TW201522042A - Release sheet - Google Patents
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- TW201522042A TW201522042A TW103137362A TW103137362A TW201522042A TW 201522042 A TW201522042 A TW 201522042A TW 103137362 A TW103137362 A TW 103137362A TW 103137362 A TW103137362 A TW 103137362A TW 201522042 A TW201522042 A TW 201522042A
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- release sheet
- ethylene
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- olefin copolymer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/201—Adhesives in the form of films or foils characterised by their carriers characterised by the release coating composition on the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本發明係關於一種離模片材。 The present invention relates to a release sheet.
黏著片材係以半導體裝置、精密機器等之電子零件之製造步驟為首,在各式各樣的用途中使用。如此之黏著片材為保護其表面,係貼合積層離模片材直至使用時。 The adhesive sheet is used in various types of applications, including the manufacturing steps of electronic components such as semiconductor devices and precision machines. The adhesive sheet is such that the surface of the adhesive sheet is adhered to the laminated sheet until it is used.
構成離模片材之基材之表面為了易從黏著片材剝離,係設置含有離型劑之樹脂層。離模片材用之離型劑最常使用聚矽氧系離型劑。然而,使用聚矽氧系離型劑時,有時聚矽氧系離型劑中所含之低分子量之聚矽氧化合物會移動至黏著片材之黏著劑表面而殘存。已有被指出殘存於黏著片材之黏著劑表面的聚矽氧化合物係不僅引起黏著劑之黏著力之降低,會徐緩地氣化,例如堆積於使用黏著片材之電子零件之表面,因此對其性能造成不良影響。 The surface of the base material constituting the release sheet is provided with a resin layer containing a release agent in order to be easily peeled off from the adhesive sheet. A release agent for release sheets is most often used as a release agent. However, when a polyoxynitride type release agent is used, the low molecular weight polyoxynitride contained in the polyoxygen type release agent may move to the surface of the adhesive sheet of the adhesive sheet and remain. It has been pointed out that the polyoxynitride compound remaining on the surface of the adhesive of the adhesive sheet not only causes a decrease in the adhesive force of the adhesive, but also vaporizes slowly, for example, on the surface of an electronic component using an adhesive sheet, and thus Its performance has an adverse effect.
就離模片材用之非聚矽氧系離型劑而言,於專利文獻1、2中已提出使用烯烴系彈性體,於專利文獻3、4中已提出使用酸改質聚烯烴。又,於專利文獻5已提出使用酸改質聚丁二烯或酸改質聚異戊二烯。 In the non-polyoxyl-based release agents for release sheets, it has been proposed to use olefin-based elastomers in Patent Documents 1 and 2, and it has been proposed to use acid-modified polyolefins in Patent Documents 3 and 4. Further, Patent Document 5 has proposed the use of acid-modified polybutadiene or acid-modified polyisoprene.
專利文獻1、2之離模片材係對於黏著片材顯示良好的離型性。然而,此等之離模片材係因耐熱性低,故於與黏著片材貼合之狀態,在高溫下保存時,有時會與黏著片材強力地接著,使操作性降低。尤其,在塗布黏著劑後之乾燥時,或在黏著片材之轉印時等,若賦予熱,離模片材之離型性易變化,操作上為不佳者。 The release sheets of Patent Documents 1 and 2 exhibit good release properties for the adhesive sheet. However, since such a release sheet is low in heat resistance, it may be strongly adhered to the adhesive sheet when it is stored at a high temperature in a state of being bonded to the adhesive sheet, and the workability may be lowered. In particular, when drying after applying the adhesive, or when transferring the adhesive sheet, if the heat is applied, the release property of the release sheet is liable to change, and the operation is not preferable.
另一方面,專利文獻3、4之離模片材係使用經酸改質之乙烯系聚合體作為離型劑,對於各式各樣的被黏著體顯示良好之離型性。然而,對於黏著片材係剝離強度略大,故有時剝離黏著片材時之操作性不佳,尤其,從黏著片材以高速剝離離模片材時,有時引起剝開,損及黏著片材表面之平滑性或透明性。 On the other hand, in the release sheets of Patent Documents 3 and 4, an acid-modified ethylene-based polymer is used as a release agent, and good release properties are exhibited for various types of adherends. However, since the peeling strength of the adhesive sheet is slightly large, the workability in peeling off the adhesive sheet may be poor, and in particular, when the release sheet is peeled off at a high speed from the adhesive sheet, peeling may occur, and adhesion may be caused. Smoothness or transparency of the surface of the sheet.
專利文獻5之離模片材係對黏著劑之離型性良好,但離型層柔軟,故將離模片材捲取成輥狀時,產生片材之壓黏,恐有無法從輥捲出之生產上的問題。 The release sheet of Patent Document 5 is excellent in release property to the adhesive, but the release layer is soft. Therefore, when the release sheet is wound into a roll, the sheet is pressed, and there is a fear that it cannot be rolled from the roll. Out of production problems.
[專利文獻1]日本特許第4907724號公報 [Patent Document 1] Japanese Patent No. 4907724
[專利文獻2]日本特許第4367082號公報 [Patent Document 2] Japanese Patent No. 4367082
[專利文獻3]日本特開2009-101680號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2009-101680
[專利文獻4]日本國際公開第2009/025063號 [Patent Document 4] Japanese International Publication No. 2009/025063
[專利文獻5]日本特開2012-152965號公報 [Patent Document 5] Japanese Patent Laid-Open Publication No. 2012-152965
本發明係有鑑於此等之問題,欲提供一種與黏著材料之離型性優異,即使以高速之剝離,操作性亦良好,耐熱性、耐壓黏性亦優異的離模片材。 In view of the above problems, the present invention is intended to provide a release sheet which is excellent in release property from an adhesive material, has excellent workability even at high speed, and is excellent in heat resistance and pressure resistance.
本發明人係為解決上述問題,經專心研究之結果,發現使用經酸改質之乙烯-α-烯烴共聚物作為離型劑,使含有此與特定之交聯劑之樹脂層設於基材上而成的離模片材可可決上述問題,終完成本發明。 The present inventors have solved the above problems, and as a result of intensive research, it has been found that an acid-modified ethylene-α-olefin copolymer is used as a release agent, and a resin layer containing the specific crosslinking agent is provided on the substrate. The above-mentioned release sheet can solve the above problems, and the present invention is finally completed.
亦即,本發明之要旨係如以下。 That is, the gist of the present invention is as follows.
(1)一種離模片材,其係於基材上設有樹脂層而成之離模片材,且樹脂層含有酸改質乙烯-α-烯烴共聚物100質量份與交聯劑0.1至50質量份,交聯劑為由唑啉化合物及/或羰二醯亞胺化合物所構成。 (1) A release sheet which is a release sheet provided with a resin layer on a substrate, and the resin layer contains 100 parts by mass of an acid-modified ethylene-α-olefin copolymer and a crosslinking agent 0.1 to 50 parts by mass, cross-linking agent It is composed of an oxazoline compound and/or a carbodiimide compound.
(2)如(1)項之離模片材,其中,構成酸改質乙烯-α-烯烴共聚物之乙烯成分與α-烯烴成分之質量比(乙烯成分/α-烯烴成分)為60/40至99/1。 (2) The release sheet according to item (1), wherein the mass ratio (ethylene component/α-olefin component) of the ethylene component and the α-olefin component constituting the acid-modified ethylene-α-olefin copolymer is 60/ 40 to 99/1.
(3)如(1)或(2)項之離模片材,其中,α-烯烴成分為丙烯或1-丁烯。 (3) The release sheet according to item (1) or (2), wherein the α-olefin component is propylene or 1-butene.
(4)如(1)至(3)項中任一項之離模片材,其中,構成酸改質乙烯-α-烯烴共聚物之酸改質成分之含量,相對於乙烯成分與α-烯烴成分之合計,為未達1質量%。 (4) The release sheet according to any one of (1) to (3) wherein the content of the acid-modified component constituting the acid-modified ethylene-α-olefin copolymer is relative to the ethylene component and α- The total of the olefin components is less than 1% by mass.
(5)如(1)至(4)項中任一項之離模片材,其中,基材為樹脂材料、紙、合成紙、布、金屬材料、玻璃材料之任一 者。 (5) The release sheet according to any one of (1) to (4), wherein the substrate is any one of a resin material, paper, synthetic paper, cloth, metal material, and glass material. By.
(6)如(5)項之離模片材,其中,樹脂材料為聚酯樹脂薄膜。 (6) The release sheet according to item (5), wherein the resin material is a polyester resin film.
(7)如(1)至(6)項中任一項之離模片材,其中,樹脂層與丙烯酸系黏著材料之剝離強度為0.5N/cm以下。 The release sheet of any one of (1) to (6), wherein the peeling strength of the resin layer and the acrylic pressure-sensitive adhesive material is 0.5 N/cm or less.
藉由使用本發明之離模片材,可保護黏著材料之黏著劑表面,在使用黏著材料時,即使以高速剝離離模片材,亦可無損黏著材料之品質而簡單地剝離。本發明之離模片材之耐熱性優異,故與黏著材料等貼合之後,熱處理後之離型性亦優異。進一步,本發明之離模片材係即使捲取成輥狀時,耐壓黏性(blocking resistance)亦優異。 By using the release sheet of the present invention, the surface of the adhesive of the adhesive material can be protected, and when the adhesive material is used, even if the release sheet is peeled off at a high speed, the quality of the adhesive material can be easily peeled off without damaging the quality of the adhesive material. Since the release sheet of the present invention is excellent in heat resistance, it is excellent in release property after heat treatment after bonding with an adhesive material or the like. Further, the release sheet of the present invention is excellent in blocking resistance even when wound into a roll shape.
以下,詳細說明本發明。 Hereinafter, the present invention will be described in detail.
本發明之離模片材係由基材與設於其上之樹脂層所構成。繼而,樹脂層係含有酸改質乙烯-α-烯烴共聚物與交聯劑。 The release sheet of the present invention is composed of a substrate and a resin layer provided thereon. Then, the resin layer contains an acid-modified ethylene-α-olefin copolymer and a crosslinking agent.
酸改質乙烯-α-烯烴共聚物為經乙烯-α-烯烴共聚物酸改質者,乙烯-α-烯烴共聚物含有乙烯成分與一種以上之α-烯烴成分。 The acid-modified ethylene-α-olefin copolymer is an acid-modified ethylene-α-olefin copolymer, and the ethylene-α-olefin copolymer contains an ethylene component and one or more α-olefin components.
α-烯烴係可舉例如丙烯、1-丁烯、1-戊烯、1-己烯、 4-甲基-1-戊烯、1-庚烯、1-辛烯、1-壬烯、1-癸烯、1-十一碳烯、1-十二碳烯等。此等之中,從經濟性之觀點或容易取得性之觀點,以丙烯、1-丁烯為較佳。 The α-olefin may, for example, be propylene, 1-butene, 1-pentene or 1-hexene. 4-methyl-1-pentene, 1-heptene, 1-octene, 1-decene, 1-decene, 1-undecene, 1-dodecene, and the like. Among these, propylene and 1-butene are preferred from the viewpoint of economy or ease of availability.
乙烯-α-烯烴共聚物中之乙烯成分與α-烯烴成分之質量比(乙烯成分/α-烯烴成分)為60/40至99/1較佳,70/30至97/3為更佳,80/20至95/5為最佳。乙烯成分與α-烯烴成分之質量比若為此範圍外,有時所得之離模片材係離型性降低,高速剝離性降低。 The mass ratio of the ethylene component to the α-olefin component (ethylene component/α-olefin component) in the ethylene-α-olefin copolymer is preferably from 60/40 to 99/1, more preferably from 70/30 to 97/3. 80/20 to 95/5 is the best. When the mass ratio of the ethylene component to the α-olefin component is outside this range, the release sheet obtained may have a reduced release property, and the high-speed peelability may be lowered.
乙烯-α-烯烴共聚物係使用二茂鐵系觸媒來製造為較佳。依此方法所製造之乙烯-α-烯烴共聚物的分子量分布窄,低分子量成分之量少,共聚合成為均一。 The ethylene-α-olefin copolymer is preferably produced by using a ferrocene-based catalyst. The ethylene-α-olefin copolymer produced by this method has a narrow molecular weight distribution, a small amount of low molecular weight components, and uniform copolymerization.
在本發明中,乙烯-α-烯烴共聚物係從提升所得之樹脂層與基材之密著性,與交聯劑反應而提升耐熱性之觀點,有經酸改質之必須。乙烯-α-烯烴共聚物之酸改質例如可藉由於乙烯-α-烯烴共聚物導入不飽和羧酸成分來進行。 In the present invention, the ethylene-α-olefin copolymer is required to improve the heat resistance of the resin layer obtained by the adhesion between the resin layer and the substrate and to improve the heat resistance by reacting with the crosslinking agent. The acid modification of the ethylene-α-olefin copolymer can be carried out, for example, by introducing an unsaturated carboxylic acid component into the ethylene-α-olefin copolymer.
於本發明中,相對於烯烴成分全量,構成酸改質乙烯-α-烯烴共聚物之酸改質成分之含量,亦即乙烯成分與α-烯烴成分之合計量,以未達1質量%為較佳,以0.01質量%以上、未達1質量%為更佳,以0.05質量%以上、未達1質量%為最佳,以0.1質量%以上、未達1質量%為特佳,以0.2質量%以上、未達1質量%為最特佳。酸改質成分之含量為未達0.01質量%之時,有時與基材之密著性變得不充分,與交聯劑之反應變得不充分,耐熱性差。另一方面, 酸改質成分之含量為1質量%以上時,有離型性降低之傾向。使含有一般乙烯成分之聚烯烴樹脂酸改質時,亦同時地進行交聯反應,故為製造酸改質量高者,從操業性之觀點,有時實質上很困難。 In the present invention, the content of the acid-modified component constituting the acid-modified ethylene-α-olefin copolymer, that is, the total amount of the ethylene component and the α-olefin component, is less than 1% by mass based on the total amount of the olefin component. Preferably, it is preferably 0.01% by mass or more and less than 1% by mass, more preferably 0.05% by mass or more, and less than 1% by mass, and particularly preferably 0.1% by mass or more and less than 1% by mass. The mass% or more and less than 1 mass% are the most preferable. When the content of the acid-modified component is less than 0.01% by mass, the adhesion to the substrate may be insufficient, the reaction with the crosslinking agent may be insufficient, and the heat resistance may be poor. on the other hand, When the content of the acid-modified component is 1% by mass or more, the release property tends to be lowered. When the polyolefin resin containing a general ethylene component is acid-modified, the crosslinking reaction is also carried out at the same time. Therefore, in order to produce a high acid-modified quality, it may be substantially difficult from the viewpoint of workability.
被導入至乙烯-α-烯烴共聚物之不飽和羧酸成分之具體例係可舉例如除了丙烯酸、甲基丙烯酸、馬來酸、馬來酸酐、衣康酸、衣康酸酐、烏頭酸、烏頭酸酐、富馬酸、巴豆酸、檸康酸、中康酸、烯丙基琥珀酸等之外,如不飽和二羧酸之半酯、半醯胺等,於分子內(單體單位內)至少具有1個之羧基或酸酐基之化合物。其中,從導入於乙烯-α-烯烴共聚物之容易性之點,以馬來酸酐、丙烯酸酸、甲基丙烯酸為較佳,以馬來酸酐為更佳。 Specific examples of the unsaturated carboxylic acid component to be introduced into the ethylene-α-olefin copolymer include, for example, acrylic acid, methacrylic acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, aconitic acid, and aconite. In addition to anhydrides, fumaric acid, crotonic acid, citraconic acid, mesaconic acid, allyl succinic acid, etc., such as semi-esters of unsaturated dicarboxylic acids, hemi-amines, etc., in the molecule (in monomer units) A compound having at least one carboxyl group or an acid anhydride group. Among them, maleic anhydride, acryl acid, and methacrylic acid are preferred from the viewpoint of easiness of introduction into the ethylene-α-olefin copolymer, and maleic anhydride is more preferable.
不飽和羧酸成分只要於乙烯-α-烯烴共聚物中共聚合即可,其形態係無限定,可舉例如無規共聚合、嵌段共聚合、分枝共聚合等。 The unsaturated carboxylic acid component is not particularly limited as long as it is copolymerized in the ethylene-α-olefin copolymer, and examples thereof include random copolymerization, block copolymerization, and branched copolymerization.
將不飽和羧酸單位導入於乙烯-α-烯烴共聚物之方法係無特別限定。可舉例如在自由基產生劑之存在下,將乙烯-α-烯烴共聚物與不飽和羧酸加熱熔融至乙烯-α-烯烴共聚物之熔點以上而使之反應的方法、或使乙烯-α-烯烴共聚物與不飽和羧酸溶解於有機溶劑之後,在自由基產生劑之存在下加熱、攪拌而反應之方法等,藉此,使乙烯-α-烯烴共聚物與不飽和羧酸進行分枝共聚合之方法。從操作簡便之點,以前者之方法為較佳。 The method of introducing the unsaturated carboxylic acid unit into the ethylene-α-olefin copolymer is not particularly limited. For example, a method of heating and melting an ethylene-α-olefin copolymer and an unsaturated carboxylic acid to a melting point or higher of an ethylene-α-olefin copolymer in the presence of a radical generating agent, or ethylene-α - a method in which an olefin copolymer and an unsaturated carboxylic acid are dissolved in an organic solvent, heated, stirred, and reacted in the presence of a radical generating agent, whereby an ethylene-α-olefin copolymer and an unsaturated carboxylic acid are separated. The method of branch copolymerization. From the point of ease of operation, the former method is preferred.
使用於分枝共聚合之自由基產生劑係可舉例如過氧化 二-第三丁基、過氧化二異丙苯基、氫過氧化第三丁基、過氧化第三丁基異丙苯基、過氧化苯甲醯基、過氧化二月桂基、氫過氧化異丙苯、苯甲酸過氧化第三丁酯、過氧化乙基乙基酮、二半酞酸二-第三丁酯等之有機過氧化物類或、偶氮雙異丁腈等之偶氮腈類。此等係依反應溫度而適宜選擇使用即可。 The radical generator used in the branch copolymerization may, for example, be peroxidized Di-tert-butyl, dicumyl peroxide, tert-butyl hydroperoxide, tributyl cumyl peroxide, benzammonium peroxide, dilauryl peroxide, hydroperoxide Organic peroxides such as cumene, butyl peroxybenzoate, ethyl ethyl ketone peroxide, di-tert-butyl dihalide, or azo such as azobisisobutyronitrile Nitrile. These are preferably selected depending on the reaction temperature.
在本發明中,樹脂層製造原料之酸改質乙烯-α-烯烴共聚物之熔融流動率係無特別限定,在230℃、2160g荷重下,以0.01至500g/10分鐘為較佳,以0.1至100g/10分鐘為更佳,以0.3至10g/10分鐘為最佳。熔融流動率為未達0.01g/10分鐘之酸改質乙烯-α-烯烴共聚物係很難溶解於溶劑,另一方面,若酸改質乙烯-α-烯烴共聚物之熔融流動率為500g/10分鐘以上,所得之樹脂層係有時與基材之密著性降低,於黏著劑等之被黏著體易引起低分子量成分之移動。 In the present invention, the melt flow rate of the acid-modified ethylene-α-olefin copolymer of the resin layer production raw material is not particularly limited, and is preferably 0.01 to 500 g/10 min at 230 ° C and 2160 g load, and 0.1. It is more preferably 100 g/10 min, and most preferably 0.3 to 10 g/10 min. The acid-modified ethylene-α-olefin copolymer having a melt flow rate of less than 0.01 g/10 minutes is hardly soluble in the solvent, and on the other hand, the melt flow rate of the acid-modified ethylene-α-olefin copolymer is 500 g. When the resin layer obtained is at least /10 minutes or more, the adhesion to the substrate may be lowered, and the adherend such as an adhesive may easily cause movement of the low molecular weight component.
用以酸改質之乙烯-α-烯烴共聚物可使用市販之乙烯-α-烯烴共聚物。市販之乙烯-α-烯烴共聚物可舉例如住友化學公司製ESPRENE系列、三井化學公司製TAFMER系列等。可使用如此之市販的乙烯-α-烯烴共聚物,以上述之方法進行酸改質,得到酸改質乙烯-α-烯烴共聚物。 Commercially available ethylene-α-olefin copolymers can be used for the acid-modified ethylene-α-olefin copolymer. The ethylene-α-olefin copolymer of the market is, for example, the ESPRENE series manufactured by Sumitomo Chemical Co., Ltd., and the TAFMER series manufactured by Mitsui Chemicals Co., Ltd., and the like. The acid-modified ethylene-α-olefin copolymer can be obtained by acid modification using the commercially available ethylene-α-olefin copolymer by the above method.
酸改質乙烯-α-烯烴共聚物亦可使用市販者。市販之酸改質乙烯-α-烯烴共聚物可舉例如三井化學公司製TAFMER系列之MP-0620、MH-7020、MA-8510等。 Acid-modified ethylene-α-olefin copolymers can also be used by marketers. The commercially available acid-modified ethylene-α-olefin copolymer may, for example, be MP-0620, MH-7020 or MA-8510 of the TAFMER series manufactured by Mitsui Chemicals.
本發明之離模片材之樹脂層含有交聯劑。交聯劑可使用於分子內具有複數個之與酸改質乙烯-α-烯烴共聚物反應之官能基的化合物,從反應性之觀點,必須為選自唑啉化合物、羰二醯亞胺化合物之至少一個交聯劑。交聯劑若使用唑啉化合物或羰二醯亞胺化合物以外之交聯劑,交聯反應不充分,故有所得之樹脂層的耐熱性降低,熱處理後之離型性降低之傾向。 The resin layer of the release sheet of the present invention contains a crosslinking agent. The crosslinking agent can be used for a compound having a plurality of functional groups reactive with the acid-modified ethylene-α-olefin copolymer in the molecule, and must be selected from the viewpoint of reactivity. At least one crosslinking agent of the oxazoline compound or the carbodiimide compound. If the crosslinker is used Since the cross-linking reaction is insufficient in the cross-linking agent other than the oxazoline compound or the carbodiimide compound, the heat resistance of the obtained resin layer is lowered, and the release property after heat treatment tends to be lowered.
唑啉化合物係只要於分子中具有2個以上之唑啉基者即可,並無特別限定。可舉例如2,2’-雙(2-唑啉)、2,2’-乙烯-雙(4,4’-二甲基-2-唑啉)、2,2’-對伸苯基-雙(2-唑啉)、雙(2-唑啉基環己烷)硫醚等之具有唑啉基之化合物或含有唑啉基之聚合物。可使用此等之1種或2種以上。此等之中,就容易處理性,以含有唑啉基之聚合物為較佳。 The oxazoline compound has two or more molecules in the molecule. The oxazoline group is not particularly limited. For example, 2,2'-double (2- Oxazoline), 2,2'-ethylene-bis(4,4'-dimethyl-2- Oxazoline), 2,2'-p-phenylene-bis(2- Oxazoline), double (2- Oxazolinylcyclohexane) thioether An oxazolyl compound or a compound An oxazoline-based polymer. One or two or more of these may be used. Among these, it is easy to handle to contain An oxazoline group polymer is preferred.
含有唑啉基之聚合物係可藉由使2-乙烯基-2-唑啉、2-乙烯基-4-甲基-2-唑啉、2-異丙烯基-2-唑啉等之加成聚合性唑啉聚合而得。依需要亦可使其他單體共聚合。含有唑啉基之聚合物之聚合方法係無特別限定,可採用公知之各種聚合方法。 contain An oxazolyl-based polymer can be obtained by making 2-vinyl-2- Oxazoline, 2-vinyl-4-methyl-2- Oxazoline, 2-isopropenyl-2- Addition polymerization of oxazoline The oxazoline is obtained by polymerization. Other monomers may also be copolymerized as needed. contain The polymerization method of the oxazoline group polymer is not particularly limited, and various known polymerization methods can be employed.
含有唑啉基之聚合物之市販品可舉例如日本觸媒公司製之Epocros系列具體地可舉例如水溶性型之「WS-500」、「WS-700」、固形型之「RPS-1005」等。 contain For example, the Epocros series manufactured by Nippon Shokubai Co., Ltd. may be, for example, a water-soluble type "WS-500", "WS-700", or a solid type "RPS-1005".
羰二醯亞胺化合物係只要於分子中至少具有2個以上之羰二醯亞胺基者即可,無特別限定。可舉例 如對伸苯基-雙(2,6-二甲苯基羰二醯亞胺)、四亞甲基-雙(第三丁基羰二醯亞胺)、環己烷-1,4-雙(亞甲基-第三丁基羰二醯亞胺)等之具有羰二醯亞胺基之化合物、或、具有羰二醯亞胺基之聚合體的聚羰二醯亞胺。可使用此等之1種或2種以上。此等之中,從容易處理性來看,以聚羰二醯亞胺為較佳。 The carbodiimide compound is not particularly limited as long as it has at least two or more carbonyldiamine imine groups in the molecule. Can be cited Such as p-phenyl-bis(2,6-dimethylphenylcarbodiimide), tetramethylene-bis(t-butylcarbonyldiimide), cyclohexane-1,4-bis ( A carbodiimide group-containing compound such as methylene-tert-butylcarbonyldiimide or a polycarbodiimide having a carbonyldiamine-imine group. One or two or more of these may be used. Among these, from the viewpoint of easy handling, polycarbodiimide is preferred.
聚羰二醯亞胺之製法係無特別限定。聚羰二醯亞胺係可舉例如藉由伴隨異氰酸酯化合物之脫二氧化碳之縮合反應來製造。異氰酸酯化合物亦無限定,脂肪族異氰酸酯、脂環族異氰酸酯、芳香族異氰酸酯之任一者均可。異氰酸酯化合物係亦可依需要而使多官能液狀橡膠或聚伸烷基二醇等共聚合。 The production method of polycarbodiimide is not particularly limited. The polycarbodiimide is produced, for example, by a condensation reaction involving decarbonation of an isocyanate compound. The isocyanate compound is not limited, and any of an aliphatic isocyanate, an alicyclic isocyanate, and an aromatic isocyanate may be used. The isocyanate compound may be copolymerized with a polyfunctional liquid rubber or a polyalkylene glycol or the like as needed.
聚羰二醯亞胺之市販品可舉例如日清紡公司製之Carbodilite系列、具體地可舉例如水溶性型之「SV-02」、「V-02」、「V-02-L2」、「V-04」、有機溶液型之「V-01」、「V-03」、「V-07」、「V-09」、無溶劑型之「V-05」等。 For example, the Carbodilite series manufactured by Nisshinbo Co., Ltd., for example, "SV-02", "V-02", "V-02-L2", and "V-", which are water-soluble types, may be mentioned. 04", "V-01", "V-03", "V-07", "V-09", and "V-05" without solvent.
相對於酸改質乙烯-α-烯烴共聚物100質量份,由唑啉化合物及/或羰二醯亞胺化合物所構成之交聯劑之含量必須為0.1至50質量份,以1至30質量份為較佳,以2至20質量份為更佳。交聯劑之含量為未達0.1質量份,有時缺乏添加效果,經時性離型性降低,或無法得到充分之耐熱性,若含量超過50質量份,有時離型性降低。交聯劑係亦可同時使用複數之種類,同時使用時,只要交聯劑之合計量滿足上述之交聯劑含量之範圍即可。 100 parts by mass relative to the acid-modified ethylene-α-olefin copolymer The content of the crosslinking agent composed of the oxazoline compound and/or the carbodiimide compound must be 0.1 to 50 parts by mass, preferably 1 to 30 parts by mass, more preferably 2 to 20 parts by mass. When the content of the crosslinking agent is less than 0.1 part by mass, the addition effect may be insufficient, the release property may be lowered with time, or sufficient heat resistance may not be obtained, and if the content exceeds 50 parts by mass, the release property may be lowered. The cross-linking agent may be used in a plurality of types at the same time, and at the same time, as long as the total amount of the cross-linking agent satisfies the range of the above-mentioned cross-linking agent content.
構成本發明之離模片材的樹脂層係如上述般,含有酸改質乙烯-α-烯烴共聚物與交聯劑,但亦可含有依需要之整平劑、消泡劑、抗起泡劑、抗靜電劑、顏料分散劑、紫外線吸收劑等之各種藥劑、或氧化鈦、鋅白、碳黑等之顏料或染料。在無損用以形成後述之樹脂層的液狀物安定性的範圍,亦可使上述以外之有機或無機之化合物添加於液狀物,使之含於樹脂層。 The resin layer constituting the release sheet of the present invention contains an acid-modified ethylene-α-olefin copolymer and a crosslinking agent as described above, but may also contain a leveling agent, an antifoaming agent, and anti-foaming as needed. Various agents such as a solvent, an antistatic agent, a pigment dispersant, and an ultraviolet absorber, or a pigment or dye such as titanium oxide, zinc white or carbon black. The organic or inorganic compound other than the above may be added to the liquid material in the range of the stability of the liquid material for forming the resin layer to be described later, and may be contained in the resin layer.
在本發明之離模片材中樹脂層之厚度以0.01至5.0μm為較佳,以0.03至3.0μm為更佳,以0.05至1.0μm為最佳。若樹脂層之厚度未達0.01μm,有時無法得到充分之離型性,另一方面,若厚度超過5.0μm,成本會上升,故不較佳。 The thickness of the resin layer in the release sheet of the present invention is preferably 0.01 to 5.0 μm, more preferably 0.03 to 3.0 μm, and most preferably 0.05 to 1.0 μm. When the thickness of the resin layer is less than 0.01 μm, sufficient release property may not be obtained. On the other hand, if the thickness exceeds 5.0 μm, the cost will increase, which is not preferable.
在本發明中,於基材上設有樹脂層之方法無特別限定。例如,製作含有酸改質乙烯-α-烯烴共聚物、交聯劑與介質之液狀物,將此液狀物塗布於基材上而使介質乾燥之方法,就易使樹脂層之厚度均一化,並可大量生產之點,較佳。或,亦可將混合有酸改質乙烯-α-烯烴共聚物與交聯劑而成者熔融押出於基材上,形成樹脂層。藉由使構成基材之樹脂材料與樹脂層形成材料共押出,亦可得到離模片材。 In the present invention, a method of providing a resin layer on a substrate is not particularly limited. For example, by preparing a liquid material containing an acid-modified ethylene-α-olefin copolymer, a crosslinking agent and a medium, and applying the liquid to a substrate to dry the medium, the thickness of the resin layer is uniform. And can be mass produced, preferably. Alternatively, a mixture of an acid-modified ethylene-α-olefin copolymer and a crosslinking agent may be melted onto a substrate to form a resin layer. A release sheet can also be obtained by coextruding a resin material constituting the substrate with a resin layer forming material.
用以製作含有上述酸改質乙烯-α-烯烴共聚物與交聯劑之液狀物之介質,可使用以可溶解或分散酸改質乙烯-α-烯烴及交聯劑之有機溶劑,於製膜之過程進行乾燥,藉此而除去者。從效率佳地從塗膜除去之觀點, 有機溶劑之沸點係以150℃以下為較佳。沸點超過150℃之有機溶劑係有時有很難從塗膜藉乾燥散去之傾向,特別是會使塗膜之接著性或耐內容物性等會降低。 The medium for preparing the liquid material containing the acid-modified ethylene-α-olefin copolymer and the crosslinking agent can be used as an organic solvent capable of dissolving or dispersing the acid-modified ethylene-α-olefin and the crosslinking agent. The process of film formation is dried, whereby it is removed. From the viewpoint of efficient removal from the coating film, The boiling point of the organic solvent is preferably 150 ° C or lower. An organic solvent having a boiling point of more than 150 ° C tends to be difficult to disperse from the coating film by drying, and in particular, the adhesion of the coating film or the physical properties of the coating film may be lowered.
有機溶劑可舉例如:丙酮、甲基乙基酮、二乙基酮(3-戊酮)、甲基丙基酮(2-戊酮)、異丁基酮、甲基異丁基酮(4-甲基-2-戊酮)、2-己酮、5-甲基-2-己酮、2-庚酮、3-庚酮、4-庚酮、環戊酮、環己酮等之酮類;甲苯、二甲苯、苯、Solvesso 100、Solvesso 150等之芳香族烴類;丁烷、戊烷、己烷、環己烷、庚烷、辛烷、壬烷等之脂肪族烴類;二氯甲烷、氯仿、四氯化碳、1,2-二氯乙烷、1,1,2,2-四氯乙烷、氯苯、鄰-二氯苯、間-二氯苯、對-二氯苯等之含鹵素類;醋酸甲酯、醋酸乙酯、醋酸-正丙酯、醋酸異丙酯、醋酸-正丁酯、醋酸異丁酯、醋酸-第二丁酯、醋酸-第三丁基、醋酸-3-甲氧基丁酯、丙酸甲酯、丙酸乙酯、碳酸二甲酯、碳酸二乙酯、γ-丁內酯、異佛酮等之酯類;甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇、第二-丁醇、第三-丁醇、正戊醇、異戊醇、第二-戊醇、第三-戊醇、1-乙基-1-丙醇、2-甲基-1-丁醇、正己醇、環己醇、乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單丙基醚、乙二醇單丁基醚等之醇類;四氫呋喃、1,4-二烷等之醚類;二甲基甲醯胺、二甲基乙醯胺、二丙酮醇、乙腈、其他、含有氨之二乙基胺、三乙基胺、二乙醇胺、三乙醇胺、N,N-二甲基乙醇胺、N,N-二乙基乙醇胺、N-二乙醇胺、3-甲氧基丙基胺、3-二乙基胺基丙基胺、二甲基胺基丙基胺等之有機胺化合 物;等。 The organic solvent may, for example, be acetone, methyl ethyl ketone, diethyl ketone (3-pentanone), methyl propyl ketone (2-pentanone), isobutyl ketone or methyl isobutyl ketone (4). Ketones such as -methyl-2-pentanone), 2-hexanone, 5-methyl-2-hexanone, 2-heptanone, 3-heptanone, 4-heptanone, cyclopentanone, cyclohexanone Oral hydrocarbons such as toluene, xylene, benzene, Solvesso 100, Solvesso 150; aliphatic hydrocarbons such as butane, pentane, hexane, cyclohexane, heptane, octane, decane; Methyl chloride, chloroform, carbon tetrachloride, 1,2-dichloroethane, 1,1,2,2-tetrachloroethane, chlorobenzene, o-dichlorobenzene, m-dichlorobenzene, p-di Halogen-containing such as chlorobenzene; methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, acetic acid-second butyrate, acetic acid-third Ester, 3-methyloxybutyl acetate, methyl propionate, ethyl propionate, dimethyl carbonate, diethyl carbonate, γ-butyrolactone, isophorone, etc.; methanol, ethanol, N-propanol, isopropanol, n-butanol, isobutanol, second-butanol, third-butanol, n-pentanol, isoamyl alcohol, second-pentanol Third-pentanol, 1-ethyl-1-propanol, 2-methyl-1-butanol, n-hexanol, cyclohexanol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, B Alcohols such as diol monopropyl ether and ethylene glycol monobutyl ether; tetrahydrofuran, 1,4-two Ethers such as alkane; dimethylformamide, dimethylacetamide, diacetone alcohol, acetonitrile, others, diethylamine containing ammonia, triethylamine, diethanolamine, triethanolamine, N, N - dimethylethanolamine, N,N-diethylethanolamine, N-diethanolamine, 3-methoxypropylamine, 3-diethylaminopropylamine, dimethylaminopropylamine, etc. Organic amine compounds; and the like.
其中,從可得到安定之液狀物,易進行塗布之觀點,以甲苯、二甲苯、苯、Solvesso 100、Solvesso 150等之芳香族烴類、丁烷、戊烷、己烷、環己烷、庚烷、辛烷、壬烷等之脂肪族烴類為較佳,從溶解度之觀點,以甲苯為特佳。 Among them, aromatic hydrocarbons such as toluene, xylene, benzene, Solvesso 100, and Solvesso 150, butane, pentane, hexane, and cyclohexane are used from the viewpoint of obtaining a stable liquid material and facilitating coating. An aliphatic hydrocarbon such as heptane, octane or decane is preferred, and toluene is particularly preferred from the viewpoint of solubility.
又,從液狀物之安定性提升、溶解度之提升、於基材之塗布性、塗布外觀之改善等之觀點,亦可組合使用上述之有機溶劑2種類以上。使用有機溶劑2種類以上時,以組合使用芳香族烴類、醇類及/或酮類較佳。使用有機溶劑2種類以上時之芳香族烴類係以甲苯、二甲苯等為較佳,醇類係以甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇等為較佳,酮類係以丙酮、甲基乙基酮、異丁基酮、甲基異丁基酮等為較佳。 In addition, from the viewpoints of the improvement of the stability of the liquid material, the improvement of the solubility, the coating property of the substrate, and the improvement of the coating appearance, two or more kinds of the above organic solvents may be used in combination. When two or more types of organic solvents are used, it is preferred to use an aromatic hydrocarbon, an alcohol, and/or a ketone in combination. When two or more types of organic solvents are used, the aromatic hydrocarbons are preferably toluene, xylene or the like, and the alcohols are preferably methanol, ethanol, n-propanol, isopropanol, n-butanol or isobutanol. The ketone is preferably acetone, methyl ethyl ketone, isobutyl ketone, methyl isobutyl ketone or the like.
藉由組合使用此等之溶劑,可提升整平性,解決塗膜之干涉條紋,得到塗布外觀優異的離模片材。使用具有干涉條紋之離模片材時,有於黏著劑等之表面轉印干涉條紋之虞,有時對於光學系之材料無法使用。 By using these solvents in combination, the leveling property can be improved, the interference fringes of the coating film can be solved, and a release sheet excellent in coating appearance can be obtained. When a release sheet having interference fringes is used, there is a possibility that the interference fringe is transferred to the surface of the adhesive or the like, and it may not be used for the optical material.
混合2種類以上之有機溶劑時之混合比率係無特別限定,芳香族烴系溶劑與醇類及/或酮類之質量比((芳香族烴系溶劑)/(醇類及/或酮類))係以99/1至50/50為較佳,以97/3至70/30為更佳,以95/5至80/20為最佳。 The mixing ratio in the case of mixing two or more kinds of organic solvents is not particularly limited, and the mass ratio of the aromatic hydrocarbon solvent to the alcohol and/or the ketone ((aromatic hydrocarbon solvent) / (alcohol and/or ketone) It is preferably from 99/1 to 50/50, more preferably from 97/3 to 70/30, and most preferably from 95/5 to 80/20.
將液狀物塗布於基材上而形成樹脂層之方法中係藉由公知之方法、例如凹版輥塗布、逆式輥塗布、 線棒塗布、模唇塗布、氣刀式塗布、簾流塗布、噴塗塗布、浸漬塗布、刮板塗布法等,使液狀物均一塗布於基材表面,依需要而於室溫左右安置後,供給至乾燥處理或用以乾燥之加熱處理,藉此,可使均一樹脂層密黏於基材而形成。 The method of applying a liquid to a substrate to form a resin layer is carried out by a known method such as gravure roll coating, reverse roll coating, Wire bar coating, lip coating, air knife coating, curtain coating, spray coating, dip coating, blade coating, etc., so that the liquid is uniformly applied to the surface of the substrate, and after being placed at room temperature as needed, It is supplied to a drying process or a heat treatment for drying, whereby a uniform resin layer can be formed by adhering to a substrate.
於基材上形成樹脂層後,為促進酸改質乙烯-α-烯烴共聚物與交聯劑之反應,亦可於被控制在一定之溫度之環境下進行老化處理。老化溫度係從對基材減輕損傷之觀點,以比較低者為較佳,從使反應充分且迅速進行之觀點,以高溫處理為較佳。老化處理係在20至100℃進行為較佳,以30至70℃進行為更佳,以40至60℃進行為最佳。 After the resin layer is formed on the substrate, in order to promote the reaction between the acid-modified ethylene-α-olefin copolymer and the crosslinking agent, the aging treatment may be carried out under an environment controlled to a certain temperature. The aging temperature is preferably from the viewpoint of reducing the damage to the substrate, and is preferably a high temperature treatment from the viewpoint of allowing the reaction to proceed sufficiently and rapidly. The aging treatment is preferably carried out at 20 to 100 ° C, more preferably 30 to 70 ° C, and most preferably 40 to 60 ° C.
製作含有酸改質乙烯-α-烯烴共聚物、交聯劑與介質之液狀物之方法可舉例如於成為介質之有機溶劑中使酸改質乙烯-α-烯烴共聚物與交聯劑溶解之方法。 A method for producing a liquid containing an acid-modified ethylene-α-olefin copolymer, a crosslinking agent and a medium, for example, dissolving an acid-modified ethylene-α-olefin copolymer and a crosslinking agent in an organic solvent serving as a medium The method.
又,製作液狀物之方法可舉例如使酸改質乙烯-α-烯烴共聚物為水性分散體,混合交聯劑之方法。使酸改質乙烯-α-烯烴共聚物分散於水性介質、得到水性分散體之方法係無特別限定,可舉例如於可密閉之容器中投入酸改質乙烯-α-烯烴共聚物、有機溶劑、水等之原料,使槽內之溫度保持於40至150℃左右之溫度同時並攪拌,藉此形成水性分散體之方法等。可舉例如國際公開02/055598號手冊所記載之方法,在水性介質中使用鹼性化合物而中和酸改質乙烯-α-烯烴共聚物,得到良好的水性分散體。 Further, a method for producing a liquid material may, for example, be a method in which an acid-modified ethylene-α-olefin copolymer is an aqueous dispersion and a crosslinking agent is mixed. The method of dispersing the acid-modified ethylene-α-olefin copolymer in an aqueous medium and obtaining the aqueous dispersion is not particularly limited, and for example, an acid-modified ethylene-α-olefin copolymer or an organic solvent is introduced into a container that can be sealed. A method of forming an aqueous dispersion by maintaining the temperature in the tank at a temperature of about 40 to 150 ° C while stirring the raw material such as water. For example, a method described in International Publication No. 02/055598 can be used to neutralize an acid-modified ethylene-α-olefin copolymer by using a basic compound in an aqueous medium to obtain a good aqueous dispersion.
液狀物中之固形分之含有率係可依樹脂層 之形成條件或厚度、性能等而適當選擇,無特別限定,但為適度地保持液狀物之黏度,且形成良好之樹脂層,以1至60質量%為較佳,以2至20質量%為更佳。 The content of the solid component in the liquid can be based on the resin layer The formation conditions, thickness, performance, and the like are appropriately selected, and are not particularly limited, but the viscosity of the liquid material is moderately maintained, and a good resin layer is formed, preferably from 1 to 60% by mass, and from 2 to 20% by mass. For better.
構成離模片材之基材係可舉例如以樹脂材料、紙、合成紙、布、金屬材料、玻璃材料等所形成者。基材之厚度係無特別限定,一般只要為1至1000μm即可,以1至500μm較佳,以10至200μm更佳,以25至100μm特佳。 The base material constituting the release sheet may be formed, for example, of a resin material, paper, synthetic paper, cloth, metal material, glass material or the like. The thickness of the substrate is not particularly limited and is generally preferably from 1 to 1000 μm, more preferably from 1 to 500 μm, still more preferably from 10 to 200 μm, still more preferably from 25 to 100 μm.
可使用於基材之樹脂材料係可舉例如作為熱塑性樹脂之聚對苯二甲酸乙二酯(PET)、聚對萘二甲酸乙二酯(PEN)、聚乳酸(PLA)等之聚酯樹脂;聚丙烯等之聚烯烴樹脂;聚苯乙烯樹脂;尼龍6、聚-間-二甲苯基己二醯胺(MXD6尼龍)等之聚醯胺樹脂;聚碳酸酯樹脂;聚丙烯腈樹脂;聚醯亞胺樹脂;此等之樹脂之複層體(例如尼龍6/MXD6尼龍/尼龍6、尼龍6/乙烯-乙烯醇共聚物/尼龍6)或混合體等。 The resin material to be used for the substrate may, for example, be a polyester resin such as polyethylene terephthalate (PET), polyethylene terephthalate (PEN) or polylactic acid (PLA) as a thermoplastic resin. Polyolefin resin such as polypropylene; polystyrene resin; polyamine resin such as nylon 6, poly-m-phenylphenyl hexamethylenediamine (MXD6 nylon); polycarbonate resin; polyacrylonitrile resin; A quinone imine resin; a laminate of such resins (for example, nylon 6/MXD6 nylon/nylon 6, nylon 6/ethylene-vinyl alcohol copolymer/nylon 6) or a mixture.
樹脂材料係亦可經延伸處理。其中,基材係以機械特性及熱特性優異之聚酯樹脂薄膜為較佳,就廉價且容易取得之點,以聚對苯二甲酸乙二酯薄膜為較佳。 The resin material can also be subjected to elongation treatment. Among them, the base material is preferably a polyester resin film excellent in mechanical properties and thermal properties, and is inexpensive and easily available, and a polyethylene terephthalate film is preferable.
於熱塑性樹脂薄膜塗布液狀物時,亦可在塗布於經二軸延伸之薄膜後,進行乾燥、熱處理,亦可於配向結束以前之未延伸薄膜、或一軸延伸終止之薄膜上塗布液狀物,乾燥後加熱而延伸、或加熱而與乾燥同時地進行延伸、終止配向。後者之未延伸薄膜、或一軸延伸終止 後之薄膜上塗布液狀物之後,進行乾燥、延伸配向之方法係可與熱塑性樹脂薄膜之製膜同時地積層樹脂層,故就成本之點,較佳。 When the liquid crystal is applied to the thermoplastic resin film, it may be dried or heat-treated after being applied to the film which is biaxially stretched, or may be applied to the unstretched film before the end of the alignment or the film which is terminated by the one-axis extension. After drying, it is heated to extend, or heated to extend and terminate the alignment simultaneously with drying. The latter unstretched film, or one-axis extension After the liquid material is applied to the film, the method of drying and stretching is preferably carried out by laminating the resin layer simultaneously with the film formation of the thermoplastic resin film, which is preferable in terms of cost.
上述熱可塑性樹脂薄膜係亦可含有公知之添加劑或安定劑,例如抗靜電劑、可塑劑、潤滑劑、抗氧化劑等。熱塑性樹脂薄膜係亦可蒸鍍二氧化矽、氧化鋁等,亦可積層阻隔層或易接著層、抗靜電層、紫外線吸收層等之其他層。為與其他之材料積層時之密著性良好,亦可於熱塑性樹脂薄膜之表面實施作為前處理之電暈處理、電漿處理、臭氧處理、藥品處理、溶劑處理等。 The thermoplastic resin film may also contain a known additive or stabilizer, such as an antistatic agent, a plasticizer, a lubricant, an antioxidant, or the like. The thermoplastic resin film may be vapor-deposited with cerium oxide, aluminum oxide, or the like, or may be laminated with another layer such as a barrier layer or an easy-adhesion layer, an antistatic layer, or an ultraviolet absorbing layer. The adhesion to other materials may be good, and the surface of the thermoplastic resin film may be subjected to corona treatment, plasma treatment, ozone treatment, pharmaceutical treatment, solvent treatment, or the like as a pretreatment.
可使用來作為基材之紙可舉例如和紙、牛皮紙、內襯紙、藝術紙、塗布紙、厚紙板紙、透明紙、半透明紙等。亦可於紙上設置剝離層等。 Papers which can be used as a substrate include, for example, paper, kraft paper, liner paper, art paper, coated paper, cardboard paper, transparent paper, translucent paper, and the like. A peeling layer or the like may also be provided on the paper.
可使用來作為基材之合成紙其構造係無特別限定、可為單層構造,亦可為多層構造。多層構造係例如基材層與表面層之2層構造、基材層之表裡面存在表面層之3層構造、於基材層與表面層之間存在其他之樹脂薄膜層的多層構造。各層係可含有無機或有機之填充劑,亦可不含有。亦可使用具有許多微細之孔的微多孔性合成紙。 The structure of the synthetic paper which can be used as a base material is not particularly limited, and may be a single layer structure or a multilayer structure. The multilayer structure is, for example, a two-layer structure of a base material layer and a surface layer, a three-layer structure in which a surface layer is present on the surface of the base material layer, and a multilayer structure in which another resin film layer exists between the base material layer and the surface layer. Each layer may contain inorganic or organic fillers or may not. Microporous synthetic paper having a plurality of fine pores can also be used.
可使用來作為基材之布係可舉例如由上述之合成樹脂所構成之纖維或、木綿、絹、麻等之天然纖維所構成之不織布、織布、編布等。 Examples of the fabric which can be used as the substrate include non-woven fabrics, woven fabrics, woven fabrics, and the like which are composed of the above-mentioned synthetic resin or natural fibers such as wood wool, crepe, and hemp.
可使用來作為基材之金屬材料係可舉例如鋁箔或銅箔等之金屬箔、或是鋁板或銅板等之金屬板等。 The metal material which can be used as the base material is, for example, a metal foil such as an aluminum foil or a copper foil, or a metal plate such as an aluminum plate or a copper plate.
可使用來作為基材之玻璃材料係可舉例如由玻璃板或玻璃纖維所構成之布等。 A glass material which can be used as a substrate is, for example, a cloth made of a glass plate or a glass fiber.
本發明之離模片材係因對於各式各樣的材料具有良好的離型性,可對於各式各樣的材料使用,可使本發明之離模片材透過樹脂層而積層於被黏著體,形成積層體。 The release sheet of the present invention has a good release property for a wide variety of materials, and can be used for a wide variety of materials, so that the release sheet of the present invention can be laminated to the adhesive layer through the resin layer. Body, forming a layered body.
本發明之離模片材具體地分別可使用來作為黏著材料或液晶顯示器用零件等之保護材料、作為使用於印刷電路板之沖壓步驟材料或航空機等之構造材等地預浸物之步驟材料、作為片材狀構造體之製造時之基底基材、作為轉印印刷用之離模片材。特別可適宜對於黏著材料使用。 Specifically, the release sheet of the present invention can be used as a protective material for an adhesive material or a component for a liquid crystal display, a step material for a prepreg used as a material for a stamping step of a printed circuit board, or a structural material such as an aircraft. A base substrate at the time of production of a sheet-like structure, and a release sheet for transfer printing. It is particularly suitable for use with adhesive materials.
黏著材料係可舉例如黏著片材、接著片材、黏著膠帶、接著膠帶等。更具體地係於基材積層黏著劑者。黏著劑之成分或基材係無特別限定,黏著劑係可舉例如丙烯酸系黏著劑、天然橡膠系黏著劑、合成橡膠系黏著劑、聚矽氧系黏著劑,此處,亦可含有松脂系、香豆素-茚烯系、萜烯系、石油系、苯乙烯系、酚系、二甲苯系等之增黏劑。基材係可舉例如上述之紙、布、樹脂材料等。 Examples of the adhesive material include an adhesive sheet, a sheet, an adhesive tape, and an adhesive tape. More specifically, it is attached to a substrate-laden adhesive. The component or the substrate of the adhesive is not particularly limited, and examples of the adhesive include an acrylic adhesive, a natural rubber adhesive, a synthetic rubber adhesive, and a polyoxygen adhesive. Here, the adhesive may also contain a rosin-based adhesive. A tackifier such as coumarin-terpene, terpene, petroleum, styrene, phenol or xylene. Examples of the substrate include paper, cloth, and a resin material described above.
對於黏著材料所使用之離模片材係尋求於其處理上離型性優異者,例如尋求丙烯酸系黏著材料之剝離強度為0.5N/cm以下者。對於丙烯酸系黏著材料使用本發明之離模片材時,貼黏丙烯酸系黏著材料,可使放置後之樹脂層與丙烯酸系黏著材料之間之剝離強度為0.5N/cm以下,更佳係0.4N/cm以下,又更佳係0.3N/cm以下,最佳係0.2N/cm 以下。與丙烯酸系黏著材料之剝離強度超過0.5N/cm時,從黏著材料剝離離模片材時,有時因感到阻抗,或黏著材料之表面粗糙,黏著性降低,很難使用來作為丙烯酸系黏著材料用之離模片材。 The release sheet used for the adhesive material is preferably one which is excellent in release property in handling, for example, the peel strength of the acrylic adhesive is 0.5 N/cm or less. When the release sheet of the present invention is used for the acrylic adhesive material, the acrylic adhesive material is adhered to make the peel strength between the resin layer after standing and the acrylic adhesive material 0.5 N/cm or less, more preferably 0.4. Below N/cm, more preferably 0.3N/cm or less, the best system is 0.2N/cm the following. When the peeling strength with the acrylic adhesive material exceeds 0.5 N/cm, when the release sheet is peeled off from the adhesive material, the adhesive may be felt, or the surface of the adhesive material may be rough, and the adhesiveness may be lowered, so that it is difficult to use it as an acrylic adhesive. Release sheet for materials.
即便是對於黏著力強之黏著材料的代表之聚矽氧系黏著材料,亦可使用本發明之離模片材。若對於聚矽氧系黏著材料使用習知之聚矽氧系離模片材,因黏著層與離型層之親和性高,故密著性高,而很難剝離。相對於此,本發明之離模片材係即使對於聚矽氧系黏著材料亦可保持良好的剝離性。對於聚矽氧系黏著材料而使用使用時,貼黏聚矽氧系黏著材料,放置後之樹脂層與聚矽氧系黏著材料之剝離強度為1.0N/cm以下較佳,更佳係0.8N/cm以下,最佳係0.7N/cm以下。 The release sheet of the present invention can be used even for a polyoxygen-based adhesive material which is a representative of an adhesive material having a strong adhesion. When a conventional polyfluorene-based release sheet is used for a polyadoxic adhesive material, since the adhesive layer and the release layer have high affinity, the adhesion is high and peeling is difficult. On the other hand, the release sheet of the present invention can maintain good peelability even for a polyoxynitride-based adhesive material. When used in the case of a polyoxygen-based adhesive material, the adhesive layer is adhered to the polyoxygen-based adhesive material, and the peeling strength of the resin layer and the polyoxyn-based adhesive material after the placement is preferably 1.0 N/cm or less, more preferably 0.8 N. Below /cm, the optimum system is 0.7 N/cm or less.
本發明之離模片材係因耐熱性優異,故貼黏有離模片材之黏著材料在保管、流通之過程中,即使在高溫下長時間曝露,亦經時地剝離強度不變化,貼黏後經過長時間後,亦可使樹脂層與黏著材料之剝離強度之變化亦抑制至很小。 Since the release sheet of the present invention is excellent in heat resistance, the adhesive material adhered to the release sheet is stored and circulated, and even when exposed to a high temperature for a long time, the peel strength does not change over time. After a long period of time after sticking, the change in peel strength between the resin layer and the adhesive material can also be suppressed to a small extent.
在工業上剝離離模片材之步驟中,隨作業生產線之高速化,一般係以超過10m/分之速度,剝離離模片材,故尋求可從黏著材料之高速剝離的離模片材。本發明之離模片材係具有充分的離型性,故即使從黏著材料以高速剝離,亦可無聲音且無阻抗感地剝離。亦即,本發明之離模片材係於高速剝離時,可藉由發出所謂剝開(zipping)或硬滑 (stick-slip)之聲音的現象,藉由黏著材料之表面狀態變粗,抑制透明性或黏著性降低。 In the industrial step of peeling off the release sheet, the release sheet is peeled off at a speed of more than 10 m/min as the speed of the production line is increased. Therefore, a release sheet which can be peeled off from the adhesive material at a high speed is sought. Since the release sheet of the present invention has sufficient release property, even if it is peeled off from the adhesive material at a high speed, it can be peeled off without sound and without a feeling of resistance. That is, the release sheet of the present invention can be so-called stripping or hard slipping at high speed peeling. The phenomenon of the sound of (stick-slip) is suppressed by the surface state of the adhesive material to suppress transparency or adhesion.
可使用本發明之離模片材作為保護材料之液晶顯示器用零件係可舉例如偏光板、位相差偏光板、位相差板等。 Examples of the liquid crystal display device which can use the release sheet of the present invention as a protective material include a polarizing plate, a phase difference polarizing plate, and a phase difference plate.
本發明之離模片材係亦可使用來作為預浸物之步驟材料者,例如,可適宜使用來作為塗布含有環氧樹脂或酚樹脂等之樹脂及硬化劑等的溶液,並乾燥而形成片材時之載體片材。 The release sheet of the present invention can also be used as a step material for the prepreg, and can be suitably used, for example, as a solution containing a resin such as an epoxy resin or a phenol resin, a curing agent, or the like, and dried to form a solution. Carrier sheet when the sheet is used.
本發明之離模片材係亦一併具有耐熱性,故即使在硬化步驟之高溫處理後,亦可維持離型性。預浸物係為提高補強效果,亦可使用碳纖維或玻璃纖維等之織物等之補強材。使用預浸物之步驟係可舉例如印刷電路板之沖壓步驟、航空機、腳踏車、風車等之構造構件之成形步驟、高爾夫球桿、網球拍等之運動休閒用品之成形步驟。印刷電路板係可舉例如單面印刷電路板、雙面印刷電路板、可撓性印刷電路板、多層印刷電路板等。 The release sheet of the present invention also has heat resistance, so that the release property can be maintained even after the high temperature treatment in the hardening step. The prepreg is a reinforcing material such as a fabric such as carbon fiber or glass fiber for improving the reinforcing effect. The steps of using the prepreg include, for example, a stamping step of a printed circuit board, a forming step of a structural member such as an aircraft, a bicycle, a windmill, and the like, and a forming step of a sports and leisure article such as a golf club or a tennis racket. The printed circuit board can be, for example, a single-sided printed circuit board, a double-sided printed circuit board, a flexible printed circuit board, a multilayer printed circuit board, or the like.
可使用本發明之離模片材作為基底基材而製造之片材狀構造體之例係可舉例如聚矽氧橡膠或氟橡膠、胺基甲酸酯橡膠等之橡膠片材、氯乙烯或胺基甲酸酯所構成之合成皮革、半氟磺酸樹脂等之高分子電解質等所構成之離子交換膜或、介電體陶瓷或玻璃等所構成之陶胚片材、含有散熱材料等之散熱片材等。 Examples of the sheet-like structure which can be produced by using the release sheet of the present invention as a base material include rubber sheets such as polyoxyethylene rubber, fluororubber, urethane rubber, vinyl chloride or the like. An ion exchange membrane composed of a synthetic leather composed of a urethane, a polymer electrolyte such as a semi-fluorosulfonic acid resin, or a ceramic sheet composed of a dielectric ceramic or glass, or the like, and a heat dissipating material. Heat sink sheet, etc.
在此等之製造步驟中係可於成為基材之本發明之離模 片材上,塗布以溶劑形成糊狀或漿液狀之原料、乾燥,形成片材狀構造體。或於離模片材上押出使之熔融的樹脂,以形成片材狀構造體。 In the manufacturing steps of the present invention, the mold of the present invention which can be used as a substrate On the sheet, a raw material in the form of a paste or a slurry is applied with a solvent, and dried to form a sheet-like structure. Or, a resin which melts is extruded on the release sheet to form a sheet-like structure.
將本發明之離模片材使用於轉寫印刷用時,藉由塗布於本發明之離模片材上,可形成印刷層、電極、保護層等之各式各樣的機能層,使離模片材上之機能層對於被轉印體進行加熱、壓接,於被轉印體上轉印機能層,然後將離模片材從機能層剝離。如此地,本發明之離模片材係可使用於亦被稱為壓印箔者。機能層係可舉例如金屬箔、顏料箔、多色印刷箔、全像術箔(hologram film)、靜電破壞箔、半鏡面金屬箔等。 When the release sheet of the present invention is used for transfer printing, by applying it to the release sheet of the present invention, various functional layers such as a printed layer, an electrode, and a protective layer can be formed. The functional layer on the mold sheet is heated and crimped to the transfer target, and the functional layer is transferred onto the transfer target, and then the release sheet is peeled off from the functional layer. Thus, the release sheet of the present invention can be used in those also referred to as imprinted foils. The functional layer may, for example, be a metal foil, a pigment foil, a multicolor printing foil, a hologram film, an electrostatic destruction foil, a semi-specular metal foil or the like.
以下,依實施例而說明本發明,但本發明係不受此等限定。 Hereinafter, the present invention will be described by way of Examples, but the present invention is not limited thereto.
(1)酸改質乙烯-α-烯烴共聚物之不飽和羧酸成分含量 (1) The content of unsaturated carboxylic acid component of acid-modified ethylene-α-olefin copolymer
相對於烯烴成分全量,不飽和羧酸成分之含量係使用下記所示之方法(A)或(B)而求出。 The content of the unsaturated carboxylic acid component is determined by the method (A) or (B) shown below with respect to the total amount of the olefin component.
(A):依據JIS K5407測定酸改質乙烯-α-烯烴共聚物之酸價,從其值將不飽和羧酸之含量(分枝率)從次式求出。含量(質量%)=(分枝之不飽和羧酸之質量)/(原料聚烯烴樹脂之質量)×100 (A): The acid value of the acid-modified ethylene-α-olefin copolymer was measured in accordance with JIS K5407, and the content (branched ratio) of the unsaturated carboxylic acid was determined from the following formula. Content (% by mass) = (mass of branched unsaturated carboxylic acid) / (mass of raw material polyolefin resin) × 100
(B):進行紅外線吸收光譜分析(Perkin Elymer公司製傅立葉轉換紅外線外分光光度計System-2000、解析能 4cm-1),求出不飽和羧酸成分之含量。 (B): Infrared absorption spectrum analysis (Fourier-converted infrared spectrophotometer System-2000, manufactured by Perkin Elymer Co., Ltd., analytical energy: 4 cm -1 ) was carried out, and the content of the unsaturated carboxylic acid component was determined.
(2)不飽和羧酸成分以外之酸改質乙烯-α-烯烴共聚物之構成 (2) Composition of acid-modified ethylene-α-olefin copolymer other than unsaturated carboxylic acid component
鄰二氯苯(d4)中,以120℃進行並求出1H-NMR、13C-NMR分析(Varian公司製、300MHz)。以13C-NMR分析係使用考量定量性之附閘門之傾析法而測定。 In the o-dichlorobenzene (d 4 ), 1 H-NMR and 13 C-NMR analysis (manufactured by Varian Co., Ltd., 300 MHz) were carried out at 120 °C. The 13 C-NMR analysis was carried out using a decantation method in which a quantitative gate was considered.
(3)酸改質乙烯-α-烯烴共聚物之熔融流動率 (3) Melt flow rate of acid-modified ethylene-α-olefin copolymer
以依據JIS K 7210(230℃、2160g荷重)之方法測定。 It was measured by the method according to JIS K 7210 (230 ° C, 2160 g load).
(4)對於丙烯酸系黏著劑之剝離強度(常溫) (4) Peel strength (normal temperature) for acrylic adhesive
於所得之離模片材之樹脂層側,將寬度50mm、長度150mm之丙烯酸系黏著膠帶(日東電工公司製、No.31B/丙烯酸系黏著劑)以橡膠輥壓接,而形成試料。將試料以金屬板/橡膠板/試料/橡膠板/金屬板之形式夾住,以2kPa荷重、25℃之環境放置24小時,得到剝離強度測定用試料。在25℃之恆溫室以拉伸試驗機(Intesco公司製、精密萬能材料試驗機、2020型)測定此剝離強度測定用試料之黏著膠帶與離模片材之剝離強度。剝離角度為180℃,剝離速度為300mm/分。 On the resin layer side of the obtained release sheet, an acrylic pressure-sensitive adhesive tape (manufactured by Nitto Denko Corporation, No. 31B/acrylic adhesive) having a width of 50 mm and a length of 150 mm was pressure-bonded to a rubber roller to form a sample. The sample was sandwiched between a metal plate/rubber plate/sample/rubber plate/metal plate, and placed in an environment of 2 kPa load and 25° C. for 24 hours to obtain a sample for measuring the peel strength. The peel strength of the adhesive tape and the release sheet of the peel strength measurement sample was measured by a tensile tester (manufactured by Intesco Co., Ltd., precision universal material testing machine, Model 2020) in a constant temperature room at 25 °C. The peeling angle was 180 ° C, and the peeling speed was 300 mm/min.
(5)對於丙烯酸系黏著劑之剝離強度(70℃) (5) Peel strength for acrylic adhesive (70 ° C)
除將放置試料之條件從25℃之環境變更為70℃之環境以外,係以上述(4)記載之方法得到剝離強度測定用試料。以上述(4)記載之方法測定此剝離強度測定用試料之黏著膠帶與離模片材之剝離強度。 A sample for measuring the peel strength was obtained by the method described in the above (4), except that the conditions for placing the sample were changed from an environment of 25 ° C to an environment of 70 ° C. The peel strength of the adhesive tape and the release sheet of the sample for peel strength measurement was measured by the method described in the above (4).
(6)高速剝離性 (6) High speed peelability
使用以上述(4)記載之方法所得之剝離強度測定用試料,將其離模片材部分以雙面膠帶固定於不鏽鋼板,以手抓持黏著膠帶之端部,一次全部剝離(剝離速度約30m/分)時,手之感觸及發出剝離時之音,以下述指標進行評價。 The peeling strength measurement sample obtained by the method described in the above (4) was used, and the release sheet portion was fixed to a stainless steel plate with a double-sided tape, and the end portion of the adhesive tape was grasped by hand, and all of the release tape was peeled off at a time (peeling speed was about At 30 m/min), the feeling of the hand and the sound of peeling off were evaluated by the following indicators.
○:可無聲音、無阻抗感地剝離。 ○: It can be peeled off without sound or with a sense of impedance.
△:剝開產生聲音,剝離時感覺阻抗。 △: Peeling produces sound, and the impedance is felt when peeling off.
×:因剝開發出很大的聲音,剝離時之阻抗大,故無法以剝離速度約30m/分剝離。 X: Since a large sound was developed due to peeling, the impedance at the time of peeling was large, and it was impossible to peel off at a peeling speed of about 30 m/min.
(7)殘留接著率 (7) Residual adhesion rate
依據前記(4)之剝離強度試驗(常溫)、(5)之剝離強度試驗(70℃)及(6)之高速剝離試驗,從離模片材表面所剝離之寬度50mm、長度150mm之聚酯黏著膠帶(日東電工公司製No.31B/丙烯酸系黏著劑)分別貼黏於不鏽鋼板(SUS 304厚度1mm),在2kPa荷重、室溫下放置20小時。其後,使聚酯黏著膠帶與不鏽鋼板之剝離強度在25℃之恆溫室下以拉伸試驗機(Intesco公司製、精密萬能材料試驗機、2020型)測定。剝離角度係180度,剝離速度係300mm/分。依此測定所得之剝離強度分別設為F1(4)、F1(5)、F1(6)。 According to the peel strength test (normal temperature) of (4), the peel strength test of (5) (70 °C) and the high speed peeling test of (6), the polyester having a width of 50 mm and a length of 150 mm peeled off from the surface of the release sheet Adhesive tape (No. 31B/acrylic adhesive manufactured by Nitto Denko Corporation) was adhered to a stainless steel plate (SUS 304 thickness: 1 mm), and allowed to stand at a load of 2 kPa at room temperature for 20 hours. Then, the peeling strength of the polyester adhesive tape and the stainless steel plate was measured by a tensile tester (manufactured by Intesco Co., Ltd., precision universal material testing machine, Model 2020) under a constant temperature chamber at 25 °C. The peeling angle was 180 degrees, and the peeling speed was 300 mm/min. The peel strengths obtained by this measurement were set to F1 (4) , F1 (5) , and F1 (6), respectively .
對不鏽鋼板(SUS304厚度1mm)貼黏寬度50mm、長度150mm之聚酯黏著膠帶(日東電工公司製No.31B/丙烯酸系黏著劑),在2kPa荷重、室溫下放置20小時。其後,使聚酯黏著膠帶與薄膜之剝離強度在25℃之恆溫室下以拉伸試驗機(Intesco公司製、精密萬能材料試驗機、2020型)測定(剝離角度係180度、剝離速度係300mm/分),所得之 剝離強度設為F2。 A polyester adhesive tape (No. 31B/acrylic adhesive manufactured by Nitto Denko Corporation) having a thickness of 50 mm and a length of 150 mm was applied to a stainless steel plate (SUS304 thickness: 1 mm), and allowed to stand at a load of 2 kPa at room temperature for 20 hours. Then, the peel strength of the polyester adhesive tape and the film was measured by a tensile tester (manufactured by Intesco Co., Ltd., precision universal material testing machine, Model 2020) under a constant temperature chamber at 25 ° C (the peeling angle was 180 degrees, and the peeling speed was 300mm / min), the resulting The peel strength was set to F2.
使用下述式分別得到黏著膠帶之殘留接著率。 The residual adhesion rate of the adhesive tape was obtained by the following formula.
常溫放置後之殘留接著率(%)=(F1(4)/F2)×100 Residual adhesion rate after standing at room temperature (%) = (F1 (4) / F2) × 100
70℃放置後之殘留接著率(%)=(F1(5)/F2)×100 Residual adhesion rate after placement at 70 ° C (%) = (F1 (5) / F2) × 100
高速剝離後之殘留接著率(%)=(F1(6)/F2)×100 Residual adhesion rate after high-speed peeling (%) = (F1 (6) / F2) × 100
黏著膠帶之黏著劑表面被離模片材汚染,或當剝離之時黏著膠帶之表面明顯地變粗時,黏著膠帶之再黏著性降低,損及黏著膠帶之性能。因此,殘留接著率係愈高愈佳。 The surface of the adhesive of the adhesive tape is contaminated by the release sheet, or when the surface of the adhesive tape is significantly thickened when peeled off, the re-adhesiveness of the adhesive tape is lowered to impair the performance of the adhesive tape. Therefore, the higher the residual adhesion rate, the better.
(8)對於聚矽氧系黏著劑之剝離強度(常溫、70℃)、高速剝離性、殘留接著率 (8) Peel strength (normal temperature, 70 ° C), high-speed peelability, and residual adhesion rate of the polyoxygen-based adhesive
在上述(4)至(7)中,替代寬度50mm、長度150mm之丙烯酸系黏著膠帶,而使用寬度25mm、長度150mm之聚矽氧系黏著膠帶(日東電工公司製、No.336/聚矽氧系黏著劑)以外,係以與上述(4)至(7)同樣之方法,對於聚矽氧系黏著劑測定剝離強度(常溫、70℃)、評估高速剝離性、測定殘留接著率。 In the above (4) to (7), an acrylic adhesive tape having a width of 50 mm and a length of 150 mm was used, and a polyoxynoxy adhesive tape having a width of 25 mm and a length of 150 mm (manufactured by Nitto Denko Corporation, No. 336/polyoxyl) was used. In the same manner as in the above (4) to (7), the peel strength (normal temperature, 70 ° C) was measured for the polyoxynoxy adhesive, and the high-speed peelability was evaluated, and the residual adhesion ratio was measured.
(9)塗布外觀(干涉條紋)之評價 (9) Evaluation of coating appearance (interference fringes)
於所得之離模片材之二軸延伸聚酯樹脂薄膜面貼合黒色光澤膠帶(Yamato公司製乙烯膠帶200-50-21),於暗室在三波長螢光(Panasonic公司製FPL 27EX-N)之正下方隔30cm,一邊改變角度一邊以目視觀察干涉條紋之程度,評估塗布外觀。 The biaxially stretched polyester resin film of the obtained release sheet was bonded to a enamel gloss tape (ethylene tape 200-50-21 manufactured by Yamato Co., Ltd.), and was irradiated at three wavelengths in a dark room (FPL 27EX-N manufactured by Panasonic). Immediately below the distance of 30 cm, the degree of interference fringes was visually observed while changing the angle, and the appearance of the coating was evaluated.
◎:幾乎看不到干涉條紋。 ◎: There is almost no interference fringe.
○:稍微看到干涉條紋。 ○: The interference fringes are slightly seen.
△:可看到微弱干涉條紋。 △: Weak interference fringes can be seen.
×:明顯看到干涉條紋。 ×: The interference fringes are clearly seen.
(10)耐壓黏性 (10) Pressure resistance
將所得之離模片材切成2片之50mm×50mm的大小,以樹脂層與樹脂層相反面接觸之方式重疊,以在60℃下施加10kPa之荷重的狀態,放置24小時後,除去荷重而冷卻至室溫後,研究樹脂層與樹脂層相反面之密著狀態,評估耐壓黏性。 The obtained release sheet was cut into two pieces of 50 mm × 50 mm in size, and the resin layer was superposed so as to be in contact with the opposite surface of the resin layer, and a load of 10 kPa was applied at 60 ° C, and after being left for 24 hours, the load was removed. After cooling to room temperature, the state of adhesion of the resin layer to the opposite side of the resin layer was examined, and the pressure resistance was evaluated.
○:於2片之片材看不到密接,或2枚之片材簡單剝離,於樹脂層看不到白化等之變化。 ○: The two sheets were not in close contact with each other, or two sheets were simply peeled off, and no change in whitening or the like was observed in the resin layer.
×:樹脂層產生凝集破壞,或剝離2片之片材後之樹脂層全部變成白色。 X: The resin layer was agglomerated, or the resin layers after peeling off two sheets were all white.
構成樹脂層之樹脂,係使用如下者。 The resin constituting the resin layer is as follows.
P-1: P-1:
使乙烯-丙烯共聚物(乙烯/丙烯=75/25質量%)100g於4口燒瓶中,在氮氣環境下溶解於加熱至130℃之二甲苯400g。然後,於此溶液中分別花費30分鐘加入馬來酸酐之甲苯溶液(5質量%)10g及二異丙苯基過氧化物之甲苯溶液(10質量%)5g,其後,於系統內保持至130℃,使之反應4小時。反應終止後,使所得之反應物投入於大量之丙酮中,使樹脂析出。將此樹脂進一步以丙酮洗淨數次,除去未反應之馬來酸酐後,減壓乾燥而得到酸改質乙烯-α-烯烴共聚物P-1。使用所得之酸改質乙烯-α-烯烴共聚物P-1。 100 g of an ethylene-propylene copolymer (ethylene/propylene = 75/25 mass%) was placed in a 4-necked flask, and dissolved in 400 g of xylene heated to 130 ° C under a nitrogen atmosphere. Then, 10 g of a toluene solution (5 mass%) of maleic anhydride and 5 g of a toluene solution (10 mass%) of dicumyl peroxide were added to the solution for 30 minutes, respectively, and then held in the system until It was allowed to react at 130 ° C for 4 hours. After the reaction was terminated, the obtained reactant was placed in a large amount of acetone to precipitate a resin. This resin was further washed with acetone several times to remove unreacted maleic anhydride, and then dried under reduced pressure to obtain an acid-modified ethylene-α-olefin copolymer P-1. The resulting acid was used to modify the ethylene-α-olefin copolymer P-1.
P-2: P-2:
於P-1之製造中,除將乙烯-丙烯共聚物(乙烯/丙烯=75/25質量%)變更成乙烯-丙烯共聚物(乙烯/丙烯=55/45質量%)以外,係進行同樣之操作而得到酸改質乙烯-α-烯烴共聚物P-2,使用所得之酸改質乙烯-α-烯烴共聚物P-2。 In the production of P-1, the ethylene-propylene copolymer (ethylene/propylene = 75/25 mass%) was changed to an ethylene-propylene copolymer (ethylene/propylene = 55/45 mass%), and the same was carried out. The acid-modified ethylene-α-olefin copolymer P-2 was obtained by the operation, and the obtained acid-modified ethylene-α-olefin copolymer P-2 was used.
P-3: P-3:
在P-1之製造中,除將乙烯-丙烯共聚物(乙烯/丙烯=75/25質量%)變更成乙烯-丁烯共聚物(乙烯/1-丁烯=70/30質量%)以外,係進行同樣之操作而得到酸改質乙烯-α-烯烴共聚物P-3,使用所得之酸改質乙烯-α-烯烴共聚物P-3。 In the production of P-1, except that the ethylene-propylene copolymer (ethylene/propylene = 75/25 mass%) was changed to an ethylene-butene copolymer (ethylene/1-butene = 70/30% by mass), The same operation was carried out to obtain an acid-modified ethylene-α-olefin copolymer P-3, and the obtained acid-modified ethylene-α-olefin copolymer P-3 was used.
P-4: P-4:
在P-1之製造中,除將乙烯-丙烯共聚物(乙烯/丙烯=75/25質量%)變更成乙烯-丙烯共聚物(乙烯/丙烯=90/10質量%)以外,係進行同樣之操作而得到酸改質乙烯-α-烯烴共聚物P-4,使用所得之酸改質乙烯-α-烯烴共聚物P-4。 In the production of P-1, the ethylene-propylene copolymer (ethylene/propylene = 75/25 mass%) was changed to an ethylene-propylene copolymer (ethylene/propylene = 90/10 mass%), and the same was carried out. The acid-modified ethylene-α-olefin copolymer P-4 was obtained by the operation, and the obtained acid-modified ethylene-α-olefin copolymer P-4 was used.
P-5: P-5:
在P-1之製造中,除將馬來酸酐之甲苯溶液(5質量%)之量變更成3g以外,係進行同樣之操作而得到酸改質乙烯-α-烯烴共聚物P-5,使用所得之酸改質乙烯-α-烯烴樹脂P-5。 In the production of P-1, the acid-modified ethylene-α-olefin copolymer P-5 was obtained by the same operation except that the amount of the toluene solution (5 mass%) of maleic anhydride was changed to 3 g. The resulting acid was modified with an ethylene-α-olefin resin P-5.
P-6: P-6:
在P-1之製造中,除將馬來酸酐之甲苯溶液(5質量%)之量變更成20g以外,係進行同樣之操作而得到酸改質乙烯-α-烯烴共聚物P-6,使用所得之酸改質乙烯-α-烯烴共聚物P-6。 In the production of P-1, the acid-modified ethylene-α-olefin copolymer P-6 was obtained by the same operation except that the amount of the toluene solution (5 mass%) of maleic anhydride was changed to 20 g. The resulting acid is modified with an ethylene-α-olefin copolymer P-6.
P-7: P-7:
在P-1之製造中,除將馬來酸酐之甲苯溶液(5質量%)之量變更成40g及將二異丙苯基過氧化物之甲苯溶液(10質量%)之量變更成7g以外,係進行同樣之操作而得到酸改質乙烯-α-烯烴共聚物P-7,使用所得之酸改質乙烯-α-烯烴共聚物P-7。 In the production of P-1, the amount of the toluene solution (5 mass%) of maleic anhydride was changed to 40 g, and the amount of the toluene solution (10 mass%) of dicumyl peroxide was changed to 7 g. The same operation was carried out to obtain an acid-modified ethylene-α-olefin copolymer P-7, and the obtained acid-modified ethylene-α-olefin copolymer P-7 was used.
P-8: P-8:
在P-1之製造中,除使乙烯-丙烯共聚物(乙烯/丙烯=75/25質量%)變更成丙烯-1-丁烯共聚物(丙烯/丁烯=70/30質量%)以外,係進行同樣之操作而得到酸改質乙烯-α-烯烴共聚物P-8,使用所得之酸改質乙烯-α-烯烴共聚物P-8。 In the production of P-1, except that the ethylene-propylene copolymer (ethylene/propylene = 75/25 mass%) was changed to a propylene-1-butene copolymer (propylene/butene = 70/30 mass%), The same operation was carried out to obtain an acid-modified ethylene-α-olefin copolymer P-8, and the obtained acid-modified ethylene-α-olefin copolymer P-8 was used.
P-9: P-9:
使用Arkema公司製、Bondine「LX-4110」(馬來酸酐改質聚乙烯樹脂)。 Bordine "LX-4110" (maleic anhydride modified polyethylene resin) manufactured by Arkema Co., Ltd. was used.
P-10 P-10
使用Kuraray公司製、Kuraprene「LIR-403」(酸改質聚異戊二烯、數平均分子量34000、酸價9至11mgKOH/g)。 Kuraprene "LIR-403" (acid-modified polyisoprene, number average molecular weight 34000, acid value 9 to 11 mgKOH/g) manufactured by Kuraray Co., Ltd. was used.
P-11: P-11:
使用未經酸改質之乙烯-丙烯共聚物(乙烯/丙烯=70/30質量%)。 An ethylene-propylene copolymer (ethylene/propylene = 70/30% by mass) which was not acid-modified was used.
將構成樹脂層之上述樹脂P-1至P-11之組 成、特性表示於表1中。 a group of the above resins P-1 to P-11 constituting the resin layer The composition and characteristics are shown in Table 1.
實施例1 Example 1
使酸改質乙烯-α-烯烴共聚物P-1溶解於甲苯中,製作2質量%之溶液。使酸改質乙烯-α-烯烴共聚物與唑啉化合物之溶液(日本觸媒公司製、Epocros「WS-500」、固形分濃度:39質量%、以異丙醇稀釋)以唑啉化合物之固形分相對於酸改質乙烯-α-烯烴共聚物100質量份為2質量份之方式進行混合而得之液狀物,於二軸延伸聚酯樹脂薄膜(Unitika公司製「EmbletPET-38」、厚度38μm)之電暈處理面,使用線棒塗布後,以140℃乾燥15秒鐘,使厚度0.2μm之樹脂層形成於薄膜上之後,以50℃進行老化2日,得到離模片材。 The acid-modified ethylene-α-olefin copolymer P-1 was dissolved in toluene to prepare a 2% by mass solution. Acid-modified ethylene-α-olefin copolymer and A solution of an oxazoline compound (manufactured by Nippon Shokubai Co., Ltd., Epocros "WS-500", solid concentration: 39% by mass, diluted with isopropanol) A liquid material obtained by mixing a solid content of an oxazoline compound in an amount of 2 parts by mass based on 100 parts by mass of the acid-modified ethylene-α-olefin copolymer, and a biaxially stretched polyester resin film (EmbletPET manufactured by Unitika Co., Ltd.) The corona-treated surface of -38" and thickness 38 μm) was coated with a wire bar, dried at 140 ° C for 15 seconds, and a resin layer having a thickness of 0.2 μm was formed on the film, and then aged at 50 ° C for 2 days to obtain a separation. Mold sheet.
實施例2至10、比較例1、4至6 Examples 2 to 10, Comparative Examples 1, 4 to 6
除將酸改質乙烯-α-烯烴共聚物之種類、交聯劑之種類與含量變更成如表2記載般之以外,係進行與實施例1 同樣之操作,得到離模片材。又,使用日清紡公司製Carbodilite「V-03」作為由羰二醯亞胺化合物所構成之交聯劑。 Except that the type of the acid-modified ethylene-α-olefin copolymer and the type and content of the crosslinking agent were changed as described in Table 2, the same procedure as in Example 1 was carried out. In the same operation, a release sheet was obtained. Further, Carbodilite "V-03" manufactured by Nisshinbo Co., Ltd. was used as a crosslinking agent composed of a carbodiimide compound.
實施例11至15 Examples 11 to 15
在實施例1中,除了將酸改質乙烯-α-烯烴共聚物P-1溶解之介質,替代甲苯而使用表2記載之組成之介質以外,係與實施例1同樣之操作,得到離模片材。 In the same manner as in Example 1, except that the medium in which the acid-modified ethylene-α-olefin copolymer P-1 was dissolved was used as the medium in which the acid-modified ethylene-α-olefin copolymer P-1 was dissolved, the same procedure as in Example 1 was carried out. Sheet.
比較例2 Comparative example 2
使用具備附加熱器之可密閉的耐壓1升容量玻璃容器之攪拌機,將60.0g之馬來酸酐改質聚乙烯樹脂P-9(Arkema公司製、Bondine「LX-4110」)、90.0g之異丙醇、3.0g之三乙基胺及147.0g之蒸餾水饋入玻璃容器內,使攪拌葉之旋轉速度設為300rpm。繼而,將系統內溫度保持於140至145℃進一步攪拌30分鐘。其後,放置於水浴中,以旋轉速度300rpm一邊攪拌一邊冷卻至室溫(約25℃)後,以300網目之不鏽鋼製過濾網(線徑0.035mm、平織)加壓濾過(空氣壓0.2MPa),得到乳白色之均一酸改質聚乙烯樹脂水性分散體E-1。 60.0 g of maleic anhydride modified polyethylene resin P-9 (Bondine "LX-4110" manufactured by Arkema Co., Ltd.) and 90.0 g were used in a mixer equipped with a heat-resistant 1 liter capacity glass container with a heater. Isopropanol, 3.0 g of triethylamine, and 147.0 g of distilled water were fed into a glass vessel to set the rotation speed of the stirring blade to 300 rpm. Then, the temperature in the system was maintained at 140 to 145 ° C and further stirred for 30 minutes. Thereafter, the mixture was placed in a water bath, cooled to room temperature (about 25 ° C) while stirring at a rotation speed of 300 rpm, and then filtered under a pressure of 300 mesh stainless steel filter (wire diameter 0.035 mm, plain weave) (air pressure 0.2 MPa). ), a milky white homo-acid modified polyethylene resin aqueous dispersion E-1 was obtained.
使所得之酸改質聚乙烯樹脂水性分散體E-1與唑啉化合物之溶液以唑啉化合物之固形分相對於酸改質聚乙烯樹脂100質量份成為5質量份之方式混合以外,係進行與實施例1同樣之操作,得到離模片材。 The obtained acid-modified polyethylene resin aqueous dispersion E-1 and a solution of an oxazoline compound A mold release sheet was obtained in the same manner as in Example 1 except that the solid content of the oxazoline compound was mixed in an amount of 5 parts by mass based on 100 parts by mass of the acid-modified polyethylene resin.
比較例3 Comparative example 3
使用具備附加熱器之可密閉的耐壓1升容量玻璃容器之攪拌機,將60.0g之酸改質聚異戊二烯P-10(Kuraray公司製、Kuraprene「LIR-403」)、60.0g之異丙醇、15g之三乙 基胺及165g之蒸餾水饋入玻璃容器內,使攪拌葉之旋轉速度設為300rpm一邊攪拌一邊加熱,使系內溫度保持於120℃進一步攪拌60分鐘。其後,以空冷一邊攪拌一邊冷卻至室溫(約25℃)後,以300網目之不鏽鋼製過濾網(線徑0.035mm、平織)加壓濾過(空氣壓0.2MPa),得到乳白色之均一酸改質聚異戊二烯水性分散體。使所得之酸改質聚異戊二烯水性分散體與唑啉化合物之溶液以唑啉化合物之固形分相對於酸改質聚乙烯樹脂100質量份成為5質量份之方式混合以外,係進行與實施例1同樣之操作,得到離模片材。 60.0 g of acid-modified polyisoprene P-10 (Kuraprene "LIR-403"), 60.0 g, was used in a mixer equipped with a heat-resistant 1 liter capacity glass container with a heater. Isopropanol, 15 g of triethylamine, and 165 g of distilled water were fed into a glass vessel, and the stirring blade was rotated at a rotation speed of 300 rpm while stirring, and the internal temperature was maintained at 120 ° C and further stirred for 60 minutes. Thereafter, the mixture was cooled to room temperature (about 25 ° C) while stirring with air cooling, and then filtered under a pressure of 300 mesh stainless steel filter (wire diameter: 0.035 mm, plain weave) (air pressure: 0.2 MPa) to obtain a milky white homogenous acid. A modified polyisoprene aqueous dispersion. The resulting acid-modified polyisoprene aqueous dispersion and a solution of an oxazoline compound A mold release sheet was obtained in the same manner as in Example 1 except that the solid content of the oxazoline compound was mixed in an amount of 5 parts by mass based on 100 parts by mass of the acid-modified polyethylene resin.
比較例7 Comparative Example 7
在實施例1中,替代唑啉化合物之溶液,而使用使異氰酸酯化合物(BASF公司製、Basonat「HW-100」、固形分濃度:100質量%)以異丙醇稀釋而成之液體,相對於酸改質乙烯-α-烯烴共聚物100質量份成為10質量份之方式混合以外,係進行同樣之操作,得到離模片材。 In the embodiment 1, instead A solution of an oxazoline compound, which is obtained by diluting an isocyanate compound (Basonat "HW-100", solid content concentration: 100% by mass) with isopropanol, with respect to the acid-modified ethylene-α- The same operation was carried out except that 100 parts by mass of the olefin copolymer was mixed in an amount of 10 parts by mass to obtain a release sheet.
比較例8 Comparative Example 8
在實施例1中,替代唑啉化合物之溶液,將環氧化合物(DIC公司製、EPICLON「860-90X」、固形分濃度:90質量%),使用以異丙醇稀釋而成之液體,相對於酸改質乙烯-α-烯烴共聚物100質量份成為5質量份之方式混合以外,係進行同樣之操作,得到離模片材。 In the embodiment 1, instead A solution of an oxazoline compound, an epoxy compound (manufactured by DIC Corporation, EPICLON "860-90X", solid content concentration: 90% by mass), a liquid diluted with isopropanol, and an acid-modified ethylene-α The same operation was carried out except that 100 parts by mass of the olefin copolymer was mixed in an amount of 5 parts by mass to obtain a release sheet.
比較例9 Comparative Example 9
在實施例1中,替代唑啉化合物之溶液,使用將三聚氰胺系化合物(日本Cytecs Industrials公司製、Cymel 「325」、固形分濃度:80質量%)以異丙醇稀釋而成之液體,相對於酸改質乙烯-α-烯烴共聚物100質量份成為10質量份之方式混合以外,係進行同樣之操作,得到離模片材。 In the embodiment 1, instead As a solution of the oxazoline compound, a liquid obtained by diluting a melamine-based compound (Cymel "325" manufactured by Cytecs Industrials Co., Ltd., solid concentration: 80% by mass) with isopropanol was used to modify ethylene-α- with respect to acid. The same operation was carried out except that 100 parts by mass of the olefin copolymer was mixed in an amount of 10 parts by mass to obtain a release sheet.
對於實施例、比較例所得之離模片材評價之結果表示於表2中。 The results of evaluation of the release sheets obtained in the examples and the comparative examples are shown in Table 2.
設有含有實施例1至15所得之酸改質乙烯- α-烯烴共聚物、與本發明規定之種類與量之交聯劑的樹脂層之離模片材,係離型性、耐熱性、高速剝離性、耐壓黏性優異者。如實施例11至15所示,使用甲苯與醇之混合物、或甲苯與酮之混合物作為液狀物之介質時,於塗布外觀為亦優異者。實施例2係構成酸改質乙烯-α-烯烴共聚物之乙烯成分與α-烯烴成分之質量比並非為較佳範圍,故離型性、高速剝離性稍降低。實施例7係構成酸改質乙烯-α-烯烴共聚物之酸改質成分之含量並非為較佳範圍,故離型性稍降低。 Provided with the acid-modified ethylene obtained in Examples 1 to 15 - The release sheet of the resin layer of the α-olefin copolymer and the cross-linking agent of the type and amount specified in the present invention is excellent in release property, heat resistance, high-speed peelability, and pressure-resistant adhesiveness. As shown in Examples 11 to 15, when a mixture of toluene and an alcohol or a mixture of toluene and a ketone was used as a medium for the liquid, the coating appearance was also excellent. In the second embodiment, the mass ratio of the ethylene component to the α-olefin component constituting the acid-modified ethylene-α-olefin copolymer is not in a preferable range, so that the release property and the high-speed peelability are slightly lowered. In Example 7, the content of the acid-modified component constituting the acid-modified ethylene-α-olefin copolymer was not in a preferable range, so that the release property was slightly lowered.
另一方面,構成樹脂層之樹脂係使用不同時含有乙烯成分與α-烯烴成分時(比較例1、2),所得之離模片材係離型性、高速剝離性差者。又,構成樹脂層之樹脂係使用酸改質聚異戊二烯時(比較例3),所得之離模片材係具有優異的離型性及耐熱性、殘留接著性,但耐壓黏性明顯降低。 On the other hand, when the resin constituting the resin layer contains an ethylene component and an α-olefin component at different times (Comparative Examples 1 and 2), the obtained release sheet is inferior in release property and high-speed peelability. Further, when the resin constituting the resin layer is an acid-modified polyisoprene (Comparative Example 3), the obtained release sheet has excellent mold release property, heat resistance, and residual adhesion, but is resistant to pressure. obviously decased.
構成樹脂層之樹脂係使用未經酸改質者之時(比較例4),所得之離模片材係、耐熱性差、受熱處理之離型性明顯降低。 When the resin constituting the resin layer was used without being acid-modified (Comparative Example 4), the obtained release sheet was inferior in heat resistance and the release property by heat treatment was remarkably lowered.
樹脂層為含有交聯劑時(比較例5),離模片材係受熱處理之離型性明顯降低。樹脂層中之交聯劑之含量較本發明規定之範圍更多時(比較例6),所得之離模片材係在常溫之離型性差,受熱處理之離型性更降低。 When the resin layer contained a crosslinking agent (Comparative Example 5), the release property of the release sheet by heat treatment was remarkably lowered. When the content of the crosslinking agent in the resin layer was more than the range specified in the present invention (Comparative Example 6), the obtained release sheet was inferior in leaving property at normal temperature, and the release property by heat treatment was further lowered.
使用本發明未規定之交聯劑時(比較例7至9)、所得之離模片材係耐熱性差、受熱處理之離型性明顯降低。 When the crosslinking agent not specified in the present invention was used (Comparative Examples 7 to 9), the obtained release sheet was inferior in heat resistance and the release property by heat treatment was remarkably lowered.
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