TW201517397A - Connector inserts and receptacle tongues formed using printed circuit board - Google Patents

Connector inserts and receptacle tongues formed using printed circuit board Download PDF

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TW201517397A
TW201517397A TW103129086A TW103129086A TW201517397A TW 201517397 A TW201517397 A TW 201517397A TW 103129086 A TW103129086 A TW 103129086A TW 103129086 A TW103129086 A TW 103129086A TW 201517397 A TW201517397 A TW 201517397A
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Taiwan
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printed circuit
circuit board
contacts
connector insert
connector
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TW103129086A
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Chinese (zh)
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TWI614949B (en
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Mahmoud R Amini
Zheng Gao
Dennis R Pyper
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Apple Inc
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Abstract

Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.

Description

使用印刷電路板形成之連接器插件及插座舌片 Connector inserts and socket tabs formed using printed circuit boards 相關申請案之交叉參考Cross-reference to related applications

本申請案主張2013年8月23日申請之美國臨時專利申請案第61/869,585號及2013年11月17日申請之美國臨時專利申請案第61/905,275號的權利,此等臨時專利申請案係以引用方式併入。 The present application claims the benefit of U.S. Provisional Patent Application No. 61/869,585, filed on Aug. 23, 2013, and U.S. Provisional Patent Application Serial No. 61/905,275, filed on It is incorporated by reference.

電子裝置之間傳送之資料的量在最近幾年已驚人地增長。現在,大量音訊、串流視訊、文字及其他類型之資料內容在桌上型及攜帶型電腦、媒體裝置、手持型媒體裝置、顯示器、儲存裝置及其他類型之電子裝置之間定期地傳送。 The amount of data transmitted between electronic devices has grown dramatically in recent years. Today, a large amount of audio, streaming video, text, and other types of data content are periodically transmitted between desktop and portable computers, media devices, handheld media devices, displays, storage devices, and other types of electronic devices.

此等資料傳送可經由各種媒體而發生。舉例而言,資料傳送可以無線方式進行、經由電線導體而進行、經由光纖纜線而進行,或資料傳送可以其他方式進行。可與資料一起傳送電力,或可分離地傳送電力。舉例而言,可將電力及資料自一個電子裝置傳送至另一電子裝置,或可將電力自電池、充電電路或電力轉換器分離地傳送至電子裝置。 Such data transfer can occur via various media. For example, data transfer can be done wirelessly, via wire conductors, via fiber optic cable, or by data transfer in other ways. The power can be transmitted with the data or can be transmitted separately. For example, power and data may be transferred from one electronic device to another electronic device, or power may be separately transmitted from the battery, charging circuit, or power converter to the electronic device.

可經由纜線輸送電力及資料,該等纜線可包括電線導體、光纖纜線,或此等或其他導體之某一組合。纜線總成可在一纜線之每一末端處包括一連接器插件,但其他纜線總成可以專用方式連接或繫栓至電子裝置。該等連接器插件可插入至通信電子裝置中之插座中。 Power and data may be delivered via a cable, which may include wire conductors, fiber optic cables, or some combination of these or other conductors. The cable assembly can include a connector insert at each end of a cable, but other cable assemblies can be attached or bolted to the electronic device in a dedicated manner. The connector inserts can be inserted into a socket in the communication electronics.

此外,通過此等連接器插件及插座之資料速率可相當高。為了提供此等高資料速率,可能需要該等連接器插件及插座具有高信號完整性及低插入損耗。 In addition, the data rate through these connector plug-ins and sockets can be quite high. In order to provide such high data rates, such connector plug-ins and sockets may be required to have high signal integrity and low insertion loss.

又,此等連接器插件可每天插入至裝置插座中達一次或多次歷時多年。可能需要此等連接器插件及插座可靠且不會過早地斷裂或磨損。此等故障可導致使用者對纜線總成及纜線總成連接至之電子裝置兩者不滿意。 Also, these connector inserts can be inserted into the device outlet once or more for many years. It may be desirable for such connector inserts and sockets to be reliable and not to break or wear prematurely. Such failures may result in the user being dissatisfied with both the cable assembly and the electronic device to which the cable assembly is connected.

電子裝置之銷售量可以數百萬計,其中數個附屬纜線總成及其連接器插件係與該等電子裝置一起銷售。就此等量而言,製造之任何縮減或簡化會變得顯著。出於此等原因,可能需要此等連接器插件及插座易於製造。 Electronic devices can be sold in millions, with several accessory cable assemblies and their connector inserts sold with such electronic devices. In this regard, any reduction or simplification of manufacturing can become significant. For these reasons, it may be desirable for such connector inserts and sockets to be easy to manufacture.

因此,所需要的是具有高信號完整性及低插入損耗、可靠且易於製造之連接器插件及插座。 What is needed, therefore, are connector inserts and sockets that have high signal integrity and low insertion loss, are reliable and easy to manufacture.

因此,本發明之實施例可提供具有高信號完整性及低插入損耗、可靠且易於製造之連接器插件及插座以及其他結構。 Thus, embodiments of the present invention can provide connector inserts and sockets and other structures that have high signal integrity and low insertion loss, are reliable and easy to manufacture.

本發明之一說明性實施例可提供連接器插件及插座,該等連接器插件及插座藉由簡化其實體信號路徑而具有高信號品質。在一項實施例中,一連接器插座之一連接器插件或舌片可主要由一印刷電路板形成。該等連接器插件或插座舌片上之接點可類似於一印刷電路板上之習知接點。此等接點可具有縮減之大小以減低接點至接點及其他雜散電容。此縮減之大小亦可幫助限制原本可能由於該接點內之短線效應(stub-effect)而發生的反射。亦可縮減電阻。此等電容、短線效應及電阻之縮減可幫助改良信號品質、縮減插入損耗,且幫助改良阻抗匹配。 An illustrative embodiment of the present invention can provide connector inserts and sockets that have high signal quality by simplifying their physical signal paths. In one embodiment, a connector insert or tab of a connector receptacle can be formed primarily from a printed circuit board. The contacts on the connector inserts or socket tabs can be similar to conventional contacts on a printed circuit board. These contacts can be reduced in size to reduce junction-to-contact and other stray capacitance. This reduction in size can also help limit reflections that would otherwise occur due to the stub-effect within the joint. It can also reduce the resistance. These capacitors, short-line effects, and resistance reductions can help improve signal quality, reduce insertion loss, and help improve impedance matching.

在本發明之一特定實施例中,該等接點之一寬度可藉由一對準 容限而判定且可不易於縮減。相似地,該接點之一長度可提供必要量之擦拭且可不易於縮減。因此,在本發明之此特定實施例中,可縮減每一接點之一高度或剖面。此高度縮減會縮減自一接點之一側至一鄰近接點或其他附近結構之一相鄰側的一電容。此高度縮減可幫助縮減該接點中之外來路徑的長度,藉此縮減該短線效應。此高度縮減亦可幫助縮減接觸電阻。此外,此等改良之累積效應可為幫助改良信號品質、縮減插入損耗及幫助改良阻抗匹配。 In a particular embodiment of the invention, one of the contacts can be widthed by an alignment It is judged by tolerance and may not be easily reduced. Similarly, one of the lengths of the joint can provide the necessary amount of wiping and can be less easily reduced. Thus, in this particular embodiment of the invention, one of the heights or profiles of each joint can be reduced. This reduction in height reduces a capacitance from one side of a contact to an adjacent contact or adjacent side of one of the other nearby structures. This reduction in height can help reduce the length of the extraneous path in the joint, thereby reducing the short-term effect. This height reduction can also help reduce contact resistance. In addition, these improved cumulative effects can help improve signal quality, reduce insertion loss, and help improve impedance matching.

本發明之實施例可將跡線經由該印刷電路板而佈線至此等接點。此等跡線可為匹配阻抗線。舉例而言,可使用帶狀線阻抗技術(strip line impedance technique)以經由該印刷電路板而遠離該等接點路由信號。 Embodiments of the present invention can route traces to the contacts via the printed circuit board. These traces can be matched impedance lines. For example, a strip line impedance technique can be used to route signals away from the contacts via the printed circuit board.

本發明之實施例可在該印刷電路板上包括一或多個電子電路、裝置、組件,或其組合。此等電路、裝置及組件可包括發光二極體、電力轉換器、時脈與資料恢復電路,及其他電子電路、裝置或組件。可藉由將一纜線附接至該連接器插件(通常附接於該連接器插件的遠離該等接點之一部分處)而形成一纜線總成。來自該等接點之印刷電路板跡線可連接至該等電子電路、裝置或組件中之一或多者,連接至該纜線中之一或多個導體,或連接至其他結構。一外殼可提供於此等電子電路、裝置或組件上方或周圍以增加連接器插件可用性。 Embodiments of the invention may include one or more electronic circuits, devices, components, or combinations thereof on the printed circuit board. Such circuits, devices and components can include light emitting diodes, power converters, clock and data recovery circuits, and other electronic circuits, devices or components. A cable assembly can be formed by attaching a cable to the connector insert (typically attached to a portion of the connector insert that is remote from one of the contacts). Printed circuit board traces from the contacts can be connected to one or more of the electronic circuits, devices or components, to one or more conductors in the cable, or to other structures. A housing can be provided over or around such electronic circuits, devices or components to increase connector insert usability.

本發明之一說明性實施例可提供一種藉由使用經建構以具有一縮減之斷裂可能性之一印刷電路板而可靠的連接器插件或插座舌片。舉例而言,可使該印刷電路板之一或多個層中的纖維定向以改良該連接器插件之可靠性。在此等及其他實施例中,可調整纖維含量、纖維類型或其他參數以改良該等連接器插件之可靠性。 An illustrative embodiment of the present invention can provide a connector insert or socket tab that is reliable by using a printed circuit board that is constructed to have a reduced likelihood of breakage. For example, the fibers in one or more layers of the printed circuit board can be oriented to improve the reliability of the connector insert. In these and other embodiments, fiber content, fiber type or other parameters can be adjusted to improve the reliability of the connector inserts.

本發明之一說明性實施例可提供一種易於製造之連接器插件或插座舌片。一特定實施例可提供一種主要由一印刷電路板形成且主要 使用習知印刷電路板製造技術製造之連接器插件或插座舌片。在此特定實施例中,一或多個電子裝置可置放於一印刷電路板上。可使用限於或包括習知印刷電路板金屬化技術之步驟來金屬化該印刷電路板上之接地環、接點及跡線或連接。該印刷電路板可經塑形以適配於一對應連接器插座中,且該等接點可經配置以與該連接器插座中之接點配合。在本發明之各種實施例中,一焊料遮罩可置放於該印刷電路板上方且經蝕刻以覆蓋一或多個非金屬化區域。在又其他實施例中,一標籤(label)或覆蓋層(coverlay)可置放於一或多個非金屬化區域中。舉例而言,一覆蓋層可被熱壓至一連接器插件上以覆蓋接點之間及接點與一接地環之間的一區域。在又其他實施例中,塑膠可置放於此等區域中。在此等實施例中,該焊料遮罩、標籤、塑膠或覆蓋層可具有各種色彩及紋理,使得該焊料遮罩、標籤、塑膠或覆蓋層在曝露於一使用者時提供可接受之外觀。 An illustrative embodiment of the present invention can provide a connector insert or socket tab that is easy to manufacture. A particular embodiment can provide a form primarily formed by a printed circuit board and Connector inserts or socket tabs made using conventional printed circuit board manufacturing techniques. In this particular embodiment, one or more electronic devices can be placed on a printed circuit board. The steps, limited to or including conventional printed circuit board metallization techniques, can be used to metallize the grounding rings, contacts, and traces or connections on the printed circuit board. The printed circuit board can be shaped to fit into a corresponding connector receptacle, and the contacts can be configured to mate with contacts in the connector receptacle. In various embodiments of the invention, a solder mask can be placed over the printed circuit board and etched to cover one or more non-metallized regions. In still other embodiments, a label or coverlay can be placed in one or more non-metallized regions. For example, a cover layer can be heat pressed onto a connector insert to cover an area between the contacts and between the contacts and a ground ring. In still other embodiments, the plastic can be placed in such areas. In such embodiments, the solder mask, label, plastic or cover layer can have a variety of colors and textures such that the solder mask, label, plastic or cover layer provides an acceptable appearance when exposed to a user.

本發明之另一說明性實施例可提供一種製造一連接器插件或插座舌片之方法。此方法可包括將一或多個電子裝置置放於一印刷電路板上。銅或其他電鍍物可置放於該印刷電路板上且經蝕刻以形成至該一或多個電子裝置之接地環、接點、跡線及連接。鎳或其他電鍍物可經蝕刻以覆蓋該銅。該等接點可被電鍍有金或其他材料以縮減氧化且改良電接觸。鉻、鈀-鎳(PdNi)或其他電鍍物可經蝕刻以覆蓋該等非接觸金屬化區域。該等金屬化區域可縮減由與一對應連接器中之固持特徵、彈簧接點或其他特徵之接觸造成的磨損。一焊料遮罩可置放於該印刷電路板上方且經蝕刻以覆蓋該等非金屬化區域,或一標籤或覆蓋層可置放於此等區域上方。 Another illustrative embodiment of the present invention can provide a method of making a connector insert or socket tab. The method can include placing one or more electronic devices on a printed circuit board. Copper or other electroplated material can be placed on the printed circuit board and etched to form ground rings, contacts, traces, and connections to the one or more electronic devices. Nickel or other electroplated materials may be etched to cover the copper. The contacts can be plated with gold or other materials to reduce oxidation and improve electrical contact. Chromium, palladium-nickel (PdNi) or other electroplated materials may be etched to cover the non-contact metallized regions. The metallized regions reduce wear caused by contact with retention features, spring contacts or other features in a corresponding connector. A solder mask can be placed over the printed circuit board and etched to cover the non-metallized regions, or a label or cover layer can be placed over such regions.

本發明之實施例可使一印刷電路板由一使用者直接使用及處置。通常,此情形可歸因於印刷電路板之至少一些部分的粗糙未拋光特性而具有很少吸引力。因此,本發明之另一說明性實施例可提供一 種查看起來及觸摸起來皆合意之連接器插件,而不管該連接器插件係至少主要使用一印刷電路板製成。可藉由在一連接器插件或插座舌片之一頂部及底部中之一者或兩者與側之間提供一去角邊緣而改良對該連接器插件之感覺。可使用一起槽機(router)來切削該去角邊緣,該起槽機具有一縱向軸線且在該縱向軸線上為圓柱形,且進一步具有正交於該縱向軸線之一或多個隆起部分。該一或多個隆起部分可具有一上部角形部分及一下部角形部分。該等角形部分可用以沿著該連接器插件之頂部及底部切削掉邊緣部分,藉此留下一去角邊緣。該上部角形部分及該下部角形部分可彎曲以給予該所得去角邊緣一曲線。舉例而言,該上部角形部分及該下部角形部分可凹入以給予該等去角邊緣一凸起彎曲邊緣,但可使用凹入、筆直及凸起邊緣之任何組合。該起槽機可具有數個隆起部分且可同時在一印刷電路板堆疊上形成去角邊緣。該等隆起部分可進一步具有在每一上部角形部分與下部角形部分之間的一平坦部分。可在切削期間將具有大致等於一平坦部分之一高度之一高度的隔片或插件插入於該堆疊中之每一印刷電路板之間。 Embodiments of the present invention enable a printed circuit board to be used and disposed of directly by a user. Typically, this situation can be attributed to the rough unpolished nature of at least some portions of the printed circuit board with little appeal. Therefore, another illustrative embodiment of the present invention may provide a A connector insert that is both viewable and touchable, regardless of whether the connector insert is at least primarily made using a printed circuit board. The feel of the connector insert can be improved by providing a chamfered edge between one or both of the top and bottom of one of the connector inserts or the socket tabs. The chamfered edge can be cut using a router having a longitudinal axis and being cylindrical on the longitudinal axis and further having one or more raised portions orthogonal to the longitudinal axis. The one or more raised portions may have an upper angular portion and a lower angular portion. The angled portion can be used to cut the edge portion along the top and bottom of the connector insert, thereby leaving a chamfered edge. The upper angular portion and the lower angular portion are bendable to impart a curve to the resulting chamfered edge. For example, the upper angular portion and the lower angular portion can be recessed to impart a convex curved edge to the chamfered edges, but any combination of concave, straight and raised edges can be used. The grooving machine can have a plurality of raised portions and can simultaneously form a chamfered edge on a printed circuit board stack. The raised portions may further have a flat portion between each of the upper angular portion and the lower angular portion. A spacer or insert having a height substantially equal to one of the heights of one of the flat portions can be inserted between each of the printed circuit boards in the stack during cutting.

此外,本發明之實施例可提供一種具有一經改良外表之連接器插件或插座舌片。通常,一印刷電路板可提供一粗糙側邊緣。由一印刷電路板製成之一連接器插件或插座舌片可遭受相同缺陷。因此,本發明之實施例可縮減或補償此粗糙度。在本發明之一特定實施例中,可使用一精細起槽機(諸如,上文所描述之該起槽機)以提供一較平滑或經拋光之側。在本發明之另一特定實施例中,一連接器插件之至少一或多個側的金屬化物具有一增加之厚度。此增加之厚度可幫助掩飾沿著該連接器插件之側的任何雜散纖維或不均勻性。在本發明之另一特定實施例中,可金屬化該連接器插件之一或多個側。可接著薄化該金屬化物以幫助掩飾沿著該連接器插件之側的任何不均勻性。 Moreover, embodiments of the present invention can provide a connector insert or socket tab having an improved appearance. Typically, a printed circuit board provides a rough side edge. A connector insert or socket tab made from a printed circuit board can suffer from the same drawbacks. Thus, embodiments of the present invention can reduce or compensate for this roughness. In a particular embodiment of the invention, a fine grooving machine (such as the grooving machine described above) can be used to provide a smoother or polished side. In another particular embodiment of the invention, the metallization of at least one or more sides of a connector insert has an increased thickness. This increased thickness can help mask any stray fibers or inhomogeneities along the sides of the connector insert. In another particular embodiment of the invention, one or more sides of the connector insert can be metallized. The metallization can then be thinned to help mask any non-uniformities along the side of the connector insert.

本發明之實施例可利用此能力以使印刷電路板由使用者使用及 處置,以提供其他結構以及連接器插件。舉例而言,本發明之一實施例可提供一種具有一舌片之連接器插座,其中該舌片係使用本發明之該等實施例或本文所描述之特徵中的一或多者製造。本發明之另一特定實施例可提供一種用於一電子裝置之印刷電路板,其中該印刷電路板之一部分經形成以提供一舌片。該舌片可用作該電子裝置上之一插座的一舌片。 Embodiments of the present invention may utilize this capability to enable printed circuit boards to be used by users and Dispose of to provide additional structure and connector plug-ins. For example, one embodiment of the present invention can provide a connector receptacle having a tab, wherein the tab is fabricated using one or more of the embodiments of the present invention or features described herein. Another particular embodiment of the present invention can provide a printed circuit board for an electronic device wherein a portion of the printed circuit board is formed to provide a tab. The tab can be used as a tab for a socket on the electronic device.

可藉由將一接地或其他平面置放於該印刷電路板之一中心層上而在此等插件及舌片中改良屏蔽。此接地平面可使該插件或舌片之一頂部上的信號與該插件或舌片之一底部上的信號隔離。 The shielding can be improved in such inserts and tabs by placing a ground or other plane on one of the central layers of the printed circuit board. This ground plane isolates the signal on the top of one of the inserts or tabs from the signal on the bottom of one of the inserts or tabs.

本發明之實施例可提供用於纜線之連接器插件,該等纜線可連接至各種類型之裝置,諸如,攜帶型運算裝置、平板電腦、桌上型電腦、膝上型電腦、一體式電腦、蜂巢式電話、智慧型電話、媒體電話、儲存裝置、攜帶型媒體播放器、導航系統、監視器、電力供應器、配接器,及充電器,以及其他裝置。此等連接器插件可提供符合諸如以下各者之各種標準的用於信號及電力之路徑:通用串列匯流排(USB)、高清晰度多媒體介面(HDMI)、數位視覺介面(DVI)、電力、乙太網路、DisplayPort、Thunderbolt、Lightning,及其他類型之標準及非標準介面。 Embodiments of the present invention can provide connector inserts for cables that can be connected to various types of devices, such as portable computing devices, tablets, desktops, laptops, integrated Computers, cellular phones, smart phones, media phones, storage devices, portable media players, navigation systems, monitors, power supplies, adapters, and chargers, among other devices. These connector plug-ins provide paths for signals and power that meet various standards such as: Universal Serial Bus (USB), High Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI), Power , Ethernet, DisplayPort, Thunderbolt, Lightning, and other types of standard and non-standard interfaces.

本發明之各種實施例可併入本文所描述之此等及其他特徵中的一或多者。藉由參考以下詳細描述及隨附圖式,可得到對本發明之本質及優點的較好理解。 Various embodiments of the invention may be incorporated into one or more of these and other features described herein. A better understanding of the nature and advantages of the present invention can be obtained by

100‧‧‧電子系統 100‧‧‧Electronic system

110‧‧‧纜線 110‧‧‧ Cable

120‧‧‧電子裝置 120‧‧‧Electronic devices

122‧‧‧螢幕 122‧‧‧ screen

130‧‧‧電子裝置 130‧‧‧Electronic devices

132‧‧‧螢幕 132‧‧‧ screen

134‧‧‧鍵盤 134‧‧‧ keyboard

136‧‧‧滑鼠 136‧‧‧ Mouse

200‧‧‧連接器插件 200‧‧‧Connector plugin

210‧‧‧印刷電路板 210‧‧‧Printed circuit board

220‧‧‧接點 220‧‧‧Contacts

230‧‧‧隔離或焊料遮罩區域 230‧‧‧Isolation or solder mask area

232‧‧‧隔離或焊料遮罩區域 232‧‧‧Isolation or solder mask area

234‧‧‧隔離或焊料遮罩區域 234‧‧‧Isolation or solder mask area

240‧‧‧接地環 240‧‧‧ Grounding ring

242‧‧‧前部分 242‧‧‧ former part

244‧‧‧側部分 244‧‧‧ side part

250‧‧‧電子裝置、電路或組件 250‧‧‧Electronic devices, circuits or components

1110‧‧‧動作 1110‧‧‧ Action

1120‧‧‧動作 1120‧‧‧ action

1130‧‧‧動作 1130‧‧‧ Action

1140‧‧‧動作 1140‧‧‧ action

1150‧‧‧動作 1150‧‧‧ action

1160‧‧‧動作 1160‧‧‧ action

1170‧‧‧動作 1170‧‧‧ action

1180‧‧‧動作 1180‧‧‧ action

1190‧‧‧動作 1190‧‧‧ action

1210‧‧‧去角邊緣 1210‧‧‧Going edge

1220‧‧‧去角邊緣 1220‧‧‧Corner edge

1410‧‧‧起槽機 1410‧‧‧Starting machine

1420‧‧‧平坦表面 1420‧‧‧ flat surface

1430‧‧‧上部角形邊緣 1430‧‧‧ upper angular edge

1440‧‧‧隆起部分 1440‧‧‧Uplifted part

1450‧‧‧下部角形邊緣 1450‧‧‧lower angular edge

1480‧‧‧隔片 1480‧‧‧ spacer

1510‧‧‧電子裝置 1510‧‧‧Electronic devices

1520‧‧‧舌片 1520‧‧‧ tongue

1530‧‧‧接點 1530‧‧‧Contacts

1610‧‧‧印刷電路板 1610‧‧‧Printed circuit board

1620‧‧‧舌片部分 1620‧‧‧ tongue part

1630‧‧‧接點 1630‧‧‧Contacts

1640‧‧‧電子裝置、電路或組件 1640‧‧‧Electronic devices, circuits or components

1650‧‧‧跡線 1650‧‧‧ Traces

1710‧‧‧電子裝置 1710‧‧‧Electronic devices

1720‧‧‧後側/印刷電路板 1720‧‧‧Back side / printed circuit board

1810‧‧‧金屬接地帶 1810‧‧‧Metal grounding strap

1820‧‧‧接點 1820‧‧‧Contacts

1830‧‧‧隔離區域 1830‧‧‧Isolated area

1840‧‧‧接地襯墊或環 1840‧‧‧ Grounding pad or ring

1860‧‧‧板 1860‧‧‧ boards

1870‧‧‧導體 1870‧‧‧Conductor

1880‧‧‧托架 1880‧‧‧ bracket

1910‧‧‧中心接地平面 1910‧‧‧Center ground plane

圖1說明可藉由併入本發明之實施例而改良的電子系統;圖2說明根據本發明之一實施例的連接器插件;圖3說明根據本發明之一實施例的連接器插件之俯視圖、側視圖及正視圖; 圖4至圖10說明根據本發明之一實施例的製造連接器插件之方法;圖11A及圖11B為根據本發明之一實施例的製造連接器插件或其他結構之方法之流程圖;圖12說明根據本發明之一實施例的具有去角邊緣之連接器插件之一部分;圖13說明根據本發明之一實施例的具有去角邊緣之連接器插件之一部分;圖14說明根據本發明之一實施例的可用以在連接器插件或其他結構上形成去角邊緣之起槽機;圖15說明藉由併入本發明之一實施例而改良的電子裝置;圖16說明根據本發明之一實施例的印刷電路板;圖17說明具有可由印刷電路板形成的後側1720的電子裝置1710;圖18說明根據本發明之一實施例的連接器插座之一部分;圖19說明根據本發明之一實施例的連接器插座之一部分之剖示圖;及圖20說明根據本發明之一實施例的連接器插座之一部分之剖示圖。 1 illustrates an electronic system that can be modified by incorporating an embodiment of the present invention; FIG. 2 illustrates a connector insert in accordance with an embodiment of the present invention; and FIG. 3 illustrates a top view of a connector insert in accordance with an embodiment of the present invention. , side view and front view; 4 through 10 illustrate a method of fabricating a connector insert in accordance with an embodiment of the present invention; and FIGS. 11A and 11B are flow diagrams of a method of fabricating a connector insert or other structure in accordance with an embodiment of the present invention; One portion of a connector insert having a chamfered edge in accordance with an embodiment of the present invention; FIG. 13 illustrates a portion of a connector insert having a chamfered edge in accordance with an embodiment of the present invention; FIG. 14 illustrates one of the present invention A slotting machine of an embodiment that can be used to form a chamfered edge on a connector insert or other structure; Figure 15 illustrates an electronic device modified by incorporating an embodiment of the present invention; and Figure 16 illustrates an implementation in accordance with one embodiment of the present invention Example of a printed circuit board; Figure 17 illustrates an electronic device 1710 having a back side 1720 that may be formed from a printed circuit board; Figure 18 illustrates a portion of a connector receptacle in accordance with one embodiment of the present invention; Figure 19 illustrates an implementation in accordance with one embodiment of the present invention 1 is a cross-sectional view of a portion of a connector receptacle; and FIG. 20 illustrates a cross-sectional view of a portion of a connector receptacle in accordance with an embodiment of the present invention.

圖1說明可藉由併入本發明之實施例而改良的電子系統。如同其他所包括圖一樣,此圖係出於說明性目的而展示,且不限制本發明之可能實施例抑或申請專利範圍。 Figure 1 illustrates an electronic system that can be modified by incorporating embodiments of the present invention. The drawings are presented for illustrative purposes, and do not limit the possible embodiments or the scope of the claims.

電子系統100可包括接合電子裝置120及130之纜線110。電子裝置120可為具有螢幕122之膝上型或攜帶型電腦。電子裝置130可為包括螢幕132、鍵盤134及滑鼠136之一體式電腦。在本發明之其他實施例 中,纜線110可耦接各種類型之裝置,諸如,攜帶型運算裝置、平板電腦、桌上型電腦、蜂巢式電話、智慧型電話、媒體電話、儲存裝置、攜帶型媒體播放器、導航系統、監視器、電力供應器、配接器,及充電器,以及其他裝置。此等纜線(諸如,纜線110)可提供符合諸如以下各者之各種標準的用於信號及電力之路徑:通用串列匯流排(USB)、高清晰度多媒體介面(HDMI)、數位視覺介面(DVI)、電力、乙太網路、DisplayPort、Thunderbolt、Lightning,及其他類型之標準及非標準介面。纜線110可使用由本發明之實施例提供的連接器插件而附接至電子裝置110及130。其他纜線(未圖示)可連接至由本發明之實施例提供的連接器插件,且可用以將充電電力提供至諸如鍵盤134及滑鼠136之裝置,以及遙控器及其他電子裝置。 Electronic system 100 can include a cable 110 that engages electronic devices 120 and 130. The electronic device 120 can be a laptop or portable computer having a screen 122. The electronic device 130 can be a computer including a screen 132, a keyboard 134, and a mouse 136. Other embodiments of the invention The cable 110 can be coupled to various types of devices, such as portable computing devices, tablet computers, desktop computers, cellular phones, smart phones, media phones, storage devices, portable media players, navigation systems. , monitors, power supplies, adapters, and chargers, among other devices. Such cables, such as cable 110, can provide paths for signals and power that conform to various standards such as: Universal Serial Bus (USB), High Definition Multimedia Interface (HDMI), Digital Vision Interface (DVI), Power, Ethernet, DisplayPort, Thunderbolt, Lightning, and other types of standard and non-standard interfaces. Cable 110 can be attached to electronic devices 110 and 130 using connector inserts provided by embodiments of the present invention. Other cables (not shown) may be coupled to the connector inserts provided by embodiments of the present invention and may be used to provide charging power to devices such as keyboard 134 and mouse 136, as well as remote controls and other electronic devices.

此外,本發明之實施例可提供至少主要由印刷電路板形成之連接器插件。可藉由使用由本發明之實施例提供的各種技術而實現以此方式使印刷電路板由使用者直接使用及處置。下圖中展示一個此連接器插件。 Moreover, embodiments of the present invention can provide a connector insert that is at least primarily formed from a printed circuit board. The printed circuit board can be directly used and disposed of by the user in this manner by using various techniques provided by embodiments of the present invention. One of the connector plugins is shown in the figure below.

圖2說明根據本發明之一實施例的連接器插件。連接器插件200可包括印刷電路板200,該印刷電路板可支撐數個電子裝置、電路或組件250。連接器插件200可進一步包括由接地環240環繞之接點220。隔離或焊料遮罩區域230可使接點220與接地環240隔離。接地環240可包括側部分244及前部分242。接地環240之前部分242可由隔離或焊料遮罩區域232及234環繞。相似於接點220而配置之其他接點可包括於連接器插件200之底面上,且該等其他接點可由對應焊料遮罩區域及接地環240之底面部分環繞。雖然在此實例中展示焊料遮罩區域230,但在本發明之又其他實施例中,可將標籤或覆蓋層置放於一或多個非金屬化區域中。此外,可將覆蓋層熱壓至連接器插件上以覆蓋接點之間及接點與接地環之間的區域。在此等實施例中,焊料遮罩、標籤或 覆蓋層可具有各種色彩及紋理,使得焊料遮罩、標籤或覆蓋層在曝露於使用者時提供可接受之外觀。 2 illustrates a connector insert in accordance with an embodiment of the present invention. The connector insert 200 can include a printed circuit board 200 that can support a number of electronic devices, circuits, or components 250. The connector insert 200 can further include a joint 220 that is surrounded by a ground ring 240. The isolation or solder mask region 230 isolates the contacts 220 from the ground ring 240. The ground ring 240 can include a side portion 244 and a front portion 242. The front portion 242 of the ground ring 240 may be surrounded by isolation or solder mask regions 232 and 234. Other contacts configured similar to contacts 220 may be included on the bottom surface of connector insert 200, and the other contacts may be surrounded by corresponding solder mask regions and a bottom portion of ground ring 240. Although solder mask region 230 is shown in this example, in still other embodiments of the invention, the label or cover layer can be placed in one or more non-metallized regions. Additionally, the cover layer can be heat pressed onto the connector insert to cover the area between the contacts and between the contacts and the ground ring. In these embodiments, the solder mask, label or The cover layer can have a variety of colors and textures such that the solder mask, label or cover layer provides an acceptable appearance when exposed to the user.

此外,本發明之實施例可提供具有高信號完整性及縮減之插入損耗的連接器插件。此情形可部分地藉由縮減接點220之大小而實現。接點220可具有不易於縮減之寬度,此係因為該寬度由於對準容限而成為必要。接點220亦可具有由於對具有某一擦拭長度之期望而成為必要的長度。因此,本發明之實施例可縮減接點220之高度或剖面。此高度縮減可縮減通過接點220之側壁的接點至接點電容,以及至諸如接地環240之其他結構的雜散電容。此剖面縮減可進一步縮減不直接位於信號路徑中之雜散金屬化物的長度,以便縮減短線效應。此高度縮減亦可縮減接觸電阻。此等改良之累積效應可為改良信號完整性及降低插入損耗。 Moreover, embodiments of the present invention can provide connector inserts with high signal integrity and reduced insertion loss. This situation can be achieved in part by reducing the size of the contacts 220. Contact 220 can have a width that is not easily reduced, as this width becomes necessary due to alignment tolerances. Contact 220 can also have a length that is necessary due to the desire to have a certain wiping length. Thus, embodiments of the present invention can reduce the height or profile of the contacts 220. This height reduction can reduce junction-to-contact capacitance through the sidewalls of contact 220, as well as stray capacitance to other structures such as ground ring 240. This profile reduction further reduces the length of stray metallization that is not directly in the signal path in order to reduce short-term effects. This height reduction also reduces contact resistance. The cumulative effect of these improvements can be to improve signal integrity and reduce insertion loss.

可藉由將纜線附接至連接器插件200(通常附接於連接器插件200的遠離接點220之部分處)而形成纜線總成。接點220及連接器插件200之底面上的對應接點可連接至一或多個電子裝置、電路或組件250,或連接至纜線中之一或多個導體。此等連接可通過由印刷電路板210中之一或多個層上之跡線形成的匹配阻抗線。 The cable assembly can be formed by attaching a cable to the connector insert 200 (typically attached to a portion of the connector insert 200 that is remote from the joint 220). The contacts 220 and corresponding contacts on the bottom surface of the connector insert 200 can be connected to one or more electronic devices, circuits or components 250, or to one or more conductors in the cable. These connections may pass through matching impedance lines formed by traces on one or more layers in printed circuit board 210.

圖3說明根據本發明之一實施例的連接器插件之俯視圖、側視圖及正視圖。此外,連接器插件200可主要由印刷電路板210形成,且可支撐一或多個電子裝置、電路或組件250。接地環240可環繞接點220。隔離或焊料遮罩230可使接點220彼此隔離且與接地環240隔離。接地環240可包括側部分244及前部分242。此外,代替隔離遮罩230,可使用標籤或覆蓋層以使接點220彼此隔離且與接地環240隔離。 3 illustrates a top, side, and front view of a connector insert in accordance with an embodiment of the present invention. Moreover, connector insert 200 can be formed primarily from printed circuit board 210 and can support one or more electronic devices, circuits, or components 250. The ground ring 240 can surround the joint 220. The isolation or solder mask 230 can isolate the contacts 220 from each other and from the ground ring 240. The ground ring 240 can include a side portion 244 and a front portion 242. Additionally, instead of the isolation mask 230, a label or cover layer can be used to isolate the contacts 220 from each other and from the ground ring 240.

本發明之實施例可提供藉由在建構時利用一或多個習知印刷電路板製造步驟而易於製造之連接器插件。在此方法中,可將電子裝置置放於印刷電路板上,且可在印刷電路板上金屬化諸如接地環、接點 及跡線之結構。可接著形成焊料遮罩區域以用於隔離及跡線保護。在以下諸圖中展示一個此方法。 Embodiments of the present invention may provide a connector insert that is easy to manufacture by utilizing one or more conventional printed circuit board manufacturing steps when constructed. In this method, the electronic device can be placed on a printed circuit board, and the grounding ring, contact can be metallized on the printed circuit board. And the structure of the traces. A solder mask region can then be formed for isolation and trace protection. One such method is shown in the following figures.

圖4至圖10說明根據本發明之一實施例的製造連接器插件之方法。圖4說明在連接器插件之製造期間的連接器插件之一部分。在圖4中,已塑形印刷電路板部分210以適配於對應連接器插座中。已將一或多個電子裝置、電路或組件250置放於印刷電路板210上。此等電子裝置、電路或組件可為表面黏著或通孔裝置、電路或組件。 4 through 10 illustrate a method of making a connector insert in accordance with an embodiment of the present invention. Figure 4 illustrates a portion of a connector insert during manufacture of the connector insert. In Figure 4, the printed circuit board portion 210 has been shaped to fit into the corresponding connector receptacle. One or more electronic devices, circuits or components 250 have been placed on the printed circuit board 210. Such electronic devices, circuits or components can be surface mount or via devices, circuits or components.

此外,本發明之實施例可提供可靠之連接器插件。在本發明之各種實施例中,可藉由使用特定類型之印刷電路板(諸如,FR4)作為印刷電路板210而改良可靠性。又,本發明之實施例可變化纖維含量、纖維方向及其他參數以改良所得連接器插件之可靠性。 Moreover, embodiments of the present invention can provide a reliable connector insert. In various embodiments of the invention, reliability can be improved by using a particular type of printed circuit board, such as FR4, as the printed circuit board 210. Moreover, embodiments of the present invention can vary fiber content, fiber orientation, and other parameters to improve the reliability of the resulting connector insert.

圖5說明在已施加銅電鍍物層之後的連接器插件之一部分。具體言之,可能已在印刷電路板210上金屬化接地環240(包括側部分244及前部分242)及接點220。又,可能已金屬化至電子裝置、電路及組件250之跡線及接點。 Figure 5 illustrates a portion of the connector insert after the copper electroplated layer has been applied. In particular, the ground ring 240 (including the side portions 244 and the front portion 242) and the contacts 220 may have been metallized on the printed circuit board 210. Again, traces and contacts to the electronics, circuitry, and components 250 may have been metallized.

在此步驟及以下金屬化步驟中,可能已在印刷電路板210上經由濺鍍或汽化而沈積金屬,在此狀況下為銅或其他材料。可接著施加抗蝕劑塗層。可遮罩此抗蝕劑且將其曝露於光。可使用蝕刻以自諸如敞開區域230、232及234之區域移除抗蝕劑及金屬。 In this step and in the following metallization steps, metal may have been deposited on the printed circuit board 210 via sputtering or vaporization, in this case copper or other material. A resist coating can then be applied. This resist can be masked and exposed to light. Etching may be used to remove the resist and metal from regions such as open regions 230, 232, and 234.

在圖6中,可將鎳或其他材料層施加至包括側部分244及前部分242之接地環240,以及施加至接點220。 In FIG. 6, a layer of nickel or other material may be applied to the ground ring 240 including the side portions 244 and the front portion 242, and to the contacts 220.

在圖7中,可對接點220進行鍍金,或將接點220電鍍有另一材料。 In FIG. 7, the contacts 220 may be plated with gold or the contacts 220 may be plated with another material.

在圖8中,可將鉻電鍍物施加至包括側部分244及前部分242之接地環240。在其他實施例中,此電鍍物可為鈀-鎳,或其他材料。 In FIG. 8, a chrome plating can be applied to the ground ring 240 including the side portion 244 and the front portion 242. In other embodiments, the electroplating can be palladium-nickel, or other materials.

在圖9中,可將焊料遮罩或隔離層施加至印刷電路板。此情形可 使用靜電噴霧製程(E-spray process)或藉由其他傳統技術而進行。在又其他實施例中,可施加覆蓋層或標籤,舉例而言,可將覆蓋層熱壓至連接器插件。 In Figure 9, a solder mask or isolation layer can be applied to the printed circuit board. This situation can be It is carried out using an E-spray process or by other conventional techniques. In still other embodiments, a cover layer or label can be applied, for example, the cover layer can be heat pressed to the connector insert.

在圖10中,已回蝕阻焊劑以覆蓋區域230、232及234。此阻焊劑遮罩亦可用以保護印刷電路板210之其他部分。 In FIG. 10, the solder resist has been etched back to cover regions 230, 232, and 234. The solder mask can also be used to protect other portions of the printed circuit board 210.

此外,此等金屬化及其他步驟中之一或多者可為習知印刷電路板製造步驟。在下圖中展示說明根據本發明之實施例的在其他結構中製造連接器插件之方法之流程圖。 Moreover, one or more of such metallization and other steps can be a conventional printed circuit board fabrication step. A flow chart illustrating a method of making a connector insert in other configurations in accordance with an embodiment of the present invention is shown in the following figures.

圖11A為根據本發明之一實施例的製造連接器插件或其他結構之方法之流程圖。在動作1110中,可將電子裝置、電路或組件置放於印刷電路板上。在動作1120中,可在印刷電路板上金屬化諸如接地環、接點及跡線之結構。在動作1130中,可將焊料遮罩置放於印刷電路板上且蝕刻焊料遮罩,或可施加標籤或覆蓋層。 11A is a flow diagram of a method of making a connector insert or other structure in accordance with an embodiment of the present invention. In act 1110, an electronic device, circuit, or component can be placed on a printed circuit board. In act 1120, structures such as ground loops, contacts, and traces can be metallized on the printed circuit board. In act 1130, a solder mask can be placed on the printed circuit board and the solder mask can be etched, or a label or cover layer can be applied.

圖11B為根據本發明之一實施例的製造印刷電路板之方法之另一流程圖。如前所述,在動作1140中,可將電子裝置、電路或組件置放於印刷電路板上。在動作1150中,可在印刷電路板上金屬化用於用以連接電子器件之接地環、接點及跡線的銅或其他電鍍物。在動作1160中,可將鎳或其他類型之電鍍物置放於銅電鍍物上方。在動作70中,可對接點進行鍍金,或將接點電鍍有另一材料。在動作1180中,可將鉻、鈀-鎳或其他電鍍物置放於非接觸金屬化區域上。在動作1190中,可將焊料遮罩置放於印刷電路板上且蝕刻焊料遮罩,或可施加標籤或覆蓋層。可將纜線附接至連接器插件,且可使用外殼以至少覆蓋電子裝置、電路及組件250以及周圍非金屬化區域。 11B is another flow diagram of a method of fabricating a printed circuit board in accordance with an embodiment of the present invention. As previously mentioned, in act 1140, an electronic device, circuit, or component can be placed on a printed circuit board. In act 1150, copper or other electroplating for grounding rings, contacts, and traces of the electronic device can be metallized on the printed circuit board. In act 1160, nickel or other type of electroplated material can be placed over the copper electroplating. In act 70, the contacts may be plated with gold or the contacts may be plated with another material. In act 1180, chromium, palladium-nickel, or other electroplated material can be placed over the non-contact metallized regions. In act 1190, a solder mask can be placed on the printed circuit board and the solder mask can be etched, or a label or cover layer can be applied. The cable can be attached to the connector insert and the outer casing can be used to cover at least the electronic device, circuitry and assembly 250, and surrounding non-metallized areas.

此外,本發明之實施例可使印刷電路板由使用者使用及處置。通常,此情形可能不合乎需要,此係因為印刷電路板之部分(特別是邊緣及拐角)具有粗糙的感覺及外表。因此,本發明之實施例提供主 要由印刷電路板形成之連接器插件及其他結構,其中該等連接器插件及其他結構具有合乎需要的外表及感覺。 Moreover, embodiments of the present invention enable printed circuit boards to be used and disposed of by a user. Often, this may not be desirable because of the rough feel and appearance of portions of the printed circuit board, particularly the edges and corners. Accordingly, embodiments of the present invention provide a master Connector inserts and other structures to be formed from printed circuit boards, wherein the connector inserts and other structures have a desirable appearance and feel.

本發明之實施例可縮減印刷電路板之粗糙度,特別是沿著邊緣。在本發明之一項實施例中,可藉由具有極精細刀刃之起槽機來塑形連接器插件或其他結構。使用精細刀刃可向印刷電路板提供平滑或經拋光之邊緣。在其他實施例中,沿著印刷電路板之側的金屬化物可相對厚,以便覆蓋任何雜散纖維或不均勻性。在本發明之又其他實施例中,可薄化印刷電路板上之金屬化物以移除或縮減不均勻表面特徵。在本發明之又其他實施例中,可使連接器插件之邊緣平滑或去角以向使用者提供更合乎需要的感覺。在下圖中展示一實例。 Embodiments of the present invention can reduce the roughness of printed circuit boards, particularly along the edges. In one embodiment of the invention, the connector insert or other structure can be shaped by a grooving machine having a very fine blade. Use a fine blade to provide a smooth or polished edge to the printed circuit board. In other embodiments, the metallization along the side of the printed circuit board can be relatively thick to cover any stray fibers or non-uniformities. In still other embodiments of the invention, the metallization on the printed circuit board can be thinned to remove or reduce uneven surface features. In still other embodiments of the invention, the edges of the connector insert can be smoothed or chamfered to provide a more desirable feel to the user. An example is shown in the figure below.

圖12說明根據本發明之一實施例的具有去角邊緣之連接器插件之一部分。在此實例中,連接器插件之頂部與側之間的邊緣具有去角邊緣1210。相似去角邊緣可形成於連接器插件之底部與側之間。 Figure 12 illustrates a portion of a connector insert having a chamfered edge in accordance with an embodiment of the present invention. In this example, the edge between the top and side of the connector insert has a chamfered edge 1210. A similar chamfered edge can be formed between the bottom and the side of the connector insert.

圖13說明根據本發明之一實施例的具有去角邊緣之連接器插件之一部分。此外,該連接器插件可包括去角邊緣1210及1220。 Figure 13 illustrates a portion of a connector insert having a chamfered edge in accordance with an embodiment of the present invention. Additionally, the connector insert can include chamfered edges 1210 and 1220.

常常需要在製造期間同時塑形若干印刷電路板。此等印刷電路板常常可彼此相繼地堆疊以使其邊緣由起槽機切割。因此,本發明之實施例可針對堆疊中之每一印刷電路板提供在連接器插件或其他結構上形成去角邊緣之方法。在下圖中展示一實例。 It is often desirable to simultaneously shape several printed circuit boards during manufacturing. These printed circuit boards can often be stacked one after another such that their edges are cut by the grooving machine. Thus, embodiments of the present invention can provide a method of forming a chamfered edge on a connector insert or other structure for each printed circuit board in the stack. An example is shown in the figure below.

圖14說明根據本發明之一實施例的可用以在連接器插件或其他結構上形成去角邊緣之起槽機。起槽機1410可在縱向方向上為圓柱形,且具有實質上正交於縱向方向之一或多個隆起部分1440。該一或多個隆起部分可包括上部角形邊緣1430及下部角形邊緣1450。可提供及使用平坦表面1420以塑形印刷電路板210。上部角形邊緣1430及下部角形邊緣1450可用以在堆疊中之鄰近印刷電路板210上產生去角邊緣1210及1220。隆起部分1420可包括在上部角形部分1430與下部角形 部分1450之間的平坦表面。此平坦表面可具有對應於隔片1480之高度或厚度的高度,該等隔片可位於堆疊中之印刷電路板210之間。 Figure 14 illustrates a grooving machine that can be used to form a chamfered edge on a connector insert or other structure in accordance with an embodiment of the present invention. The grooving machine 1410 can be cylindrical in the longitudinal direction and have one or more raised portions 1440 that are substantially orthogonal to the longitudinal direction. The one or more raised portions can include an upper angular edge 1430 and a lower angular edge 1450. A flat surface 1420 can be provided and used to shape the printed circuit board 210. Upper angular edge 1430 and lower angular edge 1450 can be used to create chamfered edges 1210 and 1220 adjacent printed circuit board 210 in the stack. The raised portion 1420 can be included in the upper angular portion 1430 and the lower angular shape A flat surface between portions 1450. This flat surface may have a height corresponding to the height or thickness of the spacer 1480, which may be located between the printed circuit boards 210 in the stack.

在本發明之各種實施例中,去角邊緣1210及1220可具有凹入、凸起或平坦表面。此等表面可由上部角形部分1430及下部角形部分1450上之對應凸起、凹入或平坦表面形成。 In various embodiments of the invention, the chamfered edges 1210 and 1220 can have concave, convex or flat surfaces. These surfaces may be formed by corresponding raised, concave or flat surfaces on the upper angular portion 1430 and the lower angular portion 1450.

此外,本發明之實施例可提供其他結構以及連接器插件。在以下諸圖中展示實例。 Moreover, embodiments of the invention may provide other configurations as well as connector inserts. Examples are shown in the following figures.

圖15說明藉由併入本發明之一實施例而改良的電子裝置。此圖展示具有包括舌片1520之插座的電子裝置1510,接點1530位於該舌片上。如同本文所展示之其他舌片及接點一樣,舌片1520及接點1530可藉由諸如包括本文所描述之技術之實施例的本發明之實施例而製成。舌片1520可經塑形以適配於連接器插件中,而接點1530可經配置以與連接器插件中之接點配合。 Figure 15 illustrates an electronic device modified by incorporating an embodiment of the present invention. This figure shows an electronic device 1510 having a socket that includes a tab 1520 on which the contacts 1530 are located. As with the other tabs and contacts shown herein, the tabs 1520 and contacts 1530 can be made by embodiments of the invention, such as embodiments including the techniques described herein. The tab 1520 can be shaped to fit into the connector insert, and the contacts 1530 can be configured to mate with the contacts in the connector insert.

在此實例中,舌片1520可僅為舌片,或該舌片可附接至印刷電路板。舉例而言,該舌片可附接至可進一步包括一或多個電子裝置、電路或組件之相對小電路板。在本發明之其他實施例中,用於電子裝置1520之主印刷電路板可包括諸如舌片1520之舌片。在下圖中展示一實例。 In this example, the tab 1520 can be only a tab or the tab can be attached to a printed circuit board. For example, the tab can be attached to a relatively small circuit board that can further include one or more electronic devices, circuits, or components. In other embodiments of the invention, the main printed circuit board for electronic device 1520 can include a tab such as tab 1520. An example is shown in the figure below.

圖16說明根據本發明之一實施例的印刷電路板。此外,印刷電路板1610可為裝置1510中之主邏輯或印刷電路板。印刷板1610可包括可藉由跡線1650而連接之一或多個電子裝置、電路或組件1640。印刷電路板1610可具有可包括接點1630之舌片部分1620。舌片部分1620可經配置以適配於連接器插件、邊緣連接器或其他插口中。接點1630可經配置以與連接器插件中之接點配合。印刷電路板1610之邊緣可在舌片周圍或在舌片及整個印刷電路板周圍經去角。舌片部分1620相比於如所展示的印刷電路板1610之側可相對短,或舌片部分1620可延續印 刷電路板1610之整個側或延續印刷電路板1610之側的實質部分。此外,可使用本文所提供之各種技術來製造此及其他舌片與特徵以及印刷電路板部分及其他結構。 Figure 16 illustrates a printed circuit board in accordance with an embodiment of the present invention. Additionally, printed circuit board 1610 can be the main logic or printed circuit board in device 1510. Print panel 1610 can include one or more electronic devices, circuits or components 1640 that can be connected by traces 1650. Printed circuit board 1610 can have a tab portion 1620 that can include contacts 1630. The tab portion 1620 can be configured to fit into a connector insert, edge connector, or other socket. Contact 1630 can be configured to mate with a contact in the connector insert. The edges of the printed circuit board 1610 can be chamfered around the tabs or around the tabs and the entire printed circuit board. The tab portion 1620 can be relatively short compared to the side of the printed circuit board 1610 as shown, or the tab portion 1620 can be reprinted The entire side of the printed circuit board 1610 or a substantial portion of the side of the printed circuit board 1610 continues. In addition, this and other tabs and features, as well as printed circuit board portions and other structures, can be fabricated using the various techniques provided herein.

能夠使印刷電路板由使用者使用及處置亦可意謂可使用印刷電路來形成電子裝置之一或多個側。下圖中展示一實例。 The ability to use and handle the printed circuit board by the user may also mean that one or more sides of the electronic device may be formed using printed circuitry. An example is shown in the figure below.

圖17說明具有可由印刷電路板形成的後側1720的電子裝置1710。印刷電路板1720可支撐一或多個電子裝置、電路或組件,該一或多個電子裝置、電路或組件可位於電子裝置1710內部。如同諸如舌片1520、舌片部分1620及下文所展示之舌片的其他結構一樣,可使用本文所展示之方法且藉由使用本發明之其他實施例來製造印刷電路板1720。 Figure 17 illustrates an electronic device 1710 having a back side 1720 that can be formed from a printed circuit board. Printed circuit board 1720 can support one or more electronic devices, circuits, or components that can be internal to electronic device 1710. As with other structures such as tab 1520, tab portion 1620, and tabs shown below, printed circuit board 1720 can be fabricated using the methods presented herein and by using other embodiments of the present invention.

此外,本發明之實施例可提供用於連接器插座之連接器插件及舌片。此等插件及舌片可包括位於印刷電路板之中間或中心層上的接地或其他隔離平面。此接地平面可幫助使連接至插件或舌片之頂部表面上之襯墊的信號與連接至插件或舌片之底部表面上之襯墊的信號隔離。在以下諸圖中展示一實例。 Moreover, embodiments of the present invention can provide connector inserts and tabs for connector receptacles. The inserts and tabs may include ground or other isolation planes located in the middle or center layer of the printed circuit board. This ground plane can help isolate the signal from the pad attached to the top surface of the insert or tab from the signal attached to the pad on the bottom surface of the insert or tab. An example is shown in the following figures.

圖18說明根據本發明之一實施例的連接器插座之一部分。此連接器插座可經配置以適配於裝置圍封體中之開口中,且可包括具有接地帶1810、由隔離區域1830環繞之接點1820及接地襯墊1840的舌片。舌片部分可由托架1880機械地支撐。板1860可與舌片一起或分離地形成。導體1870可用以將此插座部分電連接至主邏輯、主機板或其他印刷電路板。舌片可具有中心接地平面。此中心接地平面可連接至金屬接地帶1810及接地襯墊或環1840中之任一者或兩者。 Figure 18 illustrates a portion of a connector receptacle in accordance with an embodiment of the present invention. The connector receptacle can be configured to fit into an opening in the device enclosure and can include a tab having a ground strap 1810, a contact 1820 surrounded by the isolation region 1830, and a ground pad 1840. The tongue portion can be mechanically supported by the bracket 1880. Plate 1860 can be formed with or separately from the tab. Conductor 1870 can be used to electrically connect the socket portion to the main logic, motherboard or other printed circuit board. The tongue can have a central ground plane. This central ground plane can be connected to either or both of the metal ground strap 1810 and the ground pad or ring 1840.

圖19說明根據本發明之一實施例的連接器插座之一部分之剖示圖。中心接地平面1910可電連接至接地帶1810。中心接地平面1910可延伸印刷電路板之邊緣,且該中心接地平面直接接觸印刷電路板及已 附接金屬接地帶1810之邊緣上的電鍍物,抑或該中心接地平面可經由導通孔連接至頂部及底部接地襯墊或環,諸如舌片上之接地襯墊或環1840。 Figure 19 illustrates a cross-sectional view of a portion of a connector receptacle in accordance with an embodiment of the present invention. The center ground plane 1910 can be electrically connected to the ground strap 1810. The center ground plane 1910 can extend the edge of the printed circuit board, and the center ground plane directly contacts the printed circuit board and has The plating on the edge of the metal ground strap 1810 is attached, or the central ground plane can be connected to the top and bottom ground pads or rings via vias, such as a ground pad or ring 1840 on the tab.

圖20說明根據本發明之一實施例的連接器插座之一部分之剖示圖。接地平面1910可隔離舌片之頂部及底部上的高速信號以防止串擾。諸如接地平面1910之接地平面亦可位於藉由本發明之該等實施例而提供的其他舌片及插件中。 Figure 20 illustrates a cross-sectional view of a portion of a connector receptacle in accordance with an embodiment of the present invention. The ground plane 1910 isolates high speed signals on the top and bottom of the tab to prevent crosstalk. A ground plane, such as ground plane 1910, may also be located in other tabs and inserts provided by such embodiments of the present invention.

已出於說明及描述之目的而呈現本發明之實施例的以上描述。其並不意欲為詳盡的或將本發明限於所描述之精確形式,且許多修改及變化依據以上教示係可能的。選擇及描述該等實施例,以便最好地解釋本發明之原理及其實務應用,以藉此使其他熟習此項技術者能夠在各種實施例中且與適合於所涵蓋之特定用途的各種修改一起最好地利用本發明。因此,應瞭解,本發明意欲涵蓋在以下申請專利範圍之範疇內的所有修改及等效者。 The above description of the embodiments of the present invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention. The embodiments were chosen and described in order to best explain the principles of the embodiments of the invention The invention is best utilized together. Therefore, it is to be understood that the invention is intended to cover all modifications and equivalents

200‧‧‧連接器插件 200‧‧‧Connector plugin

210‧‧‧印刷電路板 210‧‧‧Printed circuit board

220‧‧‧接點 220‧‧‧Contacts

230‧‧‧隔離或焊料遮罩區域 230‧‧‧Isolation or solder mask area

232‧‧‧隔離或焊料遮罩區域 232‧‧‧Isolation or solder mask area

234‧‧‧隔離或焊料遮罩區域 234‧‧‧Isolation or solder mask area

240‧‧‧接地環 240‧‧‧ Grounding ring

242‧‧‧前部分 242‧‧‧ former part

244‧‧‧側部分 244‧‧‧ side part

250‧‧‧電子裝置、電路或組件 250‧‧‧Electronic devices, circuits or components

Claims (22)

一種連接器插件,其包含:一印刷電路板,其具有一頂部、底部及側;一或多個電子裝置,該一或多個電子裝置置放於該印刷電路板上;複數個第一接點,該複數個第一接點形成於該印刷電路板之該頂側上;及複數個跡線,該複數個跡線佈線於該印刷電路板中以將該複數個第一接點耦接至該一或多個電子裝置,其中該連接器插件經塑形以適配於一對應連接器插座中,且該複數個第一接點經配置以與該連接器插座中之對應複數個接點配合。 A connector insert comprising: a printed circuit board having a top, a bottom and a side; one or more electronic devices, the one or more electronic devices being placed on the printed circuit board; a plurality of first connections a plurality of first contacts formed on the top side of the printed circuit board; and a plurality of traces, the plurality of traces being routed in the printed circuit board to couple the plurality of first contacts To the one or more electronic devices, wherein the connector insert is shaped to fit into a corresponding connector socket, and the plurality of first contacts are configured to correspond to a plurality of connectors in the connector socket Point cooperation. 如請求項1之連接器插件,其進一步包含:複數個第二接點,該複數個第二接點形成於該印刷電路板之該底側上。 The connector insert of claim 1, further comprising: a plurality of second contacts formed on the bottom side of the printed circuit board. 如請求項1之連接器插件,其中該複數個跡線佈線於該印刷電路板中之一或多個層上。 The connector insert of claim 1, wherein the plurality of traces are routed to one or more of the layers of the printed circuit board. 如請求項1之連接器插件,其中該複數個跡線中之至少兩者具有一匹配阻抗。 The connector insert of claim 1, wherein at least two of the plurality of traces have a matching impedance. 如請求項1之連接器插件,其進一步包含在該複數個第一接點周圍之一接地環。 The connector insert of claim 1, further comprising a ground ring around the plurality of first contacts. 如請求項5之連接器插件,其進一步包含在該複數個第一接點與該接地環之間的一焊料遮罩區域。 The connector insert of claim 5, further comprising a solder mask region between the plurality of first contacts and the ground ring. 如請求項5之連接器插件,其進一步包含在該複數個第一接點與該接地環之間的一覆蓋層。 The connector insert of claim 5, further comprising a cover layer between the plurality of first contacts and the ground ring. 如請求項6之連接器插件,其中該連接器插件之該頂部與該側及該底部與該側之間的邊緣經去角。 The connector insert of claim 6, wherein the top of the connector insert and the edge between the side and the bottom and the side are chamfered. 一種製造一連接器插件之方法,該方法包含:將一或多個電子裝置置放於一印刷電路板上;金屬化該印刷電路板上之區域,該等區域包括至該印刷電路板上之該一或多個電子裝置的複數個接點及複數個連接,其中該印刷電路板經塑形以適配於一對應連接器插座中,且該複數個接點經配置以形成與該連接器插座中之對應複數個接點的電連接。 A method of making a connector insert, the method comprising: placing one or more electronic devices on a printed circuit board; metallizing regions on the printed circuit board, the regions including onto the printed circuit board a plurality of contacts and a plurality of connections of the one or more electronic devices, wherein the printed circuit board is shaped to fit into a corresponding connector socket, and the plurality of contacts are configured to form the connector An electrical connection corresponding to a plurality of contacts in the socket. 如請求項9之方法,其進一步包含:將一焊料遮罩層置放於該印刷電路板上方;及蝕刻該焊料遮罩層,使得該焊料遮罩主要覆蓋該印刷電路板之非金屬化區域。 The method of claim 9, further comprising: placing a solder mask layer over the printed circuit board; and etching the solder mask layer such that the solder mask primarily covers the non-metallized region of the printed circuit board . 如請求項10之方法,其中金屬化該印刷電路板上之區域包含:在該印刷電路板上方形成一銅層;及蝕刻該銅層以形成至該印刷電路板上之該一或多個電子裝置的該複數個接點及該複數個連接。 The method of claim 10, wherein the metallizing the region on the printed circuit board comprises: forming a copper layer over the printed circuit board; and etching the copper layer to form the one or more electrons onto the printed circuit board The plurality of contacts of the device and the plurality of connections. 如請求項11之方法,其中金屬化該印刷電路板上之區域進一步包含:在該印刷電路板上方形成一鎳層;及蝕刻該鎳層以覆蓋該銅層。 The method of claim 11, wherein the metallizing the region on the printed circuit board further comprises: forming a nickel layer over the printed circuit board; and etching the nickel layer to cover the copper layer. 如請求項12之方法,其中金屬化該印刷電路板上之區域進一步包含:對該複數個接點進行鍍金。 The method of claim 12, wherein the metallizing the region on the printed circuit board further comprises: plating the plurality of contacts. 如請求項12之方法,其中金屬化該印刷電路板上之區域進一步包含: 在該印刷電路板上方形成一金層;及蝕刻該金層以覆蓋該複數個接點。 The method of claim 12, wherein the metallizing the area on the printed circuit board further comprises: Forming a gold layer over the printed circuit board; and etching the gold layer to cover the plurality of contacts. 如請求項14之方法,其中金屬化該印刷電路板上之區域進一步包含:在該印刷電路板上方形成一金屬層;及蝕刻該金屬層以覆蓋該等非接觸金屬化區域。 The method of claim 14, wherein the metallizing the region on the printed circuit board further comprises: forming a metal layer over the printed circuit board; and etching the metal layer to cover the non-contact metallization regions. 如請求項15之方法,其中該金屬層係由鉻或鈀-鎳形成。 The method of claim 15, wherein the metal layer is formed of chromium or palladium-nickel. 一種製造一連接器插件之方法,該方法包含:提供一印刷電路板;及沿著該印刷電路板之一頂部表面與一側表面之間的一拐角邊緣切削一倒角,其中使用具有一縱向軸線之一起槽機來形成該倒角,其中該起槽機在該縱向軸線上為圓柱形且具有正交於該縱向軸線之一或多個隆起部分,其中該一或多個隆起部分具有一上部角形部分及一下部角形部分。 A method of making a connector insert, the method comprising: providing a printed circuit board; and cutting a chamfer along a corner edge between a top surface and a side surface of the printed circuit board, wherein the use has a longitudinal Forming the chamfer with a slot machine, wherein the grooving machine is cylindrical on the longitudinal axis and has one or more raised portions orthogonal to the longitudinal axis, wherein the one or more raised portions have a Upper angular portion and lower angular portion. 如請求項17之方法,其中該起槽機具有用於在複數個印刷電路板上提供一倒角之複數個隆起部分。 The method of claim 17, wherein the grooving machine has a plurality of raised portions for providing a chamfer on the plurality of printed circuit boards. 如請求項18之方法,其中該等隆起部分中的每一者進一步包括在該上部角形部分與該下部角形部分之間的一中間部分。 The method of claim 18, wherein each of the raised portions further comprises an intermediate portion between the upper angular portion and the lower angular portion. 如請求項19之方法,其中將複數個隔片中之一者插入於鄰接印刷電路板之間,其中該等隆起部分之該中間部分具有至少大致等於該複數個隔片中之每一者之一厚度的一高度。 The method of claim 19, wherein one of the plurality of spacers is interposed between adjacent printed circuit boards, wherein the intermediate portion of the raised portions has at least substantially equal to each of the plurality of spacers a height of a thickness. 一種印刷電路板,其包含:一頂部、底部及側;一或多個電子裝置,該一或多個電子裝置置放於該印刷電路 板上;一舌片部分,其自該印刷電路板之一主部分延伸;複數個第一接點,該複數個第一接點形成於該印刷電路板之該舌片部分上;及複數個跡線,該複數個跡線佈線於該印刷電路板中以將該複數個第一接點耦接至該一或多個電子裝置。 A printed circuit board comprising: a top, a bottom and a side; one or more electronic devices, the one or more electronic devices being placed on the printed circuit a tab portion extending from a main portion of the printed circuit board; a plurality of first contacts, the plurality of first contacts being formed on the tab portion of the printed circuit board; and a plurality of A plurality of traces are routed in the printed circuit board to couple the plurality of first contacts to the one or more electronic devices. 如請求項21之印刷電路板,其中該印刷電路板之該舌片部分具有在該頂部與該側及該底部與該側之間的去角邊緣。 The printed circuit board of claim 21, wherein the tab portion of the printed circuit board has a chamfered edge between the top and the side and the bottom and the side.
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