TW201520147A - Packing structure - Google Patents

Abstract

A packing structure used for packing an electronic device is provided. The packing structure includes a first gas column pocket and a second gas column pocket. The first gas column pocket and the second gas column pocket respectively has a main buffer portion, a sub buffer portion, and a first opening located between the main buffer portion and the sub buffer portion. The main buffer portions connected to each other and exists a split line therebetween. The sub buffer portions maintain a gap so as to define a second opening. When the first gas column pocket and the second gas column pocket are not inflated, the electronic device passes through the first openings from the second opening so as to accommodate in the packing structure. When the first gas column pocket and the second gas column pocket are inflated and expanded, the electronic device is held in the packing structure.

Description

Packaging structure

This invention relates to a package structure and, more particularly, to an inflatable package structure.

In recent years, with the development of the technology industry, the use of various electronic devices such as smart phones, notebooks, tablet PCs, and thin clients has become more and more popular. It is universal and is moving towards a convenient, versatile and aesthetically pleasing design to provide users with more choices.

Generally, an electronic device or its components are protected by a packaging structure during manufacture or shipment. At present, it is more common to provide a plurality of cushioning members, such as partitions, paper or plastic linings, plastic-filled foams, blister cushions, and air column bags, in the package to avoid electronic products being transported. During the period, it will shake and hit the wall of the package box, or it will directly hit the ground and external objects after falling, thereby protecting the electronic products in the package.

In the current state of the art, the cushioning member is usually provided with two electronic products. Side or four corners to engage the electronic product. In this configuration, although the purpose of collision avoidance and buffering can be achieved, it cannot be used as an anti-theft warning. That is to say, if the electronic product has been taken out of the box by the person concerned during the transportation and the electronic product is put back into the package after use, the supplier and the consumer are also difficult to obtain from the package or the electronic product. The external observations are aware of the above.

The invention provides a packaging structure which has better buffering effect and can achieve the effect of anti-theft warning.

The present invention provides a packaging structure for packaging electronic devices. The packaging structure includes a first air column bag and a second air column bag. The second air column bag is connected to the first air column bag. The first air column bag and the second air column bag respectively have a main buffer portion, a sub-buffer portion, and a first opening between the main buffer portion and the sub-buffer portion. The two main buffer portions are connected to each other with a tear line therebetween. The two sub-buffers are spaced apart to define a second opening. When the first air bag and the second air bag are not inflated, the electronic device is adapted to pass through the two first openings from the second opening to be received in the packaging structure. After the first air bag and the second air bag are inflated, the electronic device is held in the packaging structure.

Based on the above, the packaging structure of the present invention is composed of a first air column bag and a second air column bag connected to each other, wherein the electronic device can be easily used when the first air column bag and the second air column bag are not inflated. Placed in it. When the first air bag and the second air bag are inflated, the electronic device can be firmly held in the packaging structure and cannot be easily taken out. In other words, the first air column bag and the second air column bag after inflation and inflation can be As a buffer for the electronic device, the electronic device is prevented from being struck by shaking during transportation, or directly hitting the ground or an external object after falling.

On the other hand, when the first air column bag and the second air column bag are to be taken out from the inflated air bag, the first air column bag and the second air column bag are separated along the tear line. Specifically, the separated first air column bag and the second air column bag cannot be restored to the initial state, that is, the first air column bag and the second air column bag are connected to each other with the tearing therebetween. line. Therefore, the tear line can be used as a burglar warning for the supplier and the consumer to judge whether the electronic device has been taken out of the package by the person concerned during the transportation.

The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧Packaging structure

110‧‧‧First air bag

111, 121‧‧‧ main buffer

112, 122‧‧‧ sub-buffer

113, 123‧‧‧ first opening

130‧‧‧ gas column

131‧‧‧ main airbag

132‧‧‧Sub-airbag

133‧‧‧Bundle point

134‧‧‧ inflatable passage

115, 125‧‧‧ side buffer

120‧‧‧Second air bag

200‧‧‧Electronic devices

201‧‧‧ top surface

202‧‧‧ bottom

203‧‧‧ side wall

A1, A2‧‧‧ distribution area

C1, C2‧‧‧ opening cross-sectional area

G‧‧‧ spacing

OP‧‧‧ second opening

SPL‧‧‧Tear open line

1 and 2 are schematic diagrams showing the packaging of an electronic device and a package structure that has not been inflated according to an embodiment of the present invention.

Figure 3 is a schematic illustration of the package structure of Figure 1 in another perspective.

4 is a schematic view showing the packaging of the electronic device of FIG. 2 and the inflated package structure.

5 and FIG. 6 are schematic views of the inflated package structure of FIG. 4 in two different viewing angles, respectively.

Figure 7 is a schematic illustration of the disassembly of the electronic device of Figure 4 and the package structure after inflation and expansion Figure.

1 and 2 are schematic diagrams showing the packaging of an electronic device and a package structure that has not been inflated according to an embodiment of the present invention. Figure 3 is a schematic illustration of the package structure of Figure 1 in another perspective. Referring to FIGS. 1 through 3, in the present embodiment, the package structure 100 can be used to package the electronic device 200. The electronic device 200 may be a liquid crystal display, a plasma display, a tablet computer, a notebook computer, or an all-in-one PC (AIO PC), which is not limited herein.

The package structure 100 includes a first air column pouch 110 and a second air column pouch 120. The material of the first air column bag 110 and the second air column bag 120 is, for example, a cleavable polyethylene (PE) to avoid environmental pollution. Specifically, the second air bag 120 is connected to the first air bag 110, wherein the first air bag 110 has a main buffer portion 111, a sub-buffer portion 112, and a portion between the main buffer portion 111 and the sub-buffer portion 112. An opening 113, and the second air bag 120 also has a main buffer portion 121, a sub-buffer portion 122, and a first opening 123 between the main buffer portion 121 and the sub-buffer portion 122. On the other hand, the main buffer portions 111 and 121 are connected to each other with a tear line SPL therebetween, that is, the first air column pouch 110 and the second air column pouch 120 are symmetrically disposed, for example, on the tear line SPL. The two sides of the first opening 113 are aligned with the first opening 123.

As shown in FIG. 3, the first air column bag 110 and the second air column bag 120 include a plurality of air columns 130 that are independent of each other and are connected to each other, wherein each air column 130 includes a main air bag 131 and two sub air cells 132 (FIG. 1). Only one is shown in FIG. 3, and the two sub-balloons 132 Located on opposite sides of the main airbag 131, and there is a bundle point 133 between any of the sub-balloons 132 and the main airbag 131. And each of the air cylinders 130 has a plurality of inflation passages 134 communicating between the primary airbag 131 and any one of the sub-bags 132, wherein the bundle points 133 are located between any two adjacent inflation passages 134.

When the first air bag 110 and the second air bag 120 have not been inflated, the sub-buffer portions 111 and 112 maintain a spacing G to define a second opening OP, wherein the second opening OP has a distribution area of A1. Specifically, after the sub-buffer portion 112 (or the sub-buffer portion 122) is relatively unfolded with the main buffer portion 111 (or the main buffer portion 121), the maximum range of the first opening 113 (or the first opening 123) can be covered. The opening cross-sectional area is defined as C1, as shown in Figures 1 and 3.

Due to the material properties (ie, the flexibility) of the first air column bag 110 and the second air column bag 120, the first opening is inflated during the inflation process of the first air column bag 110 and the second air column bag 120. 113 and the first opening 123 opening sectional area C1, the spacing G between the sub-buffer portions 112 and 122, and the distribution area A1 of the second opening OP are gradually reduced. In other words, when the first air bag 110 and the second air bag 120 are not inflated, the first air bag 110 and the second air bag 120 provide sufficient space and way for the electronic device 200 to be easily removed from the first The two openings OP pass through the first openings 113 and 123, respectively, to be received in the package structure 100.

4 is a schematic view showing the packaging of the electronic device of FIG. 2 and the inflated package structure. 5 and FIG. 6 are schematic views of the inflated package structure of FIG. 4 in two different viewing angles, respectively. Referring to FIG. 4 to FIG. 6 , when the first air bag 110 and the second air bag 120 are inflated, the distribution area of the second opening OP is not yet inflated. A1 shrinks to A2, wherein the ratio of A2 to A1 is, for example, 0.6. On the other hand, the opening cross-sectional areas of the first openings 113 and 123 are both contracted from C1 to C2 when not inflated, wherein the ratio of C2 to C1 is, for example, between 0.4 and 0.6. Specifically, after the package structure 100 is inflated, the maximum range of opening cross-sectional area that the first opening 113 (or the first opening 123) can cover is defined as C2.

At this time, since the opening cross-sectional areas of the first opening 113 and the second opening 123 are both contracted from C1 to C2, and the distribution area of the second opening OP is contracted from A1 to A2, the electronic device 200 is held in the package structure 100, and Can't be easily removed. On the other hand, the top surface 201 of the electronic device 200 bears against the main buffer portions 111 and 121, and the back surface 202 of the top surface 201 bears against the sub-buffer portions 112 and 122, and the second opening OP exposes the back surface 202. Partial. In other words, the main airbags 131 located in the main buffer unit 111 and the main buffer unit 121 are in contact with the top surface 201, and the main airbags 131 located in the sub-buffering unit 112 and the sub-buffering unit 122 are in contact with the back surface 202, and the sub-bags 132 are in contact with each other. The side wall 203 of the electronic device 200. According to this, when the electronic device 200 is accidentally dropped or subjected to the impact of the foreign object, the inflated main airbag 131 and the sub-bag 132 can be used as a buffer for the electronic device 200 to prevent the electronic device 200 from being broken or damaged.

In the present embodiment, the first air column bag 110 further has a side buffer portion 115, and the second air column bag 120 further has a side buffer portion 125, wherein the side buffer portion 115 is connected between the main buffer portion 111 and the sub buffer portion 112. The side buffer portion 125 is connected between the main buffer portion 121 and the sub buffer portion 122. That is, the side buffer portion 115 and the first opening 113 are located on opposite sides of the sub-buffer portion 112 , and the side buffer portion 125 and the first opening 123 are located on opposite sides of the sub-buffer portion 122 .

At this time, the main airbag 131 and the sub airbag 132 located in the side buffer portion 115 and the side buffer portion 125 abut against the side wall 203 of the electronic device 200, respectively. According to this, when the electronic device 200 is accidentally dropped or subjected to the impact of the foreign object, the main airbag 131 and the sub-bag 132 located in the side buffer portion 115 and the side buffer portion 125 can also serve as a buffer for the electronic device 200, thereby avoiding the electronic device 200. Rupture or damage.

Specifically, since the parallel main airbags 131 are independent of each other, when the internal gas of one of the main airbags 131 is dissipated, the internal gas of the other main airbags 131 is not lost. Similarly, when the internal gas of one of the parallel and independent sub-balloons 132 is dissipated, the internal gas of the other sub-balloons 132 is not lost.

On the other hand, the main bag 131 and the connected sub-balloon 132 are separated by the bundle point 133, and the inflation passage 134 is provided with a check valve (not shown), so that when the internal gas of the sub-balloon 132 is lost It does not cause the internal gas of the main airbag 131 connected thereto to be lost. Similarly, when the internal gas of the main airbag 131 is lost, the internal gas of the sub-balloon 132 communicating therewith is not lost.

In short, in the case where the internal gas of the partial air column 130, the main air bag 131 or the sub-balloon 132 is lost, the other portions of the air column 130, the main air bag 131 or the sub-balloon 132 can still maintain the inflated state. As a buffer of the electronic device 200, the electronic device 200 is prevented from being broken or damaged after being accidentally dropped or subjected to an impact of a foreign object.

Figure 7 is a disassembly of the electronic device of Figure 4 and the package structure after inflation and expansion schematic diagram. Referring to FIG. 4 and FIG. 7 , when the first air bag 110 and the second air bag 120 are inflated and the electronic device 200 is held in the packaging structure 100, an external force is applied to the tear line SPL, so that the first buffer is applied. The portion 111 and the second buffer portion 121 are separated along the tear line SPL to take out the electronic device 200. Specifically, the separated first air bag 110 and the second air bag 120 cannot be restored to the initial state, that is, the first air bag 110 and the second air bag 120 are connected to each other and between the two. There is this tear line SPL.

In other words, the tear line SPL can be used as a burglar alarm for the supplier and the consumer to determine whether the electronic device 200 has been taken out of the package by the person concerned during the transportation. On the other hand, in the embodiment not shown, the separated first air bag 110 and the second air bag 120 can still be engaged with each other in the manner in which the second air bag 120 can be docked. In this way, the electronic device 200 can also be prevented from being broken or damaged after being accidentally dropped or subjected to the impact of the foreign object.

In summary, the packaging structure of the present invention is composed of a first air column bag and a second air column bag connected to each other, wherein when the first air column bag and the second air column bag are not inflated, the The electronic device is housed therein. When the first air bag and the second air bag are inflated, the electronic device can be firmly held in the packaging structure and cannot be easily taken out. In other words, the first air column bag and the second air column bag after inflation and inflation can be used as a buffer for the electronic device to prevent the electronic device from being struck by shaking during transportation, or directly hitting the ground and foreign objects after falling.

On the other hand, when the first air column bag and the second air column bag are to be taken out from the inflated air bag, the first air column bag and the second air column bag are separated along the tear line. Open. Specifically, the separated first air column bag and the second air column bag cannot be restored to the initial state, that is, the first air column bag and the second air column bag are connected to each other with the tearing therebetween. line. Therefore, the tear line can be used as a burglar warning for the supplier and the consumer to judge whether the electronic device has been taken out of the package by the person concerned during the transportation.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Packaging structure

110‧‧‧First air bag

111, 121‧‧‧ main buffer

112, 122‧‧‧ sub-buffer

113‧‧‧ first opening

130‧‧‧ gas column

131‧‧‧ main airbag

132‧‧‧Sub-airbag

133‧‧‧Bundle point

125‧‧‧ side buffer

120‧‧‧Second air bag

200‧‧‧Electronic devices

201‧‧‧ top surface

202‧‧‧ bottom

203‧‧‧ side wall

SPL‧‧‧Tear open line

Claims (9)

a packaging structure for packaging an electronic device, comprising: a first air column bag; and a second air column bag connecting the first air column bag, the first air column bag and the second air column bag Each has a main buffer portion, a sub-buffer portion, and a first opening between the main buffer portion and the sub-buffer portion. The two main buffer portions are connected to each other with a tear line therebetween. The sub-buffer portion maintains a spacing to define a second opening, and when the first air column bag and the second air column bag are not inflated, the electronic device is adapted to pass through the two first openings respectively from the second opening The electronic device is held in the packaging structure after the first air column bag and the second air column bag are inflated and expanded. The packaging structure of claim 1, wherein when the first air column bag and the second air column bag are not inflated, the second opening has a distribution area of A1, when the first air column bag is After the second air bag is inflated, the distribution area of the second opening is contracted to A2, and the ratio of the distribution area A2 to A1 is 0.6. The packaging structure of claim 1, wherein a top surface of the electronic device when the first air column bag and the second air column bag are inflated to hold the electronic device in the packaging structure Relying on the two main buffer portions, a back surface of the top surface bears against the two sub-buffer portions, and the second opening exposes a portion of the back surface. The packaging structure of claim 2, wherein the first air column bag and the second air column bag are inflated and the electronic device is held in the packaging structure Internally, an external force is applied to the tear line, so that the first buffer portion and the second buffer portion are separated along the tear line to take out the electronic device. The packaging structure of claim 1, wherein when the first air column bag and the second air column bag are not inflated, the opening cross-sectional area of each of the first openings is C1, when the first air column After the bag and the second air bag are inflated, the opening cross-sectional area of each of the first openings is contracted to C2, and the ratio of the opening cross-sectional areas C2 to C1 is between 0.4 and 0.6. The packaging structure according to claim 1, wherein the first air column bag and the second air column bag further have a side buffer portion, and each of the side buffer portions is connected to the corresponding main buffer portion and the sub-buffer portion. Between the buffers. The package structure of claim 1, wherein the first air column bag and the second air column bag respectively comprise a plurality of air columns independent of each other and connected to each other, each of the air columns comprising: a main air bag; And two sub-balloons are located on opposite sides of the main airbag and are in communication therewith, and the main airbag and each of the sub-bags have a bundle point. The packaging structure of claim 7, wherein each of the air columns has a plurality of inflation passages communicating between the main airbag and each of the sub-airbags, each of the bundle points being located adjacent to the two adjacent ones. Between the inflatable channels. The packaging structure of claim 1, wherein the material of the first air column bag and the second air column bag comprises a cleavable polyethylene.