TW201540815A - Depositing polymer solutions to form optical elements - Google Patents

Depositing polymer solutions to form optical elements Download PDF

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TW201540815A
TW201540815A TW103114815A TW103114815A TW201540815A TW 201540815 A TW201540815 A TW 201540815A TW 103114815 A TW103114815 A TW 103114815A TW 103114815 A TW103114815 A TW 103114815A TW 201540815 A TW201540815 A TW 201540815A
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polymer
polymer solution
layer
following
solvent
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TW103114815A
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Chinese (zh)
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Irina Kasyanova
Mary Parent
Evgeni Poliakov
Valery Kuzmin
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Light Polymers Holding
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Abstract

Provided are methods of depositing polymer solutions on substrates to form various optical elements. A polymer solution may include about 0.1% - 0% by weight of a specific polymer having rigid rod-like molecules. The molecules may include various cores, spacers, and sides groups to ensure their solubility, viscosity, and cross-linking ability. The deposition techniques may include slot die, spray, molding, roll coating, and so forth. Pre-deposition techniques may be used to improve wettability and adhesion of substrates. Post-deposition techniques may include ultraviolet cross-linking, specific drying techniques, evaporation of solvent, treating with salt solutions, and shaping. The disclosed polymers and deposition processes may yield optical elements with high refractive index values, such as greater than 1.6. These optical elements may be used as +A plates, -C plates, or biaxial polymers and used as retarders in LCD active panels or as light collimators and light guides.

Description

沉積聚合物溶液形成光學元件 Depositing a polymer solution to form an optical component

本發明一般而言係有關於有機化學領域,更詳言之,係有關於使用各種雙折射膜形成各種光學元件之方法。 The present invention relates generally to the field of organic chemistry, and more particularly to methods for forming various optical elements using various birefringent films.

光學聚合物具有獨特之特性,例如較高及/或各向異性之折射率,這使得這些聚合物適於各種光學應用。例如,玻璃類型之聚甲基丙烯酸甲酯(PMMA)和聚苯乙烯被用作光纖芯材、LCDs之背光用途、塑膠透鏡和膜,而矽樹脂和二氧化矽被用作纖維敷層。然而,PMMA之折射率約為1.49,而聚苯乙烯之折射率約為1.59。這些數值並不足以充分駕馭光,眾多研究力圖開發出具有更高折射率值之聚合物,以通過起動“更快(高折射率)之光學器件”而減小工作距離,並獲得光學元件之更好的幾何形狀。另一個示例性應用係為液晶顯示器(LCDs),其利用光學各向異性之雙折射膜,特別是在偏振堆疊(polarizing stacks)中,或者是在三維應用中獲得可程式設計之相位差。這樣的聚合物膜可由各種聚合物材料製備,這些聚合物材料能夠通過材料折射率之單軸或雙軸固有雙反射獲得光學各向異性,或者通過聚合物取向技術獲得它們之擴展。例如,三乙醯基纖維素(TAC)可用作雙反射固有值低之弱負C板。另一個例子係為通過拉伸由環 烯烴聚合物(COP)製作相位差膜。製作光學元件之其他例亦可包括使用聚碳酸酯、聚甲基丙烯酸甲酯(PMMA)和聚醯胺。這些聚合物可在LCDs或其他光學器件中被用作取向膜或光波導。基於聚對苯二甲酸乙二醇酯(PET)和聚碳酸酯(PC)之光學元件具有非常固有之雙反射,這使得它们成为除非採用特殊取向技術否则難以拉伸製作類似於TAC之拉伸相位差板之基底。進而,非常希望開發出新型廉價且可控之加工技術。眾多現有聚合物難以加工,並且一些加工技術對聚合物之光學特性可能有負面影響。例如,使用溫度梯度製作熱致晶體,亦被用作相位差板,然而,所述取向係通過在某一方向研磨聚醯胺結構而以預定方式獲得,增加了加工成本和製備步驟。因為屏幕尺寸持續增長,並且大尺寸拉伸膜難以加工,所以就變得更為重要。 Optical polymers have unique properties, such as higher and/or anisotropic refractive indices, which make these polymers suitable for a variety of optical applications. For example, glass type polymethyl methacrylate (PMMA) and polystyrene are used as optical fiber core materials, backlighting applications for LCDs, plastic lenses and films, and enamel resins and cerium oxide are used as fiber coatings. However, the refractive index of PMMA is about 1.49, and the refractive index of polystyrene is about 1.59. These values are not sufficient to fully control the light, and many studies have attempted to develop polymers with higher refractive index values to reduce the working distance by starting "faster (high refractive index) optics, and to obtain optical components. Better geometry. Another exemplary application is liquid crystal displays (LCDs) that utilize optically anisotropic birefringent films, particularly in polarizing stacks, or obtain programmable phase differences in three-dimensional applications. Such polymeric films can be prepared from a variety of polymeric materials that are capable of obtaining optical anisotropy by uniaxial or biaxial intrinsic double reflection of the refractive index of the material, or by polymer orientation techniques. For example, triethylenesulfonyl cellulose (TAC) can be used as a weak negative C plate with a low double reflection inherent value. Another example is by stretching by the ring An olefin polymer (COP) produces a retardation film. Other examples of making optical components may also include the use of polycarbonate, polymethyl methacrylate (PMMA), and polyamine. These polymers can be used as alignment films or optical waveguides in LCDs or other optical devices. Optical components based on polyethylene terephthalate (PET) and polycarbonate (PC) have very inherent double reflections, which makes them difficult to stretch to produce TAC-like stretches unless special orientation techniques are used. The base of the phase difference plate. Furthermore, it is highly desirable to develop new and inexpensive processing techniques that can be controlled. Many existing polymers are difficult to process, and some processing techniques may have a negative impact on the optical properties of the polymer. For example, the use of a temperature gradient to fabricate a thermotropic crystal is also used as a phase difference plate, however, the orientation is obtained in a predetermined manner by grinding the polyamine structure in a certain direction, increasing processing costs and preparation steps. Since the screen size continues to increase, and the large-sized stretched film is difficult to process, it becomes more important.

本“發明內容”以簡單的形式介紹理念之選擇,在後述“實施方式”中將進一步描述。本“發明內容”既不欲限定所要保護之主題的關鍵特徵或必要特徵,亦不欲限定所要保護之主題的範圍。 This "Summary of the Invention" introduces the selection of concepts in a simple form, which will be further described in the "Embodiment" described later. This Summary is not intended to limit the scope of the claimed subject matter, and the scope of the subject matter to be protected.

提供沉積聚合物溶液以形成各種光學元件之方法。溶液可包含約為0.1wt%~30wt%之具有剛性棒狀分子的特定聚合物。所述分子可包含各種芯、連接基和側基以確保它們的溶解度、粘度、交聯能力及其他相關加工性。所述沉積技術可包括狹縫模塗布、噴塗、在各種溫度下模塑、輥對輥塗布(roll-to-roll coating)、邁耶棒式塗布、擠出、鑄造、壓製等。能夠使用各種預沉積技術和後沉積技術。至少部分預沉積技術能夠用於提高沉積有聚合物溶液之基底的潤濕性和粘附性。一些預沉積技術例可包括 皂化、清洗、氧化、洗脫、電暈處理或等離子體處理、沉積底漆層等等。至少一些後沉積技術可包括紫外線(UV)照射、紅外線(IR)照射、化合物與基底之交聯、特定乾燥技術、溶劑蒸發、用鹽溶液處理和結構成型。該特別設計之聚合物和沉積加工能夠獲得折射率值高、例如在可見區內大於1.6、甚至大於1.7之光學元件。這些光學元件能夠被用作正A板、負C板或雙軸板,以及例如在LCD有源板中用作相位差板或在背光堆疊應用中用作光准直器和光波導。其他應用、例如透鏡、光學安全膜亦包括在本發明之範圍內。 Methods of depositing a polymer solution to form various optical components are provided. The solution may comprise from about 0.1% to about 30% by weight of a particular polymer having rigid rod-like molecules. The molecules may contain various cores, linkers, and pendant groups to ensure their solubility, viscosity, cross-linking ability, and other related processability. The deposition techniques may include slot die coating, spray coating, molding at various temperatures, roll-to-roll coating, Meyer bar coating, extrusion, casting, pressing, and the like. Various pre-deposition techniques and post-deposition techniques can be used. At least a portion of the pre-deposition technique can be used to increase the wettability and adhesion of the substrate on which the polymer solution is deposited. Some predeposition techniques may include Saponification, washing, oxidation, elution, corona treatment or plasma treatment, deposition of a primer layer, and the like. At least some of the post deposition techniques may include ultraviolet (UV) illumination, infrared (IR) illumination, cross-linking of the compound to the substrate, specific drying techniques, solvent evaporation, treatment with a salt solution, and structural shaping. This specially designed polymer and deposition process is capable of obtaining optical elements having a high refractive index value, for example greater than 1.6 or even greater than 1.7 in the visible region. These optical elements can be used as positive A plates, negative C plates or biaxial plates, and as phase difference plates, for example, in LCD active boards or as optical collimators and optical waveguides in backlight stacking applications. Other applications, such as lenses, optical security films are also included within the scope of the invention.

根據本發明公開之各方面,所述聚合物溶液包含溶劑和聚合物。該聚合物包含n個具有下述結構通式之有機單元。 According to various aspects of the present disclosure, the polymer solution comprises a solvent and a polymer. The polymer comprises n organic units having the following structural formula.

[-(Core(S)m)k-Gl-]n [-(Core(S) m ) k -G l -] n

式中,所述有機單元包含剛性共軛有機成分Core,其中,G係為選自包含-C(O)-NR1-=(C(O))2=N-、-O-NR1-線性和分支(C1-C4)烷撐-CR1R2-O-C(O)-CR1R2-、-C(O)-O-、-O-、-NR1-之列表的連接基,其中R1和R2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表;其中S係為聚合物提供在溶劑中的溶解性之親水性側基,相同或不同,獨立地選自包含下列基團中的一個或多個之列表:COOX、-SO3X(X選自包含H、烷基、鏈烯基、炔基、芳基、鹼金屬、NW4(W係為H或烷基或它們之任何組合)之列表)、-SO2NP1P2、-CONP1P2(P1和P2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表);並且,m係為0、1、2或3,k係為1、2或3。在某個實施方式中,這些n個有機單元可用任何適合的UV-固化性成分、例如鏈烯基、炔基、丙烯酸等封端。芯、連接基和S-基團可獨立地選 擇。 Wherein the organic unit comprises a rigid conjugated organic component Core, wherein the G system is selected from the group consisting of -C(O)-NR1-=(C(O))2=N-, -O-NR1-linear and a linking group of a group of (C1-C4)alkylene-CR1R2-OC(O)-CR1R2-, -C(O)-O-, -O-, -NR1-, wherein R1 and R2 are independently selected from the group consisting of a list of H, alkyl, alkenyl, alkynyl, aryl; wherein S is a hydrophilic pendant group that provides solubility to the polymer in a solvent, the same or different, independently selected from the group consisting of the following groups List of one or more: COOX, -SO3X (X is selected from the group consisting of H, alkyl, alkenyl, alkynyl, aryl, alkali metal, NW4 (W is H or alkyl or any combination thereof) List), -SO2NP1P2, -CONP1P2 (P1 and P2 are independently selected from the list comprising H, alkyl, alkenyl, alkynyl, aryl); and, m is 0, 1, 2 or 3, k Is 1, 2 or 3. In a certain embodiment, the n organic units can be capped with any suitable UV-curable component, such as alkenyl, alkynyl, acrylic, and the like. Core, linker and S-group can be independently selected Choose.

上述溶劑可以包括下述溶劑中之一種或多種:極性質子溶劑、極性非質子溶劑和非極性溶劑。更詳言之,上述溶劑可以包括下述溶劑中之一種或多種:水、酮、酮/醇二元混合物、羥基酮、四氫呋喃(THF)、乙酸甲酯(MA)、MIBK。在各種實施方式中,上述聚合物溶液可以包括一種或多種添加劑、例如壬基苯氧基縮水甘油醚、醇、酸、增塑劑、穩定劑、抗氧化劑和受阻酚。在本發明之進一步實施方式中,上述方法步驟可通過使用各種系統、裝置和機制來實施。以下詳述其他特徵、實施例和實施方式。 The above solvent may include one or more of the following solvents: a polar protic solvent, a polar aprotic solvent, and a non-polar solvent. More specifically, the above solvent may include one or more of the following solvents: water, ketone, ketone/alcohol binary mixture, hydroxyketone, tetrahydrofuran (THF), methyl acetate (MA), MIBK. In various embodiments, the above polymer solution may include one or more additives such as nonylphenoxy glycidyl ether, alcohols, acids, plasticizers, stabilizers, antioxidants, and hindered phenols. In a further embodiment of the invention, the above method steps can be implemented using various systems, devices and mechanisms. Other features, embodiments, and embodiments are detailed below.

100‧‧‧光學元件 100‧‧‧Optical components

102、202、1000、1001‧‧‧基底 102, 202, 1000, 1001‧‧‧ base

204‧‧‧聚合物膜 204‧‧‧ polymer film

300‧‧‧將聚合物溶液沉積到基底之工序 300‧‧‧Process of depositing a polymer solution onto a substrate

302‧‧‧提供聚合物溶液 302‧‧‧Providing polymer solution

304‧‧‧預沉積基板處理 304‧‧‧Predeposition substrate treatment

306‧‧‧沉積聚合物溶液 306‧‧‧Deposited polymer solution

308‧‧‧移除溶劑 308‧‧‧Remove solvent

600‧‧‧鑄模 600‧‧‧ mould

602‧‧‧第一表面 602‧‧‧ first surface

603‧‧‧型腔 603‧‧‧ cavity

604‧‧‧第二表面 604‧‧‧ second surface

606‧‧‧聚合物溶液 606‧‧‧ polymer solution

608‧‧‧水蒸氣 608‧‧‧Water Vapor

702‧‧‧成型聚合物塗層 702‧‧‧Formed polymer coating

800‧‧‧顯示系統 800‧‧‧Display system

801‧‧‧光學補償器堆疊 801‧‧‧ optical compensator stack

810‧‧‧j-相位差板 810‧‧‧j-phase difference plate

820‧‧‧第一液晶層 820‧‧‧First liquid crystal layer

825‧‧‧第二液晶層 825‧‧‧Second liquid crystal layer

830‧‧‧偏振層 830‧‧‧Polarization layer

840‧‧‧反射偏振層 840‧‧‧Reflective polarizing layer

850‧‧‧光調製器 850‧‧‧Light Modulator

900‧‧‧堆疊 900‧‧‧Stacking

905‧‧‧基底 905‧‧‧Base

910‧‧‧PVA層 910‧‧‧PVA layer

915、920‧‧‧相位差層 915, 920‧‧‧ phase difference layer

925‧‧‧PSA層 925‧‧‧PSA layer

930‧‧‧VA電池層 930‧‧‧VA battery layer

935‧‧‧PET層 935‧‧‧PET layer

940‧‧‧保護膜 940‧‧‧Protective film

1002‧‧‧狹縫模 1002‧‧‧Slit mode

1003‧‧‧塗布方向 1003‧‧‧ Coating direction

1004‧‧‧壓紋輥 1004‧‧‧embossing roller

1005‧‧‧最終結構 1005‧‧‧ final structure

實施方式通過實施例來說明,但是並不限於附圖之中的圖,附圖中示出類似元件作為參考,其中,第1圖係為與光學元件相關聯之坐標系的高階圖。 The embodiments are illustrated by the embodiments, but are not limited to the drawings in the drawings, in which like elements are referenced, wherein FIG. 1 is a high-order diagram of the coordinate system associated with the optical elements.

第2圖係為示出具有一個塗布了聚合物膜之表面的基底的高階圖。 Figure 2 is a high level diagram showing a substrate having a surface coated with a polymer film.

第3圖係為本發明公開之各種實施方式中用於在基底上沉積水性聚合物溶液之方法的示意圖。 Figure 3 is a schematic illustration of a method for depositing an aqueous polymer solution on a substrate in various embodiments of the present disclosure.

第4A圖示出沉積在基底上之聚合物溶液的乾燥厚度與濕厚度之依存性的例子。 Fig. 4A shows an example of the dependence of the dry thickness and the wet thickness of the polymer solution deposited on the substrate.

第4B圖示出沉積在基底上之聚合物溶液的厚度相位差與乾燥厚度之依存性的例子。 Fig. 4B shows an example of the dependence of the thickness phase difference of the polymer solution deposited on the substrate on the dry thickness.

第5圖示出對不同聚合物濃度(N)測得的作為剪切速率(s-1)之函數的粘度(cP)的依存性。 Figure 5 shows the dependence of viscosity (cP) as a function of shear rate (s -1 ) measured for different polymer concentrations (N).

第6A-6C圖示出形成光學元件之成型加工例。 6A-6C illustrate a molding process example of forming an optical element.

第7A、7B圖示出沉積在基底上之聚合物溶液層之開槽加工例。 7A, 7B illustrate a grooving process example of a polymer solution layer deposited on a substrate.

第8圖示出顯示系統例之剖面示意圖例。 Fig. 8 is a view showing an example of a schematic cross section of an example of a display system.

第9A-9B圖示出各種顯示系統堆疊例之剖面示意圖。 9A-9B are schematic cross-sectional views showing various stacks of display systems.

第10圖示出狹縫模沉積技術。 Figure 10 shows a slot die deposition technique.

在下述描述中,詳細說明了大量特定細節以便充分理解本發明之理念。本發明之理念不以這些細節之中的部分或全部實施為前提。在其他實例中,眾所周知之加工工序沒有詳細說明,以防止不必要地掩蓋本發明之理念。部分理念以特定實施方式之形式加以描述,應當理解這些實施方式對本發明理念沒有限定作用。 In the following description, numerous specific details are set forth in order to provide a The concept of the invention is not premised on the implementation of some or all of these details. In other instances, well known processing steps have not been described in detail to prevent unnecessarily obscuring the inventive concept. Some of the concepts are described in terms of specific embodiments, and it should be understood that these embodiments do not limit the inventive concept.

前言 Foreword

聚合物能夠被用於製造各種光學元件,例如塑膠光纖、光學塗層、透鏡、相位差板、起偏器、光准直器、光波導、光學膜(擴散器、准直結構、光學增強膜、防眩光和防反射結構)、發光器和許多其他類型之裝置。然而,這類應用要求特定光學特性,並且在很多情形下,亦要求特定加工特性,極少數聚合物具有足夠高數值之折射率及/或雙反射。例如,光學各向異性雙折射膜能夠被用在液晶顯示器(LCDs)或其他背光堆疊用途中,例如相位差板、光學膜、准直器、光學膜、發光器、光箱、光波導、光准直器等等。這些膜能夠適用於每種LCD類型之光學特性。上述膜能夠通過單軸拉伸和雙軸拉伸、對聚合物施加剪切應力、鑄造、模塑及其他合適之技術而獲得光學各向異性。例如TAC、PC、PMMA、聚醯胺、環 烯烴聚合物(COP)能夠被用於製造LCDs用負A、C、AC板或其他光學元件。另一種聚合物取向技術利用熱致液晶聚合物,並且與電學領域應用同樣地加熱到其相變點以上或採用被預拉伸或摩擦之基底以提供所要求之取向。 Polymers can be used to fabricate various optical components such as plastic optical fibers, optical coatings, lenses, phase difference plates, polarizers, optical collimators, optical waveguides, optical films (diffusers, collimating structures, optically enhanced films). , anti-glare and anti-reflective structures), illuminators and many other types of devices. However, such applications require specific optical properties and, in many cases, require specific processing characteristics, with very few polymers having sufficiently high values of refractive index and/or double reflection. For example, optically anisotropic birefringent films can be used in liquid crystal displays (LCDs) or other backlight stacking applications, such as phase difference plates, optical films, collimators, optical films, illuminators, light boxes, optical waveguides, light. Collimator and so on. These films can be adapted to the optical properties of each LCD type. The above films are capable of obtaining optical anisotropy by uniaxial stretching and biaxial stretching, applying shear stress to the polymer, casting, molding, and other suitable techniques. For example, TAC, PC, PMMA, polyamine, ring Olefin polymers (COP) can be used to make negative A, C, AC plates or other optical components for LCDs. Another polymer orientation technique utilizes a thermotropic liquid crystal polymer and is heated above its phase transition point or using a pre-stretched or rubbed substrate to provide the desired orientation as in the electrical field application.

如上所述,許多傳統之光學膜通過拉伸製造來獲得某種特性。拉伸產生各種應力並且損傷這些傳統膜,對它們之性能產生不良影響。另外,可能很難在兩個垂直方向(通常要求獲得對LCD堆疊而言係為必須之性能)進行拉伸。更大之顯示格式導致另一種複雜程度和品質要求。此處所述之方法沉積不同種類的不需要被拉伸之光學膜,或實施熱處理而獲得取向,結果在整合於光學元件、例如LCD時實質上避免應力和損傷。與傳統方法相比,因為分子在剪切應力之作用下取向,故此在沉積工序中獲得聚合物分子在這些膜中之取向。 As described above, many conventional optical films are manufactured by stretching to obtain a certain characteristic. Stretching produces various stresses and damages these conventional films, which adversely affect their performance. In addition, it may be difficult to stretch in two perpendicular directions, which typically require performance that is necessary for LCD stacking. A larger display format leads to another level of complexity and quality. The methods described herein deposit different types of optical films that do not need to be stretched, or perform heat treatment to achieve orientation, with the result that stress and damage are substantially avoided when integrated into an optical component, such as an LCD. The orientation of the polymer molecules in these films is obtained in the deposition process because the molecules are oriented under shear stress as compared to conventional methods.

根據本發明公開之一個或多個實施方式,沉積方法使用聚合物溶液形成各種光學元件。適當的聚合物溶液可包括大約0.1wt%-30wt%、甚至1wt%-10%wt的具有剛性棒狀分子之特定聚合物。聚合物溶液中使用之溶劑可包括大範圍之物質例如極性質子溶劑、極性非質子溶劑和非極性溶劑。聚合物分子可以具有鏈長約在5,000-100,000之間的均一原子質量單位,應予說明,最佳鏈長和分子量通常取決於聚合物溶液中之聚合物濃度、粘度、溫度和許多其他沉積和後沉積加工之理化參數。聚合物鏈之尺寸使得上述聚合物分子至少在塗布方向取向,從而獲得所希望之光學元件用折射率。如後所述,正A板、負C板和雙軸聚合物可至少部分基於聚合物鏈之取向或拉伸而形成。 In accordance with one or more embodiments of the present disclosure, a deposition method uses a polymer solution to form various optical components. Suitable polymer solutions can include from about 0.1 wt% to 30 wt%, or even from 1 wt% to 10% wt, of a particular polymer having rigid rod-like molecules. The solvent used in the polymer solution may include a wide range of substances such as polar protic solvents, polar aprotic solvents, and non-polar solvents. The polymer molecule may have a uniform atomic mass unit with a chain length of between about 5,000 and 100,000. It should be noted that the optimum chain length and molecular weight generally depend on the polymer concentration, viscosity, temperature, and many other depositions in the polymer solution. Physical and chemical parameters of post deposition processing. The size of the polymer chain is such that the above polymer molecules are oriented at least in the coating direction to obtain a desired refractive index for the optical element. As described later, the positive A plate, the negative C plate, and the biaxial polymer can be formed based, at least in part, on the orientation or stretching of the polymer chains.

上述聚合物溶液可使用下述技術沉積:狹縫模、噴霧、模塑、輥對輥塗布、邁耶棒式塗布、輥塗、凹版塗布、微凹版塗布、逗點式塗布、刮刀塗布、擠出、印刷、浸漬塗布等等。例如,狹縫模技術能夠在壓力作用下迫使聚合物溶液從蓄水池通過狹縫到達移動基底。狹縫可以具有遠小於蓄水池之橫截面,並且可以垂直於基底移動方向取向。壓力、狹縫寬度之尺寸、狹縫和基底之間隙、基底移動速度以及以上描述之各種聚合物溶液特性之組合提供了分子之特定取向(例如,這些參數能夠定義正A板之特性)。 The above polymer solution can be deposited using the following techniques: slot die, spray, molding, roll-to-roll coating, Meyer bar coating, roll coating, gravure coating, micro gravure coating, comma coating, knife coating, extrusion Out, printing, dip coating, and the like. For example, slot die technology is capable of forcing a polymer solution from a reservoir through a slit to a moving substrate under pressure. The slit may have a cross section that is much smaller than the reservoir and may be oriented perpendicular to the direction of movement of the substrate. The combination of pressure, slit width, slit and substrate gap, substrate movement speed, and various polymer solution characteristics described above provides a specific orientation of the molecules (e.g., these parameters can define the characteristics of the positive A-plate).

用於聚合物溶液沉積之基底可包括聚合物基底、玻璃基底、TAC基底、聚丙烯基底、聚碳酸酯基底、PET、聚丙烯酸基底、PMMA基底等等。可在沉積聚合物溶液前,採用一種或多種技術處理基底以提高沉積到基底上之聚合物溶液之潤濕性及/或粘附性。尤其是,上述處理技術可包括下述之中的一個或多個:清洗(例如,超聲波清洗)、洗脫及/或使用中度鹼性水溶液氧化、皂化、沉積底漆層(例如,矽烷或聚乙烯亞胺)、通過利用各種氣體和蒸汽對其實施電暈放電或等離子體放電而修飾基底表面之凹凸、電子束或離子束。上述預沉積技術亦可包括向聚合物溶液中添加添加劑。上述添加劑可包括增塑劑、抗氧化劑、表面活性劑、成型性劑、穩定劑、壬基苯氧基縮水甘油醚、醇、酸和受阻酚或其他低分子量材料及聚合物。 Substrates for polymer solution deposition may include polymeric substrates, glass substrates, TAC substrates, polypropylene substrates, polycarbonate substrates, PET, polyacrylic substrates, PMMA substrates, and the like. The substrate may be treated with one or more techniques prior to depositing the polymer solution to increase the wettability and/or adhesion of the polymer solution deposited onto the substrate. In particular, the above processing techniques may include one or more of the following: cleaning (eg, ultrasonic cleaning), elution, and/or oxidation with a moderately alkaline aqueous solution, saponification, deposition of a primer layer (eg, decane or Polyethyleneimine), which is modified by corona discharge or plasma discharge using various gases and vapors to modify irregularities, electron beams or ion beams on the surface of the substrate. The above predeposition techniques can also include the addition of additives to the polymer solution. The above additives may include plasticizers, antioxidants, surfactants, moldability agents, stabilizers, nonylphenoxy glycidyl ethers, alcohols, acids and hindered phenols or other low molecular weight materials and polymers.

通常,聚合物溶液在沉積前可能為各相同性,不具有適合分子取向之理想方向。然而,各種後沉積技術可被用於獲得所希望之分子取向或特定光學特性。後沉積技術可包括例如紫外線(UV)交聯、特定乾燥技 術、從聚合物溶液中蒸發溶劑技術、紅外線(IR)照射、加熱、施加乾燥氣流、成型等等。 Generally, polymer solutions may be identical before deposition and do not have the desired orientation for molecular orientation. However, various post deposition techniques can be used to achieve the desired molecular orientation or specific optical properties. Post deposition techniques may include, for example, ultraviolet (UV) crosslinking, specific drying techniques Evaporation of solvent technology from polymer solutions, infrared (IR) irradiation, heating, application of a dry gas stream, molding, and the like.

上述特別設計之聚合物和沉積加工可獲得具有高折射率值、例如在部分可見區內大於1.6甚至大於1.7之光學元件。這些光學元件可用作例如正A板、負C板或雙軸聚合物,以及例如在LCD有源板中用作相位差板或在背光堆疊應用中用作光准直器和光波導。其他應用、例如透鏡和光學安全膜亦包括在本發明之範圍內。 The specially designed polymers and deposition processes described above can achieve optical components having high refractive index values, such as greater than 1.6 or even greater than 1.7 in the partially visible region. These optical elements can be used, for example, as positive A plates, negative C plates or biaxial polymers, and as phase difference plates, for example, in LCD active plates or as optical collimators and optical waveguides in backlight stacking applications. Other applications, such as lenses and optical security films, are also included within the scope of the invention.

定義 definition

術語“可見光譜範圍”係指下限約為400nm、上限約為700nm之光譜範圍。 The term "visible spectral range" refers to a spectral range with a lower limit of about 400 nm and an upper limit of about 700 nm.

術語“相位差層”係指光學各向異性層,其能夠改變穿過該當各向異性層之光波的偏振狀態,由與沉積聚合物溶液層或基於此之相應光學元件相關聯之笛卡兒坐標系的三個主折射率(nx、ny和nz)表征。折射率nx和ny之兩個主方向屬於與相位差層之平面重合的xy-平面,而折射率(nz)之一個主方向與相位差層之法線一致。進一步示於第1圖,第1圖示出包含帶沉積聚合物溶液之基底的光學元件100和具有垂直軸x、y和z之軸系(例如笛卡兒坐標系)。在各種實施方式中,nx、ny和nz之中至少兩個折射率具有不同數值。術語“相位差層”亦可以指將入射之單色偏振光分成多個成分、並將相對相位差或相移引入其間之光學元件。 The term "phase difference layer" refers to an optically anisotropic layer capable of changing the polarization state of light waves passing through the anisotropic layer by Descartes associated with a layer of deposited polymer solution or a corresponding optical element based thereon. The three principal refractive indices (n x , n y and n z ) of the coordinate system are characterized. The two principal directions of the refractive indices n x and n y belong to the xy-plane coincident with the plane of the phase difference layer, and one main direction of the refractive index (n z ) coincides with the normal of the phase difference layer. Further shown in Fig. 1, a first diagram shows an optical element 100 comprising a substrate with a deposited polymer solution and a shaft system having a vertical axis x, y and z (e.g., a Cartesian coordinate system). In various embodiments, at least two of the refractive indices of n x , n y , and n z have different values. The term "phase difference layer" may also refer to an optical element that splits incident monochromatic polarized light into a plurality of components and introduces a relative phase difference or phase shift therebetween.

術語“雙軸相位差層”係指折射率nx、ny和nz在可見光譜範圍內符合下述條件之光學層:nx≠nz、nx≠ny和nx≠nzThe term "biaxial phase difference layer" refers to an optical layer having refractive indices n x , n y , and n z in the visible spectral range that satisfy the following conditions: n x ≠n z , n x ≠n y , and n x ≠n z .

術語“單軸相位差層”係指折射率在可見光譜範圍內符合下 述條件之光學層:nx=ny≠nz或nx≠ny=nz或nx=nz≠nyThe term "uniaxial retardation layer" refers to an optical layer having a refractive index in the visible spectral range that satisfies the following conditions: n x = n y ≠ n z or n x ≠ n y = n z or n x = n z ≠ n y .

術語“AC-板類型之光學各向異性相位差層”係指折射率nx、ny和nz在可見光譜範圍內符合下述條件之光學層:nz<ny<nxThe term "AC-plate type optically anisotropic retardation layer" refers to an optical layer having refractive indices nx, ny, and nz that meet the following conditions in the visible spectral range: n z <n y <n x .

術語“負C-板類型之光學各向異性相位差層”係指折射率nx、ny和nz在可見光譜範圍內符合下述條件之光學層:nz<nx=nyThe term "negative C-plate type optically anisotropic retardation layer" refers to an optical layer having refractive indices n x , n y and n z in the visible spectral range that satisfy the following conditions: n z <n x = n y .

對於各向異性層之所有類型而言,上述定義不隨座標系(實驗室坐標系)繞垂直z-軸之旋轉而變。 For all types of anisotropic layers, the above definition does not vary with the rotation of the coordinate system (laboratory coordinate system) about the vertical z-axis.

術語“C-板”係指雙折射光學元件,例如,具有實質上垂直於所選光學元件表面之主光軸(通常係指“非尋常光軸”)的板或膜。該主光軸係指沿著該軸上述雙折射光學元件之折射率不同於沿著對主光軸來說為尋常之方向的實質上均一的折射率。例如,使用第1圖所示軸系之C-板係為nx=ny≠nz,其中,nx、ny和nz分別係為沿x、y和z軸之折射率。該當光學各向異性被定義為△nzx=nz-nx。為了方便,將△nzx稱之為其絕對值。 The term "C-plate" refers to a birefringent optical element, for example, a plate or film having a major optical axis (generally referred to as "unusual optical axis") that is substantially perpendicular to the surface of the selected optical element. The primary optical axis means that the refractive index of the birefringent optical element along the axis is different from the substantially uniform refractive index along a direction normal to the main optical axis. For example, the C-plate system using the shafting shown in Fig. 1 is n x = n y ≠ n z , where n x , n y , and n z are refractive indices along the x, y, and z axes, respectively. The optical anisotropy is defined as Δn zx = n z - n x . For convenience, Δn zx is referred to as its absolute value.

術語“A-板”表示雙折射光學元件,例如,主光軸在光學元件之x-y平面內的板或膜。正雙折射A-板能夠使用例如聚合物(例如聚乙烯醇、聚降冰片烯或聚碳酸酯)之單軸拉伸膜、或向列相正光學各向異性液晶聚合物(LCP)材料之單軸取向膜來製造。負雙折射A-板能夠使用負光學各向異性向列相LCP材料、包括例如盤狀化合物之單軸取向膜形成。 The term "A-plate" means a birefringent optical element, such as a plate or film having a major optical axis in the x-y plane of the optical element. The positive birefringent A-plate can be a uniaxially stretched film such as a polymer (for example, polyvinyl alcohol, polynorbornene or polycarbonate), or a nematic phase positive optical anisotropic liquid crystal polymer (LCP) material. A uniaxially oriented film is produced. The negative birefringent A-plate can be formed using a negative optical anisotropic nematic phase LCP material, including a uniaxially oriented film such as a discotic compound.

術語“雙軸相位差板”可以指雙折射光學元件,例如,沿全部三個軸具有不同折射率(即nx≠ny≠nz)之板或膜。雙軸相位差板能夠通過例如雙軸取向塑膠膜製造。平面內相位差和平面外相位差係為用於描述雙軸相位差板之參數。因為平面內相位差接近0,雙軸相位差板元件表現得更 像是C-板。通常,雙軸相位差板如所定義,對550nm發光波長具有至少3nm之平面內相位差。具有更低平面內相位差之相位差板被認為是C-板。 The term "biaxial phase difference plate" may refer to a birefringent optical element, for example, a plate or film having a different refractive index (i.e., n x ≠n y ≠n z ) along all three axes. The biaxial phase difference plate can be manufactured by, for example, a biaxially oriented plastic film. The in-plane phase difference and the out-of-plane phase difference are parameters for describing the biaxial phase difference plate. Since the in-plane phase difference is close to zero, the biaxial phase difference plate element behaves more like a C-plate. Typically, the biaxial phase difference plate, as defined, has an in-plane phase difference of at least 3 nm for a 550 nm emission wavelength. A phase difference plate having a lower in-plane phase difference is considered to be a C-plate.

術語“聚合物”應當被理解為包括聚合物、共聚物(例如,使用兩個或更多不同單體製備的聚合物)、低聚物和它們之組合,以及能夠以可混溶之形式通過例如共擠出或反應、包括酯基轉移而形成之聚合物、低聚物或共聚物。除非特別說明,嵌段共聚物和無規共聚物都包括在其中。 The term "polymer" should be understood to include polymers, copolymers (eg, polymers prepared using two or more different monomers), oligomers, and combinations thereof, and capable of passing in a miscible form. For example, a polymer, oligomer or copolymer formed by coextrusion or reaction, including transesterification. Unless otherwise specified, both block copolymers and random copolymers are included.

術語“偏振”係指平面偏振、圓偏振、橢圓偏振或任何其他非隨機偏振狀態,在該狀態下,光束之電向量不會隨機改變方向,而是或者維持恒定之取向或者成體系地改變。在平面偏振中,電向量保持在單一平面內,而在圓偏振或橢圓偏振中,光束之電向量成體系地旋轉。 The term "polarization" refers to plane polarization, circular polarization, ellipsometry or any other non-random polarization state in which the electrical vector of the beam does not change direction randomly, but either maintains a constant orientation or changes systematically. In planar polarization, the electrical vector remains in a single plane, while in circular or elliptical polarization, the electrical vector of the beam rotates systematically.

術語“相位差(retardation或retardance)”係指兩個垂直折射率間差值與光學元件厚度之乘積。 The term "retardation or retardation" refers to the product of the difference between two perpendicular refractive indices and the thickness of the optical element.

術語“平面內相位差”係指兩個垂直平面內折射率間差值與光學元件厚度之乘積。 The term "in-plane phase difference" refers to the product of the difference in refractive index between two perpendicular planes and the thickness of the optical element.

術語“平面外相位差”係指沿光學元件厚度方向(z方向)之折射率減去一個平面內折射率所得差值與光學元件厚度之乘積。可選地,該術語係指沿光學元件厚度方向(z方向)之折射率減去兩個垂直平面內折射率平均值所得差值與光學元件厚度之乘積。當然平面外相位差之符號係為正或負對使用者很重要。但是方便起見,在此僅給出平面外相位差之絕對值。當然熟習此技藝者知道何時使用正或負平面外相位差之光學元件。例如,普遍認為當平面內折射率實質上相等並且厚度方向之折射率小於上述平面內指數時,包含三乙醯基纖維素之取向膜能夠製作負C-板。然而,在 此將平面外相位差之數值記載為正值。 The term "out-of-plane phase difference" means the product of the difference in refractive index in the thickness direction (z direction) of the optical element minus the in-plane refractive index and the thickness of the optical element. Alternatively, the term refers to the product of the refractive index in the thickness direction (z direction) of the optical element minus the average of the refractive indices in the two perpendicular planes and the thickness of the optical element. Of course, the sign of the out-of-plane phase difference is positive or negative and is important to the user. However, for convenience, only the absolute value of the out-of-plane phase difference is given here. Of course, those skilled in the art will know when to use optical elements with positive or negative out-of-plane retardation. For example, it is generally considered that when the in-plane refractive index is substantially equal and the refractive index in the thickness direction is smaller than the above-described in-plane index, the alignment film containing triacetyl cellulose can produce a negative C-plate. However, in This describes the value of the out-of-plane phase difference as a positive value.

術語“實質上不吸收”係指對可見光之至少一個偏振狀態,可透過至少80%之光學元件的透過率水準,在此,透過率百分比按入射強度標準化,可選地為偏振光。 The term "substantially non-absorptive" refers to a level of transmission that is permeable to at least one optical state of visible light, permeable to at least 80% of the optical elements, where the percent transmittance is normalized by incident intensity, optionally polarized light.

術語“實質上不散射”係指穿過光學元件傳輸之平行或幾乎平行入射光之水準,對可見光之至少一個偏振狀態在一個小於30°之角度內通過至少80%。 The term "substantially non-scattering" refers to the level of parallel or nearly parallel incident light transmitted through the optical element, with at least one polarization state of visible light passing through at least 80% over an angle of less than 30°.

術語“j-相位差板”係指對可見光之至少一個偏振狀態實質上不吸收和不散射之膜或片,其中三個垂直折射率之中至少兩個不相等,並且平面內相位差不超過100nm,平面外相位差之絕對值至少為50nm。 The term "j-phase difference plate" means a film or sheet that does not substantially absorb or scatter light at least one polarization state of visible light, wherein at least two of the three perpendicular refractive indices are unequal, and the in-plane phase difference does not exceed At 100 nm, the absolute value of the out-of-plane phase difference is at least 50 nm.

所有數值無論是否說明都假定被術語“大約”修飾。術語“大約”通常係指數值範圍,熟習此技藝者會認為該當數值範圍等同於所引之數值(即具有同樣功能或結果)。多數情形下,術語“大約”包括四捨五入至最接近有效數字之數值。 All values, whether or not stated, are assumed to be modified by the term "about." The term "about" is generally a range of index values, and those skilled in the art will recognize that the range of values is equivalent to the recited value (ie, having the same function or result). In most cases, the term "about" includes the value rounded to the nearest significant digit.

重量百分比、重量%、wt%等係為物質重量除以組合物重量再乘以100所得物質濃度之同義詞。 Weight percent, weight percent, wt%, etc. are synonymous with the weight of the material divided by the weight of the composition and multiplied by the concentration of the resulting material.

用端點表示之數值範圍包括該範圍內所有數值(例如1~5包括1、1.5、2、2.75、3、3.80、4和5)。 The range of values represented by the endpoints includes all values within the range (eg, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5).

在本說明書和後附之申請專利範圍中使用時,單數形式“一”、“一個”和“該當”除非特別說明亦包括複數對象。因此,例如,提到含有“化合物”之組合物亦包括兩個或更多化合物之混合物。在本說明書和後附之申請專利範圍中使用時,術語“或”除非特別說明,通常其含義中包 括“及/或”。 As used in the specification and the appended claims, the s Thus, for example, reference to a composition containing "compound" also includes a mixture of two or more compounds. When used in the specification and the appended claims, the term "or" is used in its meaning unless otherwise specified. Including "and / or".

水溶性光學聚合物之例 Example of water-soluble optical polymer

此處描述之水溶性光學聚合物包括n個亞單元的鏈,每個亞單元具有下述通式結構:[-(Core(S)m)k-Gl-]n (I) The water soluble optical polymer described herein comprises a chain of n subunits, each subunit having the following general structure: [-(Core(S) m ) k -G l -] n (I)

亞單元數n可以在大約5~50,000之間,更詳言之在10~10,000之間。熟習此技藝者能夠理解亞單元數可以定義基於此之光學元件的物性。例如,當亞單元數相對小時,相應聚合物鏈可能太短而無法獲得所希望之取向。另一方面,當亞單元數相對高時,相應聚合物鏈可能太長並導致聚合物為高粘度和低溶解性。就這一點而言,亞單元數和相應鏈長取決於所選有機成分(Core)、連接基(G)、側基(S)、所希望之取向和特殊應用。 The number of subunits n can be between about 5 and 50,000, more specifically between 10 and 10,000. Those skilled in the art will appreciate that subunit numbers can define the physical properties of optical components based thereon. For example, when the number of subunits is relatively small, the corresponding polymer chain may be too short to achieve the desired orientation. On the other hand, when the number of subunits is relatively high, the corresponding polymer chain may be too long and cause the polymer to have high viscosity and low solubility. In this regard, the number of subunits and the corresponding chain length depend on the selected organic component (Core), linker (G), pendant group (S), desired orientation, and particular application.

在各種實施方式中,上述有機成分Core提供與具有式(I)之有機高分子化合物相關聯之大分子的線性和剛性。親水性側基(Sm)和有機單元數n可以控制聚合物溶液之介晶特性和粘度間的比例。有機成分(Core)、親水性側基(S)和有機亞單元數n之選擇決定光學膜之類型和雙反射。 In various embodiments, the above organic component Core provides linearity and rigidity of the macromolecule associated with the organic polymeric compound of formula (I). The hydrophilic side group (S m ) and the number of organic units n can control the ratio between the mesogenic properties and the viscosity of the polymer solution. The choice of the organic component (Core), the hydrophilic side group (S) and the number of organic subunits n determines the type of optical film and double reflection.

在某些實施方式中,聚合物之中大部分有機單元(例如超過90%,超過95%,或超過99%)係為相同。然而,在某些實施方式中,至少一個有機亞單元係為不同而形成共聚物。 In certain embodiments, most of the organic units in the polymer (eg, more than 90%, more than 95%, or more than 99%) are the same. However, in certain embodiments, at least one of the organic subunits is different to form a copolymer.

每個亞單元可包括至少四個能形成剛性棒狀大分子之共軛有機成分Core。這些共軛成分可分別選自下列結構式(II)~(VIII): Each subunit may comprise at least four conjugated organic components Core capable of forming a rigid rod-shaped macromolecule. These conjugated components may be selected from the following structural formulae (II) to (VIII), respectively:

,其中R1,R2=H、烷基 -C≡C- (X) , where R1, R2=H, alkyl-C≡C- (X)

其中,P係為等於1、2、3、4、5或6之整數。應予說明,成分(II)-(X)能夠在結構變化時給大分子提供線性和剛性。 Wherein P is an integer equal to 1, 2, 3, 4, 5 or 6. It should be noted that the components (II) to (X) are capable of providing linearity and rigidity to the macromolecule when the structure is changed.

在某個實施方式中,每個亞單元之中有機成分(Core)可為相同類型。另外,每個有機亞單元可包括順序改變包含高分子化合物之光學元件的光學特性之不同類型的Core。熟習此技藝者應當理解將有機成分組合到亞單元中會影響光學元件用特定光學特性。 In a certain embodiment, the organic component (Core) in each subunit can be of the same type. In addition, each of the organic subunits may include a different type of Core that sequentially changes the optical characteristics of the optical element including the polymer compound. Those skilled in the art will appreciate that combining organic components into subunits can affect the optical properties of the optical component.

進而,每個亞單元亦可包括一個或多個連接基(G)。連接基的一些例子包括-C(O)-NR1-、=(C(O))2=N-、-O-NR1-、線性和分支(C1-C4) 烷撐、-CR1R2-O-C(O)-CR1R2-、-C(O)-O-、-O-、-NR1-,其中R1和R2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表。 Further, each subunit may also include one or more linkers (G). Some examples of linkers include -C(O)-NR1-, =(C(O))2=N-, -O-NR1-, linear and branched (C1-C4) Alkyl, -CR1R2-OC(O)-CR1R2-, -C(O)-O-, -O-, -NR1-, wherein R1 and R2 are independently selected from the group consisting of H, alkyl, alkenyl, alkyne A list of bases and aryl groups.

進而,每個亞單元亦包含一個或多個親水性側基(S),親水性側基包括為聚合物或其鹽提供在適當溶劑中的溶解度之親水性基團。在某些實施方式中,一個或多個側基可以係為親水性基團、例如-COOX、-SO3X,其中X選自包含H、烷基、鏈烯基、炔基、芳基、鹼金屬、NW4(W係為H或烷基或它們之任意組合)、-SO2NP1P2和-CONP1P2(P1和P2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表)之列表。在式(I)中,上述側基(m)總數係為0、1、2或3。 Further, each subunit also contains one or more hydrophilic pendant groups (S), and the hydrophilic side groups include hydrophilic groups that provide solubility of the polymer or its salt in a suitable solvent. In certain embodiments, one or more of the pendant groups may be a hydrophilic group, such as -COOX, -SO3X, wherein X is selected from the group consisting of H, alkyl, alkenyl, alkynyl, aryl, alkali metal , NW4 (W is H or alkyl or any combination thereof), -SO2NP1P2 and -CONP1P2 (P1 and P2 are independently selected from the list comprising H, alkyl, alkenyl, alkynyl, aryl) . In the formula (I), the total number of the above side groups (m) is 0, 1, 2 or 3.

在各實施方式中,所述n個有機單元可包括一個或多個按如下原則連接於這些n個有機單元之末端成分:T-[-(Core(S)m)k-Gl-]n-T In various embodiments, the n organic units may include one or more terminal components connected to the n organic units as follows: T-[-(Core(S) m ) k -G l -] n -T

其中,T包含鏈烯基、炔基、丙烯酸或任何其他UV-固化基團之中的一個或多個。 Wherein T comprises one or more of an alkenyl group, an alkynyl group, an acrylic acid or any other UV-curing group.

側基數以及有機單元n數可以控制聚合物之介晶特性和粘度間的比例。有機成分(Core)、側基(S)和有機單元數(亦即n值)的選擇決定聚合物和基於上述聚合物之相應光學元件的類型和雙反射。這些聚合物能夠形成固態光學相位差層,例如基於上述聚合物及其成分之取向或解取向的正A-型相位差層、負C-型相位差層或Ac-型相位差層。例如,具有上述式(II)之共軛成分通常係為線性,但具有上述式(III)之共軛成分通常係為無序。因此,如果亞單元僅包含共軛成分(II),則所得聚合物能夠具有負C-型相位差層。而一旦共軛成分(II)和(III)結合到亞單元上,所得聚合物就可 具有Ac-型相位差層。 The number of side groups and the number of organic units n can control the ratio between the mesogenic properties of the polymer and the viscosity. The choice of the organic component (Core), the pendant group (S) and the number of organic units (i.e., the value of n) determines the type and dual reflection of the polymer and the corresponding optical element based on the above polymer. These polymers are capable of forming a solid optical retardation layer, such as a positive A-type retardation layer, a negative C-type retardation layer or an Ac-type retardation layer based on the orientation or de-orientation of the above-described polymer and its components. For example, the conjugated component having the above formula (II) is usually linear, but the conjugated component having the above formula (III) is usually disordered. Therefore, if the subunit contains only the conjugated component (II), the resulting polymer can have a negative C-type retardation layer. And once the conjugated components (II) and (III) are bonded to the subunit, the resulting polymer can It has an Ac-type retardation layer.

分子必須為剛性且足夠長以便在乾燥時提供順序。然而,聚合物在水性溶液中的這兩項因素可能產生LLC形成傾向。該當效果在希望製造C-板時並不理想。為了抑制LLC形成,必須添加減小介晶特性之特定基團,例如下述基團(但並不限於此): The molecules must be rigid and long enough to provide a sequence when dry. However, these two factors of the polymer in an aqueous solution may have a tendency to form LLC. This effect is not ideal when it is desired to manufacture a C-plate. In order to inhibit LLC formation, it is necessary to add a specific group that reduces the mesogenic properties, such as the following groups (but not limited to this):

(a)引入鏈無序(非線性)片段 或下述基團: (a) Introducing chain disordered (nonlinear) fragments or Or the following groups:

(b)引入產生鏈間空間障礙相互作用(sterically trouble interaction)之大片段: (b) Introducing large fragments that produce sterically trouble interactions:

(c)引入產生鏈間空間障礙相互作用之側基: (c) Introducing side groups that create interactions between interchain spaces:

在某些實施方式中,聚合物可具有特定數量之有機化合物和連接基。換句話說,形成聚合物之單體亞單元可包括例如兩種有機成分,其中一種不具有側基,而另一種具有兩個側基。第一有機成分(Core)可以用上述式中的任一種表示,亦即II(其中p=1)、III(其中p=1)、V、VII和VIII。第二有機成分(Core)可以用通式II(其中p=2)代表。側基(S)可包括磺基SO3H。第一連接基(G)可包括C(O)-NH-或=2(C(O))=N-,而第二連接基(G)可包括-C(O)-、-NH-C(O)-、-N=(C(O))2=中之一。這些亞單元或聚合物的例子可包括:聚(2,2'-二磺基-4,4'-聯苯胺對苯二甲醯胺),聚(2,2'-二磺基-4,4'-聯苯胺間苯二甲醯胺),聚(2,2'-二磺基-4,4'-聯苯胺1,3-二氧代異吲哚啉-5-甲醯胺),聚(2,2'-二磺基-4,4'-聯苯胺1H-苯並咪唑-2,5-二甲醯胺),聚(2,2'-二磺基-4,4'-聯苯胺3,3',4,4'-聯苯基四甲酸二醯亞胺)和聚(2,2'-二磺基-4,4'- 聯苯胺1,4,5,8-萘四甲酸二醯亞胺)。這些亞單元之相應結構式(XI)-(XVI)如下所示: In certain embodiments, the polymer can have a specific amount of organic compound and a linking group. In other words, the monomeric subunit forming the polymer can include, for example, two organic components, one of which has no pendant groups and the other of which has two pendant groups. The first organic component (Core) can be represented by any of the above formulas, that is, II (where p = 1), III (where p = 1), V, VII and VIII. The second organic component (Core) can be represented by the general formula II (where p = 2). The pendant group (S) may include sulfo-based SO 3 H. The first linker (G) may comprise C(O)-NH- or =2(C(O))=N-, and the second linker (G) may comprise -C(O)-, -NH-C One of (O)-, -N=(C(O))2=. Examples of such subunits or polymers may include: poly(2,2'-disulfo-4,4'-benzidine-p-xylyleneamine), poly(2,2'-disulfo-4, 4'-benzidine m-xylamine, poly(2,2'-disulfo-4,4'-benzidine 1,3-dioxoisoindoline-5-carboxamide), Poly(2,2'-disulfo-4,4'-benzidine 1H-benzimidazole-2,5-dimethylguanamine), poly(2,2'-disulfo-4,4'- Benzidine 3,3',4,4'-biphenyltetracarboxylic acid diimine) and poly(2,2'-disulfo-4,4'-benzidine 1,4,5,8-naphthalene Diimine imine tetracarboxylate). The corresponding structural formulas (XI)-(XVI) of these subunits are as follows:

其中,亞單元數n可以在大約5~500,000之間。 Wherein, the number of subunits n can be between about 5 and 500,000.

在其他實施方式中,剛性棒狀大分子可由n個第一類有機亞單元和k個第二類有機亞單元合成。尤其是,第一類有機亞單元可包括下 述結構通式(XVII): In other embodiments, the rigid rod macromolecule can be synthesized from n first type of organic subunits and k second type of organic subunits. In particular, the first type of organic subunits may include the following structural formula (XVII):

而第二類有機亞單元可包括下述結構通式(XVIII): The second type of organic subunits may include the following structural formula (XVIII):

其中,n可以在5~10,000範圍內,k可以在5~10,000範圍內。R1和R2係為可獨立地選自包含-H+、烷基、-(CH2)mSO3M、-(CH2)mSi(O-烷基)3、-CH2-芳基、-(CH2)mOH(m包括1~18之中的數)之列表的側基,在側基之一為H+時,H+總數不超過大分子中側基(R1和R2)總數之50%。M係為選自包含H+、Na+、K+、Li+、Cs+、Ba2+、Ca2+、Mg2+、Sr2+、Pb2+、Zn2+、La3+、Al3+、Ce3+、Y3+、Yb3+、Gd3+、Zr4+和NH4-pQp +之列表的平衡離子,其中Q選自包含線性和分支(C1-C20)烷基、(C2-C20)鏈烯基、(C2-C20)炔基和(C6-C20)芳基烷基之列表,p係為0、1、2、3或4。第一類有機單元和第二類有機單元以任意順序包含在剛性棒狀大分子中,並且聚合了具有例如下述結構式(XIX)之至少一個芳香族二胺單體: Among them, n can be in the range of 5 to 10,000, and k can be in the range of 5 to 10,000. R 1 and R 2 are independently selected from the group consisting of -H + , alkyl, -(CH 2 ) m SO 3 M, -(CH 2 ) m Si(O-alkyl) 3 , -CH 2 -aryl The side group of the list of -(CH 2 ) m OH (m includes the number from 1 to 18). When one of the side groups is H + , the total number of H + does not exceed the side group in the macromolecule (R 1 and R 2 ) 50% of the total. The M system is selected from the group consisting of H + , Na + , K + , Li + , Cs + , Ba 2+ , Ca 2+ , Mg 2+ , Sr 2+ , Pb 2+ , Zn 2+ , La 3+ , Al a counterion of the list 3+ , Ce 3+ , Y 3+ , Yb 3+ , Gd 3+ , Zr 4+ , and NH 4-p Q p + , wherein Q is selected from the group consisting of linear and branched (C1-C20) alkane A list of (C2-C20)alkenyl, (C2-C20)alkynyl and (C6-C20)arylalkyl groups, p is 0, 1, 2, 3 or 4. The first type of organic unit and the second type of organic unit are contained in a rigid rod-shaped macromolecule in any order, and at least one aromatic diamine monomer having, for example, the following structural formula (XIX) is polymerized:

其中R係為側基,該當側基獨立地選自包含-H+、烷基、 -(CH2)mSO3M、-(CH2)mSi(O-烷基)3、-CH2-芳基和-(CH2)mOH之列表的不同單體,其中m係為1~18之數,並且至少一個雙官能親電子單體可具有例如下述結構式(XX): Wherein R is a pendant group, and the pendant group is independently selected from the group consisting of -H + , alkyl, -(CH 2 ) m SO 3 M, -(CH 2 ) m Si(O-alkyl) 3 , -CH 2 a different monomer of the list of -aryl and -(CH 2 ) m OH, wherein m is a number from 1 to 18, and at least one difunctional electrophilic monomer may have, for example, the following structural formula (XX):

酸受體和至少兩種溶劑,其中一種溶劑係為水而另一種溶劑係為與水不混溶之有機溶劑,並且其中聚合步驟之最優pH大約在7~10之間。 The acid acceptor and at least two solvents, one of which is water and the other is water-immiscible organic solvent, and wherein the optimum pH of the polymerization step is between about 7 and 10.

在各種實施方式中,可以使用一種或多種有機聚合物溶液之鹽,例如鹼金屬鹽、銨、烷基取代銨鹽、鏈烯基取代銨鹽、炔基取代銨鹽、芳基取代銨鹽。 In various embodiments, salts of one or more organic polymer solutions can be used, such as alkali metal salts, ammonium, alkyl substituted ammonium salts, alkenyl substituted ammonium salts, alkynyl substituted ammonium salts, aryl substituted ammonium salts.

在各種實施方式中,用於塗布之聚合物及/或所得聚合物結構可包括一種或多種無機化合物、例如氫氧化物和鹼金屬鹽。 In various embodiments, the polymer used for coating and/or the resulting polymer structure can include one or more inorganic compounds, such as hydroxides and alkali metal salts.

用於溶解聚合物之溶劑可包括水、任何有機溶劑或它們之任意組合。 The solvent used to dissolve the polymer may include water, any organic solvent, or any combination thereof.

實施例Example

聚合物合成例 Polymer synthesis example

參考下述說明本發明之各種實施方式的實施例,但本發明不限於此。 The embodiments of the various embodiments of the present invention are described below, but the present invention is not limited thereto.

實施例1 Example 1

本實施例描述聚(2,2'-二磺基-4,4'-聯苯胺間苯二甲醯胺)銫鹽 (亦即結構(XII))之合成: This example describes the synthesis of poly(2,2'-disulfo-4,4'-benzidine m-xylyleneamine) sulfonium salt (ie, structure (XII)):

詳言之,將1.377g(0.004摩爾)4,4'-二氨基聯苯-2,2'-二磺酸與1.2g(0.008摩爾)氫氧化銫一水合物和40毫升水混合,用分散攪拌機攪拌至溶解,將0.672g(0.008摩爾)碳酸氫鈉加入到上述溶液中並攪拌。在高速(2500rpm)攪拌所得溶液時,在5分鐘內逐步添加0.812g(0.004摩爾)間苯二甲醯氯(IPC)溶於乾燥甲苯(15毫升)所得之溶液。持續攪拌5分鐘以上,形成粘稠之白色乳液。然後將上述乳液用40毫升水稀釋,並將攪拌速度降至100rpm。在反應物料均質化後,添加250毫升丙酮使聚合物沉澱。將纖維狀之沉澱物過濾並乾燥。 In detail, 1.377 g (0.004 mol) of 4,4'-diaminobiphenyl-2,2'-disulfonic acid was mixed with 1.2 g (0.008 mol) of cesium hydroxide monohydrate and 40 ml of water to disperse The stirrer was stirred until dissolved, and 0.672 g (0.008 mol) of sodium hydrogencarbonate was added to the above solution and stirred. While stirring the resulting solution at a high speed (2500 rpm), a solution obtained by dissolving 0.812 g (0.004 mol) of m-xylylene chloride (IPC) in dry toluene (15 ml) was gradually added over 5 minutes. Stirring was continued for more than 5 minutes to form a viscous white emulsion. The above emulsion was then diluted with 40 ml of water and the stirring speed was reduced to 100 rpm. After the reaction mass was homogenized, 250 ml of acetone was added to precipitate the polymer. The fibrous precipitate was filtered and dried.

通過凝膠滲透色譜法(GPC)測定聚合物樣品之重均分子量,通過惠普©(HP)1050色譜系統分析上述樣品。用二極體陣列檢測器(DAD HP 1050,在305nm)監控洗脫液。將兩根柱TSKgel G5000PWXL和G6000PWXL串聯(TOSOH Bioscience,Japan)執行GPC測定。柱恒溫在40℃。流量為0.6毫升/分。聚(4-苯乙烯磺酸鈉)被用作GPC標準品。使用Varian GPC軟體Cirrus 3.2計算標準曲線、重均分子量Mw、數均分子量Mn和多分散性(D=Mw/Mn)。洗脫液係為0.1M磷酸鹽緩衝液(pH=7.0)和乙腈之比例分別為80/20的混合物。聚合物之Mw、Mn和多分散性(D)分別為720000、80000和9。 The weight of the polymer sample was measured by gel permeation chromatography (GPC) average molecular weight, in the sample analyzed by a Hewlett-Packard system © (HP) 1050 Chromatography. The eluent was monitored using a diode array detector (DAD HP 1050 at 305 nm). GPC measurement was performed by connecting two columns TSKgel G5000PWXL and G6000PWXL in series (TOSOH Bioscience, Japan). The column is thermostated at 40 °C. The flow rate was 0.6 ml/min. Poly(4-styrenesulfonate sodium) was used as a GPC standard. The standard curve, weight average molecular weight Mw, number average molecular weight Mn, and polydispersity (D = Mw / Mn) were calculated using Varian GPC software Cirrus 3.2. The eluent was a mixture of 0.1 M phosphate buffer (pH = 7.0) and acetonitrile in a ratio of 80/20, respectively. The Mw, Mn and polydispersity (D) of the polymer were 720000, 80,000 and 9, respectively.

實施例2 Example 2

實施例2描述2,2'-二磺基-4,4'-聯苯胺對苯二甲醯胺-間苯二甲醯胺共聚物銫鹽(結構(XI)和(XII)之共聚物)的合成: Example 2 describes 2,2'-disulfo-4,4'-benzidine p-xylamine-m-xylyleneamine copolymer sulfonium salt (copolymer of structures (XI) and (XII)) Synthesis:

可以使用與實施例1中相同之合成方法來製備不同摩爾比之共聚物。詳言之,在1L燒杯中,將4.098g(0.012摩爾)4,4'-二氨基聯苯-2,2'-二磺酸與4.02g(0.024摩爾)氫氧化銫一水合物在水(150毫升)中混合,攪拌至固體完全溶解。將3.91g(0.012摩爾)碳酸鈉加入到上述溶液中,在室溫下攪拌至溶解。然後,加入甲苯(25毫升)。邊以7000rpm攪拌所得溶液,邊加入2.41g(0.012摩爾)對苯二甲醯氯(TPC)和2.41g(0.012摩爾)間苯二甲醯氯(IPC)溶於甲苯(25毫升)所得之溶液。所得混合物在約3分鐘內稠化。停止攪拌器,加入150毫升乙醇,用攪拌器粉碎稠化混合物以製成適合過濾之漿液。過濾聚合物,用150ml 90%水性乙醇清洗兩次。所得聚合物於75℃乾燥。如實施例1所述地分析樣品之GPC分子量。 The same synthesis method as in Example 1 can be used to prepare copolymers of different molar ratios. In detail, in a 1 L beaker, 4.098 g (0.012 mol) of 4,4'-diaminobiphenyl-2,2'-disulfonic acid and 4.02 g (0.024 mol) of cesium hydroxide monohydrate in water ( Mix in 150 ml) and stir until the solid is completely dissolved. 3.91 g (0.012 mol) of sodium carbonate was added to the above solution, and stirred at room temperature until dissolved. Then, toluene (25 ml) was added. While stirring the resulting solution at 7000 rpm, a solution of 2.41 g (0.012 mol) of p-xylylene chloride (TPC) and 2.41 g (0.012 mol) of m-xylylene chloride (IPC) dissolved in toluene (25 ml) was added. . The resulting mixture thickened in about 3 minutes. The stirrer was stopped, 150 ml of ethanol was added, and the thickened mixture was pulverized with a stirrer to prepare a slurry suitable for filtration. The polymer was filtered and washed twice with 150 ml of 90% aqueous ethanol. The obtained polymer was dried at 75 °C. The GPC molecular weight of the samples was analyzed as described in Example 1.

實施例3 Example 3

實施例3描述聚(2,2'-二磺基-4,4'-聯苯胺1,4,5,8-萘四甲醯二亞胺)三乙基銨鹽(亦即上述結構(XVI))之合成: Example 3 describes poly(2,2'-disulfo-4,4'-benzidine 1,4,5,8-naphthalenetetramethyldiimide) triethylammonium salt (ie, the above structure (XVI) )) Synthesis:

將4.023g(0.015摩爾)1,4,5,8-萘四甲酸二酐、5.165g(0.015摩爾)2,2'-雙磺酸聯苯胺和0.6g苯甲酸(催化劑)放入裝備有攪拌器和用於氬氣沖洗之毛細管的三頸燒瓶。隨著氬氣流啟動,向燒瓶中加入40毫升熔融苯酚。然後,將燒瓶放入80℃水浴中,並且攪拌上述成分直至得到均勻之混合物。將4.6毫升三乙胺加入到上述混合物中,持續攪拌1小時而獲得溶液。然後將溫度相繼升至100℃、120℃和150℃。在100℃和120℃,在每個溫度下持續攪拌1小時。在這一過程中,溶液持續變稠。150℃下之攪拌時間為4到6小時。 4.023 g (0.015 mol) of 1,4,5,8-naphthalenetetracarboxylic dianhydride, 5.165 g (0.015 mol) of 2,2'-disulfonic acid benzidine and 0.6 g of benzoic acid (catalyst) were placed in a stirred state. And a three-necked flask for the capillary for argon flushing. As the argon stream was started, 40 ml of molten phenol was added to the flask. Then, the flask was placed in a water bath of 80 ° C, and the above ingredients were stirred until a homogeneous mixture was obtained. 4.6 ml of triethylamine was added to the above mixture, and stirring was continued for 1 hour to obtain a solution. The temperature was then successively raised to 100 ° C, 120 ° C and 150 ° C. Stirring was continued for 1 hour at each temperature at 100 ° C and 120 ° C. During this process, the solution continues to thicken. The stirring time at 150 ° C is 4 to 6 hours.

將上述稠化溶液用液態苯酚(水/苯酚(體積比)=1/10之混合物)稀釋至在100℃得到目標稠度,將所得混合物用丙酮驟冷。通過GPC測定聚合物樣品之重均分子量。通過惠普1050 HPLC系統和二極體陣列檢測器(λ=380nm)對聚合物樣品進行GPC分析。使用來自Shodex之OHpak SB-804 HQ柱進行色譜分離。二甲基亞碸(DMSO)和二甲基甲醯胺(DMF)之份額分別為75:25的混合物以及0.05M氯化鋰(LiCl)被用作流動相。使用ChemStation B10.03(Agilent Technologies)和GPC軟體Cirrus 3.2(Varian)收集並處理色譜數據。聚(苯乙烯磺酸)鈉鹽被用作GPC標準品。在GPC分析前,將所有待分析聚合物樣品和標準品以大約1mg/mL之濃度溶於 DMSO。 The above thickening solution was diluted with liquid phenol (water/phenol (volume ratio) = 1/10 mixture) to obtain a target consistency at 100 ° C, and the resulting mixture was quenched with acetone. The weight average molecular weight of the polymer sample was determined by GPC. GPC analysis of the polymer samples was performed by a HP 1050 HPLC system and a diode array detector (λ = 380 nm). Chromatographic separation was performed using an OHpak SB-804 HQ column from Shodex. A mixture of dimethylammonium (DMSO) and dimethylformamide (DMF) having a fraction of 75:25 and 0.05 M lithium chloride (LiCl) were used as the mobile phase. Chromatographic data was collected and processed using ChemStation B10.03 (Agilent Technologies) and GPC software Cirrus 3.2 (Varian). Poly(styrenesulfonate) sodium salt was used as a GPC standard. Dissolve all polymer samples and standards to be analyzed at a concentration of approximately 1 mg/mL prior to GPC analysis DMSO.

實施例4 Example 4

實施例4描述聚(2,2'-二磺基-4,4'-聯苯胺1,3-二氧代異吲哚啉-5-甲醯胺)銫鹽(亦即上述結構(XIII))之合成。 Example 4 describes poly(2,2'-disulfo-4,4'-benzidine 1,3-dioxoisoindoline-5-carboxamide) sulfonium salt (ie, the above structure (XIII) The synthesis of).

詳言之,將2,5-二氨基苯-1,4-二磺酸(0.688g,2.0毫摩爾)、無水N-甲基吡咯烷酮(10毫升)、三乙基胺(0.86毫升)和偏苯三酸酐醯氯(0.421g,2毫摩爾)先後加入配備有磁力攪拌器、溫度計和帶氬氣入口之空氣冷凝器的雙頸燒瓶中。然後,將反應混合物加熱到大約130-140℃並攪拌24小時。然後,將反應混合物冷卻至室溫,在磁力攪拌器攪拌下,將上述混合物慢慢地滴加進異丙醇中,使產物凝結。通過真空過濾收集沉澱,然後混懸到甲醇(50毫升)中並過濾。將褐色固體風乾數小時,然後在P2O5下於大約60℃真空乾燥2小時至恒重0.16g。 In particular, 2,5-diaminobenzene-1,4-disulfonic acid (0.688 g, 2.0 mmol), anhydrous N-methylpyrrolidone (10 ml), triethylamine (0.86 ml) and trimellitic anhydride Neodymium chloride (0.421 g, 2 mmol) was added to a two-necked flask equipped with a magnetic stirrer, a thermometer and an air condenser with an argon inlet. The reaction mixture was then heated to about 130-140 ° C and stirred for 24 hours. Then, the reaction mixture was cooled to room temperature, and the mixture was slowly added dropwise to isopropanol under stirring with a magnetic stirrer to coagulate the product. The precipitate was collected by vacuum filtration then suspended in methanol (50 mL) and filtered. The brown solid was air dried for several hours and then dried under vacuum at about 60 ° C for 2 hours under P 2 O 5 to a constant weight of 0.16 g.

通過GPC測定聚合物樣品之重均分子量。通過惠普1050 HPLC系統和二極體陣列檢測器(λ=230nm)對聚合物樣品進行GPC分析。使用TSKgel lyotropic G5000PWXL柱(TOSOH Bioscience)進行色譜分離。磷酸鹽緩衝液0.1M(pH=6.9-7.0)和乙腈之混合物被用作流動相。使用ChemStation B10.03(Agilent Technologies)和GPC軟體Cirrus 3.2(Varian)收集並處理色譜數據。聚(苯乙烯磺酸)鈉鹽被用作GPC標準品。 The weight average molecular weight of the polymer sample was determined by GPC. GPC analysis of the polymer samples was performed by a HP 1050 HPLC system and a diode array detector (λ = 230 nm). Chromatography was performed using a TSKgel lyotropic G5000PWXL column (TOSOH Bioscience). A mixture of 0.1 M phosphate buffer (pH = 6.9-7.0) and acetonitrile was used as the mobile phase. Chromatographic data was collected and processed using ChemStation B10.03 (Agilent Technologies) and GPC software Cirrus 3.2 (Varian). Poly(styrenesulfonate) sodium salt was used as a GPC standard.

實施例5 Example 5

本實施例描述結構通式(XVII)(R1係為CH3,M係為Cs,k等於n)之剛性棒狀大分子的合成。 This example describes the synthesis of rigid rod-shaped macromolecules of the general formula (XVII) (R 1 is CH 3 , M is Cs, k is equal to n).

詳言之,將30g 4,4'-二氨基聯苯-2,2'-二磺酸與300毫升吡啶混合。在攪拌下將60毫升乙醯氯加入到混合物中,將所得反應物於35-45℃攪拌2小時。再將其過濾,將濾餅用50毫升吡啶沖洗,然後用1200毫升乙醇清洗。將所得醇濕固體在60℃乾燥。4,4'-雙(乙醯基氨基)聯苯-2,2'-二磺酸吡啶鹽之收率係為95%。 In detail, 30 g of 4,4'-diaminobiphenyl-2,2'-disulfonic acid was mixed with 300 ml of pyridine. 60 ml of acetamidine chloride was added to the mixture with stirring, and the resulting reaction was stirred at 35-45 ° C for 2 hours. It was filtered again, and the filter cake was washed with 50 ml of pyridine and then with 1200 ml of ethanol. The resulting alcohol wet solid was dried at 60 °C. The yield of 4,4'-bis(ethylideneamino)biphenyl-2,2'-disulfonic acid pyridinium salt was 95%.

將12.6g 4,4'-雙(乙醯基氨基)聯苯-2,2'-二磺酸吡啶鹽與200毫升DMF混合。加入3.4g氫化鈉(油中60%分散液)。將反應物於室溫攪拌16小時。加入7.6毫升碘甲烷,將反應物於室溫攪拌16小時。然後,蒸餾出反應混合物中的揮發性成分,將殘渣用800毫升丙酮清洗並乾燥。將所得4,4'-雙[乙醯基(甲基)氨基]聯苯-2,2'-二磺酸溶於36毫升4M氫氧化鈉。將2g活性炭加入到上述溶液中,於80℃攪拌2小時。該當液體通過過濾而澄清,用35%HCl中和成pH-1,並通過蒸發使體積減少至30%。然後冷藏(5℃)一夜,將沉澱材料分離並乾燥。4,4'-雙[甲基氨基]聯苯-2,2'-二磺酸之收率係為80%。 12.6 g of 4,4'-bis(ethylideneamino)biphenyl-2,2'-disulfonic acid pyridinium salt was mixed with 200 ml of DMF. 3.4 g of sodium hydride (60% dispersion in oil) was added. The reaction was stirred at room temperature for 16 hours. 7.6 ml of methyl iodide was added and the reaction was stirred at room temperature for 16 h. Then, the volatile components in the reaction mixture were distilled off, and the residue was washed with 800 ml of acetone and dried. The obtained 4,4'-bis[ethylmercapto(methyl)amino]biphenyl-2,2'-disulfonic acid was dissolved in 36 ml of 4 M sodium hydroxide. 2 g of activated carbon was added to the above solution, and stirred at 80 ° C for 2 hours. The liquid was clarified by filtration, neutralized to pH-1 with 35% HCl, and reduced to 30% by evaporation. Then, the precipitated material was separated and dried by refrigerating (5 ° C) overnight. The yield of 4,4'-bis[methylamino]biphenyl-2,2'-disulfonic acid was 80%.

將2.0g 4,4'-雙[甲基氨基]聯苯-2,2'-二磺酸和4.2g碳酸氫銫用6毫升水混合。將該當溶液用IKA UltraTurrax T25以5000rpm攪拌1分鐘。加 入2毫升三甘醇二甲醚,然後加入4.0毫升甲苯,以20000rpm攪拌1分鐘。然後,于20000rpm將1.2g對苯二甲醯氯在2.0毫升甲苯中所得溶液加入到混合物中。將聚合物之乳液攪拌60分鐘,然後以20000rpm倒入150毫升乙醇中。攪拌20分鐘後,將聚合物之混懸液用帶纖維過濾器之布氏漏斗過濾,將所得聚合物溶于8毫升水,注入50毫升乙醇中使之沉澱,於70℃乾燥12小時。收率係為2.3g。 2.0 g of 4,4'-bis[methylamino]biphenyl-2,2'-disulfonic acid and 4.2 g of cesium hydrogencarbonate were mixed with 6 ml of water. The solution was stirred with IKA UltraTurrax T25 at 5000 rpm for 1 minute. plus 2 ml of triethylene glycol dimethyl ether was added, then 4.0 ml of toluene was added, and the mixture was stirred at 20000 rpm for 1 minute. Then, a solution of 1.2 g of p-xylylene chloride in 2.0 ml of toluene was added to the mixture at 20,000 rpm. The polymer emulsion was stirred for 60 minutes and then poured into 150 ml of ethanol at 20000 rpm. After stirring for 20 minutes, the suspension of the polymer was filtered through a Buchner funnel with a fiber filter, and the obtained polymer was dissolved in 8 ml of water, poured into 50 ml of ethanol to precipitate, and dried at 70 ° C for 12 hours. The yield was 2.3 g.

實施例6 Example 6

實施例6描述UV-固化2,2'-二磺基-4,4'-聯苯胺反丁烯二醯胺-間苯二甲醯胺共聚物鈉鹽之合成. Example 6 describes the synthesis of UV-cured 2,2'-disulfo-4,4'-benzidine anti-butenediamine-m-xylylenediamine copolymer sodium salt.

詳言之,用2L燒杯,將15.0g 2,5-二氨基苯-1,4-二磺酸與9.7g碳酸鈉在150毫升水中混合,攪拌至固體完全溶解。進一步加入350毫升甲苯。邊以7000rpm攪拌所得溶液,邊加入3.7g反丁烯二醯氯和4.9g間苯二甲醯氯之甲苯(350毫升)溶液。將所得混合物攪拌3小時。停止攪拌器,加入600毫升丙酮,用攪拌器將稠化混合物粉碎而形成適合過濾之漿液。將聚合物過濾,用350毫升份額之丙酮清洗兩次。所得聚合物於75℃乾燥。如實施例1所述地進行樣品之GPC分子量分析。 Specifically, 15.0 g of 2,5-diaminobenzene-1,4-disulfonic acid and 9.7 g of sodium carbonate were mixed in 150 ml of water in a 2 L beaker, and stirred until the solid was completely dissolved. Further 350 ml of toluene was added. While stirring the resulting solution at 7000 rpm, a solution of 3.7 g of fumartal chloride and 4.9 g of m-xylylene chloride in toluene (350 ml) was added. The resulting mixture was stirred for 3 hours. The stirrer was stopped, 600 ml of acetone was added, and the thickened mixture was pulverized with a stirrer to form a slurry suitable for filtration. The polymer was filtered and washed twice with 350 ml portions of acetone. The obtained polymer was dried at 75 °C. GPC molecular weight analysis of the samples was performed as described in Example 1.

光學膜例 Optical film

以上所列聚合物能夠被用於形成光學元件,例如光學相位差 板、光准直器、光擴散器、光波導、光纖、透鏡、LCD元件、光學安全膜和各種其他光學膜或光學元件用組件或光學器件用組件。光學特性、例如在每個方向之折射率取決於聚合物類型(例如它們的長度和剛性)、聚合物取向和其他因素。尤其是光學特性可以通過選擇有機成分(Core)、側基(S)和亞單元數(亦即n值)來控制。如上所述,通過選擇這些成分和參數,可以製造正A-板、負C-板和Ac-板。在某些實施方式中,沉積膜之雙反射至少約為0.05,更詳言之在大約0.05到0.20之間。 The polymers listed above can be used to form optical components, such as optical phase differences Plates, light collimators, light diffusers, optical waveguides, optical fibers, lenses, LCD elements, optical security films, and various other components for optical films or optical components or components for optical devices. Optical properties, such as refractive index in each direction, depend on the type of polymer (eg, their length and stiffness), polymer orientation, and other factors. In particular, the optical properties can be controlled by selecting the organic component (Core), the pendant group (S) and the number of subunits (i.e., the value of n). As described above, by selecting these components and parameters, a positive A-plate, a negative C-plate, and an Ac-plate can be produced. In certain embodiments, the double reflection of the deposited film is at least about 0.05, more specifically between about 0.05 and 0.20.

在一個實施例中,聚合物能夠形成于在X方向和Y方向形成平面的層上。X方向可以係為塗布方向。該當層可以在Z方向具有厚度。在某些實施方式中,X方向(亦即nx)之折射率可以大於Y方向和Z方向(亦即ny和nz)之折射率。Y方向和Z方向(亦即ny和nz)之折射率可以相同。這種類型之膜可以被稱為正A-板。X方向(亦即nx)之折射率至少約為1.6,至少約為1.7,甚至至少約為1.8。極少數現有聚合物具有如此高之折射率。Y方向和Z方向(亦即ny和nz)之折射率至少約為1.4,更詳言之至少約為1.5。例如,正A-板用聚合物之X方向(亦即nx)折射率為1.85,Y方向和Z方向(亦即ny和nz)之折射率為1.57。 In one embodiment, the polymer can be formed on a layer that forms a plane in the X and Y directions. The X direction can be the coating direction. The layer can have a thickness in the Z direction. In some embodiments, the refractive index in the X direction (ie, n x ) can be greater than the refractive indices in the Y and Z directions (ie, n y and n z ). The refractive indices of the Y direction and the Z direction (i.e., n y and n z ) may be the same. This type of membrane can be referred to as a positive A-plate. The X direction (i.e., n x ) has a refractive index of at least about 1.6, at least about 1.7, and even at least about 1.8. Very few existing polymers have such high refractive indices. The refractive indices in the Y and Z directions (i.e., n y and n z ) are at least about 1.4, and more specifically at least about 1.5. For example, the positive A-plate polymer has a refractive index of 1.85 in the X direction (i.e., n x ), and a refractive index of 1.57 in the Y direction and the Z direction (i.e., n y and n z ).

在某些實施方式中,X方向(亦即nx)之折射率與Y方向(亦即ny)之折射率實質上相同並且大於Z方向(亦即nz)之折射率。這種類型之膜可被稱為負C-板。X方向和Y方向(亦即nx和ny)之折射率至少約為1.5,至少約為1.6,甚至至少約為1.7,而Z方向(亦即nz)之折射率至少約為1.5,更詳言之至少約為1.55。例如,負C-板用聚合物之X方向和Y方向(亦即nx和ny)之折射率為1.72、Z方向(亦即nz)之折射率為1.59。 In some embodiments, the refractive index of the X direction (ie, n x ) is substantially the same as the refractive index of the Y direction (ie, n y ) and greater than the refractive index of the Z direction (ie, n z ). This type of membrane can be referred to as a negative C-plate. The X and Y directions (i.e., n x and n y ) have a refractive index of at least about 1.5, at least about 1.6, or even at least about 1.7, and the Z direction (i.e., n z ) has a refractive index of at least about 1.5. More specifically, it is at least about 1.55. For example, the refractive index of the negative C-plate polymer in the X direction and the Y direction (i.e., n x and n y ) is 1.72, and the refractive index in the Z direction (i.e., n z ) is 1.59.

在某些實施方式中,X方向(亦即nx)之折射率小於Y方向和Z方向(亦即ny和nz)之折射率。Y方向和Z方向(亦即ny和nz)之折射率亦可不同,例如,Y方向(亦即ny)之折射率大於Z方向(亦即nz)之折射率。這種類型之膜可稱為雙軸膜。X方向(亦即nx)之折射率至少約為1.5,更詳言之至少約為1.55。 In some embodiments, the refractive index in the X direction (ie, n x ) is less than the refractive indices in the Y and Z directions (ie, n y and n z ). The refractive indices of the Y direction and the Z direction (i.e., n y and n z ) may also be different. For example, the refractive index of the Y direction (i.e., n y ) is greater than the refractive index of the Z direction (i.e., n z ). A membrane of this type can be referred to as a biaxial membrane. The refractive index in the X direction (i.e., n x ) is at least about 1.5, and more specifically at least about 1.55.

總而言之,一些聚合物可形成為nz<nx=ny之單軸相位差層。其他聚合物可形成為nz<ny<nx之雙軸相位差層。 In summary, some polymers can be formed into a uniaxial retardation layer of nz < nx = ny. Other polymers may be formed as a biaxial retardation layer of n z <n y <n x .

沉積方法 Deposition method

第2圖係為示出一個表面被聚合物膜204覆蓋之基底202的高階圖。對熟習此技藝者來說,聚合物膜204可被沉積到基底202兩側。基底202可以包括例如聚合物基底、玻璃基底、TAC基底、聚丙烯基底、聚碳酸酯基底、丙烯酸基底、PMMA基底等等。基底202可具有任何合適之形式和形狀,例如平板或拱形板,或其他多少繁複之形式。 2 is a high level diagram showing a substrate 202 having a surface covered by a polymer film 204. Polymer film 204 can be deposited on both sides of substrate 202 for those skilled in the art. Substrate 202 can include, for example, a polymeric substrate, a glass substrate, a TAC substrate, a polypropylene substrate, a polycarbonate substrate, an acrylic substrate, a PMMA substrate, and the like. Substrate 202 can have any suitable form and shape, such as a flat or arched panel, or other intricate form.

第3圖示出根據本發明之各種實施方式用於將聚合物溶液沉積到基底202上之方法300的示意圖。方法300開始於提供聚合物溶液的工序302。以上描述了各種聚合物例,一般而言,可以包括水溶性聚合物,然而亦可以利用水不溶性聚合物。此處所述可溶聚合物可溶于水或其他溶劑。在各種實施方式中,溶劑可以包括水、酮、二元酮/醇混合物、羥基酮、四氫呋喃(THF)、乙酸甲酯(MA)、MIBK。在各種實施方式中,聚合物溶液可包括一種或多種添加劑、例如壬基苯氧基縮水甘油醚、醇、酸、增塑劑、穩定劑、抗氧化劑和受阻酚。添加劑之選擇取決於所用特定聚合物、基底類型和特定目的。 FIG. 3 shows a schematic diagram of a method 300 for depositing a polymer solution onto a substrate 202 in accordance with various embodiments of the present invention. The method 300 begins with a process 302 of providing a polymer solution. Various polymer examples are described above, and in general, water-soluble polymers may be included, although water-insoluble polymers may also be utilized. The soluble polymer described herein is soluble in water or other solvents. In various embodiments, the solvent may include water, a ketone, a diketone/alcohol mixture, a hydroxyketone, tetrahydrofuran (THF), methyl acetate (MA), MIBK. In various embodiments, the polymer solution can include one or more additives such as nonylphenoxy glycidyl ether, alcohols, acids, plasticizers, stabilizers, antioxidants, and hindered phenols. The choice of additives will depend on the particular polymer used, the type of substrate, and the particular purpose.

聚合物溶液可用以聚合物和其他非溶劑成分(如果存在)相對於溶液總重量之重量比例限定的固體成分表征。可以改變固體成分以獲得必須粘度以及濕塗層和乾塗層間的收縮率。為了本發明之目的,上述收縮率用兩個厚度、例如在實施任何乾燥前最初塗布之聚合物溶液的厚度和充分乾燥聚合物結構、亦即固體成分為100%之結構的厚度比限定。在某些實施方式中,可使用某些中間狀態之收縮率,例如部分乾燥狀態和充分乾燥狀態之間的收縮率。上述溶液亦可用聚合物類型、聚合物分子量、溫度和其他特性表征。這些特性之中的一部分係為特定沉積技術所獨有。 The polymer solution can be characterized by a solids content defined by the weight ratio of polymer and other non-solvent components, if any, to the total weight of the solution. The solid component can be varied to obtain the necessary viscosity and shrinkage between the wet coating and the dry coating. For the purposes of the present invention, the above shrinkage is defined by the thickness ratio of the two thicknesses, for example, the thickness of the polymer solution initially applied before any drying and the structure of the sufficiently dried polymer structure, that is, the structure having a solid content of 100%. In certain embodiments, shrinkage rates in certain intermediate states, such as shrinkage between a partially dry state and a sufficiently dry state, may be used. The above solutions can also be characterized by polymer type, polymer molecular weight, temperature, and other characteristics. Some of these characteristics are unique to a particular deposition technique.

在某些實施方式中,基底202可在可選工序304中預處理以提高聚合物對基底202之粘附性,引入交聯劑及其他目的。預處理技術的一些例子可包括清洗基底202、皂化、洗脫、氧化或修飾表面凹凸(例如,通過實施電暈放電)。預處理工序之各種例子示於后述實施例中。 In certain embodiments, substrate 202 can be pretreated in optional process 304 to increase the adhesion of the polymer to substrate 202, introduce crosslinkers, and other purposes. Some examples of pretreatment techniques may include cleaning the substrate 202, saponifying, eluting, oxidizing, or modifying surface relief (eg, by performing a corona discharge). Various examples of the pretreatment step are shown in the examples to be described later.

在工序306中,將聚合物溶液沉積到基底202之一面或多面以形成聚合物溶液層。該層之濕厚度可至少部分基於所希望之聚合物乾燥厚度來選擇。例如,濕厚度相對於所希望之聚合物膜乾燥厚度的比例可以在大約5%到20%之間。應予說明,上述聚合物溶液在沉積前係為各相同性。 In process 306, a polymer solution is deposited onto one or more sides of substrate 202 to form a polymer solution layer. The wet thickness of the layer can be selected based at least in part on the desired dry thickness of the polymer. For example, the ratio of wet thickness to desired dry thickness of the polymeric film can be between about 5% and 20%. It should be noted that the above polymer solutions are identical before deposition.

通常,聚合物溶液可使用下述技術之中的一種或多種來沉積:狹縫模技術、噴霧技術、成型技術、輥對輥塗布技術、邁耶棒式塗布技術、輥塗技術、凹版塗布技術、微凹版塗布技術、逗點式塗布技術、刮刀塗布技術、擠出技術、印刷技術、浸漬塗布技術等等。這些技術隨後將更詳細地描述。 In general, the polymer solution can be deposited using one or more of the following techniques: slot die technology, spray technique, molding technique, roll-to-roll coating technique, Meyer bar coating technique, roll coating technique, gravure coating technique , micro gravure coating technology, comma coating technology, blade coating technology, extrusion technology, printing technology, dip coating technology and so on. These techniques will be described in more detail later.

在工序308中,從沉積到基底202上的聚合物溶液中除去溶 劑。溶劑可以使用一種或多種技術除去,例如加熱、乾燥或實施UV或IR光照射。這些技術之中的一些例子隨後將進一步描述。 In process 308, the dissolution is removed from the polymer solution deposited onto the substrate 202. Agent. The solvent can be removed using one or more techniques, such as heating, drying, or performing UV or IR light illumination. Some examples of these techniques are described further below.

在可選工序310中,可以採用一種或多種後沉積處理技術。後沉積處理技術可以包括交聯有機單元或成型沉積聚合物膜。應當理解工序308和工序310之順序係為任意。在某個實施方式中,如第3圖所示,第一溶劑應當被除去,然後進行特定後沉積工序。在某個其他實施方式中,先進行一些後沉積加工,然後除去溶劑。在另外的其他實施方式中,工序308和工序310同時進行。進而,在另外的其他實施方式中,可以有多個在工序308之前進行和正好在工序308之後進行的後沉積操作310。熟習此技藝者能夠理解其他實施方式亦同樣可行。 In optional process 310, one or more post deposition processing techniques may be employed. Post deposition processing techniques can include cross-linking organic units or shaped deposition polymer films. It should be understood that the order of process 308 and process 310 is arbitrary. In one embodiment, as shown in Figure 3, the first solvent should be removed and then subjected to a specific post deposition process. In some other embodiments, some post deposition processing is performed followed by solvent removal. In still other embodiments, process 308 and process 310 are performed simultaneously. Further, in still other embodiments, there may be a plurality of post deposition operations 310 performed prior to process 308 and just after process 308. Those skilled in the art will appreciate that other embodiments are equally feasible.

以下示出與工序304、306、308和310相關之示例。 Examples related to the processes 304, 306, 308, and 310 are shown below.

預沉積基底處理技術例 Pre-deposited substrate processing technology example

在本發明公開之各種實施方式中,可以對基底202實施預沉積處理以提高隨後沉積之聚合物膜的潤濕性和粘附性。 In various embodiments of the present disclosure, the substrate 202 can be subjected to a pre-deposition treatment to enhance the wettability and adhesion of the subsequently deposited polymer film.

在預沉積處理的一個示例中,可以首先用水沖洗基底、然後用氫氧化鈉水溶液浸漬或塗布基底、然後進行追加沖洗、最後乾燥而將TAC基底皂化。上述浸漬工序可以持續大約0.5分鐘到5分鐘之間,更詳言之大約1分鐘到3分鐘之間,例如大約2分鐘。上述水溶液可以包含大約為1wt%~20wt%、更詳言之大約為2wt%~10wt%、例如大約為6wt%之氫氧化鈉。上述溶液可以保持在大約20℃~90℃,更詳言之大約40℃~80℃,例如大約60℃。然而,應予說明,上述溫度在皂化加工中可以改變,並且由多項標準決定。 In one example of the pre-deposition treatment, the TAC substrate may be saponified by first rinsing the substrate with water, then impregnating or coating the substrate with an aqueous solution of sodium hydroxide, followed by additional rinsing, and finally drying. The above impregnation step can last between about 0.5 minutes and 5 minutes, more specifically between about 1 minute and 3 minutes, such as about 2 minutes. The aqueous solution may comprise from about 1% to about 20% by weight, more specifically from about 2% to about 10% by weight, for example about 6% by weight of sodium hydroxide. The above solution may be maintained at about 20 ° C to 90 ° C, more specifically about 40 ° C to 80 ° C, for example about 60 ° C. However, it should be noted that the above temperature may vary in the saponification process and is determined by a number of criteria.

在預沉積處理之另一示例中,玻璃基底202可使用中度鹼性水溶液實施超聲波清洗。例如,為此可以使用約為0.1wt%~10wt%(例如約為1wt%)之DECONEX® 12-PA(可以從Borer Chemie AG,Zuchwil,Switzerland購得)。清洗溶液可以保持在大約20℃~40℃之溫度,例如大約為30℃。超聲波清洗階段之持續時間可以大約為0.5小時~24小時,更詳言之為1小時~5小時,例如約為2小時。然後,上述玻璃基底可以在實施洗脫和在包含大約1wt%~20wt%、更詳言之大約2wt%~15wt%、例如大約為15wt%氫氧化鈉之水性溶液中氧化前用水浸泡和清洗。洗脫和氧化可以在超聲波浴中實施大約5分鐘~120分鐘,更詳言之大約10分鐘~60分鐘,例如大約30分鐘。玻璃基底可隨後沖洗並乾燥。 In another example of the pre-deposition process, the glass substrate 202 can be ultrasonically cleaned using a moderately alkaline aqueous solution. For example, about 0.1 wt% to 10 wt% (e.g., about 1 wt%) of DECOX® 12-PA (available from Borer Chemie AG, Zuchwil, Switzerland) can be used for this purpose. The cleaning solution can be maintained at a temperature of from about 20 ° C to 40 ° C, for example, about 30 ° C. The duration of the ultrasonic cleaning stage can be from about 0.5 hours to about 24 hours, more specifically from 1 hour to 5 hours, for example about 2 hours. The glass substrate can then be soaked and rinsed with water prior to oxidation in an aqueous solution comprising about 1 wt% to 20 wt%, more specifically about 2 wt% to 15 wt%, for example about 15 wt% sodium hydroxide. The elution and oxidation can be carried out in an ultrasonic bath for about 5 minutes to 120 minutes, more specifically about 10 minutes to 60 minutes, for example about 30 minutes. The glass substrate can then be rinsed and dried.

在另一預沉積處理之示例中,可在聚合物溶液層沉積前,將底漆薄層沉積到基底202上。底漆之乾燥厚度可大約為10nm~200nm,更詳言之大約為20nm~100nm,例如大約為50nm。例如,矽烷或聚乙烯亞胺可用作底漆。為此可使用含有小於10wt%、更詳言之小於2%、例如大約為0.5%底漆之水性聚合物溶液。 In another example of a pre-deposition process, a thin layer of primer can be deposited onto the substrate 202 prior to deposition of the polymer solution layer. The dry thickness of the primer can be from about 10 nm to about 200 nm, more specifically from about 20 nm to about 100 nm, for example, about 50 nm. For example, decane or polyethyleneimine can be used as a primer. Aqueous polymer solutions containing less than 10% by weight, more specifically less than 2%, for example about 0.5% primer can be used for this purpose.

其他預沉積基底處理技術可包括對基底表面實施電暈放電,塗布表面活性劑溶液薄層,塗布醇薄層,施加電子束,施加離子束,施加等離子體放電等等。不管怎樣,預沉積基底處理技術都將提高基底之粘附性和潤濕性特性。 Other pre-deposited substrate processing techniques may include subjecting the surface of the substrate to corona discharge, coating a thin layer of surfactant solution, coating a thin layer of alcohol, applying an electron beam, applying an ion beam, applying a plasma discharge, and the like. In any event, pre-deposited substrate processing techniques will increase the adhesion and wettability characteristics of the substrate.

沉積技術例 Deposition technique

以下示出幾個用於在基底202上施加聚合物溶液層之沉積技術示例。熟習此技藝者能夠理解這些特性亦同樣適用於其他沉積技術。 Several examples of deposition techniques for applying a layer of polymer solution on substrate 202 are shown below. Those skilled in the art will appreciate that these characteristics are equally applicable to other deposition techniques.

狹縫模擠出例 Slot die extrusion

狹縫模技術通常適於使用粘度為1cP~100,000cP並且在高達250℃之溫度下保持的溶液(或漿液),使用每分鐘高達500米之線性速度,沉積厚度約為1微米~2000微米(濕式)之均勻層。所塗布聚合物之粘度可以通過分子量、固體成分、添加劑和溫度來控制。粘度會影響聚合物溶液之流動特性、施加于形成膜之剪切應力和所得聚合物分子在沉積層之中的取向以及所得層之光學特性。聚合物溶液溫度、亦稱為進料溫度大約為10℃~80℃。低於10℃時,水接近於其凝固點,而溫度超過80℃,將導致快速蒸發和水分損失,結果使得體系變得難以控制。在沉積前,應當確保聚合物溶液均勻,可通過加溫及/或攪拌來實現。在此步驟,可以根據應用或某種目的而在聚合物溶液中添加一種或多種添加劑。 Slot die technology is generally suitable for solutions (or slurries) with a viscosity of 1 cP to 100,000 cP and maintained at temperatures up to 250 ° C, using a linear velocity of up to 500 m per minute, with a deposition thickness of approximately 1 μm to 2000 μm ( Uniform layer of wet). The viscosity of the coated polymer can be controlled by molecular weight, solid content, additives, and temperature. The viscosity affects the flow characteristics of the polymer solution, the shear stress applied to form the film, and the orientation of the resulting polymer molecules in the deposited layer and the optical properties of the resulting layer. The polymer solution temperature, also known as the feed temperature, is between about 10 ° C and 80 ° C. Below 10 ° C, water is close to its freezing point, and temperatures above 80 ° C will result in rapid evaporation and moisture loss, with the result that the system becomes difficult to control. Prior to deposition, it should be ensured that the polymer solution is homogeneous and can be achieved by warming and/or agitation. In this step, one or more additives may be added to the polymer solution depending on the application or a purpose.

然後將所得溶液沉積于基底形成薄層。如上所述,根據一種或多種上述實施方式,聚合物溶液可沉積到基底上或形成為無支撐結構。沉積層之厚度取決於下述之中的一個或多個:基底進料速度、基底寬度、聚合物溶液進料量和固體成分。基底進料速度可以為0.5米/分鐘~500米/分鐘,更詳言之為2米/分鐘~20米/分鐘。從加工能力考慮更快之速度係為有利,可以控制進料速度來獲得用於使聚合物分子在沉積層內再分配和排列之特定剪切力。聚合物溶液之進料量可以為1g/分鐘~2500g/分鐘。在某些實施方式中,沉積膜厚度可以為10微米~2000微米,更詳言之為25微米~250微米。該當厚度係為濕塗層厚度,在乾燥時將大幅變化。如上所述,變化幅度、亦即收縮比例取決於固體成分和其他因素。 The resulting solution is then deposited on a substrate to form a thin layer. As described above, according to one or more of the above embodiments, the polymer solution may be deposited onto the substrate or formed into an unsupported structure. The thickness of the deposited layer depends on one or more of the following: substrate feed rate, substrate width, polymer solution feed amount, and solid content. The substrate feed rate can range from 0.5 m/min to 500 m/min, more specifically from 2 m/min to 20 m/min. It is advantageous to consider faster speeds from processing capabilities, and the feed rate can be controlled to obtain specific shear forces for redistributing and aligning polymer molecules within the deposited layer. The polymer solution may be fed in an amount of from 1 g/min to 2500 g/min. In some embodiments, the deposited film thickness can range from 10 microns to 2000 microns, more specifically from 25 microns to 250 microns. The thickness is the wet coating thickness and will vary greatly upon drying. As mentioned above, the magnitude of the change, ie the shrinkage ratio, depends on the solid content and other factors.

在採用狹縫模技術時,狹縫模唇可以分開10微米~1000微 米、更詳言之為25微米~250微米的距離。唇間距決定模中壓力,從而使膜厚均一。另外,狹縫模與基底分隔開,允許聚合物溶液流到基底上,並沉積成均一層。在某些實施方式中,狹縫模和基底間之間隙為10微米~1000微米,更詳言之為25微米~250微米,可以改變該間隙以控制塗布品質。 When using slot die technology, the slit lip can be separated from 10 microns to 1000 microns. Meters, more specifically, distances from 25 microns to 250 microns. The lip spacing determines the pressure in the mold so that the film thickness is uniform. Additionally, the slot die is spaced apart from the substrate, allowing the polymer solution to flow onto the substrate and deposit into a uniform layer. In some embodiments, the gap between the slot die and the substrate is from 10 microns to 1000 microns, more specifically from 25 microns to 250 microns, which can be varied to control coating quality.

為了更好地理解基於參數、例如間隔厚度、基底進料速度和溶液進料量之一些設備,關於狹縫模塗布系統之詳細說明可能會有幫助。狹縫模塗布系統可包括五個主要部分:模,模定位器,輥,液體輸送系統和基底。模決定聚合物溶液分配到基底上的量。液體流變學(亦即粘度、表面張力)與模之設計和位置同為要因。一些以聚合物為基礎之溶液具有模之特定設計所要求的特定流變學特性,亦即內部流動形狀。模歧管之輪廓係為機器加工到模主體上之流動形狀。模之功能係為將溶液保持在應用所需之適當溫度,將其均勻地分配成所希望之塗布寬度,並供給到基底。歧管分配進入模之塗布液至達到足夠目標寬度並設計成產生均勻的材料層流,通過模之出口狹縫。模定位器係為可調滑架,所述滑架以最佳角度精確地放置狹縫模,挨近輥並使模免于影響塗布應用之振動。模定位器穩定模和移動基底間之相互作用,設置模和基底間之分配的角度,並且設置模和基底間之距離。輥提供相對於模位置精確定位之表面,並且用於支撐基底。液體輸送系統用於將聚合物溶液定量供給到模中。輸送系統能夠決定沉積層之塗布重量和厚度。 For a better understanding of some of the equipment based on parameters such as spacing thickness, substrate feed rate and solution feed rate, a detailed description of the slot die coating system may be helpful. The slot die coating system can include five main sections: a die, a die positioner, a roller, a liquid delivery system, and a substrate. The mold determines the amount of polymer solution dispensed onto the substrate. Liquid rheology (ie viscosity, surface tension) is the same factor as the design and location of the mold. Some polymer-based solutions have the specific rheological properties required for the particular design of the mold, ie the internal flow shape. The profile of the mold manifold is the flow shape machined onto the mold body. The function of the mold is to maintain the solution at the appropriate temperature required for the application, distribute it evenly to the desired coating width, and supply it to the substrate. The manifold distributes the coating liquid into the mold to a sufficient target width and is designed to produce a uniform laminar flow of material through the exit slit of the die. The mold positioner is an adjustable carriage that accurately positions the slot die at an optimum angle, snagging the roller and protecting the mold from vibrations that affect the coating application. The mold positioner stabilizes the interaction between the mold and the moving substrate, sets the angle of distribution between the mold and the substrate, and sets the distance between the mold and the substrate. The roller provides a surface that is accurately positioned relative to the mold position and is used to support the substrate. A liquid delivery system is used to meter the polymer solution into the mold. The delivery system is capable of determining the coating weight and thickness of the deposited layer.

輥對輥沉積例 Roll-to-roller deposition example

在使用輥對輥技術(亦已知為捲筒操作或卷對卷操作)時, 聚合物溶液可沉積到以膜形式呈現之基底上。沉積可使用任何合適之技術。在一個示例中,沉積可包括使用能夠通過剪切力(刮刀)在移動基底上調節之敷料器。可以實施沉積以便應用進一步乾燥技術,或如下所述地利用UV交聯技術。一旦塗布了上述基底膜,就將其捲繞到另一輥上,可以用縱切機切出所希望尺寸或進一步實施下文詳述之擠出、壓制、施加高溫或浸漬到氯化鋇溶液之中的加工(單獨或組合)。另外,應予說明,可以將基底膜固定在輥上,並以預定之速率放出,從而上述聚合物溶液能夠被以所希望之厚度輸送到基底膜上。 When using roll-to-roll technology (also known as roll operation or roll-to-roll operation), The polymer solution can be deposited onto a substrate that is presented in the form of a film. Any suitable technique can be used for the deposition. In one example, depositing can include using an applicator that can be adjusted on a moving substrate by a shear force (scraper). Deposition may be performed to apply further drying techniques, or to utilize UV crosslinking techniques as described below. Once the base film is coated, it is wound onto another roll, which can be cut to the desired size by a slitter or further extruded, pressed, applied at elevated temperature or impregnated into a barium chloride solution as detailed below. Processing (alone or in combination). Further, it should be noted that the base film can be fixed on the roll and discharged at a predetermined rate so that the above polymer solution can be delivered to the base film at a desired thickness.

如上所述,在沉積前,應當確保聚合物溶液之均勻性。捲筒速度及/或塗布溶液流速應當被設置成控制所希望之剪切應力和塗布厚度。亦應設置聚合物溶液之固體濃度和進料溫度。 As noted above, the uniformity of the polymer solution should be ensured prior to deposition. The web speed and/or coating solution flow rate should be set to control the desired shear stress and coating thickness. The solids concentration and feed temperature of the polymer solution should also be set.

在一個示例中,在基底上塗布聚合物溶液以顯示如下定義之平面外相位差數值(Rth)之負C-板舉動。 In one example, the polymer solution is coated on a substrate to exhibit a negative C-plate behavior of the out-of-plane phase difference value (Rth) as defined below.

Rth=厚度×(nz-0.5(nx-ny)) Rth=thickness × (nz-0.5(nx-ny))

Rth值可以通過乾燥塗層厚度加以控制。下表1示出在包含已知固體濃度(N)之2,2'-二磺基-4,4'-聯苯胺對苯二甲醯胺-間苯二甲醯胺(亦稱為“P17”)的聚合物且以25 ft/分通過11-英寸寬隔板之流量的沉積技術中所得各種濕厚度。 The Rth value can be controlled by drying the coating thickness. Table 1 below shows 2,2'-disulfo-4,4'-benzidine p-xylamine-m-xylamine (also known as "P17") containing a known solid concentration (N). The various wet thicknesses obtained in the deposition technique of the polymer and at a flow rate of 15 ft/min through a 11-inch wide separator.

沉積聚合物溶液之乾燥厚度測定在所設置之濕厚度下成線性(雖然不精確,但聚合物膜因乾燥而收縮4%)。可以預測Rth測定值與P17層厚度係為線性關係。因此,相位差可通過沉積條件和特性來控制。進一步示於第4A圖和第4B圖,圖中示出乾燥厚度與濕厚度之依存性(第4A圖)和相位差與乾燥厚度之依存性(第4B圖)。 The dry thickness of the deposited polymer solution was determined to be linear at the set wet thickness (although not precise, but the polymer film shrinks by 4% due to drying). It can be predicted that the Rth measurement value is linear with the thickness of the P17 layer. Therefore, the phase difference can be controlled by deposition conditions and characteristics. Further shown in Fig. 4A and Fig. 4B, the dependence of the dry thickness on the wet thickness (Fig. 4A) and the dependence of the phase difference on the dry thickness (Fig. 4B) are shown.

正如前面所述,塗布聚合物溶液之粘度可通過各種參數、例如分子量、固體成分濃度、溫度等等控制。粘度亦影響聚合物溶液之流動和特性、施加于形成聚合物溶液膜之剪切應力和所得聚合物分子在沉積層之中的取向和所得光學層之光學特性。第5圖示出對不同聚合物濃度(N)測得的作為剪切速率(s-1)之函數的粘度(cP)的依存性。 As described above, the viscosity of the coating polymer solution can be controlled by various parameters such as molecular weight, solid content concentration, temperature, and the like. Viscosity also affects the flow and characteristics of the polymer solution, the shear stress applied to the film forming the polymer solution, and the orientation of the resulting polymer molecules in the deposited layer and the optical properties of the resulting optical layer. Figure 5 shows the dependence of viscosity (cP) as a function of shear rate (s -1 ) measured for different polymer concentrations (N).

模塑沉積例 Molding deposit

在使用模塑技術時,可以將聚合物溶液輸送到具有一個或多個可透過空氣和水蒸氣但透不過聚合物分子(亦即因為它們之大尺寸)之表面的鑄模型腔。鑄模可被構成為製造具有特定物理光學特性、例如折射、像差、曲率等等之透鏡或其他光學元件之形狀。 When molding techniques are used, the polymer solution can be delivered to a cast mold cavity having one or more surfaces that are permeable to air and water vapor but that are permeable to polymer molecules (i.e., because of their large size). The mold can be constructed to produce a shape of a lens or other optical element having specific physical optical properties such as refraction, aberration, curvature, and the like.

模塑操作順序示意性地示於第6A-6C圖。特別地,第6A圖示出具有第一表面602和第二表面604之鑄模600。第一表面602和第二表面 604形成用於收容聚合物溶液之型腔603。第一表面602和第二表面604間之間隔最初(例如,收容聚合物溶液時)大於最終聚合物結構之側面以適應乾燥時之收縮。在某些實施方式中,第一表面602和第二表面604可彼此相對移動以順應並控制乾燥(和收縮)聚合物之外形。 The molding operation sequence is schematically shown in Figures 6A-6C. In particular, FIG. 6A illustrates a mold 600 having a first surface 602 and a second surface 604. First surface 602 and second surface 604 forms a cavity 603 for receiving a polymer solution. The spacing between the first surface 602 and the second surface 604 is initially (e.g., when the polymer solution is contained) greater than the sides of the final polymer structure to accommodate shrinkage upon drying. In certain embodiments, the first surface 602 and the second surface 604 can be moved relative to one another to conform and control the drying (and shrinking) polymer profile.

第6B圖給出型腔內放置有聚合物溶液606之鑄模600。將型腔保持為某種初始封閉構型,同時將聚合物溶液606注入到型腔中。型腔之內部體積決定能夠放入鑄模600之聚合物溶液量。在另一個示例中,型腔603可以先打開,聚合物溶液可以先供給到鑄模600之一面(亦即第一表面602),然後與另一表面(亦即第二表面604)接合,從型腔中排出一些聚合物溶液,從而確保整個型腔裝滿了聚合物溶液。與將熱塑性聚合物熔融並以熔融狀態供給到鑄模之傳統注射模塑不同,可以在相對低的溫度、亦即大約40℃~250℃供給聚合物溶液606,以防聚合物降解。聚合物溶液之粘度可以如上所述根據狹縫模塗布通過固體成分加以控制。 Figure 6B shows a mold 600 in which a polymer solution 606 is placed in a cavity. The cavity is maintained in some initial closed configuration while the polymer solution 606 is injected into the cavity. The internal volume of the cavity determines the amount of polymer solution that can be placed in the mold 600. In another example, the cavity 603 can be opened first, and the polymer solution can be first supplied to one side of the mold 600 (i.e., the first surface 602) and then joined to the other surface (i.e., the second surface 604). Some polymer solution is drained from the chamber to ensure that the entire cavity is filled with polymer solution. Unlike conventional injection molding in which a thermoplastic polymer is melted and supplied to a mold in a molten state, the polymer solution 606 can be supplied at a relatively low temperature, that is, from about 40 ° C to 250 ° C to prevent polymer degradation. The viscosity of the polymer solution can be controlled by solid coating depending on the slit die coating as described above.

表面602和表面604之中的一個或兩個可透過水蒸氣,從而在乾燥聚合物溶液時水蒸氣能夠逸出鑄模600。然而,表面602和表面604仍舊將聚合物分子保留在鑄模中。例如,表面602和表面604之中的一個或兩個具有微孔。表面602和表面604之中的一個或兩個可以加熱到大約100℃~250℃以促進乾燥和溶劑從聚合物溶液中蒸發。 One or both of the surface 602 and the surface 604 are permeable to water vapor such that water vapor can escape the mold 600 as the polymer solution is dried. However, surface 602 and surface 604 still retain polymer molecules in the mold. For example, one or both of surface 602 and surface 604 have micropores. One or both of surface 602 and surface 604 can be heated to between about 100 ° C and 250 ° C to promote drying and evaporation of the solvent from the polymer solution.

隨著溶劑離開鑄模600,在鑄模600之中的聚合物溶液厚度會減小。為了避免在鑄模600之中形成空腔,表面602和表面604可製成在第6C圖中所示方向彼此相對移動之形狀。表面602和表面604之位置可用於控制聚合物溶液之乾燥,亦即供給到表面602和表面604之熱量,更詳言之表 面602和表面604之溫度。這種回饋可以用於防止過度乾燥或不充分乾燥。 As the solvent leaves the mold 600, the thickness of the polymer solution in the mold 600 decreases. In order to avoid the formation of a cavity in the mold 600, the surface 602 and the surface 604 may be formed in a shape that moves relative to each other in the direction shown in Fig. 6C. The location of surface 602 and surface 604 can be used to control the drying of the polymer solution, i.e., the heat supplied to surface 602 and surface 604, more particularly The temperature of face 602 and surface 604. This feedback can be used to prevent excessive drying or insufficient drying.

應予說明,表面602、表面604可具有特定形狀、形式或設計。例如,表面602、表面604可以係半球形以形成透鏡或類似裝置。表面602、表面604亦可以具有特定設計以形成例如菲涅爾透鏡類裝置。 It should be noted that surface 602, surface 604 can have a particular shape, form, or design. For example, surface 602, surface 604 can be hemispherical to form a lens or similar device. Surface 602, surface 604 may also have a particular design to form, for example, a Fresnel lens type device.

再移動溶劑技術例 Removable solvent technology example

現在回到第3圖,在工序308,溶劑被從沉積聚合物溶液中除去。溶劑可以通過在至少約為80℃之溫度下乾燥而除去。上限通常取決於溶液中使用之聚合物的穩定性。這些溫度可代表材料在乾燥時之實際溫度或周邊組件溫度、例如基底溫度、材料表面上之大氣溫度等。乾燥亦可以通過吹入特定溫度之乾燥氣體而進行。例如,乾燥氣體可以包括氮氣或加熱空氣。通常,更高溫度有助於促進乾燥工序。然而,水分快速除去會打亂聚合物分子在乾燥結構之中的排列並和使光學特性紊亂。 Returning now to Figure 3, at step 308, the solvent is removed from the deposited polymer solution. The solvent can be removed by drying at a temperature of at least about 80 °C. The upper limit usually depends on the stability of the polymer used in the solution. These temperatures may represent the actual temperature of the material as it is dried or the temperature of the surrounding components, such as the temperature of the substrate, the temperature of the atmosphere on the surface of the material, and the like. Drying can also be carried out by blowing a dry gas at a specific temperature. For example, the drying gas can include nitrogen or heated air. Generally, higher temperatures help to promote the drying process. However, rapid removal of moisture can disrupt the alignment of the polymer molecules in the dry structure and distort the optical properties.

在某一示例性實施方式中,乾燥工序可包括多個步驟。例如,加熱乾燥亦可包括隨後冷卻聚合物溶液。在各種實施方式中,可利用一個或多個乾燥裝置、例如氣流乾燥機,旋轉式乾燥機、噴霧乾燥機、流化床乾燥機、振動式流化床乾燥機、接觸式流化床乾燥機、熱板式乾燥機等等。 In an exemplary embodiment, the drying process can include multiple steps. For example, heat drying can also include subsequent cooling of the polymer solution. In various embodiments, one or more drying devices, such as a gas flow dryer, a rotary dryer, a spray dryer, a fluidized bed dryer, a vibrating fluidized bed dryer, a contact fluidized bed dryer, may be utilized. , hot plate dryers, etc.

後沉積處理技術例 Post deposition processing technique

成型 forming

在各種實施方式中,後沉積處理工序310將聚合物溶液層成型。例如,壓制聚合物溶液層而形成溝,例如第7A圖和第7B圖所示。詳言之,在第7A圖中示出具有沉積在其上之聚合物溶液層204之基底。第7B 圖示出聚合物溶液層202之開槽結果、即所謂成型聚合物塗層702。聚合物溶液層成型可在充分乾燥聚合物結構(亦即固體成分大約為100%)、部分乾燥聚合物結構或實施任何乾燥前之沉積聚合物塗層上進行。在後兩種情形下,成型裝置(亦即壓制輥)需要適應隨後的厚度變化。像這樣地,在這些情形下使用的成型裝置之容許偏差無需與用於充分乾燥聚合物結構之裝置一般精確。 In various embodiments, post-deposition treatment process 310 forms a layer of polymer solution. For example, the polymer solution layer is pressed to form a groove, such as shown in Figures 7A and 7B. In particular, a substrate having a layer 202 of polymer solution deposited thereon is shown in Figure 7A. 7B The result of the grooving of the polymer solution layer 202, the so-called shaped polymer coating 702, is illustrated. The polymer solution layer formation can be carried out on a fully dried polymer structure (i.e., about 100% solids), a partially dried polymer structure, or any deposited polymer coating prior to drying. In the latter two cases, the forming device (i.e., the press roll) needs to accommodate subsequent thickness variations. As such, the tolerances of the forming apparatus used in these situations need not be as precise as the apparatus used to sufficiently dry the polymer structure.

聚合物結構(不考慮其乾燥狀態)之成型可以在將聚合物結構保持在大約50℃~200℃之同時進行。成型工具亦可以被加熱到該當溫度範圍。在某些實施方式中,成型工具被加熱到大約100℃~200℃,而聚合物結構在與成型工具接觸前被保持在相同溫度或更低溫度。熟習此技藝者能夠理解如果聚合物結構亦包含溶劑,那麼亦可以在這些條件下進行一些乾燥。在某些實施方式中,一些乾燥可以在聚合物結構成型之後進行。除了預成型乾燥,亦可以進行這種後成型乾燥。 The formation of the polymer structure (regardless of its dry state) can be carried out while maintaining the polymer structure at about 50 ° C to 200 ° C. The forming tool can also be heated to the temperature range. In certain embodiments, the forming tool is heated to between about 100 ° C and 200 ° C, while the polymer structure is maintained at the same temperature or lower prior to contact with the forming tool. Those skilled in the art will appreciate that if the polymer structure also contains a solvent, some drying can also be carried out under these conditions. In some embodiments, some drying can be performed after the polymer structure is formed. This post-forming drying can also be carried out in addition to preform drying.

在另一其他示例中,可以通過添加溶劑來減少乾燥聚合物之中的固體成分。可依序進行以便例如對聚合物進行整形。進而,將充分乾燥或部分乾燥聚合物擠出到纖維和中空管中。與加熱熱塑性聚合物使之成為共性的傳統擠出不同,在成型或擠出前,可以將水加入到水溶性聚合物中。 In still other examples, the solid component in the dried polymer can be reduced by adding a solvent. This can be done sequentially to, for example, shape the polymer. Further, a sufficiently dried or partially dried polymer is extruded into the fibers and the hollow tube. Unlike conventional extrusion, which heats thermoplastic polymers to make them common, water can be added to the water soluble polymer prior to molding or extrusion.

交聯 Cross-linking

後沉積處理工序310可以採用UV光照射、IR光照射或其他類型活化能量源、例如電子、離子或γ照射使聚合物鏈交聯。交聯可通過連接端基在兩個或更多相鄰聚合物分子及/或延伸聚合物分子間形成連接。 作為參與交聯之UV感應性基團之示例,可包括碳碳雙鍵和碳碳三鍵。基團可以在它們合成中引入到部分或全部單體中。基團可以在塗布和部分甚至整個乾燥操作中係為相對鈍性,但能夠在塗布後、某些實施方式中在部分或整個乾燥中活性化。在各種實施例中,UV光照射可具有例如大約為180納米~400納米之波長。 The post-deposition treatment process 310 can crosslink the polymer chains using UV light illumination, IR light illumination, or other types of activation energy sources, such as electron, ion, or gamma irradiation. Crosslinking can form a linkage between two or more adjacent polymer molecules and/or extended polymer molecules by a linker. As an example of the UV-inducing group involved in crosslinking, a carbon-carbon double bond and a carbon-carbon triple bond may be included. The groups may be introduced into some or all of the monomers in their synthesis. The groups can be relatively blunt in coating and in some or even the entire drying operation, but can be activated in some or all of the drying after coating, in certain embodiments. In various embodiments, the UV light illumination can have a wavelength of, for example, approximately 180 nanometers to 400 nanometers.

以下詳細說明一個UV交聯例。下示聚合物可形成為負C-板。當沉積聚合物膜被照射UV光時,被照射之聚合物膜在任何進一步後處理、例如暴露于金屬陽離子以使之交聯前變得難以溶解。雖然沒有任何特定之理論依據,但認為每個聚合物分子中存在之雙鍵在UV照射下與相鄰分子形成分子間鍵。以下示出具有衍生結構式(XI)、(XII)之聚合物的交聯例。 A UV cross-linking example will be described in detail below. The polymer shown below can be formed as a negative C-plate. When the deposited polymer film is irradiated with UV light, the irradiated polymer film becomes difficult to dissolve before any further post treatment, such as exposure to metal cations to crosslink it. Although there is no specific theoretical basis, it is believed that the double bonds present in each polymer molecule form intermolecular bonds with adjacent molecules under UV irradiation. Crosslinking examples of polymers having the structural formulae (XI) and (XII) are shown below.

以上所示星號表示聚合物鏈之延長。雖然這些星號表示以 2D方式在兩個方向繼續,但他們亦能夠以3D方式在三個方向繼續。 The asterisk shown above indicates the elongation of the polymer chain. Although these asterisks indicate The 2D approach continues in both directions, but they can also continue in three directions in 3D.

下式示出另一示例。該當聚合物使用鏈中止劑來控制分子量。不使用這些鏈中止劑時,材料將延伸至220,000單位之分子量並變為不溶。使用鏈中止劑時,分子量將降至大約為20,000單位並具有足夠之溶解度。這些鏈中止劑可以係為UV-固化基團(例如,C=C雙鍵),該當UV-固化基團能夠容易地被活化而增加塗布後膜中的分子量,提供3D網路並降低溶解度。該示例進一步示於下述結構式: 以上所示星號表示聚合物鏈之延長。 The following formula shows another example. The polymer should use a chain stop to control the molecular weight. When these chain extenders are not used, the material will extend to a molecular weight of 220,000 units and become insoluble. When a chain terminator is used, the molecular weight will drop to about 20,000 units and have sufficient solubility. These chain terminators can be UV-curable groups (e.g., C=C double bonds) which can be readily activated to increase the molecular weight in the coated film, provide a 3D network and reduce solubility. This example is further illustrated in the following structural formula: The asterisk shown above indicates the elongation of the polymer chain.

聚合物膜轉換成水不溶性形式 Conversion of polymer membranes into water insoluble forms

在某些實施方式中,方法300用具有一個或多個下述陽離子之水溶性無機鹽溶液對聚合物層進行後沉積處理:H+、Ba2+、Pb2+、Ca2+、Mg2+、Sr2+、La3+、Zn2+、Zr4+、Ce3+、Y3+、Yb3+、Gd3+和它們之任意組合。例如,乾燥聚合物層可以浸漬或不浸漬就接觸下述物質之中的一個或多個:氯化鋇、硝酸鋇、氯化鑭、硝酸鑭、鋁鹽等等。 In certain embodiments, method 300 uses a post-deposition treatment of a polymer layer with a water-soluble inorganic salt solution having one or more of the following cations: H + , Ba 2+ , Pb 2+ , Ca 2+ , Mg 2 + , Sr 2+ , La 3+ , Zn 2+ , Zr 4+ , Ce 3+ , Y 3+ , Yb 3+ , Gd 3+ and any combination thereof. For example, the dried polymer layer may be contacted with one or more of the following materials, with or without impregnation: cerium chloride, cerium nitrate, cerium chloride, cerium nitrate, aluminum salts, and the like.

在某個實施方式中,乾燥聚合物層可以浸漬或者不浸漬就接觸硝酸鋇(Ba(NO3)2)、氯化鋇(BaCl2)或氯化鑭(LaCl3)之水性溶液。硝酸鋇在水中之濃度大約為2wt%~20wt%,更詳言之為5wt%~15wt%,例如大約為8.5wt%。例如,將87.55g無水硝酸鋇溶于942.45g水。乾燥聚合物層與後處理溶液之接觸時間大約為0.1秒~10秒,更詳言之大約為0.5秒~5秒,例如大約為1秒~2秒。在暴露於鹽溶液中後,將聚合物層用水沖洗並乾燥。在輥對輥沉積加工中,基底可以通過包含後處理溶液之浴並且在通過含水之浴後乾燥。在某些實施方式中,後處理溶液可使用例如狹縫模或噴霧技術作為塗層施加於乾燥聚合物層,以更好地控制後處理溶液之分配。基底可隨後噴水來沖洗掉後處理溶液,然後進行乾燥。這種方法避免將基底背面側暴露於任何殘留之鹽。在某些實施方式中,使用相同溶液將一個或多個上述操作重複一次或多次。 In one embodiment, the polymer layer may be dried without immersing or dipping it in contact with barium nitrate (Ba (NO 3) 2) , barium chloride (BaCl 2) or lanthanum (LaCl 3) an aqueous solution of chloride. The concentration of cerium nitrate in water is about 2 wt% to 20 wt%, more specifically 5 wt% to 15 wt%, for example about 8.5 wt%. For example, 87.55 g of anhydrous cerium nitrate is dissolved in 942.45 g of water. The contact time of the dried polymer layer with the post-treatment solution is from about 0.1 second to about 10 seconds, more specifically from about 0.5 seconds to about 5 seconds, for example from about 1 second to about 2 seconds. After exposure to the salt solution, the polymer layer was rinsed with water and dried. In a roll-to-roll deposition process, the substrate can be passed through a bath containing a post-treatment solution and dried after passing through an aqueous bath. In certain embodiments, the post-treatment solution can be applied to the dried polymer layer as a coating using, for example, a slot die or spray technique to better control the dispensing of the post-treatment solution. The substrate can then be sprayed with water to rinse off the post-treatment solution and then dried. This method avoids exposing the back side of the substrate to any residual salts. In certain embodiments, one or more of the above operations are repeated one or more times using the same solution.

光學元件例 Optical component example

第8圖示出一個示意性顯示系統800之剖面示意圖,該當顯示系統800包含設置在光學補償器堆疊801上之光調製器850,該當光學補償器堆疊801包含設置於第一液晶層820之j-相位差板810。j-相位差板810包含對至少一個可見光偏振狀態實質上不吸收和不散射之聚合物膜層。j-相位差板810具有x、y和z垂直折射率,其中垂直折射率之中的至少兩個不相等,平面內相位差100nm,平面外相位差之絕對值50nm。第一液晶層820包含液晶材料。第一液晶層820可以為o-板、a-板諸如此類。光學補償器堆疊801可包括設置於j-相位差板810之第二液晶層825或j-相位差板810能夠設置在第二液晶層825和第一液晶層820之間。第二液晶層825可以為正A- 板或諸如此類。光學補償器堆疊801可進一步包括設置於第一液晶層820之偏振層830或第一液晶層820能夠被設置在偏振層830和j-相位差板810之間。偏振層830可以為吸收偏振器或反射偏振器。反射偏振層840能夠被設置於偏振層830或偏振層830能夠設置在反射偏振層840和第一液晶層820之間。 8 is a schematic cross-sectional view of an exemplary display system 800 including a light modulator 850 disposed on an optical compensator stack 801, the optical compensator stack 801 including a first liquid crystal layer 820. - phase difference plate 810. The j-phase difference plate 810 includes a polymer film layer that does not substantially absorb or scatter the at least one visible light polarization state. The j-phase difference plate 810 has x, y, and z vertical refractive indices, wherein at least two of the vertical refractive indexes are unequal, and the in-plane phase difference 100nm, the absolute value of the out-of-plane phase difference 50nm. The first liquid crystal layer 820 contains a liquid crystal material. The first liquid crystal layer 820 may be an o-plate, an a-plate, or the like. The optical compensator stack 801 may include a second liquid crystal layer 825 or a j-phase difference plate 810 disposed on the j-phase difference plate 810 to be disposed between the second liquid crystal layer 825 and the first liquid crystal layer 820. The second liquid crystal layer 825 may be a positive A-board or the like. The optical compensator stack 801 may further include a polarizing layer 830 disposed on the first liquid crystal layer 820 or the first liquid crystal layer 820 may be disposed between the polarizing layer 830 and the j-phase difference plate 810. Polarization layer 830 can be an absorbing polarizer or a reflective polarizer. The reflective polarizing layer 840 can be disposed on the polarizing layer 830 or the polarizing layer 830 can be disposed between the reflective polarizing layer 840 and the first liquid crystal layer 820.

第9A-9B圖示出各種示例顯示系統堆疊900之剖面示意圖。在第9A圖中示出堆疊900,該當堆疊900包含四個厚度大約為80微米之基底905(亦即TAC基底),其間設置有圖案化之垂直取向(PVA)層910。PVA層910可以具有大約為20微米之厚度。鄰接於基底905,使用本說明書中記載之技術製作以正A-板為代表之沉積區域相位差層915,和使用本說明書中記載之技術製作以負C-板為代表之相位差層920。相位差層915、920之厚度大約為3微米或更小。堆疊900亦包含厚度大約為30微米之聚合物穩定取向(PSA)層925。垂直取向(VA)電池層930插入到基底905之間。亦可以使用PET層935和保護膜940,它們之厚度可以為大約25-30微米。堆疊900之總厚度大約為200微米。 9A-9B illustrate cross-sectional schematic views of various example display system stacks 900. Stack 900 is shown in FIG. 9A, which includes four substrates 905 (ie, TAC substrates) having a thickness of approximately 80 microns with a patterned vertical alignment (PVA) layer 910 disposed therebetween. The PVA layer 910 can have a thickness of approximately 20 microns. Adjacent to the substrate 905, a deposition region retardation layer 915 typified by a positive A-plate is produced by the technique described in the present specification, and a retardation layer 920 typified by a negative C-plate is produced by the technique described in the present specification. The thickness of the phase difference layers 915, 920 is approximately 3 microns or less. Stack 900 also includes a polymer stabilized orientation (PSA) layer 925 having a thickness of about 30 microns. A vertical alignment (VA) cell layer 930 is interposed between the substrates 905. A PET layer 935 and a protective film 940, which may have a thickness of about 25-30 microns, may also be used. The total thickness of stack 900 is approximately 200 microns.

實驗結果 Experimental result

進行一個實驗測定氯化鋇後處理對聚合物水溶性之有效性。將包含2,2'-二磺基-4,4'-聯苯胺對苯二甲醯胺-間苯二甲醯胺之聚合物沉積到TAC基底上形成350納米之厚膜。從該膜上切下一組樣品,在10wt%氯化鋇水溶液中浸漬大約1-2秒,然後用水沖洗並乾燥。另一組樣品用作參照,不進行任何後處理操作。然後,將每組之中的一部分於室溫在100%相對濕度中暴露3天,而每組之中的剩餘部分於60℃在90%相對濕度中暴 露20天。然後檢測所有樣品對聚合物之粘附性。測試結果示於下表2。 An experiment was conducted to determine the effectiveness of post-treatment of barium chloride on the water solubility of the polymer. A polymer comprising 2,2'-disulfo-4,4'-benzidine-p-xylamine-m-xylyleneamine was deposited onto a TAC substrate to form a thick film of 350 nm. A set of samples was cut from the film, immersed in a 10 wt% aqueous solution of barium chloride for about 1-2 seconds, then rinsed with water and dried. Another set of samples was used as a reference without any post-treatment operations. Then, a portion of each group was exposed to 100% relative humidity for 3 days at room temperature, while the remainder of each group was exposed to 60% relative humidity at 60 ° C. Dew for 20 days. The adhesion of all samples to the polymer was then tested. The test results are shown in Table 2 below.

詳言之,於60℃在90%相對濕度中暴露20天,結果未處理膜去除了60%,而有效地使處理膜未去除。於25℃在100%相對濕度中暴露3天,結果未處理膜100%去除,而依然有效地使處理膜未去除。像這樣地,用氯化鋇對2,2'-二磺基-4,4'-聯苯胺對苯二甲醯胺-間苯二甲醯胺進行後沉積處理使得處理層與未處理層相比更能抵抗濕氣。雖然沒有特定之理論依據,但認為氯化鋇導致了2,2'-二磺基-4,4'-聯苯胺對苯二甲醯胺-間苯二甲醯胺之棒狀分子間的交聯。總而言之,後處理使與其他類型聚合物相比更容易操作之水溶性聚合物變為能夠抵抗操作環境中常見之水的防水聚合物。 In detail, exposure to 90% relative humidity at 60 ° C for 20 days resulted in removal of 60% of the untreated film, effectively preventing the treated film from being removed. Exposure to 100% relative humidity at 25 ° C for 3 days resulted in 100% removal of the untreated film, while still effectively preventing the treated film from being removed. As such, post-deposition of 2,2'-disulfo-4,4'-benzidine-phthalimin-m-xylylenediamine with ruthenium chloride allows the treated layer to be treated with the untreated layer More resistant to moisture. Although there is no specific theoretical basis, it is believed that ruthenium chloride leads to the interlinking of 2,2'-disulfo-4,4'-benzidine p-xylamine-m-xylamine. Union. In summary, post-treatment makes water-soluble polymers that are easier to handle than other types of polymers to become waterproof polymers that are resistant to water commonly found in the operating environment.

在另一個實驗中,評價預處理技術改善2,2'-二磺基-4,4'-聯苯胺對苯二甲醯胺-間苯二甲醯胺對TAC基底之潤濕性和粘附性的作用。一組基底用聚乙烯亞胺進行預處理,而另一個組用作參照,不進行預處理。兩組基底都塗布2,2'-二磺基-4,4'-聯苯胺對苯二甲醯胺-間苯二甲醯胺至大約2.5微米並乾燥。然後使用ASTM 3359標準測定樣品之粘附性。一些樣 品在塗布後立刻測試,而其他樣品先於60℃在90%相對濕度中暴露40天。實驗結果示於下表3。 In another experiment, evaluation of pretreatment techniques improved the wettability and adhesion of 2,2'-disulfo-4,4'-benzidine to phthalimin-m-xylamine to TAC substrate. The role of sex. One set of substrates was pretreated with polyethyleneimine and the other set was used as a reference without pretreatment. Both sets of substrates were coated with 2,2'-disulfo-4,4'-benzidine p-xylamine-m-xylamine to about 2.5 microns and dried. The adhesion of the samples was then determined using the ASTM 3359 standard. Some kind The product was tested immediately after coating, while the other samples were exposed to 60% relative humidity at 60 ° C for 40 days. The experimental results are shown in Table 3 below.

詳言之,在暴露於上述環境條件後,預處理基底顯示出優於未處理基底之粘附性。僅有6%的膜從預處理基底上去除,相比之下,近乎三分之一的膜從未處理基底上去除。 In particular, the pretreated substrate exhibited better adhesion than the untreated substrate after exposure to the above environmental conditions. Only 6% of the film was removed from the pretreated substrate, compared to nearly one-third of the film removed from the untreated substrate.

第10圖示出狹縫模1002沉積技術,該當沉積技術包括在膜之基底1001上在塗布方向1003滾動壓紋輥1004。這項技術得到壓印在膜上之最終結構1005。 Figure 10 illustrates a slot die 1002 deposition technique that includes rolling the embossing roll 1004 in the coating direction 1003 on the substrate 1001 of the film. This technique results in a final structure 1005 imprinted on the film.

結論 in conclusion

以上描述了通過在基底上沉積聚合物溶液形成各種光學元件之方法。這些方法可以包括一個或多個預沉積工序及/或一個或多個後沉積工序。雖然為便於清楚理解而相當詳細地描述了前述理念,但顯然可在所附申請專利範圍內實施某些變化和修改。應當注意,有許多實現本說明書中所揭示過程、系統和裝置之替代方式。因此,本實施方式應被看作說明性而非限制性。 The above describes a method of forming various optical elements by depositing a polymer solution on a substrate. These methods may include one or more pre-deposition processes and/or one or more post-deposition processes. Although the foregoing concepts have been described in considerable detail, the embodiments of the invention may It should be noted that there are many alternative ways of implementing the processes, systems and devices disclosed in this specification. Therefore, the present embodiments are to be considered as illustrative and not restrictive.

300‧‧‧將聚合物溶液沉積到基底之工序 300‧‧‧Process of depositing a polymer solution onto a substrate

302‧‧‧提供聚合物溶液 302‧‧‧Providing polymer solution

304‧‧‧預沉積基板處理 304‧‧‧Predeposition substrate treatment

306‧‧‧沉積聚合物溶液 306‧‧‧Deposited polymer solution

308‧‧‧移除溶劑 308‧‧‧Remove solvent

Claims (29)

一種光學元件形成方法,該方法包含:提供聚合物溶液,該當聚合物溶液包含溶劑和聚合物,其中聚合物包含n個具有下述結構式之有機單元:[-(Core(S)m)k-Gl-]n式中,有機單元包含剛性共軛有機成分Core,G係為選自包含-C(O)-NR1-、=(C(O))2=N-、-O-NR1-、線性和分支(C1-C4)烷撐、-CR1R2-O-C(O)-CR1R2-、-C(O)-O-、-O-、-NR1-之列表的連接基,其中,R1和R2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表;其中S係為給聚合物提供在溶劑之中的溶解度的親水性側基,相同或不同並且獨立地選自包含下述中的一個或多個之列表:-COOX、-SO3X、NW4、-SO2NP1P2和-CONP1P2之列表,其中X選自包含H、烷基、鏈烯基、炔基、芳基、鹼金屬的列表,W係為H或烷基或它們之任意組合,P1和P2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表;其中m係為0、1、2或3,k係為1、2或3,將聚合物溶液層沉積到基體結構之表面,其中聚合物溶液層之濕厚度至少部分基於所希望之乾燥厚度加以選擇;並且從聚合物溶液中除去溶劑而形成乾燥聚合物層。 An optical element forming method, comprising: providing a polymer solution comprising a solvent and a polymer, wherein the polymer comprises n organic units having the following structural formula: [-(Core(S) m ) k -G l -] n in the formula, a conjugated organic unit comprising a rigid organic component Core, G is selected from the group comprising based -C (O) -NR1 -, = (C (O)) 2 = N -, - O-NR1 a linker of a list of linear and branched (C1-C4) alkylenes, -CR1R2-OC(O)-CR1R2-, -C(O)-O-, -O-, -NR1-, wherein R1 and R2 is independently selected from the list comprising H, alkyl, alkenyl, alkynyl, aryl; wherein S is a hydrophilic pendant group that provides solubility to the polymer in a solvent, the same or different and independently selected Self-contained list of one or more of the following: -COOX, -SO3X, NW4, -SO2NP1P2, and -CONP1P2, wherein X is selected from the group consisting of H, alkyl, alkenyl, alkynyl, aryl, base A list of metals, W is H or an alkyl group or any combination thereof, and P1 and P2 are independently selected from the list comprising H, alkyl, alkenyl, alkynyl, aryl; wherein m is 0, 1, 2 or 3, k is 1, 2 or 3, dissolve the polymer Layer is deposited onto the surface of the base structure, at least in part be selected polymer wherein the wet thickness of the solution layer was dried on the desired thickness; and drying the polymer layer is formed from a polymer solution the solvent was removed. 如申請專利範圍第1項所述之方法,其中,聚合物包括具有兩種類型或更多種類型之單體單元的共聚物。 The method of claim 1, wherein the polymer comprises a copolymer having two or more types of monomer units. 如申請專利範圍第1項所述之方法,其中,n個有機單元進一步包括一個或多個按下述式與n個有機單元連接之終端成分:T-[-(Core(S)m)k-Gl-]n-T, 其中,T包括一個或多個鏈烯基、炔基和丙烯酸基。 The method of claim 1, wherein the n organic units further comprise one or more terminal components connected to the n organic units according to the following formula: T-[-(Core(S) m ) k -G l -] n -T, wherein T includes one or more alkenyl, alkynyl and acrylate groups. 如申請專利範圍第1項所述之方法,其中,共軛有機成分Core包括一個或多個下述結構式: -C=C- -C≡C-其中,p為係等於1、2、3、4、5或6之整數。 The method of claim 1, wherein the conjugated organic component Core comprises one or more of the following structural formulas: -C=C- -C≡C- wherein p is an integer equal to 1, 2, 3, 4, 5 or 6. 如申請專利範圍第1項所述之方法,其中,進一步包含對基體結構進行預處理以提供被增強之聚合物溶液潤濕性或粘附性。 The method of claim 1, wherein the method further comprises pretreating the matrix structure to provide wettability or adhesion of the reinforced polymer solution. 如申請專利範圍第5項所述之方法,其中,基體結構之預處理包括下述加工中的一個或多個:皂化,洗脫和使用中度鹼性水溶液氧化,超聲波清洗,沉積至少一個底漆層,對基體結構實施電暈放電和等離子體處理,其中,至少一個底漆層包含矽烷和聚乙烯亞胺之中的一個或多個。 The method of claim 5, wherein the pretreatment of the matrix structure comprises one or more of the following processes: saponification, elution and oxidation using a moderately alkaline aqueous solution, ultrasonic cleaning, deposition of at least one bottom The lacquer layer is subjected to corona discharge and plasma treatment to the substrate structure, wherein at least one of the primer layers comprises one or more of decane and polyethyleneimine. 如申請專利範圍第1項所述之方法,其中,進一步包含用後沉積溶液對聚合物溶液進行後沉積處理,其中後沉積溶液包含下述鋇鹽、下述鑭鹽和鋁鹽之中的一個或多個:氯化鋇,硝酸鋇,氯化鑭,硝酸鑭。 The method of claim 1, further comprising post-depositing the polymer solution with a post-deposition solution, wherein the post-deposition solution comprises one of the following onium salts, the following onium salts and aluminum salts. Or more: barium chloride, barium nitrate, barium chloride, barium nitrate. 如申請專利範圍第1項所述之方法,其中,進一步包含交聯n個有機單元。 The method of claim 1, wherein the method further comprises crosslinking the n organic units. 如申請專利範圍第8項所述之方法,其中,交聯按下述式通過交聯劑B來完成: 其中,Core1和Core2、S1和S2、m1和m2、k1和k2、G1和G2、n1和n2相同或不同。 The method of claim 8, wherein the crosslinking is carried out by the crosslinking agent B according to the following formula: Among them, Core1 and Core2, S1 and S2, m1 and m2, k1 and k2, G1 and G2, n1 and n2 are the same or different. 如申請專利範圍第8項所述之方法,其中,交聯按下述式通過交聯劑B 來完成:T-[(Core1(S)m1)k1-G1-]n1-T+B+T-[(Core2(S)m2)k2-G2-]n2-T→hv T-[(Core1(S)m1)k1-G1-]n1-T-B-T-[(Core2(S)m2)k2-G2-]n2其中,Core1和Core2、S1和S2、m1和m2、k1和k2、G1和G2、n1和n2相同或不同,T基團係為選自鏈烯基、炔基和丙烯酸之中的一個或多個基團。 The method of claim 8, wherein the crosslinking is carried out by the crosslinking agent B according to the following formula: T-[(Core 1 (S) m1 ) k1 -G 1 -] n1 -T+B +T-[(Core 2 (S) m2 ) k2 -G 2 -] n2 -T→h v T-[(Core 1 (S) m1 ) k1 -G 1 -] n1 -TBT-[(Core 2 ( S) m2 ) k2 -G 2 -] n2 wherein Core 1 and Core 2 , S 1 and S 2 , m 1 and m 2 , k 1 and k 2 , G 1 and G 2 , n 1 and n 2 are the same or different, and the T group is selected from an alkenyl group. One or more groups among the alkynyl groups and acrylic acid. 如申請專利範圍第8項所述之方法,其中,交聯按下述反應進行: The method of claim 8, wherein the crosslinking is carried out according to the following reaction: 如申請專利範圍第8項所述之方法,其中,交聯按下述反應進行: The method of claim 8, wherein the crosslinking is carried out according to the following reaction: 如申請專利範圍第1項所述之方法,其中,所述交聯包含下述加工之中的一個或多個:對聚合物溶液照射紫外線(UV)光,對聚合物溶液照射紅外線(IR)光,用電子束照射聚合物溶液,用離子束照射聚合物溶液,和用γ束照射聚合物溶液。 The method of claim 1, wherein the crosslinking comprises one or more of the following: irradiating the polymer solution with ultraviolet (UV) light, and irradiating the polymer solution with infrared rays (IR). Light, the polymer solution is irradiated with an electron beam, the polymer solution is irradiated with an ion beam, and the polymer solution is irradiated with a gamma beam. 如申請專利範圍第1項所述之方法,其中,從聚合物溶液中去除溶劑包括下述加工之中的一個或多個:將聚合物溶液加熱到至少80℃,通過施加乾燥氣流而範燥聚合物溶液,使用紅外線光照射或紫外線光照射乾燥聚合物溶液。 The method of claim 1, wherein the removing the solvent from the polymer solution comprises one or more of the following: heating the polymer solution to at least 80 ° C, by applying a dry gas stream The polymer solution is irradiated with infrared light or ultraviolet light to dry the polymer solution. 如申請專利範圍第1項所述之方法,其中,進一步包括在基體結構上成型聚合物溶液以形成至少一個溝或選擇性地改變聚合物溶液層之厚度。 The method of claim 1, further comprising molding the polymer solution on the substrate structure to form at least one trench or selectively varying the thickness of the polymer solution layer. 如申請專利範圍第1項所述之方法,其中,所述聚合物溶液層之沉積包含下述技術之中的一個或多個:狹縫模擠出、邁耶棒式塗布、輥塗、凹 版塗布、微凹版塗布、逗點式塗布、刮刀塗布、擠出、印刷、噴塗和浸漬塗布。 The method of claim 1, wherein the depositing of the polymer solution layer comprises one or more of the following techniques: slot die extrusion, Meyer bar coating, roll coating, concave Plate coating, micro gravure coating, comma coating, knife coating, extrusion, printing, spraying and dip coating. 如申請專利範圍第1項所述之方法,其中,所述溶劑包含下述溶劑之中的一個或多個:極性質子溶劑、極性非質子溶劑和非極性溶劑。 The method of claim 1, wherein the solvent comprises one or more of the following: a polar protic solvent, a polar aprotic solvent, and a non-polar solvent. 如申請專利範圍第17項所述之方法,其中,所述溶劑包含下述溶劑之中的一個或多個:水、酮、醇、四氫呋喃、酯、鹼性水性溶液、二甲基亞碸、二甲基甲醯胺、二甲基乙醯胺和二氧雜環己烷。 The method of claim 17, wherein the solvent comprises one or more of the following solvents: water, ketone, alcohol, tetrahydrofuran, ester, alkaline aqueous solution, dimethyl hydrazine, Dimethylformamide, dimethylacetamide and dioxane. 如申請專利範圍第1項所述之方法,其中,所述聚合物溶液進一步包含一個或多個添加劑,其中所述添加劑選自包含表面活性劑、醇、酸、增塑劑、穩定劑和抗氧化劑之組。 The method of claim 1, wherein the polymer solution further comprises one or more additives, wherein the additive is selected from the group consisting of surfactants, alcohols, acids, plasticizers, stabilizers, and anti-drugs. Group of oxidants. 如申請專利範圍第1項所述之方法,其中,所述基體結構包含下述基底之中的一個或多個:玻璃、三乙醯基纖維素、聚烯烴、聚碳酸酯、聚醯胺、聚醯亞胺、環烯烴聚合物、環烯烴共聚物、聚對苯二甲酸乙二醇酯、聚丙烯酸和聚苯乙烯。 The method of claim 1, wherein the matrix structure comprises one or more of the following substrates: glass, triethyl fluorenyl cellulose, polyolefin, polycarbonate, polyamine, Polyimine, cycloolefin polymer, cyclic olefin copolymer, polyethylene terephthalate, polyacrylic acid, and polystyrene. 如申請專利範圍第1項所述之方法,其中,所述聚合物溶液在沉積所述層之前係為各相同性。 The method of claim 1, wherein the polymer solution is each identical prior to depositing the layer. 如申請專利範圍第1項所述之方法,其中,聚合物在所述聚合物溶液之中的濃度大約為0.1wt%~30wt%。 The method of claim 1, wherein the concentration of the polymer in the polymer solution is from about 0.1% by weight to about 30% by weight. 如申請專利範圍第1項所述之方法,其中,所述乾燥聚合物層之雙反射大約為0.03~0.2。 The method of claim 1, wherein the dry polymer layer has a double reflection of about 0.03 to 0.2. 如申請專利範圍第1項所述之方法,其中,所述乾燥聚合物層之折射率約大於1.6。 The method of claim 1, wherein the dried polymer layer has a refractive index greater than about 1.6. 如申請專利範圍第1項所述之方法,其中,所述乾燥聚合物層具有折射率nx、ny和nz,nx、ny和nz對應於與所述乾燥聚合物層相關聯之笛卡兒坐標系的軸,其中x軸和y軸實質上與所述基體結構之表面一致,nz小於nx和ny,而nx和ny大約為相同數值。 The method of claim 1, wherein the dried polymer layer has refractive indices n x , n y and n z , n x , n y and n z correspond to the dry polymer layer The axis of the Cartesian coordinate system, wherein the x-axis and the y-axis substantially coincide with the surface of the base structure, n z is less than n x and n y , and n x and n y are approximately the same value. 如申請專利範圍第1項所述之方法,其中,所述乾燥聚合物層具有折射率nx、ny和nz,nx、ny和nz對應於與所述乾燥聚合物層相關聯之笛卡兒坐標系之x、y和z軸,其中x軸和y軸實質上與基體結構之表面一致,nx大於ny,並且ny大於nzThe method of claim 1, wherein the dried polymer layer has refractive indices n x , n y and n z , n x , n y and n z correspond to the dry polymer layer The x, y, and z axes of the Cartesian coordinate system, wherein the x and y axes are substantially coincident with the surface of the base structure, n x is greater than n y , and n y is greater than n z . 如申請專利範圍第1項所述之方法,其中,所述光學元件包括下述之中的一個或多個:光學相位差板、光准直器、透鏡、光波導、擴散器、光纖、光學安全膜和液晶顯示(LCD)元件。 The method of claim 1, wherein the optical element comprises one or more of the following: an optical phase difference plate, a light collimator, a lens, an optical waveguide, a diffuser, an optical fiber, and an optical Safety film and liquid crystal display (LCD) components. 一種光學元件形成方法,所述方法包含:提供基底;用下述技術之中的一個或多個處理所述基底:清洗、氧化、實施皂化、等離子體處理、電暈放電和修飾所述基底之表面凹凸;在所述基底之至少一個表面沉積聚合物溶液層,其中所述聚合物包含n個具有下述結構式之有機單元:[-(Core(S)m)k-Gl-]n其中,有機單元包含剛性共軛有機成分Core,G係為選自包含-C(O)-NR1-、=(C(O))2=N-、-O-NR1-、線性和分支(C1-C4)烷撐、-CR1R2-O-C(O)-CR1R2-、-C(O)-O-、-O-、-NR1-之列表的連接基,其中,R1和R2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表;其中 S係為給聚合物提供在溶劑之中的溶解度的親水性側基,相同或不同並且獨立地選自包含下述中的一個或多個之列表:-COOX、-SO3X、NW4、-SO2NP1P2和-CONP1P2之列表,其中X選自包含H、烷基、鏈烯基、炔基、芳基、鹼金屬的列表,W係為H或烷基或它們之任意組合,P1和P2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表;其中m係為0、1、2或3,k係為1、2或3;並且從所述聚合物溶液蒸發出所述溶劑。 An optical element forming method, the method comprising: providing a substrate; treating the substrate with one or more of the following techniques: cleaning, oxidizing, performing saponification, plasma treatment, corona discharge, and modifying the substrate a surface unevenness; depositing a polymer solution layer on at least one surface of the substrate, wherein the polymer comprises n organic units having the following structural formula: [-(Core(S)m)k-Gl-]n The organic unit comprises a rigid conjugated organic component Core, and the G system is selected from the group consisting of -C(O)-NR1-, =(C(O))2=N-, -O-NR1-, linear and branched (C1- C4) a linker of the alkylene, -CR1R2-OC(O)-CR1R2-, -C(O)-O-, -O-, -NR1-, wherein R1 and R2 are independently selected from the group consisting of H, a list of alkyl, alkenyl, alkynyl, aryl groups; S is a hydrophilic pendant group that provides solubility to the polymer in a solvent, the same or different and independently selected from the list comprising one or more of the following: -COOX, -SO3X, NW4, -SO2NP1P2, and a list of -CONP1P2, wherein X is selected from the group consisting of H, alkyl, alkenyl, alkynyl, aryl, alkali metal, W is H or alkyl or any combination thereof, and P1 and P2 are independently selected from a list comprising H, alkyl, alkenyl, alkynyl, aryl; wherein m is 0, 1, 2 or 3, k is 1, 2 or 3; and the solvent is evaporated from the polymer solution Solvent. 一種光學元件形成方法,所述方法包含:提供基底;在所述基底之至少一個表面沉積聚合物溶液層,其中所述聚合物包含n個具有下述結構式之有機單元:[-(Core(S)m)k-Gl-]n其中,有機單元包含剛性共軛有機成分Core,G係為選自包含-C(O)-NR1-、=(C(O))2=N-、-O-NR1-、線性和分支(C1-C4)烷撐、-CR1R2-O-C(O)-CR1R2-、-C(O)-O-、-O-、-NR1-之列表的連接基,其中,R1和R2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表;其中S係為給聚合物提供在溶劑之中的溶解度的親水性側基,相同或不同並且獨立地選自包含下述中的一個或多個之列表:-COOX、-SO3X、NW4、-SO2NP1P2和-CONP1P2之列表,其中X選自包含H、烷基、鏈烯基、炔基、芳基、鹼金屬的列表,W係為H或烷基或它們之任意組合,P1和P2獨立地選自包含H、烷基、鏈烯基、炔基、芳基之列表;其中m係為0、1、2或3,k係為1、2或3; 使用下述技術之中的一個或多個交聯所述n個有機單元:UV光照射、IR光照射、電子束照射、離子束照射、γ束照射;並且從所述聚合物溶液中蒸發出所述溶劑。 An optical element forming method, the method comprising: providing a substrate; depositing a polymer solution layer on at least one surface of the substrate, wherein the polymer comprises n organic units having the following structural formula: [-(Core( S) m) k-Gl-]n wherein the organic unit comprises a rigid conjugated organic component Core, and the G system is selected from the group consisting of -C(O)-NR1-, =(C(O))2=N-,- a linking group of O-NR1-, linear and branched (C1-C4) alkylene, -CR1R2-OC(O)-CR1R2-, -C(O)-O-, -O-, -NR1-, wherein , R 1 and R 2 are independently selected from the list comprising H, alkyl, alkenyl, alkynyl, aryl; wherein S is a hydrophilic pendant group that provides solubility to the polymer in a solvent, the same or different and Independently selected from the list comprising one or more of the following: -COOX, -SO3X, NW4, -SO2NP1P2, and -CONP1P2, wherein X is selected from the group consisting of H, alkyl, alkenyl, alkynyl, aryl List of bases, alkali metals, W is H or alkyl or any combination thereof, and P1 and P2 are independently selected from the list comprising H, alkyl, alkenyl, alkynyl, aryl; wherein m is 0 , 1, 2 or 3, k is 1, 2 or 3; The n organic units are crosslinked using one or more of the following techniques: UV light irradiation, IR light irradiation, electron beam irradiation, ion beam irradiation, γ beam irradiation; and evaporating from the polymer solution The solvent.
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