TW201516317A - Light emitting diode panel and module structure thereof - Google Patents

Light emitting diode panel and module structure thereof Download PDF

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Publication number
TW201516317A
TW201516317A TW102138972A TW102138972A TW201516317A TW 201516317 A TW201516317 A TW 201516317A TW 102138972 A TW102138972 A TW 102138972A TW 102138972 A TW102138972 A TW 102138972A TW 201516317 A TW201516317 A TW 201516317A
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Taiwan
Prior art keywords
emitting diode
light
diode module
substrate
light emitting
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TW102138972A
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Chinese (zh)
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Guo-Shu Huang
yu-hong Xiao
zhuo-wei Liu
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Opto Tech Corp
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Priority to TW102138972A priority Critical patent/TW201516317A/en
Publication of TW201516317A publication Critical patent/TW201516317A/en

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Abstract

The present invention relates to a light emitting diode panel and a module structure thereof. A first light emitting diode module is provided at one side of a second light emitting diode module. The first light emitting diode module and the second light emitting diode module are respectively provided with a first engaging surface and a second engaging surface at sides that are connected to each other. The engaging surfaces are designed according to the curvature of the panel, so as to form a panel structure with best integration degree. In addition, a fastener structure is provided at the rear end of the light emitting diode module block of the present invention. The fastener structure is provided with a through hole at a position corresponding to a light emitting surface of the light emitting diode module block. The light emitting diode module block is fixed onto a substrate by means of the fastener structure, and a loosening member is inserted into the through hole to loosen the fastener structure, such that the light emitting diode module can be removed from the substrate from the front end, thereby facilitating the application in maintenance.

Description

發光二極體面板及其模組之結構Light-emitting diode panel and its module structure

本發明係有關於一種發光二極體,尤指針對一種發光二極體面板及其模組之結構。The invention relates to a light-emitting diode, in particular to a structure of a light-emitting diode panel and a module thereof.

科技日新月異,人們對於各式各樣事情的功效上要求更高,不再像以往一樣只要求能使用就好,隨著人性化的思維模式,燈一直是有史以來重要的發明之一,發展至今已有許多不同的燈具出現,有檯燈、立燈或稱為落地燈、路燈、招牌燈、紅綠燈、手電筒以及車燈等等,這些燈具皆被利用於各式的場所上,可見燈具對於我們是多重要的發明。With the rapid development of science and technology, people have higher requirements for the efficacy of various kinds of things. They are no longer required to be used as they used to be. With the humanized thinking mode, lamps have always been one of the most important inventions in history. There are many different lamps, such as table lamps, standing lamps or floor lamps, street lamps, sign lamps, traffic lights, flashlights and lights, etc. These lamps are used in various places, and the lamps are visible to us. Important invention.

隨時代的進步,燈具的演變也越來越快,電燈從最簡單型式之傳統之白織燈泡,其中,白織燈泡是製造技術最簡單且價格最低廉的發光器具,但卻有很大之缺點,如壽命不長和能源效率不佳等限制,為了更符合現代照明需求,一些照明光源如日光燈、鈉光燈、複金屬燈等,都陸續被發展出來,在慢慢演變到太陽能燈具,太陽能燈具係利用太陽能板接收太陽光後,將太陽能轉換成電能,再利用該些電能提供自身的發光元件發光,也利用發光二極體之燈具,由於發光二極體具有無須暖燈時間、反應速度很快、體積小、用電省、污染低、適合量產,具高可靠度,容易配合應用上的需要製成極小或陣列式的元件等等之優點,故,發光二極體也被廣泛運用於各種不同的照明應用之中,於市場上的佔有率有逐漸增加普及的趨勢,發光二極體被利用於各式的產品之中如:LED車燈、LED路燈、LED檯燈以及各式顯示小燈,皆有利用LED製做出來的產品。With the progress of the times, the evolution of the lamps is getting faster and faster. The electric lamps are from the simplest type of traditional white woven bulbs. Among them, the white woven bulbs are the simplest and cheapest luminaires in manufacturing technology, but they are very large. Disadvantages, such as short life and poor energy efficiency, in order to better meet the needs of modern lighting, some lighting sources such as fluorescent lamps, sodium lamps, complex metal lamps, etc., have been developed one after another, slowly evolved into solar lamps, The solar light fixture uses solar panels to receive sunlight, converts the solar energy into electrical energy, and then uses the electrical energy to provide its own light-emitting element to emit light, and also utilizes the light-emitting diode lamp, because the light-emitting diode has no need for warming time and reaction. Fast, small size, low power consumption, low pollution, suitable for mass production, high reliability, easy to meet the needs of the application to make very small or array components, etc., therefore, the LED is also Widely used in a variety of different lighting applications, the market share has gradually increased the popularity of the trend, the LED is used in a variety of products In such as: LED lights, LED lights, LED lamps and small lamps kinds of display, there are made use of products made out of LED.

現今針對發光二極體具有很多種產品,尤其是當夜晚來臨時,各家各店於大馬路旁所設置一排一排的招牌燈具,或是用於各大看板上之發光二極體燈具,上述所指出之燈具皆利用發光二極體面板拼裝出招牌或看板上之圖形、符號或文字,再依據共同設置於同一電路基板上,用電路設置共同操控該些發光二極體燈的發光順序或明滅等等,但,習知針對此種技術上之應用與維修方面並非特別突出,在應用上對於制式化的基板有特定設置,並不能靈活運用於各種樣式之基板,另外,又於維修上面更是需要耗費大量的人力與時間,將整塊基板拆下進行細部維修,所以當看板僅若壞掉一小部分,若進行維修卻需耗費大量的人力與時間,於成本上的消耗不符合效益。Nowadays, there are many kinds of products for the light-emitting diodes, especially when the night comes, each store has a row of row of sign lamps on the roadside of the road, or a light-emitting diode lamp for each big board. The lamps indicated above all use the LED panel to assemble the graphics, symbols or characters on the signboard or the kanban, and then are arranged on the same circuit substrate according to the common arrangement, and the circuit arrangement is used to jointly control the illumination order of the LEDs. Or Ming Ming and so on, but the conventional application is not particularly prominent for the application and maintenance of this technology. In the application, there is a specific setting for the standardized substrate, and it cannot be flexibly applied to various types of substrates, and also for maintenance. The above requires a lot of manpower and time, and the whole substrate is removed for detailed maintenance. Therefore, if the kanban only breaks a small part, it takes a lot of manpower and time to repair, and the cost is not consumed. Conforms to the benefits.

故,本發明針對以上習知之缺點做進一步之改良,發明出一種發光二極體面板及其模組之結構,此模組可針對各種形式之基板進行組裝,且安裝起來密合度好,另外,進行面板與面板之間之組裝也可利用此方法,並於進行維修時,能更快速更便利且不需耗費大量成本與工時,僅需要將壞掉之結構拆下作個別維修即可,且也不同與以往須將整塊基板卸下進行背後拆除維修,此發明提供一種前修式方法進需正面拆下須維修之部分,不須拆下整塊基板之固定結構,此為一種具有新穎性及進步性之發明。Therefore, the present invention further improves the above-mentioned disadvantages, and invents a structure of a light-emitting diode panel and a module thereof, which can be assembled for various forms of substrates, and has good adhesion and installation. This method can also be used for the assembly between the panel and the panel, and can be faster and more convenient when performing maintenance, and does not require a lot of cost and man-hours. It is only necessary to remove the broken structure for individual maintenance. Moreover, unlike the prior art, the entire substrate has to be removed for back-removal and maintenance. The invention provides a front-repair method for the front part to be repaired, and the fixed structure of the entire substrate is not required to be removed. Novelty and progressive invention.

本發明之主要目的,在於提供一種發光二極體面板及其模組之結構,其發光二極體面板之間可靈活組合,於組裝上之契合度高。The main object of the present invention is to provide a structure of a light-emitting diode panel and a module thereof, which can be flexibly combined between the light-emitting diode panels and has a high degree of fit in assembly.

本發明之次要目的,在於提供一種發光二極體面板及其模組之結構,於維修上更可方便拆修,進行前開式之正面維修方法。A secondary object of the present invention is to provide a structure of a light-emitting diode panel and a module thereof, which can be easily removed for maintenance, and a front-open front maintenance method.

為達上述所指稱之主要目的之功效,主要利用一第一發光二極體模組與一第二發光二極體模組,將該第二發光二極體模組設置於該第一發光二極體模組之一側, 該第一發光二極體模組與該第二發光二極體模組於相互連接之側邊分別設有一第一接合面與一第二接合面, 該第一接合面與該第二接合面分別於該第一發光二極模組之發光面與該第二發光二極體模組之發光面之夾角小於90度,使該第一發光二極模組之發光面與該第二發光二極體模組之發光面之夾角小於180度 。For the purpose of achieving the above-mentioned main purpose, a first light-emitting diode module and a second light-emitting diode module are mainly used, and the second light-emitting diode module is disposed on the first light-emitting diode The first light emitting diode module and the second light emitting diode module are respectively provided with a first bonding surface and a second bonding surface on one side of the interconnecting diode module, the first The angle between the light-emitting surface of the first light-emitting diode module and the light-emitting surface of the second light-emitting diode module is less than 90 degrees, so that the first light-emitting diode module The angle between the light emitting surface and the light emitting surface of the second light emitting diode module is less than 180 degrees.

再者,發光二極體模組為一發光二極體模塊與一基板之組合,將該發光二極體模塊於後面設置一卡扣結構,該卡扣結構對應於該發光二極體模塊之發光面貫穿設置一貫穿孔,而該發光二極體模塊使用該卡扣結構以固定於該基板之上,其中,使用一鬆脫件通過該貫穿孔以鬆開該卡扣結構,將該發光二極體模塊自該基板取下。Furthermore, the light emitting diode module is a combination of a light emitting diode module and a substrate, and the light emitting diode module is provided with a snap structure at the back, the snap structure corresponding to the light emitting diode module The light emitting diode is disposed through the through hole, and the light emitting diode module is fixed on the substrate by using the buckle structure, wherein a loose member is used to pass the through hole to release the buckle structure, and the light emitting diode The polar body module is removed from the substrate.

1‧‧‧第一發光二極體模組1‧‧‧First LED Module

2‧‧‧第二發光二極體模組2‧‧‧Second light-emitting diode module

10‧‧‧基板10‧‧‧Substrate

110‧‧‧卡扣孔110‧‧‧Snap holes

120‧‧‧定位孔120‧‧‧Positioning holes

20‧‧‧發光二極體模塊20‧‧‧Lighting diode module

210‧‧‧第一接合面210‧‧‧First joint

211‧‧‧第二接合面211‧‧‧Second joint

220‧‧‧燈板220‧‧‧light board

222‧‧‧發光二極體燈源222‧‧‧Lighting diode source

230‧‧‧固定座230‧‧‧ Fixed seat

232‧‧‧定位柱232‧‧‧Positioning column

30‧‧‧卡扣結構30‧‧‧Snap structure

300‧‧‧卡扣凹槽300‧‧‧Snap groove

310‧‧‧固定塊310‧‧‧Fixed block

312‧‧‧凸出部312‧‧‧Protruding

3121‧‧‧推面3121‧‧‧

3122‧‧‧滑面3122‧‧‧Slip surface

320‧‧‧自動復位件320‧‧‧Automatic reset parts

40‧‧‧貫穿孔40‧‧‧through holes

410‧‧‧鬆脫件410‧‧‧ release parts


第一圖:其係為發光二極體模組結構立體示意圖;
第二圖:其係為發光二極體面板結構組合示意圖;
第三A圖:其係為發光二極體模組結構示意圖;
第三B圖:其係為另一發光二極體模組結構示意圖;
第四A圖:其係為發光二極體模塊組裝示意圖;
第四B圖:其係為發光二極體模塊卡扣基板示意圖;以及
第四C圖:其係為發光二極體模塊之拆解示意圖。

The first picture is a three-dimensional schematic diagram of the structure of the light-emitting diode module;
The second picture is a schematic diagram of the combination of the structure of the light-emitting diode panel;
The third A picture: it is a schematic diagram of the structure of the light emitting diode module;
The third B picture: it is a schematic diagram of another LED module structure;
Figure 4A: It is a schematic diagram of assembly of a light-emitting diode module;
FIG. 4B is a schematic diagram of the buckle substrate of the LED module; and FIG. 4C is a schematic diagram of the disassembly of the LED module.

為使 貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識,謹佐以較佳之實施例及配合詳細之說明,說明如後:In order to provide a better understanding and understanding of the features and the efficacies of the present invention, the preferred embodiment and the detailed description are as follows:

請參閱第一圖,其係為發光二極體模組結構立體示意圖;如圖所示,本發明之發光二極體模組主要包含一基板10與一發光二極體模塊20,該發光二極體模塊20主要具有一燈板220與ㄧ固定座230組成,該固定座230之底部設有至少一卡扣結構30與複數定位柱232,另外,該基板10具有對應該卡扣結構30之至少一卡扣孔110與對應該些定位柱232之複數定位孔120。Please refer to the first figure, which is a schematic diagram of a structure of a light-emitting diode module. As shown in the figure, the light-emitting diode module of the present invention mainly comprises a substrate 10 and a light-emitting diode module 20, and the light-emitting diode 2 The pole body module 20 mainly has a light board 220 and a cymbal holder 230. The bottom of the fixing base 230 is provided with at least one snap structure 30 and a plurality of positioning posts 232. In addition, the base board 10 has a corresponding snap structure 30. At least one snap hole 110 and a plurality of positioning holes 120 corresponding to the positioning posts 232.

請一併參閱第二圖,其係為發光二極體面板結構組合示意圖;如圖所示,其主要利用一第一發光二極體模組1與ㄧ第二發光二極體模組2,將該第二發光二極體模組2設置於該第一發光二極體模組1之一側, 該第一發光二極體模組1與該第二發光二極體模組2於相互連接之側邊分別設有一第一接合面210與一第二接合面211,該第一接合面210與該第二接合面211係同時包含該發光二極體模塊20與該基板10之側邊, 該第一接合面210與該第二接合面211分別於該第一發光二極模組1之發光面與該第二發光二極體模組2之發光面之夾角小於90度,使該第一發光二極模組1之發光面與該第二發光二極體模組2之發光面之夾角小於180度,本實施例係將該發光二極體模塊 20與該基板10之側邊同時做接合面處理,以利於發光二極體模組於組合之契合度。Please refer to the second figure, which is a schematic diagram of the combination of the structure of the LED panel; as shown in the figure, it mainly utilizes a first LED module 1 and a second LED module 2, The second LED module 2 is disposed on one side of the first LED module 1 , and the first LED module 1 and the second LED module 2 are mutually connected to each other. A first joint surface 210 and a second joint surface 211 are respectively disposed on the side of the joint. The first joint surface 210 and the second joint surface 211 simultaneously include the side of the light emitting diode module 20 and the substrate 10 . The angle between the first bonding surface 210 and the second bonding surface 211 on the light emitting surface of the first light emitting diode module 1 and the light emitting surface of the second light emitting diode module 2 is less than 90 degrees. The angle between the light emitting surface of the first light emitting diode module 1 and the light emitting surface of the second light emitting diode module 2 is less than 180 degrees. In this embodiment, the light emitting diode module 20 and the side of the substrate 10 are At the same time, the joint surface treatment is performed to facilitate the fit of the LED module in combination.

請一併參閱第三A圖及第三B圖,其係為發光二極體模組結構示意圖與另一示意圖;如圖所示,其同樣係利用該第一接合面210與該第二接合面211為一具有角度之傾斜面,其針對該些發光二極體模塊20之側邊設為第一接合面210與第二接合面211,可配合該基板10之弧面設計,當該基板10為弧度之結構(如第二圖),利用該第一接合面210與該第二接合面211配合基板10之弧度設置,以利於組合該些發光二極體模塊20設置於該基板10之上,使該些發光二極體模塊20之該第一接合面210與該第二接合面211之側邊互相平行設置,該些發光二極體模塊20之間接縫達到最小化,可以密集設置該些發光二極體模塊20於該基板10之上;另外,當基板10設置為一垂直角度之結構(如第三圖),因該第一接合面210與該第二接合面211配合基板10之角度設置,該第一接合面210與該第一發光二極體之發光面夾角為45度配合該第二接合面211與該第二發光二極體之發光面夾角為45度,使該些發光二極體模塊20於基板10上之組合形成垂直角度,且能夠互相接合之接縫小,本發明利用該些發光二極體模塊20上設置複數發光二極體燈源222,再利用該些接合面210使製作發光二極體顯示屏幕時,能夠製作出弧度之顯示屏幕與具有垂直角之顯示屏幕。Please refer to FIG. 3A and FIG. 3B together, which is a schematic diagram of the structure of the LED module and another schematic diagram; as shown in the figure, the first bonding surface 210 and the second bonding are also used. The surface 211 is an angled inclined surface, and the side surfaces of the LED modules 20 are defined as a first bonding surface 210 and a second bonding surface 211, which can be matched with the arc surface design of the substrate 10 when the substrate 10 is a structure of the arc (such as the second figure), and the first bonding surface 210 and the second bonding surface 211 are matched with the arc of the substrate 10 to facilitate the combination of the LED modules 20 on the substrate 10 . The first bonding surface 210 of the LED module 20 and the side of the second bonding surface 211 are disposed in parallel with each other, and the seams between the LED modules 20 are minimized and can be densely arranged. The light emitting diode modules 20 are disposed on the substrate 10; in addition, when the substrate 10 is disposed at a vertical angle (as shown in the third figure), the first bonding surface 210 is matched with the second bonding surface 211. The angle of the substrate 10 is set, the first joint surface 210 and the first light emitting diode are emitted The angle between the surface of the second bonding surface 211 and the light emitting surface of the second LED is 45 degrees, so that the combination of the LED modules 20 on the substrate 10 forms a vertical angle and can The joint of the joint is small, and the present invention utilizes the plurality of light-emitting diode light sources 222 on the light-emitting diode modules 20, and the joint surfaces 210 are used to make the light-emitting diode display screen, and the arc can be made. Display screen and display screen with vertical angle.

請一併參閱第四A圖,其係為發光二極體模塊組裝示意圖;如圖所示,本發明之該基板10具有該卡扣孔110與該些定位孔120,利用該發光二極體模塊20之該固定座230之背面設有該些定位柱232,於該發光二極體模塊20組裝於該基板10之上時,該發光二極體模塊20之該定位柱232係對應該基板10之上之該定位孔120,而該固定塊310之該凸出部312係對應該卡扣孔110,再施加一外力將該發光二極體模塊20卡扣固定於該基板10之上。Please refer to FIG. 4A, which is a schematic diagram of the assembly of the LED module. As shown in the figure, the substrate 10 of the present invention has the locking hole 110 and the positioning holes 120, and the LED is used. The positioning post 232 is disposed on the back surface of the fixing base 230 of the module 20. When the LED module 20 is assembled on the substrate 10, the positioning post 232 of the LED module 20 corresponds to the substrate. The positioning hole 120 is disposed on the substrate 10, and the protruding portion 312 of the fixing block 310 corresponds to the locking hole 110, and an external force is applied to fix the LED module 20 to the substrate 10.

請一併參閱第四B圖,其係為發光二極體模塊卡扣基板示意圖;如圖所示,該發光二極體模塊20係利用該定位柱232設置於該定位孔120內,以固定該發光二極體模塊20之左右限位移動,另外,該凸出部312設置於該卡扣孔110內時,先施予一向下之外力以組裝該發光二極體模塊20與該基板10,利用該凸出部312之一滑面3122受到外力向下先接觸到該基板10之該卡扣孔110之孔洞邊緣後,該滑面3122會順勢滑動,進而推動連接於該固定塊310之該自動復位件320進行壓縮至一卡扣凹槽300內,而使該凸出部312慢慢滑入該卡扣孔110內,該自動復位件320會再次恢復其因受到該滑面3122而壓縮前之位置,該自動復位件320推動該固定塊310,而利用該凸出部312設置於該卡扣孔110內以固定該發光二極體模塊20之上下限位移動。Referring to FIG. 4B, it is a schematic diagram of the LED substrate of the LED module. As shown in the figure, the LED module 20 is disposed in the positioning hole 120 by the positioning post 232 to fix the LED substrate. The left and right limit positions of the LED module 20 are moved. When the protrusion 312 is disposed in the latching hole 110, a downward external force is applied to assemble the LED module 20 and the substrate 10 . After the sliding surface 3122 of the protruding portion 312 is subjected to an external force to contact the hole edge of the locking hole 110 of the substrate 10, the sliding surface 3122 slides along the ground to push the connecting block 310. The automatic resetting member 320 is compressed into a latching recess 300, and the protruding portion 312 is slowly slid into the latching hole 110. The automatic resetting member 320 is restored to the sliding surface 3122 again. Before the compression, the automatic resetting member 320 pushes the fixing block 310, and the protruding portion 312 is disposed in the locking hole 110 to fix the lower limit position movement of the LED module 20.

請一併參閱第四C圖,其係為發光二極體模塊之拆解示意圖,如圖所示,本發明更進一步利用該貫穿孔40與一鬆脫件410,當將該發光二極體模塊20從該基板10拆解下來時,從該燈板220前面該貫穿孔40穿入該鬆脫件410後,該鬆脫件410推動該貫穿孔40所對應該凸出部312之該推面3121,進而推動連接於該固定塊310之該自動復位件320進行壓縮至一卡扣凹槽300內,直到將該固定塊310之該凸出部312之位置可抽離該卡扣孔110,進而從該發光二極體模塊20前方將該發光二極體模塊20自基板10上拆解下來。Please refer to FIG. 4C, which is a schematic diagram of the disassembly of the LED module. As shown in the figure, the present invention further utilizes the through hole 40 and a release member 410 when the LED is used. When the module 20 is disassembled from the substrate 10, after the through hole 40 is inserted into the release member 410 from the front of the lamp plate 220, the release member 410 pushes the push portion 312 corresponding to the protrusion 312. The surface 3121 further pushes the automatic resetting member 320 connected to the fixing block 310 to be compressed into a latching recess 300 until the position of the protruding portion 312 of the fixing block 310 can be pulled away from the latching hole 110. Further, the LED module 20 is detached from the substrate 10 from the front of the LED module 20.

承上所述,本發明更進一步利用該貫穿孔40與一鬆脫件410,當將該發光二極體模塊20從該基板10拆解下來時,從該燈板220前面該貫穿孔40穿入該鬆脫件410後,該鬆脫件410推動該貫穿孔40所對應該凸出部312之該推面3121,進而推動連接於該固定塊310之該自動復位件320進行壓縮,直到將該固定塊310之該凸出部312之位置可抽離該卡扣孔110,進而從該發光二極體模塊20前方將該發光二極體模塊20自基板10上拆解下來。As described above, the present invention further utilizes the through hole 40 and a release member 410. When the LED module 20 is detached from the substrate 10, the through hole 40 is worn from the front of the lamp plate 220. After the release member 410 is inserted, the release member 410 pushes the push surface 3121 of the through hole 40 corresponding to the protrusion 312, thereby pushing the automatic reset member 320 connected to the fixed block 310 to compress until the The position of the protruding portion 312 of the fixing block 310 can be separated from the locking hole 110, and the LED module 20 can be disassembled from the substrate 10 from the front of the LED module 20.

此外,本發明之 該發光二極體模塊20使用該卡扣結構30以固定於該基板10之上 ,可不需利用該鬆脫件410與該貫穿孔40,直接從該基板10之後面將該卡扣結構30鬆開,將該發光二極體模塊20自該基板10取下進行維修。In addition, the LED module 20 of the present invention is used to be fixed on the substrate 10 by using the buckle structure 30. The release member 410 and the through hole 40 can be used directly from the rear surface of the substrate 10. The snap structure 30 is loosened, and the LED module 20 is removed from the substrate 10 for maintenance.

綜上所述,本發明為一種發光二極體面板及其模組之結構,主要利用該第一該發光二極體模組1與該第二發光二極體模組2,將該第一發光二極體模組1之該第一接合面210配合該第二發光二極體模組2之該第二接合面211做一角度之傾斜,其可靈活組合發光二極體面板之弧度與樣式,且發光二極體面板之契合度很高。再者,將該發光二極體模塊20於後面設置該卡扣結構30,該卡扣結構30對應於該發光二極體模塊20之發光面貫穿設置該貫穿孔40,而該發光二極體模塊20使用該卡扣結構30以固定於該基板10之上,其中,使用一鬆脫件410通過該貫穿孔40以鬆開該卡扣結構30將該發光二極體模塊20自正面從該基板10之上拆解維修,另外,也可不使用該鬆脫件410與該貫穿孔40以鬆開該卡扣結構30將該發光二極體模塊20自後面從該基板10之上拆解維修,上述兩種方式皆可利用於進行維修。In summary, the present invention is a structure of a light-emitting diode panel and a module thereof, mainly using the first light-emitting diode module 1 and the second light-emitting diode module 2, the first The first joint surface 210 of the LED module 1 is inclined at an angle with the second joint surface 211 of the second LED module 2, and the arc of the LED panel can be flexibly combined with Style, and the fit of the LED panel is very high. In addition, the light-emitting diode module 20 is provided with the buckle structure 30 at the rear, and the buckle structure 30 is disposed through the through-hole 40 corresponding to the light-emitting surface of the LED module 20, and the light-emitting diode The module 20 uses the snap structure 30 to be fixed on the substrate 10, wherein the light-emitting diode module 20 is removed from the front surface through the through hole 40 by using a release member 410 to release the buckle structure 30. The substrate 10 is disassembled and repaired. Alternatively, the detaching member 410 and the through hole 40 may be used to release the buckle structure 30 to disassemble the LED module 20 from the back of the substrate 10. Both of the above methods can be used for maintenance.

故本發明實為一具有新穎性、進步性及可供產業上利用者,應符合我國專利法專利申請要件無疑,爰依法提出發明專利申請,祈 鈞局早日賜至准專利,至感為禱。Therefore, the present invention is a novelty, progressive and available for industrial use. It should be in accordance with the patent application requirements of the Chinese Patent Law. It is undoubtedly the invention patent application, and the Prayer Council will grant the patent as soon as possible. .

惟以上所述者,僅為本發明一較佳較佳實施例而已,並非用來限定本發明實施之範圍,故舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, so that the shapes, structures, features, and spirits described in the claims of the present invention are equal. Variations and modifications are intended to be included within the scope of the invention.

10‧‧‧基板 10‧‧‧Substrate

110‧‧‧卡扣孔 110‧‧‧Snap holes

120‧‧‧定位孔 120‧‧‧Positioning holes

20‧‧‧發光二極體模塊 20‧‧‧Lighting diode module

220‧‧‧燈板 220‧‧‧light board

222‧‧‧發光二極體燈源 222‧‧‧Lighting diode source

230‧‧‧固定座 230‧‧‧ Fixed seat

232‧‧‧定位柱 232‧‧‧Positioning column

30‧‧‧卡扣結構 30‧‧‧Snap structure

40‧‧‧貫穿孔 40‧‧‧through holes

Claims (10)

一種發光二極體面板之結構,其包含:
一第一發光二極體模組;一第二發光二極體模組,其係設置於該第一發光二極體模組之一側,該第一發光二極體模組與該第二發光二極體模組於相互連接之側邊分別設有一第一接合面與一第二接合面,該第一接合面與該第二接合面分別於該第一發光二極模組之發光面與該第二發光二極體模組之發光面之夾角小於90度,使該第一發光二極模組之發光面與該第二發光二極體模組之發光面之夾角小於180度。
A structure of a light emitting diode panel comprising:
a first light emitting diode module; a second light emitting diode module disposed on one side of the first light emitting diode module, the first light emitting diode module and the second The light emitting diode module is respectively provided with a first bonding surface and a second bonding surface on the side of the interconnecting side, and the first bonding surface and the second bonding surface are respectively respectively on the light emitting surface of the first light emitting diode module The angle between the light emitting surface of the second light emitting diode module and the light emitting surface of the second light emitting diode module is less than 90 degrees.
如申請專利範圍第1項所述之發光二極體面板之結構,其中該第一發光二極體模組與該第二發光二體模組係各別由一發光二極體模塊與一基板組成。The structure of the light-emitting diode panel of the first aspect of the invention, wherein the first light-emitting diode module and the second light-emitting diode module are respectively composed of a light-emitting diode module and a substrate composition. 如申請專利範圍第2項所述之發光二極體面板之結構,其中該發光二極體模塊係包含一燈板與一固定座。The structure of the light-emitting diode panel of claim 2, wherein the light-emitting diode module comprises a light board and a fixing base. 如申請專利範圍第3項所述之發光二極體面板之結構,其中該固定座背面設有複數定位柱,而該基板上設有複數對應該些定位柱之複數定位孔,利用該些定位柱設置於該些定位孔。The structure of the LED panel of claim 3, wherein a plurality of positioning posts are disposed on the back of the fixing seat, and the plurality of positioning holes corresponding to the positioning columns are disposed on the substrate, and the positioning is performed by using the positioning The column is disposed on the positioning holes. 如申請專利範圍第1項所述之發光二極體面板之結構,更進一步設有一卡扣結構於該發光二極體模塊後面,該卡扣結構對應於該發光二極體模塊之發光面貫穿設置一貫穿孔,而該發光二極體模塊使用該卡扣結構以固定於該基板之上,其中,使用一鬆脫件通過該貫穿孔以鬆開該卡扣結構,將該發光二極體模塊自該基板取下。The structure of the light-emitting diode panel of the first aspect of the invention is further provided with a buckle structure behind the light-emitting diode module, and the buckle structure corresponds to the light-emitting surface of the light-emitting diode module. The light-emitting diode module is used to fix the buckle structure, and the light-emitting diode module is used to fix the buckle structure by using the buckle structure, and the light-emitting diode module is loosened by the through hole. Removed from the substrate. 如申請專利範圍第5項所述之發光二極體面板之結構,該卡扣結構更包含一固定塊與一自動復位件,該固定塊之一端連接該自動復位件,其中,該自動復位件推動該固定塊卡扣於一卡扣孔內,以卡扣住該固定座與該基板之間。The structure of the light-emitting diode panel according to claim 5, wherein the buckle structure further comprises a fixing block and an automatic resetting member, and one end of the fixing block is connected to the automatic resetting member, wherein the automatic resetting member The fixing block is pushed into a buckle hole to buckle between the fixing seat and the substrate. 一種發光二極體模組之結構,其包含:
一基板;
至少一發光二極體模塊,其係於後面具有一卡扣結構,該卡扣結構對應於該發光二極體模塊之發光面貫穿設置之一貫穿孔,而該發光二極體模塊使用該卡扣結構以固定於該基板之上;其中,使用一鬆脫件通過該貫穿孔以鬆開該卡扣結構,將該發光二極體模塊自該基板取下。
A structure of a light emitting diode module, comprising:
a substrate;
At least one light-emitting diode module has a snap-fit structure at the back, and the snap-fit structure has a through-hole corresponding to the light-emitting surface of the light-emitting diode module, and the light-emitting diode module uses the buckle The structure is fixed on the substrate; wherein a release member is passed through the through hole to loosen the buckle structure, and the LED module is removed from the substrate.
如申請專利範圍第7項所述之發光二極體模組之結構,其中該發光二極體模塊係包含一燈板與一固定座。The structure of the light-emitting diode module of claim 7, wherein the light-emitting diode module comprises a light board and a fixing base. 如申請專利範圍第7項所述之發光二極體模組之結構,其中該固定座背面設有複數定位柱,而該基板上設有複數對應該些定位柱之複數定位孔,利用該些定位柱設置於該些定位孔。The structure of the light-emitting diode module of claim 7, wherein a plurality of positioning posts are disposed on the back of the fixing seat, and the plurality of positioning holes corresponding to the positioning columns are disposed on the substrate, and the plurality of positioning holes are used on the substrate. Positioning posts are disposed on the positioning holes. 如申請專利範圍第7項所述之發光二極體模組之結構,該卡扣結構更包含一固定塊與一自動復位件,該固定塊之一端連接該自動復位件,其中,該自動復位件推動該固定塊卡扣於一卡扣孔內,以卡扣住該固定座與該基板之間。The structure of the light-emitting diode module according to claim 7, wherein the buckle structure further comprises a fixing block and an automatic resetting member, and one end of the fixing block is connected to the automatic resetting member, wherein the automatic resetting device The piece pushes the fixing block into a buckle hole to buckle between the fixing seat and the substrate.
TW102138972A 2013-10-28 2013-10-28 Light emitting diode panel and module structure thereof TW201516317A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601906B (en) * 2016-10-26 2017-10-11 LED fixtures
US10066800B1 (en) 2017-09-21 2018-09-04 Keeper Technology Co., Ltd. Light-emitting diode fixing apparatus
US10260696B2 (en) 2016-12-22 2019-04-16 Keeper Technology Co., Ltd. Light-emitting diode module holder

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601906B (en) * 2016-10-26 2017-10-11 LED fixtures
US10260696B2 (en) 2016-12-22 2019-04-16 Keeper Technology Co., Ltd. Light-emitting diode module holder
US10066800B1 (en) 2017-09-21 2018-09-04 Keeper Technology Co., Ltd. Light-emitting diode fixing apparatus

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