合性不飽和雙鍵,且具有與異氰酸酯基反應之基之單體。 Monomer (G2): a monomer having an addition polymerizable unsaturated double bond and having a group reactive with an isocyanate group in the monomer (G).

單體(G3):單體(G)中,具有加成聚合性不飽和雙鍵,且具有羥基之單體。 Monomer (G3): a monomer having an addition polymerizable unsaturated double bond and having a hydroxyl group in the monomer (G).

低聚物(F1)係藉由下述之合成方法而獲得。 The oligomer (F1) is obtained by the following synthesis method.

於用作稀釋劑之單體(G1)之存在下,使多元醇與聚異氰酸酯反應而獲得具有異氰酸酯基之預聚物後,使該預聚物之異氰酸酯基與單體(G2)反應之方法。 A method for reacting an isocyanate group of the prepolymer with a monomer (G2) after reacting a polyol with a polyisocyanate to obtain a prepolymer having an isocyanate group in the presence of a monomer (G1) used as a diluent .

作為多元醇,可列舉:與第一組合物中所例示之多元醇相同者。多元醇可為與第一組合物相同者,亦可為與第一組合物不同者,較佳為與第一組合物相同者。又,就提高第二組合物與其他成分之相溶性之方面而言,進而較佳為具有氧伸丙基及氧伸乙基之聚氧伸烷基多元醇。 The polyhydric alcohol may be the same as the polyol exemplified in the first composition. The polyol may be the same as the first composition, or may be the same as the first composition, preferably the same as the first composition. Further, in terms of improving the compatibility of the second composition with other components, a polyoxyalkylene polyol having an oxygen-extended propyl group and an oxygen-extended ethyl group is further preferred.

多元醇可單獨使用1種,亦可併用2種以上。 The polyol may be used alone or in combination of two or more.

作為聚異氰酸酯,可列舉:與第一組合物中所例示之聚異氰酸酯相同者。聚異氰酸酯可為與第一組合物相同者,亦可為與第一組合物不同者,較佳為與第一組合物相同者。 The polyisocyanate may be the same as the polyisocyanate exemplified in the first composition. The polyisocyanate may be the same as the first composition, or may be the same as the first composition, preferably the same as the first composition.

聚異氰酸酯可單獨使用1種,亦可併用2種以上。 The polyisocyanate may be used alone or in combination of two or more.

關於單體(G): About monomer (G):

單體(G)係具有加成聚合性不飽和雙鍵,且分子量為125~600之化合物。 The monomer (G) is a compound having an addition polymerizable unsaturated double bond and having a molecular weight of from 125 to 600.

作為單體(G)所具有之加成聚合性不飽和雙鍵,可列舉:丙烯醯氧基、甲基丙烯醯氧基等。作為單體(G)之加成聚合性不飽和雙鍵,就硬化速度較快之方面及獲得透明性較高之堰之方面而言,較佳為丙烯醯氧基或甲基丙烯醯氧基。又,就低聚物(F)與單體(G)之加成聚合性不飽和雙鍵之反應性之差變小,而可形成均質之堰之方面而言,尤佳為低聚物(F)所具有之加成聚合性不飽和雙鍵為丙烯醯氧基,單體(G)所具有之加成聚合性不飽和雙鍵為甲基丙烯醯氧基。 Examples of the addition polymerizable unsaturated double bond of the monomer (G) include an acryloxy group and a methacryloxy group. The addition polymerizable unsaturated double bond as the monomer (G) is preferably an acryloxy group or a methacryloxy group in terms of a faster curing rate and a higher transparency. . Further, the difference in reactivity between the oligomeric (F) and the monomer (G) addition polymerizable unsaturated double bond becomes small, and in terms of homogenization, it is particularly preferable to be an oligomer ( F) The addition polymerizable unsaturated double bond is an acryloxy group, and the addition polymerizable unsaturated double bond of the monomer (G) is a methacryloxy group.

單體(G)之分子量為125~600,較佳為140~400,更佳為150~350。若單體(G)之分子量為125以上,則可抑制製造顯示裝置時之單體(G)之揮發。若單體(G)之分子量為600以下,則可提高單體(G)對高分子量之低聚物(F)之溶解性,而可較佳地進行作為第二組合物之黏度調整。 The molecular weight of the monomer (G) is from 125 to 600, preferably from 140 to 400, more preferably from 150 to 350. When the molecular weight of the monomer (G) is 125 or more, volatilization of the monomer (G) in the production of the display device can be suppressed. When the molecular weight of the monomer (G) is 600 or less, the solubility of the monomer (G) to the high molecular weight oligomer (F) can be improved, and the viscosity adjustment as the second composition can be preferably carried out.

單體(G)亦可包含於低聚物(F1)之合成方法用作稀釋劑之單體(G1)。又,作為單體(G),亦可包含低聚物(F1)之合成方法所使用之未反應之單體(G2)。 The monomer (G) may also be included in the monomer (G1) used as a diluent in the synthesis method of the oligomer (F1). Further, the monomer (G) may contain an unreacted monomer (G2) used in the synthesis method of the oligomer (F1).

又,就透明面材與堰之密接性或添加劑之溶解性之方面而言,單體(G)較佳為包含單體(G3)。 Further, in terms of the adhesion between the transparent face material and the crucible or the solubility of the additive, the monomer (G) preferably contains the monomer (G3).

單體(G1): Monomer (G1):

作為單體(G1),可列舉:具有碳數8~22之烷基之(甲基)丙烯酸烷基酯((甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十八烷基酯、(甲基)丙烯酸正山崳酯等)、具有脂環式烴基之(甲基)丙烯酸酯((甲基)丙烯酸異基酯、(甲基)丙烯酸金剛烷基酯等)。 Examples of the monomer (G1) include an alkyl (meth)acrylate having an alkyl group having 8 to 22 carbon atoms (n-dodecyl (meth)acrylate, n-octadecyl (meth)acrylate. a base ester, a benzalkonium (meth)acrylate, etc., a (meth) acrylate having an alicyclic hydrocarbon group ((meth)acrylic acid) Alkyl ester, adamantyl (meth)acrylate, etc.).

單體(G2): Monomer (G2):

作為單體(G2),可列舉:具有活性氫(羥基、胺基等)及加成聚合性不飽和雙鍵之單體。作為單體(G2)之具體例,可列舉:具有碳數2~6之羥基烷基之(甲基)丙烯酸羥基烷基酯((甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯等)等。作為單體(G2),較佳為具有碳數2~4之羥基烷基之丙烯酸羥基烷基酯。 Examples of the monomer (G2) include monomers having an active hydrogen (hydroxy group, an amine group, etc.) and an addition polymerizable unsaturated double bond. Specific examples of the monomer (G2) include a hydroxyalkyl (meth)acrylate having a hydroxyalkyl group having 2 to 6 carbon atoms (2-hydroxyethyl (meth)acrylate, (meth)acrylic acid) 2-hydroxypropyl ester, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, etc.). The monomer (G2) is preferably a hydroxyalkyl acrylate having a hydroxyalkyl group having 2 to 4 carbon atoms.

單體(G3): Monomer (G3):

作為單體(G3),較佳為具有羥基數1~2、碳數3~8之羥基烷基之甲基丙烯酸羥基酯(甲基丙烯酸2-羥基丙酯、甲基丙烯酸2-羥基丁酯、甲基丙烯酸4-羥基丁酯、甲基丙烯酸6-羥基己酯等),尤佳為甲基丙烯酸2-羥基丁酯。 As the monomer (G3), a hydroxy methacrylate having a hydroxyl group of 1 to 2 and a carbon number of 3 to 8 (2-hydroxypropyl methacrylate or 2-hydroxybutyl methacrylate) is preferred. , 4-hydroxybutyl methacrylate, 6-hydroxyhexyl methacrylate, etc.), particularly preferably 2-hydroxybutyl methacrylate.

關於光聚合起始劑(E): About photopolymerization initiator (E):

作為光聚合起始劑(E),可列舉:苯乙酮系、縮酮系、安息香系、安息香醚系、氧化膦系、二苯甲酮系、9-氧硫系、醌系等光聚合起始劑。作為光聚合起始劑(E),較佳為苯乙酮系、縮酮系、安息香醚系之光聚合起始劑。於進行利用短波長之可見光之硬化之情形時,就吸收波長域之方面而言,更佳為氧化膦系之光聚合起始劑。藉由併用吸收波長域不同之2種以上之光聚合起始劑(E),而可進一步縮短硬化時間,或者提高堰之表面硬化性。 Examples of the photopolymerization initiator (E) include an acetophenone system, a ketal system, a benzoin system, a benzoin ether system, a phosphine oxide system, a benzophenone system, and a 9-oxosulfuric acid. Photopolymerization initiators such as lanthanum and lanthanide. The photopolymerization initiator (E) is preferably an acetophenone-based, ketal-based or benzoin-based photopolymerization initiator. In the case of performing hardening using visible light of a short wavelength, a phosphine oxide-based photopolymerization initiator is more preferable in terms of absorption of a wavelength region. By using two or more kinds of photopolymerization initiators (E) having different wavelength domains, the hardening time can be further shortened or the surface hardenability of tantalum can be improved.

關於添加劑: About additives:

作為添加劑,可列舉:與第一組合物中所列舉者相同者。作為添加於第二組合物之添加劑,較佳為聚合抑制劑、光穩定劑。尤其是藉由含有較聚合起始劑少之量之聚合抑制劑,而可改善第二組合物之儲藏穩定性,亦可調整第二組合物之硬化物之分子量。 The additive is the same as those listed in the first composition. As the additive to be added to the second composition, a polymerization inhibitor and a light stabilizer are preferred. In particular, the storage stability of the second composition can be improved by containing a polymerization inhibitor in an amount smaller than that of the polymerization initiator, and the molecular weight of the cured product of the second composition can also be adjusted.

關於各原料之調配比: About the blending ratio of each raw material:

關於第二組合物中之單體(G)之比例,於低聚物(F)及單體(G)之合計(100質量%)中,較佳為15~50質量%,更佳為20~45質量%,進而較佳為25~40質量%。若單體(G)之比例為15質量%以上,則第二組合物之硬化性、透明面材與堰之密接性變良好。若單體(G)之比例為50質量%以下,則容易將第二組合物之黏度調整為500Pa‧s以上。 The ratio of the monomer (G) in the second composition is preferably from 15 to 50% by mass, more preferably from 20 to 50% by mass, based on the total of the oligomer (F) and the monomer (G) (100% by mass). ~45 mass%, further preferably 25-40 mass%. When the ratio of the monomer (G) is 15% by mass or more, the curability of the second composition and the adhesion between the transparent surface material and the crucible are improved. When the ratio of the monomer (G) is 50% by mass or less, the viscosity of the second composition is easily adjusted to 500 Pa‧s or more.

再者,於低聚物(F1)之合成中,與預聚物之異氰酸酯基反應之單體(G2)係作為低聚物(F)之一部分存在,因此不包含於單體(G)之比例中。另一方面,於低聚物(F1)之合成中,用作稀釋劑之單體(G1)、及合成低聚物(F1)後所添加之單體(G)係包含於單體(G)之比例中。 Further, in the synthesis of the oligomer (F1), the monomer (G2) which reacts with the isocyanate group of the prepolymer is partially present as one of the oligomers (F), and thus is not contained in the monomer (G). In the proportion. On the other hand, in the synthesis of the oligomer (F1), the monomer (G1) used as the diluent and the monomer (G) added after the synthesis of the oligomer (F1) are contained in the monomer (G). In the proportion.

關於第二組合物中之光聚合起始劑(E2)之調配量,相對於低聚物(F)及單體(G)之合計100質量份,較佳為0.01~10質量份,更佳為0.1~5質量份。 The amount of the photopolymerization initiator (E2) in the second composition is preferably 0.01 to 10 parts by mass, more preferably 100 to 10 parts by mass, based on 100 parts by mass of the total of the oligomer (F) and the monomer (G). It is 0.1 to 5 parts by mass.

關於第二組合物中之添加劑之合計量,相對於低聚物(F)及單體(G)之合計100質量份,較佳為10質量份以下,更佳為5質量份以下。 The total amount of the additives in the second composition is preferably 10 parts by mass or less, and more preferably 5 parts by mass or less based on 100 parts by mass of the total of the oligomer (F) and the monomer (G).

關於第二組合物之黏度: Regarding the viscosity of the second composition:

第二組合物之黏度較佳為500~3000Pa‧s,更佳為800~2500Pa‧s,進而較佳為1000~2000Pa‧s。若第二組合物之黏度為500Pa‧s以上,則可相對長時間維持硬化前之堰之形狀,而可充分維持硬化前之堰之高度。若第二組合物之黏度為3000Pa‧s以下,則可藉由塗佈而形成硬化前之堰。 The viscosity of the second composition is preferably from 500 to 3,000 Pa s, more preferably from 800 to 2,500 Pa s, and still more preferably from 1,000 to 2,000 Å s. When the viscosity of the second composition is 500 Pa ‧ or more, the shape of the crucible before curing can be maintained for a relatively long period of time, and the height of the crucible before curing can be sufficiently maintained. If the viscosity of the second composition is 3,000 Pa‧s or less, the crucible before hardening can be formed by coating.

又,即便第二組合物之黏度未達500Pa‧s,於第二組合物為光硬化性樹脂組合物之情形時,只要藉由於剛塗佈後照射光,而使光照射後之第二組合物之黏度為上述較佳之範圍即可。就塗佈之容易性之方面而言,較佳為第二組合物之塗佈時之黏度未達500Pa‧s者,進而較佳為200Pa‧s以下。 Further, even if the viscosity of the second composition is less than 500 Pa s, in the case where the second composition is a photocurable resin composition, the second combination after the light irradiation is irradiated by the light immediately after application. The viscosity of the substance may be the above preferred range. In terms of easiness of coating, it is preferred that the viscosity at the time of coating of the second composition is less than 500 Pa‧s, and more preferably 200 Pa‧s or less.

(保護膜) (protective film)

對於保護膜而言,要求其並非與黏著層牢固地密接。因此,作為保護膜,較佳為聚乙烯、聚丙烯、氟系樹脂等與黏著層之密接性相對較低之膜。 For the protective film, it is required not to be in close contact with the adhesive layer. Therefore, as the protective film, a film having a relatively low adhesion to an adhesive layer such as polyethylene, polypropylene or a fluorine-based resin is preferable.

於下述之製造方法中,於支持面材貼合保護膜之情形時,對於保護膜而言,要求其可貼合於支持面材。因此,於該情形時,作為保護膜,較佳為以密接性相對較低之基材膜之單面為黏著面之自我黏著性保護膜。 In the production method described below, when the protective surface film is bonded to the surface material, the protective film is required to be bonded to the support surface material. Therefore, in this case, as the protective film, a self-adhesive protective film having an adhesive surface on one side of the base film having relatively low adhesion is preferable.

關於保護膜之黏著面之黏著力,於針對丙烯酸板之剝離速度300mm/min下之180度剝離試驗中之50mm寬度的試驗體中,較佳為0.01~0.1N,更佳為0.02~0.06N。若上述黏著力為上述下限值以上,則可貼合於支持面材。若上述黏著力為上述上限值以下,則容易自支持面材剝離保護膜。 The adhesive force of the adhesive surface of the protective film is preferably 0.01 to 0.1 N, more preferably 0.02 to 0.06 N in the test body of 50 mm width in the 180-degree peeling test at a peeling speed of 300 mm/min of the acrylic sheet. . When the adhesive force is at least the above lower limit value, it can be bonded to the support surface material. When the adhesive force is at most the above upper limit value, it is easy to peel off the protective film from the support surface material.

保護膜之厚度係根據所使用之樹脂而不同,但於使用聚乙烯、聚丙烯等相對柔軟之膜之情形時,保護膜之厚度較佳為0.04~0.2mm,更佳為0.06~0.1mm。若保護膜之厚度為上述下限值以上,則自黏著層剝離保護膜時可抑制保護膜之變形。若保護膜之厚度為上述上限值以下,則剝離時保護膜容易彎曲,而變得容易自黏著層剝離保護膜。 The thickness of the protective film varies depending on the resin to be used. However, when a relatively soft film such as polyethylene or polypropylene is used, the thickness of the protective film is preferably 0.04 to 0.2 mm, more preferably 0.06 to 0.1 mm. When the thickness of the protective film is at least the above lower limit value, deformation of the protective film can be suppressed when the protective film is peeled off from the adhesive layer. When the thickness of the protective film is at most the above upper limit value, the protective film is easily bent at the time of peeling, and it is easy to peel off the protective film from the adhesive layer.

[第1實施形態] [First Embodiment]

圖1係表示本發明之附黏著層之透明面材之第1實施形態之剖面圖。 Fig. 1 is a cross-sectional view showing a first embodiment of a transparent surface material with an adhesive layer of the present invention.

附黏著層之透明面材1具有:透明面材10、形成於透明面材10之表面之周緣部之遮光印刷部12(遮光部)、形成於形成有遮光印刷部12之側之透明面材10之表面的層狀之黏著層14、及覆蓋黏著層14之表面之可剝離之保護膜16。 The transparent surface material 1 with an adhesive layer has a transparent surface material 10, a light-shielding printing part 12 (light-shielding part) formed in the peripheral part of the surface of the transparent surface material 10, and the transparent surface material formed in the side in which the light-shielding printing part 12 was formed. A layered adhesive layer 14 on the surface of 10, and a peelable protective film 16 covering the surface of the adhesive layer 14.

自附黏著層之透明面材1剝離保護膜16後,將附黏著層之透明面 材1與顯示面板貼合,藉此可製造顯示裝置。 After the transparent surface material 1 with the adhesive layer is peeled off the protective film 16, the transparent surface of the adhesive layer is adhered The material 1 is bonded to the display panel, whereby the display device can be manufactured.

(透明面材) (transparent surface material)

透明面材10係設置於下述之顯示面板之圖像顯示面側(即,視認側)而保護顯示面板。 The transparent surface material 10 is provided on the image display surface side (that is, the viewing side) of the display panel described below to protect the display panel.

於透明面材10,為了提高顯示圖像之對比度,亦可於形成有黏著層14之側之相反側之表面設置抗反射層。又,亦可視目的,而將透明面材10之一部分或整體著色,或者將透明面材10之表面之一部分或整體研磨而製成玻璃狀以使光散射,或者於透明面材10之表面之一部分或者整體形成微細之凹凸等而使透過光折射或反射。又,亦可將著色膜、光散射膜、光折射膜、光反射膜等貼合於透明面材10之表面之一部分或整體。 In the transparent surface material 10, in order to increase the contrast of the display image, an antireflection layer may be provided on the surface opposite to the side on which the adhesive layer 14 is formed. Further, it is also possible to color a part or the whole of the transparent face material 10, or to polish a part or the whole of the surface of the transparent face material 10 to form a glass shape to scatter light, or on the surface of the transparent face material 10. A part or the whole is formed with fine irregularities or the like to refract or reflect the transmitted light. Further, a colored film, a light-scattering film, a light-refractive film, a light-reflecting film, or the like may be bonded to one or a part of the surface of the transparent surface material 10.

關於透明面材10之形狀,在與顯示裝置之外形吻合之意義上,較佳為矩形。根據顯示裝置之外形,亦可使用覆蓋顯示面板之顯示面之整面之外形形狀包含曲線的形狀之透明面材。 The shape of the transparent face material 10 is preferably rectangular in the sense of being externally fitted to the display device. Depending on the shape of the display device, it is also possible to use a transparent face material that covers the entire shape of the display surface of the display panel and has a curved shape.

透明面材10之尺寸只要依照顯示裝置之外形而適當設定即可,關於透明面材10之厚度,就機械強度、透明性之方面而言,於玻璃板之情形時,較佳為0.5~25mm。於屋內所使用之電視接收機、PC用顯示器等用途中,就顯示裝置之輕量化之方面而言,透明面材10之厚度較佳為1~6mm,於設置於屋外之公共顯示用途中,透明面材10之厚度較佳為3~20mm。於使用化學強化玻璃之情形時,關於玻璃板之厚度,就強度方面而言,較佳為0.5~1.5mm左右。於透明樹脂板之情形時,較佳為2~10mm。 The size of the transparent surface material 10 may be appropriately set in accordance with the shape of the display device. The thickness of the transparent surface material 10 is preferably 0.5 to 25 mm in terms of mechanical strength and transparency in the case of a glass plate. . For applications such as television receivers and PC monitors used in indoors, the thickness of the transparent face material 10 is preferably 1 to 6 mm in terms of weight reduction of the display device, and is used in public display applications installed outdoors. The thickness of the transparent face material 10 is preferably 3 to 20 mm. In the case of using chemically strengthened glass, the thickness of the glass plate is preferably about 0.5 to 1.5 mm in terms of strength. In the case of a transparent resin sheet, it is preferably 2 to 10 mm.

(遮光印刷部) (shading printing department)

遮光印刷部12係使下述之顯示面板之圖像顯示區域以外自透明面材10側無法視認,而隱蔽連接於顯示面板之佈線構件等。遮光印刷部12可形成於形成黏著層14之側或其相反側之表面。就減少遮光印刷 部12與圖像顯示區域之視差之方面而言,較佳為遮光印刷部12形成於形成黏著層14之側之表面。於透明面材10為玻璃板之情形時,若遮光印刷部12使用包含黑色顏料之陶瓷印刷,則遮光性較高,故而較佳。 The light-shielding printing unit 12 is invisible from the side of the transparent surface material 10 except for the image display area of the display panel described below, and concealed the wiring member or the like connected to the display panel. The light-shielding printing portion 12 may be formed on the surface on the side where the adhesive layer 14 is formed or the side opposite thereto. Reduce shading printing In terms of the parallax of the portion 12 and the image display region, it is preferable that the light-shielding portion 12 is formed on the surface on the side where the adhesive layer 14 is formed. In the case where the transparent surface material 10 is a glass plate, when the light-shielding printing portion 12 is printed using a ceramic containing a black pigment, the light-shielding property is high, which is preferable.

於顯示面板之佈線構件等為自觀察顯示面板之側無法視認之構造,或被顯示裝置之殼體等其他構件隱蔽之情形時,或者於將顯示面板以外之被貼合體與附黏著層之透明面材1貼合之情形時,亦有不將遮光印刷部12形成於透明面材10之情形。 When the wiring member or the like on the display panel is a structure that is not visible from the side of the viewing display panel, or is concealed by another member such as a casing of the display device, or is transparent to the bonded body and the adhesive layer other than the display panel When the face material 1 is bonded, there is a case where the light-shielding printing portion 12 is not formed on the transparent surface material 10.

(黏著層) (adhesive layer)

黏著層14係包含使上述之第一組合物硬化而成之透明樹脂之層。 The adhesive layer 14 is a layer containing a transparent resin obtained by hardening the above first composition.

(保護膜) (protective film)

作為保護膜16,可使用上述之聚乙烯、聚丙烯、氟系樹脂等與黏著層之密接性相對較低之膜。 As the protective film 16, a film having a relatively low adhesion to an adhesive layer such as polyethylene, polypropylene or a fluorine-based resin described above can be used.

[第2實施形態] [Second Embodiment]

圖2係表示本發明之附黏著層之透明面材之第2實施形態之剖面圖。 Fig. 2 is a cross-sectional view showing a second embodiment of the transparent surface material with an adhesive layer of the present invention.

附黏著層之透明面材2具有:透明面材10、形成於透明面材10之表面之周緣部之遮光印刷部12(遮光部)、形成於形成有遮光印刷部12之側之透明面材10之表面的層狀之黏著層14、以與黏著層14之周緣接觸之狀態包圍黏著層14之框狀的堰15、及覆蓋黏著層14之表面之可剝離之保護膜16。 The transparent surface material 2 with an adhesive layer has a transparent surface material 10, a light-shielding printing part 12 (light-shielding part) formed in the peripheral part of the surface of the transparent surface material 10, and the transparent surface material formed in the side in which the light-shielding printing part 12 was formed. The layered adhesive layer 14 on the surface of the 10 surrounds the frame-shaped cymbal 15 of the adhesive layer 14 and the peelable protective film 16 covering the surface of the adhesive layer 14 in a state of being in contact with the peripheral edge of the adhesive layer 14.

自附黏著層之透明面材2剝離保護膜16後,將附黏著層之透明面材2與顯示面板貼合,藉此可製造顯示裝置。 After the transparent surface material 2 of the adhesive layer is peeled off from the protective film 16, the transparent surface material 2 with the adhesive layer is bonded to the display panel, whereby a display device can be manufactured.

關於與第1實施形態相同之構成,附上相同符號而省略說明。 The same configurations as those in the first embodiment are denoted by the same reference numerals and will not be described.

(堰) (weir)

堰15係包含使上述之第二組合物硬化而成之透明樹脂之部分。 堰15 is a part comprising a transparent resin obtained by hardening the above second composition.

(其他實施形態) (Other embodiments)

本發明之附黏著層之透明面材只要為具有透明面材與黏著層,且黏著層中之羥基濃度及胺基甲酸酯鍵濃度為特定範圍內者即可,而並不限定於圖示例。 The transparent surface material of the adhesive layer of the present invention may have a transparent surface material and an adhesive layer, and the concentration of the hydroxyl group and the concentration of the urethane bond in the adhesive layer may be within a specific range, and is not limited to the illustration. example.

(作用機制) (Mechanism)

關於以上所說明之本發明之附黏著層之透明面材,其黏著層中之羥基濃度為600×10-6mol/g以下,黏著層中之胺基甲酸酯鍵濃度為150×10-6mol/g以下,因此與被貼合物(顯示面板等)貼合時,殘留於被貼合物與黏著層之界面之氣泡可迅速地消失。又,黏著層中之羥基濃度為100×10-6mol/g以上,因此黏著層與透明面材之密接性、及黏著層與被貼合物之密接性變良好。 With respect to the transparent surface material of the adhesive layer of the present invention described above, the concentration of the hydroxyl group in the adhesive layer is 600×10 -6 mol/g or less, and the concentration of the urethane bond in the adhesive layer is 150×10 − When the amount is 6 mol/g or less, when it is bonded to the adherend (display panel or the like), the bubbles remaining at the interface between the adherend and the adhesive layer can be quickly disappeared. Further, since the concentration of the hydroxyl group in the adhesive layer is 100 × 10 -6 mol/g or more, the adhesion between the adhesive layer and the transparent surface material and the adhesion between the adhesive layer and the adherend are improved.

<附黏著層之透明面材之製造方法> <Method of Manufacturing Transparent Surface Material with Adhesive Layer>

本發明之附黏著層之透明面材之製造方法具有下述步驟(α)、下述步驟(β)及下述步驟(γ)。作為下述步驟(α)、下述步驟(β)及下述步驟(γ)之順序,較佳為該順序。 The method for producing a transparent surface material with an adhesive layer of the present invention has the following step (α), the following step (β), and the following step (γ). The order of the following step (α), the following step (β), and the following step (γ) is preferred.

(α)向透明面材之表面供給液狀之硬化性樹脂組合物,視需要使硬化性樹脂組合物部分地硬化而製成部分硬化物之步驟。 (α) A step of supplying a liquid curable resin composition to the surface of the transparent surface material, and partially curing the curable resin composition as necessary to obtain a partially cured product.

(β)視需要,利用保護膜覆蓋硬化性樹脂組合物或部分硬化物之表面之步驟。 (β) A step of covering the surface of the curable resin composition or the partially cured product with a protective film as needed.

(γ)使硬化性樹脂組合物或部分硬化物硬化而形成黏著層之步驟。 (γ) A step of curing the curable resin composition or the partially cured product to form an adhesive layer.

本發明之附黏著層之透明面材之製造方法可分為:不具有堰之附黏著層之透明面材(例如第1實施形態之附黏著層之透明面材)之製造方法、與具有堰之附黏著層之透明面材(例如第2實施形態之附黏著層之透明面材)之製造方法。 The method for producing a transparent surface material with an adhesive layer according to the present invention can be classified into a method for producing a transparent surface material having no adhesive layer (for example, a transparent surface material with an adhesive layer according to the first embodiment), and a method for producing the same. A method for producing a transparent surface material with an adhesive layer (for example, a transparent surface material with an adhesive layer according to the second embodiment).

[不具有堰之附黏著層之透明面材之製造方法] [Manufacturing method of transparent surface material without adhesive layer]

作為不具有堰之附黏著層之透明面材之製造方法,例如可列舉:具有下述步驟(α1)、下述步驟(β1)及下述步驟(γ1)之方法。 Examples of the method for producing a transparent surface material having an adhesive layer without a crucible include a method of the following step (α1), the following step (β1), and the following step (γ1).

(α1)向透明面材之表面以層狀之方式供給液狀之黏著層形成用硬化性樹脂組合物,使供給至透明面材之表面之黏著層形成用硬化性樹脂組合物部分地硬化而形成部分硬化物之層的步驟。 (α1) The liquid curable resin composition for forming an adhesive layer is supplied to the surface of the transparent surface material in a layered manner, and the curable resin composition for forming an adhesive layer to be applied to the surface of the transparent surface material is partially cured. A step of forming a layer of a partially cured product.

(β1)視需要,利用保護膜覆蓋部分硬化物之層之表面之步驟。 (β1) A step of covering the surface of the portion of the cured portion with a protective film as needed.

(γ1)使部分硬化物之層進一步硬化而形成黏著層之步驟。 (γ1) A step of further hardening the layer of the partially cured product to form an adhesive layer.

(步驟(α1)) (step (α1))

步驟(α1)可為下述之步驟(α1a),亦可為下述之步驟(α1b)。就黏著層形成用硬化性樹脂組合物之供給、設置硬化所必需之裝置之面積較少亦可之方面、及可抑制供給至透明面材之表面之黏著層形成用硬化性樹脂組合物之周緣部向外側擴展而周緣部厚度變薄的方面而言,較佳為步驟(α1a)。 The step (α1) may be the step (α1a) described below or may be the step (α1b) described below. The periphery of the curable resin composition for forming an adhesive layer, and the area of the device necessary for curing, and the periphery of the curable resin composition for forming an adhesive layer which can be supplied to the surface of the transparent surface material can be suppressed. In the aspect in which the portion is expanded outward and the thickness of the peripheral portion is reduced, the step (α1a) is preferred.

(α1a)向透明面材之表面以層狀之方式供給液狀之黏著層形成用硬化性樹脂組合物,並且使供給至透明面材之表面之黏著層形成用硬化性樹脂組合物部分地硬化而形成部分硬化物之層的步驟。 (α1a) The liquid curable resin composition for forming an adhesive layer is supplied to the surface of the transparent surface material in a layered manner, and the curable resin composition for forming an adhesive layer to be applied to the surface of the transparent surface material is partially hardened. The step of forming a layer of partially hardened material.

(α1b)向透明面材之表面以層狀之方式供給液狀之黏著層形成用硬化性樹脂組合物,形成黏著層形成用硬化性樹脂組合物之層後,使黏著層形成用硬化性樹脂組合物之層部分地硬化而形成部分硬化物之層的步驟。 (α1b) The liquid curable resin composition for forming an adhesive layer is supplied to the surface of the transparent surface material in a layered manner, and a layer of the curable resin composition for forming an adhesive layer is formed, and then the curable resin for forming the adhesive layer is formed. The step of partially curing the layer of the composition to form a layer of partially cured.

黏著層形成用硬化性樹脂組合物之供給係使用模嘴塗佈機、刮刀塗佈機等而進行。 The supply of the curable resin composition for forming an adhesive layer is performed using a die coater, a knife coater, or the like.

關於黏著層形成用硬化性樹脂組合物之硬化,於光硬化性樹脂組合物之情形時,係藉由自光源(紫外線燈、高壓水銀燈、UV-LED等)照射紫外線或短波長之可見光而進行。光照射可於空氣中進行,亦可於氮氣供給下進行。光照射較佳為自供給黏著層形成用硬化性樹 脂組合物之側進行。 The curing of the curable resin composition for forming an adhesive layer is carried out by irradiating ultraviolet rays or short-wavelength visible light from a light source (ultraviolet lamp, high-pressure mercury lamp, UV-LED, etc.) in the case of a photocurable resin composition. . The light irradiation can be carried out in the air or under the supply of nitrogen. Light irradiation is preferably a hardening tree formed from a supply adhesive layer The side of the lipid composition is carried out.

關於黏著層形成用硬化性樹脂組合物之硬化,於熱硬化性樹脂組合物之情形時,係藉由加熱而進行。 The curing of the curable resin composition for forming an adhesive layer is carried out by heating in the case of a thermosetting resin composition.

部分硬化物之層於35℃下之儲存剪切模數係目標之黏著層於35℃下之儲存剪切模數的1/200~1/5。若部分硬化物之層於35℃下之儲存剪切模數為上述下限以上,則重疊保護膜時部分硬化物之層之形狀不會變形。若部分硬化物之層於35℃下之儲存剪切模數為上述上限以下,則與保護膜之密接力充分變高。 The layer of partially cured material is stored at 35 ° C. The storage modulus of the target is 1/200 to 1/5 of the storage shear modulus at 35 ° C. When the storage shear modulus of the layer of the partially cured product at 35 ° C is at least the above lower limit, the shape of the layer of the partially cured product is not deformed when the protective film is superposed. When the storage shear modulus of the layer of the partially cured product at 35 ° C is not more than the above upper limit, the adhesion to the protective film is sufficiently high.

(步驟(β1)) (Step (β1))

於步驟(β1)中,於部分硬化物之層之表面重疊保護膜,利用保護膜覆蓋部分硬化物之層之表面。 In the step (β1), a protective film is superposed on the surface of the partially cured layer, and the surface of the partially cured layer is covered with a protective film.

重疊可於大氣壓下進行,亦可如下述之步驟(β2)般於減壓環境下進行。 The superposition can be carried out under atmospheric pressure, or can be carried out under a reduced pressure atmosphere as in the following step (β2).

較佳為於重疊後,以部分硬化物之層之形狀不會變形之方式,自部分硬化物之層之端慢慢地進行壓接。壓接亦可使用貼合機。 Preferably, after the overlapping, the shape of the layer of the partially cured product is gradually pressed from the end of the layer of the partially cured product so as not to be deformed. A crimping machine can also be used for crimping.

(步驟(γ1)) (step (γ1))

於步驟(γ1)中,使部分硬化物之層進一步硬化而形成黏著層。 In the step (γ1), the layer of the partially cured product is further hardened to form an adhesive layer.

關於部分硬化物之層之硬化,於光硬化性樹脂組合物之情形時,係藉由自光源(紫外線燈、高壓水銀燈、UV-LED等)照射紫外線或短波長之可見光而進行。光照射可於空氣中進行,亦可於氮氣供給下進行。光照射較佳為自保護膜側進行。 The hardening of the layer of the partially cured product is carried out by irradiating ultraviolet rays or short-wavelength visible light from a light source (ultraviolet lamp, high-pressure mercury lamp, UV-LED, etc.) in the case of the photocurable resin composition. The light irradiation can be carried out in the air or under the supply of nitrogen. Light irradiation is preferably performed from the side of the protective film.

關於部分硬化物之層之硬化,於熱硬化性樹脂組合物之情形時,係藉由加熱而進行。 The hardening of the layer of the partially cured product is carried out by heating in the case of the thermosetting resin composition.

[第1實施形態之附黏著層之透明面材之製造方法] [Method for Producing Transparent Surface Material with Adhesive Layer According to First Embodiment]

以下,使用圖式,對第1實施形態之附黏著層之透明面材1之製造方法的一例具體地進行說明。 Hereinafter, an example of a method of producing the transparent surface material 1 with an adhesive layer according to the first embodiment will be specifically described with reference to the drawings.

(步驟(α1)) (step (α1))

於步驟(α1)中,如圖3及圖4所示般,一面使載置於搬送裝置(圖示省略)上之透明面材10向圖中箭頭之方向以一定速度移動,一面自以狹縫(圖示省略)於與透明面材10之移動方向正交之方向延伸之方式配置的模嘴塗佈機62向透明面材10之表面線狀地噴出液狀之第一組合物18。此時,使線狀之第一組合物18之兩端位置於遮光印刷部12上。與透明面材10之移動一起,以覆蓋透明面材10之透光部之整面及遮光印刷部12之內緣側的方式以層狀之方式供給第一組合物18。 In the step (α1), as shown in FIG. 3 and FIG. 4, the transparent surface material 10 placed on the conveying device (not shown) is moved at a constant speed in the direction of the arrow in the figure. The slit coater 62 disposed so as to extend in a direction orthogonal to the moving direction of the transparent face material 10 linearly ejects the liquid first composition 18 onto the surface of the transparent surface material 10. At this time, both ends of the linear first composition 18 are placed on the light-shielding printing portion 12. The first composition 18 is supplied in a layered manner so as to cover the entire surface of the light transmitting portion of the transparent surface material 10 and the inner edge side of the light shielding printing portion 12 together with the movement of the transparent surface material 10.

一面以層狀之方式供給第一組合物18,一面自線狀之LED光源64照射線狀之光(紫外線或短波長之可見光),使供給至透明面材10之表面之第一組合物18硬化而形成部分硬化物之層20,上述線狀之LED光源64係相對於模嘴塗佈機62,於透明面材10之移動方向之下流側,以長度方向與透明面材10之移動方向正交之方式配置。 The first composition 18 is supplied in a layered manner, and linear light (ultraviolet light or short-wavelength visible light) is irradiated from the linear LED light source 64 to supply the first composition 18 to the surface of the transparent surface material 10. The layer 20 of the partially cured product is formed by hardening to form a partially cured product, and the linear LED light source 64 is opposite to the die coater 62 on the flow side below the moving direction of the transparent face material 10, and the longitudinal direction and the moving direction of the transparent face material 10 Orthogonal configuration.

(步驟(β1)) (Step (β1))

於步驟(β1)中,如圖5所示般,於大氣壓下於部分硬化物之層20之表面重疊保護膜16,使用貼合機(圖示省略),自部分硬化物之層20之端慢慢地壓接保護膜16,利用保護膜16覆蓋部分硬化物之層20之表面。 In the step (β1), as shown in Fig. 5, the protective film 16 is superposed on the surface of the layer 20 of the partially cured product under atmospheric pressure, and the end of the layer 20 of the partially cured product is used using a bonding machine (not shown). The protective film 16 is slowly crimped, and the surface of the layer 20 of the partially cured product is covered with the protective film 16.

(步驟(γ1)) (step (γ1))

於步驟(γ1)中,自保護膜16側向部分硬化物之層20照射光(紫外線或短波長之可見光),使部分硬化物之層20進一步硬化而形成黏著層14,藉此獲得如圖1所示之附黏著層之透明面材1。 In the step (γ1), the layer 20 of the partially cured product is irradiated with light (ultraviolet rays or short-wavelength visible light) from the side of the protective film 16 to further harden the layer 20 of the partially cured product to form the adhesive layer 14, thereby obtaining the figure. A transparent face material 1 with an adhesive layer as shown in FIG.

[具有堰之附黏著層之透明面材之製造方法] [Manufacturing method of transparent surface material with adhesive layer attached]

作為具有堰之附黏著層之透明面材之製造方法,例如可列舉具有下述步驟(α21)、下述步驟(α22)、下述步驟(β2)、下述步驟(γ21)及下述步驟(γ22)之方法。 Examples of the method for producing a transparent surface material having an adhesive layer with a crucible include the following steps (α21), the following step (α22), the following step (β2), the following step (γ21), and the following steps. (γ22) method.

(α21)於透明面材之表面之周緣部形成框狀之堰的步驟。 (α21) A step of forming a frame-shaped ridge on the peripheral portion of the surface of the transparent surface material.

(α22)向被堰包圍之區域供給黏著層形成用硬化性樹脂組合物之步驟。 (α22) A step of supplying a curable resin composition for forming an adhesive layer to a region surrounded by the crucible.

(β2)於減壓環境下,將附保護膜之支持面材以保護膜接觸於黏著層形成用硬化性樹脂組合物之層之表面的方式重疊於黏著層形成用硬化性樹脂組合物之層上,而獲得黏著層形成用硬化性樹脂組合物之層被透明面材、保護膜及堰密封之積層體的步驟。 (β2) The protective surface material of the protective film is laminated on the surface of the layer of the curable resin composition for forming an adhesive layer so as to be in contact with the surface of the layer of the curable resin composition for forming an adhesive layer. In the above, a step of obtaining a layered body of a layer of a curable resin composition for forming an adhesive layer by a transparent surface material, a protective film, and a crucible is obtained.

(γ21)於將積層體放置於較步驟(β2)高之壓力環境下之狀態下,使黏著層形成用硬化性樹脂組合物之層硬化而形成黏著層之步驟。 (γ21) A step of forming a layer of the curable resin composition for forming an adhesive layer to form an adhesive layer in a state where the layered body is placed under a pressure environment higher than the step (β2).

(γ22)步驟(γ21)後,將支持面材自保護膜剝離之步驟。 After the step (γ21) (γ22), the step of supporting the face material from the protective film is removed.

(步驟(α21)) (Step (α21))

首先,作為步驟(α21),於透明面材之表面之周緣部塗佈液狀之堰形成用硬化性樹脂組合物而形成堰。 First, in the step (α21), a liquid curable resin composition for forming a crucible is applied to the peripheral portion of the surface of the transparent surface material to form a crucible.

塗佈係使用印刷機、分注器等而進行。堰可為未硬化之狀態,亦可為部分硬化之半硬化狀態。關於堰之部分硬化,於堰形成用硬化性樹脂組合物為光硬化性組合物之情形時,係藉由光之照射而進行。例如,自光源(紫外線燈、高壓水銀燈、UV-LED等)照射紫外線或短波長之可見光,而使光硬化性樹脂組合物部分硬化。 The coating is performed using a printing machine, a dispenser, or the like. The crucible may be in an unhardened state or a partially hardened semi-hardened state. The partial hardening of the crucible is carried out by irradiation of light in the case where the curable resin composition for forming a crucible is a photocurable composition. For example, ultraviolet light or short-wavelength visible light is irradiated from a light source (ultraviolet lamp, high-pressure mercury lamp, UV-LED, etc.) to partially cure the photocurable resin composition.

(步驟(α22)) (Step (α22))

步驟(α21)後,於步驟(α22)中,向被堰包圍之區域供給液狀之黏著層形成用硬化性樹脂組合物。 After the step (α21), a liquid curable resin composition for forming an adhesive layer is supplied to the region surrounded by the crucible in the step (α22).

關於黏著層形成用硬化性樹脂組合物之供給量,係預先設定如下分量,即只要由堰、透明面材及保護膜所形成之空間被黏著層形成用硬化性樹脂組合物所填充,且使透明面材與保護膜之間為特定間隔(即,使黏著層為特定厚度)。此時,較佳為預先考慮由黏著層形成用硬化性樹脂組合物之硬化收縮引起之體積減少。因此,該分量較佳為 如下量,即黏著層形成用硬化性樹脂組合物之厚度較黏著層之特定厚度略厚。 The supply amount of the curable resin composition for forming an adhesive layer is set such that the space formed by the enamel, the transparent surface material, and the protective film is filled with the curable resin composition for forming an adhesive layer, and There is a specific spacing between the transparent face material and the protective film (ie, the adhesive layer is of a specific thickness). In this case, it is preferable to consider the volume reduction caused by the hardening shrinkage of the curable resin composition for forming an adhesive layer in advance. Therefore, the component is preferably The thickness of the curable resin composition for forming an adhesive layer is slightly thicker than the specific thickness of the adhesive layer.

作為供給方法,可列舉如下方法,即水平放置透明面材,藉由分注器、模嘴塗佈機等供給機構,將黏著層形成用硬化性樹脂組合物點狀、線狀或面狀地供給。 The supply method is a method in which a transparent surface material is placed horizontally, and a curable resin composition for forming an adhesive layer is formed in a dot shape, a line shape or a planar shape by a supply mechanism such as a dispenser or a die coater. supply.

(步驟(β2)) (Step (β2))

步驟(α22)後,於步驟(β2)中,將供給有黏著層形成用硬化性樹脂組合物之透明面材放入減壓裝置,於減壓裝置內之固定支持盤上,以黏著層形成用硬化性樹脂組合物之面朝上之方式水平放置透明面材。 After the step (α22), the transparent surface material supplied with the curable resin composition for forming an adhesive layer is placed in a decompression device in a step (β2), and is formed on the fixed support disk in the decompression device by an adhesive layer. The transparent facestock was horizontally placed with the face of the curable resin composition facing up.

於減壓裝置內之上部設置有可向上下方向移動之移動支持機構,於移動支持機構安裝支持面材(玻璃板等)。於支持面材之下側之表面貼合有保護膜。 A movement support mechanism that can move up and down is provided in an upper portion of the decompression device, and a support surface material (glass plate or the like) is attached to the movement support mechanism. A protective film is attached to the surface of the lower side of the support surface material.

支持面材係放置在透明面材之上方且未與黏著層形成用硬化性樹脂組合物接觸之位置。即,使透明面材上之黏著層形成用硬化性樹脂組合物與貼合於支持面材之表面之保護膜不接觸而對向。 The support face material is placed above the transparent face material and is not in contact with the curable resin composition for forming an adhesive layer. In other words, the curable resin composition for forming an adhesive layer on the transparent surface material is opposed to the protective film attached to the surface of the support surface material without being in contact with each other.

將透明面材及支持面材配置於特定位置後,將減壓裝置之內部減壓而設為特定之減壓環境。減壓裝置之內部成為特定之減壓環境後,將移動支持機構所支持之支持面材向下方移動,而將附保護膜之支持面材以保護膜之表面接觸於黏著層形成用硬化性樹脂組合物的方式重疊於透明面材上之第一組合物上。以下,將該重疊而成者稱為積層體。 After the transparent surface material and the support surface material are placed at a specific position, the inside of the pressure reducing device is decompressed to a specific pressure reducing environment. After the inside of the decompression device becomes a specific decompression environment, the support surface material supported by the movement support mechanism is moved downward, and the support surface material with the protective film is brought into contact with the surface of the protective film to form the curable resin for the adhesive layer formation. The manner of the composition is superimposed on the first composition on the transparent facestock. Hereinafter, the overlap is referred to as a laminate.

藉由重疊,而將黏著層形成用硬化性樹脂組合物密封於被透明面材之表面、貼合於支持面材之保護膜之表面、及堰所包圍之空間內。 By laminating, the curable resin composition for forming an adhesive layer is sealed on the surface of the transparent surface material, the surface of the protective film attached to the support surface material, and the space surrounded by the crucible.

重疊時,藉由支持面材之自重、自移動支持機構之壓抵等,而將黏著層形成用硬化性樹脂組合物鋪開,而於上述空間內充滿黏著層 形成用硬化性樹脂組合物,而形成未硬化之黏著層。其後,於步驟(γ21)中暴露於較高之壓力環境時,形成氣泡較少或沒有氣泡之未硬化之黏著層。 When the film is overlapped, the curable resin composition for forming an adhesive layer is spread by supporting the weight of the face material, the pressure of the self-moving support mechanism, and the like, and the adhesive layer is filled in the space. The curable resin composition is formed to form an uncured adhesive layer. Thereafter, when exposed to a higher pressure environment in the step (?21), an uncured adhesive layer having little or no bubbles is formed.

重疊時之減壓環境較佳為1kPa以下,更佳為10~300Pa,進而較佳為15~100Pa。若減壓環境為極度低壓,則有對黏著層形成用硬化性樹脂組合物所包含之各成分(硬化性化合物、光聚合起始劑、聚合抑制劑、鏈轉移劑、光穩定劑等)造成不良影響之虞。例如,若減壓環境為極度低壓,則有各成分氣化之虞,又,有為了提供減壓環境而耗費時間之情況。 The reduced pressure environment at the time of overlap is preferably 1 kPa or less, more preferably 10 to 300 Pa, and still more preferably 15 to 100 Pa. When the pressure-reducing environment is extremely low pressure, each component (curable compound, photopolymerization initiator, polymerization inhibitor, chain transfer agent, light stabilizer, etc.) contained in the curable resin composition for forming an adhesive layer is caused. The impact of adverse effects. For example, if the decompression environment is extremely low pressure, there is a case where the components are vaporized, and it takes time to provide a reduced pressure environment.

關於自將透明面材與支持面材重疊之時點直至解除減壓環境之時間,並無特別限定,可於黏著層形成用硬化性樹脂組合物之密封後,立即解除減壓環境,亦可於黏著層形成用硬化性樹脂組合物之密封後,維持減壓狀態特定時間。 The time from the time when the transparent surface material and the support surface material are overlapped until the pressure-reducing environment is released is not particularly limited, and the pressure-reducing environment can be immediately released after sealing the adhesive layer-forming curable resin composition. After the adhesive layer is sealed with the curable resin composition, the reduced pressure state is maintained for a specific period of time.

(步驟(γ21)) (Step (γ21))

將步驟(β2)中之減壓環境解除後,作為步驟(γ21),係將積層體放置於較步驟(β2)高之壓力環境下。作為較步驟(β2)高之壓力環境,較佳為50kPa以上之壓力環境。 After the reduced pressure environment in the step (β2) is released, the step (γ21) is placed in a pressure environment higher than the step (β2). As a pressure environment higher than the step (β2), a pressure environment of 50 kPa or more is preferable.

若將積層體放置於較步驟(β2)高之壓力環境下,則藉由上升之壓力而將透明面材與支持面材向密接之方向按壓。因此,若於積層體內之密閉空間存在氣泡,則未硬化之黏著層向氣泡流動,從而藉由未硬化之黏著層而均勻地填充密閉空間整體。 When the laminated body is placed in a pressure environment higher than the step (β2), the transparent surface material and the supporting surface material are pressed in the direction in which they are adhered by the rising pressure. Therefore, if air bubbles are present in the sealed space in the laminated body, the uncured adhesive layer flows toward the air bubbles, and the entire sealed space is uniformly filled by the uncured adhesive layer.

關於自將積層體放置於較步驟(β2)高之壓力環境下之時點直至未硬化之黏著層的硬化開始之時間(以下,記載為高壓保持時間),並無特別限定。於將積層體自減壓裝置取出並向硬化裝置移動,於大氣壓環境下開始硬化前之製程的情形時,該製程所需要之時間成為高壓保持時間。 The time from the time when the laminated body is placed in the pressure environment higher than the step (β2) until the hardening of the uncured adhesive layer (hereinafter referred to as the high-pressure holding time) is not particularly limited. When the laminate is taken out from the decompression device and moved to the curing device, and the process before the hardening is started in an atmospheric pressure environment, the time required for the process becomes the high pressure holding time.

因此,於放置於大氣壓環境下之時點以前於積層體之密閉空間內不存在氣泡之情形,或者於上述製程期間氣泡消失之情形時,可立即使未硬化之黏著層硬化。於直至氣泡消失需要時間之情形時,將積層體於較步驟(β2)高之壓力環境下保持直至氣泡消失。又,即便高壓保持時間變長,通常亦不會產生問題,因此就製程上之其他必要性而言,亦可使高壓保持時間變長。高壓保持時間可為1天以上之較長時間,但就生產效率之方面而言,較佳為6小時以內,更佳為1小時以內,就進一步提高生產效率之方面而言,尤佳為10分鐘以內。 Therefore, the uncured adhesive layer can be immediately hardened when there is no bubble in the sealed space of the laminate before being placed in the atmospheric pressure environment, or when the bubble disappears during the above process. When it takes time until the bubble disappears, the laminate is held under a pressure environment higher than the step (β2) until the bubble disappears. Further, even if the high-pressure holding time is long, there is usually no problem, and therefore, the high-voltage holding time can be lengthened in addition to other necessity in the process. The high-pressure holding time may be longer than one day, but in terms of production efficiency, it is preferably within 6 hours, more preferably within 1 hour, and particularly preferably 10 in terms of further improving production efficiency. Within minutes.

繼而,藉由使未硬化之黏著層及未硬化或半硬化之堰硬化,而形成黏著層及堰。此時,未硬化或半硬化之堰之硬化可與未硬化之黏著層之硬化同時進行,亦可於未硬化之黏著層之硬化前預先使未硬化或半硬化之堰硬化。 Then, the adhesive layer and the crucible are formed by hardening the uncured adhesive layer and the uncured or semi-hardened crucible. In this case, the hardening of the unhardened or semi-hardened crucible can be carried out simultaneously with the hardening of the uncured adhesive layer, and the unhardened or semi-hardened crucible can be hardened before the hardening of the uncured adhesive layer.

未硬化之黏著層及未硬化或半硬化之堰於包含光硬化性組合物之情形時,照射光而硬化。例如自光源(紫外線燈、高壓水銀燈、UV-LED等)照射紫外線或短波長之可見光,而使光硬化性樹脂組合物硬化。於透明面材之周緣部形成有遮光印刷部之情形,或者於透明面材設置有抗反射層,而紫外線未透過抗反射層、或者形成有抗反射層之透明樹脂膜或設置於該抗反射膜與透明面材之間之黏著層等的情形時,自支持面材之側照射光。 The uncured adhesive layer and the uncured or semi-hardened enamel are hardened by irradiation with light when the photocurable composition is contained. For example, ultraviolet light or short-wavelength visible light is irradiated from a light source (ultraviolet lamp, high-pressure mercury lamp, UV-LED, etc.) to cure the photocurable resin composition. a case where a light-shielding printing portion is formed on a peripheral portion of the transparent surface material, or an anti-reflection layer is provided on the transparent surface material, and the ultraviolet ray is not transmitted through the anti-reflection layer or the transparent resin film on which the anti-reflection layer is formed or is disposed on the anti-reflection layer. In the case of an adhesive layer or the like between the film and the transparent face material, light is irradiated from the side of the support face material.

(步驟(γ22)) (Step (γ22))

於步驟(γ22)中,藉由將支持面材自保護膜剝離,而獲得預先於透明面材形成有具有充分黏著力之黏著層,且透明面材與黏著層之界面中之氣泡產生得到充分抑制的附黏著層之透明面材。 In the step (γ22), by removing the supporting surface material from the protective film, an adhesive layer having a sufficient adhesive force is formed in advance on the transparent surface material, and the bubble generation in the interface between the transparent surface material and the adhesive layer is sufficiently obtained. A transparent surface material with an adhesive layer that is suppressed.

[第2實施形態之附黏著層之透明面材之製造方法] [Method for Producing Transparent Surface Material with Adhesive Layer According to Second Embodiment]

以下,參照圖式,對第2實施形態之附黏著層之透明面材2之製造方法的一例具體地說明。該製造係依序進行下述之α21、α22、β2、 γ21、γ22之各步驟。 Hereinafter, an example of a method of producing the transparent surface material 2 with an adhesive layer according to the second embodiment will be specifically described with reference to the drawings. The manufacturing system sequentially performs the following α21, α22, β2, Each step of γ21, γ22.

(步驟(α21)) (Step (α21))

如圖6及圖7所示般,沿著透明面材10之周緣部之遮光印刷部12,藉由分注器(圖示省略)等塗佈第二組合物而形成未硬化之堰22。 As shown in FIGS. 6 and 7, the second composition is applied along the light-shielding printing portion 12 of the peripheral portion of the transparent surface material 10 by a dispenser (not shown) to form an unhardened crucible 22.

(步驟(α22)) (Step (α22))

繼而,如圖8及圖9所示般,向透明面材10之被未硬化之堰22所包圍之矩形狀的區域24供給第一組合物26。關於第一組合物26之供給量,係預先設定為如下量,即只要由未硬化之堰22、透明面材10、及保護膜16(參照圖10)所密閉之空間被第一組合物26所填充。 Then, as shown in FIGS. 8 and 9, the first composition 26 is supplied to the rectangular region 24 surrounded by the unhardened crucible 22 of the transparent surface material 10. The supply amount of the first composition 26 is set in advance to the first composition 26 as long as the space sealed by the unhardened crucible 22, the transparent surface material 10, and the protective film 16 (see FIG. 10) is sealed. Filled.

關於第一組合物26之供給,係藉由如圖8及圖9所示般,將透明面材10水平放置於下壓盤28上,藉由向水平方向移動之分注器30而將第一組合物26線狀、帶狀或點狀地供給而實施。 Regarding the supply of the first composition 26, the transparent surface material 10 is horizontally placed on the lower pressure plate 28 as shown in Figs. 8 and 9, and the dispenser 30 is moved in the horizontal direction. The composition 26 is supplied in a line shape, a belt shape, or a dot shape.

分注器30係藉由公知之水平移動機構,而可於區域24之全部範圍內水平移動,上述公知之水平移動機構包含一對進給螺桿32、與正交於進給螺桿32之進給螺桿34。亦可使用模嘴塗佈機代替分注器30。 The dispenser 30 is horizontally movable over the entire range of the region 24 by means of a known horizontal moving mechanism comprising a pair of feed screws 32 and a feed orthogonal to the feed screw 32. Screw 34. Instead of the dispenser 30, a die coater can also be used.

(步驟(β2)) (Step (β2))

繼而,如圖10所示般,將透明面材10、與附保護膜16之支持面材36搬入減壓裝置38內。於減壓裝置38內之上部配置有具有複數個吸附墊40之上壓盤42,於下部設置有下壓盤44。上壓盤42藉由氣缸46而可向上下方向移動。 Then, as shown in FIG. 10, the transparent surface material 10 and the support surface material 36 with the protective film 16 are carried in the pressure reduction device 38. A pressure plate 42 having a plurality of adsorption pads 40 is disposed on the upper portion of the pressure reducing device 38, and a lower pressure plate 44 is disposed at the lower portion. The upper platen 42 is movable in the up and down direction by the air cylinder 46.

支持面材36係使貼合有保護膜16之面朝下而安裝於吸附墊40。透明面材10係使供給有第一組合物26之面朝上而固定於下壓盤44上。 The support surface material 36 is attached to the adsorption pad 40 with the surface on which the protective film 16 is bonded facing downward. The transparent face material 10 is fixed to the lower platen 44 with the surface on which the first composition 26 is supplied facing upward.

繼而,藉由真空泵48而抽吸減壓裝置38內之空氣。減壓裝置38內之環境壓力達到例如15~100Pa之減壓環境後,於藉由上壓盤42之吸附墊40而將支持面材36吸附保持之狀態下,使氣缸46動作而向下方 待機之透明面材10下降。然後,將透明面材10與附保護膜16之支持面材36隔著未硬化之堰22而重疊。如此,構成包含第一組合物26之未硬化之黏著層被透明面材10、保護膜16及未硬化之堰22所密封之積層體,於減壓環境下將積層體保持特定時間。 Then, the air in the decompression device 38 is sucked by the vacuum pump 48. After the ambient pressure in the decompression device 38 reaches a reduced pressure environment of, for example, 15 to 100 Pa, the support surface 36 is sucked and held by the adsorption pad 40 of the upper platen 42, and the cylinder 46 is operated downward. The standby transparent face material 10 is lowered. Then, the transparent surface material 10 and the support surface material 36 with the protective film 16 are overlapped by the unhardened crucible 22. Thus, the laminated body in which the uncured adhesive layer containing the first composition 26 is sealed by the transparent surface material 10, the protective film 16, and the unhardened crucible 22 is held, and the laminated body is held for a specific period of time under a reduced pressure environment.

(步驟(γ21)) (Step (γ21))

繼而,使減壓裝置38之內部為例如大氣壓環境後,將積層體自減壓裝置38取出。若將積層體放置於大氣壓環境下,則藉由大氣壓而按壓積層體之透明面材10側之表面與支持面材36側的表面,從而利用透明面材10與支持面材36對密閉空間內之未硬化之黏著層加壓。藉由該壓力,密閉空間內之未硬化之黏著層流動,而密閉空間整體被未硬化之黏著層均勻地填充。 Then, after the inside of the decompression device 38 is, for example, an atmospheric pressure environment, the laminated body is taken out from the decompression device 38. When the laminated body is placed in an atmospheric pressure environment, the surface on the side of the transparent surface material 10 on the side of the laminated body and the surface on the side of the supporting surface material 36 are pressed by the atmospheric pressure, and the transparent surface material 10 and the supporting surface material 36 are placed in the sealed space. The uncured adhesive layer is pressurized. By this pressure, the uncured adhesive layer in the sealed space flows, and the entire sealed space is uniformly filled by the uncured adhesive layer.

繼而,自支持面材36之側向未硬化之堰22及未硬化之黏著層照射光(紫外線或短波長之可見光),使積層體內部之未硬化之堰22及未硬化之黏著層硬化,而形成黏著層14及堰15。 Then, from the side of the support surface material 36 to the unhardened crucible 22 and the uncured adhesive layer, light (ultraviolet light or short-wavelength visible light) is irradiated to harden the unhardened crucible 22 and the uncured adhesive layer inside the laminated body. The adhesive layer 14 and the crucible 15 are formed.

(步驟(γ22)) (Step (γ22))

繼而,將支持面材36自保護膜16剝離,藉此獲得圖2所示之附黏著層之透明面材2。 Then, the support face material 36 is peeled off from the protective film 16, whereby the transparent face material 2 with the adhesive layer shown in Fig. 2 is obtained.

(其他實施形態) (Other embodiments)

本發明之附黏著層之透明面材之製造方法係製造本發明之附黏著層之透明面材的方法,只要為具有步驟(α)及步驟(γ)之方法即可,並不限定於圖示例之附黏著層之透明面材之製造方法。 The method for producing the transparent surface material with an adhesive layer of the present invention is a method for producing the transparent surface material with an adhesive layer of the present invention, and the method is not limited to the method as long as it has the steps (α) and (γ). An example of a method for producing a transparent face material with an adhesive layer.

例如,亦可將附黏著層之透明面材之保護膜之周緣部於減壓條件下以遍及全周之方式與透明面材氣密性地接合。具體而言,亦可將圖1所示之附黏著層之透明面材1之保護膜16的周緣部於減壓條件下以遍及全周之方式與透明面材10之任一位置(側面、下表面、上表面等)氣密性地接合。藉此,黏著層14被保護膜16氣密性地包裹,因此可確 實防止外部氣體向黏著層14混入。 For example, the peripheral edge portion of the protective film of the transparent surface material with the adhesive layer may be hermetically bonded to the transparent surface material over the entire circumference under reduced pressure. Specifically, the peripheral edge portion of the protective film 16 of the transparent surface material 1 with the adhesive layer shown in FIG. 1 may be applied to the transparent surface material 10 over the entire circumference under reduced pressure conditions (side surface, The lower surface, the upper surface, and the like) are hermetically joined. Thereby, the adhesive layer 14 is hermetically wrapped by the protective film 16, so that it can be confirmed The external air is prevented from entering the adhesive layer 14.

又,亦可將附黏著層之透明面材於減壓條件下封入包含具有阻氣性之膜之封入體中。藉此,亦可謀求防止外部氣體向黏著層混入。 Further, the transparent surface material with the adhesive layer may be sealed in a sealed body containing a film having gas barrier properties under reduced pressure. Thereby, it is also possible to prevent the outside air from being mixed into the adhesive layer.

(作用機制) (Mechanism)

關於以上所說明之本發明之附黏著層之透明面材之製造方法,其係製造本發明之附黏著層之透明面材之方法,且具有步驟(α)及步驟(γ),因此,可製造與被貼合物貼合時,殘留於被貼合物與黏著層之界面之氣泡可迅速消失的附黏著層之透明面材。 The method for producing a transparent surface material with an adhesive layer of the present invention described above, which is a method for producing a transparent surface material with an adhesive layer of the present invention, and has the steps (α) and (γ), and thus When the film is bonded to the adherend, the transparent surface material of the adhesive layer which remains in the bubble at the interface between the adhesive composition and the adhesive layer can be quickly disappeared.

<顯示裝置> <display device>

圖11係表示本發明之顯示裝置之一例之剖面圖。 Figure 11 is a cross-sectional view showing an example of a display device of the present invention.

顯示裝置3具有:顯示面板50、與以黏著層14接觸於顯示面板50之方式貼合於顯示面板50之附黏著層之透明面材2。 The display device 3 includes a display panel 50 and a transparent face material 2 attached to an adhesive layer of the display panel 50 so as to be in contact with the display panel 50 with the adhesive layer 14.

顯示裝置3具有:透明面材10、顯示面板50、透明面材10及顯示面板50所夾持之黏著層14、包圍黏著層14之周圍之堰15、連接於顯示面板50之搭載有使顯示面板50動作之驅動IC之軟性印刷佈線板60(FPC)。 The display device 3 includes a transparent surface material 10, a display panel 50, a transparent surface material 10, and an adhesive layer 14 sandwiched between the display panel 50, a crucible 15 surrounding the adhesive layer 14, and a display connected to the display panel 50 for display. The flexible printed wiring board 60 (FPC) of the driving IC in which the panel 50 operates.

(顯示面板) (display panel)

如圖11所示般,顯示面板50係如下構成之液晶面板之一例,即將設置有彩色濾光片之透明基板52、與設置有TFT(Thin-film transistor,薄膜電晶體)之透明基板54隔著液晶層56貼合,且其被一對偏光板58所挾持。 As shown in FIG. 11, the display panel 50 is an example of a liquid crystal panel having a color filter, and a transparent substrate 52 provided with a color filter and a transparent substrate 54 provided with a TFT (Thin-film transistor). The liquid crystal layer 56 is attached and held by a pair of polarizing plates 58.

針對顯示面板50與黏著層14之接合面,為了提高與黏著層14之密接性,亦可實施表面處理。關於表面處理,可僅周緣部進行,亦可面材之表面整體進行。作為表面處理之方法,可列舉:利用可低溫加工之接著用底塗劑等進行處理之方法等。 The surface of the joint between the display panel 50 and the adhesive layer 14 may be subjected to surface treatment in order to improve adhesion to the adhesive layer 14. The surface treatment may be performed only on the peripheral portion, or the entire surface of the surface material may be performed. As a method of surface treatment, a method of treating with a primer or the like by low-temperature processing may be mentioned.

關於顯示面板50之厚度,於藉由TFT而動作之液晶面板之情形 時,顯示面板50之厚度大多為0.4~4mm左右,於EL面板之情形時,顯示面板50之厚度大多0.2~3mm左右。 Regarding the thickness of the display panel 50, the case of the liquid crystal panel that operates by the TFT The thickness of the display panel 50 is usually about 0.4 to 4 mm. In the case of the EL panel, the thickness of the display panel 50 is usually about 0.2 to 3 mm.

(形狀) (shape)

關於顯示面板50之形狀,通常為矩形。透明面材10與顯示面板50之尺寸亦可大致相等,就與收納顯示裝置之其他殼體之關係而言,亦可使透明面材10比顯示面板50大一圈。又,反之,亦可根據其他殼體之構造,而使透明面材10比顯示面板50小若干。 Regarding the shape of the display panel 50, it is generally rectangular. The transparent face material 10 and the display panel 50 may be substantially equal in size, and the transparent face material 10 may be made larger than the display panel 50 in relation to the other housings accommodating the display device. Further, conversely, the transparent face material 10 may be made smaller than the display panel 50 in accordance with the configuration of the other casings.

(其他實施形態) (Other embodiments)

本發明之顯示裝置只要為於顯示面板貼合有本發明之附黏著層之透明面材者即可,並不限定於圖示例者。 The display device of the present invention is not limited to the illustrated example as long as it is a transparent surface material to which the adhesive layer of the present invention is attached to the display panel.

例如,顯示面板並不限定於圖11所示之液晶面板。 For example, the display panel is not limited to the liquid crystal panel shown in FIG.

顯示面板係於至少一者為透明電極之一對電極間、或者具有形成於同一面內之複數個電極對之基板與透明基板之間等夾持有藉由外部之電氣訊號而光學特性變化的顯示材者。根據顯示材之種類,有液晶面板、EL面板、電漿面板、電子油墨型面板等。 The display panel is characterized in that at least one of the transparent electrodes is sandwiched between the electrodes, or between the substrate and the transparent substrate having a plurality of pairs of electrodes formed in the same plane, and optical characteristics are changed by external electrical signals. Display material. Depending on the type of display material, there are liquid crystal panels, EL panels, plasma panels, electronic ink panels, and the like.

又,顯示面板具有將至少一者為透明基板之一對面材貼合之構造,且以透明基板側與黏著層接觸之方式配置。此時,於一部分之顯示面板中,有於與黏著層接觸之側之透明基板之最外層側設置有偏光板、相位差板等光學膜之情況。於該情形時,黏著層成為將顯示面板上之光學膜與透明面材接合之樣態。 Further, the display panel has a structure in which at least one of the transparent substrates is bonded to the face material, and is disposed such that the transparent substrate side is in contact with the adhesive layer. At this time, in some of the display panels, an optical film such as a polarizing plate or a retardation film is provided on the outermost layer side of the transparent substrate on the side in contact with the adhesive layer. In this case, the adhesive layer serves to bond the optical film on the display panel to the transparent face material.

(作用機制) (Mechanism)

關於以上所說明之本發明之顯示裝置,其係於顯示面板貼合有本發明之附黏著層之透明面材者,因此成為可抑制氣泡殘留於顯示面板與黏著層之界面者。 In the display device of the present invention described above, the transparent surface material to which the adhesive layer of the present invention is attached is attached to the display panel. Therefore, it is possible to suppress the air bubbles from remaining on the interface between the display panel and the adhesive layer.

<顯示裝置之製造方法> <Method of Manufacturing Display Device>

製造本發明之顯示裝置時,自本發明之附黏著層之透明面材剝 離保護膜(保護材)後,將顯示面板與附黏著層之透明面材以黏著層接觸於顯示面板之方式重疊並貼合。 When manufacturing the display device of the present invention, the transparent surface material of the adhesive layer of the present invention is peeled off After leaving the protective film (protective material), the display panel and the transparent surface material with the adhesive layer are overlapped and adhered in such a manner that the adhesive layer contacts the display panel.

顯示裝置之製造方法亦可為包含以下所示之步驟S1、S2之方法。 The method of manufacturing the display device may be a method including the steps S1 and S2 shown below.

(步驟S1:保護膜剝離步驟) (Step S1: Protective film peeling step)

於該步驟中,自黏著層被保護膜覆蓋之附黏著層之透明面材將保護膜剝離。保護膜之剝離可於大氣中實施,亦可於減壓環境下實施。只要剝離保護膜後,可於將附黏著層之透明面材移送至步驟S2中所使用之減壓容器之內部前之期間,不將附黏著層之透明面材暴露於大氣中而於減壓環境下保管,則較佳為於減壓環境下實施保護膜之剝離。 In this step, the protective film is peeled off from the transparent face material of the adhesive layer covered by the protective film. The peeling of the protective film can be carried out in the atmosphere or under reduced pressure. After the protective film is peeled off, the transparent surface material with the adhesive layer can be exposed to the atmosphere without being exposed to the atmosphere before the transparent surface material of the adhesive layer is transferred to the inside of the reduced pressure container used in the step S2. In the case of storage in an environment, it is preferred to carry out the peeling of the protective film in a reduced pressure environment.

其中,就生產設備等情況而言,實際上難以於減壓環境下實施保護膜之剝離之情況較多。於該情形時,即便於大氣中實施保護膜之剝離亦無特別問題。就於保護膜剝離步驟中無需準備減壓容器之方面而言,較佳為於大氣中實施保護膜之剝離。保護膜之剝離後,較佳為迅速進行接下來之步驟S2。 Among them, in the case of production equipment and the like, it is actually difficult to carry out the peeling of the protective film in a reduced pressure environment. In this case, there is no particular problem even if the peeling of the protective film is carried out in the atmosphere. In the case where the pressure-reducing container is not required to be prepared in the protective film peeling step, it is preferred to carry out the peeling of the protective film in the atmosphere. After the peeling of the protective film, it is preferred to proceed to the next step S2 quickly.

(步驟S2:貼合步驟) (Step S2: lamination step)

於該步驟中,於貼合裝置中,將顯示面板與附黏著層之透明面材於以黏著層接觸於顯示面板之方式重疊之狀態下貼合。此時,較佳為於貼合裝置之減壓容器中,將顯示面板與附黏著層之透明面材於減壓環境下貼合。藉由於減壓環境下貼合,而變得難以於顯示面板與黏著層之界面產生氣泡。於減壓容器之內部,將減壓環境保持特定時間後,將減壓環境解除而設為常壓。 In this step, in the bonding apparatus, the display panel and the transparent surface material with the adhesive layer are bonded together in such a manner that the adhesive layer is in contact with the display panel. In this case, it is preferable that the display panel and the transparent surface material with the adhesive layer are bonded together under a reduced pressure environment in the pressure reduction container of the bonding apparatus. It is difficult to generate bubbles at the interface between the display panel and the adhesive layer by bonding under a reduced pressure environment. After the pressure reduction environment was maintained for a predetermined period of time inside the decompression container, the reduced pressure environment was released and the pressure was normal pressure.

貼合時之減壓環境較佳為20kPa以下,更佳為15~0.5kPa,進而較佳為10~0.2kPa。若減壓度為上述上限以下,則氣泡難以殘留,若減壓度為下限以上,則變得無需大規模之減壓裝置。 The pressure reducing environment at the time of bonding is preferably 20 kPa or less, more preferably 15 to 0.5 kPa, still more preferably 10 to 0.2 kPa. When the degree of pressure reduction is less than or equal to the above upper limit, bubbles are less likely to remain, and when the degree of pressure reduction is at least the lower limit, a large-scale pressure reducing device is not required.

關於自將顯示面板與附黏著層之透明面材重疊之時點直至解除減壓環境的時間,就生產效率之方面而言,較佳為短時間者。例如較佳為1分鐘以內,更佳為10秒鐘以內。 Regarding the time from the time when the display panel and the transparent surface material with the adhesive layer are overlapped until the decompression environment is released, it is preferable that the production efficiency is short. For example, it is preferably within 1 minute, more preferably within 10 seconds.

將顯示面板與附黏著層之透明面材貼合後,亦可向硬化不完全之黏著層再次照射光、或者加熱,藉此促進黏著層之硬化,而使黏著層之硬化狀態穩定。 After the display panel is bonded to the transparent surface material to which the adhesive layer is attached, the adhesive layer may be irradiated again with light or heated, thereby promoting the hardening of the adhesive layer and stabilizing the hardened state of the adhesive layer.

於附黏著層之透明面材具有可撓性之情形時,亦可利用如下方式貼合:以附黏著層之透明面材之形成有黏著層之面側成為凸起的方式設為使附黏著層之透明面材彎曲的狀態,將附黏著層之透明面材自一端側向另一端側慢慢地重疊於顯示面板。根據該方法,一面將存在於附黏著層之透明面材與顯示面板之間之空間的氣體自一端側向另一端側擠出,一面貼合,因此於顯示面板與黏著層之界面變得難以產生氣泡。 When the transparent surface material to which the adhesive layer is attached is flexible, it may be bonded by attaching the surface of the transparent surface material with the adhesive layer to the surface on which the adhesive layer is formed to be convex. When the transparent surface material of the layer is bent, the transparent surface material with the adhesive layer is gradually superposed on the display panel from one end side to the other end side. According to this method, the gas existing in the space between the transparent surface material of the adhesive layer and the display panel is extruded from the one end side to the other end side, and the gas is bonded to the interface between the display panel and the adhesive layer. Create bubbles.

(作用機制) (Mechanism)

如圖12所示般,有剛將附黏著層之透明面材2與顯示面板50貼合後,於顯示面板50與黏著層14之界面產生作為密閉之空間之氣泡M1、M2的情況,但剛貼合後所產生之氣泡M1、M2基本上經過特定時間後消失。 As shown in FIG. 12, the transparent surface material 2 with an adhesive layer is bonded to the display panel 50, and the bubbles M1 and M2 which are the sealed spaces are formed at the interface between the display panel 50 and the adhesive layer 14, but The bubbles M1, M2 generated immediately after the bonding are substantially disappeared after a certain period of time.

本發明者等人推測剛貼合後所產生之氣泡消失之機制如下所述。於氣泡之體積縮小之過程中,可認為有P1、P2、P3之3個過程。 The inventors of the present invention have estimated that the mechanism of the disappearance of the bubble generated immediately after the bonding is as follows. In the process of shrinking the volume of the bubble, it is considered that there are three processes of P1, P2, and P3.

(過程P1:利用貼合差壓之體積縮小) (Process P1: shrinking by the volume of the bonded differential pressure)

過程P1係於減壓環境下將顯示面板與附黏著層之透明面材貼合後,恢復至常壓環境下後,產生處於減壓狀態之氣泡內之壓力、與自外部向黏著層施加之壓力(即,恢復至大氣壓環境下時之大氣壓)的差壓,由於該差壓而氣泡之體積減少之過程。過程P1之期間例如為數秒鐘左右。即,自將壓力恢復至常壓環境之時點數秒鐘後氣泡之體積急 遽縮小。 Process P1 is a method in which a display panel and a transparent surface material with an adhesive layer are bonded together under a reduced pressure environment, and after returning to a normal pressure environment, a pressure in a bubble in a decompressed state is generated, and a pressure is applied from the outside to the adhesive layer. The differential pressure of the pressure (i.e., the atmospheric pressure when returning to the atmospheric pressure environment), the process of reducing the volume of the bubble due to the differential pressure. The period of the process P1 is, for example, about several seconds. That is, the volume of the bubble is urgent after a few seconds from the time when the pressure is restored to the atmospheric environment. 遽 Zoom out.

(過程P2:由黏著層吸收氣泡內氣體引起之體積縮小) (Process P2: the volume caused by the absorption of gas in the bubble by the adhesive layer is reduced)

過程P2係密封於氣泡內之氣體被與氣泡接觸之黏著層吸收並溶解,藉此氣泡之體積減少之過程。過程P2之期間例如為數分鐘~數10分鐘左右。過程P2中之氣泡之體積縮小之速度比過程P1中的氣泡之體積縮小之速度慢。 The process P2 is a process in which the gas sealed in the bubble is absorbed and dissolved by the adhesive layer in contact with the bubble, whereby the volume of the bubble is reduced. The period of the process P2 is, for example, several minutes to several ten minutes. The volume of the bubble in the process P2 is reduced at a slower rate than the volume of the bubble in the process P1.

(過程P3:由氣體於黏著層內之擴散引起之體積縮小) (Process P3: volume reduction caused by diffusion of gas into the adhesive layer)

過程P3係伴隨著過程P2中溶解於黏著層之氣體自氣泡之周圍向其外側擴散,從而氣泡內之氣體被與氣泡接觸之黏著層再吸收並再次溶解,藉此氣泡之體積減少之過程。 The process P3 is accompanied by a process in which the gas dissolved in the adhesive layer in the process P2 diffuses from the periphery of the bubble to the outside thereof, so that the gas in the bubble is reabsorbed by the adhesive layer in contact with the bubble and is dissolved again, whereby the volume of the bubble is reduced.

即,經過程P2而殘留於氣泡內之氣體濃度與氣泡周圍之溶解於黏著層之氣體濃度成為大致平衡狀態。然而,此時,氣泡周圍之溶解於黏著層之氣體濃度與遠離氣泡之位置之黏著層中的氣體濃度成為非平衡狀態,因此溶解於黏著層之氣體自氣泡之周圍向其進一步外側擴散。 That is, the concentration of the gas remaining in the bubble through the process P2 and the concentration of the gas dissolved in the adhesive layer around the bubble are substantially balanced. However, at this time, the concentration of the gas dissolved in the adhesive layer around the bubble and the concentration of the gas in the adhesive layer away from the bubble become a non-equilibrium state, so that the gas dissolved in the adhesive layer diffuses further outward from the bubble.

經該過程,氣泡內之氣體被與氣泡接觸之黏著層再吸收並再次溶解。過程P3之期間例如為數小時以上。過程P3中之氣泡之體積縮小之速度取決於黏著層內的氣體之擴散速度,因此比過程P2中之氣泡之體積縮小之速度更慢。經過程P3,氣泡大致完全消失。 Through this process, the gas in the bubble is reabsorbed by the adhesive layer in contact with the bubble and dissolved again. The period of the process P3 is, for example, several hours or more. The rate at which the volume of the bubble in the process P3 is reduced depends on the diffusion speed of the gas in the adhesive layer, and therefore is slower than the volume of the bubble in the process P2. Through the process P3, the bubbles almost completely disappear.

如上述般,剛將附黏著層之透明面材2與顯示面板50貼合後,於顯示面板50與黏著層14之界面產生氣泡(圖12之M1、M2)。 As described above, immediately after the transparent surface material 2 with the adhesive layer is bonded to the display panel 50, air bubbles are generated at the interface between the display panel 50 and the adhesive layer 14 (M1, M2 in Fig. 12).

本發明者等人研究之結果,可知於先前之附黏著層之透明面材中,於製造後長期保管之情形時,有氣泡消失需要較長時間之傾向,但根據本發明之附黏著層之透明面材,即便於製造後經較長期間後用於與被貼合體之貼合之情形時,氣泡亦於短時間內消失。 As a result of research by the inventors of the present invention, it has been found that in the case of the transparent surface material of the prior adhesive layer, it is necessary to have a long time for the bubble to disappear in the case of long-term storage after the production, but the adhesive layer according to the present invention is used. The transparent surface material disappears in a short time even when it is used for bonding to the bonded body after a long period of time after manufacture.

於使用本發明之附黏著層之透明面材之情形時,關於氣泡於短 時間內消失之原因,可如下述般推測。 In the case of using the transparent face material with the adhesive layer of the present invention, the bubble is short The reason for disappearing in time can be estimated as follows.

如上述般,本發明之附黏著層之透明面材之黏著層中的羥基濃度為600×10-6mol/g以下,黏著層中之胺基甲酸酯鍵濃度為150×10-6mol/g以下。因此,該黏著層之凝集力較弱,而氣體向黏著層中之擴散變得容易。藉此,過程P2、P3變快,作為結果,殘留之氣泡於短時間內消失。 As described above, the concentration of the hydroxyl group in the adhesive layer of the transparent surface material of the adhesive layer of the present invention is 600×10 -6 mol/g or less, and the concentration of the urethane bond in the adhesive layer is 150×10 -6 mol. /g below. Therefore, the cohesive force of the adhesive layer is weak, and diffusion of gas into the adhesive layer becomes easy. Thereby, the processes P2 and P3 become faster, and as a result, the remaining bubbles disappear in a short time.

(其他實施形態) (Other embodiments)

本發明之顯示裝置之製造方法係製造本發明之顯示裝置的方法,只要為於減壓環境下,將顯示面板與附黏著層之透明面材以黏著層接觸於顯示面板之方式重疊並貼合之方法即可,並不限定於上述之製造方法。 The manufacturing method of the display device of the present invention is a method for manufacturing the display device of the present invention, as long as the display panel and the transparent surface material with the adhesive layer are overlapped and adhered to the display panel in an adhesive layer under a reduced pressure environment. The method is not limited to the above-described manufacturing method.

例如,於上述之製造方法中,於第2實施形態之附黏著層之透明面材之製造步驟中將黏著層放置於減壓條件下,藉此黏著層之氣體含量變少,藉由放置於減壓下而黏著層之氣體含量變少之步驟只要於將附黏著層之透明面材貼合於被貼合物之步驟前,則可為任意時點。 For example, in the above-described manufacturing method, in the manufacturing step of the transparent surface material with an adhesive layer according to the second embodiment, the adhesive layer is placed under reduced pressure, whereby the gas content of the adhesive layer is reduced, and The step of reducing the gas content of the adhesive layer under reduced pressure may be any time before the step of bonding the transparent surface material of the adhesive layer to the adherend.

又,於不偏離本發明之主旨之範圍內可追加各種變更。 Further, various modifications can be added without departing from the spirit of the invention.

例如,附黏著層之透明面材亦可貼合於觸控面板等座標輸入裝置。 For example, the transparent surface material with an adhesive layer can also be attached to a coordinate input device such as a touch panel.

又,透明面材亦可為附觸控面板之顯示裝置中之構成觸控面板部分之附透明電極之基板。亦可於附透明電極之基板之兩面形成黏著層,亦可將透明面材與顯示面板隔著兩面形成有黏著層之附透明電極之基板而貼合。 Moreover, the transparent surface material may also be a substrate with a transparent electrode constituting the touch panel portion in the display device with the touch panel. An adhesive layer may be formed on both surfaces of the substrate with the transparent electrode, or the transparent surface material and the display panel may be bonded to each other via a substrate with a transparent electrode on which the adhesive layer is formed on both sides.

<黏著片> <adhesive sheet>

本發明之黏著片包含黏著片形成用硬化性樹脂組合物之硬化物。 The adhesive sheet of the present invention contains a cured product of a curable resin composition for forming an adhesive sheet.

本發明之黏著片亦可為視需要,於黏著片之一表面或兩面進而 具有可剝離之保護膜之附保護膜之黏著片。 The adhesive sheet of the present invention may be optionally applied to one or both sides of the adhesive sheet. An adhesive sheet with a protective film attached to a peelable protective film.

黏著片係使上述之附黏著層之透明面材中之黏著層於沒有透明面材之情況下單獨存在者。因此,黏著片之特性及材料、以及較佳之態樣係與上述黏著層相同,而省略其詳細之說明。 The adhesive sheet is such that the adhesive layer in the transparent face material of the above-mentioned adhesive layer exists alone without a transparent face material. Therefore, the characteristics and materials of the adhesive sheet, and the preferred embodiment are the same as those of the above-mentioned adhesive layer, and detailed description thereof will be omitted.

黏著片例如可藉由使用保護膜、或附保護膜之支持面材代替透明面材,並藉由與附黏著層之透明面材之製造方法相同之製造方法而製造。 The adhesive sheet can be produced, for example, by using a protective film or a support surface material with a protective film instead of the transparent face material, and by the same manufacturing method as that of the transparent face material to which the adhesive layer is attached.

關於以上所說明之本發明之黏著片,其黏著片層中之羥基濃度為600×10-6mol/g以下,黏著片中之胺基甲酸酯鍵濃度為150×10-6mol/g以下,因此與被貼合物(透明面材、顯示面板等)貼合時,殘留於被貼合物與黏著片之界面之氣泡可迅速地消失。又,黏著片中之羥基濃度為100×10-6mol/g以上,因此黏著片與被貼合物(例如,透明面材、顯示面板等)之密接性變良好。 In the adhesive sheet of the present invention as described above, the concentration of the hydroxyl group in the adhesive sheet layer is 600 × 10 -6 mol/g or less, and the concentration of the urethane bond in the adhesive sheet is 150 × 10 -6 mol/g. In the following, when it is bonded to the adherend (transparent surface material, display panel, etc.), the bubbles remaining at the interface between the adherend and the adhesive sheet can be quickly disappeared. Further, since the concentration of the hydroxyl group in the adhesive sheet is 100 × 10 -6 mol/g or more, the adhesion between the adhesive sheet and the adherend (for example, a transparent surface material, a display panel, etc.) is improved.

實施例 Example

以下,列舉實施例而對本發明具體地說明,但本發明並不受彼等例限定。 Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by the examples.

例1、2、4、5為實施例,例3、6為比較例。 Examples 1, 2, 4, and 5 are examples, and examples 3 and 6 are comparative examples.

各例中之透明面材、被貼合物、附保護膜之支持面材、硬化性低聚物(A)、非硬化性低聚物(C)、第一組合物、第二組合物係如下述般製作者。 The transparent surface material, the adherend, the protective surface material with a protective film, the curable oligomer (A), the non-hardening oligomer (C), the first composition, and the second composition system in each example Produced as follows.

(透明面材) (transparent surface material)

透明面材(1): Transparent surface material (1):

於長度240mm、寬度190mm、厚度1.3mm之鈉鈣玻璃板之一表面之周緣部,以透光部成為長度218mm、寬度168mm之方式,藉由利用包含黑色顏料之油墨之印刷而將遮光印刷部形成為邊框狀,從而製作透明面材(1)。 In the peripheral portion of the surface of one of the soda lime glass sheets having a length of 240 mm, a width of 190 mm, and a thickness of 1.3 mm, the light-shielding portion is formed by printing using an ink containing a black pigment so that the light-transmitting portion has a length of 218 mm and a width of 168 mm. It is formed into a frame shape to produce a transparent face material (1).

透明面材(2): Transparent surface material (2):

於長度100mm、寬度100mm、厚度1.3mm之鈉鈣玻璃板之一表面之周緣部,以透光部成為長度85mm、寬度85mm之方式,藉由利用包含黑色顏料之油墨之印刷而將遮光印刷部形成為邊框狀,從而製作透明面材(2)。 In the peripheral portion of the surface of one of the soda lime glass sheets having a length of 100 mm, a width of 100 mm, and a thickness of 1.3 mm, the light-shielding portion is printed by using a black pigment-containing ink so that the light-transmitting portion has a length of 85 mm and a width of 85 mm. It is formed into a frame shape to produce a transparent face material (2).

(被貼合物) (attached)

被貼合物(1): Admixture (1):

於長度220mm、寬度170mm、厚度1.1mm之鈉鈣玻璃板之一面貼合附黏著層之偏光板(Polatechno公司製造,KN-18240T),而製成代替液晶面板之被貼合物(1)。 A polarizing plate (manufactured by Polatechno Co., Ltd., KN-18240T) having an adhesive layer was attached to one surface of a soda lime glass plate having a length of 220 mm, a width of 170 mm, and a thickness of 1.1 mm to prepare a laminate (1) in place of the liquid crystal panel.

被貼合物(2): Attached compound (2):

於長度90mm、寬度90mm、厚度2mm之鈉鈣玻璃板之一面貼合附黏著層之偏光板(Polatechno公司製造,KN-18240T),而製成代替液晶顯示面板之被貼合物(2)。 A polarizing plate (manufactured by Polatechno Co., Ltd., KN-18240T) having an adhesive layer was attached to one surface of a soda lime glass plate having a length of 90 mm, a width of 90 mm, and a thickness of 2 mm to prepare a laminate (2) in place of the liquid crystal display panel.

(附保護膜之支持面材) (with protective film support surface)

將長度130mm、寬度130mm、厚度0.75mm之保護膜(Mitsui Chemicals Tohcello公司製造,PURETECT(註冊商標)VLH-9)以保護膜之黏著面接觸於玻璃之方式貼合於包含長度100mm、寬度100mm、厚度2mm之鈉鈣玻璃板之支持面材之一面,而製作附保護膜之支持面材。 A protective film having a length of 130 mm, a width of 130 mm, and a thickness of 0.75 mm (manufactured by Mitsui Chemicals Tohcello Co., Ltd., PURETECT (registered trademark) VLH-9) was attached to a glass having a length of 100 mm and a width of 100 mm so that the adhesive surface of the protective film was in contact with the glass. One side of the supporting surface material of the soda lime glass plate having a thickness of 2 mm is used to produce a supporting surface material with a protective film.

(硬化性低聚物(A)) (curable oligomer (A))

UA-1: UA-1:

將2官能之聚丙二醇(自羥值算出之數量平均分子量:18000)、與異佛爾酮二異氰酸酯以成為4:5之莫耳比混合,於錫化合物之觸媒存在下,於70℃下反應而獲得預聚物,以預聚物與丙烯酸2-羥基乙酯成為大致1:2之莫耳比向該預聚物添加丙烯酸2-羥基乙酯,於70℃下反 應,藉此獲得丙烯酸胺基甲酸酯低聚物(以下,記載為UA-1)。 The bifunctional polypropylene glycol (the number average molecular weight calculated from the hydroxyl value: 18,000) and the isophorone diisocyanate are mixed at a molar ratio of 4:5, in the presence of a catalyst of a tin compound, at 70 ° C The reaction was carried out to obtain a prepolymer, and 2-hydroxyethyl acrylate was added to the prepolymer by a prepolymer and 2-hydroxyethyl acrylate to a molar ratio of approximately 1:2, which was reversed at 70 ° C. In this way, an urethane urethane oligomer (hereinafter referred to as UA-1) is obtained.

UA-1之加成聚合性不飽和雙鍵之平均數為2,數量平均分子量為約73000,25℃下之黏度為約250Pa‧s。 The average number of addition polymerizable unsaturated double bonds of UA-1 was 2, the number average molecular weight was about 73,000, and the viscosity at 25 ° C was about 250 Pa‧s.

UA-2 UA-2

使用2官能之聚丙二醇(自羥值算出之數量平均分子量:10000),除此以外,利用與UA-1相同之方法獲得丙烯酸胺基甲酸酯低聚物(以下,記載為UA-2)。 An urethane urethane oligomer (hereinafter referred to as UA-2) was obtained by the same method as UA-1 except that a bifunctional polypropylene glycol (a number average molecular weight calculated from a hydroxyl value: 10,000) was used. .

UA-2之加成聚合性不飽和雙鍵之平均數為2,數量平均分子量為約41000,25℃下之黏度為約250Pa‧s。 The average number of addition polymerizable unsaturated double bonds of UA-2 was 2, the number average molecular weight was about 41,000, and the viscosity at 25 ° C was about 250 Pa‧s.

UA-3 UA-3

使用分子末端經環氧乙烷改性之2官能之聚丙二醇(自羥值算出之數量平均分子量:4000),除此以外,利用與UA-1相同之方法獲得丙烯酸胺基甲酸酯低聚物(以下,記載為UA-3)。 The urethane amide oligomerization was obtained by the same method as UA-1, using a 2-functional polypropylene glycol having a molecular end modified with ethylene oxide (a number average molecular weight calculated from a hydroxyl value: 4000). (hereinafter referred to as UA-3).

UA-3之加成聚合性不飽和雙鍵之平均數為2,數量平均分子量為約17300,25℃下之黏度為約250Pa‧s。 The average number of addition polymerizable unsaturated double bonds of UA-3 was 2, the number average molecular weight was about 17,300, and the viscosity at 25 ° C was about 250 Pa‧s.

UA-4 UA-4

將分子末端經環氧乙烷改性之2官能之聚丙二醇(自羥值算出之數量平均分子量:4000)、與六亞甲基二異氰酸酯以莫耳比6:7混合,繼而利用丙烯酸異酯(大阪有機化學工業公司製造,IBXA)稀釋後,於錫觸媒之存在下,於70℃下反應而獲得預聚物。將丙烯酸2-羥基乙酯以預聚物與丙烯酸2-羥基乙酯以莫耳比計成為1:2之方式添加於所獲得之預聚物,於70℃下反應,而獲得經30質量%之丙烯酸異酯稀釋之丙烯酸胺基甲酸酯低聚物(UA-4)(以下,記載為UA-4)。 A bifunctional polypropylene glycol having a molecular end modified with ethylene oxide (a number average molecular weight calculated from a hydroxyl value: 4000), and a hexamethylene diisocyanate mixed at a molar ratio of 6:7, followed by an acrylic acid The ester (manufactured by Osaka Organic Chemical Industry Co., Ltd., IBXA) was diluted, and reacted at 70 ° C in the presence of a tin catalyst to obtain a prepolymer. 2-hydroxyethyl acrylate was added to the obtained prepolymer in such a manner that the prepolymer and 2-hydroxyethyl acrylate were 1:2 in molar ratio, and reacted at 70 ° C to obtain 30% by mass. Acrylic The ester-diluted urethane urethane oligomer (UA-4) (hereinafter referred to as UA-4).

UA-4之加成聚合性不飽和雙鍵之平均數為2,數量平均分子量為55000,60℃下之黏度為580Pa‧s。 The average number of addition polymerizable unsaturated double bonds of UA-4 was 2, the number average molecular weight was 55,000, and the viscosity at 60 ° C was 580 Pa‧s.

UA-5 UA-5

將1官能之聚丙二醇(自羥值算出之數量平均分子量:10000)、與異氰酸2-丙烯醯氧基乙酯以成為1:1之莫耳比混合,於錫化合物之觸媒存在下,於70℃下反應而獲得丙烯酸胺基甲酸酯低聚物(以下,記載為UA-5)。 The monofunctional polypropylene glycol (the number average molecular weight calculated from the hydroxyl value: 10000) is mixed with 2-propenyloxyethyl isocyanate to a molar ratio of 1:1 in the presence of a catalyst of a tin compound. The reaction was carried out at 70 ° C to obtain an urethane acrylate oligomer (hereinafter referred to as UA-5).

UA-5之加成聚合性不飽和雙鍵之平均數為1,數量平均分子量為約10100,25℃下之黏度為約7Pa‧s。 The average number of addition polymerizable unsaturated double bonds of UA-5 was 1, the number average molecular weight was about 10,100, and the viscosity at 25 ° C was about 7 Pa ‧ s.

UA-6 UA-6

使用1官能之聚丙二醇(自羥值算出之數量平均分子量:5000),除此以外,利用與UA-3相同之方法獲得丙烯酸胺基甲酸酯低聚物(以下,記載為UA-6)。 An urethane urethane oligomer (hereinafter referred to as UA-6) was obtained by the same method as UA-3 except that a monofunctional polypropylene glycol (a number average molecular weight calculated from a hydroxyl value: 5000) was used. .

UA-6之硬化性基數為1,數量平均分子量為約5100,25℃下之黏度為約3Pa‧s。 UA-6 has a hardening base of 1, a number average molecular weight of about 5,100, and a viscosity at 25 ° C of about 3 Pa ‧ s.

(非硬化性低聚物(C)) (non-hardening oligomer (C))

非硬化性低聚物(1): Non-hardening oligomer (1):

將分子末端經環氧乙烷改性之2官能之聚丙二醇(自羥值算出之數量平均分子量:4000)、與分子末端經環氧乙烷改性之3官能之聚丙二醇(自羥值算出之數量平均分子量:6200)以1:1之質量比混合,而獲得非硬化性低聚物(1)。 2-functional polypropylene glycol modified with ethylene oxide at the end of the molecule (quantitative average molecular weight calculated from hydroxyl value: 4000), and trifunctional polypropylene glycol modified with ethylene oxide at the molecular end (calculated from hydroxyl value) The number average molecular weight: 6200) was mixed in a mass ratio of 1:1 to obtain a non-hardening oligomer (1).

(第一組合物) (first composition)

第一組合物(1): First composition (1):

將作為(A)成分之UA-1之20質量份、UA-5之32.5質量份、及UA-6之32.5質量份、作為(B)成分之苯基縮水甘油醚丙烯酸酯(共榮社化學公司製造,環氧酯M-600A)之15質量份均勻地混合,其後,使作為(D)成分之雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(BASF公司製造,IRGACURE(註冊商標)819)之0.3質量份、2,5-二-第三丁基對苯二酚(聚合抑制劑,東京化成公司製造)之0.04質量份、及抗氧化劑(BASF 公司,PUR68)之1質量份均勻地溶解於該混合物之100質量份並混合,其後,使作為(C)成分之末端經甲基化之聚丙二醇(自羥值算出之數量平均分子量:1200)之42.9質量份均勻地溶解於該混合物之100質量份並混合,而獲得第一組合物(1)。 20 parts by mass of UA-1 as the component (A), 32.5 parts by mass of UA-5, and 32.5 parts by mass of UA-6, and phenyl glycidyl ether acrylate as component (B) (Kyoeisha Chemical Co., Ltd.) 15 parts by mass of the epoxy ester M-600A) was uniformly mixed, and then, as a component (D), bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide ( 0.3 parts by mass of 2,5-di-t-butyl hydroquinone (polymerization inhibitor, manufactured by Tokyo Chemical Industry Co., Ltd.) manufactured by BASF Corporation, IRGACURE (registered trademark) 819), and antioxidant (BASF) 1 part by mass of the company, PUR68) was uniformly dissolved in 100 parts by mass of the mixture and mixed, and thereafter, the polypropylene glycol which was methylated at the end of the component (C) (the number average molecular weight calculated from the hydroxyl value: 1200) was obtained. 42.9 parts by mass of the mixture was uniformly dissolved in 100 parts by mass of the mixture and mixed to obtain a first composition (1).

第一組合物(1)於25℃下之黏度為3.2Pa‧s。第一組合物(1)中之羥基濃度為471×10-6mol/g,胺基甲酸酯鍵濃度為85×10-6mol/g,羥基濃度與胺基甲酸酯鍵濃度之合計為556×10-6mol/g,SP值為18.2(J/cm3)1/2。羥基、及胺基甲酸酯鍵於硬化時未反應,因此硬化後之羥基濃度、胺基甲酸酯鍵濃度亦未產生變化。 The viscosity of the first composition (1) at 25 ° C was 3.2 Pa ‧ s. The concentration of the hydroxyl group in the first composition (1) is 471×10 -6 mol/g, the concentration of the urethane bond is 85×10 -6 mol/g, and the concentration of the hydroxyl group and the concentration of the urethane bond are combined. The ratio was 556 × 10 -6 mol/g, and the SP value was 18.2 (J/cm 3 ) 1/2 . Since the hydroxyl group and the urethane bond were not reacted at the time of hardening, the hydroxyl group concentration and the urethane bond concentration after hardening did not change.

再者,關於羥基濃度之求出方法,係對(A)、(B)、(C)成分中所包含之羥基之莫耳濃度計算而求出。具體而言,於第一組合物(1)中,(B)成分之苯基縮水甘油醚丙烯酸酯具有羥基,其羥基濃度為0.0045mol/g。將(A)、(B)、(C)成分以上述調配量混合,以(A)、(B)、(C)成分中所包含之羥基濃度計算,為471×10-6mol/g。 Further, the method for determining the hydroxyl group concentration is obtained by calculating the molar concentration of the hydroxyl group contained in the components (A), (B), and (C). Specifically, in the first composition (1), the phenyl glycidyl ether acrylate of the component (B) has a hydroxyl group and a hydroxyl group concentration of 0.0045 mol/g. The components (A), (B), and (C) were mixed at the above-mentioned blending amount, and calculated to have a hydroxyl group concentration contained in the components (A), (B), and (C), and were 471 × 10 -6 mol/g.

又,胺基甲酸酯鍵濃度係對(A)、(B)、(C)成分中所包含之胺基甲酸酯鍵之莫耳濃度計算而求出。具體而言,於第一組合物(1)中,(A)成分之UA-1、UA-5及UA-6含有胺基甲酸酯鍵,各自之莫耳濃度為19×10-6mol/g、44×10-6mol/g、22×10-6mol/g。將(A)、(B)、(C)成分以上述調配量混合,以(A)、(B)、(C)成分中所包含之胺基甲酸酯鍵濃度計算,成為85×10-6mol/g。 Further, the urethane bond concentration was determined by calculating the molar concentration of the urethane bond contained in the components (A), (B), and (C). Specifically, in the first composition (1), UA-1, UA-5, and UA-6 of the component (A) contain a urethane bond, and each has a molar concentration of 19 × 10 -6 mol. /g, 44 × 10 -6 mol / g, 22 × 10 -6 mol / g. The components (A), (B), and (C) are mixed at the above-mentioned blending amount, and are calculated as the urethane bond concentration contained in the components (A), (B), and (C) to be 85 × 10 - 6 mol/g.

第一組合物(2): First composition (2):

將作為(A)成分之UA-2之20質量份、UA-5之32.5質量份、及UA-6之32.5質量份、作為(B)成分之苯基縮水甘油醚丙烯酸酯(共榮社化學公司製造,環氧醚M-600A)之15質量份均勻地混合,其後,使1-羥基-環己基-苯基-酮(BASF公司製造,IRGACURE(註冊商標)184)之3質量份、2,5-二-第三丁基對苯二酚(聚合抑制劑,東京化成公司製造)之 0.04質量份、及抗氧化劑(BASF公司製造,PUR68)之1質量份均勻地溶解於該混合物之100質量份並混合,其後,使作為(C)成分之末端經甲基化之聚丙二醇(自羥值算出之數量平均分子量:1200)之66.7質量份均勻地溶解於該混合物之100質量份並混合,而獲得第一組合物(2)。 20 parts by mass of UA-2 as the component (A), 32.5 parts by mass of UA-5, and 32.5 parts by mass of UA-6, and phenyl glycidyl ether acrylate as component (B) (Kyoeisha Chemical Co., Ltd.) 15 parts by mass of the epoxy resin M-600A) was uniformly mixed, and then 3 parts by mass of 1-hydroxy-cyclohexyl-phenyl-ketone (manufactured by BASF Corporation, IRGACURE (registered trademark) 184), 2,5-di-t-butyl hydroquinone (polymerization inhibitor, manufactured by Tokyo Chemical Industry Co., Ltd.) 1 part by mass of 0.04 parts by mass and an antioxidant (manufactured by BASF Corporation, PUR68) were uniformly dissolved in 100 parts by mass of the mixture and mixed, and thereafter, the polypropylene glycol which was methylated at the end of the component (C) was used ( 66.7 parts by mass of the number average molecular weight calculated from the hydroxyl value: 1200) was uniformly dissolved in 100 parts by mass of the mixture and mixed to obtain the first composition (2).

第一組合物(2)於25℃下之黏度為1.5Pa‧s。第一組合物(2)中之羥基濃度為398×10-6mol/g,胺基甲酸酯鍵濃度為85×10-6mol/g,羥基濃度與胺基甲酸酯鍵濃度之合計為483×10-6mol/g,SP值為18.2(J/cm3)1/2。羥基、胺基甲酸酯鍵於硬化時未反應,因此硬化後之羥基濃度、胺基甲酸酯鍵濃度亦未產生變化。 The viscosity of the first composition (2) at 25 ° C was 1.5 Pa ‧ s. The concentration of the hydroxyl group in the first composition (2) is 398 × 10 -6 mol / g, the concentration of the urethane bond is 85 × 10 -6 mol / g, and the concentration of the hydroxyl group and the concentration of the urethane bond are combined. The ratio was 483 × 10 -6 mol/g, and the SP value was 18.2 (J/cm 3 ) 1/2 . Since the hydroxyl group and the urethane bond were not reacted at the time of hardening, the hydroxyl group concentration and the urethane bond concentration after hardening did not change.

第一組合物(3): First composition (3):

將作為(A)成分之聚異戊二烯甲基丙烯酸酯(Kuraray公司製造,UC203)之25.7質量份、作為(B)成分之甲基丙烯酸二環戊烯氧基乙酯之7.7質量份、丙烯酸2-羥基丙酯之2.6質量份、作為(C)成分之聚丁二烯(Evonik Degussa公司製造,Polyoil 110)之54.1質量份、作為(D)成分之1-羥基-環己基-苯基-酮(BASF公司製造,IRGACURE(註冊商標)184)之1.8質量份、及2,4,6-三甲基苯甲醯基二苯基氧化膦(LAMBSON公司製造,SPEEDCURE TPO)之0.4質量份均勻地混合而獲得第一組合物(3)。 25.7 parts by mass of polyisoprene methacrylate (manufactured by Kuraray Co., Ltd., UC203) as the component (A), and 7.7 parts by mass of dicyclopentenyloxyethyl methacrylate as the component (B), 2.6 parts by mass of 2-hydroxypropyl acrylate, 54.1 parts by mass of polybutadiene (Polyoil 110 manufactured by Evonik Degussa Co., Ltd.) as component (C), and 1-hydroxy-cyclohexyl-phenyl group as component (D) - 1.8 parts by mass of ketone (manufactured by BASF Corporation, IRGACURE (registered trademark) 184), and 0.4 parts by mass of 2,4,6-trimethylbenzimidyldiphenylphosphine oxide (manufactured by LAMBSON Co., Ltd., SPEEDCURE TPO) The first composition (3) is obtained by uniformly mixing.

第一組合物(3)於25℃下之黏度為2.5Pa‧s。第一組合物(3)中之羥基濃度為220×10-6mol/g,胺基甲酸酯鍵濃度為0mol/g,羥基濃度與胺基甲酸酯鍵濃度之合計為220×10-6mol/g,SP值為18.0(J/cm3)1/2。羥基於硬化時未反應,因此硬化後之羥基濃度亦未產生變化。 The viscosity of the first composition (3) at 25 ° C was 2.5 Pa ‧ s. The hydroxyl group concentration in the first composition (3) is 220×10 -6 mol/g, the urethane bond concentration is 0 mol/g, and the total of the hydroxyl group concentration and the urethane bond concentration is 220×10 − 6 mol/g, SP value is 18.0 (J/cm 3 ) 1/2 . The hydroxyl group did not react upon hardening, so the hydroxyl group concentration after hardening did not change.

第一組合物(4): First composition (4):

將作為(A)成分之UA-3之40質量份、作為(B)成分之甲基丙烯酸2-羥基丁酯(共榮社化學公司製造,Lightester HOB)之40質量份、甲基 丙烯酸正十二烷基酯之20質量份均勻地混合,使作為(D)成分之雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(BASF公司製造,IRGACURE(註冊商標)819)之0.5質量份、2,5-二-第三丁基對苯二酚(聚合抑制劑,東京化成公司製造)之0.04質量份、及抗氧化劑(BASF公司製造,IRGANOX(註冊商標)1010)之0.3質量份均勻地溶解於該混合物之100質量份。其後,使作為(C)成分之非硬化性低聚物(1)之42.9質量份均勻地溶解於該混合物之100質量份並混合,而獲得第一組合物(4)。 40 parts by mass of UA-3 as the component (A), and 40 parts by mass of methyl 2-hydroxybutyl methacrylate (Lightester HOB, manufactured by Kyoeisha Chemical Co., Ltd.) as a component (B) 20 parts by mass of n-dodecyl acrylate was uniformly mixed to obtain bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide as component (D) (manufactured by BASF Corporation, IRGACURE ( Registered trademark) 819) 0.5 parts by mass, 0.04 parts by mass of 2,5-di-tert-butyl hydroquinone (polymerization inhibitor, manufactured by Tokyo Chemical Industry Co., Ltd.), and antioxidant (manufactured by BASF Corporation, IRGANOX (registered) 0.3 parts by mass of the trademark) 1010) was uniformly dissolved in 100 parts by mass of the mixture. Then, 42.9 parts by mass of the non-curable oligomer (1) as the component (C) was uniformly dissolved in 100 parts by mass of the mixture and mixed to obtain a first composition (4).

第一組合物(4)於25℃下之黏度為3.0Pa‧s。第一組合物(4)中之羥基濃度為1925×10-6mol/g,胺基甲酸酯鍵濃度為161×10-6mol/g,羥基濃度與胺基甲酸酯鍵濃度之合計為2086×10-6mol/g,SP值為20.3(J/cm3)1/2。羥基、胺基甲酸酯鍵於硬化時未反應,因此硬化後之羥基濃度、胺基甲酸酯鍵濃度亦未產生變化。 The viscosity of the first composition (4) at 25 ° C was 3.0 Pa ‧ . The concentration of the hydroxyl group in the first composition (4) is 1925 × 10 -6 mol / g, the concentration of the urethane bond is 161 × 10 -6 mol / g, and the concentration of the hydroxyl group and the concentration of the urethane bond are combined. It is 2086 × 10 -6 mol/g, and the SP value is 20.3 (J/cm 3 ) 1/2 . Since the hydroxyl group and the urethane bond were not reacted at the time of hardening, the hydroxyl group concentration and the urethane bond concentration after hardening did not change.

第一組合物(5): First composition (5):

將作為(A)成分之UA-4之50質量份、作為(B)成分之丙烯酸4-羥基丁酯之50質量份均勻地混合,使作為(D)成分之1-羥基-環己基-苯基-酮(BASF公司製造,IRGACURE(註冊商標)184)之3質量份、2,5-二-第三丁基對苯二酚(聚合抑制劑,東京化成公司製造)之0.04質量份、及抗氧化劑(BASF公司製造,PUR68)之1質量份均勻地溶解於該混合物之100質量份。其後,使作為(C)成分之非硬化性低聚物(1)之150質量份均勻地溶解於該混合物之100質量份並混合,而獲得第一組合物(5)。 50 parts by mass of UA-4 as the component (A) and 50 parts by mass of 4-hydroxybutyl acrylate as the component (B) are uniformly mixed to obtain 1-hydroxy-cyclohexyl-benzene as the component (D). 3 parts by mass of a base-ketone (manufactured by BASF Corporation, IRGACURE (registered trademark) 184), and 0.04 parts by mass of 2,5-di-t-butyl hydroquinone (polymerization inhibitor, manufactured by Tokyo Chemical Industry Co., Ltd.), and One part by mass of the antioxidant (manufactured by BASF Corporation, PUR68) was uniformly dissolved in 100 parts by mass of the mixture. Then, 150 parts by mass of the non-curable oligomer (1) as the component (C) was uniformly dissolved in 100 parts by mass of the mixture and mixed to obtain a first composition (5).

第一組合物(5)於25℃下之黏度為5.9Pa‧s。第一組合物(5)中之羥基濃度為1850×10-6mol/g,胺基甲酸酯鍵濃度為74×10-6mol/g,羥基濃度與胺基甲酸酯鍵濃度之合計為1924×10-6mol/g,SP值為19.6(J/cm3)1/2。羥基、胺基甲酸酯鍵於硬化時未反應,因此硬化後之羥基濃度、胺基甲酸酯鍵濃度亦未產生變化。 The viscosity of the first composition (5) at 25 ° C was 5.9 Pa ‧ s. The concentration of the hydroxyl group in the first composition (5) is 1850×10 -6 mol/g, the concentration of the urethane bond is 74×10 -6 mol/g, and the concentration of the hydroxyl group and the concentration of the urethane bond are combined. The value was 1924 × 10 -6 mol/g, and the SP value was 19.6 (J/cm 3 ) 1/2 . Since the hydroxyl group and the urethane bond were not reacted at the time of hardening, the hydroxyl group concentration and the urethane bond concentration after hardening did not change.

(第二組合物) (second composition)

第二組合物(1): Second composition (1):

將作為(F)成分之UA-4之55質量份、作為(G)成分之丙烯酸4-羥基丁酯(大阪有機化學工業公司製造,4HBA)之45質量份均勻地混合而獲得混合物。將作為(E)成分之1-羥基-環己基-苯基-酮(BASF公司製造,IRGACURE(註冊商標)184)之3.0質量份、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦(BASF公司製造,IRGACURE(註冊商標)819)之0.5質量份、2,5-二-第三丁基對苯二酚(聚合抑制劑,東京化成公司製造)之0.04質量份、及抗氧化劑(BASF公司製造,IRGANOX(註冊商標)1010)之0.3質量份均勻地混合於該混合物之100質量份,而獲得基礎組合物。使非硬化性低聚物(1)之25質量份均勻地溶解於基礎組合物之75質量份,而獲得第二組合物(1)。第二組合物(1)於25℃下之黏度為60Pa‧s。 55 parts by mass of UA-4 as the component (F) and 45 parts by mass of 4-hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd., 4HBA) as the component (G) were uniformly mixed to obtain a mixture. 3.0 parts by mass of bis(2,4,6-trimethylbenzylidene) which is 1-hydroxy-cyclohexyl-phenyl-ketone (manufactured by BASF Corporation, IRGACURE (registered trademark) 184) as component (E) 0.5 parts by mass of phenylphosphine oxide (manufactured by BASF Corporation, IRGACURE (registered trademark) 819) and 0.04 mass of 2,5-di-t-butyl hydroquinone (polymerization inhibitor, manufactured by Tokyo Chemical Industry Co., Ltd.) 0.3 parts by mass of the antioxidant and the antioxidant (manufactured by BASF Corporation, IRGANOX (registered trademark) 1010) were uniformly mixed in 100 parts by mass of the mixture to obtain a base composition. 25 parts by mass of the non-curable oligomer (1) was uniformly dissolved in 75 parts by mass of the base composition to obtain a second composition (1). The viscosity of the second composition (1) at 25 ° C was 60 Pa‧s.

(例1) (example 1)

附黏著層之透明面材(1)之製作: Production of transparent surface material with adhesive layer (1):

使用模嘴塗佈機,將第一組合物(1)以400μm之厚度均勻地塗佈於以一定速度移動之透明面材(1)之表面,自配置於模嘴塗佈機之下游側之LED光源照射紫外線,而形成部分硬化物之層。 The first composition (1) was uniformly applied to the surface of the transparent surface material (1) which was moved at a constant speed by a die coater at a thickness of 400 μm, and was disposed on the downstream side of the die coater. The LED light source illuminates the ultraviolet light to form a layer of partially cured material.

將較透明面材(1)大之保護膜(Mitsui Chemicals Tohcello公司製造,PURETECT(註冊商標)VLH-9)層壓於部分硬化物之層之表面。 A protective film (manufactured by Mitsui Chemicals Tohcello Co., Ltd., PURETECT (registered trademark) VLH-9) of a relatively transparent surface material (1) was laminated on the surface of the layer of the partially cured product.

自配置於保護膜側之高壓水銀光源(USHIO電機公司製造,UVC-05016S1TA01,照射強度:100mW/cm2)照射紫外線,使部分硬化物之層完全硬化,而獲得由保護膜保護之附黏著層之透明面材(1)。 A high-pressure mercury light source (manufactured by USHIO Electric Co., Ltd., UVC-05016S1TA01, irradiation intensity: 100 mW/cm 2 ) disposed on the side of the protective film is irradiated with ultraviolet rays to completely harden the layer of the partially cured product, thereby obtaining an adhesive layer protected by the protective film. Transparent surface material (1).

照射強度係使用照度計(USHIO電機公司製造,紫外線強度計Unimeter UIT-101)而測定。 The irradiation intensity was measured using an illuminometer (manufactured by USHIO Electric Co., Ltd., ultraviolet intensity meter Unimeter UIT-101).

例1中,部分硬化物之層於35℃下之儲存剪切彈性模數成為700 Pa,黏著層於35℃下之儲存剪切彈性模數成為5300Pa。 In Example 1, the storage shear elastic modulus of the partially cured layer at 35 ° C became 700. Pa, the storage shear modulus of the adhesive layer at 35 ° C became 5300 Pa.

(例2) (Example 2)

附黏著層之透明面材(2)之製作: Production of transparent surface material with adhesive layer (2):

使用第一組合物(2)代替第一組合物(1),除此以外,以與例1相同之方式獲得由保護膜保護之附黏著層之透明面材(2)。 A transparent face material (2) having an adhesive layer protected by a protective film was obtained in the same manner as in Example 1 except that the first composition (2) was used instead of the first composition (1).

例2中,部分硬化物之層於35℃下之儲存剪切模數成為60Pa,黏著層於35℃下之儲存剪切模數成為3000Pa。 In Example 2, the storage shear modulus of the partially cured layer at 35 ° C was 60 Pa, and the storage shear modulus of the adhesive layer at 35 ° C was 3000 Pa.

(例3) (Example 3)

附黏著層之透明面材(3)之製作: Production of transparent face material with adhesive layer (3):

使用第一組合物(5)代替第一組合物(1),除此以外,以與例1相同之方式獲得由保護膜保護之附黏著層之透明面材(3)。 A transparent face material (3) having an adhesive layer protected by a protective film was obtained in the same manner as in Example 1 except that the first composition (5) was used instead of the first composition (1).

例3中,部分硬化物之層於35℃下之儲存剪切模數成為900Pa,黏著層於35℃下之儲存剪切模數成為4600Pa。 In Example 3, the storage shear modulus of the partially cured layer at 35 ° C was 900 Pa, and the storage shear modulus of the adhesive layer at 35 ° C was 4600 Pa.

(消泡性試驗1) (Defoaming test 1)

常壓下,自附黏著層之透明面材(1)將保護膜剝離。使用黏著墊與靜電吸盤,將附黏著層之透明面材(1)以黏著層之面朝下之方式保持於設置有一對壓盤之升降裝置之減壓裝置內的上壓盤上。 Under normal pressure, the transparent surface material (1) with the adhesive layer peels off the protective film. Using the adhesive pad and the electrostatic chuck, the transparent face material (1) with the adhesive layer is held on the upper platen in the pressure reducing device of the lifting device provided with a pair of platens with the face of the adhesive layer facing downward.

於減壓裝置內之升降裝置之下壓盤上,將被貼合物(1)以貼合於被貼合物(1)之偏光板與附黏著層之透明面材(1)之黏著層對向,且附黏著層之透明面材(1)與偏光板之中心位置一致的方式配置,並以與附黏著層之透明面材(1)之距離成為30mm之方式保持。 Adhesive layer (1) is adhered to the adhesive layer of the polarizing plate of the adhesive composition (1) and the transparent surface material (1) of the adhesive layer on the pressure plate under the lifting device in the decompression device. The transparent surface material (1) with the adhesive layer was placed in the same direction as the center position of the polarizing plate, and was held at a distance of 30 mm from the transparent surface material (1) to which the adhesive layer was attached.

將減壓裝置設為密封狀態,進行排氣直至減壓裝置內之壓力成為約100Pa,保持10分鐘。繼而,暫時恢復至常壓並保持1分鐘。繼而,進行排氣直至減壓裝置內之壓力成為約10Pa,保持1分鐘後,利用減壓裝置內之升降裝置而使上下之壓盤接近,將貼合於被貼合物(1)之偏光板與附黏著層之透明面材(1)經由黏著層以2kPa之壓力進行 壓接,保持10秒鐘。對靜電吸盤進行去靜電而將被貼合物(1)自上壓盤分離,於約20秒鐘內使減壓裝置內恢復至大氣壓,而獲得模擬顯示裝置。 The decompression device was set to a sealed state, and the exhaust gas was evacuated until the pressure in the decompression device became about 100 Pa for 10 minutes. Then, temporarily return to normal pressure and keep it for 1 minute. Then, the pressure is reduced until the pressure in the decompression device becomes about 10 Pa, and after holding for 1 minute, the upper and lower pressure plates are brought close to each other by the lifting device in the decompression device, and the polarized film attached to the adherend (1) is attached. The plate and the transparent surface material (1) with the adhesive layer are carried out at a pressure of 2 kPa via the adhesive layer. Crimp and hold for 10 seconds. The electrostatic chuck was destaticized to separate the adherend (1) from the upper platen, and the inside of the pressure reducing device was returned to atmospheric pressure in about 20 seconds to obtain an analog display device.

剛將模擬顯示裝置與附黏著層之透明面材(1)積層後觀察,結果發現,貼合於被貼合物(1)之偏光板與附黏著層之透明面材(1)之黏著層的界面出現大量微細之氣泡。放置模擬顯示裝置,對直至氣泡消失之時間(消泡時間)進行測定。將結果作為例1示於表1。消泡時間係設為3個樣品之結果之平均。 Immediately after the simulation display device and the transparent surface material (1) with the adhesive layer were laminated, it was found that the adhesive layer adhered to the polarizing plate of the adhesive composition (1) and the transparent surface material (1) with the adhesive layer was adhered. There are a lot of tiny bubbles in the interface. An analog display device was placed to measure the time until the bubble disappeared (defoaming time). The results are shown in Table 1 as Example 1. The defoaming time was set as the average of the results of the three samples.

(消泡性試驗2) (Defoaming test 2)

使用附黏著層之透明面材(2)代替附黏著層之透明面材(1),除此以外,以與消泡性試驗1相同之方式製作模擬顯示裝置,而測定消泡時間。將結果作為例2示於表1。 An anti-foaming time was measured by preparing an analog display device in the same manner as the defoaming test 1 except that the transparent surface material (2) with an adhesive layer was used instead of the transparent surface material (1) to which the adhesive layer was attached. The results are shown in Table 1 as Example 2.

(消泡性試驗3) (Defoaming test 3)

使用附黏著層之透明面材(3)代替附黏著層之透明面材(1),除此以外,以與消泡性試驗1相同之方式製作模擬顯示裝置,而測定消泡時間。將結果作為例3示於表1。 An anti-foaming time was measured by preparing an analog display device in the same manner as the defoaming test 1 except that the transparent surface material (3) with an adhesive layer was used instead of the transparent surface material (1) to which the adhesive layer was attached. The results are shown in Table 1 as Example 3.

(90度剝離試驗) (90 degree peel test)

於由保護膜保護之附黏著層之透明面材(1)~(3)之保護膜與黏著層切入寬度25mm、長度約90mm之切痕。將其長邊側之一端剝離約30mm並安裝於黏著力測定器(島津製作所公司製造,Autograph)上,進行90度剝離試驗。將各自之結果作為例1~例3示於表1。再者,剝離速度為60mm/min。判定基準係如下所述: The protective film and the adhesive layer of the transparent surface materials (1) to (3) with the adhesive layer protected by the protective film are cut into a cut having a width of 25 mm and a length of about 90 mm. One end of the long side was peeled off by about 30 mm, and attached to an adhesion measuring instrument (manufactured by Shimadzu Corporation, Autograph), and subjected to a 90-degree peeling test. The results of each are shown in Table 1 as Examples 1 to 3. Further, the peeling speed was 60 mm/min. The criteria for judgment are as follows:

○:界面剝離(於玻璃側未殘留有黏著層)。 ○: Interface peeling (no adhesive layer remained on the glass side).

×:凝集破壞(黏著層於剝離途中斷裂,於玻璃與保護膜兩者殘留黏著層)。 ×: Aggregation failure (the adhesive layer is broken during the peeling, and the adhesive layer remains in both the glass and the protective film).

[表1] [Table 1]

將例1~3中之黏著層中之羥基濃度與消泡時間之圖表示於圖13。將例1~3中之黏著層中之羥基濃度及胺基甲酸酯鍵濃度之合計與消泡時間的圖表示於圖14。可知黏著層中之羥基濃度及胺基甲酸酯鍵濃度、與消泡時間之間存在相關關係。 The graph of the hydroxyl group concentration and the defoaming time in the adhesive layers in Examples 1 to 3 is shown in Fig. 13. The graph of the total of the hydroxyl group concentration and the urethane bond concentration in the adhesive layer in Examples 1 to 3 and the defoaming time is shown in Fig. 14 . It can be seen that there is a correlation between the concentration of the hydroxyl group and the concentration of the urethane bond in the adhesive layer and the defoaming time.

再者,圖13中之橫軸之羥基濃度之單位、及圖14中之橫軸之羥基濃度及胺基甲酸酯鍵濃度之合計的單位為mol/(g×106)。 In addition, the unit of the hydroxyl group concentration on the horizontal axis in FIG. 13 and the total of the hydroxyl group concentration and the urethane bond concentration on the horizontal axis in FIG. 14 are mol/(g×10 6 ).

(例4) (Example 4)

附黏著層之透明面材(4)之製作: Production of transparent surface material (4) with adhesive layer:

利用分注器,將第二組合物(1)以成為寬度約1mm、塗佈厚度約0.6mm之方式塗佈於距離透明面材(2)之外周緣約25mm之位置的全周,自分注器所附帶之LED光源照射紫外線,而形成半硬化之堰。 The second composition (1) was applied to the entire circumference at a position of about 25 mm from the outer periphery of the transparent face material (2) by a dispenser to have a width of about 1 mm and a coating thickness of about 0.6 mm. The LED light source attached to the device illuminates the ultraviolet rays to form a semi-hardened crucible.

使用分注器,將第一組合物(1)以總質量成為2.5g之方式供給於堰之內側之區域中之複數個部位。於供給第一組合物(1)之期間,沒有決口等破損部位,而維持半硬化之堰之形狀。 The first composition (1) was supplied to a plurality of portions in the region inside the crucible so that the total mass was 2.5 g using a dispenser. During the supply of the first composition (1), there is no damaged portion such as a breach, and the shape of the semi-hardened crucible is maintained.

將透明面材(2)以塗佈有第一組合物(1)之面朝上之方式水平放置於設置有一對壓盤之升降裝置的減壓裝置內之下壓盤上。將附帶保護膜之支持面材以貼合有保護膜16之面朝下之方式保持於減壓裝置內之上壓盤。進行排氣直至減壓裝置內之壓力成為約10000Pa,於該狀態下保持1分鐘。其後,利用減壓裝置內之升降裝置使上下之壓盤接近,將透明面材(2)與附帶保護膜之支持面材隔著第一組合物(1)以2 kPa之壓力進行壓接,保持10秒鐘而貼合。貼合後,使減壓裝置內恢復至大氣壓環境,而獲得以透明面材(2)、保護膜及堰密封有包含第一組合物(1)之未硬化之黏著層的積層體。 The transparent face material (2) is horizontally placed on the lower platen in the decompression device provided with the lifting device of the pair of platens in such a manner that the surface of the first composition (1) is coated upward. The support surface material with the protective film is held in the pressure reducing device on the upper platen with the surface of the protective film 16 facing downward. The pressure was exhausted until the pressure in the pressure reducing device became about 10,000 Pa, and was maintained in this state for 1 minute. Thereafter, the upper and lower pressure plates are brought close by the lifting device in the decompression device, and the transparent surface material (2) and the supporting surface material with the protective film are separated by the first composition (1) to 2 The pressure of kPa was crimped and held for 10 seconds to fit. After the bonding, the inside of the decompression device was returned to the atmospheric pressure environment, and a laminate in which the opaque adhesive layer containing the first composition (1) was sealed with the transparent surface material (2), the protective film, and the crucible was obtained.

自配置於支持面材側之高壓水銀光源(照射強度:100mW/cm2),對積層體照射20秒鐘紫外線,使半硬化之堰及未硬化之黏著層硬化而形成黏著層。硬化後之黏著層之厚度為0.4mm,大致均勻。 The high-pressure mercury light source (irradiation intensity: 100 mW/cm 2 ) disposed on the support surface material side was irradiated with ultraviolet rays for 20 seconds to harden the semi-hardened crucible and the uncured adhesive layer to form an adhesive layer. The thickness of the adhesive layer after hardening is 0.4 mm, which is substantially uniform.

其後,藉由剝離支持面材,而獲得由保護膜保護之附黏著層之透明面材(4)。 Thereafter, the transparent surface material (4) with the adhesive layer protected by the protective film is obtained by peeling off the supporting surface material.

例4中,黏著層於35℃下之儲存剪切模數成為7000Pa。 In Example 4, the storage shear modulus of the adhesive layer at 35 ° C became 7000 Pa.

(例5) (Example 5)

附黏著層之透明面材(5)之製作: Production of transparent surface material with adhesive layer (5):

使用第一組合物(3)代替第一組合物(1),除此以外,以與例4相同之方式獲得由保護膜保護之附黏著層之透明面材(5)。 A transparent face material (5) having an adhesive layer protected by a protective film was obtained in the same manner as in Example 4 except that the first composition (3) was used instead of the first composition (1).

例5中,黏著層於35℃下之儲存剪切模數成為10500Pa。 In Example 5, the storage shear modulus of the adhesive layer at 35 ° C became 10,500 Pa.

(例6) (Example 6)

附黏著層之透明面材(6)之製作: Production of transparent surface material (6) with adhesive layer:

使用第一組合物(4)代替第一組合物(1),除此以外,以與例4相同之方式獲得積層體。 A laminate was obtained in the same manner as in Example 4 except that the first composition (4) was used instead of the first composition (1).

自配置於支持面材側之化學燈(日本電氣公司製造,FL15BL,照射強度:2mW/cm2),對積層體照射紫外線10分鐘,使半硬化之堰及未硬化之黏著層硬化,而形成黏著層。硬化後之黏著層之厚度為0.4mm,大致均勻。 A chemical lamp (FL15BL, irradiation intensity: 2 mW/cm 2 manufactured by Nippon Electric Co., Ltd.), which is disposed on the side of the support surface material, is irradiated with ultraviolet rays for 10 minutes to harden the semi-hardened crucible and the uncured adhesive layer. Adhesive layer. The thickness of the adhesive layer after hardening is 0.4 mm, which is substantially uniform.

其後,藉由剝離支持面材而獲得由保護膜保護之附黏著層之透明面材(6)。 Thereafter, the transparent surface material (6) to which the adhesive layer is protected by the protective film is obtained by peeling off the supporting surface material.

例6中,黏著層於35℃下之儲存剪切模數成為181000Pa。 In Example 6, the storage shear modulus of the adhesive layer at 35 ° C was 181,000 Pa.

(消泡性試驗4) (Defoaming test 4)

常壓下,自附黏著層之透明面材(4)將保護膜剝離。使用黏著墊與靜電吸盤,將附黏著層之透明面材(4)以黏著層之面朝下之方式保持於設置有一對壓盤之升降裝置之減壓裝置內的上壓盤上。 Under normal pressure, the protective film is peeled off by the transparent surface material (4) attached to the adhesive layer. Using the adhesive pad and the electrostatic chuck, the transparent face material (4) with the adhesive layer is held on the upper platen in the pressure reducing device of the lifting device provided with a pair of platens with the face of the adhesive layer facing downward.

於減壓裝置內之升降裝置之下壓盤上,將被貼合物(2)以貼合於被貼合物(2)之偏光板與附黏著層之透明面材(4)之黏著層對向,且附黏著層之透明面材(4)與偏光板之中心位置一致的方式配置,並以與附黏著層之透明面材(4)之距離成為30mm之方式保持。 The adhesive layer (2) is adhered to the adhesive layer of the polarizing plate of the adhesive composition (2) and the transparent surface material (4) of the adhesive layer on the pressure plate under the lifting device in the decompression device. The transparent surface material (4) with the adhesive layer was placed in the same direction as the center position of the polarizing plate, and was held at a distance of 30 mm from the transparent surface material (4) to which the adhesive layer was attached.

將減壓裝置設為密封狀態,進行排氣直至減壓裝置內之壓力成為約10,000Pa,保持1分鐘後,利用減壓裝置內之升降裝置而使上下之壓盤接近,將貼合於被貼合物(2)之偏光板與附黏著層之透明面材(4)經由黏著層以2kPa之壓力進行壓接,保持10秒鐘。對靜電吸盤進行去靜電而將被貼合物(2)自上壓盤分離,於約20秒鐘內使減壓裝置內恢復至大氣壓,而獲得模擬顯示裝置。 The pressure-reducing device is sealed, and the pressure is reduced until the pressure in the pressure-reducing device is about 10,000 Pa. After holding for 1 minute, the upper and lower pressure plates are brought close to each other by the lifting device in the pressure reducing device, and the pressure is applied to the surface. The polarizing plate of the adhesive composition (2) and the transparent surface material (4) with the adhesive layer were pressure-bonded via the adhesive layer at a pressure of 2 kPa for 10 seconds. The electrostatic chuck was destaticized to separate the adherend (2) from the upper platen, and the inside of the pressure reducing device was returned to atmospheric pressure in about 20 seconds to obtain an analog display device.

剛將模擬顯示裝置與附黏著層之透明面材(4)積層後進行觀察,結果發現,貼合於被貼合物(2)之偏光板與附黏著層之透明面材(4)之黏著層的界面出現大量微細之氣泡。放置模擬顯示裝置,對直至氣泡消失之時間(消泡時間)進行測定。將結果作為例4示於表2。消泡時間係設為3個樣品之結果之平均。 Immediately after the simulation display device and the transparent surface material (4) with the adhesive layer were laminated, it was found that the polarizing plate attached to the adhesive composition (2) and the transparent surface material (4) adhered to the adhesive layer were adhered. A large number of fine bubbles appear at the interface of the layer. An analog display device was placed to measure the time until the bubble disappeared (defoaming time). The results are shown in Table 2 as Example 4. The defoaming time was set as the average of the results of the three samples.

(消泡性試驗5) (Defoaming test 5)

使用附黏著層之透明面材(5)代替附黏著層之透明面材(4),除此以外,以與消泡性試驗4相同之方式製作模擬顯示裝置,對消泡時間進行測定。將結果作為例5示於表2。 An analog display device was produced in the same manner as the defoaming test 4 except that the transparent surface material (5) with an adhesive layer was used instead of the transparent surface material (4) to which the adhesive layer was attached, and the defoaming time was measured. The results are shown in Table 2 as Example 5.

(消泡性試驗6) (Defoaming test 6)

使用附黏著層之透明面材(6)代替附黏著層之透明面材(4),除此以外,以與消泡性試驗4相同之方式製作模擬顯示裝置,對消泡時間進行測定。將結果作為例6示於表2。 An analog display device was produced in the same manner as the defoaming test 4 except that the transparent surface material (6) with an adhesive layer was used instead of the transparent surface material (4) to which the adhesive layer was attached, and the defoaming time was measured. The results are shown in Table 2 as Example 6.

(90度剝離試驗) (90 degree peel test)

於由保護膜保護之附黏著層之透明面材(4)~(6)之保護膜與黏著層切入寬度25mm、長度約90mm之切痕。將其長邊側之一端剝離約30mm並安裝於黏著力測定器(島津製作所公司製造,Autograph),進行90度剝離試驗。將各結果作為例4~例6示於表2。再者,剝離速度為60mm/min。判定基準係如下所述。 The protective film and the adhesive layer of the transparent surface materials (4) to (6) with the adhesive layer protected by the protective film are cut into a cut having a width of 25 mm and a length of about 90 mm. One end of the long side was peeled off by about 30 mm, and attached to an adhesion measuring instrument (Autograph manufactured by Shimadzu Corporation), and subjected to a 90-degree peeling test. The results are shown in Table 2 as Examples 4 to 6. Further, the peeling speed was 60 mm/min. The judgment criteria are as follows.

○:界面剝離(於玻璃側未殘留有黏著層)。 ○: Interface peeling (no adhesive layer remained on the glass side).

×:凝集破壞(黏著層於剝離途中斷裂,於玻璃與保護膜兩者殘留黏著層)。 ×: Aggregation failure (the adhesive layer is broken during the peeling, and the adhesive layer remains in both the glass and the protective film).

將例4~6中之黏著層中之羥基濃度與消泡時間之圖表示於圖15。將例4~6中之黏著層中之羥基濃度及胺基甲酸酯鍵濃度的合計與消泡時間之圖表示於圖16。可知黏著層中之羥基濃度及胺基甲酸酯鍵濃度與消泡時間之間存在相關關係。 The graph of the hydroxyl group concentration and the defoaming time in the adhesive layers in Examples 4 to 6 is shown in Fig. 15. The graph of the total of the hydroxyl group concentration and the urethane bond concentration in the adhesive layer in Examples 4 to 6 and the defoaming time is shown in Fig. 16 . It can be seen that there is a correlation between the concentration of the hydroxyl group in the adhesive layer and the concentration of the urethane bond and the defoaming time.

(例7) (Example 7)

附保護膜之黏著片(1)之製作: Production of adhesive sheet with protective film (1):

使用模嘴塗佈機,將第1組合物(1)以500μm之厚度連續塗佈於以一定速度移動之表面經脫模處理之聚對苯二甲酸乙二酯(PET)膜(第1基材)(帝人公司製造Purex(註冊商標))的表面後,利用表面之脫模性高於第1基材之PET膜(第2基材)(帝人Purex(註冊商標))進行夾持。自 第1基材側,自高壓水銀光源(USHIO電機公司製造,UVC-05016S1TA01,照射強度:1500mJ/cm2)照射紫外線,使第1組合物(1)完全硬化,而獲得附保護膜之黏著片(1)。黏著片於35℃下之儲存剪切模數成為5300Pa。 The first composition (1) was continuously applied to a polyethylene terephthalate (PET) film which was subjected to release treatment at a surface speed by a die coater at a thickness of 500 μm (the first base) After the surface of the product (Purex (registered trademark)) was produced by Teijin Co., Ltd., the PET film (second substrate) having a higher mold release property than the first substrate (People's Purex (registered trademark)) was used for the surface. From the first substrate side, ultraviolet rays were irradiated from a high-pressure mercury light source (manufactured by USHIO Electric Co., Ltd., UVC-05016S1TA01, irradiation intensity: 1500 mJ/cm 2 ) to completely cure the first composition (1), thereby obtaining adhesion with a protective film. Sheet (1). The storage shear modulus of the adhesive sheet at 35 ° C was 5300 Pa.

(消泡性試驗7) (Defoaming test 7)

關於上述附保護膜之黏著片,於常壓下,將附保護膜之黏著片(1)之第2基材剝離,供於消泡性試驗。使用附保護膜之黏著片(1)代替附黏著層之透明面材(1),除此以外,以與消泡性試驗1相同之方式製作模擬顯示裝置,而對消泡時間進行測定。消泡時間良好。 With respect to the above-mentioned pressure-sensitive adhesive sheet with a protective film, the second substrate of the pressure-sensitive adhesive sheet (1) with a protective film was peeled off under normal pressure and subjected to a defoaming test. An anti-foaming time was measured in the same manner as in the defoaming test 1 except that the adhesive sheet (1) with a protective film was used instead of the transparent surface material (1) to which the adhesive layer was attached. Defoaming time is good.

產業上之可利用性根據本發明,可製造將被貼合物與透明面材經由黏著層而貼合時,殘留於被貼合物與黏著層之界面之氣泡迅速消失,而沒有氣泡等缺陷之附黏著層之透明面材。該附黏著層之透明面材係作為顯示面板之保護板、座標輸入裝置之保護板、座標輸入裝置之附透明電極之基板等有用。 INDUSTRIAL APPLICABILITY According to the present invention, when the adherend and the transparent surface material are bonded together via the adhesive layer, the bubbles remaining at the interface between the adherend and the adhesive layer rapidly disappear, and there are no defects such as bubbles. The transparent surface material with the adhesive layer attached. The transparent surface material with the adhesive layer is useful as a protective plate for a display panel, a protective plate for a coordinate input device, a substrate with a transparent electrode for a coordinate input device, and the like.

再者,將2014年4月17日提出申請之日本專利申請2014-085423號之說明書、申請專利範圍、圖式及發明摘要之全部內容引用於此處,並作為本發明之揭示併入本文。 The entire disclosure of Japanese Patent Application No. 2014-085423, the entire disclosure of which is hereby incorporated by reference in its entirety in its entirety in its entirety in

1‧‧‧附黏著層之透明面材 1‧‧‧Transparent surface material with adhesive layer

10‧‧‧透明面材 10‧‧‧Transparent surface material

12‧‧‧遮光印刷部 12‧‧‧Lighting Printing Department

14‧‧‧黏著層 14‧‧‧Adhesive layer

16‧‧‧保護膜 16‧‧‧Protective film

Claims (18)

一種附黏著層之透明面材,其具有透明面材、與形成於上述透明面材之至少一表面之包含硬化性樹脂組合物之硬化物的黏著層,上述黏著層中之羥基濃度為100×10-6~600×10-6mol/g,上述黏著層中之胺基甲酸酯鍵濃度為0~150×10-6mol/g。 A transparent surface material with an adhesive layer having a transparent surface material and an adhesive layer formed on the hard surface of at least one surface of the transparent surface material comprising a curable resin composition, wherein the concentration of the hydroxyl group in the adhesive layer is 100× 10 -6 ~ 600 × 10 -6 mol / g, the concentration of the urethane bond in the above adhesive layer is 0 ~ 150 × 10 -6 mol / g. 如請求項1之附黏著層之透明面材,其中上述黏著層中之羥基濃度與上述黏著層中之胺基甲酸酯鍵濃度之合計為100×10-6~750×10-6mol/g。 The transparent surface material of the adhesive layer of claim 1, wherein the concentration of the hydroxyl group in the adhesive layer and the concentration of the urethane bond in the adhesive layer are 100×10 -6 to 750×10 -6 mol/ g. 如請求項1或2之附黏著層之透明面材,其中上述黏著層之溶解度參數為17.5~18.5(J/cm3)1/2The transparent surface material of the adhesive layer of claim 1 or 2, wherein the solubility parameter of the adhesive layer is 17.5 to 18.5 (J/cm 3 ) 1/2 . 如請求項1至3中任一項之附黏著層之透明面材,其中上述硬化性樹脂組合物包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、與具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B),且上述硬化性低聚物(A)及上述低分子量聚合性化合物(B)中之任一者或兩者具有羥基,上述硬化性低聚物(A)及上述低分子量聚合性化合物(B)中之任一者或兩者亦可具有胺基甲酸酯鍵。 The transparent surface material with an adhesive layer according to any one of claims 1 to 3, wherein the curable resin composition contains a curable oligomer (A) having an addition polymerizable unsaturated double bond, and has an additive Any one or both of the curable oligomer (A) and the low molecular weight polymerizable compound (B) having a polymerizable unsaturated double bond and a low molecular weight polymerizable compound (B), and the curability Either or both of the oligomer (A) and the above low molecular weight polymerizable compound (B) may have a urethane bond. 如請求項1至3中任一項之附黏著層之透明面材,其中上述硬化性樹脂組合物包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B)、及不具有加成聚合性不飽和雙鍵之非硬化性低聚物(C),且上述硬化性低聚物(A)、上述低分子量聚合性化合物(B)及上述非硬化性低聚物(C)中之至少一者具有羥基, 上述硬化性低聚物(A)、上述低分子量聚合性化合物(B)及上述非硬化性低聚物(C)中之至少一者亦可具有胺基甲酸酯鍵。 The transparent surface material with an adhesive layer according to any one of claims 1 to 3, wherein the curable resin composition contains a curable oligomer (A) having an addition polymerizable unsaturated double bond, and has addition polymerization. a low molecular weight polymerizable compound (B) having an unsaturated double bond, and a non-curable oligomer (C) having no addition polymerizable unsaturated double bond, and the above curable oligomer (A) and the above-mentioned low At least one of the molecular weight polymerizable compound (B) and the non-curable oligomer (C) has a hydroxyl group. At least one of the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curable oligomer (C) may have a urethane bond. 如請求項1至5中任一項之附黏著層之透明面材,其進而具有覆蓋上述黏著層之表面之可剝離之保護膜。 The transparent surface material of the adhesive layer according to any one of claims 1 to 5, which further has a peelable protective film covering the surface of the adhesive layer. 一種附黏著層之透明面材之製造方法,其係製造如請求項1至6中任一項之附黏著層之透明面材之方法,且具有下述步驟(α)及下述步驟(γ):(α)向上述透明面材之表面供給液狀之上述硬化性樹脂組合物,視需要使上述硬化性樹脂組合物部分地硬化而製成部分硬化物之步驟;(γ)使上述硬化性樹脂組合物或上述部分硬化物硬化而形成上述黏著層之步驟。 A method for producing a transparent face material with an adhesive layer, which is a method for producing a transparent face material with an adhesive layer according to any one of claims 1 to 6, and having the following step (α) and the following steps (γ) (α) a step of supplying the curable resin composition in a liquid form to the surface of the transparent surface material, and partially curing the curable resin composition to form a partially cured product, if necessary; (γ) hardening the hardened material The step of forming the above-mentioned adhesive layer by curing the resin composition or the above-mentioned partial cured product. 如請求項7之附黏著層之透明面材之製造方法,其進而具有下述步驟(β):(β)利用保護膜覆蓋上述硬化性樹脂組合物或上述部分硬化物之表面之步驟。 The method for producing a transparent surface material with an adhesive layer according to claim 7, further comprising the step (β) of: (β) covering the surface of the curable resin composition or the partially cured product with a protective film. 如請求項8之附黏著層之透明面材之製造方法,其中上述步驟(α)為下述步驟(α1),上述步驟(β)為下述步驟(β1),上述步驟(γ)為下述步驟(γ1):(α1)向上述透明面材之表面以層狀之方式供給液狀之上述硬化性樹脂組合物,使供給至上述透明面材之表面之上述硬化性樹脂組合物部分地硬化而形成部分硬化物之層的步驟;(β1)利用保護膜覆蓋上述部分硬化物之層之表面之步驟;(γ1)使上述部分硬化物之層進一步硬化而形成上述黏著層之步驟。 The method for producing a transparent surface material with an adhesive layer according to claim 8, wherein the step (α) is the following step (α1), the step (β) is the following step (β1), and the step (γ) is lower Step (γ1): (α1) The liquid curable resin composition is supplied to the surface of the transparent surface material in a layered manner, and the curable resin composition supplied to the surface of the transparent surface material is partially partially a step of hardening to form a layer of a partially cured product; (β1) a step of covering a surface of the partially cured layer with a protective film; and (γ1) a step of further hardening the layer of the partially cured product to form the adhesive layer. 如請求項8之附黏著層之透明面材之製造方法,其中上述步驟(α) 為下述步驟(α21)及下述步驟(α22),上述步驟(β)為下述步驟(β2),上述步驟(γ)為下述步驟(γ21)及下述步驟(γ22):(α21)於上述透明面材之表面之周緣部形成框狀之堰之步驟;(α22)向被上述堰包圍之區域供給上述硬化性樹脂組合物之步驟;(β2)於減壓環境下,將附保護膜之支持面材以上述保護膜接觸於上述硬化性樹脂組合物之層之表面的方式重疊於上述硬化性樹脂組合物之層上,而獲得上述硬化性樹脂組合物之層被上述透明面材、上述保護膜及上述堰密封之積層體的步驟;(γ21)於將上述積層體放置於較上述步驟(β2)高之壓力環境下之狀態下,使上述硬化性樹脂組合物之層硬化而形成上述黏著層之步驟;(γ22)於上述步驟(γ21)後,將上述支持面材自上述保護膜剝離之步驟。 The method for producing a transparent face material with an adhesive layer according to claim 8, wherein the above step (α) In the following step (α21) and the following step (α22), the above step (β) is the following step (β2), and the above step (γ) is the following step (γ21) and the following step (γ22): (α21) a step of forming a frame-shaped crucible on a peripheral portion of the surface of the transparent surface material; (α22) a step of supplying the curable resin composition to a region surrounded by the crucible; (β2) in a decompressing environment, attaching The support surface material of the protective film is superposed on the layer of the curable resin composition so that the protective film is in contact with the surface of the layer of the curable resin composition, and the layer of the curable resin composition is obtained by the transparent surface. a step of forming a laminate of the above-mentioned protective film and the above-mentioned ruthenium seal; (γ21) hardening a layer of the curable resin composition in a state where the laminate is placed under a pressure environment higher than the above step (β2) And the step of forming the adhesive layer; (γ22) after the step (γ21), the step of peeling the support surface material from the protective film. 一種顯示裝置,其具有:顯示面板、與如請求項1至5中任一項之附黏著層之透明面材,其以上述黏著層接觸於上述顯示面板之方式貼合於上述顯示面板。 A display device comprising: a display panel; and a transparent surface material with an adhesive layer according to any one of claims 1 to 5, wherein the adhesive layer is attached to the display panel so that the adhesive layer contacts the display panel. 一種顯示裝置之製造方法,其係製造如請求項11之顯示裝置之方法,且於減壓環境下,將上述顯示面板與上述附黏著層之透明面材以上述黏著層接觸於上述顯示面板之方式重疊並貼合。 A method of manufacturing a display device, which is the method of manufacturing the display device of claim 11, and contacting the display panel and the transparent surface material of the adhesive layer with the adhesive layer on the display panel under a reduced pressure environment The way overlaps and fits. 一種黏著片,其係包含硬化性樹脂組合物之硬化物者,且上述黏著片中之羥基濃度為100×10-6~600×10-6mol/g,上述黏著片中之胺基甲酸酯鍵濃度為0~150×10-6mol/g。 An adhesive sheet comprising a cured product of a curable resin composition, wherein a concentration of a hydroxyl group in the adhesive sheet is 100×10 -6 to 600×10 -6 mol/g, and the urethane in the adhesive sheet The ester bond concentration is 0 to 150×10 -6 mol/g. 如請求項13之黏著片,其中上述黏著片中之羥基濃度與上述黏著片中之胺基甲酸酯鍵濃度之合計為100×10-6~750×10-6mol/g。 The adhesive sheet of claim 13, wherein the total concentration of the hydroxyl groups in the adhesive sheet and the concentration of the urethane bond in the adhesive sheet is 100 × 10 -6 to 750 × 10 -6 mol/g. 如請求項13或14之黏著片,其中上述硬化性樹脂組合物之硬化物之溶解度參數為17.5~18.5(J/cm3)1/2The adhesive sheet of claim 13 or 14, wherein the hardening property of the curable resin composition has a solubility parameter of 17.5 to 18.5 (J/cm 3 ) 1/2 . 如請求項13至15中任一項之黏著片,其中上述硬化性樹脂組合物包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、與具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B),且上述硬化性低聚物(A)及上述低分子量聚合性化合物(B)中之任一者或兩者具有羥基,上述硬化性低聚物(A)及上述低分子量聚合性化合物(B)中之任一者或兩者亦可具有胺基甲酸酯鍵。 The adhesive sheet according to any one of claims 13 to 15, wherein the curable resin composition comprises a curable oligomer (A) having an addition polymerizable unsaturated double bond, and an addition polymerizable unsaturated double The low molecular weight polymerizable compound (B) of the bond, and one or both of the curable oligomer (A) and the low molecular weight polymerizable compound (B) have a hydroxyl group, and the curable oligomer (A) And either or both of the above low molecular weight polymerizable compounds (B) may have a urethane bond. 如請求項13至15中任一項之黏著片,其中上述硬化性樹脂組合物包含具有加成聚合性不飽和雙鍵之硬化性低聚物(A)、具有加成聚合性不飽和雙鍵之低分子量聚合性化合物(B)、及不具有加成聚合性不飽和雙鍵之非硬化性低聚物(C),且上述硬化性低聚物(A)、上述低分子量聚合性化合物(B)及上述非硬化性低聚物(C)中之至少一者具有羥基,上述硬化性低聚物(A)、上述低分子量聚合性化合物(B)及上述非硬化性低聚物(C)中之至少一者亦可具有胺基甲酸酯鍵。 The adhesive sheet according to any one of claims 13 to 15, wherein the curable resin composition contains a curable oligomer (A) having an addition polymerizable unsaturated double bond, and has an addition polymerizable unsaturated double bond. The low molecular weight polymerizable compound (B) and the non-curable oligomer (C) having no addition polymerizable unsaturated double bond, and the curable oligomer (A) and the low molecular weight polymerizable compound ( B) and at least one of the non-curable oligomers (C) having a hydroxyl group, the curable oligomer (A), the low molecular weight polymerizable compound (B), and the non-curing oligomer (C) At least one of them may also have a urethane bond. 一種附保護膜之黏著片,其具有:如請求項13至17中任一項之黏著片;與覆蓋上述黏著片之至少一表面之可剝離之保護膜。 An adhesive sheet with a protective film, comprising: the adhesive sheet according to any one of claims 13 to 17; and a peelable protective film covering at least one surface of the adhesive sheet.
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