TW201528924A - Heat sink - Google Patents

Abstract

A heat sink includes a main body and a number of waveguides. A number of through holes is defined in the main body. Three adjacent through holes compose a regular triangle. The number of the through holes is same with the waveguides. Each waveguide is a hollow tube made of metal. The waveguides are vertical with the surface of the main body and corresponding to the through holes. The waveguides are parallel with each other. The thickness of each waveguide is equal to the distance between two adjacent waveguides.

Description

heat sink

The present invention relates to a heat sink.

Electronic components such as CPUs usually need to dissipate heat by means of a heat sink. In addition, electronic components generate a large amount of electromagnetic waves during operation, and conventional heat sinks enhance the radiation intensity and efficiency of electromagnetic waves due to capacitive coupling and antenna effects, making the system Electromagnetic interference (EMI) problems are more serious.

In view of the above, it is necessary to provide a heat sink that can shield electromagnetic waves generated by electronic components and can effectively dissipate heat from the electronic components.

A heat sink includes a body and a plurality of waveguides, wherein the body is provided with a plurality of rows of heat dissipation holes extending through the lower surface and the upper surface of the body, and the number of all the even rows of heat dissipation holes is equal, and the number of all the odd rows of heat dissipation holes is equal. The number of even rows of cooling holes is one less than the number of odd rows of cooling holes, and the center of each even row of cooling holes is equilateral triangle with the center of two adjacent adjacent cooling holes of the same odd row, and the number of the cooling holes is The number of the waveguides is the same. Each of the waveguides is a hollow tube made of a metal material. The waveguides are vertically disposed on the upper surface of the body and correspond to the heat dissipation holes. Parallel to each other, the wall thickness of the waveguide is equal to the distance between any two adjacent waveguides.

A heat sink includes a body and a plurality of waveguides, wherein the body is provided with a plurality of rows of heat dissipation holes extending through the lower surface and the upper surface of the body, and the number of all the even rows of heat dissipation holes is equal, and the number of all the odd rows of heat dissipation holes is equal. The number of even rows of louvers is one more than the number of singular rows of louvers. The center of each odd row of louvers is equilateral triangle with the center of two adjacent louvers of the same even row, and the number of vents is The number of the waveguides is the same. Each of the waveguides is a hollow tube made of a metal material. The waveguides are vertically disposed on the upper surface of the body and correspond to the heat dissipation holes. Parallel to each other, the wall thickness of the waveguide is equal to the distance between any two adjacent waveguides.

The heat sink can cover electromagnetic waves and effectively reduce the heat generated by the electronic components. At the same time, when the fan on the motherboard works, the wind flow of the fan can dissipate heat from the fan cooling zone between the same row of waveguides.

1 is a schematic illustration of a first direction of a preferred embodiment of a heat sink of the present invention.

2 is a schematic illustration of a second direction of a preferred embodiment of the heat sink of the present invention.

Figure 3 is a cross-sectional view along the III-III direction of a preferred embodiment of the heat sink of the present invention.

Fig. 4 is a graph showing the attenuation rate of electromagnetic waves of different frequencies after passing through a heat sink.

Referring to FIG. 1 and FIG. 2, the heat sink of the present invention includes a body 10 and a plurality of waveguides 20. The heat sink is configured to dissipate an electronic component disposed on the motherboard and suppress electromagnetic waves generated by the electronic component.

Referring to FIG. 3 , the body 10 has a rectangular shape. The body 10 is provided with a plurality of rows of heat dissipation holes 14 , and each of the heat dissipation holes 14 extends through the lower surface 12 and the upper surface 11 of the body 10 . The number of all even rows of louvers 14 is equal, and the number of all odd rows of louvers 14 is equal. The number of even rows of louvers 14 is one less than the number of odd rows of louvers 14, and the center of each even row of louvers 14 is equilateral triangle with the center of two adjacent adjacent louvers 14 of the same odd row. In the present embodiment, the distance l between the centers of any two adjacent heat dissipation holes 14 is 6 mm. The number of the heat dissipation holes 14 is the same as the number of the waveguides 20.

In other embodiments, the number of the odd-row heat dissipation holes 14 is one less than the number of the even-numbered heat dissipation holes 14, and the center of each of the odd-numbered heat dissipation holes 14 is adjacent to the adjacent two even-numbered heat dissipation holes 14 of the same even row. The center is an equilateral triangle.

Referring to FIG. 3 together, the body 10 has a rectangular shape, and a plurality of heat dissipation holes 14 are disposed on the body 10 and penetrate the lower surface 12 and the upper surface 11 of the body 10. The center of each of the heat dissipation holes 14 is an equilateral triangle with the center of any two adjacent heat dissipation holes 14 in the periphery. In the present embodiment, the distance l between the centers of any two adjacent heat dissipation holes 14 is 6 mm. The number of the heat dissipation holes 14 is the same as the number of the waveguides 20.

Each of the waveguides 20 is a hollow tube body made of a metal material. Each of the waveguides 20 is vertically disposed on the upper surface 11 of the body 10 and is in one-to-one correspondence with the heat dissipation holes 14 . The diameter h is the same as the diameter of the heat dissipation hole 14. In the present embodiment, the inner diameter h of the waveguide 20 is 3 mm. The waveguides 20 are parallel to each other. The wall thickness m of each waveguide 20 is equal to the distance n between any two adjacent waveguides 20, that is, the wall thickness m of each waveguide 20 is between the centers of the two adjacent heat dissipation holes 14. The difference between the distance l and the diameter h of the heat dissipation hole 14 is further divided by 3, that is, m = (lh)) / 3 = (6 - 3) / 3 = 1 mm. One end of the waveguide 20 in contact with the body 10 is open, and the other end of the waveguide 20 is sealed. The body 10 and the waveguide 20 are integrally formed.

When installed and used, the heat sink is placed above the electronic component. When the fan on the motherboard works, the wind flow X of the fan can better dissipate the fan cooling dead zone Y between the same row of waveguides 20. Referring to FIG. 4, the electromagnetic wave having a frequency less than 8 Hz has an attenuation rate of less than -30 dB after passing through the heat sink, and has a good ability to cover electromagnetic waves, and can effectively reduce the heat generated by the electronic component.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent application.

10‧‧‧ Ontology

20‧‧‧waveguide

11‧‧‧ upper surface

12‧‧‧ Lower surface

14‧‧‧ vents

X‧‧‧ Merry

Y‧‧‧heat dead zone

no

10‧‧‧ Ontology

20‧‧‧waveguide

11‧‧‧ upper surface

Claims (8)

A heat sink includes a body and a plurality of waveguides, wherein the body is provided with a plurality of rows of heat dissipation holes extending through the lower surface and the upper surface of the body, and the number of all the even rows of heat dissipation holes is equal, and the number of all the odd rows of heat dissipation holes is equal. The number of even rows of cooling holes is one less than the number of odd rows of cooling holes, and the center of each even row of cooling holes is equilateral triangle with the center of two adjacent adjacent cooling holes of the same odd row, and the number of the cooling holes is The number of the waveguides is the same. Each of the waveguides is a hollow tube made of a metal material. The waveguides are vertically disposed on the upper surface of the body and correspond to the heat dissipation holes. Parallel to each other, the wall thickness of the waveguide is equal to the distance between any two adjacent waveguides. The heat sink of claim 1, wherein one end of the waveguide in contact with the body is open, and the other end of the waveguide is sealed. The heat sink of claim 1, wherein the body and the waveguide are integrally formed. The heat sink of claim 1, wherein the waveguide has an inner diameter of 5 mm. A heat sink includes a body and a plurality of waveguides, wherein the body is provided with a plurality of rows of heat dissipation holes extending through the lower surface and the upper surface of the body, and the number of all the even rows of heat dissipation holes is equal, and the number of all the odd rows of heat dissipation holes is equal. The number of even rows of louvers is one more than the number of singular rows of louvers. The center of each odd row of louvers is equilateral triangle with the center of two adjacent louvers of the same even row, and the number of vents is The number of the waveguides is the same. Each of the waveguides is a hollow tube made of a metal material. The waveguides are vertically disposed on the upper surface of the body and correspond to the heat dissipation holes. Parallel to each other, the wall thickness of the waveguide is equal to the distance between any two adjacent waveguides. The heat sink of claim 5, wherein one end of the waveguide in contact with the body is open, and the other end of the waveguide is sealed. The heat sink of claim 5, wherein the body and the waveguide are integrally formed. The heat sink of claim 5, wherein the waveguide has an inner diameter of 5 mm.