TW201529225A - Fixed-abrasive-grain wire saw device, and wafer production method using same - Google Patents

Abstract

The present invention is provided with: a first reel (31) around which a pre-usage wire is wound; and a second reel (32) around which a post-usage wire is wound and retrieved. When workpiece processing is performed on a first occasion, wire having a length obtained by adding, to a stroke amount, a usage amount required for the second reel from the first reel to perform the workpiece processing on the first occasion, is unwound to the second reel, and the wire is subsequently supplied from the second reel to a processing part of a workpiece to perform the workpiece processing on the first occasion. Furthermore, when workpiece processing is performed on a second occasion and occasions thereafter, for each of said occasions, wire having a length corresponding to 1.5 to 2.5 times the usage amount used in the previous workpiece processing is unwound to the second reel, and the wire is subsequently supplied from the second reel to the processing part to perform the workpiece processing.

Description

Fixed abrasive wire saw device and wafer manufacturing method using same

The present invention relates to a wire-saw device of a fixed abrasive type in which a plurality of wafers of a solar cell are cut into a plurality of thin wafers, and a wafer manufacturing method using the same.

A wire saw device has been conventionally known as an apparatus for cutting a plurality of wafers having a small thickness from an ingot such as a representative solar cell for processing an object (workpiece).

As a cutting method of a workpiece by a wire saw device, a free abrasive grain method in which a machining liquid called a slurry which disperses abrasive grains into an aqueous or oily dispersant is supplied is mainly used, but in recent years, due to environmental problems In addition, it is required to increase the productivity, and the method of fixing the abrasive grains by cutting the workpiece by fixing the abrasive grains of the diamond or the like to the surface in advance (for example, refer to Patent Document 1).

[Prior patent documents] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-230274

In the case of a fixed-grain type wire saw device, in order to suppress the cost of consumables and to manufacture an inexpensive wafer, it is necessary to reduce the fixed grinding cost of most of the cost. The amount of granules used. Further, the cost of the fixed abrasive wire becomes large, which is caused by a manufacturing method in which the fixed abrasive grain represented by the diamond is fixed to the fixed abrasive wire itself by plating or the like.

Due to this situation, it is required to reduce the cutting of a workpiece. The amount of wire used, that is, the line is used efficiently. Here, as a premise for making the problem clear, the idea of the wire usage amount of the wire saw device in which the abrasive grain method is fixed will be described.

Generally, in a fixed-grain type wire saw device, the workpiece is cut (to In the case of cutting into a plurality of wafers having a small thickness, the processing portion in which the ingot is placed is fixed at a fixed ratio (hereinafter, simply referred to as "processing" "Part") A new line (hereinafter, referred to as "the line before processing use") which is in a state where the processing performance is high, and the ingot is gradually cut. Further, as a method of supplying the line before processing to the processing unit, there is a method of simply continuing the feed line in one direction; and reciprocating the line, and by advancing the amount of the line wound back during the return movement The method of using the latter method is more than half of the method of feeding the line with less amount of movement and gradually supplying the difference to the processing part.

The thread before being used in the processing of the processing section starts cutting In the stage of ingot casting, it is in a state of high processing performance, but as the cutting ingot progresses, the processing performance gradually decreases (hereinafter, it is referred to as "the line after processing and use"), and finally, it becomes a non-processability. State (hereinafter, referred to as "process used line"). Of course, in the above-described process, the line before the processing is supplied to the processing portion at a fixed ratio, and the same amount of the line after the processing or the used line is processed from the processing portion, but from the viewpoint of efficient use of the line It can be said that the form in which the line used for processing is discharged from the processing unit is the most efficient method of use. Moreover, in the above process, a plurality of ingots are continuously cut In the case of the processing, the first time after the ingot is cut from the state in which the line before the processing is used is supplied to the processing unit, the second line is cut after the second use.

Here, the problem is the line after the processing of the processing unit. The degree of reduction in the workability is from the side before the supply processing is used (hereinafter referred to as the "extraction side") to the line after the discharge processing is used or the side where the processing is used up (hereinafter, referred to as The "winding side" is gradually increased, and has an influence on the quality of the wafer produced in the processing portion near the winding side.

More specifically, it was observed that the processing portion was made close to the winding side. The TTV (Total Thickness Variation) of the wafer is used to evaluate the difference between the maximum and minimum values of the height measured in the thickness direction in front of the wafer. One of the indicators of the flatness is that the change is large.

This is based on the following reasons. That is, the reason is that it is casting At the beginning of the ingot cutting process, no matter whether it is the line before the processing or the line after the processing, the same line as the line before the processing is used, there is no problem. However, if an old wire located in a state where the processing performance is as low as a predetermined value is used, the cutting can not be quickly performed as compared with the new wire in a state in which the processing performance is high, and the bending of the wire in the processing portion is increased, and the wafer is lowered. Precision.

Further, in addition to the problems as described above, if the above is used The old line in the state where the processing performance is as low as the value exceeds the fixed value may be caused by the closeness of the line or the jump of the pitch, so that the fixed abrasive grain line is broken. In general, since the number of workpieces subjected to slicing by the wire saw device is as large as a plurality, the length of the wire used in the machining is inevitably long. Therefore, the extremely expensive fixed abrasive line once A broken wire occurs, and the unusable portion of the wire is not used or is not used, and not only a large loss is incurred in terms of cost, but also the wire before processing is re-wound in the processing portion, and Reduce the production efficiency of workpiece processing.

The object of the present invention is to provide a wire saw device with a fixed abrasive pattern And the wafer manufacturing method using the same, the fixed abrasive wire saw device seeks to reduce the amount of fixed abrasive wire used in continuously processing a plurality of workpieces, and to improve the machining accuracy of the workpiece.

In order to solve the above problems, the present invention is as claimed. The fixed abrasive wire saw device according to the first aspect is characterized in that the wire for cutting a workpiece itself has abrasive grains for slicing, and the plurality of workpieces are sequentially sliced through at least two or more processing steps, and each of the workpieces is sliced. A fixed abrasive wire saw device for manufacturing a plurality of wafers on a workpiece, comprising: a first reel, which is a wire before the workpiece is wound; and a second reel, which is a wire after the workpiece is wound and processed; At the time of the first workpiece processing, the line from the first reel to the second reel is wound up to the length corresponding to the length of the amount of use required for the first workpiece processing and the length of the stroke amount. After the second reel, the line is supplied from the second reel to the processing unit, whereby the first workpiece is processed, and in the second and subsequent workpiece processing, each time is equivalent to the last time. After the wire of the length of 1.5 times to 2.5 times the amount of use of the workpiece processing is wound back to the second reel, the wire is supplied from the second reel to the processing portion, whereby the workpiece is processed.

Further, in the wafer manufacturing method using the fixed abrasive wire saw device according to the second aspect of the invention, the fixed abrasive wire saw device is cut in the workpiece. The cutting line itself has abrasive grains for slicing, and the plurality of workpieces are sequentially sliced through at least two or more processing steps, and a plurality of wafers are produced for each of the workpieces, and the first one includes: In the step, the first reel for winding the workpiece before the machining is used, and the second reel for the wire after the workpiece is wound and wound, are attached to the jigsaw device; and the second step is the machining of the first workpiece. When the line corresponding to the length of the amount of use required for the first workpiece processing and the length of the stroke amount is wound back to the second reel from the first reel to the second reel, The line is supplied from the second reel to the processing unit, whereby the first workpiece is processed; and the third step is performed in the second and subsequent workpiece processing, which is equivalent to the last time. After the wire of the length of 1.5 times to 2.5 times the amount of use of the workpiece is wound back to the second reel, the wire is supplied from the second reel to the processed portion of the workpiece, whereby the workpiece is processed.

According to the present invention, the fixed abrasive wire saw device as claimed in claim 1 and the wafer manufacturing method using the fixed abrasive wire saw device according to claim 2, in a plurality of workpieces In the case of processing, after the second and subsequent processing, the workpiece can be cut by the line where the processing performance is not lower than the fixed value, and the surface can be reduced to meet the risk of wire breakage and the amount of wire used. Reduce the accuracy of changes in TTV, etc., and improve the processing accuracy in the production line.

Further, the wafer manufacturing method according to the third aspect of the invention is the wafer manufactured by the wafer manufacturing method using the fixed abrasive wire saw device according to the second aspect of the invention.

According to the present invention, a wire saw device having a fixed abrasive pattern can be provided And the wafer manufacturing method using the same, the fixed abrasive wire saw device seeks to reduce the amount of fixed abrasive wire used in continuously processing a plurality of workpieces, and to improve the machining accuracy of the workpiece.

1‧‧‧Fixed abrasive wire saw device

10‧‧‧Processing Department

11, 12‧‧‧ spindle roller

11a, 12a‧‧‧ Roller body

11b, 12b‧‧‧Wire winding department

20‧‧‧Control device

31‧‧‧Extracted side reel

32‧‧‧Winding side reel

100‧‧‧Ingots

W‧‧‧Fixed abrasive line

Fig. 1 is a view showing the overall configuration of a fixed abrasive wire saw device according to an embodiment of the present invention.

Fig. 2 is a flow chart showing a wafer manufacturing method using a conventional fixed abrasive wire saw device.

Fig. 3 is a flow chart showing a wafer manufacturing method using the fixed abrasive wire saw device shown in Fig. 1.

Fig. 4 is a flow chart showing in more detail a wafer manufacturing method using a conventional fixed abrasive wire saw device.

Fig. 5 is a flow chart showing in more detail a wafer manufacturing method using the fixed abrasive wire saw device shown in Fig. 1.

Fig. 6 is a view showing the evaluation test results of the embodiment of the present invention, which is produced in a large amount in the case of using the present invention and the conventional fixed abrasive wire saw device of the present embodiment and the first workpiece processing of the comparative example. The test result of the evaluation of the variation of the TTV and the surface roughness of the wafer (Fig. 6(a)) shows the nth time of the comparative example using the conventional fixed abrasive wire saw device (n system 2 or more) A test result explanatory diagram (Fig. 6(b)) showing the variation of the TTV and the surface roughness of the wafer which is mass-produced at the time of processing the workpiece in the natural number), and shows the use of the fixed abrasive wire saw device of the present invention. Evaluation of the variation of TTV and surface roughness of wafers manufactured in large quantities during the processing of the workpiece at the nth time (n-series 2 or more natural numbers) Test result illustration (Fig. 6(c)).

Hereinafter, a fixed abrasive wire saw device and a wafer manufacturing method using the same according to an embodiment of the present invention will be described based on the drawings. Fig. 1 is a view showing the overall configuration of a fixed abrasive wire saw device according to an embodiment of the present invention.

The fixed abrasive wire saw device 1 of the present embodiment includes diamond abrasive grains as abrasive grains for slicing in the wire for workpiece cutting, and sequentially processes a plurality of workpieces through at least two or more processing steps. And a fixed abrasive wire saw device for manufacturing a plurality of wafers for each workpiece. In this case, in the present embodiment, an ingot for a solar cell is used as a workpiece, and this is sliced to produce a plurality of wafers for solar cells.

The fixed abrasive wire saw device 1 has two spindle rollers 11 and 12 which are arranged to be parallel to each other in the axial direction. The spindle roller drive device (not shown in Fig. 1) is used to rotate the spindle rollers 11 and 12. Rotating in synchronization with each other; the control device 20 controls the spindle rollers 11, 12 and the spindle roller driving device, and cuts the ingot 100 into a plurality of wafers (not shown) via a fixed abrasive wire W; and a workpiece lifting mechanism ( In the first drawing (not shown), the ingot 100 (hereinafter simply referred to as "ingot") is pressed against a fixed abrasive wire W which is reciprocated by the rotation of the spindle rolls 11, 12, and cut into a plurality of crystal pieces. circle.

Each of the spindle rolls 11 and 12 is composed of a roll main body 11a and 12a made of metal and wire winding portions 11b and 12b, and the wire winding portions 11b and 12b are made of a resin such as urethane, and Most of the outer peripheral surfaces of the roller bodies 11a and 12a are covered in the axial direction of the roller bodies 11a and 12a. Online winding In the outer peripheral portion of 11b and 12b, a plurality of wire winding grooves which are adjacent to each other at a small pitch are formed to wind the fixed abrasive wire W in a spiral shape.

Further, in the fixed abrasive wire saw device 1 of the present embodiment, the extraction side reel (second reel) 31 is disposed on the other side of the main spindle roller 11 opposite to the other main spindle roller 12, and the other main spindle roller 12 is disposed. A winding side reel (first reel) 32 is provided on the side opposite to the one of the main spindle rolls 11.

According to the fixed abrasive wire saw device 1 of the present embodiment, the fixed abrasive wire W sent from the take-up side reel 31 is partially wound around one of the main spindle rolls 11 while being bridged to the other main shaft roll. 12, the main shaft roller 12 is partially wound around the other, and the other main shaft roller 12 is bridged to one of the main shaft rolls 11, and partially wound around one of the main shaft rolls 11. In this manner, the fixed abrasive wire W drawn from the take-up side reel 31 is repeatedly wound around one of the main spindle rolls 11 and the other main spindle roll 12, and is bridged to each of the main spindle rolls 11, 12 After that, it is wound around the winding side reel 32.

Next, the workpiece cutting step peculiar to the fixed abrasive wire saw device 1 of the present embodiment and the accompanying wafer manufacturing method will be described.

The wafer manufacturing method using the fixed abrasive wire saw device of the present embodiment is as follows. In the step sequence, as the first step, the winding side reel (first reel) 32 of the fixed abrasive wire W before the wound ingot processing is used, and the fixed abrasive wire W after the winding ingot is processed and used The extraction side reel (second reel) 31 is attached to the fixed abrasive wire saw device 1.

In the second step, the winding side reel (first reel) 32 and the extraction side reel (second reel) 31 correspond to the first time (the first serving amount). The length of use required for ingot processing After the fixed abrasive wire W having the length of the stroke amount is added up to the take-up side reel (second reel) 31, it is retracted to the front side reel (second reel) 31 before being used for processing. The abrasive wire W is supplied to the processing unit 10, whereby the first ingot is sliced. Further, the amount of the fixed abrasive wire W required for the processing of the primary portion of the ingot referred to herein means the length of the wire required for slicing an ingot (workpiece). Moreover, the stroke amount of the fixed abrasive grain line W at this time is a method of supplying the fixed abrasive grain line W before the ingot processing to the processing part 10, and does not simply continue the feed line in one direction, but In the case where the line is reciprocated a plurality of times, the amount of the line wound back during the return movement is smaller than the amount of the line fed during the forward movement, and only the difference is gradually supplied to the processing unit, once The amount of thread that is rolled back when the feed or return travels while moving forward. More specifically, it is only necessary to ensure the amount of wire to be wound back when the return stroke is moved, and it is not necessary to secure the method of simply feeding the feed line in one direction.

Next, as a third step, at the time of the slicing of the ingot in the second and subsequent stages, the fixed abrasive wire W having a length twice the amount required for the slicing of the previous ingot is used. After being wound up to the take-up side reel (second reel) 31, the fixed abrasive wire W before processing is supplied to the processing unit 10 from the take-up side reel (second reel) 31, whereby the second casting is started. Slicing of ingots.

Then, the same steps as in the third step are sequentially repeated, and the ingot is sliced in each step, and a predetermined number of ingots are all sliced to produce a plurality of wafers.

Hereinafter, the present embodiment will be described in more detail based on a flowchart. A wafer manufacturing method of the fixed abrasive wire saw device 1. Here, before the description, in order to facilitate understanding of the difference between the present invention and the prior art, a wafer manufacturing method using a conventional fixed abrasive wire saw device will be described based on a flowchart. In the following description, n is a natural number of 2 or more and 9 or less for convenience of explanation, but of course, n may be a natural number of 9 or more. In addition, in the description of the flowchart and the following description, the "ingot" in the above embodiment is referred to as "workpiece" in terms of expression.

Fig. 2 is a flow chart showing a wafer manufacturing method using a conventional fixed abrasive wire saw device. When the wafer manufacturing method of the conventional fixed abrasive wire saw device is carried out, first, the new wire spool is mounted on the drawing side, and the processing unit is in a state of supplying a new wire (step S500). Here, the "new line" is the line before the workpiece is processed. Next, the first processing is performed (step S510). In this way, each of the workpieces is sequentially processed in sequence. In other words, the (n-1)th processing (step S (500+n×10)) is performed, and the nth processing (step S (510+n×10)) is performed, and the related processing is performed, and the predetermined processing is completed. Processing of the number of workpieces (step S600).

Next, a wafer manufacturing method using the fixed abrasive wire saw device 1 of the present embodiment will be described. Fig. 3 is a flow chart showing a method of manufacturing a wafer using the fixed abrasive wire saw device of the embodiment shown in Fig. 1. In the wafer process of the fixed abrasive wire saw device 1 of the present embodiment, first, the new wire spool is mounted on the winding side, and the new wire is supplied to the processing portion (step S100). Here, the "new line" is the line before the workpiece is processed and used. Then, only the new line of the usage amount/time+stroke amount is retracted to the extraction side (step S101). At this time, the contents of "usage" and "stroke amount" are the contents defined above. the same. Next, the first processing is performed (step S110). Then, the second processing is performed. The processing is repeated, and then (n-1)th, nth times, the processing of the required number of workpieces is continued. In addition, in this flowchart, as a general example, the process of performing the nth process after the (n-1)th process is completed will be described. Specifically, the (n-1)th process is performed (step S (100+10×n)), and the new line is only wound back to the length of the (n-1)th use amount twice the length of the extraction side. (Step S (110 + 10 × n) a). Further, the nth processing (step S (110 + 10 × n)) is performed, and the related processing is continued, and the processing of the predetermined number of workpieces is completed (step S200).

Next, the above-described conventional techniques and the respective processing contents of the present embodiment will be compared and explained in more detail. Further, in the following description, n is also a natural number of 2 or more and 9 or less, but n may be a natural number of 9 or more.

Fig. 4 is a flow chart showing in more detail the processing contents of the wafer manufacturing method using the conventional fixed abrasive wire saw device (only the first processing contents are shown in detail in Fig. 4).

Initially, a wafer manufacturing method using a conventional fixed abrasive wire saw device will be described. In the conventional wafer process, initially, a new line reel is mounted on the drawing side (step S500). Next, the workpiece is sliced (step S510). In the slicing of the first workpiece, the ingot is first mounted (step S511), then the cutting process is performed (step S512), and finally the wafer is taken out (step S513). In this manner, the workpiece is sliced n times (step S (500 + n × 10)), and a series of processing operations are completed (step S600).

Next, a wafer manufacturing method using the fixed abrasive wire saw device 1 of the present embodiment will be described. Fig. 5 is a flow chart for explaining in more detail the wafer manufacturing method using the fixed abrasive wire saw device 1 shown in Fig. 1. Crystal in this embodiment In the round process, initially, the installation of the new wire reel is performed on the winding side (step S100). Then, the new line of the usage amount/time+stroke amount is wound back to the drawing side (step S101). Next, as the first processing (step S110), the ingot is mounted (step S111), the dicing process (step S112), and the wafer is taken out (step S113). Then, only the usage amount of the new line / the length of the second × 2 is retracted to the extraction side (step S (110 + 10 × n) a). In this manner, the slicing of the workpiece is repeated n times (step S (110 + 10 × n)), and the series of processing operations is ended (step S200).

As described above, the fixed abrasive wire saw device of the present embodiment and the wafer manufacturing method using the same are characterized in that it is attached to a new wire reel to be attached to the drawing side on the winding side in the past, in the first time. Before the processing, the "line + stroke amount used in one processing" is retracted on the side of the extraction reel, and before the second and subsequent processing, the reel side is retracted in advance to "use in one processing". 2 times the amount of the line."

That is, the fundamental difference between the steps of the prior art and the steps of the present embodiment (the present invention) is as follows. In the conventional continuous processing and the winding-back continuous processing of the present embodiment, the fatigue of the line is the same when viewed as a whole, but by a special step in the present embodiment (not conventionally), A line at the start of cutting of each ingot (the second time or later) can be used in a state in which the processability is not so low as to exceed a predetermined value.

In other words, according to the fixed abrasive wire saw device 1 of the present embodiment (the present invention) and the wafer manufacturing method using the same, when a plurality of workpieces are continuously processed, the second and subsequent processing may be performed. Always cut the workpiece with a line that is not in a state where the processing performance is not lower than the fixed value, and the accuracy of the wafer manufactured in the processing portion near the winding side is reduced, and the wafer in the production line is made. The yield of manufacture is significantly higher than before.

Further, in addition to the problems as described above, it is also possible to prevent the line of the wire from being broken due to the approach of the line or the jump of the pitch. Generally, since the number of workpieces to be sliced by the fixed abrasive wire saw device is plural, the length of the wire used in the machining is inevitably long. Therefore, if the extremely expensive fixed abrasive wire W is broken, the unused portion of the wire becomes unusable, and not only causes a large loss in cost, but also the reel and the reel of the wound new wire must be re-rolled. The reel is reloaded to the wire saw device to reduce the production efficiency of the workpiece processing, but in the present embodiment, the occurrence of such a defect is surely prevented.

[Examples]

In the following, since the evaluation test for clarifying the advantages of the present invention with respect to the prior art is performed, it is explained that the test result is evaluated. Further, in the following description, the embodiment means a wafer manufactured using the fixed abrasive wire saw device 1 of the present invention, and the comparative example means the use of the steps according to the flow charts according to the above FIGS. 2 and 4 A wafer manufactured by a fixed abrasive wire saw device of a conventional example.

In the evaluation test, specifically, in each of the present embodiment and the comparative example, each of the ingots was sliced, and 1000 wafers were produced for each of the tantalum ingots. Then, in the 1000 wafers manufactured in this way, one wafer is taken out for every 20 wafers, and a total of 50 wafers are used as evaluation test objects, and the surface roughness measurement of each wafer and TTV are performed. Calculated. Further, the horizontal axis is the position in the longitudinal direction of the fixed abrasive grain used for the slicing, and the vertical axis is the surface roughness and the value of TTV.

Figure 6(a) shows an evaluation test knot of an embodiment of the present invention. The evaluation of the variation of the TTV and the surface roughness of the wafer which is mass-produced in the present embodiment using the present invention and the conventional fixed abrasive wire saw device 1 and the first workpiece processing of the comparative example. Test results illustration. It is known from Fig. 6(a) that the present example and the comparative example produced by the first slicing process have the same TTV and surface roughness. This is because both the present embodiment and the comparative example are the first slicing process, and all of them are manufactured by slicing of a new line.

On the other hand, it was found that in the nth evaluation test, a clear difference between the TTV and the surface roughness was obtained in both the present example and the comparative example. Fig. 6(b) is a view showing the TTV and surface roughness of a wafer which is mass-produced at the time of the nth (n-series 2 or more natural number) workpiece of the comparative example using the conventional fixed abrasive wire saw device. An illustration of the evaluation test results of the change in degree. Further, Fig. 6(c) shows a wafer which is mass-produced at the time of the nth (n-system 2 or more natural number) workpiece processing of the present embodiment using the fixed abrasive wire saw device 1 of the present invention. An illustration of the evaluation test results for the variation of TTV and surface roughness.

This is also known from the figure. In the case of this comparative example, the value of TTV fluctuates greatly from the supply side to the discharge side. This is considered to be because the wafer of the comparative example was not sliced by a portion having a new line or a line close to the new line.

On the other hand, it was found that in the case of the present embodiment, both the value of TTV and the surface roughness were excellent results as in the first slicing process. It is considered that this is because at the time of the nth (n-series 2 or more natural number) slicing, since the processing is performed by the steps unique to the present invention, it is possible to go from the portion having the new line or the line close to the new line. The reason why the ingot is sliced.

From the above evaluation test results, if the steps of the slicing process of the conventional example are performed, the yield of the wafer of the final product is greatly reduced. On the other hand, if the step of the slicing process of the embodiment is performed, the yield can be obtained. The wafer obtained from the entire ingot is increased to a desired value, and it is confirmed that the production efficiency of the wafer process and the manufacturing cost can be reliably reduced.

Further, in the above-described embodiment, after the second and subsequent workpiece machining, the second reel is wound back twice the length corresponding to the usage amount used in the previous workpiece machining, The wire is supplied to the processing portion from the second reel. However, the winding length of the wire may be from 1.5 times to less than 2 times and from more than 2 times to 2.5 times. The role.

Further, in the above-described embodiment, the case where one workpiece is simultaneously sliced is described, but it is of course also applicable to the case where a plurality of workpieces are simultaneously sliced.

Further, in the above-described embodiment, a so-called multiplex type fixed abrasive wire saw device in which a plurality of wafers are simultaneously manufactured by simultaneously slicing a single workpiece with a plurality of fixed abrasive grains W and a plurality of wafers is described. (Multi-machine fixed abrasive wire saw device), but of course it can also be applied to the so-called simplex type fixed abrasive wire saw device (single-work fixed abrasive wire saw) which divides the workpiece into two by one line. Device).

Moreover, the present invention may be configured to fix the abrasive wire, the spindle roller, the take-up reel, and the winding reel in a state where the workpiece is fixed, instead of the above-described embodiment.

Further, the ingot is not limited to a material such as a crucible for a solar cell, and may be an ingot composed of a crucible for semiconductor or sapphire glass.

Further, the fixed abrasive grain line is not limited to those in which the fixed abrasive grains are fixed to the wire by electroplating, and the fixed abrasive grains may be fixed to the wire by a resin bonding agent.

S100‧‧‧New wire reel installation (to the winding side)

S101‧‧‧Rewinding the new line to the withdrawal side (usage/time+stroke)

S110‧‧‧First processing

S (100 + 10 × n) ‧ ‧ (n-1) processing

S(100+10×n)a‧‧‧Rewinding the new line to the withdrawal side ((n-1) usage × 2)

S (110 + 10 × n) ‧ ‧ nth processing

S200‧‧‧ Processing ends

Claims (3)

A fixed abrasive wire saw device is provided with a grinding blade for slicing processing on a wire for workpiece cutting, and sequentially processes a plurality of workpieces through at least two or more processing steps, thereby manufacturing a plurality of workpieces. The wafer wafer includes: a first reel which is a wire before the workpiece is wound and a second reel; and a second reel which is a wire after the workpiece is wound; and when the workpiece is processed for the first time, The first reel rolls the line corresponding to the length of the amount of use required for the first workpiece processing and the length of the stroke amount to the second reel, and then retracts the line from the second reel to the second reel. The second reel is supplied to the processing unit, whereby the first workpiece is processed, and in the second and subsequent workpiece processing, it is equivalent to 1.5 used in the last workpiece processing. After the wire having a length of 2.5 times is wound back to the second reel, the wire is supplied from the second reel to the processing portion, whereby the workpiece is processed. A wafer manufacturing method using a fixed abrasive wire saw device, wherein the wire for cutting a workpiece is provided with abrasive grains for slicing, and the plurality of processing steps are sequentially performed for at least two or more times. The workpiece is subjected to slicing, and a plurality of wafers are produced for each of the workpieces. The first step includes a first reel for winding the workpiece before processing, and a line after the workpiece is wound and processed. The second reel is attached to the wire saw device, and the second step is to use the amount of use required for the first workpiece machining from the first reel to the second reel during the first workpiece machining. length After the wire having the length added to the length of the stroke amount is wound back to the second reel, the wire is supplied from the second reel to the processing portion, thereby processing the workpiece for the first time; and the third step When the second and subsequent workpieces are processed, each time the thread corresponding to the length of 1.5 to 2.5 times the amount of use used in the previous workpiece processing is wound back to the second reel, the first The 2 reels feed the wire to the processing portion of the workpiece, whereby the workpiece is processed. A wafer manufactured by the wafer manufacturing method using the fixed abrasive wire saw device described in claim 2 of the patent application.