TW201526572A - Heating system in electronic device - Google Patents

Heating system in electronic device Download PDF

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TW201526572A
TW201526572A TW102147798A TW102147798A TW201526572A TW 201526572 A TW201526572 A TW 201526572A TW 102147798 A TW102147798 A TW 102147798A TW 102147798 A TW102147798 A TW 102147798A TW 201526572 A TW201526572 A TW 201526572A
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heating
module
control signal
voltage
control
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TW102147798A
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Chinese (zh)
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TWI521917B (en
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guang-li Li
Gao-Yi Hu
Hua Lin
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Wistron Neweb Corp
Webcom Comm Kunshan Corp
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Abstract

A heating system in an electronic device is utilized for increasing an environment temperature inside the electronic device. The heating system includes a sensing module for sensing the environment temperature to generate an environment temperature value; a comparison module, coupled with the sensing module, for generating a first control signal and a second control signal according to the environment temperature value; an operation module, coupled with the comparison module, for converting a power voltage to output a heating voltage and adjusting the heating voltage according to the second control signal; a heating module, coupled with the comparison module and the operation module, for deciding whether to utilize the heating voltage to perform heating according to the first control signal for increasing the environment temperature.

Description

用於電子裝置之加熱系統 Heating system for electronic devices

本發明係關於一種用於電子裝置之加熱系統,尤指一種可在不超過特定功耗下,彈性地執行加熱以提高電子裝置內部環境溫度之加熱系統。 The present invention relates to a heating system for an electronic device, and more particularly to a heating system that can elastically perform heating to increase the ambient temperature inside the electronic device without exceeding a specific power consumption.

一般來說,透過乙太網路來傳輸資料信號之電子裝置如網路橋接器(Access Point)、網路電話機或網路攝影機等,其另需連接電源線來獲取運作所需之電源才能正常運作。因此,為了解決電子裝置需外接電源線及增置相對應之外部電源轉換器等極不便利之問題,在原有乙太網路之傳輸標準IEEE 802.3的基礎上另增加了可在乙太網路線上傳輸電源之相關標準,即IEEE 802.3af或IEEE 802.3at標準,以實現乙太網供電(Power Over Ethernet,POE)之技術。根據IEEE 802.3af或IEEE 802.3at之標準,一個完整的乙太網供電系統包括供電端設備(Power Sourcing Equipment,PSE)和受電端設備(Powered Device,PD)兩部分。供電端設備用來供電給受電端設備是整個乙太網供電過程的管理者,受電端設備透過乙太網路線之RJ45插座便可以獲取供電端設備所提供之電力。在此情形下,網路橋接器、網路電話機或網路攝影機等電子裝置可視為乙太網供電系統上之受電端設備,其透過乙太網路來獲取電源並在乙太網路上執行傳輸資料信號或收發射無線訊號等相關運作。 In general, an electronic device that transmits data signals via an Ethernet network, such as an access point, a VoIP phone, or a network camera, needs to be connected to a power cord to obtain the power required for operation. Operation. Therefore, in order to solve the problem that the electronic device needs to be connected to the power line and the corresponding external power converter is extremely inconvenient, the transmission standard of the original Ethernet network IEEE 802.3 is added to the route of the Ethernet network. The related standard for transmission power, namely IEEE 802.3af or IEEE 802.3at standard, to implement the technology of Power Over Ethernet (POE). According to the standards of IEEE 802.3af or IEEE 802.3at, a complete Ethernet power supply system includes two parts: Power Sourcing Equipment (PSE) and Powered Device (PD). The power supply device is used to supply power to the power receiving device, which is the administrator of the entire Ethernet network power supply process. The power receiving device can obtain the power provided by the power supply terminal device through the RJ45 socket of the Ethernet network route. In this case, an electronic device such as a network bridge, a VoIP phone, or a network camera can be regarded as a power receiving device on the Ethernet power supply system, which obtains power through the Ethernet network and performs transmission on the Ethernet network. Related operations such as data signals or radio signals.

另一方面,IEEE 802.3af及IEEE 802.3at標準中亦規定了在乙太網路上可傳輸電源之最大功率,如IEEE 802.3at標準定義供電端設備所能提供的最大功率為25.5瓦特,故當電子裝置為乙太網供電系統上之受電端設備時,電子裝置透過乙太網路所能獲取之電源將不會超過IEEE 802.3af或IEEE 802.3at標準所規定之最大功率(如25.5瓦特)。 On the other hand, the IEEE 802.3af and IEEE 802.3at standards also specify the maximum power that can be transmitted on the Ethernet. For example, the IEEE 802.3at standard defines that the maximum power that the power supply device can provide is 25.5 watts. When the device is a powered device on the Ethernet power supply system, the power that the electronic device can obtain through the Ethernet will not exceed IEEE 802.3af or IEEE. The maximum power (eg 25.5 watts) specified by the 802.3at standard.

藉此,當電子裝置為如室外型之網路橋接器而使用在極端低溫之室外環境時,由於電子裝置中電子元件皆有規定其可正常工作之最低工作溫度,如通用之電子元件所規定之最低工作溫度為攝氏負40度,因此當電子裝置在低於攝氏負40度之情況下運作時,為了確保電子裝置能正常運作,習知技術會在電子裝置內部設置加熱模組來執行加熱,以將電子裝置內部之溫度提高至所規定之最低工作溫度以上,讓電子裝置內部之電子元件可正常運作。在此情形下,由於習知技術之電子裝置需同時啟動加熱模組來執行加熱,以及啟動主要運作電路來執行傳輸資料信號或收發射無線訊號等運作,因此習知電子裝置之整體功耗往往就會超過電子裝置透過乙太網路所能獲取之最大功耗,進而造成電子裝置無法正常運作。 Therefore, when the electronic device is used in an outdoor environment with an extremely low temperature, such as an outdoor type network bridge, since the electronic components in the electronic device have a minimum operating temperature that can be normally operated, as stipulated by general electronic components. The minimum operating temperature is minus 40 degrees Celsius, so when the electronic device operates below 40 degrees Celsius, in order to ensure the normal operation of the electronic device, the conventional technology will provide a heating module inside the electronic device to perform heating. In order to increase the temperature inside the electronic device to a predetermined minimum operating temperature, the electronic components inside the electronic device can operate normally. In this case, since the electronic device of the prior art needs to simultaneously activate the heating module to perform heating, and activate the main operating circuit to perform operations such as transmitting data signals or transmitting and transmitting wireless signals, the overall power consumption of the conventional electronic device is often It will exceed the maximum power consumption that the electronic device can obtain through the Ethernet, which will cause the electronic device to malfunction.

因此,當電子裝置使用在極端低溫且需透過乙太網路來獲取電源時,如何在不超過乙太網路上所能提供之功耗下,妥善地控制加熱模組執行加熱來提高電子裝置內部之環境溫度,以讓電子裝置能正常運作,已成為業界努力的目標之一。 Therefore, when the electronic device is used at an extremely low temperature and needs to be powered by the Ethernet, how to properly control the heating module to perform heating to improve the internals of the electronic device without exceeding the power consumption provided by the Ethernet. The ambient temperature, in order for the electronic device to function properly, has become one of the goals of the industry.

因此,本發明提供一種用於電子裝置之加熱系統,其可在不超過所要求之功耗下,彈性地執行加熱以提高電子裝置內部環境溫度。 Accordingly, the present invention provides a heating system for an electronic device that can elastically perform heating to increase an internal ambient temperature of the electronic device without exceeding a required power consumption.

本發明揭露一種用於一電子裝置之加熱系統,用來提高該電子裝置內部之一環境溫度,該加熱系統包含有一感測模組,用來感測該環境溫度,以產生一環境溫度值;一比較模組,耦接於該感測模組,用來根據該環境溫度值,產生一第一控制訊號及一第二控制訊號;一運作模組,耦接於該比較模組,用來轉換一電源電壓以輸出一加熱電壓,並根據該第二控制訊號,調整所輸出之該加熱電壓的大小;以及一加熱模組,耦接於該比較模組及該運作模組,用來根據該第一控制訊號,決定是否使用該加熱電壓來執行加熱,以提高該環境溫度。 The invention discloses a heating system for an electronic device for improving an ambient temperature inside the electronic device, the heating system comprising a sensing module for sensing the ambient temperature to generate an ambient temperature value; a comparison module is coupled to the sensing module for generating a first control signal and a second control signal according to the ambient temperature value; and an operation module coupled to the comparison module for Converting a power supply voltage to output a heating voltage, and adjusting the magnitude of the outputted heating voltage according to the second control signal; and a heating module coupled to the comparison module and the operation module for The first control signal determines whether the heating voltage is used to perform heating to increase the ambient temperature.

10‧‧‧電子裝置 10‧‧‧Electronic devices

100‧‧‧加熱系統 100‧‧‧ heating system

110‧‧‧主要運作電路 110‧‧‧Main operating circuit

120‧‧‧感測模組 120‧‧‧Sensor module

122‧‧‧比較模組 122‧‧‧Comparative Module

124‧‧‧加熱模組 124‧‧‧heating module

126‧‧‧運作模組 126‧‧‧Operating module

128‧‧‧處理模組 128‧‧‧Processing module

130‧‧‧控制模組 130‧‧‧Control Module

132‧‧‧處理器 132‧‧‧ processor

134‧‧‧儲存裝置 134‧‧‧Storage device

TEMP‧‧‧環境溫度值 TEMP‧‧‧ ambient temperature value

CON1‧‧‧第一控制訊號 CON1‧‧‧ first control signal

CON2‧‧‧第二控制訊號 CON2‧‧‧second control signal

Vin‧‧‧電源電壓 Vin‧‧‧Power supply voltage

VH‧‧‧加熱電壓 VH‧‧‧ heating voltage

VT‧‧‧環境電壓 VT‧‧‧ ambient voltage

V1~V2‧‧‧輸入電壓 V1~V2‧‧‧ input voltage

CP1~CP2‧‧‧比較器 CP1~CP2‧‧‧ Comparator

R1~R10‧‧‧電阻 R1~R10‧‧‧ resistance

Q1~Q3‧‧‧電晶體 Q1~Q3‧‧‧Optoelectronics

200‧‧‧直流電源轉換器 200‧‧‧DC power converter

202‧‧‧加熱器 202‧‧‧heater

210‧‧‧輸入端 210‧‧‧ input

212‧‧‧輸出端 212‧‧‧output

214‧‧‧回授端 214‧‧‧reporting end

Vfb‧‧‧參考電壓 Vfb‧‧‧reference voltage

Ifb‧‧‧輸入電流 Ifb‧‧‧ input current

RST‧‧‧重置訊號 RST‧‧‧Reset signal

第1圖為本發明實施例一電子裝置之示意圖。 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention.

第2圖為第1圖之電子裝置中一加熱系統之一實施例的示意圖。 Fig. 2 is a schematic view showing an embodiment of a heating system in the electronic device of Fig. 1.

第3圖為第2圖之加熱系統中一加熱電壓相對於時間之關係圖。 Figure 3 is a graph of heating voltage versus time in the heating system of Figure 2.

請參考第1圖,第1圖為本發明實施例一電子裝置10之示意圖。如第1圖所示,電子裝置10包含有一加熱系統100及一主要運作電路110。電子裝置10係如網路橋接器(Access Point)、網路電話機或網路攝影機等,可根據IEEE 802.3af或IEEE 802.3at之標準,透過所連接乙太網路線之RJ45插座來獲取運作所需之電源,以在乙太網路上傳輸資料信號。主要運作電路110用來執行電子裝置10之主要運作,如傳輸信號、網路轉接、無線分享或網路傳輸等等,其可利用單一特殊應用積體電路(application-specific integrated circuit,ASIC)來實現或由多個電路模組合而成等。 Please refer to FIG. 1 , which is a schematic diagram of an electronic device 10 according to an embodiment of the present invention. As shown in FIG. 1, the electronic device 10 includes a heating system 100 and a main operating circuit 110. The electronic device 10 is connected to an Access Point, a VoIP phone or a network camera, and can be operated according to the IEEE 802.3af or IEEE 802.3at standard through the RJ45 socket of the connected Ethernet route. The power source to transmit data signals on the Ethernet. The main operational circuit 110 is used to perform the main operations of the electronic device 10, such as transmission signals, network switching, wireless sharing or network transmission, etc., which can utilize a single application-specific integrated circuit (ASIC). To achieve or be combined by multiple circuit modules.

加熱系統100包含有一感測模組120、一比較模組122、一加熱模組124及一運作模組126。由於電子裝置10中所有電子元件皆需在所規定之最低工作溫度(如攝氏負40度)以上才可正常運作,因此當電子裝置10使用在極端低溫之環境時,加熱系統100感測電子裝置10內部之環境溫度後並判斷是否過低,以決定是否執行加熱來提高電子裝置10內部之環境溫度,使電子裝置10可正常運作。此外,加熱系統100進一步地根據所感測到之環境溫度來判斷欲執行加熱之程度,以決定是否提高或降低加熱所需之功耗,使電子裝置10可在不超過在乙太網路所能獲取之最大功率下(如IEEE 802.3at標準所規範之最大功率為25.5瓦特),妥善地讓加熱系統100與主要運作電路110同時運作,進而使電子裝置10之環境溫度獲得提高下,也不致於因整體功耗過大而影響電子裝置10之運作。 The heating system 100 includes a sensing module 120, a comparison module 122, a heating module 124, and an operation module 126. Since all the electronic components in the electronic device 10 need to operate normally above the specified minimum operating temperature (eg, minus 40 degrees Celsius), the heating system 100 senses the electronic device when the electronic device 10 is used in an extremely low temperature environment. After the internal ambient temperature of 10, it is judged whether it is too low to determine whether to perform heating to increase the ambient temperature inside the electronic device 10, so that the electronic device 10 can operate normally. In addition, the heating system 100 further determines the degree of heating to be performed according to the sensed ambient temperature to determine whether to increase or decrease the power consumption required for heating, so that the electronic device 10 can not exceed the capacity of the Ethernet. At the maximum power obtained (such as the maximum power of 25.5 watts as specified by the IEEE 802.3at standard), the heating system 100 is properly operated simultaneously with the main operating circuit 110, thereby improving the ambient temperature of the electronic device 10, and not The operation of the electronic device 10 is affected by the excessive power consumption.

詳細來說,感測模組120具有溫度感測器可感測電子裝置10內部 之環境溫度,以產生環境溫度值TEMP,並輸出至耦接之比較模組122。其中,溫度感測器可為具有熱電偶、熱敏電阻器或其他金屬材料元件之溫度感測器等,視實際成本需求可加以變化並不受限。另外,感測模組120較佳地可設置於電子裝置10中主要運作電路110之附近,以能更準確地感測到主要運作電路110運作時之溫度。 In detail, the sensing module 120 has a temperature sensor that can sense the interior of the electronic device 10 The ambient temperature is generated to generate an ambient temperature value TEMP and output to the coupled comparison module 122. The temperature sensor can be a temperature sensor having a thermocouple, a thermistor or other metal material components, and can be changed according to actual cost requirements without limitation. In addition, the sensing module 120 is preferably disposed in the vicinity of the main operating circuit 110 of the electronic device 10 to more accurately sense the temperature of the main operating circuit 110 during operation.

接著,比較模組122將環境溫度值TEMP與預定之一溫度上限值VAL1相比較,以獲得環境溫度值TEMP是否大於溫度上限值VAL1,並產生一第一控制訊號CON1來控制加熱模組124是否執行加熱。其中,比較模組122可利用比較器結合分壓電阻來比較相對應於環境溫度值TEMP與溫度上限值VAL1之電壓大小,亦或者也可利用多個電晶體與電阻之結合電路來實現等,並不受限。 Next, the comparison module 122 compares the ambient temperature value TEMP with a predetermined temperature upper limit value VAL1 to obtain whether the ambient temperature value TEMP is greater than the temperature upper limit value VAL1, and generates a first control signal CON1 to control the heating module. 124 Whether to perform heating. The comparison module 122 can use the comparator to combine the voltage dividing resistor to compare the voltage corresponding to the ambient temperature value TEMP and the temperature upper limit value VAL1, or can also use a combination of a plurality of transistors and resistors to achieve the same. , not limited.

具體而言,可將溫度上限值VAL1適當地設定為電子裝置10可安全運作之正常溫度值,故溫度上限值VAL1將大於電子元件所規定之最低工作溫度值(如攝氏負40度)。當電子裝置10使用在極端低溫之環境時(如低於攝氏負40度),一開始環境溫度值TEMP會低於溫度上限值VAL1,故比較模組122對環境溫度值TEMP與溫度上限值VAL1進行比較後,可獲得環境溫度值TEMP未大於溫度上限值VAL1,並產生第一控制訊號CON1控制加熱模組124執行加熱。 Specifically, the temperature upper limit value VAL1 can be appropriately set to a normal temperature value that the electronic device 10 can safely operate, so the temperature upper limit value VAL1 will be greater than the minimum operating temperature value specified by the electronic component (eg, 40 degrees Celsius minus). . When the electronic device 10 is used in an extremely low temperature environment (for example, minus 40 degrees Celsius), the initial ambient temperature value TEMP is lower than the upper temperature limit value VAL1, so the comparison module 122 measures the ambient temperature value TEMP and the upper temperature limit. After the comparison of the value VAL1, the ambient temperature value TEMP is not greater than the temperature upper limit value VAL1, and the first control signal CON1 is generated to control the heating module 124 to perform heating.

加熱模組124耦接於比較模組122及運作模組126,其為電阻式之加熱器或陶瓷式之加熱器等。當加熱模組124接收到第一控制訊號CON1指示需執行加熱時,加熱模組124會啟動加熱器並透過運作模組126所輸出之加熱電壓VH來進行加熱,以提高環境溫度值TEMP。接著,環境溫度值TEMP會一直提高直到比較模組122進行比較而獲得環境溫度值TEMP大於溫度上限值VAL1後,比較模組122會產生第一控制訊號CON1控制加熱模組124不再執行加熱。最後,加熱模組124接收到第一控制訊號CON1指示不需執行加熱下,加熱模組124便會關閉加熱器而不進行加熱。 The heating module 124 is coupled to the comparison module 122 and the operation module 126, and is a resistance heater or a ceramic heater. When the heating module 124 receives the first control signal CON1 to indicate that heating needs to be performed, the heating module 124 activates the heater and heats it through the heating voltage VH outputted by the operating module 126 to increase the ambient temperature value TEMP. Then, the ambient temperature value TEMP is increased until the comparison module 122 compares to obtain the ambient temperature value TEMP greater than the temperature upper limit value VAL1. The comparison module 122 generates the first control signal CON1 to control the heating module 124 to no longer perform heating. . Finally, when the heating module 124 receives the first control signal CON1 indicating that heating is not required, the heating module 124 turns off the heater without heating.

值得注意地,比較模組122另也可當環境溫度值TEMP小於溫度上限值VAL1時,產生第一控制訊號CON1控制加熱模組124執行加熱,而當環境溫度值TEMP大於溫度上限值VAL1再加上一設定值後,才產生第一控制訊號CON1控制加熱模組124不再執行加熱。或者,當環境溫度值TEMP大於溫度上限值VAL1時,比較模組122除產生第一控制訊號CON1控制加熱模組124執行加熱外,比較模組122同時可透過第一控制訊號CON1調高溫度上限值VAL1,使得環境溫度值TEMP需小於調高之溫度上限值VAL1後,比較模組122才產生第一控制訊號CON1控制加熱模組124不再執行加熱。藉以避免由於環境溫度值TEMP之小幅變動而造成第一控制訊號CON1反覆地改變,進而反覆地控制加熱模組124執行與不執行加熱。 Notably, the comparison module 122 can also generate the first control signal CON1 to control the heating module 124 to perform heating when the ambient temperature value TEMP is less than the temperature upper limit value VAL1, and when the ambient temperature value TEMP is greater than the temperature upper limit value VAL1 After a set value is added, the first control signal CON1 is generated to control the heating module 124 to no longer perform heating. Alternatively, when the ambient temperature value TEMP is greater than the temperature upper limit value VAL1, the comparison module 122 controls the heating module 124 to perform heating in addition to the first control signal CON1, and the comparison module 122 can simultaneously increase the temperature through the first control signal CON1. After the upper limit value VAL1 is such that the ambient temperature value TEMP needs to be less than the temperature upper limit value VAL1, the comparison module 122 generates the first control signal CON1 to control the heating module 124 to no longer perform heating. The first control signal CON1 is repeatedly changed due to a small change of the ambient temperature value TEMP, and the heating module 124 is repeatedly controlled to perform and not perform heating.

也就是說,設定溫度上限值VAL1為可安全運作之正常溫度值下,當環境溫度值TEMP低於溫度上限值VAL1時,透過比較模組122之比較可產生第一控制訊號CON1來控制加熱模組124執行加熱,而環境溫度值TEMP提高到大於溫度上限值VAL1時,透過比較模組122之比較產生第一控制訊號CON1控制加熱模組124不再執行加熱。藉此,電子裝置10可讓內部之環境溫度值TEMP穩定地接近可安全運作之正常溫度值而大於所規定之最低工作溫度值,以讓電子裝置10不會因加熱模組124過度加熱而造成電子裝置10內部之環境溫度過高而損壞。 That is to say, when the set temperature upper limit value VAL1 is a normal temperature value that can be safely operated, when the ambient temperature value TEMP is lower than the temperature upper limit value VAL1, the comparison of the comparison module 122 can generate the first control signal CON1 to control The heating module 124 performs heating, and when the ambient temperature value TEMP is increased to be greater than the temperature upper limit value VAL1, the first control signal CON1 is generated by the comparison of the comparison module 122 to control the heating module 124 to no longer perform heating. Thereby, the electronic device 10 can make the internal ambient temperature value TEMP stably approach the normal temperature value of the safe operation and be greater than the specified minimum operating temperature value, so that the electronic device 10 is not caused by the excessive heating of the heating module 124. The ambient temperature inside the electronic device 10 is too high and is damaged.

此外,比較模組122另可將環境溫度值TEMP與預定之一調整設定值VAL2進行比較,以獲得環境溫度值TEMP是否大於調整設定值VAL2之資訊,並產生一第二控制訊號CON2來控制運作模組126是否調整輸出至加熱模組124之加熱電壓VH的大小。當電子裝置10使用在極端低溫(如低於攝氏負40度)時,一開始環境溫度值TEMP會低於調整設定值VAL2,較佳地可將調整設定值VAL2設定為略大於電子裝置10中電子元件所規定之最低工作溫度值(如攝氏負40度),使比較模組122對環境溫度值TEMP與調整設定值VAL2進行比較後,產生顯示環境溫度值TEMP未大於調整設定值 VAL2之第二控制訊號CON2至運作模組126。 In addition, the comparison module 122 can further compare the ambient temperature value TEMP with a predetermined one of the adjusted set values VAL2 to obtain information about whether the ambient temperature value TEMP is greater than the adjusted set value VAL2, and generate a second control signal CON2 to control the operation. Whether the module 126 adjusts the magnitude of the heating voltage VH output to the heating module 124. When the electronic device 10 is used at an extremely low temperature (for example, minus 40 degrees Celsius), the initial ambient temperature value TEMP may be lower than the adjustment set value VAL2, and the adjustment set value VAL2 may preferably be set to be slightly larger than the electronic device 10. The minimum operating temperature value (such as minus 40 degrees Celsius) specified by the electronic component causes the comparison module 122 to compare the ambient temperature value TEMP with the adjusted set value VAL2 to generate a display ambient temperature value TEMP that is not greater than the adjusted set value. The second control signal CON2 of VAL2 is to the operation module 126.

運作模組126包含有一處理模組128及一控制模組130。處理模組128耦接於比較模組122並可由一處理器132與一儲存裝置134組成,其中儲存裝置134儲存有程式碼來指示處理器執行運作。當處理模組128接收到顯示為環境溫度值TEMP未大於調整設定值VAL2之第二控制訊號CON2時,表示環境溫度值TEMP可能低於所規定之最低工作溫度值而電子元件還不能正常運作,此時處理模組128會重置處理器132使處理器132不執行運作,處理器132在被重置下會同時產生顯示為提高之一第三控制訊號CON3至控制模組130,以指示控制模組130提高加熱電壓VH之大小。 The operation module 126 includes a processing module 128 and a control module 130. The processing module 128 is coupled to the comparison module 122 and can be composed of a processor 132 and a storage device 134. The storage device 134 stores a code to instruct the processor to perform operations. When the processing module 128 receives the second control signal CON2 that is displayed as the ambient temperature value TEMP is not greater than the adjustment set value VAL2, it indicates that the ambient temperature value TEMP may be lower than the specified minimum operating temperature value and the electronic component is still not functioning properly. At this time, the processing module 128 resets the processor 132 to prevent the processor 132 from performing the operation, and the processor 132, when reset, simultaneously generates a display to increase the third control signal CON3 to the control module 130 to indicate the control. The module 130 increases the magnitude of the heating voltage VH.

控制模組130耦接於處理模組128,其包含有電源轉換器,可轉換一電源電壓Vin為加熱電壓VH。其中,電源轉換器可為線性之直流電源轉換器或切換式之直流電源轉換器等,並不受限。當控制模組130接收到顯示為提高之第三控制訊號CON3時,控制模組130控制內部之電源轉換器將加熱電壓VH提高,以使環境溫度值TEMP可較快速地增加。接著,當環境溫度值TEMP一直提高到大於調整設定值VAL2時,經比較模組122比較後產生顯示環境溫度值TEMP大於調整設定值VAL2之第二控制訊號CON2至運作模組126。 The control module 130 is coupled to the processing module 128 and includes a power converter that converts a power supply voltage Vin to a heating voltage VH. Among them, the power converter can be a linear DC power converter or a switched DC power converter, etc., without limitation. When the control module 130 receives the third control signal CON3 displayed as an increase, the control module 130 controls the internal power converter to increase the heating voltage VH so that the ambient temperature value TEMP can be increased relatively quickly. Then, when the ambient temperature value TEMP is increased to be greater than the adjustment set value VAL2, the comparison module 122 compares to generate the second control signal CON2 whose display ambient temperature value TEMP is greater than the adjustment set value VAL2 to the operation module 126.

處理模組128接收到顯示為環境溫度值TEMP大於調整設定值VAL2之第二控制訊號CON2後,此時處理模組128會取消重置處理器132以使處理器132可開始根據程式碼之指示來執行運作,並產生顯示為降低之第三控制訊號CON3至控制模組130,以指示控制模組130降低加熱電壓VH之大小。需注意的是,當處理器132開始執行運作時,處理器132另也可根據程式碼之指示,透過內部計數器延遲一設定時間後,再產生顯示為降低之第三控制訊號CON3,藉以適當地調整控制模組130由提高加熱電壓VH切換至降低加熱電壓VH之時間,以避免加熱模組124因加熱不及使環境溫度值TEMP又小於調整設定值VAL2,而造成處理模組128又需馬上透過第三 控制訊號CON3指示控制模組130切換為提高加熱電壓VH。 After the processing module 128 receives the second control signal CON2 that is displayed as the ambient temperature value TEMP is greater than the adjustment set value VAL2, the processing module 128 cancels the reset processor 132 to enable the processor 132 to start according to the code indication. The operation is performed, and the third control signal CON3 shown as being reduced is generated to the control module 130 to instruct the control module 130 to reduce the magnitude of the heating voltage VH. It should be noted that when the processor 132 starts to perform the operation, the processor 132 may further delay the set time by the internal counter according to the instruction of the code, and then generate the third control signal CON3 displayed as the lowering, thereby appropriately The adjustment control module 130 switches from the heating voltage VH to the lowering of the heating voltage VH to prevent the heating module 124 from being heated and the ambient temperature value TEMP is smaller than the adjustment setting value VAL2, so that the processing module 128 needs to pass through immediately. third The control signal CON3 instructs the control module 130 to switch to increase the heating voltage VH.

換句話說,設定調整設定值VAL2為略大於電子元件所規定之最低工作溫度值(如攝氏負40度)下,當環境溫度值TEMP未大於調整設定值VAL2時,電子裝置10透過比較模組122之比較產生第二控制訊號CON2來控制處理模組128重置處理器132。在此情形下,由於此時電子裝置10中主要運作電路110同樣也如處理器132會被重置而不執行運作,因此,電子裝置10透過第三控制訊號CON3來指示控制模組130提高加熱電壓VH之大小,使電子裝置10在乙太網路所能獲取之最大功率可全提供給加熱模組124來執行加熱,以提升加熱速度。 In other words, when the set adjustment value VAL2 is slightly larger than the minimum operating temperature value (such as minus 40 degrees Celsius) specified by the electronic component, when the ambient temperature value TEMP is not greater than the adjustment set value VAL2, the electronic device 10 transmits the comparison module. The comparison of 122 generates a second control signal CON2 to control the processing module 128 to reset the processor 132. In this case, since the main operating circuit 110 in the electronic device 10 is also reset as the processor 132 is not operated, the electronic device 10 instructs the control module 130 to increase the heating through the third control signal CON3. The magnitude of the voltage VH allows the maximum power that the electronic device 10 can obtain at the Ethernet to be supplied to the heating module 124 to perform heating to increase the heating rate.

另一方面,當加熱模組124執行加熱而使得環境溫度值TEMP大於調整設定值VAL2後,電子裝置10透過比較模組122之比較產生第二控制訊號CON2來控制處理模組128取消重置處理器132,此時處理器132會開始執行運作且主要運作電路110也會同步運作。在此情形下,為了避免因加熱模組124執行加熱且主要運作電路110同時也需運作之下,使電子裝置10之整體功耗超過在乙太網路所能獲取之最大功率,電子裝置10透過第三控制訊號CON3來指示控制模組130降低加熱電壓VH之大小。藉此,電子裝置10在乙太網路所能獲取之最大功率可一部分提供給加熱模組124加熱,而另一部分提供給主要運作電路110來運作,使得電子裝置10可彈性地執行加熱,以在不超過所要求之功耗下,仍可同時提高電子裝置10內部之環境溫度與執行運作。 On the other hand, when the heating module 124 performs heating such that the ambient temperature value TEMP is greater than the adjustment set value VAL2, the electronic device 10 generates the second control signal CON2 through the comparison of the comparison module 122 to control the processing module 128 to cancel the reset processing. The processor 132 will start to perform the operation and the main operating circuit 110 will also operate synchronously. In this case, in order to avoid that the heating module 124 performs heating and the main operating circuit 110 also needs to operate, the overall power consumption of the electronic device 10 exceeds the maximum power that can be obtained at the Ethernet, and the electronic device 10 The control module 130 is instructed to reduce the magnitude of the heating voltage VH through the third control signal CON3. Thereby, the maximum power that the electronic device 10 can obtain at the Ethernet can be partially supplied to the heating module 124 for heating, and the other portion is provided to the main operating circuit 110 for operation, so that the electronic device 10 can elastically perform heating. The ambient temperature and execution of the internals of the electronic device 10 can be simultaneously improved without exceeding the required power consumption.

值得注意地,比較模組122另也可當環境溫度值TEMP小於調整設定值VAL2時,產生第二控制訊號CON2控制處理模組128重置處理器132,而當環境溫度值TEMP大於調整設定值VAL2再加上一設定值後,才產生第二控制訊號CON2控制處理模組128取消重置處理器132。或者,當環境溫度值TEMP大於調整設定值VAL2時,比較模組122除產生第二控制訊號CON2控制控制處理模組128取消重置處理器132外,比較模組122同時 可透過第二控制訊號CON2調高調整設定值VAL2,使得環境溫度值TEMP需小於調高之調整設定值VAL2後,比較模組122才產生第二控制訊號CON2控制處理模組128重置處理器132。藉以避免由於環境溫度值TEMP之小幅變動而造成第二控制訊號CON2反覆地改變,進而反覆地控制處理模組128重置與不重置處理器132。 Notably, the comparison module 122 can also generate the second control signal CON2 to control the processing module 128 to reset the processor 132 when the ambient temperature value TEMP is less than the adjustment set value VAL2, and when the ambient temperature value TEMP is greater than the adjustment setting value. After the VAL2 is added with a set value, the second control signal CON2 is generated to control the processing module 128 to cancel the reset processor 132. Alternatively, when the ambient temperature value TEMP is greater than the adjustment set value VAL2, the comparison module 122 generates the second control signal CON2, and the control control module 128 cancels the reset processor 132, and the comparison module 122 simultaneously The adjustment setting value VAL2 can be adjusted by the second control signal CON2, so that the ambient temperature value TEMP needs to be smaller than the adjustment setting value VAL2 of the adjustment, the comparison module 122 generates the second control signal CON2, and the processing module 128 resets the processor. 132. The second control signal CON2 is repeatedly changed due to a small change of the ambient temperature value TEMP, and the control module 128 is repeatedly controlled to reset and not reset the processor 132.

簡單來說,加熱系統100利用比較模組122對環境溫度值TEMP(最佳地設定為略大於所規定之最低工作溫度值)與溫度上限值VAL1(最佳地設定為電子裝置10可安全運作之正常溫度值)進行比較,以產生第一控制訊號CON1控制加熱模組124是否執行加熱,並產生第二控制訊號CON2控制運作模組126調整輸出至加熱模組124之加熱電壓VH的大小。藉此,在環境溫度值TEMP小於調整設定值VAL2時,運作模組126可提高加熱電壓VH以讓加熱模組124利用電子裝置10所能獲取之全部功率來執行加熱,而在環境溫度值TEMP大於調整設定值VAL2時,運作模組126可降低加熱電壓VH讓加熱模組124利用電子裝置10所能獲取之部分功率來執行加熱。再者,加熱模組124在環境溫度值TEMP小於溫度上限值VAL1下,利用調整後之加熱電壓VH來執行加熱,而在環境溫度值TEMP大於溫度上限值VAL1下(代表環境溫度值TEMP已經過高),加熱模組124便停止加熱。如此一來,當電子裝置10使用在極端低溫之環境時,電子裝置10能妥善地利用加熱系統100透過加熱電壓VH之調整,彈性地執行加熱讓加熱模組124與主要運作電路110可同時安全地運作且不超過電子裝置10所能獲取之最大功率,進一步地也可避免電子裝置10過度加熱而造成損壞。 Briefly, the heating system 100 utilizes the comparison module 122 for the ambient temperature value TEMP (optimally set to be slightly greater than the specified minimum operating temperature value) and the temperature upper limit value VAL1 (optimally set to be safe for the electronic device 10 The normal temperature value of the operation is compared to generate a first control signal CON1 to control whether the heating module 124 performs heating, and generate a second control signal CON2 to control the operation module 126 to adjust the size of the heating voltage VH outputted to the heating module 124. . Therefore, when the ambient temperature value TEMP is less than the adjustment set value VAL2, the operation module 126 can increase the heating voltage VH to allow the heating module 124 to perform heating using all the power that the electronic device 10 can obtain, and at the ambient temperature value TEMP When the adjustment setting value VAL2 is greater than the adjustment setting value VAL2, the operation module 126 can lower the heating voltage VH to cause the heating module 124 to perform heating by using part of the power that the electronic device 10 can obtain. Furthermore, the heating module 124 performs heating using the adjusted heating voltage VH when the ambient temperature value TEMP is less than the temperature upper limit value VAL1, and the ambient temperature value TEMP is greater than the upper temperature limit value VAL1 (representing the ambient temperature value TEMP) Already too high), the heating module 124 stops heating. In this way, when the electronic device 10 is used in an extremely low temperature environment, the electronic device 10 can properly utilize the adjustment of the heating system 100 through the heating voltage VH, and elastically perform heating to make the heating module 124 and the main operating circuit 110 safe at the same time. The operation of the device does not exceed the maximum power that can be obtained by the electronic device 10, and further damage of the electronic device 10 caused by excessive heating can be avoided.

關於加熱系統100之實現方式不限於特定裝置或元件,可視需求由相關元件來據以實施。舉例來說,請參考第2圖,第2圖為第1圖之電子裝置10中加熱系統100之一實施例的示意圖。詳細來說,比較模組122包含有比較器CP1~CP2及電阻R4~R9。比較器CP1~CP2分別具有一正輸入端與一負輸入端(第2圖中分別以'+'與'-'來標示)。比較器CP1~CP2之正輸入 端耦接於感測模組120,可接收到感測模組120所輸出與環境溫度值TEMP相對應之環境電壓VT。其中,當環境溫度值TEMP越大,相對地環境電壓VT也就越大。電阻R4~R5相串接於電源電壓Vin及接地之間,電阻R8耦接於比較器CP1之輸出端與負輸入端之間,比較器CP1之負輸入端耦接於相串接之電阻R4~R5及電阻R8之間,以接收電源電壓Vin與比較器CP1之輸出端經由分壓電阻R4~R5及反饋之電阻R8所得之輸入電壓V1。電阻R6~R7相串接於電源電壓Vin及接地之間,電阻R9耦接於比較器CP2之輸出端與負輸入端之間,比較器CP2之負輸入端耦接於相串接之電阻R6~R7及電阻R9之間,以接收電源電壓Vin與比較器CP2之輸出端經由分壓電阻R6~R7及反饋之電阻R9所得之輸入電壓V2。 The implementation of the heating system 100 is not limited to a particular device or component, and may be implemented by related components as desired. For example, please refer to FIG. 2, which is a schematic diagram of an embodiment of the heating system 100 in the electronic device 10 of FIG. In detail, the comparison module 122 includes comparators CP1 to CP2 and resistors R4 to R9. Comparators CP1~CP2 have a positive input and a negative input respectively (indicated by '+' and '-' in Fig. 2). Positive input of comparator CP1~CP2 The terminal is coupled to the sensing module 120 and receives the ambient voltage VT output by the sensing module 120 corresponding to the ambient temperature value TEMP. Among them, when the ambient temperature value TEMP is larger, the relative ambient voltage VT is also larger. The resistors R4 to R5 are connected in series between the power supply voltage Vin and the ground. The resistor R8 is coupled between the output terminal and the negative input terminal of the comparator CP1, and the negative input terminal of the comparator CP1 is coupled to the series resistor R4. Between ~R5 and resistor R8, the input voltage V1 obtained by receiving the power supply voltage Vin and the output terminal of the comparator CP1 via the voltage dividing resistors R4 to R5 and the feedback resistor R8. The resistors R6~R7 are connected in series between the power supply voltage Vin and the ground. The resistor R9 is coupled between the output terminal and the negative input terminal of the comparator CP2, and the negative input terminal of the comparator CP2 is coupled to the series resistor R6. Between ~R7 and resistor R9, the input voltage V2 obtained by receiving the power supply voltage Vin and the output terminal of the comparator CP2 via the voltage dividing resistors R6 to R7 and the feedback resistor R9.

藉此,可根據環境電壓VT對應於環境溫度值TEMP關係,適當地選擇電阻R4~R5之大小使輸入電壓V1可對應於溫度上限值VAL1,及適當地選擇電阻R6~R7之大小使輸入電壓V2可對應於調整設定值VAL2。在此情形下,當環境電壓VT大於輸入電壓V1時,代表環境溫度值TEMP大於溫度上限值VAL1,比較器CP1會輸出具高電位之第一控制訊號CON1,同時高電位之第一控制訊號CON1會經由反饋之電阻R8提高輸入電壓V1,使得環境電壓VT需小於提高之輸入電壓V1時,比較器CP1才會輸出具低電位之第一控制訊號CON1,以避免第一控制訊號CON1反覆地變動。同樣地,當環境電壓VT大於輸入電壓V2時,代表環境溫度值TEMP大於調整設定值VAL2,比較器CP2會輸出具高電位之第二控制訊號CON2,同時高電位之第二控制訊號CON2會經由反饋之電阻R9提高輸入電壓V2,使得環境電壓VT需小於輸入電壓V2時,比較器CP2才會輸出具低電位之第二控制訊號CON2。 Therefore, according to the relationship between the ambient voltage VT and the ambient temperature value TEMP, the size of the resistors R4 to R5 can be appropriately selected so that the input voltage V1 can correspond to the temperature upper limit value VAL1, and the size of the resistors R6 to R7 can be appropriately selected for input. The voltage V2 may correspond to the adjustment set value VAL2. In this case, when the ambient voltage VT is greater than the input voltage V1, the representative ambient temperature value TEMP is greater than the temperature upper limit value VAL1, the comparator CP1 outputs the first control signal CON1 having a high potential, and the first control signal of the high potential CON1 will increase the input voltage V1 via the feedback resistor R8, so that the ambient voltage VT needs to be smaller than the increased input voltage V1, the comparator CP1 will output the first control signal CON1 with a low potential to avoid the first control signal CON1 repeatedly change. Similarly, when the ambient voltage VT is greater than the input voltage V2, the representative ambient temperature value TEMP is greater than the adjustment set value VAL2, the comparator CP2 outputs a second control signal CON2 having a high potential, and the high potential second control signal CON2 is The feedback resistor R9 increases the input voltage V2 so that the comparator CP2 outputs the second control signal CON2 with a low potential when the ambient voltage VT needs to be smaller than the input voltage V2.

加熱模組124包含有一加熱器202及一電晶體Q2。加熱器202可為電阻式之加熱器或陶瓷式之加熱器等,並不受限。加熱器202之一端耦接於控制模組130,可接收控制模組130所輸出之加熱電壓VH,加熱器202 之另一端耦接於電晶體Q2之汲極。電晶體Q2之源極接地,電晶體Q2之閘極耦接於比較器CP1以接收比較器CP1所輸出之第一控制訊號CON1。當電晶體Q2之閘極接收到具高電位之第一控制訊號CON1時,電晶體Q2會導通,使得加熱器202之兩端可具有電壓差(即加熱電壓VH),而開始進行加熱。當電晶體Q2之閘極接收到具低電位之第一控制訊號CON1時,電晶體Q2會關閉,使得加熱器202之兩端不具有電壓差,而不會進行加熱。藉此,在環境溫度值TEMP大於溫度上限值VAL1時,加熱模組124接收具高電位之第一控制訊號CON1而不進行加熱,且在環境溫度值TEMP未大於溫度上限值VAL1時,加熱模組124接收具低電位之第一控制訊號CON1而進行加熱。 The heating module 124 includes a heater 202 and a transistor Q2. The heater 202 may be a resistive heater or a ceramic heater or the like, and is not limited. One end of the heater 202 is coupled to the control module 130, and can receive the heating voltage VH output by the control module 130, and the heater 202 The other end is coupled to the drain of the transistor Q2. The source of the transistor Q2 is grounded, and the gate of the transistor Q2 is coupled to the comparator CP1 to receive the first control signal CON1 output by the comparator CP1. When the gate of the transistor Q2 receives the first control signal CON1 having a high potential, the transistor Q2 is turned on, so that both ends of the heater 202 can have a voltage difference (ie, the heating voltage VH), and heating is started. When the gate of the transistor Q2 receives the first control signal CON1 having a low potential, the transistor Q2 is turned off, so that the heater 202 does not have a voltage difference at both ends without heating. Therefore, when the ambient temperature value TEMP is greater than the temperature upper limit value VAL1, the heating module 124 receives the first control signal CON1 having a high potential without heating, and when the ambient temperature value TEMP is not greater than the temperature upper limit value VAL1, The heating module 124 receives the first control signal CON1 having a low potential for heating.

處理模組128包含有處理器132、儲存裝置134、電阻R10及電晶體Q3。電晶體Q3之汲極耦接於電阻R10後再串接至電源電壓Vin,電晶體Q3之源極接地,電晶體Q3之閘極耦接於比較器CP2,以接收比較器CP2所輸出之第二控制訊號CON2。當電晶體Q3之閘極接收到具高電位之第二控制訊號CON2時,電晶體Q3會導通,使得電晶體Q3之汲極所輸出之重置訊號RST為低電位。處理器132耦接於電晶體Q3之汲極並接收到具低電位之重置訊號RST時,處理器132會被重置而不執行運作,同時處理器132在重置下會產生高電位之第三控制訊號CON3至控制模組130。另外,當處理器132接收到具高電位之重置訊號RST時,處理器132會開始根據儲存裝置134中程式碼之指示來執行運作,並產生低電位之第三控制訊號CON3。 The processing module 128 includes a processor 132, a storage device 134, a resistor R10, and a transistor Q3. The drain of the transistor Q3 is coupled to the resistor R10 and then connected in series to the power supply voltage Vin. The source of the transistor Q3 is grounded, and the gate of the transistor Q3 is coupled to the comparator CP2 to receive the output of the comparator CP2. Two control signals CON2. When the gate of the transistor Q3 receives the second control signal CON2 with a high potential, the transistor Q3 is turned on, so that the reset signal RST outputted by the drain of the transistor Q3 is low. When the processor 132 is coupled to the drain of the transistor Q3 and receives the reset signal RST with a low potential, the processor 132 is reset without performing the operation, and the processor 132 generates a high potential under the reset. The third control signal CON3 is to the control module 130. In addition, when the processor 132 receives the reset signal RST with a high potential, the processor 132 starts to perform an operation according to the instruction of the code in the storage device 134, and generates a third control signal CON3 of a low potential.

控制模組128包含有一直流電源轉換器200、電阻R1~R3及電晶體Q1。直流電源轉換器200由輸入端210接收電源電壓Vin並輸出加熱電壓VH至輸出端212,直流電源轉換器200之回授端214耦接於電阻R2~R3之間,而直流電源轉換器200係根據回授端214之輸入電流Ifb的大小來調整所輸出加熱電壓VH之大小。電阻R2~R3串接於輸出端212與接地之間,電阻R1之一端耦接於電晶體Q1之汲極,另一端耦接於電阻R2~R3之間。 電晶體Q1之源極接地,電晶體Q1之閘極耦接於處理器132,接收處理器132所輸出之第三控制訊號CON3。 The control module 128 includes a DC power converter 200, resistors R1 R R3, and a transistor Q1. The DC power converter 200 receives the power supply voltage Vin from the input terminal 210 and outputs the heating voltage VH to the output terminal 212. The feedback terminal 214 of the DC power converter 200 is coupled between the resistors R2 R R3, and the DC power converter 200 is connected. The magnitude of the output heating voltage VH is adjusted according to the magnitude of the input current Ifb of the feedback terminal 214. The resistors R2 R R3 are connected in series between the output terminal 212 and the ground. One end of the resistor R1 is coupled to the drain of the transistor Q1, and the other end is coupled between the resistors R2 and R3. The source of the transistor Q1 is grounded, and the gate of the transistor Q1 is coupled to the processor 132 to receive the third control signal CON3 output by the processor 132.

藉此,在環境溫度值TEMP未大於調整設定值VAL2時(代表電子裝置10中電子元件尚不可執行運作),電晶體Q1之閘極接收到具高電位之第三控制訊號CON3時,電晶體Q1會導通,使得電阻R1~R2會形成並聯電阻。由於回授端214具有一參考電壓Vfb為一固定值,因此回授端214之輸入電流Ifb的大小為參考電壓Vfb除以電阻R1~R2所形成之並聯電阻,以使直流電源轉換器200提高加熱電壓VH之大小。另在環境溫度值TEMP大於調整設定值VAL2時(代表電子裝置10中電子元件可執行運作),電晶體Q1之閘極接收到具低電位之第三控制訊號CON3,電晶體Q1會關閉,使得電阻R1不會與電阻R2形成並聯電阻,輸入電流Ifb的大小將變為參考電壓Vfb除以電阻R2。在此情形下,由於電阻R2之阻值相較於電阻R1~R2所形成並聯電阻之阻值為大,故輸入電流Ifb相對地會變小,而使直流電源轉換器200降低輸出加熱電壓VH的大小。 Therefore, when the ambient temperature value TEMP is not greater than the adjustment set value VAL2 (representing that the electronic component in the electronic device 10 is still not operational), when the gate of the transistor Q1 receives the third control signal CON3 with a high potential, the transistor Q1 will turn on, causing resistors R1~R2 to form shunt resistors. Since the feedback terminal 214 has a reference voltage Vfb as a fixed value, the magnitude of the input current Ifb of the feedback terminal 214 is the reference voltage Vfb divided by the parallel resistance formed by the resistors R1 R R2 to improve the DC power converter 200. The magnitude of the heating voltage VH. In addition, when the ambient temperature value TEMP is greater than the adjustment set value VAL2 (representing that the electronic component in the electronic device 10 can perform operation), the gate of the transistor Q1 receives the third control signal CON3 with a low potential, and the transistor Q1 is turned off, so that The resistor R1 does not form a parallel resistance with the resistor R2, and the magnitude of the input current Ifb becomes the reference voltage Vfb divided by the resistor R2. In this case, since the resistance of the resistor R2 is larger than the resistance of the parallel resistor formed by the resistors R1 to R2, the input current Ifb is relatively small, so that the DC power converter 200 reduces the output heating voltage VH. the size of.

簡單來說,於此實施例中,比較模組122利用比較器CP1~CP2對相對應於環境溫度值TEMP之環境電壓VT與輸入電壓V1及輸入電壓V2進行比較,以產生第一控制訊號CON1及第二控制訊號CON2。藉此,在環境溫度值TEMP小於調整設定值VAL2時,控制模組128接收處理器132被重置下所產生具高電位之第三控制訊號CON3來提高加熱電壓VH之大小,以利用所能獲取之全部功率來執行加熱。而在環境溫度值TEMP大於調整設定值VAL2時,控制模組128接收處理器132運作後所產生具低電位之第三控制訊號CON3來降低加熱電壓VH之大小,以利用所能獲取之部分功率來執行加熱。如此一來,透過此實施例中加熱系統100之運作,電子裝置10可調整加熱電壓VH來彈性地執行加熱,以讓加熱模組124與主要運作電路110可同時運作且不超過所能獲取之最大功率,進而讓電子裝置10可正常運作。 Briefly, in this embodiment, the comparison module 122 compares the ambient voltage VT corresponding to the ambient temperature value TEMP with the input voltage V1 and the input voltage V2 by using the comparators CP1~CP2 to generate the first control signal CON1. And a second control signal CON2. Therefore, when the ambient temperature value TEMP is less than the adjustment set value VAL2, the control module 128 receives the third control signal CON3 with a high potential generated by the processor 132 to increase the magnitude of the heating voltage VH to utilize the energy. Get all the power to perform the heating. When the ambient temperature value TEMP is greater than the adjustment set value VAL2, the control module 128 receives the third control signal CON3 with a low potential generated by the processor 132 to reduce the magnitude of the heating voltage VH to utilize a portion of the power that can be obtained. To perform the heating. In this way, through the operation of the heating system 100 in this embodiment, the electronic device 10 can adjust the heating voltage VH to perform the heating elastically, so that the heating module 124 and the main operating circuit 110 can operate simultaneously and do not exceed the available The maximum power, which in turn allows the electronic device 10 to function properly.

另一方面,請參考第3圖,第3圖為第2圖之加熱系統100中加 熱電壓VH相對於時間之關係圖。如第3圖所示,在時間點t0至t1之間為一開始電子裝置10使用在極端低溫下,環境溫度值TEMP會小於調整設定值VAL2,因此加熱電壓VH之大小會因處理器132被重置下所產生具高電位之第三控制訊號CON3而提高。直到加熱模組124執行加熱至環境溫度值TEMP大於調整設定值VAL2後,即時間點t1至t2之間,加熱電壓VH之大小會因處理器132啟動運作所產生具低電位之第三控制訊號CON3而降低。藉此,在時間點t1至t2之間,電子裝置10透過加熱電壓VH之調整,可讓加熱模組124與主要運作電路110同時運作且不超過所要求之整體功耗,故電子裝置10可持續獲得加熱也可正常運作。 On the other hand, please refer to Figure 3, and Figure 3 is the heating system 100 of Figure 2. A plot of thermal voltage VH versus time. As shown in FIG. 3, the electronic device 10 is used at an extremely low temperature between time points t0 and t1, and the ambient temperature value TEMP is smaller than the adjustment set value VAL2. Therefore, the magnitude of the heating voltage VH is caused by the processor 132. The third control signal CON3 having a high potential generated by the reset is increased. Until the heating module 124 performs heating until the ambient temperature value TEMP is greater than the adjustment set value VAL2, that is, between the time points t1 and t2, the magnitude of the heating voltage VH is generated by the processor 132 to generate a third control signal with a low potential. Reduced by CON3. Therefore, between the time points t1 and t2, the adjustment of the heating voltage VH of the electronic device 10 allows the heating module 124 to operate simultaneously with the main operating circuit 110 and does not exceed the required overall power consumption, so the electronic device 10 can Continued heating also works.

具體而言,本發明係於電子裝置10中利用加熱系統100感測電子裝置10內部之環境溫度並產生環境溫度值TEMP後,對環境溫度值TEMP與溫度上限值VAL1及調整設定值VAL2來進行比較,以決定是否對電子裝置10進行加熱及決定加熱所需之程度,以使電子裝置10能彈性地執行加熱讓加熱模組124與主要運作電路110同時運作而且不超過電子裝置10所能獲取之最大功率,本領域具通常知識者當可據以進行修飾或變化。舉例來說,於本實施例中,處理模組128接收比較模組122所輸出之第二控制訊號CON2後,決定是否重置處理器132,以利用處理器132產生第三控制訊號CON3來指示控制模組130是否調整加熱電壓VH。於其他實施例中,處理模組128接收比較模組122所輸出之第二控制訊號CON2後,亦可直接透過第二控制訊號CON2來指示控制模組130是否調整加熱電壓VH,而不需再藉由處理器132來產生控制訊號,即由硬體電路來直接控制。 Specifically, the present invention is used in the electronic device 10 to sense the ambient temperature inside the electronic device 10 by using the heating system 100 and generate the ambient temperature value TEMP, and then to the ambient temperature value TEMP and the temperature upper limit value VAL1 and the adjustment set value VAL2. Comparing to determine whether to heat the electronic device 10 and determine the degree of heating required, so that the electronic device 10 can perform heating elastically so that the heating module 124 operates simultaneously with the main operating circuit 110 and does not exceed the capabilities of the electronic device 10. The maximum power obtained is subject to modification or variation by those of ordinary skill in the art. For example, in the embodiment, after receiving the second control signal CON2 output by the comparison module 122, the processing module 128 determines whether to reset the processor 132 to generate a third control signal CON3 by using the processor 132. Whether the control module 130 adjusts the heating voltage VH. In other embodiments, after receiving the second control signal CON2 outputted by the comparison module 122, the processing module 128 can directly instruct the control module 130 to adjust the heating voltage VH through the second control signal CON2. The control signal is generated by the processor 132, that is, directly controlled by the hardware circuit.

再者,於本實施例中,處理器132開始執行運作後,直接或延遲一預定時間後便根據第二控制訊號CON2產生第三控制訊號CON3,以指示控制模組130是否調整加熱電壓VH。然而,於其他實施例中,處理器132開始執行運作後,除根據第二控制訊號CON2外,亦可再參考其他設定值或參考主要運作電路110之耗電值來產生第三控制訊號CON3以指示控制模組 130是否調整加熱電壓VH。另外,於本實施例中,根據所欲輸出之加熱電壓VH的大小,透過控制模組130中適當設計之兩電阻來決定是否並聯,以控制直流電源轉換器200之回授電流來調整加熱電壓VH之大小。在其他本實施例中,控制模組130亦可透過分壓電阻以降壓之方法結合相關之電源轉換器來調整加熱電壓VH,或者透過其他升壓電源轉換器來調整加熱電壓VH,當可加以變化而不受限。 Furthermore, in the embodiment, after the processor 132 starts the operation, the third control signal CON3 is generated according to the second control signal CON2 directly or after a predetermined time delay to indicate whether the control module 130 adjusts the heating voltage VH. However, in other embodiments, after the processor 132 starts to perform operations, in addition to the second control signal CON2, the third control signal CON3 may be generated by referring to other set values or referring to the power consumption value of the main operating circuit 110. Indication control module 130 Whether to adjust the heating voltage VH. In addition, in this embodiment, according to the magnitude of the heating voltage VH to be output, whether the two resistors appropriately designed in the control module 130 are used to determine whether to connect in parallel to control the feedback current of the DC power converter 200 to adjust the heating voltage. The size of the VH. In other embodiments, the control module 130 can also adjust the heating voltage VH through a voltage dividing resistor in combination with a related power converter, or adjust the heating voltage VH through other boosting power converters. Change is not limited.

綜上所述,由於習知技術中電子裝置需執行加熱及執行傳輸資料信號或收發射無線訊號等運作,因此電子裝置之整體功耗往往就會超過電子裝置透過乙太網路所能獲取之最大功耗,進而造成電子裝置無法正常運作。本發明提出加熱系統100透過比較環境溫度值TEMP與溫度上限值VAL1及調整設定值VAL2來判斷是否對電子裝置10進行加熱及決定所需之加熱程度,可使電子裝置10彈性地執行加熱來提高電子裝置內部之環境溫度而不超過所要求之功耗。 In summary, in the prior art, the electronic device needs to perform heating and perform the operation of transmitting data signals or transmitting and transmitting wireless signals. Therefore, the overall power consumption of the electronic device often exceeds that of the electronic device through the Ethernet. The maximum power consumption, which in turn causes the electronic device to malfunction. According to the present invention, the heating system 100 determines whether to heat the electronic device 10 and determine the degree of heating required by comparing the ambient temperature value TEMP with the temperature upper limit value VAL1 and the adjustment set value VAL2, so that the electronic device 10 can perform the heating elastically. Increase the ambient temperature inside the electronic device without exceeding the required power consumption.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10‧‧‧電子裝置 10‧‧‧Electronic devices

100‧‧‧加熱系統 100‧‧‧ heating system

110‧‧‧主要運作電路 110‧‧‧Main operating circuit

120‧‧‧感測模組 120‧‧‧Sensor module

122‧‧‧比較模組 122‧‧‧Comparative Module

124‧‧‧加熱模組 124‧‧‧heating module

126‧‧‧運作模組 126‧‧‧Operating module

128‧‧‧處理模組 128‧‧‧Processing module

130‧‧‧控制模組 130‧‧‧Control Module

132‧‧‧處理器 132‧‧‧ processor

134‧‧‧儲存裝置 134‧‧‧Storage device

TEMP‧‧‧環境溫度值 TEMP‧‧‧ ambient temperature value

CON1‧‧‧第一控制訊號 CON1‧‧‧ first control signal

CON2‧‧‧第二控制訊號 CON2‧‧‧second control signal

Vin‧‧‧電源電壓 Vin‧‧‧Power supply voltage

VH‧‧‧加熱電壓 VH‧‧‧ heating voltage

Claims (10)

一種用於一電子裝置之加熱系統,用來提高該電子裝置內部之一環境溫度,該加熱系統包含有:一感測模組,用來感測該環境溫度,以產生一環境溫度值;一比較模組,耦接於該感測模組,用來根據該環境溫度值,產生一第一控制訊號及一第二控制訊號;一運作模組,耦接於該比較模組,用來轉換一電源電壓以輸出一加熱電壓,並根據該第二控制訊號,調整所輸出之該加熱電壓的大小;以及一加熱模組,耦接於該比較模組及該運作模組,用來根據該第一控制訊號,決定是否使用該加熱電壓來執行加熱,以提高該環境溫度。 A heating system for an electronic device for improving an ambient temperature inside the electronic device, the heating system comprising: a sensing module for sensing the ambient temperature to generate an ambient temperature value; The comparison module is coupled to the sensing module for generating a first control signal and a second control signal according to the ambient temperature value; and an operation module coupled to the comparison module for converting a power supply voltage for outputting a heating voltage, and adjusting the magnitude of the heating voltage to be output according to the second control signal; and a heating module coupled to the comparison module and the operation module for The first control signal determines whether the heating voltage is used to perform heating to increase the ambient temperature. 如請求項1所述之加熱系統,其中當該環境溫度值大於一第一溫度上限值時,該比較模組產生之該第一控制訊號係用來控制該加熱模組不執行加熱,以及當該環境溫度值未大於一第二溫度上限值時,該比較模組產生之該第一控制訊號係用來控制該加熱模組執行加熱。 The heating system of claim 1, wherein when the ambient temperature value is greater than a first temperature upper limit, the first control signal generated by the comparison module is used to control the heating module not to perform heating, and When the ambient temperature value is not greater than a second temperature upper limit, the first control signal generated by the comparison module is used to control the heating module to perform heating. 如請求項1所述之加熱系統,其中當該環境溫度值大於一第一調整設定值時,該比較模組產生之該第二控制訊號係用來控制該運作模組降低所輸出之該加熱電壓的大小,以及當該環境溫度值未大於一第二調整設定值時,該比較模組產生之該第二控制訊號係用來控制該運作模組提高所輸出之該加熱電壓的大小。 The heating system of claim 1, wherein the second control signal generated by the comparison module is used to control the operation module to reduce the output of the heating when the ambient temperature value is greater than a first adjustment setting value. The magnitude of the voltage, and when the ambient temperature value is not greater than a second adjustment setting, the second control signal generated by the comparison module is used to control the operation module to increase the magnitude of the heating voltage outputted. 如請求項1所述之加熱系統,其中該比較模組包含一比較器電路,用來判斷該環境溫度值之大小,以產生該第一控制訊號及該第二控制訊號。 The heating system of claim 1, wherein the comparison module comprises a comparator circuit for determining the magnitude of the ambient temperature value to generate the first control signal and the second control signal. 如請求項1所述之加熱系統,其中該運作模組包含有:一處理模組,耦接於該比較模組,用來根據該第二控制訊號,以產生一第三控制訊號;以及 一控制模組,耦接於該處理模組,用來轉換該電源電壓以輸出該加熱電壓,並根據該第三控制訊號,調整該加熱電壓之大小。 The heating system of claim 1, wherein the operation module comprises: a processing module coupled to the comparison module for generating a third control signal according to the second control signal; A control module is coupled to the processing module for converting the power voltage to output the heating voltage, and adjusting the heating voltage according to the third control signal. 如請求項5所述之加熱系統,其中該處理模組包含有:一儲存裝置,儲存有一程式碼;以及一處理器,用來當接收到顯示為降低之該第二控制訊號時,該處理器被重置並產生用來控制該控制模組降低該加熱電壓之大小的該第三控制訊號,以及當接收到顯示為提高之該第二控制訊號時,該處理器執行運作並根據該程式碼之指示,執行產生用來控制該控制模組提高該加熱電壓之大小的該第三控制訊號。 The heating system of claim 5, wherein the processing module comprises: a storage device storing a code; and a processor for receiving the second control signal displayed as being lowered The device is reset and generates the third control signal for controlling the control module to reduce the magnitude of the heating voltage, and when receiving the second control signal displayed as being enhanced, the processor performs operation according to the program The instruction of the code generates the third control signal for controlling the control module to increase the magnitude of the heating voltage. 如請求項5所述之加熱系統,其中該處理模組根據該程式碼之指示執行運作時,該處理模組根據該第二控制訊號,延遲一設定時間後再產生該第三控制訊號。 The heating system of claim 5, wherein the processing module performs the operation according to the instruction of the code, and the processing module generates the third control signal after delaying for a set time according to the second control signal. 如請求項5所述之加熱系統,其中該控制模組另包含一電源轉換器,用來轉換該電源電壓以輸出該加熱電壓,且當該控制模組接收到顯示為降低之該第三控制訊號時,該控制模組控制該電源轉換器降低所輸出之該加熱電壓的大小,以及當該控制模組接收到顯示為提高之該第三控制訊號時,該控制模組控制該電源轉換器提高所輸出之該加熱電壓的大小。 The heating system of claim 5, wherein the control module further comprises a power converter for converting the power voltage to output the heating voltage, and when the control module receives the third control displayed as decreasing The control module controls the power converter to reduce the magnitude of the output voltage outputted, and the control module controls the power converter when the control module receives the third control signal displayed for improvement The magnitude of the heating voltage outputted is increased. 如請求項5所述之加熱系統,其中該控制模組包含有:一第一電晶體,包含有一第一端、一第二端以及一控制端,該第一端耦接於一接地端,該控制端耦接於該處理模組,用來接收該第三控制訊號;一第一電阻,包含有一第一端以及一第二端,該第一端耦接於該第一電晶體之該第二端;一第二電阻,包含有一第一端以及一第二端,該第一端耦接於該接地端,該第二端耦接於該第一電阻之該第二端;一第三電阻,包含有一第一端以及一第二端,該第一端耦接於該第一電 阻之該第二端及該第二電阻之該第二端之間;以及一直流電源轉換器,包含有一輸入端、一輸出端以及一回授端,該輸入端用來接收該電源電壓,該輸出端耦接於該第三電阻之該第二端,用來輸出該加熱電壓,該回授端耦接於該第一電阻之該第二端、該第二電阻之該第二端及該第三電阻之該第一端之間,該直流電源轉換器根據該回授端之一輸入電流之大小,以調整所輸出之該加熱電壓的大小。 The heating system of claim 5, wherein the control module comprises: a first transistor, comprising a first end, a second end, and a control end, the first end being coupled to a ground end, The control terminal is coupled to the processing module for receiving the third control signal. The first resistor includes a first end and a second end. The first end is coupled to the first transistor. a second end, a second end, the first end is coupled to the ground end, the second end is coupled to the second end of the first resistor; The third resistor includes a first end and a second end, and the first end is coupled to the first electric Blocking between the second end and the second end of the second resistor; and the DC power converter includes an input end, an output end, and a feedback end, the input end is configured to receive the power supply voltage, The output end is coupled to the second end of the third resistor for outputting the heating voltage, and the feedback end is coupled to the second end of the first resistor, the second end of the second resistor, and Between the first ends of the third resistor, the DC power converter adjusts the magnitude of the output voltage according to the input current of one of the feedback terminals. 如請求項1所述之加熱系統,其中當該加熱模組接收到指示不執行加熱之該第一控制訊號時,該加熱模組不執行加熱,以及當該加熱模組接收到指示執行加熱之該第一控制訊號時,該加熱模組執行加熱。 The heating system of claim 1, wherein when the heating module receives the first control signal indicating that heating is not performed, the heating module does not perform heating, and when the heating module receives an instruction to perform heating The heating module performs heating when the first control signal is applied.
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US9510408B1 (en) 2015-09-07 2016-11-29 Power Forest Technology Corporation Light emitting diode backlight module and driving apparatus thereof

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US9510408B1 (en) 2015-09-07 2016-11-29 Power Forest Technology Corporation Light emitting diode backlight module and driving apparatus thereof
TWI572246B (en) * 2015-09-07 2017-02-21 力林科技股份有限公司 Light emitting diode backlight module and driving apparatus thereof
CN106507560A (en) * 2015-09-07 2017-03-15 力林科技股份有限公司 light-emitting diode backlight module and driving device thereof
CN106507560B (en) * 2015-09-07 2018-11-30 力林科技股份有限公司 Light-emitting diode backlight module and driving device thereof

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